WO2015045767A1 - 回路構成体 - Google Patents
回路構成体 Download PDFInfo
- Publication number
- WO2015045767A1 WO2015045767A1 PCT/JP2014/073241 JP2014073241W WO2015045767A1 WO 2015045767 A1 WO2015045767 A1 WO 2015045767A1 JP 2014073241 W JP2014073241 W JP 2014073241W WO 2015045767 A1 WO2015045767 A1 WO 2015045767A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bus bar
- circuit board
- printed
- printed circuit
- circuit body
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0238—Electrical distribution centers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a circuit structure in which a bus bar circuit body constituted by a plurality of bus bars is overlapped and fixed on a printed board.
- terminal portions of electrical components such as relays and switches are connected to the printed wiring of the printed circuit board and the bus bar of the bus bar circuit body by soldering such as reflow. .
- the circuit structure having the conventional structure has a problem that the adhesion between the bus bar and the printed board by the adhesive layer may not be maintained in the process of mounting the electrical component by soldering.
- the heating temperature in the reflow furnace during soldering needs to be higher than in the case of conventional eutectic solder, and tin applied to the surface of the bus bar. It may be higher than the melting temperature of the plating layer such as plating. In this case, the adhesion between the adhesive layer and the bus bar is not maintained by the melting of the plating layer, and the bus bar may be peeled off or detached from the printed board.
- Patent Document 2 proposes that the bus bar plating layer is formed of nickel having a melting temperature higher than the heating temperature of the reflow furnace. In this way, the problem that the plating layer of the bus bar melts due to the heating temperature at the time of soldering and the adhesion with the adhesive layer is eliminated is solved, but the hardness of the terminal portion of the nickel plated bus bar is eliminated. Is inevitable. Then, when the plating layer of the mating terminal connected to the nickel-plated terminal portion is tin plating or the like whose hardness is lower than that of nickel plating, the plating layer with low hardness is worn due to sliding between the contact surfaces of both. As a result, there is a risk that a new problem of increasing contact resistance may occur.
- the present invention has been made in the background of the above-described circumstances, and the problem to be solved is to stabilize the bus bar circuit body superimposed on the printed circuit board regardless of the heating temperature at the time of soldering of the electrical components.
- An object of the present invention is to provide a circuit structure having a novel structure that can be fixed.
- a circuit structure in which a bus bar circuit body constituted by a plurality of bus bars is overlapped and fixed on a printed circuit board having a printed wiring, and the bus bar is embedded in an insulator layer.
- the bus bar circuit body is integrally configured, and the bus bar circuit body is formed with an exposed portion in which a part of the bus bar is exposed through a through hole provided in the insulator layer.
- the insulator layer of the bus bar circuit body is overlapped with the printed circuit board and fixed through fixing means, and the exposed portion of the bus bar circuit body and the printed wiring of the printed circuit board
- the terminal part of an electrical component is mounted by soldering.
- the circuit structure is configured with the bus bar embedded in the insulator layer, and the insulator layer is superimposed on the printed circuit board and fixed by the fixing means. Therefore, even when the circuit components are heated and the surface plating of the bus bar is melted when the electrical components are mounted on the circuit components by soldering, the surface of the bus bar circuit body fixed to the printed circuit board is not plated. Melting has no effect, and the fixed state is stably maintained.
- the melting of the bus bar plating does not affect the bonding strength between the bus bar circuit body and the printed circuit board, there is no need to change the type of plating on the bus bar surface according to the heating temperature during soldering.
- the degree of freedom of selection is improved. For example, even when an electrical component is mounted on a circuit component by reflow soldering of lead-free solder, tin plating having a melting temperature lower than that of lead-free solder can be applied to the bus bar.
- bus bar circuit body is integrally formed by embedding the bus bar in the insulator layer, the handleability and insulation of the bus bar circuit body can be improved.
- the fixing means may be any means as long as the insulator layer of the bus bar circuit body can be attached to the printed circuit board with its relative position fixed, for example, an adhesive sheet interposed between the insulator layer and the printed circuit board, An adhesive may be used, and it may be constituted by a clinch portion, a bolt, a nut, and the like that sandwich the insulator layer and the printed board.
- the bus bar circuit body may be configured by molding an insulating layer made of a synthetic resin around the bus bar, or a prepreg which is a sheet material in which a glass fiber cloth is impregnated with a semi-cured epoxy resin. You may comprise the bus-bar circuit body which has the insulator layer which the bus-bar embed
- a terminal portion is integrally formed at an end portion of the bus bar and protrudes outside from the insulator layer.
- the thickness of the terminal portion is increased by folding the end portion of the bus bar.
- the plate thickness dimension is increased by folding the end portion of the terminal portion provided at the end portion of the bus bar. Therefore, it is possible to reduce the plate thickness of the intermediate portion in the longitudinal direction of the bus bar constituting the circuit portion while ensuring the necessary plate thickness for the terminal portion, and match the plate thickness of the circuit portion of the bus bar to the terminal portion. Thickening more than necessary can be avoided, and material costs can be reduced.
- the plate thickness of the entire insulator layer can be reduced, and the material cost of the entire bus bar circuit body can be reduced, and the size and thickness can be advantageously reduced. Can do.
- the fixing means protrudes outward from an outer edge portion of the insulator layer of the bus bar circuit body.
- the printed circuit board is formed between the insulator layer and the clinch part by bending the clinch part toward the printed circuit board on which the insulator layer is overlaid. By sandwiching, the insulator layer of the bus bar circuit body is fixed to the printed circuit board.
- the bus bar circuit body can be fixed to the printed circuit board by sandwiching the printed circuit board between the insulator layer and the clinched part using the clinch part provided at the end of the bus bar as the fixing means. Therefore, it is possible to eliminate the need for an adhesive sheet that is conventionally required for fixing the bus bar circuit body to the printed circuit board, and to reduce the number of components.
- the bus bar circuit body is fixed to the printed circuit board by mechanical fixing means by the clinching portion, the fixing state of both is firmly and stably without being further affected by heating during soldering. Can be maintained.
- the fixing means is interposed between the insulator layer of the bus bar circuit body and the printed board. It is constituted by an adhesive sheet.
- a wide range of the contact surface of the insulator layer of the bus bar circuit body to the printed board can be stably fixed to the printed board via the adhesive sheet.
- the adhesive sheet is directly bonded to the insulator layer and separated from the plated portion of the bus bar, the influence on the adhesive force due to the melting of the bus bar plating can be eliminated, and a stable fixing state is advantageous. Can be retained.
- the adhesive sheet and the clinching portion may alternatively be employed as the fixing means, or both may be employed.
- the metal plate according to any one of the first to fourth aspects, wherein a metal plate is disposed on a surface of the bus bar circuit body opposite to the overlapping surface of the printed circuit board.
- a heat sink made of steel is directly fixed.
- the heat sink made of a metal plate can be directly fixed to the bus bar circuit body.
- a surface opposite to the mounting surface of the printed circuit board is superimposed on the bus bar circuit body.
- a through hole is formed in the printed board at a position corresponding to the exposed portion of the bus bar circuit body, and the bus bar is exposed on the mounting surface of the printed board.
- the electrical components can be easily soldered to the printed wiring of the printed circuit board and the bus bar of the bus bar circuit body by reflow soldering, and the manufacturing process can be simplified. Moreover, peeling of the printed circuit board from the bus bar circuit body due to the heating temperature of the reflow furnace is also advantageously prevented.
- the bus bar is embedded in the insulator layer and the insulator layer is fixed to the printed circuit board, even when the surface plating of the bus bar is melted when soldering the electrical component, the fixed state is maintained. Maintained stably. Therefore, there is no need to change the type of plating on the surface of the bus bar according to the heating temperature at the time of soldering, and the degree of freedom in selecting the plating for the bus bar is improved.
- the bus bar circuit body is integrally formed by embedding the bus bar in the insulator layer, the handleability and insulation of the bus bar circuit body can be improved.
- FIG. 2 is an exploded perspective view of the circuit structure shown in FIG. 1 (excluding electrical components).
- the disassembled perspective view of the bus-bar circuit body shown in FIG. FIG. 2 is a plan view of the circuit structure shown in FIG. 1 (excluding electrical components).
- the principal part enlarged view of the VV cross section in FIG. The principal part enlarged view of the VI-VI cross section in FIG.
- FIG. 2 is a partially enlarged schematic cross-sectional view of the circuit configuration body shown in FIG. 1. It is a figure which shows the other aspect of the adhering means used for the circuit structure of this invention, Comprising:
- the principal part expanded sectional view corresponded in FIG.
- FIGS. 1 to 7 show a circuit structure 10 as an embodiment of the present invention.
- the circuit structure 10 includes a printed circuit board 12 having a printed wiring (not shown), a bus bar circuit body 16 including a plurality of bus bars 14, and a metal plate heat sink. 18 is comprised.
- the printed circuit board 12 on which the electrical component 20 such as a relay is mounted on the upper side is superposed and fixed to the bus bar circuit body 16, and the heat sink 18 is directly fixed to the lower side, whereby the circuit configuration A body 10 is configured.
- “upper” means the upper side in FIG. 1 where the printed circuit board 12 is located
- “lower” means the lower side in FIG. 1 where the heat sink 18 is located. .
- the bus bar circuit body 16 includes an upper insulating layer 22, a bus bar circuit 24 including a plurality of bus bars 14, and a lower insulating layer 26.
- the bus bar circuit 24 is a conventionally known one, and is formed by press punching and bending a conductive metal plate. Specifically, at both ends 28a and 28b in the width direction of the bus bar circuit 24, at one end 28a (the back side in FIG. 3), the ends of the plurality of bus bars 14 are bent into a crank shape and The tip portion has a tuning fork shape, and for example, a fuse connection terminal portion 30 for inserting and connecting a connection portion of an electrical component such as a fuse (not shown) is formed.
- the ends of the plurality of bus bars 14 are similarly bent into a crank shape, and are inserted into a connector housing (not shown), for example.
- a connector connection terminal portion 32 that functions as a metal fitting is formed.
- clinch portions 36 and 36 are formed at substantially the center portions in the width direction at both ends 34 a and 34 b in the longitudinal direction of the bus bar circuit 24. Specifically, at both end portions 34a and 34b in the longitudinal direction, a pair of slits 38 and 38 extending from the edge portions in the longitudinal direction are separated from each other in the width direction orthogonal to the longitudinal direction and the bus bar circuit 24 is provided. It penetrates in the thickness direction. A rectangular region sandwiched between the pair of slits 38 and 38 in the width direction is cut upward to form a clinch portion 36. As will be described later, the clinch portion 36 is bent toward the printed circuit board 12 superimposed on the bus bar circuit body 16 so that the bus bar circuit body 16 is fixed to the printed circuit board 12. It has become.
- the upper insulator layer 22 and the lower insulator layer 26 are both formed slightly smaller than the bus bar circuit body 16, and are particularly long in the longitudinal direction. The size is substantially the same as the distance between the clinch portions 36 and 36. As shown in FIG. 3, the upper insulator layer 22 and the lower insulator layer 26 are both approximately the same size, while the upper insulator layer 22 has an electrical component 20 described later. A plurality of through holes 40 for mounting the terminal portion 56 are provided.
- the upper insulator layer 22 and the lower insulator layer 26 are both made of a known insulating material such as a prepreg in which a glass fiber cloth is impregnated with an epoxy resin. In FIG.
- the upper insulator layer 22 is in a state called a so-called C stage in which a thermosetting resin such as an epoxy resin is completely cured, whereas the lower insulator layer 26 is thermoset.
- the state is called a so-called B stage where the conductive resin is not completely cured.
- the bus bar circuit 24 is sandwiched between the upper insulating layer 22 and the lower insulating layer 26 in such a state, and heat pressing is performed by applying heat and pressing.
- the thermosetting resin of the lower insulating layer 26 that is not completely cured melts, filling the gaps 42 (see FIGS. 3 and 5) between the bus bars 14 constituting the bus bar circuit 24 and the upper layer.
- the insulator layer 22 is fixed and integrated as an insulator layer.
- the bus bar circuit body 16 is integrally formed by embedding the bus bar 14 in the integrated insulator layers 22 and 26, while the bus bar circuit body 16
- the exposed portion 44 is formed in which a part of the upper surface of the bus bar 14 is exposed through the through hole 40 provided in the upper insulator layer 22.
- the lower insulator layer 26 is completely cured by being cooled after thermocompression bonding, so that it does not melt even if heat is applied next.
- a connector connecting terminal portion serving as a terminal portion is provided at an end portion 28 b (front side in FIG. 2) of the bus bar 14.
- 32 is integrally formed and protrudes from the insulator layers 22 and 26 to the outside. Further, as shown in FIG. 6, the connector connecting terminal portion 32 is bent so that the end portion of the bus bar 14 is folded, so that the plate thickness L1 of the connector connecting terminal portion 32 is the plate thickness of the bus bar 14. : Almost twice as large as L2. Accordingly, it is possible to reduce the plate thickness L2 of the intermediate portion in the longitudinal direction of the bus bar 14 constituting the circuit portion while securing the plate thickness L1 necessary for the connector connection terminal portion 32.
- the thickness of the entire insulator layers 22 and 26 can also be reduced, and the material cost of the bus bar circuit body 16 as a whole can be reduced or reduced in size. It is possible to advantageously reduce the thickness.
- the printed circuit board 12 is overlaid and fixed to the bus bar circuit body 16 configured as described above. Specifically, a surface 48 opposite to the mounting surface 46 on which the electrical component 20 of the printed circuit board 12 is mounted is superimposed on the bus bar circuit body 16, and the upper insulating layer 22 of the bus bar circuit body 16 is formed on the printed circuit board. 12 is fixed through a clinching portion 36 which is superposed on 12 and constitutes a fixing means.
- the clinching portion 36 is a bus bar that forms a bus bar circuit 24 that protrudes outward from the outer edge portions 50a and 50b in the longitudinal direction of the insulating layers 22 and 26 of the bus bar circuit body 16. 14 end portions 34a and 34b. Then, as shown in FIG. 5, the tip end portion of the clinch portion 36 cut and raised upward at the end portions 34 a and 34 b of the bus bar 14 is bent toward the printed circuit board 12 and is an upper layer insulator. By sandwiching the printed circuit board 12 between the layer 22 and the tip of the clinching portion 36, the upper insulating layer 22 of the bus bar circuit body 16 is fixed to the printed circuit board 12.
- the bus bar circuit body 16 is fixed to the printed circuit board 12 by mechanical fixing means by the clinching portion 36, the influence of heating when soldering the electrical component 20 to the printed circuit board 12, which will be described later, is affected. Without further receiving, the state of the bus bar circuit body 16 fixed to the printed circuit board 12 can be maintained firmly and stably.
- the printed circuit board 12 has substantially the same shape as the upper insulating layer 22 constituting the bus bar circuit body 16, and corresponds to the exposed portion 44 of the bus bar circuit body 16.
- a through-hole 52 is formed at a position where it does. Thereby, a part of the upper surface of the bus bar 14 is exposed on the mounting surface 46 of the printed circuit board 12.
- 56 and 56 can be mounted by reflow soldering using lead-free solder 58 or the like.
- the manufacturing process can be simplified. Can do.
- a tie bar cutting step of cutting a tie bar (not shown) temporarily connecting a plurality of bus bars 14, or a bending step of bending the ends of the bus bar 14 to form the fuse connection terminal portion 30 and the connector connection terminal portion 32.
- this is performed after reflow soldering in this embodiment, these steps may be performed before reflow soldering.
- the bus bar 14 is shown in a shape in which tie bar cutting and bending are completed in all the drawings.
- a heat sink 18 made of a metal plate having a shape slightly larger than the flat portion is directly fixed by a known heat conductive adhesive such as an epoxy resin (not shown).
- the heat sink 18 made of a metal plate can be directly fixed to the bus bar circuit body 16. Therefore, it is possible to eliminate an insulating member separately prepared when the heat sink is attached to the bus bar circuit body, thereby reducing the number of parts, simplifying the structure, and facilitating manufacture.
- the circuit structure 10 is configured with the bus bar 14 embedded in the integrated insulator layers 22 and 26, and the bus bar circuit An insulating layer 22 that is an upper layer of the body 16 is superposed on the printed circuit board 12 and fixed through a clinching portion 36 that constitutes a fixing means. Therefore, even when the circuit component 10 is heated and the surface plating of the bus bar 14 is melted when the electrical component 20 is mounted by soldering, the insulation of the upper layer constituting the fixing surface of the bus bar circuit body 16 to the printed circuit board 12 is obtained. The melting of the plating does not affect the body layer 22 at all, and the fixed state is stably maintained.
- bus bar circuit body 16 is integrally formed by embedding the bus bar 14 in the integrated insulator layers 22 and 26, the handleability and insulation of the bus bar circuit body 16 are improved. Figured.
- the fixing means is configured by the adhesive sheet 66 interposed between the upper insulating layer 22 of the bus bar circuit body 16 and the surface 48 opposite to the mounting surface 46 of the printed circuit board 12.
- the upper insulating layer 22 and the printed circuit board 12 are fixed to each other by the adhesive sheet 66, so that the circuit structure 64 has substantially the same structure as the circuit structure 10 of the previous embodiment. Therefore, the same effect can be obtained.
- a wide range of the contact surface of the upper insulating layer 22 of the bus bar circuit body 16 to the printed circuit board 12 is stably fixed to the surface 48 opposite to the mounting surface 46 of the printed circuit board 12 through the adhesive sheet 66. can do.
- the adhesive sheet 66 is directly bonded to the upper insulator layer 22 and is separated from the plated portion on the surface of the bus bar 14, the influence on the adhesive force due to melting of the plating on the surface of the bus bar 14 can be eliminated. Can be advantageously maintained in a stable state.
- the example in which the adhesive sheet 66 is used as the fixing means instead of the clinching portion 36 is shown.
- both the clinch portion 36 and the adhesive sheet 66 are used as the fixing means, and the printed circuit board 12 and the bus bar circuit Further fixing stability of the body 16 may be achieved.
- the fixing means may be any means as long as the insulator layer 22 on the upper layer of the bus bar circuit body 16 is attached to the surface 48 opposite to the mounting surface 46 of the printed circuit board 12 with its relative position fixed. It may be an adhesive interposed between the upper insulating layer 22 and the printed circuit board 12, or may be constituted by bolts and nuts that sandwich the upper insulating layer 22 and the printed circuit board 12.
- the bus bar circuit body 16 includes a method in which the bus bar 14 is sandwiched from both front and back sides by thermocompression bonding as illustrated, and an insulating layer made of a synthetic resin is provided around the bus bar 14 using the bus bar 14 as an insert. It may be configured by molding.
Abstract
Description
Claims (6)
- 複数本のバスバーにより構成されるバスバー回路体が、プリント配線を有するプリント基板に重ね合されて固着されてなる回路構成体において、
絶縁体層に前記バスバーが埋設されることにより前記バスバー回路体が一体的に構成されていると共に、該バスバー回路体には、前記絶縁体層に設けられた貫通孔を通じて前記バスバーの一部が露呈された露呈部が形成されている一方、
前記バスバー回路体の前記絶縁体層が前記プリント基板に重ね合されて固着手段を介して固着されており、
前記バスバー回路体の前記露呈部と、前記プリント基板の前記プリント配線に対して電気部品の端子部が半田付けされて実装されている
ことを特徴とする回路構成体。 - 前記バスバー回路体において、前記バスバーの端部に端子部が一体形成されて前記絶縁体層から外部に突出している一方、前記端子部の板厚が、前記バスバーの端部を折り重ねることで厚くされている請求項1に記載の回路構成体。
- 前記固着手段が、前記バスバー回路体の前記絶縁体層の外縁部から外方に突出した前記バスバーの端部に設けられたクリンチ部によって構成されており、前記クリンチ部を前記絶縁体層が重ね合された前記プリント基板に向かって屈曲して前記絶縁体層と前記クリンチ部の間に前記プリント基板を挟持することにより、前記バスバー回路体の前記絶縁体層が前記プリント基板に固着されている請求項1又は2に記載の回路構成体。
- 前記固着手段が、前記バスバー回路体の前記絶縁体層と前記プリント基板の間に介在された接着シートによって構成されている請求項1~3の何れか1項に記載の回路構成体。
- 前記バスバー回路体の前記プリント基板への重ね合わせ面と反対側の面には、金属板製のヒートシンクが直接固着されている請求項1~4の何れか1項に記載の回路構成体。
- 前記プリント基板の実装面と反対側の面が前記バスバー回路体に重ね合わされている一方、前記プリント基板には前記バスバー回路体の前記露呈部に対応する位置に貫通孔が形成されており、前記プリント基板の前記実装面に前記バスバーが露呈されている請求項1~5の何れか1項に記載の回路構成体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/024,391 US9949363B2 (en) | 2013-09-24 | 2014-09-03 | Circuit assembly |
EP14848589.9A EP3051642A4 (en) | 2013-09-24 | 2014-09-03 | CIRCUIT |
CN201480052546.XA CN105580227B (zh) | 2013-09-24 | 2014-09-03 | 电路构成体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-196764 | 2013-09-24 | ||
JP2013196764A JP5995147B2 (ja) | 2013-09-24 | 2013-09-24 | 回路構成体 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015045767A1 true WO2015045767A1 (ja) | 2015-04-02 |
Family
ID=52742914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/073241 WO2015045767A1 (ja) | 2013-09-24 | 2014-09-03 | 回路構成体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9949363B2 (ja) |
EP (1) | EP3051642A4 (ja) |
JP (1) | JP5995147B2 (ja) |
CN (1) | CN105580227B (ja) |
WO (1) | WO2015045767A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017013317A (ja) * | 2015-06-30 | 2017-01-19 | 北川工業株式会社 | インサート成形品 |
EP3291334A4 (en) * | 2015-07-20 | 2018-03-21 | LG Chem, Ltd. | Electrode lead connecting structure, battery module comprising electrode lead connecting structure, and battery pack comprising battery module |
WO2018105409A1 (ja) * | 2016-12-05 | 2018-06-14 | 株式会社オートネットワーク技術研究所 | 回路装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6397692B2 (ja) * | 2014-08-20 | 2018-09-26 | 日立オートモティブシステムズ株式会社 | リアクトルおよびそれを用いたdc−dcコンバータ |
JP6593597B2 (ja) * | 2016-03-16 | 2019-10-23 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6499124B2 (ja) * | 2016-06-30 | 2019-04-10 | 矢崎総業株式会社 | 導電部材および電気接続箱 |
JP6620941B2 (ja) * | 2016-08-22 | 2019-12-18 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
KR101989859B1 (ko) * | 2016-12-15 | 2019-09-30 | 주식회사 아모그린텍 | 파워 릴레이 어셈블리 |
WO2018173282A1 (ja) * | 2017-03-24 | 2018-09-27 | 矢崎総業株式会社 | 電気接続箱およびワイヤハーネス |
JP2019102488A (ja) * | 2017-11-28 | 2019-06-24 | 株式会社オートネットワーク技術研究所 | 回路基板及び回路基板の製造方法 |
JP6988729B2 (ja) * | 2018-07-31 | 2022-01-05 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
EP3629687A1 (de) * | 2018-09-26 | 2020-04-01 | Siemens Aktiengesellschaft | Verfahren für eine montage eines elektrischen geräts |
JP7223266B2 (ja) * | 2019-03-29 | 2023-02-16 | 日本ケミコン株式会社 | バスバー積層体及びそれを備える電子部品実装モジュール、電子部品実装モジュールの製造方法 |
JP6727367B1 (ja) * | 2019-03-29 | 2020-07-22 | 三菱電機株式会社 | プリント配線板および電力変換装置 |
US11495908B2 (en) * | 2019-04-01 | 2022-11-08 | Aptiv Technologies Limited | Electrical connector assembly with liquid cooling features |
EP3761763A1 (en) * | 2019-07-03 | 2021-01-06 | Schaffner EMV AG | Filter with busbar assembly |
US11539158B2 (en) | 2019-09-09 | 2022-12-27 | Aptiv Technologies Limited | Electrical terminal seal and electrical connector containing same |
DE102020203560A1 (de) * | 2020-03-19 | 2021-09-23 | Ellenberger & Poensgen Gmbh | Stromverteiler eines Bordnetzes eines Kraftfahrzeugs |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000333343A (ja) * | 1999-05-18 | 2000-11-30 | Yazaki Corp | バッテリ接続プレートとその製造方法 |
US20010025718A1 (en) * | 2000-03-31 | 2001-10-04 | Mitsuko Maruyama | Bus bar wiring plate body for electric coupling box |
JP2001275230A (ja) * | 2000-03-27 | 2001-10-05 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP2001352642A (ja) * | 2000-06-08 | 2001-12-21 | Auto Network Gijutsu Kenkyusho:Kk | 電気接続箱内におけるバスバー・プリント基板の接続構造 |
JP2003164039A (ja) | 2001-11-26 | 2003-06-06 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体及びその製造方法 |
JP2006005096A (ja) * | 2004-06-16 | 2006-01-05 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
JP2007306672A (ja) | 2006-05-09 | 2007-11-22 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3155767A (en) * | 1962-01-30 | 1964-11-03 | Rca Corp | Connecting arrangement in electronic modular structures |
JP2001327041A (ja) * | 2000-05-12 | 2001-11-22 | Yazaki Corp | 配線板 |
DE10254910B4 (de) * | 2001-11-26 | 2008-12-24 | AutoNetworks Technologies, Ltd., Nagoya | Schaltkreisbildende Einheit und Verfahren zu deren Herstellung |
JP4059097B2 (ja) * | 2003-02-14 | 2008-03-12 | 住友電装株式会社 | 回路構成体 |
JP4276526B2 (ja) * | 2003-11-26 | 2009-06-10 | 矢崎総業株式会社 | 電気接続箱や自動車の補機を制御する電子ユニットの構成部品とされるブスバー成形体及びその製造方法並びに電子ユニット |
JP4304111B2 (ja) * | 2004-04-06 | 2009-07-29 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP4299184B2 (ja) * | 2004-04-23 | 2009-07-22 | 矢崎総業株式会社 | 基板接続用板端子 |
US7632110B2 (en) * | 2004-11-29 | 2009-12-15 | Autonetworks Technologies, Ltd. | Electric junction box |
CN102017346B (zh) * | 2005-04-21 | 2012-11-28 | 株式会社自动网络技术研究所 | 电连接盒 |
JP4556135B2 (ja) * | 2005-08-22 | 2010-10-06 | 住友電装株式会社 | 基板用コネクタ |
JP4594198B2 (ja) * | 2005-09-02 | 2010-12-08 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP6006928B2 (ja) * | 2011-11-02 | 2016-10-12 | 東京応化工業株式会社 | 高分子化合物の製造方法 |
-
2013
- 2013-09-24 JP JP2013196764A patent/JP5995147B2/ja not_active Expired - Fee Related
-
2014
- 2014-09-03 EP EP14848589.9A patent/EP3051642A4/en not_active Withdrawn
- 2014-09-03 CN CN201480052546.XA patent/CN105580227B/zh not_active Expired - Fee Related
- 2014-09-03 WO PCT/JP2014/073241 patent/WO2015045767A1/ja active Application Filing
- 2014-09-03 US US15/024,391 patent/US9949363B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000333343A (ja) * | 1999-05-18 | 2000-11-30 | Yazaki Corp | バッテリ接続プレートとその製造方法 |
JP2001275230A (ja) * | 2000-03-27 | 2001-10-05 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
US20010025718A1 (en) * | 2000-03-31 | 2001-10-04 | Mitsuko Maruyama | Bus bar wiring plate body for electric coupling box |
JP2001352642A (ja) * | 2000-06-08 | 2001-12-21 | Auto Network Gijutsu Kenkyusho:Kk | 電気接続箱内におけるバスバー・プリント基板の接続構造 |
JP2003164039A (ja) | 2001-11-26 | 2003-06-06 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体及びその製造方法 |
JP2006005096A (ja) * | 2004-06-16 | 2006-01-05 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
JP2007306672A (ja) | 2006-05-09 | 2007-11-22 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3051642A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017013317A (ja) * | 2015-06-30 | 2017-01-19 | 北川工業株式会社 | インサート成形品 |
EP3291334A4 (en) * | 2015-07-20 | 2018-03-21 | LG Chem, Ltd. | Electrode lead connecting structure, battery module comprising electrode lead connecting structure, and battery pack comprising battery module |
US10403876B2 (en) | 2015-07-20 | 2019-09-03 | Lg Chem, Ltd. | Electrode lead connecting structure, battery module comprising electrode lead connecting structure, and battery pack comprising battery module |
WO2018105409A1 (ja) * | 2016-12-05 | 2018-06-14 | 株式会社オートネットワーク技術研究所 | 回路装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105580227B (zh) | 2019-04-09 |
CN105580227A (zh) | 2016-05-11 |
EP3051642A1 (en) | 2016-08-03 |
JP2015065721A (ja) | 2015-04-09 |
EP3051642A4 (en) | 2016-10-19 |
US20160234928A1 (en) | 2016-08-11 |
JP5995147B2 (ja) | 2016-09-21 |
US9949363B2 (en) | 2018-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5995147B2 (ja) | 回路構成体 | |
US10576912B2 (en) | Circuit assembly and electrical junction box | |
US10090657B2 (en) | Circuit assembly, connected busbar structure, and electrical junction box | |
US8091218B2 (en) | Method of manufacturing a rigid printed wiring board | |
KR100867396B1 (ko) | 적층 기판의 제조 방법 | |
WO2015170583A1 (ja) | 回路構成体および電気接続箱 | |
JP5222641B2 (ja) | 回路構成体 | |
WO2015045768A1 (ja) | 回路構成体 | |
JP4582717B2 (ja) | 回路構成体 | |
WO2015174263A1 (ja) | 回路構成体および電気接続箱 | |
JP4963281B2 (ja) | 電線とプリント基板との接続構造 | |
JP2010283014A (ja) | 電力変換装置及びその製造方法 | |
JP5561521B2 (ja) | 電気接続箱 | |
JP2014096260A (ja) | フラット配線材及びそれを用いた実装体 | |
JP2012228082A (ja) | 回路構成体及び電気接続箱 | |
WO2023119787A1 (ja) | 基板表面実装ヒューズ、及び基板表面実装ヒューズの製造方法 | |
WO2023176158A1 (ja) | 端子台及びその製造方法 | |
JP5660472B2 (ja) | プリント配線板 | |
JP2008092726A (ja) | 回路材および回路材の形成方法 | |
JP4132990B2 (ja) | 電気的接合構造 | |
JP5800076B2 (ja) | 電子装置および電子装置の取付構造 | |
JP2013094986A (ja) | 複合基板および複合基板の製造方法 | |
JP2015082890A (ja) | 回路構成体、電気接続箱及び回路構成体の製造方法 | |
JP2015002200A (ja) | 配線基板とその製造方法および他基板との接続体 | |
CN111385981A (zh) | 多样化装配印刷线路板及制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201480052546.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14848589 Country of ref document: EP Kind code of ref document: A1 |
|
REEP | Request for entry into the european phase |
Ref document number: 2014848589 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014848589 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15024391 Country of ref document: US |