WO2015007088A1 - 用于向面板贴附覆晶膜的装置及其使用方法 - Google Patents

用于向面板贴附覆晶膜的装置及其使用方法 Download PDF

Info

Publication number
WO2015007088A1
WO2015007088A1 PCT/CN2014/071667 CN2014071667W WO2015007088A1 WO 2015007088 A1 WO2015007088 A1 WO 2015007088A1 CN 2014071667 W CN2014071667 W CN 2014071667W WO 2015007088 A1 WO2015007088 A1 WO 2015007088A1
Authority
WO
WIPO (PCT)
Prior art keywords
distance
panel
component
support mechanism
chip
Prior art date
Application number
PCT/CN2014/071667
Other languages
English (en)
French (fr)
Inventor
陈方甫
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/240,369 priority Critical patent/US20150026962A1/en
Publication of WO2015007088A1 publication Critical patent/WO2015007088A1/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10681Tape Carrier Package [TCP]; Flexible sheet connector
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49004Electrical device making including measuring or testing of device or component part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component

Definitions

  • the invention relates to the field of manufacturing liquid crystal modules, in particular to a device for applying a flip chip to a panel.
  • the invention also relates to a method of using such a device. Background technique
  • the liquid crystal panel includes a panel and a flip chip attached to the panel.
  • the thickness of the flip chip is small and is generally referred to as a flip chip (C()F).
  • C()F flip chip
  • a flip chip attaching device is generally used.
  • Fig. 1 shows a schematic view of a prior art device for attaching a flip chip to a dry panel.
  • the indenter 110 is first exposed to the crystal film.
  • the panel 140 is moved to the position of the indenter 110 by the servo platform 130, and a supporting mechanism 150 for supporting is provided at a position directly below the panel 140.
  • the flip chip 120 is attached to the panel 140 by the common spoofing of the ram 110 and the support mechanism 150.
  • the device is designed to have a gap 160 between the panel 140 and the support 150. When the indenter 110 is pressed, the gap 160 causes the panel 140 to bend, resulting in a flip chip!
  • the attachment of 20 produces an offset which adversely affects the quality of the product. Summary of the invention
  • the present invention proposes a device for attaching a flip chip to a panel, aiming at reducing the distance between the panel and the supporting mechanism, thereby avoiding the sticking of the flip chip. ⁇ The offset is generated to improve the quality of the product.
  • the invention also relates to a method of using such a device.
  • a device for attaching a flip chip to a panel comprising a platform for transporting the panel, a head for carrying the flip chip, and a panel for use with the indenter
  • the support mechanism wherein the device further comprises a pitch adjustment mechanism for determining a distance between the panel and the support mechanism and reducing the distance after the panel is sent between the indenter and the support mechanism.
  • the pitching mechanism comprises a distance measuring assembly for measuring the distance between the panel and the support mechanism and a power assembly for moving the platform according to the distance to reduce the distance.
  • the ranging assembly is fixedly mounted to the support mechanism. In this way, the distance measuring component is fixed, and only the platform is moving, so that the distance measuring component can accurately measure the distance between the panel and the platform with the supporting mechanism as a reference object, thereby accurately controlling the motion of the platform.
  • the distance adjusting mechanism comprises a distance measuring assembly for measuring the distance between the panel and the supporting mechanism and the movement of the supporting mechanism according to the distance is reduced Small distance power components.
  • the distance measuring component is a photoelectric distance measuring device.
  • the power component is a servo motor.
  • the pitching mechanism also includes a data processing unit communicatively coupled to the ranging component and the power component to control operation of the power component based on the distance measured by the ranging component.
  • the data processing unit is a programmable logic controller. In this way, optical distance traceback technology and programmable logic control technology can be combined to facilitate automatic control, reduce the labor intensity of personnel, and avoid the risk of human error.
  • the data processing unit, the ranging component and the power component are in wireless communication.
  • a method of using the apparatus comprising: step 1: passing a panel through a platform between a head carrying a flip chip and a support mechanism; Two: adjust the distance between the panel and the supporting mechanism to a predetermined value by the pitch adjusting mechanism; Step 3; The indenter moves toward the panel and pastes the flip chip on the panel.
  • the distance between the indenter and the supporting mechanism is greater than the thickness of the panel. This makes it easy to place the panel between the indenter and the support mechanism: >
  • the distance is adjusted to be between 0.1 and 0.2 ⁇ .
  • the distance of this range has been sufficiently small to avoid the problem that the flip chip is displaced when the flip chip is pasted.
  • the present invention has an advantage in that the device according to the present invention uses a pitch adjustment mechanism, which can reduce the distance between the panel and the support mechanism and make the panel and the support mechanism precisely contact, thereby greatly reducing the pressure.
  • the distance adjustment mechanism includes photoelectric range finder, servo motor and programmable logic controller. This combines optical distance detection technology and programmable logic control technology to facilitate automatic control, reduce the labor intensity of personnel, and avoid human error. risk.
  • the invention will be described in more detail hereinafter based on the embodiments and with reference to the drawings.
  • Figure 2 is a schematic illustration of an apparatus for attaching a film to a panel in accordance with the present invention
  • Figure 3 is a schematic illustration of the attachment of a device according to the present invention to a panel with a flip chip attached thereto.
  • Fig. 2 schematically shows a device 10 C for attaching a flip chip to a panel according to the present invention, hereinafter referred to as device 10).
  • the apparatus 10 includes a platform 1], a ram 12, and a support mechanism 13 for use with the ram 12 (e.g., the ram 2 and the support 13 are diametrically opposed) and a pitching mechanism.
  • the platform 11 is used for transporting the panel] 5
  • the indenter 12 is used to carry the flip chip 16
  • the pitch adjusting mechanism is used to measure the panel 15 and the support after the panel 15 is sent between the indenter 2 and the supporting mechanism 13 The distance between the mechanisms 13 and reduces this distance.
  • the device 10 also includes other components which are well known to those skilled in the art and will not be described herein for the sake of brevity.
  • the pitch adjustment mechanism includes a distance measuring assembly 30 for measuring the distance between the panel 15 and the support mechanism 13, the power assembly 31 for driving the platform 11 to move up and down, and the data from the ranging assembly 30 and thereby A data processing unit 32 that controls the operation of the power unit 31.
  • the term "upper” is defined as the direction away from the panel 15, and the term “lower” is defined as the direction toward the panel 15.
  • the ranging assembly 30, the power assembly 31 and the data processing unit 32 are connected together by a cable 33 to form a complete loop.
  • the ranging component 30, the power component 31, and the data processing unit 32 can also perform data transmission using a wireless manner, so that the device 10 is more clean overall, and the entire device 10 is prevented from being damaged by the cable 33. Damage.
  • the distance measuring assembly 30 is fixedly mounted on the support mechanism 13. When the distance between the panel i5 and the support mechanism 13 is adjusted, the support mechanism 13 does not move, and only the panel 15 is moved toward the support mechanism 13 by the platform il. Thus, the distance measuring unit 30 can accurately measure the distance between the panel 15 and the support mechanism 13 with the support mechanism 13 as a reference, so that the movement of the panel 15 can be accurately controlled.
  • the ranging component 30 is a photoelectric range finder
  • the power component 31 is a servo motor
  • the data processing unit 32 is a programmable logic controller (ie, a PLC). It should also be understood that although it is disclosed in the present invention that the distance between the panel 15 and the support mechanism 3 is reduced by moving the panel 15, the panel 15 and the support mechanism 13 can also be reduced by moving the support mechanism 13. The distance between them.
  • the upper panel i5 is loaded on the stage 11, and the flip chip 16 is loaded on the indenter 12.
  • the distance between the indenter i2 and the support mechanism 13 is greater than the thickness of the panel 15, in one embodiment 5 to 20 mm, to enable the panel 15 to be placed between the indenter 12 and the support mechanism 13.
  • the panel 15 is placed between the ram 12 and the support mechanism 13 (as shown in Figure 2), and the distance measuring assembly 30 (e.g., photoelectric range finder) measures the distance 14 between the panel 15 and the support mechanism 13.
  • the distance measuring assembly 30 e.g., photoelectric range finder
  • the data processing unit 32 is in the distance data from the ranging unit 30 and controls the operation of the power unit 31 based on the distance data, thereby causing the platform 11 to move up and down, and adjusting the distance 14 between the panel 5 and the support mechanism 13 to a predetermined value ( As shown in Figure 3) .
  • the distance is adjusted to be between 0.1 and 0.2 ⁇ .
  • the indenter 2 moves toward the panel 15 and the flip chip 16 is attached to the panel 15 to complete the epitaxial film 16. Since the distance between the face plate 15 and the support mechanism 3 is already sufficiently small, the problem of the offset of the flip chip 16 when the film is superposed on the film is avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

一种用于向面板(15)贴附覆晶膜(16)的装置(10),包括用于运送面板(15)的平台(11)、用于携带覆晶膜(16)的压头(12)以及与所述压头(12)配合使用的面板支撑机构(13)。还包括调距机构,在将面板(15)送到压头(12)和支撑机构(13)之间后,测定面板(15)与支撑机构(13)之间的距离并减小所述距离。该装置(10)能避免覆晶膜的贴附产生偏移,提高产品的品质。还公开了装置(10)的使用方法。

Description

用于向面板贴附覆晶膜的装置及其使用方法 技术领域
本发明涉及液晶模组制造领域, 特别是一种用于向面板贴對覆晶膜的装置。 本发明还涉及使用这种装置的方法。 背景技术
液晶面板包括有面板 (Lead)和贴附在面板上的覆晶膜。 覆晶膜的厚度很小, 通常称之为覆晶薄膜 (C()F)。 为了实现在面板上贴 i 覆晶薄膜, 通常使用覆晶薄 膜贴附装置, 图 1显示了现有技术中的用干向面板贴跗覆晶膜的装置的示意图。
在向面板上贴附覆晶薄膜过程中, 首先压头 110吸爾覆晶薄膜】20。 接着, 通过伺服平台 130将面板 140移动至压头 110的位置处, 在面板 140正下方位置 处设有起支撑作用的支撑机构 150。 通过压头 110与支撑机构 150的共同诈 ¾, 完成向面板 140上贴^覆晶薄膜 120。在贴附覆晶薄膜过程中,为了防止面板 140 与支撑机构 150产生相互作 因此将装置设计为在面板 140与支撑 构 150存 在间隙 160。 在压头 110 T压时, 间隙 160会导致面板 140发生弯曲, 从而造成 覆晶薄膜!20的贴附产生偏移, 这会对产品的品质产生不良影响。 发明内容
针对现有技术中所存在的上述技术问题, 本发明提出了一种用于向面板贴跗 覆晶膜的装置, 旨在减小面板和支撑机构之间的距离, 从而避免覆晶薄膜的贴跗 产生偏移, 提高产品的品质。 本发明还涉及使用这种装置的方法。
1 ) 根据本发明的第一方面, 提出了一种 ¾于向面板贴附覆晶膜的装置, 包 括用于运送面板的平台、 于携带覆晶膜的压头以及与压头配合使用的面板支撑 机构, 其中, 装置还包括调距机构, 以在将面板送到压头和支撑机构之间后, 测 定面板与支撑机构之间的距离并减小该距离。
根据本发明的装置, 在调距机构的作用下, 能够减小面板与支撑机构之间的 距离并使得面板与支撑机构精密接触, 丛而大幅减小了在压头下压时面板的弯 曲, 覆晶膜的贴^也就不再会偏移, A认而能提高产品的品质。 2)在本发明的第 1 )项的一个优选实施方式中, 调距机构包括用于测量面板 与支撑机构之间的距离的测距组件和根据距离驱动平台运动以减小距离的动力 组件。 在一个优选地实施例中, 测距组件固定安装在支撑机构上。 这样, 测距组 件为固定, 仅平台为运动, 从而测距组件能以支撑机构为参照物而精确测量面板 与平台之间的距离, 进而精确控制平台的运动。
3 ) 在本发明的第 1 ) 项或第 2) 项的一个优选实施方式中, 调距机构包括用 于测量面板与支撑机构之间的距离的测距组件和根据距离驱动支撑机构运动以 减小距离的动力组件。
4 ) 在本发明的第 1 ) 项到第 3 ) 项的一个优选实施方式中, 測距组件为光电 测距器。 动力组件为伺服电机。 调距机构还包括与測距组件和动力组件通信式连 接的数据处理单元以根据测距组件测得的距离控制动力组件的运转。 数据处理单 元为可编程逻辑控制器。 这样, 可结合使用光学距离探溯技术和可编程逻辑控刺 技术, 便于实现自动控制, 降低人员的劳动强度, 也避免了人为操作失误的风险。 优选地, 数据处理单元、 测距组件和动力组件之间为无线通信。
5 ) 根据本发明的第二方面, 提出了使用根据上文所述的装置的方法, 包括: 歩骤一: 通过平台将面板送到携带有覆晶膜的压头和支撑机构之间; 步骤二: 通过调距机构将面板与支撑机构之间的距离调整到预定值; 步骤三; 压头朝向面板运动并且将覆晶膜贴對到面板上。
6)在本发明的第 5 )项的一个优选实施方式中, 在步骤一种, 压头和支撑机 构之间的距离大于面板的厚度。 这样能方便地将面板放入到压头和支撑机构之 间:>
7) 在本发明的第 5 ) 项或第 6) 项的一个优选实施方式中, 在步骤二中, 将 距离调整到 0.1〜0.2μίη之间。 这种范围的距离己经足够小而能够避免在贴跗覆晶 膜时, 覆晶膜发生偏移的问题。
与现有技术相比, 本发明的优点在于, 根据本发明的装置使用了调距机构, 能够减小面板与支撑机构之间的距离并使面板与支撑机构精密接触, 从而大幅减 小在压头下压 面板的弯曲, 覆晶膜的贴^也就不再会偏移, 从而能提高产品的 品质。 调距机构包括光电测距器、 伺服电机和可编程逻辑控制器, 这结合使用光 学距离探测技术和可编程逻辑控制技术, 便于实现自动控制, 降低人员的劳动强 度, 也避免了人为操作失误的风险。 在下文中将基于实施例并参考^图来对本发明进行更详细的描述。 其中- 图 1是现有技术中的用于向面板贴^覆晶膜的装置的示意图;
图 2是根据本发明的用于向面板贴 覆晶膜的装置的示意图;
图 3是使 ^根据本发明的装置贴向面板贴附覆晶膜的示意图。
在 it图中,相同的部件使 ffl相同的附图标记。附图并未按照实际的比例绘制。 具体实施方式
下面将结合 ϋ图对本发明做进一步说明。
图 2示意性地显示了根据本发明的用于向面板贴跗覆晶膜的装置 10 C以下称 之为装置 10) 。 装置 10包括平台 1】、 压头 12、 与压头 12配合使用的支撑机构 13 (例如, 压头】2和支撑 构 13为正相对。 ) 以及调距机构。 其中, 平台 11 用于运送面板】5, 压头 12用于携带覆晶膜 16, 调距机构用于在将面板 15送到 压头】 2和支撑机构 13之间后, 测定面板 15与支撑机构 13之间的距离并减小该 距离。 当然, 装置 10还包括其他部件, 这些部件是本领域的技术人员所熟知的, 为了简单起见, 这里不再赘述。
如图 2所示, 调距机构包括用于测量面板 15与支撑机构 13之间的距离的测 距组件 30, 驱动平台 11上下运动的动力组件 31和处于来自测距组件 30的数据 并由此控制动力组件 31运转的数据处理单元 32。 在本申请中, 用语 "上"规定 为远离面板 15的方向, 用语 "下"规定为朝向面板 15的方向。 测距组件 30、 动 力组件 31和数据处理单元 32通过线缆 33连接在一起形成完整的回路。 在一个 实施例中, 测距组件 30、动力组件 31和数据处理单元 32还可以使用无线方式进 行数据传送, 使得装置 10整体上更加筒洁, 也避免了误损坏线缆 33而造成整个 装置 10的损坏。
为了能精确地控制面板 15的运动以减小面板 15与支撑机构 13之间的距离, 在一个实施例中, 将测距组件 30固定安装在支撑机构 13上。 在调整面板 i5与 支撑机构 13之间的距离时, 支撑机构 13不动, 仅面板 15在平台 i l的带动下朝 向支撑机构 13运动。 这样, 测距组件 30就能够以支撑机构 13为参照物精确测 量面板 15与支撑机构 13之间的距离, 从而能精确地控制面板 15的运动。 在一 个具体的实施例中, 測距组件 30为光电测距器、 动力组件 31为伺服电机、 数据 处理单元 32为可编程逻辑控制器 (即 PLC) 。 还应理解地是, 虽然在本发明中 公开了通过移动面板 15来减小面板 15与支撑机构】3之间的距离, 但是还可以 通过移动支撑机构 13来减小面板 15与支撑机构 13之间的距离。
下面结合附图 2和 3来描述使用装置 10进行检测的方法。
首先, 在平台 11上装载上面板 i5 , 在压头 12上装载覆晶膜 16。 压头 i2和 支撑机构 13之间的距离大于面板 15的厚度, 在一个实施例中为 5〜20mm以能够 将面板 15放置到压头 12和支撑机构 13之间。 接着, 将面板 15放置到压头 12 和支撑机构 13之间 (如图 2所示) , 测距组件 30 (例如光电测距器) 测量面板 15和支撑机构 13之间的距离 14。 数据处理单元 32处于来自测距单元 30的距离 数据并根据该距离数据来控制动力组件 31的运转, 从而带动平台 11上下运动, 将面板 5和支撑机构 13之间的距离 14调整到预定值 (如图 3所示) 。 在一个 实施例中, 将该距离调整到 0.1〜0.2μίη之间。 最后, 压头】 2朝向面板 15运动并 且将覆晶膜 16贴爾到面板 15上, 完成贴爾覆晶膜 16。 由于面板 15和支撑机构 】3之间的距离已经足够小,因此避免了在贴爾覆晶膜 16时覆晶膜 16偏移的问题。
虽然已经参考优选实施例对本发明进行了描述, 但在不脱离本发明的范围的 情况下, 可以对其进行各种改进并且可以用等效物替换其中的部件。 尤其是, 只 要不存在结构冲突, 各个实施例中所提到的各项技术特征均可以任意方式组合起 来。 本发明并不局限于文中公幵的特定实施例, 而是包括落入权利要求的范围内 的所有技术方案。

Claims

权利要求书
1 . 一种用于向面板贴 Pfi覆晶膜的装置, 包括用于运送面板的平台、 用于携 带覆晶膜的压头以及与所述压头配合使用的面板支撑机构,
其中, 所述装置还包括调距机构, 以在将面板送到压头和支撑机构之间后, 测定所述面板与所述支撑机构之间的距离并减小所述距离。
2. 根据权利要求 1 所述的装置, 其中, 所述调距 构包括用于测量所述面 板与所述支撑机构之间的距离的测距组件和根据所述距离驱动所述平台运动以 减小所述距离的动力组件。
3. 根据权利要求 2 所述的装置, 其中, 所述测距组件为光电测距器, 所述 动力组件为伺服电机。
4. 根据权利要求 3 所述的装置, 其中, 所述调距机构还包括与劉距组件和 动力组件通信式连接的数据处理单元以根据所述测距组件测得的距离控制所述 动力组件的运转。
5 , 根据权利要求 4所述的装置, 其中, 所述数据处理单元、 测距组件和动 力组件之间为无线通信。
6. 根据权利要求 5 所述的装置, 其中, 所述数据处理单元为可编程逻辑控 制器。
7. 根据权利要求 6所述的装置, 其中, 所述測距组件固定安装在所述支撑 机构上。
8. 根据权利要求 1 所述的装置, 其中, 所述调距机构包括用于测量所述面 板与所述支撑 构之间的距离的测距组件和根据所述距离驱动所述支撑机构运 动以减小所述距离的动力组件。
9. 根据权利要求 8 所述的装置, 其中, 所述测距组件为光电测距器, 所述 动力组件为伺服电机。
10. 根据权利要求 9所述的装置, 其中, 所述调距机构还包括与测距组件和 动力组件通信式连接的数据处理单元以根据所述测距组件测得的距离控制所述 动力组件的运转。
11 . 根据权利要求 10所述的装置, 其中, 所述数据处理单元、 测距组件和 动力组件之间为无线通信。
12. 根据权利要求 i i 所述的装置, 其中, 所述数据处理单元为可编程逻辑 控制器。
13. 一种使用根据权利要求〗所述的装置的方法, 包括- 歩骤一: 通过平台将面板送到携带有覆晶膜的压头和支撑机构之间; 步骤二: 通过调距机构将所述面板与所述支撑机构之间的距离调整到预定 值;
步骤三: 所述压头朝向所述面板运动并且将覆晶膜贴^到所述面板上。
14. 根据权利要求 3 所述的方法, 其中, 在所述步骤一中, 压头和支撑机 构之间的距离大于所述面板的厚度。
15. 根据权利要求 14所述的方法, 其中, 在所述步骤二中, 将所述距离调 整到 0.1〜0.2μηι之间。
PCT/CN2014/071667 2013-07-19 2014-01-28 用于向面板贴附覆晶膜的装置及其使用方法 WO2015007088A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/240,369 US20150026962A1 (en) 2013-07-19 2014-01-28 Device for attaching chip on film onto panel and method for using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2013103072191A CN103345086A (zh) 2013-07-19 2013-07-19 用于向面板贴附覆晶膜的装置及其使用方法
CN201310307219.1 2013-07-19

Publications (1)

Publication Number Publication Date
WO2015007088A1 true WO2015007088A1 (zh) 2015-01-22

Family

ID=49279896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/071667 WO2015007088A1 (zh) 2013-07-19 2014-01-28 用于向面板贴附覆晶膜的装置及其使用方法

Country Status (3)

Country Link
US (1) US20150026962A1 (zh)
CN (1) CN103345086A (zh)
WO (1) WO2015007088A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法
CN107463013A (zh) * 2017-09-19 2017-12-12 武汉华星光电半导体显示技术有限公司 一种cof压着精度自动补偿方法及***、cof绑定机
CN109616589A (zh) * 2018-12-19 2019-04-12 武汉华星光电半导体显示技术有限公司 用于显示面板的接合装置以及显示面板的接合方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1818754A (zh) * 2005-02-10 2006-08-16 欧姆龙株式会社 接合方法以及接合装置
CN101714536A (zh) * 2008-12-02 2010-05-26 杰群科技有限公司 覆晶封装结构及其晶片附着方法
CN102209621A (zh) * 2008-11-06 2011-10-05 芝浦机械电子装置股份有限公司 贴合装置以及贴合方法
CN102555408A (zh) * 2012-02-09 2012-07-11 华映视讯(吴江)有限公司 适用于液晶显示面板的贴合装置
CN102947233A (zh) * 2010-06-15 2013-02-27 电气化学工业株式会社 透光性硬质基板层叠体的制造方法
JP2013083715A (ja) * 2011-10-06 2013-05-09 Hitachi High-Technologies Corp Fpdモジュール組立装置
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
US5208975A (en) * 1990-07-06 1993-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
JP3314663B2 (ja) * 1997-05-22 2002-08-12 松下電器産業株式会社 チップのボンディング装置
JP3828808B2 (ja) * 2000-01-31 2006-10-04 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法
US20010055069A1 (en) * 2000-03-10 2001-12-27 Hudson Edison T. One camera system for component to substrate registration
JP4237421B2 (ja) * 2000-03-24 2009-03-11 パナソニック株式会社 部品装着方法及び装置
JP4562309B2 (ja) * 2001-04-05 2010-10-13 東レエンジニアリング株式会社 チップボンディング方法およびその装置
JP3589658B2 (ja) * 2001-09-28 2004-11-17 松下電器産業株式会社 最適化装置、装着装置及び電子部品装着システム
JP2003133367A (ja) * 2001-10-19 2003-05-09 Canon Inc 実装装置
JP4185960B2 (ja) * 2005-11-29 2008-11-26 松下電器産業株式会社 回路基板に対する作業装置及び作業方法
JP4711859B2 (ja) * 2006-03-02 2011-06-29 パナソニック株式会社 部品接合方法及び部品接合装置
US7805832B2 (en) * 2008-08-19 2010-10-05 Silverbrook Research Pty Ltd Transfer apparatus for transferring a component of integrated circuitry
CN101893772A (zh) * 2009-05-24 2010-11-24 友达光电(厦门)有限公司 压合机构及压合方法
JP2012004143A (ja) * 2010-06-14 2012-01-05 Panasonic Corp 電子部品の実装装置および実装方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1818754A (zh) * 2005-02-10 2006-08-16 欧姆龙株式会社 接合方法以及接合装置
CN102209621A (zh) * 2008-11-06 2011-10-05 芝浦机械电子装置股份有限公司 贴合装置以及贴合方法
CN101714536A (zh) * 2008-12-02 2010-05-26 杰群科技有限公司 覆晶封装结构及其晶片附着方法
CN102947233A (zh) * 2010-06-15 2013-02-27 电气化学工业株式会社 透光性硬质基板层叠体的制造方法
JP2013083715A (ja) * 2011-10-06 2013-05-09 Hitachi High-Technologies Corp Fpdモジュール組立装置
CN102555408A (zh) * 2012-02-09 2012-07-11 华映视讯(吴江)有限公司 适用于液晶显示面板的贴合装置
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法

Also Published As

Publication number Publication date
US20150026962A1 (en) 2015-01-29
CN103345086A (zh) 2013-10-09

Similar Documents

Publication Publication Date Title
US10068872B2 (en) Mounting apparatus and method of correcting offset amount of the same
US9406640B2 (en) Flip chip bonder and method of correcting flatness and deformation amount of bonding stage
TWI467681B (zh) 半導體裝置之製造方法
CN104992919B (zh) 定位脚、定位装置及位置归正方法
WO2015007088A1 (zh) 用于向面板贴附覆晶膜的装置及其使用方法
CN104723648A (zh) 贴合触摸屏和显示屏的自动化装置及方法
CN103779244B (zh) 一种板上芯片封装键合自动生产线
US20120202300A1 (en) Die bonder including automatic bond line thickness measurement
JP5475059B2 (ja) 塗布装置
CN113013068A (zh) 一种提升转移良率的芯片转移方法
JP2011040551A (ja) 吸着ノズルの昇降装置及びその荷重制御方法
TWI503064B (zh) 多層板貼合方法與裝置
CN104589771A (zh) 玻璃积层贴合设备
TWI529828B (zh) 調控晶粒黏接頭移動之裝置及方法
JP6325053B2 (ja) 接合システム、接合方法、および半導体デバイスの製造方法
KR101740383B1 (ko) 도포판에의 피막액 균일 도포장치
JP2013179169A (ja) 接合方法、接合システムおよび半導体デバイス
CN102867803A (zh) 用于晶粒安装的键合层厚度控制
JP5071218B2 (ja) ペースト転写装置及びペースト転写方法
JP4486914B2 (ja) 固体撮像素子のダイボンド方法及びその装置
JPWO2008084602A1 (ja) 電子部品の実装装置及び実装方法
CN217043242U (zh) 点胶***和点胶设备
JP3588837B2 (ja) 枚葉塗工方法およびその装置
KR100800594B1 (ko) 엘시디용 씨오에프 엔시피 패키징 장치
JP6553356B2 (ja) 転写装置および転写方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14240369

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14826985

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14826985

Country of ref document: EP

Kind code of ref document: A1