WO2015002270A1 - Dicing sheet - Google Patents
Dicing sheet Download PDFInfo
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- WO2015002270A1 WO2015002270A1 PCT/JP2014/067798 JP2014067798W WO2015002270A1 WO 2015002270 A1 WO2015002270 A1 WO 2015002270A1 JP 2014067798 W JP2014067798 W JP 2014067798W WO 2015002270 A1 WO2015002270 A1 WO 2015002270A1
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- Prior art keywords
- dicing sheet
- polymerizable compound
- pressure
- polyfunctional acrylate
- energy beam
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Definitions
- the present invention relates to a dicing sheet used for dicing semiconductor packages and the like.
- a semiconductor substrate such as a semiconductor wafer is diced into individual chips, the obtained chip is picked up and mounted on a lead frame, connected to each other with bonding wires, and then sealed with resin. There is a way to stop.
- a dicing sheet in which an adhesive layer is formed on a base film is used.
- the adhesive layer is made adhesive by irradiation of energy rays such as ultraviolet rays and electron beams so that the semiconductor substrate as an adherend can be firmly adhered in the dicing process and the chip can be picked up in the pick-up process. It is made of a material that lowers.
- the dicing sheet may be expanded after the dicing step in order to make it easier to pick up the chips in order to increase the distance between the chips.
- the dicing sheet is usually bonded and fixed to the ring frame.
- a dicing sheet described in Patent Document 1 is known.
- a substrate in which a plurality of semiconductor chips are mounted is covered with one cavity of a resin molding die and resin sealed.
- a method of dividing into a plurality of parts (hereinafter also referred to as “mold chip”) by package dicing is also performed.
- the adherend of the dicing sheet is a semiconductor package
- the surface roughness of the adherend surface is larger than when a semiconductor substrate such as a semiconductor wafer is used as the adherend, and the normal package material is mold release. Contains agents.
- the adhesive force to the adherend may be insufficient.
- the thickness of the adhesive layer of the dicing sheet is conventionally set to 30 ⁇ m or more.
- the blade When the semiconductor package is diced, not only the semiconductor package but also the adhesive layer of the dicing sheet adhered to the semiconductor package is cut by the blade. If the adhesive layer is thick as described above, the blade The amount of the pressure-sensitive adhesive layer that is excluded due to the increase in the amount of the pressure-sensitive adhesive layer is referred to as an aggregate formed from components such as the pressure-sensitive adhesive that constitutes the excluded pressure-sensitive adhesive layer. ) Tends to adhere to the end of the mold chip. When such a pressure-sensitive adhesive aggregate remains on the mold chip, problems such as adhesion between the mold chips or between the mold chip and another member easily occur through the pressure-sensitive adhesive aggregate.
- the pressure-sensitive adhesive strength of the dicing sheet may be excessively reduced.
- an adjacent chip may fall off from the dicing sheet.
- the present invention has been made in view of the above circumstances, and when a workpiece having a large surface roughness such as a semiconductor package is used as an adherend, it has sufficient adhesive force before irradiation with energy rays. It is another object of the present invention to provide a dicing sheet that has an appropriate adhesive strength even after irradiation with energy rays and hardly generates adhesive aggregates.
- the present invention provides a dicing sheet having a workpiece having a surface arithmetic average roughness (Ra) of 0.1 ⁇ m or more as an adherend, wherein the dicing sheet is a base sheet.
- Material and a pressure-sensitive adhesive layer laminated on at least one surface of the base material, and the pressure-sensitive adhesive layer comprises an acrylic polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B).
- the polyfunctional acrylate-based energy beam polymerizable compound (B) is a polymerizable functional group in 1 g of the multifunctional acrylate-based energy beam polymerizable compound (B).
- the polyfunctional active polymer is based on the total amount of the acrylic polymer (A) and the polyfunctional acrylate energy beam polymerizable compound (B).
- a dicing sheet characterized in that the ratio of the rate-based energy ray polymerizable compound (B) is 20 to 65% by mass, and the thickness of the pressure-sensitive adhesive layer is 2 to 20 ⁇ m (Invention 1). .
- the polyfunctional acrylate energy beam polymerizable compound (B) has a polymerizable functional group in the above amount, and the polyfunctional acrylate energy ray polymerizable compound (B ) Ratio is in the above range, even when a workpiece having a large surface roughness such as a semiconductor package is used as an adherend, it has a sufficient adhesive force before irradiation with energy rays and is irradiated with energy rays. Later, it has a suitable adhesive strength and hardly generates an adhesive aggregate.
- the product with the number of moles of the polymerizable functional group contained in 1 g of the polyfunctional acrylate energy beam polymerizable compound (B) is preferably 0.1 to 0.48 (Invention 2).
- the molecular weight specified by the molecular structure of the polyfunctional acrylate energy beam polymerizable compound (B) is preferably 400 to 2000 (Invention 3).
- the said polyfunctional acrylate type energy ray polymeric compound (B) is esterified product of (meth) acrylic acid and a polyhydric alcohol, ester of (meth) acrylic acid and isocyanuric acid Preferably, it is at least one selected from the group consisting of a modified compound and a modified product thereof (Invention 4).
- the polyfunctional acrylate energy beam polymerizable compound (B) is a group consisting of a modified product of dipentaerythritol hexaacrylate, a modified product of isocyanuric acid triacrylate, and ditrimethylolpropane tetraacrylate. It is preferable that it is at least one selected from (Invention 5).
- the storage elastic modulus at 23 ° C. before irradiation with energy rays of the pressure-sensitive adhesive layer is preferably 12 to 45 kPa (Invention 6).
- the adherend is a flat surface made of KE-G1250 manufactured by Kyocera Chemical Co., and the member whose arithmetic average roughness (Ra) is 2 ⁇ m is to be adhered.
- the dicing sheet was affixed and allowed to stand in an atmosphere of 23 ° C. and 50% RH for 20 minutes, and the measured adhesive strength of the dicing sheet was taken as the adhesive strength before irradiation with the energy beam. Is affixed to the adherend under the same conditions as described above, and then left for 20 minutes in an atmosphere of 23 ° C. and 50% RH.
- ultraviolet rays are irradiated as energy rays, and the intensity of light is 230 mW / cm 2 .
- the energy for the adhesive force before the irradiation the energy beam
- the ratio of the adhesive strength after chromatography ray irradiation is preferably 0.06 to 0.5 (Invention 7).
- the workpiece is a semiconductor package (Invention 8).
- the dicing sheet of the present invention even when a workpiece having a large surface roughness such as a semiconductor package is used as an adherend, it has a sufficient adhesive force before irradiation with energy rays, thereby suppressing the occurrence of chip scattering. can do. Moreover, since it has moderate adhesive force even after energy beam irradiation, it is possible to prevent the adjacent chips from falling off the dicing sheet when the chips are pushed up with pins or the like during pick-up. Furthermore, since it is difficult for the pressure-sensitive adhesive aggregates to be generated, the occurrence of problems due to the pressure-sensitive adhesive aggregates can be suppressed.
- FIG. 1 is a cross-sectional view of a dicing sheet according to an embodiment of the present invention.
- the dicing sheet 1 according to the present embodiment includes a base material 2 and a pressure-sensitive adhesive layer 3 laminated on one surface of the base material 2 (the upper surface in FIG. 1).
- the adherend of the dicing sheet 1 is a work having a surface arithmetic average roughness (Ra) of 0.1 ⁇ m or more, preferably 0.5 to 10 ⁇ m, more preferably 1 to 6 ⁇ m.
- the work having a rough surface as described above has a sufficient fixing performance when a dicing sheet is pasted compared to a semiconductor substrate such as a semiconductor wafer (for example, a silicon mirror wafer (usually Ra is about 0.005 ⁇ m)).
- a semiconductor substrate such as a semiconductor wafer (for example, a silicon mirror wafer (usually Ra is about 0.005 ⁇ m)).
- a semiconductor package for example, a silicon mirror wafer (usually Ra is about 0.005 ⁇ m)
- Examples of such a workpiece include a semiconductor package, a wafer with a protective film provided with a protective film obtained by curing a back surface protective film, and a semiconductor package is particularly preferable.
- the semiconductor package is an electronic component assembly in which a plurality
- Base material 2 of the dicing sheet 1 according to the present embodiment is not particularly limited as long as it is not broken in an expanding process or the like performed after the dicing process.
- a resin-based material is a main material. Consists of film.
- Such films include ethylene-copolymer films such as ethylene-vinyl acetate copolymer films, ethylene- (meth) acrylic acid copolymer films, and ethylene- (meth) acrylic acid ester copolymer films; low density Polyethylene films such as polyethylene (LDPE) film, linear low density polyethylene (LLDPE) film, high density polyethylene (HDPE) film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film, Polyolefin film such as norbornene resin film; Polyvinyl chloride film such as polyvinyl chloride film and vinyl chloride copolymer film; Polyethylene terephthalate film, Polybutylene tele Polyester film of tallate films; polyurethane film; polyimide film; polystyrene films; polycarbonate films; and fluorine resin film.
- low density Polyethylene films such as polyethylene (LDPE) film, linear low density polyethylene
- modified films such as these crosslinked films and ionomer films are also used.
- the substrate 2 may be a film made of one of these, or may be a laminated film in which two or more of these are combined.
- (meth) acrylic acid in the present specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
- the film constituting the substrate 2 preferably comprises at least one of an ethylene copolymer film and a polyolefin film. It is easy to control the mechanical characteristics of an ethylene copolymer film in a wide range by changing the copolymerization ratio. For this reason, the base material 2 provided with the ethylene copolymer film is easy to satisfy the mechanical properties required as the base material of the dicing sheet 1 according to the present embodiment. In addition, since the ethylene copolymer film has relatively high adhesion to the pressure-sensitive adhesive layer 3, peeling at the interface between the base material 2 and the pressure-sensitive adhesive layer 3 hardly occurs when used as a dicing sheet.
- the ethylene copolymer film and the polyolefin film are components that adversely affect the properties as a dicing sheet (for example, in the case of a polyvinyl chloride film, the plasticizer contained in the film is transferred from the substrate 2 to the adhesive layer 3). And further distributed on the surface of the pressure-sensitive adhesive layer 3 opposite to the side facing the base material 2 to reduce the adhesive strength of the dicing sheet 1 to the adherend. Therefore, problems such as a decrease in the adhesive strength of the dicing sheet 1 to the adherend are unlikely to occur. That is, the ethylene copolymer film and the polyolefin film are excellent in chemical stability.
- the base material 2 may contain various additives such as pigments, flame retardants, plasticizers, antistatic agents, lubricants, fillers, etc. in a film mainly composed of the above-mentioned resin-based material.
- the pigment include titanium dioxide and carbon black.
- the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles. The content of such additives is not particularly limited, but should be limited to a range in which the substrate 2 exhibits a desired function and does not lose smoothness and flexibility.
- the base material 2 preferably has transparency to the ultraviolet rays.
- the base material 2 has the transparency of an electron beam.
- the surface of the substrate 2 on the pressure-sensitive adhesive layer 3 side contains one or more selected from the group consisting of a carboxyl group and ions and salts thereof. It is preferable that the component which has is present.
- the above components in the substrate 2 and the components related to the pressure-sensitive adhesive layer 3 (components used for forming the pressure-sensitive adhesive layer 3 such as the component constituting the pressure-sensitive adhesive layer 3 and the crosslinking agent (C) are exemplified.) Can interact with each other chemically to reduce the possibility of delamination between them.
- the specific method for making such a component exist in a base-material adhesion surface is not specifically limited.
- the base material 2 itself is an ethylene- (meth) acrylic acid copolymer film, an ionomer resin film, etc., and the resin that constitutes the base material 2 is selected from the group consisting of carboxyl groups and ions and salts thereof. You may have 1 type (s) or 2 or more types.
- the substrate 2 is, for example, a polyolefin-based film, and is subjected to corona treatment on the substrate adhesion surface side or provided with a primer layer. May be.
- Various coating films may be provided on the surface of the substrate 2 opposite to the substrate-coated surface.
- the thickness of the base material 2 is not limited as long as the dicing sheet 1 can function properly in each of the aforementioned steps.
- the range is preferably 20 to 450 ⁇ m, more preferably 25 to 400 ⁇ m, and particularly preferably 50 to 350 ⁇ m.
- the breaking elongation of the substrate 2 in this embodiment is preferably 100% or more as a value measured at 23 ° C. and a relative humidity of 50%, particularly preferably 200 to 1000%.
- the elongation at break is the elongation relative to the original length of the test piece at the time of breaking the test piece in a tensile test according to JIS K7161: 1994 (ISO 527-1 1993).
- the base material 2 having a breaking elongation of 100% or more is not easily broken during the expanding process, and the chips formed by cutting the workpiece are easily separated.
- the tensile stress at 25% strain of the base material 2 in this embodiment is preferably 5 to 15 N / 10 mm, and the maximum tensile stress is preferably 15 to 50 MPa.
- the tensile stress at 25% strain and the maximum tensile stress are measured by a test based on JIS K7161: 1994.
- the base material 2 is loosened when the workpiece is bonded to the dicing sheet 1 and then fixed to a frame such as a ring frame. Generation
- production is suppressed and it can prevent that a conveyance error arises.
- the dicing sheet 1 itself is prevented from peeling off from the ring frame during the expanding process.
- the elongation at break, the tensile stress at 25% strain, and the maximum tensile stress are values measured in the longitudinal direction of the original fabric in the substrate 2.
- the pressure-sensitive adhesive layer 3 provided in the dicing sheet 1 comprises an acrylic polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B) described below, and further a crosslinking agent as necessary. It is formed from a pressure-sensitive adhesive composition containing (C) or the like.
- Acrylic polymer (A) The pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 in the present embodiment contains an acrylic polymer (A) as a main component. In the pressure-sensitive adhesive layer 3 formed from this pressure-sensitive adhesive composition, at least a part of the acrylic polymer (A) may be contained as a cross-linked product by performing a cross-linking reaction with a cross-linking agent (C) described later. .
- the weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1,500,000 from the viewpoint of film forming properties during coating.
- the weight average molecular weight in this specification is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.
- the glass transition temperature Tg of the acrylic polymer (A) is preferably in the range of ⁇ 70 ° C. to 30 ° C., more preferably in the range of ⁇ 60 ° C. to 20 ° C.
- the glass transition temperature can be calculated from the Fox equation.
- the acrylic polymer (A) may be a homopolymer formed from one type of acrylic monomer, or may be a copolymer formed from a plurality of types of acrylic monomers, It may be a copolymer formed from one or more types of acrylic monomers and monomers other than acrylic monomers.
- Specific types of the compound to be an acrylic monomer are not particularly limited, and specific examples include (meth) acrylic acid, itaconic acid, (meth) acrylic acid ester, and derivatives thereof (acrylonitrile, etc.).
- (meth) acrylic acid esters include chain skeletons such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
- Cyclic skeletons such as cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, and imide acrylate
- a (meth) acrylate having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; glycidyl (meth) acrylate, N-methylamino Having a reactive functional group other than hydroxyl group, such as chill (meth) acrylate (meth) acrylate.
- monomers other than acrylic monomers include olefins such as ethylene and norbornene, vinyl acetate, and styrene.
- the acrylic monomer is an alkyl (meth) acrylate, the alkyl group preferably has 1 to 18 carbon atoms.
- the acrylic polymer (A ) Preferably has a reactive functional group that reacts with the crosslinking agent (C).
- the type of the reactive functional group is not particularly limited, and may be appropriately determined based on the type of the crosslinking agent (C).
- examples of the reactive functional group possessed by the acrylic polymer (A) include a hydroxyl group, a carboxyl group, and an amino group.
- a highly functional hydroxyl group is preferred.
- the method for introducing a hydroxyl group as a reactive functional group into the acrylic polymer (A) is not particularly limited.
- the reaction for all monomers in terms of monomers for forming the acrylic polymer (A) is preferably about 1 to 20% by mass, and more preferably 2 to 10% by mass.
- the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 in the present embodiment contains a polyfunctional acrylate-based energy ray polymerizable compound (B).
- the polyfunctional acrylate energy beam polymerizable compound (B) in the present specification has 3 or more polymerizable functional groups such as (meth) acryloyl groups in the molecule (at least one (meth) acryloyl group). And a compound that does not have a repeating structure other than an alkylene structure, an oxyalkylene structure, and a ring-opening polymer of a cyclic ester, and can be polymerized by irradiation with energy rays.
- urethane (meth) acrylate is not included in the polyfunctional acrylate energy beam polymerizable compound (B).
- the polymerizable functional group include (meth) acryloyl group, vinyl group, epoxy group, alkynyl group, oxetanyl group and the like, and (meth) acryloyl group is particularly preferable.
- the polyfunctional acrylate energy beam polymerizable compound (B) in the present embodiment has 0.004 to 0.009 mol of a polymerizable functional group in 1 g of the polyfunctional acrylate energy beam polymerizable compound (B). It is.
- the ratio of the polyfunctional acrylate energy beam polymerizable compound (B) to the total amount of the acrylic polymer (A) and the polyfunctional acrylate energy beam polymerizable compound (B) is 20 to 65% by mass.
- the polyfunctional acrylate energy beam polymerizable compound (B) has a polymerizable functional group in the above amount and the ratio of the polyfunctional acrylate energy beam polymerizable compound (B) is in the above range.
- the dicing sheet 1 having the pressure-sensitive adhesive layer 3 is sufficient before irradiation with energy rays when a workpiece having a large surface roughness such as a semiconductor package is used as an adherend even if the pressure-sensitive adhesive layer 3 is thin. Adhesive strength, moderate adhesive strength even after irradiation with energy rays, and adhesive agglomerates hardly occur.
- the adhesive strength after energy beam irradiation may not be sufficiently reduced, and chip pick-up may be difficult. is there.
- the polymerizable functional group of the polyfunctional acrylate-based energy beam polymerizable compound (B) exceeds 0.009 mol, the adhesive strength after energy beam irradiation is excessively lowered, and the adjacent chip is dropped during pickup. The possibility increases.
- the amount of the polymerizable functional group in 1 g of the polyfunctional acrylate energy beam polymerizable compound (B) is preferably 0.0043 to 0.008 mol, and particularly 0.0046 to 0.0075. Mole is preferred.
- the polyfunctional acrylate compound is easy to adjust the amount of the polymerizable functional group within the above range.
- the ratio of the polyfunctional acrylate-based energy beam polymerizable compound (B) is less than 20% by mass, the adhesive strength before energy beam irradiation may not be sufficiently obtained.
- the said ratio of a polyfunctional acrylate type energy ray polymeric compound (B) exceeds 65 mass%, the plasticization effect
- the proportion of the polyfunctional acrylate energy beam polymerizable compound (B) is preferably 35 to 65% by mass, and particularly preferably 45 to 65% by mass.
- the product of the number of moles of the polymerizable functional group contained in 1 g is preferably 0.1 to 0.48, and more preferably 0.1 to 0.39.
- the adhesive strength before irradiation with energy rays and the adhesive strength after irradiation with energy rays can be set to more desirable levels.
- the adhesive force after energy beam irradiation may fall too much.
- the molecular weight specified by the molecular structure of the polyfunctional acrylate-based energy beam polymerizable compound (B) is preferably 400 to 2000, more preferably 800 to 1600, and particularly preferably 1000 to 1600. . When the molecular weight is 2000 or less, a sufficient adhesive force before irradiation with energy rays can be easily obtained.
- polyfunctional acrylate energy beam polymerizable compound (B) examples include esterified products of (meth) acrylic acid and polyhydric alcohol, esterified products of (meth) acrylic acid and isocyanuric acid, modified products thereof, and the like. Is mentioned. Examples of modified products include alkoxylated products and lactone modified products.
- a modified product of dipentaerythritol hexaacrylate, a modified product of isocyanuric acid triacrylate, and ditrimethylolpropane tetraacrylate are preferable, and caprolactone-modified dipentaerythritol hexaacrylate (molecular weight: 1262, polymerizable functional group amount: 0).
- a polyfunctional acrylate type energy ray polymeric compound (B) can be used individually by 1 type or in combination of 2 or more types.
- Examples of the energy beam for curing the polyfunctional acrylate energy beam polymerizable compound (B) include ionizing radiation, that is, X-rays, ultraviolet rays, and electron beams. Among these, ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.
- near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling.
- the amount of light may be appropriately selected according to the type of the polyfunctional acrylate energy beam polymerizable compound (B) and the thickness of the pressure-sensitive adhesive layer 3, and is usually about 50 to 500 mJ / cm 2 , and is 100 to 450 mJ / cm 2 is preferable, and 200 to 400 mJ / cm 2 is more preferable.
- the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 200 ⁇ 400mW / cm 2.
- the ultraviolet light source is not particularly limited, and for example, a high pressure mercury lamp, a metal halide lamp, a UV-LED, or the like is used.
- the acceleration voltage may be appropriately selected according to the type of the polyfunctional acrylate-based energy beam polymerizable compound (B) and the thickness of the pressure-sensitive adhesive layer 3, and is usually accelerated.
- the voltage is preferably about 10 to 1000 kV.
- the irradiation dose may be set in a range where the polyfunctional acrylate energy beam polymerizable compound (B) is appropriately cured, and is usually selected in the range of 10 to 1000 krad.
- the electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
- various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
- the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 in the present embodiment may contain a crosslinking agent (C) that can react with the acrylic polymer (A).
- the pressure-sensitive adhesive layer 3 in the present embodiment contains a crosslinked product obtained by a crosslinking reaction between the acrylic polymer (A) and the crosslinking agent (C).
- crosslinking agent (C) examples include polyimine compounds such as polyisocyanate compounds, epoxy compounds, metal chelate compounds, and aziridine compounds, melamine resins, urea resins, dialdehydes, methylol polymers, metal alkoxides, A metal salt etc. are mentioned. Among these, a polyisocyanate compound or an epoxy-based compound is preferable because the crosslinking reaction is easily controlled.
- a polyisocyanate compound is a compound having two or more isocyanate groups per molecule.
- aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4′-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate
- alicyclic isocyanate compounds such as hydrogenated xylylene diisocyanate; and isocyanates having a chain skeleton such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and lysine diisocyanate.
- Said polyisocyanate compound can be used individually by 1 type or in combination of 2 or more types.
- Examples of the epoxy compound include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylenediamine, ethylene glycol diglycidyl ether, Examples include 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.
- the content of the crosslinking agent (C) in the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 varies depending on the type of the crosslinking agent (C), but is usually 0 with respect to 100 parts by mass of the acrylic polymer (A). It is preferably 0.01 parts by mass or more, more preferably 0.03 to 50 parts by mass, and particularly preferably 0.05 to 40 parts by mass.
- the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 in this embodiment contains a crosslinking agent (C), it contains an appropriate crosslinking accelerator depending on the type of the crosslinking agent (C). Is preferred.
- the crosslinking agent (C) is a polyisocyanate compound
- the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 preferably contains an organometallic compound-based crosslinking accelerator such as an organic tin compound.
- the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 3 in the present embodiment is a photopolymerization initiator, an antistatic agent, a coloring material such as a dye or a pigment, a flame retardant, You may contain various additives, such as a filler.
- photopolymerization initiators examples include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones.
- 1-hydroxycyclohexyl phenyl ketone benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like.
- ultraviolet rays When ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced by blending a photopolymerization initiator.
- the thickness of the pressure-sensitive adhesive layer 3 in this embodiment is 2 to 20 ⁇ m, preferably 5 to 15 ⁇ m, particularly preferably 8 to 12 ⁇ m. Since the thickness of the pressure-sensitive adhesive layer 3 is 20 ⁇ m or less, it is possible to suppress the amount of pressure-sensitive adhesive agglomerates generated when dicing a workpiece such as a semiconductor package, and the pressure-sensitive adhesive agglutinates adhere to the chip or the like. It is difficult for problems to occur.
- the pressure-sensitive adhesive layer 3 in this embodiment is formed from the pressure-sensitive adhesive composition described above, even if the thickness of the pressure-sensitive adhesive layer 3 is thin as described above, it is a workpiece having a large surface roughness such as a semiconductor package. On the other hand, desired adhesiveness can be exhibited. On the other hand, if the thickness of the pressure-sensitive adhesive layer 3 is less than 2 ⁇ m, there may be a problem that the variation in the adhesive strength of the dicing sheet 1 becomes large.
- the storage elastic modulus at 23 ° C. before the energy ray irradiation of the pressure-sensitive adhesive layer 3 (hereinafter sometimes referred to as “storage elastic modulus before irradiation”) is preferably 12 to 45 kPa, It is more preferably 12 to 40 kPa, and particularly preferably 12 to 30 kPa.
- storage elastic modulus before irradiation is 12 kPa or more, the adhesive strength after irradiation with energy rays is unlikely to be excessively low.
- the storage elastic modulus before irradiation is 50 kPa or less, it is easy to maintain a high adhesive force before irradiation with energy rays for a workpiece having a large surface roughness such as a semiconductor package.
- the storage elastic modulus before irradiation can be determined by, for example, changing the molecular weight or content of the acrylic polymer (A), the degree of crosslinking thereof, or the type or content of the polyfunctional acrylate energy ray polymerizable compound (B). Can be controlled.
- said storage elastic modulus before irradiation can be measured using a known viscoelasticity measuring apparatus (for example, ARES, manufactured by T.A. Instruments Inc.).
- ARES viscoelasticity measuring apparatus
- a layered body having a thickness of about 1 mm made of the material constituting the pressure-sensitive adhesive layer 3 is used as a measurement object from the viewpoint of reducing variation in measurement results. preferable.
- the ratio of the adhesive strength after irradiation with energy rays to the adhesive strength before irradiation with energy rays of the dicing sheet 1 is preferably 0.06 to 0.5, and preferably 0.075 to 0.3. It is more preferable. When the ratio of the adhesive strength is within the above range, the balance between the adhesive strength before irradiation with energy rays and the adhesive strength after irradiation with energy rays becomes good, and sufficient adhesive strength and energy rays before irradiation with energy rays are obtained. It becomes easy to achieve later moderate adhesive strength.
- the adhesive strength before irradiation with energy rays is such that the adherend surface is a flat surface made of KE-G1250 manufactured by Kyocera Chemical Co., and the member whose arithmetic average roughness (Ra) is 2 ⁇ m is to be adhered.
- the adhesive strength after irradiation with energy rays was determined by applying the dicing sheet to the adherend under the same conditions as described above, and then leaving it in an atmosphere of 23 ° C.
- the adhesive strength of the dicing sheet 1 before irradiation with energy rays is preferably 1000 to 4000 mN / 25 mm, and more preferably 1300 to 3000 mN / 25 mm.
- tip scattering can be suppressed because the adhesive force before energy ray irradiation exists in said range.
- the adhesive strength of the dicing sheet 1 after irradiation with energy rays is preferably 190 to 600 mN / 25 mm, and more preferably 230 to 500 mN / 25 mm. Adhesive strength after energy beam irradiation is within the above range, so that the chip can be easily picked up from the dicing sheet at the time of picking up, and the adjacent chip from the dicing sheet when the chip is pushed up with a pin or the like. It can suppress falling off.
- the pressure-sensitive adhesive layer 3 is formed from the above-described pressure-sensitive adhesive composition, the pressure-sensitive adhesive force before energy beam irradiation, the pressure-sensitive adhesive force after energy beam irradiation, and the ratio thereof are within the above range. Easy to control.
- the dicing sheet 1 according to the present embodiment is provided on the substrate 2 side of the adhesive layer 3 for the purpose of protecting the adhesive layer 3 until the adhesive layer 3 is applied to the adherend.
- a release sheet may be laminated on the surface opposite to the surface.
- the configuration of the release sheet is arbitrary, and examples include a release film of a plastic film with a release agent or the like.
- Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
- silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
- the thickness of the release sheet is not particularly limited, but is usually about 20 to 250 ⁇ m.
- the manufacturing method of the dicing sheet 1 is not particularly limited as long as the pressure-sensitive adhesive layer 3 formed from the above-described pressure-sensitive adhesive composition can be laminated on one surface of the substrate 2.
- the above-mentioned pressure-sensitive adhesive composition and, if desired, a coating composition further containing a solvent are prepared, and a die coater, curtain coater, spray coater, slit coater is formed on one surface of the substrate 1.
- the pressure-sensitive adhesive layer 3 can be formed by applying the coating composition with a knife coater or the like to form a coating film and drying the coating film.
- the properties of the coating composition are not particularly limited as long as it can be applied.
- the composition for forming the pressure-sensitive adhesive layer 3 may be contained as a solute, or may be contained as a dispersoid. There is also.
- the coating composition contains a cross-linking agent (C), changing the drying conditions (temperature, time, etc.) described above, or providing a heat treatment separately, What is necessary is just to advance the crosslinking reaction of a unification
- the obtained dicing sheet 1 is placed in an environment of, for example, 23 ° C. and a relative humidity of 50%. Curing may be performed such as standing for days.
- the coating composition is applied on the release surface of the release sheet to form a coating film, which is dried to form the adhesive layer 3 and the release sheet.
- a laminate of the dicing sheet 1 and the release sheet may be obtained by attaching a surface opposite to the release sheet side of the adhesive layer 3 of the laminate to the substrate 1. .
- the release sheet in this laminate may be peeled off as a process material, or the adhesive layer 3 may be protected until it is attached to an adherend such as a semiconductor package.
- Chip Manufacturing Method A method of manufacturing a mold chip from a semiconductor package as an example using the dicing sheet 1 according to the present embodiment will be described below.
- the dicing sheet 1 affixes the surface of the pressure-sensitive adhesive layer 3 side (that is, the surface of the pressure-sensitive adhesive layer 3 opposite to the substrate 2) to the resin sealing surface of the semiconductor package.
- a release sheet is laminated on the surface of the dicing sheet 1 on the pressure-sensitive adhesive layer 3 side, the release sheet is peeled off to expose the surface on the pressure-sensitive adhesive layer 3 side, and the resin sealing surface of the semiconductor package
- the surface may be affixed to.
- the peripheral edge portion of the dicing sheet 1 is usually attached to an annular jig called a ring frame for conveyance and fixing to the apparatus by an adhesive layer 3 provided in that portion.
- the dicing sheet 1 has a sufficient adhesive force before energy beam irradiation, and the mold chip to be formed is firmly fixed to the dicing sheet 1, so that chip scattering hardly occurs during the dicing process.
- the size of the mold chip formed by the dicing process is usually 5 mm ⁇ 5 mm or less, and in recent years it may be about 1 mm ⁇ 1 mm, but the dicing sheet 1 according to the present embodiment has sufficient adhesive force, Such fine pitch dicing can also be sufficiently handled.
- the pressure-sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is less likely to generate pressure-sensitive adhesive aggregates during the dicing process, in the dicing process and the subsequent processes, the mold chips are arranged via the pressure-sensitive adhesive aggregates. Alternatively, problems such as adhesion of the mold chip and other members hardly occur.
- an expanding process of extending the dicing sheet 1 in the plane direction is performed so that a plurality of mold chips arranged close to the dicing sheet 1 can be easily picked up.
- the degree of extension may be set as appropriate in consideration of the distance that the mold chips arranged in close proximity should have, the tensile strength of the base material 2, and the like. In addition, you may perform an expanding process before energy beam irradiation.
- the mold chip on the adhesive layer 3 is picked up.
- the pickup is performed by general-purpose means such as a suction collet.
- the picked-up mold chip is used for the next process such as a transport process.
- another layer may be interposed between the base material 2 and the pressure-sensitive adhesive layer 3 in the dicing sheet 1.
- Example 1 Preparation of coating composition The following components (a) to (d) were mixed to prepare a coating composition (solvent: toluene) in a solution state.
- A As an acrylic polymer (A), a copolymer (weight average) obtained by copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 40 parts by mass of methyl acrylate, and 10 parts by mass of acrylic acid 100 parts by mass (b) of polyfunctional acrylate-based energy beam polymerizable compound (B) with a molecular weight of 800,000) as a solid content, caprolactone-modified dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-60, molecular weight: 1262) , Polymerizable functional group amount: 0.00475 mol / g) as a solid content and 100 parts by mass (c) a crosslinking agent component (Toyochem
- a 140 ⁇ m thick ethylene-methacrylic acid copolymer (EMAA) film (25% strain tensile stress: 10.8 N / 10 mm, maximum tensile stress: 25.5 MPa, as a base material irradiated with an electron beam on one side, (Elongation at break: 525%) was prepared.
- Elongation at break: 525% a base material irradiated with an electron beam on one side, (Elongation at break: 525%) was prepared.
- Elongation at break: 525% ethylene-methacrylic acid copolymer
- the thickness of the pressure-sensitive adhesive layer was determined by measuring the thickness of the dicing sheet using a constant pressure thickness measuring instrument (manufactured by TECLOCK Co., Ltd .: PG-02). Derived by subtracting.
- Example 2 Except for using 0.07 parts by mass (solid content) of 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Inc .: TETRAD-C) as the crosslinking agent (C), A dicing sheet was produced in the same manner as in Example 1.
- Example 3 A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate energy beam polymerizable compound (B) was changed to 33.3 parts by mass (solid content).
- Example 4 A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 150 parts by mass (solid content).
- Example 5 As polyfunctional acrylate-based energy ray polymerizable compound (B), ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: A-9300, molecular weight: 423, polymerizable functional group amount: 0.00709 mol / g) A dicing sheet was produced in the same manner as in Example 1 except that it was used.
- Example 6 Ditrimethylolpropane tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: AD-TMP, molecular weight: 466, polymerizable functional group amount: 0.00858 mol / g) is used as the polyfunctional acrylate energy beam polymerizable compound (B).
- a dicing sheet was produced in the same manner as in Example 1 except that.
- Example 7 A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 15 ⁇ m.
- Example 1 A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 22 parts by mass (solid content).
- Example 4 A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 400 parts by mass (solid content).
- Comparative Example 5 A dicing sheet was produced in the same manner as in Comparative Example 3 except that the blending amount of the polyfunctional acrylate energy beam polymerizable compound (B) was changed to 400 parts by mass (solid content).
- Example 8 A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 25 ⁇ m.
- Example 9 A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 30 ⁇ m.
- Table 1 summarizes the number of moles of the functional functional group, the blending ratio (mass%), the product of the number of moles of the polymerizable functional group and the blending ratio, and the thickness ( ⁇ m) of the pressure-sensitive adhesive layer.
- the meanings of the abbreviations of the component types in Table 1 are as follows.
- DPHA 1 dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-20)
- DPHA 2 caprolactone-modified dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-60)
- DPHA 3 caprolactone-modified dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-120)
- A-9300 4 ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: A-9300)
- AD-ATP 5 ditrimethylolpropane tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: AD-TMP)
- U 6 3-4 functional urethaned by Shin
- a sample for measuring the viscoelasticity of the pressure-sensitive adhesive layer by sticking the pressure-sensitive adhesive layer to a thickness of 800 ⁇ m using these laminates and punching out the resulting pressure-sensitive adhesive layer into a circle having a diameter of 10 mm.
- a viscoelasticity measuring device manufactured by TA Instruments Inc .: ARES
- a strain of a frequency of 1 Hz was applied to the above sample, a storage elastic modulus of ⁇ 50 to 150 ° C. was measured, and a storage elastic modulus at 23 ° C. was measured. Values were obtained as storage modulus before irradiation.
- the measurement results are shown in Table 2.
- a simulated semiconductor package having a size of 150 mm ⁇ 50 mm, a thickness of 600 ⁇ m, and an arithmetic average roughness (Ra) of the adherend to which the dicing sheet is attached is 2 ⁇ m, and this is covered. It was a kimono.
- the dicing sheet is left in an atmosphere of 23 ° C. and 50% RH for 20 minutes, and then an ultraviolet irradiation device (manufactured by Lintec Corp .: RAD-2000m / 12) is used under a nitrogen atmosphere. Then, ultraviolet (UV) irradiation (illuminance 230 mW / cm 2 , light amount 190 mJ / cm 2 ) was performed from the substrate side of the dicing sheet. About the dicing sheet after ultraviolet irradiation, adhesive force was measured like the above, and it was set as the adhesive force (mN / 25mm) after energy ray irradiation. The results are shown in Table 2.
- UV ultraviolet
- Test Example 3 ⁇ Evaluation of chip scattering property>
- a semiconductor package resin manufactured by Kyocera Chemical Co., Ltd .: KE-G1250
- the arithmetic average roughness of the adherend surface to which the dicing sheet is affixed having a size of 50 mm ⁇ 50 mm and a thickness of 600 ⁇ m.
- a simulated semiconductor package having a thickness (Ra) of 2 ⁇ m was produced.
- the dicing sheets manufactured according to the examples and comparative examples were cut into a circle having a diameter of 207 mm, and the surface of the obtained dicing sheet on the pressure-sensitive adhesive layer side was used with a tape mounter (manufactured by Lintec: Adwill RAD-2500m / 12). Affixed to the adherend surface of the fabricated simulated semiconductor package described above.
- the laminate of the dicing sheet and the simulated semiconductor package thus obtained is mounted on a dicing ring frame (Disco: 2-6-1), and the following dicing is performed using a dicing apparatus (Disco: DFD651).
- a dicing process of cutting from the simulated semiconductor package side was performed under the conditions, and divided into 1 mm ⁇ 1 mm mold chips (division number 2500).
- An expanding process was performed in which the dicing sheet after irradiation with the ultraviolet rays was expanded 20 mm in the plane direction of the sheet at a speed of 300 mm / min by using an expanding apparatus (manufactured by JCM Co., Ltd .: ME-300B type).
- a pick-up aptitude test was performed on 100 mold chips located near the center of the surface of the dicing sheet on the pressure-sensitive adhesive layer side. Specifically, the part in contact with the mold chip to be picked up in the dicing sheet is pushed up by 1.5 mm from the substrate side with a needle, and a vacuum collet is placed on the surface of the protruding mold chip opposite to the side facing the dicing sheet. The mold chip was picked up by vacuum collet.
- the sample that can be picked up by the vacuum collet at the moment when the needle is pushed up to the maximum height is “ ⁇ ”, and after the needle is pushed up to the maximum height, it takes time, but the sample that can be picked up by the vacuum collet is “ ⁇ "A sample that could not be picked up was evaluated as” x "(pickup evaluation).
- Test Example 5 ⁇ Evaluation of adhesive aggregate> A dicing process was performed in the same manner as in Test Example 3 except that the size of the mold chip was changed to 5 mm ⁇ 5 mm. The side surface of the mold chip obtained by the dicing process is observed with an optical microscope, and the size (maximum diameter) of the pressure-sensitive adhesive aggregate adhering to the side surface is measured. The occurrence situation was evaluated. The results are shown in Table 2.
- Adhesive aggregate of 10 ⁇ m or more is not generated
- Adhesive aggregate of 10 ⁇ m or more and less than 20 ⁇ m is generated
- Adhesive aggregate of 20 ⁇ m or more and less than 30 ⁇ m is generated
- XX Adhesive aggregate of 30 ⁇ m or more Occurs
- the dicing sheets produced in the examples had a sufficient adhesive force before irradiation with energy rays, and could suppress the occurrence of chip scattering. Also, it has moderate adhesive strength after irradiation with energy rays, and the dicing sheet is peeled off from the ring frame in the expanding process, and when the chip is pushed up with a pin or the like at the time of pickup, the adjacent chip is dropped from the dicing sheet. could be suppressed. Furthermore, the dicing sheet produced in the example hardly generated adhesive aggregates.
- the dicing sheet according to the present invention is suitably used for dicing a semiconductor package having a large surface roughness.
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Abstract
Description
図1は本発明の一実施形態に係るダイシングシートの断面図である。本実施形態に係るダイシングシート1は、基材2と、基材2の一方の面(図1では上側の面)に積層された粘着剤層3とを備えて構成される。 Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a cross-sectional view of a dicing sheet according to an embodiment of the present invention. The dicing sheet 1 according to the present embodiment includes a
本実施形態に係るダイシングシート1の基材2は、ダイシング工程の後に行われるエキスパンド工程などにおいて破断しない限り、その構成材料は特に限定されず、通常は樹脂系の材料を主材とするフィルムから構成される。そのフィルムの具体例として、エチレン-酢酸ビニル共重合体フィルム、エチレン-(メタ)アクリル酸共重合体フィルム、エチレン-(メタ)アクリル酸エステル共重合体フィルム等のエチレン系共重合フィルム;低密度ポリエチレン(LDPE)フィルム、直鎖低密度ポリエチレン(LLDPE)フィルム、高密度ポリエチレン(HDPE)フィルム等のポリエチレンフィルム、ポリプロピレンフィルム、ポリブテンフィルム、ポリブタジエンフィルム、ポリメチルペンテンフィルム、エチレン-ノルボルネン共重合体フィルム、ノルボルネン樹脂フィルム等のポリオレフィン系フィルム;ポリ塩化ビニルフィルム、塩化ビニル共重合体フィルム等のポリ塩化ビニル系フィルム;ポリエチレンテレフタレートフィルム、ポリブチレンテレフタレートフィルム等のポリエステル系フィルム;ポリウレタンフィルム;ポリイミドフィルム;ポリスチレンフィルム;ポリカーボネートフィルム;フッ素樹脂フィルムなどが挙げられる。またこれらの架橋フィルム、アイオノマーフィルムのような変性フィルムも用いられる。上記の基材2はこれらの1種からなるフィルムでもよいし、さらにこれらを2種類以上組み合わせた積層フィルムであってもよい。なお、本明細書における「(メタ)アクリル酸」は、アクリル酸およびメタクリル酸の両方を意味する。他の類似用語についても同様である。 1. Base material The
本実施形態に係るダイシングシート1が備える粘着剤層3は、次に説明するアクリル系重合体(A)および多官能アクリレート系エネルギー線重合性化合物(B)、さらに必要に応じ架橋剤(C)などを含有する粘着剤組成物から形成されるものである。 2. The pressure-sensitive adhesive layer The pressure-
本実施形態における粘着剤層3を形成する粘着剤組成物は、主成分としてアクリル系重合体(A)を含有する。この粘着剤組成物から形成された粘着剤層3において、アクリル系重合体(A)は少なくともその一部が後述する架橋剤(C)と架橋反応を行って架橋物として含有される場合もある。 (1) Acrylic polymer (A)
The pressure-sensitive adhesive composition forming the pressure-
本実施形態における粘着剤層3を形成する粘着剤組成物は、多官能アクリレート系エネルギー線重合性化合物(B)を含有する。本明細書における多官能アクリレート系エネルギー線重合性化合物(B)とは、分子内に(メタ)アクリロイル基等の重合性官能基を3個以上((メタ)アクリロイル基は少なくとも1個)有し、かつ、アルキレン構造、オキシアルキレン構造および環状エステルの開環重合物からなる構造以外の繰返し構造を有さず、エネルギー線の照射により重合し得る化合物である。したがって、上記多官能アクリレート系エネルギー線重合性化合物(B)には、ウレタン(メタ)アクリレートは含まれない。上記重合性官能基としては、例えば、(メタ)アクリロイル基、ビニル基、エポキシ基、アルキニル基、オキセタニル基等が挙げられ、中でも(メタ)アクリロイル基が好ましい。 (2) Polyfunctional acrylate energy beam polymerizable compound (B)
The pressure-sensitive adhesive composition forming the pressure-
本実施形態における粘着剤層3を形成する粘着剤組成物は、前述したように、アクリル系重合体(A)と反応し得る架橋剤(C)を含有してもよい。この場合には、本実施形態における粘着剤層3は、アクリル系重合体(A)と架橋剤(C)との架橋反応により得られた架橋物を含有する。 (3) Crosslinking agent (C)
As described above, the pressure-sensitive adhesive composition forming the pressure-
本実施形態における粘着剤層3を形成する粘着剤組成物は、上記の成分に加えて、光重合開始剤、帯電防止剤、染料や顔料などの着色材料、難燃剤、フィラー等の各種添加剤を含有してもよい。 (4) Other components In addition to the above components, the pressure-sensitive adhesive composition forming the pressure-
(a)厚さ
本実施形態における粘着剤層3の厚さは2~20μmであり、好ましくは5~15μmであり、特に好ましくは8~12μmである。粘着剤層3の厚さが20μm以下であることにより、半導体パッケージ等のワークをダイシングする際に発生する粘着剤凝着物の量を少なく抑えることができ、粘着剤凝着物がチップなどに付着したことに起因する不具合が生じ難い。本実施形態における粘着剤層3は、前述した粘着剤組成物から形成されるため、粘着剤層3の厚さが上記のように薄くても、半導体パッケージのように表面粗さが大きいワークに対して、所望の粘着性を発揮することができる。一方、粘着剤層3の厚さが2μm未満であると、ダイシングシート1の粘着力のばらつきが大きくなるといった問題が生じるおそれがある。 (5) Physical properties, shape, etc. (a) Thickness The thickness of the pressure-
粘着剤層3のエネルギー線照射前の23℃における貯蔵弾性率(以下「照射前貯蔵弾性率」という場合がある。)は、12~45kPaであることが好ましく、12~40kPaであることがより好ましく、12~30kPaであることが特に好ましい。照射前貯蔵弾性率が12kPa以上であると、エネルギー線照射後の粘着力が過度に低くなり難い。また、照射前貯蔵弾性率が50kPa以下であると、半導体パッケージのように表面粗さが大きいワークに対して、エネルギー線照射前の粘着力を高く維持し易い。 (B) Storage elastic modulus before irradiation The storage elastic modulus at 23 ° C. before the energy ray irradiation of the pressure-sensitive adhesive layer 3 (hereinafter sometimes referred to as “storage elastic modulus before irradiation”) is preferably 12 to 45 kPa, It is more preferably 12 to 40 kPa, and particularly preferably 12 to 30 kPa. When the storage elastic modulus before irradiation is 12 kPa or more, the adhesive strength after irradiation with energy rays is unlikely to be excessively low. Moreover, when the storage elastic modulus before irradiation is 50 kPa or less, it is easy to maintain a high adhesive force before irradiation with energy rays for a workpiece having a large surface roughness such as a semiconductor package.
ダイシングシート1のエネルギー線照射前の粘着力に対するエネルギー線照射後の粘着力の比は、0.06~0.5であることが好ましく、0.075~0.3であることがより好ましい。上記粘着力の比が上記の範囲内にあると、エネルギー線照射前の粘着力とエネルギー線照射後の粘着力とのバランスが良好になり、エネルギー線照射前の十分な粘着力とエネルギー線照射後の適度な粘着力とを達成し易くなる。 (C) Adhesive strength The ratio of the adhesive strength after irradiation with energy rays to the adhesive strength before irradiation with energy rays of the dicing sheet 1 is preferably 0.06 to 0.5, and preferably 0.075 to 0.3. It is more preferable. When the ratio of the adhesive strength is within the above range, the balance between the adhesive strength before irradiation with energy rays and the adhesive strength after irradiation with energy rays becomes good, and sufficient adhesive strength and energy rays before irradiation with energy rays are obtained. It becomes easy to achieve later moderate adhesive strength.
本実施形態に係るダイシングシート1は、被着体に粘着剤層3を貼付するまでの間、粘着剤層3を保護する目的で、粘着剤層3の基材2側の面と反対側の面に、剥離シートが積層されていてもよい。剥離シートの構成は任意であり、プラスチックフィルムを剥離剤等により剥離処理したものが例示される。プラスチックフィルムの具体例としては、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステルフィルム、およびポリプロピレンやポリエチレン等のポリオレフィンフィルムが挙げられる。剥離剤としては、シリコーン系、フッ素系、長鎖アルキル系等を用いることができるが、これらの中で、安価で安定した性能が得られるシリコーン系が好ましい。剥離シートの厚さについては特に制限はないが、通常20~250μm程度である。 (D) Release sheet The dicing sheet 1 according to the present embodiment is provided on the
ダイシングシート1の製造方法は、前述の粘着剤組成物から形成される粘着剤層3を基材2の一の面に積層できれば、詳細な方法は特に限定されない。一例を挙げれば、前述の粘着剤組成物、および所望によりさらに溶媒を含有する塗工用組成物を調製し、基材1の一の面上に、ダイコーター、カーテンコーター、スプレーコーター、スリットコーター、ナイフコーター等によりその塗工用組成物を塗布して塗膜を形成し、当該塗膜を乾燥させることにより、粘着剤層3を形成することができる。塗工用組成物は、塗布を行うことが可能であればその性状は特に限定されず、粘着剤層3を形成するための成分を溶質として含有する場合もあれば、分散質として含有する場合もある。 3. Manufacturing method of dicing sheet The manufacturing method of the dicing sheet 1 is not particularly limited as long as the pressure-
本実施形態に係るダイシングシート1を用いて、一例として半導体パッケージからモールドチップを製造する方法を以下に説明する。 4). Chip Manufacturing Method A method of manufacturing a mold chip from a semiconductor package as an example using the dicing sheet 1 according to the present embodiment will be described below.
(1)塗工用組成物の調製
次の(a)~(d)の成分を混合し、溶液状態の塗工用組成物(溶媒:トルエン)を調製した。
(a)アクリル系重合体(A)として、50質量部の2-エチルヘキシルアクリレートと、40質量部のメチルアクリレートと、10質量部のアクリル酸とを共重合して得た共重合体(重量平均分子量:80万)を固形分として100質量部
(b)多官能アクリレート系エネルギー線重合性化合物(B)として、カプロラクトン変性ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-60,分子量:1262,重合性官能基量:0.00475モル/g)を固形分として100質量部
(c)架橋剤(C)として、トリメチロールプロパントリレンジイソシアネート(TDI-TMP)を含有する架橋剤成分(トーヨーケム社製:BHS 8515)を固形分として10質量部
(d)光重合開始剤として、1-ヒドロキシシクロヘキシルフェニルケトン(BASF社製:IRGACURE 184)を固形分として3質量部 [Example 1]
(1) Preparation of coating composition The following components (a) to (d) were mixed to prepare a coating composition (solvent: toluene) in a solution state.
(A) As an acrylic polymer (A), a copolymer (weight average) obtained by copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 40 parts by mass of methyl acrylate, and 10 parts by mass of acrylic acid 100 parts by mass (b) of polyfunctional acrylate-based energy beam polymerizable compound (B) with a molecular weight of 800,000) as a solid content, caprolactone-modified dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-60, molecular weight: 1262) , Polymerizable functional group amount: 0.00475 mol / g) as a solid content and 100 parts by mass (c) a crosslinking agent component (Toyochem) containing trimethylolpropane tolylene diisocyanate (TDI-TMP) as a crosslinking agent (C) 10 parts by weight (BHS 8515) as a solid component (d) as a photopolymerization initiator, 3 parts by mass of cyclohexyl phenyl ketone (manufactured by BASF: IRGACURE 184) as a solid content
厚さ38μmのポリエチレンテレフタレート製基材フィルムの片面にシリコーン系の剥離剤層が形成されてなる剥離シート(リンテック社製:SP-PET381031)を用意した。この剥離シートの剥離面上に、前述の塗工用組成物を、ナイフコーターにて、最終的に得られる粘着剤層の厚さが10μmとなるように塗布した。得られた塗膜を剥離シートごと100℃の環境下に1分間経過させることにより塗膜を乾燥させて、剥離シートと粘着剤層(厚さ:10μm)とからなる積層体を得た。 (2) Production of dicing sheet A release sheet (SP-PET 381031 manufactured by Lintec Co., Ltd.) having a silicone release agent layer formed on one side of a 38 μm thick polyethylene terephthalate base film was prepared. On the release surface of this release sheet, the aforementioned coating composition was applied with a knife coater so that the thickness of the finally obtained pressure-sensitive adhesive layer was 10 μm. The obtained coating film was allowed to dry together with the release sheet in an environment of 100 ° C. for 1 minute to dry the coating film to obtain a laminate composed of the release sheet and the pressure-sensitive adhesive layer (thickness: 10 μm).
架橋剤(C)として、1,3-ビス(N,N’-ジグリシジルアミノメチル)シクロヘキサン(三菱ガス化学社製:TETRAD-C)を0.07質量部(固形分)使用する以外は、実施例1と同様にしてダイシングシートを製造した。 [Example 2]
Except for using 0.07 parts by mass (solid content) of 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Inc .: TETRAD-C) as the crosslinking agent (C), A dicing sheet was produced in the same manner as in Example 1.
多官能アクリレート系エネルギー線重合性化合物(B)の配合量を33.3質量部(固形分)に変更する以外は、実施例1と同様にしてダイシングシートを製造した。 Example 3
A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate energy beam polymerizable compound (B) was changed to 33.3 parts by mass (solid content).
多官能アクリレート系エネルギー線重合性化合物(B)の配合量を150質量部(固形分)に変更する以外は、実施例1と同様にしてダイシングシートを製造した。 Example 4
A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 150 parts by mass (solid content).
多官能アクリレート系エネルギー線重合性化合物(B)として、エトキシ化イソシアヌル酸トリアクリレート(新中村化学工業社製:A-9300,分子量:423,重合性官能基量:0.00709モル/g)を使用する以外は、実施例1と同様にしてダイシングシートを製造した。 Example 5
As polyfunctional acrylate-based energy ray polymerizable compound (B), ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: A-9300, molecular weight: 423, polymerizable functional group amount: 0.00709 mol / g) A dicing sheet was produced in the same manner as in Example 1 except that it was used.
多官能アクリレート系エネルギー線重合性化合物(B)として、ジトリメチロールプロパンテトラアクリレート(新中村化学工業社製:AD-TMP,分子量:466,重合性官能基量:0.00858モル/g)を使用する以外は、実施例1と同様にしてダイシングシートを製造した。 Example 6
Ditrimethylolpropane tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: AD-TMP, molecular weight: 466, polymerizable functional group amount: 0.00858 mol / g) is used as the polyfunctional acrylate energy beam polymerizable compound (B). A dicing sheet was produced in the same manner as in Example 1 except that.
粘着剤層の厚さを15μmに変更する以外は、実施例1と同様にしてダイシングシートを製造した。 Example 7
A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 15 μm.
多官能アクリレート系エネルギー線重合性化合物(B)の配合量を22質量部(固形分)に変更する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 1]
A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 22 parts by mass (solid content).
多官能アクリレート系エネルギー線重合性化合物(B)として、ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-20,分子量:578,重合性官能基量:0.01040モル/g)を使用する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 2]
Dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-20, molecular weight: 578, polymerizable functional group amount: 0.01040 mol / g) is used as the polyfunctional acrylate-based energy beam polymerizable compound (B). A dicing sheet was produced in the same manner as in Example 1 except for the above.
多官能アクリレート系エネルギー線重合性化合物(B)として、ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-120,分子量:1946,重合性官能基量:0.00308モル/g)を使用する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 3]
Dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-120, molecular weight: 1946, polymerizable functional group amount: 0.00308 mol / g) is used as the polyfunctional acrylate-based energy beam polymerizable compound (B). A dicing sheet was produced in the same manner as in Example 1 except for the above.
多官能アクリレート系エネルギー線重合性化合物(B)の配合量を400質量部(固形分)に変更する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 4]
A dicing sheet was produced in the same manner as in Example 1 except that the blending amount of the polyfunctional acrylate-based energy beam polymerizable compound (B) was changed to 400 parts by mass (solid content).
多官能アクリレート系エネルギー線重合性化合物(B)の配合量を400質量部(固形分)に変更する以外は、比較例3と同様にしてダイシングシートを製造した。 [Comparative Example 5]
A dicing sheet was produced in the same manner as in Comparative Example 3 except that the blending amount of the polyfunctional acrylate energy beam polymerizable compound (B) was changed to 400 parts by mass (solid content).
多官能アクリレート系エネルギー線重合性化合物(B)に替えて、3~4官能ウレタンアクリレート(大日精化工業社製:EXL810TL,重量平均分子量(Mw):5000)を100質量部(固形分)使用する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 6]
Instead of the polyfunctional acrylate-based energy ray-polymerizable compound (B), 100 parts by mass (solid content) of 3 to 4 functional urethane acrylate (Daiichi Seika Kogyo Co., Ltd .: EXL810TL, weight average molecular weight (Mw): 5000) is used. A dicing sheet was produced in the same manner as in Example 1 except that.
多官能アクリレート系エネルギー線重合性化合物(B)に替えて、5~6官能ウレタンアクリレート(大日精化工業社製:14-29B,重量平均分子量(Mw):2500)を100質量部(固形分)使用する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 7]
100 parts by mass (solid content) of 5-6 functional urethane acrylate (manufactured by Dainichi Seika Kogyo Co., Ltd .: 14-29B, weight average molecular weight (Mw): 2500) instead of polyfunctional acrylate energy ray polymerizable compound (B) ) A dicing sheet was produced in the same manner as in Example 1 except that it was used.
粘着剤層の厚さを25μmに変更する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 8]
A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 25 μm.
粘着剤層の厚さを30μmに変更する以外は、実施例1と同様にしてダイシングシートを製造した。 [Comparative Example 9]
A dicing sheet was produced in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 30 μm.
「DPHA 1」:ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-20)
「DPHA 2」:カプロラクトン変性ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-60)
「DPHA 3」:カプロラクトン変性ジペンタエリスリトールヘキサアクリレート(日本化薬社製:DPCA-120)
「A-9300 4」:エトキシ化イソシアヌル酸トリアクリレート(新中村化学工業社製:A-9300)
「AD-ATP 5」:ジトリメチロールプロパンテトラアクリレート(新中村化学工業社製:AD-TMP)
「UA 6」:3~4官能ウレタンアクリレート(大日精化工業社製:EXL810TL)
「UA 7」5~6官能ウレタンアクリレート(大日精化工業社製:14-29B)
また、表1におけるエネルギー線重合性化合物の配合割合は、アクリル系重合体(A)およびエネルギー線重合性化合物の合計量に対するエネルギー線重合性化合物の割合を意味する。 Kind, molecular weight, polymerization of energy ray polymerizable compounds (polyfunctional acrylate energy ray polymerizable compound (B) and polyfunctional urethane acrylate) used for forming the pressure-sensitive adhesive layer of the dicing sheet according to the above examples and comparative examples Table 1 summarizes the number of moles of the functional functional group, the blending ratio (mass%), the product of the number of moles of the polymerizable functional group and the blending ratio, and the thickness (μm) of the pressure-sensitive adhesive layer. The meanings of the abbreviations of the component types in Table 1 are as follows.
“DPHA 1”: dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd .: DPCA-20)
“
“
“A-9300 4”: ethoxylated isocyanuric acid triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: A-9300)
“AD-ATP 5”: ditrimethylolpropane tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: AD-TMP)
“UA 6”: 3-4 functional urethane acrylate (manufactured by Dainichi Seika Kogyo Co., Ltd .: EXL810TL)
"UA 7" 5-6 functional urethane acrylate (Daiichi Seika Kogyo Co., Ltd .: 14-29B)
Moreover, the compounding ratio of the energy beam polymerizable compound in Table 1 means the ratio of the energy beam polymerizable compound to the total amount of the acrylic polymer (A) and the energy beam polymerizable compound.
厚さ38μmのポリエチレンテレフタレート製基材フィルムの片面にシリコーン系の剥離剤層が形成されてなる剥離シート(リンテック社製:SP-PET381031)を用意した。実施例および比較例において調製した塗工用組成物のそれぞれを、上記の剥離シートの剥離面上に、ナイフコーターにて、最終的に得られる粘着剤層の厚さが40μmとなるように塗布した。得られた塗膜を剥離シートごと100℃の環境下に1分間経過させることにより塗膜を乾燥させて、各塗工用組成物から形成された粘着剤層(厚さ:40μm)と剥離シートとからなる積層体を複数準備した。 [Test Example 1] <Measurement of storage elastic modulus>
A release sheet (manufactured by Lintec Corporation: SP-PET 381031) having a silicone release agent layer formed on one side of a base film made of polyethylene terephthalate having a thickness of 38 μm was prepared. Each of the coating compositions prepared in Examples and Comparative Examples was applied on the release surface of the release sheet with a knife coater so that the finally obtained pressure-sensitive adhesive layer had a thickness of 40 μm. did. The resulting coating film is dried together with the release sheet in an environment of 100 ° C. for 1 minute to dry the coating film, and an adhesive layer (thickness: 40 μm) formed from each coating composition and the release sheet A plurality of laminates made of
実施例および比較例にて製造したダイシングシートを幅25mm×長さ200mmに裁断し、これを試験片とした。一方、半導体基板の代わりのガラスエポキシ板(ガラス繊維にエポキシ樹脂を含浸させ、硬化させたもの)の片面上に、半導体パッケージ用樹脂(京セラケミカル製:KE-G1250)を下記条件にてトランスファー成型して樹脂封止し、サイズ150mm×50mm、厚さ600μmであって、ダイシングシートが貼付される被着面の算術平均粗さ(Ra)が2μmである模擬半導体パッケージを作製し、これを被着体とした。 [Test Example 2] <Measurement of adhesive strength>
The dicing sheets produced in the examples and comparative examples were cut into a width of 25 mm and a length of 200 mm, and this was used as a test piece. On the other hand, a resin for semiconductor packaging (Kyocera Chemical: KE-G1250) is transfer molded on one side of a glass epoxy board (glass fiber impregnated with epoxy resin and cured) instead of a semiconductor substrate under the following conditions. Then, a simulated semiconductor package having a size of 150 mm × 50 mm, a thickness of 600 μm, and an arithmetic average roughness (Ra) of the adherend to which the dicing sheet is attached is 2 μm, and this is covered. It was a kimono.
・封止装置:アピックヤマダ社製,MPC-06M Trial Press
・注入樹脂温度:180℃
・樹脂注入圧:6.9MPa
・樹脂注入時間:120秒 <Transfer molding conditions>
Sealing device: manufactured by Apic Yamada, MPC-06M Trial Press
-Injection resin temperature: 180 ° C
・ Resin injection pressure: 6.9 MPa
・ Resin injection time: 120 seconds
試験例2と同様にして、半導体パッケージ用樹脂(京セラケミカル製:KE-G1250)を用いて、サイズ50mm×50mm、厚さ600μmであって、ダイシングシートが貼付される被着面の算術平均粗さ(Ra)が2μmである模擬半導体パッケージを作製した。 [Test Example 3] <Evaluation of chip scattering property>
In the same manner as in Test Example 2, using a semiconductor package resin (manufactured by Kyocera Chemical Co., Ltd .: KE-G1250), the arithmetic average roughness of the adherend surface to which the dicing sheet is affixed having a size of 50 mm × 50 mm and a thickness of 600 μm. A simulated semiconductor package having a thickness (Ra) of 2 μm was produced.
・ダイシング装置 :DISCO社製 DFD-651
・ブレード :DISCO社製 ZBT-5074(Z111OLS3)
・刃の厚さ :0.17mm
・刃先出し量 :3.3mm
・ブレード回転数 :30000rpm
・切削速度 :100mm/分
・基材切り込み深さ:50μm
・切削水量 :1.0L/分
・切削水温度 :20℃ <Dicing conditions>
・ Dicing machine: DFD-651 made by DISCO
・ Blade: ZBT-5074 (Z111OLS3) manufactured by DISCO
・ Blade thickness: 0.17 mm
-Blade tip length: 3.3 mm
・ Blade rotation speed: 30000 rpm
・ Cutting speed: 100 mm / min ・ Base material cutting depth: 50 μm
・ Cutting water volume: 1.0 L / min ・ Cutting water temperature: 20 ° C.
試験例3と同様にしてダイシング工程を行った。次いで、複数のモールドチップが付着するダイシングシートに対して、紫外線照射装置(リンテック社製:RAD-2000m/12)を用い、窒素雰囲気下にてダイシングシートの基材側から紫外線照射(照度230mW/cm2,光量190mJ/cm2)を行った。 [Test Example 4] <Pickup suitability test>
A dicing process was performed in the same manner as in Test Example 3. Next, the dicing sheet to which a plurality of mold chips adhere is irradiated with ultraviolet rays (illuminance of 230 mW / second) from the substrate side of the dicing sheet in a nitrogen atmosphere using an ultraviolet irradiation apparatus (RAD-2000 m / 12 manufactured by Lintec Corporation). cm 2 , light quantity 190 mJ / cm 2 ).
モールドチップの大きさを5mm×5mmに変更する以外、試験例3と同様にしてダイシング工程を行った。ダイシング工程により得られたモールドチップの側面を光学顕微鏡にて観察し、それらの側面に付着している粘着剤凝集物の大きさ(最大直径)を測定し、以下の基準で粘着剤凝集物の発生状況の評価を行った。結果を表2に示す。
○ :10μm以上の粘着剤凝集物が発生していない
△ :10μm以上20μm未満の粘着剤凝集物が発生
× :20μm以上30μm未満の粘着剤凝集物が発生
××:30μm以上の粘着剤凝集物が発生 [Test Example 5] <Evaluation of adhesive aggregate>
A dicing process was performed in the same manner as in Test Example 3 except that the size of the mold chip was changed to 5 mm × 5 mm. The side surface of the mold chip obtained by the dicing process is observed with an optical microscope, and the size (maximum diameter) of the pressure-sensitive adhesive aggregate adhering to the side surface is measured. The occurrence situation was evaluated. The results are shown in Table 2.
○: Adhesive aggregate of 10 μm or more is not generated Δ: Adhesive aggregate of 10 μm or more and less than 20 μm is generated ×: Adhesive aggregate of 20 μm or more and less than 30 μm is generated XX: Adhesive aggregate of 30 μm or more Occurs
試験例3と同様にしてダイシング工程を行った。次いで、複数のモールドチップが付着するダイシングシートに対して、紫外線照射装置(リンテック社製:AD-2000m/12)を用い、窒素雰囲気下にてダイシングシートの基材側から紫外線照射(照度230mW/cm2,光量190mJ/cm2)を行った。 [Test Example 6] <Ring frame retention test>
A dicing process was performed in the same manner as in Test Example 3. Next, the dicing sheet to which a plurality of mold chips adhere is irradiated with ultraviolet rays (illuminance of 230 mW / day) from the substrate side of the dicing sheet in a nitrogen atmosphere using an ultraviolet irradiation device (manufactured by Lintec: AD-2000 m / 12). cm 2 , light quantity 190 mJ / cm 2 ).
2…基材
3…粘着剤層 DESCRIPTION OF SYMBOLS 1 ... Dicing
Claims (8)
- 表面の算術平均粗さ(Ra)が0.1μm以上であるワークを被着体とするダイシングシートであって、
前記ダイシングシートは、基材と、前記基材の少なくとも一方の面に積層された粘着剤層とを備えており、
前記粘着剤層は、アクリル系重合体(A)および多官能アクリレート系エネルギー線重合性化合物(B)を含有する粘着剤組成物から形成されたものであり、
前記多官能アクリレート系エネルギー線重合性化合物(B)は、当該多官能アクリレート系エネルギー線重合性化合物(B)1g中に、重合性官能基を0.004~0.009モル有しており、
前記アクリル系重合体(A)および前記多官能アクリレート系エネルギー線重合性化合物(B)の合計量に対する前記多官能アクリレート系エネルギー線重合性化合物(B)の割合は、20~65質量%であり、
前記粘着剤層の厚さは、2~20μmである
ことを特徴とするダイシングシート。 A dicing sheet having a workpiece having a surface arithmetic average roughness (Ra) of 0.1 μm or more as an adherend,
The dicing sheet comprises a base material and an adhesive layer laminated on at least one surface of the base material,
The pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing an acrylic polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B),
The polyfunctional acrylate energy beam polymerizable compound (B) has 0.004 to 0.009 mol of a polymerizable functional group in 1 g of the polyfunctional acrylate energy beam polymerizable compound (B).
The ratio of the polyfunctional acrylate energy beam polymerizable compound (B) to the total amount of the acrylic polymer (A) and the polyfunctional acrylate energy beam polymerizable compound (B) is 20 to 65% by mass. ,
A dicing sheet, wherein the pressure-sensitive adhesive layer has a thickness of 2 to 20 μm. - 前記アクリル系重合体(A)および前記多官能アクリレート系エネルギー線重合性化合物(B)の合計量に対する前記多官能アクリレート系エネルギー線重合性化合物(B)の割合と、前記多官能アクリレート系エネルギー線重合性化合物(B)1g中に含まれる重合性官能基のモル数との積は、0.1~0.48であることを特徴とする請求項1に記載のダイシングシート。 The ratio of the polyfunctional acrylate energy beam polymerizable compound (B) to the total amount of the acrylic polymer (A) and the polyfunctional acrylate energy beam polymerizable compound (B), and the polyfunctional acrylate energy beam. The dicing sheet according to claim 1, wherein the product of the polymerizable compound (B) and the number of moles of the polymerizable functional group contained in 1 g is 0.1 to 0.48.
- 前記多官能アクリレート系エネルギー線重合性化合物(B)の分子構造より特定される分子量は、400~2000であることを特徴とする請求項1または2に記載のダイシングシート。 3. The dicing sheet according to claim 1, wherein the molecular weight specified by the molecular structure of the polyfunctional acrylate-based energy beam polymerizable compound (B) is 400 to 2000.
- 前記多官能アクリレート系エネルギー線重合性化合物(B)は、(メタ)アクリル酸と多価アルコールとのエステル化物、(メタ)アクリル酸とイソシアヌル酸とのエステル化物、およびそれらの変性物からなる群から選ばれる少なくとも1種であることを特徴とする請求項1または2に記載のダイシングシート。 The polyfunctional acrylate-based energy beam polymerizable compound (B) is a group consisting of an esterified product of (meth) acrylic acid and a polyhydric alcohol, an esterified product of (meth) acrylic acid and isocyanuric acid, and a modified product thereof. The dicing sheet according to claim 1, wherein the dicing sheet is at least one selected from the group consisting of:
- 前記多官能アクリレート系エネルギー線重合性化合物(B)は、ジペンタエリスリトールヘキサアクリレートの変性物、イソシアヌル酸トリアクリレートの変性物およびジトリメチロールプロパンテトラアクリレートからなる群から選ばれる少なくとも1種であることを特徴とする請求項1または2に記載のダイシングシート。 The polyfunctional acrylate-based energy ray polymerizable compound (B) is at least one selected from the group consisting of a modified product of dipentaerythritol hexaacrylate, a modified product of isocyanuric acid triacrylate, and ditrimethylolpropane tetraacrylate. The dicing sheet according to claim 1, wherein the sheet is a dicing sheet.
- 前記粘着剤層のエネルギー線照射前の23℃における貯蔵弾性率は、12~45kPaであることを特徴とする請求項1~5のいずれか一項に記載のダイシングシート。 The dicing sheet according to any one of claims 1 to 5, wherein the pressure-sensitive adhesive layer has a storage elastic modulus at 23 ° C before irradiation with energy rays of 12 to 45 kPa.
- 被着面が京セラケミカル社製のKE-G1250からなる平面であり、当該被着面の算術平均粗さ(Ra)が2μmである部材を被着体として、1kg重の荷重を加えてダイシングシートを貼付し、23℃、50%RHの雰囲気下に20分間放置した後、測定したダイシングシートの粘着力をエネルギー線照射前の粘着力とし、
ダイシングシートを前記被着体に前記と同じ条件で貼付してから、23℃、50%RHの雰囲気下に20分間放置し、窒素雰囲気下にて、エネルギー線照射として紫外線を照度230mW/cm2、光量190mJ/cm2で照射した後、測定したダイシングシートの粘着力をエネルギー線照射後の粘着力としたときに、
前記エネルギー線照射前の粘着力に対する前記エネルギー線照射後の粘着力の比が、0.06~0.5である
ことを特徴とする請求項1~6のいずれか一項に記載のダイシングシート。 The surface to be adhered is a flat surface made of KE-G1250 manufactured by Kyocera Chemical Co., Ltd., and the member whose arithmetic average roughness (Ra) is 2 μm is applied to the substrate, and a load of 1 kg is applied to the dicing sheet. After being left for 20 minutes in an atmosphere of 23 ° C. and 50% RH, the measured adhesive strength of the dicing sheet is defined as the adhesive strength before energy beam irradiation.
After the dicing sheet was attached to the adherend under the same conditions as described above, the dicing sheet was left in an atmosphere of 23 ° C. and 50% RH for 20 minutes, and ultraviolet rays were irradiated as energy rays in a nitrogen atmosphere at an illumination intensity of 230 mW / cm 2. When the adhesive strength of the dicing sheet measured after irradiation with a light amount of 190 mJ / cm 2 is taken as the adhesive strength after irradiation with energy rays,
The dicing sheet according to any one of claims 1 to 6, wherein a ratio of the adhesive strength after irradiation with the energy beam to the adhesive strength before irradiation with the energy beam is 0.06 to 0.5. . - 前記ワークが半導体パッケージであることを特徴とする請求項1~7のいずれか一項に記載のダイシングシート。 The dicing sheet according to any one of claims 1 to 7, wherein the workpiece is a semiconductor package.
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JP2015525273A JP6317744B2 (en) | 2013-07-05 | 2014-07-03 | Dicing sheet |
CN201480038559.1A CN105378899B (en) | 2013-07-05 | 2014-07-03 | Cutting sheet |
SG11201600047XA SG11201600047XA (en) | 2013-07-05 | 2014-07-03 | Dicing sheet |
PH12016500005A PH12016500005B1 (en) | 2013-07-05 | 2016-01-04 | Dicing sheet |
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JP2015149429A (en) * | 2014-02-07 | 2015-08-20 | 株式会社ディスコ | Wafer processing method |
WO2019044786A1 (en) * | 2017-08-29 | 2019-03-07 | 東亞合成株式会社 | Resin sheet and curable composition for producing same |
JP2020170877A (en) * | 2015-03-06 | 2020-10-15 | ルミレッズ ホールディング ベーフェー | Mounting method of ceramic phosphor plate on light emitting device (led) die using dicing tape, formation method of dicing tape, and dicing tape |
WO2021065071A1 (en) * | 2019-10-04 | 2021-04-08 | リンテック株式会社 | Pressure-sensitive-adhesive sheet |
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WO2015115552A1 (en) | 2014-01-29 | 2015-08-06 | 日立化成株式会社 | Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element |
TWI660023B (en) | 2014-01-29 | 2019-05-21 | 日立化成股份有限公司 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element |
KR20160114048A (en) | 2014-01-29 | 2016-10-04 | 히타치가세이가부시끼가이샤 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element |
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JP2011122100A (en) * | 2009-12-11 | 2011-06-23 | Lintec Corp | Adhesive sheet for processing electronic part |
JP2011181899A (en) * | 2010-02-02 | 2011-09-15 | Lintec Corp | Dicing sheet |
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