WO2014208523A1 - 無アルカリガラス - Google Patents
無アルカリガラス Download PDFInfo
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- WO2014208523A1 WO2014208523A1 PCT/JP2014/066626 JP2014066626W WO2014208523A1 WO 2014208523 A1 WO2014208523 A1 WO 2014208523A1 JP 2014066626 W JP2014066626 W JP 2014066626W WO 2014208523 A1 WO2014208523 A1 WO 2014208523A1
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- glass
- compaction
- alkali
- mgo
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
Definitions
- the present invention is suitable for display substrate glass and photomask substrate glass used in the manufacture of various flat panel displays (FPDs), is substantially free of alkali metal oxides, has low compaction, and can be float-molded. , Relating to alkali-free glass.
- FPDs flat panel displays
- Patent Document 1 Conventionally, various display substrate glasses, particularly those in which a metal or oxide thin film is formed on the surface, have been required to have the following characteristics as shown in Patent Document 1, for example. (1) When an alkali metal oxide is contained, alkali metal ions diffuse into the thin film and deteriorate the film characteristics, so that the alkali metal ions are not substantially contained. (2) Sufficient chemical durability against various chemicals used for semiconductor formation.
- buffered hydrofluoric acid (BHF: mixture of hydrofluoric acid and ammonium fluoride) for etching SiO x and SiN x , and chemicals containing hydrochloric acid used for etching ITO, various acids used for etching metal electrodes (Nitric acid, sulfuric acid, etc.) Resistant to alkali of resist stripping solution. (3) There are no defects (bubbles, striae, inclusions, pits, scratches, etc.) inside and on the surface.
- BHF mixture of hydrofluoric acid and ammonium fluoride
- a-Si amorphous silicon
- p-Si polycrystalline silicon
- a glass having a small average thermal expansion coefficient is required to increase productivity and thermal shock resistance by increasing the temperature raising / lowering rate of the heat treatment during liquid crystal display production.
- glass compaction is required to be low in order to minimize dimensional changes associated with glass deformation and glass structural stability when exposed to high temperatures in the thin film formation process. It has been.
- An object of the present invention is to provide an alkali-free glass having a low compaction, a small average thermal expansion coefficient, and easy float forming.
- the compaction C1 is 5 ppm or less
- the compaction C2 is 40 ppm or less
- expressed in mass% based on the oxide SiO 2 64 to 72, Al 2 O 3 17-22, MgO 1-8, CaO 4 to 15.5, And an alkali-free glass satisfying 0.20 ⁇ MgO / (MgO + CaO) ⁇ 0.41.
- the compaction C1 is 5 ppm or less
- the compaction C2 is 25 ppm or less
- expressed in mass% based on the oxide, SiO 2 67.5-72, Al 2 O 3 17-21, MgO 1-6, CaO 4 to 8.5, Containing SiO 2 , Al 2 O 3 , MgO and CaO are 96% by mass or more in total, It is preferable that 0.22 ⁇ MgO / (MgO + CaO) ⁇ 0.39.
- the compaction C1 is 5 ppm or less
- the compaction C2 is 40 ppm or less
- expressed in mass% based on the oxide, SiO 2 64 to 68, Al 2 O 3 17-22, MgO 2.3-8, CaO 9 to 15.5, Containing SiO 2 , Al 2 O 3 , MgO and CaO are 96% by mass or more in total, It is preferable that 0.22 ⁇ MgO / (MgO + CaO) ⁇ 0.39.
- the alkali-free glass of the present invention is suitable as a substrate glass for various displays and a substrate glass for a photomask, but can also be used as a glass substrate for a magnetic disk.
- glass substrates for various displays and photomasks that are required to minimize deformation due to glass deformation and glass structural stabilization when exposed to high temperatures in the thin film formation process. It is effective as a glass substrate.
- the composition range of each component will be described. If SiO 2 exceeds 72% (mass%, the same unless otherwise specified), the devitrification temperature T L may increase. In addition, the viscosity is increased, and there is a risk that bubbles may be mixed in due to an increase in melting temperature or bubbles that cannot be completely removed during clarification. If it is less than 64%, the ratio of network formers decreases, and compaction increases. Moreover, an average thermal expansion coefficient becomes large. In the first aspect of the alkali-free glass of the present invention, SiO 2 content is less 72% or more 67.5%.
- the viscosity will be high, the melting temperature will increase, and bubbles may not be removed at the time of clarification, and bubbles may be mixed in. If it is less than 67.5%, compaction may increase. 68% or more is more preferable.
- the SiO 2 content is 64% or more and 68% or less. If it exceeds 68%, the melting temperature may increase. 67% or less is more preferable. If it is less than 64%, compaction may increase. Moreover, an average thermal expansion coefficient becomes large.
- the devitrification temperature T L may increase. Further, since it works as a network former like SiO 2, if it exceeds 22%, the viscosity increases, and there is a possibility that the melting temperature rises and bubbles are mixed. If it is less than 17%, the compaction will increase.
- the Al 2 O 3 content is 17% or more and 21% or less. If it exceeds 21%, the devitrification temperature T L may increase. 20.5% or less is more preferable. If it is less than 17%, the compaction will increase. 18% or more is more preferable.
- the Al 2 O 3 content is 17% or more and 22% or less. If it exceeds 22%, the devitrification temperature T L may increase. 21% or less is more preferable. If it is less than 17%, the compaction will increase. 18% or more is more preferable.
- the glass transition point Tg decreases.
- compaction increases and the average coefficient of thermal expansion increases. If it is less than 1%, the solubility will deteriorate, the Young's modulus will decrease, and the devitrification temperature TL will increase.
- the MgO content is 1% or more and 6% or less. If it exceeds 6%, the glass transition point Tg decreases, the compaction increases, and the average thermal expansion coefficient increases. 5% or less is more preferable. If it is less than 1%, the devitrification temperature TL will increase. In addition, Young's modulus decreases. 2% or more is more preferable.
- the MgO content is 2.3% or more and 8% or less. If it exceeds 8%, compaction increases and the average thermal expansion coefficient becomes large. If it is less than 2.3%, the devitrification temperature T L will increase. In addition, Young's modulus decreases. 4% or more is more preferable.
- the CaO content is 4% or more and 8.5% or less. If it exceeds 8.5%, the compaction will increase and the devitrification temperature TL will increase. If it is less than 4%, the solubility deteriorates, the melting temperature rises, and the devitrification temperature also rises. 5% or more is more preferable.
- the CaO content is 9% or more and 15.5% or less. If it exceeds 15.5%, the compaction will increase and the devitrification temperature TL will increase. If it is less than 9%, the solubility deteriorates and the dissolution temperature rises. 10% or more is more preferable.
- MgO / (CaO + MgO) is higher than 0.41, compaction at the time of heat treatment at 600 ° C. increases. Moreover, an average thermal expansion coefficient becomes large. 0.39 or less is preferable and 0.37 or less is more preferable. When it is lower than 0.20, the devitrification temperature T L increases. 0.22 or more is preferable and 0.24 or more is more preferable.
- the other components are preferably less than 5%, more preferably less than 4%, more preferably less than 3%, even more preferably less than 1%, and still more preferably in order to achieve both high Young's modulus and low compaction. Is less than 0.5%, and particularly preferably, it is substantially not contained, that is, excluding inevitable impurities. Accordingly, in the present invention, the total content of SiO 2 , Al 2 O 3 , CaO, and MgO is preferably 95% or more, more preferably 96% or more, and 97% or more. More preferably, it is 99% or more, more preferably 99.5% or more. It is particularly preferred that it consists essentially of SiO 2 , Al 2 O 3 , CaO and MgO, excluding unavoidable impurities.
- the B 2 O 3 can be contained to improve the melting reactivity of the glass. However, if the amount is too large, the Young's modulus decreases and the compaction increases. Therefore, the content is preferably less than 3%, more preferably less than 1%, and particularly preferably not contained.
- BaO can be included to improve the solubility of the glass.
- the content is preferably less than 5%, more preferably less than 3%, even more preferably less than 1%, even more preferably less than 0.5%, substantially It is particularly preferable that it is not contained in.
- the SrO can be contained to improve solubility. However, if the amount is too large, the average thermal expansion coefficient increases, so the content is preferably less than 5%.
- the SrO content is preferably less than 3%, more preferably less than 1%, even more preferably less than 0.5%, and substantially no content. Particularly preferred.
- the content of SrO is preferably less than 2%, more preferably less than 1%, more preferably less than 0.3%, and particularly preferably not contained.
- ZrO 2 can be contained to improve the Young's modulus of the glass. However, if the amount is too large, the devitrification temperature increases, so the content is preferably less than 3%, more preferably less than 1%, and particularly preferably not contained.
- the total amount of ZnO, SO 3 , Fe 2 O 3 , F, Cl and SnO 2 is less than 1%, preferably 0.8%. It can be contained less than 5%, more preferably less than 0.3%, and even more preferably less than 0.1%.
- the glass of the present invention does not contain an alkali metal oxide in excess of the impurity level (ie substantially) in order not to cause deterioration of the characteristics of the metal or oxide thin film provided on the glass surface during panel production.
- PbO, As 2 O 3 and Sb 2 O 3 are not substantially contained.
- the alkali-free glass of the present invention has a very low compaction.
- Compaction is the glass heat shrinkage generated by relaxation of the glass structure during the heat treatment.
- compaction means a value measured by the method described below.
- the target glass is melted at 1550 ° C. to 1650 ° C., then the molten glass is poured out, formed into a plate shape, and then cooled.
- the obtained plate glass is polished to obtain a glass plate of 100 mm ⁇ 20 mm ⁇ 1 mm.
- the obtained glass plate is heated to the glass transition point Tg + 70 ° C., held at this temperature for 1 minute, and then cooled to room temperature at a temperature drop rate of 40 ° C./min.
- the alkali-free glass of the present invention has a compaction C1 of 5 ppm or less.
- the compaction C2 is 40 ppm or less.
- the alkali-free glass of the present invention has a compact film C1, C2 satisfying the above conditions, and therefore, when exposed to high temperatures in a thin film forming process performed in the process of manufacturing various displays using the alkali-free glass, The dimensional change accompanying the deformation of the glass and the stabilization of the glass structure can be minimized.
- compaction C1 is 5 ppm or less.
- the compaction C2 is 25 ppm or less, and more preferably 20 ppm or less.
- the compaction C1 is 5 ppm or less.
- compaction C2 is 40 ppm or less, and 35 ppm or less is more preferable.
- the alkali-free glass of the present invention has a temperature T 2 at which the viscosity ⁇ becomes 10 2 poise (dPa ⁇ s) in order to facilitate melting and to suppress erosion of the refractory bricks constituting the melting furnace. It is preferable that it is 1760 degrees C or less. In the first aspect of the alkali-free glass of the present invention, it is preferred that T 2 is 1760 ° C. or less. 1740 ° C. is more preferable, and 1720 ° C. or lower is even more preferable. In the second embodiment of the alkali-free glass of the present invention, T 2 is preferably 1730 ° C. or lower. 1710 degrees C or less is more preferable, and 1690 degrees C or less is still more preferable.
- the alkali-free glass of the present invention preferably has a temperature T 4 at which the viscosity ⁇ becomes 10 4 poise (dPa ⁇ s) of 1380 ° C. or lower in order to facilitate float forming.
- T 4 is 1380 ° C. or less. 1360 ° C. is more preferable, and 1340 ° C. or less is even more preferable.
- T 4 is preferably 1360 ° C. or lower. 1340 degrees C or less is more preferable, and 1320 degrees C or less is still more preferable.
- the alkali-free glass of the present invention has an average thermal expansion coefficient of 40 ⁇ 10 ⁇ 7 / ° C. or less at 50 to 350 ° C. in order to increase the thermal shock resistance and increase the productivity during panel manufacture.
- the average thermal expansion coefficient at 50 to 350 ° C. is preferably 37 ⁇ 10 ⁇ 7 / ° C. or less, more preferably 34 ⁇ 10 ⁇ 7 / ° C. or less. preferable.
- the average thermal expansion coefficient at 50 to 350 ° C. is preferably 40 ⁇ 10 ⁇ 7 / ° C. or less, and more preferably 38 ⁇ 10 ⁇ 7 / ° C. or less.
- the alkali-free glass of the present invention has a glass transition point of 780 ° C. or higher in order to suppress thermal shrinkage during panel production and to make it possible to apply a method by laser annealing as a method for producing p-Si TFTs. Is preferred.
- the glass transition point is 780 ° C. or more, the fictive temperature of the glass tends to increase in the production process (for example, organic EL having a thickness of 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less) Suitable for a display substrate or lighting substrate for use in the like, or a thin display substrate or lighting substrate having a thickness of 0.3 mm or less, preferably 0.1 mm or less.
- the alkali-free glass of the present invention can be produced, for example, by the following method.
- the raw materials of each component that are normally used are blended so as to become target components, which are continuously charged into a melting furnace, heated to 1550 to 1650 ° C. and melted.
- the molten glass is formed into a predetermined plate thickness by the float method, and then the glass plate can be obtained by slow cooling and cutting.
- examples 1 to 12 are examples, and examples 13 to 15 are comparative examples.
- the raw materials of each component were prepared so as to have a target composition, and were melted at a temperature of 1550 to 1650 ° C. using a platinum crucible. In melting, the mixture was stirred using a platinum stirrer to homogenize the glass. Next, the molten glass was poured out, formed into a plate shape, and then slowly cooled.
- the glass composition (unit: mass%), density ⁇ (g / cm 3 ), Young's modulus E (GPa) (measured by ultrasonic method), specific modulus E / ⁇ (GPa ⁇ cm 3 / g), glass transition point Tg (unit: ° C.), average thermal expansion coefficient ⁇ (unit: ⁇ 10 ⁇ 7 / ° C.) at 50 to 350 ° C., temperature T 2 (glass viscosity ⁇ becomes 10 2 poises) (Unit: ° C.), temperature T 4 (unit: ° C.) at which the glass viscosity ⁇ is 10 4 poise, and compaction C1, C2 (measured by the method described above, unit: ppm) are shown.
- the values shown in parentheses are calculated values.
- the glass of the example has a compaction C1 of 5 ppm or less and a compaction C2 of 40 ppm or less.
- the average thermal expansion coefficient at 50 to 350 ° C. is 40 ⁇ 10 ⁇ 7 / ° C. or less.
- the alkali-free glass of the present invention is suitable as a substrate glass for various displays and a substrate glass for a photomask, but can also be used as a glass substrate for a magnetic disk.
- glass substrates for various displays and photomasks that are required to minimize deformation due to glass deformation and glass structural stabilization when exposed to high temperatures in the thin film formation process. It is effective as a glass substrate.
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Abstract
Description
(1)アルカリ金属酸化物を含有していると、アルカリ金属イオンが薄膜中に拡散して膜特性を劣化させるため、実質的にアルカリ金属イオンを含まないこと。
(2)半導体形成に用いる各種薬品に対して充分な化学耐久性を有すること。特にSiOxやSiNxのエッチングのためのバッファードフッ酸(BHF:フッ酸とフッ化アンモニウムの混合液)、およびITOのエッチングに用いる塩酸を含有する薬液、金属電極のエッチングに用いる各種の酸(硝酸、硫酸等)、レジスト剥離液のアルカリに対して耐久性のあること。
(3)内部および表面に欠点(泡、脈理、インクルージョン、ピット、キズ等)がないこと。
(4)ディスプレイの軽量化が要求され、ガラス自身も密度の小さいガラスが望まれる。
(5)ディスプレイの軽量化が要求され、基板ガラスの薄板化が望まれる。
(7)液晶ディスプレイ作製時の熱処理の昇降温速度を速くして、生産性を上げたり耐熱衝撃性を上げるために、ガラスの平均熱膨張係数の小さいガラスが求められる。
SiO2 64~72、
Al2O3 17~22、
MgO 1~8、
CaO 4~15.5、
を含有し
0.20≦MgO/(MgO+CaO)≦0.41である無アルカリガラスを提供する。
コンパクションC1が5ppm以下であり、コンパクションC2が25ppm以下であり、酸化物基準の質量%表示で、
SiO2 67.5~72、
Al2O3 17~21、
MgO 1~6、
CaO 4~8.5、
を含有し、
SiO2 、Al2O3、MgOおよびCaOが合量で96質量%以上であり、
0.22≦MgO/(MgO+CaO)≦0.39であることが好ましい。
SiO2 64~68、
Al2O3 17~22、
MgO 2.3~8、
CaO 9~15.5、
を含有し、
SiO2 、Al2O3、MgOおよびCaOが合量で96質量%以上であり、
0.22≦MgO/(MgO+CaO)≦0.39であることが好ましい。
ここで、本発明の無アルカリガラスの第1態様では、SiO2含有量が67.5%以上72%以下である。72%超では、粘性も高くなり、溶解温度の上昇や、清澄時に泡が抜けきらず、気泡が混入するおそれがある。67.5%未満では、コンパクションが増加するおそれがある。68%以上がより好ましい。
本発明の無アルカリガラスの第2態様では、SiO2含有量が64%以上68%以下である。68%超では、溶解温度が上昇するおそれがある。67%以下がより好ましい。64%未満では、コンパクションが増加するおそれがある。また、平均熱膨張係数が大きくなる。
ここで、本発明の無アルカリガラスの第1態様では、Al2O3含有量が17%以上21%以下である。21%超では、失透温度TLが上昇する恐れがある。20.5%以下がより好ましい。17%未満では、コンパクションの増加を起こしてしまう。18%以上がより好ましい。
本発明の無アルカリガラスの第2態様では、Al2O3含有量が17%以上22%以下である。22%超では、失透温度TLが上昇する恐れがある。21%以下がより好ましい。17%未満では、コンパクションの増加を起こしてしまう。18%以上がより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、MgO含有量が1%以上6%以下である。6%超では、ガラス転移点Tgが低下し、コンパクションが増加し、平均熱膨張係数が大きくなる。5%以下がより好ましい。1%未満では、失透温度TLの上昇を起こしてしまう。また、ヤング率が低下する。2%以上がより好ましい。
本発明の無アルカリガラスの第2態様では、MgO含有量が2.3%以上8%以下である。8%超では、コンパクションが増加し、平均熱膨張係数が大きくなる。2.3%未満では失透温度TLの上昇を起こしてしまう。また、ヤング率が低下する。4%以上がより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、CaO含有量が4%以上8.5%以下である。8.5%超では、コンパクションの増加や失透温度TLの上昇を起こしてしまう。4%未満では、溶解性が悪化し、溶解温度が上昇し、失透温度も上昇する。5%以上がより好ましい。
本発明の無アルカリガラスの第2態様では、CaO含有量が9%以上15.5%以下である。15.5%超では、コンパクションの増加や失透温度TLの上昇を起こしてしまう。9%未満では、溶解性が悪化し、溶解温度が上昇する。10%以上がより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、SrOの含有量が3%未満が好ましく、1%未満がより好ましく、0.5%未満がさらにより好ましく、実質的に含有しないことが特に好ましい。
本発明の無アルカリガラスの第2態様では、SrOの含有量が2%未満が好ましく、1%未満がより好ましく、0.3%未満がより好ましく、実質的に含有しないことが特に好ましい。
コンパクションとは、加熱処理の際にガラス構造の緩和によって発生するガラス熱収縮率である。本発明においてコンパクションとは、次に説明する方法で測定した値を意味するものとする。
初めに、対象となるガラスを1550℃~1650℃で溶解した後、溶融ガラスを流し出し、板状に成形後冷却する。得られた板状ガラスを研磨加工して100mm×20mm×1mmのガラス板を得る。
次に、得られたガラス板をガラス転移点Tg+70℃まで加熱し、この温度で1分間保持した後、降温速度40℃/分で室温まで冷却する。その後、ガラス板の表面に圧痕を長辺方向に2箇所、間隔A(A=90mm)で打ち、処理前試料とする。
次に処理前試料を450℃まで昇温速度100℃/時間で加熱し、450℃で2時間保持した後、降温速度100℃/時間で室温まで冷却し処理後試料1とする。
そして、処理後試料1の圧痕間距離B1を測定する。
このようにして得たA、B1から下記式を用いてコンパクションC1を算出する。
C1[ppm]=(A-B1)/A×106
また処理前試料を600℃まで昇温速度100℃/時間で加熱し、600℃で1時間保持した後、降温速度100℃/時間で室温まで冷却し処理後試料2とする。
そして、処理後試料2の圧痕間距離B2を測定する。
このようにして得たA、B2から下記式を用いてコンパクションC2を算出する。
C2[ppm]=(A-B2)/A×106
本発明の無アルカリガラスは、コンパクションC1、C2が上記の条件を満たすため、無アルカリガラスを用いて各種ディスプレイを製造する過程で実施される薄膜形成工程で、高温にさらされた際に、ガラスの変形およびガラスの構造安定化に伴う寸法変化を最小限に抑制することができる。
ここで、本発明の無アルカリガラスの第1態様では、コンパクションC1が5ppm以下である。一方、コンパクションC2が25ppm以下であり、20ppm以下がより好ましい。
本発明の無アルカリガラスの第2態様では、コンパクションC1が5ppm以下である。一方、コンパクションC2が40ppm以下であり、35ppm以下がより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、T2が1760℃以下であることが好ましい。1740℃がより好ましく、1720℃以下がさらにより好ましい。
本発明の無アルカリガラスの第2態様では、T2が1730℃以下であることが好ましい。1710℃以下がより好ましく、1690℃以下がさらにより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、T4が1380℃以下であることが好ましい。1360℃がより好ましく、1340℃以下がさらにより好ましい。
本発明の無アルカリガラスの第2態様では、T4が1360℃以下であることが好ましい。1340℃以下がより好ましく、1320℃以下がさらにより好ましい。
ここで、本発明の無アルカリガラスの第1態様では、50~350℃での平均熱膨張係数が37×10-7/℃以下であることが好ましく、34×10-7/℃以下がより好ましい。
本発明の無アルカリガラスの第2態様では、50~350℃での平均熱膨張係数が40×10-7/℃以下であることが好ましく、38×10-7/℃以下がより好ましい。
ガラス転移点が780℃以上であると、製造プロセスにおいてガラスの仮想温度が上昇しやすい用途(例えば、板厚0.7mm以下、好ましくは0.5mm以下、より好ましくは0.3mm以下の有機EL等用のディスプレイ用基板または照明用基板、あるいは板厚0.3mm以下、好ましくは0.1mm以下の薄板のディスプレイ用基板または照明用基板)に適している。
板厚0.7mm以下、さらには0.5mm以下、さらには0.3mm以下、さらには0.1mm以下の板ガラスの成形では、成形時の引き出し速度が速くなる傾向があるため、ガラスの仮想温度が上昇し、ガラスのコンパクションが増大しやすい。この場合、高ガラス転移点のガラスであると、コンパクションを抑制することができる。
なお、表1~2中、括弧書で示した値は計算値である。
本出願は、2013年6月27日出願の日本特許出願2013-134900に基づくものであり、その内容はここに参照として取り込まれる。
Claims (3)
- コンパクションC1が5ppm以下であり、コンパクションC2が40ppm以下であり、酸化物基準の質量%表示で、
SiO2 64~72、
Al2O3 17~22、
MgO 1~8、
CaO 4~15.5、
を含有し
0.20≦MgO/(MgO+CaO)≦0.41である無アルカリガラス。 - コンパクションC1が5ppm以下であり、コンパクションC2が25ppm以下であり、酸化物基準の質量%表示で、
SiO2 67.5~72、
Al2O3 17~21、
MgO 1~6、
CaO 4~8.5、
を含有し、
SiO2 、Al2O3、MgOおよびCaOが合量で96質量%以上であり、
0.22≦MgO/(MgO+CaO)≦0.39である、請求項1に記載の無アルカリガラス。 - コンパクションC1が5ppm以下であり、コンパクションC2が40ppm以下であり、酸化物基準の質量%表示で、
SiO2 64~68、
Al2O3 17~22、
MgO 2.3~8、
CaO 9~15.5、
を含有し、
SiO2 、Al2O3、MgOおよびCaOが合量で96質量%以上であり、
0.22≦MgO/(MgO+CaO)≦0.39である、請求項1に記載の無アルカリガラス。
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TW201509856A (zh) | 2015-03-16 |
KR102229428B1 (ko) | 2021-03-18 |
KR20160023700A (ko) | 2016-03-03 |
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