WO2014178268A1 - Sealing sheet application method and sealing sheet application device - Google Patents
Sealing sheet application method and sealing sheet application device Download PDFInfo
- Publication number
- WO2014178268A1 WO2014178268A1 PCT/JP2014/060336 JP2014060336W WO2014178268A1 WO 2014178268 A1 WO2014178268 A1 WO 2014178268A1 JP 2014060336 W JP2014060336 W JP 2014060336W WO 2014178268 A1 WO2014178268 A1 WO 2014178268A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealing sheet
- semiconductor substrate
- sealing
- holding
- pressing
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 201
- 238000000034 method Methods 0.000 title claims description 50
- 239000004065 semiconductor Substances 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000003825 pressing Methods 0.000 claims abstract description 47
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims description 32
- 230000007723 transport mechanism Effects 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 230000006837 decompression Effects 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Definitions
- the present invention relates to a sealing sheet pasting method and a sealing sheet pasting apparatus for pasting and sealing a sealing sheet formed with a sealing layer made of a resin composition on a plurality of semiconductor elements formed on a semiconductor substrate. About.
- each of both surfaces of the semiconductor chip is sandwiched between a first sealing resin sheet and a second sealing resin sheet made of a prepreg impregnated with resin.
- a semiconductor device is manufactured by sealing a semiconductor chip (see Patent Document 1).
- semiconductor devices tend to be miniaturized due to the demand for high-density mounting accompanying rapid development of applications. Therefore, after the semiconductor wafer is divided into semiconductor elements by the dicing process, the semiconductor elements are individually sealed with resin, resulting in a problem that throughput is lowered and production efficiency is lowered.
- the main objective is to provide the sealing sheet sticking method and sealing sheet sticking apparatus which can stick a sealing sheet to a semiconductor substrate accurately.
- the present inventors obtained the following knowledge as a result of intensive studies by repeating experiments and simulations in order to solve the inconvenience.
- the sealing sheet when the sealing sheet is attached to the semiconductor substrate, there arises a problem that the protruding portions such as the slack and the bending of the sealing sheet are unevenly contacted with the semiconductor element to damage the semiconductor element.
- the problem is that the semiconductor element is damaged by two different phenomena when the sealing sheet is pasted on the semiconductor substrate from the room temperature state and when the sealing sheet is preheated and pasted. Obtained as a new finding.
- the sealing layer of the sealing sheet is a resin composition having high hardness at room temperature. Therefore, when a sealing sheet having a convex portion on the bonding surface is attached to a semiconductor substrate in a room temperature state, an excessive load is applied to the unevenly contacting semiconductor element to cause damage.
- the sealing sheet was preheated and pasted on the semiconductor substrate, the following phenomenon occurred when the sealing layer hit the semiconductor substrate.
- the softened resin composition from the portion where the sealing layer is unevenly pushed is pushed out toward the outside of the semiconductor substrate and spreads unevenly on the semiconductor substrate.
- the flow rate of the resin composition was large, and the semiconductor element was damaged by the impact of the resin composition colliding with the semiconductor element in the direction of fast flow rate.
- This invention has the following configuration in order to achieve such an object.
- a sealing sheet attaching method for attaching a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate, In the process of holding and transporting the sealing sheet cut below the shape of the semiconductor substrate with a holding member, an inspection process of inspecting the convex portion on the adhesive surface side of the sealing sheet with a detector, A pressing process of pressing the sealing sheet in which the convex portion is detected in the inspection process to correct the sealing sheet; Affixing process for applying the flattened sealing sheet to a semiconductor substrate while applying pressure and heating; It is provided with.
- the inspection process may be a sealing sheet in a room temperature state or a sealing sheet in a state where the sealing layer is softened by being preheated. In either state, the convex portion can be crushed and the adhesive surface can be corrected flat. In addition, it can utilize not only for the convex part of a sealing sheet but for correction
- the pressing of the sealing sheet in the pressing process is preferably sandwiched between a pressing member having a size larger than the outer shape of the sealing sheet and a holding member.
- a pressing member having a size larger than the outer shape of the sealing sheet and a holding member.
- the pressing member include a plate and a roll. More preferably, it is preferable to press the sealing sheet while heating.
- the load applied to the semiconductor substrate by the pressure of the sealing sheet in the pasting process is detected by a detector, and the sealing sheet is pasted to the semiconductor substrate while adjusting to a predetermined load based on the detection result. May be.
- the flow rate when the resin composition softened by heating (plastic deformation) in the pasting process spreads radially by pressing can be kept constant. it can. Therefore, damage to the semiconductor element due to the collision of the resin composition can be avoided.
- the present invention has the following configuration in order to achieve such an object.
- a sealing sheet affixing device for affixing a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
- a holding table for holding the semiconductor substrate;
- a transport mechanism for holding a sealing sheet cut to a shape equal to or less than the shape of the semiconductor substrate and holding the sealing sheet on a semiconductor substrate on a holding table;
- a detector for detecting a convex portion on the adhesive surface side of the sealing sheet held by the holding member of the transport mechanism; Based on the detection result of the detector, a pressing mechanism that sandwiches the sealing sheet held by the holding member and corrects the convex part, And a pasting mechanism for pasting the sealing sheet with the convex portion corrected on the semiconductor substrate while applying pressure and heating.
- the convex portion of the adhesive surface of the sealing sheet held by the holding member is corrected by the pressing mechanism.
- the sealing sheet is attached to the semiconductor substrate by an attaching mechanism. Therefore, the said sealing sheet sticking apparatus can implement the said method suitably.
- either the holding member or the pressing mechanism includes a heater.
- the sealing layer of a sealing sheet can be softened and an adhesive surface can be planarized easily.
- a detector that detects a load applied to the semiconductor substrate; You may provide the control part which operates the said sticking mechanism and adjusts the load to a semiconductor substrate based on the comparison of the predetermined reference value and the said detection result.
- the flow rate when the resin composition plastically deformed by heating in the pasting process spreads radially by pressing can be kept constant.
- the sealing sheet can be attached with high accuracy without damaging the semiconductor elements formed on the semiconductor substrate.
- the sealing sheet T is supplied by being cut into a sheet-shaped body having a predetermined shape from an original roll or a raw roll in which a long sealing sheet T is wound.
- the sealing sheet T is provided with a protective first release liner S1 and a second release liner S2 on both surfaces of the sealing layer M.
- the sealing layer M is formed into a sheet shape from a sealing material.
- the sealing material include thermosetting silicone resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting urethane resin, and the like.
- a curable resin is mentioned.
- the above-mentioned thermosetting resin and the thermosetting resin composition which contains an additive in an appropriate ratio can also be mentioned.
- Examples of the additive include a filler and a phosphor.
- Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and silicon nitride, and organic fine particles such as silicone particles.
- the phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. .
- Examples of the yellow phosphor include garnet phosphors such as Y 3 Al 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce).
- Examples of the red phosphor include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu.
- the sealing layer M is adjusted to a semi-solid state before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
- a thermosetting resin for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
- the dimensions of the sealing layer M are appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long sheet, the length in the left-right direction of the sealing layer, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm. Hereinafter, it is preferably 700 mm or less.
- the thickness of the sealing layer is appropriately set according to the size of the semiconductor element, and is, for example, 30 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 3000 ⁇ m or less, preferably 1000 ⁇ m or less.
- first release liner S1 and the second release liner S2 include polymer sheets such as polyethylene sheets, polyester sheets (such as PET), polystyrene sheets, polycarbonate sheets, and polyimide sheets, such as ceramic sheets, such as metal foil. It is done.
- the contact surface in contact with the sealing layer can be subjected to a release treatment such as a fluorine treatment.
- the dimensions of the first release liner and the second release liner are appropriately set according to the release conditions, and the thickness is, for example, 15 ⁇ m or more, preferably 25 ⁇ m or more, and for example, 125 ⁇ m or less, preferably 75 ⁇ m. It is as follows.
- FIG. 3 is a front view of the sealing sheet sticking apparatus
- FIG. 4 is a plan view of the sealing sheet sticking apparatus.
- the sealing sheet sticking apparatus includes a sheet supply unit 1, a pressing mechanism 5, a first transport mechanism 21, a liner peeling mechanism 22, a first holding table 23, a second transport mechanism 24, a sticking mechanism 25, and the like.
- the sheet supply unit 1 has a mounting table 2.
- the storage container 3 is placed on the mounting table 2.
- the storage container 3 stores, for example, a single wafer sealing sheet T cut into the shape of the semiconductor substrate W in a stacked manner.
- the pressing mechanism 5 includes a robot arm 6.
- the robot arm 6 is configured to be able to move forward and backward, turn, and move up and down.
- a pressing plate 7 larger than the outer shape of the sealing sheet T is provided at the tip of the robot arm 6.
- the pressing mechanism 5 moves the pressing plate 7 over the transport path of the first transport mechanism 21 and the standby position deviated from the transport path.
- the pressing plate 7 corresponds to the pressing member of the present invention.
- the first transport mechanism 21 is provided with a suction plate 26 at the lower end of a suction unit that can move horizontally and move up and down and back and forth. That is, a first movable base 28 that moves on the guide rail R1 along the frame 27 extending in the lateral direction of the apparatus main body is provided. A guide rail R2 that is horizontally held toward the front and rear of the apparatus main body is attached to the lower portion of the first movable base 28. A suction plate 26 is provided that can move up and down along a vertical frame that is suspended and supported by a second movable base 30 that can move back and forth along the guide rail R2. The suction plate 26 corresponds to the holding member of the present invention.
- the suction plate 26 has a rectangular shape that is larger than the outer shape of the sealing sheet T, as shown in FIGS.
- the suction plate 26 has a heater 29 embedded therein.
- a displacement sensor composed of a projector 10 and a light receiver 11 is disposed opposite to the lower end of the flange 12 attached downward from each corner of the suction plate 26 so that the height can be adjusted. That is, the height of the displacement sensor is adjusted according to the thickness of the sealing sheet T. Accordingly, the displacement sensor detects looseness or deflection that is a convex portion on the back surface side of the sealing sheet T held by suction on the suction plate 26.
- the displacement sensor corresponds to the detector of the present invention.
- the liner peeling mechanism 22 includes a peeling tape supply unit 31, a peeling unit 32, a tape recovery unit 33, and a camera 34.
- the peeling tape supply unit 31 supplies a long peeling tape TS narrower than the sealing sheet T toward the peeling unit 32.
- the peeling unit 32 includes a peeling roller 35 around which the peeling tape TS is wound.
- the peeling roller 35 can be lifted and lowered to a position higher than the storage container 3. That is, in the process in which the sealing sheet T is sucked and held by the first transport mechanism 21 and is transported, the release roller 35 presses and attaches the release tape TS to the release liner S2 on the back surface of the sealing sheet T.
- the tape recovery unit 33 collects the release tape TS together with the release liner S2 peeled from the sealing sheet T by winding the release tape TS in a state of being attached to the release liner S2 on the back side of the sealing sheet T by the release roller 35.
- the release tape TS is wound around the bobbin and collected.
- the camera 34 images the sealing sheet T from which the second peeling liner S2 has been peeled off from the back surface, and transmits the image data to the control unit 100.
- the first holding table 23 is a chuck table that is larger than the semiconductor substrate W.
- the first holding table 23 is configured to rotate around the longitudinal central axis and perform alignment of the semiconductor substrate W. Further, the first holding table 23 is configured to reciprocate along the guide rail 38 over the mounting position of the semiconductor substrate W and the alignment position on the back side of the apparatus.
- Two cameras 39 are provided above the alignment position, take an image of the semiconductor substrate W, and transmit both image data to the control unit 100.
- the second transport mechanism 24 includes a movable base 42 that moves the apparatus on a guide rail R3 that reaches the pasting mechanism 25 side along a frame 41 that extends in the lateral direction of the apparatus main body.
- a suction plate 44 is provided at the lower end of the suction unit that can be moved up and down along a vertical frame suspended and supported by the movable table 42.
- the suction plate 44 is larger than the shape of the semiconductor substrate W. That is, the substrate transport mechanism 24 is configured to reciprocate from the first holding table 23 to a second holding table 45 described later.
- the pasting mechanism 25 includes a second holding table 45, a decompression chamber 46, and the like.
- the second holding table 45 is housed in the lower housing 46B among the upper and lower upper housings 46A and 46B constituting the decompression chamber 46.
- the lower housing 46B is configured to reciprocate between the receiving position of the semiconductor substrate W on the front side of the apparatus main body and below the upper housing 46A along the guide rail 48.
- the upper and lower housings 46A constituting the decompression chamber 46 are provided in the lift drive mechanism 50.
- the elevating drive mechanism 50 includes a movable base 53 that can be moved up and down along a rail 52 that is vertically arranged on the back of a vertical wall 51, a movable frame 54 that is supported on the movable base 53 so that the height can be adjusted, and the movable frame 53.
- An arm 55 extending forward from the frame 54 is provided.
- An upper housing 46A is mounted on a support shaft 56 that extends downward from the tip of the arm 55.
- the movable base 53 is adapted to be screwed up and down by rotating the screw shaft 57 forward and backward by a motor 58.
- a push plate 59 that can be raised and lowered is housed inside the upper housing 46A.
- a heater 60 is embedded in the pressing plate 59.
- the storage container 3 in which the sealing sheet T is stored is mounted on the mounting table 2.
- the suction plate 26 of the first transport mechanism 21 sucks and carries the sealing sheet T (step S1A).
- the first transport mechanism 21 transports the sealing sheet T to the liner peeling mechanism 22.
- the convex part on the back surface of the sealing sheet T is inspected by a displacement sensor composed of two sets of light projectors 10 and light receivers 11 arranged opposite to each other on the diagonal line of the suction plate 26 (step S2A). That is, the light intensity signal detected by the light receiver 11 is transmitted to the control unit 100.
- the control unit 100 compares a predetermined reference value with an actual measurement value. As a result of the comparison, when the actual measurement value falls below the reference value, the control unit 100 determines that there is a convex portion.
- the control unit 100 stops the first transport mechanism 21 and activates the pressing mechanism 5.
- the pressing plate 7 provided in the pressing mechanism 5 moves below the suction plate 26 and faces the sealing sheet T.
- the pressing plate 7 is raised and brought into contact with the back surface of the sealing sheet T.
- the pressing plate 7 is raised to a predetermined height and the convex portion is crushed and flattened in a state where the suction force of the suction plate 7 is reduced or suction is stopped. (Step S3A).
- the suction plate 26 sucks and holds the sealing sheet T sandwiched in cooperation with the pressing plate 7 again.
- the sealing sheet T is sucked by the suction plate 26, the pressing plate 7 is lowered and returned to the standby position that is out of the transport path of the first transport mechanism 21, as shown in FIG.
- the back surface of the sealing sheet T is reinspected by the displacement sensor (step S2A). If a convex part is not detected as a result of the re-examination, the sealing sheet T is conveyed to the peeling position of the liner peeling mechanism 22.
- the sealing sheet T is first conveyed above the camera 34. At this time, as shown in FIG. 7, the peeling roller 35 rises to a position in the front of the transport direction that is out of the storage container 3 in the process of horizontal transport.
- the peeling tape TS wound around the peeling roller 35 is pressed against the second peeling liner S2 on the back surface side of the sealing sheet T as indicated by a chain line.
- the second release liner S2 is peeled from the sealing sheet T while winding the release tape TS at a speed synchronized with the transport speed of the first transport mechanism 21.
- the peeled second peeling liner S2 is wound up and collected on the collecting bobbin together with the peeling tape TS (step S4A).
- the sealing sheet T When the sealing sheet T reaches above the camera 34, the sealing sheet T is imaged.
- the acquired image data is transmitted to the control unit 100 (step S5A).
- the first transport mechanism 21 moves onto the first holding table 23 while holding the sealing sheet T by suction.
- the semiconductor substrate W is placed on the first holding table 23 substantially simultaneously (step S1B).
- the first holding table 23 holding the semiconductor substrate W by suction moves to the alignment position, and the surface of the first holding table 23 is imaged by the camera 39.
- the captured image data is transmitted to the control unit 100.
- the first holding stage 23 returns to the placement position.
- the alignment of the semiconductor substrate W is performed so that the contour of the sealing sheet T obtained by the image analysis processing of the control unit 100 matches the contour of the semiconductor substrate W (step S2B).
- Alignment is performed by rotating the first holding table 23 around the vertical axis.
- the sealing sheet T transported by the first transport mechanism 21 is disposed to face the semiconductor substrate W as shown in FIG. Thereafter, as shown in FIG. 14, the suction plate 26 is lowered to a predetermined height, and the sealing sheet T comes into contact with the semiconductor element C. At this time, the sealing layer M of the sealing sheet T is heated to a predetermined temperature and softened to a predetermined viscosity. The semiconductor substrate W placed and held on the first holding table 23 is also heated to a predetermined temperature by the heater 37. As shown in FIG. 15, by further lowering the suction plate 26, the resin composition forming the softened sealing layer M enters and adheres while excluding air between a plurality of adjacent semiconductor elements. (Step S6).
- the sealing layer is in a temporarily pressure-bonded state that is not completely cured.
- the first transport mechanism 21 returns to the standby position on the mounting table 2 side.
- step S7 The semiconductor substrate W to which the sealing sheet T has been temporarily press-bonded is sucked and held by the second transport mechanism 24 and transported to the second holding table 45.
- the second transport mechanism 24 rises and returns to the first holding table 23 side.
- the second holding table 45 moves to below the upper housing 46A while holding the semiconductor substrate W by suction.
- the lower end of the upper housing 46A is lowered to a position where it comes into contact with the lower housing 46B. That is, the decompression chamber 46 is formed. Thereafter, the inside of the decompression chamber 46 is decompressed. Further, as shown in FIG. 17, the pressing plate 59 is lowered to press and heat the sealing sheet T to be finally press bonded to the semiconductor substrate W (step S ⁇ b> 8). At this point, the sealing layer M is not yet completely cured.
- the decompression chamber 46 is returned to the atmospheric pressure, and the upper housing 46A is opened.
- the lower housing 46B returns to the substrate transfer position together with the second holding table 45.
- the first release liner S1 is peeled off from the semiconductor substrate W to which the sealing sheet T is press-bonded (step S9).
- a series of operations for attaching the sealing sheet T to the semiconductor substrate W is completed.
- the sealing layer M of the sealing sheet T is bonded to the semiconductor element C at the time of application. Don't get overwhelmed. That is, an excessive load is not applied to the specific semiconductor element C. In addition, a rapid flow of the softened resin composition due to uneven contact does not occur. Therefore, damage to the semiconductor element C due to a phenomenon that occurs due to the uneven contact of the sealing layer can be avoided.
- the present invention can also be implemented in the following forms.
- the load applied to the semiconductor substrate W by the pressing of the sealing sheet T during the temporary pressing may be measured by a load sensor, and the load may be adjusted.
- a load sensor For example, at least one of the suction plate 26 and the second holding table 23 includes a load sensor.
- the actual measurement value detected by the load sensor is compared with a predetermined reference value by the control unit 100. If the actual measurement value exceeds the reference value, the lowering speed of the suction plate 26 is reduced to reduce the load. Is configured to be kept constant.
- the flow rate of the resin composition that is plastically deformed by heating radially spread on the semiconductor substrate can be integrally maintained. That is, the resin composition can be prevented from colliding with the semiconductor element C and being damaged by a rapid flow.
- the sealing sheet T may be flattened while the heater 29 embedded in the suction plate 26 is operated and heated at a predetermined temperature. According to this configuration, since the sealing layer M is softened, flattening is facilitated.
- the second peeling liner S2 on the back surface may be peeled off after bringing the cooling plate or the like into contact with the sealing sheet T and returning to a predetermined temperature (for example, room temperature).
- the convex portion of the sealing sheet T is detected and the convex portion is crushed and flattened.
- the concave portion of the sealing sheet T may be detected by scanning a line sensor. Or what is necessary is just to obtain
- the sealing layer M may be heated by a heater embedded in at least one of the pressing plate 7 or the suction plate 26 and softened to be sandwiched between the pressing plate 7 and the suction plate 26 and flattened.
- the sealing sheet T may be flattened by rolling a roll longer than the diameter of the sealing sheet T instead of the pressing plate 7.
- the shape of the semiconductor substrate W is not limited to a circle. Therefore, the semiconductor substrate W may be a quadrangle such as a square or a rectangle.
- the sealing sheet T is predetermined by the heater 29 embedded in the suction plate 26 before being transferred from the storage container 3 to the first holding table 23 via the liner peeling mechanism 22. You may preheat to temperature.
- the waiting time until the adsorption rate 26 reaches the set temperature and stabilizes when the sealing sheet T is stuck can be shortened.
- the present invention is suitable for accurately sticking a sealing sheet without damaging a semiconductor element formed on a semiconductor substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
While a sealing sheet that has been cut to a size less than or equal to that of the shape of a semiconductor substrate is being held and transported by a pick-up plate (step S1A), convex portions on the rear face side of the sealing sheet, which is the adhesive surface of the sealing sheet, are inspected for by a displacement sensor (step S2A), and if convex portions are detected in the inspection, the sealing sheet is sandwiched and pressed by the pick-up plate and a pressing plate so to be flattened (step S3A). The flattened sealing sheet is tentatively pressure bonded on the semiconductor substrate while being pressed and heated by the pick-up plate (step S6).
Description
本発明は、半導体基板上に形成された複数個の半導体素子に樹脂組成物からなる封止層の形成された封止シートを貼り付けて封止する封止シート貼付け方法および封止シート貼付け装置に関する。
The present invention relates to a sealing sheet pasting method and a sealing sheet pasting apparatus for pasting and sealing a sealing sheet formed with a sealing layer made of a resin composition on a plurality of semiconductor elements formed on a semiconductor substrate. About.
1個の半導体チップの周りを枠体で囲んだ後に、樹脂を含浸させたプリプレグから成る第1の封止用樹脂シートと第2の封止用樹脂シートによって当該半導体チップの両面のそれぞれを挟み込み、半導体チップを封止して半導体装置を製造している(特許文献1を参照)。
After surrounding one semiconductor chip with a frame, each of both surfaces of the semiconductor chip is sandwiched between a first sealing resin sheet and a second sealing resin sheet made of a prepreg impregnated with resin. A semiconductor device is manufactured by sealing a semiconductor chip (see Patent Document 1).
しかしながら、上記従来方法では次のような問題が生じている。
However, the above conventional method has the following problems.
すなわち、近年、アプリケーションの急速な進歩に伴う高密度実装の要求により、半導体装置が小型化される傾向にある。したがって、ダイシング処理によって半導体ウエハを半導体素子に分断した後に、半導体素子を個々に樹脂で封止しているので、スループットが低下し、ひいては生産効率を低下させるといった不都合が生じている。
That is, in recent years, semiconductor devices tend to be miniaturized due to the demand for high-density mounting accompanying rapid development of applications. Therefore, after the semiconductor wafer is divided into semiconductor elements by the dicing process, the semiconductor elements are individually sealed with resin, resulting in a problem that throughput is lowered and production efficiency is lowered.
本発明はこのような事情に鑑みてなされたものであって、半導体基板に封止シートを精度よく貼り付けることが可能な封止シート貼付け方法および封止シート貼付け装置を提供することを主たる目的とする。
This invention is made | formed in view of such a situation, Comprising: The main objective is to provide the sealing sheet sticking method and sealing sheet sticking apparatus which can stick a sealing sheet to a semiconductor substrate accurately. And
そこで、本発明者たちは、当該不都合を解決するために、実験やシミュレーションを繰り返して鋭意検討した結果、以下の知見を得た。
Therefore, the present inventors obtained the following knowledge as a result of intensive studies by repeating experiments and simulations in order to solve the inconvenience.
半導体基板の全面に樹脂組成物からなる封止層の形成された枚葉の封止シートを貼り付けて硬化させた後に、当該半導体装置に分断することを試みた。
An attempt was made to divide into a semiconductor device after a single-sheet sealing sheet having a sealing layer made of a resin composition was applied to the entire surface of the semiconductor substrate and cured.
しかしながら、封止シートを半導体基板に貼り付けるとき、封止シートの弛みや撓みなどの凸部が、半導体素子に偏当たりして半導体素子を破損させるといった問題が生じた。当該問題は、室温状態から半導体基板に封止シートを貼り付ける場合、および、封止シートを予め予備加熱して貼り付ける場合とでは、異なる2通りの現象によって半導体素子を破損させていることが新たな知見として得られた。
However, when the sealing sheet is attached to the semiconductor substrate, there arises a problem that the protruding portions such as the slack and the bending of the sealing sheet are unevenly contacted with the semiconductor element to damage the semiconductor element. The problem is that the semiconductor element is damaged by two different phenomena when the sealing sheet is pasted on the semiconductor substrate from the room temperature state and when the sealing sheet is preheated and pasted. Obtained as a new finding.
封止シートの封止層は、室温状態では硬度の高い樹脂組成物である。それ故に、室温状態で接着面に凸部を有する封止シートを半導体基板に貼り付けると、偏当たりする半導体素子に過剰な荷重がかかり破損させていた。
The sealing layer of the sealing sheet is a resin composition having high hardness at room temperature. Therefore, when a sealing sheet having a convex portion on the bonding surface is attached to a semiconductor substrate in a room temperature state, an excessive load is applied to the unevenly contacting semiconductor element to cause damage.
また、封止シートを予備加熱して半導体基板に貼り付ける場合、封止層が半導体基板に偏当たりすると、次のような現象が生じた。封止層が偏当たりした部位から軟化した樹脂組成物が、半導体基板の外側に向けて押し出されて半導体基板上で不均一に広がってゆく。このとき、樹脂組成物の流量が多く、かつ、流速の早い方向にある半導体素子に樹脂組成物が衝突する衝撃によって当該半導体素子を破損させていた。
In addition, when the sealing sheet was preheated and pasted on the semiconductor substrate, the following phenomenon occurred when the sealing layer hit the semiconductor substrate. The softened resin composition from the portion where the sealing layer is unevenly pushed is pushed out toward the outside of the semiconductor substrate and spreads unevenly on the semiconductor substrate. At this time, the flow rate of the resin composition was large, and the semiconductor element was damaged by the impact of the resin composition colliding with the semiconductor element in the direction of fast flow rate.
この発明は、このような目的を達成するために、次のような構成をとる。
This invention has the following configuration in order to achieve such an object.
すなわち、熱可塑性の樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け方法であって、
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して搬送する過程で、封止シートの接着面側の凸部を検出器によって検査する検査過程と、
前記検査過程で凸部の検出された封止シートを押圧して平坦に矯正する押圧過程と、
平坦に矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け過程と、
を備えたことを特徴とする。 That is, a sealing sheet attaching method for attaching a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
In the process of holding and transporting the sealing sheet cut below the shape of the semiconductor substrate with a holding member, an inspection process of inspecting the convex portion on the adhesive surface side of the sealing sheet with a detector,
A pressing process of pressing the sealing sheet in which the convex portion is detected in the inspection process to correct the sealing sheet;
Affixing process for applying the flattened sealing sheet to a semiconductor substrate while applying pressure and heating;
It is provided with.
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して搬送する過程で、封止シートの接着面側の凸部を検出器によって検査する検査過程と、
前記検査過程で凸部の検出された封止シートを押圧して平坦に矯正する押圧過程と、
平坦に矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け過程と、
を備えたことを特徴とする。 That is, a sealing sheet attaching method for attaching a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
In the process of holding and transporting the sealing sheet cut below the shape of the semiconductor substrate with a holding member, an inspection process of inspecting the convex portion on the adhesive surface side of the sealing sheet with a detector,
A pressing process of pressing the sealing sheet in which the convex portion is detected in the inspection process to correct the sealing sheet;
Affixing process for applying the flattened sealing sheet to a semiconductor substrate while applying pressure and heating;
It is provided with.
(作用・効果) この方法によれば、検査過程で検出された封止シートの接着面側に凸部が、半導体基板に貼り付けられる前に平坦に矯正される。したがって、封止シートが、半導体基板上に形成された半導体素子に偏当たりしないので、半導体素子の破損を回避することがきる。
(Action / Effect) According to this method, the convex portion on the adhesive surface side of the sealing sheet detected in the inspection process is corrected to be flat before being attached to the semiconductor substrate. Therefore, since the sealing sheet does not strike the semiconductor element formed on the semiconductor substrate, damage to the semiconductor element can be avoided.
なお、検査過程は、室温状態の封止シートまたは予備加熱されて封止層が軟化している状態の封止シートであってもよい。いずれの状態であっても凸部を潰して接着面を平坦に矯正することができる。なお、封止シートの凸部に限らず、構造物などが封止シートに接触または衝突して形成された凹部の修正にも利用できる。すなわち、封止シートを加圧することにより、封止層を形成する樹脂組成物を変形させて凹部を埋め尽くすことができる。
The inspection process may be a sealing sheet in a room temperature state or a sealing sheet in a state where the sealing layer is softened by being preheated. In either state, the convex portion can be crushed and the adhesive surface can be corrected flat. In addition, it can utilize not only for the convex part of a sealing sheet but for correction | amendment of the recessed part formed when a structure etc. contacted or collided with the sealing sheet. That is, by pressurizing the sealing sheet, the resin composition forming the sealing layer can be deformed to fill the recess.
押圧過程での封止シートの押圧は、封止シートの外形以上のサイズの押圧部材と保持部材で挟みこむことが好ましい。押圧部材は、例えば、プレートおよびロールなどがあげられる。さらに好ましくは、封止シートを加熱しながら押圧することが好ましい。
The pressing of the sealing sheet in the pressing process is preferably sandwiched between a pressing member having a size larger than the outer shape of the sealing sheet and a holding member. Examples of the pressing member include a plate and a roll. More preferably, it is preferable to press the sealing sheet while heating.
この方法において、封止シートが加熱によって軟化していると、平坦に矯正しやすくなる。
In this method, when the sealing sheet is softened by heating, it becomes easy to correct it flatly.
上記方法は、貼付け過程で封止シートの加圧により半導体基板にかかる荷重を検出器によって検出し、検出結果に基づいて予め決めた荷重に調整しながら封止シートを半導体基板に貼り付けるようにしてもよい。
In the above method, the load applied to the semiconductor substrate by the pressure of the sealing sheet in the pasting process is detected by a detector, and the sealing sheet is pasted to the semiconductor substrate while adjusting to a predetermined load based on the detection result. May be.
この方法によれば、半導体基板への荷重が一定に保たれることにより、貼付け過程で加熱により軟化(塑性変形)した樹脂組成物が、押圧によって放射状に広がるときの流速を一定に保つことができる。したがって、樹脂組成物の衝突による半導体素子の破損を回避することができる。
According to this method, by keeping the load on the semiconductor substrate constant, the flow rate when the resin composition softened by heating (plastic deformation) in the pasting process spreads radially by pressing can be kept constant. it can. Therefore, damage to the semiconductor element due to the collision of the resin composition can be avoided.
また、この発明は、このような目的を達成するために、次のような構成をとる。
Also, the present invention has the following configuration in order to achieve such an object.
すなわち、熱可塑性の樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
前記半導体基板を保持する保持テーブルと、
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して保持テーブル上の半導体基板に重ね合わせる搬送機構と、
前記搬送機構の保持部材に保持された封止シートの接着面側の凸部を検出する検出器と、
前記検出器の検出結果に基づいて、保持部材の保持された封止シートを挟み込んで凸部を矯正する押圧機構と、
凸部の矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け機構と
を備えたことを特徴とする。 That is, a sealing sheet affixing device for affixing a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
A holding table for holding the semiconductor substrate;
A transport mechanism for holding a sealing sheet cut to a shape equal to or less than the shape of the semiconductor substrate and holding the sealing sheet on a semiconductor substrate on a holding table;
A detector for detecting a convex portion on the adhesive surface side of the sealing sheet held by the holding member of the transport mechanism;
Based on the detection result of the detector, a pressing mechanism that sandwiches the sealing sheet held by the holding member and corrects the convex part,
And a pasting mechanism for pasting the sealing sheet with the convex portion corrected on the semiconductor substrate while applying pressure and heating.
前記半導体基板を保持する保持テーブルと、
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して保持テーブル上の半導体基板に重ね合わせる搬送機構と、
前記搬送機構の保持部材に保持された封止シートの接着面側の凸部を検出する検出器と、
前記検出器の検出結果に基づいて、保持部材の保持された封止シートを挟み込んで凸部を矯正する押圧機構と、
凸部の矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け機構と
を備えたことを特徴とする。 That is, a sealing sheet affixing device for affixing a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
A holding table for holding the semiconductor substrate;
A transport mechanism for holding a sealing sheet cut to a shape equal to or less than the shape of the semiconductor substrate and holding the sealing sheet on a semiconductor substrate on a holding table;
A detector for detecting a convex portion on the adhesive surface side of the sealing sheet held by the holding member of the transport mechanism;
Based on the detection result of the detector, a pressing mechanism that sandwiches the sealing sheet held by the holding member and corrects the convex part,
And a pasting mechanism for pasting the sealing sheet with the convex portion corrected on the semiconductor substrate while applying pressure and heating.
この構成によれば、保持部材により保持された封止シートの接着面の凸部が、押圧機構によって矯正される。当該封止シートは、貼付け機構により半導体基板に貼り付けられる。したがって、当該封止シート貼付け装置は、上記方法を好適に実施することができる。
According to this configuration, the convex portion of the adhesive surface of the sealing sheet held by the holding member is corrected by the pressing mechanism. The sealing sheet is attached to the semiconductor substrate by an attaching mechanism. Therefore, the said sealing sheet sticking apparatus can implement the said method suitably.
上記構成において、保持部材および押圧機構のいずれかに加熱器を備えていることが好ましい。この構成によれば、封止シートの封止層を軟化させて接着面を容易に平坦化することができる。
In the above configuration, it is preferable that either the holding member or the pressing mechanism includes a heater. According to this structure, the sealing layer of a sealing sheet can be softened and an adhesive surface can be planarized easily.
また、上記構成において、封止シートを貼り付ける過程で、半導体基板にかかる荷重を検出する検出器と、
予め決めた基準値と前記検出結果の比較に基づいて、前記貼付け機構を操作して半導体基板への荷重を調整する制御部を備えてもよい。 Further, in the above configuration, in the process of attaching the sealing sheet, a detector that detects a load applied to the semiconductor substrate;
You may provide the control part which operates the said sticking mechanism and adjusts the load to a semiconductor substrate based on the comparison of the predetermined reference value and the said detection result.
予め決めた基準値と前記検出結果の比較に基づいて、前記貼付け機構を操作して半導体基板への荷重を調整する制御部を備えてもよい。 Further, in the above configuration, in the process of attaching the sealing sheet, a detector that detects a load applied to the semiconductor substrate;
You may provide the control part which operates the said sticking mechanism and adjusts the load to a semiconductor substrate based on the comparison of the predetermined reference value and the said detection result.
この構成によれば、貼付け過程で加熱により塑性変形した樹脂組成物が、押圧によって放射状に広がるときの流速を一定に保つことができる。
According to this configuration, the flow rate when the resin composition plastically deformed by heating in the pasting process spreads radially by pressing can be kept constant.
本発明の封止シート貼付け方法および封止シート貼付け装置によれば、半導体基板上に形成された半導体素子を破損させることなく封止シートを精度よく貼り付けることができる。
According to the sealing sheet sticking method and the sealing sheet sticking apparatus of the present invention, the sealing sheet can be attached with high accuracy without damaging the semiconductor elements formed on the semiconductor substrate.
1 … シート供給部
2 … 載置台
3 … 収納容器
5 … 押圧機構
7 … 押圧プレート
10 … 投光器
11 … 受光器
21 … 第1搬送機構
22 … 剥離機構
23 … 第1保持テーブル
24 … 第2搬送機構
26 … 吸着プレート
25 … 貼付け機構
29 … ヒータ
37 … ヒータ
100 … 制御部
T … 封止シート
C … 半導体素子
M … 封止層
S1、S2…第1および第2剥離ライナ
W … 半導体基板 DESCRIPTION OFSYMBOLS 1 ... Sheet supply part 2 ... Mounting stand 3 ... Storage container 5 ... Pressing mechanism 7 ... Pressing plate 10 ... Light projector 11 ... Light receiver 21 ... 1st conveyance mechanism 22 ... Peeling mechanism 23 ... 1st holding table 24 ... 2nd conveyance mechanism DESCRIPTION OF SYMBOLS 26 ... Adsorption plate 25 ... Pasting mechanism 29 ... Heater 37 ... Heater 100 ... Control part T ... Sealing sheet C ... Semiconductor element M ... Sealing layer S1, S2 ... 1st and 2nd peeling liner W ... Semiconductor substrate
2 … 載置台
3 … 収納容器
5 … 押圧機構
7 … 押圧プレート
10 … 投光器
11 … 受光器
21 … 第1搬送機構
22 … 剥離機構
23 … 第1保持テーブル
24 … 第2搬送機構
26 … 吸着プレート
25 … 貼付け機構
29 … ヒータ
37 … ヒータ
100 … 制御部
T … 封止シート
C … 半導体素子
M … 封止層
S1、S2…第1および第2剥離ライナ
W … 半導体基板 DESCRIPTION OF
以下、図面を参照して本発明の一実施例を説明する。表面に複数個の半導体素子が形成された半導体基板に、樹脂組成物からなる封止層の形成された封止シートを貼り付ける場合を例に取って説明する。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. A case where a sealing sheet having a sealing layer made of a resin composition is attached to a semiconductor substrate having a plurality of semiconductor elements formed on the surface will be described as an example.
<封止シート>
封止シートTは、例えば、図1および図2に示すように、長尺の封止シートTを巻き回した原反ロールまたは当該原反ロールから所定形状の枚様体に切断して供給される。また、当該封止シートTは、封止層Mの両面に保護用の第1剥離ライナS1および第2剥離ライナS2が添設されている。 <Sealing sheet>
For example, as shown in FIGS. 1 and 2, the sealing sheet T is supplied by being cut into a sheet-shaped body having a predetermined shape from an original roll or a raw roll in which a long sealing sheet T is wound. The Further, the sealing sheet T is provided with a protective first release liner S1 and a second release liner S2 on both surfaces of the sealing layer M.
封止シートTは、例えば、図1および図2に示すように、長尺の封止シートTを巻き回した原反ロールまたは当該原反ロールから所定形状の枚様体に切断して供給される。また、当該封止シートTは、封止層Mの両面に保護用の第1剥離ライナS1および第2剥離ライナS2が添設されている。 <Sealing sheet>
For example, as shown in FIGS. 1 and 2, the sealing sheet T is supplied by being cut into a sheet-shaped body having a predetermined shape from an original roll or a raw roll in which a long sealing sheet T is wound. The Further, the sealing sheet T is provided with a protective first release liner S1 and a second release liner S2 on both surfaces of the sealing layer M.
封止層Mは、封止材料からシート形状に形成されている。封止材料としては、例えば、熱硬化性シリコーン樹脂、エポキシ樹脂、熱硬化性ポリイミド樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、熱硬化性ウレタン樹脂、などの熱硬化性樹脂が挙げられる。また、封止材料として、上記した熱硬化性樹脂と、添加剤を適宜の割合で含有する熱硬化性樹脂組成物を挙げることもできる。
The sealing layer M is formed into a sheet shape from a sealing material. Examples of the sealing material include thermosetting silicone resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting urethane resin, and the like. A curable resin is mentioned. Moreover, as a sealing material, the above-mentioned thermosetting resin and the thermosetting resin composition which contains an additive in an appropriate ratio can also be mentioned.
添加剤としては、例えば、充填剤、蛍光体などが挙げられる。充填剤としては、例えば、シリカ、チタニア、タルク、アルミナ、窒化アルミニウム、窒化ケイ素などの無機微粒子、例えば、シリコーン粒子、などの有機微粒子などが挙げられる。蛍光体は、波長変換機能を有しており、例えば、青色光を黄色光に変換することのできる黄色蛍光体、青色光を赤色光に変化することのできる赤色蛍光体などを挙げることができる。黄色蛍光体としては、例えば、Y3Al5O12:Ce(YAG(イットリウム・アルミニウム・ガーネット):Ce)などのガーネット型蛍光体が挙げられる。赤色蛍光体としては、例えば、CaAlSiN3:Eu、CaSiN2:Euなどの窒化物蛍光体などが挙げられる。
Examples of the additive include a filler and a phosphor. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and silicon nitride, and organic fine particles such as silicone particles. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. . Examples of the yellow phosphor include garnet phosphors such as Y 3 Al 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce). Examples of the red phosphor include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu.
封止層Mは、半導体素子を封止する前において、半固形状に調整されており、具体的には、封止材料が熱硬化性樹脂を含有する場合には、例えば、完全硬化(Cステージ化)する前、つまり、半硬化(Bステージ)状態で調整されている。
The sealing layer M is adjusted to a semi-solid state before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
封止層Mの寸法は、半導体素子および基板の寸法に応じて適宜に設定されている。具体的には、封止シートが長尺のシートとして用意される場合における封止層の左右方向における長さ、つまり、幅は、例えば、100mm以上、好ましくは、200mm以上であり、例えば、1500mm以下、好ましくは、700mm以下である。また、封止層の厚みは、半導体素子に寸法に対応して適宜に設定され、例えば、30μm以上、好ましくは、100μm以上であり、また、例えば、3000μm以下、好ましくは、1000μm以下である。
The dimensions of the sealing layer M are appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long sheet, the length in the left-right direction of the sealing layer, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm. Hereinafter, it is preferably 700 mm or less. The thickness of the sealing layer is appropriately set according to the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less.
第1剥離ライナS1および第2剥離ライナS2は、例えば、ポリエチレンシート、ポリエステルシート(PETなど)、ポリスチレンシート、ポリカーボネートシート、ポリイミドシートなどのポリマーシート、例えば、セラミックシート、例えば、金属箔などが挙げられる。剥離ライナにおいて、封止層と接触する接触面には、フッ素処理などの離型処理を施すこともできる。第1剥離ライナおよび第2剥離ライナの寸法は、剥離条件に応じて適宜に設定され、厚みが、例えば、15μm以上、好ましくは、25μm以上であり、また、例えば、125μm以下、好ましくは、75μm以下である。
Examples of the first release liner S1 and the second release liner S2 include polymer sheets such as polyethylene sheets, polyester sheets (such as PET), polystyrene sheets, polycarbonate sheets, and polyimide sheets, such as ceramic sheets, such as metal foil. It is done. In the release liner, the contact surface in contact with the sealing layer can be subjected to a release treatment such as a fluorine treatment. The dimensions of the first release liner and the second release liner are appropriately set according to the release conditions, and the thickness is, for example, 15 μm or more, preferably 25 μm or more, and for example, 125 μm or less, preferably 75 μm. It is as follows.
<封止シート貼付け装置>
<Seal sheet pasting device>
図3は封止シート貼付け装置の正面図、図4は、封止シート貼付け装置の平面図である。
FIG. 3 is a front view of the sealing sheet sticking apparatus, and FIG. 4 is a plan view of the sealing sheet sticking apparatus.
封止シート貼付け装置は、シート供給部1、押圧機構5、第1搬送機構21、ライナ剥離機構22、第1保持テーブル23、第2搬送機構24および貼付け機構25などから構成されている。
The sealing sheet sticking apparatus includes a sheet supply unit 1, a pressing mechanism 5, a first transport mechanism 21, a liner peeling mechanism 22, a first holding table 23, a second transport mechanism 24, a sticking mechanism 25, and the like.
シート供給部1は、載置台2を有する。載置台2に収納容器3が載置される。当該収納容器3は、例えば、半導体基板Wの形状に切断された枚葉の封止シートTを積層収納している。
The sheet supply unit 1 has a mounting table 2. The storage container 3 is placed on the mounting table 2. The storage container 3 stores, for example, a single wafer sealing sheet T cut into the shape of the semiconductor substrate W in a stacked manner.
押圧機構5は、ロボットアーム6を備えている。ロボットアーム6は、水平進退、旋回および昇降可能に構成されている。ロボットアーム6の先端に封止シートTの外形よりも大形の押圧プレート7を備えている。押圧機構5は、第1搬送機構21の搬送経路と当該搬送経路から外れた待機位置とにわたって押圧プレート7を移動させる。なお、押圧プレート7は、本発明の押圧部材に相当する。
The pressing mechanism 5 includes a robot arm 6. The robot arm 6 is configured to be able to move forward and backward, turn, and move up and down. A pressing plate 7 larger than the outer shape of the sealing sheet T is provided at the tip of the robot arm 6. The pressing mechanism 5 moves the pressing plate 7 over the transport path of the first transport mechanism 21 and the standby position deviated from the transport path. The pressing plate 7 corresponds to the pressing member of the present invention.
第1搬送機構21は、前後左右に水平移動および昇降可能な吸着ユニットの下端に吸着プレート26を備えている。すなわち、装置本体の横方向に伸びるフレーム27に沿ったガイドレールR1上を移動する第1可動台28を備える。装置本体の前後に向けて水平保持されたガイドレールR2が第1可動台28の下部に装着されている。ガイドレールR2に沿って前後に移動可能な第2可動台30に懸垂支持された縦フレームに沿って昇降可能な吸着プレート26を備えている。なお、吸着プレート26は、本発明の保持部材に相当する。
The first transport mechanism 21 is provided with a suction plate 26 at the lower end of a suction unit that can move horizontally and move up and down and back and forth. That is, a first movable base 28 that moves on the guide rail R1 along the frame 27 extending in the lateral direction of the apparatus main body is provided. A guide rail R2 that is horizontally held toward the front and rear of the apparatus main body is attached to the lower portion of the first movable base 28. A suction plate 26 is provided that can move up and down along a vertical frame that is suspended and supported by a second movable base 30 that can move back and forth along the guide rail R2. The suction plate 26 corresponds to the holding member of the present invention.
吸着プレート26は、図5および図6に示すように、封止シートTの外形よりも大形の矩形状である。また、当該吸着プレート26は、内部にヒータ29が埋設されている。
The suction plate 26 has a rectangular shape that is larger than the outer shape of the sealing sheet T, as shown in FIGS. The suction plate 26 has a heater 29 embedded therein.
投光器10と受光器11からなる変位センサが、吸着プレート26の各角部から下向きに取り付けられたフランジ12の下端に高さ調整可能に対向配備されている。すなわち、変位センサは、封止シートTの厚みに応じて高さ調整される。したがって、変位センサは、吸着プレート26に吸着保持された封止シートTの裏面側の凸部である弛みや撓みを検出する。なお、変位センサは、本発明の検出器に相当する。
A displacement sensor composed of a projector 10 and a light receiver 11 is disposed opposite to the lower end of the flange 12 attached downward from each corner of the suction plate 26 so that the height can be adjusted. That is, the height of the displacement sensor is adjusted according to the thickness of the sealing sheet T. Accordingly, the displacement sensor detects looseness or deflection that is a convex portion on the back surface side of the sealing sheet T held by suction on the suction plate 26. The displacement sensor corresponds to the detector of the present invention.
ライナ剥離機構22は、図7に示すように、剥離テープ供給部31、剥離ユニット32、テープ回収部33およびカメラ34から構成される。
As shown in FIG. 7, the liner peeling mechanism 22 includes a peeling tape supply unit 31, a peeling unit 32, a tape recovery unit 33, and a camera 34.
剥離テープ供給部31は、封止シートTよりも幅の狭い長尺の剥離テープTSを剥離ユニット32に向けて供給する。
The peeling tape supply unit 31 supplies a long peeling tape TS narrower than the sealing sheet T toward the peeling unit 32.
剥離ユニット32は、剥離テープTSを巻き回される剥離ローラ35を備えている。当該剥離ローラ35は、昇降可能であり、収納容器3よりも高い位置まで上昇する。すなわち、封止シートTが第1搬送機構21によって吸着保持されて搬送される過程で、剥離ローラ35は、封止シートTの裏面の剥離ライナS2に剥離テープTSを押圧して貼り付ける。
The peeling unit 32 includes a peeling roller 35 around which the peeling tape TS is wound. The peeling roller 35 can be lifted and lowered to a position higher than the storage container 3. That is, in the process in which the sealing sheet T is sucked and held by the first transport mechanism 21 and is transported, the release roller 35 presses and attaches the release tape TS to the release liner S2 on the back surface of the sealing sheet T.
テープ回収部33は、剥離ローラ35によって封止シートTの裏面側の剥離ライナS2に貼り付けられた状態で剥離テープTSを巻き取ることにより、封止シートTから剥離された剥離ライナS2とともに回収ボビンに剥離テープTSを巻き取り回収する。
The tape recovery unit 33 collects the release tape TS together with the release liner S2 peeled from the sealing sheet T by winding the release tape TS in a state of being attached to the release liner S2 on the back side of the sealing sheet T by the release roller 35. The release tape TS is wound around the bobbin and collected.
カメラ34は、裏面から第2剥離ライナS2の剥離された封止シートTを撮像し、当該画像データを制御部100に送信する。
The camera 34 images the sealing sheet T from which the second peeling liner S2 has been peeled off from the back surface, and transmits the image data to the control unit 100.
第1保持テーブル23は、半導体基板Wよりも大形のチャックテーブルで構成されている。第1保持テーブル23は、縦中心軸周りに回転し、半導体基板Wのアライメントを行うよう構成されている。また、第1保持テーブル23は、ガイドレール38に沿って半導体基板Wの載置位置と装置奥側のアライメント位置とにわたって往復移動するように構成されている。
The first holding table 23 is a chuck table that is larger than the semiconductor substrate W. The first holding table 23 is configured to rotate around the longitudinal central axis and perform alignment of the semiconductor substrate W. Further, the first holding table 23 is configured to reciprocate along the guide rail 38 over the mounting position of the semiconductor substrate W and the alignment position on the back side of the apparatus.
アライメント位置の上方には、2台のカメラ39が配備されており、半導体基板Wを撮像し、両画像データを制御部100に送信する。
Two cameras 39 are provided above the alignment position, take an image of the semiconductor substrate W, and transmit both image data to the control unit 100.
第2搬送機構24は、装置本体の横方向に伸びるフレーム41に沿って貼付け機構25側まで達するガイドレールR3上を装置移動する可動台42を備える。当該可動台42に懸垂支持された縦フレームに沿って昇降可能な吸着ユニットの下端に吸着プレート44を備えている。吸着プレート44は、半導体基板Wの形状以上の大きさを有する。すなわち、基板搬送機構24は、第1保持テーブル23から後述する第2保持テーブル45までを往復移動するよう構成されている。
The second transport mechanism 24 includes a movable base 42 that moves the apparatus on a guide rail R3 that reaches the pasting mechanism 25 side along a frame 41 that extends in the lateral direction of the apparatus main body. A suction plate 44 is provided at the lower end of the suction unit that can be moved up and down along a vertical frame suspended and supported by the movable table 42. The suction plate 44 is larger than the shape of the semiconductor substrate W. That is, the substrate transport mechanism 24 is configured to reciprocate from the first holding table 23 to a second holding table 45 described later.
貼付け機構25は、第2保持テーブル45および減圧室46などから構成されている。
The pasting mechanism 25 includes a second holding table 45, a decompression chamber 46, and the like.
第2保持テーブル45は、図8に示すように、減圧室46を構成する上下一対の上ハウジング46Aと下ハウジング46Bのうち、下ハウジング46Bに収納されている。
As shown in FIG. 8, the second holding table 45 is housed in the lower housing 46B among the upper and lower upper housings 46A and 46B constituting the decompression chamber 46.
また、下ハウジング46Bは、ガイドレール48に沿って、装置本体の前側の半導体基板Wの受け取り位置と上ハウジング46Aの下方の間を往復移動するよう構成されている。
Further, the lower housing 46B is configured to reciprocate between the receiving position of the semiconductor substrate W on the front side of the apparatus main body and below the upper housing 46A along the guide rail 48.
減圧室46を構成する上ハウジング46Aには、昇降駆動機構50に備えてられている。この昇降駆動機構50は、縦壁51の背部に縦向きに配置されたレール52に沿って昇降可能な可動台53、この可動台53に高さ調節可能に支持された可動枠54、この可動枠54から前方に向けて延出されたアーム55を備えている。このアーム55の先端部から下方に延出する支軸56に上ハウジング46Aが装着されている。
The upper and lower housings 46A constituting the decompression chamber 46 are provided in the lift drive mechanism 50. The elevating drive mechanism 50 includes a movable base 53 that can be moved up and down along a rail 52 that is vertically arranged on the back of a vertical wall 51, a movable frame 54 that is supported on the movable base 53 so that the height can be adjusted, and the movable frame 53. An arm 55 extending forward from the frame 54 is provided. An upper housing 46A is mounted on a support shaft 56 that extends downward from the tip of the arm 55.
可動台53は、ネジ軸57をモータ58によって正逆転することでねじ送り昇降されるようになっている。また、上ハウジング46Aの内部には、昇降可能な押圧プレート59が内装されている。当該押圧プレート59には、ヒータ60が埋設されている。
The movable base 53 is adapted to be screwed up and down by rotating the screw shaft 57 forward and backward by a motor 58. A push plate 59 that can be raised and lowered is housed inside the upper housing 46A. A heater 60 is embedded in the pressing plate 59.
<封止シート貼付け処理>
次に、上記封止シート貼付け装置によって半導体基板に封止シートを貼り付ける一連の動作について図9に示すフローチャートに沿って詳述する。 <Sealing sheet pasting process>
Next, a series of operations for attaching the sealing sheet to the semiconductor substrate by the sealing sheet attaching apparatus will be described in detail with reference to the flowchart shown in FIG.
次に、上記封止シート貼付け装置によって半導体基板に封止シートを貼り付ける一連の動作について図9に示すフローチャートに沿って詳述する。 <Sealing sheet pasting process>
Next, a series of operations for attaching the sealing sheet to the semiconductor substrate by the sealing sheet attaching apparatus will be described in detail with reference to the flowchart shown in FIG.
封止シートTの収納された収納容器3が、載置台2に載置される。第1搬送機構21の吸着プレート26が、封止シートTを吸着して搬出する(ステップS1A)。
The storage container 3 in which the sealing sheet T is stored is mounted on the mounting table 2. The suction plate 26 of the first transport mechanism 21 sucks and carries the sealing sheet T (step S1A).
第1搬送機構21は、封止シートTをライナ剥離機構22へと搬送する。この搬送過程で、吸着プレート26の対角線上に対向配備した2組の投光器10と受光器11からなる変位センサによって封止シートTの裏面の凸部を検査する(ステップS2A)。すなわち、受光器11で検出された光強度信号が、制御部100に送信される。制御部100は、予め決めた基準値と実測値を比較する。比較の結果、実測値が基準値を下回ると、制御部100は、凸部有りと判定する。
The first transport mechanism 21 transports the sealing sheet T to the liner peeling mechanism 22. In this conveyance process, the convex part on the back surface of the sealing sheet T is inspected by a displacement sensor composed of two sets of light projectors 10 and light receivers 11 arranged opposite to each other on the diagonal line of the suction plate 26 (step S2A). That is, the light intensity signal detected by the light receiver 11 is transmitted to the control unit 100. The control unit 100 compares a predetermined reference value with an actual measurement value. As a result of the comparison, when the actual measurement value falls below the reference value, the control unit 100 determines that there is a convex portion.
凸部が検出されると、制御部100は、第1搬送機構21を停止させるとともに、押圧機構5を作動させる。図10に示すように、押圧機構5に備わった押圧プレート7が、吸着プレート26の下方に移動し、封止シートTに対向する。図11に示すように、押圧プレート7を上昇させて封止シートTの裏面に当接させる。押圧プレート7が、封止シートTの裏面に当接すると、吸着プレート7の吸引力を低下または吸引を停止させた状態で、押圧プレート7を所定高さまで上昇させて凸部を潰して平坦化する(ステップS3A)。
When the convex portion is detected, the control unit 100 stops the first transport mechanism 21 and activates the pressing mechanism 5. As shown in FIG. 10, the pressing plate 7 provided in the pressing mechanism 5 moves below the suction plate 26 and faces the sealing sheet T. As shown in FIG. 11, the pressing plate 7 is raised and brought into contact with the back surface of the sealing sheet T. When the pressing plate 7 comes into contact with the back surface of the sealing sheet T, the pressing plate 7 is raised to a predetermined height and the convex portion is crushed and flattened in a state where the suction force of the suction plate 7 is reduced or suction is stopped. (Step S3A).
押圧処理が完了すると、吸着プレート26は、押圧プレート7と協働して挟み込んでいる封止シーTを再び吸着保持する。吸着プレート26によって封止シートTが吸着されると、図12に示すように、押圧プレート7を下降させて第1搬送機構21の搬送経路から外れた待機位置に戻す。
When the pressing process is completed, the suction plate 26 sucks and holds the sealing sheet T sandwiched in cooperation with the pressing plate 7 again. When the sealing sheet T is sucked by the suction plate 26, the pressing plate 7 is lowered and returned to the standby position that is out of the transport path of the first transport mechanism 21, as shown in FIG.
変位センサによって封止シートTの裏面を再検査する(ステップS2A)。再検査の結果、凸部が検出されなければライナ剥離機構22の剥離位置へと封止シートTを搬送する。
The back surface of the sealing sheet T is reinspected by the displacement sensor (step S2A). If a convex part is not detected as a result of the re-examination, the sealing sheet T is conveyed to the peeling position of the liner peeling mechanism 22.
封止シートTは、先ずカメラ34の上方に搬送される。このとき、図7に示すように、水平搬送される過程で収納容器3から外れた搬送方向の前方の位置に剥離ローラ35が上昇してくる。当該剥離ローラ35に巻き回された剥離テープTSが、鎖線で示すように、封止シートTの裏面側の第2剥離ライナS2に押圧される。その後、第1搬送機構21の搬送速度と同調した速度で剥離テープTSを巻き取りながら、第2剥離ライナS2を封止シートTから剥離する。剥離された第2剥離ライナS2は、剥離テープTSごと回収ボビンに巻き取り回収される(ステップS4A)。
The sealing sheet T is first conveyed above the camera 34. At this time, as shown in FIG. 7, the peeling roller 35 rises to a position in the front of the transport direction that is out of the storage container 3 in the process of horizontal transport. The peeling tape TS wound around the peeling roller 35 is pressed against the second peeling liner S2 on the back surface side of the sealing sheet T as indicated by a chain line. Thereafter, the second release liner S2 is peeled from the sealing sheet T while winding the release tape TS at a speed synchronized with the transport speed of the first transport mechanism 21. The peeled second peeling liner S2 is wound up and collected on the collecting bobbin together with the peeling tape TS (step S4A).
カメラ34の上方に封止シートTが達すると、封止シートTが撮像される。取得された画像データは、制御部100に送信される(ステップS5A)。撮像処理が完了すると、第1搬送機構21は、封止シートTを吸着保持したまま、第1保持テーブル23上へと移動する。
When the sealing sheet T reaches above the camera 34, the sealing sheet T is imaged. The acquired image data is transmitted to the control unit 100 (step S5A). When the imaging process is completed, the first transport mechanism 21 moves onto the first holding table 23 while holding the sealing sheet T by suction.
封止シートTが、収納容器3から搬出されると略同時に、第1保持テーブル23に半導体基板Wが載置される(ステップS1B)。半導体基板Wを吸着保持した第1保持テーブル23は、アライメント位置に移動し、カメラ39によって表面が撮像される。撮像された画像データは、制御部100へと送信される。
When the sealing sheet T is unloaded from the storage container 3, the semiconductor substrate W is placed on the first holding table 23 substantially simultaneously (step S1B). The first holding table 23 holding the semiconductor substrate W by suction moves to the alignment position, and the surface of the first holding table 23 is imaged by the camera 39. The captured image data is transmitted to the control unit 100.
撮像処理が完了すると、第1保持ステージ23は、載置位置に戻る。ここで、制御部100の画像解析処理により求めた封止シートTの輪郭と半導体基板Wの輪郭とが合致するように、半導体基板Wのアライメントを行う(ステップS2B)。第1保持テーブル23を縦軸周りに回転させてアライメントを行う。
When the imaging process is completed, the first holding stage 23 returns to the placement position. Here, the alignment of the semiconductor substrate W is performed so that the contour of the sealing sheet T obtained by the image analysis processing of the control unit 100 matches the contour of the semiconductor substrate W (step S2B). Alignment is performed by rotating the first holding table 23 around the vertical axis.
半導体基板Wのアライメントが完了すると、第1搬送機構21によって搬送されてきた封止シートTが、図13に示すように、半導体基板Wに対向配置される。その後に、図14に示すように、吸着プレート26が所定高さまで下降して封止シートTが半導体素子Cに当接する。このとき、封止シートTの封止層Mは、所定温度まで加熱されて所定の粘度まで軟化している。また、第1保持テーブル23に載置保持された半導体基板Wもヒータ37によって所定温度まで加熱されている。図15に示すように、さらに吸着プレート26下降させることによって、軟化している封止層Mを形成する樹脂組成物が、隣接する複数個の半導体素子間のエアーを排除しながら進入しゆき密着する(ステップS6)。
When the alignment of the semiconductor substrate W is completed, the sealing sheet T transported by the first transport mechanism 21 is disposed to face the semiconductor substrate W as shown in FIG. Thereafter, as shown in FIG. 14, the suction plate 26 is lowered to a predetermined height, and the sealing sheet T comes into contact with the semiconductor element C. At this time, the sealing layer M of the sealing sheet T is heated to a predetermined temperature and softened to a predetermined viscosity. The semiconductor substrate W placed and held on the first holding table 23 is also heated to a predetermined temperature by the heater 37. As shown in FIG. 15, by further lowering the suction plate 26, the resin composition forming the softened sealing layer M enters and adheres while excluding air between a plurality of adjacent semiconductor elements. (Step S6).
なお、この時点で、封止層は、完全に硬化していない仮圧着された状態にある。封止シートTの仮圧着が完了すると、第1搬送機構21は、載置台2側の待機位置に戻る。
At this point, the sealing layer is in a temporarily pressure-bonded state that is not completely cured. When the temporary pressure bonding of the sealing sheet T is completed, the first transport mechanism 21 returns to the standby position on the mounting table 2 side.
封止シートTが仮圧着された半導体基板Wは、第2搬送機構24によって吸着保持され、第2保持テーブル45に搬送される(ステップS7)。
The semiconductor substrate W to which the sealing sheet T has been temporarily press-bonded is sucked and held by the second transport mechanism 24 and transported to the second holding table 45 (step S7).
半導体基板Wが第2保持テーブル45に載置されると、第2搬送機構24は上昇して第1保持テーブル23側に戻る。第2保持テーブル45は、半導体基板Wを吸着保持したまま、上ハウジング46Aの下方まで移動する。
When the semiconductor substrate W is placed on the second holding table 45, the second transport mechanism 24 rises and returns to the first holding table 23 side. The second holding table 45 moves to below the upper housing 46A while holding the semiconductor substrate W by suction.
図16に示すように、上ハウジング46Aの下端が下ハウジング46Bに当接する位置まで下降する。つまり、減圧室46を形成する。その後、減圧室46内を減圧する。さらに、図17に示すように、押圧プレート59を下降させて封止シートTを押圧および加熱して半導体基板Wに本圧着する(ステップS8)。この時点で、封止層Mは、未だに完全に硬化していない状態である。
As shown in FIG. 16, the lower end of the upper housing 46A is lowered to a position where it comes into contact with the lower housing 46B. That is, the decompression chamber 46 is formed. Thereafter, the inside of the decompression chamber 46 is decompressed. Further, as shown in FIG. 17, the pressing plate 59 is lowered to press and heat the sealing sheet T to be finally press bonded to the semiconductor substrate W (step S <b> 8). At this point, the sealing layer M is not yet completely cured.
本圧着が完了すると、減圧室46内を大気圧まで戻して上ハウジング46Aを開放する。下ハウジング46Bは、第2保持テーブル45ごと基板の受け渡し位置まで戻る。封止シートTの本圧着された半導体基板Wは、第1剥離ライナS1が剥離される(ステップS9)。以上で半導体基板Wに封止シートTを貼り付ける一連の動作が完了する。
When the main pressure bonding is completed, the decompression chamber 46 is returned to the atmospheric pressure, and the upper housing 46A is opened. The lower housing 46B returns to the substrate transfer position together with the second holding table 45. The first release liner S1 is peeled off from the semiconductor substrate W to which the sealing sheet T is press-bonded (step S9). Thus, a series of operations for attaching the sealing sheet T to the semiconductor substrate W is completed.
上記実施例装置によれば、半導体基板Wに貼り付けられる前に封止シートTの凸部が潰されて平坦化されるので、貼付け時に封止シートTの封止層Mが、半導体素子Cに偏当たりしない。すなわち、特定の半導体素子Cに過剰な荷重がかからない。また、偏当たりに伴う軟化した樹脂組成物の急速な流れが生じない。したがって、封止層の偏当たりで生じる現象に起因する半導体素子Cの破損を回避することができる。
According to the above-described embodiment apparatus, since the convex portion of the sealing sheet T is crushed and flattened before being attached to the semiconductor substrate W, the sealing layer M of the sealing sheet T is bonded to the semiconductor element C at the time of application. Don't get overwhelmed. That is, an excessive load is not applied to the specific semiconductor element C. In addition, a rapid flow of the softened resin composition due to uneven contact does not occur. Therefore, damage to the semiconductor element C due to a phenomenon that occurs due to the uneven contact of the sealing layer can be avoided.
なお、本発明は以下のような形態で実施することもできる。
The present invention can also be implemented in the following forms.
(1)上記実施例において、仮圧着の過程で封止シートTの押圧によって半導体基板Wにかかる荷重をロードセンサで測定し、荷重を調整するよう構成してもよい。例えば、吸着プレート26または第2保持テーブル23のうち少なくともいずれかにロードセンサを備える。封止シート貼付け過程で、当該ロードセンサによって検出される当実測値と予め決めた基準値を制御部100によって比較し、実測値が基準値を超えると吸着プレート26の下降速度を減速させて荷重を一定に保つように構成する。
(1) In the above embodiment, the load applied to the semiconductor substrate W by the pressing of the sealing sheet T during the temporary pressing may be measured by a load sensor, and the load may be adjusted. For example, at least one of the suction plate 26 and the second holding table 23 includes a load sensor. In the pasting process of the sealing sheet, the actual measurement value detected by the load sensor is compared with a predetermined reference value by the control unit 100. If the actual measurement value exceeds the reference value, the lowering speed of the suction plate 26 is reduced to reduce the load. Is configured to be kept constant.
この構成によれば、加熱によって塑性変形した樹脂組成物が、半導体基板上で放射状に広がる流速を一体に保つことができる。すなわち、急速な流れで樹脂組成物が半導体素子Cに衝突して破損するのを抑制することができる。
According to this configuration, the flow rate of the resin composition that is plastically deformed by heating radially spread on the semiconductor substrate can be integrally maintained. That is, the resin composition can be prevented from colliding with the semiconductor element C and being damaged by a rapid flow.
(2)上記各実施例装置において、吸着プレート26に埋設されたヒータ29を作動させて所定温度で加熱しながら封止シートTを平坦化してもよい。この構成によれば封止層Mが軟化しているので、平坦化が容易になる。
(2) In each of the above embodiments, the sealing sheet T may be flattened while the heater 29 embedded in the suction plate 26 is operated and heated at a predetermined temperature. According to this configuration, since the sealing layer M is softened, flattening is facilitated.
なお、当該実施形態において、平坦化した後に、封止シートTに冷却プレートなどを当接させて所定温度(例えば室温)まで戻してから裏面の第2剥離ライナS2を剥離してもよい。
In the embodiment, after the planarization, the second peeling liner S2 on the back surface may be peeled off after bringing the cooling plate or the like into contact with the sealing sheet T and returning to a predetermined temperature (for example, room temperature).
(2)上記各実施例装置において、封止シートTの凸部を検出し、当該凸部を潰して平坦化していたが、次のようにしてもよい。例えば、構成物の接触または衝突によって封止シートTに形成された凹部を平坦化するよう構成してもよい。
(2) In each of the above-described embodiments, the convex portion of the sealing sheet T is detected and the convex portion is crushed and flattened. For example, you may comprise so that the recessed part formed in the sealing sheet T by the contact or collision of a structure may be planarized.
なお、この場合、封止シートTの凹部の検出は、ラインセンサを走査させて検出してもよい。または、撮像カメラによって取得した画像から凹部を求めればよい。
In this case, the concave portion of the sealing sheet T may be detected by scanning a line sensor. Or what is necessary is just to obtain | require a recessed part from the image acquired with the imaging camera.
凹部が検出された場合、押圧プレート7または吸着プレート26の少なくとも一方に埋設したヒータによって封止層Mを加熱し、軟化させ状態で押圧プレート7と吸着プレート26とで挟み込み平坦化すればよい。
When the concave portion is detected, the sealing layer M may be heated by a heater embedded in at least one of the pressing plate 7 or the suction plate 26 and softened to be sandwiched between the pressing plate 7 and the suction plate 26 and flattened.
(3)上記各実施例装置において、押圧プレート7に代えて封止シートTの直径より長いロールを転動させて封止シートTを平坦化してもよい。
(3) In each of the above embodiments, the sealing sheet T may be flattened by rolling a roll longer than the diameter of the sealing sheet T instead of the pressing plate 7.
(4)上記各実施例装置において、半導体基板Wの形状は、円形に限定されない。したがって、半導体基板Wは、正方形または長方形などの四角形であってもよい。
(4) In each of the above embodiments, the shape of the semiconductor substrate W is not limited to a circle. Therefore, the semiconductor substrate W may be a quadrangle such as a square or a rectangle.
(5)上記各実施例装置において、封止シートTは、収納容器3からライナ剥離機構22を経由して第1保持テーブル23に搬送させるまでに、吸着プレート26に埋設されたヒータ29によって所定温度まで予備加熱してもよい。
(5) In each of the above embodiments, the sealing sheet T is predetermined by the heater 29 embedded in the suction plate 26 before being transferred from the storage container 3 to the first holding table 23 via the liner peeling mechanism 22. You may preheat to temperature.
この場合、封止シートTの貼付け時に吸着レート26が、設定温度に到達して安定するまでの待ち時間を短縮することができる。
In this case, the waiting time until the adsorption rate 26 reaches the set temperature and stabilizes when the sealing sheet T is stuck can be shortened.
以上のように、本発明は、半導体基板上に形成された半導体素子を破損させることなく封止シートを精度よく貼り付けるのに適している。
As described above, the present invention is suitable for accurately sticking a sealing sheet without damaging a semiconductor element formed on a semiconductor substrate.
Claims (8)
- 熱可塑性の樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け方法であって、
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して搬送する過程で、封止シートの接着面側の凸部を検出器によって検査する検査過程と、
前記検査過程で凸部の検出された封止シートを押圧して平坦に矯正する押圧過程と、
平坦に矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け過程と、
を備えたことを特徴とする封止シート貼付け方法。 A sealing sheet affixing method for affixing a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
In the process of holding and transporting the sealing sheet cut below the shape of the semiconductor substrate with a holding member, an inspection process of inspecting the convex portion on the adhesive surface side of the sealing sheet with a detector,
A pressing process of pressing the sealing sheet in which the convex portion is detected in the inspection process to correct the sealing sheet;
Affixing process for applying the flattened sealing sheet to a semiconductor substrate while applying pressure and heating;
The sealing sheet sticking method characterized by having provided. - 請求項1に記載の封止シート貼付け方法において、
前記検査過程は、保持部材によって所定の温度に予備加熱されている封止シートの接着面側の凸部を検出器で検査する
ことを特徴とする封止シート貼付け方法。 In the sealing sheet sticking method of Claim 1,
The said inspection process inspects the convex part by the side of the adhesive surface of the sealing sheet preheated to predetermined temperature with the holding member with a detector. The sealing sheet sticking method characterized by the above-mentioned. - 請求項1に記載の封止シート貼付け方法において、
前記押圧過程は、封止シートの外形以上のサイズの押圧部材と前記保持部材で封止シートを挟み込む
ことを特徴とする封止シート貼付け方法。 In the sealing sheet sticking method of Claim 1,
In the pressing process, the sealing sheet is sandwiched between a pressing member having a size equal to or larger than the outer shape of the sealing sheet and the holding member. - 請求項1に記載の封止シート貼付け方法において、
前記押圧過程は、封止シートを加熱しながら平坦に矯正する
ことを特徴とする封止シート貼付け方法。 In the sealing sheet sticking method of Claim 1,
The said pressing process corrects flatly, heating a sealing sheet. The sealing sheet sticking method characterized by the above-mentioned. - 請求項1に記載の封止シート貼付け方法において、
前記貼付け過程は、封止シートの加圧により半導体基板にかかる荷重を検出器によって検出し、検出結果に基づいて予め決めた荷重に調整しながら封止シートを半導体基板に貼り付ける
ことを特徴とする封止シート貼付け方法。 In the sealing sheet sticking method of Claim 1,
The pasting process is characterized in that a load applied to the semiconductor substrate by pressure of the sealing sheet is detected by a detector, and the sealing sheet is pasted on the semiconductor substrate while adjusting to a predetermined load based on the detection result. A sealing sheet pasting method. - 熱可塑性の樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
前記半導体基板を保持する保持テーブルと、
前記半導体基板の形状以下に切断された封止シートを保持部材で保持して保持テーブル上の半導体基板に重ね合わせる搬送機構と、
前記搬送機構の保持部材に保持された封止シートの接着面側の凸部を検出する検出器と、
前記検出器の検出結果に基づいて、保持部材の保持された封止シートを挟み込んで凸部を矯正する押圧機構と、
凸部の矯正された前記封止シートを加圧および加熱しながら半導体基板に貼り付ける貼付け機構と、
を備えたことを特徴とする封止シート貼付け装置。 A sealing sheet affixing device for affixing a sealing sheet formed with a sealing layer made of a thermoplastic resin composition to a semiconductor substrate,
A holding table for holding the semiconductor substrate;
A transport mechanism for holding a sealing sheet cut to a shape equal to or less than the shape of the semiconductor substrate and holding the sealing sheet on a semiconductor substrate on a holding table;
A detector for detecting a convex portion on the adhesive surface side of the sealing sheet held by the holding member of the transport mechanism;
Based on the detection result of the detector, a pressing mechanism that sandwiches the sealing sheet held by the holding member and corrects the convex part,
A pasting mechanism that affixes to the semiconductor substrate while pressurizing and heating the sealing sheet with the convex portion corrected,
The sealing sheet sticking apparatus characterized by having provided. - 請求項6に記載の封止シート貼付け装置において、
前記保持部材および押圧機構のいずれかに加熱器を備えた
ことを特徴とする封止シート貼付け装置。 In the sealing sheet sticking device according to claim 6,
One of the holding member and the pressing mechanism is provided with a heater. - 請求項6に記載の封止シート貼付け装置において、
前記封止シートを貼り付ける過程で、半導体基板にかかる荷重を検出する検出器と、
予め決めた基準値と前記検出結果の比較に基づいて、前記貼付け機構を操作して半導体基板への荷重を調整する制御部を備えた
ことを特徴とする封止シート貼付け装置。 In the sealing sheet sticking device according to claim 6,
In the process of pasting the sealing sheet, a detector that detects the load applied to the semiconductor substrate;
A sealing sheet sticking apparatus comprising: a control unit that operates the sticking mechanism and adjusts a load on the semiconductor substrate based on a comparison between a predetermined reference value and the detection result.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013095333A JP2014216608A (en) | 2013-04-30 | 2013-04-30 | Sealing sheet sticking method and sealing sheet sticking device |
JP2013-095333 | 2013-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014178268A1 true WO2014178268A1 (en) | 2014-11-06 |
Family
ID=51843403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/060336 WO2014178268A1 (en) | 2013-04-30 | 2014-04-09 | Sealing sheet application method and sealing sheet application device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2014216608A (en) |
TW (1) | TW201501254A (en) |
WO (1) | WO2014178268A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002254455A (en) * | 2001-03-02 | 2002-09-11 | Matsushita Electric Works Ltd | Method for producing molding material sheet and method for producing electronic part |
JP2010179507A (en) * | 2009-02-04 | 2010-08-19 | Apic Yamada Corp | Compression molding method |
JP2011049298A (en) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device |
-
2013
- 2013-04-30 JP JP2013095333A patent/JP2014216608A/en active Pending
-
2014
- 2014-04-09 WO PCT/JP2014/060336 patent/WO2014178268A1/en active Application Filing
- 2014-04-29 TW TW103115263A patent/TW201501254A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002254455A (en) * | 2001-03-02 | 2002-09-11 | Matsushita Electric Works Ltd | Method for producing molding material sheet and method for producing electronic part |
JP2010179507A (en) * | 2009-02-04 | 2010-08-19 | Apic Yamada Corp | Compression molding method |
JP2011049298A (en) * | 2009-08-26 | 2011-03-10 | Fujitsu Semiconductor Ltd | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2014216608A (en) | 2014-11-17 |
TW201501254A (en) | 2015-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4781802B2 (en) | Support plate laminating means and laminating apparatus, and support plate laminating method | |
JP5095876B2 (en) | Bonding apparatus and control method thereof | |
KR20190052136A (en) | Method of manufacturing semiconductor device, and mounting device | |
WO2021131081A1 (en) | Bonding method, bonded article, and bonding device | |
JP2009070837A (en) | Protective tape separation method, and protective tape separation apparatus | |
TW201338076A (en) | Substrate transport method and substrate transport apparatus | |
JP6636696B2 (en) | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus | |
JP4918539B2 (en) | Protective tape peeling device | |
WO2014167947A1 (en) | Manufacturing method for semiconductor device | |
JPWO2019207632A1 (en) | Protective tape affixing device and affixing method to semiconductor wafers | |
WO2014178268A1 (en) | Sealing sheet application method and sealing sheet application device | |
WO2014167949A1 (en) | Sealing-sheet application method and stealing-sheet application device | |
WO2014167948A1 (en) | Method for attaching sealing sheet and apparatus for attaching sealing sheet | |
WO2015087763A1 (en) | Sealing sheet adhesion method | |
WO2014188810A1 (en) | Method for affixing sealing sheet | |
WO2014188809A1 (en) | Application method for sealing sheet | |
WO2014178267A1 (en) | Sealing sheet application method and sealing sheet application device | |
WO2014178269A1 (en) | Sealing sheet attachment method | |
JP6017131B2 (en) | Board assembly equipment | |
WO2014178266A1 (en) | Sealing sheet application method and sealing sheet application device | |
WO2015087762A1 (en) | Sealing sheet adhesion method | |
JP7298851B2 (en) | Alignment device and alignment method | |
JP6653032B2 (en) | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus | |
JP2015115348A (en) | Encapsulation sheet adhesion method | |
WO2017065006A1 (en) | Adhesive tape affixing method and adhesive tape affixing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14792160 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14792160 Country of ref document: EP Kind code of ref document: A1 |