WO2014161245A1 - 金手指及触摸屏 - Google Patents

金手指及触摸屏 Download PDF

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Publication number
WO2014161245A1
WO2014161245A1 PCT/CN2013/079164 CN2013079164W WO2014161245A1 WO 2014161245 A1 WO2014161245 A1 WO 2014161245A1 CN 2013079164 W CN2013079164 W CN 2013079164W WO 2014161245 A1 WO2014161245 A1 WO 2014161245A1
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WO
WIPO (PCT)
Prior art keywords
conductive
gold finger
substrate
wires
wire
Prior art date
Application number
PCT/CN2013/079164
Other languages
English (en)
French (fr)
Inventor
唐根初
董绳财
刘伟
唐彬
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Priority to KR1020137026485A priority Critical patent/KR20140127736A/ko
Priority to KR1020157026541A priority patent/KR20150119454A/ko
Priority to US13/968,331 priority patent/US9179547B2/en
Publication of WO2014161245A1 publication Critical patent/WO2014161245A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to the field of touch screen technologies, and in particular, to a gold finger and a touch screen. Background technique
  • a touch screen is an inductive device that can receive input signals such as touch.
  • the touch screen gives a new look to the information interaction and is a brand new information interaction device.
  • the development of touch screen technology has attracted widespread attention from the information media community at home and abroad.
  • the conductive layer of the touch screen is electrically connected to the flexible printed circuit board (FPCB) through the lead electrode at the end of the lead electrode, and the portion for electrically connecting to the circuit board is called a gold finger.
  • FPCB flexible printed circuit board
  • the gold finger parts are usually printed by screen printing silver needle wires, or the silver paddles are printed on the entire surface of the connecting area and then the laser needles are laser-elected.
  • the gold fingers obtained by the two methods are attached to the conductive wires due to the silver paddles.
  • the surface of the layer is prone to scratching or falling off, which makes the gold finger have poor electrical conductivity and affects the performance of the touch screen. Summary of the invention
  • a gold finger comprising a substrate, further comprising a molding glue layer and a plurality of wires electrically connectable to the circuit board, wherein the molding glue layer is attached to one side of the substrate, and the molding glue layer is away from a side of the substrate A grid-like recess is provided, and the wire includes a conductive mesh housed in the groove.
  • the wire has a thickness no greater than a depth of the groove.
  • the conductive mesh of the wire is formed by curing a conductive material filled in the groove, the conductive material being metal, graphene, conductive polymer, carbon nanotube or indium tin oxide.
  • the wire may be anisotropically conductive through a plurality of conductive balls
  • the glue is electrically connected to the circuit board, and a diameter of a largest circle in a region surrounded by the grid unit is smaller than an average value of a distance between all adjacent conductive balls.
  • the largest circle of the grid unit has a diameter of no more than 50 ⁇ m and no less than 5 ⁇ m.
  • the molding layer is attached to the surface of the substrate that has been plasma pretreated.
  • a touch screen includes an inductive component, a circuit board and an anisotropic conductive adhesive provided with a plurality of conductive balls, further comprising the gold finger, the gold finger is disposed on the sensing element, and the wire of the gold finger
  • the conductive ball of the anisotropic conductive paste is electrically connected to the circuit board.
  • the diameter of the conductive ball is not less than the diameter of the largest circle in the area enclosed by the grid cells of the wire, and is not greater than the largest area enclosed by the grid cells of the wire. 1.2 times the diameter of the circle
  • the gold finger and the touch screen have a molding glue layer attached to one side of the substrate, and a grid-like groove is formed on a side of the molding glue layer away from the substrate, and the conductive mesh is received in the groove to form a wire to form a gold finger, and the gold finger is
  • the wire is disposed on the sensing element, and the wire of the gold finger is electrically connected to the circuit board through the anisotropic conductive adhesive.
  • a grid-like structure is used to increase the contact area between the wire and the molding layer, so that the wire is tightly bonded to the molding layer, so that the wire is not easily peeled off or scratched. To ensure the conductivity of the gold finger and improve the performance of the touch screen.
  • FIG. 1 is a schematic structural view of a touch screen including the gold finger in one embodiment of the present invention
  • Figure 2 is a schematic enlarged view of the crucible in Figure 1;
  • Figure 3 is a schematic view showing another structure of view at B in Figure 2;
  • Figure 4 is a schematic view showing the structure of the wire of the gold finger shown in Figure 1;
  • Figure 5 is a schematic enlarged view of the structure C in Figure 4.
  • Figure 6 is a schematic enlarged view of another embodiment of Figure 4.
  • FIG. 7 is an enlarged schematic structural view of still another embodiment of FIG. detailed description
  • a gold finger 100 includes a substrate 1 10 , a molding layer 120 and a plurality of wires 130 electrically connectable to the circuit board, and the molding layer 120 is attached to On the substrate 110 side, a side of the molding adhesive layer 120 away from the substrate 1 10 is provided with a grid-like recess 122, and the conductive line 130 includes a conductive mesh 132 received in the recess 122.
  • the gold finger 100 is coated with a gel on the side of the substrate 110 to form a molding layer 120.
  • a groove 122 is formed in a side of the molding layer 120 away from the substrate 110, and the conductive grid 132 of the wire 130 is formed.
  • the gold wire 100 is formed in the groove 122 to form the wire 130.
  • the gold finger 100 is disposed on the sensing element, and the gold finger 100 is electrically connected to the circuit board through the anisotropic conductive paste.
  • the conductive mesh 132 of the wire 130 is received in the groove 122 to form the wire 130.
  • the mesh structure is used to increase the contact area between the wire 130 and the molding layer 120, so that the wire 130 is tightly bonded to the molding layer 120, thereby The wire 130 is not easy to fall off or scratch, and the conductive performance of the gold finger 100 is ensured, and the use performance of the touch screen is improved.
  • the material of the substrate 110 may be glass, acrylic resin, polyethylene terephthalate, polycarbonate plastic, etc., and a transparent insulating material is preferred.
  • the thickness of the substrate 110 can be
  • the thickness of the substrate 110 can be further set to 50 ⁇ 0.7 ⁇ .
  • the material of the molding layer 120 may be a thermoplastic polymer, a thermosetting polymer, a UV-curable polymer or the like.
  • the thickness of the molding layer 120 may be 1 ⁇ to 10 ⁇ . To ensure the overall light transmission effect of the product provided with the molding layer 120, the thickness of the molding layer 120 may be further set to 2 ⁇ to 5 ⁇ .
  • the thickness of the wire 130 is not greater than the groove 122.
  • the depth of the conductive material of the wire 130 does not exceed the horizontal plane of the opening of the groove 122, and the protection of the wire 130 can be further strengthened, so that the wire 130 is less likely to fall off or scratch, the conductive performance of the gold finger 100 is ensured, and the use of the touch screen is improved. performance.
  • the conductive mesh 132 of the wire 130 is formed by curing of a conductive material filled in the recess 122.
  • the grid-shaped groove 122 is embossed on the side of the molding layer 120 away from the substrate 110 through an imprinting mold, and the conductive material is filled in the groove 122 by a doctor blade process, and a sintering process is performed to form a conductive mesh.
  • the grid 132 constitutes a wire 130.
  • Filling the recesses 122 with the conductive material forms a plurality of metal lines 1324 which intersect to form the conductive mesh 132 according to the shape of the recess 122.
  • the mesh structure is used to make the wire 130 and the forming adhesive layer 120 tightly combined, so that the wire 130 is not easy to fall off or scratch, thereby ensuring the conductive performance of the gold finger 100 and improving the performance of the touch screen.
  • the conductive material is filled in the recess 122 to form a plurality of metal lines 1324, and the metal lines 1324 intersect to form a conductive mesh 132.
  • the electrical grid 132 includes a plurality of grid cells 1320.
  • the thickness of the metal wire 1324 formed by filling the conductive material into the grid-like groove 122 can be reasonably set to 1 ⁇ m to 10 ⁇ m, and the width of the wire 1324 can be reasonably set to 0.5 ⁇ m to 5 ⁇ m.
  • the gold finger 100 includes a plurality of wires 130.
  • the thickness of the wire 1324 can be further appropriately set to 2 ⁇ 5 ⁇ , the metal wire 1324 The width is reasonably set to 2 ⁇ 5 ⁇ .
  • the conductive material of the wire 130 may be metal, graphene, conductive polymer, carbon nanotube or indium tin oxide. Specifically, one of gold, silver, copper, aluminum, nickel, zinc or an alloy of at least two of them may be used, and since these metal materials are relatively inexpensive, the cost can be reduced. In this embodiment, the conductive material used is silver.
  • the conductive mesh 132 includes a plurality of mesh cells 1320.
  • the grid cells 1320 of all of the conductive grids 132 can be made identical, ie, the conductive grids 132 are regular conductive grids 132.
  • the grid unit 1320 is a regular polygon such as a square, a diamond, a regular hexagon, or the like. In the embodiment shown in Figure 5, grid unit 1320 is square. In another embodiment, as shown in FIG. 6, grid unit 1320 is diamond shaped.
  • the grid cells 1320 of the at least two conductive meshes 132 may also be different, that is, the conductive meshes 132 are irregular conductive meshes 132.
  • a molding layer 120 is attached to the surface of the substrate 110 that has been plasma pretreated. Specifically, plasma pretreatment is performed on the surface of the substrate 110, and a gel is applied to the surface to form a molding layer 120, so that oil stains and the like on the surface of the substrate 1 10 can be removed, and the surface of the substrate 1 10 is ionized. Thereby, the bonding strength between the molding layer 120 and the surface of the substrate 110 is enhanced. It should be noted that even if plasma pretreatment is not performed, the purpose of attaching the molding layer 120 to the side of the substrate 10 can be achieved.
  • the wire 130 is electrically connected to the circuit board through the anisotropic conductive paste.
  • the anisotropic conductive paste includes a plurality of conductive balls, and the diameter of the largest circle 1322 of the mesh unit 1320 is smaller than all the phases. The average of the distance between adjacent conductive balls.
  • the anisotropic conductive adhesive comprises a plurality of conductive balls, and the anisotropic conductive adhesive mainly connects the circuit board with the wires 130 of the gold finger 100 through the conductive balls.
  • the conductive ball In order to ensure that the conductive ball can be fully connected to the circuit board and the wire 130 of the gold finger 100, the conductive ball is completely prevented from falling into the area enclosed by the grid unit 1320 without contacting the circuit board, so the grid unit 1320 is reasonably disposed.
  • the diameter of the largest circle 1322 is less than the average of the distances between all adjacent conductive balls.
  • the anisotropic conductive adhesive uses conductive particles to connect the electrodes between the IC chip and the substrate 110 to make it conductive, and at the same time avoids conduction short circuit between adjacent electrodes, and achieves only in a certain direction.
  • an anisotropic conductive paste is used to electrically connect the wires 130 to the circuit board, which ensures that the gold fingers 100 are only conductive in a specific direction to avoid short circuits during electrical connection.
  • the conductive ball of the anisotropic conductive adhesive is usually subjected to heat and pressure treatment to be fractured, and the conductive balls are randomly distributed in the anisotropic conductive adhesive, and the distance between the adjacent conductive balls is calculated by the distance distribution straight line statistics.
  • the average value is about 50 ⁇ m, so in order to ensure that the conductive ball can be sufficiently connected to the circuit board and the wire 130 of the gold finger 100, the diameter of the largest circle 1322 of the grid unit 1320 can be reasonably set to be no more than 50 ⁇ m.
  • the grid unit 1320 is formed by imprinting, in order to ensure pressure The diameter of the largest circle 1322 of the grid unit 1320 can be reasonably set to be no less than 5 ⁇ m.
  • a touch screen includes an inductive component, a circuit board, an anisotropic conductive adhesive provided with a plurality of conductive balls, and a gold finger 100.
  • the gold finger 100 is disposed on the sensing On the component, the wire 130 of the gold finger 100 is electrically connected to the circuit board through a conductive ball of an anisotropic conductive paste.
  • the touch screen is coated with a glue on the side of the substrate 110 to form a molding layer 120.
  • a groove 122 is formed in a side of the molding layer 120 away from the substrate 110, and the conductive grid 132 of the wire 130 is received.
  • the recess 122 forms a wire 130 to form a gold finger 100.
  • the gold finger 100 is disposed on the sensing element, and the gold finger 100 is electrically connected to the circuit board through the conductive ball of the anisotropic conductive paste, thereby electrically connecting the sensing element to the circuit board.
  • the conductive mesh 132 of the wire 130 is received in the groove 122 to form the wire 130.
  • the mesh structure is used to increase the contact area between the wire 130 and the molding layer 120, so that the wire 130 and the molding layer 120 are tightly combined, thereby
  • the wire 130 is not easy to fall off or scratch, and the conductive performance of the gold finger 100 is ensured, and the use performance of the touch screen is improved.
  • the anisotropic conductive paste is formed by adhering a plurality of conductive balls to the tape.
  • the use of an anisotropic conductive adhesive to electrically connect the wire 130 to the circuit board ensures that the gold finger 100 conducts only in a particular direction, avoiding short circuits during electrical connections.
  • the diameter of the conductive ball is not less than the diameter of the largest circle 1322 in the area surrounded by the grid unit 1320 of the wire 130, and is not larger than the grid of the wire 130.
  • the largest circle 1322 in the area enclosed by the unit 1320 is 1.2 times the diameter.
  • the gold finger 100 is electrically connected to the circuit board through the conductive ball of the anisotropic conductive adhesive. Specifically, the anisotropic conductive adhesive is pressed into the gold finger 100, because the wire 130 of the gold finger 100 adopts a grid structure, if the grid The unit 1320 is too small, which inevitably causes the metal wire 1324 constituting the mesh to break when pressed, affecting the electrical conductivity of the gold finger 100.
  • the diameter of the ball is not less than the diameter of the largest circle 1322 in the area enclosed by the grid unit 1320 of the wire 130, and is not larger than
  • the grid unit 1320 of the wire 130 encloses 1.2 times the diameter of the largest circle 1322 in the region.
  • the conductive ball of the anisotropic conductive adhesive is usually subjected to heat and pressure treatment to be fractured, and the conductive balls are randomly distributed in the anisotropic conductive adhesive, and the distance between the adjacent conductive balls is calculated by the distance distribution straight line statistics.
  • the average value is about 50 ⁇ m, so in order to ensure that the conductive ball can be sufficiently connected to the circuit board and the wire 130 of the gold finger 100, the diameter of the largest circle 1322 of the grid unit 1320 can be reasonably set to be no more than 50 ⁇ m.
  • the grid unit 1320 is formed by imprinting. In order to ensure the imprinting effect and the manufacturing process requirements, the diameter of the largest circle 1322 of the grid unit 1320 can be reasonably set to be no less than 5 ⁇ m.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种金手指，包括基板，还包括成型胶层和多个可与电路板电连接的导线，成型胶层附着于所述基板一侧，成型胶层远离基板的一侧设有网格状的凹槽，导线包括收容于凹槽中的导电网格，在基板一侧附着成型胶层，在成型胶层远离基板的一侧开设网格状的凹槽，导电网格收容于该凹槽形成导线，构成金手指，将金手指设置于感应元件，金手指的导线通过异方性导电胶与电路板电连接。如此，通过将导线的导电网格收容于凹槽，采用网格状结构，增大导线与成型胶层的接触面积，使导线与成型胶层结合更紧密，从而使导线不容易脱落或者刮花，保证金手指的导电性能，提高触摸屏的使用性能，本发明提供一种含有该金手指的触摸屏。

Description

金手指及触摸屏
技术领域
本发明涉及触摸屏技术领域， 特别是涉及一种金手指及触摸屏。 背景技术
触摸屏是一种可接收触摸等输入信号的感应式装置。触摸屏赋予了信 息交互崭新的面貌， 是一种全新的信息交互设备。 触摸屏技术的发展引起 了国内外信息传媒界的普遍关注。 其中， 触摸屏的导电层通过引线电极与 印刷电路板 ( Flexible Printed Circuit Board, FPCB ) 电连接， 位于引线电 极末端， 且用于与电路板电连接的部分称为金手指。
目前， 金手指部位一般都是通过丝网印刷出银针导线， 或者先在连接 区域整面印刷银桨再用激光镭射出银针导线，这两种方式得到的金手指由 于银桨附着在导电层表面， 容易出现刮花或者脱落的现象， 从而使金手指 导电性能差， 影响触摸屏的使用性能。 发明内容
基于此，有必要针对金手指容易刮花或者脱落，影响使用性能的问题， 提供一种金手指及触摸屏。
一种金手指， 包括基板， 还包括成型胶层和多个可与电路板电连接的 导线， 所述成型胶层附着于所述基板一侧， 所述成型胶层远离所述基板的 一侧设有网格状的凹槽， 所述导线包括收容于所述凹槽中的导电网格。
在其中一个实施例中， 所述导线的厚度不大于所述凹槽的深度。
在其中一个实施例中， 所述导线的导电网格由填充于所述凹槽中的导 电材料固化形成， 所述导电材料为金属、 石墨烯、 导电高分子、 碳纳米管 或氧化铟锡。
在其中一个实施例中， 所述导线可通过包括多个导电球的异方性导电 胶与电路板电连接， 所述网格单元所围区域内最大圆的直径小于所述所有 的相邻导电球之间距离的平均值。
在其中一个实施例中， 所述网格单元的最大圆的直径不大于 50μηι， 且不小于 5μηι。
在其中一个实施例中， 所述成型胶层附着于所述基板经等离子预处理 的表面。
一种触摸屏， 包括感应元件， 电路板和设有多个导电球的异方性导电 胶， 还包括所述的金手指， 所述金手指设置于所述感应元件上， 所述金手 指的导线通过所述异方性导电胶的导电球与所述电路板电连接。
在其中一个实施例中， 所述导电球的直径不小于所述导线的网格单元 所围成区域内的最大圆的直径， 且不大于所述导线的网格单元所围成区域 内的最大圆直径的 1.2倍
上述金手指及触摸屏， 在基板一侧附着成型胶层， 在成型胶层远离基 板的一侧开设网格状的凹槽， 导电网格收容于该凹槽形成导线， 构成金手 指， 将金手指设置于感应元件， 金手指的导线通过异方性导电胶与电路板 电连接。 如此， 通过将导线的导电网格收容于凹槽， 采用网格状结构， 增 大导线与成型胶层的接触面积， 使导线与成型胶层结合更紧密， 从而使导 线不容易脱落或者刮花，保证金手指的导电性能，提高触摸屏的使用性能。 附图说明
图 1为本发明其中一个实施例中的含有该金手指的触摸屏的结构示意 图；
图 2为图 1中 Α处的放大结构示意图；
图 3为图 2中 B处的另一视角结构示意图；
图 4为图 1所示金手指的导线结构示意图；
图 5为图 4中 C处的放大结构示意图；
图 6为图 4中 C处的另一实施例放大结构示意图；
图 7为图 4中 C处的又一实施例放大结构示意图。 具体实施方式
为了便于理解本发明， 下面将参照相关附图对本发明进行更全面的描 述。 附图中给出了本发明的首选实施例。 但是， 本发明可以以许多不同的 形式来实现， 并不限于本文所描述的实施例。 相反地， 提供这些实施例的 目的是使对本发明的公开内容更加透彻全面。
如图 1、图 2和图 3所示的实施例中，一种金手指 100，包括基板 1 10、 成型胶层 120和多个可与电路板电连接的导线 130， 成型胶层 120附着于 基板 110—侧，成型胶层 120远离基板 1 10的一侧设有网格状的凹槽 122， 导线 130包括收容于凹槽 122的导电网格 132。
上述金手指 100， 在基板 110—侧涂布胶状物， 形成成型胶层 120， 在成型胶层 120远离基板 110的一侧开设网格状的凹槽 122， 将导线 130 的导电网格 132收容于该凹槽 122形成导线 130， 构成金手指 100， 金手 指 100设置于感应元件， 金手指 100通过异方性导电胶与电路板电连接。 将导线 130的导电网格 132收容于凹槽 122形成导线 130， 采用网格状结 构，增大导线 130与成型胶层 120的接触面积，使导线 130与成型胶层 120 结合更紧密， 从而使导线 130不容易脱落或者刮花， 保证金手指 100的导 电性能， 提高触摸屏的使用性能。
其中， 基板 110的材料可以为玻璃、 亚克力树脂、 聚对苯二甲酸乙二 酯、 聚碳酸酯塑料等， 以透明绝缘材料为佳。 基板 110的厚度可以为
25μηι~1ηιηι, 为了保证设有该基板 110的产品的整体透光效果， 基板 110 的厚度可进一步设置为 50μηι~0.7ηιηι。
其中， 成型胶层 120的材料可以为热塑性聚合物、 热固性聚合物、 UV 固化聚合物等。 成型胶层 120的厚度可以为 1 μηι~10μηι， 为了保证设有该 成型胶层 120的产品的整体透光效果， 成型胶层 120的厚度可进一步设置 为 2μΓη~5μηι。
请参阅图 3， 在其中一个实施例中， 导线 130的厚度不大于凹槽 122 的深度， 从而导线 130的导电材料不会超过凹槽 122开口的水平面， 可进 一步加强对导线 130的保护， 使导线 130更加不容易脱落或者刮花， 保证 金手指 100的导电性能， 提高触摸屏的使用性能。
请参阅图 3， 在其中一个实施例中， 导线 130的导电网格 132由填充 于凹槽 122中的导电材料固化形成。 具体地， 在成型胶层 120远离基板 110的一侧通过压印模具压印出网格状的凹槽 122， 再通过刮涂工艺将导 电材料填充于凹槽 122，并进行烧结工艺形成导电网格 132，构成导线 130。 将导电材料填充于凹槽 122形成多条金属线 1324，根据凹槽 122的形状这 些金属线 1324交叉构成导电网格 132。采用网格状结构， 使导线 130与成 型胶层 120结合紧密，从而导线 130不容易脱落或者刮花，保证金手指 100 的导电性能， 提高触摸屏的使用性能。
其中， 导电材料填充于凹槽 122中会形成多条金属线 1324， 这些金属 线 1324会交叉构成导电网格 132， 电网格 132包括多个网格单元 1320。
其中， 为了保证导线 130的导电性能， 将导电材料填充于网格状凹槽 122所形成的金属线 1324的厚度可合理设置为 1μηι~10μηι， 金属线 1324 的宽度可合理设置为 0.5μηι~5μηι。在保证导线 130的导电性能的同时， 金 手指 100包括多条导线 130， 为了便于导线 130的结构设计和排线， 该金 属线 1324的厚度还可进一步合理设置为 2μηι~5μηι， 金属线 1324的宽度 合理设置为 2μηι~5μηι。
其中， 该导线 130的导电材料可以为金属、 石墨烯、 导电高分子、 碳 纳米管或氧化铟锡。 具体可采用金、 银、 铜、 铝、 镍、 锌或其中至少二者 的合金中的一种， 因这些金属材料价格相对便宜， 故可降低成本。 在本实 施例中， 所采用的导电材料为银。
其中， 导电网格 132包括多个网格单元 1320。根据对网格图案需求的 不同， 可使所有的导电网格 132的网格单元 1320均相同， 即导电网格 132 为规则的导电网格 132。 具体地， 网格单元 1320为正多边形， 如正方形、 菱形、 正六边形等。 如图 5所示的实施例中， 网格单元 1320为正方形。 如图 6所示的另一实施例中， 网格单元 1320为菱形。
如图 7所示的又一实施例中， 还可以使至少两个导电网格 132的网格 单元 1320不相同， 即导电网格 132为不规则的导电网格 132。
请参阅图 2，在其中一个实施例中，成型胶层 120附着于所述基板 110 经等离子预处理的表面。 具体地， 在基板 110—表面进行等离子预处理， 再在该表面涂布胶状物， 固化形成成型胶层 120， 如此可除去基板 1 10表 面的油污等脏污， 同时使基板 1 10表面离子化， 从而加强成型胶层 120与 基板 110表面的粘合强度。 需要指出的是， 即使不进行等离子预处理， 也 可以实现成型胶层 120附着于基板 1 10—侧的目的。
请参阅图 6， 在其中一个实施例中， 导线 130通过异方性导电胶与电 路板电连接，异方性导电胶包括多个导电球，网格单元 1320的最大圆 1322 的直径小于所有相邻导电球之间距离的平均值。 其中， 异方性导电胶包括 多个导电球， 而异方性导电胶主要是通过这些导电球将电路板与金手指 100的导线 130连通。 为了保证导电球能够充分与电路板， 及金手指 100 的导线 130连接， 避免导电球完全落入网格单元 1320所围成的区域内而 不与电路板接触， 故合理设置网格单元 1320的最大圆 1322的直径小于所 有相邻导电球之间距离的平均值。
其中， 异方性导电胶是利用导电粒子连接 IC芯片与基板 1 10两者之 间的电极使之成为导通， 同时又能避免相邻两电极间导通短路， 而达成只 在某一方向导通的目的。 在本实施例中， 采用异方性导电胶来使导线 130 与电路板电连接， 可保证金手指 100只在一个特定的方向导电， 避免在电 连接的过程中出现短路。
具体地， 异方性导电胶的导电球通常有经过加热加压处理而被压裂， 导电球随机分布于异方性导电胶中， 经间距分布直方统计， 所有相邻导电 球之间距离的平均值约为 50μηι， 故为了保证导电球能够充分与电路板， 及金手指 100的导线 130连接， 网格单元 1320的最大圆 1322的直径可合 理设置为不大于 50μηι。 又该网格单元 1320是通过压印成型， 为了保证压 印成型效果及制作工序要求， 网格单元 1320的最大圆 1322的直径可合理 设置为不下于 5μηι。
如图 1、 图 2和图 3所示的实施例中， 一种触摸屏， 包括感应元件、 电路板、 设有多个导电球的异方性导电胶和金手指 100， 金手指 100设置 于感应元件上， 金手指 100的导线 130通过异方性导电胶的导电球与所述 电路板电连接。
上述触摸屏， 在基板 110—侧涂布胶状物， 形成成型胶层 120， 在成 型胶层 120远离基板 110的一侧开设网格状的凹槽 122， 将导线 130的导 电网格 132收容于该凹槽 122形成导线 130， 构成金手指 100， 将金手指 100设置于感应元件， 金手指 100通过异方性导电胶的导电球与电路板电 连接， 从而使感应元件与电路板电连接。 将导线 130的导电网格 132收容 于凹槽 122形成导线 130，采用网格状结构，增大导线 130与成型胶层 120 的接触面积， 使导线 130与成型胶层 120结合更紧密， 从而使导线 130不 容易脱落或者刮花，保证金手指 100的导电性能，提高触摸屏的使用性能。
其中， 异方性导电胶是通过多个导电球粘附于胶带而形成。 采用异方 性导电胶来使导线 130与电路板电连接， 可保证金手指 100只在一个特定 的方向导电， 避免在电连接的过程中出现短路。
请参阅图 6， 在其中一个实施例中， 所述导电球的直径不小于所述导 线 130的网格单元 1320所围区域内的最大圆 1322的直径， 且不大于所述 导线 130的网格单元 1320所围区域内的最大圆 1322直径的 1.2倍。 金手 指 100通过异方性导电胶的导电球与电路板电连接， 具体地， 将异方性导 电胶压合于金手指 100， 因金手指 100的导线 130采用网格状结构， 若网 格单元 1320太小， 难免会导致在压合时， 构成网格的金属线 1324断结， 影响金手指 100的导电性能。 若网格单元 1320太大， 难免会导致导电球 刚好落入网格单元 1320所围成的区域内， 从而导致导电球无法与金属性 1324搭接， 导致无法导通， 故合理设置所述导电球的直径不小于所述导线 130的网格单元 1320所围成区域内的最大圆 1322的直径， 且不大于所述 导线 130的网格单元 1320所围成区域内的最大圆 1322直径的 1.2倍。 具体地， 异方性导电胶的导电球通常有经过加热加压处理而被压裂， 导电球随机分布于异方性导电胶中， 经间距分布直方统计， 所有相邻导电 球之间距离的平均值约为 50μηι， 故为了保证导电球能够充分与电路板， 及金手指 100的导线 130连接， 网格单元 1320的最大圆 1322的直径可合 理设置为不大于 50μηι。 又该网格单元 1320是通过压印成型， 为了保证压 印成型效果及制作工序要求， 网格单元 1320的最大圆 1322的直径可合理 设置为不下于 5μηι。 以上所述实施例仅表达了本发明的几种实施方式， 其描述较为具体和 详细， 但并不能因此而理解为对本发明专利范围的限制。 应当指出的是， 对于本领域的普通技术人员来说， 在不脱离本发明构思的前提下， 还可以 做出若干变形和改进， 这些都属于本发明的保护范围。 因此， 本发明专利 的保护范围应以所附权利要求为准。

Claims

权 利 要 求 书
1、 一种金手指， 包括基板， 其特征在于， 还包括成型胶层和多个可 与电路板电连接的导线， 所述成型胶层附着于所述基板一侧， 所述成型胶 层远离所述基板的一侧设有网格状的凹槽， 所述导线包括收容于所述凹槽 中的导电网格。
2、 根据权利要求 1所述的金手指， 其特征在于， 所述导线的厚度不 大于所述凹槽的深度。
3、 根据权利要求 1所述的金手指， 其特征在于， 所述导线的导电网 格由填充于所述凹槽中的导电材料固化形成， 所述导电材料为金属、 石墨 烯、 导电高分子、 碳纳米管或氧化铟锡。
4、 根据权利要求 3所述的金手指， 其特征在于， 所述导线可通过包 括多个导电球的异方性导电胶与电路板电连接， 所述网格单元所围区域内 最大圆的直径小于所述所有的相邻导电球之间距离的平均值。
5、 根据权利要求 4所述的金手指， 其特征在于， 所述网格单元的最 大圆的直径不大于 50μηι， 且不小于 5μηι。
6、 根据权利要求 1至 5任意一项所述的金手指， 其特征在于， 所述 成型胶层附着于所述基板经等离子预处理的表面。
7、 一种触摸屏， 包括感应元件， 电路板和设有多个导电球的异方性 导电胶， 其特征在于， 还包括如权利要求 1至 6任意一项所述的金手指， 所述金手指设置于所述感应元件上， 所述金手指的导线通过所述异方性导 电胶的导电球与所述电路板电连接。
8、 根据权利要求 7所述的触摸屏， 其特征在于， 所述导电球的直径 不小于所述导线的网格单元所围成区域内的最大圆的直径， 且不大于所述 导线的网格单元所围成区域内的最大圆直径的 1.2倍。
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