WO2014044157A1 - 触控面板模块、触控装置及其制作方法 - Google Patents

触控面板模块、触控装置及其制作方法 Download PDF

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Publication number
WO2014044157A1
WO2014044157A1 PCT/CN2013/083547 CN2013083547W WO2014044157A1 WO 2014044157 A1 WO2014044157 A1 WO 2014044157A1 CN 2013083547 W CN2013083547 W CN 2013083547W WO 2014044157 A1 WO2014044157 A1 WO 2014044157A1
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Prior art keywords
touch panel
layer
panel module
module according
adhesive layer
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PCT/CN2013/083547
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English (en)
French (fr)
Inventor
李裕文
刘仁昌
庄江强
邱宗科
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宸鸿科技(厦门)有限公司
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Publication of WO2014044157A1 publication Critical patent/WO2014044157A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G06F3/04182—Filtering of noise external to the device and not generated by digitiser components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/742—Carbon nanotubes, CNTs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/81—Of specified metal or metal alloy composition

Definitions

  • the present invention relates to the field of touch technologies, and in particular to a touch panel module, a touch device, and a method of fabricating the same.
  • PDAs personal digital assistants
  • mobile phones mobile
  • Touch panels are widely used in portable electronic products such as Phone), notebooks and tablet PCs.
  • Panel as an interface tool for data communication.
  • the design of electronic products is currently in the direction of light, thin, short and small, it is hoped that the traditional input devices such as keyboards and mice can be omitted in the design of products, especially in the demand for tablet computers with humanized design. Driven by the touch panel, it has become one of the key components.
  • the touch panel is disposed on an electronic component. Since the touch panel is susceptible to external electromagnetic interference or electromagnetic noise between electronic components and interfere with each other, how to effectively resist electromagnetic interference and improve stability has become a An important issue is that the current touch panel module usually has an anti-electromagnetic interference layer to avoid electromagnetic interference, but the anti-electromagnetic interference layer is usually an anti-interference conductive layer formed on the carrier board, so anti-electromagnetic interference is added. The layer also increases the thickness of the overall touch panel and complicates the process steps.
  • the anti-interference conductive layer with anti-electromagnetic interference effect is firstly fabricated on the adhesive layer, and the subsequent assembly does not require an additional anti-electromagnetic interference layer, which saves the process steps. .
  • a touch panel module includes a sensing layer on a substrate, a first adhesive layer on the sensing layer, and an anti-interference conductive layer directly Formed on the first adhesive layer.
  • the touch panel module further includes a protective layer between the first adhesive layer and the sensing layer.
  • the touch panel module further includes a flat layer between the substrate and the sensing layer.
  • the touch panel module further includes a flat layer between the substrate and the sensing layer.
  • the anti-interference conductive layer material is selected from indium tin oxide (Indium Tin Oxides, ITO), Indium Zinc Oxide (IZO), Aluminum Zinc Oxide (Zinc oxide doping 3 oxidation 2 Aluminium, AZO) and other solid conductive materials.
  • ITO Indium Tin Oxides
  • IZO Indium Zinc Oxide
  • Zinc oxide doping 3 oxidation 2 Aluminium, AZO Aluminum Zinc Oxide
  • the anti-interference conductive layer material is selected from a nanometer conductive atom such as nano silver, a metal such as a carbon nanotube or a silver paste, or a poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (Poly(3). , 4– Liquid conductive material such as ethylenedioxythiophene) poly (styrene sulfonate), PEDOT:PSS).
  • a nanometer conductive atom such as nano silver
  • a metal such as a carbon nanotube or a silver paste
  • a poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid Poly(3). , 4– Liquid conductive material such as ethylenedioxythiophene) poly (styrene sulfonate), PEDOT:PSS).
  • a touch device includes a touch panel module, the touch panel module includes a sensing layer disposed on a substrate, and a first adhesive layer is located at the sensing Above the layer; and an anti-interference conductive layer directly formed on the first adhesive layer, and an electronic component, and a second adhesive layer between the anti-interference conductive layer and the electronic component.
  • the electronic component comprises a display module or a circuit board.
  • the touch panel module further includes a protective layer between the first adhesive layer and the sensing layer.
  • the touch panel module further includes a flat layer between the substrate and the sensing layer.
  • the touch panel module further includes a light shielding frame between the substrate and the sensing layer.
  • the anti-interference conductive layer material is selected from indium tin oxide (Indium Tin Oxides, ITO), Indium Zinc Oxide (IZO), Aluminum Zinc Oxide (Zinc oxide doping 3 oxidation 2 Aluminium, AZO) and other solid conductive materials.
  • ITO Indium Tin Oxides
  • IZO Indium Zinc Oxide
  • Zinc oxide doping 3 oxidation 2 Aluminium, AZO Aluminum Zinc Oxide
  • the anti-interference conductive layer material is selected from a nanometer conductive atom such as nano silver, a metal such as a carbon nanotube or a silver paste, or a poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (Poly(3). , 4– Liquid conductive material such as ethylenedioxythiophene) poly (styrene sulfonate), PEDOT:PSS).
  • a nanometer conductive atom such as nano silver
  • a metal such as a carbon nanotube or a silver paste
  • a poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid Poly(3). , 4– Liquid conductive material such as ethylenedioxythiophene) poly (styrene sulfonate), PEDOT:PSS).
  • a method for fabricating a touch device includes the steps of: forming a sensing layer on a substrate; forming a first adhesive layer on the sensing layer; and forming a The anti-interference conductive layer is on a first adhesive layer.
  • the method for fabricating the touch panel module further includes forming an electronic component located above the anti-interference conductive layer and forming a second adhesive layer between the electronic component and the anti-interference conductive layer.
  • the electronic component includes a display module or a circuit board
  • the method for fabricating the touch panel module further includes forming a protective layer between the first adhesive layer and the sensing layer.
  • the method for fabricating the touch panel module further includes forming a flat layer between the substrate and the sensing layer.
  • the method for manufacturing the touch panel module further includes forming a light shielding frame between the substrate and the sensing layer.
  • the anti-interference conductive layer material is selected from indium tin oxide (Indium Tin Oxides, ITO), Indium Zinc Oxide (IZO), Aluminum Zinc Oxide (Zinc oxide doping 3 oxidation 2 Aluminium, AZO) and other solid conductive materials.
  • the anti-interference conductive layer material is selected from nanometer conductive atoms such as nano silver, metal such as carbon nanotubes, silver paste or poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (Poly(3,4–) Liquid conductive material such as ethylenedioxythiophene) poly (styrene sulfonate), PEDOT:PSS).
  • the method for manufacturing the touch panel module further includes performing a pre-processing step on the first adhesive layer.
  • the pretreatment step includes a deep ultraviolet light irradiation step, a shallow ultraviolet light irradiation step or a plasma treatment step.
  • the deep ultraviolet light irradiation step and the light ultraviolet light irradiation step have a light source wavelength of 160 to 190 nm and an irradiation time of 180 to 240 seconds.
  • the plasma treatment step comprises: introducing 100-140 ml of argon gas and 60-100 ml of oxygen per minute, the pressure is between 35 and 55 Pa, and the plasma treatment step is 800 to 1000 seconds.
  • the anti-interference conductive layer forming step includes: forming the liquid conductive material anti-interference conductive layer on the first adhesive layer. Further comprising performing a pretreatment step on the liquid conductive material.
  • the pretreatment step includes incorporating a cosolvent into the liquid conductive material.
  • the cosolvent includes ethanol and dimethyl sulfoxide. The volume ratio of the liquid conductive material to the co-solvent is 1:1 to 4.
  • the touch device and the manufacturing method thereof include a touch panel module, and an anti-interference conductive layer is directly formed on the adhesive layer of the touch panel module, so that the touch panel module directly has the capability of resisting electromagnetic interference.
  • an anti-electromagnetic interference function component having a carrier it is not necessary to additionally attach an anti-electromagnetic interference function component having a carrier. Therefore, the thickness of the touch device is reduced and the process steps are simplified.
  • FIG. 1 is a cross-sectional view showing the structure of a touch panel module according to a first preferred embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the structure of a touch panel module according to a second preferred embodiment of the present invention.
  • FIG 3 is a cross-sectional view showing the structure of a touch panel module according to a third preferred embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing the structure of a touch panel module according to a fourth preferred embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing the structure of a touch device according to a preferred embodiment of the present invention.
  • FIG. 6 is a flow chart showing a method of fabricating the touch device of FIG. 5 according to the present invention.
  • FIG. 1 is a cross-sectional view showing the structure of a touch panel module according to a first preferred embodiment of the present invention.
  • the touch panel module 10 includes a substrate 12 , a sensing layer 14 , a first adhesive layer 20 , and an anti-interference conductive layer 22 .
  • the substrate 12 can be a variety of transparent or opaque materials, not limited to rigid substrates or flexible substrates, such as glass, polycarbonate (polycarbonate, PC), polyethylene terephthalate (PET), polymethylmesacrylate, PMMA), polysulfone (PES) or other cyclic olefin copolymer.
  • the sensing layer 14 is formed on the substrate 12, wherein the sensing layer 14 includes a plurality of first electrodes along a first direction and a plurality of second electrodes arranged along a second direction, and a plurality of wires respectively connected to the first electrode and The second electrode is electrically connected, and the other end of the wire is connected to an external processor, but the structure of the sensing layer 14 is not limited thereto.
  • the sensing layer 14 further includes a first adhesive layer 20, and an anti-interference conductive layer 22 is disposed on the first adhesive layer 20.
  • the first adhesive layer 20 can be a photo-curing adhesive, a wet-solid adhesive, a thermosetting adhesive or other adhesive for bonding.
  • the anti-interference conductive layer 22 may be a solid film layer and adhered to the first adhesive layer 20, or may be formed on the first adhesive layer 20 by spin coating, plating, sputtering, printing or the like.
  • the anti-interference conductive layer 22 may include a solid conductive material or a liquid conductive material.
  • the solid conductive material may be, for example, indium tin oxide (Indium) Tin Oxides, ITO), Indium Zinc Oxide (IZO), Aluminum Zinc Oxide (Zinc oxide doping 3) Oxidation 2 aluminium, AZO);
  • the liquid conductive material may be, for example, a nano-conductive atom such as nano-silver, a carbon nanotube, a poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (Poly(3,4–) Ethylenedioxythiophene) poly (styrene sulfonate), PEDOT: PSS), or metal such as silver paste.
  • the anti-interference conductive layer 22 is directly formed on the first adhesive layer 20, so the touch panel module 10 itself has the function of resisting electromagnetic interference.
  • touch panel module 10 of the present embodiment can be selectively added to other components, and has different embodiments.
  • different embodiments of the present invention will be described, in order to highlight differences between the embodiments, The same components are denoted by the same reference numerals, and the manufacturing method and materials thereof are the same as those described in the first preferred embodiment, and are not described again.
  • the touch panel module 10 ⁇ includes a substrate 12, a sensing layer 14, a first adhesive layer 20, and an anti-interference conductive layer 22.
  • a protective layer 24 may be further included between the first adhesive layer 20 and the sensing layer 14.
  • the protective layer 24 is typically an insulating film that covers and protects the sensing layer 14 from physical or chemical changes.
  • the material of the protective layer 24 is selected from the group consisting of polyimide (PI), ink, silicon nitride (S3N4) or silicon dioxide (SiO2), etc., but the material range of the implementation is not limited to the foregoing materials. It is worth noting that the protective layer 24 is implemented according to the actual application. The remaining components are the same as the first preferred embodiment, and are not described herein again.
  • FIG. 3 is a cross-sectional view showing a structure of a touch panel module according to a third preferred embodiment of the present invention.
  • the touch panel module 10 ⁇ ⁇ includes a substrate 12, a sensing layer 14, a first adhesive layer 20, and an anti-interference conductive layer 22. .
  • the difference from the first preferred embodiment is that the present embodiment further includes a flat layer 18 between the sensing layer 14 and the substrate 12.
  • the flat layer 18 is preferably formed of a non-conductive material, covering one of the upper surface or the lower surface of the substrate 12, or covering both the upper surface and the lower surface of the substrate to solve the unevenness of the upper surface or the lower surface of the substrate 12.
  • the sensing layer 14 can be formed on a flat surface.
  • the flat layer 18 may be, for example, a smooth layer formed of a polymer, such as polyimide (PI), or may be formed of an inorganic material such as silicon nitride (Si 3 N 4 ) or silicon dioxide (SiO 2 ).
  • PI polyimide
  • Si 3 N 4 silicon nitride
  • SiO 2 silicon dioxide
  • the invention does not limit the material of the planar layer 18. It is to be noted that the present embodiment can also be combined with the second preferred embodiment. That is, the touch panel module 10 ⁇ ⁇ of the embodiment can also be combined with the second preferred embodiment, that is, the embodiment.
  • a protective layer 24 is disposed between the first adhesive layer 20 and the sensing layer 14. The remaining components are the same as the first preferred embodiment, and are not described herein again.
  • FIG. 4 is a cross-sectional view showing a structure of a touch panel module according to a fourth preferred embodiment of the present invention.
  • the touch panel module 10 ⁇ ⁇ ⁇ includes a substrate 12, a sensing layer 14, a first adhesive layer 20, and an anti-interference conductive layer. twenty two.
  • the difference between this embodiment and the first preferred embodiment is that, in this embodiment, between the sensing layer 14 and the substrate 12, the light shielding frame 16 is generally composed of an opaque material, such as a dark color.
  • the photoresist or the like covers the peripheral area of the substrate 12, and can shield other electronic components such as wires and the like located above the light shielding frame 16 so as not to be exposed to the user interface, thereby achieving an aesthetic effect.
  • the touch panel module 10 ⁇ ⁇ ⁇ of the embodiment may also include a The protective layer 24 is located between the first adhesive layer 20 and the sensing layer 14, or a flat layer 18 is located between the sensing layer 14 and the substrate 12, wherein the flat layer 18 can cover the substrate 12 and the light shielding frame 16, or only The central area of the substrate 12 is covered without extending over the light-shielding frame 16 such that the top of the light-shielding frame 16 is flush with the top of the flat layer 18.
  • the remaining components are the same as the first preferred embodiment, and are not described herein again.
  • the protective layer 24, the light-shielding frame 16 and the flat layer 18 described in the above embodiments can be freely and selectively added to the touch panel module 10 of the present invention according to an actual manufacturing process, and various combinations thereof belong to the present invention. Covered by the scope.
  • the touch panel module 10 mentioned above may have only one substrate 12, that is, the substrate 12 may be a glass cover substrate of a general touch device, and the sensing layer 14 is directly formed on the substrate 12, that is, the touch glass. Integration On lens, TOL) structure.
  • the touch panel module 10 itself has an anti-electromagnetic interference function, and the touch panel module 10 can be independent. It can be easily combined with other electronic components to become a touch device, and it is not necessary to additionally attach a component with an anti-electromagnetic interference function of a carrier.
  • FIG. 5 is a cross-sectional view showing the structure of a touch device according to a preferred embodiment of the present invention.
  • FIG. 1 A schematic cross-sectional view of a touch device according to a preferred embodiment of the present invention is shown in FIG.
  • the touch device 30 includes a touch panel module 10 , a second adhesive layer 34 , and an electronic component 32 .
  • the second adhesive layer 34 is disposed between the touch panel module 10 and the electronic component 32 and is used to fit the touch panel module 10 and the electronic component 32.
  • the touch panel module 10 is disposed on the electronic component 32 for use as a touch input device.
  • the touch panel module 10 with electromagnetic interference resistance is combined with other electronic components 32 to form a complete touch device 30.
  • the electronic component 32 is, for example, a display module, and may include a liquid crystal layer, a color filter layer, a circuit board, or a backlight module. It is not limited to when applied to non-displays.
  • the substrate 12 needs to be a transparent substrate, and the sensing layer 14 also needs to be composed of transparent electrodes.
  • the anti-interference conductive layer of the touch panel module 10 of the present invention has been directly fabricated on the first adhesive layer 20, and the structure can be simply combined with other electronic components, and only the touch panel module 10 and the electronic component 32 are required to be combined. A second adhesive layer 34 may be applied between them.
  • the touch panel module 10 is combined with the electronic component 32, but the touch panel module according to the second to fourth preferred embodiments of the present invention is 10 ⁇ , 10 ⁇ ⁇ or 10 ⁇ ⁇ ⁇ . It is also possible to combine with the electronic component 32 to form a touch device of different implementations. It is to be understood that combinations of the various embodiments are also within the scope of the present invention.
  • FIG. 6 is a flow chart showing a method for fabricating the touch device of FIG. 5 according to the present invention.
  • the manufacturing method mainly includes the step S10: providing a substrate 12, the steps are as follows. S12: forming a sensing layer 14 on the substrate 12, step S14: forming a first adhesive layer 20 on the sensing layer 14, and step S16: forming an anti-interference conductive layer 22 on the first adhesive layer 20, wherein the anti-interference
  • the material of the conductive layer 22 may be a solid conductive material or a liquid conductive material.
  • the anti-interference conductive layer 22 when the anti-interference conductive layer 22 is made of a solid conductive material, it may be directly formed on the surface of the first adhesive layer 20 by sputtering, plating, or film bonding. However, the surface of the first adhesive layer 20 is highly viscous. In order to facilitate the formation of the anti-interference conductive layer 22 or to avoid surface unevenness caused by the anti-interference conductive layer 22, the present invention may also first perform the first adhesive layer 20. After the pretreatment, the anti-interference conductive layer 20 of the solid conductive material is formed on the surface of the first adhesive layer 20.
  • the pretreatment method of the first adhesive layer 20 may be at least one of a deep ultraviolet light irradiation method, a shallow ultraviolet light irradiation method, or a plasma treatment.
  • the wavelength of the light source in the deep ultraviolet light irradiation step or the shallow ultraviolet light irradiation step is preferably between 160 nm and 190 nm, and the irradiation time is preferably between 180 and 240 seconds.
  • the first adhesive layer 20 is pretreated by using a plasma treatment step, it is preferred to pass 100-140 ml of argon gas and 60-100 ml of oxygen per minute, the ambient pressure is between 35 and 55 Pa, and the electricity is supplied.
  • the slurry processing step time is 800 to 1000 seconds, but the above parameters are only preferred data of the embodiment, and the present invention is not limited to this parameter.
  • the liquid material of the anti-interference conductive layer 22 is incompatible with the adhesive which is adhesive to the surface of the first adhesive layer 20, and thus cannot be directly formed on the first adhesive layer 20 without any treatment.
  • the present invention can perform the pretreatment of the first method on the first adhesive layer 20.
  • the present invention may also pretreat the anti-interference conductive layer 22 of the liquid conductive material, including mixing a co-solvent in the conductive liquid, for example, when the main component of the conductive liquid is highly conductive.
  • the cosolvent is preferably ethanol and dimethyl sulfoxide (Dimethyl) Sulfoxide, DMSO), wherein the conductive liquid: ethanol: dimethyl sulfoxide is preferably disposed between 1:1 and 3: 0.1 to 0.5.
  • the cosolvent can also be ethanol and dimethyl sulfoxide, wherein the volume ratio of the conductive liquid: ethanol: dimethyl sulfoxide is preferably between 1 and 1. :1 ⁇ 3: between 0.3 ⁇ 0.8. Therefore, as a whole, the volume ratio of the conductive liquid: co-solvent is between 1:1 and 4.
  • the above is only the solution configuration ratio of the preferred embodiment of the present invention, and other ratios of different variations are also within the scope of the present invention.
  • the liquid material of the anti-interference conductive layer 22 can be applied to the first adhesive layer 20 after being uniformly stirred and filtered.
  • the conductive liquid is applied to the first adhesive layer 20 by direct coating, spin coating, electroplating, printing or the like, an additional film forming step is required to form the anti-interference conductive layer 22 liquid conductive material to form the anti-interference conductive layer 22.
  • the film forming step varies according to the composition of the liquid conductive material of the anti-interference conductive layer 22.
  • the conductive liquid when the conductive liquid contains PEDOT:PSS, it can be placed in a vacuum environment for 5-20 minutes to dry, or 30-100. The temperature of °C is heated for about 10 to 50 minutes. When the conductive liquid contains nano silver, it is preferably heated at a temperature of 60 to 150 ° C for about 90 to 120 minutes.
  • the pretreatment step of the first adhesive layer 20 and the pretreatment step of the liquid conductive material of the anti-interference conductive layer 22 are not the same, but the order is not limited. The invention can be carried out from either one of the two to facilitate the formation of the anti-interference conductive layer 22 on the first adhesive layer 20. Of course, both are preferably carried out, and the invention is not limited thereto.
  • the above manufacturing method can selectively form a light-shielding frame between the substrate and the sensing layer, and the light-shielding frame covers the peripheral region of the substrate, so as to shield the excess light and the aesthetic effect. And selectively forming a flat layer on the upper surface or the lower surface of the substrate to solve the problem of unevenness of the substrate surface.
  • the light-shielding frame and the flat layer can be formed separately without coexisting at the same time.
  • a protective layer is selectively formed between the sensing layer and the first adhesive layer to protect the sensing layer from chemical changes or physical damage.
  • the invention is not limited to the formation of the light shielding frame, the flat layer and the protective layer.
  • the protective layer, the light-shielding frame and the flat layer described in the above embodiments can be freely and selectively added to the touch panel module of the present invention according to an actual manufacturing process, and various combinations thereof are within the scope of protection of the present invention.
  • the material selection and the manufacturing method of the light-shielding frame, the flat layer, and the protective layer are the same as those described in the second embodiment to the fourth embodiment of the present invention, and are not described herein again.
  • the above steps S10 to S16 are the flow of steps for fabricating the touch panel module of the first preferred embodiment of the present invention.
  • the method further includes the step S20: forming a second adhesive layer on the anti-interference conductive layer, and step S22: forming an electronic component on the second adhesive layer.
  • the touch panel module is combined with the electronic component to complete a touch device.
  • the touch device can also be combined with the above-mentioned light shielding frame, flat layer or protective layer.
  • the touch device of the present invention can be, for example, a touch display panel or other non-transparent touch device.
  • the layers of the touch panel module include a substrate, a sensing layer, a first adhesive layer, and an anti-reflection device.
  • the interference conductive layer is preferably made of a transparent material to achieve a light transmissive effect, and conversely, when applied to other touch devices, there is no such limitation.
  • the materials, the manufacturing methods, the manufacturing parameters, and the like mentioned in the above steps are the same as those described in the first to fourth preferred embodiments of the present invention, and are not described herein again.
  • the anti-interference conductive layer is directly formed on the adhesive layer of the touch panel module provided by the present invention, so that the touch panel module directly has anti-electromagnetic interference function, and the touch panel module can be independently manufactured, and Simple to combine with other components. For example, it can be combined with a display device or a circuit board, and when combined, there is no need to additionally attach a component having an anti-electromagnetic interference layer function of a carrier, which can reduce the thickness of the touch device and save the process steps.

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Abstract

本发明涉及触控技术领域，提供了一种触控面板模块，包括一基板，一感应层，位于该基板之上，一第一胶层，位于该感应层之上，以及一抗干扰导电层，位于该第一胶层之上。此外，本发明还提供一种触控装置及触控面板模块的制造方法。本发明的触控面板模块可独立制作，并具有抗电磁干扰的功能，可简单与其他电子组件结合成为触控装置，降低触控装置的厚度且减少制程步骤。

Description

触控面板模块、触控装置及其制作方法 技术领域
本发明涉及触控技术领域，且特别是一种触控面板模块、触控装置及其制作方法。
背景技术
在现今各式消费性电子产品的市场中，个人数字助理(PDA)、移动电话(mobile Phone)、笔记本电脑(notebook)及平板计算机(tablet PC)等可携式电子产品皆已广泛的使用触控面板(touch panel)作为其数据沟通的接口工具。此外，由于目前电子产品的设计皆以轻、薄、短、小为方向，因此在产品的设计上会希望能省略如键盘、鼠标等传统输入设备，尤其在讲求人性化设计的平板计算机需求的带动下，触控式面板已经一跃成为关键的零组件之一。
通常，将触控面板配置在电子组件上使用，由于触控面板在使用是容易受到外界电磁干扰或电子组件间会产生电磁噪声而互相干扰，因此如何有效抗电磁干扰增进稳定度，已成为一重要课题，目前的触控面板模块通常会另加上一抗电磁干扰层以避免电磁干扰，但该抗电磁干扰层通常为一制作于载板上的抗干扰导电层，因此加上抗电磁干扰层也同时会增加整体触控面板的厚度，并且使制程步骤更为复杂。
发明内容
因此，若能于制作触控面板模块时，先将具有抗电磁干扰作用的抗干扰导电层先行制作于胶层上，后续组装时就不需要另外再结合一抗电磁干扰层，可节省制程步骤。
根据本发明的一实施例，本发明提供一种触控面板模块，包含一感应层，位于一基板之上；一第一胶层，位于该感应层之上；以及一抗干扰导电层，直接形成于该第一胶层上。
进一步的，该触控面板模块更包括一保护层，位于该第一胶层与该感应层之间。
进一步的，该该触控面板模块更包括一平坦层，位于该基板与该感应层之间。
进一步的，该该触控面板模块更包括一平坦层，位于该基板与该感应层之间。
进一步的，该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。
进一步的，该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
根据本发明的另一实施例，本发明提供一种触控装置，包含一触控面板模块，该触控面板模块包括一感应层，位于一基板之上；一第一胶层，位于该感应层之上；以及一抗干扰导电层，直接形成于该第一胶层上，还有一电子组件，以及一第二胶层，位于该抗干扰导电层与该电子组件之间。
进一步的，该电子组件包括一显示模块或是一电路板。
进一步的，该触控面板模块更包括一保护层，位于该第一胶层与该感应层之间。
进一步的，该触控面板模块更包括一平坦层，位于该基板与该感应层之间。
进一步的，该触控面板模块更包括一遮光框，位于该基板与该感应层之间。
进一步的，该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。
进一步的，该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸 (Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
根据本发明的另一实施例，本发明提供一种触控装置的制作方法，包含以下步骤：形成一感应层于一基板上；形成一第一胶层于该感应层之上；以及形成一抗干扰导电层于一第一胶层上。
进一步的，该触控面板模块制作方法更包括形成一电子组件，位于该抗干扰导电层之上方，且形成一第二胶层于该电子组件与该抗干扰导电层之间。该电子组件包括一显示模块或是一电路板
进一步的，该触控面板模块制作方法更包括形成一保护层于该第一胶层与该感应层之间。
进一步的，该触控面板模块制作方法更包括形成一平坦层于该基板与该感应层之间。
进一步的，该触控面板模块制作方法更包括形成一遮光框于该基板与该感应层之间。
进一步的，该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
进一步的，该触控面板模块制作方法更包对该第一胶层进行一预处理步骤。该预处理步骤包括一深紫外光照射步骤，一浅紫外光照射步骤或是一电浆处理步骤。该深紫外光照射步骤与该浅紫外光照射步骤之光源波长介于160～190奈米，照射时间介于180～240秒。该电浆处理步骤包括：每分钟通入100～140毫升的氩气与60～100毫升的氧气，压力介于35～55帕,且进行电浆处理步骤时间为800~1000秒。
进一步的，该抗干扰导电层形成步骤包括：形成该液体导电材料抗干扰导电层于该第一胶层上。更包括对该液体导电材料进行一预处理步骤。该预处理步骤包括掺入一共溶剂于该液体导电材料中。该共溶剂包括乙醇与二甲基亚砜。该液体导电材料与共溶剂体积比值为1：1～4。
本发明提供的触控装置与其制作方法，包含有一触控面板模块，该触控面板模块之胶层上直接形成一抗干扰导电层，可使得触控面板模块直接具有抗电磁干扰的能力，在组合触控装置时，不需另外再贴上具有一载板的抗电磁干扰功能的组件。因此，减少触控装置的厚度，并简化制程步骤。
附图说明
图1绘示本发明第一较佳实施例的触控面板模块结构剖面示意图。
图2绘示本发明第二较佳实施例的触控面板模块结构剖面示意图。
图3绘示本发明第三较佳实施例的触控面板模块结构剖面示意图。
图4绘示本发明第四较佳实施例的触控面板模块结构剖面示意图。
图5绘示本发明一较佳实施例之触控装置的结构剖面示意图。
第6图绘示本发明图5之触控装置制作方法的流程图。
具体实施方式
为使熟习本发明所属技术领域之一般技艺者能更进一步了解本发明，下文特列举本发明之较佳实施例，并配合所附图式，详细说明本发明的构成内容及所欲达成之功效。
为了方便说明，本发明之各图式仅为示意以更容易了解本发明，其详细的比例可依照设计的需求进行调整。在文中所描述对于图形中相对组件之上下关系，在本领域之人皆应能理解其系指对象之相对位置而言，因此皆可以翻转而呈现相同之构件，此皆应同属本说明书所揭露之范围，在此容先叙明。
请参考图1，图1绘示本发明第一较佳实施例的触控面板模块结构剖面示意图。如图1所示，触控面板模块10包含有一基板12，感应层14、第一胶层20以及抗干扰导电层22。基板12可为各种透明或不透明材质，不限于硬质基板或是可挠式基板，例如玻璃、聚碳酸脂（polycarbonate, PC）、聚对苯二甲酸乙二脂(polyethylene terephthalate, PET)、聚甲基丙烯酸甲脂(polymethylmesacrylate, PMMA)、聚砜(Polysulfone, PES)或其他环烯共聚物（cyclic olefin copolymer）等。
感应层14形成于基板12上，其中，感应层14包括复数条沿一第一方向的第一电极与复数条沿一第二方向排列的第二电极，以及复数条导线分别与第一电极以及第二电极电性连接，导线的另一端与一外部的处理器相连，但感应层14的结构并不以此为限。
之后，感应层14之上，更包括有一第一胶层20，以及一抗干扰导电层22位于第一胶层20之上。第一胶层20可为光固胶、湿固胶、热固胶或是其他用于黏合的胶。抗干扰导电层22可为一固状的膜层，并贴合于第一胶层20上，或是以旋转涂布、电镀、溅镀、印刷或其他方式形成于第一胶层20上。抗干扰导电层22可以包括固体导电材料或是液体导电材料。其中固体导电材料例如可以是铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)；液体导电材料例如可以是奈米银等奈米导电原子，奈米碳管、聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS)，或者银浆等金属等。由于本实施例中，抗干扰导电层22直接制作于第一胶层20上，因此触控面板模块10本身即具有抗电磁干扰的作用。
此外，本实施例的触控面板模块10更可选择性地加入其他组件，而具有不同的实施例，以下将针对本发明不同实施例进行说明，其中为突显各实施例之间的不同处，相同的组件以相同之标号表示，其制作方法与材料与第一较佳实施例所述相同，并且不另外赘述。
本发明第二较佳实施例之触控面板模块结构剖面示意图，如图2所示，触控面板模块10´包含有一基板12，感应层14、第一胶层20以及抗干扰导电层22。与第一较佳实施例不同之处在于,第一胶层20与感应层14之间，更可包含有一保护层24。保护层24通常为一绝缘薄膜，覆盖并保护感应层14受到物理或是化学变化而被破坏。保护层24的材料选自聚酰亚胺（Polyimide，PI）、油墨、氮化硅（S3N4）或二氧化硅（SiO2）等，但实施的材料范围不以前述材料为限。值得注意的是，保护层24根据实际应用选择实施。其余组件与第一较佳实施例相同，在此不再赘述。
本发明第三较佳实施例之触控面板模块结构剖面示意图，如图3所示，触控面板模块10´´包含有一基板12，感应层14、第一胶层20以及抗干扰导电层22。与第一较佳实施例不同之处在于，本实施例在感应层14与基板12之间，更包括一平坦层18。平坦层18较佳由非导电材质所形成，覆盖于基板12之一上表面或是下表面，也可同时覆盖基板的上表面以及下表面,以解决基板12上表面或下表面的不平整问题，使得感应层14可形成于一平坦表面上。平坦层18例如可以是以聚合物形成的平滑层，例如聚亚酰胺（polyimide，PI），也可以使以无机材料形成的，例如氮化硅（Si3N4）或是二氧化硅（SiO2）,本发明并不限定平坦层18的材料。值得注意的是，本实施例也可与第二较佳实施例互相结合，也就是说，本实施例的触控面板模块10´´也可与第二较佳实施例结合，即本实施例具有一保护层24位于第一胶层20与感应层14之间。其余组件与第一较佳实施例相同，在此不再赘述。
本发明第四较佳实施例之触控面板模块结构剖面示意图，如图4所示，触控面板模块10´´´包含有一基板12，感应层14、第一胶层20以及抗干扰导电层22。本实施例与第一较佳实施例不同之处在于，本实施例中，位在感应层14与基板12之间，更包括一遮光框16，遮光框16通常由不透明材质所组成，例如暗色光阻等，并覆盖基板12的周边区域，可遮蔽位于遮光框16之上的其他电子组件如导线等，使之不曝露于用户接口中，达到美观效果。值得注意的是，本实施例也可与本发明第二较佳实施例或是第三较佳实施例互相结合，因此，本实施例所述的触控面板模块10´´´也可包含有一保护层24位于第一胶层20与感应层14之间，或是一平坦层18位于感应层14与基板12之间，其中平坦层18可覆盖于基板12以及遮光框16上，或是仅覆盖基板12中央区域，而不延伸至遮光框16上，使得遮光框16的顶部与平坦层18的顶部齐平。其余组件与第一较佳实施例相同，在此不再赘述。
上述各实施例中所述的保护层24、遮光框16以及平坦层18，可依实际制作流程，自由选择性地加入本发明的触控面板模块10中，其各种组合皆属于本发明所涵盖的范围内。此外，上述所提及的触控面板模块10可以仅有一基板12，即该基板12可为一般触控装置的玻璃上盖基板，而感应层14直接制作于基板12上，也就是触控玻璃一体化(touch on lens, TOL)结构。
本发明的特征在于，触控面板模块10之第一胶层20上直接形成一抗干扰导电层22，因此触控面板模块10本身具有抗电磁干扰的功能，此外，触控面板模块10可独立制作，并可方便与其他电子组件结合成为触控装置，结合时也不需要另外再贴上具有一载板的抗电磁干扰功能的组件。
上述第一～第四较佳实施例中的触控面板模块10～10´´´皆可与一电子组件结合，成为一触控装置。在此以触控面板模块10与电子装置的结合举例说明，图5绘示本发明一佳实施例之触控装置的结构剖面示意图。
本发明一佳实施例之触控装置的结构剖面示意图，如图5所示。本实施例提供一种触控装置30，包含一触控面板模块10、第二胶层34以及电子组件32。其中第二胶层34置于触控面板模块10和电子组件32之间，并用于贴合触控面板模块10和电子组件32。
触控面板模块10配置于电子组件32上作为触控输入设备使用。本实施例将具有抗电磁干扰的触控面板模块10与其他电子组件32结合，进而形成一完整的触控装置30。当触控装置30应用于显示器例如为触控显示面板时,电子组件32例如为一显示模块，可以包含有液晶层、彩色滤光层、电路板或是背光模块等，而当触控装置30应用于非显示器时不以此为限。在此请注意，当电子组件32为显示面板时,基板12需为透明基板，且感应层14也需由透明电极所组成。
本发明所提出的触控面板模块10抗干扰导电层已经直接制作于第一胶层20上，且结构可简单与其他电子组件组合，组合时也仅需于触控面板模块10与电子组件32之间涂布一第二胶层34即可。在组合触控装置时，不需另外再贴上具有一载板的抗电磁干扰功能的组件，可降低整体触控装置32的厚度，并且减少制程步骤。当然，本实施例中虽以触控面板模块10结合电子组件32为例，但本发明第二～第四较佳实施例所述的触控面板模块10´、10´´或10´´´也可与电子组件32结合成为不同实施态样的触控装置，可理解的是，各实施例彼此间的组合也属于本发明所涵盖的范围内。
上述各实施例所述的触控面板模块以及触控装置可透过本发明提供的制作方法来形成。请合并参阅图1、图5和第6图所示，其中第6图绘示本发明图5之触控装置之制作方法的流程图,该制作方法主要包括步骤S10：提供一基板12，步骤S12：形成一感应层14于基板12上，步骤S14：形成一第一胶层20于感应层14上，以及步骤S16：形成一抗干扰导电层22于第一胶层20上，其中抗干扰导电层22的材料可选用固体导电材料或液体导电材料。
一般来说，当抗干扰导电层22选用固体导电材料时，可以直接通过溅镀、电镀、膜层贴合的方式形成于第一胶层20表面上。但第一胶层20的表面黏性较高，为了利于抗干扰导电层22的形成,或是避免抗干扰导电层22产生表面不平整的问题,本发明也可以先对第一胶层20进行一预处理后再将固体导电材料的抗干扰导电层20形成于第一胶层20表面上。第一胶层20的预处理方法可选用一深紫外光照射方法、一浅紫外光照射方法或是一电浆处理中至少一种。其中深紫外光照射步骤或是浅紫外光照射步骤的光源波长较佳介于160奈米～190奈米之间，照射时间则较佳介于180～240秒之间。当使用电浆处理步骤对第一胶层20进行预处理时，较佳每分钟通入100～140毫升的氩气与60～100毫升的氧气，环境压力介于35～55帕，且进行电浆处理步骤时间为800～1000秒，不过上述参数仅为本实施例较佳实作数据，本发明并不以此参数为限。
当抗干扰导电层22选用液体导电材料时，抗干扰导电层22液体材料因与第一胶层20表面具黏性的胶不兼容，故无法不经过任何处理直接形成于第一胶层20上。本发明可以对第一胶层20进行上述方法的预处理。除了对第一胶层进行预处理外，本发明也可以对液体导电材料的抗干扰导电层22采用预处理，包括混入一共溶剂于导电液中，举例来说，当导电液主要成分为高导电分子(例如为PEDOT：PSS)时，共溶剂较佳为乙醇与二甲基亚砜(Dimethyl sulfoxide, DMSO)，其中导电液：乙醇：二甲基亚砜相互间配置的体积比例较佳介于1：1~3：0.1~0.5之间。当抗干扰导电层22液体材料主要成分为奈米银时，共溶剂同样可为乙醇与二甲基亚砜，其中导电液：乙醇：二甲基亚砜相互间配置的体积比例较佳介于1：1~3：0.3~0.8之间。所以整体而言，导电液：共溶剂的体积比值约1：1~4之间。然而，上述仅为本发明较佳实施方式的溶液配置比率，其他不同变化的比率也属本发明所涵盖的范围之内。抗干扰导电层22液体材料以一定比率配置完成后,经搅拌均匀与过滤后，即可涂布于第一胶层20上。导电液以直接涂布、旋转涂布、电镀、印刷或其他方式涂于第一胶层20上后，需另外进行一成膜步骤使抗干扰导电层22液体导电材料形成抗干扰导电层22。成膜步骤依照抗干扰导电层22液体导电材料组成分不同而有所变化，例如当导电液包含有PEDOT：PSS时，可选择于真空环境下放置5～20分钟干燥，或是以30～100℃的温度加热大约10～50分钟。而当导电液包含有奈米银时，较佳以60～150℃的温度加热大约90～120分钟。另外值得注意的是，上述对第一胶层20进行的预处理步骤以及抗干扰导电层22液体导电材料进行的预处理步骤并不相同，但其先后顺序并无限制。本发明可从两者选择其中之一进行，以促进抗干扰导电层22于第一胶层20上的成型，当然最佳的是两者皆进行，本发明并不以此为限。
此外，上述的制作方法更可选择性地形成一遮光框于基板以及感应层之间，且遮光框覆盖基板的周边区域，可达到遮蔽多余光线与美观作用。以及选择性形成一平坦层位于基板之上表面或下表面，以解决基板表面不平整的问题。值得注意的是，本案中遮光框与平坦层可以分别形成而不需要同时并存。另外还有选择性地形成一保护层位于感应层与第一胶层之间，以保护感应层避免受到化学变化或是物理作用而损害。当然，关于遮光框、平坦层与保护层的形成与否，本发明并不以此为限。上述各实施例中所述的保护层、遮光框以及平坦层，可依实际制作流程，自由选择性地加入本发明的触控面板模块中，其各种组合皆属于本发明所保护的范围内。而此处所述之遮光框、平坦层以及保护层，其材料选择以及制作方法等，皆与本发明第二图～第四图较佳实施例所述相同，在此不再赘述。
上述步骤S10~S16为制作本发明第一较佳实施例的触控面板模块之步骤流程。此外，在完成触控面板模块之后，更包括步骤S20：形成一第二胶层于抗干扰导电层上，以及步骤S22：形成一电子组件于第二胶层上。将触控面板模块与电子组件结合，完成一触控装置。此外，触控装置也可与上述的遮光框、平坦层或保护层互相组合。本发明的触控装置可例如为触控显示面板或其他非透明触控装置，当应用于触控显示面板时，触控面板模块的各层，包括基板、感应层、第一胶层与抗干扰导电层较佳使用透明材质以达到透光效果，反之，当应用于其他触控装置时则无此限制。上述各步骤所提及的材料与制作方法、制作参数等与本发明第一～第四较佳实施例所述相同，在此不再赘述。
综上所述，本发明所提供的触控面板模块之胶层上直接形成一抗干扰导电层，可使得触控面板模块直接具有抗电磁干扰功能，此触控面板模块可独立制作，并可简单与其他组件结合。例如可与一显示设备或电路板结合，在结合时也不需要额外再贴上具有一载板的抗电磁干扰层功能的组件，可降低触控装置的厚度并节省制程步骤。
以上所述仅为本发明之较佳实施例，凡依本发明申请专利范围所做之均等变化与修饰，皆应属本发明之涵盖范围。

Claims (30)

  1. 一种触控面板模块，其特征在于，包含：
    一感应层，位于一基板之上；
    一第一胶层，位于该感应层之上；以及
    一抗干扰导电层，直接形成于该第一胶层上。
  2. 根据权利要求1所述的触控面板模块，其特征在于,更包括一保护层，位于该第一胶层与该感应层之间。
  3. 根据权利要求1所述的触控面板模块，其特征在于,更包括一平坦层，位于该基板与该感应层之间。
  4. 根据权利要求1所述的触控面板模块，其特征在于,更包括一遮光框，位于该基板与该感应层之间。
  5. 根据权利要求1所述的触控面板模块，其特征在于,该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。
  6. 根据权利要求1所述的触控面板模块，其特征在于,该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
  7. 一种触控装置，包含：
    一触控面板模块，包括一感应层，位于一基板之上；一第一胶层，位于该感应层之上；以及一抗干扰导电层，直接形成于该第一胶层上；
    一电子组件；以及
    一第二胶层，位于该抗干扰导电层与该电子组件之间。
  8. 根据权利要求7所述的触控装置，其特征在于,该电子组件包括一显示模块或是一电路板。
  9. 根据权利要求7所述的触控装置，其特征在于,更包括一保护层，位于该第一胶层与该感应层之间。
  10. 根据权利要求7所述的触控装置，其特征在于,更包括一平坦层，位于该基板与该感应层之间。
  11. 根据权利要求7所述的触控装置，其特征在于,更包括一遮光框，位于该基板与该感应层之间。
  12. 根据权利要求7所述的触控装置，其特征在于,该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。
  13. 根据权利要求7所述的触控装置，其特征在于,该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸 (Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
  14. 一种触控面板模块制作方法，包含：
    形成一感应层于一基板上；
    形成一第一胶层于该感应层之上；以及
    形成一抗干扰导电层于一第一胶层上。
  15. 根据权利要求14所述的触控面板模块制作方法，其特征在于，更包括形成一电子组件，位于该抗干扰导电层之上方，且形成一第二胶层于该电子组件与该抗干扰导电层之间。
  16. 根据权利要求15所述的触控面板模块制作方法，其特征在于，该电子组件包括一显示模块或是一电路板。
  17. 根据权利要求14所述的触控面板模块制作方法，其特征在于，更包括形成一保护层于该第一胶层与该感应层之间。
  18. 根据权利要求14所述的触控面板模块制作方法，其特征在于，更包括形成一平坦层于该基板与该感应层之间。
  19. 根据权利要求14所述的触控面板模块制作方法，其特征在于，更包括，形成一遮光框于该基板与该感应层之间。
  20. 根据权利要求14所述的触控面板模块制作方法，其特征在于，该抗干扰导电层材料选用铟锡氧化物(Indium Tin Oxides, ITO)、铟锌氧化物(Indium Zinc Oxide, IZO)、铝锌氧化物(Zinc oxide doping 3 oxidation 2 aluminium, AZO)等固体导电材料。
  21. 根据权利要求14所述的触控面板模块制作方法，其特征在于，该抗干扰导电层材料选用奈米银等奈米导电原子，奈米碳管、银浆等金属或者聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(Poly(3,4– ethylenedioxythiophene) poly (styrene sulfonate), PEDOT：PSS) 等液体导电材料。
  22. 根据权利要求14所述的触控面板模块制作方法，其特征在于，更包括对该第一胶层进行一预处理步骤。
  23. 根据权利要求122所述的触控面板模块制作方法，其特征在于，该预处理步骤包括一深紫外光照射步骤，一浅紫外光照射步骤或是一电浆处理步骤。
  24. 根据权利要求23所述的触控面板模块制作方法，其特征在于，该深紫外光照射步骤与该浅紫外光照射步骤之光源波长介于160～190奈米，照射时间介于180～240秒。
  25. 根据权利要求23所述的触控面板模块制作方法，其特征在于，该电浆处理步骤包括：每分钟通入100～140毫升的氩气与60～100毫升的氧气，压力介于35～55帕，且进行电浆处理步骤时间为800～1000秒。
  26. 根据权利要求21所述的触控面板模块制作方法，其特征在于，该抗干扰导电层形成步骤包括：形成该液体导电材料抗干扰导电层于该第一胶层上。
  27. 根据权利要求26所述的触控面板模块制作方法，其特征在于，更包括对该液体导电材料进行一预处理步骤。
  28. 根据权利要求27所述的触控面板模块制作方法，其特征在于，该预处理步骤包括掺入一共溶剂于该液体导电材料中。
  29. 根据权利要求28所述的触控面板模块制作方法，其特征在于，该共溶剂包括乙醇与二甲基亚砜。
  30. 根据权利要求28所述的触控面板模块制作方法，其特征在于，该液体导电材料与共溶剂体积比值为1：1～4。
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US9658711B2 (en) 2017-05-23

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