M416813 100-8-29 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種觸控面板，且特別是有關於一種 具有框形圖案層之觸控面板。 【先前技術】 觸控面板(touch panel)為貼附在顯示面板上之裝置，其 功月b為使使用者可透過手指來點選顯示面板上選項，以完 成資料的傳輸或閱讀顯示面板上的訊息。一般而言，在觸 控面板的周圍常設有遮蔽層，以掩蓋遮蔽層下之周邊線 路，從而使觸控面板較為美觀。傳統的做法是，在觸控面 板之外表面上設置遮蔽層，再利用光學膠(〇pticaladhesive) 將保護鏡(cover lens)與遮蔽層貼合。然而，此做法會使得 觸控面板整體厚度增加，故不合乎現今電子產品薄型化的 趨勢。 因此，已有習知技術提出了一種薄型化的觸控面板， 在此薄型化義控面板巾，製造者將遮蔽層整合於觸控面 板内表面，以減少觸控面板整體厚度。然而，由於遮蔽層 是設置在，邊線路上，因此周邊線路與觸控面板内部感測 串列間之高U差㈣較大，域得周邊線路與内部感測 串^間發生開路(覆蓋*良的斷線)之機率增加，進而使得 此薄型=觸控面板的良率下降。承上述，如何開發出一種 可將，蔽層整合於觸控面板内表面且具有高&率之觸控面 板’實為研發者所欲達成的目的。 3 M416813 100-8-29 【新型内容】 f創作提供-種觸控面板’其具有較高之製造良率。 声一種觸控面板，其包括基板、框形圖案 U/、線路層。基板具有觸控區與周邊區， i卜上與觸控區連接。框形圖案層位於基板之周邊 :入觸控區。介電層覆蓋觸控區以及框形圖案層， ”電層具有平㈣上表面。制線路層位於介電層上。 供—種觸控面板，此觸控面板藉由在框形圖 案層”感麟路層間配置具有平坦上表面之透明介電層， ，得第-感測串列（或第二感測串列)與周邊線路間“ 度洛差極小，因此周邊線路可輕易地與第一感測串列（或第 二感測串列)連接。如此—來’在第一感測串列（或第二感 測串列)與周邊線路連接處便;^發生開路(覆蓋不良的斷 線)的情形’進而提升本創作之觸控面板的製造良率。 為讓本創作之上述特徵和優職更鴨雜，下文特舉 實施例，並配合所附圖式作詳細說明如下。 【實施方式】 【第一實施例】 圖1為本創作一實施例之觸控面板100上視示意圖， 而圖2A至圖2G為對應圖丨之區域A所繪示之觸控面板 100製造流程上視示意圖。圖3A至圖3G分別為對應圖2A 至圖2G之剖線Ι-Γ所繪示之觸控面板1〇〇製造流程剖面示 意圖。以下將搭配圖1、圖2A至圖2G以及圖3A至圖3G 對觸控面板1〇〇的製造方法進行詳細之描述。 4 100-8-29 广照®卜首先，提供基板1〇2，此基板ι〇2具有 接工與周邊區112,周邊區R2實質上與觸控區R1連 域if施例中，基板1〇2之觸控區R1可為一矩形區 形區1 2可為一環繞觸控區R1並與其連接之口字 幻-域。然’本創作不限於此’在其他實施例中，觸控區 而你為圓形、擴圓形、多邊形或依照實際的需求 圓产’而周邊區R2之形狀亦可為圓環形、橢 1、工心夕邊形或搭配觸控區R1之形狀做適當的更 ^板1G2可為硬縣板、可撓縣板、印刷電路板或 透:尊板102之材質可為玻璃、石英、有機聚合物' 月導電材料或是其它可剌的材料。 =，請同時參照圖卜圖2Α以及圖3Α，於基板102 形成框形圖案層104,框形圖案層川4環繞 在本實施例中’框形圖案層刚例如為-口字 f層，且覆蓋整個周邊區R2。框形圖案層104係用 邊i路控區幻’並遮蔽周邊區R2上之走線，例如周 104 ® 2Α 3A ° ^ 用以具良好遮光性之材質為佳，例如金屬鉻 、/化物(Cr〇x)或黑色樹脂以及有色樹脂等。 A八ίΓ ’請同時參照圖2B以及圖3B，於基板102上形 104,且介静^ 覆盍觸控區R1以及框形圖案層 此介電# ιηΛ*具有平坦的上表面S。值得—提的是， am ☆ 9 /、有良好的階梯覆蓋性(stePcoverage)及一定 、旱又D❿使件此介電層1〇6在覆蓋觸控區W以及凸 M416813 100-8-29 起於觸控區R1之框形圖案層104後’其上表面s為___ 坦的表面，以利後續感測線路層SL·的形成。介電屛平 材質的選用以具良好的階梯覆蓋性及絕緣性的透明^ 106 如氧化石夕、氮化石夕、氮氧化石夕、透明有機化合物: 透明樹酯或上述至少二種材料的堆疊層等。 接著，於介電層106上形成感測線路層SL , =了本實施例之觸控面板i⑻。在本實施例中，ς 路層SL包括多個彼此電性絕緣之第一感測串列^夕伽 Πϊ絕緣之第二感測串列S2、絕緣圖案層GI^ 電:絕缘路二第一感測串列S1與第二感測串列5 線路=第上且各條周邊 、'J串歹j S1或弟—感測串列S2電性造 =將搭配圖扣至圖2G、以及圖3C至圖太 貫=之感測線路層SL的步驟進行麵之描述，成本 成多====圖二，r—上形 B1是形成在觸控區R1内之:些橋接導線 式排列。第~橋接_ B1 刚上，並以陣列的形 質為佳，例如合金'全屬材=貝，以具良好導電性之材 物、金屬材· ^屬材4鼠化物、金屬材料的氧化 的堆疊層。，’ **氧化物、或是金屬材料與其它導電材料 絕緣==Γ 3板102上形成 暴路出34些第一橋接導線m的兩端m-a。詳細 M416813 100-8-29 而言，本實施例之絕緣圖案層GI例如為多個島狀圖案 GI-a，其中各島狀圖案GI-a覆蓋各第一橋接導線B1的中 間部Bl-b，且暴露出各第一橋接導線B1的兩端Bl-a。然， 本創作不限於此，在其他實施例中，絕緣圖案層GI亦可 為一具有多個孔洞之絕緣層，此絕緣層覆蓋整個基板102 僅透過多個孔洞暴露出各第一橋接導線B1的兩端Bl_a。 在本實施例中，絕緣圖案層GI之材質例如為透明有機化 合物、透明樹脂、氧化矽、氮化矽、氮氧化矽等。 接著，請同時參照圖2E及圖3E，於觸控區R1上形 成多個第一感測墊P1以及多個第二感測串列S2，其中各 第一橋接導線B1透過各第一橋接導線B1的兩端Bl-a與 二相鄰之第一感測墊P1電性連接，而這些第一感測墊P1 與這些第一橋接導線B1構成多個第一感測串列S1。各第 二感測串列S2包括多個第二感測墊P2與多個第二橋接導 線B2，其中各第二橋接導線B2與二相鄰之第二感測墊P2 電性連接，且這些第二橋接導線B2配置於絕緣圖案層GI 上，以使這些第二感測串列S2與這些第一感測串列S1電 性絕緣。 在本實施例中，第一感測串列S1與第二感測串列S2 係交錯配置，換句話說，第一感測串列S1與第二感測串 列S2的延伸方向不平行，較佳的是，第一感測串列S1與 第二感測串列S2的延伸方向垂直。舉例而言，第一感測 串列S1若是沿著Y方向延伸，第二感測串列S2則是沿著 X方向延伸；反之，第一感測串列S1若是沿著X方向延 7 M416813 100-8-29 伸’第二感測串列S2則是沿著γ方向延伸。此外，本實 施例之第一感測墊Ρ1與第二感測墊Ρ2的形狀常為菱形， 以使第—感測墊Ρ1與第二感測墊Ρ2矸以較密集的方式配 置於觸控區Ri中，進而使得觸控面板1〇〇具有較佳的靈 敏度，並使得觸控面板100上之第一感測墊P1與第二感 測墊P2的外輪廓不易被使用者辨識。然，本創作不限於 此在其他實施例中，第一感測塾pl與第二感測塾的 形狀亦可根據實際產品的需求做其他適當設計。 在本實施例中，第一感測串列S1與第二感測串列S2 是，同一道製程形成的，因此本實施例之第一感測串列si 與第二感測串列S2的材質為相同的透明導電感測串列， 其材質包括金屬氧化物’例如是銦錫氧化物、銦鋅氧化物、 紹錫氧化物、轉祕物、錮鍺鋅氧化物、其它合適的氧 化物、或者是上述至少二者之堆疊層。 接者，請同時參照圖2F及圖3F，於介電層1〇6JN 形圖案層104重疊之區域上形成多個周邊線路L。在本4 施例中，各周邊線路L分別與一第一感測塾ρι(或第二名 測墊P2)連接。f特㈣明的是，本實施例之周邊線路l 第-感測墊P1以及第二感測塾？2皆是形成於介電層ι( =平坦上表面S上’因此周邊線路L可輕易地與第一感《 fpl以及第二感測墊p2連接’而不易有開路(覆蓋不良€ 斷線)的問題。因此，本實施例之觸控錄⑽的製造良2 的提昇。周邊線路"之材質，以具_ 性之材貝為佳，例如合金、金屬材料的氮化物、金屬奶 8 M416813 100-8-29 的氧化物、金屬材料的氮氧化物、或是 電材料的堆疊層。 蜀何杆與其它導 此外，本實施例之觸控面板1〇〇可進—牛勺 覆蓋__ SL，浙為_及_ 層 A上之倾^ BP可減少感測線路層 被J傷之機率’並阻擒水氣與感測 降低感測線路層SL被氧化之機率，進而延觸’而 之使用壽命。值得注音# e ® 、觸控面板100 中為非y I丰Γ 疋’保護層Βρ的製作在本創作M416813 100-8-29 V. New Description: [New Technical Field] The present invention relates to a touch panel, and more particularly to a touch panel having a frame pattern layer. [Previous technology] A touch panel is a device attached to a display panel, and the power month b is a function for the user to click on the display panel to complete the transmission of the data or read the display panel. Message. Generally, a shielding layer is often disposed around the touch panel to cover the peripheral lines under the shielding layer, thereby making the touch panel more beautiful. Conventionally, a shielding layer is provided on the outer surface of the touch panel, and the cover lens is attached to the shielding layer by using an optical adhesive (〇pticaladhesive). However, this practice will increase the overall thickness of the touch panel, which is not suitable for the trend of thinning electronic products. Therefore, the prior art has proposed a thinned touch panel. In this thinned control panel towel, the manufacturer integrates the shielding layer on the inner surface of the touch panel to reduce the overall thickness of the touch panel. However, since the shielding layer is disposed on the side line, the high U difference (four) between the peripheral line and the sensing series inside the touch panel is large, and an open circuit occurs between the surrounding line and the internal sensing string (covering * good) The probability of a broken line increases, which in turn makes the thin type = the yield of the touch panel decreases. In view of the above, how to develop a touch panel that can integrate the mask on the inner surface of the touch panel and has a high & rate is what the developer wants to achieve. 3 M416813 100-8-29 [New content] f creation provides a touch panel that has a high manufacturing yield. A touch panel comprising a substrate, a frame pattern U/, and a circuit layer. The substrate has a touch area and a peripheral area, and is connected to the touch area. The frame pattern layer is located at the periphery of the substrate: into the touch area. The dielectric layer covers the touch area and the frame pattern layer, "the electric layer has a flat (four) upper surface. The circuit layer is located on the dielectric layer. For a touch panel, the touch panel is in a frame pattern layer" A transparent dielectric layer having a flat upper surface is disposed between the interlayers of the sensory roads, and the first sensing series (or the second sensing series) and the peripheral lines are extremely small, so that the peripheral lines can be easily combined with the a sensing serial (or second sensing series) connection. Thus - to 'where the first sensing series (or the second sensing series) is connected to the peripheral line; ^ an open circuit occurs (poor coverage) In the case of the disconnection, the manufacturing yield of the touch panel of the present invention is further improved. In order to make the above-mentioned features and superior functions of the present creation more complicated, the following specific embodiments are described below in conjunction with the drawings. [First Embodiment] FIG. 1 is a schematic diagram of a touch panel 100 according to an embodiment of the present invention, and FIG. 2A to FIG. 2G are diagrams showing a manufacturing process of the touch panel 100 according to an area A of the corresponding figure. Figure 3A to Figure 3G are respectively corresponding to the line Ι-Γ of Figure 2A to Figure 2G The schematic diagram of the manufacturing process of the touch panel 1 is shown in detail. The manufacturing method of the touch panel 1A will be described in detail below with reference to FIG. 1 , FIG. 2A to FIG. 2G and FIG. 3A to FIG. 3G. -29 Guangzhao® Bu First, the substrate 1〇2 is provided. The substrate ι〇2 has a working area and a peripheral area 112. The peripheral area R2 is substantially connected to the touch area R1. In the example embodiment, the substrate 1〇2 touches The control area R1 can be a rectangular area 1 2 can be a mouth-shaped magic-domain surrounding the touch area R1 and connected thereto. However, the present invention is not limited to this. In other embodiments, the touch area is Round, expanded circular, polygonal or according to actual needs, and the shape of the surrounding area R2 can also be circular, elliptical 1, Igong-shaped or with the shape of the touch area R1 to make appropriate ^ The board 1G2 can be a hard county board, a flexible board, a printed circuit board or a transparent board. The material of the board 102 can be glass, quartz, organic polymer 'month conductive material or other awkward material. 2B and FIG. 3A, a frame-shaped pattern layer 104 is formed on the substrate 102, and the frame-shaped pattern layer 4 is surrounded by the 'frame-shaped pattern' in this embodiment. The layer is just a layer of - word f, and covers the entire peripheral area R2. The frame pattern layer 104 uses the edge i to control the area and shields the traces on the peripheral area R2, for example, week 104 ® 2Α 3A ° ^ It is preferable to use a material having a good light-shielding property, such as a metal chromium, a compound (Cr〇x) or a black resin, a colored resin, etc. A 八Γ 请 'Please refer to FIG. 2B and FIG. 3B simultaneously, and form 104 on the substrate 102, and介静^ Covering touch area R1 and frame pattern layer This dielectric # ιηΛ* has a flat upper surface S. It is worth mentioning that am ☆ 9 /, with good step coverage (stePcoverage) and certain, After the dielectric layer 1〇6 covers the touch area W and the convex M416813 100-8-29 starts from the frame pattern layer 104 of the touch area R1, the surface of the upper surface s is ___tan In order to facilitate the subsequent sensing of the formation of the line layer SL·. The dielectric flat material is selected to be transparent with good step coverage and insulation. For example, oxidized stone, cerium nitride, oxynitride, transparent organic compound: transparent resin or stack of at least two kinds of materials mentioned above. Layers, etc. Next, a sensing circuit layer SL is formed on the dielectric layer 106, and the touch panel i (8) of the embodiment is formed. In this embodiment, the circuit layer SL includes a plurality of first sensing series electrically insulated from each other, and a second sensing series S2, an insulating pattern layer GI^: an insulating circuit 2 Sensing string S1 and second sensing series 5 line=first and each strip perimeter, 'J string歹j S1 or brother-sensing string S2 electrical making=will match the figure to FIG. 2G, and 3C to the picture too = the step of sensing the circuit layer SL is described in the face, the cost is more ==== Figure 2, r-upper shape B1 is formed in the touch area R1: some bridged wire arrangement. The first ~ bridge _ B1 is just above, and the shape of the array is better, for example, the alloy 'all genus = shell, for the material with good electrical conductivity, the metal material · the genus 4 rat, the oxidized stack of metal materials Floor. , ' ** oxide, or metal material is insulated from other conductive materials == Γ 3 plate 102 forms a violent path 34 m-a of the first bridge wire m. In detail, the insulating pattern layer GI of the present embodiment is, for example, a plurality of island patterns GI-a, wherein each of the island patterns GI-a covers the intermediate portion B1-b of each of the first bridge wires B1. And exposing both ends Bl-a of each of the first bridging wires B1. The present invention is not limited thereto. In other embodiments, the insulating pattern layer GI may also be an insulating layer having a plurality of holes covering the entire substrate 102 to expose the first bridge wires B1 through only a plurality of holes. Both ends of Bl_a. In the present embodiment, the material of the insulating pattern layer GI is, for example, a transparent organic compound, a transparent resin, cerium oxide, cerium nitride, cerium oxynitride or the like. 2E and FIG. 3E, a plurality of first sensing pads P1 and a plurality of second sensing series S2 are formed on the touch area R1, wherein each of the first bridge wires B1 passes through the first bridge wires. The two ends of the B1 are electrically connected to the two adjacent first sensing pads P1, and the first sensing pads P1 and the first bridging wires B1 form a plurality of first sensing series S1. Each of the second sensing series S2 includes a plurality of second sensing pads P2 and a plurality of second bridge wires B2, wherein each of the second bridge wires B2 is electrically connected to two adjacent second sensing pads P2, and these The second bridge wire B2 is disposed on the insulation pattern layer GI to electrically insulate the second sensing series S2 from the first sensing series S1. In this embodiment, the first sensing series S1 and the second sensing series S2 are alternately arranged. In other words, the extending directions of the first sensing series S1 and the second sensing series S2 are not parallel. Preferably, the first sensing series S1 is perpendicular to the extending direction of the second sensing series S2. For example, if the first sensing series S1 extends along the Y direction, the second sensing series S2 extends along the X direction; otherwise, the first sensing series S1 extends along the X direction by 7 M416813. 100-8-29 The 'second sensing series S2' extends in the gamma direction. In addition, the shape of the first sensing pad 1 and the second sensing pad 2 in the embodiment is often a diamond shape, so that the first sensing pad 1 and the second sensing pad 2 are arranged in a dense manner on the touch. In the area Ri, the touch panel 1 〇〇 has better sensitivity, and the outer contours of the first sensing pad P1 and the second sensing pad P2 on the touch panel 100 are not easily recognized by the user. However, the present creation is not limited to this. In other embodiments, the shapes of the first sensing 塾 pl and the second sensing 塾 may be other suitable designs according to the requirements of the actual product. In this embodiment, the first sensing series S1 and the second sensing series S2 are formed by the same process. Therefore, the first sensing series si and the second sensing series S2 of the embodiment are The material is the same transparent conductive sensing series, and its material includes metal oxides such as indium tin oxide, indium zinc oxide, sulphur oxide, transfer material, bismuth zinc oxide, other suitable oxides. Or a stacked layer of at least two of the above. Referring to FIG. 2F and FIG. 3F simultaneously, a plurality of peripheral lines L are formed on a region where the dielectric layer 1〇6JN-shaped pattern layer 104 overlaps. In the fourth embodiment, each of the peripheral lines L is connected to a first sensing 塾ρι (or a second-name pad P2). f (four) clearly, the peripheral line l of the present embodiment, the first-sensing pad P1 and the second sensing 塾? 2 is formed on the dielectric layer ι (= flat upper surface S' so that the peripheral line L can be easily connected to the first sense "fpl and the second sensing pad p2" and is not easy to open (covering bad broken line) Therefore, the manufacturing of the touch recording (10) of the present embodiment is improved. The material of the peripheral circuit is preferably made of a material such as an alloy, a nitride of a metal material, or a metal milk 8 M416813. The oxide layer of 100-8-29, the oxynitride of the metal material, or the stacked layer of the electric material. The rod and the other guides of the present invention, the touch panel of the embodiment can be inserted into the __ SL, Zhewei _ and _ layer P on BP can reduce the probability of sensing the circuit layer being injured by J' and block the water vapor and sensing to reduce the probability that the sensing circuit layer SL is oxidized, and then delay ' The service life is worthy of the phonetic # e ® , the touch panel 100 is not y I Γ Γ 疋 'protective layer Β ρ produced in this creation
Si; I:是通常知識者，據產品的 層ΒΡ例如為透明伴^呆^層ΒΡ。在本實施例中，保護 Η為透明保濩層’其材料可為 化石夕、氮化石夕、氮氧化石夕、或二，乳 有機材料或上狀組合。堆叠層）、 由圖1、圓2G以及圖3G可知，太瑞, 1〇0包括基板102、框形圖案層104'介電層 線路層SL。基板102 *有觸 w 曰6以及感測 區幻實質上與觸控區R & ’且周邊 102 u 1連接。框形圖案層1〇4位於基板 ^邊°° 且壤繞觸控區R卜介電層106覆蓋觸 =1以及框形圖案層购，且具有平坦的上表面s:: 感測線路層SL位於介電層1〇6上。 ^實施例之感測線路層SL包括多個第—橋接導線 串列i=1GI、多個第—感測墊p卜^ 觸控區二t 線路L。多個第一橋接導線B1位於 “ 上。絕緣圖案層GI位於基板102上，絕緣圖案 9 M4I0813 100-8-29 覆魏5第—橋接導線B1 J'暴露ώ這些第一橋 R1上 的兩端Bl_a。多個第-感測墊Ρ1位於觸控區 ，其中各第—橋接導線Βι透過各第一橋接導線 一端Bl-a與二相鄰之第一感測墊卩丨電性連接，這些第 感測塾P1與這些第—橋接導線B1構成多個第一感測串 歹J S1夕個弟一感測串列S2位於觸控區R1上，各第二 感測串列S2包括多個第二感測墊p2與多個第二橋接導線 B2其中各第二橋接導線B2與二相鄰之第二感測墊p2電 I*生連接’且這些第二橋接導線B2配置於絕緣圖案層GI 上’以使這些第二感測串列S2與這些第一感測串列si電 性絕緣。多個周邊線路SL位於介電層106與框形圖案層 104重叠之區域上。此外，本實施例之觸控面板ι〇〇可進 一步包括保護層BP，以覆蓋感測線路層SL。 【第二實施例】 本實施例之觸控面板與第一實施例之觸控面板〗〇〇的 結構以及製造方法類似，惟本實施例之感測線路層SL，與 第一實施例之感測線路層SL的結構以及製造方法不同。 以下’僅就兩者相異之處進行說明，相同之處便不再重述。 圖4A至圖4C為本實施例之感測線路層SL’製造流程 上視示意圖。圖5A至圖5C分別為對應圖4A至圖4C之 剖線Π _ Π ’所繪示之感測線路層SL’製造流程剖面示意 圖。以下將搭配圖4A至圖4C以及圖5A至圖5C，對形成 本實施例之感測線路層SL’的步驟進行詳細之描述。 100-8-29 成多個第-圖及圖5A ’於觸控區R1上形 第二感測串㈣二個第二感測串列S2,其中各 導線B2，各第-二接=第二感測墊P2與多個第二橋接 電性連接 橋接¥線B2與二相鄰之第二感測塾P2Si; I: is a general knowledge, according to the layer of the product, for example, a transparent partner. In the present embodiment, the protective crucible is a transparent protective layer', and the material thereof may be fossil eve, nitrite, oxynitride, or bis, a milk organic material or an upper combination. Stacked layer), as shown in Fig. 1, circle 2G, and Fig. 3G, Terry, 1 〇 0 includes a substrate 102, a frame pattern layer 104' dielectric layer circuit layer SL. The substrate 102 * has a touch 曰 6 and the sensing area is substantially connected to the touch area R & and the periphery 102 u 1 . The frame pattern layer 1〇4 is located on the substrate edge°° and is surrounded by the touch region R dielectric layer 106 to cover the touch=1 and the frame pattern layer, and has a flat upper surface s:: sensing circuit layer SL Located on the dielectric layer 1〇6. The sensing circuit layer SL of the embodiment includes a plurality of first-bridged conductor strings i=1GI, a plurality of first sensing pads, and a touch region two t-lines L. A plurality of first bridging wires B1 are located on the upper side. The insulating pattern layer GI is located on the substrate 102, and the insulating pattern 9 M4I0813 100-8-29 covers the Wei 5th - the bridging wires B1 J' are exposed at both ends of the first bridge R1 Bl_a. The plurality of first sensing pads 1 are located in the touch area, wherein each of the first bridge wires is electrically connected to the two adjacent first sensing pads through the first ends of the first bridge wires B1-a. The sensing 塾P1 and the first bridge wires B1 form a plurality of first sensing series J S1, the first sensing series S2 is located on the touch area R1, and each of the second sensing series S2 includes a plurality of The second sensing pad p2 and the plurality of second bridging wires B2, wherein each of the second bridging wires B2 is electrically connected to the two adjacent second sensing pads p2 and the second bridging wires B2 are disposed on the insulating pattern layer GI The upper sensing line S2 is electrically insulated from the first sensing series si. The plurality of peripheral lines SL are located on a region where the dielectric layer 106 overlaps the frame-shaped pattern layer 104. In addition, the present embodiment The touch panel ι can further include a protective layer BP to cover the sensing circuit layer SL. [Second embodiment] The touch panel of the embodiment is similar to the structure and manufacturing method of the touch panel of the first embodiment, but the sensing circuit layer SL of the present embodiment, and the structure of the sensing circuit layer SL of the first embodiment and The manufacturing method is different. The following is a description of the differences between the two, and the same points will not be repeated. FIG. 4A to FIG. 4C are schematic diagrams showing the manufacturing process of the sensing circuit layer SL' of the present embodiment. 5C is a schematic cross-sectional view showing the manufacturing process of the sensing circuit layer SL' corresponding to the line Π _ Π ' of FIG. 4A to FIG. 4C. The following will be combined with FIG. 4A to FIG. 4C and FIG. 5A to FIG. The steps of sensing the circuit layer SL' in this embodiment are described in detail. 100-8-29 A plurality of the first picture and FIG. 5A 'the second sensing string (four) on the touch area R1 The series S2, wherein each of the wires B2, each of the second and second contacts = the second sensing pad P2 and the plurality of second bridges are electrically connected to the bridge B2 and the second adjacent second sensing node P2
1月同時參照®4B及圖5B 按者 ，案層GI，絕緣覆 切與各第-感測墊Η的部ϋ圖5C’於絕緣圖案層 線則，其中各第一橋接線Βι°==成多個第一橋接導 電性連接，這些第一感測墊P1以:之二P1 虑容徊笛1 ri興坆些第一橋接導線B1構 芦1{)4會/ =列⑴同時間於介電層106與框形圖案 么⑽重登之區域上形成多個周邊線路L，到此便完成了 不貫施例之感測線路層SL，。 夕本只施例之感測線路層SL’包括多個第一感測墊卩丄、 夕個第二感測串列S2、絕緣圖案層GI、多個第一橋接導 、、’敦B1以及多個周邊線路L。多個第一感測塾pi位於觸控 區R1上。多個第二感測串列S2位於觸控區R1上，其中 各第二感測串列S2包括多個第二感測墊P2與多個第二橋 接導線B2,各第二橋接導線B2與二相鄰之第二感測墊P2 電性連接。絕緣圖案層GI位於基板102上，其中絕緣圖 案層GI至少覆蓋這些第二橋接導線B2。多個第一橋接導 線B1位於絕緣圖案層GI與各第一感測墊P1的部分區域 上’其中各第一橋接導線B1與二相鄰之第一感測墊P1電 11 100-8-29 性連接，這些第一感測墊P1與這些第一橋接導線B1構成 多個第一感測串列S1。多個周邊線路L位於介電層1〇6 與框形圖案層104重疊之區域上。 【第三實施例】 本實施例之觸控面板與第一實施例之觸控面板100的 結構以及製造方法類似，惟本實施例之感測線路層SL’’與 第一實施例之感測線路層SL的結構以及製造方法不同。 以下，僅就兩者相異之處進行說明，相同之處便不再重述。 圖6A至圖6C為本實施例之感測線路層SL’，製造流 程上視示意圖。圖7A至圖7C分別為對應圖6A至圖6C 之剖線Π - ΠΓ所繪示之感測線路層S L，，製造流程剖面杀意 圖。以下將搭配圖6A至圖6C以及圖7A至圖7C，對衫成 本實施例之感測線路層SL’’的步驟進行詳細之描述。 首先，清同時參照圖6A及圖7A，於觸控區Rl上形 成多個第一橋接導線B1，同時間於介電層1〇6與框形_案 層104重疊之區域上形成多個周邊線路l。接著，請同時 參照圖6B及圖7B，於基板1〇2上形成絕緣圖案層，絕 緣圖案層GI至少覆蓋這些第一橋接導線B1且暴露出道竣 第·一橋接導線B1的兩端Bl-a。然後，請同時參照圖6C 及圖7C，於觸控區R1上形成多個第一感測墊p〗以及多 個第二感測串列S2 ’其中各第—橋接導線B1透過各第^ 橋接導線B1的兩端Bl-a與二相鄰之第一感測塾pi電1 生 連接’這些第一感測墊P1與這些第一橋接導線B1構成多 12 M416813 100-8-29 個第4測串列S1 ’各第二感測串列S2包括多個第 測塾P2與夕個第-橋接導線B2 ’其中各第二橋接導線^ 與二相鄰之第二感缝P2電性連接，且這些第二橋 線B2配置於絕緣圖案層GI上，以使·第1測㈣ S2與這_ 一感測串列S1電性絕緣，到此便完 施例之感測線路層SL’，。 本實施例之感測線路層SL，，包括多個第—橋接 B1、多個周邊線路L、絕緣圖案層⑺、多個第一感測墊 P1以及多個第二感測串列S2。多個第一橋接導線m位於 觸控區上。多烟邊線路L位於介電層觸與框 案層104重疊之區域上。絕緣圖案層GI位於基板1〇2上， 絕緣圖案層GI至少覆蓋這些第—橋接導線bi且暴露 些第-橋接導線Bi的兩端Bl_a。多個第一感測墊？1位於 觸控區R1上，其中各第—橋接導線則透過各第-橋接導 線B1的雨端Bl-a與二相鄰之第—感測墊ρι電性連接， ^些第一感測塾P1與這些第—橋接導線B1構❹個第一 ::串列s卜多個第二感測串列S2位於觸控區幻上， 接導S2包括多個第二感測塾？2與多個第二橋 二橋接導線拉與：相鄰^測 層G/’ ’且这些第二橋接導線B2配置於絕緣圖案 心二使這些第二感測串列S2與這些第一感測串列 13 M416813 100-8-29 面之第一感測串列（或第二感測串列)與周邊線路L間之高 度落差極小化，因此周邊線路可輕易地與第一感測串列（或 苐一感測串列)連接。如此一來，在本創作之觸控面板中便 不易發生習知技術中第一感測串列（或第二感測串列）與周 邊線路開路(覆蓋不良的斷線)的情形，進而提升本創作之 觸控面板的良率。 雖然本創作已以實施例揭露如上，然其並非用以限定 本創作’任何所屬技術領域中具有通常知識者，在不脫離 本創作之精神和範圍内，當可作些許之更動與潤飾，故本 創作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本創作第一實施例之觸控面板上視示意圖。 圖2A至圖2G為對應圖1之區域A所繪示之觸控面 板製造流程上視示意圖。 圖至圖3G分別為對應圖2A至圖2G之剖線1_工， 所緣示之觸控面板製造流程剖面示意圖。 圖4A至圖4C為本創作第二實施例之感測線路層製造 流程上視示意圖。 ，圖5A至圖5C分別為對應圖4A至圖4C之剖線π_ Π’所繪示之感測線路層製造流程剖面示意圖。 圖6Α至圖6C為本創作第三實施例之威測線路層製造 流程上視示意圖。 、 ，圖7A至圖7C分別為對應圖6A至圖6C之剖線皿· ΠΓ所繪示之感測線路層製造流程剖面示意圖。、 M416813 100-8-29 【主要元件符號說明】 100 :觸控面板 102 :基板 104 :框形圖案層 106 :介電層 SL :感測線路層 51 :第一感測串列 52 :第二感測串列 GI :絕緣圖案層 GI-a :島狀圖案 L:周邊線路 B1 :第一橋接導線 B2 :第二橋接導線 Bl-a:第一橋接導線兩端 P1 :第一感測墊 P2 :第二感測墊 51 :第一感測串列 52 :第二感測串列 BP :保護層 X、Y:方向 S :表面 D :厚度 R1 :觸控區 R2 :周邊區 R ·區域 15In January, reference is made to ®4B and FIG. 5B, the layer GI, the insulation coating and the parts of each of the first-sensing pads are shown in FIG. 5C' in the insulating pattern layer line, wherein each first bridge wire Βι°== The plurality of first bridges are electrically connected, and the first sensing pads P1 are: P1, and the first bridge wires B1 are arranged. The first bridge wires B1 are arranged 1{) 4 will be / = column (1) at the same time A plurality of peripheral lines L are formed on the region where the dielectric layer 106 and the frame-shaped pattern (10) are re-entered, and thus the sensing circuit layer SL of the embodiment is completed. The sensing circuit layer SL' of the embodiment only includes a plurality of first sensing pads, a second sensing series S2, an insulating pattern layer GI, a plurality of first bridge guides, and a 'Bun B1 and A plurality of peripheral lines L. A plurality of first sensing electrodes pi are located on the touch area R1. The plurality of second sensing series S2 are located on the touch area R1, wherein each of the second sensing series S2 includes a plurality of second sensing pads P2 and a plurality of second bridge wires B2, and each of the second bridge wires B2 and The two adjacent second sensing pads P2 are electrically connected. The insulating pattern layer GI is located on the substrate 102, wherein the insulating pattern layer GI covers at least the second bridge wires B2. The plurality of first bridging wires B1 are located on the insulating pattern layer GI and a portion of each of the first sensing pads P1. The first sensing pads P1 and the two adjacent first sensing pads P1 are electrically 11 100-8-29 The first sensing pads P1 and the first bridging wires B1 form a plurality of first sensing series S1. A plurality of peripheral lines L are located on a region where the dielectric layer 1〇6 overlaps the frame-shaped pattern layer 104. [Third Embodiment] The touch panel of the present embodiment is similar to the structure and manufacturing method of the touch panel 100 of the first embodiment, but the sensing circuit layer SL'' of the present embodiment and the sensing line of the first embodiment The structure and manufacturing method of the road layer SL are different. In the following, only the differences between the two will be explained, and the same points will not be repeated. 6A to 6C are schematic views showing the manufacturing process of the sensing circuit layer SL' of the present embodiment. 7A to 7C are schematic diagrams showing the manufacturing process layer layer S L corresponding to the line Π - ΠΓ of FIG. 6A to FIG. 6C, respectively. The steps of the sensing circuit layer SL'' of the shirt embodiment will be described in detail below with reference to Figs. 6A to 6C and Figs. 7A to 7C. First, referring to FIG. 6A and FIG. 7A, a plurality of first bridging wires B1 are formed on the touch region R1, and a plurality of peripheral regions are formed on the region where the dielectric layer 1〇6 overlaps the frame-shaped layer 104. Line l. Next, referring to FIG. 6B and FIG. 7B, an insulating pattern layer is formed on the substrate 1〇2, and the insulating pattern layer GI covers at least the first bridging wires B1 and exposes both ends of the ballast first bridging wire B1, Bl-a. . Then, referring to FIG. 6C and FIG. 7C, a plurality of first sensing pads p and a plurality of second sensing series S2′ are formed on the touch area R1, wherein each of the first bridge wires B1 passes through each of the second bridges. The two ends of the wire B1, Bl-a, are connected to the two adjacent first sensing electrodes pi. The first sensing pads P1 and the first bridge wires B1 constitute 12 M416813 100-8-29 4th. Each of the second sensing series S2 includes a plurality of second sensing wires P2 and a plurality of second sensing wires B2 ′, wherein each of the second bridge wires 2 is electrically connected to two adjacent second sensing slits P2, And the second bridge line B2 is disposed on the insulating pattern layer GI such that the first (four) S2 is electrically insulated from the one sensing series S1, and the sensing circuit layer SL' of the embodiment is completed. . The sensing circuit layer SL of the embodiment includes a plurality of first bridges B1, a plurality of peripheral lines L, an insulating pattern layer (7), a plurality of first sensing pads P1, and a plurality of second sensing series S2. A plurality of first bridge wires m are located on the touch area. The multi-smoke line L is located on a region where the dielectric layer contacts the mask layer 104. The insulating pattern layer GI is located on the substrate 1〇2, and the insulating pattern layer GI covers at least the first bridge wires bi and exposes both ends Bl_a of the first bridge wires Bi. Multiple first sensing pads? 1 is located in the touch area R1, wherein each of the first bridge wires is electrically connected to the two adjacent first sensing pads ρι through the rain end Bl-a of each of the first bridge wires B1. P1 and these first-bridging wires B1 are configured first:: serials s, a plurality of second sensing series S2 are located on the touch area, and the guiding S2 includes a plurality of second sensing electrodes? 2 and a plurality of second bridge two bridge wires are pulled: adjacent to the test layer G/'' and the second bridge wires B2 are disposed on the insulation pattern core 2 to make the second sense series S2 and the first senses The height difference between the first sensing series (or the second sensing series) and the peripheral line L of the series 13 M416813 100-8-29 surface is minimized, so the peripheral line can be easily connected with the first sensing series (or a sense series) connection. As a result, in the touch panel of the present invention, the first sensing series (or the second sensing series) and the peripheral line opening (unsettled broken lines) in the prior art are less likely to occur, thereby improving The yield of the touch panel of this creation. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention to anyone having ordinary knowledge in the art, and may make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic top view of a touch panel according to a first embodiment of the present invention. 2A to 2G are schematic top views showing the manufacturing process of the touch panel corresponding to the area A of FIG. 1. FIG. 3G is a cross-sectional view showing the manufacturing process of the touch panel corresponding to the line 1_ to FIG. 2A to FIG. 2G, respectively. 4A to 4C are schematic top views showing the manufacturing process of the sensing circuit layer of the second embodiment of the present invention. 5A to 5C are schematic cross-sectional views showing the manufacturing process of the sensing circuit layer corresponding to the line π_ Π' of FIG. 4A to FIG. 4C, respectively. 6A to 6C are schematic top views showing the manufacturing process of the power line layer of the third embodiment of the present invention. 7A to 7C are schematic cross-sectional views showing the manufacturing process of the sensing circuit layer corresponding to the cross-dishes of FIG. 6A to FIG. 6C, respectively. M416813 100-8-29 [Description of Main Component Symbols] 100: Touch Panel 102: Substrate 104: Frame Pattern Layer 106: Dielectric Layer SL: Sensing Circuit Layer 51: First Sensing String 52: Second Sensing series GI: Insulation pattern layer GI-a: Island pattern L: Peripheral line B1: First bridging conductor B2: Second bridging conductor Bl-a: Both ends of the first bridging conductor P1: First sensing pad P2 : second sensing pad 51 : first sensing series 52 : second sensing series BP : protective layer X, Y: direction S : surface D : thickness R1 : touch area R2 : peripheral area R · area 15