WO2014043929A1 - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
WO2014043929A1
WO2014043929A1 PCT/CN2012/081999 CN2012081999W WO2014043929A1 WO 2014043929 A1 WO2014043929 A1 WO 2014043929A1 CN 2012081999 W CN2012081999 W CN 2012081999W WO 2014043929 A1 WO2014043929 A1 WO 2014043929A1
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WO
WIPO (PCT)
Prior art keywords
main body
display device
body portion
back plate
front frame
Prior art date
Application number
PCT/CN2012/081999
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English (en)
French (fr)
Inventor
萧宇均
李全
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/642,535 priority Critical patent/US8964393B2/en
Priority to DE112012006821.1T priority patent/DE112012006821T5/de
Publication of WO2014043929A1 publication Critical patent/WO2014043929A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of display, and in particular to a display device.
  • the driving chip of the display panel that drives the display device does not have a large amount of heat emitted by a light source (for example, an LED light source) due to the total heat, and thus no additional heat sink is disposed to dissipate heat.
  • a light source for example, an LED light source
  • the driver chip has a temperature of about 100 to 150 degrees Celsius when operating, and this temperature can still affect the operational stability and reliability of the driver chip.
  • the technical problem to be solved by the present invention is to provide a display device capable of dissipating heat for a driving chip and improving the operational stability and reliability of the driving chip.
  • one technical solution adopted by the present invention is to provide a display device, wherein the display device comprises a display panel, a driving chip, a heat sink and a backlight module.
  • the driver chip is used to drive the display panel.
  • the heat sink is in thermal contact with the driving chip to dissipate heat generated by the driving chip.
  • the backlight module includes a back plate, and the heat sink is further fixed on the back plate and is in thermal contact with the back plate.
  • the heat sink includes a main body portion and two support portions.
  • the two support portions are located at two ends of the main body portion, and are respectively fixed to the back plate and support the main body portion such that the main body portion is spaced apart from the back plate, and the driving chip is disposed on the side surface of the main body portion facing the back plate.
  • the main body portion and the two support portions are integrally formed.
  • the main body portion includes a parallel portion and a first bent portion.
  • the parallel portion is disposed in parallel with the bottom surface of the back plate.
  • the first bent portion is connected to the outer edge of the parallel portion and extends obliquely toward the back plate, and the driving chip is disposed on the side surface of the first bent portion facing the back plate.
  • the display device further includes a front frame, the main body portion further includes a second bent portion, the second bent portion is connected to the first bent portion, and extends away from the back plate in a direction perpendicular to a bottom surface of the back plate, and second The bent portion further interferes with the inner side of the front frame.
  • the main body portion further includes a third bent portion connected to the inner edge of the parallel portion and extending away from the back plate in a direction perpendicular to the bottom surface of the back plate.
  • the display device includes a display panel, a driving chip, a heat sink, and a front frame.
  • the driver chip is used to drive the display panel.
  • the heat sink is in thermal contact with the driver chip to dissipate heat generated by the driver chip.
  • the front frame is provided with an opening, and the heat sink is fixed on the front frame and is in thermal contact with the driving chip through the opening.
  • the heat sink comprises a main body portion and a convex portion.
  • the main body portion is fixed to the front frame.
  • the raised portion protrudes from the body portion and is in thermal contact with the driving chip via the opening.
  • the main body portion and the convex portion are an integrally formed structure.
  • the front frame is further provided with a concave portion on the outer periphery of the opening, and the main body portion is disposed in the concave portion.
  • the depth of the recess is set such that the outer surface of the body portion is flush with the outer surface of the front frame.
  • a display device including a display panel, a driving chip, and a heat sink.
  • the driver chip is used to drive the display panel.
  • the heat sink is in thermal contact with the driver chip to dissipate heat generated by the driver chip.
  • the display device further includes a backlight module, and the backlight module includes a back plate, and the heat sink is further fixed on the back plate and is in thermal contact with the back plate.
  • the heat sink includes a main body portion and two support portions.
  • the two support portions are located at two ends of the main body portion, and are respectively fixed to the back plate and support the main body portion such that the main body portion is spaced apart from the back plate, and the driving chip is disposed on the side surface of the main body portion facing the back plate.
  • the main body portion includes a parallel portion and a first bent portion.
  • the parallel portion is disposed in parallel with the bottom surface of the back plate.
  • the first bent portion is connected to the outer edge of the parallel portion and extends obliquely toward the back plate, and the driving chip is disposed on the side surface of the first bent portion facing the back plate.
  • the display device further includes a front frame, the main body portion further includes a second bent portion, the second bent portion is connected to the first bent portion, and extends away from the back plate in a direction perpendicular to a bottom surface of the back plate, and second The bent portion further interferes with the inner side of the front frame.
  • the main body portion further includes a third bent portion connected to the inner edge of the parallel portion and extending away from the back plate in a direction perpendicular to the bottom surface of the back plate.
  • the display device further includes a backlight module.
  • the backlight module includes a front frame, and the front frame is provided with an opening.
  • the heat sink is fixed on the front frame and is in thermal contact with the driving chip through the opening.
  • the heat sink comprises a main body portion and a convex portion.
  • the main body portion is fixed to the front frame.
  • the raised portion protrudes from the body portion and is in thermal contact with the driving chip via the opening.
  • the front frame is further provided with a concave portion on the outer periphery of the opening, and the main body portion is disposed in the concave portion.
  • the depth of the recess is set such that the outer surface of the body portion is flush with the outer surface of the front frame.
  • the present invention provides heat dissipation for the driving chip by providing a heat sink in thermal contact with the driving chip in the display device, thereby improving the operational stability and reliability of the driving chip.
  • FIG. 1 is a partial structural schematic view of a display device according to a first embodiment of the present invention
  • Figure 2 is a cross-sectional view showing a display device of a first embodiment of the present invention
  • Figure 3 is a plan view of the heat sink of Figure 1;
  • Figure 4 is a side view of the heat sink of Figure 1;
  • Figure 5 is a partial cross-sectional view showing a display device of a second embodiment of the present invention.
  • FIG. 6 is a schematic view of the heat sink and the front frame assembled according to the second embodiment of the present invention.
  • Fig. 7 is a schematic view showing the heat sink and the front frame of the second embodiment of the present invention before assembly.
  • FIG. 1 is a partial structural view of a display device according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the display device according to the first embodiment of the present invention.
  • the display device includes: a heat sink 10, a backlight module 20, a display panel 30, a driving chip 40, and a front frame 50.
  • the drive chip 40 is used to drive the display panel 30.
  • the position of the driving chip 40 is different according to different situations. In this embodiment, only a relatively common setting mode of the driving chip 40 is selected for explanation.
  • the heat sink 10 is in thermal contact with the drive chip 40 to dissipate heat generated by the drive core 40.
  • the backlight module 20 includes a back plate 21 for mating with the middle frame 22 to house components such as a light source (not shown), a light guide plate 23, and an optical film 24.
  • the heat sink 10 is specifically fixed on the back plate 21 and is in thermal contact with the back plate 21.
  • FIG. 3 is a plan view of the heat sink of FIG. 1
  • FIG. 4 is a side view of the heat sink of FIG.
  • the heat sink 10 includes a main body portion 11 and two support portions 12, 13.
  • the two support portions 12 and 13 are located at both ends of the main body portion 11 and are respectively fixed to the back plate 21 and support the main body portion 11 such that the main body portion 11 and the back plate 21 are spaced apart from each other.
  • the support portions 12, 13 can be fixed and in thermal contact with the backing plate 21 by a double-sided tape, and the double-sided tape is preferably a high-temperature double-sided tape.
  • Fixing holes may be provided on the supporting portions 12, 13, and matching fixing holes are provided at corresponding positions of the back plate 21, so that the supporting portions 12, 13 can be fixed and in thermal contact with the back plate 21 by screws or rivets.
  • the main body portion 11 includes a parallel portion 111, a first bent portion 112, a second bent portion 113, and a third bent portion 114.
  • the parallel portion 111 is disposed in parallel with the bottom surface of the back plate 21, and opposite sides of the parallel portion 111 are connected to the support portions 12, 13.
  • the first bent portion 112 is connected to the outer edge of the parallel portion 111 and extends obliquely toward the back plate 21, and the driving chip 40 is disposed on the side surface of the first bent portion 112 facing the back plate 21.
  • the second bent portion 113 is connected to the first bent portion 112 and extends away from the back plate 21 in a direction perpendicular to the bottom surface of the back plate 21, and the second bent portion 113 further abuts against the inner side of the front frame 50.
  • the third bent portion 114 is connected to the inner edge of the parallel portion 111 and extends away from the back plate 21 in a direction perpendicular to the bottom surface of the back plate 21.
  • the body portion 11 and the two support portions 12, 13 are integrally formed.
  • the driving chip 40 is disposed on a side surface of the main body portion 11 facing the backing plate 21 to bring the heat sink 10 into thermal contact with the driving chip 40.
  • the heat generated when the driving chip 40 operates is transferred to the main body portion 11 by thermal contact with the main body portion 11 of the heat sink 10, and further diffused to the entire heat sink 10.
  • the heat sink 10 is preferably a metal heat sink, and the surface may be coated with a heat dissipating material that increases the heat dissipation effect, such as a radiation heat dissipating material or the like.
  • FIG. 5 is a partial cross-sectional view showing a display device according to a second embodiment of the present invention.
  • the display device includes a heat sink 60, a backlight module 70, a display panel 80, and a driving chip 90.
  • the driving chip 90 is used to drive the display panel 80, and the heat sink 60 is in thermal contact with the driving chip 90 to dissipate heat generated by the driving chip 90.
  • FIG. 6 is a schematic view of the heat sink and the front frame assembled according to the second embodiment of the present invention
  • FIG. 7 is a schematic view of the heat sink and the front frame of the second embodiment of the present invention before assembly.
  • the display device includes a front frame 70 that includes a main body portion 61, a raised portion 62, and a first fixing hole 63.
  • the front frame 70 is provided with an opening 712, a recess 711, and a second fixing hole 713.
  • the recess 711 is disposed at a periphery of the opening 712
  • the second fixing hole 713 is disposed in the recess 711 .
  • the main body portion 61 is fixed to the front frame 70 and is specifically disposed in the recess portion 711.
  • the depth of the recess 711 is set such that the outer surface of the main body portion 61 is flush with the outer surface of the front frame 70.
  • the raised portion 62 protrudes from the body portion 61 and is in thermal contact with the drive chip 90 via the opening 712 such that the heat sink 60 is in thermal contact with the drive chip 90 via the opening 712.
  • the body portion 61 and the boss portion 62 are integrally formed.
  • the first fixing hole 63 is disposed corresponding to the second fixing hole 713
  • the display device further includes a fixing member (not shown), and the fixing member is disposed in the first fixing hole 63 and the second fixing hole 713 to enable
  • the heat sink 60 is fixed to the front frame 70.
  • the heat sink 60 can also be secured to the front frame 70 by applying a double-sided tape to the body portion 61.
  • the double-sided tape is preferably a high-temperature double-sided tape
  • the heat sink 60 is preferably a metal heat sink, and the surface may be coated with a heat-dissipating material that increases heat dissipation, such as a radiation heat-dissipating material.
  • the front frame 70 can be made of a plastic material.
  • the present invention heats the driving chip by disposing a heat sink in thermal contact with the driving chip in the display device, thereby improving the operational stability and reliability of the driving chip.

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Abstract

一种显示装置，包括显示面板（30，80）、驱动芯片（40，90）以及散热片（10，60）。驱动芯片（40，90）用于驱动显示面板。散热片（10，60）与驱动芯片（40，90）热接触，以对驱动芯片（40，90）产生的热量进行散热。通过上述方式，提高了驱动芯片（40，90）的工作稳定性和可靠性。

Description

显示装置
【技术领域】
本发明涉及显示领域，特别是涉及一种显示装置。
【背景技术】
随着科技的发展，电脑等显示装置已经成为人们学习、工作、生活中的必要元素。目前，驱动显示装置的显示面板的驱动芯片由于总热量并没有光源（例如LED光源）所散发的热量大，因此不会设置附加的散热装置对其进行散热。然而，经本申请人研究发现，驱动芯片工作时具有摄氏100~150度左右的温度，这种温度仍可影响到驱动芯片的工作稳定性和可靠性。
因此，需要提供一种显示装置，以解决上述问题。
【发明内容】
本发明主要解决的技术问题是提供一种显示装置，能够为驱动芯片进行散热，提高驱动芯片的工作稳定性和可靠性。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种显示装置，其中，显示装置包括显示面板、驱动芯片、散热片以及背光模组。驱动芯片用于驱动显示面板。散热片，与驱动芯片热接触，以对驱动芯片产生的热量进行散热。背光模组包括背板，散热片进一步固定于背板上，并与背板热接触。散热片包括主体部以及两个支撑部。两个支撑部位于主体部两端，并分别固定于背板上且支撑主体部，以使主体部与背板间隔设置，驱动芯片设置于主体部朝向背板的侧表面上。其中，主体部与两个支撑部为一体成型结构。
其中，主体部包括平行部以及第一弯折部。平行部与背板的底面平行设置。第一弯折部与平行部的外边缘连接，且朝向背板倾斜延伸，驱动芯片设置于第一弯折部朝向背板的侧表面上。
其中，显示装置进一步包括前框，主体部进一步包括第二弯折部，第二弯折部与第一弯折部连接，且在垂直于背板的底面的方向上远离背板延伸，第二弯折部进一步抵触于前框的内侧。
其中，主体部进一步包括第三弯折部，第三弯折部与平行部的内边缘连接，且在垂直于背板的底面的方向上远离背板延伸。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种显示装置，其中，显示装置包括显示面板、驱动芯片、散热片以及前框。驱动芯片用于驱动显示面板。散热片与驱动芯片热接触，以对驱动芯片产生的热量进行散热。前框设置有开口，散热片固定于前框上，并经开口与驱动芯片热接触。其中，散热片包括主体部以及凸起部。主体部固定于前框上。凸起部凸出于主体部，并经开口与驱动芯片热接触。其中，主体部与凸起部为一体成型结构。
其中，前框于开口的***进一步设置有凹部，主体部设置于凹部内。
其中，凹部的深度设置成使得主体部的外表面与前框的外表面平齐。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种显示装置，包括显示面板、驱动芯片以及散热片。驱动芯片用于驱动显示面板。散热片与驱动芯片热接触，以对驱动芯片产生的热量进行散热。
其中，显示装置进一步包括背光模组，背光模组包括背板，散热片进一步固定于背板上，并与背板热接触。
其中，散热片包括：主体部以及两个支撑部。两个支撑部位于主体部两端，并分别固定于背板上且支撑主体部，以使主体部与背板间隔设置，驱动芯片设置于主体部朝向背板的侧表面上。
其中，主体部包括平行部以及第一弯折部。平行部与背板的底面平行设置。第一弯折部与平行部的外边缘连接，且朝向背板倾斜延伸，驱动芯片设置于第一弯折部朝向背板的侧表面上。
其中，显示装置进一步包括前框，主体部进一步包括第二弯折部，第二弯折部与第一弯折部连接，且在垂直于背板的底面的方向上远离背板延伸，第二弯折部进一步抵触于前框的内侧。
其中，主体部进一步包括第三弯折部，第三弯折部与平行部的内边缘连接，且在垂直于背板的底面的方向上远离背板延伸。
其中，显示装置进一步包括背光模组，背光模组包括前框，前框设置有开口，散热片固定于前框上，并经开口与驱动芯片热接触。
其中，散热片包括主体部以及凸起部。主体部固定于前框上。凸起部凸出于主体部，并经开口与驱动芯片热接触。
其中，前框于开口的***进一步设置有凹部，主体部设置于凹部内。
其中，凹部的深度设置成使得主体部的外表面与前框的外表面平齐。
本发明的有益效果是：区别于现有技术的情况，本发明通过在显示装置中设置与驱动芯片热接触的散热片来为驱动芯片进行散热，提高了驱动芯片的工作稳定性和可靠性。
【附图说明】
图1是本发明第一实施例的显示装置的部分结构示意图；
图2是本发明第一实施例的显示装置的截面图；
图3是图1中的散热片的俯视图；
图4是图1中的散热片的侧视图；
图5是本发明第二实施例的显示装置的部分截面图；
图6是本发明第二实施例的散热片与前框组装后的示意图；
图7是本发明第二实施例的散热片与前框组装前的示意图。
【具体实施方式】
请参阅图1与图2，图1是本发明第一实施例的显示装置的部分结构示意图，图2是本发明第一实施例的显示装置的截面图。在本实施例中，显示装置包括：散热片10、背光模组20、显示面板30、驱动芯片40以及前框50。
驱动芯片40用于驱动显示面板30。根据不同的情况，驱动芯片40设置的位置不同，本实施例仅选择一比较常见的驱动芯片40的设置方式来进行说明。
散热片10与驱动芯片40热接触，以对驱动芯40片产生的热量进行散热。背光模组20中包括背板21，其用于与中框22配合，收容光源（未图示）、导光板23和光学膜片24等元件。在本实施例中，散热片10具体固定于背板21上，并与背板21热接触。
参阅图3与图4，图3是图1中的散热片的俯视图，图4是图1中的散热片的侧视图。在本实施例中，散热片10包括主体部11与两个支撑部12、13。
两个支撑部12、13位于主体部11两端，并分别固定于背板21上且支撑主体部11，以使主体部11与背板21间隔设置。支撑部12、13可通过双面胶与背板21固定并热接触，并且，双面胶优选为高温双面胶。支撑部12、13上还可设置固定孔，并在背板21的对应位置设置相配合的固定孔，从而使支撑部12、13可通过螺钉或铆钉与背板21进行固定并热接触。
主体部11包括平行部111、第一弯折部112、第二弯折部113以及第三弯折部114。平行部111与背板21的底面平行设置，并且平行部111的相对两侧与支撑部12、13连接。第一弯折部112与平行部111的外边缘连接，且朝向背板21倾斜延伸，驱动芯片40设置于第一弯折部112朝向背板21的侧表面上。第二弯折部113与第一弯折112部连接，且在垂直于背板21的底面的方向上远离背板21延伸，第二弯折部113进一步抵触于前框50的内侧。第三弯折部114与平行部111的内边缘连接，且在垂直于背板21的底面的方向上远离背板21延伸。在优选实施例中，主体部11与两个支撑部12、13为一体成型结构。
驱动芯片40设置于主体部11朝向背板21的侧表面上，以使散热片10与驱动芯片40热接触。驱动芯片40工作时产生的热量，通过与散热片10的主体部11的热接触，将热量传递到主体部11上，并进一步扩散至整个散热片10。散热片10优选为金属散热片，并且表面可以涂布增加散热效果的散热材料，例如辐射散热材料等。
请参阅图5，图5是本发明第二实施例的显示装置的部分截面图。在本实施例中，显示装置包括散热片60、背光模组70、显示面板80以及驱动芯片90。其中，驱动芯片90用于驱动显示面板80，散热片60与驱动芯片90热接触，以对驱动芯片90产生的热量进行散热。
进一步参阅图6与图7，图6是本发明第二实施例的散热片与前框组装后的示意图，图7是本发明第二实施例的散热片与前框组装前的示意图。显示装置包括前框70，散热片60包括主体部61、凸起部62以及第一固定孔63。
在本实施例中，前框70上设置有开口712、凹部711以及第二固定孔713。凹部711设置于开口712的***，第二固定孔713设置于凹部711中。主体部61固定于前框70上，具体设置于凹部711内。凹部711的深度设置成使得主体部61的外表面与前框70的外表面平齐。凸起部62凸出于主体部61，并经开口712与驱动芯片90热接触，从而使散热片60经开口712与驱动芯片90热接触。在优选实施例中，主体部61与凸起部62为一体成型结构。
在本实施例中，第一固定孔63与第二固定孔713对应设置，显示装置进一步包括固定件（未图示），固定件设置于第一固定孔63与第二固定孔713中以使散热片60固定于前框70上。在其他实施例中，散热片60也可通过在主体部61上涂布双面胶从而使其固定于前框70上。与上一实施例相同，双面胶优选为高温双面胶，散热片60优选为金属散热片，并且表面可以涂布增加散热效果的散热材料，例如辐射散热材料等。在优选实施例中，该前框70可以采用塑胶材料制成。
通过上述方式，本发明通过在显示装置中设置与驱动芯片热接触的散热片来为驱动芯片进行散热，提高了驱动芯片的工作稳定性和可靠性。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种显示装置，其中，所述显示装置包括：
    显示面板；
    驱动芯片，用于驱动所述显示面板；
    散热片，与所述驱动芯片热接触，以对所述驱动芯片产生的热量进行散热；
    背光模组，所述背光模组包括背板，所述散热片进一步固定于所述背板上，并与所述背板热接触；
    所述散热片包括：
    主体部；
    两个支撑部，所述两个支撑部位于所述主体部两端，并分别固定于所述背板上且支撑所述主体部，以使所述主体部与所述背板间隔设置，所述驱动芯片设置于所述主体部朝向所述背板的侧表面上；
    其中，所述主体部与所述两个支撑部为一体成型结构。
  2. 根据权利要求1所述的显示装置，其中，所述主体部包括：
    平行部，所述平行部与所述背板的底面平行设置；
    第一弯折部，所述第一弯折部与所述平行部的外边缘连接，且朝向所述背板倾斜延伸，所述驱动芯片设置于所述第一弯折部朝向所述背板的侧表面上。
  3. 根据权利要求2所述的显示装置，其中，所述显示装置进一步包括前框，所述主体部进一步包括第二弯折部，所述第二弯折部与所述第一弯折部连接，且在垂直于所述背板的底面的方向上远离所述背板延伸，所述第二弯折部进一步抵触于所述前框的内侧。
  4. 根据权利要求3所述的显示装置，其中，所述主体部进一步包括第三弯折部，所述第三弯折部与所述平行部的内边缘连接，且在垂直于所述背板的底面的方向上远离所述背板延伸。
  5. 一种显示装置，其中，所述显示装置包括：
    显示面板；
    驱动芯片，用于驱动所述显示面板；
    散热片，与所述驱动芯片热接触，以对所述驱动芯片产生的热量进行散热；
    前框，所述前框设置有开口，所述散热片固定于所述前框上，并经所述开口与所述驱动芯片热接触。
    其中，所述散热片包括：
    主体部，所述主体部固定于所述前框上；
    凸起部，所述凸起部凸出于所述主体部，并经所述开口与所述驱动芯片热接触；
    其中，所述主体部与所述凸起部为一体成型结构。
  6. 根据权利要求5所述的显示装置，其中，所述前框于所述开口的***进一步设置有凹部，所述主体部设置于所述凹部内。
  7. 根据权利要求6所述的显示装置，其中，所述凹部的深度设置成使得所述主体部的外表面与所述前框的外表面平齐。
  8. 一种显示装置，其中，所述显示装置包括：
    显示面板；
    驱动芯片，用于驱动所述显示面板；
    散热片，与所述驱动芯片热接触，以对所述驱动芯片产生的热量进行散热。
  9. 根据权利要求8所述的显示装置，其中，所述显示装置进一步包括背光模组，所述背光模组包括背板，所述散热片进一步固定于所述背板上，并与所述背板热接触。
  10. 根据权利要求9所述的显示装置，其中，所述散热片包括：
    主体部；
    两个支撑部，所述两个支撑部位于所述主体部两端，并分别固定于所述背板上且支撑所述主体部，以使所述主体部与所述背板间隔设置，所述驱动芯片设置于所述主体部朝向所述背板的侧表面上。
  11. 根据权利要求10所述的显示装置，其中，所述主体部包括：
    平行部，所述平行部与所述背板的底面平行设置；
    第一弯折部，所述第一弯折部与所述平行部的外边缘连接，且朝向所述背板倾斜延伸，所述驱动芯片设置于所述第一弯折部朝向所述背板的侧表面上。
  12. 根据权利要求11所述的显示装置，其中，所述显示装置进一步包括前框，所述主体部进一步包括第二弯折部，所述第二弯折部与所述第一弯折部连接，且在垂直于所述背板的底面的方向上远离所述背板延伸，所述第二弯折部进一步抵触于所述前框的内侧。
  13. 根据权利要求12所述的显示装置，其中，所述主体部进一步包括第三弯折部，所述第三弯折部与所述平行部的内边缘连接，且在垂直于所述背板的底面的方向上远离所述背板延伸。
  14. 根据权利要求8所述的显示装置，其中，所述显示装置进一步包括前框，所述前框设置有开口，所述散热片固定于所述前框上，并经所述开口与所述驱动芯片热接触。
  15. 根据权利要求14所述的显示装置，其中，所述散热片包括：
    主体部，所述主体部固定于所述前框上；
    凸起部，所述凸起部凸出于所述主体部，并经所述开口与所述驱动芯片热接触。
  16. 根据权利要求15所述的显示装置，其中，所述前框于所述开口的***进一步设置有凹部，所述主体部设置于所述凹部内。
  17. 根据权利要求16所述的显示装置，其中，所述凹部的深度设置成使得所述主体部的外表面与所述前框的外表面平齐。
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