WO2014038353A1 - Film de base pour feuilles de découpage en dés et feuille de découpage en dés - Google Patents

Film de base pour feuilles de découpage en dés et feuille de découpage en dés Download PDF

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Publication number
WO2014038353A1
WO2014038353A1 PCT/JP2013/071677 JP2013071677W WO2014038353A1 WO 2014038353 A1 WO2014038353 A1 WO 2014038353A1 JP 2013071677 W JP2013071677 W JP 2013071677W WO 2014038353 A1 WO2014038353 A1 WO 2014038353A1
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Prior art keywords
resin
resin layer
dicing
less
mpa
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PCT/JP2013/071677
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English (en)
Japanese (ja)
Inventor
田矢　直紀
公史 上田
伊藤　雅春
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リンテック株式会社
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Publication of WO2014038353A1 publication Critical patent/WO2014038353A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Definitions

  • the present invention relates to a dicing sheet to which a cut object such as a semiconductor wafer is cut and separated into element pieces and a base film used for the dicing sheet.
  • Semiconductor wafers such as silicon and gallium arsenide and various packages (hereinafter, these may be collectively referred to as “objects to be cut”) are manufactured in a large diameter state. It is cut and separated (diced).
  • the object to be cut subjected to this dicing process is a dicing comprising a base film and a pressure-sensitive adhesive layer provided thereon for the purpose of ensuring the handleability of the object to be cut and chips in the dicing process and subsequent processes.
  • the sheet is attached in advance to the surface of the workpiece on the side opposite to the side on which the cutting tool for cutting is close.
  • a polyolefin film or a polyvinyl chloride film is usually used as a base film.
  • full-cut dicing as a specific method of the dicing process, an object to be cut is cut by a rotating round blade.
  • the pressure-sensitive adhesive layer is also cut beyond the thickness of the object to be cut so that the object to be cut with the dicing sheet attached is cut over the entire surface. May be disconnected.
  • dicing waste made of the material constituting the pressure-sensitive adhesive layer and the base film may be generated from the dicing sheet, and the resulting chip may be contaminated by the dicing waste.
  • One form of such dicing waste is thread-like dicing waste that adheres on the dicing line or near the cross section of the chip separated by dicing.
  • a dicing blade having a thicker blade width is used than when dicing a semiconductor wafer.
  • the cutting depth of dicing becomes deeper. For this reason, since the amount of the base film that is cut and removed during dicing is larger than that in the case of a semiconductor wafer, the amount of thread-like dicing waste generated also tends to increase.
  • Patent Document 1 discloses an invention in which a polyolefin film irradiated with an electron beam or a ⁇ (gamma) ray of 1 to 80 Mrad is used as a base film of a dicing sheet. Is disclosed. In the said invention, it is thought that resin which comprises a base film bridge
  • Patent Document 1 polyethylene, polypropylene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene-methyl are used as polyolefin films irradiated with electron beams or ⁇ rays.
  • Examples include (meth) acrylic acid ester copolymers, ethylene-ethyl (meth) acrylic acid copolymers, ethylene-ionomer copolymers, ethylene-vinyl alcohol copolymers, and polybutenes.
  • (meth) acrylic acid” is a general term for acrylic acid and methacrylic acid. The same applies to other similar words.
  • the present invention has been made in view of the above-described actual situation, and does not give physical energy such as an electron beam or ⁇ -ray, and is generated during dicing of an object to be cut, in particular, thread-like dicing waste.
  • a substrate for a dicing sheet that is excellent in handling property in the dicing process, and that is less likely to break the substrate in the expanding process, and the substrate.
  • An object is to provide a dicing sheet.
  • the present invention firstly provides a resin layer (A) and a dicing sheet comprising a resin layer (B) laminated on one surface of the resin layer (A).
  • a norbornene-based resin (a1) which is a base film, wherein the resin layer (A) has a tensile modulus at 23 ° C. of 1000 MPa or less and has at least one structural unit derived from a norbornene-based compound;
  • the resin layer (B) includes a polypropylene resin (a2) which is a resin based on a propylene polymer, and the resin layer (B) has a tensile elastic modulus at 23 ° C. of 50 MPa or more and 500 MPa or less and a breaking elongation of 100% or more.
  • a substrate film for a dicing sheet characterized in that (Invention 1).
  • the “dicing sheet” includes a dicing die bonding sheet, and the “sheet” in the present invention includes the concept of “tape”.
  • the “norbornene-based resin (a1)” is a resin based on a polymer containing at least one structural unit derived from a norbornene-based compound.
  • the “norbornene-based compound” refers to norbornene and norbornene.
  • a compound having a cyclic structure containing a bicyclo ring for example, dicyclopentadiene, and one or more compounds selected from the group consisting of these derivatives.
  • polypropylene resin (a2) means a polymer having substantially no structural unit derived from a norbornene compound and having a structural unit derived from propylene (hereinafter referred to as “propylene polymer”). ").”
  • the mass ratio in the said polymer of the structural unit derived from a propylene is 75 mass% or more.
  • the resin layer (A) has a phase separation structure of a phase based on the norbornene resin (a1) and a phase based on the polypropylene resin (a2). Therefore, dicing waste is not easily generated when the resin layer (A) is cut in the dicing process. Moreover, since the base material is provided with the resin layer (A) and the resin layer (B), the dicing sheet according to the invention (invention 1) is subjected to the expanding process after the resin layer (A) is cut by the dicing process. Even if provided, problems such as breakage of the substrate hardly occur. And since the tensile elasticity modulus of the resin layer (B) of a base material is controlled by the appropriate range, the handling property of a dicing sheet cannot fall easily.
  • the content of the polypropylene resin (a2) in all resin components in the resin layer (A) is preferably 1% by mass or more and 60% by mass or less (Invention 2).
  • the content of the polypropylene resin (a2) is in the above range, it becomes easy to set the tensile elastic modulus at 23 ° C. of the resin layer (A) to the above range, and the base material is broken in the expanding step. The possibility of performing can be reduced more stably.
  • the said resin layer (A) may further contain the low elastic resin (a3) which is a resin whose tensile elasticity modulus in 23 degreeC is lower than the said polypropylene resin (a2). Preferred (Invention 3).
  • the low elastic resin (a3) is contained, it becomes easy to set the tensile elastic modulus at 23 ° C. of the resin layer (A) within the above-mentioned range, and the possibility that the base material breaks in the expanding process is more stable. Can be reduced.
  • the low elastic resin (a3) is preferably a resin having a tensile elastic modulus at 23 ° C. of 50 MPa or more and 500 MPa or less (Invention 4).
  • the low elastic resin (a3) has such characteristics, it is easier to set the tensile elastic modulus at 23 ° C. of the resin layer (A) within the above range, and the base material can be broken in the expanding process.
  • the possibility that the handling property of the dicing sheet is lowered can also be more stably reduced.
  • the low-elasticity resin (a3) is preferably a polyethylene resin (a3i) (Invention 5).
  • the “polyethylene resin (a3i)” is a kind of low-elasticity resin (a3) and is a polymer having a structural unit derived from ethylene (also referred to as “ethylene polymer” in the present specification). )).
  • the low elastic resin (a3) is a polyethylene resin (a3i)
  • the polyethylene resin (a3i) easily forms a phase separation structure with the norbornene resin (a1).
  • the polymer which comprises a polyethylene-type resin (a3i) is 70 mass% or more of the mass ratio in the said polymer of the structural unit derived from ethylene. In this case, the above phase separation structure is formed more stably.
  • content of the said norbornene-type resin (a1) in all the resin components of the said resin layer (A) is 3 mass% or more and 60 mass% or less
  • the content of the low elasticity resin (a3) is 30% by mass or more and 96% by mass or less (Invention 6).
  • the propylene polymer of the polypropylene resin (a2) is preferably a block copolymer (Invention 7).
  • the possibility that dicing waste is generated when the resin layer (A) is cut in the dicing step is more stably reduced.
  • the resin layer (B) preferably contains an olefin resin (Invention 8).
  • olefin resin means a resin based on a polymer containing a structural unit derived from an olefin compound.
  • the adhesion of the resin layer (B) to the resin layer (A) is high, and delamination occurs between the resin layer (A) and the resin layer (B). The possibility of occurring is reduced more stably.
  • the base film has a tensile elastic modulus at 23 ° C. of 70 MPa or more and 500 MPa or less (Invention 9). In this case, it is difficult to cause a trouble that a dicing sheet conveyance error occurs or the dicing sheet comes off the ring frame in the expanding process.
  • a second aspect of the present invention is a substrate film for dicing according to any one of the above inventions (Inventions 1 to 9), and an adhesive layer laminated on the surface of the film on the resin layer (A) side.
  • a dicing sheet is provided (Invention 10).
  • such a dicing sheet includes the excellent base film according to the above-described invention, dicing waste is hardly generated in the dicing process, the handling property in the dicing process is excellent, and the base material is not easily broken in the expanding process.
  • the generation of dicing debris generated during dicing of an object to be cut is reduced without applying physical energy such as an electron beam or ⁇ -ray. Can be made. And it is excellent in handling property in a dicing process etc., and a base material does not break easily in an expanding process. Therefore, the dicing sheet provided with the substrate film for dicing sheet according to the present invention is less likely to cause a process failure during use.
  • a dicing sheet 1 includes a base film 2 having a structure in which a resin layer (A) and a resin layer (B) are laminated, and the substrate.
  • Resin layer (A) The resin layer (A) included in the base film 2 according to this embodiment includes a norbornene resin (a1) and a polypropylene resin (a2).
  • Norbornene resin (a1)
  • the “norbornene-based compound” that gives a norbornene-based resin is a kind selected from the group consisting of norbornene, a compound having a cyclic structure containing a bicyclo ring related to norbornene (for example, dicyclopentadiene), and derivatives thereof. Or 2 or more types of compounds are meant.
  • the norbornene-based resin (a1) and the polypropylene-based resin (a2) are whether the polymer constituting each resin substantially has a chemical structure having a ring skeleton including a norbornene ring. Therefore, physical properties such as tensile modulus and softening point are different. For this reason, in the resin layer (A), the norbornene resin (a1) phase and the polypropylene resin (a2) phase are phase-separated. That is, the resin layer (A) is a multiphase resin layer having a phase separation structure.
  • phase separation structure varies depending on the chemical structure and content ratio of each resin.
  • a resin layer having a low content is dispersed in a matrix composed of a resin layer having a high content (hereinafter referred to as “dispersed form”).
  • the phase separation structure in the resin layer (A) has the above dispersed form, and the phase of the resin to be dispersed (hereinafter referred to as “dispersed phase”).
  • the resin phase forming the matrix is preferably referred to as “matrix phase”).
  • matrix phase When the size of the dispersed phase is excessively increased in the dispersed form, the surface property of the resin layer (A) is deteriorated (specifically, the surface property of the resin layer (A) is deteriorated) There is a concern that chipping is likely to occur in the cross-section of the workpiece when used as the dicing sheet 1. Furthermore, when the size of the dispersed phase becomes excessively large, the dispersed phases are connected to each other.
  • the length in the thickness direction of the resin layer (A) at the interface between the dispersed phase and the matrix phase is the resin layer (A).
  • the possibility that a thing equivalent to the thickness of will occur will increase.
  • the resin layer (A) has a dispersion
  • a high magnification microscope for example, scanning electron microscope.
  • norbornene-based compounds include norbornene (bicyclo [2.2.1] hept-2-ene), compounds having a cyclic structure containing a bicyclo ring related to norbornene (for example, dicyclopentadiene), and derivatives thereof.
  • norbornene bicyclo [2.2.1] hept-2-ene
  • compounds having a cyclic structure containing a bicyclo ring related to norbornene for example, dicyclopentadiene
  • One or two or more compounds selected from the group consisting of, and specific examples other than norbornene include cyclopentadiene and tetracyclododecene.
  • a polymer (homopolymer or copolymer) containing a structural unit derived from a norbornene compound has a bicyclo [2.2.1] heptane ring structure in the main chain or side chain.
  • a preferred structure of the norbornene-based resin (a1) is a structure in which a cyclic structure constitutes at least a part of the main chain of the polymer constituting the resin, and the bicyclo ring part in the cyclic structure is a part of the main chain. It is more preferable if it is a structure to constitute.
  • a ring-opening metathesis polymer hydride of a norbornene-based monomer specifically, available as ZEONEX (registered trademark) series manufactured by Nippon Zeon Co., Ltd.
  • norbornene and ethylene Copolymers specifically available as TOPAS (registered trademark) series manufactured by Polyplastics Co., Ltd.
  • copolymers based on ring-opening polymerization of dicyclopentadiene and tetracyclopentadenecene specifically Is available as ZEONOR (registered trademark) series manufactured by Nippon Zeon Co., Ltd.
  • a copolymer of ethylene and tetracyclododecene specifically, it is available as Apel (registered trademark) series manufactured by Mitsui Chemicals, Inc.)
  • Cyclic olefin resins containing polar groups derived from dicyclopentadiene and methacrylate esters specifically, available as ZEONEX (registered trademark) series manufactured
  • the dispersion state of the phase of the norbornene resin (a1) and the phase of the polypropylene resin (a2) in the region subjected to the shearing force or frictional heat based on the dicing process is dicing waste. This is a particularly suitable state for suppressing the occurrence.
  • the polymer constituting the norbornene-based resin (a1) may be one type or a blend of a plurality of types of polymers.
  • the types of polymers are different from the states of branching (that is, polymer architecture), molecular weight, blending balance of monomers constituting the polymer, and composition of the monomers constituting the polymer, and It means that these combinations are different to the extent that they have a great influence on physical properties.
  • branching that is, polymer architecture
  • molecular weight molecular weight
  • blending balance of monomers constituting the polymer and composition of the monomers constituting the polymer, and It means that these combinations are different to the extent that they have a great influence on physical properties.
  • a structure may be formed, or a phase-separated structure may be formed with the polypropylene resin (a2) while forming different phases in the resin layer (A).
  • the norbornene-based resin (a1) may have a crosslinked structure.
  • the kind of the crosslinking agent that brings about the crosslinked structure is arbitrary, and a compound having an organic peroxide such as dicumyl peroxide or an epoxy group is typical.
  • the crosslinking agent may be crosslinked between one type of polymer constituting the norbornene-based resin (a1), or may be crosslinked between different types of polymers.
  • the bonding site of the crosslinking agent is also arbitrary. You may bridge
  • the degree of crosslinking is arbitrary, but if the degree of crosslinking proceeds excessively, the processability (particularly moldability) of the resin layer (A) containing the norbornene-based resin (a1) decreases excessively, or the resin layer (A ) May deteriorate excessively, or the brittleness of the resin layer (A) may be reduced, so that such a problem should not be caused.
  • the norbornene resin (a1) in all resin components in the resin layer (A)
  • the content of is preferably 3% by mass or more, more preferably 4% by mass or more, and further preferably 5% by mass or more.
  • the tensile elastic modulus at 23 ° C. of the resin layer (A) in this specification, “tensile elastic modulus”, which is not particularly specified, means a tensile elastic modulus at a measurement temperature of 23 ° C.) (described later).
  • the content of the norbornene-based resin (a1) in all the resin components in the resin layer (A) is preferably 60% by mass or less, and 55% by mass or less from the viewpoint of facilitating setting to 1000 MPa or less). More preferably, it is more preferable to set it as 45 mass% or less.
  • the norbornene-based resin (a1) preferably has thermoplasticity.
  • the degree of thermoplasticity can be expressed by melt mass flow rate (MFR) indicating the viscosity at the time of melting, and the resin layer (A) has an appropriate phase separation structure. What is necessary is just to set suitably so that it may have. If the melt mass flow rate is excessively high, the difference in physical properties from the polypropylene resin (a2) decreases, and there is a concern that the function of suppressing the generation of dicing waste tends to be reduced. In addition, it is preferable to consider this point because the higher the thermoplasticity, the better the workability such as molding.
  • the preferred degree of thermoplasticity that the norbornene-based resin (a1) should have is shown in accordance with JIS K7210: 1999 (ISO 1133: 1997), a melt mass flow rate (MFR) at a temperature of 230 ° C. and a load of 2.16 kgf.
  • the value of is preferably 0.1 g / 10 min or more from the viewpoint of workability and the like.
  • the melt mass flow rate of the norbornene resin (a1) is 0.5 / 10 min or more and 50.0 g / 10 min or less. It is more preferable that it is 1.0 g / 10 min or more and 25.0 g / 10 min or less.
  • the tensile modulus of the norbornene resin (a1) is preferably more than 1.5 GPa. Details of the method for measuring the tensile modulus will be described later in Examples. By setting the tensile elastic modulus within this range, the difference in physical properties from the polypropylene resin (a2) increases, and a phase separation structure suitable for suppressing dicing dust generation is easily obtained in the resin layer (A). From the viewpoint of stably obtaining this phase separation structure, the norbornene-based resin (a1) preferably has a tensile elastic modulus at 23 ° C. of 2.0 GPa or more.
  • the tensile elastic modulus of the norbornene-based resin (a1) is preferably 3.0 GPa or less because it becomes easy to make the tensile elastic modulus of the resin layer (A) 1000 MPa or less as described later. From this viewpoint, it is more preferable that the tensile elastic modulus at 23 ° C. of the norbornene resin (a1) is 2.5 GPa or less.
  • the fluidization temperature of the norbornene resin (a1) is preferably 225 ° C. or less, more preferably 200 ° C. or less, and more preferably 180 ° C. or less.
  • the fluidization temperature is the temperature of the entire sample when the sample is further heated beyond the state in which the degree of molecular deformation increases and the intermolecular interaction is increased due to the passage of the softening point of the heated resin sample. The lowest temperature at which fluidization occurs.
  • the fluidization temperature is 225 ° C. or lower, it is difficult for the phase of the norbornene-based resin (a1) to become coarse in the resin layer (A), and the occurrence of dicing waste is effectively suppressed, and chipping is prevented.
  • the fluidization temperature of the norbornene resin (a1) is excessively low, the tensile elastic modulus at 23 ° C. may be lowered to 1.5 GPa or less. In this case, there is a concern that the difference in physical properties from the polypropylene resin (a2) becomes small, and it is difficult to obtain a phase separation structure suitable for suppressing dicing dust generation in the resin layer (A). Therefore, the lower limit of the fluidization temperature is preferably 100 ° C. or higher.
  • fluidization temperature in the present specification is a value obtained by a Koka flow tester. Specifically, using a die with a load of 49.05 N, a hole shape of ⁇ 2.0 mm, and a length of 5.0 mm, the sample temperature fluctuates with increasing temperature while increasing the sample temperature at a heating rate of 10 ° C./min.
  • the stroke displacement speed (mm / min) to be measured is measured to obtain a temperature dependence chart of the stroke displacement speed.
  • the stroke displacement rate increases when the sample temperature reaches the softening point, and once decreases after reaching a predetermined peak. After reaching the lowest point due to this descent, the stroke displacement speed rapidly increases as fluidization of the entire sample proceeds.
  • the temperature that gives the minimum value of the stroke displacement speed that appears after the stroke displacement speed once reaches the peak is defined as the fluidization temperature.
  • the density of the norbornene-based resin (a1) increases the difference in physical characteristics from the polypropylene-based resin (a2) sufficiently, and a phase separation structure suitable for suppressing dicing generation is easily obtained in the resin layer (A). From the viewpoint, it is preferably 0.98 g / cm 3 or more.
  • the norbornene-based resin (a1) may be crystalline or non-crystalline, but from the viewpoint of sufficiently increasing the difference in physical properties from the polypropylene-based resin (a2), It is preferably crystalline.
  • the polypropylene resin (a2) means a resin based on a propylene polymer that does not substantially contain a constituent unit derived from a norbornene compound.
  • the resin layer (A) according to this embodiment contains the norbornene resin (a1) and the polypropylene resin (a2), a phase separation structure is easily formed in the resin layer (A), and dicing dust is generated. Can be more effectively suppressed, and by containing the polypropylene resin (a2), delamination between the resin layer (A) and the pressure-sensitive adhesive layer 3 is less likely to occur, and when used as the dicing sheet 1, dicing is performed. The possibility of occurrence of defects (chip scattering, expandability deterioration, etc.) in the process and the expanding process is reduced.
  • the propylene polymer according to the polypropylene resin (a2) may be a propylene homopolymer or a copolymer of propylene and another compound having an ethylenically unsaturated bond.
  • a compound having an ethylenically unsaturated bond that gives a constituent unit other than a constituent unit derived from propylene, contained in the propylene-based polymer according to the polypropylene-based resin (a2) is also referred to as “other unsaturated compound”.
  • examples of other unsaturated compounds include alkenes having a double bond at the ⁇ -position of 4 to 18 carbon atoms such as 1-butene, 1-hexene and 1-octene.
  • Preferred examples include ⁇ -olefins and ethylene.
  • the propylene polymer related to the polypropylene resin (a2) is a copolymer of propylene and another unsaturated compound
  • the content of the structural unit derived from propylene in the copolymer is the copolymer content.
  • a mass ratio of propylene with respect to the whole monomer for forming a polymer it is 75 mass% or more and 99.9 mass% or less normally, Preferably it is 80 mass% or more and 99 mass% or less, More preferably, it is 85 mass%. It is not less than 99% by mass and more preferably not less than 90% by mass and not more than 99% by mass.
  • the propylene polymer according to the polypropylene resin (a2) contains a copolymer having a propylene mass ratio of 75% by mass or more, the generation of dicing waste when the dicing sheet 1 is processed. It is suppressed more stably.
  • the specific mode of the copolymer is not particularly limited, and a random copolymer, a block copolymer, and a graft copolymer are used. Any of these may be used, and the propylene polymer may contain these two or more types of copolymers. Of these forms, block copolymers are preferred from the viewpoint of more stably reducing the possibility of generating dicing waste in the dicing step.
  • the content of the polypropylene resin (a2) in all the resin components in the resin layer (A) is preferably 1% by mass or more and 60% by mass or less, and more preferably 2% by mass or more and 40% by mass or less. More preferably, it is 5 mass% or more and 20 mass% or less.
  • the content of the polypropylene resin (a2) in all resin components in the resin layer (A) is in the above range, generation of dicing waste is suppressed in the dicing process, and the tensile elastic modulus of the resin layer (A) is described later. It becomes easy to make it the range (1000 Mpa or less).
  • the polypropylene resin (a2) is preferably a thermoplastic resin from the viewpoint of facilitating the production of the resin layer (A).
  • the propylene polymer according to the polypropylene resin (a2) is not crosslinked or is in a state where the degree of crosslinking is appropriately controlled.
  • the melt mass flow rate (MFR) forms a phase separation structure between the norbornene resin (a1) and the polypropylene resin (a2) in the resin layer (A). From the viewpoint of easiness, it is preferably at least the melt mass flow rate (MFR) of the norbornene resin (a1).
  • melt mass flow rate (MFR) when measured at a temperature of 190 ° C. and a load of 2.16 kgf is preferably 0.5 g / 10 min or more and 10 g / 10 min or less, and 2.0 g / 10 min or more and 7. More preferably, it is 0 g / 10 min or less.
  • the melting peak temperature is preferably 120 ° C. or higher and 170 ° C. or lower, and more preferably 130 ° C. or higher and 165 ° C. or lower.
  • the melting peak temperature of the polypropylene resin (a2) is 120 ° C. or lower
  • the structure of the propylene polymer according to the polypropylene resin (a2) is not mainly a block polymer, and is a random copolymer and / or Mainly a graft copolymer. In such a case, there is a concern that it is difficult to suppress the generation of dicing waste.
  • the melting peak temperature of the polypropylene resin (a2) is 170 ° C. or higher, the molecular weight of the propylene polymer related to the polypropylene resin (a2) becomes excessively large, so the resin layer (A) is formed.
  • a resin composition including polypropylene-based resin (a2) as a component
  • the heat of fusion ⁇ H is preferably 60 J / g or more and 100 J / g or less, and 70 J / g or more and 90 J / g or less. More preferably, it is as follows.
  • the heat of fusion ⁇ H of the polypropylene resin (a2) is less than 60 J / g, the polypropylene resin (a2) is a norbornene resin (a2) because the crystallization degree of the propylene polymer related to the polypropylene resin (a2) is small.
  • the melting peak temperature and the heat of fusion ⁇ H in this specification are values obtained by a differential scanning calorimeter (in the test example, model number: Q2000 manufactured by TA Instruments Inc.). Specifically, the measurement is performed as follows. That is, after heating from ⁇ 50 ° C. to 250 ° C. at a heating rate of 20 ° C./min, rapid cooling to ⁇ 50 ° C., heating again to 250 ° C. at a heating rate of 20 ° C./min, and holding at that temperature . The peak temperature obtained by the second temperature rise measurement is taken as the melting peak temperature. Thereafter, the amount of heat of fusion ⁇ H is calculated from the data obtained when cooling from 250 ° C. to ⁇ 50 ° C. at a cooling rate of 20 ° C./min.
  • the tensile elastic modulus of the polypropylene resin (a2) suppresses the generation of dicing waste in the dicing process and stably realizes that the tensile elastic modulus of the resin layer (A) is 1000 MPa or less. It is preferably 600 MPa or more and 999 MPa or less, more preferably 650 MPa or more and 990 MPa or less, and particularly preferably 700 MPa or more and 990 MPa or less.
  • the resin layer (A) preferably further contains a low-elasticity resin (a3) in order to stably set the tensile elastic modulus to 1000 MPa or less.
  • the “low elastic resin (a3)” means a resin having a lower tensile elastic modulus at 23 ° C. than the polypropylene resin (a2). From the viewpoint of stably realizing that the tensile elastic modulus of the resin layer (A) is 1000 MPa or less, the tensile elastic modulus of the low elastic resin (a3) in the resin layer (A) is preferably 500 MPa or less, More preferably, it is 300 MPa or less, and particularly preferably 200 MPa or less. On the other hand, when the tensile elastic modulus of the low elastic resin (a3) in the resin layer (A) is excessively low, the tensile elastic modulus of the entire base film 2 may be excessively low.
  • the tensile elastic modulus of the low elastic resin (a3) is preferably 50 MPa or more, more preferably 60 MPa or more, and particularly preferably 80 MPa or more.
  • the content of the low elastic resin (a3) in all the resin components in the resin layer (A) is 30% by mass or more. It is preferable that it is 35 mass% or more, and it is especially preferable to set it as 40 mass% or more.
  • the content of the low elastic resin (a3) in the resin layer (A) is excessively high, the tensile elastic modulus of the entire base film 2 may be excessively low.
  • the dicing sheet There is a concern that the handling property of No. 1 may deteriorate.
  • the content of the low elastic resin (a3) in all the resin components in the resin layer (A) is preferably 96% by mass or less, more preferably 85% by mass or less, and 75% by mass or less. It is particularly preferred that
  • the specific configuration of the low-elasticity resin (a3) is not particularly limited as long as it satisfies the above-described requirements regarding the tensile elastic modulus.
  • the polymer constituting the low elastic resin (a3) may be one kind or plural kinds.
  • the low elastic resin (a3) is preferably a resin that is hardly compatible with the norbornene resin (a1) and highly compatible with the polypropylene resin (a2).
  • the low elastic resin (a3) is an ethylenic resin.
  • a resin based on a polymer containing a structural unit derived from a compound having a saturated bond is preferable.
  • the low-elasticity resin (a3) are based on one or more polymers selected from the group consisting of a polyethylene resin (a3i), a styrene-ethylene-butylene-styrene block copolymer, and a modified product thereof. Resin (SEBS resin) etc. are mentioned.
  • the polyethylene resin (a3i) which is a preferable example of the low-elasticity resin (a3) will be described in detail.
  • the resin layer (A) contains the polyethylene resin (a3i)
  • the polyethylene-based resin (a3i) is a kind of low-elasticity resin (a3), and is a resin based on a polymer (ethylene-based polymer) having a structural unit derived from ethylene.
  • Specific examples of the ethylene polymer related to the polyethylene resin (a3i) include ethylene homopolymer, ethylene- ⁇ olefin copolymer, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, Examples thereof include ethylene copolymers such as ethylene- (meth) acrylic acid ester copolymers.
  • the ethylene polymer according to the polyethylene resin (a3i) may be composed of a homopolymer composed of one type of monomer, or may be composed of a copolymer composed of a plurality of types of monomers.
  • the content rate of the structural unit derived from ethylene in the ethylene-based polymer related to the polyethylene-based resin (a3i) is generally 70% by mass or more as a mass ratio of ethylene to the whole monomer for forming the copolymer. Preferably, it is 70 mass% or more and 99.9 mass% or less, More preferably, it is 80 mass% or more and 99 mass% or less, Most preferably, it is 90 mass% or more and 98 mass% or less.
  • the polyethylene resin (a3i) contains an ethylene copolymer in which the mass ratio of ethylene is within the above range, the polyethylene resin (a3i) and the norbornene resin (a1) It is easy to form a phase separation structure, and it is more stably realized to suppress the generation of dicing waste in the dicing process.
  • the density of the ethylene polymer according to the polyethylene resin (a3i) is preferably 0.87 g / cm 3 or more and 0.92 g / cm 3 or less, and 0.89 g / cm 3 or more and 0.91 g / cm 3. More preferably, it is 3 or less.
  • the density of the ethylene-based polymer is less than 0.87 g / cm 3 , the adhesiveness of the resin layer (A) is excessively increased, and there is a concern that blocking may easily occur when the base film 21 is wound up. Is done.
  • the polyethylene resin (a3i) is preferably a thermoplastic resin.
  • the ethylene polymer according to the polyethylene resin (a3i) is not crosslinked or the degree of crosslinking is appropriately controlled. Is in a state of being.
  • the melt mass flow rate (MFR) forms a phase separation structure between the norbornene resin (a1) and the polyethylene resin (a3i) in the resin layer (A).
  • MFR melt mass flow rate
  • the melt mass flow rate (MFR) when measured at a temperature of 190 ° C. and a load of 2.16 kgf is preferably 0.5 g / 10 min or more and 10 g / 10 min or less, and 2.0 g / 10 min or more and 7. More preferably, it is 0 g / 10 min or less.
  • the melting peak temperature is preferably 90 ° C. or higher and 140 ° C. or lower, and more preferably 100 ° C. or higher and 130 ° C. or lower. preferable.
  • the heat of fusion ⁇ H of the thermoplastic resin and crystalline polyethylene resin (a3i) is preferably 50 J / g or more and 160 J / g or less.
  • the polyethylene resin (a3i) may satisfy the above characteristics (density and melting peak temperature and heat of fusion ⁇ H, etc. in the case of a thermoplastic resin) with one kind of ethylene polymer, You may satisfy said characteristic as a mixture of an ethylene polymer.
  • the polyethylene resin (a3i) is preferably a resin based on a mixture of an ethylene polymer having a low density and an ethylene polymer having a high density within the above range.
  • the resin layer (A) may contain components other than the above resins.
  • examples of such components include various additives such as pigments, flame retardants, plasticizers, antistatic agents, lubricants and fillers.
  • examples of the pigment include titanium dioxide and carbon black.
  • examples of the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles. The content of such an additive is not particularly limited, but should be within a range where the resin layer (A) exhibits a desired function and does not lose smoothness and flexibility.
  • the tensile elastic modulus of the resin layer (A) provided in the base film 2 for the dicing sheet 1 according to the present embodiment is such that the base film 2 can be broken in the expanding step. From the viewpoint of reducing the property, it is 1000 MPa or less. From the viewpoint of more stably reducing the possibility that the base film 2 breaks, the tensile elastic modulus of the resin layer (A) is preferably 900 MPa or less, and more preferably 500 MPa or less.
  • the low elasticity resin (a3) is included. It is preferable.
  • the tensile modulus of the resin layer (A) is preferably 50 MPa or more, more preferably 100 MPa or more, and particularly preferably 150 MPa or more.
  • the resin layer (A) preferably has thermoplasticity as a whole.
  • the fluidization temperature of the resin layer (A) is preferably 90 ° C. or higher and 120 ° C. or lower, and particularly preferably 100 ° C. or higher and 115 ° C. or lower.
  • the fluidization temperature of the resin layer (A) is 90 ° C. or higher, the base film 2 is less likely to be blocked, and good handling properties of the base film 2 can be ensured.
  • the fluidization temperature of the resin layer (A) exceeds 120 ° C., the base film 2 may be necked in the expanding process after dicing, and the chip interval may not be expanded uniformly.
  • the thickness of the resin layer (A) is preferably 10 ⁇ m or more and 120 ⁇ m or less, more preferably 20 ⁇ m or more and 100 ⁇ m or less, and particularly preferably 30 ⁇ m or more and 80 ⁇ m or less. If the thickness of the resin layer (A) is less than 10 ⁇ m, there is a concern that it is difficult to suppress the generation of dicing waste. On the other hand, when the thickness of the resin layer (A) exceeds 120 ⁇ m, there is a concern that the tensile elastic modulus of the base film 2 becomes excessively high and its expandability is lowered.
  • the resin layer (A) is composed of a single resin layer, but the resin layer (A) may have a structure composed of a plurality of resin layers. In this case, each layer constituting the resin layer (A) has the above-described compositional characteristics of the resin layer (A). As the resin layer (A) composed of a plurality of layers, the above-described conditions of the tensile elastic modulus, etc. Should be satisfied.
  • Resin layer (B) The resin layer (B) has a tensile modulus of 50 MPa or more and 500 MPa or less and a breaking elongation of 100% or more.
  • the resin layer (B) having such a high flexibility (extensibility) can impart excellent expand performance to the base film 2.
  • the tensile elastic modulus of the resin layer (B) exceeds 500 MPa, the flexibility of the resin layer (B) becomes low and the resin layer (B) is easily broken, so that the base film 2 has desired expanding performance. It becomes difficult.
  • the tensile elastic modulus of the resin layer (B) is less than 50 MPa, the handling property is deteriorated.
  • the preferred tensile modulus of the resin layer (B) is 55 MPa or more and 400 MPa or less, more preferred tensile modulus is 60 MPa or more and 300 MPa or less, and particularly preferred tensile modulus is 65 MPa or more and 200 MPa or less.
  • the breaking elongation of the resin layer (B) is less than 100%, the resin layer (B) is easily broken when the dicing sheet 1 is expanded, and the base film 2 has a desired expanding performance. It becomes difficult to have
  • the preferred breaking elongation of the resin layer (B) is 200% or more, and the particularly preferred breaking elongation is 300% or more.
  • the upper limit of the elongation at break of the resin layer (B) is not particularly limited, but is generally 1000% or less and may be about 800% or less.
  • Ratio of tensile elastic modulus of resin layer (A) to tensile elastic modulus of resin layer (B) tensile elastic modulus of resin layer (A) / tensile elastic modulus of resin layer (B), in this specification, “elastic modulus ratio” Is also preferably 10 or less.
  • the elastic modulus ratio is excessively large, the possibility of delamination between the resin layer (A) and the resin layer (B) increases when the base film 2 is stretched in the expanding step.
  • plastic deformation (yield) occurs in the resin layer (B) having a relatively low tensile modulus, and when the tensile force is released, the base film 2 curls so that the resin layer (A) side is inward.
  • the elastic modulus ratio is preferably 8 or less, and more preferably 4 or less.
  • the lower limit of the elastic modulus ratio is not particularly limited, but is usually 1.0 or more.
  • the elastic modulus ratio may be less than 1.0 because the tensile elastic modulus of the resin layer (B) is excessively high. In this case, there is an increased possibility that problems such as breakage of the base film occur in the expanding step.
  • the resin constituting the resin layer (B) is not particularly limited as long as it satisfies the above physical properties.
  • a resin include an olefin resin that is a resin based on a polymer containing an olefin compound as a structural unit; a polyester such as polyethylene terephthalate and polyethylene naphthalate; a polyurethane; a polyvinyl chloride; and a polyamide.
  • the resin constituting the resin layer (B) is preferably an olefin resin which is a resin based on a polymer containing an olefin compound as a structural unit.
  • the resin layer (B) adheres to the resin layer (A) containing the norbornene resin (a1) and the polypropylene resin (a2) described above. The possibility of delamination between the resin layer (A) and the resin layer (B) can be more stably reduced.
  • polystyrene resin examples include polyolefins such as polyethylene, polypropylene, polybutene, ethylene-propylene copolymer, ethylene-butene copolymer; one or more selected from olefin compounds and acrylic compounds And a copolymer obtained by polymerizing.
  • a copolymer examples include an ethylene- (meth) acrylic acid copolymer, an ethylene-vinyl acetate copolymer, and an ethylene- (meth) acrylic ester copolymer.
  • the polymer relating to the olefin resin may be a single type or a mixture of two or more types of polymers.
  • the resin layer (B) having excellent toughness is easily obtained, and the resin layer (B) with respect to the resin layer (A) containing the norbornene resin (a1) and the polypropylene resin (a2). Since the adhesion is high, an ethylene- (meth) acrylic acid copolymer is preferred as the polymer relating to the resin constituting the resin layer (B).
  • the content of the structural unit derived from (meth) acrylic acid in the ethylene- (meth) acrylic acid copolymer is expressed as a mass ratio of (meth) acrylic acid to the whole monomer for forming the copolymer, It is preferably 3% by mass or more and 20% by mass or less, more preferably 4% by mass or more and 15% by mass or less, and particularly preferably 5% by mass or more and 12% by mass or less.
  • the mass ratio of the (meth) acrylic acid is less than 3% by mass, the crystallinity of the resin layer (B) is increased, and the base film 2 is necked during expansion after dicing, so that the chip interval is uniform. It may be difficult to expand.
  • the mass ratio of the (meth) acrylic acid exceeds 20% by mass, the resin layer (B) itself may be sticky, and the dicing sheet 1 is conveyed when dicing using the apparatus. You might not be able to do it.
  • the ethylene- (meth) acrylic acid copolymer in addition to the structural unit derived from ethylene, acrylic acid and / or methacrylic acid, it is derived from other compounds as long as the purpose of the dicing sheet 1 according to this embodiment is not impaired. It may contain a structural unit. Examples of such other compounds include ⁇ -olefins such as propylene; (meth) acrylic acid esters such as methyl (meth) acrylate and ethyl (meth) acrylate.
  • the content of the structural unit derived from such other compound is the mass ratio of the other compound to the whole monomer for forming the copolymer in the ethylene- (meth) acrylic acid copolymer. The ratio is preferably less than 10% by mass.
  • the polymer according to the resin layer (B) preferably contains 70% by mass or more of the ethylene- (meth) acrylic acid copolymer based on the entire resin constituting the resin layer (B), and is 80% by mass. More preferably, it is contained, more preferably 90% by mass or more.
  • Resin layer (B) may contain components other than the above-mentioned resin.
  • components include various additives such as pigments, flame retardants, plasticizers, antistatic agents, lubricants and fillers.
  • the pigment include titanium dioxide and carbon black.
  • the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles. The content of such an additive is not particularly limited, but should be within a range where the resin layer (B) exhibits a desired function and does not lose smoothness and flexibility.
  • the thickness of the resin layer (B) is preferably 40 ⁇ m or more and 120 ⁇ m or less, and particularly preferably 50 ⁇ m or more and 100 ⁇ m or less.
  • the resin layer (B) is composed of a single resin layer, but the resin layer (B) may have a structure composed of a plurality of resin layers. In this case, what is necessary is just to satisfy the conditions of said tensile elasticity modulus and the conditions of breaking elongation as a resin layer (B) which consists of multiple layers.
  • An intervening layer such as an adhesive layer may exist between the resin layer (A) and the resin layer (B).
  • the tensile modulus of the base film 2 is preferably 70 MPa or more and 500 MPa or less, more preferably 100 MPa or more and 400 MPa or less, and 100 MPa or more and 300 MPa or less. It is particularly preferred.
  • the tensile elastic modulus is less than 70 MPa, when the wafer is attached to the dicing sheet 1 and fixed to the ring frame, the base film 2 is soft and may be loosened, which may cause a conveyance error.
  • the tensile modulus exceeds 500 MPa, the load applied during the expanding process must be increased, and thus there may be a problem that the dicing sheet 1 itself is peeled off from the ring frame.
  • the breaking elongation of the base film 2 is preferably 100% or more, particularly preferably 200% or more.
  • the base film 2 having a breaking elongation of 100% or more is not easily broken during the expanding step, and the chips formed by cutting the workpiece are easily separated.
  • the ratio of the thickness of the resin layer (B) to the thickness of the resin layer (A) (the thickness of the resin layer (A)) / Thickness of the resin layer (B)) is preferably 0.1 or more and 1.0 or less, and more preferably 0.25 or more and 1.0 or less.
  • the thickness of the base film 2 is not particularly limited, it is usually preferably 50 ⁇ m or more and 400 ⁇ m or less, more preferably 50 ⁇ m or more and 300 ⁇ m or less, and particularly preferably 60 ⁇ m or more and 200 ⁇ m or less.
  • the base film 2 may be manufactured by co-extrusion or the like by forming the resin layer (A) and the resin layer (B) at the same time and laminating the resin layer (A) and After each resin layer (B) is formed, the resin layer (A) and the resin layer (B) may be laminated by an adhesive or the like.
  • the resin layer (A) is prepared by kneading a norbornene resin (a1), a polypropylene resin (a2), a low-elasticity resin (a3) and other additive components as required, and directly from the kneaded product.
  • the pellets can be once produced and then formed by extrusion or the like.
  • the dicing sheet 1 includes a pressure-sensitive adhesive layer 3 formed so as to be in contact with the resin layer (A) in the base film 2. It does not specifically limit as an adhesive which comprises the adhesive layer 3, What is normally used as the dicing sheet 1 can be used, For example, rubber type, an acrylic type, an epoxy type, a silicone type, a polyvinyl ether type etc. An energy ray curable pressure sensitive adhesive (including an ultraviolet curable pressure sensitive adhesive) or a heat curable pressure sensitive adhesive can also be used. In addition, when the dicing sheet 1 in the present embodiment is used as a dicing die bonding sheet, an adhesive, a thermoplastic adhesive, a B stage adhesive, etc.
  • the thickness of the pressure-sensitive adhesive layer 3 is not particularly limited, and is usually 3 ⁇ m or more and 100 ⁇ m or less, preferably 5 ⁇ m or more and 80 ⁇ m or less.
  • the dicing sheet 1 may include components other than the base film 2 and the pressure-sensitive adhesive layer 3. As an example of such other components, a release sheet for protecting the surface of the pressure-sensitive adhesive layer 3 that is not in contact with the resin layer (A), that is, the surface to be attached to an object to be cut. It is done.
  • release sheets include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane Film, ethylene vinyl acetate film, ionomer resin film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc. Can be used. Moreover, you may use these bridge
  • the release surface of the release sheet (the surface facing the pressure-sensitive adhesive layer 3) is preferably subjected to a release treatment.
  • the release agent used for the release treatment include alkyd, silicone, fluorine, unsaturated polyester, polyolefin, and wax release agents.
  • the thickness of the release sheet is not particularly limited, and is usually about 20 to 150 ⁇ m.
  • the dicing sheet 1 which concerns on this embodiment can be manufactured by a conventional method.
  • a coating agent containing a material constituting the pressure-sensitive adhesive layer 3 and optionally a solvent is prepared, and a roll coater, knife coater, roll knife coater, air knife coater, die coater, bar coater, gravure coater, curtain coater.
  • It can be manufactured by forming the pressure-sensitive adhesive layer 3 by applying it to the exposed surface of the resin layer (A) of the base film 2 with a coating machine such as the like and drying it. Or after apply
  • the dicing sheet 1 according to the present embodiment can be preferably used as a dicing sheet used in dicing and expanding processes for semiconductor wafers, BGA type packages and the like.
  • the dicing sheet 1 according to the present embodiment is suitable as a dicing sheet used in a dicing process and an expanding process for a BGA type package in which a large amount of dicing waste is generated.
  • Norbornene resin 1 TOPAS (registered trademark) 8007 manufactured by Polyplastics, resin density at 23 ° C .: 1.02 g / cm 3 , tensile elastic modulus at 23 ° C .: 2.0 GPa, fluidization temperature: 142 ° C. MFR at a temperature of 230 ° C. and a load of 2.16 kgf: 12 g / 10 min
  • Norbornene resin 2 TOPAS (registered trademark) 7010 manufactured by Polyplastics, resin density at 23 ° C .: 1.02 g / cm 3 , tensile elastic modulus at 23 ° C .: 2.2 GPa, fluidization temperature: 163 ° C.
  • Norbornene resin 3 TOPAS (registered trademark) 5013 manufactured by Polyplastics, resin density at 23 ° C .: 1.02 g / cm 3 , tensile modulus at 23 ° C. 2.3 GPa, fluidization temperature: 175 ° C.
  • Polypropylene resin 1 ethylene-propylene block copolymer (Prime Polypro (registered trademark) F707W manufactured by Prime Polymer Co., Ltd., heat of fusion ⁇ H: 83.2 J / g, tensile elastic modulus at 23 ° C .: 980 MPa, temperature 190 ° C.
  • Polypropylene resin 2 ethylene-propylene random copolymer (Prime Polypro (registered trademark) B241 manufactured by Prime Polymer Co., Ltd. B241, tensile modulus at 23 ° C .: 750 MPa, heat of fusion ⁇ H: 78.6 J / g, temperature 190 ° C.
  • Low elastic resin 1 low density polyethylene (Sumikasen (registered trademark) L705, manufactured by Sumitomo Chemical Co., Ltd.), resin density: 0.918 g / cm 3 , heat of fusion ⁇ H: 126.0 J / g, tensile elastic modulus at 23 ° C .: 140 MPa , MFR when measured at a temperature of 190 ° C.
  • Low elastic resin 2 Ultra low density polyethylene (Exelen (registered trademark) VL700, manufactured by Sumitomo Chemical Co., Ltd., resin density: 0.900 g / cm 3 , heat of fusion ⁇ H: 79.1 J / g, tensile elastic modulus at 23 ° C .: (MFR when measured at 64 MPa, temperature 190 ° C., load 2.16 kgf: 7 g / 10 min, melting peak temperature: 105 ° C.)
  • pressure-sensitive adhesive Copolymer (Mw: 500,000) obtained by copolymerizing 95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid, 120 parts by mass of urethane acrylate oligomer (Mw: 8000), isocyanate 5 parts by mass of a system curing agent (Coronate L manufactured by Nippon Polyurethane Co., Ltd.) and 4 parts by mass of a photopolymerization initiator (Irgacure 184 manufactured by Ciba Specialty Chemicals) were mixed to obtain an energy ray curable pressure-sensitive adhesive composition.
  • a system curing agent Coronate L manufactured by Nippon Polyurethane Co., Ltd.
  • a photopolymerization initiator Irgacure 184 manufactured by Ciba Specialty Chemicals
  • the test piece was set to a distance between chucks of 100 mm with a tensile tester (Autograph AG-IS 500N manufactured by Shimadzu Corporation), and then a tensile test was performed at a speed of 200 mm / min.
  • the tensile modulus is measured in both the extrusion direction (MD) and the direction perpendicular to the extrusion direction (CD) during molding of the resin film or the base film, and the average value of these measurement results is the resin film or It was set as the tensile elasticity modulus of the base film.
  • the elongation at break (unit:%) was also measured at the same time as the measurement of the tensile elastic modulus. Specifically, the elongation at break was determined by dividing the distance between chucks when the test piece broke by 100 mm, which is the distance before the test. In addition, about the breaking elongation, the minimum value of the measurement result performed in both the extrusion direction (MD) at the time of shaping
  • tip was peeled by irradiating an ultraviolet-ray (160mJ / cm ⁇ 2 >) from the base film side.
  • an ultraviolet-ray 160mJ / cm ⁇ 2 >
  • the number of filamentous scraps having a length of 100 ⁇ m or more generated in one vertical line and one horizontal line near the center of each was measured using a digital microscope (VHX-100, Keyence Corporation, magnification: 100). Times).
  • the measurement results were evaluated according to the following criteria.
  • the results are shown in Table 2.
  • Test Example 4 (Handling evaluation) In carrying out the test example 2 (observation of dicing waste), dicing was performed with a dicing apparatus (DFD-651 manufactured by DISCO). The handling property at this time was evaluated according to the following criteria. A: When no special problems occur B: When a transport error occurs and / or when the wafer cassette is mounted again, the dicing sheet bends and touches another dicing sheet installed in the lower stage The results are shown in Table 2.
  • the dicing sheets produced in the examples are less likely to generate dicing waste during the dicing process, have excellent expandability during the expanding process, and are excellent in handling characteristics during the dicing process. It was.
  • the substrate film for dicing sheet and the dicing sheet according to the present invention are suitably used for dicing semiconductor wafers and various packages.

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  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un film de base (2) pour feuilles de découpage en dés, pourvu d'une couche de résine (A) et d'une couche de résine (B) stratifiée sur une surface de la couche de résine (A). La couche de résine (A) contient une résine de norbornène (a1), qui consiste en une résine contenant au moins un motif constitutif dérivé d'un composé norbornène et présentant un module d'élasticité en traction inférieur ou égal à 1 000 MPa à 23 °C, et une résine de polypropylène (a2), qui consiste en une résine basée sur un polymère de propylène. La couche de résine (B) présente un module d'élasticité en traction situé dans la plage allant de 50 MPa à 500 MPa (inclus) à 23 °C et un allongement à la rupture supérieur ou égal à 100 %. Ledit film de base (2) pour feuilles de découpage en dés présente d'excellentes propriétés de manipulation lors d'une étape de découpage en dés, tout en présentant une possibilité réduite de génération de poussière de découpage en dés lors du découpage en dés d'un objet devant être découpé, ainsi qu'une possibilité réduite de rupture de la base lors d'une étape de dilatation.
PCT/JP2013/071677 2012-09-04 2013-08-09 Film de base pour feuilles de découpage en dés et feuille de découpage en dés WO2014038353A1 (fr)

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JP2012193953A JP2015213096A (ja) 2012-09-04 2012-09-04 ダイシングシート用基材フィルムおよびダイシングシート
JP2012-193953 2012-09-04

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WO2015193990A1 (fr) * 2014-06-18 2015-12-23 リンテック株式会社 Film de base pour feuille de découpage en dés et feuille de découpage en dés
WO2015193991A1 (fr) * 2014-06-18 2015-12-23 リンテック株式会社 Film de base pour feuille de découpage en dés et feuille de découpage en dés

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WO2017110761A1 (fr) * 2015-12-24 2017-06-29 トヨタ自動車株式会社 Module de cellule solaire
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WO2018142467A1 (fr) * 2017-01-31 2018-08-09 株式会社アシックス Élément semelle et chaussure
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KR20220008823A (ko) * 2019-05-15 2022-01-21 다키론 씨아이 가부시키가이샤 다이싱 테이프용 기재 필름
JP7512663B2 (ja) 2020-04-28 2024-07-09 住友ベークライト株式会社 機能層貼付用フィルムセットおよび絶縁フィルム

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JP2009242519A (ja) * 2008-03-31 2009-10-22 Dainippon Printing Co Ltd 粘着フィルム
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WO2015193990A1 (fr) * 2014-06-18 2015-12-23 リンテック株式会社 Film de base pour feuille de découpage en dés et feuille de découpage en dés
WO2015193991A1 (fr) * 2014-06-18 2015-12-23 リンテック株式会社 Film de base pour feuille de découpage en dés et feuille de découpage en dés
KR20170018904A (ko) * 2014-06-18 2017-02-20 린텍 가부시키가이샤 다이싱 시트용 기재 필름 및 다이싱 시트
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JPWO2015193990A1 (ja) * 2014-06-18 2017-04-20 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
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KR102207369B1 (ko) 2014-06-18 2021-01-25 린텍 가부시키가이샤 다이싱 시트용 기재 필름 및 다이싱 시트

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