WO2014026976A1 - Module de del et procédé de fabrication d'un module de del - Google Patents

Module de del et procédé de fabrication d'un module de del Download PDF

Info

Publication number
WO2014026976A1
WO2014026976A1 PCT/EP2013/066893 EP2013066893W WO2014026976A1 WO 2014026976 A1 WO2014026976 A1 WO 2014026976A1 EP 2013066893 W EP2013066893 W EP 2013066893W WO 2014026976 A1 WO2014026976 A1 WO 2014026976A1
Authority
WO
WIPO (PCT)
Prior art keywords
led module
plastically deformable
board
band
shaped
Prior art date
Application number
PCT/EP2013/066893
Other languages
German (de)
English (en)
Inventor
Thomas Donauer
Franco Zanon
Alberto ZANOTTO
Matteo CALDON
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Priority to CN201390000710.3U priority Critical patent/CN204829434U/zh
Publication of WO2014026976A1 publication Critical patent/WO2014026976A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module with a plurality of LEDs comprising a band-shaped support member comprising at least one band-shaped board element, with which the plurality of LEDs is coupled, wherein the support member is formed flexible. It also relates to a method for producing such an LED module.
  • OSRAM LinearLight Flex Protect or OSRAM LinearLight Flex. While the OSRAM LinearLight Flex is a "bare" printed circuit board with LEDs, the OSRAM LinearLight Flex Protect encapsulates the LED module to provide moisture protection.
  • OSRAM LinearLight Flex is a "bare" printed circuit board with LEDs
  • OSRAM LinearLight Flex Protect encapsulates the LED module to provide moisture protection.
  • a generic LED module allows easy installation at almost The life span is at least five times longer than that of the neon tube and the assembly is also in the smallest Environments possible. Shadow-free illumination is also ensured.
  • the bendable element itself is not bright, but serves only as a mechanical support for a sitting at the end of the gooseneck bulbs, such as an LED module or a discharge lamp.
  • the object of the present invention is to develop a generic LED module or a generic method such that further applications are opened. This object is achieved by an LED module having the features of patent claim 1 and by a method having the features of patent claim 16.
  • modules are to be considered as plastically deformable, whose degree of plastic deformability, without impairing the function, permits bends of more than 90 °, preferably more than 150 ° in at least one direction, the bending radius being less than 100 times, preferably less than 100 times, more preferably less than 10 times the thickness of the elastic element and / or the LED module, but in particular less than 5 cm, particularly preferably less than 1 cm.
  • these bends more than 1 time, in particular more than 5 times possible.
  • the LED module should be bendable and dimensionally stable, that is, not recover after bending by itself. In this way, for example, a particularly simple and customer-friendly installation can be achieved.
  • An LED module according to the invention also opens up the possibility for a user to design free shapes himself by bending the LED module into the appropriate shape and the LED module maintaining this plastic deformation accordingly.
  • the LED module shines in the present case not only at the end to which the light source is attached, but over its entire length. In this way, luminaires can be designed by users themselves, with the additional advantage that the user can deform the module several times and thus make one and the same LED module accessible for other purposes. This reusability results in high cost savings for the user.
  • the present invention further solves the problem encountered in prior art LED modules known in the art which are provided with a self-adhesive backing. Due to the flexibility of LED modules known in the art where the protective material is silicone or polyurethane, these LED modules tend to come off particularly in those applications where tight angles or special tight shapes occur. In this respect, the known LED modules require a
  • Attachment structure which limits the range of potential applications.
  • an inventive LED module Due to the fact that the band-shaped support element is plastically deformable, the adhesive strength is significantly improved when providing an adhesive strip on the back side. Furthermore, a problem is eliminated, which has occurred in known from the prior art LED modules in the case of insufficient peel strength: By local detachments there were mechanical stresses in the LED module, whereby the life of the LED modules was significantly reduced. According to the invention, this goal is achieved in that the band-shaped support member is formed plastically deformable.
  • the band-shaped support member is formed plastically deformable such that it is bendable, in particular reversibly bendable, and holds the bent state independently.
  • the board element is designed such that it gives the support element the plastic deformability. Since that
  • Board element is present anyway, it can be modified in the sense of the present invention to give the LED module the desired plastic deformability.
  • the board element has a length, a width and a height, wherein the height is dimensioned such that the board element gives the plastic element the plastic deformability.
  • the height is between 100 ym and 500 ym.
  • the support element comprises a receiving element, in particular a U- or O-shaped receiving element, for the board element, wherein the support element further comprises at least one plastically deformable element.
  • at least one plastically deformable element can be arranged on the outside of the receiving element.
  • the at least one plastically deformable element is particularly preferably flat.
  • the receiving element on two side legs and a middle leg, wherein at least one plastically deformable element is arranged on the middle leg.
  • at least one plastically deformable element can be arranged within the receiving element.
  • Particularly preferred is at least one plastically deformable Element wire-shaped, in particular with a round cross-section or as a flexible sheet or gooseneck.
  • the receiving element may be filled with a transparent material, in particular silicone or PVC or polyurethane.
  • a transparent material in particular silicone or PVC or polyurethane.
  • the at least one plastically deformable element and / or the board element may comprise copper or aluminum.
  • the at least one plastically deformable element has a coefficient of elasticity of 50 to 150 kN / mm 2 at 20 ° C, in particular from 50 to 130 kN / mm 2 at 20 ° C, on. This ensures that, with a suitably selected yield strength, a not too great force is required for deformation of the element, whereby the shape once achieved by plastic deformation is nevertheless retained and does not deform again, for example due to the inherent weight of the module.
  • the yield strength of the material of the plastically deformable element is preferably chosen so that a deformation of the LED module by hand is still possible.
  • the elongation at fracture of the material of the plastically deformable element as well as the maximum stress of the material are to be chosen depending on the geometry of the element and the LED module such that they be exceeded in any area of the material volume at a normal deformation. In this way, a permanent plastic deformability is provided, without causing breakage or damage to the plastically deformable element.
  • the LED module usually has at least a first and a second voltage connection for the supply.
  • the at least one plastically deformable element is thus coupled to the first and the second voltage connection, so that the LED module can also be used for the transmission of power. This is particularly advantageous for long LED modules. Further advantageous embodiments will become apparent from the dependent claims.
  • a preferred embodiment of the method according to the invention is characterized in that the board element and at least one plastically deformable element are extruded together to produce the band-shaped support element.
  • a protective material in particular a so-called IP material (Ingress Protection)
  • IP material IP material
  • the protective material is preferably transparent.
  • a plastically deformable element is first coupled to a receiving element for producing the band-shaped carrier element, the coupling in particular comprising gluing.
  • the board element with the receiving element also in particular by gluing coupled.
  • a protective material in particular transparent silicone, is applied at least to the board element, in particular by casting.
  • Receiving element are provided. Then, the board element is then coupled to the receiving element, in particular by gluing. Subsequently, a protective material, in particular transparent silicone, is applied again, at least to the board element, in particular by casting.
  • a protective material in particular transparent silicone
  • Fig. 1 in a schematic representation a first
  • Fig. 2 is a schematic representation of a second
  • Embodiment of an LED module according to the invention shows a schematic illustration of a first example of an application of an LED module according to the invention
  • Fig. 4 is a schematic representation of a second
  • FIG. 5 is a schematic representation of a view from below (FIG. 5a) and from above (FIG. 5b) of an embodiment of an LED module according to the invention
  • FIG. 6 shows two schematic representations for illustrating the production of an LED module according to a first exemplary embodiment of a method according to the invention for producing an LED module by extrusion
  • FIG. 7 is a schematic representation of production steps of a second embodiment of a method according to the invention.
  • Fig. 8 shows two further application examples of an LED module according to the invention.
  • Fig. 1 shows a schematic representation of a first embodiment of an LED module 10 according to the invention in cross-sectional view.
  • This comprises a band-shaped, that is elongate, board element 12, on which a plurality of LEDs 14 are arranged.
  • This may be, for example, a populated printed circuit board (assembled PCB - Printed Circuit Board).
  • a U-shaped receiving element which consists in particular of silicone or plastic, is denoted by 16 and serves to receive the assembled printed circuit board 12.
  • the U-shaped receiving element 16 is provided with a transparent material 18, which is for example silicone or PVC or Polyurethane can act poured out.
  • a plastically deformable element 20 is mounted, which consists in particular of aluminum or copper.
  • the combination of the elements by the reference numerals 12, 16, 18, 20 referred to as a support member 22. That is, it can be provided that the support element 22 is fitted later only with the LEDs 14, in particular in embodiments in which there is no casting with a material 18.
  • the stiffness of a module 10 that is, the resistance of the module to deformation by a force or a torque, depends on the materials used, in particular their coefficient of elasticity and yield strength, as well as the processing as well as the geometry of the module 10. While a known flexible LED module based on its molding materials used a low
  • Materials with a higher coefficient of elasticity such as aluminum (70 kN / mm 2 at 20 ° C) or copper (100 to 130 kN / mm 2 at 20 ° C) are more resistant to deformation.
  • plastic deformation or plasticity describe the ability of solid materials to permanently deform under the action of force and to maintain this shape after exposure. For example, a thin metal wire is bendable in all directions and has a high plasticity.
  • the plastically deformable element 20 can be glued to the U-shaped receiving element 16.
  • the plastically deformable element 20 can also be designed as a gooseneck, which supports the U-shaped receiving element 16 from the rear.
  • an adhesive tape may be attached to facilitate the assembly of an LED module 10 according to the invention.
  • the length of an LED module 10 according to the invention can be in particular up to 100 m.
  • the height of the board element of Fig. 1 is usually 18 to 75 ym.
  • the plastically deformable element 20 is designed as a round metal wire, which is arranged within the U-shaped receiving element 16 and cast into the U-shaped receiving element 16 by means of the transparent material 18 is.
  • the plastically deformable element 20 may also be designed differently, for example, flat or rectangular.
  • the plastically deformable element 20 may be formed for example by a thick strand or a gooseneck.
  • the plastic deformability is achieved in that the board element 12 is made thicker than usual.
  • the height in this embodiment is preferably between 100 ym and 500 ym.
  • An adhesive tape may be arranged on the rear side of the U-shaped receiving element 16 in order to facilitate the assembly of an LED module 10 according to the invention.
  • the plastically deformable elements 20 used in the exemplary embodiments according to FIGS. 1 and 2 can be used to increase the carrying capacity or for further electrical contacting and wiring.
  • the plastically deformable element 20 can be used as a return conductor when the LEDs 14 of the LED module 10 are connected in series, for example.
  • a corresponding insulation is to be provided for this purpose.
  • the plastically deformable elements 20 also serve by their thermal conductivity for cooling the corresponding LED module 10th FIGS. 3 and 4 show possible applications of an LED module 10 according to the invention.
  • Typical applications of an LED module 10 according to the invention are, for example, self-supporting and at the same time self-luminous structures, for example floor or table lamps, whereby in particular a new type of luminaire in freeform geometries is simpler, more cost-effective and with smaller space can be designed.
  • FIG. 4 shows by way of example a coiled helix which has been formed from an LED module 10 according to the invention.
  • This product is self-supporting and can, for example, be placed on the ground as a light or suspended from a ceiling.
  • Fig. 5 shows a schematic representation of an embodiment of an LED module 10 according to the invention, in which three semi-rigid metal wires 20 are coupled to the board element 12, by pouring into a transparent material 18.
  • the metal wires 20 are arranged on the back of the board element 12 so that the optical properties are not affected.
  • Fig. 6 shows two schematic sketches to illustrate an embodiment of a manufacturing method according to the invention.
  • the board element 12 is arranged thereon with LEDs 14 together with the metal wires 20 in a protective material 18 and extruded at the same time.
  • the protective material 18 is preferably transparent.
  • plastically deformable elements in particular metal wires 20, inside or outside of an egg ⁇ shaped receiving element 16, which preferably consists of silicone, glued. Subsequently, the board element is glued to the U-shaped receiving member 16 and finally potted the surface with a protective material.
  • Fig. 7 is already equipped with plastically deformable elements 20, in particular metal wires
  • Receiving element 16 is provided, in which plastically deformable elements 20, in particular metal wires, are arranged. In this case, this basic structure is already plastically deformable.
  • the board element 12 comprising the LEDs 14 is glued to the receiving element 16, see Fig. 7b, and finally the surface with protective material 18 shed, see Fig. 7c.
  • the protective material 18 is again preferably transparent.
  • An inventive LED module may further be provided on its back with an adhesive strip to facilitate the assembly of an LED module 10 according to the invention.
  • FIGS. 8 a and 8 b show two further applications of an LED module 10 according to the invention.
  • the LED module 10 has mechanical, electrical and thermal improvements as a result of the measures according to the invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention concerne un module de DEL (10) pourvu d'un élément porteur (22) en forme de bande qui comprend au moins un élément platine (12) en forme de bande auquel une pluralité de DEL (14) est couplée, l'élément porteur (22) étant conçu flexible et l'élément porteur (22) en forme de bande étant en outre conçu plastiquement déformable. L'invention concerne également un procédé de fabrication correspondant d'un tel module de DEL (10).
PCT/EP2013/066893 2012-08-14 2013-08-13 Module de del et procédé de fabrication d'un module de del WO2014026976A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201390000710.3U CN204829434U (zh) 2012-08-14 2013-08-13 Led模块

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012214492.7A DE102012214492B4 (de) 2012-08-14 2012-08-14 LED-Modul und Verfahren zum Herstellen eines LED-Moduls
DE102012214492.7 2012-08-14

Publications (1)

Publication Number Publication Date
WO2014026976A1 true WO2014026976A1 (fr) 2014-02-20

Family

ID=48998600

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/066893 WO2014026976A1 (fr) 2012-08-14 2013-08-13 Module de del et procédé de fabrication d'un module de del

Country Status (3)

Country Link
CN (1) CN204829434U (fr)
DE (1) DE102012214492B4 (fr)
WO (1) WO2014026976A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016074886A1 (fr) * 2014-11-10 2016-05-19 Ronny Kirschner Système d'éclairage pourvu d'un élément de tension tendu et une bande de del
WO2016174626A1 (fr) * 2015-04-29 2016-11-03 Iguzzini Illuminazione S.P.A. Dispositif d'éclairage en forme de bande comprenant des sources électroluminescentes ponctuelles, pourvu d'un moyen conçu pour commander les mouvements d'allongement et de torsion de ladite bande
EP3130844A1 (fr) * 2015-08-13 2017-02-15 Philips Lighting Holding B.V. Dispositif d'éclairage allongé sur la base d'une technologie d'éclairage à état solide
CN107709878A (zh) * 2015-04-27 2018-02-16 B/E航空公司 柔性led照明元件
WO2018065378A1 (fr) * 2016-10-06 2018-04-12 Döllken-Kunststoffverarbeitung Gmbh Panneau pour meubles
EP3360392A4 (fr) * 2015-10-07 2019-05-15 B/E Aerospace, Inc. Élément d'éclairage à del flexible
IT201800003694A1 (it) * 2018-03-16 2019-09-16 Linea Light S R L Striscia luminosa e relativo metodo di fabbricazione
US10433393B2 (en) 2008-09-24 2019-10-01 B/E Aerospace, Inc. Flexible LED lighting element

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017106734A1 (de) 2017-03-29 2018-10-04 Vossloh-Schwabe Lighting Solutions GmbH & Co. KG Trägeranordnung für wenigstens ein elektrisches und/oder elektronisches Bauteil, Verfahren zu deren Herstellung sowie Leuchtenbaugruppe mit einer Trägeranordnung
ES1211489Y (es) * 2018-04-06 2018-07-26 Ohmio Servicios Integrales S L Tira de leds con iluminacion discontinua

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EP1308668A1 (fr) * 2001-10-31 2003-05-07 Yen-Chuan Hsu Structure de tube lumineux
US20040037079A1 (en) * 2002-08-26 2004-02-26 Luk John F. Flexible LED lighting strip
DE102008054288A1 (de) * 2008-11-03 2010-05-06 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines flexiblen Leuchtbands
WO2011110217A1 (fr) * 2010-03-09 2011-09-15 Tri-O-Light Bv Bande lumineuse

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DE20216833U1 (de) * 2002-10-31 2004-03-04 Osram Opto Semiconductors Gmbh Beleuchtungsanordnung mit LEDs
DE202005006643U1 (de) * 2005-04-26 2005-09-08 Fan, Ben, Hsitzu Flexible LED-Kabel-Beleuchtung
IT1402856B1 (it) * 2010-10-28 2013-09-27 Posa S P A Strisce di led incapsulate in guaine flessibili in elastomero siliconico vulcanizzabile a freddo, relativo processo di preparazione e loro uso come guarnizioni

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EP1308668A1 (fr) * 2001-10-31 2003-05-07 Yen-Chuan Hsu Structure de tube lumineux
US20040037079A1 (en) * 2002-08-26 2004-02-26 Luk John F. Flexible LED lighting strip
DE102008054288A1 (de) * 2008-11-03 2010-05-06 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines flexiblen Leuchtbands
WO2011110217A1 (fr) * 2010-03-09 2011-09-15 Tri-O-Light Bv Bande lumineuse

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10433393B2 (en) 2008-09-24 2019-10-01 B/E Aerospace, Inc. Flexible LED lighting element
WO2016074886A1 (fr) * 2014-11-10 2016-05-19 Ronny Kirschner Système d'éclairage pourvu d'un élément de tension tendu et une bande de del
CN107709878A (zh) * 2015-04-27 2018-02-16 B/E航空公司 柔性led照明元件
WO2016174626A1 (fr) * 2015-04-29 2016-11-03 Iguzzini Illuminazione S.P.A. Dispositif d'éclairage en forme de bande comprenant des sources électroluminescentes ponctuelles, pourvu d'un moyen conçu pour commander les mouvements d'allongement et de torsion de ladite bande
CN107980087B (zh) * 2015-04-29 2020-11-13 伊古齐尼照明有限公司 设有适于控制带的延伸和扭转运动的装置的包括点发光源的带状照明设备
CN107980087A (zh) * 2015-04-29 2018-05-01 伊古齐尼照明有限公司 设有适于控制带的延伸和扭转运动的装置的包括点发光源的带状照明设备
CN107923604A (zh) * 2015-08-13 2018-04-17 飞利浦照明控股有限公司 基于固态照明技术的细长照明设备
WO2017025286A1 (fr) * 2015-08-13 2017-02-16 Philips Lighting Holding B.V. Dispositif d'éclairage allongé basé sur la technologie d'éclairage à semi-conducteur
CN107923604B (zh) * 2015-08-13 2019-12-06 飞利浦照明控股有限公司 基于固态照明技术的细长照明设备
US10655797B2 (en) 2015-08-13 2020-05-19 Signify Holding B.V. Elongated lighting device based on solid state lighting technology
EP3130844A1 (fr) * 2015-08-13 2017-02-15 Philips Lighting Holding B.V. Dispositif d'éclairage allongé sur la base d'une technologie d'éclairage à état solide
EP3360392A4 (fr) * 2015-10-07 2019-05-15 B/E Aerospace, Inc. Élément d'éclairage à del flexible
WO2018065378A1 (fr) * 2016-10-06 2018-04-12 Döllken-Kunststoffverarbeitung Gmbh Panneau pour meubles
IT201800003694A1 (it) * 2018-03-16 2019-09-16 Linea Light S R L Striscia luminosa e relativo metodo di fabbricazione
WO2019175914A1 (fr) * 2018-03-16 2019-09-19 Linea Light S.R.L. Bande d'éclairage et procédé de fabrication correspondant

Also Published As

Publication number Publication date
CN204829434U (zh) 2015-12-02
DE102012214492B4 (de) 2016-09-15
DE102012214492A1 (de) 2014-02-20

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