WO2014020862A1 - Intaglio plate for offset gravure printing and printed wiring board - Google Patents

Intaglio plate for offset gravure printing and printed wiring board Download PDF

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Publication number
WO2014020862A1
WO2014020862A1 PCT/JP2013/004483 JP2013004483W WO2014020862A1 WO 2014020862 A1 WO2014020862 A1 WO 2014020862A1 JP 2013004483 W JP2013004483 W JP 2013004483W WO 2014020862 A1 WO2014020862 A1 WO 2014020862A1
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WO
WIPO (PCT)
Prior art keywords
pattern
printing
intaglio
gravure offset
offset printing
Prior art date
Application number
PCT/JP2013/004483
Other languages
French (fr)
Japanese (ja)
Inventor
健太郎 窪田
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to CN201380035908.XA priority Critical patent/CN104411502B/en
Priority to JP2014527971A priority patent/JP6217639B2/en
Publication of WO2014020862A1 publication Critical patent/WO2014020862A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Definitions

  • the present invention relates to an intaglio used for gravure offset printing, and a printed wiring substrate provided with a wiring pattern formed by gravure offset printing using the intaglio.
  • Gravure offset printing is a method for stably printing excellent images with high resolution and high dimensional accuracy over a wide area using various high-viscosity coating materials such as various inks, resins, and conductive pastes on the surface of printing objects. It is a technique to do.
  • Fig. 1 shows a general gravure offset printing process.
  • Gravure offset printing is a process of filling the ink 102 with a doctor, squeegee or scraper 103 into the pattern portion 104 of the gravure offset printing intaglio 101 made of glass, resin, metal, etc. (step 1), and the pattern portion.
  • a gravure offset printing intaglio 101 filled with ink 102 in 104 is rotated while contacting a transfer body 111 having a transfer layer 112 formed of a resin such as silicone on the surface, and an ink film is formed on the transfer layer 112.
  • a step of transferring 113 (step 2), and a step of pressure-bonding the transfer body 111 to the printing body 121 and transferring the print pattern 122 of the ink film 113 remaining on the transfer layer 112 to the printing body 121 (step 3).
  • a transfer printing method In this gravure offset printing, coating materials having high viscosity such as various inks, resins, and conductive pastes can be printed on the surface of a printing medium in a wide range with high resolution and high dimensional accuracy.
  • the ink filled in the desired pattern portion provided in the intaglio is reliably transferred onto the transfer layer having ink releasability. Is required.
  • the ink is filled in the desired pattern part with a doctor, squeegee or scraper in advance, and the ink surface filled in the pattern part is smoothed, and the ink peelability It is necessary for the ink surface to be in uniform contact with the transfer body when it is pressure-bonded to the transfer body having the transfer layer.
  • Patent Document 1 specifically describes means for smoothing the ink surface filled in the pattern portion of the intaglio, bringing the ink surface into contact with the transfer body evenly, and reliably transferring the ink surface onto the transfer layer.
  • the pattern to be printed exists continuously substantially perpendicular to the printing progress direction
  • the transfer body is rotated while contacting the intaglio
  • the distortion of the transfer layer generated inside the continuous pattern portion of the intaglio The problem is that the shape of the ink film transferred to the transfer layer changes continuously because the behavior is different within each continuous pattern part of the intaglio that exists continuously perpendicular to the direction of movement of the transfer body. Occurs. This problem becomes more prominent as high-definition fine line patterns are formed in gravure offset printing.
  • an object of the present invention is to prevent a change in the shape of a continuous pattern in the printing direction, particularly a continuous fine line pattern, and to stably supply a printed wiring substrate having a high-definition wiring pattern.
  • one aspect of the present invention is a gravure offset printing intaglio having a pattern part for forming a wiring pattern, wherein a part of the pattern part is in a printing direction.
  • a plurality of fine line-shaped pattern portions extending in a substantially vertical direction and continuously arranged in the printing direction; (a) a dummy pattern portion is provided at the upper end in the printing direction of the plurality of fine line-shaped pattern portions; (B) Of the plurality of fine line-shaped pattern portions, the line width of the pattern portion located at the start end in the printing direction satisfies any one of the narrower than the line width of the pattern portion located at the end in the printing direction. It is characterized by.
  • the line width of the plurality of fine line-shaped pattern portions is 10 ⁇ m or more and 5 mm or less, and the distance between the lines is 10 ⁇ m or more and 100 ⁇ m or less.
  • another aspect of the present invention is a printed wiring substrate including a wiring pattern formed by gravure offset printing, wherein a part of the wiring pattern extends in a direction substantially perpendicular to the printing direction and extends in the printing direction.
  • a plurality of fine line-shaped wiring patterns arranged side by side; (a) having a dummy pattern at the upper end in the printing direction of the plurality of fine line-shaped wiring patterns; and (b) a plurality of fine line-shaped wiring patterns.
  • the line width of the plurality of thin line-shaped wiring patterns is 10 ⁇ m or more and 5 mm or less, and the distance between the lines is 10 ⁇ m or more and 100 ⁇ m or less.
  • the intaglio for gravure offset printing of the present invention By using the intaglio for gravure offset printing of the present invention, it becomes possible to perform printing with high reproducibility without a change in shape on a thin line-like wiring pattern continuous in the printing direction.
  • the effect of the gravure offset printing intaglio according to the present invention becomes more prominent as the wiring pattern becomes thinner, it is suitable for forming a fine wiring pattern.
  • FIG. 1 is a process diagram of gravure offset printing according to the present invention.
  • FIG. 2 is a top view of an intaglio for gravure offset printing having a pattern portion having a conventional shape.
  • FIG. 3 is a top view showing an embodiment of an intaglio for gravure offset printing according to the present invention.
  • FIG. 4 is a top view showing an embodiment of the gravure offset printing intaglio according to the present invention.
  • FIG. 5 is a top view showing the gravure offset printing intaglio according to Example 1.
  • FIG. 6 is a top view showing an intaglio for gravure offset printing according to Example 2.
  • FIG. 1 is a process diagram of gravure offset printing according to the present invention.
  • FIG. 2 is a top view of an intaglio for gravure offset printing having a pattern portion having a conventional shape.
  • FIG. 3 is a top view showing an embodiment of an intaglio for gravure offset printing according to the present invention.
  • FIG. 4
  • FIG. 1 is a process chart of the general gravure offset printing described above.
  • the ink 102 is put on the gravure offset printing intaglio 101, and the gravure is rolled while the ink 102 is rolled in the direction of the arrow in the figure by a doctor, a squeegee or a scraper 103.
  • the ink 102 is filled into the pattern portion 104 of the intaglio 101 for gravure offset printing.
  • the pattern portion 104 of the intaglio 101 for gravure offset printing is formed by a groove having a width of about 10 ⁇ m to 5 mm and a depth of about 5 ⁇ m to 20 ⁇ m.
  • the distance between the grooves is about 10 ⁇ m to 100 ⁇ m, preferably 20 to 50 ⁇ m.
  • the present invention is particularly effective for an intaglio for gravure offset printing having a groove having a width of about 10 ⁇ m to 100 ⁇ m, and having a distance between the grooves of about 10 ⁇ m to 100 ⁇ m, and further 20 ⁇ m to 50 ⁇ m.
  • the gravure offset printing intaglio 101 has a smooth surface. Thereby, it is possible to print without causing ink leakage to the surface of the intaglio. Further, chipping of a doctor or the like can be suppressed.
  • the surface of the intaglio 101 for gravure offset printing is the surface in contact with the doctor, squeegee or scraper 103 in the intaglio 101 for gravure offset printing, or the inner surface of the pattern portion 104 (groove) of the intaglio 101 for gravure offset printing. I mean. Note that the surface of the gravure offset printing intaglio 101 can be smoothed by rough surface polishing, mirror polishing, or ultra-precision polishing (lapping or polishing).
  • Examples of the method for forming the pattern portion 104 of the intaglio 101 for gravure offset printing include an etching method, an electroforming method, and a sand blast method. From the viewpoint of workability by these forming methods, the gravure offset printing intaglio 101 is preferably made of glass or a metal such as copper or nickel. Further, it is desirable to form a rubbing resistant film of chromium or carbon on the surface.
  • the doctor, squeegee or scraper 103 needs to be filled with the ink 102 in the pattern portion 104 of the gravure offset printing intaglio 101 and scrape the ink 102 on the gravure offset printing intaglio 101 to some extent. Flexibility is required. Therefore, the doctor, squeegee or scraper 103 is preferably made of a metal such as stainless steel, a resin such as urethane, or a ceramic.
  • the transfer body 111 having the transfer layer 112 is rotated and moved on the intaglio plate 101 for gravure offset printing in which the pattern portion 104 is filled with the ink 102, and gravure offset printing is performed.
  • the ink 102 in the pattern portion 104 of the intaglio 101 is transferred to the transfer layer 112, and an ink film 113 is formed on the transfer layer 112.
  • a material for forming the transfer layer 112 a known material can be used, and among these, silicone rubber is desirable.
  • the surface of the transfer layer 112 and the surface of the ink 102 filled in the pattern portion 104 of the gravure offset printing intaglio 101 are in the contact surface. It is necessary to touch evenly.
  • the transfer layer of the transfer body largely falls into the pattern portion located at the start end in the printing direction. The transfer layer of the transfer body cannot sufficiently contact the ink inside the pattern portion in the pattern portion to be contacted next, and there is a problem that the ink cannot be sufficiently transferred.
  • a gravure offset printing intaglio having a pattern portion (pattern portion having the same shape) having a conventional shape shown in FIG.
  • a gravure offset printing intaglio 210 including a plurality of thin line-like pattern portions 211 extending in a direction perpendicular to the Y direction (X direction) and continuously arranged is used to form a pattern.
  • the transfer member is rotated and moved in the Y direction after the ink is filled in the portion 211, the transfer layer of the transfer member falls into the concave portion 212 at the start end of the pattern portion 211, and is arranged in parallel in the Y direction with respect to the concave portion 212.
  • a phenomenon occurs in which the ink film transferred from the recessed portions 213 and other recessed portions gradually becomes thinner in the Y direction.
  • the shape of the wiring pattern in the printing direction changes, and the designed wiring pattern is reproduced. Can not do it.
  • the difference in shape between the recess 212 and the recess 212 adjacent to the recess 212 in the Y direction becomes significant.
  • the pattern portion of the gravure offset printing intaglio is, for example, a dummy pattern portion on the upper end of the concave portion 312 at the start end in the Y direction in the pattern portion 311 as in the gravure offset printing intaglio 310 shown in FIG. 313 is arranged.
  • the transfer body is rotated and moved in the Y direction using the gravure offset printing intaglio plate 310 provided with the dummy pattern portion 313, the transfer layer of the transfer body is intentionally dropped into the dummy pattern portion 313, so that the subsequent pattern Contact with the portion 311 can be stabilized.
  • the printing direction refers to the moving direction of the transfer body when the ink film transferred to the transfer layer surface of the transfer body is transferred to the printing medium.
  • This printing direction is the same as the moving direction of the transfer body when the ink filled in the pattern portion of the gravure offset printing intaglio is transferred to the transfer layer surface of the transfer body.
  • the starting end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most upstream side in the moving direction of the transfer body. In other words, it refers to the position of the concave portion of the gravure offset printing intaglio that first comes into contact with the transfer body. Specifically, it refers to a position where the recess 212 in FIG.
  • the end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most downstream side in the moving direction of the transfer body. In other words, it refers to the position of the recess of the gravure offset printing intaglio that comes into contact with the transfer body last.
  • the upper end in the printing direction of the pattern portion of the gravure offset printing intaglio plate refers to the position in the direction opposite to the printing direction of the concave portion arranged on the most upstream side in the moving direction of the transfer body. Specifically, FIG. This is the position of the dummy pattern portion 313 adjacent in the direction opposite to the printing direction of the recess 312.
  • the dummy pattern part may or may not be arranged as a part of the pattern part for forming the wiring pattern. That is, the pattern formed by the dummy pattern portion may or may not be conductive. Therefore, the shape of the dummy pattern portion may be a disconnected shape.
  • a part of the pattern portion of the gravure offset printing intaglio is a plurality of fine line-shaped pattern portions extending in a direction substantially perpendicular to the printing direction and continuously arranged in the printing direction.
  • the effect becomes noticeable.
  • the thin line pattern part extends in a direction substantially perpendicular to the printing direction, the pattern part becomes substantially parallel to the width direction of the transfer body, so that the transfer layer of the transfer body drops into the pattern part. It is easily affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion.
  • the direction substantially perpendicular to the printing direction means that the pattern portion strictly extends with respect to the printing direction as long as the pattern portion extends in a direction that is affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion. This means that it does not have to be in the vertical direction.
  • the pattern portion extends in a direction perpendicular to the printing direction or extends in a direction substantially perpendicular (specifically, a direction inclined by about 60 to 120 degrees with respect to the printing direction), the present invention. Can be suitably applied.
  • the area (length) of the pattern portion that is affected by the transfer layer of the transfer body increases, so that the transfer that occurs inside the pattern portion It is susceptible to strain behavior of the body transfer layer.
  • the line width of the pattern portion 411 of the intaglio 410 for gravure offset printing is set in the printing direction (here, as shown in FIG. 4).
  • a method of changing from the start end to the end in the (Y direction) is effective. For example, among the pattern portions 411 in FIG.
  • the line width of a plurality of concave portions 412 including a concave portion at the start end in the printing direction and a concave portion located in the vicinity thereof is set to an average line width of the entire pattern portion 411 (a desired wiring pattern
  • the line width of the plurality of concave portions 413 including the concave portion at the end in the printing direction and the concave portion located in the vicinity of the pattern portion 411 is made 10% thinner than the designed line width for forming the line width). , 10% thicker than the average line width. Thereby, it is possible to suppress the line width variation of the entire ink film transferred from the pattern portion 411.
  • the pattern portion 411 of the gravure offset printing intaglio 410 shown in FIG. 4 adjusts the line widths of the pattern portions near the start end in the printing direction and near the end (three recesses near the start end and near the end, respectively). It is sufficient that at least the line width of the pattern portion located at the start end in the printing direction is narrower than the line width of the pattern portion located at the end in the printing direction. Thereby, it is possible to suppress the influence on the line width of the print pattern due to the drop of the transfer layer of the transfer body onto the pattern portion located at the start end in the printing direction.
  • the pattern portion is gradually changed from the start end to the end.
  • the line width of the part may be made narrower than the average line width only at the starting end.
  • the transfer body 111 is rolled on the substrate 121 to transfer the ink film 113, thereby forming the print pattern 122 and obtaining the printed wiring substrate.
  • the printed wiring board of the present invention is produced by gravure offset printing using the above-described intaglio for gravure offset printing of the present invention.
  • the ink filled in the pattern portion of the intaglio for gravure offset printing of the present invention is transferred onto the transfer layer of the transfer body.
  • the formed ink film is transferred onto the base material to form a print pattern on the base material.
  • the printed pattern formed on the substrate is a plurality of fine line-shaped wiring patterns that partially extend in a direction substantially perpendicular to the printing direction and are continuously arranged in the printing direction. Then, a dummy pattern is formed at the upper end in the printing direction of the plurality of thin line-shaped wiring patterns.
  • the printed wiring base material of the present invention has a dummy pattern, it has a high-definition wiring pattern with little change in the shape of the wiring pattern.
  • a plurality of fine wiring patterns are formed in which the line width of the pattern located at the start end in the printing direction is narrower than the line width of the pattern located at the end in the printing direction. Is done.
  • the printed wiring board of the present invention has a high-definition wiring pattern with little change in the shape of the wiring pattern because the line width of the pattern is different between the starting end and the terminal end in the printing direction.
  • the shape of the wiring pattern corresponds to the shape of the pattern portion of the intaglio for gravure offset printing
  • the line width of the wiring pattern is about 10 ⁇ m to 5 mm
  • the distance between the lines is about 10 ⁇ m to 100 ⁇ m, preferably Is 20 ⁇ m to 50 ⁇ m.
  • the present invention is particularly effective for a thin line-like wiring pattern having a line width of about 10 ⁇ m to 100 ⁇ m, a distance between the lines of about 10 ⁇ m to 100 ⁇ m, and further 20 ⁇ m to 50 ⁇ m.
  • FIG. 5 shows an outline of an intaglio for gravure offset printing according to the first embodiment.
  • the gravure offset printing intaglio 510 has a pattern portion 511 formed by etching using glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm.
  • the width of the pattern portion 511 is 30 ⁇ m and has a shape in which 15 fine lines are continuous.
  • the depth of the pattern portion 511 is 10 ⁇ m.
  • a dummy pattern portion 512 is formed at the upper end in the printing direction (Y direction).
  • the gravure offset printing intaglio 610 is the same as the gravure offset printing intaglio 510 according to the first embodiment shown in FIG. 5, using a glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm. 611 is formed. Three recesses 612 are 27 ⁇ m wide on the start side in the printing direction (Y direction) of the pattern portion 611, and three recesses 613 are 33 ⁇ m wide on the end side.
  • the intaglio for gravure offset printing according to the comparative example has the same material and size as those of the first and second embodiments, but the dummy pattern portion and the pattern portion that is changed from the start end to the end in the printing direction are arranged. However, the pattern part which consists of a thin line with the thickness of 30 micrometers uniformly is formed by the etching.
  • gravure offset printing was performed in order to form a conductive silver-based wiring pattern on a polyethylene terephthalate substrate.
  • the polyethylene terephthalate substrate used had a thickness of 188 ⁇ m, a length of 120 mm, and a width of 120 mm.
  • the viscosity measured using a rheology measuring device was 9.5 Pa.s at an angular velocity of 10 rad / sec.
  • the ink which is s was used.
  • As the ink-peelable transfer member a material having a rubber hardness (JIS A) of 45 ° and a rubber thickness of 0.6 mm mainly composed of silicone rubber manufactured by Kinyo Co., Ltd. was used.
  • the doctor used a regular type of doctor blade manufactured by MDC.
  • the gravure offset printing device used was a commonly used printing device.
  • the printing conditions were such that the doctor speed was 50 mm / sec, the transfer body speed was 50 mm / sec, the contact width between the transfer body and the gravure offset printing intaglio, and the contact width between the transfer body and the polyethylene terephthalate substrate was uniformly 10 mm.
  • the printed wiring substrates of Example 1, Example 2, and Comparative Example were produced by the following steps. First, the conductive silver paste was filled with a doctor into the pattern portion of the prepared gravure offset printing intaglio. Next, on the gravure offset printing plate filled with ink, the transfer body is rotated and moved in the printing direction (Y direction) of the gravure offset printing intaglio to form a conductive silver-based film on the silicone rubber. Formed. Finally, the transfer body on which the conductive silver-based film is formed is rotated and moved in the printing direction of the polyethylene terephthalate substrate, and the conductive silver paste film is transferred onto the polyethylene terephthalate substrate to form a wiring pattern. did.
  • the line width of the wiring pattern of each printed wiring base material was measured with a microscope, and the average value of the entire wiring pattern was calculated to be the average line width. . At this time, 100 measurements were performed.
  • the line width of the wiring pattern was the thickest at the starting end in the printing direction and gradually decreased from there.
  • the wiring patterns of Example 1 and Example 2 do not completely eliminate the variation in line width, but as shown in the results, they are smaller than the variation in line width of the wiring pattern of the comparative example, and the shape is more stable. I was doing.

Abstract

Provided are an intaglio plate for offset gravure printing and a printed wiring board. The present invention: prevents changes in the shape of a pattern that continues in a printing direction, in particular, a pattern of continuous thin lines; and stably supplies a printed wiring board provided with a high-definition wiring pattern. The intaglio plate for offset gravure printing (310) is provided with a pattern section for forming a wiring pattern. Part of the pattern section is a pattern section having a plurality of thin lines (311) that extend in a substantially vertical direction with respect to the printing direction, and are successively arranged in rows in the printing direction. A dummy pattern section (313) is provided at the upper end of the pattern section having a plurality of thin lines (311) in the printing direction. As an alternative to providing the dummy pattern section (313), amid the pattern section having a plurality of thin lines (311), the line width of the pattern section positioned at the beginning in the printing direction is made thinner than the line width of the pattern section positioned at the end in the printing direction.

Description

グラビアオフセット印刷用凹版および印刷配線基材Intaglio for gravure offset printing and printed wiring board
　本発明は、グラビアオフセット印刷に用いられる凹版、及びこの凹版を用いたグラビアオフセット印刷によって形成された配線パターンを備える印刷配線基材に関する。 The present invention relates to an intaglio used for gravure offset printing, and a printed wiring substrate provided with a wiring pattern formed by gravure offset printing using the intaglio.
　近年、建材分野、パッケージ分野、出版分野、エレクトロニクス分野など生活系、電気系、情報系さまざまな分野における工業製品の製造方法として、グラビアオフセット印刷を用いるケースが増加している。グラビアオフセット印刷とは、印刷対象物の表面に各種インキ、樹脂、導電ペーストなどの各種の粘度の高い塗布材料を用いて、広範囲に高解像力、高寸法精度のある優れた画像を安定的に印刷するための技術である。 In recent years, the use of gravure offset printing is increasing as a manufacturing method for industrial products in various fields such as the building materials field, packaging field, publishing field, and electronics field. Gravure offset printing is a method for stably printing excellent images with high resolution and high dimensional accuracy over a wide area using various high-viscosity coating materials such as various inks, resins, and conductive pastes on the surface of printing objects. It is a technique to do.
　一般的なグラビアオフセット印刷の工程を図１に示す。グラビアオフセット印刷は、ガラス、樹脂、金属などで作製されたグラビアオフセット印刷用凹版１０１のパターン部１０４内に、ドクター、スキージまたはスクレーパー１０３によってインキ１０２を充填する工程（工程１）と、そのパターン部１０４内にインキ１０２が充填されたグラビアオフセット印刷用凹版１０１上に、表面をシリコーンなどの樹脂で形成された転写層１１２を備える転写体１１１を接触させながら回転させ、転写層１１２上にインキ皮膜１１３を転移させる工程（工程２）と、転写体１１１を被印刷体１２１に圧着し、転写層１１２上に残るインキ皮膜１１３の印刷パターン１２２を被印刷体１２１に転写する工程（工程３）を具備する転写印刷法である。このグラビアオフセット印刷は、被印刷体の表面に各種インキ、樹脂、導電ペーストなどの粘度の高い塗布材料を高解像、高寸法精度で、広範囲に印刷することが可能である。 Fig. 1 shows a general gravure offset printing process. Gravure offset printing is a process of filling the ink 102 with a doctor, squeegee or scraper 103 into the pattern portion 104 of the gravure offset printing intaglio 101 made of glass, resin, metal, etc. (step 1), and the pattern portion. A gravure offset printing intaglio 101 filled with ink 102 in 104 is rotated while contacting a transfer body 111 having a transfer layer 112 formed of a resin such as silicone on the surface, and an ink film is formed on the transfer layer 112. A step of transferring 113 (step 2), and a step of pressure-bonding the transfer body 111 to the printing body 121 and transferring the print pattern 122 of the ink film 113 remaining on the transfer layer 112 to the printing body 121 (step 3). A transfer printing method. In this gravure offset printing, coating materials having high viscosity such as various inks, resins, and conductive pastes can be printed on the surface of a printing medium in a wide range with high resolution and high dimensional accuracy.
　グラビアオフセット印刷により、ＩＣカードアンテナ（コイル状のパターン）や太陽電池バックシートの導配線、電磁波シールド、タッチパネル用の信号取出し配線等を、導電性インキ、導電性ペースト等を用いて、ポリエチレンテレフタレート、ポリエチレンナフタレート、アクリル、ガラス等からなる基材上に広範囲の面積に高精細に印刷する場合、下記のような機能が要求される。
［１］広範囲に均一かつ安定した高精細な細線の印刷を可能にすること。
［２］被印刷体に印刷された細線が、断線、ショートしないこと。
［３］安定した膜厚の細線を印刷できること。 By gravure offset printing, IC card antenna (coiled pattern), solar cell back sheet conductive wiring, electromagnetic wave shield, touch panel signal extraction wiring, etc. using conductive ink, conductive paste, etc., polyethylene terephthalate, The following functions are required for high-definition printing over a wide area on a substrate made of polyethylene naphthalate, acrylic, glass, or the like.
[1] To enable uniform and stable high-definition fine line printing over a wide area.
[2] The fine line printed on the substrate is not broken or short-circuited.
[3] A thin line with a stable film thickness can be printed.
　上記の機能を有するグラビアオフセット印刷を用いて細線のパターンを量産するためには、インキ剥離性を有する転写層上に、凹版が備える所望のパターン部内部に満たされたインキを確実に転移させることが必要となる。また、無断線の細線のパターンを形成するには、予めドクター、スキージまたはスクレーパーなどで所望のパターン部内部にインキを充填し、そのパターン部内部に満たされたインキ面を平滑にし、インキ剥離性の転写層を有する転写体との圧着時に、そのインキ面が均等に転写体と接触することが必要である。 In order to mass-produce fine line patterns using gravure offset printing having the above functions, the ink filled in the desired pattern portion provided in the intaglio is reliably transferred onto the transfer layer having ink releasability. Is required. In addition, in order to form an unbroken thin line pattern, the ink is filled in the desired pattern part with a doctor, squeegee or scraper in advance, and the ink surface filled in the pattern part is smoothed, and the ink peelability It is necessary for the ink surface to be in uniform contact with the transfer body when it is pressure-bonded to the transfer body having the transfer layer.
　上記の機能を達成するために、例えば、引用文献１には、厚膜印刷、特に微細画像、あるいはベタ像など、ピンホール、断線をきらうパターン形成において、オフセット方式による重ね刷りを採用することにより、細線の不連続、版の目詰まりによるピンホール、印刷パターンの伸び縮みを防止することが記載されている。 In order to achieve the above-mentioned function, for example, in the cited document 1, by using overprinting by an offset method in thick film printing, in particular, pattern formation that avoids pinholes and disconnections such as fine images or solid images, etc. Further, it is described that the discontinuity of fine lines, pinholes due to clogging of the plate, and the expansion and contraction of the printing pattern are prevented.
特開昭５５－５８５６号公報Japanese Patent Laid-Open No. 55-5856
　しかしながら、特許文献１に記載の方法では、重ね塗りをすることで工程や操作が煩雑になる。また、特許文献１には、凹版のパターン部内部に充填されたインキ面を平滑にし、そのインキ面を均等に転写体に接触させ、確実に転写層上へ転移させる手段について、具体的には開示されていない。一方、印刷しようとするパターンが印刷進行方向に対して略垂直に連続して存在する場合、凹版上に転写体を接触させながら回転させるとき、凹版の連続したパターン部内部で生じる転写層の歪み挙動が、転写体の移動方向に対して略垂直に連続して存在する凹版の連続した各パターン部内部で異なるため、転写層へ転写したインキ皮膜の形状が連続的に変化してしまうという問題が生じる。この課題は、グラビアオフセット印刷において、高精細な細線のパターンを形成しようとするほど顕著になる。 However, in the method described in Patent Document 1, the process and operation become complicated by overcoating. Further, Patent Document 1 specifically describes means for smoothing the ink surface filled in the pattern portion of the intaglio, bringing the ink surface into contact with the transfer body evenly, and reliably transferring the ink surface onto the transfer layer. Not disclosed. On the other hand, when the pattern to be printed exists continuously substantially perpendicular to the printing progress direction, when the transfer body is rotated while contacting the intaglio, the distortion of the transfer layer generated inside the continuous pattern portion of the intaglio The problem is that the shape of the ink film transferred to the transfer layer changes continuously because the behavior is different within each continuous pattern part of the intaglio that exists continuously perpendicular to the direction of movement of the transfer body. Occurs. This problem becomes more prominent as high-definition fine line patterns are formed in gravure offset printing.
　そこで、本発明は、印刷方向に連続するパターン、特に連続した細線パターンの形状の変化を防止し、高精細な配線パターンを備える印刷配線基材を安定的に供給することを目的とする。 Therefore, an object of the present invention is to prevent a change in the shape of a continuous pattern in the printing direction, particularly a continuous fine line pattern, and to stably supply a printed wiring substrate having a high-definition wiring pattern.
　上記の課題を解決するための手段として、本発明の一局面は、配線パターンを形成するためのパターン部を備えるグラビアオフセット印刷用凹版であって、パターン部の一部が、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状のパターン部であり、（ａ）複数の細線状のパターン部の印刷方向の上端に、ダミーパターン部を設けること、（ｂ）複数の細線状のパターン部のうち、印刷方向の始端に位置するパターン部の線幅が、印刷方向の終端に位置するパターン部の線幅より細いこと、のいずれかを満たすことを特徴とする。 As a means for solving the above problems, one aspect of the present invention is a gravure offset printing intaglio having a pattern part for forming a wiring pattern, wherein a part of the pattern part is in a printing direction. A plurality of fine line-shaped pattern portions extending in a substantially vertical direction and continuously arranged in the printing direction; (a) a dummy pattern portion is provided at the upper end in the printing direction of the plurality of fine line-shaped pattern portions; (B) Of the plurality of fine line-shaped pattern portions, the line width of the pattern portion located at the start end in the printing direction satisfies any one of the narrower than the line width of the pattern portion located at the end in the printing direction. It is characterized by.
　上記複数の細線状のパターン部の線幅が１０μｍ以上５ｍｍ以下であり、線と線との間の距離が１０μｍ以上１００μｍ以下であることが好ましい。 It is preferable that the line width of the plurality of fine line-shaped pattern portions is 10 μm or more and 5 mm or less, and the distance between the lines is 10 μm or more and 100 μm or less.
　また本発明の他の局面は、グラビアオフセット印刷によって形成された配線パターンを備える印刷配線基材であって、配線パターンの一部が、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状の配線パターンであり、（ａ）複数の細線状の配線パターンの印刷方向の上端に、ダミーパターンを有すること、（ｂ）複数の細線状の配線パターンのうち、印刷方向の始端に位置する配線パターンの線幅が、印刷方向の終端に位置する配線パターンの線幅より細いこと、のいずれかを満たすことを特徴とする印刷配線基材。 Further, another aspect of the present invention is a printed wiring substrate including a wiring pattern formed by gravure offset printing, wherein a part of the wiring pattern extends in a direction substantially perpendicular to the printing direction and extends in the printing direction. A plurality of fine line-shaped wiring patterns arranged side by side; (a) having a dummy pattern at the upper end in the printing direction of the plurality of fine line-shaped wiring patterns; and (b) a plurality of fine line-shaped wiring patterns. A printed wiring base material satisfying any one of the following: a line width of a wiring pattern located at a starting end in a printing direction is narrower than a line width of a wiring pattern located at an end in a printing direction.
　上記複数の細線状の配線パターンの線幅が１０μｍ以上５ｍｍ以下であり、線と線との間の距離が１０μｍ以上１００μｍ以下であることが好ましい。 It is preferable that the line width of the plurality of thin line-shaped wiring patterns is 10 μm or more and 5 mm or less, and the distance between the lines is 10 μm or more and 100 μm or less.
　本発明のグラビアオフセット印刷用凹版を用いることで、印刷方向に連続する細線状の配線パターンに対して、形状の変化がなく再現度の高い印刷をすることが可能になる。特に、より細い配線パターンになるにつれて本発明のグラビアオフセット印刷用凹版の効果は顕著化するため、微細な配線パターンの形成に適している。 By using the intaglio for gravure offset printing of the present invention, it becomes possible to perform printing with high reproducibility without a change in shape on a thin line-like wiring pattern continuous in the printing direction. In particular, since the effect of the gravure offset printing intaglio according to the present invention becomes more prominent as the wiring pattern becomes thinner, it is suitable for forming a fine wiring pattern.
図１は、本発明のグラビアオフセット印刷の工程図である。FIG. 1 is a process diagram of gravure offset printing according to the present invention. 図２は、従来の形状からなるパターン部を備えるグラビアオフセット印刷用凹版の上面図である。FIG. 2 is a top view of an intaglio for gravure offset printing having a pattern portion having a conventional shape. 図３は、本発明のグラビアオフセット印刷用凹版の一実施形態を示した上面図である。FIG. 3 is a top view showing an embodiment of an intaglio for gravure offset printing according to the present invention. 図４は、本発明のグラビアオフセット印刷用凹版の一実施形態を示した上面図である。FIG. 4 is a top view showing an embodiment of the gravure offset printing intaglio according to the present invention. 図５は、実施例１に係るグラビアオフセット印刷用凹版を示した上面図である。FIG. 5 is a top view showing the gravure offset printing intaglio according to Example 1. FIG. 図６は、実施例２に係るグラビアオフセット印刷用凹版を示した上面図である。6 is a top view showing an intaglio for gravure offset printing according to Example 2. FIG.
　以下、図面を参照しながら、本発明の実施形態について説明する。なお、本発明の実施形態は、以下に記載する実施形態に限定されうるものではなく、当業者の知識に基づいて設計の変更などの変形を加えることも可能であり、そのような変形が加えられた実施形態も本発明の実施形態の範囲に含まれうるものである。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments of the present invention are not limited to the embodiments described below, and modifications such as design changes can be added based on the knowledge of those skilled in the art. The described embodiments can also be included in the scope of the embodiments of the present invention.
［グラビアオフセット印刷用凹版について］
　本発明の実施形態に係るグラビアオフセット印刷の工程について、前述の一般的なグラビアオフセット印刷の工程図である図１を参照しながら説明する。 [About intaglio for gravure offset printing]
A process of gravure offset printing according to an embodiment of the present invention will be described with reference to FIG. 1 which is a process chart of the general gravure offset printing described above.
　まず、図１の工程１に示すように、グラビアオフセット印刷用凹版１０１上にインキ１０２を乗せ、ドクター、スキージまたはスクレーパー１０３にてインキ１０２を一定の圧力で図中の矢印の方向に転がしながらグラビアオフセット印刷用凹版１０１上を移動させることで、グラビアオフセット印刷用凹版１０１のパターン部１０４内にインキ１０２を充填する。 First, as shown in Step 1 of FIG. 1, the ink 102 is put on the gravure offset printing intaglio 101, and the gravure is rolled while the ink 102 is rolled in the direction of the arrow in the figure by a doctor, a squeegee or a scraper 103. By moving on the intaglio 101 for offset printing, the ink 102 is filled into the pattern portion 104 of the intaglio 101 for gravure offset printing.
　この際、グラビアオフセット印刷用凹版１０１のパターン部１０４は、幅が１０μｍから５ｍｍ程度、深さが５μｍから２０μｍ程度の溝によって形成される。また、溝と溝との間の距離は１０μｍから１００μｍ程度、好ましくは２０から５０μｍである。本発明は、特に幅が１０μｍから１００μｍ程度の溝を備え、溝と溝との間の距離が１０μｍから１００μｍ程度、さらに２０μｍから５０μｍであるグラビアオフセット印刷用凹版に対して有効であり、印刷方向に連続するパターン、特に連続する細線パターンに対して後述するダミーパターンやパターン補正を加えることで、設計したパターンの再現度の高い印刷をすることができる。 At this time, the pattern portion 104 of the intaglio 101 for gravure offset printing is formed by a groove having a width of about 10 μm to 5 mm and a depth of about 5 μm to 20 μm. The distance between the grooves is about 10 μm to 100 μm, preferably 20 to 50 μm. The present invention is particularly effective for an intaglio for gravure offset printing having a groove having a width of about 10 μm to 100 μm, and having a distance between the grooves of about 10 μm to 100 μm, and further 20 μm to 50 μm. By adding a dummy pattern and pattern correction to be described later to a continuous pattern, particularly a continuous thin line pattern, printing with a high reproducibility of the designed pattern can be performed.
　また、グラビアオフセット印刷用凹版１０１は、その表面が平滑であることが望ましい。これにより、凹版表面へのインキ漏れを起こすことなく印刷をすることが可能である。また、ドクターなどの欠けなども抑制することができる。ここで、グラビアオフセット印刷用凹版１０１の表面とは、グラビアオフセット印刷用凹版１０１におけるドクター、スキージまたはスクレーパー１０３と接触する表面、又は、グラビアオフセット印刷用凹版１０１のパターン部１０４（溝）の内側表面のことをいう。なお、グラビアオフセット印刷用凹版１０１の表面は、粗面研磨加工、鏡面研磨加工、超精密研磨加工（ラッピングやポリシング）によって平滑にすることができる。 Further, it is desirable that the gravure offset printing intaglio 101 has a smooth surface. Thereby, it is possible to print without causing ink leakage to the surface of the intaglio. Further, chipping of a doctor or the like can be suppressed. Here, the surface of the intaglio 101 for gravure offset printing is the surface in contact with the doctor, squeegee or scraper 103 in the intaglio 101 for gravure offset printing, or the inner surface of the pattern portion 104 (groove) of the intaglio 101 for gravure offset printing. I mean. Note that the surface of the gravure offset printing intaglio 101 can be smoothed by rough surface polishing, mirror polishing, or ultra-precision polishing (lapping or polishing).
　グラビアオフセット印刷用凹版１０１のパターン部１０４の形成方法としては、エッチング法、電鋳法、サンドブラスト法などが挙げられる。これらの形成方法による加工性という点から、グラビアオフセット印刷用凹版１０１はガラス又は銅、ニッケルなどの金属であることが望ましい。また、表面にクロムやカーボンによる耐擦性皮膜を形成していることが望ましい。 Examples of the method for forming the pattern portion 104 of the intaglio 101 for gravure offset printing include an etching method, an electroforming method, and a sand blast method. From the viewpoint of workability by these forming methods, the gravure offset printing intaglio 101 is preferably made of glass or a metal such as copper or nickel. Further, it is desirable to form a rubbing resistant film of chromium or carbon on the surface.
　また、ドクター、スキージまたはスクレーパー１０３には、グラビアオフセット印刷用凹版１０１のパターン部１０４内にインキ１０２を充填しかつグラビアオフセット印刷用凹版１０１上のインキ１０２を掻き取る必要があることから、ある程度のしなりが求められる。よって、ドクター、スキージまたはスクレーパー１０３は、ステンレスなどの金属、またはウレタンなどの樹脂、セラミックであることが望ましい。 In addition, the doctor, squeegee or scraper 103 needs to be filled with the ink 102 in the pattern portion 104 of the gravure offset printing intaglio 101 and scrape the ink 102 on the gravure offset printing intaglio 101 to some extent. Flexibility is required. Therefore, the doctor, squeegee or scraper 103 is preferably made of a metal such as stainless steel, a resin such as urethane, or a ceramic.
　次に、図１の工程２に示すように、転写層１１２を有する転写体１１１を、パターン部１０４にインキ１０２が充填されたグラビアオフセット印刷用凹版１０１上で回転及び移動させて、グラビアオフセット印刷用凹版１０１のパターン部１０４内のインキ１０２を転写層１１２に転写し、転写層１１２上にインキ皮膜１１３が形成される。転写層１１２を形成する材料としては、公知の材料を用いることができるが、その中でもシリコーンゴムが望ましい。 Next, as shown in step 2 of FIG. 1, the transfer body 111 having the transfer layer 112 is rotated and moved on the intaglio plate 101 for gravure offset printing in which the pattern portion 104 is filled with the ink 102, and gravure offset printing is performed. The ink 102 in the pattern portion 104 of the intaglio 101 is transferred to the transfer layer 112, and an ink film 113 is formed on the transfer layer 112. As a material for forming the transfer layer 112, a known material can be used, and among these, silicone rubber is desirable.
　この際に、形状の変化がなく再現度の高い配線パターンを形成するためには、転写層１１２の表面とグラビアオフセット印刷用凹版１０１のパターン部１０４に充填されたインキ１０２面とが接触面内で均等に接している必要がある。しかしながら、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数のパターン部においては、印刷方向の始端に位置するパターン部へ転写体の転写層が大きく落ち込むため、次に接触するパターン部において転写体の転写層がパターン部内部のインキに十分に接触できず、インキを十分に転移させることができないという不具合が生じる。すなわち、パターン部内部で生じる転写体の転写層の歪み挙動が、印刷方向に連続して存在するパターン部内部で異なるため、印刷方向においてインキの移転の程度に違いが生じる。これにより、印刷方向に連続した配線パターンにおいて印刷方向の始端と終端とで同一形状の設計であっても形状が変化してしまい、設計上の配線パターンの再現度が低下する。 At this time, in order to form a highly reproducible wiring pattern with no change in shape, the surface of the transfer layer 112 and the surface of the ink 102 filled in the pattern portion 104 of the gravure offset printing intaglio 101 are in the contact surface. It is necessary to touch evenly. However, in a plurality of pattern portions that extend in a direction substantially perpendicular to the printing direction and are arranged side by side in the printing direction, the transfer layer of the transfer body largely falls into the pattern portion located at the start end in the printing direction. The transfer layer of the transfer body cannot sufficiently contact the ink inside the pattern portion in the pattern portion to be contacted next, and there is a problem that the ink cannot be sufficiently transferred. That is, since the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion is different inside the pattern portion existing continuously in the printing direction, a difference occurs in the degree of ink transfer in the printing direction. As a result, in the wiring pattern continuous in the printing direction, the shape changes even if the same shape is designed at the start and end in the printing direction, and the reproducibility of the designed wiring pattern is lowered.
　上記の現象を、図２に示した従来の形状からなるパターン部（同一形状のパターン部）を備えるグラビアオフセット印刷用凹版で説明する。図２に示すように、Ｙ方向に対して垂直な方向（Ｘ方向）に伸び、連続して並設された複数の細線状のパターン部２１１を備えるグラビアオフセット印刷用凹版２１０を用いて、パターン部２１１にインキを充填した後、Ｙ方向に転写体を回転及び移動させた場合、パターン部２１１の始端の凹部２１２に転写体の転写層が落ち込み、凹部２１２に対してＹ方向に並設されている凹部２１３や他の凹部から転移したインキ皮膜がＹ方向に向かうにつれて徐々に細くなっていくという現象が起こる。結果として、同一形状のパターン部を備えるグラビアオフセット印刷用凹版によって形成されたインキ皮膜を被印刷体に転写しでも、印刷方向の配線パターンの形状が変化してしまい、設計上の配線パターンを再現することができない。特に、凹部２１２と凹部２１２とＹ方向で隣り合う凹部２１３との形状の差異が顕著となる。 The above phenomenon will be described with a gravure offset printing intaglio having a pattern portion (pattern portion having the same shape) having a conventional shape shown in FIG. As shown in FIG. 2, a gravure offset printing intaglio 210 including a plurality of thin line-like pattern portions 211 extending in a direction perpendicular to the Y direction (X direction) and continuously arranged is used to form a pattern. When the transfer member is rotated and moved in the Y direction after the ink is filled in the portion 211, the transfer layer of the transfer member falls into the concave portion 212 at the start end of the pattern portion 211, and is arranged in parallel in the Y direction with respect to the concave portion 212. A phenomenon occurs in which the ink film transferred from the recessed portions 213 and other recessed portions gradually becomes thinner in the Y direction. As a result, even if the ink film formed by the intaglio for gravure offset printing with the pattern part of the same shape is transferred to the substrate, the shape of the wiring pattern in the printing direction changes, and the designed wiring pattern is reproduced. Can not do it. In particular, the difference in shape between the recess 212 and the recess 212 adjacent to the recess 212 in the Y direction becomes significant.
　そこで、本発明のグラビアオフセット印刷用凹版のパターン部は、例えば、図３に示したグラビアオフセット印刷用凹版３１０のように、パターン部３１１のうちＹ方向の始端の凹部３１２より上端にダミーパターン部３１３を配置する。ダミーパターン部３１３を備えるグラビアオフセット印刷用凹版３１０を用いてＹ方向に転写体を回転及び移動させた場合、ダミーパターン部３１３に意図的に転写体の転写層を落ち込ませることで、その後のパターン部３１１への接触を安定化させることができる。そして、パターン部３１１から転移したインキ皮膜全体の線幅や形状の変化を抑え、設計に対して再現性の高い印刷物を形成することが可能となる。 Therefore, the pattern portion of the gravure offset printing intaglio according to the present invention is, for example, a dummy pattern portion on the upper end of the concave portion 312 at the start end in the Y direction in the pattern portion 311 as in the gravure offset printing intaglio 310 shown in FIG. 313 is arranged. When the transfer body is rotated and moved in the Y direction using the gravure offset printing intaglio plate 310 provided with the dummy pattern portion 313, the transfer layer of the transfer body is intentionally dropped into the dummy pattern portion 313, so that the subsequent pattern Contact with the portion 311 can be stabilized. In addition, it is possible to suppress a change in the line width and shape of the entire ink film transferred from the pattern portion 311 and form a printed matter having high reproducibility with respect to the design.
　ここで、印刷方向とは、転写体の転写層表面に転移させたインキ皮膜を被印刷体に転写するときの転写体の移動方向のことをいう。この印刷方向は、グラビアオフセット印刷用凹版のパターン部に充填されたインキを転写体の転写層表面に転移させるときの転写体の移動方向と同じである。また、グラビアオフセット印刷用凹版のパターン部の印刷方向の始端とは、転写体の移動方向の最も上流側に配置された凹部の位置のことをいう。言い換えると、転写体と最初に接触するグラビアオフセット印刷用凹版の凹部の位置のことをいう。具体的には、図２の凹部２１２や図３の凹部３１２が配置された位置のことをいう。また、グラビアオフセット印刷用凹版のパターン部の印刷方向の終端とは、転写体の移動方向の最も下流側に配置された凹部の位置のことをいう。言い換えると、転写体と最後に接触するグラビアオフセット印刷用凹版の凹部の位置のことをいう。また、グラビアオフセット印刷用凹版のパターン部の印刷方向の上端とは、転写体の移動方向の最も上流側に配置された凹部の印刷方向と反対方向の位置を指し、具体的には、図３の凹部３１２の印刷方向と反対方向で隣り合うダミーパターン部３１３の位置のことをいう。 Here, the printing direction refers to the moving direction of the transfer body when the ink film transferred to the transfer layer surface of the transfer body is transferred to the printing medium. This printing direction is the same as the moving direction of the transfer body when the ink filled in the pattern portion of the gravure offset printing intaglio is transferred to the transfer layer surface of the transfer body. Further, the starting end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most upstream side in the moving direction of the transfer body. In other words, it refers to the position of the concave portion of the gravure offset printing intaglio that first comes into contact with the transfer body. Specifically, it refers to a position where the recess 212 in FIG. 2 or the recess 312 in FIG. 3 is arranged. Further, the end in the printing direction of the pattern portion of the gravure offset printing intaglio plate means the position of the concave portion arranged on the most downstream side in the moving direction of the transfer body. In other words, it refers to the position of the recess of the gravure offset printing intaglio that comes into contact with the transfer body last. Further, the upper end in the printing direction of the pattern portion of the gravure offset printing intaglio plate refers to the position in the direction opposite to the printing direction of the concave portion arranged on the most upstream side in the moving direction of the transfer body. Specifically, FIG. This is the position of the dummy pattern portion 313 adjacent in the direction opposite to the printing direction of the recess 312.
　ダミーパターン部は、配線パターンを形成するためのパターン部の一部として配置されていてもよく、配置されていなくてもよい。すなわち、ダミーパターン部によって形成されるパターンは導通していてもよく、導通していなくてもよい。したがって、ダミーパターン部の形状は、断線形状などでもよい。 The dummy pattern part may or may not be arranged as a part of the pattern part for forming the wiring pattern. That is, the pattern formed by the dummy pattern portion may or may not be conductive. Therefore, the shape of the dummy pattern portion may be a disconnected shape.
　本発明は、グラビアオフセット印刷用凹版のパターン部の一部が、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状のパターン部であるときに、効果が顕著化する。細線状のパターン部が印刷方向に対して略垂直な方向に伸びている場合、パターン部が転写体の幅方向と略平行になるため、パターン部への転写体の転写層の落ち込みが大きくなり、パターン部内部で生じる転写体の転写層の歪み挙動の影響を受けやすい。なお、印刷方向に対して略垂直な方向とは、パターン部がパターン部内部で生じる転写体の転写層の歪み挙動の影響を受ける程度の方向に伸びていれば、厳密に印刷方向に対して垂直な方向になっていなくてもよいという意味である。すなわち、パターン部が印刷方向に対して垂直な方向に伸びているか、おおよそ垂直な方向（具体的には印刷方向に対して６０度から１２０度程度傾斜した方向）に伸びていれば、本発明を好適に適用できる。また、細線状のパターン部が印刷方向に連続して複数並設されている場合、転写体の転写層の影響を受けるパターン部の面積（長さ）が増加するため、パターン部内部で生じる転写体の転写層の歪み挙動を受けやすい。 In the present invention, when a part of the pattern portion of the gravure offset printing intaglio is a plurality of fine line-shaped pattern portions extending in a direction substantially perpendicular to the printing direction and continuously arranged in the printing direction. , The effect becomes noticeable. When the thin line pattern part extends in a direction substantially perpendicular to the printing direction, the pattern part becomes substantially parallel to the width direction of the transfer body, so that the transfer layer of the transfer body drops into the pattern part. It is easily affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion. Note that the direction substantially perpendicular to the printing direction means that the pattern portion strictly extends with respect to the printing direction as long as the pattern portion extends in a direction that is affected by the distortion behavior of the transfer layer of the transfer body generated inside the pattern portion. This means that it does not have to be in the vertical direction. In other words, if the pattern portion extends in a direction perpendicular to the printing direction or extends in a direction substantially perpendicular (specifically, a direction inclined by about 60 to 120 degrees with respect to the printing direction), the present invention. Can be suitably applied. In addition, when a plurality of fine line-shaped pattern portions are continuously arranged in the printing direction, the area (length) of the pattern portion that is affected by the transfer layer of the transfer body increases, so that the transfer that occurs inside the pattern portion It is susceptible to strain behavior of the body transfer layer.
　また、グラビアオフセット印刷用凹版が、ダミーパターン部を配置することが不可能な場合は、図４に示すように、グラビアオフセット印刷用凹版４１０のパターン部４１１の線幅を、印刷方向（ここではＹ方向）の始端から終端に向かって変化させる手法が有効である。例えば、図４のパターン部４１１のうち、印刷方向の始端の凹部とその近傍に位置する凹部とからなる複数の凹部４１２の線幅を、パターン部４１１全体の平均線幅（所望の配線パターンの線幅を形成するための設計上の線幅）よりも１０％細くし、パターン部４１１のうち、印刷方向の終端の凹部とその近傍に位置する凹部とからなる複数の凹部４１３の線幅を、上記平均線幅よりも１０％太くする。これにより、パターン部４１１から転移したインキ皮膜全体の線幅ばらつきを抑制することが可能である。 If the intaglio for gravure offset printing cannot dispose the dummy pattern portion, the line width of the pattern portion 411 of the intaglio 410 for gravure offset printing is set in the printing direction (here, as shown in FIG. 4). A method of changing from the start end to the end in the (Y direction) is effective. For example, among the pattern portions 411 in FIG. 4, the line width of a plurality of concave portions 412 including a concave portion at the start end in the printing direction and a concave portion located in the vicinity thereof is set to an average line width of the entire pattern portion 411 (a desired wiring pattern The line width of the plurality of concave portions 413 including the concave portion at the end in the printing direction and the concave portion located in the vicinity of the pattern portion 411 is made 10% thinner than the designed line width for forming the line width). , 10% thicker than the average line width. Thereby, it is possible to suppress the line width variation of the entire ink film transferred from the pattern portion 411.
　図４に示したグラビアオフセット印刷用凹版４１０のパターン部４１１は、印刷方向の始端近傍、終端近傍のパターン部（始端近傍、終端近傍のそれぞれ３箇所の凹部）の線幅を調整しているが、少なくとも、印刷方向の始端に位置するパターン部の線幅が、印刷方向の終端に位置するパターン部の線幅より細ければよい。これにより、印刷方向の始端に位置するパターン部への転写体の転写層の落ち込みによる、印刷パターンの線幅への影響を抑制することができる。 The pattern portion 411 of the gravure offset printing intaglio 410 shown in FIG. 4 adjusts the line widths of the pattern portions near the start end in the printing direction and near the end (three recesses near the start end and near the end, respectively). It is sufficient that at least the line width of the pattern portion located at the start end in the printing direction is narrower than the line width of the pattern portion located at the end in the printing direction. Thereby, it is possible to suppress the influence on the line width of the print pattern due to the drop of the transfer layer of the transfer body onto the pattern portion located at the start end in the printing direction.
　その他、グラビアオフセット印刷用凹版のパターン部の線幅を印刷方向の始端から終端に向かって変化させる具体的な手法としては、パターン部の線幅を始端から終端に向かって徐々に変化させる、パターン部の線幅を始端のみを平均線幅よりも細くする、などが挙げられる。 In addition, as a specific method for changing the line width of the pattern portion of the gravure offset printing intaglio from the start end to the end in the printing direction, the pattern portion is gradually changed from the start end to the end. For example, the line width of the part may be made narrower than the average line width only at the starting end.
　最後に、図１の工程３に示すように、被印刷体１２１上に転写体１１１を転がしインキ皮膜１１３を転写することで印刷パターン１２２が形成され、印刷配線基材が得られる。 Finally, as shown in step 3 of FIG. 1, the transfer body 111 is rolled on the substrate 121 to transfer the ink film 113, thereby forming the print pattern 122 and obtaining the printed wiring substrate.
［印刷配線基材について］
　本発明の印刷配線基材は、上述の本発明のグラビアオフセット印刷用凹版を用いたグラビアオフセット印刷によって作製される。まず、本発明のグラビアオフセット印刷用凹版のパターン部に充填されたインキを転写体の転写層上に転移させる。次いで、形成されたインキ被膜を基材上に転写させることで、基材上に印刷パターンを形成する。 [About printed wiring board]
The printed wiring board of the present invention is produced by gravure offset printing using the above-described intaglio for gravure offset printing of the present invention. First, the ink filled in the pattern portion of the intaglio for gravure offset printing of the present invention is transferred onto the transfer layer of the transfer body. Next, the formed ink film is transferred onto the base material to form a print pattern on the base material.
　基材上に形成された印刷パターンは、その一部が印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状の配線パターンである。そして、その複数の細線状の配線パターンの印刷方向の上端に、ダミーパターンが形成される。このように、本発明の印刷配線基材は、ダミーパターンが形成されているので、配線パターンの形状の変化が少ない高精細な配線パターンを備える。一方、ダミーパターンを配置することが不可能な場合は、印刷方向の始端に位置するパターンの線幅が、印刷方向の終端に位置するパターンの線幅より細い複数の細線状の配線パターンが形成される。このように、本発明の印刷配線基材は、パターンの線幅が印刷方向の始端と終端で異なっているので、配線パターンの形状の変化が少ない高精細な配線パターンを備える。なお、配線パターンの形状は、グラビアオフセット印刷用凹版のパターン部の形状に相当するから、配線パターンの線幅は、１０μｍから５ｍｍ程度、線と線との間の距離が１０μｍから１００μｍ程度、好ましくは２０μｍから５０μｍである。本発明は、特に線幅が１０μｍから１００μｍ程度であり、線と線との間の距離が１０μｍから１００μｍ程度、さらに２０μｍから５０μｍである細線状の配線パターンに対して有効である。 The printed pattern formed on the substrate is a plurality of fine line-shaped wiring patterns that partially extend in a direction substantially perpendicular to the printing direction and are continuously arranged in the printing direction. Then, a dummy pattern is formed at the upper end in the printing direction of the plurality of thin line-shaped wiring patterns. Thus, since the printed wiring base material of the present invention has a dummy pattern, it has a high-definition wiring pattern with little change in the shape of the wiring pattern. On the other hand, when it is impossible to arrange dummy patterns, a plurality of fine wiring patterns are formed in which the line width of the pattern located at the start end in the printing direction is narrower than the line width of the pattern located at the end in the printing direction. Is done. As described above, the printed wiring board of the present invention has a high-definition wiring pattern with little change in the shape of the wiring pattern because the line width of the pattern is different between the starting end and the terminal end in the printing direction. Since the shape of the wiring pattern corresponds to the shape of the pattern portion of the intaglio for gravure offset printing, the line width of the wiring pattern is about 10 μm to 5 mm, and the distance between the lines is about 10 μm to 100 μm, preferably Is 20 μm to 50 μm. The present invention is particularly effective for a thin line-like wiring pattern having a line width of about 10 μm to 100 μm, a distance between the lines of about 10 μm to 100 μm, and further 20 μm to 50 μm.
　まず、テスト用のパターン部を備えるグラビアオフセット印刷用凹版を３種類用意した。図５に実施例１に係るグラビアオフセット印刷用凹版の概略を示す。グラビアオフセット印刷用凹版５１０は、縦が１２０ｍｍ、横が１２０ｍｍ、高さが３ｍｍのガラスを用いて、エッチングにてパターン部５１１を形成したものである。パターン部５１１の幅は３０μｍであり、細線が１５本連続した形状をしている。パターン部５１１の深さは１０μｍである。印刷方向（Ｙ方向）の上端にはダミーパターン部５１２が形成されている。 First, three types of gravure offset printing intaglios with test pattern portions were prepared. FIG. 5 shows an outline of an intaglio for gravure offset printing according to the first embodiment. The gravure offset printing intaglio 510 has a pattern portion 511 formed by etching using glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm. The width of the pattern portion 511 is 30 μm and has a shape in which 15 fine lines are continuous. The depth of the pattern portion 511 is 10 μm. A dummy pattern portion 512 is formed at the upper end in the printing direction (Y direction).
　次に、実施例２に係るグラビアオフセット印刷用凹版について図６を用いて説明する。グラビアオフセット印刷用凹版６１０は、図５に示した実施例１に係るグラビアオフセット印刷用凹版５１０と同じく、縦が１２０ｍｍ、横が１２０ｍｍ、高さが３ｍｍのガラスを用いて、エッチングにてパターン部６１１を形成したものである。パターン部６１１の印刷方向（Ｙ方向）の始端側のうち３本の凹部６１２は２７μｍ幅であり、終端側のうち３本の凹部６１３は３３μｍ幅である。 Next, a gravure offset printing intaglio according to Example 2 will be described with reference to FIG. The gravure offset printing intaglio 610 is the same as the gravure offset printing intaglio 510 according to the first embodiment shown in FIG. 5, using a glass having a length of 120 mm, a width of 120 mm, and a height of 3 mm. 611 is formed. Three recesses 612 are 27 μm wide on the start side in the printing direction (Y direction) of the pattern portion 611, and three recesses 613 are 33 μm wide on the end side.
　比較例に係るグラビアオフセット印刷用凹版は、実施例１および実施例２と同様の材質、サイズであるが、ダミーパターン部や印刷方向の始端から終端に向かって変化させているパターン部は配置されておらず、一律３０μｍ幅の太さの細線からなるパターン部がエッチングにより形成されている。 The intaglio for gravure offset printing according to the comparative example has the same material and size as those of the first and second embodiments, but the dummy pattern portion and the pattern portion that is changed from the start end to the end in the printing direction are arranged. However, the pattern part which consists of a thin line with the thickness of 30 micrometers uniformly is formed by the etching.
　この３種類のグラビアオフセット印刷用凹版を用いて、ポリエチレンテレフタレート基材上に導電性銀ベーストによる配線パターンを形成するために、グラビアオフセット印刷を行った。 Using these three types of gravure offset printing intaglios, gravure offset printing was performed in order to form a conductive silver-based wiring pattern on a polyethylene terephthalate substrate.
　ポリエチレンテレフタレート基材は、厚さが１８８μｍ、縦が１２０ｍｍ、横が１２０ｍｍのものを使用した。また、導電性銀ペーストとして、レオロジー測定装置を用いて測定した粘度が角速度１０ｒａｄ／秒において、９．５Ｐａ．ｓであるインキを使用した。また、インキ剥離性の転写体は、金陽社製のシリコーンゴムを主体とするゴム硬さ（ＪＩＳ　Ａ）４５°、ゴム厚さ０．６ｍｍの素材を円筒に巻いたものを使用した。また、ドクターは、ＭＤＣ社製ドクターブレードのレギュラータイプを使用した。 The polyethylene terephthalate substrate used had a thickness of 188 μm, a length of 120 mm, and a width of 120 mm. In addition, as a conductive silver paste, the viscosity measured using a rheology measuring device was 9.5 Pa.s at an angular velocity of 10 rad / sec. The ink which is s was used. As the ink-peelable transfer member, a material having a rubber hardness (JIS A) of 45 ° and a rubber thickness of 0.6 mm mainly composed of silicone rubber manufactured by Kinyo Co., Ltd. was used. The doctor used a regular type of doctor blade manufactured by MDC.
　グラビアオフセット印刷装置は、一般に使用されている印刷装置を使用した。印刷条件は、ドクター速度を５０ｍｍ／秒、転写体速度を５０ｍｍ／秒とし、転写体とグラビアオフセット印刷用凹版の接触幅、転写体とポリエチレンテレフタレート基材の接触幅は一律で１０ｍｍとした。 The gravure offset printing device used was a commonly used printing device. The printing conditions were such that the doctor speed was 50 mm / sec, the transfer body speed was 50 mm / sec, the contact width between the transfer body and the gravure offset printing intaglio, and the contact width between the transfer body and the polyethylene terephthalate substrate was uniformly 10 mm.
　実施例１、実施例２、比較例の印刷配線基材は、以下の工程により作製した。まず、用意したグラビアオフセット印刷用凹版のパターン部に上記導電性銀ペーストをドクターによって充填した。次に、インキが充填されたグラビアオフセット印刷用図版上で、グラビアオフセット印刷用凹版の印刷方向（Ｙ方向）に上記転写体を回転及び移動させて、シリコーンゴム上に導電性銀ベーストの皮膜を形成した。最後に、導電性銀ベーストの皮膜が形成された転写体をポリエチレンテレフタレート基材の印刷方向に回転及び移動させて、ポリエチレンテレフタレート基材上に導電性銀ペーストの皮膜を転写し、配線パターンを形成した。 The printed wiring substrates of Example 1, Example 2, and Comparative Example were produced by the following steps. First, the conductive silver paste was filled with a doctor into the pattern portion of the prepared gravure offset printing intaglio. Next, on the gravure offset printing plate filled with ink, the transfer body is rotated and moved in the printing direction (Y direction) of the gravure offset printing intaglio to form a conductive silver-based film on the silicone rubber. Formed. Finally, the transfer body on which the conductive silver-based film is formed is rotated and moved in the printing direction of the polyethylene terephthalate substrate, and the conductive silver paste film is transferred onto the polyethylene terephthalate substrate to form a wiring pattern. did.
　上記条件において、実施例１、実施例２、比較例に係るそれぞれのグラビアオフセット印刷用凹版にてグラビアオフセット印刷を行い、実施例１、実施例２、比較例の印刷配線基材を各２０枚作製した。実施例１の印刷配線基材の配線パターンの平均線幅と標準偏差（σ）を算出したところ、平均線幅が２８．３μｍ、σが２．５１μｍであった。また実施例２では平均線幅が２９．５μｍ、σが＝３．１μｍであった。比較例の平均線幅が２８．５μｍ、σが６．６μｍであった。なお、印刷配線基材の配線パターンの平均線幅については、顕微鏡にて各印刷配線基材の配線パターンの線幅を測定して、配線パターン全体の平均値を算出して平均線幅とした。このとき、測定は１００点行なった。 Under the above conditions, gravure offset printing is performed on each of the intaglio plates for gravure offset printing according to Example 1, Example 2, and Comparative Example, and each of the printed wiring substrates of Example 1, Example 2, and Comparative Example is 20 sheets. Produced. When the average line width and standard deviation (σ) of the wiring pattern of the printed wiring substrate of Example 1 were calculated, the average line width was 28.3 μm and σ was 2.51 μm. In Example 2, the average line width was 29.5 μm, and σ was 3.1 μm. The average line width of the comparative example was 28.5 μm and σ was 6.6 μm. In addition, about the average line width of the wiring pattern of a printed wiring base material, the line width of the wiring pattern of each printed wiring base material was measured with a microscope, and the average value of the entire wiring pattern was calculated to be the average line width. . At this time, 100 measurements were performed.
　比較例の印刷配線基材を顕微鏡にて確認したところ、配線パターンの線幅は印刷方向の始端が最も太く、そこから徐々に細くなる傾向が確認された。一方、実施例１、実施例２の配線パターンは、線幅のばらつきが完全に無くなりはしないものの、結果に示したように比較例の配線パターンの線幅のばらつきより小さく、よりその形状が安定をしていた。 When the printed wiring substrate of the comparative example was confirmed with a microscope, it was confirmed that the line width of the wiring pattern was the thickest at the starting end in the printing direction and gradually decreased from there. On the other hand, the wiring patterns of Example 1 and Example 2 do not completely eliminate the variation in line width, but as shown in the results, they are smaller than the variation in line width of the wiring pattern of the comparative example, and the shape is more stable. I was doing.
　本発明のグラビアオフセット印刷用凹版を用いることで、高精細な配線パターンを形成する場合においても収率良く安定して印刷配線基材を作製することが可能である。 By using the intaglio for gravure offset printing of the present invention, it is possible to produce a printed wiring substrate stably with high yield even when a high-definition wiring pattern is formed.
　１０１　　グラビアオフセット印刷用凹版
　１０２　　インキ
　１０３　　ドクター、スキージまたはスクレーパー
　１０４　　パターン部
　１１１　　転写体
　１１２　　転写層
　１１３　　インキ皮膜
　１２１　　被印刷体
　１２２　　印刷パターン
　２１０　　グラビアオフセット印刷用凹版
　２１１　　パターン部
　２１２　　凹部
　２１３　　凹部
　３１０　　グラビアオフセット印刷用凹版
　３１１　　パターン部
　３１２　　凹部
　３１３　　ダミーパターン部
　４１０　　グラビアオフセット印刷用凹版
　４１１　　パターン部
　４１２　　複数の凹部
　４１３　　複数の凹部
　５１０　　グラビアオフセット印刷用凹版
　５１１　　パターン部
　５１２　　凹部
　５１３　　ダミーパターン部
　６１０　　グラビアオフセット印刷用凹版
　６１１　　パターン部
　６１２　　３本の凹部
　６１３　　３本の凹部 DESCRIPTION OF SYMBOLS 101 Intaglio for gravure offset printing 102 Ink 103 Doctor, squeegee or scraper 104 Pattern part 111 Transfer body 112 Transfer layer 113 Ink film 121 Printed object 122 Print pattern 210 Intaglio for gravure offset printing 211 Pattern part 212 Concave 213 Concave 310 Gravure offset printing Intaglio 311 Pattern part 312 Concave 313 Dummy pattern part 410 Gravure offset printing intaglio 411 Pattern part 412 Multiple recesses 413 Multiple recesses 510 Gravure offset printing intaglio 511 Pattern part 512 Concave part 513 Dummy pattern part 610 Gravure offset printing intaglio 611 Pattern part 612 Three concave parts 613 Three concave parts

Claims (4)

  1. 　配線パターンを形成するためのパターン部を備えるグラビアオフセット印刷用凹版であって、
    　前記パターン部の一部が、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状のパターン部であり、
    　（ａ）前記複数の細線状のパターン部の印刷方向の上端に、ダミーパターン部を設けること、
    　（ｂ）前記複数の細線状のパターン部のうち、印刷方向の始端に位置するパターン部の線幅が、印刷方向の終端に位置するパターン部の線幅より細いこと、
    のいずれかを満たすことを特徴とするグラビアオフセット印刷用凹版。     A gravure offset printing intaglio having a pattern portion for forming a wiring pattern,
    A part of the pattern portion extends in a direction substantially perpendicular to the printing direction, and is a plurality of fine line-shaped pattern portions arranged in parallel in the printing direction,
    (A) providing a dummy pattern portion at the upper end in the printing direction of the plurality of fine line-shaped pattern portions;
    (B) Among the plurality of fine line-shaped pattern portions, the line width of the pattern portion located at the start end in the printing direction is narrower than the line width of the pattern portion located at the end in the printing direction;
    An intaglio for gravure offset printing characterized by satisfying any of the following.
  2. 　前記複数の細線状のパターン部の線幅が１０μｍ以上５ｍｍ以下であり、線と線との間の距離が１０μｍ以上１００μｍ以下であることを特徴とする請求項１に記載のグラビアオフセット印刷用凹版。 2. The intaglio for gravure offset printing according to claim 1, wherein a line width of the plurality of fine line-shaped pattern portions is 10 μm or more and 5 mm or less, and a distance between the lines is 10 μm or more and 100 μm or less. .
  3. 　グラビアオフセット印刷によって形成された配線パターンを備える印刷配線基材であって、
    　前記配線パターンの一部が、印刷方向に対して略垂直な方向に伸び、印刷方向に連続して並設された複数の細線状の配線パターンであり、
    　（ａ）前記複数の細線状の配線パターンの印刷方向の上端に、ダミーパターンを有すること、
    　（ｂ）前記複数の細線状の配線パターンのうち、印刷方向の始端に位置する配線パターンの線幅が、印刷方向の終端に位置する配線パターンの線幅より細いこと、
    のいずれかを満たすことを特徴とする印刷配線基材。     A printed wiring substrate provided with a wiring pattern formed by gravure offset printing,
    A part of the wiring pattern extends in a direction substantially perpendicular to the printing direction, and is a plurality of thin line-like wiring patterns arranged in parallel in the printing direction,
    (A) having a dummy pattern at the upper end in the printing direction of the plurality of thin line-shaped wiring patterns;
    (B) Of the plurality of thin line-shaped wiring patterns, the line width of the wiring pattern positioned at the start end in the printing direction is narrower than the line width of the wiring pattern positioned at the end of the printing direction;
    A printed wiring board characterized by satisfying any of the above.
  4. 　前記複数の細線状の配線パターンの線幅が１０μｍ以上５ｍｍ以下であり、線と線との間の距離が１０μｍ以上１００μｍ以下であることを特徴とする請求項３に記載の印刷配線基材。 The printed wiring board according to claim 3, wherein a line width of the plurality of thin line-shaped wiring patterns is 10 μm or more and 5 mm or less, and a distance between the lines is 10 μm or more and 100 μm or less.
PCT/JP2013/004483 2012-08-01 2013-07-23 Intaglio plate for offset gravure printing and printed wiring board WO2014020862A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018070171A1 (en) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 Printed wiring
JP2018144496A (en) * 2018-04-23 2018-09-20 日本航空電子工業株式会社 Manufacturing method of printed wiring

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361902A (en) * 1989-07-31 1991-03-18 Toppan Printing Co Ltd Production of color filter
JPH0516322A (en) * 1991-07-11 1993-01-26 Toppan Printing Co Ltd Manufacture of intaglio printing plate
JPH09141829A (en) * 1995-11-27 1997-06-03 Matsushita Electric Ind Co Ltd Apparatus for producing electronic part
JP2001353973A (en) * 2000-06-16 2001-12-25 Canon Inc Printing intaglio and offset printing method using the same
JP2003291548A (en) * 2002-03-29 2003-10-15 Tdk Corp Gravure roll and method for manufacturing laminated electronic component
JP2007250892A (en) * 2006-03-16 2007-09-27 Sumitomo Rubber Ind Ltd Method to manufacture conductive paste for intaglio offset printing and conductive pattern
JP2008184501A (en) * 2007-01-29 2008-08-14 Mitsubishi Materials Corp Printing ink and electrode for plasma display panel using the same, and method for producing the electrode
JP2010145777A (en) * 2008-12-19 2010-07-01 Bridgestone Corp Method for manufacturing panel for information display

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3825689B2 (en) * 2001-02-13 2006-09-27 三井金属鉱業株式会社 Printed wiring substrate and electrolytic tin-based alloy plating method
JP4993658B2 (en) * 2005-12-13 2012-08-08 住友ゴム工業株式会社 Printing method
US8101231B2 (en) * 2007-12-07 2012-01-24 Cabot Corporation Processes for forming photovoltaic conductive features from multiple inks
JPWO2010007787A1 (en) * 2008-07-15 2012-01-05 吉田　健治 Autostereoscopic image display system, autostereoscopic image display device, game machine, parallax barrier sheet
JP2010105217A (en) * 2008-10-28 2010-05-13 Panasonic Electric Works Co Ltd Method for manufacturing printing intaglio plate, printing intaglio plate and conductor pattern

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361902A (en) * 1989-07-31 1991-03-18 Toppan Printing Co Ltd Production of color filter
JPH0516322A (en) * 1991-07-11 1993-01-26 Toppan Printing Co Ltd Manufacture of intaglio printing plate
JPH09141829A (en) * 1995-11-27 1997-06-03 Matsushita Electric Ind Co Ltd Apparatus for producing electronic part
JP2001353973A (en) * 2000-06-16 2001-12-25 Canon Inc Printing intaglio and offset printing method using the same
JP2003291548A (en) * 2002-03-29 2003-10-15 Tdk Corp Gravure roll and method for manufacturing laminated electronic component
JP2007250892A (en) * 2006-03-16 2007-09-27 Sumitomo Rubber Ind Ltd Method to manufacture conductive paste for intaglio offset printing and conductive pattern
JP2008184501A (en) * 2007-01-29 2008-08-14 Mitsubishi Materials Corp Printing ink and electrode for plasma display panel using the same, and method for producing the electrode
JP2010145777A (en) * 2008-12-19 2010-07-01 Bridgestone Corp Method for manufacturing panel for information display

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018070171A1 (en) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 Printed wiring
JP2018063578A (en) * 2016-10-13 2018-04-19 日本航空電子工業株式会社 Printed wiring manufacturing method
KR20190033626A (en) * 2016-10-13 2019-03-29 니혼 고꾸 덴시 고교 가부시끼가이샤 Printed wiring
US10754485B2 (en) 2016-10-13 2020-08-25 Japan Aviation Electronics Industry, Limited Printed wiring
KR102189438B1 (en) * 2016-10-13 2020-12-11 니혼 고꾸 덴시 고교 가부시끼가이샤 Printed wiring
US11209945B2 (en) 2016-10-13 2021-12-28 Japan Aviation Electronics Industry, Limited Printed wiring
JP2018144496A (en) * 2018-04-23 2018-09-20 日本航空電子工業株式会社 Manufacturing method of printed wiring

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