WO2013183507A1 - Dispositif de collage par pression de composant - Google Patents

Dispositif de collage par pression de composant Download PDF

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Publication number
WO2013183507A1
WO2013183507A1 PCT/JP2013/064846 JP2013064846W WO2013183507A1 WO 2013183507 A1 WO2013183507 A1 WO 2013183507A1 JP 2013064846 W JP2013064846 W JP 2013064846W WO 2013183507 A1 WO2013183507 A1 WO 2013183507A1
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WIPO (PCT)
Prior art keywords
buffer sheet
component
sheet
lower buffer
following configuration
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PCT/JP2013/064846
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English (en)
Japanese (ja)
Inventor
弘規 宮崎
塩田　素二
松井　隆司
中山　正樹
Original Assignee
シャープ株式会社
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Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to CN201380020798.XA priority Critical patent/CN104246998A/zh
Publication of WO2013183507A1 publication Critical patent/WO2013183507A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75986—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to a component crimping apparatus.
  • Display panels such as liquid crystal display panels and organic EL display panels are generally modularized in combination with mounting components such as ICs and flexible wiring boards (FPCs) for driving them.
  • FPCs flexible wiring boards
  • thermocompression bonding is performed by pressing a mounted component with a heater tool and connecting it to an anisotropic conductive adhesive layer (hereinafter referred to as “ACF layer”) formed on the glass substrate of the display panel. Connection is adopted.
  • ACF layer anisotropic conductive adhesive layer
  • a liquid crystal display panel is mounted on a liquid crystal display panel mounting table via a buffer material layer, and an IC chip is mounted on the extended portion of the substrate of the liquid crystal display panel.
  • the electrode terminals are arranged to face each other through the layers.
  • a thermocompression-bonding jig is brought into contact with the upper surface of the IC chip, and the ACF layer is softened by pressing it in the direction of the liquid crystal display panel mounting base while heating it. Connect the terminal and fix it.
  • a lower buffer sheet (corresponding to the “buffer material layer” in Patent Document 1) is interposed between the backup base on which the liquid crystal display panel is placed and the liquid crystal display panel.
  • an upper buffer sheet is generally interposed between the mounting component and the heater tool.
  • the lower buffer sheet absorbs variations in the thickness of the glass substrate (TFT glass substrate) of the liquid crystal display panel so that uniform pressurization is always performed.
  • the upper buffer sheet absorbs variations in the thickness of the mounted parts so that uniform pressurization is always performed.
  • the upper cushioning sheet further plays a role of preventing crimp displacement at the time of connection.
  • FIG. 12 shows a configuration example of a component crimping device including a lower buffer sheet and an upper buffer sheet.
  • a liquid crystal display panel 1 includes a TFT glass substrate 2 and a CF glass substrate 3 that are bonded to each other.
  • the end of the TFT glass substrate 2 is an extended portion 2a that protrudes from the CF glass substrate 3, and an electrode terminal (not shown) is formed on the upper surface of the extended portion 2a, and an adhesive layer is formed on the electrode terminal.
  • an ACF layer 4 is formed.
  • an electrode terminal (not shown) of the mounting component 5 and the electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4. Connected.
  • the component crimping apparatus 10 that crimps the mounting component 5 to the ACF layer 4 includes a backup base 11 that receives the liquid crystal display panel 10 and a heater tool 12 that presses the mounting component 5 against the ACF layer 4.
  • a lower buffer sheet 13 is disposed between the liquid crystal display panel 1 and the backup table 11, and an upper buffer sheet 14 is disposed between the mounting component 5 and the heater tool 12.
  • the extended portion 2a of the TFT glass substrate 2 of the liquid crystal display panel 1 is placed on the lower buffer sheet 13 placed on the backup table 11, and the mounting component 5 is placed on the ACF layer 4 on the upper surface of the extended portion 2a. Put.
  • An upper buffer sheet 14 is placed on the mounting component 5.
  • the lower buffer sheet 13 absorbs variations in the thickness of the TFT glass substrate 2 so that uniform pressurization is performed.
  • the upper buffer sheet 14 absorbs variations in the thickness of the mounted component 5 so that uniform pressure is applied, and prevents crimping displacement at the time of connection.
  • a material having heat resistance and buffering ability (which can also be expressed as cushioning or elasticity) capable of sufficiently fulfilling the expected role of each is selected. .
  • the component crimping apparatus as described above is used not only for modularizing the display panel, but also for crimping the mounted component to the component mounting board (in this case, the ACF layer is also used).
  • the present invention has been made in view of the above points, and in a component crimping apparatus for pressing a mounting component with a heater tool onto an adhesive layer on a plate-like member such as a display panel or a component mounting substrate, a lower buffer sheet and an upper buffer sheet
  • a component crimping apparatus for pressing a mounting component with a heater tool onto an adhesive layer on a plate-like member such as a display panel or a component mounting substrate, a lower buffer sheet and an upper buffer sheet
  • the purpose is to continue to use the product without hardening or distortion.
  • a component crimping apparatus presses a mounted component against a backup base for receiving a plate-shaped member, a lower buffer sheet interposed between the plate-shaped member and the backup base, and an adhesive layer on the plate-shaped member.
  • the lower buffer sheet and the upper buffer sheet are fed out and wound up independently of each other.
  • the lower buffer sheet is a stack of a plurality of types of lower buffer sheets.
  • the plurality of types of lower buffer sheets are fed out in an overlapped state from the same feeding roll and wound up in the overlapping state on the same winding roll.
  • the plurality of types of lower buffer sheets are separately fed out from the feeding rolls according to type and wound up around the winding rolls according to type.
  • the plurality of types of lower buffer sheets are separated from each other at the time of feeding and winding, and are fed and wound by feeding and winding settings independent of each other.
  • a material having a higher hardness and a lower thickness than those disposed below the plurality of types of lower buffer sheets is selected as the material disposed in the uppermost layer.
  • the plate-like member is preferably a display panel.
  • the plate-like member is a component mounting board.
  • a new part of the sheet without curing or distortion can be used before significant curing or distortion appears in the lower cushioning sheet or the upper cushioning sheet. Crimping work can be performed.
  • 1 is a schematic configuration diagram of a component crimping apparatus according to a first embodiment. It is the schematic block diagram which looked at the component crimping apparatus of 1st Embodiment from the direction orthogonal to FIG. It is 1st explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment. It is the 2nd explanatory view of the thermocompression bonding connection process of the mounting parts by the component crimping apparatus of a 1st embodiment. It is a 3rd explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment.
  • FIGS. 1 to 11 the first to fourth embodiments of the component crimping apparatus according to the present invention will be described with reference to FIGS. 1 to 11.
  • constituent elements that are functionally common with the conventional structure shown in FIG. 12 are denoted by the same reference numerals used in FIG. 12, and description thereof is omitted.
  • the characteristic of the component crimping apparatus 10 according to the first embodiment is that the lower cushioning sheet 13 and the upper cushioning sheet 14 are respectively wound in a roll shape, and the lower cushioning sheet 13 and the upper cushioning sheet 14 are fed out from the rolls by a required length, The lower buffer sheet 13 and the upper buffer sheet 14 that have been used are wound in a roll again and disposed of.
  • the lower buffer sheet 13 is fed out from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and is wound up on the take-up roll 23 through the guide roller 22.
  • the upper buffer sheet 14 is fed out from the feed roll 24, reaches the lower side of the heater tool 12 through the guide roller 25, passes through the portion of the heater tool 12, and is taken up by the take-up roll 27 through the guide roller 26.
  • the take-up rolls 23 and 27 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13 and the upper buffer sheet 14 can be wound up independently of each other.
  • the feeding rolls 20 and 24 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13 and the upper buffer sheet 14.
  • the tensioner may be provided on the guide rollers 21 and 25 instead of the feeding rolls 20 and 24.
  • the take-up roll 23 is rotated to pull out the lower buffer sheet 13 from the feed roll 20, and a place that has not yet been subjected to heat and pressure is placed on the backup table 11. Further, the take-up roll 27 is rotated to pull out the upper buffer sheet 14 from the feed roll 24, and a portion that has not been subjected to heat and pressure is placed under the heater tool 12.
  • the plate-like member is placed on the lower buffer sheet 13.
  • 1 to 5 show the TFT glass substrate 2 of the liquid crystal display panel 1, and the extended portion 2 a among them, as a plate-like member.
  • the extended portion 2 a of the TFT glass substrate 2 is inserted between the backup table 11 and the heater tool 12, and then it is lowered and placed on the lower buffer sheet 13.
  • the upper buffer sheet 14 is lowered and applied to the mounting component 5 placed on the ACF layer 4 on the upper surface of the TFT glass substrate 2.
  • the heater tool 12 is lowered, and heat and pressure are applied to the component 5 through the upper buffer sheet 14.
  • the mounting component 5 is physically connected to the TFT glass substrate 2 via the ACF layer 4, and an electrode terminal (not shown) of the mounting component 5 and an electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4.
  • the heater tool 12 and the upper buffer sheet 14 are raised to open the space between the backup table 11 and the lower buffer sheet 13, and the liquid crystal display panel 1 in which the thermocompression bonding of the mounting component 5 is completed is pulled out.
  • the portions to which heat and pressure are applied in the lower buffer sheet 13 and the upper buffer sheet 14 are gradually cured. As shown in FIG. 4, distortions 15 and 16 also occur. Therefore, the lower buffer sheet 13 and the upper buffer sheet 14 are wound at an appropriate timing, and the positions of the distortions 15 and 16 are shifted from the backup table 11 and the heater tool 12 as shown in FIG. As a result, a portion of the lower buffer sheet 13 that has not yet received heat and pressure is placed on the backup table 11, and a portion of the upper buffer sheet 14 that has not yet received heat and pressure has been heated. It will be placed under the tool 12.
  • the “appropriate timing” is set as a timing other than the process in which the heater tool 12 presses the mounting component 5 against the ACF layer 4.
  • the winding of the lower buffer sheet 13 and the upper buffer sheet 14 can be set so as to be performed every time the thermocompression bonding of the mounting component 5 is performed a predetermined number of times, and each time the thermocompression bonding of the mounting component 5 is performed once. It can also be set to be performed. The above settings may be made after confirming how much the sheet is cured by one thermocompression bonding and how much distortion occurs.
  • the amount of winding of the lower buffer sheet 13 required to shift the distortion 15 from the backup table 11 and the amount of winding of the upper buffer sheet 14 required to shift the distortion 16 from the heater tool 12 are not the same.
  • the lower buffer sheet 13 and the upper buffer sheet 14 are provided with independent winding rotation mechanisms, so that a winding amount suitable for each of the lower buffer sheet 13 and the upper buffer sheet 14 can be set. . Not only the amount of winding but also the timing of winding can be set separately for the lower buffer sheet 13 and the upper buffer sheet 14.
  • FIG. 6 and 7 show a second embodiment.
  • the second embodiment is different from the first embodiment in the configuration of the lower buffer sheet 13. That is, the lower cushioning sheet 13 is obtained by stacking a plurality of types of lower cushioning sheets vertically.
  • FIG. 7 shows an example in which two types of lower buffer sheets 13A and 13B are stacked, it goes without saying that three or more types of lower buffer sheets may be stacked.
  • the lower buffer sheets 13 ⁇ / b> A and 13 ⁇ / b> B in an overlapped state are fed out from the same feed roll 20 and taken up on the same take-up roll 23.
  • the lower buffer sheet 13A and the lower buffer sheet 13B are made of materials having different physical properties (heat resistance and buffer properties).
  • a material having a higher hardness and a lower thickness than the lower buffer sheet 13B disposed below the upper buffer sheet 13A is selected.
  • the third embodiment is characterized in that a lower buffer sheet 28 different from the lower buffer sheet 13 wound around the feeding roll 20 is fixed to the upper surface of the backup table 11.
  • the material of the lower buffer sheet 28 is selected so that optimum physical properties can be obtained by a synergistic effect with the lower buffer sheet 13.
  • the lower buffer sheet 13 may have a single layer structure as in the first embodiment, or may have a multilayer structure as in the second embodiment.
  • the fourth embodiment uses a plurality of types of lower shock-absorbing sheets stacked one above the other, but the plurality of types of lower shock-absorbing sheets are separately fed from the type-by-type feeding rolls. It is characterized by being wound up separately on a winding roll.
  • the lower cushioning sheet 13A is fed from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and then is wound on the take-up roll 23 through the guide roller 22.
  • the lower buffer sheet 13B is fed out from the feed roll 29, reaches the upper surface of the backup table 11 through the guide roller 30, passes through the location of the backup table 11, and then is wound up on the take-up roll 32 through the guide roller 31.
  • the lower cushion sheet 13A that is the uppermost layer is selected from a material that is harder and thinner than the lower cushion sheet 13B that is disposed below it.
  • the take-up rolls 23 and 32 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13A and the lower buffer sheet 13B can be wound up independently of each other.
  • the feeding rolls 20 and 29 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13A and the lower buffer sheet 13B.
  • the tensioner may be provided on the guide rollers 21 and 30 instead of the feeding rolls 20 and 29.
  • the distortion generated in the lower buffer sheet 13A and the distortion generated in the lower buffer sheet 13B are not necessarily the same size, and the lower buffer sheet 13A necessary for shifting the distortion of the lower buffer sheet 13A from the backup table 11 And the amount of winding of the lower buffer sheet 13B necessary for shifting the distortion of the lower buffer sheet 13B from the backup table 11 may not be the same. Further, the lower buffer sheet 13A and the lower buffer sheet 13B have different degrees of curing, and it may be necessary to perform winding at different timings.
  • the lower buffer sheet 13A and the lower buffer sheet 13B are provided with mutually independent winding and rotating mechanisms.
  • the lower cushioning sheet 13A and the lower cushioning sheet 13B are separated from each other at the time of unwinding and winding, so that the lower cushioning sheet 13A and the lower cushioning sheet 13B do not rub against each other and do not interfere with the winding, and are independent of each other.
  • the upper cushioning sheet 14 It is also possible to apply to the upper cushioning sheet 14 a configuration in which a plurality of types of buffer sheets are separately fed out from the different types of feeding rolls and wound up separately into the respective types of winding rolls.
  • liquid crystal display panel has been described as an example of the plate member, it is needless to say that the present invention is not limited thereto.
  • the component crimping device of the present invention can be used to crimp components to any plate-like member such as an organic EL display panel and a component mounting board.
  • the present invention is widely applicable to a component crimping apparatus used for forming a liquid crystal module by combining a liquid crystal display panel with mounting components such as an IC for driving a liquid crystal and a flexible wiring board.
  • SYMBOLS 1 Liquid crystal display panel 2 TFT glass substrate 3 CF glass substrate 4 Anisotropic conductive contact bonding layer (ACF layer) 5 Mounting Parts 10 Parts Crimping Device 11 Backup Stand 12 Heater Tool 13, 13A, 13B Lower Buffer Sheet 14 Upper Buffer Sheet 20, 24, 29 Feeding Roll 23, 27, 32 Winding Roll

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un dispositif de collage par pression de composant (10) qui comprend : une table de soutien (11) sur laquelle est placé un panneau d'affichage à cristaux liquides (1) comme exemple d'élément de type plaque ; une feuille de tampon inférieure (13) interposée entre le panneau d'affichage à cristaux liquides et la table de soutien ; un outil de chauffage (12) qui pousse un composant à monter (5) contre une couche ACF (4) sur le panneau d'affichage à cristaux liquides ; et une feuille de tampon supérieure (14) interposée entre le composant à monter (5) et l'outil de chauffage. La feuille de tampon inférieure et la feuille de tampon supérieure sont alimentées par des rouleaux d'alimentation (20, 24), et amenées à l'emplacement de la table de soutien et de l'outil de chauffage, et sont ensuite enroulées sur des rouleaux enrouleurs (23, 27). La feuille de tampon inférieure et la feuille de tampon supérieure sont enroulées à un moment autre que l'étape dans laquelle l'outil de chauffage pousse contre la couche ACF le composant à monter.
PCT/JP2013/064846 2012-06-06 2013-05-29 Dispositif de collage par pression de composant WO2013183507A1 (fr)

Priority Applications (1)

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CN201380020798.XA CN104246998A (zh) 2012-06-06 2013-05-29 部件压接装置

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JP2012-128776 2012-06-06
JP2012128776 2012-06-06

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WO2013183507A1 true WO2013183507A1 (fr) 2013-12-12

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Cited By (4)

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EP3331001A4 (fr) * 2015-08-28 2019-02-20 Hitachi Chemical Company, Ltd. Composition pour feuille d'amortissement, et feuille d'amortissement
WO2019175934A1 (fr) * 2018-03-12 2019-09-19 堺ディスプレイプロダクト株式会社 Dispositif de liaison par thermocompression
CN112218516A (zh) * 2019-07-09 2021-01-12 芝浦机械电子装置株式会社 安装装置
US11201133B2 (en) * 2018-11-28 2021-12-14 Samsung Display Co., Ltd. Bonding apparatus and method

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CN107210242B (zh) * 2015-12-23 2019-08-02 深圳市柔宇科技有限公司 绑定装置及柔性显示模组的绑定方法
TWI567011B (zh) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process

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JP2002222829A (ja) * 2001-01-24 2002-08-09 Nec Kagoshima Ltd 液晶表示装置の製造方法
JP2007115893A (ja) * 2005-10-20 2007-05-10 Toshiba Matsushita Display Technology Co Ltd 熱圧着方法および熱圧着装置
JP2007165571A (ja) * 2005-12-14 2007-06-28 Matsushita Electric Ind Co Ltd 電子部品実装装置

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TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
JP2007109813A (ja) * 2005-10-12 2007-04-26 Toshiba Matsushita Display Technology Co Ltd 表示装置の製造装置
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置

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JP2002222829A (ja) * 2001-01-24 2002-08-09 Nec Kagoshima Ltd 液晶表示装置の製造方法
JP2007115893A (ja) * 2005-10-20 2007-05-10 Toshiba Matsushita Display Technology Co Ltd 熱圧着方法および熱圧着装置
JP2007165571A (ja) * 2005-12-14 2007-06-28 Matsushita Electric Ind Co Ltd 電子部品実装装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3331001A4 (fr) * 2015-08-28 2019-02-20 Hitachi Chemical Company, Ltd. Composition pour feuille d'amortissement, et feuille d'amortissement
WO2019175934A1 (fr) * 2018-03-12 2019-09-19 堺ディスプレイプロダクト株式会社 Dispositif de liaison par thermocompression
US11201133B2 (en) * 2018-11-28 2021-12-14 Samsung Display Co., Ltd. Bonding apparatus and method
CN112218516A (zh) * 2019-07-09 2021-01-12 芝浦机械电子装置株式会社 安装装置
CN112218516B (zh) * 2019-07-09 2021-08-20 芝浦机械电子装置株式会社 安装装置

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