WO2013183507A1 - Component press-bonding device - Google Patents

Component press-bonding device Download PDF

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Publication number
WO2013183507A1
WO2013183507A1 PCT/JP2013/064846 JP2013064846W WO2013183507A1 WO 2013183507 A1 WO2013183507 A1 WO 2013183507A1 JP 2013064846 W JP2013064846 W JP 2013064846W WO 2013183507 A1 WO2013183507 A1 WO 2013183507A1
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WIPO (PCT)
Prior art keywords
buffer sheet
component
sheet
lower buffer
following configuration
Prior art date
Application number
PCT/JP2013/064846
Other languages
French (fr)
Japanese (ja)
Inventor
弘規 宮崎
塩田　素二
松井　隆司
中山　正樹
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to CN201380020798.XA priority Critical patent/CN104246998A/en
Publication of WO2013183507A1 publication Critical patent/WO2013183507A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
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    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75986—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to a component crimping apparatus.
  • Display panels such as liquid crystal display panels and organic EL display panels are generally modularized in combination with mounting components such as ICs and flexible wiring boards (FPCs) for driving them.
  • FPCs flexible wiring boards
  • thermocompression bonding is performed by pressing a mounted component with a heater tool and connecting it to an anisotropic conductive adhesive layer (hereinafter referred to as “ACF layer”) formed on the glass substrate of the display panel. Connection is adopted.
  • ACF layer anisotropic conductive adhesive layer
  • a liquid crystal display panel is mounted on a liquid crystal display panel mounting table via a buffer material layer, and an IC chip is mounted on the extended portion of the substrate of the liquid crystal display panel.
  • the electrode terminals are arranged to face each other through the layers.
  • a thermocompression-bonding jig is brought into contact with the upper surface of the IC chip, and the ACF layer is softened by pressing it in the direction of the liquid crystal display panel mounting base while heating it. Connect the terminal and fix it.
  • a lower buffer sheet (corresponding to the “buffer material layer” in Patent Document 1) is interposed between the backup base on which the liquid crystal display panel is placed and the liquid crystal display panel.
  • an upper buffer sheet is generally interposed between the mounting component and the heater tool.
  • the lower buffer sheet absorbs variations in the thickness of the glass substrate (TFT glass substrate) of the liquid crystal display panel so that uniform pressurization is always performed.
  • the upper buffer sheet absorbs variations in the thickness of the mounted parts so that uniform pressurization is always performed.
  • the upper cushioning sheet further plays a role of preventing crimp displacement at the time of connection.
  • FIG. 12 shows a configuration example of a component crimping device including a lower buffer sheet and an upper buffer sheet.
  • a liquid crystal display panel 1 includes a TFT glass substrate 2 and a CF glass substrate 3 that are bonded to each other.
  • the end of the TFT glass substrate 2 is an extended portion 2a that protrudes from the CF glass substrate 3, and an electrode terminal (not shown) is formed on the upper surface of the extended portion 2a, and an adhesive layer is formed on the electrode terminal.
  • an ACF layer 4 is formed.
  • an electrode terminal (not shown) of the mounting component 5 and the electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4. Connected.
  • the component crimping apparatus 10 that crimps the mounting component 5 to the ACF layer 4 includes a backup base 11 that receives the liquid crystal display panel 10 and a heater tool 12 that presses the mounting component 5 against the ACF layer 4.
  • a lower buffer sheet 13 is disposed between the liquid crystal display panel 1 and the backup table 11, and an upper buffer sheet 14 is disposed between the mounting component 5 and the heater tool 12.
  • the extended portion 2a of the TFT glass substrate 2 of the liquid crystal display panel 1 is placed on the lower buffer sheet 13 placed on the backup table 11, and the mounting component 5 is placed on the ACF layer 4 on the upper surface of the extended portion 2a. Put.
  • An upper buffer sheet 14 is placed on the mounting component 5.
  • the lower buffer sheet 13 absorbs variations in the thickness of the TFT glass substrate 2 so that uniform pressurization is performed.
  • the upper buffer sheet 14 absorbs variations in the thickness of the mounted component 5 so that uniform pressure is applied, and prevents crimping displacement at the time of connection.
  • a material having heat resistance and buffering ability (which can also be expressed as cushioning or elasticity) capable of sufficiently fulfilling the expected role of each is selected. .
  • the component crimping apparatus as described above is used not only for modularizing the display panel, but also for crimping the mounted component to the component mounting board (in this case, the ACF layer is also used).
  • the present invention has been made in view of the above points, and in a component crimping apparatus for pressing a mounting component with a heater tool onto an adhesive layer on a plate-like member such as a display panel or a component mounting substrate, a lower buffer sheet and an upper buffer sheet
  • a component crimping apparatus for pressing a mounting component with a heater tool onto an adhesive layer on a plate-like member such as a display panel or a component mounting substrate, a lower buffer sheet and an upper buffer sheet
  • the purpose is to continue to use the product without hardening or distortion.
  • a component crimping apparatus presses a mounted component against a backup base for receiving a plate-shaped member, a lower buffer sheet interposed between the plate-shaped member and the backup base, and an adhesive layer on the plate-shaped member.
  • the lower buffer sheet and the upper buffer sheet are fed out and wound up independently of each other.
  • the lower buffer sheet is a stack of a plurality of types of lower buffer sheets.
  • the plurality of types of lower buffer sheets are fed out in an overlapped state from the same feeding roll and wound up in the overlapping state on the same winding roll.
  • the plurality of types of lower buffer sheets are separately fed out from the feeding rolls according to type and wound up around the winding rolls according to type.
  • the plurality of types of lower buffer sheets are separated from each other at the time of feeding and winding, and are fed and wound by feeding and winding settings independent of each other.
  • a material having a higher hardness and a lower thickness than those disposed below the plurality of types of lower buffer sheets is selected as the material disposed in the uppermost layer.
  • the plate-like member is preferably a display panel.
  • the plate-like member is a component mounting board.
  • a new part of the sheet without curing or distortion can be used before significant curing or distortion appears in the lower cushioning sheet or the upper cushioning sheet. Crimping work can be performed.
  • 1 is a schematic configuration diagram of a component crimping apparatus according to a first embodiment. It is the schematic block diagram which looked at the component crimping apparatus of 1st Embodiment from the direction orthogonal to FIG. It is 1st explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment. It is the 2nd explanatory view of the thermocompression bonding connection process of the mounting parts by the component crimping apparatus of a 1st embodiment. It is a 3rd explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment.
  • FIGS. 1 to 11 the first to fourth embodiments of the component crimping apparatus according to the present invention will be described with reference to FIGS. 1 to 11.
  • constituent elements that are functionally common with the conventional structure shown in FIG. 12 are denoted by the same reference numerals used in FIG. 12, and description thereof is omitted.
  • the characteristic of the component crimping apparatus 10 according to the first embodiment is that the lower cushioning sheet 13 and the upper cushioning sheet 14 are respectively wound in a roll shape, and the lower cushioning sheet 13 and the upper cushioning sheet 14 are fed out from the rolls by a required length, The lower buffer sheet 13 and the upper buffer sheet 14 that have been used are wound in a roll again and disposed of.
  • the lower buffer sheet 13 is fed out from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and is wound up on the take-up roll 23 through the guide roller 22.
  • the upper buffer sheet 14 is fed out from the feed roll 24, reaches the lower side of the heater tool 12 through the guide roller 25, passes through the portion of the heater tool 12, and is taken up by the take-up roll 27 through the guide roller 26.
  • the take-up rolls 23 and 27 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13 and the upper buffer sheet 14 can be wound up independently of each other.
  • the feeding rolls 20 and 24 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13 and the upper buffer sheet 14.
  • the tensioner may be provided on the guide rollers 21 and 25 instead of the feeding rolls 20 and 24.
  • the take-up roll 23 is rotated to pull out the lower buffer sheet 13 from the feed roll 20, and a place that has not yet been subjected to heat and pressure is placed on the backup table 11. Further, the take-up roll 27 is rotated to pull out the upper buffer sheet 14 from the feed roll 24, and a portion that has not been subjected to heat and pressure is placed under the heater tool 12.
  • the plate-like member is placed on the lower buffer sheet 13.
  • 1 to 5 show the TFT glass substrate 2 of the liquid crystal display panel 1, and the extended portion 2 a among them, as a plate-like member.
  • the extended portion 2 a of the TFT glass substrate 2 is inserted between the backup table 11 and the heater tool 12, and then it is lowered and placed on the lower buffer sheet 13.
  • the upper buffer sheet 14 is lowered and applied to the mounting component 5 placed on the ACF layer 4 on the upper surface of the TFT glass substrate 2.
  • the heater tool 12 is lowered, and heat and pressure are applied to the component 5 through the upper buffer sheet 14.
  • the mounting component 5 is physically connected to the TFT glass substrate 2 via the ACF layer 4, and an electrode terminal (not shown) of the mounting component 5 and an electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4.
  • the heater tool 12 and the upper buffer sheet 14 are raised to open the space between the backup table 11 and the lower buffer sheet 13, and the liquid crystal display panel 1 in which the thermocompression bonding of the mounting component 5 is completed is pulled out.
  • the portions to which heat and pressure are applied in the lower buffer sheet 13 and the upper buffer sheet 14 are gradually cured. As shown in FIG. 4, distortions 15 and 16 also occur. Therefore, the lower buffer sheet 13 and the upper buffer sheet 14 are wound at an appropriate timing, and the positions of the distortions 15 and 16 are shifted from the backup table 11 and the heater tool 12 as shown in FIG. As a result, a portion of the lower buffer sheet 13 that has not yet received heat and pressure is placed on the backup table 11, and a portion of the upper buffer sheet 14 that has not yet received heat and pressure has been heated. It will be placed under the tool 12.
  • the “appropriate timing” is set as a timing other than the process in which the heater tool 12 presses the mounting component 5 against the ACF layer 4.
  • the winding of the lower buffer sheet 13 and the upper buffer sheet 14 can be set so as to be performed every time the thermocompression bonding of the mounting component 5 is performed a predetermined number of times, and each time the thermocompression bonding of the mounting component 5 is performed once. It can also be set to be performed. The above settings may be made after confirming how much the sheet is cured by one thermocompression bonding and how much distortion occurs.
  • the amount of winding of the lower buffer sheet 13 required to shift the distortion 15 from the backup table 11 and the amount of winding of the upper buffer sheet 14 required to shift the distortion 16 from the heater tool 12 are not the same.
  • the lower buffer sheet 13 and the upper buffer sheet 14 are provided with independent winding rotation mechanisms, so that a winding amount suitable for each of the lower buffer sheet 13 and the upper buffer sheet 14 can be set. . Not only the amount of winding but also the timing of winding can be set separately for the lower buffer sheet 13 and the upper buffer sheet 14.
  • FIG. 6 and 7 show a second embodiment.
  • the second embodiment is different from the first embodiment in the configuration of the lower buffer sheet 13. That is, the lower cushioning sheet 13 is obtained by stacking a plurality of types of lower cushioning sheets vertically.
  • FIG. 7 shows an example in which two types of lower buffer sheets 13A and 13B are stacked, it goes without saying that three or more types of lower buffer sheets may be stacked.
  • the lower buffer sheets 13 ⁇ / b> A and 13 ⁇ / b> B in an overlapped state are fed out from the same feed roll 20 and taken up on the same take-up roll 23.
  • the lower buffer sheet 13A and the lower buffer sheet 13B are made of materials having different physical properties (heat resistance and buffer properties).
  • a material having a higher hardness and a lower thickness than the lower buffer sheet 13B disposed below the upper buffer sheet 13A is selected.
  • the third embodiment is characterized in that a lower buffer sheet 28 different from the lower buffer sheet 13 wound around the feeding roll 20 is fixed to the upper surface of the backup table 11.
  • the material of the lower buffer sheet 28 is selected so that optimum physical properties can be obtained by a synergistic effect with the lower buffer sheet 13.
  • the lower buffer sheet 13 may have a single layer structure as in the first embodiment, or may have a multilayer structure as in the second embodiment.
  • the fourth embodiment uses a plurality of types of lower shock-absorbing sheets stacked one above the other, but the plurality of types of lower shock-absorbing sheets are separately fed from the type-by-type feeding rolls. It is characterized by being wound up separately on a winding roll.
  • the lower cushioning sheet 13A is fed from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and then is wound on the take-up roll 23 through the guide roller 22.
  • the lower buffer sheet 13B is fed out from the feed roll 29, reaches the upper surface of the backup table 11 through the guide roller 30, passes through the location of the backup table 11, and then is wound up on the take-up roll 32 through the guide roller 31.
  • the lower cushion sheet 13A that is the uppermost layer is selected from a material that is harder and thinner than the lower cushion sheet 13B that is disposed below it.
  • the take-up rolls 23 and 32 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13A and the lower buffer sheet 13B can be wound up independently of each other.
  • the feeding rolls 20 and 29 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13A and the lower buffer sheet 13B.
  • the tensioner may be provided on the guide rollers 21 and 30 instead of the feeding rolls 20 and 29.
  • the distortion generated in the lower buffer sheet 13A and the distortion generated in the lower buffer sheet 13B are not necessarily the same size, and the lower buffer sheet 13A necessary for shifting the distortion of the lower buffer sheet 13A from the backup table 11 And the amount of winding of the lower buffer sheet 13B necessary for shifting the distortion of the lower buffer sheet 13B from the backup table 11 may not be the same. Further, the lower buffer sheet 13A and the lower buffer sheet 13B have different degrees of curing, and it may be necessary to perform winding at different timings.
  • the lower buffer sheet 13A and the lower buffer sheet 13B are provided with mutually independent winding and rotating mechanisms.
  • the lower cushioning sheet 13A and the lower cushioning sheet 13B are separated from each other at the time of unwinding and winding, so that the lower cushioning sheet 13A and the lower cushioning sheet 13B do not rub against each other and do not interfere with the winding, and are independent of each other.
  • the upper cushioning sheet 14 It is also possible to apply to the upper cushioning sheet 14 a configuration in which a plurality of types of buffer sheets are separately fed out from the different types of feeding rolls and wound up separately into the respective types of winding rolls.
  • liquid crystal display panel has been described as an example of the plate member, it is needless to say that the present invention is not limited thereto.
  • the component crimping device of the present invention can be used to crimp components to any plate-like member such as an organic EL display panel and a component mounting board.
  • the present invention is widely applicable to a component crimping apparatus used for forming a liquid crystal module by combining a liquid crystal display panel with mounting components such as an IC for driving a liquid crystal and a flexible wiring board.
  • SYMBOLS 1 Liquid crystal display panel 2 TFT glass substrate 3 CF glass substrate 4 Anisotropic conductive contact bonding layer (ACF layer) 5 Mounting Parts 10 Parts Crimping Device 11 Backup Stand 12 Heater Tool 13, 13A, 13B Lower Buffer Sheet 14 Upper Buffer Sheet 20, 24, 29 Feeding Roll 23, 27, 32 Winding Roll

Abstract

A component press-bonding device (10) includes: a backup table (11) on which a liquid crystal display panel (1) as an example of a plate-like member is placed; a lower buffer sheet (13) interposed between the liquid crystal display panel and the backup table; a heater tool (12) that presses a mount component (5) against an ACF layer (4) on the liquid crystal display panel; and an upper buffer sheet (14) interposed between the mount component (5) and the heater tool. The lower buffer sheet and the upper buffer sheet are fed from feed rolls (20, 24), and led to the position of the backup table and the heater tool, and thereafter are wound up on take-up rolls (23, 27). The lower buffer sheet and the upper buffer sheet are wound up at a timing other than the step in which the heater tool presses the mount component against the ACF layer.

Description

部品圧着装置Component crimping device
　本発明は部品圧着装置に関する。 The present invention relates to a component crimping apparatus.
　液晶表示パネルや有機ＥＬ表示パネルのような表示パネルは、それらを駆動するＩＣやフレキシブル配線基板（ＦＰＣ）などの実装部品と組み合わせてモジュール化されるのが一般的である。表示パネルのモジュール化にあたっては、表示パネルのガラス基板上に形成された異方性導電接着層（以下本明細書では「ＡＣＦ層」と称する）に実装部品をヒーターツールで押し付けて接続する熱圧着接続が採用される。このような熱圧着接続を行う装置の例を特許文献１に見ることができる。 Display panels such as liquid crystal display panels and organic EL display panels are generally modularized in combination with mounting components such as ICs and flexible wiring boards (FPCs) for driving them. When modularizing a display panel, thermocompression bonding is performed by pressing a mounted component with a heater tool and connecting it to an anisotropic conductive adhesive layer (hereinafter referred to as “ACF layer”) formed on the glass substrate of the display panel. Connection is adopted. An example of an apparatus for performing such thermocompression bonding can be found in Patent Document 1.
　特許文献１に記載された部品圧着装置では、液晶表示パネル載置台上に緩衝材層を介して液晶表示パネルを載置し、その液晶表示パネルの基板の延設部状にＩＣチップを、ＡＣＦ層を介して互いの電極端子を対向させて配置する。そのＩＣチップの上面に熱圧着用治具を当接させ、それを加熱しながら、液晶表示パネル載置台の方向に押圧してＡＣＦ層を一旦軟化させた後硬化させ、基板とＩＣチップの電極端子を導通させて接着固定する。 In the component crimping apparatus described in Patent Document 1, a liquid crystal display panel is mounted on a liquid crystal display panel mounting table via a buffer material layer, and an IC chip is mounted on the extended portion of the substrate of the liquid crystal display panel. The electrode terminals are arranged to face each other through the layers. A thermocompression-bonding jig is brought into contact with the upper surface of the IC chip, and the ACF layer is softened by pressing it in the direction of the liquid crystal display panel mounting base while heating it. Connect the terminal and fix it.
　液晶モジュール形成のための熱圧着接続においては、液晶表示パネルを載置するバックアップ台と液晶表示パネルの間に下緩衝シート（特許文献１の「緩衝材層」に相当）を介在させることはもちろんであるが、実装部品とヒーターツールの間に上緩衝シートを介在させることも一般的に行われる。下緩衝シートは液晶表示パネルのガラス基板（ＴＦＴガラス基板）の厚みのバラツキを吸収して常に均等な加圧が行われるようにする。上緩衝シートは実装部品の厚みのバラツキを吸収して常に均等な加圧が行われるようにする。上緩衝シートはさらに、接続時の圧着ズレを防止する役割も果たす。 In thermocompression bonding for forming a liquid crystal module, a lower buffer sheet (corresponding to the “buffer material layer” in Patent Document 1) is interposed between the backup base on which the liquid crystal display panel is placed and the liquid crystal display panel. However, an upper buffer sheet is generally interposed between the mounting component and the heater tool. The lower buffer sheet absorbs variations in the thickness of the glass substrate (TFT glass substrate) of the liquid crystal display panel so that uniform pressurization is always performed. The upper buffer sheet absorbs variations in the thickness of the mounted parts so that uniform pressurization is always performed. The upper cushioning sheet further plays a role of preventing crimp displacement at the time of connection.
　下緩衝シートと上緩衝シートを備える部品圧着装置の構成例を図１２に示す。１は液晶表示パネルであって、互いに貼り合わせられるＴＦＴガラス基板２とＣＦガラス基板３を備える。ＴＦＴガラス基板２の端はＣＦガラス基板３からはみ出す延設部２ａとなっており、その延設部２ａの上面に電極端子（図示せず）が形成され、その電極端子の上に、接着層としてＡＣＦ層４が形成されている。ＡＣＦ層４に載置された実装部品５に熱と圧力を加えることにより、実装部品５の電極端子（図示せず）とＴＦＴガラス基板２の前記図示しない電極端子がＡＣＦ層４を介して電気的に接続される。 FIG. 12 shows a configuration example of a component crimping device including a lower buffer sheet and an upper buffer sheet. A liquid crystal display panel 1 includes a TFT glass substrate 2 and a CF glass substrate 3 that are bonded to each other. The end of the TFT glass substrate 2 is an extended portion 2a that protrudes from the CF glass substrate 3, and an electrode terminal (not shown) is formed on the upper surface of the extended portion 2a, and an adhesive layer is formed on the electrode terminal. As shown, an ACF layer 4 is formed. By applying heat and pressure to the mounting component 5 placed on the ACF layer 4, an electrode terminal (not shown) of the mounting component 5 and the electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4. Connected.
　実装部品５をＡＣＦ層４に圧着する部品圧着装置１０は、液晶表示パネル１０を受け止めるバックアップ台１１と、ＡＣＦ層４に実装部品５を押し付けるヒーターツール１２を備える。液晶表示パネル１とバックアップ台１１の間には下緩衝シート１３が配置され、実装部品５とヒーターツール１２の間には上緩衝シート１４が配置されている。 The component crimping apparatus 10 that crimps the mounting component 5 to the ACF layer 4 includes a backup base 11 that receives the liquid crystal display panel 10 and a heater tool 12 that presses the mounting component 5 against the ACF layer 4. A lower buffer sheet 13 is disposed between the liquid crystal display panel 1 and the backup table 11, and an upper buffer sheet 14 is disposed between the mounting component 5 and the heater tool 12.
　バックアップ台１１に載置された下緩衝シート１３の上に液晶表示パネル１のＴＦＴガラス基板２の延設部２ａを載置し、延設部２ａの上面のＡＣＦ層４の上に実装部品５を置く。実装部品５の上には上緩衝シート１４を置く。ヒーターツール１２で上緩衝シート１４の上から実装部品５を圧迫すると、ヒーターツール１２より熱と圧力が実装部品５に伝わり、実装部品５はＡＣＦ層４に圧着され、実装部品５は液晶表示パネル１に物理的及び電気的に接続される。下緩衝シート１３はＴＦＴガラス基板２の厚みのバラツキを吸収して均等な加圧が行われるようにする。上緩衝シート１４は実装部品５の厚みのバラツキを吸収して均等な加圧が行われるようにするとともに、接続時の圧着ズレを防止する。下緩衝シート１３と上緩衝シート１４には、それぞれに期待されている役割を十分に果たし得る耐熱性と緩衝性（クッション性あるいは弾力性と表現することもできる）を備えた材料が選択される。 The extended portion 2a of the TFT glass substrate 2 of the liquid crystal display panel 1 is placed on the lower buffer sheet 13 placed on the backup table 11, and the mounting component 5 is placed on the ACF layer 4 on the upper surface of the extended portion 2a. Put. An upper buffer sheet 14 is placed on the mounting component 5. When the mounting tool 5 is pressed from above the upper buffer sheet 14 by the heater tool 12, heat and pressure are transmitted from the heater tool 12 to the mounting part 5, and the mounting part 5 is pressure-bonded to the ACF layer 4, and the mounting part 5 is a liquid crystal display panel. 1 is physically and electrically connected. The lower buffer sheet 13 absorbs variations in the thickness of the TFT glass substrate 2 so that uniform pressurization is performed. The upper buffer sheet 14 absorbs variations in the thickness of the mounted component 5 so that uniform pressure is applied, and prevents crimping displacement at the time of connection. For the lower cushioning sheet 13 and the upper cushioning sheet 14, a material having heat resistance and buffering ability (which can also be expressed as cushioning or elasticity) capable of sufficiently fulfilling the expected role of each is selected. .
　上記のような部品圧着装置は、表示パネルをモジュール化するのに用いられるばかりでなく、部品実装基板に実装部品を圧着する（この場合にもＡＣＦ層が用いられる）のにも利用される。 The component crimping apparatus as described above is used not only for modularizing the display panel, but also for crimping the mounted component to the component mounting board (in this case, the ACF layer is also used).
特開２００９－６９７０５号公報JP 2009-69705 A
　図１２の部品圧着装置１０において、下緩衝シート１３と上緩衝シート１４には同一の箇所に熱と圧力が加わり続ける。下緩衝シート１３と上緩衝シート１４には耐久性に富む材料が選択されるとはいうものの、同一箇所に熱と圧力が加わり続けることで、その箇所は次第に硬化して行く。その結果、所期の緩衝作用が得られなくなり、接続の不具合が発生する。 In the component crimping apparatus 10 of FIG. 12, heat and pressure continue to be applied to the same location in the lower buffer sheet 13 and the upper buffer sheet 14. Although a material having high durability is selected for the lower buffer sheet 13 and the upper buffer sheet 14, when the heat and pressure are continuously applied to the same part, the part gradually hardens. As a result, the desired buffer action cannot be obtained, and a connection failure occurs.
　熱と圧力を受ける箇所は硬化するばかりでなく歪みもする。下緩衝シート１３と上緩衝シート１４に歪み部１５、１６が生じると、それはさらなる接続不具合を招く。 ¡The part that receives heat and pressure is not only hardened but also distorted. If the distortion parts 15 and 16 arise in the lower buffer sheet 13 and the upper buffer sheet 14, it will cause the further connection malfunction.
　本発明は上記の点に鑑みなされたものであり、表示パネルや部品実装基板などの板状部材の上の接着層にヒーターツールで実装部品を押し付ける部品圧着装置において、下緩衝シートと上緩衝シートを硬化や歪みのない状態で使い続けられるようにすることを目的とする。 The present invention has been made in view of the above points, and in a component crimping apparatus for pressing a mounting component with a heater tool onto an adhesive layer on a plate-like member such as a display panel or a component mounting substrate, a lower buffer sheet and an upper buffer sheet The purpose is to continue to use the product without hardening or distortion.
　本発明に係る部品圧着装置は、板状部材を受け止めるバックアップ台と、前記板状部材と前記バックアップ台との間に介在する下緩衝シートと、前記板状部材上の接着層に実装部品を押し付けるヒーターツールと、前記実装部品と前記ヒーターツールとの間に介在する上緩衝シートを備え、前記下緩衝シートと前記上緩衝シートは繰り出しロールより繰り出されて前記バックアップ台及び前記ヒーターツールの箇所に至り、その後巻き取りロールに巻き取られるものであり、前記下緩衝シートと前記上緩衝シートの繰り出し及び巻き取りは、前記ヒーターツールが前記実装部品を前記接着層に押し付ける工程以外のタイミングで実行されることを特徴としている。 A component crimping apparatus according to the present invention presses a mounted component against a backup base for receiving a plate-shaped member, a lower buffer sheet interposed between the plate-shaped member and the backup base, and an adhesive layer on the plate-shaped member. A heater tool, and an upper cushioning sheet interposed between the mounting component and the heater tool, wherein the lower cushioning sheet and the upper cushioning sheet are fed from a feeding roll to reach the backup table and the heater tool. Then, the sheet is wound on a winding roll, and the lower buffer sheet and the upper buffer sheet are fed out and wound at a timing other than the step in which the heater tool presses the mounting component against the adhesive layer. It is characterized by that.
　上記構成の部品圧着装置において、前記下緩衝シートと前記上緩衝シートの繰り出し及び巻き取りは、互いに独立して行われることが好ましい。 In the component crimping apparatus having the above-described configuration, it is preferable that the lower buffer sheet and the upper buffer sheet are fed out and wound up independently of each other.
　上記構成の部品圧着装置において、前記下緩衝シートは複数種類の下緩衝シートを上下に重ねて用いるものであることが好ましい。 In the component crimping apparatus having the above-described configuration, it is preferable that the lower buffer sheet is a stack of a plurality of types of lower buffer sheets.
　上記構成の部品圧着装置において、前記複数種類の下緩衝シートは、同一の前記繰り出しロールより重ね合わせ状態で繰り出され、同一の前記巻き取りロールに重ね合わせ状態で巻き取られることが好ましい。 In the component crimping apparatus having the above-described configuration, it is preferable that the plurality of types of lower buffer sheets are fed out in an overlapped state from the same feeding roll and wound up in the overlapping state on the same winding roll.
　上記構成の部品圧着装置において、前記複数種類の下緩衝シートは、種類別の前記繰り出しロールより別々に繰り出され、種類別の前記巻き取りロールに別々に巻き取られることが好ましい。 In the component crimping apparatus having the above-described configuration, it is preferable that the plurality of types of lower buffer sheets are separately fed out from the feeding rolls according to type and wound up around the winding rolls according to type.
　上記構成の部品圧着装置において、前記複数種類の下緩衝シートは、繰り出し及び巻き取り時には互いに分離され、互いに独立した繰り出し及び巻き取り設定で繰り出し及び巻き取りがなされることが好ましい。 In the component crimping apparatus having the above-described configuration, it is preferable that the plurality of types of lower buffer sheets are separated from each other at the time of feeding and winding, and are fed and wound by feeding and winding settings independent of each other.
　上記構成の部品圧着装置において、前記複数種類の下緩衝シートのうち、最上層に配置されるものにはそれよりも下に配置されるものに比べ硬度が高く薄い材料が選択されることが好ましい。 In the component crimping device having the above-described configuration, it is preferable that a material having a higher hardness and a lower thickness than those disposed below the plurality of types of lower buffer sheets is selected as the material disposed in the uppermost layer. .
　上記構成の部品圧着装置において、前記板状部材が表示パネルであることが好ましい。 In the component crimping apparatus having the above configuration, the plate-like member is preferably a display panel.
　上記構成の部品圧着装置において、前記板状部材が部品実装基板であることが好ましい。 In the component crimping apparatus configured as described above, it is preferable that the plate-like member is a component mounting board.
　本発明によると、下緩衝シートまたは上緩衝シートに顕著な硬化や歪みが現れる前に、硬化や歪みのないシートの新しい部位を用いることができるから、接続不具合を発生させることなく多数回の熱圧着作業を遂行することができる。 According to the present invention, a new part of the sheet without curing or distortion can be used before significant curing or distortion appears in the lower cushioning sheet or the upper cushioning sheet. Crimping work can be performed.
第１実施形態に係る部品圧着装置の概略構成図である。1 is a schematic configuration diagram of a component crimping apparatus according to a first embodiment. 第１実施形態の部品圧着装置を図１とは直角の方向から見た概略構成図である。It is the schematic block diagram which looked at the component crimping apparatus of 1st Embodiment from the direction orthogonal to FIG. 第１実施形態の部品圧着装置による実装部品の熱圧着接続工程の第１の説明図である。It is 1st explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment. 第１実施形態の部品圧着装置による実装部品の熱圧着接続工程の第２の説明図である。It is the 2nd explanatory view of the thermocompression bonding connection process of the mounting parts by the component crimping apparatus of a 1st embodiment. 第１実施形態の部品圧着装置による実装部品の熱圧着接続工程の第３の説明図である。It is a 3rd explanatory drawing of the thermocompression bonding connection process of the mounting components by the component crimping apparatus of 1st Embodiment. 第２実施形態に係る部品圧着装置の概略構成図である。It is a schematic block diagram of the component crimping | compression-bonding apparatus which concerns on 2nd Embodiment. 第２実施形態の部品圧着装置を図６とは直角の方向から見た概略構成図である。It is the schematic block diagram which looked at the component crimping | compression-bonding apparatus of 2nd Embodiment from the direction orthogonal to FIG. 第３実施形態に係る部品圧着装置の概略構成図である。It is a schematic block diagram of the component crimping | compression-bonding apparatus which concerns on 3rd Embodiment. 第３実施形態の部品圧着装置を図８とは直角の方向から見た概略構成図である。It is the schematic block diagram which looked at the component crimping apparatus of 3rd Embodiment from the direction orthogonal to FIG. 第４実施形態に係る部品圧着装置の概略構成図である。It is a schematic block diagram of the component crimping | compression-bonding apparatus which concerns on 4th Embodiment. 第４実施形態の部品圧着装置を図１０とは直角の方向から見た概略構成図である。It is the schematic block diagram which looked at the component crimping apparatus of 4th Embodiment from the direction orthogonal to FIG. 従来の部品圧着装置の一例を示す概略構成図である。It is a schematic block diagram which shows an example of the conventional component crimping | compression-bonding apparatus.
　以下、図１から図１１までの図面に基づき本発明に係る部品圧着装置の第１実施形態から第４実施形態までを説明する。いずれの実施形態においても、図１２に示した従来構造と機能的に共通する構成要素については図１２で用いた符号をそのまま付し、説明は省略するものとする。 Hereinafter, the first to fourth embodiments of the component crimping apparatus according to the present invention will be described with reference to FIGS. 1 to 11. In any of the embodiments, constituent elements that are functionally common with the conventional structure shown in FIG. 12 are denoted by the same reference numerals used in FIG. 12, and description thereof is omitted.
　図１から図５に第１実施形態を示す。第１実施形態に係る部品圧着装置１０の特徴は、下緩衝シート１３と上緩衝シート１４をそれぞれロール状に巻き、そのロールから必要な長さだけ下緩衝シート１３と上緩衝シート１４を繰り出し、用を終えた下緩衝シート１３と上緩衝シート１４は再びロール状に巻いて処分するようにした点にある。 1 to 5 show a first embodiment. The characteristic of the component crimping apparatus 10 according to the first embodiment is that the lower cushioning sheet 13 and the upper cushioning sheet 14 are respectively wound in a roll shape, and the lower cushioning sheet 13 and the upper cushioning sheet 14 are fed out from the rolls by a required length, The lower buffer sheet 13 and the upper buffer sheet 14 that have been used are wound in a roll again and disposed of.
　下緩衝シート１３は繰り出しロール２０から繰り出され、ガイドローラ２１を経てバックアップ台１１の上面に至り、バックアップ台１１の箇所を通過した後、ガイドローラ２２を経て巻き取りロール２３に巻き取られる。上緩衝シート１４は繰り出しロール２４から繰り出され、ガイドローラ２５を経てヒーターツール１２の下方に至り、ヒーターツール１２の箇所を通過した後、ガイドローラ２６を経て巻き取りロール２７に巻き取られる。 The lower buffer sheet 13 is fed out from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and is wound up on the take-up roll 23 through the guide roller 22. The upper buffer sheet 14 is fed out from the feed roll 24, reaches the lower side of the heater tool 12 through the guide roller 25, passes through the portion of the heater tool 12, and is taken up by the take-up roll 27 through the guide roller 26.
　巻き取りロール２３、２７には互いに独立した巻き取り回転機構（図示せず）が設けられる。このため下緩衝シート１３と上緩衝シート１４は、互いに独立して巻き取りを行うことが可能である。繰り出しロール２０、２４には下緩衝シート１３と上緩衝シート１４に適度の張力を与えるためのテンショナー（図示せず）が設けられている。テンショナーは繰り出しロール２０、２４ではなくガイドローラ２１、２５に設けられていてもよい。 The take-up rolls 23 and 27 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13 and the upper buffer sheet 14 can be wound up independently of each other. The feeding rolls 20 and 24 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13 and the upper buffer sheet 14. The tensioner may be provided on the guide rollers 21 and 25 instead of the feeding rolls 20 and 24.
　図１から図５を参照しつつ部品圧着装置１０による部品圧着作業について説明する。最初に、巻き取りロール２３を回転させて繰り出しロール２０から下緩衝シート１３を引き出し、まだ熱と圧力を受けたことのない箇所をバックアップ台１１の上に置く。また巻き取りロール２７を回転させて繰り出しロール２４から上緩衝シート１４を引き出し、まだ熱と圧力を受けたことのない箇所をヒーターツール１２の下に置く。 The component crimping operation by the component crimping apparatus 10 will be described with reference to FIGS. First, the take-up roll 23 is rotated to pull out the lower buffer sheet 13 from the feed roll 20, and a place that has not yet been subjected to heat and pressure is placed on the backup table 11. Further, the take-up roll 27 is rotated to pull out the upper buffer sheet 14 from the feed roll 24, and a portion that has not been subjected to heat and pressure is placed under the heater tool 12.
　続いて板状部材を下緩衝シート１３の上に置く。図１から図５で板状部材として示されているのは液晶表示パネル１のＴＦＴガラス基板２、その中でも延設部２ａである。ＴＦＴガラス基板２の延設部２ａをバックアップ台１１とヒーターツール１２の間に挿入し、次いでそれを降下させて下緩衝シート１３の上に載置する。 Subsequently, the plate-like member is placed on the lower buffer sheet 13. 1 to 5 show the TFT glass substrate 2 of the liquid crystal display panel 1, and the extended portion 2 a among them, as a plate-like member. The extended portion 2 a of the TFT glass substrate 2 is inserted between the backup table 11 and the heater tool 12, and then it is lowered and placed on the lower buffer sheet 13.
　続いて上緩衝シート１４を下げ、ＴＦＴガラス基板２の上面のＡＣＦ層４に載置されている実装部品５に当てる。その後ヒーターツール１２を降下させ、上緩衝シート１４を介して部品５に熱と圧力を加える。これにより実装部品５はＡＣＦ層４を介してＴＦＴガラス基板２に物理的に接続され、また実装部品５の図示しない電極端子とＴＦＴガラス基板２の図示しない電極端子がＡＣＦ層４を介して電気的に接続される。その後ヒーターツール１２と上緩衝シート１４を上昇させてバックアップ台１１及び下緩衝シート１３との間隔を開き、実装部品５の熱圧着接続が完了した液晶表示パネル１を引き出し、代わりに新しい液晶表示パネル１をセットする。 Subsequently, the upper buffer sheet 14 is lowered and applied to the mounting component 5 placed on the ACF layer 4 on the upper surface of the TFT glass substrate 2. Thereafter, the heater tool 12 is lowered, and heat and pressure are applied to the component 5 through the upper buffer sheet 14. As a result, the mounting component 5 is physically connected to the TFT glass substrate 2 via the ACF layer 4, and an electrode terminal (not shown) of the mounting component 5 and an electrode terminal (not shown) of the TFT glass substrate 2 are electrically connected via the ACF layer 4. Connected. Thereafter, the heater tool 12 and the upper buffer sheet 14 are raised to open the space between the backup table 11 and the lower buffer sheet 13, and the liquid crystal display panel 1 in which the thermocompression bonding of the mounting component 5 is completed is pulled out. Set 1
　実装部品５の熱圧着が繰り返されると、下緩衝シート１３と上緩衝シート１４の中で熱と圧力が加わる箇所が次第に硬化する。図４に示すように歪み１５、１６も発生する。そこで、適切なタイミングで下緩衝シート１３と上緩衝シート１４の巻き取りを行い、図５に示すように歪み１５、１６の箇所をバックアップ台１１とヒーターツール１２からずらす。これにより、再び下緩衝シート１３の中でまだ熱と圧力を受けていない箇所がバックアップ台１１の上に置かれ、上緩衝シート１４の中でまだ熱と圧力を受けたことのない箇所がヒーターツール１２の下に置かれることになる。「適切なタイミング」は、ヒーターツール１２が実装部品５をＡＣＦ層４に押し付ける工程以外のタイミングとして設定される。 When the thermocompression bonding of the mounting component 5 is repeated, the portions to which heat and pressure are applied in the lower buffer sheet 13 and the upper buffer sheet 14 are gradually cured. As shown in FIG. 4, distortions 15 and 16 also occur. Therefore, the lower buffer sheet 13 and the upper buffer sheet 14 are wound at an appropriate timing, and the positions of the distortions 15 and 16 are shifted from the backup table 11 and the heater tool 12 as shown in FIG. As a result, a portion of the lower buffer sheet 13 that has not yet received heat and pressure is placed on the backup table 11, and a portion of the upper buffer sheet 14 that has not yet received heat and pressure has been heated. It will be placed under the tool 12. The “appropriate timing” is set as a timing other than the process in which the heater tool 12 presses the mounting component 5 against the ACF layer 4.
　下緩衝シート１３と上緩衝シート１４の巻き取りは、実装部品５の熱圧着が所定回数行われる度に実行されるように設定することもでき、実装部品５の熱圧着が１回行われる度に遂行されるように設定することもできる。１回の熱圧着でシートがどの程度硬化するか、またどの程度の歪みが発生するかを実験で確かめた上で上記設定を行うとよい。 The winding of the lower buffer sheet 13 and the upper buffer sheet 14 can be set so as to be performed every time the thermocompression bonding of the mounting component 5 is performed a predetermined number of times, and each time the thermocompression bonding of the mounting component 5 is performed once. It can also be set to be performed. The above settings may be made after confirming how much the sheet is cured by one thermocompression bonding and how much distortion occurs.
　歪み１５をバックアップ台１１からずらすのに必要な下緩衝シート１３の巻き取り量と、歪み１６をヒーターツール１２からずらすのに必要な上緩衝シート１４の巻き取り量は同一ではない。前述の通り、下緩衝シート１３と上緩衝シート１４には互いに独立した巻き取り回転機構が設けられるから、下緩衝シート１３と上緩衝シート１４のそれぞれに適した巻き取り量を設定することができる。巻き取り量だけでなく、巻き取りのタイミングも下緩衝シート１３と上緩衝シート１４で別々に設定することができる。 The amount of winding of the lower buffer sheet 13 required to shift the distortion 15 from the backup table 11 and the amount of winding of the upper buffer sheet 14 required to shift the distortion 16 from the heater tool 12 are not the same. As described above, the lower buffer sheet 13 and the upper buffer sheet 14 are provided with independent winding rotation mechanisms, so that a winding amount suitable for each of the lower buffer sheet 13 and the upper buffer sheet 14 can be set. . Not only the amount of winding but also the timing of winding can be set separately for the lower buffer sheet 13 and the upper buffer sheet 14.
　図６及び図７に第２実施形態を示す。第２実施形態が第１実施形態と異なるのは下緩衝シート１３の構成である。すなわち下緩衝シート１３は複数種類の下緩衝シートを上下に重ねたものである。図７には２種類の下緩衝シート１３Ａ、１３Ｂを重ねた例を示すが、３種類以上の下緩衝シートを重ねても良いことは言うまでもない。重ね合わせ状態の下緩衝シート１３Ａ、１３Ｂは同一の繰り出しロール２０より繰り出され、同一の巻き取りロール２３に巻き取られる。 6 and 7 show a second embodiment. The second embodiment is different from the first embodiment in the configuration of the lower buffer sheet 13. That is, the lower cushioning sheet 13 is obtained by stacking a plurality of types of lower cushioning sheets vertically. Although FIG. 7 shows an example in which two types of lower buffer sheets 13A and 13B are stacked, it goes without saying that three or more types of lower buffer sheets may be stacked. The lower buffer sheets 13 </ b> A and 13 </ b> B in an overlapped state are fed out from the same feed roll 20 and taken up on the same take-up roll 23.
　下緩衝シート１３Ａと下緩衝シート１３Ｂには物性（耐熱性、緩衝性）の異なる材料を用いる。最上層の下緩衝シート１３Ａには、それよりも下に配置される下緩衝シート１３Ｂに比べ硬度が高く薄い材料を選択する。このように物性の異なる材料を組み合わせて用いることにより、全体としての下緩衝シート１３の物性を精密に制御し、求められる物性に一層近づけることができる。なお、このように複数種類のシートを組み合わせるという考えを、上緩衝シート１４に応用してもよい。 The lower buffer sheet 13A and the lower buffer sheet 13B are made of materials having different physical properties (heat resistance and buffer properties). For the lower buffer sheet 13A of the uppermost layer, a material having a higher hardness and a lower thickness than the lower buffer sheet 13B disposed below the upper buffer sheet 13A is selected. By using a combination of materials having different physical properties in this way, it is possible to precisely control the physical properties of the lower cushion sheet 13 as a whole and bring it closer to the required physical properties. Note that the idea of combining a plurality of types of sheets as described above may be applied to the upper buffer sheet 14.
　図８及び図９に第３実施形態を示す。第３実施形態は、繰り出しロール２０に巻かれた下緩衝シート１３とは別の下緩衝シート２８が、バックアップ台１１の上面に固定されていることを特徴とする。下緩衝シート１３との相乗効果で最適な物性が得られるように、下緩衝シート２８の材料を選択する。下緩衝シート１３は、第１実施形態のような単層構造であってもよく、第２実施形態のような複層構造であってもよい。 8 and 9 show a third embodiment. The third embodiment is characterized in that a lower buffer sheet 28 different from the lower buffer sheet 13 wound around the feeding roll 20 is fixed to the upper surface of the backup table 11. The material of the lower buffer sheet 28 is selected so that optimum physical properties can be obtained by a synergistic effect with the lower buffer sheet 13. The lower buffer sheet 13 may have a single layer structure as in the first embodiment, or may have a multilayer structure as in the second embodiment.
　図１０及び図１１に第４実施形態を示す。第４実施形態は、第２実施形態と同様、複数種類の下緩衝シートを上下に重ねて用いるが、その複数種類の下緩衝シートは、種類別の繰り出しロールより別々に繰り出され、種類別の巻き取りロールに別々に巻き取られることを特徴としている。 10 and 11 show a fourth embodiment. As in the second embodiment, the fourth embodiment uses a plurality of types of lower shock-absorbing sheets stacked one above the other, but the plurality of types of lower shock-absorbing sheets are separately fed from the type-by-type feeding rolls. It is characterized by being wound up separately on a winding roll.
　図１０、１１には２種類の下緩衝シート１３Ａ、１３Ｂを用いる例が示されている。下緩衝シート１３Ａは繰り出しロール２０から繰り出され、ガイドローラ２１を経てバックアップ台１１の上面に至り、バックアップ台１１の箇所を通過した後、ガイドローラ２２を経て巻き取りロール２３に巻き取られる。下緩衝シート１３Ｂは繰り出しロール２９から繰り出され、ガイドローラ３０を経てバックアップ台１１の上面に至り、バックアップ台１１の箇所を通過した後、ガイドローラ３１を経て巻き取りロール３２に巻き取られる。 10 and 11 show examples using two types of lower buffer sheets 13A and 13B. The lower cushioning sheet 13A is fed from the feed roll 20, reaches the upper surface of the backup table 11 through the guide roller 21, passes through the location of the backup table 11, and then is wound on the take-up roll 23 through the guide roller 22. The lower buffer sheet 13B is fed out from the feed roll 29, reaches the upper surface of the backup table 11 through the guide roller 30, passes through the location of the backup table 11, and then is wound up on the take-up roll 32 through the guide roller 31.
　第２実施形態と同様、最上層となる下緩衝シート１３Ａには、それよりも下に配置される下緩衝シート１３Ｂに比べ硬度が高く薄い材料を選択する。 As in the second embodiment, the lower cushion sheet 13A that is the uppermost layer is selected from a material that is harder and thinner than the lower cushion sheet 13B that is disposed below it.
　巻き取りロール２３、３２には互いに独立した巻き取り回転機構（図示せず）が設けられる。このため下緩衝シート１３Ａと下緩衝シート１３Ｂは、互いに独立して巻き取りを行うことが可能である。繰り出しロール２０、２９には下緩衝シート１３Ａと下緩衝シート１３Ｂに適度の張力を与えるためのテンショナー（図示せず）が設けられている。テンショナーは繰り出しロール２０、２９ではなくガイドローラ２１、３０に設けられていてもよい。 The take-up rolls 23 and 32 are provided with take-up rotation mechanisms (not shown) that are independent of each other. For this reason, the lower buffer sheet 13A and the lower buffer sheet 13B can be wound up independently of each other. The feeding rolls 20 and 29 are provided with tensioners (not shown) for applying appropriate tension to the lower buffer sheet 13A and the lower buffer sheet 13B. The tensioner may be provided on the guide rollers 21 and 30 instead of the feeding rolls 20 and 29.
　下緩衝シート１３Ａに発生する歪みと、下緩衝シート１３Ｂに発生する歪みは、必ずしも同じ大きさになる訳ではなく、下緩衝シート１３Ａの歪みをバックアップ台１１からずらすのに必要な下緩衝シート１３Ａの巻き取り量と、下緩衝シート１３Ｂの歪みをバックアップ台１１からずらすのに必要な下緩衝シート１３Ｂの巻き取り量は同一でないことがある。また下緩衝シート１３Ａと下緩衝シート１３Ｂとでは硬化の度合が異なり、異なるタイミングで巻き取りを行わねばならないこともある。 The distortion generated in the lower buffer sheet 13A and the distortion generated in the lower buffer sheet 13B are not necessarily the same size, and the lower buffer sheet 13A necessary for shifting the distortion of the lower buffer sheet 13A from the backup table 11 And the amount of winding of the lower buffer sheet 13B necessary for shifting the distortion of the lower buffer sheet 13B from the backup table 11 may not be the same. Further, the lower buffer sheet 13A and the lower buffer sheet 13B have different degrees of curing, and it may be necessary to perform winding at different timings.
　下緩衝シート１３Ａと下緩衝シート１３Ｂに互いに独立した巻き取り回転機構が設けられていることがここで役立つ。繰り出し及び巻き取り時には下緩衝シート１３Ａと下緩衝シート１３Ｂを互いに分離し、下緩衝シート１３Ａと下緩衝シート１３Ｂが相互にこすれあわないように、また巻き取りを阻害し合わないようにし、互いに独立した繰り出し及び巻き取り設定で繰り出し及び巻き取りを行うことで、互いに異なる巻き取り量で巻き取る、また互いに異なるタイミングで巻き取るという要請に応えることができる。 It is useful here that the lower buffer sheet 13A and the lower buffer sheet 13B are provided with mutually independent winding and rotating mechanisms. The lower cushioning sheet 13A and the lower cushioning sheet 13B are separated from each other at the time of unwinding and winding, so that the lower cushioning sheet 13A and the lower cushioning sheet 13B do not rub against each other and do not interfere with the winding, and are independent of each other. By performing the feeding and winding with the set feeding and winding settings, it is possible to meet the request of winding at different winding amounts and winding at different timings.
　複数種類の緩衝シートを種類別の繰り出しロールより別々に繰り出し、種類別の巻き取りロールに別々に巻き取るという構成を上緩衝シート１４に応用することも可能である。 It is also possible to apply to the upper cushioning sheet 14 a configuration in which a plurality of types of buffer sheets are separately fed out from the different types of feeding rolls and wound up separately into the respective types of winding rolls.
　板状部材の例として液晶表示パネルを取り上げて説明したが、言うまでもなくそれに限定されるものではない。有機ＥＬ表示パネルや部品実装基板など、あらゆる板状部材に部品を圧着するのに本発明部品圧着装置を用いることができる。 Although the liquid crystal display panel has been described as an example of the plate member, it is needless to say that the present invention is not limited thereto. The component crimping device of the present invention can be used to crimp components to any plate-like member such as an organic EL display panel and a component mounting board.
　以上、本発明の実施形態につき説明したが、本発明の範囲はこれに限定されるものではなく、発明の主旨を逸脱しない範囲で種々の変更を加えて実施することができる。 The embodiment of the present invention has been described above, but the scope of the present invention is not limited to this, and various modifications can be made without departing from the spirit of the invention.
　本発明は液晶表示パネルに液晶駆動用のＩＣやフレキシブル配線基板などの実装部品を組み合わせて液晶モジュールを形成するのに用いる部品圧着装置に広く適用可能である。 The present invention is widely applicable to a component crimping apparatus used for forming a liquid crystal module by combining a liquid crystal display panel with mounting components such as an IC for driving a liquid crystal and a flexible wiring board.
　　　１　　液晶表示パネル
　　　２　　ＴＦＴガラス基板
　　　３　　ＣＦガラス基板
　　　４　　異方性導電接着層（ＡＣＦ層）
　　　５　　実装部品
　　　１０　部品圧着装置
　　　１１　バックアップ台
　　　１２　ヒーターツール
　　　１３、１３Ａ、１３Ｂ　下緩衝シート
　　　１４　上緩衝シート
　　　２０、２４、２９　繰り出しロール
　　　２３、２７、３２　巻き取りロール DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2 TFT glass substrate 3 CF glass substrate 4 Anisotropic conductive contact bonding layer (ACF layer)
5 Mounting Parts 10 Parts Crimping Device 11 Backup Stand 12 Heater Tool 13, 13A, 13B Lower Buffer Sheet 14 Upper Buffer Sheet 20, 24, 29 Feeding Roll 23, 27, 32 Winding Roll

Claims (9)

  1. 　部品圧着装置であって、以下の構成を備えるもの：
    　板状部材を受け止めるバックアップ台と、
    　前記板状部材と前記バックアップ台との間に介在する下緩衝シートと、
    　前記板状部材上の接着層に実装部品を押し付けるヒーターツールと、
    　前記実装部品と前記ヒーターツールとの間に介在する上緩衝シートを備え、
    　前記下緩衝シートと前記上緩衝シートは繰り出しロールより繰り出されて前記バックアップ台及び前記ヒーターツールの箇所に至り、その後巻き取りロールに巻き取られるものであり、
    　前記下緩衝シートと前記上緩衝シートの繰り出し及び巻き取りは、
    　前記ヒーターツールが前記実装部品を前記接着層に押し付ける工程以外のタイミングで実行される。     A component crimping apparatus having the following configuration:
    A backup stand for receiving plate-like members;
    A lower cushioning sheet interposed between the plate-like member and the backup table;
    A heater tool for pressing the mounting component against the adhesive layer on the plate-like member;
    An upper cushioning sheet interposed between the mounting component and the heater tool;
    The lower cushioning sheet and the upper cushioning sheet are drawn from a feeding roll to reach the backup stand and the heater tool, and are then wound on a winding roll,
    The feeding and winding of the lower buffer sheet and the upper buffer sheet are as follows:
    The heater tool is executed at a timing other than the step of pressing the mounted component against the adhesive layer.
  2. 　請求項１の部品圧着装置であって、以下の構成を備えるもの：
    　前記下緩衝シートと前記上緩衝シートの繰り出し及び巻き取りは、互いに独立して行われる。     The component crimping device according to claim 1, comprising the following configuration:
    The lower buffer sheet and the upper buffer sheet are fed out and wound up independently of each other.
  3. 　請求項１の部品圧着装置であって、以下の構成を備えるもの：
    　前記下緩衝シートは複数種類の下緩衝シートを上下に重ねて用いるものである。     The component crimping device according to claim 1, comprising the following configuration:
    The lower buffer sheet is a stack of a plurality of types of lower buffer sheets.
  4. 　請求項３の部品圧着装置であって、以下の構成を備えるもの：
    　前記複数種類の下緩衝シートは、同一の前記繰り出しロールより重ね合わせ状態で繰り出され、同一の前記巻き取りロールに重ね合わせ状態で巻き取られる。     The component crimping apparatus according to claim 3, comprising the following configuration:
    The plurality of types of lower buffer sheets are fed out in an overlapped state from the same feed-out roll and wound up in the overlapped state on the same take-up roll.
  5. 　請求項３の部品圧着装置であって、以下の構成を備えるもの：
    　前記複数種類の下緩衝シートは、種類別の前記繰り出しロールより別々に繰り出され、種類別の前記巻き取りロールに別々に巻き取られる。     The component crimping apparatus according to claim 3, comprising the following configuration:
    The plurality of types of lower shock-absorbing sheets are separately fed from the type-specific feeding rolls, and are separately wound on the type-specific winding rolls.
  6. 　請求項５の部品圧着装置であって、以下の構成を備えるもの：
    　前記複数種類の下緩衝シートは、繰り出し及び巻き取り時には互いに分離され、互いに独立した繰り出し及び巻き取り設定で繰り出し及び巻き取りがなされる。     The component crimping device according to claim 5, comprising the following configuration:
    The plurality of types of lower buffer sheets are separated from each other at the time of feeding and winding, and are fed and wound at a feeding and winding setting independent of each other.
  7. 　請求項３の部品圧着装置であって、以下の構成を備えるもの：
    　前記複数種類の下緩衝シートのうち、最上層に配置されるものにはそれよりも下に配置されるものに比べ硬度が高く薄い材料が選択される。     The component crimping apparatus according to claim 3, comprising the following configuration:
    Of the plurality of types of lower cushioning sheets, a material having a higher hardness and a lower thickness is selected as the material disposed in the uppermost layer as compared with the material disposed in the lowermost layer.
  8. 　請求項１から７のいずれかの部品圧着装置であって、以下の構成を備えるもの：
    　前記板状部材が表示パネルである。     The component crimping device according to any one of claims 1 to 7, comprising the following configuration:
    The plate member is a display panel.
  9. 　請求項１から７のいずれかの部品圧着装置であって、以下の構成を備えるもの：
    　前記板状部材が部品実装基板である。     The component crimping device according to any one of claims 1 to 7, comprising the following configuration:
    The plate member is a component mounting board.
PCT/JP2013/064846 2012-06-06 2013-05-29 Component press-bonding device WO2013183507A1 (en)

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EP3331001A4 (en) * 2015-08-28 2019-02-20 Hitachi Chemical Company, Ltd. Composition for buffer sheets, and buffer sheet
WO2019175934A1 (en) * 2018-03-12 2019-09-19 堺ディスプレイプロダクト株式会社 Thermocompression bonding device
US11201133B2 (en) * 2018-11-28 2021-12-14 Samsung Display Co., Ltd. Bonding apparatus and method
CN112218516A (en) * 2019-07-09 2021-01-12 芝浦机械电子装置株式会社 Mounting device
CN112218516B (en) * 2019-07-09 2021-08-20 芝浦机械电子装置株式会社 Mounting device

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