TW201701374A - Lamination device and lamination method - Google Patents

Abstract

In order to provide a lamination device and a lamination method by which a resin film can be made to completely follow irregularities on a substrate even if the irregularities on the substrate include pointed parts, this lamination device is provided with: a conveying means for conveying a temporarily laminated body comprising a substrate having irregularities, with a resin film made from a thermosetting resin in a B-stage state placed on the irregular surface of the substrate; a sealed space forming means for accommodating the conveyed temporarily laminated body; a negative pressure forming means for generating a negative pressure in a sealed space formed by the sealed space forming means; and a heating means for heating the temporarily laminated body from the substrate side thereof, in the sealed space in the negative pressure state, to soften the resin film. The sealed space in the negative pressure state is set to ambient pressure or is pressurized, and the resin film which has been softened in a non-contact state is caused to adhere along the irregularities of the substrate to form a final laminated body from the temporarily laminated body.

Description

疊層裝置及疊層方法Lamination device and lamination method

本發明係關於在電子電路板及半導體裝置的製造中，將樹脂膜疊層於有凹凸的基材之裝置。更詳細而言，係關於服貼於基材之樹脂膜的膜厚均勻性高並抑制疊層後之小氣泡(微孔隙，microvoid)的產生，同時即使在基材之凹凸使用導線也不會使樹脂膜破裂、或產生導線彎折之疊層裝置及疊層方法。The present invention relates to an apparatus for laminating a resin film on a substrate having irregularities in the manufacture of an electronic circuit board and a semiconductor device. More specifically, the film thickness of the resin film applied to the substrate is high and the generation of small bubbles (microvoids) after lamination is suppressed, and the wire is not used even in the unevenness of the substrate. A laminating apparatus and a lamination method for rupturing a resin film or causing a wire to be bent.

近年，隨著電子設備的小型化、高性能化，電子電路板之高密度化、多層化也在進行。在如此的電子電路板之多層化中，尋求：將樹脂膜疊層到有凹凸的基材而得的疊層體之表面係為平滑。作為對應如此要求之疊層裝置，本案申請人已提出：首先，利用加壓疊層構件來形成樹脂膜與基材一體化而成的暫時疊層體，然後以非接觸狀態將此暫時疊層體利用加壓疊層構件而形成正式疊層體之疊層裝置(參照專利文獻1)。根據此裝置，在以非接觸狀態加壓之前，預先以接觸狀態實施按壓加壓將樹脂膜暫時固定在基材的凸部，故不會因加熱等使樹脂膜翹曲、變形並可使基材與樹脂膜以沿基材之凹凸以厚度為均勻的狀態完全地密合。 [先前技術文獻] [專利文獻]In recent years, with the miniaturization and high performance of electronic devices, high density and multi-layering of electronic circuit boards are also progressing. In the multilayering of such an electronic circuit board, it has been sought to form a surface of a laminate obtained by laminating a resin film on a substrate having irregularities. As a lamination device corresponding to such a request, the applicant has proposed that a temporary laminate in which a resin film and a substrate are integrated is formed by a pressure lamination member, and then this temporary lamination is performed in a non-contact state. A laminate device in which a laminated body is formed by a press laminate member (see Patent Document 1). According to this device, the resin film is temporarily fixed to the convex portion of the base material by pressing and pressing in a contact state before being pressurized in a non-contact state. Therefore, the resin film is not warped or deformed by heating or the like, and the base can be made. The material and the resin film are completely adhered in a state in which the thickness of the substrate is uniform along the unevenness of the substrate. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利第5334135號公報[Patent Document 1] Japanese Patent No. 5334135

[發明所欲解決之課題] 但是，上述裝置為了防止因加熱等導致樹脂膜的翹曲、或變形，於非接觸疊層前，預先以接觸狀態將樹脂膜加壓層合於基材。因此，就基材之凹凸為不具尖銳部位者，例如，基材之凹凸係因覆晶安裝(flip chip mounting)而形成者而言，發揮了可用精確的等級使樹脂膜之膜厚保持均勻直接服貼於基材之優良的效果。但是，對於基材之凹凸為具有尖銳部位者，例如，基材之凹凸係因打線接合(wire bonding)而形成者，於接觸狀態加壓層合時，有可能發生膜受推壓於基材之尖銳部分而破裂，或因推壓導致打線接合所用的導線崩塌等問題，有改良的餘地。[Problems to be Solved by the Invention] However, in order to prevent warpage or deformation of the resin film due to heating or the like, the above-described apparatus pressurizes the resin film to the substrate in a contact state before the non-contact lamination. Therefore, if the unevenness of the substrate is not sharp, for example, if the unevenness of the substrate is formed by a flip chip mounting, the film thickness of the resin film can be kept uniform and can be directly and directly maintained. Excellent effect on the substrate. However, if the unevenness of the substrate is sharp, for example, the unevenness of the substrate is formed by wire bonding, and when the film is pressed and laminated in a contact state, the film may be pressed against the substrate. There is room for improvement in the case where the sharp portion is broken or the wire used for wire bonding is collapsed due to pressing.

本發明係鑑於如此的情事，目的為提供：即使對於具有尖銳部分作為基材之凹凸者，例如，利用打線接合而安裝有半導體元件之基材，可使導線不崩塌而將樹脂膜完全地服貼於基材之凹凸，仍可將服貼後之樹脂膜的膜厚以更精確的等級均勻化之疊層裝置及疊層方法。 [解決課題之手段]The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a substrate in which a semiconductor element is mounted by wire bonding, for example, by a wire having a sharp portion as a base material, so that the wire can be completely collapsed without causing the wire to collapse. A lamination device and a lamination method in which the film thickness of the resin film after the application is uniformized at a more precise level can be applied to the unevenness of the substrate. [Means for solving the problem]

為了達成上述目的，本發明之第1要旨為一種疊層裝置，具備以下構件：搬運構件，搬運在有凹凸的基材之該凹凸面上承載了由B階狀態之熱硬化性樹脂構成的樹脂膜之暫時疊層體；密閉空間形成構件，容納被搬運的暫時疊層體；負壓形成構件，將上述密閉空間形成構件所形成的密閉空間調為負壓；加熱構件，於上述負壓狀態之該密閉空間中將暫時疊層體從基材側加熱並將樹脂膜軟化；及下述構件中之至少一種：加壓構件，將上述負壓狀態之密閉空間加壓而以非接觸狀態使上述經軟化之樹脂膜沿基材之凹凸密合，從上述暫時疊層體形成正式疊層體；及常壓構件，將上述負壓狀態之密閉空間的負壓狀態解除而以非接觸狀態使上述經軟化之樹脂膜沿基材之凹凸密合，從上述暫時疊層體形成正式疊層體。In order to achieve the above object, a first aspect of the present invention provides a laminating apparatus comprising: a conveying member that carries a resin composed of a thermosetting resin in a B-stage state on the uneven surface of a substrate having irregularities; a temporary laminate of a film; a sealed space forming member that accommodates the temporarily stacked body to be conveyed; a negative pressure forming member that adjusts a sealed space formed by the sealed space forming member to a negative pressure; and a heating member in the negative pressure state In the sealed space, the temporary laminate is heated from the substrate side and the resin film is softened; and at least one of the following members is a pressurizing member that pressurizes the sealed space in the negative pressure state to be in a non-contact state. The softened resin film is adhered to the concave and convex portions of the base material to form a main laminate from the temporary laminate; and the normal pressure member releases the negative pressure state of the sealed space in the negative pressure state in a non-contact state. The softened resin film is adhered to the unevenness of the substrate, and a continuous laminate is formed from the temporary laminate.

又，第2要旨為一種疊層方法，具備以下步驟：將在有凹凸的基材之該凹凸面上承載了由B階狀態之熱硬化性樹脂構成的樹脂膜之暫時疊層體容納於密閉空間；將上述密閉空間調為負壓後將暫時疊層體從基材側加熱使樹脂膜軟化，以樹脂膜與基材之凹凸面之間為負壓的狀態，而使樹脂膜服貼於基材之凹凸面上；及下述步驟中之至少一種：在上述樹脂膜服貼於基材之凹凸面後將上述密閉空間之負壓解除；及在上述樹脂膜服貼於基材之凹凸面後將上述密閉空間加壓，並以非接觸狀態從暫時疊層體形成正式疊層體。In addition, the second method is a lamination method in which a temporary laminate in which a resin film made of a thermosetting resin in a B-stage state is placed on the uneven surface of a substrate having irregularities is sealed in a sealed state. When the sealed space is adjusted to a negative pressure, the temporary laminate is heated from the substrate side to soften the resin film, and the resin film is placed under a negative pressure between the resin film and the uneven surface of the substrate, and the resin film is applied to the space. At least one of the following steps: after the resin film is applied to the uneven surface of the substrate, the negative pressure of the sealed space is released; and the resin film is applied to the substrate After the surface, the sealed space is pressurized, and the main laminate is formed from the temporary laminate in a non-contact state.

亦即，本發明人們將下述作為課題：即使對於利用打線接合而安裝有半導體元件之基材仍使樹脂膜完全地服貼於該凹凸、及將服貼後之樹脂膜的膜厚以更精確的等級均勻化等，並為了本案申請人先前提出的裝置之改良，進行了一系列的研究。在其過程發現，前述疊層裝置中會發生樹脂膜破裂、導線崩塌等之問題係因如先前所述，在以非接觸疊層前，預先使可撓性片材等膨脹而按壓於樹脂膜，所謂以接觸狀態將樹脂膜暫時固定於基材之情事。於是，對於是否可不實施如此的接觸疊層方法而從最初即以非接觸將樹脂膜疊層於基材之事進行了反覆的研究。其結果發現：選擇熱硬化性樹脂作為樹脂膜，並將其設定在B階狀態製得僅重疊於基材之暫時疊層體，再將此暫時疊層體放入密閉空間內，並將此密閉空間調為負壓後將暫時疊層體從基材側加熱而使樹脂膜軟化，再於該狀態解除此密閉空間之負壓的話，即使不實施接觸層合形成暫時疊層體，也可形成樹脂膜不翹曲、變形而使樹脂膜之厚度為均勻的狀態服貼於基材之凹凸的正式疊層體，乃至完成本發明。 [發明之效果]In other words, the present inventors have made a problem that the resin film is completely adhered to the unevenness and the film thickness of the resin film after the application is further applied to the substrate on which the semiconductor element is mounted by wire bonding. A precise level equalization, etc., and a series of studies were carried out for the improvement of the device previously proposed by the applicant. In the process of the present invention, it has been found that a problem of resin film cracking, wire collapse, and the like occurs in the above-described laminating apparatus. As described above, the flexible sheet or the like is previously inflated and pressed against the resin film before being laminated in a non-contact manner. The case where the resin film is temporarily fixed to the substrate in a contact state. Then, whether or not the resin film is laminated on the substrate in a non-contact manner from the beginning, whether or not such a contact lamination method can be carried out, has been repeatedly studied. As a result, it was found that a thermosetting resin was selected as the resin film, and this was set in the B-stage state to obtain a temporary laminate which was only superposed on the substrate, and the temporary laminate was placed in a sealed space. When the sealed space is adjusted to a negative pressure, the temporary laminate is heated from the substrate side to soften the resin film, and when the negative pressure in the sealed space is released in this state, the temporary laminate can be formed without contact lamination. The present invention has been completed by forming a formal laminate in which the resin film is not warped or deformed and the thickness of the resin film is uniform, and is applied to the unevenness of the substrate. [Effects of the Invention]

因此，根據本發明之疊層裝置，在暫時疊層體形成時，不將樹脂膜對於基材進行按壓而僅為承載，故可達成裝置之簡化。此外，由於不需按壓，故即使對於基材之凹凸為具有尖銳部位者，例如，具有打線接合者，仍可不發生樹脂膜破裂、導線崩塌等之問題而疊層樹脂膜。而且，由於以非接觸將樹脂膜疊層於基材之凹凸，故疊層後之樹脂膜的膜厚不會因按壓之推壓力差所致產生不均勻的膜厚，可用更精確的等級均勻製作，且可製造光學上顏色不均勻少的優良光半導體裝置。Therefore, according to the laminating apparatus of the present invention, when the temporary laminate is formed, the resin film is not pressed against the substrate, and only the load is carried, so that the simplification of the apparatus can be achieved. Further, since it is not necessary to press, even if the unevenness of the base material has a sharp portion, for example, a wire bonder can be laminated, and the resin film can be laminated without causing problems such as cracking of the resin film or collapse of the wire. Further, since the resin film is laminated on the unevenness of the substrate in a non-contact manner, the film thickness of the laminated resin film does not cause uneven film thickness due to the pressing pressure difference of the pressing, and can be uniformly graded with a more precise level. It is produced and can produce an excellent optical semiconductor device with less optical unevenness.

又，於負壓狀態之該密閉空間中將暫時疊層體從基材側加熱並將樹脂膜軟化之加熱構件係對於上述搬運構件上的暫時疊層體，將熱源介隔搬運構件而抵接於基材的話，使熱源抵接於基材可均勻地將熱傳導到樹脂膜，故更可防止因施加不均勻的熱而造成樹脂膜波浪、反翹等。In the sealed space in the negative pressure state, the heating member that heats the temporary laminate from the substrate side and softens the resin film is placed on the temporary laminate on the transport member, and the heat source is placed in contact with the transport member. In the case of the substrate, the heat source is caused to abut the substrate to uniformly conduct heat to the resin film, so that it is possible to prevent the resin film from being waved, warped, or the like due to the application of uneven heat.

此外，根據本發明之疊層方法，即使對於利用打線接合而安裝有半導體元件之基材，也可不使用複雜的裝置而迅速地以樹脂膜不破損地、或導線不崩塌地將樹脂膜完全地服貼於基材之凹凸，且可將服貼後之樹脂膜的膜厚以更精確的等級均勻化。Further, according to the lamination method of the present invention, even in the case of a substrate on which a semiconductor element is mounted by wire bonding, the resin film can be completely removed without causing damage to the resin film or by collapse of the wire without using a complicated device. The film is applied to the unevenness of the substrate, and the film thickness of the resin film after the application can be made uniform at a more precise level.

另外，本發明中「暫時疊層體」係指：在有凹凸的基材之凹凸面上僅為承載地承載了由B階狀態之熱硬化性樹脂構成的樹脂膜且尚未密合服貼的狀態之疊層體。然後，樹脂膜為B階狀態，係指在熱硬化性樹脂中，位於硬化反應之中間階段者。In the present invention, the term "temporary laminate" means that the resin film composed of the thermosetting resin of the B-stage state is carried only on the uneven surface of the substrate having irregularities and is not yet closely adhered. A laminate of states. Then, the resin film is in the B-stage state, and it means that it is in the intermediate stage of the hardening reaction in the thermosetting resin.

又，本發明中「以『非接觸狀態』將樹脂膜加壓」係指，「以『可撓性片材等之有形物體不接觸的狀態』加壓於樹脂膜」一事。In the present invention, "pressing the resin film in a "non-contact state" means "pressing the resin film in a state where the tangible object such as a flexible sheet is not in contact with the resin film".

然後，針對用來實施本發明之形態進行說明。惟，本發明並非受限於此實施形態。Next, the form for carrying out the invention will be described. However, the invention is not limited to the embodiment.

圖1表示本發明之疊層裝置之一種實施形態。此疊層裝置A具備：搬運部[A- 2]，將表背雙面中至少一面具有凹凸的基材1之凹凸面上承載由B階狀態之熱硬化性樹脂構成的樹脂膜2而成的暫時疊層體3[參照圖2(a)]裝載於搬運膜16而如圖示之由左側往右側的箭頭之方式間歇性地搬運；及本體部[A-1]，在其搬運過程中具有密閉空間之形成部5’，且在所形成的密閉空間5內(參照圖4)形成以不接觸樹脂膜2之非接觸狀態使該樹脂膜2服貼於基材之凹凸的正式疊層體4[圖2(b)]。另外，上述本體部[A-1]中，搬運膜16係臨時停止。且在圖1、圖2(a)、圖2(b)中，各部分係示意性地表示(以下之圖皆同)。Fig. 1 shows an embodiment of a laminating apparatus of the present invention. The laminating apparatus A includes a conveying unit [A-2], and a resin film 2 made of a thermosetting resin in a B-stage state, which is provided on the uneven surface of the base material 1 having at least one of the front and back sides. The temporary laminate 3 (see FIG. 2( a )) is placed on the conveyance film 16 and intermittently conveyed as shown by the arrow on the left side to the right side; and the body portion [A-1] is carried in the process. The formed portion 5' having a sealed space therein is formed in the sealed space 5 (see FIG. 4) to form a formal stack in which the resin film 2 is applied to the unevenness of the substrate without contacting the resin film 2 in a non-contact state. Layer 4 [Fig. 2(b)]. Further, in the main body portion [A-1], the conveyance film 16 is temporarily stopped. In Fig. 1, Fig. 2(a), and Fig. 2(b), each part is schematically shown (the same applies to the following figures).

更詳細地描述的話，上述本體部[A-1]係於圖3將其之部分放大圖概略顯示，具有：上部平板部11，具有上側真空框架8、連接口9及連接口10；下部平板部15(密閉空間形成構件)，具有可自由昇降之下側加熱板12、及具備可動框架13之下側真空框架14，且於上述連接口9、10，真空吸抽裝置(負壓形成構件)及空氣加壓裝置(加壓構件)(均未圖示)可切換地連接。上述上部平板部11係將金屬平板底面切削成凹狀者。下部平板部15也和上部平板部11同樣由金屬平板構成，四角狀的下側加熱板12(熱源、加熱構件)介隔未圖示之隔熱板而自由昇降地位於頂面之凹處內。下部平板部15係利用油壓缸體19而可自由昇降，如從圖1之狀態上昇並介隔上側真空框架8、可動框架13及下側真空框架14而和上部平板部11密合 (參照圖4)。以此方式形成以上部平板部11與下部平板部15分隔而成的密閉空間5。暫時疊層體3係於此密閉空間5內成為正式疊層體4。In more detail, the main body portion [A-1] is schematically shown in a partially enlarged view of Fig. 3, and has an upper flat plate portion 11 having an upper vacuum frame 8, a connection port 9 and a connection port 10; The portion 15 (closed space forming member) has a lower-side heating plate 12 and a vacuum frame 14 provided on the lower side of the movable frame 13, and at the above-mentioned connecting ports 9, 10, a vacuum suction device (negative pressure forming member) And an air pressurizing device (pressurizing member) (none of which is shown) is switchably connected. The upper flat plate portion 11 is formed by cutting the bottom surface of the metal flat plate into a concave shape. Similarly to the upper flat plate portion 11, the lower flat plate portion 15 is formed of a metal flat plate, and the rectangular lower heating plate 12 (heat source, heating member) is placed in the concave portion of the top surface so as to be freely movable up and down via a heat insulating plate (not shown). . The lower flat plate portion 15 is freely movable up and down by the hydraulic cylinder 19, and rises from the state of FIG. 1 and is in close contact with the upper flat plate portion 11 via the upper vacuum frame 8, the movable frame 13, and the lower vacuum frame 14 (refer to Figure 4). In this way, the sealed space 5 in which the upper flat portion 11 and the lower flat portion 15 are separated is formed. The temporary laminate 3 is the main laminate 4 in the sealed space 5 .

上述搬運部[A-2]，如圖1顯示其概略，具有：捲放單元17，捲繞有搬運膜16；捲繞單元18，用來捲繞搬運膜16，且跨越捲放單元17與捲繞單元18之間的搬運膜16係以通過上述本體部[A-1]之上部平板部11與下部平板部15之間的方式配置(搬運構件)。然後，由捲放單元17送出並以捲繞單元18捲繞之搬運膜16係利用夾輥(nip roll)20、上述捲放單元17及捲繞單元18控制，使其具有一定張力。而且，搬運膜16上所承載的暫時疊層體3係從紙面的左朝向右搬運，故可連續地實施運入本體部[A-1]內而形成正式疊層體4再從本體部[A-1]運出之一系列的步驟。As shown in FIG. 1, the transport unit [A-2] has a winding unit 17 in which a transport film 16 is wound, and a winding unit 18 for winding the transport film 16 and spanning the reel unit 17 and The conveyance film 16 between the winding units 18 is disposed so as to pass between the upper flat plate portion 11 and the lower flat plate portion 15 of the main body portion [A-1] (transport member). Then, the transport film 16 fed by the winding unit 17 and wound by the winding unit 18 is controlled by a nip roll 20, the above-described winding unit 17, and the winding unit 18 to have a certain tension. Further, since the temporary laminate 3 carried on the conveyance film 16 is conveyed from the left side to the right side of the paper surface, it can be continuously carried into the main body portion [A-1] to form the main laminate 4 and then from the main body portion [ A-1] Steps to ship a series.

另外，疊層裝置A設置有各別控制上述搬運構件、密閉空間形成構件、負壓形成構件、加熱構件、加壓構件之控制構件，該等控制可藉由操作操作面板23而實施。Further, the laminating apparatus A is provided with control members for individually controlling the conveying member, the sealed space forming member, the negative pressure forming member, the heating member, and the pressing member, and the control can be performed by operating the operation panel 23.

然後，針對運作進行說明。首先，作為有凹凸的基材，使用如圖2(a)所示在由具有絕緣性之基材與導體圖案構成的基材1上利用打線接合將發光元件21以預定間隔設置成為凸部，並在該凸部與凸部之間成為凹部者。然後，舉將此凹凸面承載了由B階狀態之熱硬化性樹脂構成的樹脂膜2而得之暫時疊層體3製成將樹脂膜2服貼於基材1之凹凸並密合之正式疊層體4[參照圖2(b)]時為例進行詳述。亦即，上述基材1係於該凸部具有打線接合所使用的導線22。Then, explain the operation. First, as the base material having irregularities, the light-emitting elements 21 are provided as convex portions at predetermined intervals by wire bonding on the base material 1 composed of the insulating base material and the conductor pattern as shown in Fig. 2(a). And it becomes a recess between the convex part and the convex part. Then, the temporary laminate 3 obtained by carrying the resin film 2 composed of the thermosetting resin in the B-stage state is formed into a form in which the resin film 2 is applied to the unevenness of the substrate 1 and is closely sealed. The laminate 4 [see FIG. 2(b)] will be described in detail as an example. That is, the base material 1 is such that the convex portion has the wire 22 used for wire bonding.

上述暫時疊層體3所使用之由B階狀態之熱硬化性樹脂構成的樹脂膜2，係於熱硬化性樹脂中處於硬化反應之中間階段者，除了可使用以B階品形式市售者，也可使用施加熱於A階狀態(未硬化)之樹脂而成之B階狀態者。作為判斷是否為B階狀態之樹脂膜的一種指標，可列舉是否其本身具有自我形狀保持性，且可輕易剝離保護樹脂膜之保護膜、支持樹脂膜之支持體膜。保護膜、支持體膜無法輕易剝離，或已剝離該等之狀態下無法保持預定形狀時，即可謂並非適當的B階狀態。The resin film 2 composed of the thermosetting resin in the B-stage state used in the temporary laminate 3 is in the intermediate stage of the hardening reaction in the thermosetting resin, and may be used in the form of a B-stage product. It is also possible to use a B-stage state in which a resin which is heated to the A-stage state (unhardened) is applied. As an index of the resin film for determining whether or not it is in the B-stage state, a protective film which protects the resin film and a support film which supports the resin film can be easily peeled off. When the protective film or the support film is not easily peeled off, or when the predetermined shape cannot be maintained in a state where the film is peeled off, it is not an appropriate B-stage state.

在本發明中，暫時疊層體3所使用的樹脂膜2為B階狀態係重要的要件之一，即使使用A階狀態之樹脂膜形成暫時疊層體也無法發揮所期望的效果。亦即，若為A階狀態之樹脂膜時，將暫時疊層體加熱的話，硬化反應會急速地進行，膜會翹曲、變形，故無法以均勻的厚度服貼於基材之凹凸。又，如之後的記載，考慮將樹脂膜2從支持體膜、或保護膜等剝離並單獨承載於基材1之必要性，樹脂膜2為適當的B階狀態亦為重要。In the present invention, the resin film 2 used in the temporary laminate 3 is one of the important requirements in the B-stage state, and the desired effect cannot be exhibited even if the temporary laminate is formed using the resin film of the A-stage. In other words, in the case of the resin film of the A-stage state, when the temporary laminate is heated, the curing reaction proceeds rapidly, and the film warps and deforms, so that the unevenness of the substrate cannot be applied with a uniform thickness. Further, as will be described later, it is also important to peel the resin film 2 from the support film or the protective film and to carry it on the substrate 1 alone, and it is also important that the resin film 2 is in an appropriate B-stage state.

此外，在本發明中，樹脂膜2以裸膜的狀態承載於基材1而形成暫時疊層體3係為重要的要件之一。亦即由於維持以具有保護膜、或支持體膜之狀態係柔軟性不足，且難以於非接觸狀態以服貼至基材1之凹凸的細部之狀態進行疊層。Further, in the present invention, the resin film 2 is carried on the substrate 1 in a bare state to form the temporary laminate 3, which is one of the important requirements. In other words, the state in which the protective film or the support film is provided is insufficient in flexibility, and it is difficult to adhere to the uneven portion of the substrate 1 in a non-contact state.

因此，在基材1上的預定位置僅承載已將保護膜、支持體膜等之保護材料全部剝離之由上述B階狀態之熱硬化性樹脂構成的樹脂膜2，而形成暫時疊層體3 [參照圖2(a)]。然後，將此暫時疊層體3裝載於如圖1所示之搬運膜16，沿圖中白色空心箭頭的方向搬運，運入上部平板部11與下部平板部15之間的密閉空間之形成部5’(參照圖3)。然後以該狀態將搬運膜16間歇停止。此時，上述暫時疊層體3之樹脂膜2僅為放置於基材1上之狀態，由於係B階狀態之硬化結束前的樹脂膜，可保持本身的形狀同時利用本身所具有的黏性而成為輕輕地附著於基材1之凸部(發光元件21)之狀態[參照圖2(a)]。Therefore, the resin film 2 composed of the thermosetting resin of the B-stage state in which the protective material such as the protective film or the support film is completely peeled off is placed at a predetermined position on the substrate 1 to form the temporary laminate 3 [Refer to Fig. 2(a)]. Then, the temporary laminate 3 is placed on the carrier film 16 as shown in FIG. 1, and conveyed in the direction of the white hollow arrow in the drawing, and carried into the formation portion of the sealed space between the upper flat plate portion 11 and the lower flat plate portion 15. 5' (refer to Figure 3). Then, the conveyance film 16 is intermittently stopped in this state. In this case, the resin film 2 of the temporary laminate 3 is placed only on the substrate 1, and the resin film before the end of the curing in the B-stage state can maintain its own shape while utilizing the viscosity itself. In the state of being gently attached to the convex portion (light-emitting element 21) of the substrate 1 (see FIG. 2(a)).

然後，從圖1之狀態驅動油壓缸體19使其上昇，並如圖4所示，使上部平板部11與下部平板部15介隔上側真空框架8、可動框架13、下側真空框架14而抵接，形成密閉空間5。此時，暫時疊層體3位於搬運膜16上，未接觸上部平板部11也未接觸下部平板部15。於此狀態下利用以可切換地連接於連接口9、10之真空吸抽裝置，將密閉空間5內的空氣吸抽而將密閉空間5調為負壓。Then, the hydraulic cylinder 19 is driven to rise from the state of FIG. 1, and the upper flat plate portion 11 and the lower flat plate portion 15 are separated from the upper vacuum frame 8, the movable frame 13, and the lower vacuum frame 14 as shown in FIG. And abutting, forming a confined space 5. At this time, the temporary laminate 3 is placed on the conveyance film 16 and does not contact the upper flat plate portion 11 or the lower flat plate portion 15. In this state, the air in the sealed space 5 is sucked by the vacuum suction device that is switchably connected to the connection ports 9, 10, and the sealed space 5 is adjusted to a negative pressure.

將密閉空間5調為負壓後，使下部平板部15之下側加熱板12上昇，如圖5所示，介隔搬運膜16而從基材1側將下側加熱板12抵接於暫時疊層體3。藉此來自於下側加熱板12的熱會經由搬運膜16及基材1而傳導至B階狀態之樹脂膜2，可用和緩且均勻的狀態加熱樹脂膜2。因此，暫時疊層體3之樹脂膜2會慢慢地軟化，不產生反翹、變形等而鬆鬆地服貼於基材1之凹凸。When the sealed space 5 is adjusted to a negative pressure, the lower heating plate 12 is raised below the lower flat plate portion 15, and as shown in FIG. 5, the lower heating plate 12 is brought into contact with the carrier 1 through the substrate 1 side. Laminate 3. Thereby, the heat from the lower heating plate 12 is conducted to the resin film 2 in the B-stage state via the conveyance film 16 and the substrate 1, and the resin film 2 can be heated in a gentle and uniform state. Therefore, the resin film 2 of the temporary laminate 3 is gradually softened, and is loosely applied to the unevenness of the substrate 1 without causing warping, deformation, or the like.

然後，維持於利用下側加熱板12持續加熱之狀態，驅動以可切換地連接於連接口9、10之空氣加壓裝置，將壓縮空氣送入密閉空間5內。這樣的話，鬆鬆地服貼於基材1之凹凸的樹脂膜2會不管基材1之凹凸而均勻地受到空氣強力的推壓，並如圖6所示，以完全服貼於基材1之凹凸的狀態密合。然後，藉由使利用上述持續加熱所為之樹脂膜2的硬化反應結束，可形成樹脂膜以完全沿著基材1之凹凸(由基材1及發光元件21構成的凹凸)的狀態固著之正式疊層體4。Then, while the lower heating plate 12 is continuously heated, the air pressurizing device that is switchably connected to the connection ports 9 and 10 is driven to feed the compressed air into the sealed space 5. In this case, the resin film 2 which is loosely applied to the unevenness of the substrate 1 is uniformly pressed by the air regardless of the unevenness of the substrate 1, and is completely applied to the substrate 1 as shown in FIG. The state of the concavities and convexities is close. By the end of the hardening reaction of the resin film 2 by the above-described continuous heating, the resin film can be formed to be completely adhered to the unevenness of the base material 1 (the unevenness of the base material 1 and the light-emitting element 21). Formal laminate 4.

形成正式疊層體4，即停止利用下側加熱板12所為之加熱及對密閉空間5之加壓，並使下部平板部15連同下側加熱板12下降，解開上側真空框架8與下側真空框架14之嚙合並解除密閉(參照圖7)。然後如圖1所示，藉由使載置正式疊層體4之搬運部[A-2]的搬運膜16從間歇停止狀態利用捲繞單元18進行捲繞，可將上述正式疊層體4從本體部A-1運出。Forming the main laminate 4, that is, heating by the lower heating plate 12 and pressurization of the sealed space 5 is stopped, and the lower flat plate portion 15 is lowered together with the lower heating plate 12, and the upper vacuum frame 8 and the lower side are unwound. The vacuum frame 14 is engaged and released from the airtightness (refer to Fig. 7). Then, as shown in FIG. 1, the carrier film 16 of the conveyance unit [A-2] on which the main laminated body 4 is placed is wound by the winding unit 18 from the intermittent stop state, whereby the above-mentioned main laminate 4 can be used. It is shipped from the body portion A-1.

如此根據此實施形態之疊層裝置A，即使省略前案裝置之暫時疊層體製作時的按壓步驟，仍可完全未接觸樹脂膜2而服貼於基材1之凹凸，故即使利用打線接合將發光元件21搭載於基材1，仍可不產生樹脂膜2破裂、導線崩塌等之問題而使樹脂膜高度地服貼於基材之凹凸。又，可使服貼於有凹凸的基材1之樹脂膜2的膜厚以更精確的等級成為均勻的厚度，故此疊層裝置A於普通的印刷基板之密封當然有效，在其以外的用途亦為有效，尤其在打線接合而成的LED基板、或PDP基板之密封係為有效。此外，不必製作如前案裝置之在基材1與樹脂膜2之間具有負壓的密閉空間之特殊的暫時疊層體，故可對應於各式各樣的基材及樹脂膜，同時可達成正式疊層體形成之迅速化。而且，由於不需要按壓步驟，也可實現裝置之簡單化及省空間化。According to the laminating apparatus A of the embodiment, even if the pressing step in the production of the temporary laminate of the front-end apparatus is omitted, the resin film 2 can be completely untouched and adhered to the unevenness of the substrate 1, so that even the bonding is performed by wire bonding. When the light-emitting element 21 is mounted on the substrate 1, the resin film can be highly adhered to the unevenness of the substrate without causing problems such as cracking of the resin film 2 or collapse of the wire. Further, since the film thickness of the resin film 2 applied to the substrate 1 having irregularities can be made uniform at a more precise level, it is of course effective to seal the laminate device A on a common printed substrate, and the use thereof is not limited. It is also effective, and it is effective especially in the LED board of a wire bonding or the sealing system of a PDP board. Further, it is not necessary to produce a special temporary laminate having a sealed space having a negative pressure between the substrate 1 and the resin film 2 as in the prior art device, and thus it is possible to correspond to various substrates and resin films, and at the same time, Achieving rapid formation of a formal laminate. Moreover, since the pressing step is not required, the simplification and space saving of the device can be achieved.

上述實施形態中，就搬運部[A-2]而言，使用搬運膜16、捲繞搬運膜16而成的捲放單元17及捲繞搬運膜16用的捲繞單元18實施暫時疊層體3或正式疊層體4之搬運，但亦可使用其他的構件實施。作為如此的構件可列舉例如：先將圖1之本體部[A-1]的下部平板部15設為可左右自由滑動，從圖1之狀態使下部平板部15滑動至左方，使用SCARA(Selective Compliance Assembly Robot Arm)機器人(未圖示)將暫時疊層體3直接設置於下部平板部15，再使其滑動回到預定位置。又，取出正式疊層體4時也同樣地亦可使下部平板部15滑動至圖1之右方，使用相同或不同的SCARA機器人(未圖示)直接取出。藉此即不需要設置搬運部[A-2]之空間，故可達到省空間化。又，不需要搬運膜16、或廢棄搬運膜16之費用，故也可實現成本削減。In the above-described embodiment, the transport unit [A-2] performs the temporary laminate using the transport unit 16 and the winding unit 17 for winding the transport film 16 and the winding unit 18 for winding the transport film 16. 3 or the transfer of the official laminate 4, but it can also be carried out using other members. As such a member, for example, the lower flat plate portion 15 of the main body portion [A-1] of Fig. 1 is slidable left and right, and the lower flat plate portion 15 is slid to the left from the state of Fig. 1, and SCARA (using SCARA) is used. Selective Compliance Assembly Robot Arm) The robot (not shown) directly sets the temporary laminate 3 to the lower flat plate portion 15 and slides it back to the predetermined position. Further, when the main laminate 4 is taken out, the lower flat portion 15 can be slid to the right in FIG. 1 and taken out directly using the same or different SCARA robot (not shown). This eliminates the need to provide space for the transport unit [A-2], so that space saving can be achieved. Moreover, since the cost of transporting the film 16 or discarding the transport film 16 is not required, cost reduction can be achieved.

而且，上述實施形態僅將連接口9、10設於上部平板部11，但也可於上下平板部各別設置連接口。又，也可設置多數的連接口，不需要以能切換地連接真空吸抽裝置、空氣加壓裝置而將其設置於各別的連接口亦可。Further, in the above embodiment, only the connection ports 9 and 10 are provided in the upper flat plate portion 11, but the connection ports may be provided in the upper and lower flat plate portions. Further, a plurality of connection ports may be provided, and it is not necessary to connect the vacuum suction device and the air press device to each of the connection ports.

就本發明所使用的有凹凸的基材1而言，特別適合使用在樹脂或陶瓷等之絕緣性基板上以預定間隔設置了發光元件(LED)之LED基板等基材之凹凸較大者。此外也可用於施加有銅等之圖案而成的印刷基板、或增層工法所使用的多疊層基板等之基材之凹凸較小者。因此，本發明之疊層裝置可有效地用於晶圓等級的半導體裝置之密封、有機基板上所搭載的半導體晶片表面的保護、LED元件的密封、太陽能電池的密封、半導體及LED、光器件、太陽能電池所使用的基板之阻劑層的形成等。In the base material 1 having irregularities used in the present invention, it is particularly preferable to use a base material such as an LED substrate in which a light-emitting element (LED) is provided at predetermined intervals on an insulating substrate such as a resin or ceramic. Further, it can be used for a printed circuit board to which a pattern such as copper or the like is applied, or a substrate having a multi-layered substrate used in a build-up method, and the like. Therefore, the lamination device of the present invention can be effectively used for sealing of wafer-level semiconductor devices, protection of semiconductor wafer surfaces mounted on organic substrates, sealing of LED elements, sealing of solar cells, semiconductors and LEDs, and optical devices. The formation of a resist layer of a substrate used for a solar cell, and the like.

又，就樹脂膜2而言，具有黏接性、或絕緣性、黏合性、熱熔性優良的性質之樹脂組成物較理想，例如適合為在熱硬化性樹脂中摻合安定劑、硬化劑、色素、潤滑劑等而成的樹脂膜(樹脂組成物)。具體而言可列舉：矽酮樹脂、聚醯亞胺樹脂、環氧樹脂、丙烯酸系樹脂等，以及於該等中添加各種無機質填充材而成的組成物等。作為上述無機質填充材除了可列舉二氧化矽、微粉末二氧化矽、氧化鋁、YAG等之螢光體、氧化鈦之外，亦可列舉熱傳導性填料、電氣傳導性優良的填充劑、碳黑等之著色劑等。Further, the resin film 2 is preferably a resin composition having properties of excellent adhesion, insulating properties, adhesive properties, and hot melt properties, and for example, it is suitable to blend a stabilizer and a hardener in a thermosetting resin. A resin film (resin composition) made of a pigment, a lubricant, or the like. Specific examples thereof include an anthrone resin, a polyimide resin, an epoxy resin, an acrylic resin, and the like, and a composition obtained by adding various inorganic fillers thereto. Examples of the inorganic filler include a phosphor such as cerium oxide, fine powder of cerium oxide, aluminum oxide, and YAG, and titanium oxide. Examples thereof include a thermally conductive filler, a filler having excellent electrical conductivity, and carbon black. Wait for the coloring agent, etc.

而且，利用負壓形成構件所形成的密閉空間5之負壓的程度宜為100~0Pa，為70~0Pa更佳。而且，密閉空間5的負壓狀態宜維持0.5~10分鐘，維持1~5分鐘更佳。Further, the degree of the negative pressure of the sealed space 5 formed by the negative pressure forming member is preferably 100 to 0 Pa, more preferably 70 to 0 Pa. Further, the negative pressure state of the sealed space 5 is preferably maintained for 0.5 to 10 minutes, and it is preferably maintained for 1 to 5 minutes.

又，作為在負壓的密閉空間5中將暫時疊層體3從基材1側加熱的加熱構件使用時之下側加熱板12的溫度宜為100~180℃，為120~150℃更佳。其原因為：溫度過高的話，會觀察到樹脂膜2對於基材1之凹凸服貼不足、發生樹脂膜2之破損(破裂)等的傾向，相反地，溫度過低亦會觀察到樹脂膜2對於基材1之凹凸服貼不足的傾向。Further, when the heating member for heating the temporary laminate 3 from the substrate 1 side in the sealed space 5 of the negative pressure is used, the temperature of the lower heating plate 12 is preferably 100 to 180 ° C, preferably 120 to 150 ° C. . The reason is that when the temperature is too high, the resin film 2 tends to be insufficiently applied to the unevenness of the substrate 1 and the resin film 2 is broken (broken). On the contrary, when the temperature is too low, a resin film is observed. 2 There is a tendency for the unevenness of the substrate 1 to be insufficient.

另外，在上述實施形態係於連接口9、10連接空氣加壓裝置，並對負壓之密閉空間5加壓，但依基材1之凹凸程度、或樹脂膜2之材料等，亦可於連接口9、10連接大氣導入管(常壓構件)等，不將密閉空間5加壓而是調為常壓，並以不接觸樹脂膜2之非接觸狀態，從暫時疊層體3形成正式疊層體4。 [實施例]Further, in the above-described embodiment, the air pressurizing device is connected to the connection ports 9 and 10, and the sealed space 5 of the negative pressure is pressurized. However, depending on the degree of unevenness of the substrate 1, or the material of the resin film 2, The connection ports 9 and 10 are connected to an air introduction pipe (normal pressure member), etc., and are not pressurized, but are placed in a normal pressure without being in contact with the resin film 2, and form a formal form from the temporary laminate 3 without contacting the resin film 2 in a non-contact state. Laminate 4. [Examples]

將本發明之疊層裝置所使用的實施例與比較例合併說明。惟，本發明並不限於此。The examples used in the laminating apparatus of the present invention will be described in conjunction with comparative examples. However, the invention is not limited thereto.

[實施例1] 利用圖1所示之疊層裝置A實施下述所示之基材(I)與樹脂膜α之疊層。亦即，將樹脂膜α從支持體膜剝離而與基材(I)疊合，形成由樹脂膜α與基材(I)構成的暫時疊層體3。將此暫時疊層體3載置於搬運部[A-2]之搬運膜16上並搬運至本體部[A-1]。在本體部[A-1]，係將暫時疊層體3容納於利用密閉空間形成構件所形成的密閉空間5內，然後，將容納有暫時疊層體3之密閉空間5利用以可自由切換地連接於連接口9、10之負壓形成構件(真空吸抽裝置)調為50Pa之負壓，將已加熱至140℃之下側加熱板12(熱源)從基材(I)側介隔搬運膜16而抵接於暫時疊層體3，並維持該狀態3分鐘。然後，使用以可自由切換地連接於連接口9、10之大氣導入管(常壓構件)將大氣壓之空氣導入密閉空間5內，並維持該狀態30秒鐘，獲得作為目的之正式疊層體4。 ＜基材(I)＞ 已利用打線接合在具有預定的導電圖案(高度50μm)之配設有正負電極的(陶瓷)基板上安裝了半導體發光元件(氮化鎵)之基材。 此基材係製成正方形的形狀，邊長為70mm且基板厚度為600μm，從基板表面到導電圖案上所安裝的半導體發光元件之頂部為止之厚度為200μm。上述半導體發光元件係以1cm間隔縱橫5列、合計25個的方式安裝於此基板上。 ＜樹脂膜α＞ B階狀態之市售品(樹脂厚度100μm)。[Example 1] A laminate of the substrate (I) and the resin film α shown below was carried out by using the lamination device A shown in Fig. 1 . That is, the resin film α is peeled off from the support film and superposed on the substrate (I) to form a temporary laminate 3 composed of the resin film α and the substrate (I). This temporary laminate 3 is placed on the conveyance film 16 of the conveyance unit [A-2] and conveyed to the main body portion [A-1]. In the main body portion [A-1], the temporary laminate 3 is housed in the sealed space 5 formed by the sealed space forming member, and then the sealed space 5 in which the temporary laminated body 3 is accommodated is used to be freely switchable. The negative pressure forming member (vacuum suction device) connected to the connection ports 9, 10 is adjusted to a negative pressure of 50 Pa, and the side heating plate 12 (heat source) heated to 140 ° C is separated from the substrate (I) side. The film 16 was transported to abut against the temporary laminate 3, and this state was maintained for 3 minutes. Then, air of atmospheric pressure is introduced into the sealed space 5 by an air introduction pipe (normal pressure member) that is detachably connected to the connection ports 9, 10, and the state is maintained for 30 seconds to obtain a formal laminate for the purpose. 4. <Substrate (I)> A substrate on which a semiconductor light-emitting element (gallium nitride) was mounted on a (ceramic) substrate provided with a positive and negative electrode having a predetermined conductive pattern (height 50 μm) was bonded by wire bonding. This substrate was formed into a square shape having a side length of 70 mm and a substrate thickness of 600 μm, and the thickness from the surface of the substrate to the top of the semiconductor light-emitting element mounted on the conductive pattern was 200 μm. The semiconductor light-emitting elements were mounted on the substrate so as to have a total of 25 vertical and horizontal lines at a distance of 1 cm. <Resin film α> A commercially available product in a B-stage state (resin thickness: 100 μm).

[實施例2~10] 將下側加熱板12之溫度(℃)、真空吸抽裝置之驅動時間(分鐘)如表1~2所示進行變更，除此之外與實施例1同樣地進行而獲得作為目的之正式疊層體4。[Examples 2 to 10] The temperature (°C) of the lower heating plate 12 and the driving time (minutes) of the vacuum suction device were changed as shown in Tables 1 and 2, except that the same procedure as in Example 1 was carried out. A formal laminate 4 is obtained for the purpose.

[實施例11] 使用空氣加壓裝置替換大氣導入管，並於密閉空間5內導入0.3MPa之壓縮空氣且維持該狀態30秒鐘，除此之外與實施例1同樣地進行而獲得作為目的之正式疊層體4。[Example 11] The object was obtained in the same manner as in Example 1 except that the air inlet pipe was replaced with an air pressurizing device, and compressed air of 0.3 MPa was introduced into the sealed space 5 and maintained in this state for 30 seconds. The formal laminate 4 is.

[比較例1] 將樹脂膜2變更為A階狀態之樹脂膜β(樹脂厚度50μm)，除此之外與實施例1同樣地進行而獲得作為目的之正式疊層體。另外，樹脂膜β係為A階狀態故黏性高，剝離支持體膜及保護膜非常困難。[Comparative Example 1] The intended laminate was obtained in the same manner as in Example 1 except that the resin film 2 was changed to the resin film β in the A-stage state (resin thickness: 50 μm). Further, since the resin film β is in the A-stage state, the viscosity is high, and it is very difficult to peel off the support film and the protective film.

[比較例2] 不剝離支持體膜，除此之外與實施例1同樣地進行而獲得作為目的之正式疊層體。另外，支持體膜係於正式疊層體形成後剝離。[Comparative Example 2] The intended main laminate was obtained in the same manner as in Example 1 except that the support film was not peeled off. Further, the support film is peeled off after the formation of the main laminate.

[比較例3] 將比較例1所使用的A階狀態之樹脂膜β連同支持體膜的方式接觸層合於基材(I)(使用預先加熱至140℃之層合裝置壓緊5秒鐘)，形成將該等一體化而成的暫時疊層體。然後，將此暫時疊層體容納於已調節至140℃之減壓加壓槽內，並於已將此減壓加壓槽內進行減壓(50Pa)之狀態保持2分鐘，形成上述暫時疊層體之基材(I)與樹脂膜β之間具有減壓環境氣體之密封空間(S)的暫時疊層體。形成暫時疊層體後，從減壓加壓槽之開口部將大氣導入減壓加壓槽內，並更導入0.3MPa之壓縮空氣於減壓加壓槽內，利用減壓加壓槽之密閉空間與暫時疊層體之密封空間(S)的氣壓差，完成基材(I)與樹脂膜β之密合狀態下的疊層，獲得作為目的之正式疊層體。亦即，比較例3之正式疊層體係與前案之疊層裝置所形成的相同。另外，支持體膜於暫時疊層體形成後剝離。[Comparative Example 3] The resin film β of the A-stage state used in Comparative Example 1 was contact-bonded to the substrate (I) in contact with the support film (using a laminating apparatus previously heated to 140 ° C for 5 seconds) ), forming a temporary laminate in which these are integrated. Then, the temporary laminate was placed in a reduced pressure pressurization tank adjusted to 140 ° C, and maintained in a reduced pressure (50 Pa) in the reduced pressure pressurization tank for 2 minutes to form the above-mentioned temporary stack. A temporary laminate of a sealed space (S) of a reduced-pressure ambient gas is provided between the substrate (I) and the resin film β of the layer. After the temporary laminate is formed, the atmosphere is introduced into the pressure reduction and pressure tank from the opening of the pressure reduction tank, and 0.3 MPa of compressed air is introduced into the pressure reduction tank, and sealed by a pressure reduction tank. The air pressure difference between the space and the sealed space (S) of the temporary laminate is completed by laminating the substrate (I) and the resin film β, and a target laminate is obtained. That is, the main lamination system of Comparative Example 3 was the same as that of the laminating apparatus of the foregoing. Further, the support film is peeled off after the temporary laminate is formed.

針對上述實施例1~11及比較例1~3所得到的正式疊層體，各別利用以下要領實施服貼性、導線崩塌之評價。所實施的評價結果如後述表1及2所示。With respect to the main laminates obtained in the above Examples 1 to 11 and Comparative Examples 1 to 3, the evaluation of the conformability and the wire collapse was carried out by the following methods. The evaluation results carried out are shown in Tables 1 and 2 below.

[服貼性] 以100倍顯微鏡目視確認樹脂膜對於有凹凸的基材之服貼性並進行如下評價。 ○…樹脂膜完全地填充於有凹凸的基材之凹部。 △…樹脂膜幾乎完全地填充於有凹凸的基材之凹部，但於有凹凸的基材之凹部(凹面)的一部分些微觀察到有氣泡。 ×…樹脂膜並未完全地填充於有凹凸的基材之凹部，且有凹凸的基材之凹部(凹面)有氣泡殘留。[Adhesiveness] The conformability of the resin film to the uneven substrate was visually observed with a 100-fold microscope and evaluated as follows. ○... The resin film is completely filled in the concave portion of the uneven substrate. Δ... The resin film was almost completely filled in the concave portion of the uneven substrate, but a small amount of bubbles were observed in a part of the concave portion (concave surface) of the uneven substrate. ×: The resin film is not completely filled in the concave portion of the uneven substrate, and the concave portion (concave surface) of the uneven substrate has air bubbles remaining.

[導線崩塌] 以目視進行觀察正式疊層體並進行如下評價。 ○…基材上安裝發光元件之導線完全未崩塌。 ×…基材上安裝發光元件之導線有過半崩塌。[Wire collapse] The formal laminate was visually observed and evaluated as follows. ○... The wires on which the light-emitting elements were mounted on the substrate did not collapse at all. ×... The wire on which the light-emitting element is mounted on the substrate has collapsed excessively.

【表1】 【Table 1】

【表2】 【Table 2】

於上述實施例中已表示有關本發明中的具體形態，但上述實施例僅為例示，並非作限定性解釋。對該技術領域中具有通常知識者而言顯而易見的各種變化皆意欲包括於本發明之範圍內。 [產業上利用性]The specific embodiments of the present invention have been shown in the above embodiments, but the above embodiments are merely illustrative and not limiting. Various changes that are obvious to those skilled in the art are intended to be included within the scope of the present invention. [Industrial use]

本發明之疊層裝置可利用作為在電子電路板及半導體裝置之製造中，將樹脂膜疊層於有凹凸的基材上，尤其是疊層於利用打線接合而安裝了半導體元件之基材上的裝置。The laminating apparatus of the present invention can be used for laminating a resin film on a substrate having irregularities in the manufacture of an electronic circuit board and a semiconductor device, in particular, on a substrate on which a semiconductor element is mounted by wire bonding. s installation.

A‧‧‧疊層裝置
A-1‧‧‧本體部
A-2‧‧‧搬運部
1‧‧‧基材
2‧‧‧樹脂膜
3‧‧‧暫時疊層體
4‧‧‧正式疊層體
5‧‧‧密閉空間
5’‧‧‧密閉空間之形成部
8‧‧‧上側真空框架
9‧‧‧連接口
10‧‧‧連接口
11‧‧‧上部平板部
12‧‧‧下側加熱板
13‧‧‧可動框架
14‧‧‧下側真空框架
15‧‧‧下部平板部
16‧‧‧搬運膜
17‧‧‧捲放單元
18‧‧‧捲繞單元
19‧‧‧油壓缸體
20‧‧‧夾輥
21‧‧‧發光元件
22‧‧‧導線
23‧‧‧操作面板A‧‧‧Multilayer
A-1‧‧‧ Body Department
A-2‧‧‧Transportation Department
1‧‧‧Substrate
2‧‧‧ resin film
3‧‧‧ Temporary laminate
4‧‧‧Formal laminate
5‧‧‧Confined space
5'‧‧‧The formation of confined spaces
8‧‧‧Upside vacuum frame
9‧‧‧Connecting port
10‧‧‧Connecting port
11‧‧‧Upper flat section
12‧‧‧Under heating plate
13‧‧‧ movable frame
14‧‧‧Under vacuum frame
15‧‧‧ Lower flat section
16‧‧‧Transport film
17‧‧‧Reel unit
18‧‧‧Winding unit
19‧‧‧Hydraulic cylinder
20‧‧‧Pinch roller
21‧‧‧Lighting elements
22‧‧‧Wire
23‧‧‧Operator panel

【圖1】係本發明之一種實施形態之概略結構圖。 【圖2】(a)係示意性地表示作為本發明對象之暫時疊層體的圖，(b)係示意性地表示本發明所形成之正式疊層體的圖。 【圖3】係本發明之一種實施形態之部分放大說明圖。 【圖4】係本發明之一種實施形態之部分放大說明圖。 【圖5】係本發明之一種實施形態之部分放大說明圖。 【圖6】係本發明之一種實施形態之部分放大說明圖。 【圖7】係本發明之一種實施形態之部分放大說明圖。Fig. 1 is a schematic block diagram showing an embodiment of the present invention. Fig. 2 (a) is a view schematically showing a temporary laminate which is the object of the present invention, and (b) is a view schematically showing a main laminate formed by the present invention. Fig. 3 is a partially enlarged explanatory view showing an embodiment of the present invention. Fig. 4 is a partially enlarged explanatory view showing an embodiment of the present invention. Fig. 5 is a partially enlarged explanatory view showing an embodiment of the present invention. Fig. 6 is a partially enlarged explanatory view showing an embodiment of the present invention. Fig. 7 is a partially enlarged explanatory view showing an embodiment of the present invention.

A‧‧‧疊層裝置 A‧‧‧Multilayer

A-1‧‧‧本體部 A-1‧‧‧ Body Department

A-2‧‧‧搬運部 A-2‧‧‧Transportation Department

3‧‧‧暫時疊層體 3‧‧‧ Temporary laminate

4‧‧‧正式疊層體 4‧‧‧Formal laminate

5’‧‧‧密閉空間之形成部 5’‧‧‧The formation of confined spaces

15‧‧‧下部平板部 15‧‧‧ Lower flat section

16‧‧‧搬運膜 16‧‧‧Transport film

17‧‧‧捲放單元 17‧‧‧Reel unit

18‧‧‧捲繞單元 18‧‧‧Winding unit

19‧‧‧油壓缸體 19‧‧‧Hydraulic cylinder

20‧‧‧夾輥 20‧‧‧Pinch roller

23‧‧‧操作面板 23‧‧‧Operator panel

Claims (3)

一種疊層裝置，其特徵為具備以下構件： 搬運構件，搬運在有凹凸的基材之該凹凸面上承載了由B階狀態之熱硬化性樹脂構成的樹脂膜之暫時疊層體； 密閉空間形成構件，容納被搬運的暫時疊層體； 負壓形成構件，將該密閉空間形成構件所形成的密閉空間調為負壓； 加熱構件，於負壓狀態之該密閉空間中將暫時疊層體從基材側加熱並將樹脂膜軟化；及 下述構件中之至少一種： 加壓構件，將負壓狀態之該密閉空間加壓而以非接觸狀態使經軟化之該樹脂膜沿基材之凹凸密合而，該暫時疊層體形成正式疊層體；及 常壓構件，將負壓狀態之該密閉空間的負壓狀態解除而以非接觸狀態使經軟化之該樹脂膜沿基材之凹凸密合，從該暫時疊層體形成正式疊層體。A laminating apparatus comprising: a transporting member that transports a temporary laminated body of a resin film made of a thermosetting resin in a B-stage state on the uneven surface of the base material having irregularities; Forming a member to accommodate the temporarily stacked body to be conveyed; a negative pressure forming member to adjust a sealed space formed by the sealed space forming member to a negative pressure; and heating the member to temporarily form the sealed body in the sealed space in a negative pressure state Heating from the substrate side and softening the resin film; and at least one of the following members: the pressing member pressurizing the sealed space in a negative pressure state to cause the softened resin film to be along the substrate in a non-contact state The temporary laminate forms a main laminate, and the normal pressure member releases the negative pressure state of the sealed space in a negative pressure state, and softens the resin film along the substrate in a non-contact state. The concave and convex is adhered to form a main laminate from the temporary laminate. 如申請專利範圍第1項之疊層裝置，其中，於負壓狀態之該密閉空間中將暫時疊層體從基材側加熱並將樹脂膜軟化之加熱構件，係對於該搬運構件上之暫時疊層體將熱源介隔搬運構件而抵接於基材。The laminating apparatus of claim 1, wherein the heating member that heats the temporary laminate from the substrate side and softens the resin film in the sealed space in a negative pressure state is temporarily attached to the conveying member The laminate contacts the substrate with a heat source interposed therebetween. 一種疊層方法，其特徵為具備以下步驟，並以非接觸狀態從暫時疊層體形成正式疊層體： 將在有凹凸的基材之該凹凸面上承載了由B階狀態之熱硬化性樹脂構成的樹脂膜之暫時疊層體容納於密閉空間； 將該密閉空間調為負壓後將暫時疊層體從基材側加熱使樹脂膜軟化，以樹脂膜與基材之凹凸面之間為負壓的狀態，而使樹脂膜服貼於基材之凹凸面上；及 下述步驟中之至少一種： 在該樹脂膜服貼於基材之凹凸面後將該密閉空間之負壓解除；及 在該樹脂膜服貼於基材之凹凸面後將該密閉空間加壓。A lamination method comprising the steps of: forming a formal laminate from a temporary laminate in a non-contact state: carrying a thermosetting property in a B-stage state on the uneven surface of the substrate having irregularities The temporary laminate of the resin film made of a resin is accommodated in a sealed space. After the sealed space is adjusted to a negative pressure, the temporary laminate is heated from the substrate side to soften the resin film, and between the resin film and the uneven surface of the substrate. a negative pressure state, the resin film is applied to the uneven surface of the substrate; and at least one of the following steps: releasing the negative pressure of the sealed space after the resin film is applied to the uneven surface of the substrate And pressing the sealed space after the resin film is applied to the uneven surface of the substrate.