WO2013171960A1 - 熱伝導性シート供給体及び熱伝導性シートの供給方法 - Google Patents
熱伝導性シート供給体及び熱伝導性シートの供給方法 Download PDFInfo
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- WO2013171960A1 WO2013171960A1 PCT/JP2013/002186 JP2013002186W WO2013171960A1 WO 2013171960 A1 WO2013171960 A1 WO 2013171960A1 JP 2013002186 W JP2013002186 W JP 2013002186W WO 2013171960 A1 WO2013171960 A1 WO 2013171960A1
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- conductive sheet
- heat conductive
- heat
- supply body
- carrier tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a heat conductive sheet supply body and a method for supplying a heat conductive sheet.
- LSI chips such as CPUs, driver ICs, and memories used in electronic devices such as personal computers, digital video disks, and mobile phones are becoming more and more themselves as performance, speed, size, and integration increase. Heat is generated, and the temperature rise of the chip due to the heat causes a malfunction and destruction of the chip. Therefore, many heat dissipating methods for suppressing the temperature rise of the chip during operation and heat dissipating members used therefor have been proposed.
- a heat sink using a metal plate having a high thermal conductivity such as aluminum or copper is used in order to suppress a temperature rise of a chip during operation.
- the heat sink conducts heat generated by the chip and releases the heat from the surface due to a temperature difference from the outside air.
- the heat sink In order to efficiently transfer the heat generated from the chip to the heat sink, the heat sink needs to be in close contact with the chip, but because there is a difference in the height of each chip and tolerance due to assembly processing, a flexible sheet or grease is used. It is interposed between the chip and the heat sink, and heat conduction from the chip to the heat sink is realized through this sheet or grease.
- a grease-like heat dissipation material can be thinned and is an excellent heat dissipation material, but it is difficult to manage.
- the application process may be performed manually by screen printing, extruded from a syringe, or automatically using a dispensing device, but it is very time consuming and not easy to handle. It may be.
- the thermal conductive sheet is only affixed at the time of mounting, no special equipment is required, and it is easier to handle and manage than grease, but the affixing work is mostly manual and very efficient. In some cases, the rate of the product assembly process is limited. Thus, the productivity can be dramatically improved by automatically mounting the thermally conductive sheet mounting process using a vacuum nozzle or the like, which is the mainstream in mounting semiconductor components.
- a thermal conductive sheet cut into a predetermined size is arranged on a substrate such as a PET film or a resin tray, and the vacuum nozzle is used one by one. There is a way to pick up the sheet.
- the heat conductive sheets are arranged in a flat shape, and it takes a lot of space, the vacuum nozzle sucks up the sheet, and the distance from the sheet to the mounting location is different one by one.
- the number of conductive sheets is large, the distance to the mounting location becomes long, and there is a problem that the risk of the sheet falling from the nozzle increases.
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a heat conductive sheet supply body using an embossed carrier tape and a method for supplying a heat conductive sheet.
- an embossed carrier tape having a plurality of pockets each containing a thermal conductive sheet on its surface, and a cover film for protecting the surface of the embossed carrier tape are in the form of a reel.
- a thermally conductive sheet supply body is provided which is wound around a sheet.
- Such a heat conductive sheet supply body can prepare many heat conductive sheets without spreading in a plane. Furthermore, since the heat conductive sheet can be taken up in a fixed position by feeding the tape little by little while peeling the cover film, the vacuum nozzle only needs to move in a constant manner, and the movement of the nozzle is simplified and the mounting process is improved. The risk of failure is reduced, and the automatic mounting process can be simplified and more efficient.
- the tack energy of at least one surface of the thermal conductive sheet is 70 ⁇ J or less.
- Such a heat conductive sheet can be sucked and supplied with a vacuum nozzle without adhering to the cover film or adhering to the bottom surface of the pocket of the embossed carrier tape.
- the heat conductive sheet is preferably a laminate of a reinforcing layer and a heat conductive resin layer.
- the thickness of the heat conductive sheet is preferably 60 ⁇ m or more and 600 ⁇ m or less.
- the stress between a heat generating member and a cooling member can be relieved, and it has further favorable sheet moldability.
- the thermal conductivity of the thermally conductive resin layer is preferably 1.0 W / mK or more, more preferably 3.0 W / mK or more.
- the thermal conductive sheet can be applied to a heat generating part having a large calorific value.
- the thermally conductive resin layer contains 300 parts by mass or more of a thermally conductive filler with respect to 100 parts by mass of the silicone resin.
- Such a heat conductive resin layer can sufficiently obtain the heat conductivity of the heat conductive resin layer.
- the reinforcing layer is preferably an aluminum foil.
- Such a reinforcing layer is relatively inexpensive and can maintain the stability of the product.
- a thermal conductive sheet is automatically mounted by sucking and supplying the thermal conductive sheet stored in the pocket of the embossed carrier tape of the thermal conductive sheet supply body one by one from the pocket using a vacuum nozzle.
- a sheet supply method is provided.
- the heat conductive sheet supply body and the method for supplying a heat conductive sheet of the present invention a large number of heat conductive sheets can be prepared without spreading in a plane, and the tape is peeled off while removing the cover film. Since the heat conductive sheet can be picked up at a fixed position by feeding the nozzles little by little, the vacuum nozzle only needs to move constantly, simplifying the nozzle movement and reducing the risk of failure in the mounting process. In addition, simplification and efficiency improvement of the automatic mounting process can be realized.
- FIG. 1 (A) shows an example of an automatic mounting process by the heat conductive sheet supply body and the method of supplying a heat conductive sheet of the present invention.
- FIG. 1B shows an example of a mounting failure that does not depend on the thermal conductive sheet supplier and the thermal conductive sheet supply method of the present invention.
- It is a top view which shows an example of the embossed carrier tape used by the Example and comparative example of this invention.
- the present inventor as a result of sucking the thermally conductive sheet and carrying it to the mounting location, a supply method using an embossed carrier tape and a thermally conductive sheet in the pocket of the embossed carrier tape.
- the sheet was stored one by one and protected from above with a cover film, and then the carrier tape was wound in a reel shape to find a heat conductive sheet supply body.
- this method and the supply body many thermal conductive sheets can be prepared without spreading in a plane, and the tape is fed little by little while peeling the cover film, so that the thermal conductive sheet is taken up at a fixed position.
- the vacuum nozzle only needs to move constantly, the movement of the nozzle is simplified, the risk of failure in the mounting process is reduced, and simplification and efficiency of the automatic mounting process can be realized.
- the supply method using the embossed carrier tape has been known as a supply method for semiconductor components that are very small and weak in strength (Patent Documents 1 to 4), there has been no example as a supply method for a heat conductive sheet.
- the present invention has been completed by finding that the thermal conductive sheet supply body and the thermal conductive sheet supply method of the present invention can simplify and improve the automatic mounting process of the thermal conductive sheet.
- an embossed carrier tape having a plurality of pockets each containing one heat conductive sheet on its surface and a cover film protecting the surface of the embossed carrier tape are wound in a reel shape.
- the heat conductive sheet supply body characterized by the above.
- an embossed carrier tape 3 having a plurality of pockets 2 containing a heat conductive sheet 1 on its surface and a cover film 4 for protecting the surface of the embossed carrier tape 3 are a reel.
- the embossed carrier tape can be replaced with one that is particularly small among semiconductor manufacturing parts and that is widely used when housing low-strength parts.
- There are many inventions related to embossed carrier tapes for conveying semiconductor components for example, Documents 1 to 4 are exemplified.
- the material is preferably polycarbonate from the viewpoint of heat resistance and weather resistance.
- the embossed pocket size is preferably about 10 to 20% larger than the sheet size both vertically and horizontally. If it is this size, there is no risk of the thermal conductive sheet getting caught in the pocket when sucking with the nozzle, and the thermal conductive sheet will not be displaced in the pocket during transportation, so it can be sucked correctly. it can.
- protrusions at the four corners of the bottom surface of the pocket or to provide convex portions at both ends of the bottom surface of the pocket so that the heat conductive sheet does not contact the bottom surface as much as possible.
- a protrusion and a convex part a heat conductive sheet can be smoothly attracted
- the protrusions and the protrusions have a shape that does not damage the heat conductive sheet.
- the pocket depth preferably has a margin of about 3 to 5 mm at the top when the heat conductive sheet is stored. If there is enough margin, there is no risk of the thermal conductive sheet protruding from the pocket during the process of storing the thermal conductive sheet and protecting it with the cover film, and it will not hinder the suction of the thermal conductive sheet. .
- the interval between the pockets is arbitrary, but is preferably about 5 mm.
- the embossed carrier tape of the present invention can have a length of several tens of meters to several hundreds of meters, and can accommodate thousands of thermal conductive sheets of several tens of mm square.
- cover film There are many inventions related to cover films for embossed carrier tapes for transporting semiconductor components (Patent Document 5).
- the cover film used in the present invention is particularly small among semiconductor manufacturing components, and is used to protect low-strength components. Widely used ones can be substituted.
- the material is preferably a polyester film.
- the embossed carrier tape and the cover film need to be joined, and there are two methods, one is applying an adhesive to the end of the cover film and bonding the other, and the other is heat-compressing the carrier tape and the cover film. It is preferable that the bonding strength is resistant to vibration, heat, and thermal shock when the thermally conductive sheet supply body is transported, and is stable over time. If the bonding strength is too weak, it will be peeled off during transportation, and if it is too strong, an extra load will be applied when the tape is peeled off during mounting.
- the tack energy of at least one surface of the thermal conductive sheet is 70 ⁇ J or less.
- the tack energy of the surface of the conductive sheet is more preferably 40 ⁇ J or less. If the tack energy of the surface of at least one surface of the heat conductive sheet is 70 ⁇ J or less, the cover film side is the lower side when the heat conductive sheet is stored in the pocket of the embossed carrier tape, protected with a cover film, and reeled. Even if it becomes, since there is little possibility that a heat conductive sheet adheres to a cover film and there is little possibility of being judged as an error in computer control of an automatic mounting process, a process can be advanced smoothly.
- the heat conductive sheet is preferably a laminate of a reinforcing layer and a heat conductive resin layer.
- the reinforcing layer is preferably a metal foil, a glass cloth, or a polyimide film from the viewpoint of heat dissipation performance and reinforcing capability. More preferably, the metal foil has a thickness of 20 ⁇ m or more.
- the metal foil reinforcing layer having this thickness has high thermal conductivity (for example, 237 W / mK for aluminum foil) and has little influence on heat dissipation performance. More preferred is a metal foil having a thickness of 20 ⁇ m to 150 ⁇ m. If it is this thickness, workability is favorable, a softness
- the metal foil include gold foil, silver foil, copper foil, and aluminum foil. Aluminum foil is preferable in consideration of price, workability, ductility, malleability, and product stability.
- Thermal conductive resin layer examples of the matrix of the thermally conductive resin include rubbers such as organic rubber, silicone rubber, polyurethane gel, synthetic rubber, and natural rubber, thermosetting resins such as epoxy resins and urethane resins, and thermoplastic elastomers.
- the matrix may be used alone or in combination of two or more. In consideration of heat resistance, cold resistance, weather resistance, electrical characteristics, and importance of the heat conductive sheet in the electronic component, the matrix is preferably silicone rubber.
- the thickness of the said heat conductive sheet is 60 micrometers or more and 600 micrometers or less.
- the thermal resistance when mounted can be reduced, while the stress between the heat generating member and the cooling member can be relieved, and the sheet moldability is improved. Can keep.
- the thermal resistance can be measured under the conditions of 30 psi / 100 ° C./30 minutes using the ASTM D-5470 test method.
- the thermal conductivity of the thermally conductive resin layer is preferably 1.0 W / mK or more, More preferably, it is 3.0 W / mK or more.
- the heat conductive sheet can be applied to a heat generating portion having a large heat generation amount.
- Two samples obtained by molding a thermally conductive silicone cured product to a size of 60 ⁇ 60 ⁇ 6 mm are prepared as measurement samples, and a probe is sandwiched between the molded products, and the thermal conductivity can be measured using a hot disk method.
- the thermally conductive resin layer preferably contains 300 parts by mass or more of a thermally conductive filler with respect to 100 parts by mass of the silicone resin.
- the filling amount of the thermally conductive filler is 200 parts by mass or more and 1300 parts by mass or less with respect to 100 parts by mass of the thermally conductive resin, sufficient thermal conductivity of the thermally conductive resin layer can be obtained, and heat generation While adaptable to a large amount of heat generating member, the moldability of the heat conductive sheet is also good, and the flexibility of the molded heat conductive sheet is excellent, being 300 parts by mass or more and 1300 parts by mass or less. Is more preferable.
- thermally conductive filler examples include nonmagnetic metals such as copper and aluminum, metal oxides such as alumina, silica, magnesia, bengara, beryllia, titania, zirconia, and metal nitrides such as aluminum nitride, silicon nitride, and boron nitride.
- a material generally used as a heat conductive filler such as metal hydroxide such as magnesium hydroxide, artificial diamond or silicon carbide can be used.
- a heat conductive filler having a center particle diameter of 0.1 to 200 ⁇ m can be used, and one kind may be used alone, or two or more kinds may be used in combination.
- the present invention is characterized in that the thermal conductive sheet accommodated in the pocket of the embossed carrier tape of the thermal conductive sheet supply body is automatically mounted by sucking and supplying one by one from the pocket using a vacuum nozzle. This is a method for supplying a thermally conductive sheet.
- the heat conductive sheets 1 are stored in the pockets 2 of the embossed carrier tape 3 one by one. Since many heat conductive sheets can be prepared and the embossed carrier tape 3 is fed little by little while peeling the cover film 4, the heat conductive sheet can be taken up at a fixed position. Since it only needs to move, in the automatic mounting of the heat conductive sheet, the heat conductive sheet 1 can be correctly sucked by the vacuum nozzle 7 and mounted in a predetermined place, for example, the semiconductor chip 8 (FIG. 1A )), Simplification and efficiency of the automatic mounting process can be realized.
- the heat conductive sheets are arranged in a plane, and a very large space is taken up.
- the vacuum nozzle sucks the heat conductive sheet and the distance until it is carried to the mounting location is different one by one, so if the number of heat conductive sheets spread on the plane is large, the distance to the mounting location becomes long, The risk of the sheet falling from the nozzle is increased.
- FIG. 1 (B) the heat conductive sheet cannot be correctly sucked by the vacuum nozzle 7, and the automatic mounting process is simplified and made more efficient. It cannot be realized.
- Components of thermal conductive sheet Component (A-1): X is a vinyl group, organopolysiloxane viscosity: 600 mm 2 / s (A-2) Component Methylvinylpolysiloxane comprising 99.85 mol% of dimethylsiloxane units and 0.15 mol% of methylvinylsiloxane units and having an average degree of polymerization of 8,000. (A-3) Component Poly-2-butyl acrylate
- C component Aluminum hydroxide (C-1) as a heat conductive filler having an average particle size as follows Average particle size: 1 ⁇ m: Aluminum powder (C-2) Average particle size: 10 ⁇ m: Aluminum powder (C-3) Average particle diameter: 1 ⁇ m: Alumina (C-4) Average particle diameter: 10 ⁇ m: Alumina
- (D) component 5% chloroplatinic acid 2-ethylhexanol solution as an addition reaction accelerator
- E component: Ethynylmethylidenecarbinol as an addition reaction control agent.
- (F) component A dimethylpolysiloxane having an average degree of polymerization of 30 and having one end blocked with a trimethoxysilyl group.
- compositions A to toluene was added to prepare a 20% toluene solution.
- This solution is coated on the reinforcing layer using a spacer, and toluene is volatilized at 80 ° C., followed by curing at 120 ° C.
- the other surface is coated with a toluene solution of the composition.
- One side of the reinforcing layer is the front side, and the back side is the back side.
- the composition applied to the front surface and the composition applied to the back surface may be different.
- coating was performed on the reinforcing layer without adding toluene.
- the curing temperature was 190 ° C.
- the sealing material may be the same as the material to be coated.
- Thermal conductive sheet supplier The thermal resistance (K-cm 2 / W) and tack energy ( ⁇ J) of the obtained heat conductive sheet were measured. Furthermore, it cut out to 10x10 mm size. Regarding Examples 1 to 5, 1000 heat conductive sheets were accommodated in the pockets of the polycarbonate embossed carrier tape described in FIG. At this time, the cover film side was stored so that the surface with a small tack energy of the heat conductive sheet came. The embossed carrier tape was protected from above with a polyester film, and the tape was reeled to produce a thermally conductive sheet supply body (Examples 1 to 5).
- Comparative Example 1 the obtained thermal conductive sheets are arranged one by one on a polycarbonate tray, and in Comparative Example 2, the obtained thermal conductive sheets are arranged one by one on a PET film. It is a thing.
- the vacuum nozzle When an embossed carrier tape is used as in the embodiment, the area required for storing the heat conductive sheet can be reduced, and the heat conductive sheet can be efficiently stored. Also, by using the embossed carrier tape at the time of mounting, the vacuum nozzle moves in a constant manner, and the distance to the mounting location is also constant, so that it can be mounted efficiently and less time is required.
- the vacuum nozzle can correctly suck the heat conductive sheet and supply it without error when mounting the heat conductive sheet.
- the vacuum nozzle cannot suck the heat conductive sheet correctly, and a supply error occurs.
- the heat conductive sheet is stored in the pocket of the embossed carrier tape of the present invention one by one, protected with a cover film, and the reel-like supply form is optimal for the supply form of the automatic mounting process of the heat conductive sheet. Yes, it greatly contributes to improving the efficiency of the mounting process.
- the heat conductive sheet preferably has a reinforcing layer, and the tack energy of the surface on the cover film side is preferably 70 microJ or less.
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Abstract
Description
チップから発生する熱をヒートシンクに効率良く伝えるために、ヒートシンクをチップに密着させる必要があるが、各チップの高さの違いや組み付け加工による公差があるため、柔軟性を有するシートや、グリースをチップとヒートシンクとの間に介装させ、このシートまたはグリースを介してチップからヒートシンクへの熱伝導を実現している。
一方、熱伝導性シートに関しては、実装時は貼り付けるだけで、特別な装置は必要なく、グリースに比べて取扱い性や管理が容易であるが、貼り付け作業は手作業がほとんどで非常に効率が悪く、製品の組み立て工程の律速となっている場合がある。そこで、熱伝導性シートの実装工程を半導体部品の実装において主流となっているバキュームノズルなどを用いた自動実装にすることで、飛躍的な生産性の向上が見込める。
この方法及び供給体によれば、平面状に広がることなく、多くの熱伝導性シートを準備でき、さらにカバーフィルムを剥がしながらテープを少しずつ送ることで、定位置で熱伝導性シートを取り上げることができるため、バキュームノズルは一定の動きをすればよく、ノズルの動きが単純化され実装工程上の失敗の危険性が少なくなり、自動実装工程の簡略化や効率化を実現することができる。
エンボスキャリアテープを用いた供給方法は、非常に小さく強度の弱い半導体部品の供給方法としては知られていた(特許文献1~4)ものの、熱伝導性シートの供給方法としては例がなかった。
このように、本発明の熱伝導性シート供給体及び熱伝導性シートの供給方法であれば、熱伝導性シートの自動実装工程を簡略化及び効率化できることを見出し、本発明を完成させた。
図1~図3に示したように、熱伝導性シート1を収納したポケット2を表面に複数備えたエンボスキャリアテープ3と、このエンボスキャリアテープ3の表面を保護するカバーフィルム4とが、リール5状に巻かれてなることを特徴とする本発明の熱伝導性シート供給体6及びこれを用いた熱伝導性シートの供給方法であれば、熱伝導性シート1をバキュームノズル7で正しく吸引し、例えば半導体チップ8などに実装することができるので、熱伝導性シート1の自動実装工程を簡略化及び効率化することができる。
以下、本発明について詳細に説明する。
エンボスキャリアテープは、半導体製造用部品の中でも特に非常に小さく、強度の弱いものを収納する際に広く用いられているものを代用することができる。半導体用部品搬送用のエンボスキャリアテープに関する発明は数多くあり、例えば、文献1~4等が例示される。素材は耐熱性、耐候性の点から、ポリカーボネートが好ましい。
この場合、突起や凸部が、熱伝導性シートを傷つけない形状であることが好ましい。
半導体部品搬送用エンボスキャリアテープのカバーフィルムに関する発明は数多くある(特許文献5)が、本発明に用いるカバーフィルムは、半導体製造用部品の中でも特に非常に小さく、強度の弱いものを保護する際に広く用いられているものを代用することができる。素材はポリエステルフィルムなどが好ましい。
エンボスキャリアテープとカバーフィルムを接合させる必要があるが、その方法は、カバーフィルムの端部に接着剤を塗布し接着させる方法とキャリアテープとカバーフィルムを熱圧着させる方法とがある。
接合強度は、熱伝導性シート供給体を輸送する際の振動や熱、熱衝撃に耐え、経時でも安定していることが好ましい。接合強度が弱すぎると輸送中に剥がれてしまい、強すぎると実装時にテープを剥がす際に余分な負荷がかかることになる。
本発明では、前記熱伝導性シートの少なくとも片面の表面のタックエネルギーが、70μJ以下であることが好ましい。
また、熱伝導性シートをポケットに収納する際には、カバーフィルム側に熱伝導性シートのタックエネルギーの小さい面がくるように収納するのが好ましい。
タックエネルギーの測定方法としては、マルコム社製タッキネステスターTK-1を用いることができる。測定条件はIPC規格に準拠した。
補強層を有していれば、熱伝導性シートの厚みが600μm以下の場合でも、リール化した後、輸送の際にエンボスキャリアテープのポケットが上下逆さまになったとしても、ポケットの中で、熱伝導性シートが、端に寄ったり折れ曲がったり、裏返ってしまうおそれがない。そのため実装時にバキュームノズルで正しく熱伝導性シートを吸引することが可能となる。
補強層は、放熱性能や補強能力から、金属箔やガラスクロス、ポリイミドフィルムが好ましい。より好ましくは20μm以上の厚みを有する金属箔である。この厚みを有する金属箔の補強層であれば、十分な補強性能を有することに加え、熱伝導率が高く(例えばアルミ箔は237W/mK)、放熱性能への影響も少ない。さらに好ましいのは、20μ~150μmの厚みを有する金属箔である。この厚みであれば、加工性が良好で、柔軟性も失われず、圧縮性能も富む。
金属箔の種類は、例えば、金箔、銀箔、銅箔、アルミ箔などが挙げられる。価格、加工性、延性、展性、製品安定性を考慮するとアルミ箔が好ましい。
また、補強層の上に熱伝導性樹脂層を積層させる場合は、補強層の片側だけに積層させてもよいが、両側に積層させるのが好ましい。補強層の両側に熱伝導性樹脂層を積層させた方が、実装させたときに発熱部と冷却部との密着性が向上しより高い放熱効果が期待できる。
熱伝導性樹脂のマトリックスとしては、有機ゴム、シリコーンゴム、ポリウレタンゲル、合成ゴム、天然ゴムなどのゴムや、エポキシ樹脂、ウレタン樹脂などの熱硬化性樹脂、熱可塑性エラストマーが挙げられる。マトリックスは一種類を単独で又は二種以上組み合わせても使用してもよい。
マトリックスは、耐熱性、耐寒、耐候性、電気特性、及び熱伝導性シートの電子部品における重要性を考慮すると、シリコーンゴムが好ましい。
また、前記熱伝導性シートの厚みは、60μm以上600μm以下であることが好ましい。
熱抵抗は、ASTM D-5470試験法を用い、30psi/100℃/30分の条件で熱抵抗を測定できる。
また、前記熱伝導性樹脂層の熱伝導率は、1.0W/mK以上であることが好ましく、
さらに好ましくは3.0W/mK以上である。
測定用サンプルとして熱伝導性シリコーン硬化物を60×60×6mmのサイズに成型したものを2つ準備し、成型体でプローブを挟み、ホットディスク法を用いて熱伝導率を測定できる。
前記熱伝導性樹脂層が、シリコーン樹脂100質量部に対し、熱伝導性充填材を300質量部以上含有することが好ましい。
熱伝導性充填材としては、非磁性の銅やアルミニウム等の金属、アルミナ、シリカ、マグネシア、ベンガラ、ベリリア、チタニア、ジルコニア等の金属酸化物、窒化アルミニウム、窒化ケイ素、窒化硼素等の金属窒化物、水酸化マグネシウム等の金属水酸化物、人工ダイヤモンドあるいは炭化珪素等、一般に熱伝導充填材とされる物質を用いることができる。また中心粒径が、0.1~200μmの熱伝導性充填材を用いることができ、1種単独で又は2種以上複合して用いてもよい。
実施例および比較例を行なうにあたり、熱伝導性シートの成分及び成型方法を以下に記載する。
(A-1)成分:
粘度:600mm2/s
(A-2)成分
ジメチルシロキサン単位99.85モル%及びメチルビニルシロキサン単位0.15モル%からなる、平均重合度が8,000のメチルビニルポリシロキサン
(A-3)成分
ポリ2-ブチルアクリレート
平均重合度が下記の通りである、両末端が炭化水素で封鎖されたハイドロジェンポリシロキサン
平均重合度:o=28、p=2
(B-2)成分
デナコールEX83D(ナガセケムテックス(株))
平均粒径が下記の通りである熱伝導性充填材としての水酸化アルミニウム
(C-1)平均粒径:1μm:アルミニウム粉
(C-2)平均粒径:10μm:アルミニウム粉
(C-3)平均粒径:1μm:アルミナ
(C-4)平均粒径:10μm:アルミナ
付加反応促進剤として、5%塩化白金酸2-エチルヘキサノール溶液
(E)成分:
付加反応制御剤として、エチニルメチリデンカルビノール。
アルミ箔 厚み50μm
ガラスクロス 厚み64μm、
密度たて60本、よこ47本/25mm
(A-1)、(A-3)成分をベースポリマーとして用いる際にはプラネタリーミキサーを用いて混練し、(A-2)成分をベースポリマーとして用いる際にはバンバリミキサーを用いて混練し、熱伝導性シートの組成物イ~トを得た。
得られた組成物イ~トの構成成分とその配分、及び伝導率を表1に示した。
組成物トに関しては、トルエンを添加せずに補強層上に塗工を行なった。硬化温度は190℃とした。
得られた熱伝導性シートの熱抵抗(K-cm2/W)、タックエネルギー(μJ)を測定した。さらに10×10mmサイズに切り出した。実施例1から5に関しては、図4に記載のポリカーボネート製エンボスキャリアテープのポケットに熱伝導性シートを1000個収納した。この時、カバーフィルム側に熱伝導性シートのタックエネルギーの小さい面がくるように収納した。エンボスキャリアテープの上からポリエステルフィルムで保護し、さらにテープをリール化して熱伝導性シート供給体を作製した(実施例1~5)。
これらの結果を表2に示した。
また、本発明の熱伝導性シート供給体及び熱伝導性シートの供給方法によれば、熱伝導性シートの実装時において、バキュームノズルが、熱伝導性シートを正しく吸引してミスなく供給できるのに対し、本発明の熱伝導性シート供給体及び熱伝導性シートの供給方法によらない比較例では、バキュームノズルが熱伝導性シートを正しく吸引できず、供給ミスが生じる。
Claims (9)
- 各々一つの熱伝導性シートを収納したポケットを表面に複数備えたエンボスキャリアテープと、該エンボスキャリアテープの表面を保護するカバーフィルムとが、リール状に巻かれてなることを特徴とする熱伝導性シート供給体。
- 前記熱伝導性シートの少なくとも片面の表面のタックエネルギーが、70μJ以下であることを特徴とする請求項1に記載の熱伝導性シート供給体。
- 前記熱伝導性シートが、補強層と熱伝導性樹脂層とを積層させたものであることを特徴とする請求項1又は2に記載の熱伝導性シート供給体。
- 前記熱伝導性シートの厚みが、60μm以上600μm以下であることを特徴とする請求項1から3のいずれか1項に記載の熱伝導性シート供給体。
- 前記熱伝導性樹脂層の熱伝導率が、1.0W/mK以上であることを特徴とする請求項3又は4に記載の熱伝導性シート供給体。
- 前記熱伝導性樹脂層の熱伝導率が、3.0W/mK以上であることを特徴とする請求項3から5のいずれか1項に記載の熱伝導性シート供給体。
- 前記熱伝導性樹脂層が、シリコーン樹脂100質量部に対し、熱伝導性充填材を300質量部以上含有するものであることを特徴とする請求項3から6のいずれか1項に記載の熱伝導性シート供給体。
- 前記補強層が、アルミ箔であることを特徴とする請求項3から7のいずれか1項に記載の熱伝導性シート供給体。
- 請求項1から8のいずれか1項に記載の熱伝導性シート供給体のエンボスキャリアテープのポケットに収納された熱伝導性シートを、バキュームノズルを用いて前記ポケットから1つずつ吸引して供給することで自動実装することを特徴とする熱伝導性シートの供給方法。
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CN104303290A (zh) | 2015-01-21 |
JP2013239525A (ja) | 2013-11-28 |
CN104303290B (zh) | 2017-06-23 |
KR101998218B1 (ko) | 2019-07-09 |
US9385063B2 (en) | 2016-07-05 |
EP2851947A4 (en) | 2016-01-27 |
KR20150010724A (ko) | 2015-01-28 |
EP2851947A1 (en) | 2015-03-25 |
EP2851947B1 (en) | 2018-06-06 |
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