WO2013137005A1 - 発光装置およびバックライト装置 - Google Patents
発光装置およびバックライト装置 Download PDFInfo
- Publication number
- WO2013137005A1 WO2013137005A1 PCT/JP2013/055439 JP2013055439W WO2013137005A1 WO 2013137005 A1 WO2013137005 A1 WO 2013137005A1 JP 2013055439 W JP2013055439 W JP 2013055439W WO 2013137005 A1 WO2013137005 A1 WO 2013137005A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting device
- light emitting
- light
- lead frame
- case member
- Prior art date
Links
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 29
- 238000005452 bending Methods 0.000 claims description 10
- 230000004907 flux Effects 0.000 abstract description 2
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Definitions
- the present invention relates to a light emitting device and a backlight device.
- FIGS. 6A and 6B there is a light emitting device as shown in FIGS. 6A and 6B (see Japanese Patent Application Laid-Open No. 2011-34674: Patent Document 1).
- the light emitting device 100 includes a lead frame 101, a light emitting element 102 disposed on the lead frame 101, and a light emitting element 102 that is disposed on the lead frame 101 and seals the light emitting element 102.
- the sealing resin 103 and the resin case member 104 covering the periphery of the side surface of the sealing resin 103 were included.
- the lead frame 101 and the light emitting element 102 are connected by a wire 105.
- the upper end surface 103 a of the sealing resin 103 was an opening for emitting light from the light emitting element 102.
- the light emitting device 100 was used as a backlight device as shown in FIG. As shown in FIG. 7, a plurality of light emitting devices 100 are arranged in a line, and the light guide 106 is arranged so as to face the upper end surface 103 a of the sealing resin 103 of the light emitting device 100.
- the light guide 106 has a plate shape, and the end surface 106 a of the light guide 106 is opposed to the upper end surface 103 a of the sealing resin 103 of the light emitting device 100. Then, the light emitted from the upper end surface 103a of the sealing resin 103 is taken into the light guide 106 from the end surface 106a of the light guide 106, diffusely reflected at an arbitrary location inside the light guide 106, The light guide 106 was taken out from the flat surface 106b. The light extracted from the flat surface 106b of the light guide 106 has been used as a backlight for liquid crystal panels and advertising films.
- FIG. 9A shows a cross section when the backlight device is cut perpendicular to the thickness direction of the light guide 106.
- FIG. 9A shows a normal positional relationship in which the light emitting device 100 and the light guide 106 are installed at a sufficient interval so as not to collide.
- a part of the light beam emitted from the light emitting element 102 of the light emitting device 100 did not enter the light guide 106 as indicated by the dotted arrow A.
- FIG. 9B shows a state in which the distance between the light emitting device 100 and the light guide 106 is closer than that shown in FIG. 9A. 9B, a part of the light beam that has not entered the light guide 106 in FIG. 9A enters the light guide 106 as indicated by the dotted arrow A.
- FIG. 9B shows a state in which the distance between the light emitting device 100 and the light guide 106 is closer than that shown in FIG. 9A. 9B, a part of the light beam that has not entered the light guide 106 in FIG. 9A enters the light guide 106 as indicated by the dotted arrow A.
- the light of the light emitting device 100 can be efficiently incident on the light guide 106.
- an object of the present invention is to provide a light emitting device and a backlight device that can increase the amount of light incident on the light guide and reduce the probability of occurrence of disconnection failure caused by thermal expansion of the light guide. is there.
- a light-emitting device of the present invention includes A lead frame having a lead frame main body and a bumper portion standing up from the lead frame main body; A bottom member is attached to the lead frame body, and a case member having a hole, A light emitting device disposed in the hole of the case member and attached to the lead frame body; The inside of the hole of the case member is filled with a sealing resin for sealing the light emitting element, The front end surface of the bumper part is higher than or equal to the upper end surface of the case member.
- the “upper end surface” refers to an end surface in a direction of emitting light of the light emitting element.
- the light guide when the light guide is disposed so as to face the upper end surface of the sealing resin of the light emitting device, the light guide is disposed in the vicinity of the upper end surface of the sealing resin of the light emitting device.
- the light guide collides with the light emitting device due to thermal expansion.
- the bumper portion comes into contact with the light guide and receives the force of the light guide to guide the bumper portion.
- the force of the light body is prevented from being transmitted to the case member.
- the light guide can be disposed in the vicinity of the light emitting device, and the light emitted from the light emitting device can be efficiently guided to the light guide. At the same time, even if the light guide collides with the light emitting device due to thermal expansion, it is possible to prevent the occurrence of disconnection failure of the light emitting device.
- the bumper portion is formed by bending a part of the lead frame.
- the bumper part is formed by bending a part of the lead frame, the bumper part can be easily manufactured.
- the bumper portion is disposed so as to be orthogonal to the lead frame body.
- the bumper portion is disposed so as to be orthogonal to the lead frame body, the direction of the force that the bumper portion receives from the thermal expansion light guide, and the bumper portion The orthogonal direction arranged in the lead frame body can be matched. Accordingly, a bending force is not applied from the light guide to the bumper portion, and the light guide can be reliably supported by the bumper portion.
- the lead frame main body has a terminal portion protruding from the end portion along the planar direction and exposed from the case member,
- the bumper portion is continuous with the terminal portion.
- the bumper portion since the bumper portion is connected to the terminal portion, the heat of the light emitting element can be released also in the bumper portion in addition to the terminal portion.
- the lead frame body has a terminal portion that protrudes from the end portion along the planar direction and is exposed from the case member,
- the bumper portion is continuous with the portion of the lead frame body where the terminal portion is not provided, and penetrates the case member.
- the installation space for the bumper portion can be reduced.
- the lead frame main body has a terminal portion protruding from the end portion along the planar direction and exposed from the case member,
- the bumper portion is continuous with the end portion of the lead frame main body without the terminal portion, and is exposed from the case member.
- the bumper portion is connected to the end portion of the lead frame main body without the terminal portion and is exposed from the case member. Therefore, in addition to the terminal portion, the bumper portion However, the heat of the light emitting element can be released. Further, the light emitting device can be arranged so that the bumper portion faces downward, and the light emitting device can be used as a side light emitting type device.
- the light emitting device In the backlight device of one embodiment, The light emitting device; A light guide disposed to face the upper end surface of the sealing resin of the light emitting device.
- the backlight device of this embodiment since the light emitting device is provided, the light efficiency is good and there is no disconnection failure.
- the front end surface of the bumper portion is higher than or equal to the upper end surface of the case member, so that the amount of light incident on the light guide can be increased, and The probability of occurrence of disconnection failure caused by thermal expansion of the light guide can be reduced.
- the backlight device of the present invention since the light emitting device is provided, the light efficiency is good and there is no disconnection failure.
- FIG. 2B It is a perspective view which shows the light-emitting device of 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device of 2nd Embodiment.
- FIG. 1 It is a perspective view which shows the light-emitting device of 3rd Embodiment of this invention. It is sectional drawing of the light-emitting device of 3rd Embodiment. It is a perspective view which shows the conventional light-emitting device. It is sectional drawing which shows the conventional light-emitting device. It is a perspective view which shows the state which used the conventional light-emitting device as a backlight apparatus. It is a longitudinal cross-sectional view of a backlight apparatus. It is explanatory drawing explaining the leakage of the light beam from a light-emitting device to a light guide while showing the cross section of a backlight apparatus.
- FIG. 1A is a perspective view showing a light emitting device according to a first embodiment of the present invention.
- FIG. 1B is a cross-sectional view of the light-emitting device.
- the light emitting device 10 includes a lead frame 1, a case member 4, a light emitting element 2, and a sealing resin 3.
- the lead frame 1 is made of metal, and has a lead frame main body 11 and a bumper portion 12 standing from the lead frame main body 11.
- the case member 4 is made of resin, and the bottom surface of the case member 4 is attached to the lead frame main body 11.
- the case member 4 is formed by lead frame 1 and insert molding.
- the case member 4 has a hole 40.
- the light emitting element 2 is disposed in the hole 40.
- the inner surface of the hole 40 is formed on an inclined surface where the opening side of the hole 40 is widened, and the light of the light emitting element 2 is reflected on this inclined surface. That is, the case member 4 plays the role of a reflector (reflector).
- the light emitting element 2 is a semiconductor light emitting element such as an LED.
- the light emitting element 2 is die-bonded to the lead frame body 11.
- the lead frame body 11 and the light emitting element 2 are connected by a wire 5.
- the sealing resin 3 is made of a translucent resin and is filled in the hole 40 of the case member 4 to seal the light emitting element 2.
- An upper end surface 3 a of the sealing resin 3 is an opening that emits light from the light emitting element 2. Note that a phosphor may be mixed in the sealing resin 3.
- the lead frame main body 11 has a terminal portion 11 a that protrudes from the end portion along the plane direction and is exposed from the case member 4.
- the terminal part 11a is soldered to a mounting board, for example.
- the lead frame main body 11 is formed in a substantially rectangular shape, and terminal portions 11 a are provided on one pair of opposing sides of the rectangular lead frame main body 11.
- the bumper portion 12 is connected to the terminal portion 11a.
- the bumper portion 12 is disposed so as to be orthogonal to the lead frame main body 11.
- the bumper portion 12 is formed by bending a part of the lead frame 1 by 90 °. Specifically, the bumper portion 12 is molded in advance when the material of the lead frame 1 is pressed, and is formed by bending with a press at the time of lead cutting after insert molding the case member 4.
- each bumper part 12 is disposed outside the four corners of the rectangular case member 4 and is exposed from the case member 4.
- the front end surface 12 a of the bumper portion 12 is higher than the upper end surface 4 a of the case member 4.
- the upper end surface 4 a of the case member 4 is the same height as the upper end surface 3 a of the sealing resin 3.
- These upper end surfaces 3 a and 4 a are end surfaces in the direction of emitting light of the light emitting element 2.
- the backlight device includes a light emitting device 10 and a light guide 106 disposed so as to face the upper end surface 3 a of the sealing resin 3 of the light emitting device 10.
- the light guide 106 is the same as that described with reference to FIG.
- the plurality of light emitting devices 10 are mounted on the substrate 7, and the plurality of light emitting devices 10 are arranged in a line as shown in FIG. 7, for example.
- the end face 106 a of the light guide 106 faces the upper end face 3 a of the sealing resin 3 of the light emitting device 10. Then, the light emitted from the upper end surface 3a of the sealing resin 3 is taken into the light guide 106 from the end surface 106a of the light guide 106, diffusely reflected at an arbitrary location inside the light guide 106, The light guide 106 is taken out from the flat surface 106b.
- the light extracted from the flat surface 106b of the light guide 106 is used as a backlight for a liquid crystal panel or an advertising film. This backlight device is called a so-called edge type backlight.
- the light guide 106 is disposed in the vicinity of the upper end surface 3a of the sealing resin 3 of the light emitting device 10. Accordingly, as described with reference to FIG. 9B, the light from the light emitting device 10 can be efficiently incident on the light guide 106.
- the light guide 106 When the light emitting device 10 is brought close to contact with the light guide 106, when the light emitting element 2 is turned on or the ambient temperature rises, the light guide 106 is thermally expanded in the arrow direction as shown in FIG. 2B. The light guide 106 collides with the light emitting device 10.
- the front end surface 12 a of the bumper portion 12 is higher than the upper end surface 4 a of the case member 4, so that the bumper portion 12 comes into contact with the light guide body 106 and the force of the light guide body 106. In response, the force of the light guide 106 is prevented from being transmitted to the case member 4.
- the light guide 106 can be disposed in the vicinity of the light emitting device 10, and the light emitted from the light emitting device 10 can be efficiently guided to the light guide. At the same time, even if the light guide 106 collides with the light emitting device 10 due to thermal expansion, it is possible to prevent the occurrence of disconnection failure of the light emitting device 10.
- the bumper portion 12 serves not only to increase the strength of the light emitting device 10 but also to reduce the thermal resistance of the light emitting device 10 by increasing the total weight of the lead frame 1. Moreover, by protecting the mechanical strength of the light emitting device 10 by the bumper portion 12, the resin material used for the case member 4 is specialized in improving the reflectance and preventing discoloration during long-term energization at the expense of strength. Material can be selected.
- the bumper portion 12 is formed by bending a part of the lead frame 1, the bumper portion 12 can be easily manufactured.
- the bumper portion 12 is disposed so as to be orthogonal to the lead frame main body 11, the direction of the force received by the bumper portion 12 from the thermally expanded light guide 106 and the lead frame main body of the bumper portion 12. 11 and the orthogonal direction arranged at 11 can be matched. As a result, no bending force is applied to the bumper portion 12 from the light guide body 106, and the light guide body 106 can be reliably supported by the bumper portion 12.
- the bumper portion 12 is connected to the terminal portion 11a, the heat of the light emitting element 2 can be released also in the bumper portion 12 in addition to the terminal portion 11a.
- the backlight device having the above configuration, since the light emitting device 10 is provided, the light efficiency is good and the disconnection failure is not caused.
- FIG. 4A is a perspective view showing a light emitting device according to a second embodiment of the present invention.
- FIG. 4B is a cross-sectional view of the light-emitting device. The difference from the first embodiment will be described. In the second embodiment, the position where the bumper portion of the lead frame is provided is different.
- the lead frame main body 11A protrudes from the end portion along the plane direction and is exposed from the case member 4.
- the lead frame body 11A is formed in a rectangular shape. Terminal portions 11a are provided on one pair of opposing sides of the rectangular lead frame main body 11A.
- the bumper portion 12A is continuous with the portion of the lead frame main body 11A without the terminal portion 11a and penetrates the case member 4.
- the bumper portion 12A is not continuous with the terminal portion 11a, but is continuous with the lead frame main body 11A covered with the case member 4.
- the bumper portion 12 ⁇ / b> A is embedded in the case member 4 so that the front end surface 12 a of the bumper portion 12 ⁇ / b> A is exposed from the upper end surface 4 a of the case member 4.
- the bumper portion 12A is disposed so as to be orthogonal to the lead frame main body 11A.
- the bumper portion 12A is formed by bending a part of the lead frame 1A by 90 °.
- each bumper portion 12A is arranged at the four corners of the rectangular case member 4.
- the front end surface 12a of the bumper portion 12A is higher than the upper end surface 4a of the case member 4.
- the upper end surface 4 a of the case member 4 is the same height as the upper end surface 3 a of the sealing resin 3.
- These upper end surfaces 3 a and 4 a are end surfaces in the direction of emitting light of the light emitting element 2.
- the initial lead frames are individually separated by performing dicing called a map method.
- the bumper portion 12A penetrates the case member 4, so that the installation space for the bumper portion 12A can be reduced.
- FIG. 5A is a perspective view showing a light emitting device according to a third embodiment of the present invention.
- FIG. 5B is a cross-sectional view of the light-emitting device. The difference from the first embodiment will be described.
- the position where the bumper portion of the lead frame is provided is different.
- the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and the description thereof is omitted.
- the lead frame main body 11B protrudes along the planar direction from the end portion and is exposed from the case member 4.
- the lead frame main body 11B is formed in a rectangular shape. Terminal portions 11a are provided on one pair of opposing sides of the rectangular lead frame main body 11B.
- the bumper portion 12B is continuous with the end portion of the lead frame main body 11B without the terminal portion 11a and is exposed from the case member 4.
- the bumper portion 12B is connected to the other pair of opposite sides of the lead frame main body 11B so as to be exposed from the case member 4.
- the bumper portion 12B is disposed so as to be orthogonal to the lead frame main body 11B.
- the bumper portion 12B is formed by bending a part of the lead frame 1B by 90 °.
- each bumper portion 12B is disposed outside the four corners of the case member 4 having a rectangular shape in plan view.
- the front end surface 12a of the bumper portion 12B is higher than the upper end surface 4a of the case member 4.
- the upper end surface 4 a of the case member 4 is the same height as the upper end surface 3 a of the sealing resin 3.
- These upper end surfaces 3 a and 4 a are end surfaces in the direction of emitting light of the light emitting element 2.
- the bumper portion 12B is further connected to the end portion of the lead frame main body 11B where the terminal portion 11a is not provided.
- the heat of the light emitting element 2 can be released also in the bumper portion 12B.
- the light emitting device 10B can be arranged so that the bumper portion 12B faces downward, and the light emitting device 10B can be used as a side light emitting type device.
- the height of the front end surface of the bumper portion may be equal to the height of the upper end surface of the case member. You may arrange
- the bumper part can be freely increased or decreased.
- the material of the case member may be other than resin. You can freely change the shape of the lead frame body and increase or decrease the number of terminal parts. You may use the light-emitting device of the said structure for light source devices other than a backlight apparatus.
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Abstract
Description
リードフレーム本体とこのリードフレーム本体から起立したバンパー部とを有するリードフレームと、
上記リードフレーム本体に底面が取り付けられると共に、穴部を有するケース部材と、
上記ケース部材の上記穴部内に配置されると共に、上記リードフレーム本体に取り付けられた発光素子と、
上記ケース部材の上記穴部内に充填されると共に、上記発光素子を封止する封止樹脂と
を備え、
上記バンパー部の先端面は、上記ケース部材の上端面よりも高いか、または、等しい高さを有することを特徴としている。
上記リードフレーム本体は、端部から平面方向に沿って突出すると共に上記ケース部材から露出する端子部を有し、
上記バンパー部は、上記端子部に連なっている。
上記リードフレーム本体は、端部から平面方向に沿って突出すると共に上記ケース部材から露出する端子部を有し、
上記バンパー部は、上記リードフレーム本体の上記端子部のない部分に連なると共に、上記ケース部材を貫通している。
上記リードフレーム本体は、端部から平面方向に沿って突出すると共に上記ケース部材から露出する端子部を有し、
上記バンパー部は、上記リードフレーム本体の上記端子部のない端部に連なると共に、上記ケース部材から露出している。
上記発光装置と、
上記発光装置の上記封止樹脂の上端面に対向するように配置された導光体と
を備える。
図1Aは、この発明の第1実施形態の発光装置を示す斜視図である。図1Bは、発光装置の断面図である。図1Aと図1Bに示すように、この発光装置10は、リードフレーム1と、ケース部材4と、発光素子2と、封止樹脂3とを有している。
図4Aは、この発明の第2実施形態の発光装置を示す斜視図である。図4Bは、発光装置の断面図である。上記第1の実施形態と相違する点を説明すると、この第2の実施形態では、リードフレームのバンパー部を設ける位置が相違する。
図5Aは、この発明の第3実施形態の発光装置を示す斜視図である。図5Bは、発光装置の断面図である。上記第1の実施形態と相違する点を説明すると、この第3の実施形態では、リードフレームのバンパー部を設ける位置が相違する。
2 発光素子
3 封止樹脂
3a 上端面
4 ケース部材
4a 上端面
40 穴部
5 ワイヤー
10,10A,10B 発光装置
11,11A,11B リードフレーム本体
11a 端子部
12,12A,12B バンパー部
12a 先端面
106 導光体
106a 端面
Claims (7)
- リードフレーム本体(11,11A,11B)とこのリードフレーム本体(11,11A,11B)から起立したバンパー部(12,12A,12B)とを有するリードフレーム(1,1A,1B)と、
上記リードフレーム本体(11,11A,11B)に底面が取り付けられると共に、穴部(40)を有するケース部材(4)と、
上記ケース部材(4)の上記穴部(40)内に配置されると共に、上記リードフレーム本体(11,11A,11B)に取り付けられた発光素子(2)と、
上記ケース部材(4)の上記穴部(40)内に充填されると共に、上記発光素子(2)を封止する封止樹脂(3)と
を備え、
上記バンパー部(12,12A,12B)の先端面(12a)は、上記ケース部材(4)の上端面(4a)よりも高いか、または、等しい高さを有することを特徴とする発光装置。 - 請求項1に記載の発光装置において、
上記バンパー部(12,12A,12B)は、上記リードフレーム(1,1A,1B)の一部を折り曲げて、形成されていることを特徴とする発光装置。 - 請求項1または2に記載の発光装置において、
上記バンパー部(12,12A,12B)は、上記リードフレーム本体(11,11A,11B)に直交するように、配置されていることを特徴とする発光装置。 - 請求項1から3の何れか一つに記載の発光装置において、
上記リードフレーム本体(11)は、端部から平面方向に沿って突出すると共に上記ケース部材(4)から露出する端子部(11a)を有し、
上記バンパー部(12)は、上記端子部(11a)に連なっていることを特徴とする発光装置。 - 請求項1から3の何れか一つに記載の発光装置において、
上記リードフレーム本体(11A)は、端部から平面方向に沿って突出すると共に上記ケース部材(4)から露出する端子部(11a)を有し、
上記バンパー部(12A)は、上記リードフレーム本体(11A)の上記端子部(11a)のない部分に連なると共に、上記ケース部材(4)を貫通していることを特徴とする発光装置。 - 請求項1から3の何れか一つに記載の発光装置において、
上記リードフレーム本体(11B)は、端部から平面方向に沿って突出すると共に上記ケース部材(4)から露出する端子部(11a)を有し、
上記バンパー部(12B)は、上記リードフレーム本体(11B)の上記端子部(11a)のない端部に連なると共に、上記ケース部材(4)から露出していることを特徴とする発光装置。 - 請求項1から6の何れか一つに記載の発光装置(10,10A,10B)と、
上記発光装置(10,10A,10B)の上記封止樹脂(3)の上端面(3a)に対向するように配置された導光体(106)と
を備えることを特徴とするバックライト装置。
Priority Applications (3)
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US14/385,014 US9163810B2 (en) | 2012-03-13 | 2013-02-28 | Light emitting device and backlight device |
CN201380013663.0A CN104170105B (zh) | 2012-03-13 | 2013-02-28 | 发光装置以及背光装置 |
JP2014504786A JP5866431B2 (ja) | 2012-03-13 | 2013-02-28 | 発光装置およびバックライト装置 |
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JP2012-055669 | 2012-03-13 | ||
JP2012055669 | 2012-03-13 |
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JP (1) | JP5866431B2 (ja) |
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Cited By (1)
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WO2015097955A1 (ja) * | 2013-12-26 | 2015-07-02 | アピックヤマダ株式会社 | リードフレーム、ledパッケージ用基板、リフレクタ部材、ledパッケージ、発光装置、発光システム、並びに、ledパッケージ用基板及びledパッケージの製造方法 |
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JP6279737B2 (ja) * | 2014-07-18 | 2018-02-14 | 堺ディスプレイプロダクト株式会社 | 光源装置及び表示装置 |
CN108496210B (zh) * | 2016-06-23 | 2020-04-28 | 华为技术有限公司 | 红外光发射装置及移动终端 |
JP7251990B2 (ja) * | 2019-01-23 | 2023-04-04 | トライベイル テクノロジーズ, エルエルシー | バックライト及び表示装置 |
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JPWO2013137005A1 (ja) | 2015-08-03 |
JP5866431B2 (ja) | 2016-02-17 |
US20150043245A1 (en) | 2015-02-12 |
CN104170105A (zh) | 2014-11-26 |
CN104170105B (zh) | 2017-03-15 |
US9163810B2 (en) | 2015-10-20 |
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