WO2013129873A1 - Apparatus for testing elements - Google Patents

Apparatus for testing elements Download PDF

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Publication number
WO2013129873A1
WO2013129873A1 PCT/KR2013/001648 KR2013001648W WO2013129873A1 WO 2013129873 A1 WO2013129873 A1 WO 2013129873A1 KR 2013001648 W KR2013001648 W KR 2013001648W WO 2013129873 A1 WO2013129873 A1 WO 2013129873A1
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WO
WIPO (PCT)
Prior art keywords
unit
test
picker
support
loading
Prior art date
Application number
PCT/KR2013/001648
Other languages
French (fr)
Korean (ko)
Inventor
유홍준
서용진
김민성
유태식
Original Assignee
(주)제이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120071089A external-priority patent/KR102000949B1/en
Application filed by (주)제이티 filed Critical (주)제이티
Publication of WO2013129873A1 publication Critical patent/WO2013129873A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

Definitions

  • the present invention relates to a device inspection device, and more particularly, to a device inspection device for inspecting the electrical characteristics of the device.
  • semiconductor devices (hereinafter referred to as “devices”) are subjected to various tests such as electrical properties, heat or pressure reliability test by the semiconductor device inspection device after the packaging process.
  • the inspection of the device is carried out in the room temperature test or the high temperature environment according to the type of device such as the memory device or the non-memory device such as the CPU (Central Processing Unit) and the GPU (Graphic Processing Unit), the LED device and the solar device. There are various tests, such as the heating test being performed.
  • LSI has a problem that it is difficult to use expensive inspection equipment because of the small quantity of inspection compared to the inspection apparatus of a standardized memory device due to the characteristics of small quantities of various kinds.
  • the present invention is to solve the above problems of the prior art, an object of the present invention is to provide a device inspection apparatus capable of inspecting a variety of LSI devices while performing a quick inspection for a small quantity of various types of LSI devices Is in.
  • another object of the present invention is to provide a device inspection apparatus that can accurately perform the movement in the horizontal direction and the vertical direction of the element pressing tool to pick up the element and press the test socket.
  • another object of the present invention is to provide a device inspection apparatus that can easily reduce the production cost of the device by reducing the maintenance cost by the easy maintenance of the components.
  • Another object of the present invention is to provide a device inspection apparatus capable of accurately setting and confirming a pressing position of an element pressing tool for picking up an element and pressing the test socket.
  • Device inspection apparatus for achieving the above object is a loading unit is loaded with one or more trays loaded with a plurality of elements; A loading buffer unit which temporarily receives elements from a tray of the loading unit through a loading transfer tool and temporarily loads the elements; A test unit which receives the elements from the loading buffer unit and performs a test; An unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit; An unloading unit configured to classify and load elements loaded in the unloading buffer unit according to a test result of the test unit through an unloading transfer tool; The device may include one or more device pressing tools for transferring devices between the loading unit, the test unit, and the unloading unit.
  • the device inspection apparatus includes a loading unit for loading one or more trays are loaded with a plurality of devices;
  • a test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit;
  • An unloading unit configured to classify and load the tested elements according to the test result of the test unit;
  • Any one transfer tool may include an adsorption pad exchange unit capable of automatically exchanging the adsorption pads respectively coupled to the pickers.
  • the device inspection apparatus includes a loading unit for loading one or more trays are loaded with a plurality of devices;
  • a test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit;
  • An unloading unit configured to classify and load the tested elements according to the test result of the test unit; It includes one or more transfer tools for transferring the device between the loading unit, the test unit and the unloading unit, is installed on one side of the test unit by injecting air in the state in which the test socket is covered by the movement to the test It may further include a cleaning part for removing foreign matter from the socket.
  • the device inspection apparatus includes a loading unit for loading a plurality of devices, and a test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; And at least one shuttle unit for transferring the element transferred from the loading unit to the test unit and transferring the element transferred from the test unit to the unloading unit, wherein the shuttle unit includes: a shuttle plate on which the element is mounted; It may include a plate fixing portion to which the shuttle plate is detachably coupled, and a plate detachment portion installed on the plate fixing portion to fix the shuttle plate to the plate fixing portion.
  • the device inspection apparatus includes a loading unit for loading one or more trays are loaded with a plurality of devices; A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit; An unloading unit configured to classify and load the tested elements according to the test result of the test unit; And one or more transfer tools for transferring an element between the loading unit, the test unit, and the unloading unit, wherein the transfer tool transfers the elements from the loading unit to the test unit or from the test unit to the unloading unit. And a pair of device pressing tools for delivering the device, wherein the device pressing tools may include a support that is movably installed and one or more picker modules that are detachably coupled to the support and to which one or more pickers are coupled. .
  • Device inspection apparatus includes a loading unit for loading a plurality of devices; A test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; An element pressing unit for picking up the element and pressing the test socket, wherein the element pressing unit picks up the element and moves the element to a pressing position by linear movement to press the element into the test socket and; A horizontal moving device connected to the element pressing tool to move the element pressing tool to the test socket; The cam member may include a first vertical moving device for vertically moving the element pressing tool to the pressing position.
  • the test unit is provided with a loading unit for loading a plurality of devices, a plurality of test sockets for performing a test on the device transferred from the loading unit, and the test The unloading unit for classifying the test-completed device according to the test result, and at least one shuttle for transferring the device transferred from the loading unit toward the test unit and the device transferred from the test unit toward the unloading unit And at least one loading transfer tool for picking up an element from the loading unit and transferring it to the shuttle unit; At least one unloading transfer tool for picking up the element from the shuttle unit and transferring the element to the unloading unit; At least one device pressing tool for picking up the device from the shuttle unit and pressurized to the test socket, the device is pressed to the test socket and delivers the completed test device to the shuttle unit, the device pressing tool is movable And a support unit to be installed and detachably coupled to the support unit, and at least one picker module to which at least one picker is coupled.
  • the device inspection apparatus includes a loading unit for loading a plurality of devices; A test unit provided with a plurality of test sockets for testing a device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; A picker for picking up the device, the pick-up device comprising one or more device pressing tools for picking up the device and forcing it to the test socket, wherein the device pressing tool includes a heating unit for heating the device picked up by the picker; Can be.
  • the device inspection apparatus includes a loading unit for loading a plurality of devices; A test unit including a plurality of test sockets for testing the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; At least one element pressing tool for picking up the element and moving the element to the pressing position by linear movement and pressing the test socket, and a first vertical movement for linearly moving the element pressing tool to the pressing position by a cam member.
  • An element pressing unit including an apparatus; A second vertical moving device which linearly moves the element pressing unit with respect to the test unit; When the element pressing tool is brought into contact with the test part by the second vertical moving device, the load applied to the test part by the second vertical moving device is detected, and when the detected load becomes a predetermined reference load. It may include a control unit for determining the position of the device pressing tool of the pressing position.
  • Device inspection apparatus there is an advantage that can be inspected a variety of LSI devices while performing a quick test for a small amount of various types of LSI devices.
  • the first vertical moving device for vertically moving the element pressing tool for picking up the element and pressurized by the test socket includes a cam member, the cam member is rotated
  • the device pressing tool is configured to move in the vertical direction, whereby the position of the device pressing tool in the vertical direction can be accurately set.
  • the device inspection apparatus has an advantage that the maintenance cost of the device can be easily configured, thereby reducing the cost of maintenance of the device and significantly reducing the production cost of the device.
  • the device inspection apparatus according to an embodiment of the present invention, the device pressing tool for picking up the device to press the test socket, the support is installed so as to move, the support is detachably coupled to one or more pickers By having one or more picker modules to be coupled there is an advantage that the maintenance of the device pressing tool is easy.
  • the device inspection apparatus by supporting the heater and the one or more first connectors for power supply and signal transmission to the temperature sensor is installed, the support portion when the support unit and the picker module constituting the element pressing tool It is automatically connected to the second connector installed in the need for a separate connection work for power supply and signal transmission, there is an advantage of easy manufacturing and maintenance of the device.
  • the device inspection apparatus the plate for the element replacement between the test portion and the loading buffer portion or the element exchange between the test portion and the unloading buffer portion plate by a simple operation of the plate detachment portion Since it is configured to be detachable from the government, there is an advantage that the shuttle plate on which the device is seated can be easily replaced when the type of device to be inspected, in particular, the size of the device is changed.
  • the device inspection apparatus is provided with a heating unit for heating the picked up element in the picker of the element pressing tool for picking up the element and pressurized by the test socket, it is possible to heat the element quickly The temperature drop of the device can be minimized, and accordingly, there is an advantage that the inspection of the device can be performed accurately.
  • the device inspection apparatus according to an embodiment of the present invention, the replacement of the suction pad to stop the operation of the device and after manual replacement, compared to the prior art that the device is restarted, it is possible to automatically replace the suction pad from the picker There is an advantage in that the productivity of the equipment can be greatly improved by additionally provided with a suction pad exchanger.
  • the device inspection apparatus is installed on one side of the test unit by injecting air in a state in which the test socket is covered by the movement further comprises a cleaning unit for removing foreign matter from the test socket by The presence of foreign matter in the test socket prevents errors in the test or renders the test task impossible, thereby greatly improving the performance of the device.
  • FIG. 1 is a plan view schematically showing a device inspection apparatus according to an embodiment of the present invention.
  • FIG. 2 is a plan view schematically illustrating an example of a plate member of a loading buffer unit and an unloading buffer unit in the device inspection apparatus of FIG. 1.
  • FIG. 3 is a cross-sectional view schematically showing the first shuttle unit and the second shuttle unit in the device inspection apparatus of FIG.
  • FIG. 4 is a perspective view schematically illustrating a plate detachment unit for fixing the shuttle plate to the plate fixing unit in the first shuttle unit and the second shuttle unit of FIG. 3.
  • FIG. 5 and 6 are schematic diagrams for explaining the operation of the plate removable portion of FIG.
  • FIG. 7 is a schematic cross-sectional view of the cleaning unit of the device inspection apparatus of FIG. 1.
  • FIG. 8 is a plan view schematically illustrating a cleaning part of the device inspection apparatus of FIG. 1.
  • FIG. 9 is a cross-sectional view illustrating a device pressing tool provided in the device inspecting apparatus of FIG. 1.
  • FIG. 10 is an exploded perspective view of a picker provided in the element pressing tool of FIG. 9.
  • FIG. 10 is an exploded perspective view of a picker provided in the element pressing tool of FIG. 9.
  • FIG. 11 is a perspective view illustrating a support of the device pressing tool of FIG. 9.
  • FIG. 12 is a perspective view illustrating a picker module of the device pressing tool of FIG. 9.
  • FIG. 13 is a cross-sectional view illustrating an operation in which the picker module is coupled to a support part in the device pressing tool of FIG. 1.
  • FIG. 14 is a cross-sectional view showing another example of the element pressing tool provided in the device inspection apparatus of FIG.
  • FIG. 15 is an enlarged cross-sectional view of a part of the element pressing tool of FIG. 14.
  • 16 and 17 are schematic views illustrating a horizontal moving device and a first vertical moving device for moving the element pressing tool provided in the device inspecting apparatus of FIG. 1 in a horizontal direction and a vertical direction.
  • FIG. 18 is a cross-sectional view schematically illustrating a horizontal moving device for moving the device pressing tool provided in the device inspecting apparatus of FIG. 1 in a horizontal direction.
  • FIG. 19 is a longitudinal sectional view schematically showing a first vertical moving device for moving the device pressing tool provided in the device inspecting apparatus of FIG. 1 in a vertical direction.
  • FIG. 20 is a schematic diagram showing a configuration for setting the pressing position of the element pressing tool in the element inspection apparatus of FIG.
  • FIG. 21 is an enlarged cross-sectional view of a part of the configuration of FIG. 20.
  • FIG. 21 is an enlarged cross-sectional view of a part of the configuration of FIG. 20.
  • FIG. 22 is a perspective view illustrating a suction pad exchanger for automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool provided in the device inspection apparatus of FIG. 1.
  • 23 to 25 are partial cross-sectional views of an adsorption pad exchanger showing a process of automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool provided in the device inspection apparatus of FIG. 1; .
  • FIG. 26 and FIG. 27 are partial plan views of a suction pad exchanger showing a process of automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool included in the device inspection apparatus of FIG. 1. .
  • the loading unit 100 is loaded with a plurality of devices (1);
  • According to the test result of the test unit 300 may include an unloading unit 500 for classifying and loading the elements (1).
  • the device 1 to be tested may be a memory semiconductor or a non-memory device such as a central processing unit (CPU), a graphics processing unit (GPU), and a system large scale integration (LSI).
  • the device 1 may be a non-memory device, in particular, a device in which ball-shaped connection terminals are formed on the bottom.
  • the method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 may be performed by various methods.
  • the loading unit 100 and the unloading unit 500 are configurations in which one or more trays 2 on which the plurality of elements 1 are loaded are loaded, and various configurations are possible according to design.
  • the loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) in which a plurality of trays 2 may be loaded.
  • a plurality of trays 2 are properly disposed in the loading unit 100 so that the elements 1 can be picked up and transported continuously.
  • the tray 2 in which the elements 1 are empty may be replaced with the tray 2 in which the elements 1 are filled.
  • a batch of trays 2 can be loaded into the tray loading section automatically or manually.
  • the empty tray 2 after the elements 1 are drawn out in the loading unit 100 may be transferred to the unloading unit 500 by a tray transfer unit (not shown).
  • the tray 2 is disposed at the tray inverting portion (not shown) so that the element 1 that is not drawn out from the tray 2 can be removed before the empty tray 2 is transferred to the unloading portion 500. Can be rotated (inverted).
  • the unloading unit 500 may be configured similarly to the loading unit 100.
  • a plurality of empty trays 2 may be appropriately arranged according to the classification level so that the devices 1 may be classified and loaded in succession according to the test result.
  • the tray 2 filled with the tested devices 1 may be replaced with the empty tray 2.
  • a tray buffer part (not shown) in which the empty tray 2 is temporarily loaded is additionally provided so that the empty tray 2 may be temporarily loaded. Can be installed.
  • a plurality of receiving grooves 2a may be formed in the tray 2 so that the plurality of elements 1 may be loaded.
  • the plurality of receiving grooves 2a may be formed in the tray 2 in a matrix such as 8 ⁇ 16.
  • the loading unit 100 and the test unit 300 so that the speed at which the element 1 is conveyed may be increased, or the plurality of elements 1 may be sufficiently heated.
  • a loading buffer 200 for temporarily loading the elements (1) transferred from the tray 2 of the loading unit 100.
  • the devices 1 that have been tested by the test part 300 are temporarily loaded between the test part 300 and the unloading part 500 so that the speed at which the device 1 is transferred may be increased.
  • the unloading buffer unit 400 may be provided.
  • the unloading buffer unit 400 may be installed at a position opposite to the loading buffer unit 200 with respect to the test unit 300.
  • the device 1 to be tested may be transferred from the loading unit 100 and temporarily loaded in the loading buffer unit 200 and then transferred to the test unit 300.
  • the test unit 300 may be transferred from the test unit 300 and temporarily loaded in the unloading buffer unit 400 and then transferred to the unloading unit 500.
  • the loading buffer unit 200 and the unloading buffer unit 500 may be loaded with a relatively large number of elements (1) compared to the tray (2) on which a relatively small number of elements (1) are loaded. have.
  • a plurality of loading grooves 211 and 411 are formed on an upper surface of the loading buffer unit 200 and the unloading buffer unit 400. It may include a plate-shaped plate member (210, 410).
  • the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be configured to be substantially identical to each other. However, when it is necessary to heat (preheat) the device 1 in order to test the device 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer part 200.
  • the loading grooves 211 and 411 of the plate buffers 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are arranged to be spaced apart from the test sockets 310 of the test unit 300. It may be arranged, or arranged in accordance with the interval of the receiving grooves (2a) of the tray (2).
  • the interval between the receiving grooves 2a of the tray 2 and the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer 200 and the unloading buffer 400 may be In the same manner, the spacing of the test sockets 310 of the test unit 300 may be formed n times, for example, twice the spacing of the receiving grooves 2a of the tray 2.
  • the plate members 210 and 410 are elements for temporarily replacing the elements 1 and exchanging the elements with the test unit 300.
  • the plate members 210 and 410 are installed in a fixed state within the device inspection apparatus or are movable. Various configurations are possible.
  • the test unit 300 is for testing the device 1 transferred from the loading buffer unit 200, and various configurations are possible according to the type of test.
  • the test unit 300 is provided with a plurality of test sockets 310 in which the device 1 is pressed.
  • a plurality of test sockets 310 may be provided with a terminal connected to a power source, and an energization test of the device 1 may be performed through a process in which the device 1 is pressed against the terminal.
  • the test sockets 310 may be arranged in various matrices such as 8 ⁇ 2 and 8 ⁇ 4.
  • the test socket 310 is a configuration for connection between the device 1 and the terminal for the test of the device 1, various configurations are possible.
  • the test socket 310 may be installed to be replaced according to the type of device, the type of test.
  • the test unit 300 may be an independent configuration in which the test socket 310 and the rest of the configuration is modular, it may be implemented as a PCB board with the test socket 310 is installed as a simple configuration.
  • the test socket 310 may be characterized by each test to significantly reduce the configuration cost of the relatively expensive test unit 300. Can be.
  • test unit 300 may be configured to test the device 1 at a temperature of room temperature or more.
  • the test unit 300 may include a chamber member surrounding a partial region including the test socket 310 to minimize temperature change.
  • element exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is not directly made, but the element transferred from the loading buffer unit 200 ( 1) may be made by the shuttle unit (610, 620) for transferring to the test unit 300 and the element 1 transferred from the test unit 300 toward the unloading buffer unit 400.
  • the shuttle units 610 and 620 may be configured for element exchange between the test unit 300 and the loading buffer unit 200 or element exchange between the test unit 300 and the unloading buffer unit 400. It is possible.
  • the shuttle parts 610 and 620 may include a first device transfer position, a test unit 300, and a device for receiving the device 1 from the loading unit 100.
  • a first device transfer position for receiving the device 1 a device exchange position for exchanging the device 1 with the test unit 300, and a second device for delivering the device 1 to the unloading unit 500.
  • It may include a second shuttle portion 620 moved between the transfer position.
  • the first element transfer position, the element exchange position and the second element transfer position may be variously arranged according to the configuration of the device, it may be arranged sequentially in a straight line.
  • the first shuttle 610 and the second shuttle 620 may be disposed at both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween.
  • the first shuttle part 610 and the second shuttle part 620 are horizontally along the guide rails 611 and 621 and the guide rails 611 and 621 which are installed to face each other with respect to the test part 300.
  • the first device transfer position for receiving the device from the loading buffer unit 200, the device exchange position with the test unit 300, the second device transfer position for delivering the device to the unloading buffer unit 400
  • One or more shuttle plates 612 and 622 which are alternately moved and on which the elements 1 are loaded, and the shuttle plates 612 and 622 are detachably coupled and installed to move along the guide rails 611 and 621. And may include governments 613 and 623.
  • the guide rails 611 and 621 may be configured to guide the movement of the shuttle plates 612 and 622.
  • an element 1 is used for the element exchange between the test unit 300 and the loading buffer unit 200 or the element exchange between the test unit 300 and the unloading buffer unit 400.
  • At least one device seating groove is formed.
  • the plate fixing parts 613 and 623 are provided for the convenience of replacing the shuttle plates 612 and 622, and various configurations are possible, and a heater for heating the device 1 may be provided. Since the shuttle plates 612 and 622 are detachably installed on the plate fixing parts 613 and 623, the device 1 is seated when the type of the device 1 to be inspected, in particular, the size of the device 1 is changed. Shuttle plates 612 and 622 may be replaced.
  • the plate fixing parts 613 and 623 may be provided with plate detachable parts 614 and 624 to detachably fix the shuttle plates 612 and 622 to the plate fixing parts 613 and 623.
  • the plate detachable parts 614 and 624 are configured for detachment of the shuttle plates 612 and 622 from the plate fixing parts 613 and 623, and various configurations are possible, and the detachment of the shuttle plates 612 and 622 by simple manual operation is possible. This may be configured to enable.
  • the plate detachable parts 614 and 624 include the supports 614a and 624a fixed to the plate fixing parts 613 and 623, and the supports 614a and 624a.
  • Fixtures 614b and 624b which are pivotally connected via the first hinge shafts 614c and 624c and which selectively fix the shuttle plates 612 and 622 by rotation, and the fixtures 614b and 624b.
  • Elastic bodies 614d and 624d elastically supporting the first hinge shafts 614c and 624c, and pressing surfaces in contact with the fixing bodies 614b and 624b and in contact with the fixing bodies 614b and 624b.
  • pressure members 614i and 624i which are formed and pressurize the fixtures 614b and 624b, and are connected to the pressure bodies 614i and 624i and are movable up and down (Z-axis direction) inside the supports 614a and 624a.
  • the movable bodies 614e and 624e which are installed in such a manner, the handles 614g and 624g rotatably connected to the second hinge shafts 614f and 624f provided in the movable bodies 614e and 624e, and the support bodies 614a and 624a.
  • Installed in It may comprise a fixed hook (614h, 624h) which end is fixed hanging of the handle (614g, 624g).
  • the fixtures 614b and 624b may be formed in a shape that is bent in an approximately 'L' shape, and the bent portions may contact the edges of the shuttle plates 612 and 622 so that the shuttle plates 612 and 622 may be formed. Can be fixed to the plate fixing parts (613, 623).
  • a torsion spring may be used as the elastic bodies 614d and 624d.
  • the fixed hooks 614h and 624h are formed so that the end of the handles 614g and 624g can be caught and fixed by the worker rotating the handles 614g and 624g or the end of the handles 614g and 624g can be released. It is preferable to be.
  • the pressing bodies 614i and 624i move in the vertical direction by moving the moving bodies 614e and 624e in accordance with the displacement of the handles 614g and 624g, and thus the fixed body 614b.
  • the postures of the fixing bodies 614b and 624b may be changed according to the shape of the curved surface of the pressing surfaces of the pressing bodies 614i and 624i in contact with the 624b.
  • the postures of the fixing bodies 614b and 624b may be kept constant by the elastic force of the elastic bodies 614d and 624d.
  • the movement of the movable bodies 614e and 624e in the vertical direction may be performed by the rotation of the handles 614g and 624g around the second hinge axes 614f and 624f.
  • the rotation of the handles 614g and 624g is limited, and accordingly, the movements of the moving bodies 614e and 624e and the pressing bodies 614i and 624i are restricted. Since the movement in the vertical direction is limited, the postures of the fixing bodies 614b and 624b can be prevented from being changed arbitrarily.
  • the handles 614g and 624g are fixed about the second hinge axes 614f and 624f.
  • the elastic force of the elastic bodies 614d and 624d acts on the pressing bodies 614i and 624i and the moving bodies 614e and 624e, and pressurizes them.
  • the stationary bodies 614b. , 624b is rotated in a direction (clockwise in FIG. 5) from the shuttle plates 612 and 622 around the first hinge axes 614c and 624c by the elastic force of the elastic bodies 614d and 624d. Accordingly, as shown in FIG. 6, the fixing of the shuttle plates 612 and 622 may be released.
  • the handles 614g and 624g are centered on the second hinge shafts 614f and 624f to secure the hooks 614h and 624h.
  • the pressing body (614i, 624i) and the moving body (614e, 624e) is moved upwards, As the positions of the pressing surfaces of the pressing bodies 614i and 624i in contact with the fixing bodies 614b and 624b are changed, the fixing bodies 614b and 624b are positioned around the first hinge shafts 614c and 624c.
  • the shuttle plates 612 and 622 may be fixed by the fixtures 614b and 624b. Can be.
  • the elastic force of the elastic bodies 614d and 624d acts on the fixing bodies 614b and 624b, and thus the fixing bodies 614b and 624b. Can be prevented from rotating arbitrarily.
  • the plate detachable parts 614 and 624 that detachably fix the shuttle plates 612 and 622 to the plate fixing parts 613 and 623 rotate the handles 614g and 624g. It is configured to perform the operation of fixing and releasing the shuttle plates (612, 622) by a simple operation to make, the operation of fixing and releasing the shuttle plates (612, 622) very simple and easy to perform It can work.
  • the test unit 300 may be a situation that can not be tested, such as foreign matter flowed into the test socket 310, in this case, the device inspection after stopping the operation of the device inspection device and removing the foreign matter by manual labor There was a hassle to restart the device.
  • the cleaning unit 700 is provided on one side of the test unit 300 to remove foreign matters from the test socket 310 by spraying air in a state where the test socket 310 is covered by movement. desirable.
  • the cleaning unit 700 may be configured in various ways. For example, as shown in FIGS. 7 and 8, the cleaning unit 700 includes a main body 710 covering the test socket 310 and forming a cleaning space on the test socket 310, and a test. A driving unit 720 may be included to move the main body 710 between one side of the unit 300 and an upper portion of the test socket 310.
  • the main body 710 is configured to cover the test socket 310 and to form a cleaning space on the upper part of the test socket 310, and may have various configurations, and may have various shapes such as a bowl shape to form a closed cleaning space.
  • One or more nozzles 712 may be installed.
  • main body 710 may be connected to the discharge pipe 713 so that the foreign matter is discharged to the outside from the cleaning space with the air injected through the nozzle 712.
  • the driving unit 720 is configured to move the main body 710 between one side of the test unit 300 and the test socket 310, and various configurations such as a hydraulic cylinder and a pneumatic cylinder are possible.
  • the cleaning part 700 may include the first shuttle part 610 and the second shuttle part.
  • the driving unit 720 installed at 620 may be configured to linearly move the main body 710 in a direction parallel to the guide rails 611 and 621.
  • one or more loading transfer tools 810 that are moved between the loading unit 100 and the shuttle units 610 and 620 and pick up the device 1 from the loading unit 100 and transfer them to the shuttle units 610 and 620. 814 may be installed.
  • one loading transfer tool 810, 814 moves between the loading unit 100 and the shuttle units 610, 620 and picks up the element 1 from the loading unit 100 so that the shuttle unit 610, 620 may be configured to deliver.
  • the loading transfer tools 810 and 814 may pick up the device 1 from the loading unit 100 and transfer it to the loading buffer unit 200.
  • the first loading transfer tool 810 and the second loading transfer tool 814 for picking up the device 1 from the loading buffer unit 200 and transferring the elements 1 to the shuttle units 610 and 620.
  • At least one unloading transfer tool which is moved between the shuttle unit 610, 620 and the unloading unit 500 to pick up the device (1) from the shuttle unit (610, 620) and transfer it to the unloading unit 500 820 and 824 may be installed.
  • one unloading transfer tool 820, 824 moves between the shuttle portions 610, 620 and the unloading portion 500, picking up the element 1 from the shuttle portions 610, 620 and unloading it. It may be configured to deliver to the loading unit 500.
  • the unloading transfer tools 820 and 824 pick up the element 1 from the unloading buffer unit 400 to unload the unit 500.
  • a second unloading transfer tool 824 for picking up the device 1 from the shuttle parts 610 and 620 and transferring the picked-up element 1 to the unloading buffer part 400. can do.
  • the loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824 may be identical or similar to each other.
  • Each of the loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824 is configured to transfer the element 1, and includes a plurality of pickers and a vertical direction (Z direction) and It may include a driving device for driving the movement of the plurality of pickers in the horizontal direction (XY direction) or the like.
  • the picker is a component for picking up the element 1 and transporting it to a predetermined position.
  • the picker is composed of a suction pad for forming a vacuum pressure on the upper surface of the element 1 and a pneumatic cylinder for delivering pneumatic pressure to the suction pad. Can be.
  • the pickers may be disposed between the receiving grooves 2a of the tray 2 of the loading unit 100 and the unloading unit 500, and the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400.
  • the horizontal and vertical spacing may be adjusted. Can be fixed.
  • the driving device for moving the plurality of pickers may be configured in various ways according to the driving aspect of the pickers, and may include a moving device for moving the pickers up and down and a left and right moving device for moving in the left and right directions.
  • the moving device may be configured to move all the pickers up and down at once, or may be individually connected to each picker so that each picker is moved up and down independently.
  • the left and right moving apparatuses can be configured in various ways according to the movement mode of the pickers, and can be configured to allow a single direction movement in the X direction or the Y direction, or the X-Y direction movement.
  • the device pressing tools 830 and 840 may be installed to transfer the tested devices to the shuttle units 610 and 620.
  • the device pressing tools 830 and 840 are components for transferring the device 1 between the test unit 300 and the first shuttle unit 610 and between the test unit 300 and the second shuttle unit 620.
  • Various configurations are possible according to the transfer mode of the element 1.
  • the device pressing tools 830 and 840 may pick up the device 1 from the first shuttle 610 and press the test socket 310 while moving between the first shuttle 610 and the test unit 300.
  • Tool 840 may be included. As such, when the element pressing tools 830 and 840 are configured in a pair, the pair of element pressing tools 830 and 840 may be moved in cooperation with each other for the convenience of element replacement.
  • the device pressing tools 830 and 840 may have the same or similar structure as that of the loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824. Can be.
  • the device pressing tools 830 and 840 may include a plurality of pickers 831 and 841 picking up the device 1.
  • the gap between the loading grooves 211 and 411 of the plate members 210 and 410 is a device pressing tool so that the device exchange between the plate members 210 and 410 and the test unit 300 can be easily performed.
  • 1 / n for example, 1/2 of the interval of the pickers (831, 841) of (830, 840).
  • N is a natural number of two or more.
  • the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are disposed at 16 ⁇ 8
  • the test sockets 310 of the test unit 300 are disposed at 8 ⁇ 4.
  • the device pressing tools 830 and 840 include pickers 831 and 841 arranged at 8 ⁇ 4 at intervals corresponding to the test sockets 310 of the test unit 300 so that 8 ⁇ 4 devices at a time. It is possible to transport the field (1).
  • the pickers of the device pressing tools 830 and 840 when the pickers of the first loading transfer tool 810 are arranged in 8 ⁇ 4 (8 ⁇ 2) so as to enable the transfer of a larger number of semiconductor devices 10.
  • 831 and 841 may be arranged in 8 ⁇ 4 (8 ⁇ 2).
  • the element pressing tools 830 and 840 each place the element 1 into the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400. By skipping and withdrawing or stacking, it is unnecessary to adjust the gap between the pickers 831 and 841, thereby speeding up device transfer.
  • the element pressing tools 830 and 840 need to replace the pickers 831 and 841 according to the type and size of the element 1.
  • the element pressing tools 830 and 840 are attached to and detached from the supports 833 and 843 and the supports 833 and 843 movably installed in the device inspection apparatus. It may comprise one or more picker modules 834, 844 that are possibly coupled and to which one or more pickers 831, 841 are coupled.
  • the supporting members 833 and 843 may have any configuration as long as the supporting members 833 and 843 can support the picker modules 834 and 844.
  • the support parts 833 and 843 may be provided with first support plates 833a and 843b having a flat lower surface such that the picker modules 834 and 844 may be detachably fixed.
  • the picker modules 834 and 844 are coupled to the second support plates 835 and 845 and the second support plates 835 and 845 having an upper side in close contact with the lower sides of the first support plates 833a and 843b.
  • the pickers 831 and 841 are hollow coupling members 891 fixed to the picker support blocks 836 and 846, and hollows detachably coupled to the ends of the coupling members 891.
  • FIG. It can be composed of the suction pad (892).
  • the suction pad 892 may have a protrusion 892a which protrudes more than the outer circumferential surface of the coupling member 891.
  • the coupling member 891 may be detachably fixed to the picker support blocks 836 and 846 by the guide member 883.
  • the pickers 831 and 841 may be provided in the picker modules 834 and 844 in a state in which the coupling member 891 and the suction pad 892 are coupled to each other.
  • the suction pad 892 may be connected to the suction passage 899 through the coupling member 891.
  • the adsorption pad 892 may be made of a flexible material such as rubber or synthetic resin.
  • the dampers 839 and 849 serve to adjust the contact force of the device 1 to the test socket 1 while the device 1 presses the test socket 310 together with the picker modules 834 and 844. It acts as a buffer to the force exerted on it.
  • the dampers 839 and 949 have predetermined spaces formed therein, the chambers 839d and 849d in which pneumatic passages 839c and 849c communicate with the spaces, and the interiors of the chambers 839d and 849d.
  • pressing members 839b and 849b connected to the pickers 831 and 841 through the heating blocks 838 and 848 to press the elastic films 839a and 849a. Can be.
  • the elastic membranes 839a and 849a are elastically deformed to the pressing members 839b and 849b.
  • the predetermined pressure is applied. Therefore, the element 1 with respect to the test socket 310 when the element 1 is pressed into the test socket 310 by the pneumatic pressure acting inside the chambers 839d and 849d and the elasticity of the elastic membranes 839a and 849a. ) Can be determined.
  • the element 1 is connected to the test socket 310 by the pressure applied to the pressing members 839b and 849b by the pneumatic pressure applied to the interior of the chambers 839d and 849d and the elasticity of the elastic membranes 839a and 849a.
  • the force applied to the picker modules 834 and 844 in the process of pressing may be buffered.
  • the pneumatic pressure acting on the internal spaces of the chambers 839d and 849d depends on the plurality of picker modules 834 and 844. Can be adjusted differently. That is, in the process of pressing the plurality of devices 1 into the plurality of test sockets 310 using the plurality of picker modules 834 and 844, the plurality of devices 1 are uniform to the plurality of test sockets 310. It is necessary to pressurize with one contact force so that the test of the plurality of elements 1 can be performed uniformly at the same time.
  • the specifications of the plurality of picker modules 834 and 844 i.e., the positions of the pickers 831 and 841, the elastic force of the elastic membranes 839a and 849a, the assembly tolerances, the degree of aging of the parts, and the like must be used. Since it may not be the same, the plurality of devices 1 may not be uniformly pressed against the plurality of test sockets 310. Therefore, by allowing the air pressure applied to the internal spaces of the chambers 839d and 849d to be individually adjusted according to the plurality of picker modules 834 and 844, the air pressure may be adjusted according to the specifications of the plurality of picker modules 834 and 844. By allowing the individual adjustment, the plurality of devices 1 may be pressed with a uniform contact force to the plurality of test sockets 310.
  • the support parts 833 and 843 and the picker modules 834 and 844 are provided with the dampers 839 and 849.
  • Pneumatic connecting passages 833c, 843b, 835b, and 845b communicating with the pneumatic passages 839c and 849c may be formed.
  • the pneumatic connection passages 833b, 843b, 835b, and 845b are formed on the first plates 833a and 843a of the support parts 833 and 843 and are connected to an external pneumatic source (not shown).
  • the picker modules 834 and 844 are coupled to the support parts 833 and 843 without any additional work for connecting the pneumatic generators and the pneumatic passages 839c and 849c of the dampers 839 and 849 to thereby provide the pneumatic generators.
  • pneumatic passages 839c and 849c of dampers 839 and 849 may be automatically connected.
  • the picker support blocks 836 and 846 are portions on which the pickers 831 and 841 are supported, and suction paths 899 may be formed in communication with the suction pads 892 of the pickers 831 and 841.
  • the suction passage 899 functions as a passage through which air is sucked by being connected to a vacuum pressure source (not shown), and negative pressure may be formed in the suction pad 892 by suction of air along the suction passage 899.
  • the element 1 may be adsorbed to the suction pad 892 by the negative pressure.
  • the suction passage 899 may be formed inside the picker modules 834 and 844, but is not limited thereto, and the suction passage 899 may be formed as a separate tube connected to the suction pad 892. Can be.
  • the picker support blocks 836 and 846 having suction paths 899 in communication with the suction pads 892 are installed in the picker modules 834 and 844, the support parts 833 and 843 and the picker module (8).
  • the vacuum pressure connection paths 833c, 843c, 835c, and 845c connected to the suction passage 899 and the tube may be formed in the 834 and 844.
  • the vacuum pressure connection paths 833c, 843c, 835c, and 845c are formed on the first plates 833a and 843a of the support parts 833 and 843 and are connected to an external vacuum pressure source (not shown).
  • the heating blocks 838 and 848 are supported by the dampers 839 and 849 as a heating unit for heating the device 1 so that the test unit 300 can test the device 1 under a constant temperature. It may be installed between blocks 836 and 846. Heaters 838a and 848a may be installed in the heating blocks 838 and 848.
  • the plurality of heaters 838a and 848a may be provided in the plurality of picker modules 834 and 844, respectively.
  • the plurality of heaters 838a and 848a may be independently controlled according to the plurality of picker modules 834 and 844.
  • the picker modules 834 and 844 are connected to the heaters 838a and 848a to directly sense the temperature of the heaters 838a and 848a, or are connected to other objects connected to the heaters 838a and 848a to connect the heaters ( Temperature sensors 838b and 848b may be further provided to indirectly detect the temperatures of the 838a and 848a.
  • the plurality of heaters 838a and 848a are provided in the plurality of picker modules 834 and 844, respectively
  • the plurality of temperature sensors 838b and 848b may be provided in the plurality of picker modules 834 and 844, respectively.
  • the plurality of temperature sensors 838b and 848b sense the temperatures of the plurality of heaters 838a and 848a, and the temperatures of the plurality of heaters 838a and 848a according to the result detected by the plurality of temperature sensors 838b and 848b. Can be controlled.
  • each of the picker modules 834 and 844 is provided with heaters 838a and 848a and temperature sensors 838b and 848b, respectively, and heaters 838a and 848a according to the results detected by the temperature sensors 838b and 848b. Since the temperature of the can be controlled independently, the temperature is independently adjusted according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to test the plurality of elements 1. It can be done correctly.
  • the second plates 835 and 845 of 844 may be made of a heat insulating material.
  • a heat insulating member (not shown) may be installed between the heating blocks 838 and 848 and the dampers 839 and 849 and between the dampers 839 and 849 and the second plates 835 and 845.
  • the picker modules 834 and 844 may be provided with one or more first connectors 91 for power supply and signal transmission to the heaters 838a and 848a or the temperature sensors 838b and 848b.
  • the support parts 833 and 843 are coupled to the first connector 91 to supply power to the heaters 838a and 848a and the temperature sensors 838b and 848b when the picker modules 834 and 844 are coupled to each other.
  • the second connector 92 for transmitting a signal may be installed.
  • the terminals of the first connector 91 and the terminals of the second connector 92 may be variously configured such that they may be electrically connected to each other by a method of being inserted into each other.
  • the heaters (838a, 848a) by the combination of the picker module (834, 844) and the support (833, 843) without a separate connection work
  • power and signal transmission to the temperature sensors 838b and 848b may be possible. That is, the first connector 91 and the second connector 92 are installed at the parts that are in contact with each other when the picker modules 834 and 844 and the support parts 833 and 843 are coupled to each other so that the picker modules 834 and 844 and the support part ( 833, 843 may be automatically connected when mutually coupled.
  • the device pressing tools 830 and 840 include the device 1 picked up by the pickers 831 and 841. It may be provided with a heating gas spray unit for spraying the heating gas toward.
  • the element 1 may be heated by the heating gas injected into the element 1 by the heating gas injection unit, and thus, a high temperature test on the element 1 may be performed.
  • the plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, the plurality of heating gas spray units may be provided in the plurality of picker modules 834 and 844, respectively. In this case, the temperature of the heating gas sprayed by the plurality of heating gas spray units may be independently controlled according to the plurality of picker modules 834 and 844.
  • the heating gas spray unit is in communication with the injection hole 894 and a guide member 893 which is disposed on the outer circumference of the suction pad 892 to form an injection hole 894 through which the heating gas is injected together with the suction pad 892.
  • the heating gas path 895 may be connected to the heating gas supplier 896 for supplying the heating gas.
  • the heating gas passage 895 may be formed inside the heating blocks 838 and 848.
  • the shape of the heating injection port 894 may be formed in various shapes in which a heating gas injected through the injection port 894 may be injected toward the element 1 adsorbed by the suction pad 892.
  • the guide member 893 is formed around the outer circumference of the suction pad 892 at a predetermined interval so that the injection hole 894 may be formed at the outer circumference of the suction pad 892. It can be coupled to the picker support blocks 836, 846 to wrap.
  • the injection hole 894 may be connected to the heating gas supply 896 through the heating gas flow path 895.
  • the heating gas passage 895 may be formed inside the picker modules 834 and 844, but is not limited thereto.
  • the heating gas passage 895 may include a separate tube connected to the suction pad 892. Can lose.
  • the adsorption pad ( The heating gas may be injected from the injection holes 894 formed at the outer circumference of the 892, and the heating element may be heated while the injected heating gas collides with the element 1 adsorbed by the suction pad 892.
  • the heating of the device 1 is directly performed by the heating gas, the device 1 is heated in comparison with the case in which the device 1 is heated by using the heaters 838a and 848a in the picker modules 834 and 844.
  • Heat transfer efficiency for heating the heating element 1) can be heated not only to heat the element 1 quickly but also to minimize the temperature drop of the element 1, so that the inspection of the element 1 is performed at a predetermined temperature. Can be performed correctly.
  • the heaters 838a and 848a may not be installed in the picker modules 838 and 844.
  • the complexity of the design and the difficulty of assembling for installing the heaters 838a and 848a in the 838 and 844 can be eliminated.
  • the picker modules 838 and 844 may be provided with a heater 838a and 848a and a heating gas spray unit.
  • the heating gas may be injected from the injection hole 894 while the device pressing tools 830 and 840 pressurize the device 1 to the test socket 310, and the injected heating gas may be injected into the test socket 310.
  • the test socket 310 may be heated while colliding. As described above, since the heating of the test socket 310 is directly performed by the heating gas, the test socket 310 is heated in comparison with the case in which the heater is installed in the test socket 310 and the test socket 310 is heated using the heater. The complexity of the design and the difficulty of assembly for installing the heaters can be eliminated.
  • the picker modules 834 and 844 may be provided with temperature sensors 838b and 848b for sensing the temperature of the heating gas. Therefore, according to the result detected by the temperature sensors 838b and 848b, the temperature of the heating gas injected toward the element 1 can be controlled.
  • a plurality of temperature sensors 838b and 848b may be provided in the plurality of picker modules 834 and 844, respectively.
  • the plurality of temperature sensors 838b and 848b sense the temperature of the heating gas injected toward the element 1 picked up to each of the picker modules 834 and 844, and are detected by the plurality of temperature sensors 838b and 848b. According to the result, the temperature of the heating gas can be controlled.
  • each of the picker modules 834 and 844 is provided with a heating gas spray unit and temperature sensors 838b and 848b, respectively, and sprayed toward the element 1 according to the result detected by the temperature sensors 838b and 848b. Since the temperature of the heating gas to be controlled can be independently controlled, the temperature is independently adjusted according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to test the plurality of elements 1. Can be done more accurately.
  • the support parts 833 and 843 may be provided on one side of the support parts 833 and 843 and the picker modules 834 and 844 so that the picker modules 834 and 844 may be detachably coupled to the support parts 833 and 843.
  • a fastening unit 850 for fastening the picker modules 834 and 844, and on the other side of the support parts 833 and 843 and the picker modules 834 and 844, the picker module 834 to the support parts 833 and 843.
  • the first support unit 860 for supporting the 844 may be provided. According to the configuration, the support parts 833 and 843 and the picker modules 834 and 844 may be fastened to each other by the fastening unit 850 while being supported by the first support unit 860.
  • the fastening unit 850 includes a ring moving member 852 for moving the ring 851 and the ring 851 installed on one side of the picker modules 834 and 844 in a vertical direction, and one side of the support parts 833 and 843. Installed in the hook may include a ring locking member 853 is caught. According to this configuration, by hooking the hook 861 to the hooking member 853, by pulling the hook 851 downward using the ring moving member 852, the support parts 833, 843 and the picker module ( 834 and 844 may be fastened to each other.
  • the first support unit 860 is provided on the other side of the picker module 834, 844 protruding piece 861 protruding to a predetermined length, and the other side of the support portion 833, 843 is inserted into the protruding piece 861 It may include a protrusion piece fixing portion 862 is fixed.
  • the protruding piece fixing part 862 protrudes from the lower surface of the support parts 833 and 843, that is, from the lower surface of the first plates 833a and 843a, to a predetermined length so as to provide a space into which the protruding piece 861 is inserted.
  • the protrusion piece fixing part 862 includes an elastic member 865 that elastically supports the second support member 864, and a fixing member 866 that fixes the elastic member 865 to the support parts 833 and 843. It may include.
  • the protruding pieces 861 Since the second support member 864 is elastically supported by the elastic member 865, the protruding pieces 861 easily move into the space between the lower surfaces of the support parts 833 and 843 and the second support member 864. Can be inserted. In addition, after the protruding piece 861 is inserted into the space between the lower surfaces of the supporting portions 833 and 843 and the second supporting member 864, the elastic member 865 presses the second supporting member 864. Therefore, the protruding pieces 861 may be firmly fixed so as not to be separated from the space between the lower surfaces of the support parts 833 and 843 and the second support member 864.
  • the hook 851 is hooked member 853 in a state where the protrusion piece 861 is inserted into and fixed to the space between the lower surfaces of the support parts 833 and 843 and the second support member 864.
  • the support parts 833 and 843 and the picker modules 834 and 844 may be coupled to each other by a simple operation of pulling the ring 851 downward using the ring moving member 862.
  • the support parts 833 and 843 and the picker modules 834 and 844 may be more easily coupled to each other, so that the support parts 833 and 843 and the picker modules 834 and 844 support the parts 833 and 843.
  • the second support unit 870 is provided to guide the lower side and the upper side of the picker module (834, 844), that is, the upper side of the second plate (835, 845) in close contact with each other.
  • the second support unit 870 includes a protrusion bar 871 having a head 875 protruding from an upper side of the picker modules 834 and 844 and having a stepped portion, and a lower side of the support portions 833 and 843. It may include a locking plate (873) is formed in the head receiving portion 872 is inserted in the head 875 of the protrusion bar (871) and the head insertion hole 874 is inserted into the head 875 is formed.
  • the head 875 is accommodated in the head accommodation part 872 through the head insertion hole 874.
  • the stepped portion of the head 875 is caught by the locking plate 873 by the horizontal movement of the picker modules 834 and 844 relative to the support parts 833 and 843, thereby causing the picker module ( 834, 844 may be supported.
  • the second support unit 870 serves to fix the support parts 833 and 843 and the picker modules 834 and 844 together, among the first support unit 860 and the second support unit 870. It is also possible to have a configuration provided with only one.
  • a positioning unit 880 is provided between the support parts 833 and 843 and the picker modules 834 and 844 for determining the engagement position between the support parts 833 and 843 and the picker modules 834 and 844. It is preferable.
  • the positioning unit 880 has a protruding rod 881 protruding from the upper side surfaces of the picker modules 834 and 844, and a protruding rod 881 being embedded from the lower side of the support portions 833 and 843. It may include a protrusion rod insertion groove 882 is inserted. According to such a configuration, while the support parts 833 and 843 and the picker modules 834 and 844 are coupled to each other, the protrusions 881 are inserted into the protrusion bar insertion grooves 882 and the support parts 833 and 843. And coupling positions of the picker modules 834 and 844 may be determined.
  • the support part 833, 843 or the picker module 834, 844 includes a detection sensor 889 that detects that the lower side of the support part 833, 843 and the upper side of the picker module 834, 844 are in close contact with each other. It is preferred to be provided. In the drawings, a configuration in which the sensing sensor 889 is disposed on the lower surface of the support parts 833 and 843 is provided.
  • the present invention is not limited thereto, and the sensing sensor 889 is formed on the picker modules 834 and 844. It may be provided on the side.
  • the detection sensor 889 may be formed of a pressure sensor that detects surface contact. By using the detection sensor 889, it is possible to detect whether the lower side of the support parts 833 and 843 and the upper side of the picker modules 834 and 844 are in close contact with each other, and the support parts 833 and 843 according to the detection result. ) And the picker modules 834 and 844 may be coupled to each other.
  • the element pressing tools 830 and 840 move in the horizontal direction (Y axis direction) and the vertical direction (X axis direction), and the elements 1 mounted on the first shuttle part 610 and the second shuttle part 620. ) Is moved to the test socket 310 of the test unit, and the device 1 that has been tested is moved from the test socket 310 to the first shuttle unit 610 and the second shuttle unit 620.
  • Apparatus 801 is provided, and is provided with a first vertical movement apparatus 802 connected to the element pressing tools 830, 840, respectively, to move the element pressing tools 830, 840 in the vertical direction (Z-axis direction). do.
  • the horizontal moving device 801 is a connecting member 830b in which the support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 are constrained in the horizontal direction but are movable in the vertical direction. , 840b and a horizontal driver 803 for moving the connecting members 830b and 840b in a horizontal direction.
  • the support shafts 830a and 840a are connected to the connecting members 830b and 840b so that the movement of the supporting shafts 830a and 840a is constrained in the horizontal direction and can be movably connected in the vertical direction.
  • Through holes 830c and 840c into which the shafts 830a and 840a are inserted may be formed.
  • the support shafts 830a and 840a are inserted into the through holes 830c and 840c of the connecting members 830b and 840b, the movement of the support shafts 830a and 840a in the horizontal direction is connected to the connecting members 830b and 840b.
  • the through holes 830c and 840c may serve to guide the movement of the support shafts 830a and 840a in the vertical direction.
  • the horizontal driving unit 803 may include, for example, a belt 803a connected to the connection members 830b and 840b, a pulley 803b to which the belt 803a is wound, and a rotation motor connected to the pulley 803b. Not shown). According to such a configuration, the pulley 803b is rotated by the rotational force of the rotating motor (not shown), and the connecting members 830b and 840b connected to the belt 803a and the belt 803a by the rotation of the pulley 803b. Is moved in the horizontal direction, and thus, the support shafts 830a and 840a and the element pressing tools 830 and 840 connected to the connecting members 830b and 840b may be moved in the horizontal direction.
  • the belt 803a and the pulley 803b are provided as the horizontal driving unit 803, but the present invention is not limited thereto.
  • Various horizontal feed mechanisms can be used, such as actuating actuators, linear motors or ball screw devices.
  • the first vertical movement device 802 includes support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840, respectively, which are constrained in the vertical direction and movably connected in the horizontal direction.
  • Cam members moving blocks 830d, 840d
  • cam followers 830e, 840e
  • cam grooves 830f, 840f
  • 830g and 840g and lifting blocks 830h and 840h connected to the moving blocks 830d and 840d to guide the movement of the moving blocks 830d and 840d in the vertical direction.
  • Guide rails 830i and 840i are installed at the moving blocks 830d and 840d to be connected to ends of the support shafts 830a and 840a and extend in the horizontal direction to guide the movement of the support shafts 830a and 840a in the horizontal direction. Can be. Therefore, the support shafts 830a and 840a can be moved in the horizontal direction along the guide rails 830i and 840i.
  • the driving motors 830j and 840j are connected to the cam members 830g and 840g, respectively. Accordingly, the cam members 830g and 840g may be rotated by the driving motors 830j and 840j.
  • the cam members 830g and 840g may be provided in pairs so as to be connected to the pair of element pressing tools 830 and 840, respectively.
  • the cam grooves 830f and 840f are formed to include a first radius section and a second radius section having a constant radius, and a variable section connecting the first radius section and the second radius section.
  • the cam grooves 830f and 840f are configured as described above, when the cam followers 830e and 840e are in the first radius section having a small radius, the element pressing tools 830 and 840 are in a state of being positioned upward.
  • the cam follower 830e and 840e are in the variable section, the device pressing tools 830 and 840 are moved upward or downward, and the cam follower 830e and 840e have a larger radius than the first radius section. In the radial section, the device pressing tools 830 and 840 are maintained at the lower side.
  • the moving blocks 830d and 840d may be connected to the cam members 830g and 840g through the cam followers 830e and 840e being inserted into the cam grooves 830f and 840f.
  • the moving blocks 830d and 840d may be connected to the lifting guides 830h and 840h to move up and down. Accordingly, when the cam members 830g and 840g are rotated, the cam follower nodes 830e and 840e move vertically in accordance with the shape of the cam grooves 830f and 840f, and thus are connected to the cam follower nodes 830e and 840e.
  • the moving blocks 830d and 840d may be moved in the vertical direction, and the element pressing tools 830 and 840 connected through the moving blocks 830d and 840d and the support shafts 830a and 840a may be moved in the vertical direction. .
  • the elevating guides 830h and 840h may be fixed to the fixture 804 provided on the moving blocks 830d and 840d.
  • the present invention is not limited thereto, and various configurations may be used as the lifting guides 830h and 840h if the lifting blocks 830d and 840d can guide the lifting of the moving blocks 830d and 840d.
  • the device pressing tools 830 and 840 are moved in the horizontal direction by the horizontal moving device 801, and thus, between the first shuttle 610 and the test socket 310 and the second
  • the device pressing tools 830 and 840 may be moved in the horizontal direction between the shuttle 620 and the test socket 310.
  • the element pressing tools 830 and 840 are perpendicular to the upper portion of the first shuttle portion 610, the upper portion of the second shuttle portion 620, and the upper portion of the test socket 310 by the first vertical moving device 802.
  • the device 1 may be picked up or the device 1 may be loaded while being moved in the direction.
  • the device pressing tools 830 and 840 are moved vertically from the top of the test socket 310 and the device 1 is connected to the test socket 310 in order to firmly couple the device 1 to the test socket 310. Pressurizing with a constant force can be performed together.
  • the moving positions of the device pressing tools 830 and 840 in the vertical direction can be set accurately.
  • the pressing state of the device 1 against the test socket 310 must be maintained for a predetermined time.
  • the linear motor such as the rotary motor or the linear motor of the ball screw device
  • a relatively large voltage for pressurizing the element 1 is continued to the linear motor.
  • the cam members 830g and 840g are used, the pressing state of the device 1 against the test socket 310 is applied to the driving motors 830j and 840j. Regardless of the change in voltage, the cam member 830g may be maintained according to the shape of the second radius section of the cam members 830g and 840g.
  • the first vertical moving device 802 for moving the element pressing tools 830 and 840 in the vertical direction includes the cam members 830g and 840g
  • the cam members 830g and 840g are used. It is possible to save energy as compared to the case of using only a linear motor without moving.
  • the device 1 is pressurized by the test socket 310 so that the device 1 can be accurately tested so that the device 1 is pressurized according to the type of the device 1 being tested or the type of the test socket 310.
  • the pressing position at which the pickers 831, 841 of the tools 830, 840 should be positioned may be changed.
  • the horizontal moving device 801 and the first vertical moving device 802 connected to the element pressing tools 830 and 840 are lifted in the vertical direction.
  • the cam members 830g and 840g are rotated, and it is necessary to determine whether the pressing positions of the element pressing tools 830 and 840 coincide with the pressing positions to be set, that is, the reference positions.
  • the device inspection apparatus according to an embodiment of the present invention, as shown in Figure 20 and 21, the device pressing tools 830, 840, the horizontal moving device 801 and the first vertical moving device 802
  • the device pressing tools 830 and 840 are connected to the device pressing unit including a second vertical moving device 805 and a second vertical moving device 805 to move the device pressing unit linearly in the vertical direction.
  • Detecting the load applied to the test unit 300 by the second vertical moving device 805 when contacted with (300), and the element pressing tools (830, 840) when the detected load becomes a predetermined reference load It may include a controller 807 to determine the position of the pressing position.
  • the second vertical movement device 805 may also be connected to the first vertical movement device 802 and the horizontal movement device 801, and in this case, the first vertical movement device 802 and the horizontal movement device 801 may be together.
  • the second vertical moving device 805 may be lifted and, accordingly, the device pressing tools 830 and 840 may be lifted and lowered.
  • a portion of the device pressing tools 830 and 840 contacting the test unit 300 is a lower side of the picker modules 834 and 844 positioned around the pickers 831 and 841, that is, the picker support blocks 836 and 846. It can be the lower side of).
  • a portion of the lower side surfaces of the picker support blocks 836 and 846 which are in contact with the test unit 300 may be made of a metal such as aluminum.
  • a portion where the device pressing tools 830 and 840 contact each other in the test unit 300 may be an upper surface of the support frame 312 supporting the test socket 310.
  • a portion of the upper surface of the support frame 312 in which the element pressing tools 830 and 840 contact may be made of a metal such as aluminum.
  • the height of the support frame 312 is changed, By determining whether the lower surfaces of the device pressing tools 830 and 840 are in contact with the upper surface of the support frame 312, it may be determined whether the device 1 is located at the pressing position.
  • the device pressing tool 830 may be considered to include a sensor for detecting whether the lower side of the device pressing tool 830 is in contact with the upper side of the support frame 312, but in this case, the cost is dependent on the provision of the sensor There is an increasing disadvantage, and the configuration of the device pressing tools 830, 840 and the test socket 310 is complicated when considering the installation position of the sensor.
  • a control unit 807 which detects the load applied to the load and determines the positions of the element pressing tools 830 and 840 as the pressing positions when the detected load becomes a preset reference load.
  • the control unit 807 when the second vertical movement device 805 is a ball screw device including the motor 806 or a belt transfer mechanism connected to the motor 806 through the pulley, as shown in FIG. Likewise, it may be connected to the motor 806 to sense a load such as torque of the motor 806. According to such a configuration, when the device pressing tools 830 and 840 are lowered by the second vertical moving device 805 while the device pressing tools 830 and 840 are not in contact with the test unit 300, the control unit Although the amount of change in the load of the motor 806 detected by the 807 is not large, when the device pressing tools 830 and 840 are in contact with the test unit 300, the load detected by the controller 807 increases.
  • the controller 807 detects the load of the motor 806 and uses the sensed load to control the second vertical moving device 805 when the device pressing tools 830 and 840 are in contact with the test unit 300.
  • the load applied to the test unit 300 is detected, and the positions of the element pressing tools 830 and 840 when the detected load becomes the preset reference load are determined as the pressing positions.
  • the controller 807 may be configured to sense the load of the linear motor.
  • the first device pressing tool 830 of the device pressing tools 830 and 840 is positioned above the test unit 300 having a predetermined height, that is, above the support frame 312, and then the first device.
  • the first element pressing tool 830 is positioned at the lowest position where the first element pressing tool 830 can be lowered by the rotation of the cam member 830a by rotating the cam member 830g connected to the pressing tool 830. Let's do it.
  • the second vertical moving device 805 is operated to gradually lower the first device pressing tool 830 while gradually lowering the device pressing unit.
  • the controller 807 detects the load applied by the first device pressing tool 830 to the test unit 300 by sensing the load of the second vertical mobile device 805.
  • the first device pressing tool 830 As shown in FIGS. 20 and 21, as the first device pressing tool 830 is lowered by the second vertical moving device 805, the first device pressing tool 830 contacts the test unit 300. Accordingly, the load applied by the first device pressing tool 830 to the test unit 300 is changed. At this time, the controller 807 determines that the position of the first element pressing tool 830 coincides with the preset pressing position when the load applied by the first element pressing tool 830 to the test unit 300 becomes the reference load. Then, the operation of the second vertical transfer device 805 is stopped.
  • the process of setting the pressing position of the second device pressing tool 840 is performed by the first device pressing tool 830. It can be carried out in the same manner as the process of setting the pressing position of.
  • the element 1 is picked up by the element pressing tools 830 and 840 and pressed into the test socket 310. You can perform the test process.
  • the second vertical moving device 805 By operating the device pressing tools 830 and 840 are brought into contact with the test unit 300 and the load of the second vertical moving device 805 is sensed, and the detected load is applied to the test unit 300.
  • the pressing positions of the element pressing tools 830 and 840 are determined by determining the positions of the element pressing tools 830 and 840 as the pressing positions. Easy and accurate decision
  • the picking tools 881 of the loading transfer tools 810 and 814, the unloading transfer tools 820 and 824, or the device pressing tools 830 and 840 for transferring the device 1 are shown in FIG. 10.
  • Adsorption pads 892 made of rubber or the like are coupled to the ends of the device 1 to facilitate adsorption of the device 1. In this case, the suction pad 892 should be replaced.
  • the replacement of the adsorption pad 892 is made by hand in the conventional case, which is very inconvenient, such as separating the pickers 891 and replacing them one by one.
  • the present invention provides a suction pad 892 coupled to the pickers 891 of at least one of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840.
  • the picker 891 may include pickers provided in the loading transfer tools 810 and 814 and picking units provided in the unloading transfer tools 820 and 824 and pickers 831 and 841 provided in the element pressing tools 830 and 840. Can be.
  • the suction pad exchanger 900 considers the copper wire of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840.
  • the suction pad accommodating pads 910 and the suction pad accommodating pads 911 which are disposed at an appropriate position and have a plurality of suction pad accommodating spaces 911 into which the suction pads 892 of the picker 891 are inserted. It may include a suction pad pick-up unit 920 installed at least in part to pick up the suction pad accommodated in the suction pad accommodation space (911).
  • the suction pad accommodating parts 910 in which the suction pad pickup part 920 is installed may be separated from the pickers 891 by the pad pickup part 920 to accommodate the suction pad 892.
  • the adsorption pad accommodation space 911 is empty, and the adsorption pad accommodation portion 910 of at least some of the adsorption pad pickup portions 920 may be replaced with a new adsorption pad to be replaced with the picker 891 from which the adsorption pad 892 has been removed. 892) is inserted.
  • the suction pad accommodating part 910 is formed by a plurality of suction pads 892, so that the suction pads 892 are separated from the pickers 891 by the pad pick-up part 920, or the suction pads 892 are removed.
  • Various configurations are possible as a new suction pad 892 is inserted into the picker 891 to be replaced.
  • the suction pad accommodating part 910 may include a receiving part body 912 in which a plurality of suction pad accommodating spaces 911 are formed.
  • the accommodating part body 912 is a configuration in which the suction pad accommodating spaces 911 are formed, and various configurations are possible.
  • the adsorption pad accommodation space 911 is configured to accommodate the adsorption pad 892 separated from the picker 891 or to accommodate a new adsorption pad 892 to be coupled to the picker 891 from which the adsorption pad 892 is separated. If the suction pad 892 can be accommodated, various configurations such as grooves are possible.
  • the suction pad pick-up unit 920 is configured to separate the suction pad 892 from the pickers 891 by the pad pick-up unit 920.
  • the suction pad pick-up unit 920 is installed at the receiving unit body 912 so that the suction pad 892 is a picker.
  • Various configurations are possible, such as configured to pick up the suction pad 892 after being inserted into the suction pad accommodation space 911 in a state coupled to the 891.
  • the adsorption pad pick-up unit 920 may be configured in various ways according to its pickup method, such as pick-up / pick-up through locking and release, clamping using a ring-type clamper, and pick-up / release through clamping-release. Do.
  • the suction pad pick-up unit 920 may include a moving member 921 installed to be movable in a direction parallel to the upper surface, that is, in a horizontal direction, while covering the upper surface of the accommodating body 912. Can be.
  • the moving member 921 may be configured in various ways as a configuration for picking up / un-picking up through locking and releasing by horizontal movement.
  • the suction pad 892 may be used.
  • Is coupled to the picker 891 and the plurality of penetrating portions 922 are formed so as to be movable to the suction pad accommodation space 911 and are connected to each of the penetrating portions 922 and the suction pad 892.
  • the suction pad 892 may have a protrusion 892a which protrudes more than the outer circumferential surface of the picker 891, wherein the locking portion 923 is a picker (
  • the suction pad 892 may be larger than the outer circumferential surface of the 891 and smaller than the outer circumferential surface of the protrusion 892a so that the adsorption pad 892 may be caught when the picker 891 moves upward.
  • the movable member 921 of the suction pad pick-up unit 920 has a maximum radius of the suction pad 892 in consideration of the size of the radius of the picker 891 to which the suction pad 892 and the suction pad 892 are coupled.
  • a larger through portion 922 and a locking portion 923 having a smaller radius in at least a portion of the suction pad 892 the suction pad accommodation is accommodated when the suction pad 892 is inserted into the suction pad accommodation space 911.
  • the through portion 922 may be positioned on the space 911 and the catching portion 923 may be positioned when the suction pad 892 is separated from the picker 891.
  • the moving member 921 of the suction pad pick-up unit 920 is moved to the engaging and releasing position of the suction pad 892, although not shown in the various driving sources such as linear movement by a linear moving device The movement can be driven by this.
  • the adsorption pad 892 is moved to the adsorption pad accommodation unit 910 to which it is coupled to separate the adsorption pad 892 (FIGS. 23 to 25), and then the adsorption pad accommodation unit 910 where the new adsorption pad 892 is accommodated.
  • the new adsorption pad 892 is coupled (FIGS. 24 and 25) to complete the replacement of the adsorption pad 892, and then transfers the device 1.
  • the configuration of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840 for transferring the device 1 may be performed in advance in addition to the device inspection device.

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  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention discloses an apparatus for testing elements comprising: a loading portion on which at least one tray, on which a plurality of elements are loaded, is loaded; a test portion, which comprises a plurality of test sockets for testing each of the elements, for receiving the elements from the loading portion; an unloading portion for categorizing and loading the elements that are tested, depending on the result of the test carried out by the test portion; and at least one transport tool for transporting the elements between the loading portion, the test portion, and the unloading portion, wherein the transport tool comprises one pair of element pressing tools for delivering the elements from the loading portion to the test portion, or for delivering the elements from the test portion to the unloading portion, wherein the element pressing tools comprise a support portion which is movably installed, and at least one picker module which is detachably coupled to the support portion and to which at least one picker is coupled.

Description

소자검사장치Device inspection device
본 발명은 소자검사장치에 관한 것으로, 보다 상세하게는, 소자에 대한 전기적 특성을 검사하는 소자검사장치에 관한 것이다.The present invention relates to a device inspection device, and more particularly, to a device inspection device for inspecting the electrical characteristics of the device.
반도체소자(이하, '소자'라 한다)는 패키지공정을 마친 후 반도체소자 검사장치에 의하여 전기특성, 열이나 압력에 대한 신뢰성 검사 등 다양한 검사를 거친다.Semiconductor devices (hereinafter referred to as "devices") are subjected to various tests such as electrical properties, heat or pressure reliability test by the semiconductor device inspection device after the packaging process.
소자에 대한 검사는 메모리소자 또는 CPU (Central Processing Unit), GPU (Graphic Processing Unit) 등과 같은 비메모리소자, LED소자, 태양광소자 등 소자의 종류에 따라서 실온환경에서 수행하는 실온검사, 고온환경에서 수행되는 가열검사 등 다양한 검사들이 있다.The inspection of the device is carried out in the room temperature test or the high temperature environment according to the type of device such as the memory device or the non-memory device such as the CPU (Central Processing Unit) and the GPU (Graphic Processing Unit), the LED device and the solar device. There are various tests, such as the heating test being performed.
한편, 스마트폰, 스마트패드, 스마트TV 등 IT기기의 종류가 다양해지며 대중화됨에 따라 CPU 등과 같은 비메모리소자, 즉, LSI (Large Scale Integration)의 수요가 급증하고 있다.Meanwhile, as the types of IT devices such as smart phones, smart pads, and smart TVs are diversified and popularized, demand for non-memory devices such as CPUs, that is, large scale integration (LSI), is rapidly increasing.
그런데, LSI는 소량다품종의 특성으로 인하여 규격화된 메모리소자의 검사장치에 비하여 검사수량이 작아 고가의 검사장비의 사용이 어려운 문제점이 있다.However, LSI has a problem that it is difficult to use expensive inspection equipment because of the small quantity of inspection compared to the inspection apparatus of a standardized memory device due to the characteristics of small quantities of various kinds.
본 발명은 상기한 종래기술의 문제점을 해결하기 위한 것으로, 본 발명의 목적은, 소량다품종의 LSI소자에 대한 검사를 빠르게 수행하면서 다양한 종류의 LSI소자를 검사할 수 있는 소자검사장치를 제공하는 데에 있다.The present invention is to solve the above problems of the prior art, an object of the present invention is to provide a device inspection apparatus capable of inspecting a variety of LSI devices while performing a quick inspection for a small quantity of various types of LSI devices Is in.
또한, 본 발명의 다른 목적은, 소자를 픽업하여 테스트소켓으로 가압하는 소자가압툴의 수평방향으로의 이동 및 수직방향으로의 이동을 정확하게 수행할 수 있는 소자검사장치를 제공하는 데에 있다.In addition, another object of the present invention is to provide a device inspection apparatus that can accurately perform the movement in the horizontal direction and the vertical direction of the element pressing tool to pick up the element and press the test socket.
또한, 본 발명의 또 다른 목적은, 부품의 유지보수가 용이하게 구성함으로써 유지보수비용을 절감하여 소자의 생산비용을 현저하게 절감할 수 있는 소자검사장치를 제공하는 데에 있다.In addition, another object of the present invention is to provide a device inspection apparatus that can easily reduce the production cost of the device by reducing the maintenance cost by the easy maintenance of the components.
또한, 본 발명의 또 다른 목적은, 소자를 픽업하여 테스트소켓에 가압하기 위한 소자가압툴의 가압위치를 정확하게 설정 및 확인할 수 있는 소자검사장치를 제공하는 데에 있다.Further, another object of the present invention is to provide a device inspection apparatus capable of accurately setting and confirming a pressing position of an element pressing tool for picking up an element and pressing the test socket.
상기한 목적을 달성하기 위한 본 발명의 실시예에 따른 소자검사장치는 다수개의 소자들이 적재된 하나 이상의 트레이가 로딩되는 로딩부와; 상기 로딩부의 트레이로부터 로딩이송툴을 통해 소자들을 전달받아 임시로 적재하는 로딩버퍼부와; 상기 로딩버퍼부로부터 소자들을 전달받아 테스트를 수행하는 테스트부와; 상기 테스트부를 중심으로 상기 로딩버퍼부와 대향되는 위치에 설치되어 상기 테스트부에 의한 테스트가 완료된 소자들을 전달받는 언로딩버퍼부와; 상기 테스트부의 테스트결과에 따라서 상기 언로딩버퍼부에 적재된 소자들을 언로딩이송툴을 통해 분류하여 적재하는 언로딩부와; 상기 로딩부, 상기 테스트부 및 상기 언로딩부 사이에서 소자를 이송하는 하나 이상의 소자가압툴을 포함할 수 있다.Device inspection apparatus according to an embodiment of the present invention for achieving the above object is a loading unit is loaded with one or more trays loaded with a plurality of elements; A loading buffer unit which temporarily receives elements from a tray of the loading unit through a loading transfer tool and temporarily loads the elements; A test unit which receives the elements from the loading buffer unit and performs a test; An unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit; An unloading unit configured to classify and load elements loaded in the unloading buffer unit according to a test result of the test unit through an unloading transfer tool; The device may include one or more device pressing tools for transferring devices between the loading unit, the test unit, and the unloading unit.
또한, 본 발명의 실시예에 따른 소자검사장치는 다수개의 소자들이 적재된 하나 이상의 트레이가 로딩되는 로딩부와; 상기 로딩부로부터 소자들을 전달받아 각 소자의 테스트를 위한 복수의 테스트소켓들을 포함하는 테스트부와; 상기 테스트부의 테스트결과에 따라서 테스트를 마친 소자들을 분류하여 적재하는 언로딩부와; 상기 로딩부, 상기 테스트부 및 상기 언로딩부 사이에서 소자를 이송하는 하나 이상의 이송툴들을 포함하며, 상기 이송툴은 끝단에 흡착패드가 각각 결합된 복수의 픽커들을 포함하며, 상기 이송툴 중 적어도 어느 하나의 이송툴은 상기 픽커들에 각각 결합된 상기 흡착패드를 자동으로 교환할 수 있는 흡착패드교환부를 포함할 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading one or more trays are loaded with a plurality of devices; A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit; An unloading unit configured to classify and load the tested elements according to the test result of the test unit; At least one transfer tool for transferring the device between the loading unit, the test unit and the unloading unit, the transfer tool includes a plurality of pickers each coupled to the suction pad at the end, at least one of the transfer tools Any one transfer tool may include an adsorption pad exchange unit capable of automatically exchanging the adsorption pads respectively coupled to the pickers.
또한, 본 발명의 실시예에 따른 소자검사장치는 다수개의 소자들이 적재된 하나 이상의 트레이가 로딩되는 로딩부와; 상기 로딩부로부터 소자들을 전달받아 각 소자의 테스트를 위한 복수의 테스트소켓들을 포함하는 테스트부와; 상기 테스트부의 테스트결과에 따라서 테스트를 마친 소자들을 분류하여 적재하는 언로딩부와; 상기 로딩부, 상기 테스트부 및 상기 언로딩부 사이에서 소자를 이송하는 하나 이상의 이송툴들을 포함하며, 상기 테스트부의 일측에 설치되어 이동에 의하여 상기 테스트소켓을 복개한 상태에서 공기를 분사하여 상기 테스트소켓에서 이물질을 제거하기 위한 크리닝부를 추가로 포함할 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading one or more trays are loaded with a plurality of devices; A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit; An unloading unit configured to classify and load the tested elements according to the test result of the test unit; It includes one or more transfer tools for transferring the device between the loading unit, the test unit and the unloading unit, is installed on one side of the test unit by injecting air in the state in which the test socket is covered by the movement to the test It may further include a cleaning part for removing foreign matter from the socket.
또한, 본 발명의 실시예에 따른 소자검사장치는 복수의 소자가 로딩되는 로딩부와, 상기 로딩부로부터 이송된 소자에 대한 테스트를 수행하기 위한 복수의 테스트소켓이 마련되는 테스트부와; 상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부와; 상기 로딩부로부터 전달된 소자를 상기 테스트부 쪽으로 이송하고, 상기 테스트부로부터 전달된 소자를 상기 언로딩부 쪽으로 이송하는 하나 이상의 셔틀부를 포함하고, 상기 셔틀부는, 상기 소자가 탑재되는 셔틀플레이트와, 상기 셔틀플레이트가 탈착이 가능하게 결합되는 플레이트고정부와, 상기 플레이트고정부에 설치되어 상기 셔틀플레이트를 상기 플레이트고정부에 고정시키는 플레이트탈착부를 포함할 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading a plurality of devices, and a test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; And at least one shuttle unit for transferring the element transferred from the loading unit to the test unit and transferring the element transferred from the test unit to the unloading unit, wherein the shuttle unit includes: a shuttle plate on which the element is mounted; It may include a plate fixing portion to which the shuttle plate is detachably coupled, and a plate detachment portion installed on the plate fixing portion to fix the shuttle plate to the plate fixing portion.
또한, 본 발명의 실시예에 따른 소자검사장치는 다수개의 소자들이 적재된 하나 이상의 트레이가 로딩되는 로딩부와; 상기 로딩부로부터 소자들을 전달받아 각 소자의 테스트를 위한 복수의 테스트소켓들을 포함하는 테스트부와; 상기 테스트부의 테스트결과에 따라서 테스트를 마친 소자들을 분류하여 적재하는 언로딩부와; 상기 로딩부, 상기 테스트부 및 상기 언로딩부 사이에서 소자를 이송하는 하나 이상의 이송툴들을 포함하며, 상기 이송툴은 상기 로딩부로부터 소자들을 상기 테스트부로 전달하거나, 상기 테스트부로부터 상기 언로딩부로 소자를 전달하는 한 쌍의 소자가압툴들을 포함하며, 상기 소자가압툴들은 이동가능하게 설치되는 지지부와, 상기 지지부에 탈착가능하게 결합되며 하나 이상의 픽커들이 결합되는 하나 이상의 픽커모듈을 포함할 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading one or more trays are loaded with a plurality of devices; A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit; An unloading unit configured to classify and load the tested elements according to the test result of the test unit; And one or more transfer tools for transferring an element between the loading unit, the test unit, and the unloading unit, wherein the transfer tool transfers the elements from the loading unit to the test unit or from the test unit to the unloading unit. And a pair of device pressing tools for delivering the device, wherein the device pressing tools may include a support that is movably installed and one or more picker modules that are detachably coupled to the support and to which one or more pickers are coupled. .
본 발명의 실시예에 따른 소자검사장치는 복수의 소자가 로딩되는 로딩부와; 상기 로딩부로부터 이송된 소자에 대한 테스트를 수행하기 위한 복수의 테스트소켓이 마련되는 테스트부와; 상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부와; 상기 소자를 픽업하여 상기 테스트소켓으로 가압하는 소자가압부를 포함하고, 상기 소자가압부는, 상기 소자를 픽업하여 선형이동에 의하여 상기 소자를 가압위치로 이동시켜 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴과; 상기 소자가압툴과 연결되어 상기 소자가압툴을 상기 테스트소켓으로 이동시키는 수평이동장치와; 캠부재에 의하여 상기 소자가압툴을 가압위치로 수직으로 이동시키는 제1수직이동장치를 포함할 수 있다.Device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading a plurality of devices; A test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; An element pressing unit for picking up the element and pressing the test socket, wherein the element pressing unit picks up the element and moves the element to a pressing position by linear movement to press the element into the test socket and; A horizontal moving device connected to the element pressing tool to move the element pressing tool to the test socket; The cam member may include a first vertical moving device for vertically moving the element pressing tool to the pressing position.
또한, 본 발명의 실시예에 따른 소자검사장치는 복수의 소자가 로딩되는 로딩부와, 상기 로딩부로부터 이송된 소자에 대한 테스트를 수행하기 위한 복수의 테스트소켓이 마련되는 테스트부와, 상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부와, 상기 로딩부로부터 전달된 소자를 상기 테스트부 쪽으로 이송하고 상기 테스트부로부터 전달된 소자를 상기 언로딩부 쪽으로 이송하는 하나 이상의 셔틀부와, 상기 로딩부에서 소자를 픽업하여 상기 셔틀부로 전달하는 하나 이상의 로딩이송툴과; 상기 셔틀부에서 소자를 픽업하여 상기 언로딩부로 전달하는 하나 이상의 언로딩이송툴과; 상기 셔틀부에서 소자를 픽업하여 상기 테스트소켓으로 가압하고, 상기 테스트소켓에 가압되면서 테스트가 완료된 소자를 상기 셔틀부로 전달하는 하나 이상의 소자가압툴을 포함하고, 상기 소자가압툴은, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커가 결합되는 하나 이상의 픽커모듈을 포함하며, 상기 지지부 및 상기 픽커모듈의 일측에는 상기 지지부 및 상기 픽커모듈을 체결하는 체결유닛이 마련되고, 상기 지지부 및 상기 픽커모듈의 타측에는 상기 지지부에 상기 픽커모듈을 지지시키는 지지유닛이 마련될 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, the test unit is provided with a loading unit for loading a plurality of devices, a plurality of test sockets for performing a test on the device transferred from the loading unit, and the test The unloading unit for classifying the test-completed device according to the test result, and at least one shuttle for transferring the device transferred from the loading unit toward the test unit and the device transferred from the test unit toward the unloading unit And at least one loading transfer tool for picking up an element from the loading unit and transferring it to the shuttle unit; At least one unloading transfer tool for picking up the element from the shuttle unit and transferring the element to the unloading unit; At least one device pressing tool for picking up the device from the shuttle unit and pressurized to the test socket, the device is pressed to the test socket and delivers the completed test device to the shuttle unit, the device pressing tool is movable And a support unit to be installed and detachably coupled to the support unit, and at least one picker module to which at least one picker is coupled. A fastening unit for fastening the support unit and the picker module is provided at one side of the support unit and the picker module. The support unit may be provided on the other side of the support unit and the picker module to support the picker module.
또한, 본 발명의 실시예에 따른 소자검사장치는 복수의 소자가 로딩되는 로딩부와; 상기 로딩부로부터 이송된 소자에 대한 테스트를 위한 복수의 테스트소켓이 구비되는 테스트부와; 상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부와; 상기 소자를 픽업하는 픽커를 구비하고, 상기 소자를 픽업하여 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴을 포함하고, 상기 소자가압툴에는 상기 픽커에 의하여 픽업된 상기 소자를 가열하는 가열부가 구비될 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading a plurality of devices; A test unit provided with a plurality of test sockets for testing a device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; A picker for picking up the device, the pick-up device comprising one or more device pressing tools for picking up the device and forcing it to the test socket, wherein the device pressing tool includes a heating unit for heating the device picked up by the picker; Can be.
또한, 본 발명의 실시예에 따른 소자검사장치는 복수의 소자가 로딩되는 로딩부와; 상기 로딩부로부터 이송된 소자에 대한 테스트를 위한 복수의 테스트소켓들이 구비되는 테스트부와; 상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부와; 상기 소자를 픽업하여 선형이동에 의하여 상기 소자를 가압위치로 이동시켜 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴과, 캠부재에 의하여 상기 소자가압툴을 가압위치로 선형으로 이동시키는 제1수직이동장치를 포함하는 소자가압부와; 상기 테스트부에 대하여 상기 소자가압부를 선형으로 이동시키는 제2수직이동장치와; 상기 제2수직이동장치에 의하여 상기 소자가압툴이 상기 테스트부와 접촉되었을 때 상기 제2수직이동장치에 의하여 상기 테스트부에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때의 상기 소자가압툴의 위치를 가압위치로 결정하는 제어부를 포함할 수 있다.In addition, the device inspection apparatus according to an embodiment of the present invention includes a loading unit for loading a plurality of devices; A test unit including a plurality of test sockets for testing the device transferred from the loading unit; An unloading unit which classifies the device in which the test is completed in the test unit according to a test result; At least one element pressing tool for picking up the element and moving the element to the pressing position by linear movement and pressing the test socket, and a first vertical movement for linearly moving the element pressing tool to the pressing position by a cam member. An element pressing unit including an apparatus; A second vertical moving device which linearly moves the element pressing unit with respect to the test unit; When the element pressing tool is brought into contact with the test part by the second vertical moving device, the load applied to the test part by the second vertical moving device is detected, and when the detected load becomes a predetermined reference load. It may include a control unit for determining the position of the device pressing tool of the pressing position.
본 발명의 실시예에 따른 소자검사장치는, 소량다품종의 LSI소자에 대한 검사를 빠르게 수행하면서 다양한 종류의 LSI소자를 검사할 수 있는 이점이 있다.Device inspection apparatus according to an embodiment of the present invention, there is an advantage that can be inspected a variety of LSI devices while performing a quick test for a small amount of various types of LSI devices.
또한, 본 발명의 실시예에 따른 소자검사장치는, 소자를 픽업하여 테스트소켓으로 가압하는 소자가압툴을 수직방향으로 이동시키기 위한 제1수직이동장치가 캠부재를 포함하고, 캠부재의 회전에 의하여 소자가압툴이 수직방향으로 이동되도록 구성됨으로써, 소자가압툴의 수직방향으로의 이동위치가 정확하게 설정될 수 있는 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, the first vertical moving device for vertically moving the element pressing tool for picking up the element and pressurized by the test socket includes a cam member, the cam member is rotated The device pressing tool is configured to move in the vertical direction, whereby the position of the device pressing tool in the vertical direction can be accurately set.
또한, 본 발명의 실시예에 따른 소자검사장치는, 장치의 유지보수를 용이하게 구성함으로써 장치의 유비보수비용을 절감하여 소자의 생산비용을 현저하게 절감할 수 있는 이점이 있다.In addition, the device inspection apparatus according to the embodiment of the present invention has an advantage that the maintenance cost of the device can be easily configured, thereby reducing the cost of maintenance of the device and significantly reducing the production cost of the device.
또한, 본 발명의 실시예에 따른 소자검사장치는, 소자를 픽업하여 테스트소켓으로 가압하는 소자가압툴이, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커들이 결합되는 하나 이상의 픽커모듈을 구비함으로써 소자가압툴의 유지보수가 용이한 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, the device pressing tool for picking up the device to press the test socket, the support is installed so as to move, the support is detachably coupled to one or more pickers By having one or more picker modules to be coupled there is an advantage that the maintenance of the device pressing tool is easy.
또한, 본 발명의 실시예에 따른 소자검사장치는, 히터 및 상기 온도센서에 대한 전원공급 및 신호전달을 위한 하나 이상의 제1커넥터가 설치됨으로써 소자가압툴을 구성하는 지지부 및 픽커모듈의 결합 시 지지부에 설치된 제2커넥터와 자동으로 연결됨으로써 전원공급 및 신호전달을 위한 별도의 연결작업이 불필요하여 장치의 제조, 유지보수가 용이한 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, by supporting the heater and the one or more first connectors for power supply and signal transmission to the temperature sensor is installed, the support portion when the support unit and the picker module constituting the element pressing tool It is automatically connected to the second connector installed in the need for a separate connection work for power supply and signal transmission, there is an advantage of easy manufacturing and maintenance of the device.
또한, 본 발명의 실시예에 따른 소자검사장치는, 테스트부와 로딩버퍼부 사이의 소자교환 또는 테스트부와 언로딩버퍼부 사이의 소자교환을 위한 셔틀플레이트가 플레이트탈착부의 간단한 작동에 의하여 플레이트고정부에 탈착이 가능하게 구성되므로, 검사대상인 소자의 종류, 특히, 소자의 크기가 달라지는 경우 소자가 안착되는 셔틀플레이트가 용이하게 교체될 수 있는 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, the plate for the element replacement between the test portion and the loading buffer portion or the element exchange between the test portion and the unloading buffer portion plate by a simple operation of the plate detachment portion Since it is configured to be detachable from the government, there is an advantage that the shuttle plate on which the device is seated can be easily replaced when the type of device to be inspected, in particular, the size of the device is changed.
또한, 본 발명의 실시예에 따른 소자검사장치는, 소자를 픽업하여 테스트소켓으로 가압하는 소자가압툴의 픽커에 픽업된 소자를 가열하는 가열부가 구비됨으로써, 소자를 신속하게 가열할 수 있을 뿐만 아니라 소자의 온도하락을 최소화할 수 있고, 이에 따라, 소자의 검사를 정확하게 수행할 수 있는 이점이 있다.In addition, the device inspection apparatus according to the embodiment of the present invention is provided with a heating unit for heating the picked up element in the picker of the element pressing tool for picking up the element and pressurized by the test socket, it is possible to heat the element quickly The temperature drop of the device can be minimized, and accordingly, there is an advantage that the inspection of the device can be performed accurately.
또한, 본 발명의 실시예에 따른 소자검사장치는, 흡착패드의 교체를 위하여 장치의 작동을 멈추고 수작업에 의한 교체 후 장치가 재가동되는 종래기술에 비하여, 픽커로부터 흡착패드를 자동으로 교체할 수 있는 흡착패드교환부를 추가로 구비함으로써 장비의 생산성을 크게 향상시킬 수 있는 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention, the replacement of the suction pad to stop the operation of the device and after manual replacement, compared to the prior art that the device is restarted, it is possible to automatically replace the suction pad from the picker There is an advantage in that the productivity of the equipment can be greatly improved by additionally provided with a suction pad exchanger.
또한, 본 발명의 실시예에 따른 소자검사장치는, 테스트부의 일측에 설치되어 이동에 의하여 상기 테스트소켓을 복개한 상태에서 공기를 분사하여 상기 테스트소켓에서 이물질을 제거하기 위한 크리닝부를 추가로 포함함으로써 테스트소켓에 이물질이 존재하여 테스트의 오류 또는 테스트 작업이 불가능하게 되는 것을 방지하여 장치의 성능을 크게 향상시킬 수 있는 이점이 있다.In addition, the device inspection apparatus according to an embodiment of the present invention is installed on one side of the test unit by injecting air in a state in which the test socket is covered by the movement further comprises a cleaning unit for removing foreign matter from the test socket by The presence of foreign matter in the test socket prevents errors in the test or renders the test task impossible, thereby greatly improving the performance of the device.
도 1은 본 발명의 실시예에 따른 소자검사장치가 개략적으로 도시된 평면도이다.1 is a plan view schematically showing a device inspection apparatus according to an embodiment of the present invention.
도 2는 도 1의 소자검사장치에서, 로딩버퍼부 및 언로딩버퍼부의 플레이트부재의 일 예가 개략적으로 도시된 평면도이다.FIG. 2 is a plan view schematically illustrating an example of a plate member of a loading buffer unit and an unloading buffer unit in the device inspection apparatus of FIG. 1.
도 3은 도 1의 소자검사장치에서, 제1셔틀부 및 제2셔틀부가 개략적으로 도시된 단면도이다.3 is a cross-sectional view schematically showing the first shuttle unit and the second shuttle unit in the device inspection apparatus of FIG.
도 4는 도 3의 제1셔틀부 및 제2셔틀부에서, 셔틀플레이트를 플레이트고정부에 고정시키는 플레이트탈착부가 개략적으로 도시된 사시도이다.FIG. 4 is a perspective view schematically illustrating a plate detachment unit for fixing the shuttle plate to the plate fixing unit in the first shuttle unit and the second shuttle unit of FIG. 3.
도 5 및 도 6은 도 4의 플레이트탈착부의 작동을 설명하기 위한 개략도이다.5 and 6 are schematic diagrams for explaining the operation of the plate removable portion of FIG.
도 7은 도 1의 소자검사장치의 크리닝부가 개략적으로 도시된 단면도이다.7 is a schematic cross-sectional view of the cleaning unit of the device inspection apparatus of FIG. 1.
도 8은 도 1의 소자검사장치의 크리닝부가 개략적으로 도시된 평면도이다.8 is a plan view schematically illustrating a cleaning part of the device inspection apparatus of FIG. 1.
도 9는 도 1의 소자검사장치에 구비되는 소자가압툴이 도시된 단면도이다.FIG. 9 is a cross-sectional view illustrating a device pressing tool provided in the device inspecting apparatus of FIG. 1.
도 10은 도 9의 소자가압툴에 구비되는 픽커의 분해사시도이다.FIG. 10 is an exploded perspective view of a picker provided in the element pressing tool of FIG. 9. FIG.
도 11은 도 9의 소자가압툴의 지지부가 도시된 사시도이다.FIG. 11 is a perspective view illustrating a support of the device pressing tool of FIG. 9.
도 12는 도 9의 소자가압툴의 픽커모듈이 도시된 사시도이다.12 is a perspective view illustrating a picker module of the device pressing tool of FIG. 9.
도 13은 도 1의 소자가압툴에서, 지지부에 픽커모듈이 결합되는 작동을 설명하기 위한 단면도이다.FIG. 13 is a cross-sectional view illustrating an operation in which the picker module is coupled to a support part in the device pressing tool of FIG. 1.
도 14는 도 1의 소자검사장치에 구비되는 소자가압툴의 다른 예가 도시된 단면도이다.14 is a cross-sectional view showing another example of the element pressing tool provided in the device inspection apparatus of FIG.
도 15는 도 14의 소자가압툴의 일부를 확대한 단면도이다.FIG. 15 is an enlarged cross-sectional view of a part of the element pressing tool of FIG. 14.
도 16 및 도 17은 도 1의 소자검사장치에 구비되는 소자가압툴을 수평방향 및 수직방향으로 이동시키기 위한 수평이동장치 및 제1수직이동장치가 도시된 개략도이다.16 and 17 are schematic views illustrating a horizontal moving device and a first vertical moving device for moving the element pressing tool provided in the device inspecting apparatus of FIG. 1 in a horizontal direction and a vertical direction.
도 18은 도 1의 소자검사장치에 구비되는 소자가압툴을 수평방향으로 이동시키기 위한 수평이동장치가 개략적으로 도시된 횡단면도이다.FIG. 18 is a cross-sectional view schematically illustrating a horizontal moving device for moving the device pressing tool provided in the device inspecting apparatus of FIG. 1 in a horizontal direction.
도 19는 도 1의 소자검사장치에 구비되는 소자가압툴을 수직방향으로 이동시키기 위한 제1수직이동장치가 개략적으로 도시된 종단면도이다.19 is a longitudinal sectional view schematically showing a first vertical moving device for moving the device pressing tool provided in the device inspecting apparatus of FIG. 1 in a vertical direction.
도 20은 도 1의 소자검사장치에서, 소자가압툴의 가압위치를 설정하기 위한 구성이 도시된 개략도이다.20 is a schematic diagram showing a configuration for setting the pressing position of the element pressing tool in the element inspection apparatus of FIG.
도 21은 도 20의 구성 중 일부를 확대한 단면도이다.FIG. 21 is an enlarged cross-sectional view of a part of the configuration of FIG. 20. FIG.
도 22는 도 1의 소자검사장치에 구비되는 로딩이송툴, 언로딩이송툴 또는 소자가압툴에 설치되는 픽커의 흡착패드를 자동으로 교환하기 위한 흡착패드교환부가 도시된 사시도이다.FIG. 22 is a perspective view illustrating a suction pad exchanger for automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool provided in the device inspection apparatus of FIG. 1.
도 23 내지 도 25는 도 1의 소자검사장치에 구비되는 로딩이송툴, 언로딩이송툴 또는 소자가압툴에 설치되는 픽커의 흡착패드를 자동으로 교환하는 과정이 도시된 흡착패드교환부의 일부 단면도이다.23 to 25 are partial cross-sectional views of an adsorption pad exchanger showing a process of automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool provided in the device inspection apparatus of FIG. 1; .
도 26 및 도 27은 도 1의 소자검사장치에 구비되는 로딩이송툴, 언로딩이송툴 또는 소자가압툴에 설치되는 픽커의 흡착패드를 자동으로 교환하는 과정이 도시된 흡착패드교환부의 일부 평면도이다.FIG. 26 and FIG. 27 are partial plan views of a suction pad exchanger showing a process of automatically replacing a suction pad of a picker installed in a loading transfer tool, an unloading transfer tool, or an element pressing tool included in the device inspection apparatus of FIG. 1. .
이하, 첨부된 도면을 참조하여, 본 발명의 실시예에 따른 소자검사장치에 대하여 설명한다.Hereinafter, a device inspection apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.
도 1에 도시된 바와 같이, 본 발명의 실시예에 따른 소자검사장치는, 다수의 소자들(1)이 로딩되는 로딩부(100)와; 로딩부(100)로부터 전달된 소자들(1)을 테스트하는 테스트부(300)와; 테스트부(300)의 테스트결과에 따라 소자들(1)을 분류하여 적재하는 언로딩부(500)를 포함할 수 있다.As shown in Figure 1, the device inspection apparatus according to an embodiment of the present invention, the loading unit 100 is loaded with a plurality of devices (1); A test unit 300 for testing the elements 1 transferred from the loading unit 100; According to the test result of the test unit 300 may include an unloading unit 500 for classifying and loading the elements (1).
테스트의 대상이 되는 소자(1)는 메모리반도체나, CPU (Central Processing Unit), GPU (Graphics Processing Unit), 시스템 LSI (Large Scale Integration)와 같은 비메모리소자가 될 수 있다. 소자(1)는 비메모리소자, 특히, 저면에 볼형상의 접속단자들이 형성되는 소자가 될 수 있다.The device 1 to be tested may be a memory semiconductor or a non-memory device such as a central processing unit (CPU), a graphics processing unit (GPU), and a system large scale integration (LSI). The device 1 may be a non-memory device, in particular, a device in which ball-shaped connection terminals are formed on the bottom.
로딩부(100), 테스트부(300) 및 언로딩부(500) 사이에서 소자들(1)을 이송하는 방법은 다양한 방법에 의하여 수행될 수 있다.The method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 may be performed by various methods.
로딩부(100) 및 언로딩부(500)는 복수의 소자들(1)이 적재된 하나 이상의 트레이(2)가 로딩되는 구성으로서, 설계에 따라 다양한 구성이 가능하다. 로딩부(100) 및 언로딩부(500)에는 복수의 트레이들(2)이 적재될 수 있는 트레이적재부(미도시)가 설치될 수 있다.The loading unit 100 and the unloading unit 500 are configurations in which one or more trays 2 on which the plurality of elements 1 are loaded are loaded, and various configurations are possible according to design. The loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) in which a plurality of trays 2 may be loaded.
예를 들면, 로딩부(100)에는 소자들(1)이 연속적으로 픽업되어 이송될 수 있도록 복수의 트레이들(2)이 적절하게 배치된다. 그리고, 소자들(1)이 비워진 트레이(2)는 소자들(1)이 채워진 트레이(2)와 교체될 수 있다. 예를 들면, 일정 묶음의 트레이들(2)이 자동 또는 수동으로 트레이적재부로 로딩될 수 있다.For example, a plurality of trays 2 are properly disposed in the loading unit 100 so that the elements 1 can be picked up and transported continuously. In addition, the tray 2 in which the elements 1 are empty may be replaced with the tray 2 in which the elements 1 are filled. For example, a batch of trays 2 can be loaded into the tray loading section automatically or manually.
로딩부(100) 내에서 소자들(1)이 인출된 후의 빈 트레이(2)는 트레이전달부(미도시)에 의하여 언로딩부(500)로 이송될 수 있다. 또한, 빈 트레이(2)가 언로딩부(500)로 이송되기 전에 트레이(2)로부터 미처 인출되지 않은 소자(1)가 제거될 수 있도록, 트레이(2)가 트레이반전부(미도시)에서 회전(반전)될 수 있다.The empty tray 2 after the elements 1 are drawn out in the loading unit 100 may be transferred to the unloading unit 500 by a tray transfer unit (not shown). In addition, the tray 2 is disposed at the tray inverting portion (not shown) so that the element 1 that is not drawn out from the tray 2 can be removed before the empty tray 2 is transferred to the unloading portion 500. Can be rotated (inverted).
한편, 언로딩부(500)는 로딩부(100)와 유사하게 구성될 수 있다. 예를 들면, 언로딩부(500)에는, 소자들(1)이 테스트결과에 따라 연속적으로 분류되어 적재될 수 있도록, 복수의 빈 트레이들(2)이 분류등급에 따라 적절하게 배치될 수 있다. 언로딩부(500)에서, 테스트가 완료된 소자들(1)이 채워진 트레이(2)는 빈 트레이(2)와 교체될 수 있다.On the other hand, the unloading unit 500 may be configured similarly to the loading unit 100. For example, in the unloading unit 500, a plurality of empty trays 2 may be appropriately arranged according to the classification level so that the devices 1 may be classified and loaded in succession according to the test result. . In the unloading unit 500, the tray 2 filled with the tested devices 1 may be replaced with the empty tray 2.
또한, 로딩부(100)와 언로딩부(500) 사이에는, 빈 트레이(2)가 임시로 적재될 수 있도록, 빈 트레이(2)가 임시로 적재되는 트레이버퍼부(미도시)가 추가로 설치될 수 있다.In addition, between the loading part 100 and the unloading part 500, a tray buffer part (not shown) in which the empty tray 2 is temporarily loaded is additionally provided so that the empty tray 2 may be temporarily loaded. Can be installed.
트레이(2)에는 복수의 소자들(1)이 적재될 수 있도록 복수의 수용홈(2a)이 형성될 수 있다. 예를 들면, 복수의 수용홈(2a)은 트레이(2)에 8×16 등의 행렬로 형성될 수 있다.A plurality of receiving grooves 2a may be formed in the tray 2 so that the plurality of elements 1 may be loaded. For example, the plurality of receiving grooves 2a may be formed in the tray 2 in a matrix such as 8 × 16.
도 1 및 도 2에 도시된 바와 같이, 소자(1)가 이송되는 속도가 증가될 수 있도록, 또는 복수의 소자들(1)이 충분히 가열될 수 있도록, 로딩부(100)와 테스트부(300)의 사이에는 로딩부(100)의 트레이(2)로부터 전달된 소자들(1)이 임시로 적재되는 로딩버퍼부(200)가 설치될 수 있다. 그리고, 소자(1)가 이송되는 속도가 증가될 수 있도록, 테스트부(300)와 언로딩부(500)의 사이에는 테스트부(300)에 의하여 테스트가 완료된 소자들(1)이 임시로 적재되는 언로딩버퍼부(400)가 구비될 수 있다. 언로딩버퍼부(400)는 테스트부(300)를 중심으로 로딩버퍼부(200)와 대향되는 위치에 설치될 수 있다. 따라서, 테스트의 대상이 되는 소자(1)는 로딩부(100)로부터 이송되어 로딩버퍼부(200)에 임시로 적재된 후 테스트부(300)으로 이송될 수 있고, 테스트가 완료된 소자(1)는 테스트부(300)로부터 이송되어 언로딩버퍼부(400)에 임시로 적재된 후 언로딩부(500)로 이송될 수 있다.As shown in FIGS. 1 and 2, the loading unit 100 and the test unit 300 so that the speed at which the element 1 is conveyed may be increased, or the plurality of elements 1 may be sufficiently heated. Between the) may be installed a loading buffer 200 for temporarily loading the elements (1) transferred from the tray 2 of the loading unit 100. In addition, between the test part 300 and the unloading part 500, the devices 1 that have been tested by the test part 300 are temporarily loaded between the test part 300 and the unloading part 500 so that the speed at which the device 1 is transferred may be increased. The unloading buffer unit 400 may be provided. The unloading buffer unit 400 may be installed at a position opposite to the loading buffer unit 200 with respect to the test unit 300. Therefore, the device 1 to be tested may be transferred from the loading unit 100 and temporarily loaded in the loading buffer unit 200 and then transferred to the test unit 300. The test unit 300 may be transferred from the test unit 300 and temporarily loaded in the unloading buffer unit 400 and then transferred to the unloading unit 500.
특히, 로딩버퍼부(200) 및 언로딩버퍼부(500)에는 상대적으로 적은 수의 소자들(1)이 적재된 트레이(2)에 비하여 상대적으로 많은 수의 소자들(1)이 적재될 수 있다.In particular, the loading buffer unit 200 and the unloading buffer unit 500 may be loaded with a relatively large number of elements (1) compared to the tray (2) on which a relatively small number of elements (1) are loaded. have.
도 2에 도시된 바와 같이, 로딩버퍼부(200) 및 언로딩버퍼부(400)은, 복수의 소자들(1)이 적재될 수 있도록 상면에 다수의 적재홈들(211, 411)이 형성되는 판형상의 플레이트부재(210, 410)를 포함할 수 있다.As shown in FIG. 2, in the loading buffer unit 200 and the unloading buffer unit 400, a plurality of loading grooves 211 and 411 are formed on an upper surface of the loading buffer unit 200 and the unloading buffer unit 400. It may include a plate-shaped plate member (210, 410).
로딩버퍼부(200) 및 언로딩버퍼부(400)의 플레이트부재(210, 410)는 서로 거의 동일하게 구성될 수 있다. 다만, 소자(1)를 테스트하기 위하여 소자(1)를 가열(예열)할 필요가 있는 경우, 로딩버퍼부(200)의 플레이트부재(210)에는 히터와 같은 가열수단이 부가될 수 있다.The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be configured to be substantially identical to each other. However, when it is necessary to heat (preheat) the device 1 in order to test the device 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer part 200.
로딩버퍼부(200) 및 언로딩버퍼부(400)의 플레이트부재(210, 410)의 적재홈들(211, 411)은, 테스트부(300)의 테스트소켓들(310)의 간격에 맞게 배열될 수 있거나, 트레이(2)의 수용홈들(2a)의 간격에 맞게 배열될 수 있다.The loading grooves 211 and 411 of the plate buffers 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are arranged to be spaced apart from the test sockets 310 of the test unit 300. It may be arranged, or arranged in accordance with the interval of the receiving grooves (2a) of the tray (2).
예를 들면, 트레이(2)의 수용홈(2a)들의 간격과 로딩버퍼부(200) 및 언로딩버퍼부(400)의 플레이트부재(210, 410)의 적재홈(211, 411)들의 간격은 동일하게 하고, 테스트부(300)의 테스트소켓(310)들의 간격은 트레이(2)의 수용홈들(2a)의 간격보다 n배, 예를 들면, 2배로 형성될 수 있다.For example, the interval between the receiving grooves 2a of the tray 2 and the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer 200 and the unloading buffer 400 may be In the same manner, the spacing of the test sockets 310 of the test unit 300 may be formed n times, for example, twice the spacing of the receiving grooves 2a of the tray 2.
플레이트부재들(210, 410)은 소자들(1)을 임시로 적재하여 테스트부(300)와의 소자교환을 위한 구성으로서, 소자검사장치의 내부에서 고정된 상태로 설치되거나, 이동가능하게 설치되는 등 다양한 구성이 가능하다.The plate members 210 and 410 are elements for temporarily replacing the elements 1 and exchanging the elements with the test unit 300. The plate members 210 and 410 are installed in a fixed state within the device inspection apparatus or are movable. Various configurations are possible.
도 1에 도시된 바와 같이, 테스트부(300)는 로딩버퍼부(200)로부터 전달된 소자(1)를 테스트하기 위한 것으로, 테스트의 종류에 따라 다양한 구성이 가능하다. 테스트부(300)에는 소자(1)가 가압되는 복수의 테스트소켓들(310)이 설치된다. 예를 들면, 복수의 테스트소켓들(310)에는 전원과 연결되는 단자가 구비되고, 소자(1)가 단자에 가압되는 과정을 통하여 소자(1)에 대한 통전테스트가 수행될 수 있다.As shown in FIG. 1, the test unit 300 is for testing the device 1 transferred from the loading buffer unit 200, and various configurations are possible according to the type of test. The test unit 300 is provided with a plurality of test sockets 310 in which the device 1 is pressed. For example, a plurality of test sockets 310 may be provided with a terminal connected to a power source, and an energization test of the device 1 may be performed through a process in which the device 1 is pressed against the terminal.
테스트소켓들(310)은 8×2, 8×4 등 다양한 행렬로 배치될 수 있다. 테스트소켓(310)은, 소자(1)의 테스트를 위하여 소자(1)와 단자 사이의 연결을 위한 구성으로서, 다양한 구성이 가능하다. 이러한 테스트소켓(310)은 소자의 종류, 테스트 종류 등에 따라서 교체가 가능하게 설치될 수 있다.The test sockets 310 may be arranged in various matrices such as 8 × 2 and 8 × 4. The test socket 310 is a configuration for connection between the device 1 and the terminal for the test of the device 1, various configurations are possible. The test socket 310 may be installed to be replaced according to the type of device, the type of test.
한편, 테스트부(300)는 테스트소켓(310)과 나머지 구성이 모듈화된 독립적 구성이 될 수 있으며, 간단한 구성으로서 테스트소켓(310)이 설치된 PCB보드로 구현될 수 있다. 특히, 테스트부(300)가 테스트소켓(310)이 설치된 PCB보드로 구현되는 경우에는 테스트소켓(310)을 각 테스트 별로 특성화함으로써 상대적으로 고가인 테스트부(300)의 구성비용을 현저하게 절감할 수 있다.On the other hand, the test unit 300 may be an independent configuration in which the test socket 310 and the rest of the configuration is modular, it may be implemented as a PCB board with the test socket 310 is installed as a simple configuration. In particular, when the test unit 300 is implemented as a PCB board on which the test socket 310 is installed, the test socket 310 may be characterized by each test to significantly reduce the configuration cost of the relatively expensive test unit 300. Can be.
한편, 테스트부(300)에서는 다양한 테스트가 수행될 수 있다. 보다 바람직하게는, 테스트부(300)는 실온이상의 온도에서 소자(1)에 대한 테스트가 가능하게 구성될 수 있다.Meanwhile, various tests may be performed in the test unit 300. More preferably, the test unit 300 may be configured to test the device 1 at a temperature of room temperature or more.
테스트부(300)는 고온테스트 등 온도에 연관된 테스트의 경우, 온도변화를 최소화하기 위하여, 테스트소켓(310)를 포함하여 일부 영역을 둘러싸는 챔버부재가 그 주변에 설치될 수 있다.In the case of a test related to temperature, such as a high temperature test, the test unit 300 may include a chamber member surrounding a partial region including the test socket 310 to minimize temperature change.
한편, 테스트부(300)와 로딩버퍼부(200)의 사이 또는 테스트부(300)와 언로딩버퍼부(400) 사이의 소자교환은 직접 이루어지기보다는 로딩버퍼부(200)로부터 전달된 소자(1)를 테스트부(300) 쪽으로 이송하고 테스트부(300)로부터 전달된 소자(1)를 언로딩버퍼부(400) 쪽으로 이송하는 셔틀부(610, 620)에 의하여 이루어질 수 있다. 셔틀부(610, 620)는, 테스트부(300)와 로딩버퍼부(200) 사이의 소자교환 또는 테스트부(300)와 언로딩버퍼부(400) 사이의 소자교환을 위한 구성으로서 다양한 구성이 가능하다.On the other hand, element exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is not directly made, but the element transferred from the loading buffer unit 200 ( 1) may be made by the shuttle unit (610, 620) for transferring to the test unit 300 and the element 1 transferred from the test unit 300 toward the unloading buffer unit 400. The shuttle units 610 and 620 may be configured for element exchange between the test unit 300 and the loading buffer unit 200 or element exchange between the test unit 300 and the unloading buffer unit 400. It is possible.
예를 들면, 도 1 및 도 3에 도시된 바와 같이, 셔틀부(610, 620)는 로딩부(100)로부터 소자(1)를 전달받기 위한 제1소자전달위치, 테스트부(300)와 소자(1)를 교환하기 위한 소자교환위치 및 언로딩부(500)로 소자(1)를 전달하기 위한 제2소자전달위치 사이에서 이동되는 제1셔틀부(610)와, 로딩부(100)로부터 소자(1)를 전달받기 위한 제1소자전달위치, 테스트부(300)와 소자(1)를 교환하기 위한 소자교환위치 및 언로딩부(500)로 소자(1)를 전달하기 위한 제2소자전달위치의 사이에서 이동되는 제2셔틀부(620)를 포함할 수 있다. 여기에서, 제1소자전달위치, 소자교환위치 및 제2소자전달위치는 장치의 구성에 따라서 다양하게 배치될 수 있으며, 직선으로 순차적으로 배치될 수 있다.For example, as illustrated in FIGS. 1 and 3, the shuttle parts 610 and 620 may include a first device transfer position, a test unit 300, and a device for receiving the device 1 from the loading unit 100. (1) from the first shuttle unit 610 and the loading unit 100 to be moved between the element exchange position for replacing the element and the second element transfer position for transferring the element 1 to the unloading unit 500 A first device transfer position for receiving the device 1, a device exchange position for exchanging the device 1 with the test unit 300, and a second device for delivering the device 1 to the unloading unit 500. It may include a second shuttle portion 620 moved between the transfer position. Here, the first element transfer position, the element exchange position and the second element transfer position may be variously arranged according to the configuration of the device, it may be arranged sequentially in a straight line.
제1셔틀부(610) 및 제2셔틀부(620)는 테스트부(300)의 테스트소켓(310)을 사이에 두고 테스트소켓(310)의 양측에 배치될 수 있다. 제1셔틀부(610) 및 제2셔틀부(620)는, 테스트부(300)를 중심으로 서로 대향되게 설치되는 가이드레일(611, 621)과, 가이드레일(611, 621)을 따라 수평으로 이동되면서, 로딩버퍼부(200)로부터 소자를 전달받기 위한 제1소자전달위치, 테스트부(300)와의 소자교환위치, 언로딩버퍼부(400)로 소자를 전달하기 위한 제2소자전달위치를 번갈아 가면서 이동되며 소자들(1)이 적재되는 하나 이상의 셔틀플레이트(612, 622)와, 셔틀플레이트(612, 622)가 탈착가능하게 결합되며 가이드레일(611, 621)을 따라 이동되도록 설치된 플레이트고정부(613, 623)를 포함할 수 있다.The first shuttle 610 and the second shuttle 620 may be disposed at both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween. The first shuttle part 610 and the second shuttle part 620 are horizontally along the guide rails 611 and 621 and the guide rails 611 and 621 which are installed to face each other with respect to the test part 300. While moving, the first device transfer position for receiving the device from the loading buffer unit 200, the device exchange position with the test unit 300, the second device transfer position for delivering the device to the unloading buffer unit 400 One or more shuttle plates 612 and 622 which are alternately moved and on which the elements 1 are loaded, and the shuttle plates 612 and 622 are detachably coupled and installed to move along the guide rails 611 and 621. And may include governments 613 and 623.
가이드레일(611, 621)은 셔틀플레이트(612, 622)의 이동을 안내하기 위한 구성으로서 다양한 구성이 가능하다.The guide rails 611 and 621 may be configured to guide the movement of the shuttle plates 612 and 622.
셔틀플레이트(612, 622)에는, 테스트부(300)와 로딩버퍼부(200) 사이의 소자교환 또는 테스트부(300)와 언로딩버퍼부(400) 사이의 소자교환을 위하여, 소자(1)가 안착되는 하나 이상의 소자안착홈이 형성된다.In the shuttle plates 612 and 622, an element 1 is used for the element exchange between the test unit 300 and the loading buffer unit 200 or the element exchange between the test unit 300 and the unloading buffer unit 400. At least one device seating groove is formed.
플레이트고정부(613, 623)는 셔틀플레이트(612, 622)의 교체 편의를 위하여 설치된 구성으로서 다양한 구성이 가능하며, 소자(1)를 가열하기 위한 히터 등이 구비될 수 있다. 셔틀플레이트(612, 622)가 플레이트고정부(613, 623)에 탈착가능하게 설치되므로, 검사대상인 소자(1)의 종류, 특히, 소자(1)의 크기가 달라지는 경우 소자(1)가 안착되는 셔틀플레이트(612, 622)가 교체될 수 있다.The plate fixing parts 613 and 623 are provided for the convenience of replacing the shuttle plates 612 and 622, and various configurations are possible, and a heater for heating the device 1 may be provided. Since the shuttle plates 612 and 622 are detachably installed on the plate fixing parts 613 and 623, the device 1 is seated when the type of the device 1 to be inspected, in particular, the size of the device 1 is changed. Shuttle plates 612 and 622 may be replaced.
플레이트고정부(613, 623)에는 셔틀플레이트(612, 622)를 플레이트고정부(613, 623)에 탈착가능하게 고정시키는 플레이트탈착부(614, 624)가 구비될 수 있다. 플레이트탈착부(614, 624)는 플레이트고정부(613, 623)에서 셔틀플레이트(612, 622)의 탈착을 위한 구성으로서 다양한 구성이 가능하며, 간단한 수작업에 의하여 셔틀플레이트(612, 622)의 탈착이 가능하도록 구성될 수 있다.The plate fixing parts 613 and 623 may be provided with plate detachable parts 614 and 624 to detachably fix the shuttle plates 612 and 622 to the plate fixing parts 613 and 623. The plate detachable parts 614 and 624 are configured for detachment of the shuttle plates 612 and 622 from the plate fixing parts 613 and 623, and various configurations are possible, and the detachment of the shuttle plates 612 and 622 by simple manual operation is possible. This may be configured to enable.
예를 들면, 도 4 내지 도 6에 도시된 바와 같이, 플레이트탈착부(614, 624)는, 플레이트고정부(613, 623)에 고정되는 지지체(614a, 624a)와, 지지체(614a, 624a)에 구비된 제1힌지축(614c, 624c)을 통하여 회동이 가능하게 연결되고 회동에 의하여 셔틀플레이트(612, 622)를 선택적으로 고정하는 고정체(614b, 624b)와, 고정체(614b, 624b)를 제1힌지축(614c, 624c)에 탄성적으로 지지하는 탄성체(614d, 624d)와, 고정체(614b, 624b)와 접촉되며 고정체(614b, 624b)와 접촉되는 가압면이 곡면으로 형성되어 고정체(614b, 624b)를 가압하는 가압체(614i, 624i)와, 가압체(614i, 624i)와 연결되고 지지체(614a, 624a)의 내부에서 상하방향(Z축방향)으로 이동가능하게 설치되는 이동체(614e, 624e)와, 이동체(614e, 624e)에 구비된 제2힌지축(614f, 624f)에 회동이 가능하게 연결되는 핸들(614g, 624g)과, 지지체(614a, 624a)에 설치되어 핸들(614g, 624g)의 단부가 걸려 고정되는 고정걸이(614h, 624h)를 포함할 수 있다.For example, as illustrated in FIGS. 4 to 6, the plate detachable parts 614 and 624 include the supports 614a and 624a fixed to the plate fixing parts 613 and 623, and the supports 614a and 624a. Fixtures 614b and 624b which are pivotally connected via the first hinge shafts 614c and 624c and which selectively fix the shuttle plates 612 and 622 by rotation, and the fixtures 614b and 624b. ) Elastic bodies 614d and 624d elastically supporting the first hinge shafts 614c and 624c, and pressing surfaces in contact with the fixing bodies 614b and 624b and in contact with the fixing bodies 614b and 624b. And pressure members 614i and 624i which are formed and pressurize the fixtures 614b and 624b, and are connected to the pressure bodies 614i and 624i and are movable up and down (Z-axis direction) inside the supports 614a and 624a. The movable bodies 614e and 624e which are installed in such a manner, the handles 614g and 624g rotatably connected to the second hinge shafts 614f and 624f provided in the movable bodies 614e and 624e, and the support bodies 614a and 624a. Installed in It may comprise a fixed hook (614h, 624h) which end is fixed hanging of the handle (614g, 624g).
고정체(614b, 624b)는 대략 알파벳 'L'자 형으로 절곡된 형상으로 형성될 수 있으며, 절곡된 부분이 셔틀플레이트(612, 622)의 모서리에 접촉되는 것에 의하여 셔틀플레이트(612, 622)가 플레이트고정부(613, 623)에 고정될 수 있다.The fixtures 614b and 624b may be formed in a shape that is bent in an approximately 'L' shape, and the bent portions may contact the edges of the shuttle plates 612 and 622 so that the shuttle plates 612 and 622 may be formed. Can be fixed to the plate fixing parts (613, 623).
탄성체(614d, 624d)로는, 예를 들면, 토션스프링이 사용될 수 있다.As the elastic bodies 614d and 624d, for example, a torsion spring may be used.
고정걸이(614h, 624h)는 작업자가 핸들(614g, 624g)을 회동시키는 것에 의하여 핸들(614g, 624g)의 단부가 걸려 고정되거나 핸들(614g, 624g)의 단부의 걸림이 해제될 수 있을 정도로 형성되는 것이 바람직하다.The fixed hooks 614h and 624h are formed so that the end of the handles 614g and 624g can be caught and fixed by the worker rotating the handles 614g and 624g or the end of the handles 614g and 624g can be released. It is preferable to be.
이러한 구성에 따르면, 핸들(614g, 624g)의 변위에 따라 이동체(614e, 624e)가 상하방향으로 이동하는 것에 의하여 가압체(614i, 624i)가 상하방향으로 이동하며, 이에 따라, 고정체(614b, 624b)와 접촉되는 가압체(614i, 624i)의 가압면의 곡면의 형상에 따라 고정체(614b, 624b)의 자세가 변경될 수 있다. 고정체(614b, 624b)의 자세가 변경되는 경우에는 탄성체(614d, 624d)의 탄성력에 의하여 고정체(614b, 624b)의 자세가 일정하게 유지될 수 있다.According to this configuration, the pressing bodies 614i and 624i move in the vertical direction by moving the moving bodies 614e and 624e in accordance with the displacement of the handles 614g and 624g, and thus the fixed body 614b. The postures of the fixing bodies 614b and 624b may be changed according to the shape of the curved surface of the pressing surfaces of the pressing bodies 614i and 624i in contact with the 624b. When the postures of the fixing bodies 614b and 624b are changed, the postures of the fixing bodies 614b and 624b may be kept constant by the elastic force of the elastic bodies 614d and 624d.
그리고, 이동체(614e, 624e)의 상하방향으로의 이동은 제2힌지축(614f, 624f)을 중심으로 하는 핸들(614g, 624g)의 회동에 의하여 수행될 수 있다. 한편, 핸들(614g, 624g)이 고정걸이(614h, 624h)에 걸리는 경우에는 핸들(614g, 624g)의 회동이 제한되고, 이에 따라, 이동체(614e, 624e) 및 가압체(614i, 624i)의 상하방향으로의 이동이 제한되므로, 고정체(614b, 624b)의 자세가 임의대로 변경되는 것이 방지될 수 있다.In addition, the movement of the movable bodies 614e and 624e in the vertical direction may be performed by the rotation of the handles 614g and 624g around the second hinge axes 614f and 624f. On the other hand, when the handles 614g and 624g are caught by the fixed hooks 614h and 624h, the rotation of the handles 614g and 624g is limited, and accordingly, the movements of the moving bodies 614e and 624e and the pressing bodies 614i and 624i are restricted. Since the movement in the vertical direction is limited, the postures of the fixing bodies 614b and 624b can be prevented from being changed arbitrarily.
도 5에 도시된 바와 같이, 셔틀플레이트(612, 622)가 고정체(614b, 624b)에 의하여 고정된 상태에서, 핸들(614g, 624g)을 제2힌지축(614f, 624f)을 중심으로 고정걸이(614h, 624h)로부터 이탈되는 방향(도 5에서의 시계방향)으로 회동시키면, 탄성체(614d, 624d)의 탄성력이 가압체(614i, 624i) 및 이동체(614e, 624e)에 작용되면서, 가압체(614i, 624i) 및 이동체(614e, 624e)가 하측방향으로 이동하고, 고정체(614b, 624b)에 접촉되는 가압체(614i, 624i)의 가압면의 위치가 변경되면서, 고정체(614b, 624b)가 탄성체(614d, 624d)의 탄성력에 의하여 제1힌지축(614c, 624c)을 중심으로 셔틀플레이트(612, 622)로부터 이탈되는 방향(도 5에서의 시계방향)으로 회전되며, 이에 따라, 도 6에 도시된 바와 같이, 셔틀플레이트(612, 622)의 고정이 해제될 수 있다.As shown in FIG. 5, with the shuttle plates 612 and 622 fixed by the fixing bodies 614b and 624b, the handles 614g and 624g are fixed about the second hinge axes 614f and 624f. When rotating in the direction deviating from the hangers 614h and 624h (clockwise in FIG. 5), the elastic force of the elastic bodies 614d and 624d acts on the pressing bodies 614i and 624i and the moving bodies 614e and 624e, and pressurizes them. As the sieves 614i and 624i and the movable bodies 614e and 624e move downward, and the positions of the pressurizing surfaces of the urging bodies 614i and 624i that are in contact with the stationary bodies 614b and 624b are changed, the stationary bodies 614b. , 624b is rotated in a direction (clockwise in FIG. 5) from the shuttle plates 612 and 622 around the first hinge axes 614c and 624c by the elastic force of the elastic bodies 614d and 624d. Accordingly, as shown in FIG. 6, the fixing of the shuttle plates 612 and 622 may be released.
한편, 도 6에 도시된 바와 같이, 셔틀플레이트(612, 622)의 고정이 해제된 상태에서, 핸들(614g, 624g)을 제2힌지축(614f, 624f)을 중심으로 고정걸이(614h, 624h)로부터 걸리는 방향(도 6에서의 반시계방향)으로 회동시켜 고정걸이(614h, 624h)에 고정시키는 과정에서, 가압체(614i, 624i) 및 이동체(614e, 624e)가 상측방향으로 이동하고, 고정체(614b, 624b)에 접촉되는 가압체(614i, 624i)의 가압면의 위치가 변경되면서, 고정체(614b, 624b)가 제1힌지축(614c, 624c)을 중심으로 셔틀플레이트(612, 622)로 접촉되는 방향(도 6에서의 반시계방향)으로 회전되며, 이에 따라, 도 5에 도시된 바와 같이, 셔틀플레이트(612, 622)가 고정체(614b, 624b)에 의하여 고정될 수 있다. 그리고, 셔틀플레이트(612, 622)가 고정체(614b, 624b)에 의하여 고정된 상태에서는 탄성체(614d, 624d)의 탄성력이 고정체(614b, 624b)에 작용하므로, 고정체(614b, 624b)가 임의대로 회전되는 것이 방지될 수 있다.Meanwhile, as shown in FIG. 6, in the state in which the shuttle plates 612 and 622 are released, the handles 614g and 624g are centered on the second hinge shafts 614f and 624f to secure the hooks 614h and 624h. In the process of turning in the direction (counterclockwise direction in Fig. 6) to the fixed hook (614h, 624h), the pressing body (614i, 624i) and the moving body (614e, 624e) is moved upwards, As the positions of the pressing surfaces of the pressing bodies 614i and 624i in contact with the fixing bodies 614b and 624b are changed, the fixing bodies 614b and 624b are positioned around the first hinge shafts 614c and 624c. , 622 is rotated in a direction of contact (counterclockwise in FIG. 6), and thus, as shown in FIG. 5, the shuttle plates 612 and 622 may be fixed by the fixtures 614b and 624b. Can be. In the state where the shuttle plates 612 and 622 are fixed by the fixing bodies 614b and 624b, the elastic force of the elastic bodies 614d and 624d acts on the fixing bodies 614b and 624b, and thus the fixing bodies 614b and 624b. Can be prevented from rotating arbitrarily.
이와 같이, 본 발명의 실시예에 따르면, 셔틀플레이트(612, 622)를 플레이트고정부(613, 623)에 탈착가능하게 고정시키는 플레이트탈착부(614, 624)가 핸들(614g, 624g)을 회동시키는 간단한 작동에 의하여 셔틀플레이트(612, 622)의 고정 및 고정을 해제하는 작동을 수행할 수 있도록 구성됨으로써, 셔틀플레이트(612, 622)의 고정 및 고정을 해제하는 작동을 매우 간단하고 용이하게 수행할 수 있는 효과가 있다.As described above, according to the exemplary embodiment of the present invention, the plate detachable parts 614 and 624 that detachably fix the shuttle plates 612 and 622 to the plate fixing parts 613 and 623 rotate the handles 614g and 624g. It is configured to perform the operation of fixing and releasing the shuttle plates (612, 622) by a simple operation to make, the operation of fixing and releasing the shuttle plates (612, 622) very simple and easy to perform It can work.
한편, 테스트부(300)는 테스트소켓(310)에 이물질이 유입되는 등 테스트가 불가한 상황이 발생될 수 있는데, 이러한 경우에는, 소자검사장치의 가동을 멈추고 수작업에 의하여 이물질을 제거한 후 소자검사장치를 재가동하여야 하는 번거로움이 있었다.On the other hand, the test unit 300 may be a situation that can not be tested, such as foreign matter flowed into the test socket 310, in this case, the device inspection after stopping the operation of the device inspection device and removing the foreign matter by manual labor There was a hassle to restart the device.
따라서, 테스트부(300)의 일측에 설치되어 이동에 의하여 테스트소켓(310)를 복개한 상태에서 공기를 분사하여 테스트소켓(310)에서 이물질 등을 제거하기 위한 크리닝부(700)가 구비되는 것이 바람직하다.Therefore, the cleaning unit 700 is provided on one side of the test unit 300 to remove foreign matters from the test socket 310 by spraying air in a state where the test socket 310 is covered by movement. desirable.
크리닝부(700)로는 다양한 구성이 가능하다. 예를 들면, 도 7 및 도 8에 도시된 바와 같이, 크리닝부(700)는, 테스트소켓(310)을 복개하며 테스트소켓(310)의 상부에 크리닝공간을 형성하는 본체(710)와, 테스트부(300)의 일측 및 테스트소켓(310)의 상부 사이에서 본체(710)를 이동시키기 위한 구동부(720)를 포함할 수 있다.The cleaning unit 700 may be configured in various ways. For example, as shown in FIGS. 7 and 8, the cleaning unit 700 includes a main body 710 covering the test socket 310 and forming a cleaning space on the test socket 310, and a test. A driving unit 720 may be included to move the main body 710 between one side of the unit 300 and an upper portion of the test socket 310.
본체(710)는 테스트소켓(310)을 복개하며 테스트소켓(310)의 상부에 크리닝공간을 형성하는 구성으로서 다양한 구성이 가능하며, 밀폐된 크리닝공간을 형성하도록 그릇형상 등 다양한 형상을 가질 수 있으며, 각 테스트소켓(310)에 공기를 분사할 수 있도록 공기공급장치(미도시)와 연결되는 공기유로(711) 및 공기유로(711)로부터 공기를 전달받아 테스트소켓(310)에 공기를 분사하는 하나 이상의 노즐(712)이 설치될 수 있다.The main body 710 is configured to cover the test socket 310 and to form a cleaning space on the upper part of the test socket 310, and may have various configurations, and may have various shapes such as a bowl shape to form a closed cleaning space. To receive the air from the air passage 711 and the air passage 711 connected to the air supply device (not shown) to inject air to each test socket 310 to inject air to the test socket 310 One or more nozzles 712 may be installed.
아울러, 본체(710)는 노즐(712)을 통하여 분사된 공기와 함께 이물질이 크리닝공간으로부터 외부로 배출되도록 배출관(713)과 연결될 수 있다.In addition, the main body 710 may be connected to the discharge pipe 713 so that the foreign matter is discharged to the outside from the cleaning space with the air injected through the nozzle 712.
구동부(720)는 테스트부(300)의 일측 및 테스트소켓(310) 사이에서 본체(710)를 이동시키기 위한 구성으로서 유압실린더, 공압실린더 등 다양한 구성이 가능하다.The driving unit 720 is configured to move the main body 710 between one side of the test unit 300 and the test socket 310, and various configurations such as a hydraulic cylinder and a pneumatic cylinder are possible.
여기에서, 제1셔틀부(610) 및 제2셔틀부(620)에 가이드레일(611, 621)이 구비되는 경우에는, 크리닝부(700)는 제1셔틀부(610) 및 제2셔틀부(620)에 설치되어 구동부(720)는 본체(710)를 가이드레일(611, 621)과 평행한 방향으로 선형으로 이동시키도록 구성될 수 있다.Here, when the guide rails 611 and 621 are provided at the first shuttle part 610 and the second shuttle part 620, the cleaning part 700 may include the first shuttle part 610 and the second shuttle part. The driving unit 720 installed at 620 may be configured to linearly move the main body 710 in a direction parallel to the guide rails 611 and 621.
한편, 로딩부(100)와 셔틀부(610, 620)의 사이에서 이동되면서 로딩부(100)에서 소자(1)를 픽업하여 셔틀부(610, 620)로 전달하는 하나 이상의 로딩이송툴(810, 814)이 설치될 수 있다. 이와 같은 경우, 하나의 로딩이송툴(810, 814)이 로딩부(100)와 셔틀부(610, 620) 사이에서 이동하면서 로딩부(100)에서 소자(1)를 픽업하여 셔틀부(610, 620)로 전달하도록 구성될 수 있다. 그리고, 전술한 바와 같이, 로딩버퍼부(200)가 설치되는 경우, 로딩이송툴(810, 814)은 로딩부(100)에서 소자(1)를 픽업하여 로딩버퍼부(200)로 전달하는 제1로딩이송툴(810)과, 로딩버퍼부(200)에서 소자(1)를 픽업하여 셔틀부(610, 620)로 전달하는 제2로딩이송툴(814)을 포함할 수 있다.Meanwhile, one or more loading transfer tools 810 that are moved between the loading unit 100 and the shuttle units 610 and 620 and pick up the device 1 from the loading unit 100 and transfer them to the shuttle units 610 and 620. 814 may be installed. In this case, one loading transfer tool 810, 814 moves between the loading unit 100 and the shuttle units 610, 620 and picks up the element 1 from the loading unit 100 so that the shuttle unit 610, 620 may be configured to deliver. As described above, when the loading buffer unit 200 is installed, the loading transfer tools 810 and 814 may pick up the device 1 from the loading unit 100 and transfer it to the loading buffer unit 200. The first loading transfer tool 810 and the second loading transfer tool 814 for picking up the device 1 from the loading buffer unit 200 and transferring the elements 1 to the shuttle units 610 and 620.
또한, 셔틀부(610, 620)와 언로딩부(500) 사이에서 이동되면서 셔틀부(610, 620)에서 소자(1)를 픽업하여 언로딩부(500)로 전달하는 하나 이상의 언로딩이송툴(820, 824)이 설치될 수 있다. 이와 같은 경우, 하나의 언로딩이송툴(820, 824)이 셔틀부(610, 620)와 언로딩부(500) 사이에서 이동하면서 셔틀부(610, 620)에서 소자(1)를 픽업하여 언로딩부(500)로 전달하도록 구성될 수 있다. 그리고, 전술한 바와 같이, 언로딩버퍼부(400)가 설치되는 경우, 언로딩이송툴(820, 824)은 언로딩버퍼부(400)에서 소자(1)를 픽업하여 언로딩부(500)으로 전달하는 제1언로딩이송툴(820)과, 셔틀부(610, 620)에서 소자(1)를 픽업하여 언로딩버퍼부(400)로 전달하는 제2언로딩이송툴(824)을 포함할 수 있다.In addition, at least one unloading transfer tool which is moved between the shuttle unit 610, 620 and the unloading unit 500 to pick up the device (1) from the shuttle unit (610, 620) and transfer it to the unloading unit 500 820 and 824 may be installed. In this case, one unloading transfer tool 820, 824 moves between the shuttle portions 610, 620 and the unloading portion 500, picking up the element 1 from the shuttle portions 610, 620 and unloading it. It may be configured to deliver to the loading unit 500. As described above, when the unloading buffer unit 400 is installed, the unloading transfer tools 820 and 824 pick up the element 1 from the unloading buffer unit 400 to unload the unit 500. And a second unloading transfer tool 824 for picking up the device 1 from the shuttle parts 610 and 620 and transferring the picked-up element 1 to the unloading buffer part 400. can do.
로딩이송툴(810, 814) 및 언로딩이송툴(820, 824)은 서로 동일하거나 유사하게 구성될 수 있다. 로딩이송툴(810, 814) 및 언로딩이송툴(820, 824)에는 각각 소자(1)를 이송하기 위한 구성으로서, 소자(1)를 픽업하는 복수의 픽커들 및 상하방향(Z방향) 및 수평방향(X-Y방향) 등으로 복수의 픽커들의 이동을 구동하기 위한 구동장치를 포함할 수 있다.The loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824 may be identical or similar to each other. Each of the loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824 is configured to transfer the element 1, and includes a plurality of pickers and a vertical direction (Z direction) and It may include a driving device for driving the movement of the plurality of pickers in the horizontal direction (XY direction) or the like.
픽커는 소자(1)를 픽업하여 소정의 위치로 이송하기 위한 구성으로서, 다양한 구성이 가능하며 소자(1)의 상면에 진공압을 형성하는 흡착패드 및 흡착패드에 공압을 전달하는 공압실린더로 구성될 수 있다.The picker is a component for picking up the element 1 and transporting it to a predetermined position. Various picks are possible, and the picker is composed of a suction pad for forming a vacuum pressure on the upper surface of the element 1 and a pneumatic cylinder for delivering pneumatic pressure to the suction pad. Can be.
픽커들은 로딩부(100) 및 언로딩부(500)의 트레이(2)의 수용홈들(2a)의 간격 및 로딩버퍼부(200)와 언로딩버퍼부(400)의 플레이트부재(210, 410)들의 적재홈(211, 411)들의 간격이 서로 다른 경우를 고려하여 가로 및 세로 간격의 조절이 가능하도록 구성될 수 있으나, 보다 많은 수의 반도체소자(10)들의 이송이 가능하도록 가로 및 세로 간격이 고정될 수 있다.The pickers may be disposed between the receiving grooves 2a of the tray 2 of the loading unit 100 and the unloading unit 500, and the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400. Considering the case where the spacing of the loading grooves 211 and 411 of the plurality of windows is different from each other, the horizontal and vertical spacing may be adjusted. Can be fixed.
복수의 픽커들을 이동시키는 구동장치는 픽커들의 구동태양에 따라서 다양한 구성이 가능하며, 픽커들을 상하로 이동시키기 위한 상하이동장치 및 좌우방향으로 이동하기 위한 좌우이동장치를 포함하여 구성될 수 있다. 상하이동장치는 픽커들 전체를 한꺼번에 상하로 이동시키도록 구성되거나, 각 픽커들이 독립적으로 상하로 이동되도록 각 픽커들과 개별적으로 연결될 수 있다. 좌우이동장치는 픽커들의 이동태양에 따라서 다양한 구성이 가능하며, X방향 또는 Y방향으로의 단일방향의 이동, 또는 X-Y방향 이동이 가능하도록 구성될 수 있다.The driving device for moving the plurality of pickers may be configured in various ways according to the driving aspect of the pickers, and may include a moving device for moving the pickers up and down and a left and right moving device for moving in the left and right directions. The moving device may be configured to move all the pickers up and down at once, or may be individually connected to each picker so that each picker is moved up and down independently. The left and right moving apparatuses can be configured in various ways according to the movement mode of the pickers, and can be configured to allow a single direction movement in the X direction or the Y direction, or the X-Y direction movement.
한편, 테스트부(300)와 셔틀부(610, 620) 사이에서 이동되면서 셔틀부(610, 620)에서 소자(1)를 픽업하여 테스트소켓(310)으로 가압하고, 테스트소켓(310)에 가압되어 테스트가 완료된 소자를 셔틀부(610, 620)으로 전달하는 소자가압툴(830, 840)이 설치될 수 있다. 소자가압툴(830, 840)은 테스트부(300)와 제1셔틀부(610) 사이 및 테스트부(300)와 제2셔틀부(620) 사이에서 소자(1)를 이송하기 위한 구성으로서, 소자(1)의 이송태양에 따라서 다양한 구성이 가능하다. 소자가압툴(830, 840)은, 제1셔틀부(610)와 테스트부(300) 사이에서 이동하면서 제1셔틀부(610)에서 소자(1)를 픽업하여 테스트소켓(310)으로 가압하고 테스트소켓(310)에 가압되어 테스트가 완료된 소자를 제1셔틀부(610)로 전달하는 제1소자가압툴(830)과, 제2셔틀부(620)와 테스트부(300) 사이에서 이동하면서 제2셔틀부(620)에서 소자(1)를 픽업하여 테스트소켓(310)으로 가압하고 테스트소켓(310)에 가압되어 테스트가 완료된 소자를 제2셔틀부(620)로 전달하는 제2소자가압툴(840)을 포함할 수 있다. 이와 같이, 소자가압툴(830, 840)이 한 쌍으로 구성되는 경우에는, 소자교환의 편의를 위하여, 한 쌍의 소자가압툴(830, 840)이 서로 연동하여 이동될 수 있다.On the other hand, while moving between the test unit 300 and the shuttle unit (610, 620) to pick up the element (1) from the shuttle unit (610, 620) and pressurized by the test socket 310, pressurized on the test socket 310 The device pressing tools 830 and 840 may be installed to transfer the tested devices to the shuttle units 610 and 620. The device pressing tools 830 and 840 are components for transferring the device 1 between the test unit 300 and the first shuttle unit 610 and between the test unit 300 and the second shuttle unit 620. Various configurations are possible according to the transfer mode of the element 1. The device pressing tools 830 and 840 may pick up the device 1 from the first shuttle 610 and press the test socket 310 while moving between the first shuttle 610 and the test unit 300. While moving between the first element pressing tool 830 and the second shuttle unit 620 and the test unit 300, which is pressed by the test socket 310 and transfers the tested element to the first shuttle unit 610. Picking up the device 1 from the second shuttle unit 620 and pressing the test socket 310 and the second device pressurized by the test socket 310 to transfer the completed device to the second shuttle unit 620 Tool 840 may be included. As such, when the element pressing tools 830 and 840 are configured in a pair, the pair of element pressing tools 830 and 840 may be moved in cooperation with each other for the convenience of element replacement.
예를 들면, 도 9 내지 도 15에 도시된 바와 같이, 소자가압툴(830, 840)은 로딩이송툴(810, 814) 및 언로딩이송툴(820, 824)과 서로 동일하거나 유사한 구조를 가질 수 있다. 소자가압툴(830, 840)은, 소자(1)를 픽업하는 복수의 픽커들(831, 841)을 포함할 수 있다.For example, as shown in FIGS. 9 to 15, the device pressing tools 830 and 840 may have the same or similar structure as that of the loading transfer tools 810 and 814 and the unloading transfer tools 820 and 824. Can be. The device pressing tools 830 and 840 may include a plurality of pickers 831 and 841 picking up the device 1.
한편, 플레이트부재(210, 410)와 테스트부(300) 사이의 소자교환이 용이하게 수행될 수 있도록, 플레이트부재(210, 410)의 적재홈들(211, 411) 사이의 간격은 소자가압툴(830, 840)의 픽커(831, 841)들의 간격의 1/n, 예를 들면, 1/2로 형성될 수 있다. 여기서 n은 2 이상의 자연수이다.On the other hand, the gap between the loading grooves 211 and 411 of the plate members 210 and 410 is a device pressing tool so that the device exchange between the plate members 210 and 410 and the test unit 300 can be easily performed. 1 / n, for example, 1/2 of the interval of the pickers (831, 841) of (830, 840). N is a natural number of two or more.
특히, 언로딩버퍼부(400)의 플레이트부재(210, 410)의 적재홈(211, 411)들이 16×8로 배치되고, 테스트부(300)의 테스트소켓(310)들이 8×4로 배치된 경우, 소자가압툴(830, 840)은 테스트부(300)의 테스트소켓(310)들에 대응되는 간격으로 8×4로 배치된 픽커(831, 841)들을 포함함으로써 한번에 8×4의 소자들(1)을 이송할 수 있게 된다. 특히, 보다 많은 수의 반도체소자(10)들의 이송이 가능하도록, 제1로딩이송툴(810)의 픽커들이 8×4(8×2)로 배치된 경우 소자가압툴(830, 840)의 픽커(831, 841)들은 8×4(8×2)로 배치될 수 있다.In particular, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are disposed at 16 × 8, and the test sockets 310 of the test unit 300 are disposed at 8 × 4. In this case, the device pressing tools 830 and 840 include pickers 831 and 841 arranged at 8 × 4 at intervals corresponding to the test sockets 310 of the test unit 300 so that 8 × 4 devices at a time. It is possible to transport the field (1). In particular, the pickers of the device pressing tools 830 and 840 when the pickers of the first loading transfer tool 810 are arranged in 8 × 4 (8 × 2) so as to enable the transfer of a larger number of semiconductor devices 10. 831 and 841 may be arranged in 8 × 4 (8 × 2).
또한, 소자가압툴(830, 840)은 로딩버퍼부(200) 및 언로딩버퍼부(400)의 플레이트부재(210, 410)의 적재홈(211, 411)들에 소자(1)를 한 칸씩 건너뛰어 인출하거나 적재함으로써 픽커(831, 841)들 간의 간격조절이 불필요하여 소자이송을 빠르게 할 수 있다.In addition, the element pressing tools 830 and 840 each place the element 1 into the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400. By skipping and withdrawing or stacking, it is unnecessary to adjust the gap between the pickers 831 and 841, thereby speeding up device transfer.
한편, 소자가압툴(830, 840)은 소자(1)의 종류, 크기 등에 따라서 픽커(831, 841)의 교체가 필요하다.Meanwhile, the element pressing tools 830 and 840 need to replace the pickers 831 and 841 according to the type and size of the element 1.
따라서, 도 9 내지 도 15에 도시된 바와 같이, 소자가압툴(830, 840)은, 소자검사장치의 내부에서 이동가능하게 설치되는 지지부(833, 843)와, 지지부(833, 843)에 탈착가능하게 결합되며 하나 이상의 픽커(831, 841)가 결합되는 하나 이상의 픽커모듈(834, 844)을 포함할 수 있다.Accordingly, as shown in FIGS. 9 to 15, the element pressing tools 830 and 840 are attached to and detached from the supports 833 and 843 and the supports 833 and 843 movably installed in the device inspection apparatus. It may comprise one or more picker modules 834, 844 that are possibly coupled and to which one or more pickers 831, 841 are coupled.
지지부(833, 843)는 픽커모듈(834, 844)을 지지할 수 있는 구성이면 어떠한 구성도 가능하다. 지지부(833, 843)에는 픽커모듈(834, 844)이 탈착가능하게 고정될 수 있도록 하측면이 평면인 제1지지플레이트(833a, 843b)가 구비될 수 있다.The supporting members 833 and 843 may have any configuration as long as the supporting members 833 and 843 can support the picker modules 834 and 844. The support parts 833 and 843 may be provided with first support plates 833a and 843b having a flat lower surface such that the picker modules 834 and 844 may be detachably fixed.
픽커모듈(834, 844)은, 제1지지플레이트(833a, 843b)의 하측면에 밀착되는 상측면을 가지는 제2지지플레이트(835, 845)와, 제2지지플레이트(835, 845)에 결합되는 댐퍼(839, 849)와, 댐퍼(839, 849)에 결합되는 히팅블럭(838, 848)과, 히팅블럭(838, 848)에 결합되는 픽커지지블럭(836, 846)과, 픽커지지블럭(836, 846)에 고정되는 픽커(831, 841)를 포함할 수 있다.The picker modules 834 and 844 are coupled to the second support plates 835 and 845 and the second support plates 835 and 845 having an upper side in close contact with the lower sides of the first support plates 833a and 843b. Dampers 839 and 849, heating blocks 838 and 848 coupled to the dampers 839 and 849, picker support blocks 836 and 846 coupled to the heating blocks 838 and 848, and picker support blocks. And pickers 831 and 841 secured to 836 and 846.
도 10에 도시된 바와 같이, 픽커(831, 841)는, 픽커지지블럭(836, 846)에 고정되는 중공의 결합부재(891)와, 결합부재(891)의 단부에 탈착가능하게 결합되는 중공의 흡착패드(892)로 구성될 수 있다. 흡착패드(892)는 결합부재(891)의 외주면보다 더 돌출된 돌출부(892a)가 형성될 수 있다. 결합부재(891)는 픽커지지블럭(836, 846)에 가이드부재(893)에 의하여 탈착가능하게 고정될 수 있다. 이러한 픽커(831, 841)는 결합부재(891)와 흡착패드(892)가 결합된 상태로 픽커모듈(834, 844)에 구비될 수 있다. 흡착패드(892)는 결합부재(891)를 통하여 흡입유로(899)와 연결될 수 있다. 흡착패드(892)는 고무, 합성수지 등과 같은 유연성이 있는 재질로 이루어질 수 있다.As shown in FIG. 10, the pickers 831 and 841 are hollow coupling members 891 fixed to the picker support blocks 836 and 846, and hollows detachably coupled to the ends of the coupling members 891. FIG. It can be composed of the suction pad (892). The suction pad 892 may have a protrusion 892a which protrudes more than the outer circumferential surface of the coupling member 891. The coupling member 891 may be detachably fixed to the picker support blocks 836 and 846 by the guide member 883. The pickers 831 and 841 may be provided in the picker modules 834 and 844 in a state in which the coupling member 891 and the suction pad 892 are coupled to each other. The suction pad 892 may be connected to the suction passage 899 through the coupling member 891. The adsorption pad 892 may be made of a flexible material such as rubber or synthetic resin.
댐퍼(839, 849)는 소자(1)가 테스트소켓(310)으로 가압하는 과정에서 테스트소켓(1)에 대한 소자(1)의 접촉력을 조절하는 역할을 하는 것과 함께 픽커모듈(834, 844)에 가해지는 힘을 완충하는 역할을 한다. 예를 들면, 댐퍼(839, 949)는 내부에 소정의 공간이 형성되고, 공간과 연통되는 공압통로(839c, 849c)가 형성되는 챔버(839d, 849d)와, 챔버(839d, 849d)의 내부에 배치되는 탄성막(839a, 849a)과, 히팅블럭(838, 848)을 통하여 픽커(831, 841)와 연결되어 탄성막(839a, 849a)를 가압하는 가압부재(839b, 849b)를 포함할 수 있다. 이러한 구성에 따르면, 공압통로(839c, 849c)를 통하여 챔버(839d, 849d)의 내부공간으로 공압이 작용되면, 탄성막(839a, 849a)가 탄성적으로 변형되면서 가압부재(839b, 849b)에 소정의 압력이 작용된다. 따라서, 챔버(839d, 849d)의 내부에 작용되는 공압과 탄성막(839a, 849a)의 탄성에 의하여 소자(1)가 테스트소켓(310)으로 가압될 때 테스트소켓(310)에 대한 소자(1)의 접촉력이 결정될 수 있다. 그리고, 챔버(839d, 849d)의 내부에 작용되는 공압과 탄성막(839a, 849a)의 탄성에 의하여 가압부재(839b, 849b)에 작용되는 압력에 의하여, 소자(1)가 테스트소켓(310)으로 가압하는 과정에서 픽커모듈(834, 844)에 가해지는 힘이 완충될 수 있다.The dampers 839 and 849 serve to adjust the contact force of the device 1 to the test socket 1 while the device 1 presses the test socket 310 together with the picker modules 834 and 844. It acts as a buffer to the force exerted on it. For example, the dampers 839 and 949 have predetermined spaces formed therein, the chambers 839d and 849d in which pneumatic passages 839c and 849c communicate with the spaces, and the interiors of the chambers 839d and 849d. And pressing members 839b and 849b connected to the pickers 831 and 841 through the heating blocks 838 and 848 to press the elastic films 839a and 849a. Can be. According to this configuration, when pneumatic pressure is applied to the internal space of the chambers 839d and 849d through the pneumatic passages 839c and 849c, the elastic membranes 839a and 849a are elastically deformed to the pressing members 839b and 849b. The predetermined pressure is applied. Therefore, the element 1 with respect to the test socket 310 when the element 1 is pressed into the test socket 310 by the pneumatic pressure acting inside the chambers 839d and 849d and the elasticity of the elastic membranes 839a and 849a. ) Can be determined. Then, the element 1 is connected to the test socket 310 by the pressure applied to the pressing members 839b and 849b by the pneumatic pressure applied to the interior of the chambers 839d and 849d and the elasticity of the elastic membranes 839a and 849a. The force applied to the picker modules 834 and 844 in the process of pressing may be buffered.
한편, 소자가압툴(830, 840)에 복수의 픽커모듈(834, 844)가 구비되는 경우, 챔버(839d, 849d)의 내부공간에 작용되는 공압은 복수의 픽커모듈(834, 844)에 따라 서로 다르게 조절될 수 있다. 즉, 복수의 픽커모듈(834, 844)를 이용하여 복수의 소자(1)를 복수의 테스트소켓(310)으로 가압하는 과정에서, 복수의 소자(1)가 복수의 테스트소켓(310)에 균일한 접촉력으로 가압되어야 복수의 소자(1)에 대한 테스트를 동시에 균일하게 수행할 수 있다. 그러나, 복수의 픽커모듈(834, 844)의 사양, 즉, 예를 들면, 픽커(831, 841,)의 위치, 탄성막(839a, 849a)의 탄성력, 조립공차, 부품의 노화정도 등이 반드시 동일할 수 없으므로, 복수의 소자(1)가 복수의 테스트소켓(310)에 균일하게 가압되지 않을 수 있다. 따라서, 챔버(839d, 849d)의 내부공간에 작용되는 공압을 복수의 픽커모듈(834, 844)에 따라 개별적으로 조절할 수 있도록 함으로써, 복수의 픽커모듈(834, 844)의 사양에 따라, 공압을 개별적으로 조절할 수 있도록 함으로써, 복수의 소자(1)가 복수의 테스트소켓(310)에 균일한 접촉력으로 가압되도록 할 수 있다.On the other hand, when the plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, the pneumatic pressure acting on the internal spaces of the chambers 839d and 849d depends on the plurality of picker modules 834 and 844. Can be adjusted differently. That is, in the process of pressing the plurality of devices 1 into the plurality of test sockets 310 using the plurality of picker modules 834 and 844, the plurality of devices 1 are uniform to the plurality of test sockets 310. It is necessary to pressurize with one contact force so that the test of the plurality of elements 1 can be performed uniformly at the same time. However, the specifications of the plurality of picker modules 834 and 844, i.e., the positions of the pickers 831 and 841, the elastic force of the elastic membranes 839a and 849a, the assembly tolerances, the degree of aging of the parts, and the like must be used. Since it may not be the same, the plurality of devices 1 may not be uniformly pressed against the plurality of test sockets 310. Therefore, by allowing the air pressure applied to the internal spaces of the chambers 839d and 849d to be individually adjusted according to the plurality of picker modules 834 and 844, the air pressure may be adjusted according to the specifications of the plurality of picker modules 834 and 844. By allowing the individual adjustment, the plurality of devices 1 may be pressed with a uniform contact force to the plurality of test sockets 310.
한편, 픽커모듈(834, 844)에 공압에 의하여 작동되는 댐퍼(839, 849)가 설치되는 것을 고려하여, 지지부(833, 843) 및 픽커모듈(834, 844)에는 댐퍼(839, 849)의 공압통로(839c, 849c)와 연통되는 공압연결통로(833b, 843b, 835b, 845b)가 형성될 수 있다. 이러한 공압연결통로(833b, 843b, 835b, 845b)는 지지부(833, 843)의 제1플레이트(833a, 843a)에 형성되고 외부의 공압발생원(미도시)와 연결되는 제1공압연결통로(833b, 843b)와, 제1공압연결통로(833b, 843b) 및 댐퍼(839, 849)의 공압통로(839c, 849c)를 연통시키도록 픽커모듈(834, 844)의 제2플레이트(835, 845)에 형성되는 제2공압연결통로(835b, 845b)를 포함할 수 있다. 따라서, 공압발생원과 댐퍼(839, 849)의 공압통로(839c, 849c)를 연결시키기 위한 별도의 작업 없이, 픽커모듈(834, 844)가 지지부(833, 843)에 결합되는 것에 의하여, 공압발생원과 댐퍼(839, 849)의 공압통로(839c, 849c)가 자동적으로 연결될 수 있다.Meanwhile, considering that the dampers 839 and 849 operated by pneumatic pressure are installed in the picker modules 834 and 844, the support parts 833 and 843 and the picker modules 834 and 844 are provided with the dampers 839 and 849. Pneumatic connecting passages 833c, 843b, 835b, and 845b communicating with the pneumatic passages 839c and 849c may be formed. The pneumatic connection passages 833b, 843b, 835b, and 845b are formed on the first plates 833a and 843a of the support parts 833 and 843 and are connected to an external pneumatic source (not shown). 843b and second plates 835 and 845 of the picker modules 834 and 844 to communicate the first pneumatic connecting passages 833b and 843b and the pneumatic passages 839c and 849c of the dampers 839 and 849. It may include a second pneumatic connection passage (835b, 845b) formed in. Accordingly, the picker modules 834 and 844 are coupled to the support parts 833 and 843 without any additional work for connecting the pneumatic generators and the pneumatic passages 839c and 849c of the dampers 839 and 849 to thereby provide the pneumatic generators. And pneumatic passages 839c and 849c of dampers 839 and 849 may be automatically connected.
픽커지지블럭(836, 846)은 픽커(831, 841)이 지지되는 부분으로 내부에 픽커(831, 841)의 흡착패드(892)와 연통되는 흡입유로(899)가 형성될 수 있다.The picker support blocks 836 and 846 are portions on which the pickers 831 and 841 are supported, and suction paths 899 may be formed in communication with the suction pads 892 of the pickers 831 and 841.
흡입유로(899)는 진공압발생원(미도시)과 연결되어 공기가 흡입되는 통로로서의 기능을 하며, 흡입유로(899)를 따라 공기가 흡입되는 것에 의하여 흡착패드(892)에는 부압이 형성될 수 있고, 이러한 부압에 의하여 흡착패드(892)에 소자(1)가 흡착될 수 있다. 이러한 흡입유로(899)는 픽커모듈(834, 844)의 내부에 형성될 수 있으나, 본 발명의 이에 한정되지 않으며, 흡입유로(899)가 흡착패드(892)와 연결되는 별도의 튜브로 이루어 질 수 있다.The suction passage 899 functions as a passage through which air is sucked by being connected to a vacuum pressure source (not shown), and negative pressure may be formed in the suction pad 892 by suction of air along the suction passage 899. In addition, the element 1 may be adsorbed to the suction pad 892 by the negative pressure. The suction passage 899 may be formed inside the picker modules 834 and 844, but is not limited thereto, and the suction passage 899 may be formed as a separate tube connected to the suction pad 892. Can be.
한편, 픽커모듈(834, 844)에 흡착패드(892)와 연통되는 흡입유로(899)를 가지는 픽커지지블럭(836, 846)이 설치되는 것을 고려하여, 지지부(833, 843) 및 픽커모듈(834, 844)에는 흡입유로(899)와 튜브 등을 통하여 연결되는 진공압연결통로(833c, 843c, 835c, 845c)가 형성될 수 있다. 이러한 진공압연결통로(833c, 843c, 835c, 845c)는 지지부(833, 843)의 제1플레이트(833a, 843a)에 형성되고 외부의 진공압발생원(미도시)와 연결되는 제1진공압연결통로(833c, 843c)와, 제1진공압연결통로(833c, 843c) 와 연통되도록 픽커모듈(834, 844)의 제2플레이트(835, 845)에 형성되는 제2진공압연결통로(835c, 845c)를 포함할 수 있다. 따라서, 진공압발생원과 흡입유로(899)를 연결시키기 위한 별도의 작업 없이, 픽커모듈(834, 844)가 지지부(833, 843)에 결합되는 것에 의하여, 진공압발생원과 흡입유로(899)가 자동적으로 연결될 수 있다.On the other hand, considering that the picker support blocks 836 and 846 having suction paths 899 in communication with the suction pads 892 are installed in the picker modules 834 and 844, the support parts 833 and 843 and the picker module (8). The vacuum pressure connection paths 833c, 843c, 835c, and 845c connected to the suction passage 899 and the tube may be formed in the 834 and 844. The vacuum pressure connection paths 833c, 843c, 835c, and 845c are formed on the first plates 833a and 843a of the support parts 833 and 843 and are connected to an external vacuum pressure source (not shown). A second vacuum connection passage 835c formed in the second plates 835 and 845 of the picker modules 834 and 844 so as to communicate with the passages 833c and 843c and the first vacuum connection passages 833c and 843c. 845c). Accordingly, the picker module 834, 844 is coupled to the support parts 833, 843 without the additional work for connecting the vacuum generator and the suction passage 899, whereby the vacuum generator and the suction passage 899 are formed. Can be connected automatically.
테스트부(300)가 일정한 온도 하에서 소자(1)에 대한 테스트를 수행할 수 있도록, 소자(1)를 가열하기 위한 가열부로서 히팅블럭(838, 848)이 댐퍼(839, 849)와 픽커지지블럭(836, 846) 사이에 설치될 수 있다. 히팅블럭(838, 848)에는 히터(838a, 848a)가 설치될 수 있다.The heating blocks 838 and 848 are supported by the dampers 839 and 849 as a heating unit for heating the device 1 so that the test unit 300 can test the device 1 under a constant temperature. It may be installed between blocks 836 and 846. Heaters 838a and 848a may be installed in the heating blocks 838 and 848.
소자가압툴(830, 840)에 복수의 픽커모듈(834, 844)가 구비되는 경우, 복수의 히터(838a, 848a)가 복수의 픽커모듈(834, 844)에 각각 구비될 수 있다. 이와 같은 경우, 복수의 히터(838a, 848a)는 복수의 픽커모듈(834, 844)에 따라 독립적으로 제어될 수 있다.When the plurality of picker modules 834 and 844 are provided in the device pressing tools 830 and 840, the plurality of heaters 838a and 848a may be provided in the plurality of picker modules 834 and 844, respectively. In this case, the plurality of heaters 838a and 848a may be independently controlled according to the plurality of picker modules 834 and 844.
이와 같은 경우, 픽커모듈(834, 844)에는 히터(838a, 848a)와 연결되어 히터(838a, 848a)의 온도를 직접적으로 감지하거나 또는 히터(838a, 848a)와 연결된 다른 물체와 연결되어 히터(838a, 848a)의 온도를 간접적으로 감지하는 온도센서(838b, 848b)가 더 구비될 수 있다. 복수의 히터(838a, 848a)가 복수의 픽커모듈(834, 844)에 각각 구비되는 경우, 복수의 온도센서(838b, 848b)가 복수의 픽커모듈(834, 844)에 각각 구비될 수 있다. 복수의 온도센서(838b, 848b)는 복수의 히터(838a, 848a)의 온도를 감지하며, 복수의 온도센서(838b, 848b)에 의하여 감지된 결과에 따라 복수의 히터(838a, 848a)의 온도가 제어될 수 있다.In such a case, the picker modules 834 and 844 are connected to the heaters 838a and 848a to directly sense the temperature of the heaters 838a and 848a, or are connected to other objects connected to the heaters 838a and 848a to connect the heaters ( Temperature sensors 838b and 848b may be further provided to indirectly detect the temperatures of the 838a and 848a. When the plurality of heaters 838a and 848a are provided in the plurality of picker modules 834 and 844, respectively, the plurality of temperature sensors 838b and 848b may be provided in the plurality of picker modules 834 and 844, respectively. The plurality of temperature sensors 838b and 848b sense the temperatures of the plurality of heaters 838a and 848a, and the temperatures of the plurality of heaters 838a and 848a according to the result detected by the plurality of temperature sensors 838b and 848b. Can be controlled.
이와 같이, 각 픽커모듈(834, 844)마다 히터(838a, 848a) 및 온도센서(838b, 848b)가 각각 구비되고, 온도센서(838b, 848b)에 의하여 감지된 결과에 따라 히터(838a, 848a)의 온도가 독립적으로 제어될 수 있으므로, 소자가압툴(830, 840)에 의하여 픽업된 복수의 소자(1)의 특성에 따라 온도를 독립적으로 조절하여 복수의 소자(1)에 대한 테스트를 보다 정확하게 수행할 수 있다.As such, each of the picker modules 834 and 844 is provided with heaters 838a and 848a and temperature sensors 838b and 848b, respectively, and heaters 838a and 848a according to the results detected by the temperature sensors 838b and 848b. Since the temperature of the can be controlled independently, the temperature is independently adjusted according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to test the plurality of elements 1. It can be done correctly.
이때, 픽커모듈(834, 844)에 히터(838a, 848a) 또는 온도센서(838b, 848b)가 설치됨을 고려하여 지지부(833, 843)의 제1플레이트(833a, 843b) 및 픽커모듈(834, 844)의 제2플레이트(835, 845)는 단열재질로 이루어질 수 있다. 또한, 히팅블럭(838, 848)과 댐퍼(839, 849)의 사이 및 댐퍼(839, 849)와 제2플레이트(835, 845) 사이에는 단열부재(미도시)가 설치될 수 있다. 또한, 픽커모듈(834, 844)에는 히터(838a, 848a) 또는 온도센서(838b, 848b)에 대한 전원공급 및 신호전달을 위한 하나 이상의 제1커넥터(91)가 설치될 수 있다.In this case, considering that the heaters 838a and 848a or the temperature sensors 838b and 848b are installed in the picker modules 834 and 844, the first plates 833a and 843b and the picker modules 834 and 843 of the support parts 833 and 843. The second plates 835 and 845 of 844 may be made of a heat insulating material. In addition, a heat insulating member (not shown) may be installed between the heating blocks 838 and 848 and the dampers 839 and 849 and between the dampers 839 and 849 and the second plates 835 and 845. In addition, the picker modules 834 and 844 may be provided with one or more first connectors 91 for power supply and signal transmission to the heaters 838a and 848a or the temperature sensors 838b and 848b.
또한, 상기 지지부(833, 843)에는, 픽커모듈(834, 844)과의 결합 시 제1커넥터(91)와 결합되어 히터(838a, 848a), 온도센서(838b, 848b)에 대하여 전원을 공급하고, 신호를 전달하는 제2커넥터(92)가 설치될 수 있다.In addition, the support parts 833 and 843 are coupled to the first connector 91 to supply power to the heaters 838a and 848a and the temperature sensors 838b and 848b when the picker modules 834 and 844 are coupled to each other. And, the second connector 92 for transmitting a signal may be installed.
제1커넥터(91)의 단자들과 제2커넥터(92)의 단자들은, 서로 삽입되는 방식 등에 의하여 서로 전기적으로 연결될 수 있는 등 다양한 구성이 가능하다.The terminals of the first connector 91 and the terminals of the second connector 92 may be variously configured such that they may be electrically connected to each other by a method of being inserted into each other.
상기와 같은 제1커넥터(91) 및 제2커넥터(92)의 구성에 의하여 별도의 연결작업 없이, 픽커모듈(834, 844) 및 지지부(833, 843)의 결합에 의하여 히터(838a, 848a), 온도센서(838b, 848b)에 대한 전원공급 및 신호전달이 가능할 수 있다. 즉, 제1커넥터(91) 및 제2커넥터(92)는 픽커모듈(834, 844) 및 지지부(833, 843)의 결합 시 서로 접촉되는 부분에 설치되어 픽커모듈(834, 844) 및 지지부(833, 843)의 상호 결합 시 자동으로 연결될 수 있다.By the configuration of the first connector 91 and the second connector 92 as described above, the heaters (838a, 848a) by the combination of the picker module (834, 844) and the support (833, 843) without a separate connection work In addition, power and signal transmission to the temperature sensors 838b and 848b may be possible. That is, the first connector 91 and the second connector 92 are installed at the parts that are in contact with each other when the picker modules 834 and 844 and the support parts 833 and 843 are coupled to each other so that the picker modules 834 and 844 and the support part ( 833, 843 may be automatically connected when mutually coupled.
한편, 소자(1)를 가열하기 위한 가열부의 다른 예로서, 도 14 및 도 15에 도시된 바와 같이, 소자가압툴(830, 840)에는 픽커(831, 841)에 픽업된 소자(1)를 향하여 가열기체를 분사하는 가열기체분사유닛이 구비될 수 있다. 가열기체분사유닛에 의하여 소자(1)로 분사된 가열가스에 의하여 소자(1)가 가열될 수 있으며, 이에 따라, 소자(1)에 대한 고온테스트가 수행될 수 있다. 소자가압툴(830, 840)에 복수의 픽커모듈(834, 844)가 구비되는 경우, 복수의 가열기체분사유닛이 복수의 픽커모듈(834, 844)에 각각 구비될 수 있다. 이와 같은 경우, 복수의 가열기체분사유닛에 의하여 분사되는 가열기체의 온도는 복수의 픽커모듈(834, 844)에 따라 독립적으로 제어될 수 있다.Meanwhile, as another example of a heating unit for heating the device 1, as shown in FIGS. 14 and 15, the device pressing tools 830 and 840 include the device 1 picked up by the pickers 831 and 841. It may be provided with a heating gas spray unit for spraying the heating gas toward. The element 1 may be heated by the heating gas injected into the element 1 by the heating gas injection unit, and thus, a high temperature test on the element 1 may be performed. When the plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, the plurality of heating gas spray units may be provided in the plurality of picker modules 834 and 844, respectively. In this case, the temperature of the heating gas sprayed by the plurality of heating gas spray units may be independently controlled according to the plurality of picker modules 834 and 844.
가열기체분사유닛은, 흡착패드(892)의 외주둘레에 배치되어 흡착패드(892)와 함께 가열기체가 분사되는 분사구(894)를 형성하는 가이드부재(893)와, 분사구(894)와 연통되고 가열기체를 공급하는 가열기체공급기(896)와 연결되는 가열기체유로(895)를 포함할 수 있다. 가열기체유로(895)는 히팅블럭(838, 848)의 내부에 형성될 수 있다. 가열분사구(894)의 형상은 분사구(894)를 통하여 분사되는 가열기체가 흡착패드(892)에 흡착된 소자(1)를 향하여 분사될 수 있는 다양한 형상으로 형성될 수 있다. 흡착패드(892)의 외주둘레에 분사구(894)가 형성될 수 있도록, 가이드부재(893)는 흡착패드(892)의 외주면으로 소정의 간격으로 이격된 상태에서 흡착패드(892)의 외주둘레를 감싸도록 픽커지지블럭(836, 846)에 결합될 수 있다. 분사구(894)는 가열기체유로(895)를 통하여 가열기체공급기(896)와 연결될 수 있다. 가열기체유로(895)는 픽커모듈(834, 844)의 내부에 형성될 수 있으나, 본 발명의 이에 한정되지 않으며, 가열기체유로(895)가 흡착패드(892)와 연결되는 별도의 튜브로 이루어 질 수 있다.The heating gas spray unit is in communication with the injection hole 894 and a guide member 893 which is disposed on the outer circumference of the suction pad 892 to form an injection hole 894 through which the heating gas is injected together with the suction pad 892. The heating gas path 895 may be connected to the heating gas supplier 896 for supplying the heating gas. The heating gas passage 895 may be formed inside the heating blocks 838 and 848. The shape of the heating injection port 894 may be formed in various shapes in which a heating gas injected through the injection port 894 may be injected toward the element 1 adsorbed by the suction pad 892. The guide member 893 is formed around the outer circumference of the suction pad 892 at a predetermined interval so that the injection hole 894 may be formed at the outer circumference of the suction pad 892. It can be coupled to the picker support blocks 836, 846 to wrap. The injection hole 894 may be connected to the heating gas supply 896 through the heating gas flow path 895. The heating gas passage 895 may be formed inside the picker modules 834 and 844, but is not limited thereto. The heating gas passage 895 may include a separate tube connected to the suction pad 892. Can lose.
이러한 구성에 따르면, 소자가압툴(830, 840)의 픽커(831, 841)의 흡착패드(892)에 소자(1)가 흡착된 상태에서, 가열기체공급기(896)의 작동에 의하여 흡착패드(892)의 외주둘레에 형성된 분사구(894)로부터 가열기체가 분사되며, 분사된 가열기체가 흡착패드(892)에 흡착된 소자(1)에 충돌되면서 소자(1)가 가열될 수 있다. 이와 같이, 소자(1)의 가열이 가열기체에 의하여 직접적으로 수행되므로, 픽커모듈(834, 844)에 히터(838a, 848a)를 이용하여 소자(1)를 가열하는 경우에 비하여, 소자(1)를 가열하기 위한 열전달효율이 증가하여 소자(1)를 신속하게 가열할 수 있을 뿐만 아니라 소자(1)의 온도하락을 최소화할 수 있으며, 이에 따라, 소자(1)의 검사가 미리 설정된 온도에서 정확하게 수행될 수 있다.According to this configuration, in the state in which the element 1 is adsorbed to the adsorption pad 892 of the pickers 831 and 841 of the element pressing tools 830 and 840, the adsorption pad ( The heating gas may be injected from the injection holes 894 formed at the outer circumference of the 892, and the heating element may be heated while the injected heating gas collides with the element 1 adsorbed by the suction pad 892. As described above, since the heating of the device 1 is directly performed by the heating gas, the device 1 is heated in comparison with the case in which the device 1 is heated by using the heaters 838a and 848a in the picker modules 834 and 844. Heat transfer efficiency for heating the heating element 1) can be heated not only to heat the element 1 quickly but also to minimize the temperature drop of the element 1, so that the inspection of the element 1 is performed at a predetermined temperature. Can be performed correctly.
흡착패드(892)의 외주둘레에서 가열기체가 분사되는 분사구(894)가 형성되는 경우에는, 픽커모듈(838, 844)에 히터(838a, 848a)가 설치되지 않을 수 있으며, 이에 따라, 픽커모듈(838, 844)에 히터(838a, 848a)를 설치하기 위한 설계의 복잡성 및 조립의 곤란성을 해소할 수 있다. 물론, 픽커모듈(838, 844)에 히터(838a, 848a) 및 가열기체분사유닛이 함께 구비될 수 있다.When the injection holes 894 are formed in the outer circumference of the suction pad 892, the heaters 838a and 848a may not be installed in the picker modules 838 and 844. The complexity of the design and the difficulty of assembling for installing the heaters 838a and 848a in the 838 and 844 can be eliminated. Of course, the picker modules 838 and 844 may be provided with a heater 838a and 848a and a heating gas spray unit.
또한, 소자가압툴(830, 840)이 소자(1)를 테스트소켓(310)으로 가압하는 과정에서 분사구(894)로부터 가열기체가 분사될 수 있으며, 분사된 가열기체가 테스트소켓(310)에 충돌되면서 테스트소켓(310)이 가열될 수 있다. 이와 같이, 테스트소켓(310)의 가열이 가열기체에 의하여 직접적으로 수행되므로, 테스트소켓(310)에 히터를 설치하고 이를 이용하여 테스트소켓(310)을 가열하는 경우에 비하여, 테스트소켓(310)에 히터를 설치하기 위한 설계의 복잡성 및 조립의 곤란성을 해소할 수 있다.In addition, the heating gas may be injected from the injection hole 894 while the device pressing tools 830 and 840 pressurize the device 1 to the test socket 310, and the injected heating gas may be injected into the test socket 310. The test socket 310 may be heated while colliding. As described above, since the heating of the test socket 310 is directly performed by the heating gas, the test socket 310 is heated in comparison with the case in which the heater is installed in the test socket 310 and the test socket 310 is heated using the heater. The complexity of the design and the difficulty of assembly for installing the heaters can be eliminated.
한편, 픽커모듈(834, 844)에는 가열기체의 온도를 감지하는 온도센서(838b, 848b)가 구비될 수 있다. 따라서, 온도센서(838b, 848b)에 의하여 감지된 결과에 따라 소자(1)를 향하여 분사되는 가열기체의 온도가 제어될 수 있다. 복수의 가열기체분사유닛이 복수의 픽커모듈(834, 844)에 각각 구비되는 경우, 복수의 온도센서(838b, 848b)가 복수의 픽커모듈(834, 844)에 각각 구비될 수 있다. 복수의 온도센서(838b, 848b)는 각 픽커모듈(834, 844)에 픽업된 소자(1)를 향하여 분사되는 가열기체의 온도를 감지하며, 복수의 온도센서(838b, 848b)에 의하여 감지된 결과에 따라 가열기체의 온도가 제어될 수 있다.Meanwhile, the picker modules 834 and 844 may be provided with temperature sensors 838b and 848b for sensing the temperature of the heating gas. Therefore, according to the result detected by the temperature sensors 838b and 848b, the temperature of the heating gas injected toward the element 1 can be controlled. When a plurality of heating gas spray units are provided in the plurality of picker modules 834 and 844, a plurality of temperature sensors 838b and 848b may be provided in the plurality of picker modules 834 and 844, respectively. The plurality of temperature sensors 838b and 848b sense the temperature of the heating gas injected toward the element 1 picked up to each of the picker modules 834 and 844, and are detected by the plurality of temperature sensors 838b and 848b. According to the result, the temperature of the heating gas can be controlled.
이와 같이, 각 픽커모듈(834, 844)마다 가열기체분사유닛 및 온도센서(838b, 848b)가 각각 구비되고, 온도센서(838b, 848b)에 의하여 감지된 결과에 따라 소자(1)를 향하여 분사되는 가열기체의 온도가 독립적으로 제어될 수 있으므로, 소자가압툴(830, 840)에 의하여 픽업된 복수의 소자(1)의 특성에 따라 온도를 독립적으로 조절하여 복수의 소자(1)에 대한 테스트를 보다 정확하게 수행할 수 있다.In this way, each of the picker modules 834 and 844 is provided with a heating gas spray unit and temperature sensors 838b and 848b, respectively, and sprayed toward the element 1 according to the result detected by the temperature sensors 838b and 848b. Since the temperature of the heating gas to be controlled can be independently controlled, the temperature is independently adjusted according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to test the plurality of elements 1. Can be done more accurately.
픽커모듈(834, 844)이 지지부(833, 843)에 탈착가능하게 결합될 수 있도록, 예를 들면, 지지부(833, 843) 및 픽커모듈(834, 844)의 일측에는 지지부(833, 843) 및 픽커모듈(834, 844)을 체결하는 체결유닛(850)이 구비될 수 있으며, 지지부(833, 843) 및 픽커모듈(834, 844)의 타측에는 지지부(833, 843)에 픽커모듈(834, 844)을 지지시키는 제1지지유닛(860)이 구비될 수 있다. 이와 같은 구성에 따르면, 지지부(833, 843) 및 픽커모듈(834, 844)이 제1지지유닛(860)에 의하여 서로 지지된 상태에서, 체결유닛(850)에 의하여 서로 체결될 수 있다.For example, the support parts 833 and 843 may be provided on one side of the support parts 833 and 843 and the picker modules 834 and 844 so that the picker modules 834 and 844 may be detachably coupled to the support parts 833 and 843. And a fastening unit 850 for fastening the picker modules 834 and 844, and on the other side of the support parts 833 and 843 and the picker modules 834 and 844, the picker module 834 to the support parts 833 and 843. The first support unit 860 for supporting the 844 may be provided. According to the configuration, the support parts 833 and 843 and the picker modules 834 and 844 may be fastened to each other by the fastening unit 850 while being supported by the first support unit 860.
체결유닛(850)은, 픽커모듈(834, 844)의 일측에 설치되는 고리(851) 및 고리(851)를 상하방향으로 이동시키는 고리이동부재(852)와, 지지부(833, 843)의 일측에 설치되어 고리(851)가 걸리는 고리걸림부재(853)를 포함할 수 있다. 이와 같은 구성에 따르면, 고리(861)를 고리걸림부재(853)에 걸고, 고리이동부재(852)를 이용하여 고리(851)를 하측으로 당기는 것에 의하여, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 체결될 수 있다.The fastening unit 850 includes a ring moving member 852 for moving the ring 851 and the ring 851 installed on one side of the picker modules 834 and 844 in a vertical direction, and one side of the support parts 833 and 843. Installed in the hook may include a ring locking member 853 is caught. According to this configuration, by hooking the hook 861 to the hooking member 853, by pulling the hook 851 downward using the ring moving member 852, the support parts 833, 843 and the picker module ( 834 and 844 may be fastened to each other.
제1지지유닛(860)은, 픽커모듈(834, 844)의 타측에서 소정의 길이로 돌출되는 돌출편(861)과, 지지부(833, 843)의 타측에 설치되어 돌출편(861)이 삽입되어 고정되는 돌출편고정부(862)를 포함할 수 있다. 돌출편고정부(862)는, 돌출편(861)이 삽입되는 공간을 제공하도록, 지지부(833, 843)의 하측면, 즉, 제1플레이트(833a, 843a)의 하측면으로부터 소정의 길이로 돌출되는 제1지지부재(863)와, 제1지지부재(863)에 지지되며 지지부(833, 843)의 하측면으로부터 소정의 간격으로 이격되게 배치되는 제2지지부재(864)로 구성될 수 있다. 돌출편(861)이 지지부(833, 843)의 하측면과 제2지지부재(864) 사이의 공간에 용이하게 삽입될 수 있도록, 제2지지부재(864)는 돌출편(861)과 접촉되는 면이 곡면으로 형성되는 것이 바람직하다. 또한, 돌출편고정부(862)는, 제2지지부재(864)를 탄성적으로 지지하는 탄성부재(865)와, 탄성부재(865)를 지지부(833, 843)에 고정시키는 고정부재(866)를 포함할 수 있다. 제2지지부재(864)가 탄성부재(865)에 의하여 탄성적으로 지지되므로, 돌출편(861)이 지지부(833, 843)의 하측면과 제2지지부재(864) 사이의 공간으로 용이하게 삽입될 수 있다. 또한, 돌출편(861)이 지지부(833, 843)의 하측면과 및 제2지지부재(864) 사이의 공간으로 삽입된 후에는, 탄성부재(865)가 제2지지부재(864)를 가압하므로, 돌출편(861)이 지지부(833, 843)의 하측면과 제2지지부재(864) 사이의 공간으로부터 이탈되지 않게 견고하게 고정될 수 있다.The first support unit 860 is provided on the other side of the picker module 834, 844 protruding piece 861 protruding to a predetermined length, and the other side of the support portion 833, 843 is inserted into the protruding piece 861 It may include a protrusion piece fixing portion 862 is fixed. The protruding piece fixing part 862 protrudes from the lower surface of the support parts 833 and 843, that is, from the lower surface of the first plates 833a and 843a, to a predetermined length so as to provide a space into which the protruding piece 861 is inserted. And a second support member 864 supported by the first support member 863 and spaced apart from the lower surfaces of the support parts 833 and 843 at predetermined intervals. . The second support member 864 is in contact with the protruding piece 861 so that the protruding piece 861 can be easily inserted into the space between the lower surfaces of the supporting parts 833 and 843 and the second supporting member 864. It is preferable that the surface is formed into a curved surface. In addition, the protrusion piece fixing part 862 includes an elastic member 865 that elastically supports the second support member 864, and a fixing member 866 that fixes the elastic member 865 to the support parts 833 and 843. It may include. Since the second support member 864 is elastically supported by the elastic member 865, the protruding pieces 861 easily move into the space between the lower surfaces of the support parts 833 and 843 and the second support member 864. Can be inserted. In addition, after the protruding piece 861 is inserted into the space between the lower surfaces of the supporting portions 833 and 843 and the second supporting member 864, the elastic member 865 presses the second supporting member 864. Therefore, the protruding pieces 861 may be firmly fixed so as not to be separated from the space between the lower surfaces of the support parts 833 and 843 and the second support member 864.
이와 같은 구성에 따르면, 돌출편(861)을 지지부(833, 843)의 하측면과 제2지지부재(864) 사이의 공간으로 삽입하여 고정시킨 상태에서, 고리(851)를 고리걸림부재(853)에 걸고, 고리이동부재(862)를 이용하여 고리(851)를 하측으로 당기는 간단한 작동에 의하여, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합될 수 있다.According to such a configuration, the hook 851 is hooked member 853 in a state where the protrusion piece 861 is inserted into and fixed to the space between the lower surfaces of the support parts 833 and 843 and the second support member 864. ) And the support parts 833 and 843 and the picker modules 834 and 844 may be coupled to each other by a simple operation of pulling the ring 851 downward using the ring moving member 862.
한편, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합되는 작동을 보다 용이하게 수행할 수 있도록, 지지부(833, 843) 및 픽커모듈(834, 844)에는 지지부(833, 843)의 하측면과 픽커모듈(834, 844)의 상측면, 즉, 제2플레이트(835, 845)의 상측면이 서로 밀착되도록 안내하는 제2지지유닛(870)이 구비되는 것이 바람직하다.On the other hand, the support parts 833 and 843 and the picker modules 834 and 844 may be more easily coupled to each other, so that the support parts 833 and 843 and the picker modules 834 and 844 support the parts 833 and 843. It is preferable that the second support unit 870 is provided to guide the lower side and the upper side of the picker module (834, 844), that is, the upper side of the second plate (835, 845) in close contact with each other.
제2지지유닛(870)은, 픽커모듈(834, 844)의 상측면으로부터 돌출되며 단턱부를 가지는 헤드(875)가 상부에 형성되는 돌출바(871)와, 지지부(833, 843)의 하측면에서 내입되어 돌출바(871)의 헤드(875)가 수용되는 헤드수용부(872) 및 헤드(875)가 삽입되는 헤드삽입공(874)이 형성되는 걸림판(873)을 포함할 수 있다. 이와 같은 구성에 따르면, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합되는 과정에서, 헤드(875)가 헤드삽입공(874)을 통하여 헤드수용부(872)의 내부에 수용되고, 지지부(833, 843)에 대한 픽커모듈(834, 844)의 상대적인 수평이동에 의하여 헤드(875)의 단턱부가 걸림판(873)에 걸리는 것에 의하여, 지지부(833, 843)에 픽커모듈(834, 844)이 지지될 수 있다.The second support unit 870 includes a protrusion bar 871 having a head 875 protruding from an upper side of the picker modules 834 and 844 and having a stepped portion, and a lower side of the support portions 833 and 843. It may include a locking plate (873) is formed in the head receiving portion 872 is inserted in the head 875 of the protrusion bar (871) and the head insertion hole 874 is inserted into the head 875 is formed. According to this configuration, in the process in which the support parts 833 and 843 and the picker modules 834 and 844 are coupled to each other, the head 875 is accommodated in the head accommodation part 872 through the head insertion hole 874. The stepped portion of the head 875 is caught by the locking plate 873 by the horizontal movement of the picker modules 834 and 844 relative to the support parts 833 and 843, thereby causing the picker module ( 834, 844 may be supported.
이와 같은 제2지지유닛(870)은 지지부(833, 843) 및 픽커모듈(834, 844)을 서로 고정시키는 역할을 함께 수행하므로, 제1지지유닛(860)과 제2지지유닛(870) 중 어느 하나만이 구비되는 구성도 가능하다.Since the second support unit 870 serves to fix the support parts 833 and 843 and the picker modules 834 and 844 together, among the first support unit 860 and the second support unit 870. It is also possible to have a configuration provided with only one.
한편, 지지부(833, 843) 및 픽커모듈(834, 844)의 사이에는, 지지부(833, 843) 및 픽커모듈(834, 844) 사이의 결합위치를 결정하는 위치결정유닛(880)이 구비되는 것이 바람직하다.On the other hand, between the support parts 833 and 843 and the picker modules 834 and 844, a positioning unit 880 is provided for determining the engagement position between the support parts 833 and 843 and the picker modules 834 and 844. It is preferable.
예를 들면, 위치결정유닛(880)은, 픽커모듈(834, 844)의 상측면으로부터 돌출되는 돌출봉(881)과, 지지부(833, 843)의 하측면으로부터 내입되어 돌출봉(881)이 삽입되는 돌출봉삽입홈(882)을 포함할 수 있다. 이와 같은 구성에 따르면, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합되는 과정에서, 돌출봉(881)이 돌출봉삽입홈(882)에 삽입되면서, 지지부(833, 843) 및 픽커모듈(834, 844)의 결합위치가 결정될 수 있다.For example, the positioning unit 880 has a protruding rod 881 protruding from the upper side surfaces of the picker modules 834 and 844, and a protruding rod 881 being embedded from the lower side of the support portions 833 and 843. It may include a protrusion rod insertion groove 882 is inserted. According to such a configuration, while the support parts 833 and 843 and the picker modules 834 and 844 are coupled to each other, the protrusions 881 are inserted into the protrusion bar insertion grooves 882 and the support parts 833 and 843. And coupling positions of the picker modules 834 and 844 may be determined.
한편, 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합된 상태에서는, 지지부(833, 843)의 하측면 및 픽커모듈(834, 844)의 상측면이 서로 밀착된다. 따라서, 지지부(833, 843) 또는 픽커모듈(834, 844)에는 지지부(833, 843)의 하측면 및 픽커모듈(834, 844)의 상측면이 서로 밀착되는 것을 감지하는 감지센서(889)가 구비되는 것이 바람직하다. 도면에서는 감지센서(889)가 지지부(833, 843)의 하측면에 배치되는 구성에 대하여 제시하고 있으나, 본 발명은 이에 한정되지 않으며, 감지센서(889)가 픽커모듈(834, 844)의 상측면에 구비될 수 있다. 감지센서(889)는 면접촉을 감지하는 압력센서로 이루어질 수 있다. 이러한 감지센서(889)를 이용하여 지지부(833, 843)의 하측면 및 픽커모듈(834, 844)의 상측면이 서로 밀착되었는지 여부를 감지할 수 있고, 그 감지결과에 따라 지지부(833, 843) 및 픽커모듈(834, 844)이 서로 결합되었는지 여부를 판단할 수 있다.On the other hand, in a state in which the support parts 833 and 843 and the picker modules 834 and 844 are coupled to each other, the lower side of the support parts 833 and 843 and the upper side surfaces of the picker modules 834 and 844 are in close contact with each other. Therefore, the support part 833, 843 or the picker module 834, 844 includes a detection sensor 889 that detects that the lower side of the support part 833, 843 and the upper side of the picker module 834, 844 are in close contact with each other. It is preferred to be provided. In the drawings, a configuration in which the sensing sensor 889 is disposed on the lower surface of the support parts 833 and 843 is provided. However, the present invention is not limited thereto, and the sensing sensor 889 is formed on the picker modules 834 and 844. It may be provided on the side. The detection sensor 889 may be formed of a pressure sensor that detects surface contact. By using the detection sensor 889, it is possible to detect whether the lower side of the support parts 833 and 843 and the upper side of the picker modules 834 and 844 are in close contact with each other, and the support parts 833 and 843 according to the detection result. ) And the picker modules 834 and 844 may be coupled to each other.
소자가압툴(830, 840)은, 수평방향(Y축방향) 및 수직방향(X축방향)으로 이동되면서, 제1셔틀부(610) 및 제2셔틀부(620)에 적재된 소자(1)를 테스트부의 테스트소켓(310)으로 이동시키고, 테스트가 완료된 소자(1)를 테스트소켓(310)으로부터 제1셔틀부(610) 및 제2셔틀부(620)로 이동시키는 작동을 한다.The element pressing tools 830 and 840 move in the horizontal direction (Y axis direction) and the vertical direction (X axis direction), and the elements 1 mounted on the first shuttle part 610 and the second shuttle part 620. ) Is moved to the test socket 310 of the test unit, and the device 1 that has been tested is moved from the test socket 310 to the first shuttle unit 610 and the second shuttle unit 620.
예를 들면, 도 16 내지 도 19에 도시된 바와 같이, 소자가압툴(830, 840)을 각각 수평방향(Y축방향)으로 이동시키기 위하여 소자가압툴(830, 840)과 각각 연결되는 수평이동장치(801)가 구비되고, 소자가압툴(830, 840)을 수직방향(Z축방향)으로 이동시키기 위하여 소자가압툴(830, 840)과 각각 연결되는 제1수직이동장치(802)가 구비된다.For example, as illustrated in FIGS. 16 to 19, horizontal movements connected to the element pressing tools 830 and 840, respectively, to move the element pressing tools 830 and 840 in the horizontal direction (Y-axis direction), respectively. Apparatus 801 is provided, and is provided with a first vertical movement apparatus 802 connected to the element pressing tools 830, 840, respectively, to move the element pressing tools 830, 840 in the vertical direction (Z-axis direction). do.
수평이동장치(801)는 소자가압툴(830, 840)로부터 수직방향으로 연장되는 지지축(830a, 840a)이 수평방향으로의 이동이 구속되되 수직방향으로 이동이 가능하게 연결되는 연결부재(830b, 840b)와, 연결부재(830b, 840b)를 수평방향으로 이동시키는 수평구동부(803)를 포함할 수 있다.The horizontal moving device 801 is a connecting member 830b in which the support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 are constrained in the horizontal direction but are movable in the vertical direction. , 840b and a horizontal driver 803 for moving the connecting members 830b and 840b in a horizontal direction.
연결부재(830b, 840b)에 지지축(830a, 840a)이 수평방향으로의 이동이 구속되되 수직방향으로 이동가능하게 연결될 수 있도록, 연결부재(830b, 840b)에는 수직방향으로 관통되게 형성되어 지지축(830a, 840a)이 삽입되는 관통공(830c, 840c)이 형성될 수 있다. 지지축(830a, 840a)이 연결부재(830b, 840b)의 관통공(830c, 840c)에 삽입됨에 따라, 지지축(830a, 840a)의 수평방향으로의 이동은 연결부재(830b, 840b)에 의하여 구속되지만, 지지축(830a, 840a)의 수직방향으로의 이동은 구속되지 않는다. 관통공(830c, 840c)은 지지축(830a, 840a)의 수직방향으로의 이동을 안내하는 역할을 함께 수행할 수 있다.The support shafts 830a and 840a are connected to the connecting members 830b and 840b so that the movement of the supporting shafts 830a and 840a is constrained in the horizontal direction and can be movably connected in the vertical direction. Through holes 830c and 840c into which the shafts 830a and 840a are inserted may be formed. As the support shafts 830a and 840a are inserted into the through holes 830c and 840c of the connecting members 830b and 840b, the movement of the support shafts 830a and 840a in the horizontal direction is connected to the connecting members 830b and 840b. Although constrained by, the movement of the support shafts 830a and 840a in the vertical direction is not constrained. The through holes 830c and 840c may serve to guide the movement of the support shafts 830a and 840a in the vertical direction.
수평구동부(803)는, 예를 들면, 연결부재(830b, 840b)와 연결되는 벨트(803a)와, 벨트(803a)가 감기는 풀리(803b)와, 풀리(803b)와 연결되는 회전모터(미도시)를 포함할 수 있다. 이와 같은 구성에 따르면, 회전모터(미도시)의 회전력에 의하여 풀리(803b)가 회전되고, 풀리(803b)의 회전에 의하여 벨트(803a) 및 벨트(803a)와 연결된 연결부재(830b, 840b)가 수평방향으로 이동되며, 이에 따라, 연결부재(830b, 840b)에 연결된 지지축(830a, 840a) 및 소자가압툴(830, 840)이 수평방향으로 이동될 수 있다. 한편, 본 발명의 실시예에서는 수평구동부(803)로 벨트(803a)와 풀리(803b)가 구비된 구성에 대하여 제시하였으나, 본 발명은 이에 한정되지 않으며, 수평구동부(803)로 유압 또는 공압으로 작동되는 액추에이터, 리니어모터 또는 볼스크류장치 등 다양한 수평이송기구가 사용될 수 있다.The horizontal driving unit 803 may include, for example, a belt 803a connected to the connection members 830b and 840b, a pulley 803b to which the belt 803a is wound, and a rotation motor connected to the pulley 803b. Not shown). According to such a configuration, the pulley 803b is rotated by the rotational force of the rotating motor (not shown), and the connecting members 830b and 840b connected to the belt 803a and the belt 803a by the rotation of the pulley 803b. Is moved in the horizontal direction, and thus, the support shafts 830a and 840a and the element pressing tools 830 and 840 connected to the connecting members 830b and 840b may be moved in the horizontal direction. Meanwhile, in the exemplary embodiment of the present invention, the belt 803a and the pulley 803b are provided as the horizontal driving unit 803, but the present invention is not limited thereto. Various horizontal feed mechanisms can be used, such as actuating actuators, linear motors or ball screw devices.
제1수직이동장치(802)는, 소자가압툴(830, 840)로부터 수직방향으로 연장되는 지지축(830a, 840a)이 수직방향으로의 이동은 구속되고 수평방향으로의 이동가능하게 각각 연결되는 이동블럭(830d, 840d)과, 이동블럭(830d, 840d)에 연결되는 캠종동절(830e, 840e)과, 캠종동절(830e, 840e)이 삽입되는 캠홈(830f, 840f)이 형성되는 캠부재(830g, 840g)와, 이동블럭(830d, 840d)과 연결되어 이동블럭(830d, 840d)의 수직방향으로의 이동을 안내하는 승강가이드(830h, 840h)를 포함할 수 있다.The first vertical movement device 802 includes support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840, respectively, which are constrained in the vertical direction and movably connected in the horizontal direction. Cam members (moving blocks 830d, 840d), cam followers (830e, 840e) connected to the moving blocks (830d, 840d), and cam grooves (830f, 840f) into which the cam followers (830e, 840e) are inserted. 830g and 840g and lifting blocks 830h and 840h connected to the moving blocks 830d and 840d to guide the movement of the moving blocks 830d and 840d in the vertical direction.
이동블럭(830d, 840d)에는 지지축(830a, 840a)의 단부와 연결되며 수평방향으로 연장되어 지지축(830a, 840a)의 수평방향으로의 이동을 안내하는 안내레일(830i, 840i)이 설치될 수 있다. 따라서, 지지축(830a, 840a)이 안내레일(830i, 840i)을 따라 수평방향으로 이동될 수 있다. Guide rails 830i and 840i are installed at the moving blocks 830d and 840d to be connected to ends of the support shafts 830a and 840a and extend in the horizontal direction to guide the movement of the support shafts 830a and 840a in the horizontal direction. Can be. Therefore, the support shafts 830a and 840a can be moved in the horizontal direction along the guide rails 830i and 840i.
캠부재(830g, 840g)에는 각각 구동모터(830j, 840j)가 연결되며, 이에 따라, 구동모터(830j, 840j)의 구동에 의하여 캠부재(830g, 840g)가 회전될 수 있다. 이러한 캠부재(830g, 840g)는 한 쌍의 소자가압툴(830, 840)과 각각 연결되도록 한 쌍으로 구비될 수 있다.The driving motors 830j and 840j are connected to the cam members 830g and 840g, respectively. Accordingly, the cam members 830g and 840g may be rotated by the driving motors 830j and 840j. The cam members 830g and 840g may be provided in pairs so as to be connected to the pair of element pressing tools 830 and 840, respectively.
캠홈(830f, 840f)은, 반경이 일정한 제1반경구간 및 제2반경구간과, 제1반경구간 및 제2반경구간을 연결하는 가변구간을 포함하여 형성된다. 캠홈(830f, 840f)이 상기와 같이 구성되는 경우에는, 캠종동절(830e, 840e)이 반경이 작은 제1반경구간에 있을 때에는 소자가압툴(830, 840)이 상측에 위치된 상태에 있으며, 캠종동절(830e, 840e)이 가변구간에 있는 경우 소자가압툴(830, 840)이 상측으로 이동되거나 하측으로 이동되며, 캠종동절(830e, 840e)이 제1반경구간보다 반경이 더 큰 제2반경구간에 있는 경우 소자가압툴(830, 840)이 하측에 위치된 상태를 유지한다.The cam grooves 830f and 840f are formed to include a first radius section and a second radius section having a constant radius, and a variable section connecting the first radius section and the second radius section. In the case where the cam grooves 830f and 840f are configured as described above, when the cam followers 830e and 840e are in the first radius section having a small radius, the element pressing tools 830 and 840 are in a state of being positioned upward. When the cam follower 830e and 840e are in the variable section, the device pressing tools 830 and 840 are moved upward or downward, and the cam follower 830e and 840e have a larger radius than the first radius section. In the radial section, the device pressing tools 830 and 840 are maintained at the lower side.
이동블럭(830d, 840d)은 캠종동절(830e, 840e)이 캠홈(830f, 840f)에 삽입되는 것을 통하여 캠부재(830g, 840g)와 연결될 수 있다. 그리고, 이동블럭(830d, 840d)은 승강가이드(830h, 840h)에 연결되어 상하방향으로 승강할 수 있다. 따라서, 캠부재(830g, 840g)가 회전될 때, 캠종동절(830e, 840e)이 캠홈(830f, 840f)의 형상에 따라 수직방향으로 이동하며, 이에 따라, 캠종동절(830e, 840e)과 연결된 이동블럭(830d, 840d)이 수직방향으로 이동될 수 있고, 이동블럭(830d, 840d)과 지지축(830a, 840a)을 통하여 연결된 소자가압툴(830, 840)이 수직방향으로 이동될 수 있다.The moving blocks 830d and 840d may be connected to the cam members 830g and 840g through the cam followers 830e and 840e being inserted into the cam grooves 830f and 840f. The moving blocks 830d and 840d may be connected to the lifting guides 830h and 840h to move up and down. Accordingly, when the cam members 830g and 840g are rotated, the cam follower nodes 830e and 840e move vertically in accordance with the shape of the cam grooves 830f and 840f, and thus are connected to the cam follower nodes 830e and 840e. The moving blocks 830d and 840d may be moved in the vertical direction, and the element pressing tools 830 and 840 connected through the moving blocks 830d and 840d and the support shafts 830a and 840a may be moved in the vertical direction. .
승강가이드(830h, 840h)는 이동블럭(830d, 840d)의 상부에 구비된 고정물(804)에 고정될 수 있다. 다만, 본 발명은 이에 한정되지 않으며, 이동블럭(830d, 840d)의 승강을 안내할 수 있다면 승강가이드(830h, 840h)로 다양한 구성이 사용될 수 있다.The elevating guides 830h and 840h may be fixed to the fixture 804 provided on the moving blocks 830d and 840d. However, the present invention is not limited thereto, and various configurations may be used as the lifting guides 830h and 840h if the lifting blocks 830d and 840d can guide the lifting of the moving blocks 830d and 840d.
이와 같은 구성에 따르면, 소자가압툴(830, 840)은 수평이동장치(801)에 의하여 수평방향으로 이동되며, 이에 따라, 제1셔틀부(610)와 테스트소켓(310)의 사이 및 제2셔틀부(620)와 테스트소켓(310)의 사이에서 소자가압툴(830, 840)이 수평방향으로 이동될 수 있다. 또한, 소자가압툴(830, 840)은 제1수직이동장치(802)에 의하여 제1셔틀부(610)의 상부, 제2셔틀부(620)의 상부 및 테스트소켓(310)의 상부에서 수직방향으로 이동되면서 소자(1)를 픽업하거나 소자(1)를 적재할 수 있다. 이러한 소자가압툴(830, 840)은 테스트소켓(310)의 상부에서 수직방향으로 이동되면서 소자(1)를 테스트소켓(310)에 견고하게 결합시키기 위하여 소자(1)를 테스트소켓(310)으로 일정한 힘으로 가압하는 역할을 함께 수행할 수 있다.According to this configuration, the device pressing tools 830 and 840 are moved in the horizontal direction by the horizontal moving device 801, and thus, between the first shuttle 610 and the test socket 310 and the second The device pressing tools 830 and 840 may be moved in the horizontal direction between the shuttle 620 and the test socket 310. In addition, the element pressing tools 830 and 840 are perpendicular to the upper portion of the first shuttle portion 610, the upper portion of the second shuttle portion 620, and the upper portion of the test socket 310 by the first vertical moving device 802. The device 1 may be picked up or the device 1 may be loaded while being moved in the direction. The device pressing tools 830 and 840 are moved vertically from the top of the test socket 310 and the device 1 is connected to the test socket 310 in order to firmly couple the device 1 to the test socket 310. Pressurizing with a constant force can be performed together.
이와 같이, 소자가압툴(830, 840)은 캠부재(830g, 840g)의 회전에 따라서 수직방향으로 이동되므로, 소자가압툴(830, 840)의 수직방향으로의 이동위치가 정확하게 설정될 수 있다.As such, since the device pressing tools 830 and 840 are moved in the vertical direction according to the rotation of the cam members 830g and 840g, the moving positions of the device pressing tools 830 and 840 in the vertical direction can be set accurately. .
또한, 소자(1)가 테스트소켓(310)으로 가압되어 테스트가 진행되는 과정에서, 테스트소켓(310)에 대한 소자(1)의 가압상태를 소정의 시간 동안 유지하여야 한다. 이를 위하여, 캠부재(830g, 840g)를 이용하지 않고 볼스크류장치의 회전모터나 리니어모터와 같은 직선이동용 모터만을 이용한 경우에는, 소자(1)의 가압을 위한 비교적 큰 전압을 직선이동용 모터에 계속 인가하여 항상 일정한 힘으로 소자(1)에 가압하여야 했으나, 캠부재(830g, 840g)를 이용하는 경우에는 테스트소켓(310)에 대한 소자(1)의 가압상태가 구동모터(830j, 840j)에 인가되는 전압의 변화와 무관하게 캠부재(830g, 840g)의 제2반경구간의 형상에 따라 유지될 수 있다. 따라서, 소자가압툴(830, 840)을 수직방향으로 이동시키기 위한 제1수직이동장치(802)가 캠부재(830g, 840g)를 포함하여 구성되는 경우에는, 캠부재(830g, 840g)를 이용하지 않고 직선이동용 모터만을 이용한 경우에 비하여 에너지를 절감할 수 있는 효과가 있다.In addition, while the device 1 is pressed by the test socket 310 and the test is in progress, the pressing state of the device 1 against the test socket 310 must be maintained for a predetermined time. For this purpose, when only the linear motor such as the rotary motor or the linear motor of the ball screw device is used without using the cam members 830g and 840g, a relatively large voltage for pressurizing the element 1 is continued to the linear motor. When the cam members 830g and 840g are used, the pressing state of the device 1 against the test socket 310 is applied to the driving motors 830j and 840j. Regardless of the change in voltage, the cam member 830g may be maintained according to the shape of the second radius section of the cam members 830g and 840g. Accordingly, when the first vertical moving device 802 for moving the element pressing tools 830 and 840 in the vertical direction includes the cam members 830g and 840g, the cam members 830g and 840g are used. It is possible to save energy as compared to the case of using only a linear motor without moving.
한편, 소자(1)가 테스트소켓(310)으로 정확하게 가압되어 소자(1)에 대한 테스트가 정확하게 수행될 수 있도록, 테스트되는 소자(1)의 종류 또는 테스트소켓(310)의 종류에 따라 소자가압툴(830, 840)의 픽커(831, 841)가 위치되어야 할 가압위치가 변경될 수 있다. 또한, 소자가압툴(830, 840)이 그 가압위치로 정확하게 하강하여 소자(1)를 테스트소켓(310)으로 가압하고 있는지를 확인 및 점검할 필요가 있다.Meanwhile, the device 1 is pressurized by the test socket 310 so that the device 1 can be accurately tested so that the device 1 is pressurized according to the type of the device 1 being tested or the type of the test socket 310. The pressing position at which the pickers 831, 841 of the tools 830, 840 should be positioned may be changed. In addition, it is necessary to confirm and check whether the element pressing tools 830 and 840 are correctly lowered to the pressing position to press the element 1 with the test socket 310.
따라서, 소자가압툴(830, 840)의 가압위치를 변경하거나 확인하기 위해서는 먼저 소자가압툴(830, 840)과 연결된 수평이동장치(801) 및 제1수직이동장치(802)를 상하방향으로 승강시킨 후, 캠부재(830g, 840g)를 회전시키면서 소자가압툴(830, 840)의 가압위치가 설정되어야 할 가압위치, 즉, 기준위치와 일치하는지 여부를 판단할 필요가 있다.Accordingly, in order to change or confirm the pressing positions of the element pressing tools 830 and 840, first, the horizontal moving device 801 and the first vertical moving device 802 connected to the element pressing tools 830 and 840 are lifted in the vertical direction. After the rotation, the cam members 830g and 840g are rotated, and it is necessary to determine whether the pressing positions of the element pressing tools 830 and 840 coincide with the pressing positions to be set, that is, the reference positions.
이를 위하여, 본 발명의 실시예에 따른 소자검사장치에는, 도 20 및 도 21에 도시된 바와 같이, 소자가압툴(830, 840), 수평이동장치(801) 및 제1수직이동장치(802)로 구성되는 소자가압부와 연결되어 소자가압부를 수직방향으로 선형으로 이동시키는 제2수직이동장치(805)와, 제2수직이동장치(805)에 의하여 소자가압툴(830, 840)이 테스트부(300)와 접촉되었을 때 제2수직이동장치(805)에 의하여 테스트부(300)에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때의 소자가압툴(830, 840)의 위치를 가압위치로 결정하는 제어부(807)를 포함할 수 있다.To this end, the device inspection apparatus according to an embodiment of the present invention, as shown in Figure 20 and 21, the device pressing tools 830, 840, the horizontal moving device 801 and the first vertical moving device 802 The device pressing tools 830 and 840 are connected to the device pressing unit including a second vertical moving device 805 and a second vertical moving device 805 to move the device pressing unit linearly in the vertical direction. Detecting the load applied to the test unit 300 by the second vertical moving device 805 when contacted with (300), and the element pressing tools (830, 840) when the detected load becomes a predetermined reference load It may include a controller 807 to determine the position of the pressing position.
제2수직이동장치(805)는 제1수직이동장치(802) 및 수평이동장치(801)와도 연결될 수 있으며, 이와 같은 경우, 제1수직이동장치(802) 및 수평이동장치(801)가 함께 제2수직이동장치(805)에 의하여 승강될 수 있고, 이에 따라, 소자가압툴(830, 840)이 승강될 수 있다.The second vertical movement device 805 may also be connected to the first vertical movement device 802 and the horizontal movement device 801, and in this case, the first vertical movement device 802 and the horizontal movement device 801 may be together. The second vertical moving device 805 may be lifted and, accordingly, the device pressing tools 830 and 840 may be lifted and lowered.
소자가압툴(830, 840)에서 테스트부(300)에 접촉되는 부분은 픽커(831, 841)의 주위에 위치된 픽커모듈(834, 844)의 하측면, 즉, 픽커지지블럭(836, 846)의 하측면이 될 수 있다. 이를 위하여, 픽커지지블럭(836, 846)의 하측면 중 테스트부(300)와 접촉되는 부분은 알루미늄과 같은 금속으로 이루어질 수 있다.A portion of the device pressing tools 830 and 840 contacting the test unit 300 is a lower side of the picker modules 834 and 844 positioned around the pickers 831 and 841, that is, the picker support blocks 836 and 846. It can be the lower side of). To this end, a portion of the lower side surfaces of the picker support blocks 836 and 846 which are in contact with the test unit 300 may be made of a metal such as aluminum.
또한, 테스트부(300)에서 소자가압툴(830, 840)이 접촉되는 부분은, 테스트소켓(310)을 지지하는 지지프레임(312)의 상측면이 될 수 있다. 이를 위하여, 지지프레임(312)의 상측면 중 소자가압툴(830, 840)이 접촉되는 부분은 알루미늄과 같은 금속으로 이루어질 수 있다. 소자(1)를 테스트소켓(310)으로 가압하여 테스트를 수행하는 과정에서 픽커모듈(834, 844)의 하측면이 지지프레임(312)의 상측면에 접촉되면서, 소자가압툴(830, 840)의 하강이 제한되면서 테스트소켓(310)에 대한 소자(1)의 가압위치가 결정된다.In addition, a portion where the device pressing tools 830 and 840 contact each other in the test unit 300 may be an upper surface of the support frame 312 supporting the test socket 310. To this end, a portion of the upper surface of the support frame 312 in which the element pressing tools 830 and 840 contact may be made of a metal such as aluminum. In the process of performing the test by pressing the device 1 with the test socket 310, the lower surface of the picker module (834, 844) is in contact with the upper surface of the support frame 312, the device pressing tools (830, 840) The downward position of the device 1 with respect to the test socket 310 is limited while the lowering of.
따라서, 소자(1)의 종류, 테스트소켓(310)의 종류 또는 테스트소켓(310)의 내부에 구비되는 단자(311)의 종류 등이 변경됨에 따라 지지프레임(312)의 높이가 달라지는 경우에는, 소자가압툴(830, 840)의 하측면이 지지프레임(312)의 상측면에 접촉되는지 여부를 판단하는 것을 통하여, 소자(1)가 가압위치에 위치되는지 여부를 판단할 수 있다.Therefore, when the type of the device 1, the type of the test socket 310 or the type of the terminal 311 provided inside the test socket 310, etc., the height of the support frame 312 is changed, By determining whether the lower surfaces of the device pressing tools 830 and 840 are in contact with the upper surface of the support frame 312, it may be determined whether the device 1 is located at the pressing position.
이를 위하여, 소자가압툴(830)의 하측면이 지지프레임(312)의 상측면에 접촉되는지 여부를 감지하는 센서를 구비하는 방안이 고려될 수 있으나, 이와 같은 경우에는 센서의 구비에 따라 비용이 증가하는 단점이 있으며, 센서의 설치위치 등을 고려할 때 소자가압툴(830, 840) 및 테스트소켓(310)의 구성이 복잡해지는 문제가 있다.To this end, it may be considered to include a sensor for detecting whether the lower side of the device pressing tool 830 is in contact with the upper side of the support frame 312, but in this case, the cost is dependent on the provision of the sensor There is an increasing disadvantage, and the configuration of the device pressing tools 830, 840 and the test socket 310 is complicated when considering the installation position of the sensor.
따라서, 소자가압툴(830, 840)이 테스트부(300)와 접촉되었을 때, 제2수직이동장치(805)의 부하의 변화량을 감지하고, 감지된 부하의 변화량을 이용하여 테스트부(300)에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때의 소자가압툴(830, 840)의 위치를 가압위치로 결정하는 제어부(807)가 구비된다.Therefore, when the element pressing tools 830 and 840 are in contact with the test unit 300, the change amount of the load of the second vertical mobile device 805 is sensed and the test unit 300 is detected using the detected change amount of the load. A control unit 807 is provided which detects the load applied to the load and determines the positions of the element pressing tools 830 and 840 as the pressing positions when the detected load becomes a preset reference load.
제어부(807)는, 제2수직이동장치(805)가 모터(806)를 포함하는 볼스크류장치 또는 모터(806)와 풀리를 통하여 연결되는 벨트이송기구가 되는 경우에는, 도 20에 도시된 바와 같이, 모터(806)와 연결되어 모터(806)의 토크와 같은 부하를 감지할 수 있다. 이와 같은 구성에 따르면, 소자가압툴(830, 840)이 테스트부(300)에 접촉되지 않은 상태에서 제2수직이동장치(805)에 의하여 소자가압툴(830, 840)이 하강하는 경우에는 제어부(807)가 감지하는 모터(806)의 부하의 변화량이 크지 않으나, 소자가압툴(830, 840)이 테스트부(300)에 접촉되는 경우에는 제어부(807)에서 감지되는 부하가 증가하게 된다. 따라서, 제어부(807)는 모터(806)의 부하를 감지하고, 감지된 부하를 이용하여, 소자가압툴(830, 840)이 테스트부(300)와 접촉되었을 때 제2수직이동장치(805)에 의하여 테스트부(300)에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때의 소자가압툴(830, 840)의 위치를 가압위치로 결정한다.The control unit 807, when the second vertical movement device 805 is a ball screw device including the motor 806 or a belt transfer mechanism connected to the motor 806 through the pulley, as shown in FIG. Likewise, it may be connected to the motor 806 to sense a load such as torque of the motor 806. According to such a configuration, when the device pressing tools 830 and 840 are lowered by the second vertical moving device 805 while the device pressing tools 830 and 840 are not in contact with the test unit 300, the control unit Although the amount of change in the load of the motor 806 detected by the 807 is not large, when the device pressing tools 830 and 840 are in contact with the test unit 300, the load detected by the controller 807 increases. Accordingly, the controller 807 detects the load of the motor 806 and uses the sensed load to control the second vertical moving device 805 when the device pressing tools 830 and 840 are in contact with the test unit 300. The load applied to the test unit 300 is detected, and the positions of the element pressing tools 830 and 840 when the detected load becomes the preset reference load are determined as the pressing positions.
다른 예로서, 제2수직이동장치(805)가 영구자석과 전자석 간의 전자기적 상호작용을 이용하여 작동하는 리니어모터인 경우, 제어부(807)는 리니어모터의 부하를 감지하도록 구성될 수 있다.As another example, when the second vertical moving device 805 is a linear motor that operates using electromagnetic interaction between the permanent magnet and the electromagnet, the controller 807 may be configured to sense the load of the linear motor.
이하, 상기한 바와 같은 구성을 이용하여, 소자가압툴(830, 840)의 가압위치를 설정하는 방법에 대하여 설명한다.Hereinafter, a method of setting the pressing positions of the element pressing tools 830 and 840 using the above configuration will be described.
먼저, 소자가압툴(830, 840) 중 제1소자가압툴(830)을 미리 설정된 높이를 가지는 테스트부(300)의 상부, 즉, 지지프레임(312)의 상부에 위치시킨 후, 제1소자가압툴(830)과 연결된 캠부재(830g)를 회전시켜 제1소자가압툴(830)이 캠부재(830a)의 회전에 의하여 하강할 수 있는 최하위치에 제1소자가압툴(830)을 위치시킨다.First, the first device pressing tool 830 of the device pressing tools 830 and 840 is positioned above the test unit 300 having a predetermined height, that is, above the support frame 312, and then the first device. The first element pressing tool 830 is positioned at the lowest position where the first element pressing tool 830 can be lowered by the rotation of the cam member 830a by rotating the cam member 830g connected to the pressing tool 830. Let's do it.
그리고, 제2수직이동장치(805)를 작동하여 소자가압부를 서서히 하강시키면서 제1소자가압툴(830)을 서서히 하강시키는 과정을 수행한다. 이와 동시에, 제어부(807)는 제2수직이동장치(805)의 부하를 감지하는 것을 통하여 제1소자가압툴(830)이 테스트부(300)에 가하는 하중을 감지하는 과정을 수행한다.Then, the second vertical moving device 805 is operated to gradually lower the first device pressing tool 830 while gradually lowering the device pressing unit. At the same time, the controller 807 detects the load applied by the first device pressing tool 830 to the test unit 300 by sensing the load of the second vertical mobile device 805.
도 20 및 도 21에 도시된 바와 같이, 제2수직이동장치(805)에 의하여 제1소자가압툴(830)이 하강함에 따라 제1소자가압툴(830)이 테스트부(300)에 접촉되며, 이에 따라, 제1소자가압툴(830)이 테스트부(300)에 가하는 하중이 변화하게 된다. 이때, 제어부(807)는 제1소자가압툴(830)이 테스트부(300)에 가하는 하중이 기준하중이 되었을 때, 제1소자가압툴(830)의 위치가 미리 설정된 가압위치와 일치되었다고 판단하고, 제2수직이동장치(805)의 작동을 중지한다.As shown in FIGS. 20 and 21, as the first device pressing tool 830 is lowered by the second vertical moving device 805, the first device pressing tool 830 contacts the test unit 300. Accordingly, the load applied by the first device pressing tool 830 to the test unit 300 is changed. At this time, the controller 807 determines that the position of the first element pressing tool 830 coincides with the preset pressing position when the load applied by the first element pressing tool 830 to the test unit 300 becomes the reference load. Then, the operation of the second vertical transfer device 805 is stopped.
상기한 바와 같이, 제1소자가압툴(830)의 가압위치를 설정하는 과정을 완료한 후에는, 제2소자가압툴(840)의 가압위치를 설정하는 과정을 제1소자가압툴(830)의 가압위치를 설정하는 과정과 동일하게 수행할 수 있다.As described above, after the process of setting the pressing position of the first device pressing tool 830 is completed, the process of setting the pressing position of the second device pressing tool 840 is performed by the first device pressing tool 830. It can be carried out in the same manner as the process of setting the pressing position of.
이와 같은 과정을 통하여, 소자가압툴(830, 840)의 가압위치가 설정되면, 소자가압툴(830, 840)로 소자(1)를 픽업하여 테스트소켓(310)으로 가압하는 소자(1)의 테스트과정을 수행할 수 있다.Through such a process, when the pressing positions of the element pressing tools 830 and 840 are set, the element 1 is picked up by the element pressing tools 830 and 840 and pressed into the test socket 310. You can perform the test process.
상술한 바와 같은 본 발명의 실시예에 따른 소자검사장치는, 소자(1)의 종류 또는 테스트소켓(310)의 종류에 따라 소자가압툴(830, 840)의 가압위치를 조절할 필요가 있는 경우, 또는, 소자가압툴(830, 840)이 그 가압위치로 정확하게 하강하여 소자(1)를 테스트소켓(310)으로 가압하고 있는지를 확인 및 점검할 필요가 있는 경우, 제2수직이동장치(805)를 작동시켜 소자가압툴(830, 840)이 테스트부(300)에 접촉되도록 하강하는 것과 함께 제2수직이동장치(805)의 부하를 감지하고, 감지된 부하를 이용하여 테스트부(300)에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때, 소자가압툴(830, 840)의 위치를 가압위치로 결정하는 것을 통하여, 소자가압툴(830, 840)의 가압위치를 용이하면서도 정확하게 결정할 수 있다.In the device inspection apparatus according to the embodiment of the present invention as described above, when it is necessary to adjust the pressing position of the device pressing tools 830, 840 according to the type of the device 1 or the type of the test socket 310, Alternatively, when it is necessary to check and check whether the element pressing tools 830 and 840 are correctly lowered to the pressing position to press the element 1 with the test socket 310, the second vertical moving device 805 By operating the device pressing tools 830 and 840 are brought into contact with the test unit 300 and the load of the second vertical moving device 805 is sensed, and the detected load is applied to the test unit 300. When the applied load is detected and the detected load becomes a preset reference load, the pressing positions of the element pressing tools 830 and 840 are determined by determining the positions of the element pressing tools 830 and 840 as the pressing positions. Easy and accurate decision
한편, 소자(1) 이송을 위한 로딩이송툴(810, 814), 언로딩이송툴(820, 824) 또는 소자가압툴(830, 840)의 픽커(891)들은 도 10에 도시된 바와 같이, 소자(1)의 흡착이 용이하도록 그 끝단에 고무 등의 재질을 가지는 흡착패드(892)가 결합되는데, 소자(1)의 변경이 있는 경우, 마모에 따라서 흡착에 불량이 있는 경우, 유지보수 경과 등의 경우 흡착패드(892)를 교체하여야 한다.Meanwhile, as shown in FIG. 10, the picking tools 881 of the loading transfer tools 810 and 814, the unloading transfer tools 820 and 824, or the device pressing tools 830 and 840 for transferring the device 1 are shown in FIG. 10. Adsorption pads 892 made of rubber or the like are coupled to the ends of the device 1 to facilitate adsorption of the device 1. In this case, the suction pad 892 should be replaced.
그런데, 흡착패드(892)의 교환은 종래의 경우 수작업에 의하여 이루어져 픽커(891)들을 분리하여 일일이 하나씩 교체하는 등 매우 불편한 문제점이 있다.However, the replacement of the adsorption pad 892 is made by hand in the conventional case, which is very inconvenient, such as separating the pickers 891 and replacing them one by one.
이에 본 발명은 로딩이송툴(810, 814), 언로딩이송툴(820, 824) 또는 소자가압툴(830, 840)들 중 적어도 어느 하나의 픽커(891)들에 각각 결합된 흡착패드(892)를 자동으로 교환할 수 있는 흡착패드교환부(900)를 추가로 포함할 수 있다. 여기에서, 픽커(891)는, 로딩이송툴(810, 814) 및 언로딩이송툴(820, 824)에 마련되는 픽커 및 소자가압툴(830, 840)에 마련되는 픽커(831, 841)가 될 수 있다.Accordingly, the present invention provides a suction pad 892 coupled to the pickers 891 of at least one of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840. ) May further include an adsorption pad exchanger 900 capable of automatically replacing. Here, the picker 891 may include pickers provided in the loading transfer tools 810 and 814 and picking units provided in the unloading transfer tools 820 and 824 and pickers 831 and 841 provided in the element pressing tools 830 and 840. Can be.
도 22 내지 도 27에 도시된 바와 같이, 흡착패드교환부(900)는 로딩이송툴(810, 814), 언로딩이송툴(820, 824) 또는 소자가압툴(830, 840)의 동선을 고려하여 적절한 위치에 배치되며, 픽커(891)의 흡착패드(892)가 삽입되는 복수의 흡착패드수용공간(911)들이 형성된 흡착패드수용부(910)들과, 흡착패드수용부(911)들 중 적어도 일부에 설치되어 흡착패드수용공간(911)에 수용된 흡착패드를 픽업하는 흡착패드픽업부(920)를 포함할 수 있다.As shown in FIGS. 22 to 27, the suction pad exchanger 900 considers the copper wire of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840. Of the suction pad accommodating pads 910 and the suction pad accommodating pads 911 which are disposed at an appropriate position and have a plurality of suction pad accommodating spaces 911 into which the suction pads 892 of the picker 891 are inserted. It may include a suction pad pick-up unit 920 installed at least in part to pick up the suction pad accommodated in the suction pad accommodation space (911).
여기에서, 흡착패드픽업부(920)가 설치된 흡착패드수용부(910)들 중 적어도 일부는 픽커(891)들로부터 패드픽업부(920)에 의하여 흡착패드(892)를 분리하여 수용할 수 있도록 흡착패드수용공간(911)이 비워져 있으며, 흡착패드픽업부(920)들 중 적어도 일부의 흡착패드수용부(910)는 흡착패드(892)가 제거된 픽커(891)에 교체될 새로운 흡착패드(892)가 삽입되어 있다.Here, at least some of the suction pad accommodating parts 910 in which the suction pad pickup part 920 is installed may be separated from the pickers 891 by the pad pickup part 920 to accommodate the suction pad 892. The adsorption pad accommodation space 911 is empty, and the adsorption pad accommodation portion 910 of at least some of the adsorption pad pickup portions 920 may be replaced with a new adsorption pad to be replaced with the picker 891 from which the adsorption pad 892 has been removed. 892) is inserted.
흡착패드수용부(910)는 복수의 흡착패드(892)들이 형성됨으로써 픽커(891)들로부터 패드픽업부(920)에 의하여 흡착패드(892)를 분리하여 수용하거나, 흡착패드(892)가 제거된 픽커(891)에 교체될 새로운 흡착패드(892)가 삽입되는 구성으로서 다양한 구성이 가능하다.The suction pad accommodating part 910 is formed by a plurality of suction pads 892, so that the suction pads 892 are separated from the pickers 891 by the pad pick-up part 920, or the suction pads 892 are removed. Various configurations are possible as a new suction pad 892 is inserted into the picker 891 to be replaced.
일 예로서, 흡착패드수용부(910)는 복수의 흡착패드수용공간(911)들이 형성된 수용부본체(912)를 포함할 수 있다.As an example, the suction pad accommodating part 910 may include a receiving part body 912 in which a plurality of suction pad accommodating spaces 911 are formed.
수용부본체(912)는 흡착패드수용공간(911)들이 형성되는 구성으로서 다양한 구성이 가능하다.The accommodating part body 912 is a configuration in which the suction pad accommodating spaces 911 are formed, and various configurations are possible.
흡착패드수용공간(911)는 픽커(891)로부터 분리된 흡착패드(892)를 수납하거나, 흡착패드(892)가 분리된 픽커(891)에 결합될 새로운 흡착패드(892)가 수납되는 구성으로서 흡착패드(892)가 수용될 수 있으면 홈 등 다양한 구성이 가능하다.The adsorption pad accommodation space 911 is configured to accommodate the adsorption pad 892 separated from the picker 891 or to accommodate a new adsorption pad 892 to be coupled to the picker 891 from which the adsorption pad 892 is separated. If the suction pad 892 can be accommodated, various configurations such as grooves are possible.
흡착패드픽업부(920)는 픽커(891)들로부터 패드픽업부(920)에 의하여 흡착패드(892)를 분리하기 위한 구성으로서, 수용부본체(912)에 설치되어 흡착패드(892)가 픽커(891)에 결합된 상태로 흡착패드수용공간(911)에 삽입된 후 흡착패드(892)를 픽업하도록 구성되는 등 다양한 구성이 가능하다.The suction pad pick-up unit 920 is configured to separate the suction pad 892 from the pickers 891 by the pad pick-up unit 920. The suction pad pick-up unit 920 is installed at the receiving unit body 912 so that the suction pad 892 is a picker. Various configurations are possible, such as configured to pick up the suction pad 892 after being inserted into the suction pad accommodation space 911 in a state coupled to the 891.
예를 들면 상기 흡착패드픽업부(920)는 걸림 및 걸림해제를 통한 픽업/픽업해제, 링형태의 클램퍼 등을 이용한 클램핑 및 클램핑해제를 통한 픽업/픽업해제 등 그 픽업방식에 따라서 다양한 구성이 가능하다.For example, the adsorption pad pick-up unit 920 may be configured in various ways according to its pickup method, such as pick-up / pick-up through locking and release, clamping using a ring-type clamper, and pick-up / release through clamping-release. Do.
또 다른 예로서, 흡착패드픽업부(920)는 수용부본체(912)의 상면을 복개함과 아울러 상면과 평행한 방향, 즉 수평방향으로 이동이 가능하도록 설치되는 이동부재(921)를 포함할 수 있다.As another example, the suction pad pick-up unit 920 may include a moving member 921 installed to be movable in a direction parallel to the upper surface, that is, in a horizontal direction, while covering the upper surface of the accommodating body 912. Can be.
이때, 이동부재(921)는 수평이동에 의하여 걸림 및 걸림해제를 통한 픽업/픽업해제를 위한 구성으로서 다양한 구성이 가능하며, 예로서, 도 22 내지 도 27에 도시된 바와 같이, 흡착패드(892)가 픽커(891)에 결합된 상태로 관통하여 흡착패드수용공간(911)으로 이동이 가능하도록 형성된 복수의 관통부분(922)들과, 관통부분(922)들 각각과 연결되어 흡착패드(892)가 픽커(891)에 결합된 상태에서 흡착패드수용공간(911)으로부터 이동될 때 흡착패드(892)가 걸림되고 픽커(891)만이 이동이 가능하도록 형성된 복수의 걸림부분(923)들을 포함할 수 있다.In this case, the moving member 921 may be configured in various ways as a configuration for picking up / un-picking up through locking and releasing by horizontal movement. For example, as illustrated in FIGS. 22 to 27, the suction pad 892 may be used. ) Is coupled to the picker 891 and the plurality of penetrating portions 922 are formed so as to be movable to the suction pad accommodation space 911 and are connected to each of the penetrating portions 922 and the suction pad 892. ) Includes a plurality of locking portions 923 formed so that the adsorption pad 892 is engaged and only the picker 891 is movable when it is moved from the adsorption pad accommodation space 911 in a state coupled to the picker 891. Can be.
특히, 이동부재(921)에 의한 걸림효과를 높이기 위하여, 흡착패드(892)는 픽커(891)의 외주면보다 더 돌출된 돌출부(892a)가 형성될 수 있으며, 이때 걸림부분(923)은 픽커(891)의 외주면보다는 크고 돌출부(892a)의 외주면보다 작게 형성되어 픽커(891)의 상측방향 이동시 흡착패드(892)가 걸림될 수 있다.In particular, in order to increase the locking effect by the moving member 921, the suction pad 892 may have a protrusion 892a which protrudes more than the outer circumferential surface of the picker 891, wherein the locking portion 923 is a picker ( The suction pad 892 may be larger than the outer circumferential surface of the 891 and smaller than the outer circumferential surface of the protrusion 892a so that the adsorption pad 892 may be caught when the picker 891 moves upward.
흡착패드픽업부(920)의 이동부재(921)는 흡착패드(892) 및 흡착패드(892)가 결합되는 픽커(891)에서 반경의 크기가 다름을 고려하여, 흡착패드(892)의 최대반경보다 큰 관통부분(922)과, 흡착패드(892)의 적어도 일부에서 반경이 작은 걸림부분(923)을 구비함으로써, 흡착패드수용공간(911)에 흡착패드(892)가 삽입될 때 흡착패드수용공간(911) 상에 관통부분(922)을 위치시키고 픽커(891)에서 흡착패드(892)를 분리할 때 걸림부분(923)을 위치시키도록 구성될 수 있다.The movable member 921 of the suction pad pick-up unit 920 has a maximum radius of the suction pad 892 in consideration of the size of the radius of the picker 891 to which the suction pad 892 and the suction pad 892 are coupled. By having a larger through portion 922 and a locking portion 923 having a smaller radius in at least a portion of the suction pad 892, the suction pad accommodation is accommodated when the suction pad 892 is inserted into the suction pad accommodation space 911. The through portion 922 may be positioned on the space 911 and the catching portion 923 may be positioned when the suction pad 892 is separated from the picker 891.
한편, 흡착패드픽업부(920)의 이동부재(921)는 흡착패드(892)의 걸림 및 걸림해제 위치로 이동됨을 특징으로 하는바 도시되지는 않았지만 선형이동장치에 의하여 선형이동되는 등 다양한 구동원에 의하여 그 이동이 구동될 수 있다.On the other hand, the moving member 921 of the suction pad pick-up unit 920 is moved to the engaging and releasing position of the suction pad 892, although not shown in the various driving sources such as linear movement by a linear moving device The movement can be driven by this.
한편, 로딩이송툴(810, 814), 언로딩이송툴(820, 824) 또는 의 픽커(891)에서 흡착패드(892)를 교체하고자 하는 경우 흡착패드교환부(900)의 위치, 먼저 흡착패드픽업부(920)가 결합된 흡착패드수용부(910)로 이동하여 흡착패드(892)를 분리한 다음(도 23 내지 도 25), 새로운 흡착패드(892)가 수용된 흡착패드수용부(910)로 이동하여 새로운 흡착패드(892)가 결합되어(도 24 및 도 25), 흡착패드(892) 교체를 마친 후 소자(1) 이송작업을 수행한다.On the other hand, if you want to replace the adsorption pad 892 in the loading transfer tool (810, 814), unloading transfer tool (820, 824) or the picker 891 of the position of the adsorption pad exchange unit 900, first, the adsorption pad The pick-up unit 920 is moved to the adsorption pad accommodation unit 910 to which it is coupled to separate the adsorption pad 892 (FIGS. 23 to 25), and then the adsorption pad accommodation unit 910 where the new adsorption pad 892 is accommodated. The new adsorption pad 892 is coupled (FIGS. 24 and 25) to complete the replacement of the adsorption pad 892, and then transfers the device 1.
한편 상기와 같은 소자(1) 이송을 위한 로딩이송툴(810, 814), 언로딩이송툴(820, 824) 또는 소자가압툴(830, 840) 에 관한 구성은 소자검사장치 이외에, 미리 수행된 검사결과에 따라서 소자의 분류를 수행하는 분류공정을 수행하거나, 소자를 검사하고 및 그 검사에 따라서 소자를 분류하는 검사 및 분류공정을 수행하는 소자핸들러로서, 소자들을 트레이에 적재하여 로딩하고 하나 이상의 이송툴에 의하여 복수의 소자들을 이송하는 소자핸들러에 적용될 수 있음은 물론이다.Meanwhile, the configuration of the loading transfer tool 810, 814, the unloading transfer tool 820, 824, or the element pressing tool 830, 840 for transferring the device 1 may be performed in advance in addition to the device inspection device. A device handler that performs a classification process for classifying devices according to an inspection result, or performs an inspection and classification process for classifying devices according to the inspection and classifying the devices according to the inspection. Of course, it can be applied to the element handler for transferring a plurality of elements by the transfer tool.
이상에서는 본 발명의 바람직한 실시예를 예시적으로 설명하였으나, 본 발명의 범위는 이와 같은 특정 실시예에만 한정되는 것은 아니며, 특허청구범위에 기재된 범주 내에서 적절하게 변경 가능한 것이다.Although the preferred embodiments of the present invention have been described above by way of example, the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope described in the claims.

Claims (42)

  1. 다수개의 소자들이 적재된 하나 이상의 트레이가 로딩되는 로딩부와;A loading unit in which one or more trays in which a plurality of elements are loaded are loaded;
    상기 로딩부로부터 소자들을 전달받아 각 소자의 테스트를 위한 복수의 테스트소켓들을 포함하는 테스트부와;A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit;
    상기 테스트부의 테스트결과에 따라서 테스트를 마친 소자들을 분류하여 적재하는 언로딩부와;An unloading unit configured to classify and load the tested elements according to the test result of the test unit;
    상기 로딩부, 상기 테스트부 및 상기 언로딩부 사이에서 소자를 이송하는 하나 이상의 이송툴들을 포함하며,At least one transfer tool for transferring the device between the loading unit, the test unit and the unloading unit,
    상기 이송툴은 상기 로딩부로부터 소자들을 상기 테스트부로 전달하거나, 상기 테스트부로부터 상기 언로딩부로 소자를 전달하는 한 쌍의 소자가압툴들을 포함하며,The transfer tool includes a pair of device pressing tools for transferring devices from the loading unit to the test unit, or for transferring elements from the test unit to the unloading unit,
    상기 소자가압툴들은 이동가능하게 설치되는 지지부와, 상기 지지부에 탈착가능하게 결합되며 하나 이상의 픽커들이 결합되는 하나 이상의 픽커모듈을 포함하는 것을 특징으로 하는 소자검사장치.The device pressurization tools are device inspection apparatus characterized in that it comprises a support that is movably installed, and at least one picker module detachably coupled to the support and one or more pickers are coupled.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 픽커모듈은 히터와, 온도센서와, 상기 히터 및 상기 온도센서에 대한 전원공급 및 신호전달을 위한 하나 이상의 제1커넥터가 설치된 것을 특징으로 하는 소자검사장치.The picker module includes a heater, a temperature sensor, and at least one first connector for power supply and signal transmission to the heater and the temperature sensor is installed.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 제1커넥터는 상기 지지부에 설치된 제2커넥터와 삽입결합에 의하여 연결되는 것을 특징으로 하는 소자검사장치.And the first connector is connected to the second connector installed in the support part by insertion coupling.
  4. 청구항 3에 있어서The method according to claim 3
    상기 제1커넥터 및 상기 제2커넥터는 상기 지지부 및 상기 픽커모듈이 결합될 때 함께 결합되는 것을 특징으로 하는 소자검사장치.And the first connector and the second connector are coupled together when the support and the picker module are coupled to each other.
  5. 청구항 4에 있어서,The method according to claim 4,
    상기 제1커넥터 및 상기 제2커넥터는 상기 지지부 및 상기 픽커모듈의 결합 시 서로 접촉되는 부분에 설치된 것을 특징으로 하는 소자검사장치.And the first connector and the second connector are installed at portions in contact with each other when the support unit and the picker module are coupled to each other.
  6. 청구항 1 내지 청구항 5 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 5,
    상기 로딩부의 트레이로부터 로딩이송툴을 통해 소자들을 전달받아 임시로 적재하는 로딩버퍼부와;A loading buffer unit which temporarily receives elements from a tray of the loading unit through a loading transfer tool and temporarily loads the elements;
    상기 테스트부를 중심으로 상기 로딩버퍼부와 대향되는 위치에 설치되어 상기 테스트부에 의한 테스트가 완료된 소자들을 전달받는 언로딩버퍼부를 추가로 포함하는 것을 특징으로 하는 소자검사장치.And an unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit.
  7. 청구항 6에 있어서,The method according to claim 6,
    상기 하나 이상의 이송툴에 의하여 상기 로딩버퍼부로부터 소자들을 전달받아 상기 테스트부에 전달하거나 상기 테스트부로부터 소자를 전달받아 상기 언로딩버퍼부로 소자를 전달하는 제1셔틀부 및 제2셔틀부를 포함하는 것을 특징으로 하는 소자검사장치.A first shuttle part and a second shuttle part receiving the elements from the loading buffer part by the one or more transfer tools and transferring the elements to the test part or receiving the elements from the test part and transferring the elements to the unloading buffer part; Device inspection apparatus characterized in that.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 제1셔틀부 및 제2셔틀부는 상기 테스트부를 중심으로 서로 대향되어 설치되며,The first shuttle unit and the second shuttle unit is installed to face each other with respect to the test unit,
    상기 제1셔틀부 및 제2셔틀부는 각각 가이드레일과, 상기 가이드레일을 따라서 이동되어 상기 로딩버퍼부로부터 소자를 전달받기 위한 제1소자전달위치, 상기 테스트부와의 소자교환위치, 상기 언로딩버퍼부로 소자를 전달하기 위한 제2소자전달위치를 번갈아가면서 이동되는 하나 이상의 셔틀플레이트를 포함하는 것을 특징으로 하는 소자검사장치.The first shuttle portion and the second shuttle portion are guide rails and a first device transfer position for receiving a device from the loading buffer part and moved along the guide rail, respectively, an element exchange position with the test part, and the unloading. And at least one shuttle plate which is alternately moved to a second device delivery position for delivering a device to the buffer unit.
  9. 복수의 소자가 로딩되는 로딩부;A loading unit in which a plurality of elements are loaded;
    상기 로딩부로부터 이송된 소자에 대한 테스트를 수행하기 위한 복수의 테스트소켓이 마련되는 테스트부;A test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit;
    상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부; 및An unloading unit which classifies the device having been tested in the test unit according to a test result; And
    상기 소자를 픽업하여 상기 테스트소켓으로 가압하는 소자가압부를 포함하고,An element pressing unit for picking up the element and pressing the test socket;
    상기 소자가압부는,The device pressing unit,
    상기 소자를 픽업하여 선형이동에 의하여 상기 소자를 가압위치로 이동시켜 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴;One or more element pressing tools for picking up the element and moving the element to a pressing position by linear movement to press the element into the test socket;
    상기 소자가압툴과 연결되어 상기 소자가압툴을 상기 테스트소켓으로 이동시키는 수평이동장치; 및A horizontal moving device connected to the device pressing tool to move the device pressing tool to the test socket; And
    캠부재에 의하여 상기 소자가압툴을 가압위치로 수직으로 이동시키는 제1수직이동장치를 포함하는 것을 특징으로 하는 소자검사장치.And a first vertical moving device for vertically moving the device pressing tool to the pressing position by a cam member.
  10. 청구항 9에 있어서,The method according to claim 9,
    상기 수평이동장치는,The horizontal moving device,
    상기 소자가압툴로부터 수직방향으로 연장되는 지지축이 수평방향으로의 이동이 구속되되 수직방향으로 이동이 가능하게 연결되는 연결부재; 및A connection member connected to the support shaft extending in the vertical direction from the device pressing tool so as to be constrained in the horizontal direction and movable in the vertical direction; And
    상기 연결부재를 수평방향으로 이동시키는 수평구동부를 포함하는 것을 특징으로 하는 소자검사장치.Device inspection apparatus comprising a horizontal drive for moving the connecting member in the horizontal direction.
  11. 청구항 10에 있어서,The method according to claim 10,
    상기 연결부재에는 수직방향으로 관통되게 형성되어 상기 지지축이 삽입되는 관통공이 형성되는 것을 특징으로 하는 소자검사장치.The connecting member is formed to penetrate in the vertical direction, the device inspection apparatus, characterized in that the through hole is formed is inserted into the support shaft.
  12. 청구항 10에 있어서,The method according to claim 10,
    상기 수평구동부는,The horizontal driving unit,
    상기 연결부재와 연결되는 벨트;A belt connected to the connection member;
    상기 벨트가 감기는 풀리; 및A pulley to which the belt is wound; And
    상기 풀리와 연결되는 회전모터를 포함하는 것을 특징으로 하는 소자검사장치.Device inspection apparatus comprising a rotating motor connected to the pulley.
  13. 청구항 9에 있어서,The method according to claim 9,
    상기 제1수직이동장치는,The first vertical moving device,
    상기 소자가압툴로부터 수직방향으로 연장되는 지지축이 수직방향으로의 이동은 구속되고 수평방향으로의 이동이 가능하게 각각 연결되는 이동블럭;A moving block to which the support shaft extending in the vertical direction from the device pressing tool is constrained in the vertical direction and connected to each other in a horizontal direction;
    상기 이동블럭에 연결되며 상기 캠부재에 형성되는 캠홈에 삽입되어 캠홈의 형상에 따라 수직방향으로 이동하는 캠종동절; 및A cam follower connected to the movable block and inserted into a cam groove formed in the cam member to move in a vertical direction according to the shape of the cam groove; And
    상기 이동블럭과 연결되어 상기 이동블럭의 수직방향으로의 이동을 안내하는 승강가이드를 포함하는 것을 특징으로 하는 소자검사장치.And an elevating guide connected to the movable block to guide the movement of the movable block in a vertical direction.
  14. 청구항 13에 있어서,The method according to claim 13,
    상기 이동블럭에는 상기 지지축의 단부와 연결되며 수평방향으로 연장되어 상기 지지축의 수평방향으로의 이동을 안내하는 안내레일이 설치되는 것을 특징으로 하는 소자검사장치.And a guide rail connected to an end of the support shaft and extending in a horizontal direction to guide the movement of the support shaft in a horizontal direction.
  15. 복수의 소자가 로딩되는 로딩부;A loading unit in which a plurality of elements are loaded;
    상기 로딩부로부터 이송된 소자에 대한 테스트를 수행하기 위한 복수의 테스트소켓이 마련되는 테스트부;A test unit provided with a plurality of test sockets for performing a test on the device transferred from the loading unit;
    상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부;An unloading unit which classifies the device in which the test is completed in the test unit according to a test result;
    상기 로딩부로부터 전달된 소자를 상기 테스트부 쪽으로 이송하고 상기 테스트부로부터 전달된 소자를 상기 언로딩부 쪽으로 이송하는 하나 이상의 셔틀부;At least one shuttle unit for transferring the device transferred from the loading unit toward the test unit and transferring the device transferred from the test unit toward the unloading unit;
    상기 로딩부에서 소자를 픽업하여 상기 셔틀부로 전달하는 하나 이상의 로딩이송툴;At least one loading transfer tool for picking up an element from the loading unit and transferring it to the shuttle unit;
    상기 셔틀부에서 소자를 픽업하여 상기 언로딩부로 전달하는 하나 이상의 언로딩이송툴; 및At least one unloading transfer tool for picking up the element from the shuttle unit and transferring the device to the unloading unit; And
    상기 셔틀부에서 소자를 픽업하여 상기 테스트소켓으로 가압하고, 상기 테스트소켓에 가압되면서 테스트가 완료된 소자를 상기 셔틀부로 전달하는 하나 이상의 소자가압툴을 포함하고,At least one device pressing tool for picking up the device from the shuttle unit and pressurized to the test socket, the device is pressed to the test socket and delivers the test device to the shuttle unit,
    상기 소자가압툴은, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커가 결합되는 하나 이상의 픽커모듈을 포함하며,The device pressing tool includes a support unit which is installed to be movable, and at least one picker module which is detachably coupled to the support unit, and at least one picker is coupled thereto.
    상기 지지부 및 상기 픽커모듈의 일측에는 상기 지지부 및 상기 픽커모듈을 체결하는 체결유닛이 마련되고, 상기 지지부 및 상기 픽커모듈의 타측에는 상기 지지부에 상기 픽커모듈을 지지시키는 지지유닛이 마련되는 것을 특징으로 하는 소자검사장치.One side of the support and the picker module is provided with a fastening unit for fastening the support and the picker module, the other side of the support and the picker module is provided with a support unit for supporting the picker module in the support portion Device inspection device.
  16. 청구항 15에 있어서,The method according to claim 15,
    상기 체결유닛은, 상기 픽커모듈의 일측에 설치되는 고리 및 고리를 상하방향으로 이동시키는 고리이동부재와, 상기 지지부의 일측에 설치되어 상기 고리가 걸리는 고리걸림부재를 포함하는 것을 특징으로 하는 소자검사장치.The fastening unit, the device inspection, characterized in that it comprises a ring moving member for moving the ring and the ring installed on one side of the picker module in the up and down direction, and the hook engaging member is installed on one side of the support portion to catch the ring Device.
  17. 청구항 15에 있어서,The method according to claim 15,
    상기 지지유닛은, 상기 픽커모듈의 타측에서 돌출되는 돌출편과, 상기 지지부의 타측에 설치되어 상기 돌출편이 삽입되어 고정되는 돌출편고정부를 포함하는 것을 특징으로 하는 소자검사장치.The support unit includes a protruding piece protruding from the other side of the picker module, and a protruding piece fixing part which is installed on the other side of the support and is inserted into and fixed to the protruding piece.
  18. 청구항 17에 있어서,The method according to claim 17,
    상기 돌출편고정부는, 상기 돌출편이 삽입되는 공간을 제공하도록, 상기 지지부의 하측면으로부터 돌출되는 제1지지부재와, 상기 제1지지부재에 지지되며 상기 지지부의 하측면으로부터 소정의 간격으로 배치되는 제2지지부재를 포함하는 것을 특징으로 하는 소자검사장치.The protruding piece fixing portion is provided with a first support member protruding from the lower surface of the support portion and a first interval supported by the first support member so as to provide a space into which the protruding piece is inserted. Device inspection apparatus comprising a second support member.
  19. 청구항 18에 있어서,The method according to claim 18,
    상기 돌출편고정부에는, 상기 제2지지부재를 탄성적으로 지지하는 탄성부재가 마련되는 것을 특징으로 하는 소자검사장치.The protruding piece fixing portion is provided with an element for resiliently supporting the second support member.
  20. 청구항 15에 있어서,The method according to claim 15,
    상기 지지유닛은,The support unit,
    상기 픽커모듈의 상측면으로부터 돌출되며 단턱부를 가지는 헤드가 상부에 형성되는 돌출바와,A protruding bar protruding from an upper side of the picker module and having a head having a stepped portion formed thereon;
    상기 지지부의 하측면에서 내입되어 상기 돌출바의 헤드가 수용되는 헤드수용부를 복개하며, 상기 돌출바의 헤드가 삽입되는 헤드삽입공이 형성되는 걸림판을 포함하는 것을 특징으로 하는 소자검사장치.And a locking plate inserted into the lower side of the support part to cover the head accommodation portion in which the head of the protruding bar is accommodated and a head insertion hole into which the head of the protruding bar is inserted.
  21. 청구항 15에 있어서,The method according to claim 15,
    상기 지지부 및 상기 픽커모듈의 사이에는, 상기 지지부 및 상기 픽커모듈 사이의 결합위치를 결정하는 위치결정유닛이 마련되는 것을 특징으로 하는 소자검사장치.And a positioning unit for determining a coupling position between the support and the picker module between the support and the picker module.
  22. 청구항 21에 있어서,The method according to claim 21,
    상기 위치결정유닛은,The positioning unit,
    상기 픽커모듈의 상측면으로부터 돌출되는 돌출봉과,Protruding rods protruding from the upper surface of the picker module,
    상기 지지부의 하측면으로부터 내입되어 상기 돌출봉이 삽입되는 돌출봉삽입홈을 포함하는 것을 특징으로 하는 소자검사장치.And a protrusion rod insertion groove which is inserted from the lower side of the support to insert the protrusion rod.
  23. 청구항 15에 있어서,The method according to claim 15,
    상기 지지부와 상기 픽커모듈의 사이에는 상기 지지부와 상기 픽커모듈의 결합여부를 감지하는 감지센서가 마련되는 것을 특징으로 하는 소자검사장치.A device inspection apparatus is provided between the support unit and the picker module to detect a coupling between the support unit and the picker module.
  24. 청구항 15에 있어서,The method according to claim 15,
    상기 픽커모듈에는 공압통로를 통하여 작용되는 공압을 조절하면서 상기 픽커에 픽업된 소자가 상기 테스트소켓에 가압될 때의 상기 테스트소켓에 대한 상기 소자의 접촉력을 조절하는 댐퍼가 구비되는 것을 특징으로 하는 소자검사장치.The picker module is provided with a damper for adjusting the contact force of the device with respect to the test socket when the device picked up by the picker is pressed while adjusting the pneumatic pressure acting through the pneumatic passage Inspection device.
  25. 청구항 24에 있어서,The method of claim 24,
    상기 댐퍼는,The damper is,
    내부에 소정의 공간이 형성되고, 상기 공압통로가 상기 공간과 연통되도록 형성되는 챔버;A chamber in which a predetermined space is formed and the pneumatic passage is formed in communication with the space;
    상기 챔버의 내부에 배치되는 탄성막; 및An elastic membrane disposed inside the chamber; And
    상기 픽커와 연결되며 상기 탄성막을 가압하는 가압부재를 포함하는 것을 특징으로 하는 소자검사장치.And an urging member connected to the picker and urging the elastic membrane.
  26. 청구항 24 또는 청구항 25에 있어서,The method according to claim 24 or 25,
    상기 지지부와 상기 픽커모듈에는 상기 공압통로와 공압발생원을 연통시키기 위한 공압연결통로가 각각 형성되는 것을 특징으로 하는 소자검사장치.And a pneumatic connection passage for communicating between the pneumatic passage and the pneumatic source is formed in the support portion and the picker module, respectively.
  27. 청구항 15에 있어서,The method according to claim 15,
    상기 픽커는 상기 픽커모듈의 내부에 형성되는 흡입유로와 연통되고,The picker is in communication with the suction flow path formed inside the picker module,
    상기 지지부와 상기 픽커모듈에는 상기 흡입유로와 진공압발생원을 연통시키기 위한 진공압연결통로가 각각 형성되는 것을 특징으로 하는 소자검사장치.And a vacuum pressure connection passage is formed in the support portion and the picker module to connect the suction flow path and the vacuum pressure source, respectively.
  28. 복수의 소자가 로딩되는 로딩부;A loading unit in which a plurality of elements are loaded;
    상기 로딩부로부터 이송된 소자에 대한 테스트를 위한 복수의 테스트소켓이 구비되는 테스트부;A test unit provided with a plurality of test sockets for testing a device transferred from the loading unit;
    상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부; 및An unloading unit which classifies the device having been tested in the test unit according to a test result; And
    상기 소자를 픽업하는 픽커를 구비하고, 상기 소자를 픽업하여 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴을 포함하고,A picker for picking up the device, the pick-up tool for picking up the device and forcing it into the test socket,
    상기 소자가압툴에는 상기 픽커에 의하여 픽업된 상기 소자를 가열하는 가열부가 구비되는 것을 특징으로 하는 소자검사장치.And the heating device for heating the device picked up by the picker is provided in the device pressing tool.
  29. 청구항 28에 있어서,The method according to claim 28,
    상기 가열부는, 상기 픽커에 의하여 픽업된 소자를 향하여 가열기체를 분사하는 가열기체분사유닛을 포함하는 것을 특징으로 하는 소자검사장치.And the heating unit includes a heating gas injection unit for injecting a heating gas toward the device picked up by the picker.
  30. 청구항 29에 있어서,The method of claim 29,
    상기 픽커에는 상기 소자가 흡착되는 흡착패드가 구비되고,The picker is provided with a suction pad to which the device is adsorbed,
    상기 가열기체분사유닛은, 상기 흡착패드의 외주둘레에 배치되어 가열기체가 분사되는 분사구를 형성하는 가이드부재와, 상기 분사구와 연통되고 가열기체를 공급하는 가열기체공급기와 연결되는 가열기체유로를 포함하는 것을 특징으로 하는 소자검사장치.The heating gas spray unit includes a guide member disposed on an outer circumference of the suction pad to form an injection hole for injecting a heating gas, and a heating gas flow passage connected to the heating gas supply to communicate with the injection hole and to supply the heating gas. Device inspection apparatus characterized in that.
  31. 청구항 30에 있어서,The method of claim 30,
    상기 소자가압툴은, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커가 결합되는 하나 이상의 픽커모듈을 포함하며,The device pressing tool includes a support unit which is installed to be movable, and at least one picker module which is detachably coupled to the support unit, and at least one picker is coupled thereto.
    상기 가열기체유로는 상기 픽커모듈의 내부에 형성되는 것을 특징으로 하는 소자검사장치.And the heater gas flow path is formed inside the picker module.
  32. 청구항 29에 있어서,The method of claim 29,
    상기 소자가압툴은, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커가 결합되는 복수의 픽커모듈을 포함하며,The device pressing tool includes a support part which is installed to be movable and a plurality of picker modules which are detachably coupled to the support part and which one or more pickers are coupled to,
    상기 소자를 향하여 분사되는 가열기체의 온도는 상기 복수의 픽커모듈에 따라 개별적으로 제어되는 것을 특징으로 하는 소자검사장치.And a temperature of the heating gas sprayed toward the device is individually controlled according to the plurality of picker modules.
  33. 청구항 32에 있어서,The method according to claim 32,
    상기 복수의 픽커모듈에는 상기 가열기체의 온도를 감지하는 온도센서가 구비되고,The plurality of picker module is provided with a temperature sensor for sensing the temperature of the heating gas,
    상기 온도센서에 의하여 감지된 결과에 따라 상기 소자를 향하여 분사되는 가열기체의 온도가 제어되는 것을 특징으로 하는 소자검사장치.And the temperature of the heating gas sprayed toward the device is controlled according to the result detected by the temperature sensor.
  34. 청구항 28에 있어서,The method according to claim 28,
    상기 소자가압툴은, 이동이 가능하게 설치되는 지지부와, 상기 지지부에 탈착이 가능하게 결합되며 하나 이상의 픽커가 결합되는 복수의 픽커모듈을 포함하고,The device pressing tool includes a support unit which is installed to be movable, and a plurality of picker modules which are detachably coupled to the support unit and to which one or more pickers are coupled.
    상기 가열부는, 상기 복수의 픽커모듈에 각각 설치되는 복수의 히터를 포함하며,The heating unit includes a plurality of heaters respectively installed in the plurality of picker modules,
    상기 히터의 온도는 상기 복수의 픽커모듈에 따라 개별적으로 제어되는 것을 특징으로 하는 소자검사장치.The temperature of the heater is device inspection apparatus, characterized in that individually controlled according to the plurality of picker module.
  35. 청구항 34에 있어서,The method of claim 34, wherein
    상기 복수의 픽커모듈에는 상기 히터의 온도를 감지하는 복수의 온도센서가 각각 설치되며,The plurality of picker modules are each provided with a plurality of temperature sensors for sensing the temperature of the heater,
    상기 온도센서에 의하여 감지된 결과에 따라 상기 히터의 온도가 제어되는 것을 특징으로 하는 소자검사장치.Device inspection apparatus characterized in that the temperature of the heater is controlled according to the result detected by the temperature sensor.
  36. 복수의 소자가 로딩되는 로딩부;A loading unit in which a plurality of elements are loaded;
    상기 로딩부로부터 이송된 소자에 대한 테스트를 위한 복수의 테스트소켓들이 구비되는 테스트부;A test unit having a plurality of test sockets for testing a device transferred from the loading unit;
    상기 테스트부에서 테스트가 완료된 소자를 테스트결과에 따라 분류하는 언로딩부;An unloading unit which classifies the device having been tested in the test unit according to a test result;
    상기 소자를 픽업하여 선형이동에 의하여 상기 소자를 가압위치로 이동시켜 상기 테스트소켓으로 가압하는 하나 이상의 소자가압툴과, 캠부재에 의하여 상기 소자가압툴을 가압위치로 선형으로 이동시키는 제1수직이동장치를 포함하는 소자가압부;One or more element pressing tools for picking up the element and moving the element to the pressing position by linear movement to press the test socket, and a first vertical movement for linearly moving the element pressing tool to the pressing position by a cam member An element pressing unit including an apparatus;
    상기 테스트부에 대하여 상기 소자가압부를 선형으로 이동시키는 제2수직이동장치; 및A second vertical moving device which linearly moves the element pressing unit with respect to the test unit; And
    상기 제2수직이동장치에 의하여 상기 소자가압툴이 상기 테스트부와 접촉되었을 때 상기 제2수직이동장치에 의하여 상기 테스트부에 가해지는 하중을 검출하고, 검출된 하중이 미리 설정된 기준하중이 되었을 때의 상기 소자가압툴의 위치를 가압위치로 결정하는 제어부를 포함하는 소자검사장치.When the element pressing tool is brought into contact with the test part by the second vertical moving device, the load applied to the test part by the second vertical moving device is detected, and when the detected load becomes a predetermined reference load. And a control unit for determining a position of the element pressing tool as a pressing position.
  37. 청구항 36에 있어서,The method of claim 36,
    상기 제2수직이동장치는, 모터를 포함하여 구성되고,The second vertical movement device is configured to include a motor,
    상기 제어부는 상기 모터의 부하를 검출하여 상기 테스트부에 가해지는 하중을 검출하는 것을 특징으로 하는 소자검사장치.And the control unit detects the load applied to the test unit by detecting the load of the motor.
  38. 청구항 36에 있어서,The method of claim 36,
    상기 소자가압툴은, 이동가능하게 설치되는 지지부와, 상기 지지부에 탈착가능하게 결합되며 하나 이상의 픽커가 결합되는 하나 이상의 픽커모듈을 포함하고,The device pressing tool includes a support unit movably installed, one or more picker modules detachably coupled to the support unit and one or more pickers coupled thereto,
    상기 테스트소켓은 지지프레임에 지지되며,The test socket is supported on the support frame,
    상기 소자가압툴의 하강에 의하여, 상기 픽커모듈의 하측면이 상기 지지프레임의 상측면에 접촉되는 것을 특징으로 하는 소자검사장치.And the lower side of the picker module contacts the upper side of the support frame by the lowering of the pressing tool.
  39. 청구항 36에 있어서,The method of claim 36,
    상기 소자가압툴은, 이동가능하게 설치되는 지지부와, 상기 지지부에 탈착가능하게 결합되며 하나 이상의 픽커가 결합된 복수의 픽커모듈을 포함하고,The device pressing tool includes a support unit movably installed, a plurality of picker modules detachably coupled to the support unit and one or more pickers coupled thereto,
    상기 픽커모듈에는 공압을 조절하면서 상기 픽커에 픽업된 상기 소자가 상기 테스트소켓에 가압될 때의 상기 테스트소켓에 대한 상기 소자의 접촉력을 조절하는 댐퍼가 구비되는 것을 특징으로 하는 소자검사장치.And a damper for adjusting the contact force of the device to the test socket when the device picked up by the picker is pressed by the picker while adjusting the pneumatic pressure.
  40. 청구항 39에 있어서,The method of claim 39,
    상기 댐퍼의 공압은 상기 복수의 픽커모듈에 따라 개별적으로 조절되는 것을 특징으로 하는 소자검사장치.The pneumatic pressure of the damper is individually inspected device according to the plurality of picker module.
  41. 청구항 39에 있어서,The method of claim 39,
    상기 댐퍼는,The damper is,
    내부에 소정의 공간이 형성되고, 상기 공간과 연통되는 공압통로가 형성되는 챔버;A chamber in which a predetermined space is formed and a pneumatic passage communicating with the space is formed;
    상기 챔버의 내부에 배치되는 탄성막; 및An elastic membrane disposed inside the chamber; And
    상기 픽커와 연결되며 상기 탄성막을 가압하는 가압부재를 포함하는 것을 특징으로 하는 소자검사장치.And an urging member connected to the picker and urging the elastic membrane.
  42. 청구항 41에 있어서,The method of claim 41,
    상기 지지부와 상기 픽커모듈에는 상기 공압통로와 공압발생원을 연통시키기 위한 공압연결통로가 각각 형성되는 것을 특징으로 하는 소자검사장치.And a pneumatic connection passage for communicating between the pneumatic passage and the pneumatic source is formed in the support portion and the picker module, respectively.
PCT/KR2013/001648 2012-02-29 2013-02-28 Apparatus for testing elements WO2013129873A1 (en)

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KR1020120071089A KR102000949B1 (en) 2012-02-29 2012-06-29 Semiconductor device inspection apparatus
KR1020120071098A KR102000950B1 (en) 2012-02-29 2012-06-29 Semiconductor device inspection apparatus
KR10-2012-0071098 2012-06-29
KR1020120071086A KR102000948B1 (en) 2012-02-29 2012-06-29 Semiconductor device inspection apparatus
KR10-2012-0071089 2012-06-29
KR10-2012-0071086 2012-06-29
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KR10-2013-0009887 2013-01-29
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KR1020130009889A KR101417772B1 (en) 2012-02-29 2013-01-29 Semiconductor device inspection apparatus
KR1020130009887A KR101436028B1 (en) 2012-02-29 2013-01-29 Semiconductor device inspection apparatus
KR10-2013-0009889 2013-01-29
KR1020130009890A KR101417773B1 (en) 2012-02-29 2013-01-29 Semiconductor device inspection apparatus and semiconductor device pressing tool
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CN103293426B (en) 2017-03-01
CN103293458B (en) 2017-03-01
CN103293458A (en) 2013-09-11

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