WO2013127161A1 - Led灯的散热结构 - Google Patents

Led灯的散热结构 Download PDF

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Publication number
WO2013127161A1
WO2013127161A1 PCT/CN2012/080442 CN2012080442W WO2013127161A1 WO 2013127161 A1 WO2013127161 A1 WO 2013127161A1 CN 2012080442 W CN2012080442 W CN 2012080442W WO 2013127161 A1 WO2013127161 A1 WO 2013127161A1
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WO
WIPO (PCT)
Prior art keywords
metal member
led lamp
heat dissipation
partition
chip
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PCT/CN2012/080442
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English (en)
French (fr)
Inventor
周南庆
Original Assignee
正屋(厦门)电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 正屋(厦门)电子有限公司 filed Critical 正屋(厦门)电子有限公司
Priority to GB1317093.1A priority Critical patent/GB2514201A/en
Priority to EP12869620.0A priority patent/EP2821696A4/en
Priority to US14/005,504 priority patent/US20150003082A1/en
Publication of WO2013127161A1 publication Critical patent/WO2013127161A1/zh
Priority to ZA2014/04341A priority patent/ZA201404341B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lamp, in particular to a heat dissipation structure of an LED lamp.
  • LED energy-saving lamps Compared with ordinary energy-saving lamps, LED energy-saving lamps have the advantages of high luminous efficiency, low power consumption, and long life, so they are more and more popular. However, the heat generation of the LED chip is high, and a special heat dissipation structure must be provided.
  • the conventional LED lamp is mainly composed of a lamp cap 1', a casing 2', a metal member 3', an LED chip 4' and a lampshade 5', and is mounted inside the casing 2'.
  • a circuit component such as a circuit board, the LED chip 4' is fixed to the metal member 3', and the metal member 3' can provide a heat dissipation effect.
  • the housing 2' is usually made of plastic and is injection-molded together with the metal piece 3' so that the metal piece 3' together with the entire housing 2 'Equipped as a heat sink, the heat emitted by the LED chip 4' is first conducted by the metal member 3' to the casing 1', and the heat is dissipated by the casing 1'. It is sometimes also possible to form a plurality of fins on the outside of the housing 1' for the purpose of further heat dissipation.
  • the metal member 3' is also necessarily a hollow cylindrical body.
  • an annular convex edge 31' is disposed under the hollow metal member 3'. The structure makes the LED chip 4' only have an edge in contact with the heat-dissipating material, the heat can only be emitted from the edge, the middle portion is suspended, and is not attached to the heat-dissipating material, so the heat-dissipating effect is poor, the chip is easy to be damaged, and needs to be improved. .
  • the technical problem to be solved by the present invention is to provide a heat dissipation structure of an LED lamp which can sufficiently contact the LED chip and the heat dissipation material to improve the heat dissipation effect.
  • the technical solution of the present invention is:
  • a heat dissipation structure of an LED lamp comprising a plastic case and a metal member as a heat sink, the metal member being a hollow structure, which is combined with the plastic case after the plastic case is injection molded; the metal piece is also formed There is a partition, and the LED chip of the LED lamp is fixed under the partition and directly contacts the metal member.
  • the partition of the metal piece is disposed in the middle of the inner side thereof or disposed below or above it.
  • the LED chip is directly fixed under the spacer to be in contact with the spacer.
  • the plastic housing is also formed with a partition that is placed over the partition of the metal piece.
  • a chip holder is further formed under the separator of the metal member, and the LED chip is fixed on the chip holder and directly contacts the chip holder.
  • the plastic housing is also formed with a partition, and the partition of the metal member is formed in the partition of the plastic housing.
  • a plurality of fins are formed on the outer side of the plastic casing.
  • the metal member is also formed with fins formed in the fins of the plastic housing.
  • the metal member is provided with a plurality of through holes.
  • the chip holder of the metal piece is a hollow structure, and the plastic case is provided with a convex portion formed in the hollow cavity of the chip fixing seat.
  • the LED chip is fixed under the spacer, directly contacts the spacer or contacts the chip holder on the spacer, thereby making the LED chip Direct contact with the metal parts, so that the heat generated by the LED chip can be smoothly transmitted to the plastic casing, thereby facilitating heat dissipation of the chip.
  • Figure 1 is an exploded perspective view of a conventional LED lamp
  • FIG. 2 is an exploded perspective view of an existing LED lamp
  • Figure 3 is a combined sectional view of a conventional LED lamp
  • Figure 4 is an exploded perspective view of the first embodiment of the present invention.
  • Figure 5 is a perspective exploded view of the first embodiment of the present invention.
  • Figure 6 is a sectional view showing the combination of the first embodiment of the present invention.
  • Figure 7 is an exploded perspective view of a second embodiment of the present invention.
  • Figure 8 is a sectional view showing a combination of a second embodiment of the present invention.
  • Figure 9 is an exploded perspective view of a third embodiment of the present invention.
  • Figure 10 is a cross-sectional view showing the assembly of a third embodiment of the present invention.
  • the LED lamp generally includes a lamp cap 1, a plastic case 2, a metal member 3, and an LED chip 4. Inside the plastic case 2, circuit components such as a circuit board are mounted. In order to increase the intensity or the illumination angle, a lens 5 may be disposed in front of the LED chip 4, and the lens 5 may be fixed to the front of the casing 1 by a lens holder 6.
  • the improvement of the present invention resides in the plastic housing 2 and the metal member 3 as a heat sink.
  • the metal piece 3 is a hollow structure which is combined with the plastic case 2 after the plastic case 2 is injection molded.
  • the metal member 3 is also formed with a partition 31, and the LED chip 4 is fixed under the partition 31 to directly contact the metal member 3. In the present embodiment, the LED chip 4 is directly fixed under the spacer 31.
  • the LED chip 4 Since the LED chip 4 is completely in close contact with the metal member 3, the heat radiated from the chip can be smoothly transmitted to the plastic case 2 through the metal member 3, thereby facilitating heat dissipation of the LED chip 4.
  • the partition plate 31 of the metal member 3 may be disposed at the inner middle portion thereof, so that a cavity is formed above or below the plastic casing 2, and the upper cavity of the partition plate 31 can be used for installing the circuit board.
  • the lower cavity of the board 31 can be used to accommodate components such as the LED chip 4 and the lens 5.
  • a partition plate 21 may be disposed in the inner middle portion of the plastic casing 2, and the partition plate 21 is in close contact with the partition plate 31 of the metal member 3. After the partition 21 is disposed in the plastic casing 2, the heat on the metal member 3 is more easily conducted to the plastic casing 2, so that the heat dissipation of the chip can be further facilitated.
  • the partition 21 can block the heat of the chip, prevent heat from being conducted to the circuit board on the partition 21, and prevent the circuit board from being overheated and damaged.
  • a plurality of fins 22 may be formed on the outer side of the plastic casing 2 to increase the heat dissipation effect.
  • the LED lamp also includes a lamp cap 1, a plastic housing 2, a metal member 3 and an LED chip 4.
  • a lamp cover 7 is further disposed in front of the plastic casing 2.
  • the metal member 3 is a hollow structure and is also bonded to the plastic housing 2 after injection molding.
  • the metal member 3 is also formed with a partition 31 which is located below the metal member.
  • the LED chip 4 is fixed under the partition 31 and directly contacts the metal member 3.
  • plastic casing 2 may also be formed with a partition 21 which is placed above the partition 31 of the metal member 3 to increase heat conduction.
  • the outer side of the plastic casing 2 may be formed with fins 22 to increase the heat dissipation effect.
  • a fin 32 may also be formed on the metal member 3, and the fin 32 is formed in the fin 22 of the plastic casing 2.
  • the LED lamp comprises a lamp cap 1, a plastic housing 2, a metal member 3 and an LED chip 4.
  • a reflector cup 8 may be disposed inside the lower side of the plastic casing 2. among them:
  • the metal piece 3 is a hollow structure which is combined with the plastic case 2 after the plastic case 2 is injection molded.
  • the metal member 3 is also formed with a partition 31 which is located above the metal member.
  • the LED chip 4 is fixed under the partition 31 and is in contact with the metal member 3.
  • a chip holder 33 is further formed under the spacer 31, and the LED chip 4 is fixed on the chip holder 33 to be in contact with the chip holder 33.
  • the plastic casing 2 is also formed with a partition 21 which encloses the partition 31 of the metal member 3 therein, thereby increasing the heat conduction effect.
  • a plurality of through holes 34 may be formed in the metal member 3 for a more stable connection with the plastic housing 2.
  • the chip holder 33 of the metal member 3 may have a hollow structure to reduce the amount of metal and reduce the cost.
  • the plastic housing 2 can be formed with a convex portion 23 formed in the hollow cavity of the chip fixing base 33 to increase the contact area between the metal member 3 and the plastic housing 2, thereby increasing the heat dissipation effect.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED灯的散热结构，包括作为散热体的塑料壳体（2）及金属件（3）。金属件（3）为中空结构，其在塑料壳体（2）注塑成型后与塑料壳体（2）结合在一起。金属件（3）还成型有一隔板（31）。LED灯的LED芯片（4）固定在隔板（31）的下方，直接与金属件（3）接触。隔板（31）使LED芯片（4）完全与金属件（3）接触，可顺利地将LED芯片（4）发出的热量传导至塑料壳体（2），有利于LED芯片（4）的散热。

Description

LED灯的散热结构 技术领域
本发明涉及一种灯具，尤指一种LED灯的散热结构。
背景技术
LED节能灯与普通的节能灯相比，具有光效高、耗电少、寿命长等优点，因此越来越受到人们的青睐。但是，LED芯片的发热量较高，必须设置特殊的散热结构。
如图1、2、3所示，现有的LED灯主要由灯头1＇、壳体2＇、金属件3＇、LED芯片4＇及灯罩5＇组成，在壳体2＇之内安装有线路板等电路元件，所述的LED芯片4＇与金属件3＇固定在一起，该金属件3＇可以起到散热的效果。为了降低成本又可以达到良好的散热效果，所述的壳体2＇通常为塑料制成，并且将其与所述的金属件3＇注塑结合在一起，这样金属件3＇连同整个壳体2＇都被设计成一个散热体，首先由金属件3＇将LED芯片4＇发出的热量传导至壳体1＇上，再由壳体1＇将热量散发出去。有时还可以在壳体1＇的外侧成型若干鳍片，以起到进一步散热的目的。
然而由于壳体1＇内部要安装线路板，因此金属件3＇也必然为中空结构的筒状体，为了固定LED芯片4＇，中空的金属件3＇下方设置有环状凸沿31＇，这种结构使LED芯片4＇只有边缘与散热材料接触，热量只能从边缘处散发出去，中间部分则悬空，没有与散热材料贴合在一起，因此散热效果较差，芯片易损坏，有待改进。
发明内容
本发明所要解决的技术问题在于提供一种可使LED芯片与散热材料充分接触以提高散热效果的LED灯的散热结构。
为解决上述技术问题，本发明的技术解决方案是：
一种LED灯的散热结构，包括作为散热体的塑料壳体及金属件，该金属件为中空结构，其在所述塑料壳体注塑成型后与塑料壳体结合在一起；该金属件还成型有一隔板，所述LED灯的LED芯片固定在该隔板的下方，直接与该金属件接触。
所述金属件的隔板设置在其内侧中部，或者设置在其下方或者上方。
所述的LED芯片直接固定在所述隔板的下方与该隔板接触。
所述的塑料壳体也成型有一隔板，该隔板紧贴在所述金属件的隔板上方。
所述金属件的隔板下方还成型有一芯片固定座，所述的LED芯片固定在该芯片固定座上，与该芯片固定座直接接触。
所述的塑料壳体也成型有一隔板，所述金属件的隔板成型在该塑料壳体的隔板之内。
所述的塑料壳体外侧成型有若干鳍片。
所述的金属件上也成型有鳍片，该鳍片成型在所述塑料壳体的鳍片之内。
所述的金属件上设置有若干通孔。
所述金属件的芯片固定座为中空结构，所述的塑料壳体设置有一凸部成型在该芯片固定座的中空腔之内。
采用上述方案后，由于本发明在金属件上设置了一个隔板，将LED芯片固定在该隔板的下方，直接与隔板接触或者与隔板上的芯片固定座接触，从而使该LED芯片直接接触金属件，这样即可顺利将LED芯片发出的热量传导至塑料壳体上，从而更利于芯片的散热。
附图说明
图1是现有LED灯的立体分解图一；
图2是现有LED灯的立体分解图二；
图3是现有LED灯的组合剖视图；
图4是本发明第一实施例的立体分解图一；
图5是本发明第一实施例的立体分解图二；
图6是本发明第一实施例的组合剖视图；
图7是本发明第二实施例的立体分解图；
图8是本发明第二实施例的组合剖视图；
图9是本发明第三实施例的立体分解图；
图10是本发明第三实施例的组合剖视图。
具体实施方式
下面结合附图和具体实施例对本发明作进一步详述。
本发明所揭示的是一种LED灯的散热结构，如图4、5、6所示，为本发明的第一较佳实施例。所述的LED灯一般包括灯头1、塑料壳体2、金属件3及LED芯片4，该塑料壳体2之内安装有线路板等电路元件。为了增加强度或者照射角度，在LED芯片4前方可设置一个透镜5，该透镜5可以通过一个透镜固定座6固定在壳体1的前方。
本发明的改进之处在于作为散热体的塑料壳体2及金属件3。所述的金属件3为中空结构，其在所述塑料壳体2注塑成型后与塑料壳体2结合在一起。该金属件3还成型有一隔板31，所述的LED芯片4固定在该隔板31的下方直接金属件3接触。在本实施例中，该LED芯片4直接固定在所述的隔板31的下方。
由于所述的LED芯片4完全紧贴在金属件3上，因此可将芯片散发出的热量顺利通过金属件3传导至塑料壳体2上，从而更利于LED芯片4的散热。
更进一步的，所述金属件3的隔板31可以设置在其内侧中部，从而使塑料壳体2的上方或下方均形成一空腔，隔板31的上方空腔可以用来安装线路板，隔板31的下方空腔则可以用来容纳LED芯片4及透镜5等部件。
另外，所述的塑料壳体2内侧中部也可以设置一隔板21，该隔板21紧贴在所述金属件3的隔板31上方。在塑料壳体2内设置了隔板21之后，使金属件3上的热量更容易被传导至塑料壳体2上，从而可以更进一步利于芯片的散热。此外，该隔板21还可以阻隔芯片的热量，防止热量传导至隔板21上的线路板上，防止线路板过热而损坏。
再者，所述的塑料壳体2外侧可成型有若干鳍片22，以增加散热效果。
如图7、8所示，为本发明的第二较佳实施例。所述的LED灯同样包括灯头1、塑料壳体2、金属件3及LED芯片4。本实施例在塑料壳体2的前方还罩设有一灯罩7。
本发明的关键在于：所述的金属件3为中空结构，且同样与所述的塑料壳体2注塑成型后结合在一起。该金属件3也成型有一隔板31，该隔板31位于金属件的下方，所述的LED芯片4固定在该隔板31的下方，直接与该金属件3接触。
更进一步的，所述的塑料壳体2也可以成型有一隔板21，该隔板21紧贴在所述金属件3的隔板31上方，以增加热的传导。
所述的塑料壳体2外侧可成型有鳍片22，以增加散热效果。所述的金属件3上也可以成型有鳍片32，该鳍片32成型在塑料壳体2的鳍片22之内。
如图9及图10所示，为本发明的第三实施例。所述的LED灯包括灯头1、塑料壳体2、金属件3及LED芯片4。本实施例在塑料壳体2的下方内侧还可设置一个反光杯8。其中：
所述的金属件3为中空结构，其在所述塑料壳体2注塑成型后与塑料壳体2结合在一起。该金属件3还成型有一隔板31，该隔板31位于金属件的上方，所述的LED芯片4固定在该隔板31的下方，其与该金属件3接触。
本实施例，所述的隔板31下方还成型有一芯片固定座33，所述的LED芯片4固定在该芯片固定座33上，与该芯片固定座33接触。
更进一步的，所述的塑料壳体2上也成型有一隔板21，该隔板21将上述金属件3的隔板31包覆在其内，从而可以增加热传导效果。
此外，所述的金属件3上可以设置若干通孔34，以便与塑料壳体2更稳固的连接。
再者，所述金属件3的芯片固定座33可以为中空结构，以减少金属的用量，降低成本。而所述的塑料壳体2可设置一凸部23成型在该芯片固定座33的中空腔之内，以增加金属件3与塑料壳体2之间的接触面积，增加散热效果。
以上所述，仅为本发明的较佳实施例而已，并非用来限定本发明实施的范围。故但凡依本发明的权利要求和说明书所做的变化或修饰，皆应属于本发明专利涵盖的范围之内。

Claims (10)

1、一种LED灯的散热结构，其特征在于：包括作为散热体的塑料壳体及金属件，该金属件为中空结构，其在所述塑料壳体注塑成型后与塑料壳体结合在一起；该金属件还成型有一隔板，所述LED灯的LED芯片固定在该隔板的下方，直接与该金属件接触。
2、根据权利要求1所述的LED灯的散热结构，其特征在于：所述金属件的隔板设置在其内侧中部，或者设置在其下方或者上方。
3、根据权利要求2所述的LED灯的散热结构，其特征在于：所述的LED芯片直接固定在所述隔板的下方与该隔板接触。
4、根据权利要求3所述的LED灯的散热结构，其特征在于：所述的塑料壳体也成型有一隔板，该隔板紧贴在所述金属件的隔板上方。
5、根据权利要求2所述的LED灯的散热结构，其特征在于：所述金属件的隔板下方还成型有一芯片固定座，所述的LED芯片固定在该芯片固定座上，与该芯片固定座直接接触。
6、根据权利要求5所述的LED灯的散热结构，其特征在于：所述的塑料壳体也成型有一隔板，所述金属件的隔板成型在该塑料壳体的隔板之内。
7、根据权利要求1-6之一所述的LED灯的散热结构，其特征在于：所述的塑料壳体外侧成型有若干鳍片。
8、根据权利要求7所述的LED灯的散热结构，其特征在于：所述的金属件上也成型有鳍片，该鳍片成型在所述塑料壳体的鳍片之内。
9、根据权利要求1-6之一所述的LED灯的散热结构，其特征在于：所述的金属件上设置有若干通孔。
10、根据权利要求6所述的LED灯的散热结构，其特征在于：所述金属件的芯片固定座为中空结构，所述的塑料壳体设置有一凸部成型在该芯片固定座的中空腔之内。
PCT/CN2012/080442 2012-02-29 2012-08-22 Led灯的散热结构 WO2013127161A1 (zh)

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