WO2013088745A1 - 有機el表示パネルの製造方法 - Google Patents
有機el表示パネルの製造方法 Download PDFInfo
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- WO2013088745A1 WO2013088745A1 PCT/JP2012/008030 JP2012008030W WO2013088745A1 WO 2013088745 A1 WO2013088745 A1 WO 2013088745A1 JP 2012008030 W JP2012008030 W JP 2012008030W WO 2013088745 A1 WO2013088745 A1 WO 2013088745A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 66
- 239000000976 ink Substances 0.000 claims abstract description 411
- 239000002904 solvent Substances 0.000 claims abstract description 103
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000001035 drying Methods 0.000 claims description 125
- 238000000034 method Methods 0.000 claims description 71
- 239000011368 organic material Substances 0.000 description 247
- 239000012298 atmosphere Substances 0.000 description 45
- 238000002347 injection Methods 0.000 description 27
- 239000007924 injection Substances 0.000 description 27
- 238000005192 partition Methods 0.000 description 21
- 238000007639 printing Methods 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000007789 sealing Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 10
- 238000005401 electroluminescence Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 238000009835 boiling Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000001291 vacuum drying Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- BFIMMTCNYPIMRN-UHFFFAOYSA-N 1,2,3,5-tetramethylbenzene Chemical compound CC1=CC(C)=C(C)C(C)=C1 BFIMMTCNYPIMRN-UHFFFAOYSA-N 0.000 description 2
- GWHJZXXIDMPWGX-UHFFFAOYSA-N 1,2,4-trimethylbenzene Chemical compound CC1=CC=C(C)C(C)=C1 GWHJZXXIDMPWGX-UHFFFAOYSA-N 0.000 description 2
- QNLZIZAQLLYXTC-UHFFFAOYSA-N 1,2-dimethylnaphthalene Chemical compound C1=CC=CC2=C(C)C(C)=CC=C21 QNLZIZAQLLYXTC-UHFFFAOYSA-N 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- RMKJTYPFCFNTGQ-UHFFFAOYSA-N 1,3-dimethyl-5-propan-2-ylbenzene Chemical group CC(C)C1=CC(C)=CC(C)=C1 RMKJTYPFCFNTGQ-UHFFFAOYSA-N 0.000 description 2
- QHJMFSMPSZREIF-UHFFFAOYSA-N 1,3-dimethylnaphthalene Chemical compound C1=CC=CC2=CC(C)=CC(C)=C21 QHJMFSMPSZREIF-UHFFFAOYSA-N 0.000 description 2
- APQSQLNWAIULLK-UHFFFAOYSA-N 1,4-dimethylnaphthalene Chemical compound C1=CC=C2C(C)=CC=C(C)C2=C1 APQSQLNWAIULLK-UHFFFAOYSA-N 0.000 description 2
- CBMXCNPQDUJNHT-UHFFFAOYSA-N 1,6-dimethylnaphthalene Chemical compound CC1=CC=CC2=CC(C)=CC=C21 CBMXCNPQDUJNHT-UHFFFAOYSA-N 0.000 description 2
- MEMBJMDZWKVOTB-UHFFFAOYSA-N 1-ethyl-2,4-dimethylbenzene Chemical group CCC1=CC=C(C)C=C1C MEMBJMDZWKVOTB-UHFFFAOYSA-N 0.000 description 2
- NPDIDUXTRAITDE-UHFFFAOYSA-N 1-methyl-3-phenylbenzene Chemical group CC1=CC=CC(C=2C=CC=CC=2)=C1 NPDIDUXTRAITDE-UHFFFAOYSA-N 0.000 description 2
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 2
- RJTJVVYSTUQWNI-UHFFFAOYSA-N 2-ethylnaphthalene Chemical compound C1=CC=CC2=CC(CC)=CC=C21 RJTJVVYSTUQWNI-UHFFFAOYSA-N 0.000 description 2
- QIMMUPPBPVKWKM-UHFFFAOYSA-N 2-methylnaphthalene Chemical compound C1=CC=CC2=CC(C)=CC=C21 QIMMUPPBPVKWKM-UHFFFAOYSA-N 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- UUGLJVMIFJNVFH-UHFFFAOYSA-N Hexyl benzoate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1 UUGLJVMIFJNVFH-UHFFFAOYSA-N 0.000 description 2
- LTEQMZWBSYACLV-UHFFFAOYSA-N Hexylbenzene Chemical compound CCCCCCC1=CC=CC=C1 LTEQMZWBSYACLV-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- XSIFPSYPOVKYCO-UHFFFAOYSA-N butyl benzoate Chemical compound CCCCOC(=O)C1=CC=CC=C1 XSIFPSYPOVKYCO-UHFFFAOYSA-N 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- 150000001722 carbon compounds Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- UZILCZKGXMQEQR-UHFFFAOYSA-N decyl-Benzene Chemical compound CCCCCCCCCCC1=CC=CC=C1 UZILCZKGXMQEQR-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- -1 polyphenylene vinylene Polymers 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 2
- 229910000314 transition metal oxide Inorganic materials 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VUMCUSHVMYIRMB-UHFFFAOYSA-N 1,3,5-tri(propan-2-yl)benzene Chemical compound CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1 VUMCUSHVMYIRMB-UHFFFAOYSA-N 0.000 description 1
- UNEATYXSUBPPKP-UHFFFAOYSA-N 1,3-Diisopropylbenzene Chemical compound CC(C)C1=CC=CC(C(C)C)=C1 UNEATYXSUBPPKP-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- VEAFKIYNHVBNIP-UHFFFAOYSA-N 1,3-Diphenylpropane Chemical compound C=1C=CC=CC=1CCCC1=CC=CC=C1 VEAFKIYNHVBNIP-UHFFFAOYSA-N 0.000 description 1
- 239000005967 1,4-Dimethylnaphthalene Substances 0.000 description 1
- SPPWGCYEYAMHDT-UHFFFAOYSA-N 1,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(C(C)C)C=C1 SPPWGCYEYAMHDT-UHFFFAOYSA-N 0.000 description 1
- IQISOVKPFBLQIQ-UHFFFAOYSA-N 1,4-dimethoxy-2-methylbenzene Chemical compound COC1=CC=C(OC)C(C)=C1 IQISOVKPFBLQIQ-UHFFFAOYSA-N 0.000 description 1
- UALKQROXOHJHFG-UHFFFAOYSA-N 1-ethoxy-3-methylbenzene Chemical compound CCOC1=CC=CC(C)=C1 UALKQROXOHJHFG-UHFFFAOYSA-N 0.000 description 1
- ZMXIYERNXPIYFR-UHFFFAOYSA-N 1-ethylnaphthalene Chemical compound C1=CC=C2C(CC)=CC=CC2=C1 ZMXIYERNXPIYFR-UHFFFAOYSA-N 0.000 description 1
- AWONIZVBKXHWJP-UHFFFAOYSA-N 1-methoxy-2,3,5-trimethylbenzene Chemical compound COC1=CC(C)=CC(C)=C1C AWONIZVBKXHWJP-UHFFFAOYSA-N 0.000 description 1
- BLMBNEVGYRXFNA-UHFFFAOYSA-N 1-methoxy-2,3-dimethylbenzene Chemical compound COC1=CC=CC(C)=C1C BLMBNEVGYRXFNA-UHFFFAOYSA-N 0.000 description 1
- NLWCWEGVNJVLAX-UHFFFAOYSA-N 1-methoxy-2-phenylbenzene Chemical group COC1=CC=CC=C1C1=CC=CC=C1 NLWCWEGVNJVLAX-UHFFFAOYSA-N 0.000 description 1
- JCHJBEZBHANKGA-UHFFFAOYSA-N 1-methoxy-3,5-dimethylbenzene Chemical compound COC1=CC(C)=CC(C)=C1 JCHJBEZBHANKGA-UHFFFAOYSA-N 0.000 description 1
- ABMKWMASVFVTMD-UHFFFAOYSA-N 1-methyl-2-(2-methylphenyl)benzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1C ABMKWMASVFVTMD-UHFFFAOYSA-N 0.000 description 1
- WCOYPFBMFKXWBM-UHFFFAOYSA-N 1-methyl-2-phenoxybenzene Chemical compound CC1=CC=CC=C1OC1=CC=CC=C1 WCOYPFBMFKXWBM-UHFFFAOYSA-N 0.000 description 1
- ALLIZEAXNXSFGD-UHFFFAOYSA-N 1-methyl-2-phenylbenzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1 ALLIZEAXNXSFGD-UHFFFAOYSA-N 0.000 description 1
- GVEDOIATHPCYGS-UHFFFAOYSA-N 1-methyl-3-(3-methylphenyl)benzene Chemical group CC1=CC=CC(C=2C=C(C)C=CC=2)=C1 GVEDOIATHPCYGS-UHFFFAOYSA-N 0.000 description 1
- HKTCLPBBJDIBGF-UHFFFAOYSA-N 1-phenyl-2-propan-2-ylbenzene Chemical group CC(C)C1=CC=CC=C1C1=CC=CC=C1 HKTCLPBBJDIBGF-UHFFFAOYSA-N 0.000 description 1
- FZSPYHREEHYLCB-UHFFFAOYSA-N 1-tert-butyl-3,5-dimethylbenzene Chemical group CC1=CC(C)=CC(C(C)(C)C)=C1 FZSPYHREEHYLCB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- UOBQDYFTAJKQAL-UHFFFAOYSA-N 2-cyclohexylcyclohexan-1-one Chemical compound O=C1CCCCC1C1CCCCC1 UOBQDYFTAJKQAL-UHFFFAOYSA-N 0.000 description 1
- CWZGKTMWPFTJCS-UHFFFAOYSA-N 2-cyclopentylcyclopentan-1-one Chemical compound O=C1CCCC1C1CCCC1 CWZGKTMWPFTJCS-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PJXHBTZLHITWFX-UHFFFAOYSA-N 2-heptylcyclopentan-1-one Chemical compound CCCCCCCC1CCCC1=O PJXHBTZLHITWFX-UHFFFAOYSA-N 0.000 description 1
- JTHVYOIHZNYRCC-UHFFFAOYSA-N 2-hexylcyclopentan-1-one Chemical compound CCCCCCC1CCCC1=O JTHVYOIHZNYRCC-UHFFFAOYSA-N 0.000 description 1
- DUAYDERMVQWIJD-UHFFFAOYSA-N 2-n,2-n,6-trimethyl-1,3,5-triazine-2,4-diamine Chemical compound CN(C)C1=NC(C)=NC(N)=N1 DUAYDERMVQWIJD-UHFFFAOYSA-N 0.000 description 1
- TVYVQNHYIHAJTD-UHFFFAOYSA-N 2-propan-2-ylnaphthalene Chemical compound C1=CC=CC2=CC(C(C)C)=CC=C21 TVYVQNHYIHAJTD-UHFFFAOYSA-N 0.000 description 1
- MLLAPOCBLWUFAP-UHFFFAOYSA-N 3-Methylbutyl benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1 MLLAPOCBLWUFAP-UHFFFAOYSA-N 0.000 description 1
- OKSDJGWHKXFVME-UHFFFAOYSA-N 4-ethylcyclohexan-1-one Chemical compound CCC1CCC(=O)CC1 OKSDJGWHKXFVME-UHFFFAOYSA-N 0.000 description 1
- SUFDFKRJYKNTFH-UHFFFAOYSA-N 6-methoxy-1,2,3,4-tetrahydronaphthalene Chemical compound C1CCCC2=CC(OC)=CC=C21 SUFDFKRJYKNTFH-UHFFFAOYSA-N 0.000 description 1
- 229910000600 Ba alloy Inorganic materials 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920001393 Crofelemer Polymers 0.000 description 1
- SQPOKBBCNZIWFI-UHFFFAOYSA-N Cyclohexyl 3-methylbutanoate Chemical compound CC(C)CC(=O)OC1CCCCC1 SQPOKBBCNZIWFI-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000733 Li alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 229910015711 MoOx Inorganic materials 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- KYZHGEFMXZOSJN-UHFFFAOYSA-N benzoic acid isobutyl ester Natural products CC(C)COC(=O)C1=CC=CC=C1 KYZHGEFMXZOSJN-UHFFFAOYSA-N 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical compound CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- HHNHBFLGXIUXCM-GFCCVEGCSA-N cyclohexylbenzene Chemical compound [CH]1CCCC[C@@H]1C1=CC=CC=C1 HHNHBFLGXIUXCM-GFCCVEGCSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- PJRHFTYXYCVOSJ-UHFFFAOYSA-N cyclopropyl(phenyl)methanone Chemical compound C=1C=CC=CC=1C(=O)C1CC1 PJRHFTYXYCVOSJ-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- TWXWPPKDQOWNSX-UHFFFAOYSA-N dicyclohexylmethanone Chemical compound C1CCCCC1C(=O)C1CCCCC1 TWXWPPKDQOWNSX-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- KXUHSQYYJYAXGZ-UHFFFAOYSA-N isobutylbenzene Chemical compound CC(C)CC1=CC=CC=C1 KXUHSQYYJYAXGZ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- 238000004768 lowest unoccupied molecular orbital Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- VXNSQGRKHCZUSU-UHFFFAOYSA-N octylbenzene Chemical compound [CH2]CCCCCCCC1=CC=CC=C1 VXNSQGRKHCZUSU-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
Definitions
- the present invention relates to a method for manufacturing an organic EL display panel including a step of forming a light emitting layer by a printing method such as an inkjet method.
- organic electroluminescence element (hereinafter referred to as “organic EL element”), which has been researched and developed in recent years, is a current-driven light-emitting element, and a light-emitting element utilizing an electroluminescence phenomenon of an organic fluorescent substance. It is.
- an organic EL display panel in which the organic EL element is disposed on a substrate is widely used.
- the organic EL element in the organic EL display panel is made of, for example, a TFT (thin film transistor) substrate, an anode made of a metal such as Al, a light emitting layer made of an organic light emitting material, and a transparent material such as ITO (Indium Tin Oxide).
- the cathodes are sequentially stacked.
- the organic EL element includes a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, a sealing layer, and the like as necessary.
- a method for manufacturing a light emitting layer in an organic EL display panel As a method for manufacturing a light emitting layer in an organic EL display panel, a method of forming using a vacuum vapor deposition method and a printing method in which an organic material ink in which a small amount of an organic light emitting material is dissolved in a solvent are applied using an ink jet are formed. There is a method. If formed by the printing method, the light emitting layer can be formed with a simpler manufacturing apparatus than the vacuum deposition method. And since a printing system can be utilized also when manufacturing a large sized organic EL display panel with a manufacturing apparatus simpler than a vacuum evaporation method, it is useful in terms of manufacturing cost, for example.
- a partition wall also referred to as a “bank” made of a material containing a liquid repellent component is formed on a substrate, and then This is performed by applying an organic material ink, which is an ink obtained by dissolving a small amount of an organic light-emitting material in a solvent, into a sub-pixel region surrounded by a partition wall and drying it (see Patent Documents 1 and 2).
- the light emission colors of the adjacent light emitting layers are different from R (red: Red), G (green: Green), and B (blue: Blue). Further, the material of the light emitting layer is different for each emission color.
- An object of the present invention is to suppress luminance unevenness in an organic EL display panel manufactured using a printing method.
- the method for manufacturing an organic EL display panel includes a step of preparing a first ink containing a first organic light emitting material and a solvent, and a second organic light emitting device having a light emission wavelength different from that of the first organic light emitting material.
- Preparing a second ink containing a material and a solvent preparing a third ink containing a third organic light emitting material having a light emission wavelength different from that of the first and second organic light emitting materials; and a solvent; Applying the first ink to a first subpixel region on the substrate; applying the second ink to a second subpixel region adjacent to the first subpixel region; and the first subpixel.
- the second ink adjacent to the first sub-pixel region to which the first ink is applied is applied in the period from the start of the application of the first ink to the completion of the drying.
- the difference in concentration of the solvent atmosphere between the solvent evaporated from the second sub-pixel region and the solvent evaporated from the third sub-pixel region to which the third ink adjacent to the first sub-pixel region is applied (hereinafter referred to as this) (Referred to as “solvent atmosphere difference around the sub-pixel region”).
- the ink is applied to the second subpixel region and the third subpixel region on both sides adjacent to the first subpixel region.
- the solvent atmosphere difference around the first sub-pixel region can be suppressed.
- the difference in solvent atmosphere around each first sub-pixel region is suppressed, the occurrence of a difference in solvent atmosphere between the first sub-pixel regions located at different locations in the organic EL display panel can also be suppressed.
- the distribution of the solute is different between the sub-pixel regions located at different places when the drying of the first ink is completed, and the first ink is formed by application of the first ink.
- the shape may vary.
- the organic EL display panel is formed by applying the first ink by suppressing a difference in solvent atmosphere between the first sub-pixel regions located at different locations in the organic EL display panel.
- FIG. 2 is a top view of the organic EL display panel shown in FIG. 1 in a state where an electron injection layer, a cathode, and a sealing layer are removed. It is sectional drawing which shows the manufacturing process of the organic electroluminescence display panel shown in FIG. (A) is a figure which shows operation
- FIG. 6 is a top view illustrating a manufacturing process of the organic EL display panel illustrated in FIG. 5.
- FIG. 6 is a time chart showing manufacturing steps of the organic EL display panel shown in FIG. 5.
- (A)-(c) is a figure which shows the shape of the upper surface of the light emitting layer of each of three places of the conventional organic EL display panel
- (d)-(e) is the organic EL display panel shown in FIG. It is a figure which shows the shape of the upper surface of the light emitting layer of each of these three places.
- It is a figure explaining the manufacturing process of the organic electroluminescence display panel shown in FIG. It is a figure explaining the manufacturing process at the time of using a low-viscosity organic material ink.
- FIG. 13 is a top view showing a manufacturing process of the organic EL display panel shown in FIG.
- FIG. 13 is a time chart showing manufacturing steps of the organic EL display panel shown in FIG. 12.
- FIG. 12 is a time chart figure which shows the manufacturing process of the organic electroluminescence display panel which concerns on a modification.
- It is a schematic block diagram which shows schematic structure of the organic electroluminescence display provided with the organic electroluminescence display panel shown in FIG. It is an external view of the organic electroluminescence display provided with the organic electroluminescence display panel shown in FIG.
- the order of vapor-depositing an organic light emitting material can consider the order of R, G, B, for example. This is because the lifetime of the organic EL element is generally considered to be shorter in the order of R, G, and B, and there is an advantage in forming it from the R light emitting layer having a long lifetime.
- advantages of forming the light emitting layer with a long lifetime in order will be described.
- the manufacture of the organic EL element is completed, for example, by forming a light emitting layer on a TFT substrate and then sealing the light emitting layer with a cathode or a sealing layer.
- moisture and oxygen easily reach the light emitting layer, and the light emitting layer is likely to deteriorate. Therefore, the longer the period from formation of the light emitting layer to sealing, the greater the possibility of deterioration of the light emitting layer.
- the light emitting layer having a long lifetime is formed, the light emitting layer having a short lifetime is placed in an environment where the possibility of deterioration is smaller. Therefore, the light emitting layer having a short lifetime is placed in an environment where the possibility of deterioration is greater. Rather than the deterioration of the lifetime of the entire organic EL display panel.
- the inventors decided to manufacture an organic EL display panel by a printing method using an ink jet capable of forming a light emitting layer with a manufacturing apparatus simpler than the vacuum deposition method.
- the printing method research and development on the application order of the organic light emitting material has not been made yet. Therefore, it is considered that the organic light emitting material is applied in the same order as the above-described example of the vapor deposition method. Therefore, the organic material ink is applied in order from the ink corresponding to the light-emitting layer having a long lifetime, as in the example of the order of forming the vapor-deposited light-emitting layers.
- the reason why the cross-sectional shape of the light emitting layer formed using the organic material ink with low viscosity varies is that the organic material ink with low viscosity has a larger fluidity of the solvent than the organic material ink with high viscosity, and the surroundings This is considered to be easily affected by the solvent atmosphere.
- the inventors focused on this point and decided to determine the application order of the organic material ink based on the viscosity of the organic material ink. As a result, even in a light emitting layer using a low-viscosity organic material ink, it is possible to suppress variations in the cross-sectional shape of the light-emitting layer between sub-pixel regions to which the low-viscosity organic material ink is applied. It was. One embodiment of the present invention has been obtained by such a process.
- the method for manufacturing an organic EL display panel includes a step of preparing a first ink containing a first organic light emitting material and a solvent, and a second organic light emitting device having a light emission wavelength different from that of the first organic light emitting material Preparing a second ink containing a material and a solvent; preparing a third ink containing a third organic light emitting material having a light emission wavelength different from that of the first and second organic light emitting materials; and a solvent; Applying the first ink to a first subpixel region on the substrate; applying the second ink to a second subpixel region adjacent to the first subpixel region; and the first subpixel.
- the influence of the solvent atmosphere around the first sub-pixel region in the period from the start of application of the first ink, which is a low-viscosity ink, to the completion of drying. Can be suppressed.
- the ink is present in the second sub-pixel region and the third sub-pixel region adjacent to the first sub-pixel region, so that the adjacent second sub-pixel region
- the solvent atmosphere difference from the adjacent second sub-pixel region and third sub-pixel region is suppressed.
- the first sub-pixel region located at a different location in the organic EL display panel compared to the case where ink is present only in one of the second sub-pixel region and the third sub-pixel region adjacent to the first sub-pixel region. It is possible to suppress the occurrence of a difference in solvent atmosphere difference. As a result, when a plurality of light emitting layers formed of the first ink are compared, variation in shape can be suppressed.
- the method for manufacturing an organic EL display panel according to an aspect of the present invention includes a step of drying the second and third inks after the step of applying the second and third inks,
- the application of the first ink may be started after the process of drying the third ink is started.
- the method for manufacturing an organic EL display panel includes a step of drying the second and third inks after the step of applying the second and third inks, And after completion of the step of drying the third ink, the application of the first ink may be started.
- the method for manufacturing an organic EL display panel according to an aspect of the present invention includes a step of forcibly drying the second and third inks after the application of the second and third inks is completed.
- the natural drying time from the completion of the application to the start of the forced drying process may be longer than the natural drying time from the completion of the application of at least one of the second and third inks to the start of the forced drying process.
- the application of the second and third inks is completed, the application of the first ink is started, and after the application of the first ink is completed,
- the first, second, and third inks may be forcibly dried.
- the method for manufacturing an organic EL display panel includes a step of drying the second and third inks after the application of the second and third inks is completed. After completing the step of drying the three inks, the application of the first ink may be started, and the second and third inks may be forcibly dried.
- the first ink may be dried by natural drying after the step of applying the first ink.
- the application may be started from an ink having a long lifetime among the second ink and the third ink.
- the application may be started from an ink having a low viscosity among the second ink and the third ink.
- the natural drying time from the completion of application of the low viscosity ink of the second ink and the third ink to forced drying is It may be longer than the natural drying time from the completion of application of the high viscosity ink among the ink and the third ink to forced drying.
- FIG. 1 is a cross-sectional view of an organic EL display panel.
- anode 13 made of a metal such as Al
- a hole injection layer 14 an IL (intermediate) layer 15
- light emitting layers 16R, 16G made of an organic material, 16B (hereinafter collectively referred to as “light emitting layer 16” when there is no need to distinguish).
- an electron injection layer 17 that covers the partition wall layer 12 and the light emitting layer 16, a cathode 18 made of a transparent material such as ITO (Indium Tin Oxide), and a sealing made of a light transmissive material such as SiN or SiON.
- the layer 19 is laminated in order.
- a combination of three sub-pixels R, G, and B is one pixel. Further, the reason that the emission color of the sub-pixel region is different from R, G, and B is due to the difference in the material of the light emitting layer 16.
- FIG. 2 is a top view of the organic EL display panel 1 with the electron injection layer 17, the cathode 18, and the sealing layer 19 removed, and the partition wall layer 12 and the light emitting layer 16 are visible.
- FIG. 1 corresponds to a cross-sectional view taken along the line AA ′ of FIG. 1 and 2 show one pixel (three sub-pixels) of the organic EL display panel 1.
- the partition layer 12 surrounds the light emitting layer 16. Further, the visible region of the light emitting layer 16 corresponds to each subpixel region. In a general 20-inch organic EL display panel, when 1280 ⁇ 768 pixels are arranged at an equal distance, the size of the sub-pixel region is about (64 ⁇ m ⁇ 234 ⁇ m).
- the light emitting layers that emit blue, red, and green light are referred to as a B light emitting layer, an R light emitting layer, and a G light emitting layer, respectively.
- the organic material inks that emit blue, red, and green light are referred to as B organic material ink BI, R organic material ink RI, and G organic material ink GI, respectively.
- a substrate provided with a TFT substrate 11, a partition wall layer 12, an anode 13, a hole injection layer 14, and an IL layer 15 is prepared.
- an organic material ink that is a material of the light emitting layer 16 is applied to a sub-pixel region surrounded by the partition wall layer 12 by a printing method using an ink jet, and then dried to emit light. Layer 16 is formed.
- the organic material ink is dried by performing forced drying such as reduced pressure drying or baking after natural drying.
- an electron injection layer 17 and a cathode 18 are formed so as to cover the partition wall layer 12 and the light emitting layer 16.
- the organic EL display panel 1 is manufactured through the above steps. 3. Details of light emitting layer formation process (operation of inkjet head) Here, the details of the process of forming the light emitting layer 16, particularly the operation of the inkjet head, will be described in detail.
- an inkjet apparatus including an inkjet head 20 having three ink ejection nozzles is used.
- the ink jet apparatus scans the ink jet head 20 while controlling the positional relationship between the nozzle and the substrate, and discharges and applies organic material ink from the nozzle to the sub-pixel region.
- the inkjet head 20 uses, for example, a piezo-type inkjet head that discharges ink by deformation of the piezo.
- a multi-pass printing method is used in which the organic material ink is applied by repeating the operation of scanning the inkjet head 20 in the Y direction and then shifting in the X direction a plurality of times.
- the inkjet head 20 has an R print head, a G print head, and a B print head corresponding to each color of the emission color. Then, the heads of the respective colors cause one nozzle and one sub-pixel to correspond to each other and eject organic material ink droplets. The ink droplets land on a desired subpixel region and are dried to form the light emitting layer 16.
- the number of nozzles of one head used in the present embodiment is 64 for each color. Therefore, by moving the head from the first scan to the portion where printing is not performed from the first scan and repeating the scan 20 times until the 20th scan, the organic material ink is applied to the entire surface of the panel. By carrying out with all colors G and B, the formation of the light emitting layer 16 of the entire organic EL display panel 1 is completed.
- the viscosity adjustment of the ink and the conditions for dropping the ink onto the sub-pixel area are as follows: G organic material ink (viscosity: about 5 mPas), which is a relatively low-viscosity ink, is 72 pl in one sub-pixel, higher viscosity than the G organic material ink R organic material ink (viscosity: about 15 mPas), which is the ink of No. 1, is 72 pl in one subpixel, and B organic material ink (viscosity: about 12 mPas), which is higher in viscosity than the G organic material ink, is contained in one subpixel. Set to 70 pl, respectively. An organic solvent having a boiling point of about 200 ° C.
- FIG. 5 is a cross-sectional view showing details of the light emitting layer forming process of the manufacturing process shown in FIG. 3
- FIG. 6 is a top view showing the manufacturing process of the organic EL display panel 1 shown in FIG.
- the R organic material ink 16RI is applied to the R sub-pixel region by an ink jet method.
- an R light emitting layer 16R is formed. Specifically, after applying the R organic material ink 16RI and performing vacuum drying at 0.5 Pa for 20 minutes, the R light emitting layer 16R is obtained in the R sub-pixel region.
- the solvent of the R organic material ink 16RI is completely dried from within the R sub-pixel by natural drying and reduced-pressure drying. In addition to drying under reduced pressure, forced drying can be performed by heat drying such as baking.
- Fig.6 (a) the figure which looked at the state of FIG.5 (b) from the top is Fig.6 (a).
- the B organic material ink 16BI is applied to the B sub-pixel region by an inkjet method.
- the B light emitting layer 16B is formed. Specifically, after applying the B organic material ink 16BI to the B sub-pixel region on the entire surface of the panel, vacuum drying is performed at 0.5 Pa for 20 minutes. In addition, the figure which looked at the state of FIG.5 (d) from the top is FIG.6 (b). In addition, in the time from the start of application of the R and B organic material inks 16RI and 16BI to the end of application, the ink is naturally dried in the first applied B sub-pixel region.
- the G organic material ink 16G is applied to the G sub-pixel region by an inkjet method. Since R and B light emitting layers 16R and 16B are formed in the R and B sub pixel regions adjacent to the G sub pixel region, only one of the R and B sub pixel regions is applied when the G organic material ink is applied. The difference in the solvent atmosphere in the R and B sub-pixel regions, that is, the difference in the solvent atmosphere around the G sub-pixel region, is suppressed as compared with the case where undried ink is present.
- a G light emitting layer 16G is formed. Specifically, after applying the G organic material ink 16GI to the G sub-pixel region on the entire surface of the panel, without waiting for the solvent in all the G sub-pixel regions in the panel to be dried without using forced drying. I do.
- drying without leaving forced drying such as heating or decompression without leaving the substrate is called natural drying.
- natural drying is performed until the solvent in all the sub-pixel regions in the panel is dried, and the waiting time required for natural drying is about 20 to 30 minutes. Thereafter, vacuum drying is performed at 0.5 Pa for 20 minutes.
- FIG.6 (c) the figure which looked at the state of FIG.5 (f) from the top is FIG.6 (c).
- the entire surface of the organic EL display panel 1 is baked and dried at 130 ° C. for 10 minutes in an N 2 atmosphere, the formation of the light emitting layer 16 is completed.
- FIG. 7 is a time chart showing the manufacturing process of the organic EL display panel 1. Steps indicated by R, G, and B indicate steps for the R, G, and B sub-pixel regions, respectively.
- the R organic material ink 16RI is applied, and then forced drying is performed under reduced pressure to obtain the R light emitting layer 16R.
- forced drying by reduced pressure drying is performed to obtain the B light emitting layer 16B.
- forced drying by natural drying and reduced pressure drying is performed to obtain the G light emitting layer 16G.
- FIGS. 8A, 8B, and 8C show the shapes of the upper surfaces of three different G light-emitting layers 16G in the organic EL display panel 1 according to the comparative example.
- FIGS. 8D, 8E, and 8F are diagrams showing the shapes of the upper surfaces of three different G light emitting layers 16G in the organic EL display panel 1 according to the present embodiment.
- the inkjet head 20 scans and applies R, G, and B organic material inks 16RI, 16GI, and 16BI (hereinafter collectively referred to as “organic material ink 16” when there is no need to distinguish).
- organic material ink 16I is dried, the shape of the upper surface of the obtained G light emitting layer 16G is subjected to scanning evaluation by an AFM (Atomic Force Microscope).
- the shape of the upper surface of the G light emitting layer 16G in three different sub-pixel regions varies. Specifically, the uppermost portion of the upper surface of the G light emitting layer 16G is ⁇ 20 ⁇ m in FIG. 8A, 0 ⁇ m in FIG. 8B, and 5 ⁇ m in FIG. Further, the lowest part of the upper surface of the G light emitting layer 16G is 70 ⁇ m in FIG. 8A, ⁇ 75 ⁇ m in FIG. 8B, and 95 ⁇ m in FIG. 8C.
- FIGS. 8D, 8E, and 8F in this embodiment, variations in the shape of the upper surface of the G light emitting layer 16G in three different sub-pixel regions are suppressed.
- the uppermost portion of the upper surface of the G light emitting layer 16G is 0 ⁇ m in FIGS. 8D, 8E, and 8F
- the lowermost portion of the upper surface of the G light emitting layer 16G is illustrated in FIG. e) It is ⁇ 100 ⁇ m in (f).
- the cross-sectional shape of each sub-pixel region can be made more uniform by appropriately selecting the bank material, water repellency, side surface inclination angle, and the like.
- FIG. 9 is a diagram for explaining a manufacturing process of the organic EL display panel 1, and in particular, a diagram for explaining a process of forming the G light emitting layer 16G.
- the arrows in FIGS. 9A and 9B indicate solvent convection.
- the G organic material ink 16GI in which the solute is distributed in the solvent is applied to the G sub-pixel region.
- the solvent is dried by natural drying, but the drying speed of the solvent is different between the central region and the peripheral region in the sub-pixel region. The difference in drying speed of the solvent causes convection, and the solute moves in the solvent.
- the G light emitting layer 16G is formed.
- the convection of the solvent tends to be asymmetric. That is, the shape of the light emitting layer in the sub-pixel region is affected by the surrounding solvent atmosphere. Therefore, in the organic EL display panel 1, when attention is paid to two sub-pixel regions located at different locations, if the difference in solvent atmosphere between the sub-pixel regions adjacent to each sub-pixel region is different, the organic EL display panel 1 The cross-sectional shape of the light emitting layer varies.
- FIG. 10 is a diagram for explaining a manufacturing process when a low-viscosity organic material ink is used
- FIG. 11 is a diagram for explaining a manufacturing process when a high-viscosity organic material ink is used.
- the arrows in FIGS. 10 (a) and 11 (a) indicate solvent convection.
- FIG. 10 (a) when a low-viscosity organic material ink is used, the fluidity of the solvent increases, so the convection increases and the solute moves more intensely.
- FIGS. 10 (b-1), (b-2), and (b-3) the distribution of solutes at the time of convection stop varies greatly.
- This distribution variation is a distribution as shown in FIG. 10B-1 in a certain sub-pixel region, a distribution as shown in FIG. 10B-2 in another sub-pixel region, and a further sub-region. In the pixel area, the distribution is as shown in FIG.
- the susceptibility to influence from adjacent sub-pixel regions varies depending on the viscosity of the organic material ink. Therefore, it is efficient to suppress the variation in the solvent atmosphere difference depending on the location of the sub-pixel region for the organic material ink having the lowest viscosity.
- the application order is set so that the ink before drying does not exist in the adjacent sub-pixel region when the application of the low-viscosity organic material is started. Is adjusted.
- the dried sub-pixels adjacent to the first sub-pixel region are adjacent to each other due to the presence of the dried ink in the second sub-pixel region and the third sub-pixel region.
- the difference in solvent atmosphere from the adjacent second subpixel region and third subpixel region is suppressed.
- the first subpixel located at a different location in the organic EL display panel 1 as compared with the case where ink is present only in one of the second subpixel region and the third subpixel region adjacent to the first subpixel region. Occurrence of a difference in solvent atmosphere difference between regions can be suppressed.
- the area near the center of the organic EL display panel tends to be harder to dry than the area at the end of the organic EL display panel.
- the R organic material ink 16RI and the B organic material ink 16BI are already dried before the G organic material ink 16GI is applied, the difference in the solvent atmosphere around the G sub-pixel region is further suppressed. can do.
- the dried state of the other organic material inks already applied differs depending on the location of the sub-pixel region in the organic EL display panel. For example, in the sub-pixel region to which the organic material ink is applied in the initial stage, the drying of the organic material ink proceeds, and the solvent atmosphere difference from the sub-pixel region to which the organic material ink is not applied is relatively small. On the other hand, in the sub-pixel region where the organic material ink is applied relatively newly, a lot of solvent remains in the sub-pixel region, and the solvent atmosphere difference from the sub-pixel region where the organic material ink is not applied is relatively small. large.
- the G organic material ink 16GI is dried by natural drying until the shape of the G light emitting layer 16G is determined, and then forced drying is performed. Therefore, when the G organic material ink 16GI is subjected to forced drying, the amount of the solvent is reduced to some extent and the shape thereof is determined.
- R and B organic material inks 16RI and 16BI are naturally dried during the time from the start of application to the completion of application, and are forcibly dried after the application is completed.
- the natural drying time after application of the G organic material ink 16GI having a low viscosity (that is, the time until forced drying) is longer than the natural drying time after application of the R organic material ink 16RI and the G organic material ink 16BI. long.
- the reason why it is possible to suppress the variation of the light emitting layer whose shape is determined by natural drying and the variation of the cross-sectional shape of the light emitting layer formed by taking a long natural drying time will be described.
- the shape may vary between the sub-pixel regions. If forced drying such as reduced pressure drying or heat drying is performed without sufficient natural drying in this state, the organic light emitting layer 16 may be formed with the solute distribution variation remaining.
- the embodiment including both the order of applying the organic material ink and the drying method has been described.
- the solute variation immediately after the application affects the final shape of the light emitting layer. It is possible to prevent this and suppress the variation in shape between the sub-pixel regions.
- forced drying is performed at the same time as the application of the R and B organic material inks is completed.
- the forced drying may be performed after natural drying for a predetermined time.
- the tact time becomes long, and as described above, it is efficient to make the natural drying time of the low viscosity organic material ink the longest.
- each sub-pixel region can be made more uniform.
- the film thickness variation in each sub-pixel region is also caused by the material of the partition layer, the water repellency, the inclination angle of the side surface, and the like. Therefore, the film thickness in the sub-pixel region may not be uniform even when the left and right solvent atmospheres are the same for one sub-pixel region. However, the thickness of the light-emitting layer formed in the subpixel region can be made more uniform when the solvent atmosphere difference is smaller than when the solvent atmosphere difference between the left and right of one subpixel region is large. it can.
- the natural drying time after application of the low viscosity G organic material ink 16GI (that is, the time until forced drying) is longer than the natural drying time after application of the R organic material ink 16RI and the G organic material ink 16GI. long. Therefore, the cross-sectional shape of the G light-emitting layer 16 whose cross-sectional shape is most likely to vary can be made more uniform between the G light-emitting layers 16 located at different locations in the organic EL display panel 1.
- forced drying is performed on the G organic material ink GI.
- drying may be completed by natural drying.
- the G organic material ink When the G organic material ink is applied, if the undried ink is applied to both the R and B sub pixel areas that are adjacent to the G sub pixel area, the R and B sub pixel areas The absolute value of the solvent atmosphere difference is smaller than when the undried ink is applied to only one of these. As a result, variation in solvent atmosphere difference depending on the location is also suppressed. That is, when the G organic material ink is applied to the sub pixel area, the R organic material ink and the B organic material ink are already applied to the R and B sub pixel areas located on both sides of the G sub pixel area. Variations in the shape of the G light emitting layer 16G can be suppressed.
- the organic material ink other than the G organic material ink having the lowest viscosity that is, the organic material ink having the longer lifetime among the B organic material ink and the R organic material ink first.
- the R organic material ink has a longer life than the B organic material ink, it is formed by the G organic material ink by applying the R organic material ink, the B organic material ink, and the B organic material ink in this order.
- the lifetime of the organic EL panel can be kept longer.
- an organic material ink having a low viscosity may be applied first.
- the organic material ink having a low viscosity is more likely to cause variation in the shape of the light emitting layer between the sub-pixel regions.
- the organic material ink having a low viscosity is applied first, when the application of the organic material ink having the low viscosity of the two is started, another organic material is placed on the organic EL panel. Ink does not exist and is not easily affected by the solvent atmosphere.
- the natural drying time after the application of the organic material ink having a low viscosity is completed is R
- the natural drying time for an organic material having a low viscosity may be extended.
- the application of the G organic material ink may be started before the application of the R organic material ink and the B material ink is completed.
- the second embodiment is different from the first embodiment only in the process of forming the light emitting layer 16. Therefore, since the substrate configuration is the same as that in the first embodiment and an inkjet is used, the description of the configuration related to the substrate, the inkjet, and the organic material ink is omitted. Details of Light-Emitting Layer Formation Step First, as shown in FIG. 12A, R organic material ink 16RI is applied to the R sub-pixel region by an inkjet method.
- the B organic material ink 16BI is applied to the B sub-pixel region by an inkjet method.
- the R light emitting layer 16R and the B light emitting layer 16B are formed. Specifically, R and B organic material inks 16RI and 16BI were applied to the R and B subpixel regions on the entire surface of the panel, and then vacuum drying was performed at 0.5 Pa for 20 minutes.
- FIG.13 (a) the figure which looked at the state of FIG.12 (c) from the top is FIG.13 (a).
- the G organic material ink 16GI is applied to the G sub-pixel region. Since the R and B light emitting layers 16R and 16B are formed in the R and B sub pixel regions adjacent to the G sub pixel region, the solvent atmosphere difference between the R and B sub pixel regions is suppressed.
- a G light emitting layer 16G is formed. Specifically, in a state where the substrate is left after application of the G organic material ink 16GI, the process waits until the solvents in all the G subpixel regions in the organic EL display panel 1 are dried. The waiting time is about 20 to 30 minutes. As a result, the G light emitting layer 16G made only by natural drying is obtained in the G subpixel region. In addition, the figure which looked at the state of FIG.12 (e) from the top is FIG.13 (b).
- the entire surface of the organic EL display panel 1 is baked at 130 ° C. for 10 minutes in an N 2 atmosphere, whereby the formation of the light emitting layer 16 is completed.
- FIG. 14 is a time chart showing the manufacturing process of the organic EL display panel 1.
- R and B light emitting layers 16R and 16B are obtained by application of R and B organic material inks 16RI and 16BI and forced drying.
- the G organic material ink 16GI is applied and naturally dried.
- forced drying is performed by baking, and R, G, and B light emitting layers 16R, 16G, and 16B are obtained.
- the natural drying time of the G organic material ink 16GI is longer than the natural drying time of the R organic material ink 16RI. Note that the R organic material ink 16RI and the B organic material ink 16BI, which are high-viscosity inks, are not easily changed in shape by the state of the solvent atmosphere difference between adjacent sub-pixel regions.
- the two organic material inks can be forcibly dried at once after being applied to the entire panel regardless of the order of application. By simultaneously forcibly drying high viscosity organic material ink at the same time, the manufacturing time can be further reduced as compared with the first embodiment.
- application of the G organic material ink is started after the drying of the B organic material ink and the R organic material ink is completed.
- the present invention is not limited to this embodiment, and the application of the G organic material ink may be started before the drying of the B organic material ink and the R organic material ink is completed.
- any one of the adjacent sub-pixel regions is started.
- the difference in solvent atmosphere around the sub-pixel region to which the G organic material ink is applied can be suppressed. I can do it.
- variation in the cross-sectional shape of the light emitting layer using the G organic material ink can be suppressed.
- a solvent is present in the G sub-pixel region, so that it is affected by the difference in solvent atmosphere between the left and right. Therefore, before the application of the G organic material ink, the left and right sub-pixel regions are already in the applied state, so that only one of the left and right sub-pixel regions is in the applied state.
- the solvent atmosphere difference around the pixel region can be suppressed. As a result, the variation in the solvent atmosphere difference around the sub-pixel regions located at different locations is suppressed, so that the shape variation of the light emitting layers located at different locations can be suppressed.
- the application of the B organic material ink is started after the application of the R organic material ink is completed. Then, before the application of the R, B organic material ink is completed, the G organic material ink is applied, and the R, G, B organic material ink is forcibly dried.
- the manufacturing time can be further reduced as compared with the first embodiment.
- the B organic material ink is applied in the middle of the application of the R organic material ink
- the G organic material ink is applied in the middle of the application of the B organic material ink. Perform forced drying.
- the organic material ink is naturally dried immediately after application, in this modified example, when the G organic material ink is applied, the adjacent R and B organic material inks are completely dried before the application of the G organic material ink. If so, it is more preferable. Variation in the cross-sectional shape of the G light emitting layer between the G sub-pixel regions can be suppressed. Thereby, manufacturing time can be further shortened by repeating the application
- Properties of organic material ink (viscosity) In the above embodiment, the description has been made on the assumption that the ink containing the first organic light-emitting material having the lowest viscosity among the organic material inks is green. However, the organic light-emitting material having the lowest viscosity is blue. Or it may be red.
- the viscosity of the B organic material ink is lower than that of the other two color organic material inks, it is preferable to start application of the B organic material ink before application of the other organic material inks.
- the organic material ink used for the device structure using the ink jet method an ink having an ink viscosity of 5 mPas to 50 mPas is preferable.
- the high-viscosity organic material ink in the present invention is a generic term for an organic material ink having a viscosity of about 9 mPas to 15 mPas
- the low-viscosity organic material ink is an organic material ink having a viscosity of about 4 mPas to 7 mPas.
- the surface tension of the organic material ink is preferably 20 mN / m to 70 mN / m, and particularly preferably 25 mN / m to 45 mN / m. By setting the surface tension within this range, it is possible to suppress the flight bending of the droplets of the organic material ink during ink ejection.
- the surface tension of the organic material ink is less than 20 mN / m
- the wettability of the organic material ink on the nozzle surface increases, and when the organic material ink is ejected, the organic material ink is in the nozzle hole. May adhere asymmetrically around.
- the organic material ink is ejected by non-uniform force, and so-called the target position cannot be reached. The frequency of occurrence of flight bends increases.
- the solid content concentration of the organic material ink is preferably 0.01 wt% to 10.0 wt%, more preferably 0.1 wt% to 5 wt%, based on the entire composition. If the solid content concentration is too low, the number of ejections increases to obtain the required film thickness, resulting in poor production efficiency. On the other hand, if the solid content concentration is too high, the viscosity becomes high, which affects the dischargeability.
- solvent an organic material constituting a layer having a light emitting function such as a light emitting layer and a hole injection layer used in the present invention is dissolved in an organic solvent and applied in the form of an organic material ink.
- the selection of the solvent for the organic material is based on the solubility and stability of the organic material, the viscosity and surface tension of the organic material ink, which are important for forming the light emitting layer, and the solvent necessary to guarantee the uniformity of the light emitting layer. Carry out considering the boiling point.
- a solvent having a boiling point exceeding 300 ° C. such as dodecylbenzene can be used from a solvent having a relatively low boiling point such as toluene and xylene.
- n-dodecylbenzene isopropylbiphenyl, 3-ethylbiphenylnonylbenzene, 3-methylbiphenyl, 2-isopropylnaphthalene, 1,2-dimethylnaphthalene, 1,4-dimethylnaphthalene, 1,6 -Dimethylnaphthalene, 1,3-diphenylpropane, diphenylmethane, octylbenzene, 1,3-dimethylnaphthalene, 1-ethylnaphthalene, 2-ethylnaphthalene, 2,2'-dimethylbiphenyl, 3,3'-dimethylbiph Enyl, 2-methylbiphenyl, 1-methylnaphthalene, 2-methylnaphthalene, cyclohexylbenzene, 1,3,5-triisopropylbenzene, hex
- monohydric alcohols such as methanol, ethanol, isopropyl alcohol and n-butanol
- cellosolv solvents such as methyl cellosolve and ethyl cellosolve can be used.
- other solvents can be used.
- solvents may be used alone, but are preferably mixed and used.
- a solvent having a high boiling point is mixed with a solvent having a relatively low boiling point
- the planarity of the light emitting layer during solvent drying can be improved.
- a solvent having a boiling point of 250 ° C. to 350 ° C. is mixed with a solvent having a boiling point of 100 ° C. to 200 ° C.
- a light emitting layer having excellent flatness can be obtained in the ink jet method and the nozzle coating method. 3.
- a multi-pass printing method in which printing is performed by a plurality of inkjet head scans is used, but a method in which printing is performed by a single inkjet head scan may be used.
- a printing method such as a line bank may be used. 4).
- Printing Method The organic material ink printing method applicable to the present invention is not limited to the inkjet method.
- the present invention can be applied even if a gravure printing method or the like is used. 5.
- Drying method The drying method of the organic material ink is important for suppressing variation in the cross-sectional shape of the light emitting layer. As a drying method, vacuum drying, heat drying, or drying in an inert gas is used.
- the layer configuration may be a bottom emission type in which light from the light emitting layer is extracted from the glass substrate side, in addition to a so-called top emission type in which the light is emitted from the opposite side of the glass substrate.
- a substantially light-transmitting anode is preferably used as the anode
- a cathode that reflects light is preferably used as the cathode.
- the cathode and the anode often have a multilayer structure.
- the light emitting layer may be of any type as long as it can be dissolved in a solvent and coated to form a thin film, including polyfluorene-based, polyphenylene vinylene-based, pendant-type, dendrimer-type, and coating-type low-molecular weight types. .
- the light-emitting layer can contain a plurality of materials having a light-emitting function, and the mobility and injectability between holes and electrons and the emission chromaticity can be adjusted.
- the coating liquid which mixed the dopant with the host material can be used.
- the dopant a known fluorescent material or phosphorescent material can be used. These materials may be so-called low molecules, polymers or oligomers. In addition, various combinations such as addition of a low molecular dopant to the high molecular host material are possible. 8).
- Partition Layer and Bank The thickness of the partition layer varies depending on the concentration of the organic material ink to be printed, but is desirably 100 nm or more.
- any material having electrical insulation can be used arbitrarily, and it is an electrical insulation resin (for example, polyimide resin) having heat resistance and resistance to solvents. It is preferable.
- the component contained in the organic material constituting the partition contains a component repellent to the organic material ink printed in the bank using an inkjet or the like. It is desirable to have a function to prevent overflow of organic material ink.
- a photolithography technique or the like is used, and the partition layer is formed by patterning. For example, after a partition wall layer material is applied, a desired shape is formed on the hole injection layer by baking, mask exposure, development, or the like.
- the shape of the partition wall layer is a forward taper shape, but it is preferable in terms of preventing ink overflow and confirming the formation state of the light emitting layer, but is not limited thereto.
- the hole injection layer is an organic material
- a material such as the above polythiophene-based PEDT: PSS is formed by a spin coating method, an inkjet method, or a nozzle coating method.
- a polyaniline-based material can also be used.
- Inorganic hole injection layers are also known, and molybdenum oxide, tungsten oxide, vanadium oxide, ruthenium oxide, and the like are used.
- a carbon compound such as fullerene can be deposited and used as the hole injection layer, and is formed by a vacuum deposition method, an electron beam deposition method, or a sputtering method.
- the thickness of the hole injection layer is preferably 5 nm to 200 nm.
- a film formed by vapor deposition or sputtering of a carbon compound such as molybdenum oxide, tungsten oxide, or fullerene is preferably used.
- Transition metal oxides are particularly preferable because of their high ionization potential, easy hole injection into the light-emitting material, and excellent stability. These oxides are effective in improving the hole injection property of the hole injection layer if they are formed so as to have a defect level during or after formation. 10.
- Cathode As the cathode, a metal or alloy having a low work function is used.
- an ultra-thin film using a metal having a low work function is formed, and an upper thin film is formed thereon.
- a transparent cathode may be formed by stacking conductive films made of a light-transmitting material such as ITO or IZO.
- This ultra-thin film made of a metal having a small work function is not limited to a Ba-AI two-layer structure, but a Ca-AI two-layer structure, or Li, Ce, Ca, Ba, In, Mg, Ti, etc.
- Metals, oxides thereof, halides typified by fluoride, Mg alloys such as Mg-Ag alloy, Mg-In alloy, AI alloys such as AI-Li alloy, AI-Sr gold, AI-Ba alloy, etc. Is used.
- Mg alloys such as Mg-Ag alloy, Mg-In alloy
- AI alloys such as AI-Li alloy, AI-Sr gold, AI-Ba alloy, etc.
- a laminated structure of an ultrathin film having a laminated structure such as LiO2 / AI or LiF / AI and a light-transmitting conductive film is also suitable as the cathode material.
- a transition metal oxide such as TiOx, MoOx, WOx, TiOx, ZnO or the like that has oxygen deficiency and exhibits conductivity can be used as an electron injection layer.
- the organic EL display panel of the above embodiment is connected to a drive circuit 31, and the drive circuit 31 is controlled by a control circuit 32.
- 12 Product Form The organic EL display panel of the above embodiment can be distributed as it is to a sales channel as a single device. However, the present invention is not limited to this, and as shown in FIG. 17, it may be incorporated and distributed in a display device such as a digital television.
- the present invention can suppress luminance unevenness generated in the organic EL display panel when using a low-viscosity ink. Since it is possible to provide a high-quality organic EL display that does not cause luminance unevenness due to the viscosity of the ink material, it is highly versatile and useful in the display field of various electronic devices.
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Abstract
Description
以下、本発明の一態様を具体的に説明するに先立ち、本発明の一態様を得るに至った経緯について説明する。
[本発明の一態様の概要]
本発明の一態様に係る有機EL表示パネルの製造方法は、第1有機発光材料と溶媒とを含む第1インクを準備する工程と、前記第1有機発光材料と発光波長が異なる第2有機発光材料と、溶媒とを含む第2インクを準備する工程と、前記第1及び第2有機発光材料と発光波長が異なる第3有機発光材料と、溶媒とを含む第3インクを準備する工程と、基板上の第1サブ画素領域に、前記第1インクを塗布する工程と、前記第1サブ画素領域に隣り合う第2サブ画素領域に、前記第2インクを塗布すると共に、前記第1サブ画素領域を挟んで前記第2サブ画素領域とは反対側で前記第1サブ画素領域に隣り合う第3サブ画素領域に、前記第3インクを塗布する工程と、を有し、前記第1インクの粘度は、前記第2及び第3インクの粘度よりも低く、前記第2及び第3インクの塗布の開始後に、前記第1インクの塗布を開始することを特徴とする。
<実施の形態1>
1.全体構成
以下、実施の形態を、図面を参照しつつ、詳細に説明する。図1は、有機EL表示パネルの断面図である。有機EL表示パネル1は、ガラス基板、TFT(薄膜トランジスタ)層及び平坦化膜層等を含むTFT基板11と、TFT基板11上に形成された隔壁層12とを備える。有機EL表示パネル1を点灯させる際には、ガラス基板と陽極13との間の平坦化膜層は、ガラス基板上に配置された薄膜トランジスタ及びトランジスタによるラフネスを緩和する。なお、薄膜トランジスタ及び平坦化膜の構成は周知のものを使用しているため、ここでは図示しない。隔壁層12の膜厚は1um程度であり、その断面形状は順テーパー状である。
2.有機EL表示パネル1の製造工程
次に、有機EL表示パネルの製造工程について説明する。まず、図3を用いて全体の工程を説明し、その後、図4から図7を用いて発光層の形成工程を詳細に説明する。
3.発光層形成工程の詳細
(インクジェットヘッドの動作)
ここで、発光層16を形成する工程の詳細、特に、インクジェットヘッドの動作について詳しく説明する。
(発光層形成工程の詳細)
図5は、図3に示した製造工程の発光層形成工程の詳細を示す断面図であり、図6は、図5に示した有機EL表示パネル1の製造工程を示す上面図である。
5.効果
(5-1)発光層の断面形状の観測結果
図8(a)(b)(c)は、比較例に係る有機EL表示パネル1における3つの異なるG発光層16Gの上面の形状を示す図であり、図8(d)(e)(f)は、本実施の形態に係る有機EL表示パネル1における3つの異なるG発光層16Gの上面の形状を示す図である。具体的には、インクジェットヘッド20がR、G、B有機材料インク16RI、16GI、16BI(以下、区別の必要がないときは「有機材料インク16」と総称する)を各々20回ずつ走査塗布し、その後有機材料インク16Iを乾燥した後に、得られたG発光層16Gの上面の形状をAFM(Atomic Force Microscope:原子間力顕微鏡)によって走査評価を行っている。
(5-2-1)塗布順序についての考察
本実施の形態のインクの塗布順序による効果について、以下で詳しく考察する。
(5-2-2)乾燥方法についての考察
有機材料インクを塗布する順番に加えて、有機材料インクの乾燥方法が発光層の形状に与える影響について検討する。
(5-3)効果のまとめ
本実施の形態では、隣り合うサブ画素領域において、R、B発光層16R、16Bの塗布、および乾燥が完了している時点で、G有機材料インク16GIの塗布を開始する。これにより、特定のGサブ画素領域に隣り合うサブ画素領域の溶媒雰囲気差を抑制できる。
それぞれのGサブ画素領域周辺の溶媒雰囲気差が抑制されると、有機EL表示パネル1における異なる場所に位置するGサブ画素領域間の溶媒雰囲気差の違いの発生も抑制される。その結果、Gサブ画素領域と隣り合うR、Bサブ画素領域の一方のみにインクが存在する場合に比べて、有機EL表示パネル1における異なる場所に位置するGサブ画素領域間の溶媒雰囲気差の違いの発生を抑制することができる。これにより、有機EL表示パネル1における異なる場所に位置するG発光層16G同士を比較した場合に、その断面形状のばらつきが抑制され、輝度ムラを抑制できる。
<実施の形態2>
以下、実施の形態2は、発光層16の形成工程のみが、上記実施の形態1と異なる。よって、上記実施の形態1と基板構成が重複し、インクジェットを使用するため、基板、インクジェット、及び有機材料インクに関する構成の説明は割愛する
1.発光層形成工程の詳細
まず、図12(a)に示すように、インクジェット方式で、Rサブ画素領域にR有機材料インク16RIを塗布する。
2.効果
この工程では、R、B有機材料インク16R、Bのベーク乾燥による強制乾燥を同時に行うことで、実施の形態1に比べ、製造時間をさらに短縮できる。また、R有機材料インクの自然乾燥時間をより長く確保することで、R有機材料インクにより形成されるR発光層の形状ばらつきを抑制することが出来る。
[変形例]
1.発光層形成の工程
上記実施の形態では、B有機材料インクとR有機材料インクの乾燥が完了した後にG有機材料インクの塗布を開始した。G有機材料インクが受ける溶媒雰囲気差の影響をさらに抑制するためには、B有機材料インクとR有機材料インクの塗布が完了した後に、他の有機材料インクの塗布を開始することが望ましい。しかし、この実施の形態に限られず、G有機材料インクの塗布を、B有機材料インクとR有機材料インクとの乾燥が完了する前に開始してもよい。
2.有機材料インクの特性
(粘度)
上記実施の形態では、有機材料インクのうち、最も粘度の低い第1有機発光材料を含むインクが緑であるとして説明を行ったが、これに限らず、最も粘度の低い有機発光材料が青、又は赤であってもよい。
(表面張力)
有機材料インクの表面張力は、好ましくは20mN/m~70mN/mであって、特に好ましくは25mN/m~45mN/mである。この範囲の表面張力にすることにより、インク吐出の際の、有機材料インクの液滴の飛行曲がりを抑制できる。具体的には、有機材料インクの表面張力が20mN/m未満であると、有機材料インクのノズル面上での濡れ性が増大し、有機材料インクを吐出する際、有機材料インクがノズル孔の周囲に非対称に付着することがある。この場合、ノズル孔に付着した有機材料インクと吐出しようとする付着物との相互間に引力が働くため、有機材料インクは不均一な力により吐出されることになり、目標位置に到達できない所謂飛行曲がりが生じる頻度が高くなる。また、有機材料インクの表面張力が70mN/mを超えると、ノズル先端での液滴の形状が安定しないため、有機材料インクの吐出径、及び吐出タイミングの制御が困難になる。
(固形物濃度)
有機材料インクの固形分濃度は、組成物全体に対して0.01wt%~10.0wt%が好ましく、0.1wt%~5、0wt%が更に好ましい。固形分濃度が低すぎると必要な膜厚を得るために吐出回数が多くなってしまい、製造効率が悪くなってしまう。また、固形分濃度が高すぎると粘度が高くなってしまい、吐出性に影響を与える。
(溶媒)
本発明に用いられる発光層、ホール注入層などの発光機能を有する層を構成する有機材料は、有機溶媒に溶解させて有機材料インクの形にして塗布するのが一般的である。有機材料用の溶媒の選択は、有機材料の溶解性や安定性、発光層を形成する場合に重要な有機材料インクの粘度及び表面張力、発光層の均一性を保証するために必要な溶媒の沸点などを考慮して行う。
3.インクジェットヘッド
ピエゾ型インクジェットヘッドは、ピエゾの変形でインクを吐出するため、あまりに高粘度のインクでは吐出性が悪化し、着弾制度が悪くなる。従って、高粘度のインクを用いる場合、ピエゾ型インクジェットヘッドの性能を考慮する必要がある。
4.印刷方法
本発明に適用できる有機材料インクの印刷方法は、インクジェット方式に限らない。例えば、グラビア印刷方式等を用いても、本発明を適用できる。
5.乾燥方法
有機材料インクの乾燥方法は、発光層の断面形状ばらつきの抑制のために重要である。乾燥方法としては、真空乾燥、加熱乾燥、不活性ガス中での乾燥が用いられ、他に、有機材料インクの溶媒である程度満たした雰囲気下で、乾燥させる場合もある。
6.層構成
層構成は、ガラス基板の反対側から取り出すいわゆるトップエミッション型の他に、発光層からの光をガラス基板側から取り出すボトムエミッション型でもよい。ボトムエミッション型の場合は、陽極には実質的に透光性のある陽極を用いることが好ましく、陰極には光を反射する陰極を用いることが好ましい。ここで、陰極及び陽極は、多層構成とする場合が多い。さらに、基板に近い方の電極を陰極とする、いわゆるリバース構造をとることも可能である。リバース構造においてもボトムエミッション型、及びトップエミッション型があり、本発明においては、どちらの構造でも効果が期待できる。
7.発光層及びIL層
ホール注入層の上には、有機半導体材料を塗布して、発光層を形成する。また、発光層と陰極との間には、電子注入層が形成される。この際、発光層とホール注入層との間に、ホールブロッキング層としてIL層を設けると、発光効率の点で好ましい。このホールブロッキング層としては、ポリフルオレン系の高分子材料で発光層に用いる材料よりLUMO(最低空軌道)レベルが高いか、もしくは電子の移動度が小さいTFB等が用いられるが、これに限ったものではない。発光層としては、ポリフルオレン系、ポリフエニレンビニレン系、ペンダント型、デンドリマー型、塗布型の低分子系を含め、溶媒に溶解させ、塗布して薄膜を形成出来るものであれば種類を問わない。
8.隔壁層及びバンク
隔壁層の厚みは、印刷を行う有機材料インクの濃度によって大きくことなるが、100nm以上であることが望ましい。また、上記実施の形態における隔壁層の材料としては電気絶縁性を有する材料であれば任意に用いることができ、耐熱性、溶媒に対する耐性を持つ電気絶縁性樹脂(例えば、ポリイミド樹脂等)であることが好ましい。加えて、さらに好ましいのは、その隔壁を構成する有機材料中に含まれる成分に、有機材料インクに対して撥液する成分を含有することが、インクジェットなどを用いてバンク内に印刷を行った際の、有機材料インクの溢れを防ぐ機能を持たせることが望ましい。隔壁層の形成方法としては、フォトリソグラフィ技術等が用いられており、パターニングにより形成される。例えば、隔壁層材料を塗布した後、ベーク処理、マスク露光処理、現像処理等により所望の形状がホール注入層上に形成される。また、上記実施の形態では、隔壁層の形状が、順テーパー状であったが、インクの溢れを防ぐ点、発光層の形成状態を確認する点で好ましいが、これに限るものではない。
9.ホール注入層
ホール注入層として、有機物であれば上記のポリチオフエン系のPEDT:PSS等の材料をスピンコート法で、あるいは、インクジェット法、ノズルコート法のいずれかで形成する。ホール注入層としては、ポリアニリン系の材料も用いることが出来る。また、無機物のホール注入層も知られており、酸化モリブデン、酸化タングステン、酸化バナジウム、酸化ルテニウム等が用いられる。その他に、ホール注入層としてフラーレン等の炭素化合物を蒸着して用いることができ、真空蒸着法、電子ビーム蒸着法、スパッタリング法によって形成される。
10.陰極
陰極としては、仕事関数の小さい金属もしくは合金が用いられるが、トップエミッション構造では、本実施の形態では、仕事関数の小さい金属を用いた光透過性の高い超薄膜を形成し、その上部にITO,IZOなどの透光性材料からなる導電膜を積層することで、透明陰極を形成すればよい。この仕事関数の小さい金属からなる超薄膜は、Ba-AIの2層構造に限定されることなく、Ca-AIの2層構造、あるいはLi、Ce、Ca、Ba、In、Mg、Ti等の金属やこれらの酸化物、フッ化物に代表されるハロゲン化物、Mg-Ag合金、Mg-In合金等のMg合金や、AI-Li合金、AI-Sr金、AI-Ba合金等のAI合金等が用いられる。あるいはLiO2/AIやLiF/AI等の積層構造の超薄膜と、透光性導電膜との積層構造も陰極材料として好適である。さらに、TiOxや、MoOx,WOx,TiOx,ZnO等の遷移金属酸化物で酸素欠損をもち、導電性をしめすものを、電子の注入層として使用することが出来る。
11.有機EL表示パネルの電気的接続
図16に示すように、上記実施の形態の有機EL表示パネルは、駆動回路31に接続され、駆動回路31は制御回路32により制御される。
12.製品形態
上記実施の形態の有機EL表示パネルは、単独での装置として、そのまま販売経路に流通できる。しかしながら、これに限らず、図17に示すように、デジタルテレビ等の表示装置に組み込まれて流通してもよい。
11 TFT基板
12 隔壁層
13 陽極
14 ホール注入層
15 IL層
16 発光層
16R R発光層
16G G発光層
16B B発光層
16I 有機材料インク
16RI R有機材料インク
16GI G有機材料インク
16BI B有機材料インク
17 電子注入層
18 陰極
19 封止層
20 インクジェットヘッド
31 駆動回路
32 制御回路
Claims (10)
- 第1有機発光材料と溶媒とを含む第1インクを準備する工程と、
前記第1有機発光材料と発光波長が異なる第2有機発光材料と、溶媒とを含む第2インクを準備する工程と、
前記第1及び第2有機発光材料と発光波長が異なる第3有機発光材料と、溶媒とを含む第3インクを準備する工程と、
基板上の第1サブ画素領域に、前記第1インクを塗布する工程と、
前記第1サブ画素領域に隣り合う第2サブ画素領域に、前記第2インクを塗布すると共に、前記第1サブ画素領域を挟んで前記第2サブ画素領域とは反対側で前記第1サブ画素領域に隣り合う第3サブ画素領域に、前記第3インクを塗布する工程と、
を有し、
前記第1インクの粘度は、前記第2及び第3インクの粘度よりも低く、
前記第2及び第3インクの塗布の開始後に、前記第1インクの塗布を開始する
ことを特徴とする有機EL表示パネルの製造方法。 - 前記第2及び第3インクを塗布する工程の後に、前記第2及び第3インクを乾燥する工程を有し、
前記第2及び第3インクを乾燥する工程の開始後に、前記第1インクの塗布を開始する
ことを特徴とする請求項1に記載の有機EL表示パネルの製造方法。 - 前記第2及び第3インクを塗布する工程の後に、前記第2及び第3インクを乾燥する工程を有し、
前記第2及び第3インクを乾燥する工程の完了後に、前記第1インクの塗布を開始する
ことを特徴とする請求項1に記載の有機EL表示パネルの製造方法 - 前記第2及び第3インクの塗布完了後、前記第2及び第3インクを強制乾燥する工程を有し、
前記第1インクの塗布完了後から強制乾燥工程開始までの自然乾燥時間が、前記第2及び第3インクの少なくとも一方の塗布完了後から強制乾燥工程開始までの自然乾燥時間よりも長い
ことを特徴とする請求項1に記載の有機EL表示パネルの製造方法。 - 前記第2及び第3インクの塗布完了後、前記第1インクの塗布を開始し、
前記第1インクの塗布完了後、前記第1、第2、及び第3インクを強制乾燥する
ことを特徴とする請求項2~4のいずれか一項に記載の有機EL表示パネルの製造方法。 - 前記第2及び第3インクの塗布完了後、前記第2及び第3インクを乾燥する工程を有し、
前記第2及び第3インクを乾燥する工程の完了後、前記第1インクの塗布を開始し、
前記第2及び第3インクを強制乾燥する
ことを特徴とする請求項2~4のいずれか一項に記載の有機EL表示パネルの製造方法。 - 前記第1インクを塗布する工程の後に、前記第1インクを自然乾燥により乾燥する工程を有する
ことを特徴とする請求項1~6のいずれか一項に記載の有機EL表示パネルの製造方法。 - 前記第2インクと前記第3インクのうち、寿命の長いインクから塗布を開始する
ことを特徴とする請求項1~7のいずれか一項に記載の有機EL表示パネルの製造方法。 - 前記第2インクと前記第3インクのうち、粘度の低いインクから塗布を開始する
ことを特徴とする請求項1~7のいずれか一項に記載の有機EL表示パネルの製造方法。 - 前記第2インクと前記第3インクのうち粘度の低いインクの塗布完了後から強制乾燥までの自然乾燥時間が、前記第2インクと前記第3インクのうち粘度の高いインクの塗布完了後から強制乾燥までの自然乾燥時間よりも長い
ことを特徴とする請求項9に記載の有機EL表示パネルの製造方法。
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