WO2013084708A1 - ハードディスク装置組み立て用カチオン硬化型樹脂組成物 - Google Patents
ハードディスク装置組み立て用カチオン硬化型樹脂組成物 Download PDFInfo
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- WO2013084708A1 WO2013084708A1 PCT/JP2012/080004 JP2012080004W WO2013084708A1 WO 2013084708 A1 WO2013084708 A1 WO 2013084708A1 JP 2012080004 W JP2012080004 W JP 2012080004W WO 2013084708 A1 WO2013084708 A1 WO 2013084708A1
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- hard disk
- disk device
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/06—Metallic compounds other than hydrides and other than metallo-organic compounds; Boron halide or aluminium halide complexes with organic compounds containing oxygen
- C08F4/20—Metallic compounds other than hydrides and other than metallo-organic compounds; Boron halide or aluminium halide complexes with organic compounds containing oxygen of antimony, bismuth, vanadium, niobium or tantalum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F216/125—Monomers containing two or more unsaturated aliphatic radicals, e.g. trimethylolpropane triallyl ether or pentaerythritol triallyl ether
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F216/14—Monomers containing only one unsaturated aliphatic radical
- C08F216/1416—Monomers containing oxygen in addition to the ether oxygen, e.g. allyl glycidyl ether
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F216/14—Monomers containing only one unsaturated aliphatic radical
- C08F216/16—Monomers containing no hetero atoms other than the ether oxygen
- C08F216/165—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/375—Thiols containing six-membered aromatic rings
Definitions
- the present invention relates to a cationic curable resin composition for assembling a hard disk device, a method for producing a hard disk device using the composition, and a hard disk device assembled using the composition.
- Patent Document 1 discloses an epoxy compound, an epoxy compound partially introduced with a (meth) acryl group, a (meth) acryl compound, an amine-based curing agent, and light.
- An epoxy resin composition containing an initiator is disclosed.
- the epoxy resin composition disclosed in Patent Document 1 reduces an outgas component derived from a photoinitiator by using a component having an epoxy group capable of anion polymerization and a component having a radical polymerizable (meth) acryl group.
- an adhesive method is adopted in which energy rays are irradiated to temporarily fix the components, and main curing is performed by heat curing.
- radical polymerization of acrylate compounds by irradiation with energy rays is not preferable for use around the magnetic head of a hard disk, which is rapidly miniaturized and refined because there are many outgasses derived from unreacted monomers and radical initiators. .
- the present invention is a cationic curing type resin composition for assembling a hard disk device, which has good adhesion by energy irradiation and heating, and can reduce outgas generated during energy beam irradiation, a method for producing a hard disk device using the composition, and It is an object of the present invention to provide a hard disk device assembled using the composition.
- the present invention (1) A cationic curable resin composition for assembling a hard disk device, comprising a resin having a cationic polymerizable functional group (component A) and a cationic polymerization initiator (component B),
- component B is represented by the following formula: X + (SbF 6 ) ⁇ (B1) X + (B (C 6 F 5 ) 4 ) ⁇ (B2), and X + ((Rf) n PF 6 ⁇ n ) ⁇ (B3) (Wherein X + is iodonium or sulfonium, Rf is fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6).
- a method of manufacturing a hard disk device including a step of bonding a peripheral portion of a magnetic head in the hard disk device using the cationic curable resin composition for assembling the hard disk device according to (1), and (3) It relates to a hard disk device assembled using the cationic curable resin composition for assembling the hard disk device described in 1).
- the adhesiveness by energy irradiation and a heating is favorable, the outgas generated at the time of energy ray irradiation can be reduced, the cation hardening-type resin composition for hard disk apparatus assembly, The manufacturing method of the hard disk apparatus using the composition , And a hard disk device assembled using the composition.
- the cationic curable resin composition for assembling a hard disk device of the present invention contains a resin having a cationic polymerizable functional group (component A) and a cationic polymerization initiator (component B).
- the resin having a cationically polymerizable functional group is preferably a resin having an epoxy group, a resin having an oxetanyl group, and a resin having an oxetanyl group, from the viewpoint of reducing reactivity by improving the reactivity and eliminating oxygen inhibition. It is at least one selected from the group consisting of resins having a vinyl ether group, more preferably a resin having an epoxy group and / or a resin having an oxetanyl group, and still more preferably a resin having an epoxy group. Particularly preferred is a mixture of a resin having an epoxy group with an epoxy equivalent of 150 or more and a resin having an oxetanyl group or a resin having an epoxy group with an epoxy equivalent of less than 150.
- the resin having an epoxy group needs to maintain the fixing accuracy of the hard disk assembly component, and since heat resistance is required, the glass transition temperature needs to be high, and from the viewpoint that the adhesion to the assembly member is necessary, preferably Bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, alicyclic epoxy resin and At least one resin selected from the group consisting of polybutadiene epoxy resins, more preferably bisphenol A type epoxy resins, hydrogenated bisphenol A type epoxy resins, bisphenol F type epoxy resins, cresol novolac type epoxies.
- At least one resin selected from the group consisting of cis-resins and alicyclic epoxy resins more preferably bisphenol A type epoxy resins, bisphenol F type epoxy resins, cresol novolac type epoxy resins and / or alicyclic type epoxies.
- Resin Particularly preferably, at least selected from the group consisting of a bisphenol A type epoxy resin, a hydrogenated bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a cresol novolac type epoxy resin, and an alicyclic epoxy resin having an epoxy equivalent of 150 or more.
- One type of resin and particularly preferably an epoxy equivalent of 150 or more, bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, cresol novolac type epoxy resin and alicyclic type epoxy It is a mixture of at least one resin selected from the group consisting of resins and an alicyclic epoxy resin having an epoxy equivalent of less than 150.
- bisphenol A type epoxy resin examples include EPICLON 850, 850-S, 860, and 1055 manufactured by DIC.
- hydrogenated bisphenol A type epoxy resin examples include KRM-2408 manufactured by ADEKA and YX-8034 manufactured by JER.
- bisphenol F type epoxy resin examples include EPICLON 830-S and EXA-830 LVP manufactured by DIC.
- naphthalene type epoxy resins include EPICLON HP-4032D and HP-7200H manufactured by DIC.
- phenol novolac type epoxy resin examples include EPICLON N-740 and N-770 manufactured by DIC.
- cresol novolac type epoxy resin examples include EPICLON N-660, N-670 and N-655-EXP-S manufactured by DIC.
- alicyclic epoxy resins having an epoxy equivalent of 150 or more include 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol (EHPE3150 manufactured by Daicel Corporation).
- the resin having an oxetanyl group is preferably 3-ethyl-3-hydroxymethyloxetane (oxetane alcohol) (for example, OXT-101 manufactured by Toagosei Co., Ltd.), 2-ethylhexyloxetane (for example, OXT-212 manufactured by Toagosei Co., Ltd.) Xylylenebisoxetane (XDO: for example, OXT-121 manufactured by Toagosei Co., Ltd.), 3-ethyl-3 ⁇ [((3-ethyloxetane-3-yl) methoxy] methyl ⁇ oxetane (eg, OXT- manufactured by Toagosei Co., Ltd.) 221), oxetanylsilsesquioxetane (eg, OXT-191 manufactured by Toa Gosei Co., Ltd.), phenol novolac oxetane (
- the resin having a vinyl ether group is preferably hydroxybutyl vinyl ether (for example, HBVE manufactured by ISP), vinyl ether of 1,4-cyclohexanedimethanol (for example, CHVE manufactured by ISP), or triethylene glycol divinyl ether (for example, ISP).
- HBVE hydroxybutyl vinyl ether
- CHVE vinyl ether of 1,4-cyclohexanedimethanol
- ISP triethylene glycol divinyl ether
- Component B has the following formula: X + (SbF 6 ) ⁇ (B1), X + (B (C 6 F 5 ) 4 ) ⁇ (B2), and X + ((Rf) n PF 6 ⁇ n ) ⁇ (B3) (Wherein X + is iodonium or sulfonium, Rf is fluorinated alkyl having 1 to 6 carbon atoms, and n is an integer of 1 to 6), and is at least one compound selected from the group consisting of .
- Diphenyl 4-thiophenoxyphenylsulfonium hexafluoroantimonate for example, CPI-101A manufactured by San Apro Co., Ltd., SP-170, SP-172 manufactured by Adeka Co., Ltd., WPI-016 manufactured by Wako Pure Chemical Industries, Ltd., Sanshin Chemical Co., Ltd.
- SI-series compound B2 have the following formula (2):
- 4-methylphenyl-4- (1-methylethyl) phenyliodonium tetrakis (pentafluorophenyl) borate for example, PI-2074 manufactured by Rhodia
- diphenyl 4-thiophenoxyphenylsulfonium tris for example, CPI-210S, CPI-200K manufactured by San Apro Co., Ltd.
- Component C From the viewpoint of reducing the curing stress due to curing shrinkage, it is preferable to add a filler (component C) to the cationic curable resin composition for assembling the hard disk device of the present invention.
- Component C includes an inorganic filler and an organic filler, and an organic filler is preferable from the viewpoint of suppressing the influence on the disk and the magnetic head due to dropping from the resin.
- the inorganic filler include talc, silica, mica and the like.
- the organic filler include polyacrylate particles, coalescent polyacrylate particles, polystyrene particles, acrylic-styrene copolymer particles, polypropylene particles, and polyethylene particles.
- the average particle size of the particles constituting the filler is 0.5 to 150 ⁇ m from the viewpoint of requiring insulation when bonding the hard disk device assembly parts and further reducing outgassing by blending non-reactive components. More preferably, it is 1 to 100 ⁇ m, and further preferably 5 to 50 ⁇ m.
- the average particle size of component C is measured with a laser diffraction / scattering particle size distribution analyzer (for example, Partica LA-950V2 manufactured by HORIBA).
- the cationic curable resin composition for assembling a hard disk device of the present invention can contain additives such as a silane coupling agent and a photosensitizer within the scope of the effects of the present invention.
- the silane coupling agent is preferably tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, tetrabutoxysilane, Tetraalkoxysilanes such as dimethoxydiethoxysilane, dimethoxydiisopropoxysilane, diethoxydiisopropoxysilane, diethoxydibutoxysilane; methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, ethyltriethoxysilane , Ethyltributoxysilane, cyclohexyltriethoxysilane, phenyltriisopropoxysilane, vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane,
- photosensitizer examples include carbonyl compounds, organic sulfur compounds, persulfides, redox compounds, azo and diazo compounds, halogen compounds, and photoreductive dyes from the viewpoint of curability.
- photosensitizers include benzoin derivatives such as benzoin methyl ether, benzoin isopropyl ether, ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone; benzophenone, 2,4-dichlorobenzophenone, methyl o-benzoylbenzoate.
- Benzophenone derivatives such as 4,4′-bis (diethylamino) benzophenone; thioxanthone derivatives such as 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone; 2-chloroanthraquinone, 2-methylanthraquinone, etc.
- Anthraquinone derivatives; acridone derivatives such as N-methylacridone and N-butylacridone; other ⁇ , ⁇ -diethoxyacetophenone, benzyl, fluorenone, xanthone, uranyl compounds Etc.
- These photosensitizers may be used alone or in combination of two or more.
- a preferred photosensitizer is 2,4-diethylthioxanthone (for example, DETX-S manufactured by Nippon Kayaku).
- the total content of components A and B is the cation curable resin composition of the present invention.
- the content is preferably 30.0 to 100% by weight, more preferably 40.0 to 90.0% by weight, still more preferably 50.0 to 80.0% by weight.
- the weight ratio A / B of component A and component B is preferably 99.9 / 0.1 to 90.0 / 10.0, more preferably 99.5 / 0.5 to 93.0 / 7.0. More preferably, it is 99.0 / 1.0 to 97.0 / 3.0.
- the content of Component C is preferably 5. with respect to 100 parts by weight of Component A from the viewpoint of stably mixing with the resin and suppressing curing shrinkage. It is 0 to 90.0 parts by weight, more preferably 10.0 to 85.0 parts by weight, still more preferably 20.0 to 80.0 parts by weight.
- a photosensitizer is included, from the viewpoint of improving curability, it is preferably 0.3 to 30.0 parts by weight, more preferably 1.0 to 25.0 parts by weight, with respect to 100 parts by weight of Component B.
- the amount is more preferably 5.0 to 25.0 parts by weight, still more preferably 10.0 to 20.0 parts by weight.
- Method of manufacturing hard disk drive In a method of manufacturing a hard disk device having a step of bonding a magnetic head peripheral portion in a hard disk device, the magnetic head peripheral portion is bonded using the cationic curable resin composition of the present invention, for example, fixing of a piezo element If the magnetic head is fixed, the magnetic head and the suspension are fixed (head, gimbal, assembly (HGA)), etc., the outgas component does not adhere to the disk surface or the magnetic head, and there is no error in reading and writing. High hard disk drive can be manufactured.
- compositions of Examples 1-8 and Comparative Examples 1 and 2 were prepared using the following raw materials: (1) Polymerizable resin [resin having a cationic polymerizable functional group (component A)] Bisphenol A type epoxy resin (DICIC, EPICLON 850); -Bisphenol F type epoxy resin (manufactured by DIC, EPICLON EXA-830LVP); A cresol novolac type epoxy resin (manufactured by DIC, EPICLON N-655-EXP-S); -Polyfunctional epoxy (3 ', 4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate) (Dacel, Celoxide 2021P); -Monofunctional oxetane (3-ethyl-3-phenoxymethyloxetane) (POX: manufactured by Toagosei Co., Ltd., OXT-211); Xylylene bisoxetane (1,4-bis [
- polymerizable resin and polymerization initiator (total 154 g, in Comparative Example 2, total 104 g) were added to the mixing tank (NO.300 (manufactured by Kinki Container), capacity 300 ml, polyethylene).
- the mixture was stirred with a stirrer (RW28 (manufactured by IKA), 600 rpm) under a room temperature environment until it became transparent, and the cationic curable resin compositions of Examples 1 to 8 of the present invention and Comparative Examples 1 and 2 A composition was prepared.
- the room temperature of the Example was 23 degreeC.
- a mold with a thickness of 1 mm and a diameter of 4.5 mm was made on silicon.
- the resin compositions of Examples 1 to 8 and Comparative Examples 1 and 2 were poured therein, sandwiched between PET films, irradiated with 6000 mJ / cm 2 (365 nm) using a metal halide lamp manufactured by Eye Graphics, and a test piece. Was made.
- the heat loss rate was calculated
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- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Polyethers (AREA)
- Polymerization Catalysts (AREA)
Abstract
Description
(1)カチオン重合性官能基を有する樹脂(成分A)及びカチオン重合開始剤(成分B)を含有するハードディスク装置組み立て用カチオン硬化型樹脂組成物であって、
前記成分Bが、下記式:
X+(SbF6)- (B1)
X+(B(C6F5)4)- (B2)、及び
X+((Rf)nPF6-n)- (B3)
(式中、X+はヨードニウム又はスルホニウムであり、Rfは炭素数1~6のフッ素化アルキルであり、nは1~6の整数である)からなる群から選ばれる少なくとも1種である組成物、
(2)前記(1)記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物を使用してハードディスク装置中の磁気ヘッド周辺部位を接着する工程を含む、ハードディスク装置の製造方法、及び
(3)前記(1)記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物を使用して組み立てたハードディスク装置に関する。
カチオン重合性官能基を有する樹脂は、反応性の向上、酸素阻害をなくすことにより、未反応成分を抑えてアウトガスを低くする観点から、好ましくは、エポキシ基を有する樹脂、オキセタニル基を有する樹脂及びビニルエーテル基を有する樹脂からなる群より選ばれる少なくとも1種であり、より好ましくはエポキシ基を有する樹脂及び/又はオキセタニル基を有する樹脂であり、更に好ましくはエポキシ基を有する樹脂である。特に好ましくは、エポキシ当量が150以上であるエポキシ基を有する樹脂と、オキセタニル基を有する樹脂又はエポキシ当量が150未満であるエポキシ基を有する樹脂との混合物である。
水添ビスフェノールA型エポキシ樹脂の具体的な例には、ADEKA社製KRM-2408、JER社製のYX-8034などがある。
ビスフェノールF型エポキシ樹脂の具体的な例には、DIC社製EPICLON830-S、EXA-830LVPなどがある。
ナフタレン型エポキシ樹脂の具体的な例には、DIC社製EPICLONのHP-4032D、HP-7200Hなどがある。
フェノールノボラック型エポキシ樹脂の具体的な例には、DIC社製EPICLON N-740,N-770などがある。
クレゾールノボラック型エポキシ樹脂の具体的な例には、DIC社製のEPICLON N-660,N-670、N-655-EXP-Sなどがある。
脂環型エポキシ樹脂、特にエポキシ当量が150未満である脂環型エポキシ樹脂の具体的な例には、3’,4’-エポキシシクロヘキシルメチル 3,4-エポキシシクロヘキサンカルボキシレート(ダイセル社製セロキサイド2021P)、1,2:8,9-ジエポキシリモネン(ダイセル社製セロキサイド3000)、1,2-エポキシ-4-ビニルシクロヘキサン(ダイセル社製セロキサイド2000)などがある。エポキシ当量が150以上である脂環型エポキシ樹脂の具体的な例には、2,2-ビス(ヒドロキシメチル)-1-ブタノールの1,2-エポキシ-4-(2-オキシラニル)シクロヘキサン付加物(ダイセル社製EHPE3150)などがある。
成分Bは、下記式:
X+(SbF6)- (B1)、
X+(B(C6F5)4)- (B2)、及び
X+((Rf)nPF6-n)- (B3)
(式中、X+はヨードニウム又はスルホニウムであり、Rfは炭素数1~6のフッ素化アルキルであり、nは1~6の整数である)からなる群から選ばれる少なくとも1種の化合物である。
本発明のハードディスク装置組み立て用カチオン硬化型樹脂組成物には、硬化収縮による硬化応力を低減する観点から、フィラー(成分C)を添加することが好ましい。成分Cとして、無機フィラーと有機フィラーがあるが、樹脂からの脱落によるディスクや磁気ヘッドへの影響を抑制する観点から有機フィラーが好ましい。無機フィラーとしては、タルク、シリカ、マイカなどが挙げられる。有機フィラーとしては、ポリアクリレート粒子、コアシャル型のポリアクリレート粒子、ポリスチレン粒子、アクリル-スチレン共重合粒子、ポリプロピレン粒子、ポリエチレン粒子などが挙げられる。
本発明のハードディスク装置組み立て用カチオン硬化型樹脂組成物は、本発明の効果を奏する範囲内で、シランカップリング剤、光増感剤等の添加剤を含むことができる。
本発明のハードディスク装置組み立て用カチオン硬化型樹脂組成物の硬化強度を安定に確保し、かつアウトガスを低減する観点から、成分A及びBの合計の含有量は、本発明のカチオン硬化型樹脂組成物中、好ましくは30.0~100重量%、より好ましくは40.0~90.0重量%、更に好ましくは50.0~80.0重量%である。成分Aと成分Bの重量配合比A/Bは、好ましくは99.9/0.1~90.0/10.0、より好ましくは99.5/0.5~93.0/7.0、更に好ましくは99.0/1.0~97.0/3.0である。本発明のカチオン硬化型樹脂組成物が成分Cを含む場合は、成分Cの含有量は、樹脂に安定に混合され硬化収縮を抑制する観点から、成分A100重量部に対して、好ましくは5.0~90.0重量部、より好ましくは10.0~85.0重量部、更に好ましくは20.0~80.0重量部である。
光増感剤を含める場合は、硬化性を向上する観点から、成分B100重量部に対して、 好ましくは0.3~30.0重量部、より好ましくは1.0~25.0重量部、更に好ましくは5.0~25.0重量部、更に好ましくは10.0~20.0重量部である。
ハードディスク装置中の磁気ヘッド周辺部位を接着する工程を有するハードディスク装置の製造方法において、本発明のカチオン硬化型樹脂組成物を使用して磁気ヘッド周辺部位の接着をして、例えば、ピエゾ素子の固定、磁気ヘッドの固定、磁気ヘッドとサスペンションの固定(ヘッド・ジンバル・アセンブル(HGA))等を行うと、アウトガス成分がディスク表面や磁気ヘッドに付着して読み書きにエラーが生じることがなく、品質の高いハードディスク装置を製造できる。
(1)重合性樹脂
〔カチオン重合性官能基を有する樹脂(成分A)〕
- ビスフェノールA型エポキシ樹脂(DIC社製、EPICLON 850);
- ビスフェノールF型エポキシ樹脂(DIC社製、EPICLON EXA-830LVP);
- クレゾールノボラック型エポキシ樹脂(DIC社製、EPICLON N-655-EXP-S);
- 多官能エポキシ(3’,4’-エポキシシクロヘキシルメチル 3,4-エポキシシクロヘキサンカルボキシレート)(ダイセル社製、セロキサイド2021P);
- 単官能オキセタン(3-エチル-3-フェノキシメチルオキセタン)(POX:東亞合成社製、OXT-211);
- キシリレンビスオキセタン(1,4-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]ベンゼン(主成分))(XDO:東亞合成社製、OXT-121)。
〔ラジカル重合性官能基を有する樹脂〕
- ビスフェノールA型アクリル樹脂(日本化薬製、KAYAHARD R-280)(20%2-ヒドロキシプロピルメタクリレート希釈品)。
〔カチオン重合開始剤(成分B)〕
- ジフェニル4-チオフェノキシフェニルスルホニウムヘキサフルオロアンチモネート(サンアプロ株式会社製、CPI-101A(実施例1)又はアデカ社製、SP-172(実施例6))(化合物B1:上記式(1));
- 4-メチルフェニル-4-(1-メチルエチル)フェニルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート(ローディア社製、PI-2074)(化合物B2:上記式(2));
- ジフェニル4-チオフェノキシフェニルスルホニウムトリス(ペンタフルオロエチル)トリフルオロホスフェート(サンアプロ株式会社製、CPI-210S)(化合物B3:上記式(3))。
〔カチオン重合開始剤(成分B以外)〕
- ジフェニル4-チオフェノキシフェニルスルホニウムヘキサフルオロホスフェート(サンアプロ株式会社製、CPI-100P)(下記式(4)):
〔ラジカル重合開始剤〕
(1-ヒドロキシシクロヘキシル)フェニルケトン(BASF製、イルガキュア184)。
実施例1~8並びに比較例1及び2の各組成物の硬化中のアウトガスの発生を以下のようにして評価した。
減量率=((W1-W0)/W0)×100
以上の結果を表1、2にまとめた。
Claims (8)
- カチオン重合性官能基を有する樹脂(成分A)及びカチオン重合開始剤(成分B)を含有するハードディスク装置組み立て用カチオン硬化型樹脂組成物であって、
前記成分Bが、下記式
X+(SbF6)- (B1)
X+(B(C6F5)4)- (B2)、及び
X+((Rf)nPF6-n)- (B3)
(式中、X+はヨードニウム又はスルホニウムであり、Rfは炭素数1~6のフッ素化アルキルであり、nは1~6の整数である)からなる群から選ばれる少なくとも1種である組成物。 - 前記成分Aが、エポキシ基を有する樹脂、オキセタニル基を有する樹脂及びビニルエーテル基を有する樹脂からなる群より選ばれる少なくとも1種である、請求項1記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物。
- 前記エポキシ基を有する樹脂が、エポキシ当量が150以上であるエポキシ基を有する樹脂である、請求項1又は2記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物。
- 前記成分Aが、エポキシ当量が150以上であるエポキシ基を有する樹脂と、オキセタニル基を有する樹脂との混合物である、請求項1~3のいずれか記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物。
- 前記成分Aが、エポキシ当量が150以上であるエポキシ基を有する樹脂と、エポキシ当量が150未満であるエポキシ基を有する樹脂との混合物である、請求項1~3のいずれか記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物。
- 硬化物の加熱減量率が1質量%未満である、請求項1~5のいずれか記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物。
- 請求項1~6のいずれか1項記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物を使用してハードディスク装置中の磁気ヘッド周辺部位を接着する工程を含む、ハードディスク装置の製造方法。
- 請求項1~6のいずれか1項記載のハードディスク装置組み立て用カチオン硬化型樹脂組成物を使用して組み立てた、ハードディスク装置。
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