WO2013080317A1 - 半導体装置、及び車載用電力変換装置 - Google Patents
半導体装置、及び車載用電力変換装置 Download PDFInfo
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- WO2013080317A1 WO2013080317A1 PCT/JP2011/077620 JP2011077620W WO2013080317A1 WO 2013080317 A1 WO2013080317 A1 WO 2013080317A1 JP 2011077620 W JP2011077620 W JP 2011077620W WO 2013080317 A1 WO2013080317 A1 WO 2013080317A1
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- semiconductor device
- heat
- pressing
- pressing member
- generating element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a semiconductor device, a charger that is mounted on a plug-in hybrid vehicle, an electric vehicle, or the like in which the semiconductor device is incorporated, converts an AC input power source into a direct current, and charges the high voltage battery. It is related with vehicle-mounted power converters, such as a DCDC converter which converts the voltage of this to a 12V system voltage, and charges an auxiliary battery.
- vehicle-mounted power converters such as a DCDC converter which converts the voltage of this to a 12V system voltage, and charges an auxiliary battery.
- a heat generating element particularly a power element that controls switching of a large current has a large amount of heat generation, and is thus disposed and fixed on a heat dissipation member. Thereby, the heat of the heating element is transmitted to the cooling medium via the heat radiating member, and the heating element is cooled.
- an in-vehicle power conversion device such as the charger or the DCDC converter
- high performance is required for cooling the device from the mounting environment and the operating environment in the vehicle.
- Patent Documents 1 to 4 describe structures for attaching the heat generating member to the heat radiating member.
- Patent Documents 1 to 3 describe a structure in which an electric device is pressed onto a heat radiating member by the elastic force of the pressing member.
- Patent Document 4 describes the structure of a surrounding stop plate for the heat generating element when the heat generating element is fastened to the heat radiating member.
- Plug-in hybrid vehicles are equipped with an engine, and the vehicle layout of the in-vehicle power conversion device is difficult, and the electric vehicle is a small vehicle, so there is a strong demand for downsizing the in-vehicle power conversion device. .
- it is necessary to further improve the cooling performance of the device due to an increase in heat capacity accompanying the reduction in size.
- the heating element is directly attached to the heat radiating member by a fastening member as in the prior art, a difference in the pressing force of the fastening member occurs due to dimensional variation of the heating element, and stable heat dissipation (low thermal resistance) is achieved. Can't get.
- An object of the present invention is to provide a semiconductor device that can improve the heat dissipation of a heat generating element and reduce the mounting area of a mounting board. It is another object of the present invention to provide an in-vehicle power conversion device that can suppress heat interference with other components and can downsize the entire device.
- a semiconductor device includes a mounting substrate, a heating element connected via a terminal extending in a direction perpendicular to the mounting substrate, and an element in direct or indirect surface contact with the mounting surface of the heating element
- a heat-dissipating member having a contact portion; a pressing means that contacts the heat-generating element and presses the heat-generating element against the heat-dissipating member; and the pressing means is passed through a through-hole formed parallel to the mounting surface in the pressing means.
- a fastening means for fixing to the heat dissipating member, The pressing means is formed with an inclined surface in which a component of the axial force of the tightening force of the tightening means is generated in a direction perpendicular to the mounting surface.
- the on-vehicle power conversion device includes a semiconductor device and a cooler that seals a refrigerant and cools a large current component, and the semiconductor device includes an element contact portion of a heat dissipation member. It is buried in.
- the heat generating elements are connected via the terminals extending in the vertical direction with respect to the mounting substrate, and the mounting area of the mounting substrate can be reduced.
- the pressing means that contacts the heat generating element and presses the heat generating element against the heat radiating member is formed with an inclined surface in which a component of the axial force of the tightening force of the tightening means is generated in a direction perpendicular to the mounting surface. Therefore, the pressing force of the pressing means against the heat generating element is increased by the tightening force of the tightening means, the contact thermal resistance between the heat generating element and the heat radiating member is reduced, and the heat dissipation of the heat generating element is improved.
- the semiconductor device is embedded in the cooler having the element contact portion of the heat radiating member, so that heat interference with other components can be suppressed, and the entire device is downsized. Is done.
- FIG. 3 is an enlarged view of a Z part in FIG. 2. It is sectional drawing which shows the principal part of the semiconductor device of Embodiment 2 of this invention. It is sectional drawing which shows the principal part of the semiconductor device of Embodiment 3 of this invention. It is arrow sectional drawing along the VI-VI line of FIG. It is arrow sectional drawing along the VII-VII line of FIG. It is sectional drawing which shows the principal part of the semiconductor device of Embodiment 4 of this invention. It is sectional drawing which shows the principal part of the semiconductor device of Embodiment 5 of this invention. (A) is principal part sectional drawing which shows an example of the conventional semiconductor device, (b) is a top view of (a), (c) is arrow sectional drawing along cc of (a).
- FIG. FIG. 1 is a schematic sectional view showing an in-vehicle power converter according to the present invention
- FIG. 2 is a sectional view showing the semiconductor device of FIG.
- the cooler 8 having the heat radiating member 2 and the case 13 is covered with a cover 14.
- a coil 11 and a capacitor 12, which are large current components, are disposed.
- the semiconductor device according to the first embodiment of the present invention is embedded in the recess 2c of the heat radiating member 2.
- a plurality of electronic components 10 mounted on the mounting substrate 5 are disposed above the cooler 8.
- the semiconductor device includes a heating element 1 connected via a terminal 1a extending in a direction perpendicular to the mounting substrate 5, and an element contact portion 2a that is in surface contact with the mounting surface 1e of the heating element 1 via a heat dissipation sheet 7.
- the heat radiating member 2 having contact with the heat generating element 1 and pressing means 20 for pressing the heat generating element 1 against the heat radiating member 2, and the pressing means 20 through the through hole 3c formed in parallel to the mounting surface 1e.
- a fixing screw 6 which is a tightening means for fixing to the heat radiating member 2.
- the pressing means 20 is formed with an inclined surface in which a component of the axial force of the fastening force of the fixing screw 6 is generated in a direction perpendicular to the mounting surface 1 e of the heating element 1.
- the heating element 1 covers the bare chip with a resin-molded package 1b.
- a mounting hole 1c is formed in the package 1b.
- the mounting board 5 is fixed with a plurality of fixing screws 15 (for example, four corners of the heat radiating member 2) on the mounting board 5.
- a recess 2 c is formed in the middle part of the heat radiating member 2.
- the pair of heat generating elements 1 are opposed to the element contact part 2 a, which is the side surface, via the heat dissipation sheet 7.
- the heat radiating sheet 7 is formed of a silicon material or the like, and is responsible for heat transfer between the heat generating member 1 and the heat radiating member 2 and current insulation.
- the pressing means 20 embedded in the recess 2c includes a first pressing member 3 and a second pressing member 4 made of an aluminum material or the like.
- a through hole 3 c is formed in the first pressing member 3, and the first pressing member 3 is fixed to the heat radiating member 2 with a fixing screw 6 passing through the through hole 3 c.
- the 1st press member 3 has the inclined surface 3a which the both sides
- the second pressing member is provided on each side of the first pressing member 3 and has inclined surfaces 4a in surface contact with the inclined surfaces 3a.
- protrusion 4b is formed in the surface on the opposite side to the inclined surface 4a.
- the protrusion 4 b is fitted in the mounting hole 1 c of the heat generating element 1.
- the space 2 of the recess 2c is filled with grease 2b.
- the grease 2b may be omitted.
- the heat radiating member 2 seals a part of the case 13 through the O-ring 16.
- the sealed case 13 is filled with, for example, water as a refrigerant. This water circulates between the heat radiating member 2 and a cooling means (not shown) provided outside, and is cooled by the cooling means.
- the refrigerant may be air.
- the heat generating element 1 is disposed so as to extend in the direction perpendicular to the mounting substrate surface 5a, so that the component mounting area of the mounting substrate 5 can be reduced.
- the through-hole 3c formed in the 1st press member 3 is provided in parallel with the element contact part 2a of the thermal radiation member 2, and the 1st press member 3 and the 2nd press member 4 are inclined. Surface contact is made through the surfaces 3a and 4a. As shown in FIG. 3, the inclined surfaces 3a and 4a are inclined so that the component force Fh of the axial force Fv of the fixing screw 6 is directed in the vertical direction with respect to the element contact portion 2a.
- the heat generating element 1 is strongly pressed against the element contact portion 2a by the component force Fh of the axial force generated by tightening the fixing screw 6, the contact thermal resistance between the heat generating element 1 and the heat radiating member 2 is reduced. As a result, the heat dissipation of the heating element 1 is improved. Thereby, the interference of the heat to other components can be suppressed and the whole vehicle-mounted power converter device can be reduced in size.
- the diameter of the fixing screw 6 used for fixing the heating element 1 can be changed to a large diameter such as an M4 screw instead of the M3 screw.
- a large diameter such as an M4 screw instead of the M3 screw.
- the inclined surfaces 3 a and 4 a of the first pressing member 3 and the second pressing member 4 are changed with respect to the axis of the fixing screw 6, so that the heating element 1
- the pressing force to the heat radiating member 2 can be arbitrarily set. Therefore, since the angle can be adjusted so as to obtain an optimum pressing force according to the strength of the heat generating element 1 to be pressed, the degree of design freedom is improved.
- the protrusion 4 b of the second pressing member 4 is fitted into the mounting hole 1 c of the heat generating element 1 and presses the heat generating element 1 against the element contact portion 2 a of the heat radiating member 2 through the heat radiating sheet 7. . Accordingly, the second pressing member 4 holds and positions the heat generating element 1 and forms a mounting hole 1c at a location where the load resistance of the heat generating element 1 is high, and a projection 4b is formed in accordance with the mounting hole 1c. By forming, deformation and breakage due to the load of the package 1b of the heating element 1 can be prevented. In the case of the package 1b without the mounting hole 1c, the protrusion 4b may be pressed against the portion of the package 1b having a high load resistance.
- the terminal 1a of the heat generating element 1 extends in a direction perpendicular to the mounting substrate 5, so that not only the bending of the terminal is unnecessary, but also the fixing screw 6 and the heat generating element 6 of the first embodiment are connected.
- the distance is larger than that of the conventional electronic component mounting structure shown in FIG. 10 and has the following advantages. That is, in FIG. 10, the flat surface of the heat generating element 1 and the heat radiating member 2 are in surface contact, and the heat generating element 1 attaches the heat radiating member 2 with the full axial force of the fixing screw 6 passing through the mounting hole 1 c of the heat generating element 1.
- the fixing screw 6 passes through the conductor portion 1d of the heating element 1, whereas in this embodiment, the fixing screw 6 is between the fixing screw 6 and the conductor portion 1d of the heating element 1.
- One pressing member 3 and a second pressing member 4 are interposed. For this reason, the risk that the heating element 1 is short-circuited by chips generated when the fixing screw 6 is screwed into the heat radiating member 2 is reduced.
- the two heat generating elements 1 can be pressed and fixed to the heat radiating member 2 with one fixing screw 6, the number of fixing screws 6 required for fixing the heat generating element 1 can be reduced by half and fixed. Since the fastening direction of the screw 6 is the same as the fastening direction of the mounting substrate 5 and other components, the assembly workability is improved.
- FIG. 4 is a sectional view showing a semiconductor device according to a second embodiment of the present invention.
- the first pressing member 3 has a curved surface shape in which the inclined surface 3a protrudes toward the second pressing member 4 side.
- Other configurations are the same as those of the semiconductor device of the first embodiment.
- parallelism of the 1st press member 3 and the 2nd press member 4 is made by making the inclined surface 3a of the 1st press member 3 into the curved surface shape which protruded in the 2nd press member 4 side.
- the heat sink 1 is absorbed by the curved inclined surface 4a, and the heat generating element 1, the heat radiating sheet 7, and the heat radiating member 2 are securely pressed without any gap.
- the thermal resistance between the heating element 1 and the heat radiating member 2 is kept low, and stable and efficient heat radiating performance is obtained.
- the same effect can be obtained even if the inclined surface 4a of the second pressing member 4 has a curved surface shape protruding toward the first pressing member 3 side.
- FIG. 5 is a cross-sectional view showing the main part of the semiconductor device according to the third embodiment of the present invention
- FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5
- FIG. 7 is taken along line VII-VII in FIG. FIG.
- the heat radiating member 2 is provided with a trapezoidal support part 2d in parallel with the element contact part 2a at the center.
- the first pressing member 3 is a curved surface in which the cross-sectional shape opposite to the heat generating element 1 is a wedge shape, and the cross-sectional shape on the heat generating element 1 side protrudes toward the heat generating element 1.
- a portion on the wedge-shaped side of the first pressing member 3 is in surface contact with the support portion 2 d of the heat radiating member 2.
- the curved portion of the first pressing member 3 is in contact with the second pressing member 4.
- the through hole 3c of the first pressing member 3 is a long hole whose inner diameter dimension in the vertical direction with respect to the element contact portion 2a is larger than the inner diameter dimension in the direction perpendicular to the vertical direction.
- the long hole has a rectangular shape in FIG. 7, but may have an elliptical shape.
- the two heat generating elements 1 are pressed against the heat radiating member 2 by the first pressing member 3 respectively, whereas in this embodiment, the first pressing member 3
- the difference is that one heating element 1 is pressed against the heat radiating member 2.
- Other configurations are the same as those of the semiconductor device of the first embodiment.
- the first pressing member 3 moves to the heat generating element 1 side and presses the heat generating element 1 against the heat radiating member 2 in accordance with the tightening amount of the fixing screw 6 to the heat radiating member 2.
- the same effects as those of the semiconductor devices of the first and second embodiments can be obtained.
- abutted to the 2nd press member 4 is a curved surface, the parallel of the 1st press member 3 and the 2nd press member 4 is similar to Embodiment 2.
- FIG. FIG. 8 is a cross-sectional view showing a main part of the semiconductor device according to the fourth embodiment of the present invention.
- the cross-sectional shape of the first pressing member 3 opposite to the heat generating element 1 is a wedge shape
- the cross-sectional shape of the first pressing member 3 on the heat generating element 1 side is a rectangular shape.
- a portion on the wedge-shaped side of the first pressing member 3 is in surface contact with the support portion 2 d of the heat radiating member 2.
- a portion on the rectangular side of the first pressing member 3 is in surface contact with the second pressing member 4.
- a protrusion 4b having a curved base is formed on the side of the heat generating element 1 of the second pressing member 4.
- the tip of the protrusion 4b is loosely inserted into the mounting hole 1c of the heating element 1.
- the through hole 3c of the first pressing member 3 has an inner diameter dimension perpendicular to the element contact portion 2a and an inner diameter dimension perpendicular to the vertical direction, as in the semiconductor device of the third embodiment. Is a larger slot.
- This embodiment is different in that one heating element 1 is pressed against the heat radiating member 2 by the first pressing member 3.
- Other configurations are the same as those of the semiconductor device of the first embodiment.
- the first pressing member 3 moves to the heat generating element 1 side and presses the heat generating element 1 against the heat radiating member 2 in accordance with the tightening amount of the fixing screw 6 to the heat radiating member 2.
- the second pressing member 4 has a curved base 4b with a curved base 4b inserted into the mounting hole 1c of the heating element 1, and the first pressing member 3 and the second pressing member 4 are the same as in the second embodiment. Even when the parallelism of the pressing member 4 varies, the variation is absorbed by the curved base of the protrusion 4b, and the heat generating element 1, the heat radiating sheet 7, and the heat radiating member 2 are securely pressed without any gaps. .
- FIG. FIG. 9 is a sectional view showing a main part of the semiconductor device according to the fifth embodiment of the present invention.
- the cross-sectional shape of the first pressing member 3 opposite to the heat generating element 1 is a wedge shape
- the cross-sectional shape of the first pressing member 3 on the heat generating element 1 side is a rectangular shape.
- the wedge-shaped portion of the first pressing member 3 is in surface contact with the support portion 2d facing the element contact portion 2a of the heat radiating member 2.
- a protrusion 3 d that is fitted into the mounting hole 1 c of the heat generating element 1 is formed on the rectangular side portion of the first pressing member 3.
- the second pressing member 4 interposed between the first pressing member 3 and the heating element 1 is omitted.
- Other configurations are the same as those of the fourth embodiment.
- the first pressing member 3 presses the heat dissipation member 2 while moving the heating element 1 downward.
- the size can be further reduced by the amount that the second pressing member 4 is deleted.
- a fixing screw is used as the tightening means.
- the present invention is not limited to this, and for example, a rivet may be used.
- the heat generating element 1 and the heat radiating member 2 may be in direct surface contact with each other without the heat radiating sheet 7 interposed therebetween.
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
上記充電器やDCDCコンバータなどの車載用電力変換装置の場合、車両への搭載環境、動作環境などから装置の冷却に高い性能が要求される。
発熱部材の放熱部材への取付構造としては、例えば特許文献1~4に記載されている。
特許文献1~3には、押圧部材の弾性力によって、電気装置を放熱部材上に押圧する構造が記載されている。
また、特許文献4には、発熱素子を放熱部材に締結する際の、発熱素子の周り止め板の構造が記載されている。
しかし、従来技術のように、発熱素子を締結部材により、直接放熱部材に取り付けるものでは、発熱素子の寸法ばらつき等により、締結部材の押圧力に差が生じ、安定した放熱性(低熱抵抗)を得ることができない。
また、熱や振動による押圧部材の劣化により、安定した放熱性(低熱抵抗)を得ることができない。
また、特許文献4に記載されたもののように、放熱部材の底面に発熱部品を配置した場合、部品実装面積が増大するなどの問題点がある。
また、他部品への熱の干渉を抑制することができ、装置全体を小型化することができる車載用電力変換装置を得ることを目的とする。
前記押圧手段には、前記締付手段の締付力の軸力の分力が前記取付面に対して垂直方向に生じる傾斜面が形成されている。
また、発熱素子に接触し発熱素子を放熱部材に押圧する押圧手段には、締付手段の締付力の軸力の分力が取付面に対して垂直方向に生じる傾斜面が形成されているので、締付手段の締付力で押圧手段による発熱素子に対する押圧力が増大し、発熱素子と放熱部材間との接触熱抵抗が低減して発熱素子の放熱性が向上する。
図1はこの発明の車載用電力変換装置を示す概略断面図、図2は図1の半導体装置を示す断面図である。
この車載用電力変換装置では、放熱部材2及びケース13を有する冷却器8は、カバー14で覆われている。冷却器8内には、大電流部品である、コイル11及びコンデンサ12が配設されている。また、放熱部材2の凹部2cには、この発明の実施の形態1の半導体装置が埋設されている。この冷却器8の上側には、実装基板5上に実装された複数の電子部品10が配設されている。
押圧手段20には、固定ネジ6の締付力の軸力の分力が発熱素子1の取付面1eに対して垂直方向に生じる傾斜面が形成されている。
発熱素子1は、樹脂モールドしたパッケージ1bでベアチップを覆っている。パッケージ1bには取付穴1cが形成されている。
放熱部材2の中間部には凹部2cが形成されている。この凹部2cは、その側面である素子接触部位2aに一対の発熱素子1がそれぞれ放熱シート7を介して対面している。この放熱シート7は、シリコン材等で形成され、発熱部材1と放熱部材2との間の伝熱と、電流の絶縁を担っている。
第2の押圧部材は、第1の押圧部材3の両側にそれぞれ配設され、それぞれ傾斜面3aと面接触した傾斜面4aを有している。
この第2の押圧部材4は、傾斜面4aと反対側の面に突起4bが形成されている。この突起4bは、発熱素子1の取付穴1cに嵌着されている。
凹部2cの空間部には、グリス2bが充填されている。なお、グリス2bは無くてもよい。
冷却器8では、放熱部材2がOリング16を介してケース13内の一部を密閉している。密閉されたケース13内には、冷媒として例えば水が充填されている。この水は、放熱部材2と外部に設けられた冷却手段(図示せず)との間で循環し、冷却手段で冷却される。
なお、冷媒は空気であってもよい。
また、第1の押圧部材3に形成された貫通孔3cは、放熱部材2の素子接触部位2aと平行に設けられており、第1の押圧部材3と第2の押圧部材4とは、傾斜面3a,4aを介して面接触している。そして、傾斜面3a、4aは、図3に示すように、固定ネジ6の軸力Fvの分力Fhが素子接触部位2aに対して垂直方向に指向するように傾斜している。
従って、固定ネジ6を締付けることで生じた、その軸力の分力Fhで発熱素子1を素子接触部位2aに強く押圧するので、発熱素子1と放熱部材2との間の接触熱抵抗が低減して発熱素子1の放熱性が向上する。
これにより、他部品への熱の干渉を抑制でき、車載用電力変換装置全体の小型化が可能となる。
即ち、従来の電子部品の実装構造を示す、図10のものでは、発熱素子1の取付穴1cを用いて、M3ネジで発熱素子1を放熱部材2に固定する場合、押付力は、Fv=740[N](=M3ネジの定格軸力)である。
一方、この実施の形態のように、第1の押圧部材3、第2の押圧部材4を用いて、発熱素子1を放熱部材2に固定する場合、第1の押圧部材3及び第2の押圧部材4のそれぞれの傾斜面3a,3bを、固定ネジ6の軸線に対して30°で形成し、M4ネジ(軸力Fv=1290[N])で固定すれば、M3ネジを用いた、図10の固定状態と同等の押付力が得られる(Fh=Fv×tan30°)。
このM4ネジを用いた例の場合、発熱素子1の押圧面積が、3×10-4[m2]のものでは、押圧力は2.5[MPA]となる。この力は、放熱シート7の伝熱性能を発揮するのに充分な値である。
従って、押圧される発熱素子1の強度に応じて、最適な押付力となるように角度を調整できることから、設計自由度が向上する。
即ち、図10(c)から分かるように、従来のものでは、固定ネジ6の回転に伴い、発熱素子1、端子1aには回転ストレスが作用するが、この実施の形態の半導体装置では、このようなことはない。
従って、第2の押圧部材4は、発熱素子1を保持し、また位置決めしているとともに、発熱素子1の耐荷重が高い個所に取付穴1cを形成し、取付穴1cに合わせて突起4bを形成することで、発熱素子1のパッケージ1bの荷重による変形や破損を防ぐことができる。
なお、取付穴1cが無いパッケージ1bの場合には、突起4bを耐荷重が高いパッケージ1bの部位に押圧すればよい。
即ち、図10のものは、発熱素子1の平面と放熱部材2とが面接触しており、発熱素子1の取付穴1cを通る固定ネジ6の全軸力で発熱素子1が放熱部材2を押圧するものの、固定ネジ6は、発熱素子1の導体部分1dを通っているのに対して、この実施の形態では、固定ネジ6と、発熱素子1の導体部分1dとの間には、第1の押圧部材3及び第2の押圧部材4が介在している。
このため、固定ネジ6を放熱部材2にねじ込む時に発生する切粉により、発熱素子1が短絡するリスクが低減する。
図4はこの発明の実施の形態2の半導体装置を示す断面図である。
この実施の形態では、第1の押圧部材3は、傾斜面3aが第2の押圧部材4側に突出した曲面形状である。
他の構成は、実施の形態1の半導体装置と同じである。
このことにより、発熱素子1と放熱部材2との間の熱抵抗が低く抑えられ、安定して効率のよい放熱性能が得られる。
なお、第2の押圧部材4の傾斜面4aを第1の押圧部材3側に突出した曲面形状にするようにしても同様の効果を得ることができる。
図5はこの発明の実施の形態3の半導体装置の要部を示す断面図、図6は図5のVI-VI線に沿った矢視断面図、図7は図5のVII-VII線に沿った矢視断面図である。
この実施の形態では、放熱部材2は、その中心部に断面台形状の支持部位2dが素子接触部位2aと並立して設けられている。
第1の押圧部材3は、発熱素子1と反対側の断面形状が楔形状で、発熱素子1側の断面形状が発熱素子1側に突出した曲面である。第1の押圧部材3の楔形状側の部位は、放熱部材2の支持部位2dと面接触している。第1の押圧部材3の曲面の部位は、第2の押圧部材4に当接している。
第1の押圧部材3の貫通孔3cは、素子接触部位2aに対して垂直方向の内径寸法が、この垂直方向に対して直角方向の内径寸法よりも大きい長孔である。この長孔は、図7では矩形状であるが、楕円形状であってよい。
実施の形態1,2では、第1の押圧部材3により、二個の発熱素子1をそれぞれ放熱部材2に押圧していたのに対して、この実施の形態では、第1の押圧部材3により、1個の発熱素子1を放熱部材2に押圧している点で異なる。
他の構成は、実施の形態1の半導体装置と同じである。
また、第2の押圧部材4に当接した第1の押圧部材3の部位は、曲面であるので、実施の形態2と同様に、第1の押圧部材3及び第2の押圧部材4の平行度がばらついた場合でも、曲面でそのばらつきは吸収され、発熱素子1、放熱シート7及び放熱部材2の各間は、隙間なく確実に圧接される。
図8はこの発明の実施の形態4の半導体装置の要部を示す断面図である。
この実施の形態では、第1の押圧部材3の発熱素子1と反対側の断面形状が楔形状であり、第1の押圧部材3の発熱素子1側の断面形状が、矩形状である。第1の押圧部材3の楔形状側の部位は、放熱部材2の支持部位2dと面接触している。第1の押圧部材3の矩形状側の部位は、第2の押圧部材4と面接触している。
この第2の押圧部材4の発熱素子1側には、基部が曲面形状の突起4bが形成されている。この突起4bの先端部は、発熱素子1の取付穴1cに遊挿されている。
また、第1の押圧部材3の貫通孔3cは、実施の形態3の半導体装置と同様に、素子接触部位2aに対して垂直方向の内径寸法が、この垂直方向に対して直角方向の内径寸法よりも大きい長孔である。
この実施の形態では、第1の押圧部材3により、一個の発熱素子1を放熱部材2に押圧している点で異なる。
他の構成は、実施の形態1の半導体装置と同じである。
また、第2の押圧部材4は、基部が曲面形状の突起4bが発熱素子1の取付穴1cに遊挿されており、実施の形態2と同様に、第1の押圧部材3及び第2の押圧部材4の平行度がばらついた場合でも、突起4bの曲面形状の基部で、そのばらつきが吸収され、発熱素子1、放熱シート7及び放熱部材2の各間は、隙間なく確実に圧接される。
図9はこの発明の実施の形態5の半導体装置の要部を示す断面図である。
この実施の形態では、第1の押圧部材3の発熱素子1と反対側の断面形状が楔形状であり、第1の押圧部材3の発熱素子1側の断面形状が、矩形状である。第1の押圧部材3の楔形状側の部位は、放熱部材2の素子接触部位2aと対向した支持部位2dと面接触している。第1の押圧部材3の矩形状側の部位には、発熱素子1の取付穴1cに嵌着した突起3dが形成されている。
この実施の形態では、第1の押圧部材3と発熱素子1との間に介在した第2の押圧部材4が削除されている。
他の構成は、実施の形態4と同じである。
また、第2の押圧部材4が削除された分だけ、より小型化を図ることができる。
また、発熱素子1と放熱部材2との間には放熱シート7を介在せず、発熱素子1と放熱部材2とが直接面接触したものでもよい。
Claims (12)
- 実装基板に対して垂直方向に延びた端子を介して接続された発熱素子と、
この発熱素子の取付面に直接または間接的に面接触した素子接触部位を有する放熱部材と、
前記発熱素子に接触し発熱素子を前記放熱部材に押圧する押圧手段と、
この押圧手段に前記取付面に対して平行に形成された貫通孔を通じて前記押圧手段を前記放熱部材に固定する締付手段とを備え、
前記押圧手段には、前記締付手段の締付力の軸力の分力が前記取付面に対して垂直方向に生じる傾斜面が形成されていることを特徴とする半導体装置。 - 前記押圧手段は、前記貫通孔を有する第1の押圧部材と、この第1の押圧部材に一方の面が接触し、他方の面が前記発熱素子に接触した第2の押圧部材とを備えており、
前記第1の押圧部材と前記第2の押圧部材とは、互いに形成された前記傾斜面で接触していることを特徴とする請求項1に記載の半導体装置。 - 前記第1の押圧部材及び前記第2の押圧部材の何れか一方の前記傾斜面は、他方の前記傾斜面側に突出した曲面形状であることを特徴とする請求項2に記載の半導体装置。
- 前記放熱部材は、前記素子接触部位と対向した支持部位を有しており、
前記押圧手段は、前記貫通孔、及び前記支持部位に面接触した前記傾斜面を有する第1の押圧部材を備えていることを特徴とする請求項1に記載の半導体装置。 - さらに、前記押圧手段は、前記第1の押圧部材に一方の面が接触し、他方の面が前記発熱素子に接触した第2の押圧部材を備えていることを特徴とする請求項4に記載の半導体装置。
- 前記第1の押圧部材または前記第2の押圧部材は、接触する側に突出した曲面を有していることを特徴とする請求項5に記載の半導体装置。
- 前記押圧手段には、前記発熱素子に接触して発熱素子を押圧する突起が形成されていることを特徴とする請求項1~6の何れか1項に記載の半導体装置。
- 前記発熱素子には、前記突起が挿入される取付穴が形成されていることを特徴とする請求項7に記載の半導体装置。
- 前記貫通孔は、前記取付面に対して垂直方向の内径寸法が、この垂直方向に対して直角方向の内径寸法よりも大きい長孔であることを特徴とする請求項1~8の何れか1項に記載の半導体装置。
- 前記発熱素子と前記冷却部材の前記素子接触部位との間には放熱シートが設けられていることを特徴とする請求項1~9の何れか1項に記載の半導体装置。
- 前記締付手段は、固定ネジであることを特徴とする請求項1~10の何れか1項に記載の半導体装置。
- 請求項1~11の何れか1項に記載の半導体装置と、冷媒が密閉され大電流部品を冷却する冷却器とを備え、
前記半導体装置は、前記放熱部材の前記素子接触部位を有した前記冷却器に埋設されていることを特徴とする車載用電力変換装置。
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Also Published As
Publication number | Publication date |
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JP5634621B2 (ja) | 2014-12-03 |
EP2787529A4 (en) | 2015-08-12 |
EP2787529B1 (en) | 2018-05-23 |
CN103975430A (zh) | 2014-08-06 |
US20140252587A1 (en) | 2014-09-11 |
JPWO2013080317A1 (ja) | 2015-04-27 |
EP2787529A1 (en) | 2014-10-08 |
US9147634B2 (en) | 2015-09-29 |
CN103975430B (zh) | 2016-12-07 |
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