WO2013051524A1 - 超音波センサおよびその製造方法 - Google Patents
超音波センサおよびその製造方法 Download PDFInfo
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- WO2013051524A1 WO2013051524A1 PCT/JP2012/075446 JP2012075446W WO2013051524A1 WO 2013051524 A1 WO2013051524 A1 WO 2013051524A1 JP 2012075446 W JP2012075446 W JP 2012075446W WO 2013051524 A1 WO2013051524 A1 WO 2013051524A1
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- Prior art keywords
- case
- ultrasonic sensor
- side wall
- damping
- buffer
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000013016 damping Methods 0.000 claims abstract description 50
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 10
- 239000012779 reinforcing material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 239000011358 absorbing material Substances 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 229920006311 Urethane elastomer Polymers 0.000 description 5
- 230000002238 attenuated effect Effects 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
Definitions
- the present invention relates to an ultrasonic sensor and a method of manufacturing the same, and more particularly to an ultrasonic sensor having a piezoelectric element and an input / output terminal electrically connected to the piezoelectric element, and used for, for example, an automobile corner sonar and back sonar, and It relates to the manufacturing method.
- the ultrasonic sensor detects an object by intermittently transmitting an ultrasonic pulse signal and receiving a reflected signal reflected after the transmitted ultrasonic pulse signal reaches the object.
- Ultrasonic sensors are used for back sonars, corner sonars of automobiles, and parking spot sensors that detect distances from obstacles such as side walls when parallel parking. This type of ultrasonic sensor is disclosed in Patent Documents 1 to 3.
- FIG. 9 is a partially broken front view of the ultrasonic sensor of Patent Document 1.
- This ultrasonic sensor includes an ultrasonic transducer 1, a buffer member 2, a shield wire 5, a sound absorbing material 6, and a housing 3.
- the buffer member 2 has an opening for ultrasonic transmission / reception, and surrounds the ultrasonic transducer 1.
- the housing 3 is a molded product and houses the ultrasonic transducer 1 and the buffer member 2.
- One end of the shield wire 5 is connected to the ultrasonic transducer 1 inside the housing 3, and the other end is drawn out from the housing 3.
- An air layer 4 is formed so as to surround the ultrasonic transducer 1 in a portion corresponding to the side surface of the ultrasonic transducer 1 inside the buffer member 2.
- an ultrasonic transducer an inner casing having an ultrasonic radiation wall bonded to form a bottom surface portion and a cylindrical side wall, and a cylindrical side wall of the inner casing are coaxial.
- an outer housing having a cylindrical side wall disposed on the outer housing, the outer housing supports the inner housing at a plurality of support locations on the ultrasonic radiation wall side, other than the plurality of support locations.
- 1 shows a structure in which a gap is formed between the outer wall of the cylindrical side wall of the inner casing and the outer wall of the cylindrical side wall of the outer casing.
- Patent Document 3 discloses an ultrasonic vibrator, a holding member that has an opening for transmitting and receiving ultrasonic waves and surrounds the ultrasonic vibrator, and is a molded product that houses the ultrasonic vibrator and the holding member.
- the ultrasonic sensor including the housing, a structure in which a gap is generated in a place other than the convex portion by providing the convex portion inside the holding member is shown.
- vibration leakage increases the reverberation time (the reverberation characteristics deteriorate). And if the reverberation time is prolonged, when detecting an object located at a short distance, the reflected signal is received within the time when the reverberation by the transmitted ultrasonic pulse signal is continued. It is impossible to detect a positioned object.
- An object of the present invention is to provide an ultrasonic sensor that prevents vibration leakage to a terminal and improves reverberation characteristics due to vibration leakage.
- the ultrasonic sensor of the present invention A bottomed cylindrical case having a bottom and a side wall; and A piezoelectric element provided on the inner bottom surface of the case; A terminal that is electrically connected to the piezoelectric element via a conducting member in the case and protrudes to the outside of the case; A terminal holding member for holding the terminal; A buffer member for holding the terminal holding member in the case; A damping member provided along the inner peripheral surface of the side wall of the case; A filling member filled in the upper part of the damping member and the buffer member in the case, A gap (air layer) is provided between the damping member and the buffer member.
- the said filling member has a smaller elastic modulus than the said damping member.
- a closing member (a cover resin) that closes a boundary portion (opening portion of the air layer) between the gap and the filling member.
- the side wall portion of the case includes a thin portion on the opening side and a thick portion on the bottom side, It is preferable that a reinforcing material having an acoustic impedance higher than that of the case is provided on the thick portion.
- a sound absorbing member is provided between the piezoelectric element and the buffer member. With this structure, unnecessary sound waves are absorbed by the sound absorbing material, and unnecessary sound waves transmitted from the piezoelectric element to the inside of the case can be attenuated more efficiently.
- An ultrasonic sensor manufacturing method of the present invention is the ultrasonic sensor manufacturing method according to any one of (1) to (5), Inserting an annular molded piece having a larger outer diameter than the buffer member into the case; Filling the periphery of the molding piece in the case with the elastic resin for forming the damping member; Removing the molding piece from the case, and mounting the buffer member in the case.
- vibration transmitted from the case is attenuated (blocked) by the damping member, the buffer member, and the gap (air layer), and hardly transmitted to the terminal through the terminal holding member, so that vibration leakage can be greatly reduced. Therefore, deterioration of the reverberation characteristic due to vibration leakage can be prevented, and an object located at a closer distance can be detected.
- FIG. 1 is a cross-sectional view of an ultrasonic sensor 101 according to the first embodiment.
- FIG. 2 is an exploded perspective view excluding a part of the ultrasonic sensor 101.
- FIG. 3A is a diagram illustrating the reverberation characteristics of the ultrasonic sensor 101 according to the first embodiment
- FIG. 3B is a diagram illustrating the reverberation characteristics of an ultrasonic sensor as a comparative example.
- FIG. 4 is a diagram showing the relationship between the gap 40 between the damping member 39 and the buffer member 33 and the vibration leakage time.
- FIG. 5 is a diagram illustrating a process of forming the damping member 39 and the gap 40.
- FIG. 6 is a cross-sectional view of the ultrasonic sensor 102 according to the second embodiment.
- FIG. 7 is a cross-sectional view of the ultrasonic sensor 103 according to the third embodiment.
- FIG. 8 is a cross-sectional view of the ultrasonic sensor 104 according to the fourth embodiment.
- FIG. 9 is a partially broken front view of the ultrasonic sensor of Patent Document 1.
- FIG. 1 is a cross-sectional view of an ultrasonic sensor 101 according to the first embodiment.
- FIG. 2 is an exploded perspective view excluding a part of the ultrasonic sensor 101.
- the ultrasonic sensor 101 includes a bottomed cylindrical case 31 made of aluminum having a disk-like bottom portion 31b and a cylindrical side wall portion 31a, a piezoelectric element 32 attached to the inner bottom surface of the case 31, a reinforcing material ( A weight) 37, a terminal 43, a terminal holding member 41 for holding the terminal 43, and the like.
- the terminal 43 and the piezoelectric element 32 are electrically connected by a wiring material (conductive member) not shown in FIG.
- the wiring material (conductive member) is, for example, a lead wire or a flexible substrate.
- the piezoelectric element 32 has a flat plate shape and spreads and vibrates in the in-plane direction when a driving voltage is applied.
- the piezoelectric element 32 is joined to the bottom 31 b of the case 31.
- the piezoelectric element 32 is made of, for example, piezoelectric ceramics, and includes a disk-shaped piezoelectric substrate and electrodes provided on main surfaces of the piezoelectric substrate facing each other.
- the case 31 has a bottomed cylindrical shape that is closed on the bottom 31b side and opened on the opposite side to the bottom 31b side, and the opening of the case 31 is circular in plan view.
- the side wall 31a of the case 31 includes a thin portion 31t on the opening side and a thick portion 31h on the bottom side.
- a step portion 31ST is formed on the side wall portion 31a of the case 31.
- the reinforcing member (weight) 37 is a ring-shaped member having an opening 37h at the center, and is disposed on the thick portion 31h of the case 31 and at a position not in contact with the inner peripheral surface of the thin portion 31t of the side wall portion 31a. ing.
- the reinforcing member 37 may be a member having high acoustic impedance and functioning as a weight.
- the reinforcing member 37 may be made of the same material as the case 31 by adjusting the size such as thickness, that is, made of aluminum.
- the reinforcing member 37 is made of a material constituting the case 31 such as stainless steel or zinc. It is preferable that the material is made of a material having high density and high rigidity.
- the region surrounded by the step portion 31ST in the bottom 31b is the main vibration region.
- the main vibration region of the case 31 is rectangular in plan view, and since the y-axis direction is long, the y-axis direction is the long axis and the x-axis direction is short, so the x-axis direction is the short axis.
- the main vibration region has an anisotropic shape, anisotropy occurs in the directivity of ultrasonic waves. That is, the directivity angle in the major axis direction (y-axis direction) is narrow, and the directivity angle in the minor axis direction (x-axis direction) is wide.
- a flat sound absorbing material 38 is provided on the piezoelectric element 32.
- the sound absorbing material 38 is disposed in a space surrounded by the step portion 31ST inside the case 31.
- the sound absorbing material 38 is made of, for example, polyester felt or porous silicone, and absorbs unnecessary ultrasonic waves emitted from the piezoelectric element 32 to the opening side of the case 31.
- a buffer member 33 made of an elastic material such as silicone rubber or urethane rubber is provided between the reinforcing material 37 and the sound absorbing material 38 and the terminal holding member 41. The buffer member 33 holds the terminal holding member 41 in the case 31.
- a damping member 39 which is a cylindrical member made of an elastic body such as urethane rubber or silicone rubber and having an opening at the center, is provided along the inner peripheral surface of the side wall portion 31a of the case 31.
- a gap (air layer) 40 is formed between the damping member 39 and the buffer member 33.
- the buffer member 33 has a flange-shaped (collar-shaped) portion that comes into contact with the damping member 39, and the flange-shaped (collar-shaped) portion is provided between the damping member 39 and the buffer member 33.
- a gap (air layer) 40 is formed.
- a filling member 36 made of an elastic material such as silicone rubber or urethane rubber.
- the same material can be used for the filling member 36 and the damping member 39.
- the case 31 is formed by forging, for example.
- the buffer material 33 is a cup-shaped member, and has a bottom portion having an engaging portion 33e that engages with the opening 37h of the reinforcing material 37, and a cylindrical side wall portion.
- the terminal holding member 41 is made of a resin such as polybutylene terephthalate (PBT) and holds two pin-shaped terminals 43.
- the terminal holding member 41 has a flange-like engaging portion (hereinafter referred to as “flange portion”) 41 f that engages with the inner surface of the cylindrical side wall portion of the buffer member 33.
- flange portion flange-like engaging portion
- the upper surface 41 s of the flange portion 41 f of the terminal holding member 41 is covered with the filling member 36.
- the damping member 39 in contact with the inner peripheral surface of the side wall portion 31a of the case 31 is provided, the vibration of the side wall portion 31a of the case 31 is attenuated by the damping member 39. Since the gap (air layer) 40 is formed between the damping member 39 and the buffer member 33, the vibration of the side wall portion 31 a of the case 31 is difficult to propagate to the buffer member 33 through the damping member 39. That is, vibration hardly propagates along the path of the buffer member 33 ⁇ the terminal holding member 41 ⁇ the terminal 43, and vibration leakage is effectively suppressed. In addition, vibration propagating from the case 31 via a portion other than the gap (air layer) 40 is attenuated in the filling member 36 and hardly propagates to the terminal 43 via the terminal holding member 41.
- vibration leakage that occurs when the ultrasonic sensor 101 is mounted on an external circuit board can be greatly reduced.
- the upper surface 41 s of the flange portion 41 f of the terminal holding member 41 is covered with the filling member 36, it is possible to prevent the terminal holding member 41 from being detached from the case 31.
- the buffer member 33 is difficult to propagate vibration, and the damping member 39 and the filling member 36 suppress (dampen) the vibration of the side wall portion 31a of the case 31. That is, the damping member 39 and the filling member 36 preferably have a higher elastic modulus than the buffer member 33. More specifically, the elastic modulus includes a storage elastic modulus and a loss elastic modulus. It is preferable that the damping member 39 and the filling member 36 have a large loss elastic modulus, and that the buffer member 33 has a low storage elastic modulus.
- FIG. 3A is a diagram showing the reverberation characteristics of the ultrasonic sensor 101 according to the first embodiment
- FIG. 3B is a diagram showing the reverberation characteristics of the ultrasonic sensor as a comparative example.
- the ultrasonic sensor of this comparative example does not have the gap 40 shown in FIG. 1, and the buffer member 33 is expanded in that portion, and the ultrasonic sensor according to the first embodiment except that the gap 40 is not provided.
- the configuration is the same as that of the ultrasonic sensor 101.
- the horizontal axis is 500 ⁇ s / div
- the vertical axis is 1 V / div.
- the terminal 43 is fixed to an external circuit board by soldering, 8 burst waves are transmitted at a transmission time of 0.13 ms, and the voltage waveform appearing on the piezoelectric element is amplified and observed.
- the attenuation of the amplitude starts immediately after the end of transmission, but since the dynamic range of the amplifier circuit is exceeded for a while, the waveform is saturated during that time.
- the amplitude converges quickly, vibration leakage is suppressed, and the reverberation time is reduced. Is short.
- FIG. 4 is a diagram showing the relationship between the gap 40 between the damping member 39 and the buffer member 33 and the vibration leakage time.
- the “vibration leakage time” is a state in which the normal reverberation time in a state where the terminal 43 is fixed to the external circuit board by soldering and the vibration leaking to the terminal 43 is sandwiched between silicone rubbers to suppress the vibration leakage.
- the reverberation time is defined as the amount of fluctuation of the reverberation.
- the gap 40 is not provided, that is, in the case of the comparative example, the fluctuation of the vibration leakage time is large.
- the vibration leakage time becomes very small and the fluctuation is also reduced. From this result, it can be seen that by providing a gap exceeding 0 mm, the vibration leakage time can be suppressed to a usable level of less than 0.1 ms.
- FIG. 5 is a diagram showing a process of forming the damping member 39 and the gap 40.
- the piezoelectric element 32 is joined in the case 31, the reinforcing member 37 is attached, the sound absorbing member 38 is disposed on the piezoelectric element 32, and the molding piece 51 is mounted.
- the molding piece 51 is disposed so as to have a gap having the same shape as the damping member 39 between the case 31 and the side wall portion 31a of the case 31.
- the weather resin 39P is applied to a part of the gap between the molding piece 51 and the side wall 31a of the case 31 and cured.
- the weather resin 39P is made of the same material as that of the damping member 39 and later becomes a part of the damping member 39.
- the resin for the damping member 39 is applied (filled) into the gap between the molding piece 51 and the side wall 31a of the case 31 and cured. Thereafter, the molding piece 51 is removed as shown in FIG. 5D, and the buffer member 33 is mounted as shown in FIG.
- the gap 40 is provided between the damping member 39 and the buffer member 33.
- FIG. 6 is a cross-sectional view of the ultrasonic sensor 102 according to the second embodiment.
- the structure of the ultrasonic sensor 102 is the same as that of the ultrasonic sensor 101 shown in the first embodiment.
- the filling member 36 is made of a material different from that of the damping member 39.
- the elastic modulus of the filling member 36 is smaller than the elastic modulus of the damping member 39.
- the damping member 39 is made of urethane rubber
- the filling member 36 is made of silicone rubber.
- both may be urethane rubber.
- the damping member 39 is an elastic material having a high damping property with respect to the side wall portion 31 a of the case 31, and the filling member 36 may be an elastic material that hardly propagates the vibration of the side wall portion 31 a to the terminal holding member 41.
- FIG. 7 is a cross-sectional view of the ultrasonic sensor 103 according to the third embodiment.
- the ultrasonic sensor 103 includes a closing member 34 that closes a boundary portion between the gap 40 and the filling member 36.
- Other configurations are the same as those of the ultrasonic sensor 101 shown in the first embodiment.
- the closing member 34 can be provided by applying a thixotropic resin with a dispenser so as not to enter the gap 40.
- the closing member 34 closes (stices) the boundary portion (opening portion of the air layer) between the gap 40 and the filling member 36, thereby preventing the filling resin from flowing into the gap 40 during filling of the filling member 36.
- FIG. 8 is a cross-sectional view of the ultrasonic sensor 104 according to the fourth embodiment.
- the opening of the gap 40 between the damping member 39 and the buffer member 33 is closed with the filling member 36.
- Other configurations are the same as those of the ultrasonic sensor 101 shown in the first embodiment.
- a resin material having a high thixotropic property is used so that the resin does not flow into the gap 40 at the time of filling.
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Abstract
Description
底部と側壁部とを有する有底筒状のケースと、
前記ケースの内底面に設けられた圧電素子と、
前記ケース内で導通部材を介して前記圧電素子と電気的に接続され、前記ケースの外部へ突出する端子と、
前記端子を保持する端子保持部材と、
前記端子保持部材を前記ケース内で保持する緩衝部材と、
前記ケースの側壁部の内周面に沿って設けられたダンピング部材と、
前記ケース内の、前記ダンピング部材および前記緩衝部材の上部に充填された充填部材と、を備え、
前記ダンピング部材と前記緩衝部材との間に間隙(空気層)が設けられていることを特徴としている。
厚肉部上に、ケースよりも音響インピーダンスの高い補強材が設けられていることが好ましい。この構造により、ケースの底面の周囲の剛性が高まり、ケースの底面の振動がケースの側壁部へ伝わるのが抑制されるとともに、センサとしての感度が向上する。
前記緩衝部材より外径の大きな円環状の成型コマを前記ケース内に挿入する工程と、
前記ダンピング部材形成用の弾性樹脂を前記ケース内の前記成型コマの周囲に充填する
工程と、
前記成型コマを前記ケースから除去し、前記ケース内に前記緩衝部材を搭載する工程と、を備えたことを特徴としている。
図1は第1の実施形態に係る超音波センサ101の断面図である。図2は超音波センサ101の一部を除く分解斜視図である。
図6は第2の実施形態に係る超音波センサ102の断面図である。超音波センサ102の構造は、第1の実施形態で示した超音波センサ101と同じである。但し、充填部材36はダンピング部材39とは異なる材料からなる。第2の実施形態の超音波センサ102では、充填部材36の弾性率はダンピング部材39の弾性率より小さい。
図7は第3の実施形態に係る超音波センサ103の断面図である。超音波センサ103においては、間隙40と充填部材36との境界部を閉塞する閉塞部材34を備えている。その他の構成は第1の実施形態で示した超音波センサ101と同じである。
図8は第4の実施形態に係る超音波センサ104の断面図である。超音波センサ104においては、ダンピング部材39と緩衝部材33との間の間隙40の開口を充填部材36で閉塞したものである。その他の構成は第1の実施形態で示した超音波センサ101と同じである。
31a…側壁部
31b…底部
31h…厚肉部
31ST…段差部
31t…薄肉部
32…圧電素子
33…緩衝部材
33e…係合部
34…閉塞部材
36…充填部材
37…補強材
37h…開口
38…吸音部材
39…ダンピング部材
40…間隙
41…端子保持部材
41f…フランジ部
41s…上面
43…端子
51…成型コマ
101~104…超音波センサ
Claims (6)
- 底部と側壁部とを有する有底筒状のケースと、
前記ケースの内底面に設けられた圧電素子と、
前記ケース内で導通部材を介して前記圧電素子と電気的に接続され、前記ケースの外部へ突出する端子と、
前記端子を保持する端子保持部材と、
前記端子保持部材を前記ケース内で保持する緩衝部材と、
前記ケースの側壁部の内周面に沿って設けられたダンピング部材と、
前記ケース内の、前記ダンピング部材および前記緩衝部材の上部に充填された充填部材と、を備え、
前記ダンピング部材と前記緩衝部材との間に間隙が設けられていることを特徴とする超音波センサ。 - 前記充填部材は、前記ダンピング部材より弾性率が小さい、請求項1に記載の超音波センサ。
- 前記間隙と前記充填部材との境界部を閉塞する閉塞部材を備えた、請求項1または2に記載の超音波センサ。
- 前記ケースの側壁部は、開口側に薄肉部、前記底部側に厚肉部をそれぞれ備え、
前記厚肉部上に、前記ケースよりも音響インピーダンスの高い補強材が設けられている、請求項1~3の何れかに記載の超音波センサ。 - 前記圧電素子と前記緩衝部材との間に吸音部材が設けられている、請求項1~4の何れかに記載の超音波センサ。
- 請求項1~5の何れかに記載の超音波センサの製造方法であって、
前記緩衝部材より外径の大きな円環状の成型コマを前記ケース内に挿入する工程と、
前記ダンピング部材形成用の弾性樹脂を前記ケース内の前記成型コマの周囲に充填する工程と、
前記成型コマを前記ケースから除去し、前記ケース内に前記緩衝部材を搭載する工程と、を備えた、超音波センサの製造方法。
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US20200393564A1 (en) * | 2019-06-17 | 2020-12-17 | Aisin Seiki Kabushiki Kaisha | Sonar unit |
WO2021215177A1 (ja) * | 2020-04-21 | 2021-10-28 | 株式会社デンソー | 超音波センサおよび振動吸収体 |
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WO2016171003A1 (ja) * | 2015-04-20 | 2016-10-27 | 株式会社村田製作所 | 超音波センサ |
CN106017529B (zh) * | 2016-07-15 | 2018-08-07 | 广东奥迪威传感科技股份有限公司 | 一种开放式传感器 |
KR20180065580A (ko) * | 2016-12-08 | 2018-06-18 | 아이에스테크놀로지 주식회사 | 차량용 초음파 트랜스듀서의 와이어 정렬 지그 |
JP6631549B2 (ja) * | 2017-02-01 | 2020-01-15 | 株式会社デンソー | 超音波出力装置 |
JP7519252B2 (ja) * | 2020-10-01 | 2024-07-19 | Tdk株式会社 | 超音波トランスデューサ |
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JP2021173560A (ja) * | 2020-04-21 | 2021-11-01 | 株式会社デンソー | 超音波センサおよび振動吸収体 |
JP7294223B2 (ja) | 2020-04-21 | 2023-06-20 | 株式会社デンソー | 超音波センサおよび振動吸収体 |
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CN103843366B (zh) | 2016-11-02 |
JP5522311B2 (ja) | 2014-06-18 |
JPWO2013051524A1 (ja) | 2015-03-30 |
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