WO2013009133A3 - 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 - Google Patents
표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 Download PDFInfo
- Publication number
- WO2013009133A3 WO2013009133A3 PCT/KR2012/005587 KR2012005587W WO2013009133A3 WO 2013009133 A3 WO2013009133 A3 WO 2013009133A3 KR 2012005587 W KR2012005587 W KR 2012005587W WO 2013009133 A3 WO2013009133 A3 WO 2013009133A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- surface treatment
- steel sheet
- sheet coated
- dissipation
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/68—Particle size between 100-1000 nm
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Paints Or Removers (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12810861.0A EP2733181B1 (en) | 2011-07-13 | 2012-07-13 | Resin composition for a surface treatment, and steel sheet coated with same |
US14/232,014 US9376576B2 (en) | 2011-07-13 | 2012-07-13 | Resin composition for a surface treatment, and steel sheet coated with same |
CN201280034796.1A CN103649243B (zh) | 2011-07-13 | 2012-07-13 | 表面处理用树脂组合物及被该组合物涂覆的钢板 |
JP2014520134A JP5914650B2 (ja) | 2011-07-13 | 2012-07-13 | 表面処理用樹脂組成物及びこれによってコーティングされた鋼板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110069491A KR101271965B1 (ko) | 2011-07-13 | 2011-07-13 | 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 |
KR10-2011-0069491 | 2011-07-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013009133A2 WO2013009133A2 (ko) | 2013-01-17 |
WO2013009133A3 true WO2013009133A3 (ko) | 2013-04-11 |
Family
ID=47506741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/005587 WO2013009133A2 (ko) | 2011-07-13 | 2012-07-13 | 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9376576B2 (ko) |
EP (1) | EP2733181B1 (ko) |
JP (1) | JP5914650B2 (ko) |
KR (1) | KR101271965B1 (ko) |
CN (1) | CN103649243B (ko) |
WO (1) | WO2013009133A2 (ko) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10252945B2 (en) | 2012-09-26 | 2019-04-09 | Multiple Energy Technologies Llc | Bioceramic compositions |
EP3083846B1 (en) * | 2013-12-19 | 2018-07-18 | TATA STEEL UK Limited | Graphene based anti-corrosion coatings |
EP2886616A1 (en) * | 2013-12-19 | 2015-06-24 | Tata Steel UK Ltd | Graphene based anti-corrosion coatings |
CN105899613A (zh) * | 2014-01-08 | 2016-08-24 | 捷恩智株式会社 | 热传导性片用树脂组合物、热传导性片、树脂覆膜金属、电子装置 |
JP2015183033A (ja) * | 2014-03-20 | 2015-10-22 | 株式会社カネカ | 高熱伝導性樹脂組成物、それを含有する放熱・伝熱用樹脂材料および熱伝導膜 |
PE20170278A1 (es) | 2014-05-05 | 2017-04-05 | Multiple Energy Tech Llc | Composiciones de bioceramica y usos biomoduladores de las mismas |
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KR101674749B1 (ko) * | 2014-12-03 | 2016-11-10 | 주식회사 포스코 | 도금강판용 피복 조성물, 이를 이용한 표면처리강판 및 이의 제조방법 |
CN105733430A (zh) * | 2014-12-11 | 2016-07-06 | 宝山钢铁股份有限公司 | 一种热镀铝锌钢板用表面处理剂、热镀铝锌钢板及其制造方法 |
US11028276B2 (en) | 2015-03-31 | 2021-06-08 | Nippon Steel Corporation | Surface-treated metal sheet, coated member, and method for producing coated member |
WO2016163830A1 (ko) * | 2015-04-08 | 2016-10-13 | 주식회사 아모그린텍 | 방열 코팅조성물 및 이를 통해 형성된 방열유닛 |
US11104108B2 (en) | 2015-04-08 | 2021-08-31 | Amogreentech Co., Ltd. | Heat dissipating coating composition and heat dissipating unit formed using same |
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US10689501B2 (en) * | 2015-10-27 | 2020-06-23 | Jinan Shengquan Group Share Holding Co., Ltd. | Composite polyester material, composite polyester fiber, processes for preparing the same and uses thereof |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050028912A (ko) * | 2002-07-23 | 2005-03-23 | 제이에프이 스틸 가부시키가이샤 | 내백청성이 우수한 표면처리 강판 및 그 제조 방법 |
JP2008502815A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高い熱伝導性被覆を有する織物 |
KR100926064B1 (ko) * | 2008-11-18 | 2009-11-16 | 주식회사 코리아 인스트루먼트 | 금속 인쇄회로기판의 원판 및 그 제조방법 |
KR20100112425A (ko) * | 2009-04-09 | 2010-10-19 | (주)와이에스썸텍 | 금속 기판의 고방열성을 위한 절연층 형성방법 및 이에 의해 제조된 금속 기판 |
JP2010248626A (ja) * | 2009-03-27 | 2010-11-04 | Kobe Steel Ltd | 高熱伝導性放熱鋼板 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4314006A (en) | 1980-06-26 | 1982-02-02 | Xerox Corporation | Flexible document transport belt of ethylene propylene diene rubber |
JPS61281879A (ja) | 1985-06-06 | 1986-12-12 | Sumitomo Metal Ind Ltd | ボイラ−内部金属部材の為の耐熱性耐食性セラミツク被覆組成物 |
US5026422A (en) * | 1989-11-03 | 1991-06-25 | Union Carbide Coatings Service Technology Corporation | Powder coating compositions |
JP2918328B2 (ja) | 1990-11-26 | 1999-07-12 | 株式会社デンソー | 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置 |
JP3493844B2 (ja) * | 1994-11-15 | 2004-02-03 | 住友電気工業株式会社 | 半導体基板材料とその製造方法及び該基板を用いた半導体装置 |
JP2789088B2 (ja) | 1996-12-16 | 1998-08-20 | 東洋アルミニウム株式会社 | 粒子状無機質複合体の製造方法 |
JP3835949B2 (ja) * | 1999-06-11 | 2006-10-18 | 松下電器産業株式会社 | 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板の製造方法 |
JP3446951B2 (ja) * | 1999-11-15 | 2003-09-16 | 電気化学工業株式会社 | 無機質粉末及びそれが充填された樹脂組成物 |
US20030165689A1 (en) * | 2001-12-14 | 2003-09-04 | Miller Edward A. | Articles spray coated with non-melting polymer |
AU2003227474A1 (en) * | 2002-04-12 | 2003-10-27 | Nippon Steel Corporation | Cover for exothermic article excellent in heat absorbing property and surface treated metal sheet therefor, and applications thereof |
JP4765936B2 (ja) | 2004-04-28 | 2011-09-07 | 住友金属工業株式会社 | 放熱性に優れた塗装鋼板 |
JP5175022B2 (ja) | 2004-06-14 | 2013-04-03 | スリーエム イノベイティブ プロパティズ カンパニー | 多層熱伝導性シート |
US20070036900A1 (en) * | 2005-08-12 | 2007-02-15 | Yuqing Liu | Process for improving the corrosion resistance of a non-stick coating on a substrate |
JP4907998B2 (ja) * | 2006-01-18 | 2012-04-04 | 住友大阪セメント株式会社 | 樹脂組成物 |
JP5028873B2 (ja) * | 2006-06-09 | 2012-09-19 | 株式会社カネカ | 高熱伝導性熱可塑性樹脂組成物 |
JP2010514886A (ja) * | 2006-12-27 | 2010-05-06 | ポスコ | 優れた放熱黒色樹脂組成物、これを利用した亜鉛めっき鋼板処理方法、及びこれにより処理されためっき鋼板 |
CN100534954C (zh) | 2007-02-09 | 2009-09-02 | 江苏苏嘉集团新材料有限公司 | 一种非氧化物复合低碳镁碳砖 |
CN101029191A (zh) * | 2007-03-30 | 2007-09-05 | 孟中 | 纳米绝热涂料及其生产方法 |
US8106119B2 (en) | 2007-12-04 | 2012-01-31 | Sea-Fue Wang | Thermally conductive silicone composition |
CN101235243B (zh) * | 2008-01-23 | 2011-05-18 | 陈树望 | 一种多功能防护复合涂层材料 |
JP5407163B2 (ja) * | 2008-04-02 | 2014-02-05 | 東レ株式会社 | ペースト組成物およびそれを用いた高熱伝導率樹脂組成物 |
CN101654778A (zh) | 2008-08-21 | 2010-02-24 | 北京盘天新技术有限公司 | 一种由聚合物先驱体制备绝缘导热陶瓷涂层的方法 |
JP2010138267A (ja) * | 2008-12-11 | 2010-06-24 | Cluster Technology Co Ltd | 熱伝導性樹脂組成物 |
WO2010092923A1 (ja) | 2009-02-12 | 2010-08-19 | 電気化学工業株式会社 | アルミニウム-黒鉛複合体からなる基板、それを用いた放熱部品及びled発光部材 |
JP2010285569A (ja) * | 2009-06-15 | 2010-12-24 | Panasonic Corp | 熱伝導性樹脂材料およびその製造方法 |
US20110077337A1 (en) | 2009-09-25 | 2011-03-31 | Yeh Yun-Chao | Method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers |
JP2011079968A (ja) * | 2009-10-07 | 2011-04-21 | Uniplus Electronics Co Ltd | 高熱伝導性で、低損失係数のビルドアップ材料 |
KR101035011B1 (ko) | 2010-01-19 | 2011-05-17 | 한국전기연구원 | 방열 코팅제 및 이를 이용한 방열판 |
-
2011
- 2011-07-13 KR KR1020110069491A patent/KR101271965B1/ko active IP Right Grant
-
2012
- 2012-07-13 EP EP12810861.0A patent/EP2733181B1/en active Active
- 2012-07-13 CN CN201280034796.1A patent/CN103649243B/zh active Active
- 2012-07-13 WO PCT/KR2012/005587 patent/WO2013009133A2/ko active Application Filing
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050028912A (ko) * | 2002-07-23 | 2005-03-23 | 제이에프이 스틸 가부시키가이샤 | 내백청성이 우수한 표면처리 강판 및 그 제조 방법 |
JP2008502815A (ja) * | 2004-06-15 | 2008-01-31 | シーメンス パワー ジェネレーション インコーポレイテッド | 高い熱伝導性被覆を有する織物 |
KR100926064B1 (ko) * | 2008-11-18 | 2009-11-16 | 주식회사 코리아 인스트루먼트 | 금속 인쇄회로기판의 원판 및 그 제조방법 |
JP2010248626A (ja) * | 2009-03-27 | 2010-11-04 | Kobe Steel Ltd | 高熱伝導性放熱鋼板 |
KR20100112425A (ko) * | 2009-04-09 | 2010-10-19 | (주)와이에스썸텍 | 금속 기판의 고방열성을 위한 절연층 형성방법 및 이에 의해 제조된 금속 기판 |
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KR20130008855A (ko) | 2013-01-23 |
EP2733181A2 (en) | 2014-05-21 |
KR101271965B1 (ko) | 2013-06-07 |
CN103649243B (zh) | 2016-03-30 |
JP2014520962A (ja) | 2014-08-25 |
WO2013009133A2 (ko) | 2013-01-17 |
EP2733181A4 (en) | 2015-08-05 |
US9376576B2 (en) | 2016-06-28 |
EP2733181B1 (en) | 2024-02-07 |
JP5914650B2 (ja) | 2016-05-11 |
EP2733181C0 (en) | 2024-02-07 |
CN103649243A (zh) | 2014-03-19 |
US20140147645A1 (en) | 2014-05-29 |
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