WO2012161458A3 - 피시비 기판 검사장치 - Google Patents

피시비 기판 검사장치 Download PDF

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Publication number
WO2012161458A3
WO2012161458A3 PCT/KR2012/003832 KR2012003832W WO2012161458A3 WO 2012161458 A3 WO2012161458 A3 WO 2012161458A3 KR 2012003832 W KR2012003832 W KR 2012003832W WO 2012161458 A3 WO2012161458 A3 WO 2012161458A3
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
inspection
shuttles
carry
inspecting
Prior art date
Application number
PCT/KR2012/003832
Other languages
English (en)
French (fr)
Other versions
WO2012161458A2 (ko
Inventor
한충희
김기영
Original Assignee
주식회사 미르기술
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Publication of WO2012161458A2 publication Critical patent/WO2012161458A2/ko
Publication of WO2012161458A3 publication Critical patent/WO2012161458A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

본 발명에 따른 피시비 기판 검사장치는 인입된 피시비 기판을 검사영역으로 이송시키기 위한 한쌍의 제 1, 제 2 인입부셔틀과, 상기 피시비 기판을 검사하기 위한 한쌍의 제 1, 제 2 검사부와, 상기 제 1, 제 2 인입부셔틀로부터 피시비 기판을 전달받아 제 1, 제 2 배출부셔틀에 전달하기 위한 한쌍의 제 1, 제 2 검사부컨베이어와, 상기 제 1, 제 2 인입부셔틀과 대향된 위치에서 상기 제 1, 제 2 검사부컨베이어부로부터 검사가 완료된 피시비 기판을 전달받아 배출하기 위한 제 1, 제 2 배출부셔틀을 포함한다. 본 발명에 의해, 피시비 기판을 효율적이면서도 안정적으로 검사할 수 있다. 또한, 피시비 기판에 대한 검사를 신속하게 수행할 수 있도록 함으로써 검사 수율을 향상시킬 수 있으며, 피시비 기판의 위치를 정밀하게 정렬할 수 있다.
PCT/KR2012/003832 2011-05-20 2012-05-16 피시비 기판 검사장치 WO2012161458A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110047963A KR101178416B1 (ko) 2011-05-20 2011-05-20 피시비 기판 검사장치
KR10-2011-0047963 2011-05-20

Publications (2)

Publication Number Publication Date
WO2012161458A2 WO2012161458A2 (ko) 2012-11-29
WO2012161458A3 true WO2012161458A3 (ko) 2013-01-17

Family

ID=46888085

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003832 WO2012161458A2 (ko) 2011-05-20 2012-05-16 피시비 기판 검사장치

Country Status (2)

Country Link
KR (1) KR101178416B1 (ko)
WO (1) WO2012161458A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101582896B1 (ko) * 2014-12-19 2016-01-07 (주)넥스티지 부품 부착 상태 검사 장치
CN105691005B (zh) * 2016-01-30 2017-08-22 江西中信华电子工业有限公司 一种自动打码设备
DE102017102700A1 (de) * 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
KR101902966B1 (ko) 2018-07-31 2018-11-22 오정기 기판 고정장치
CN112485274A (zh) * 2020-11-23 2021-03-12 苏州浪潮智能科技有限公司 一种电路板的运送装置及其控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980017826U (ko) * 1996-09-24 1998-07-06 김광호 Pcb 검사용 pcb 위치설정장치
KR19990017113A (ko) * 1997-08-21 1999-03-15 구자홍 인쇄회로기판 검사 장치 및 그 방법
JP2000012999A (ja) * 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
KR20100132948A (ko) * 2008-03-14 2010-12-20 파나소닉 주식회사 기판검사 장치 및 기판검사 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980017826U (ko) * 1996-09-24 1998-07-06 김광호 Pcb 검사용 pcb 위치설정장치
KR19990017113A (ko) * 1997-08-21 1999-03-15 구자홍 인쇄회로기판 검사 장치 및 그 방법
JP2000012999A (ja) * 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
KR20100132948A (ko) * 2008-03-14 2010-12-20 파나소닉 주식회사 기판검사 장치 및 기판검사 방법

Also Published As

Publication number Publication date
KR101178416B1 (ko) 2012-08-31
WO2012161458A2 (ko) 2012-11-29

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