WO2012157952A3 - 피시비 기판 검사장치 - Google Patents

피시비 기판 검사장치 Download PDF

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Publication number
WO2012157952A3
WO2012157952A3 PCT/KR2012/003831 KR2012003831W WO2012157952A3 WO 2012157952 A3 WO2012157952 A3 WO 2012157952A3 KR 2012003831 W KR2012003831 W KR 2012003831W WO 2012157952 A3 WO2012157952 A3 WO 2012157952A3
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
pcb substrates
parts
pcb
substrates
Prior art date
Application number
PCT/KR2012/003831
Other languages
English (en)
French (fr)
Other versions
WO2012157952A2 (ko
Inventor
한충희
김기영
Original Assignee
주식회사 미르기술
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Publication of WO2012157952A2 publication Critical patent/WO2012157952A2/ko
Publication of WO2012157952A3 publication Critical patent/WO2012157952A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

본 발명에 따른 피시비 기판 검사장치는 피시비 기판을 검사하기 위한 검사영역으로 피시비 기판을 인입하기 위한 한쌍의 제 1, 제 2 인입부와, 상기 피시비 기판을 검사하기 위한 한쌍의 제 1, 제 2 검사부와, 인입된 피시비 기판을 상기 제 1, 제 2 검사부로 각각 이송시키기 위한 한쌍의 제 1, 제 2 컨베이어셔틀부와;, 상기 제 1, 제 2 인입부와 대향된 위치에서 상기 제 1, 제 2 컨베이어셔틀부로부터 검사가 완료된 피시비 기판을 전달받아 배출하기 위한 제 1, 제 2 배출부를 포함하는 것을 특징으로 한다. 본 발명에 의해, 피시비 기판을 효율적이면서도 안정적으로 검사할 수 있다. 또한, 피시비 기판에 대한 검사를 신속하게 수행할 수 있도록 함으로써 검사 수율을 향상시킬 수 있으며, 피시비 기판의 위치를 정밀하게 정렬할 수 있다.
PCT/KR2012/003831 2011-05-18 2012-05-16 피시비 기판 검사장치 WO2012157952A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0047024 2011-05-18
KR1020110047024A KR101178409B1 (ko) 2011-05-18 2011-05-18 피시비 기판 검사장치

Publications (2)

Publication Number Publication Date
WO2012157952A2 WO2012157952A2 (ko) 2012-11-22
WO2012157952A3 true WO2012157952A3 (ko) 2013-01-24

Family

ID=46888082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/003831 WO2012157952A2 (ko) 2011-05-18 2012-05-16 피시비 기판 검사장치

Country Status (2)

Country Link
KR (1) KR101178409B1 (ko)
WO (1) WO2012157952A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908457B (zh) * 2015-06-15 2017-04-19 苏州石丸英合精密机械有限公司 键盘激光自动打标机的气动上料机构
KR101891892B1 (ko) * 2016-11-01 2018-08-27 신흥에스이씨주식회사 캡플레이트 반제품의 제조장치
KR102581387B1 (ko) * 2018-09-11 2023-09-21 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980017826U (ko) * 1996-09-24 1998-07-06 김광호 Pcb 검사용 pcb 위치설정장치
KR19990017113A (ko) * 1997-08-21 1999-03-15 구자홍 인쇄회로기판 검사 장치 및 그 방법
JP2000012999A (ja) * 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
KR20100132948A (ko) * 2008-03-14 2010-12-20 파나소닉 주식회사 기판검사 장치 및 기판검사 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980017826U (ko) * 1996-09-24 1998-07-06 김광호 Pcb 검사용 pcb 위치설정장치
KR19990017113A (ko) * 1997-08-21 1999-03-15 구자홍 인쇄회로기판 검사 장치 및 그 방법
JP2000012999A (ja) * 1998-06-18 2000-01-14 Nagoya Denki Kogyo Kk 基板検査方法およびその装置
KR20100132948A (ko) * 2008-03-14 2010-12-20 파나소닉 주식회사 기판검사 장치 및 기판검사 방법

Also Published As

Publication number Publication date
WO2012157952A2 (ko) 2012-11-22
KR101178409B1 (ko) 2012-08-31

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