WO2012099286A1 - Apparatus and method for processing light guide plate using laser - Google Patents

Apparatus and method for processing light guide plate using laser Download PDF

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Publication number
WO2012099286A1
WO2012099286A1 PCT/KR2011/000425 KR2011000425W WO2012099286A1 WO 2012099286 A1 WO2012099286 A1 WO 2012099286A1 KR 2011000425 W KR2011000425 W KR 2011000425W WO 2012099286 A1 WO2012099286 A1 WO 2012099286A1
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WO
WIPO (PCT)
Prior art keywords
laser
guide plate
light guide
unit
processing
Prior art date
Application number
PCT/KR2011/000425
Other languages
French (fr)
Korean (ko)
Inventor
윤태중
Original Assignee
Yoon Taejoong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yoon Taejoong filed Critical Yoon Taejoong
Priority to CN201180065345.XA priority Critical patent/CN103314324B/en
Priority to PCT/KR2011/000425 priority patent/WO2012099286A1/en
Publication of WO2012099286A1 publication Critical patent/WO2012099286A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065—Manufacturing aspects; Material aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces

Definitions

  • the present invention relates to a light guide plate processing apparatus using a laser, and a device for processing an optical pattern using a laser on a light guide plate used in a backlight unit, and a method of processing an optical pattern on a light guide plate.
  • LCDs Liquid crystal displays
  • LCDs which are recently attracting attention as display devices, inject liquid crystals between substrates on which electrodes for controlling each pixel are formed, and form an electric field between the substrates to display image information.
  • the state is changed and the desired image information is displayed using the transmittance difference accordingly.
  • an LCD such as a liquid crystal itself, does not emit light, but only light passes. Therefore, a light source device must be separately provided to display image information.
  • a light source device provided in an LCD or the like is commonly referred to as a backlight unit.
  • the backlight unit includes a light source such as a cathode ray tube generating light, an LED, a fluorescent lamp, and a light guide plate and a prism sheet to evenly distribute the light generated from the light source.
  • the light source is generally located at the end of the LCD, and several sheets including the light guide plate are required to evenly distribute the light generated at the end.
  • the double light guide plate is usually made of an acrylic resin to form a constant optical pattern in an intaglio or embossed on one side.
  • the optical pattern plays a role that the light generated from the light source comes out of the light guide plate during propagation by total reflection, that is, the incident angle of the light propagated at a specific position is less than the critical angle so that the light generated from the light source provided on one side is transferred to the whole LCD Serve evenly.
  • the light guide plate formed with the optical pattern is manufactured by injection molding through a mold in which the optical pattern is formed, but it is very difficult to manufacture a light guide plate applied to a large size of 10 inches or more. There is a problem in that the light guide plate of a predetermined thickness or less through the injection molding is becoming thinner.
  • the light guide plate processing apparatus using a conventional laser not only has a high quality of the laser because the quality of the laser is not uniform, but also inefficiently controlled by the optical device that irradiates the laser, so that the manufacturing time of the light guide plate is much longer than that of the injection molding. There is a problem of low economic efficiency.
  • the present invention is to solve the above problems, an object of the present invention is to increase the processing speed by processing the optical pattern without accelerating, decelerating, reorientation of the optical device, to generate a uniform laser using a step-by-step cooling device light guide plate
  • Light guide plate processing device and processing method using laser which improves the quality of processing and generates laser pulse with energy optimized for light guide plate processing through the shutter device to improve the quality of optical pattern processed on the light guide plate and enables fast processing In providing.
  • a first embodiment of a light guide plate processing apparatus using a laser of the present invention is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, wherein a laser for processing the optical pattern is generated.
  • a second embodiment of a light guide plate processing apparatus using a laser of the present invention to achieve the above object is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, the laser for processing the optical pattern Laser generating unit for generating a; A stage in which a light guide plate on which the optical pattern is to be processed is located; A rotating optical unit for irradiating the light guide plate with a laser generated by the laser generating unit; A rotating optical unit moving unit for moving the rotating optical unit at a predetermined speed for processing the optical pattern; And a control unit for controlling the laser generating unit, the rotating optical unit, and the rotating optical unit moving unit to process the optical pattern.
  • the laser generation unit is characterized in that it comprises a laser light source, and a cooling device for maintaining the laser light source at a predetermined temperature.
  • the laser light source is characterized in that it comprises a carbon dioxide laser.
  • the laser generating unit may further include a shutter device, wherein the control unit controls the laser to be continuously generated in the carbon dioxide laser, and controls the operation of the shutter device to generate a laser pulse corresponding to the optical pattern. It is characterized by.
  • the shutter device is characterized in that it comprises an acoustic optical modulator (AOM).
  • AOM acoustic optical modulator
  • the laser light source may be a laser light source for generating a laser having a wavelength substantially between 10 ⁇ m and 20 ⁇ m (acrylic absorption wavelength band).
  • the cooling device is characterized in that for adjusting the temperature of the laser light source within the range of ⁇ 0.1 °C of the predetermined temperature.
  • the cooling device controls the temperature through at least two or more steps to adjust the temperature in the range of ⁇ 0.1 °C of the predetermined temperature, characterized in that the width of the temperature control is narrowed as each step passes.
  • the cooling device is a cooling device using a cooling water, and comprises a temperature sensor for sensing the temperature of the cooling water in the main cooling unit, the auxiliary cooling unit and the main cooling unit to maintain a constant temperature of the cooling water,
  • the auxiliary cooling unit is provided at the inlet or the outlet of the main cooling unit, and heats or cools the cooling water flowing in or out of the main cooling unit based on the temperature of the cooling water detected by the temperature sensor.
  • the rotatable optical unit may include a mirror unit for changing a traveling direction of the laser generated by the laser generation unit, a laser header unit for irradiating a light guide plate to a laser input through the mirror unit, and the laser header unit may be fixedly installed. And a wheel frame and an actuator for rotating the wheel frame at a constant speed.
  • the mirror unit may include a first mirror installed at an upper portion of the wheel frame to change a traveling direction of the laser generated by the laser generation unit, and a laser installed at a central portion of the wheel frame reflected from the total reflection mirror to a laser header unit. And a second mirror for reflecting.
  • the first mirror is fixed to the upper portion of the wheel frame
  • the laser header portion and the second mirror is at least two pairs are installed in the wheel frame, each second mirror in the fixed first mirror And reflects the reflected laser back to the mating laser header portion.
  • the first embodiment of the light guide plate processing method using the laser processing apparatus of the present invention in order to achieve the above object in the light guide plate processing method for processing an optical pattern on the light guide plate using a laser processing apparatus, Transferring the light guide plate provided on the transfer unit of the laser processing apparatus for transferring the light guide plate at a predetermined speed; And processing an optical pattern on the light guide plate being conveyed in a concentric curve form by rotating the rotating optical unit of the laser processing apparatus at a constant speed on the light guide plate being transferred at a predetermined speed in the transferring step.
  • the second embodiment of the light guide plate processing method using the laser processing apparatus of the present invention in order to achieve the above object in the light guide plate processing method for processing an optical pattern on the light guide plate using a laser processing apparatus, Installing the light guide plate on a stage of the laser processing apparatus for processing; Transferring a rotating optical unit of the laser processing apparatus, which rotates at a constant speed to an upper portion of the light guide plate installed at the stage, at a predetermined speed; Processing the optical pattern on the light guide plate provided on the stage by rotating the rotating optical unit at a predetermined speed at a constant speed in the form of concentric curves.
  • the present invention having the above configuration has the effect of significantly improving the processing speed since the processing of the optical pattern is made without changing the acceleration and deceleration of the optical unit.
  • the use of the shutter device has the effect of supplying a laser that is uniform and optimized for processing even in fast processing.
  • step-by-step cooling device to maintain a constant temperature of the laser light source has the effect of generating a uniform and high-quality laser.
  • FIG. 1 is a schematic block diagram of a first embodiment of a laser processing apparatus according to the present invention.
  • FIG. 2 is a schematic block diagram of a second embodiment of a laser processing apparatus according to the present invention.
  • FIG. 3 is a front view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention
  • FIG. 4 is a plan view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention
  • FIG. 5 is a front view showing the overall configuration of a laser processing apparatus according to a second embodiment of the present invention.
  • FIG. 6 is a block diagram showing a schematic configuration of a cooling unit according to an embodiment of the present invention.
  • FIG. 7 is a flowchart illustrating a first embodiment of a light guide plate processing method using a laser processing apparatus according to the present invention
  • FIG. 8 is a flowchart illustrating a first embodiment of a light guide plate processing method using a laser processing apparatus according to the present invention
  • FIG. 9 is a graph showing absorption versus wavelength of a laser of an acrylic light guide plate.
  • a first embodiment of a light guide plate processing apparatus using a laser of the present invention the laser processing apparatus for processing an optical pattern on the light guide plate using a laser, comprising: a laser generating unit for generating a laser for processing the optical pattern; A transfer unit for transferring the light guide plate on which the optical pattern is to be processed; A rotating optical unit for irradiating the laser generated by the laser generating unit to the light guide plate being transferred; It includes a control unit for controlling the laser generating unit, the transfer unit and the rotating optical unit for processing the optical pattern.
  • a second embodiment of a light guide plate processing apparatus using a laser of the present invention is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, comprising: a laser generating unit for generating a laser for processing the optical pattern; A stage in which a light guide plate on which the optical pattern is to be processed is located; A rotating optical unit for irradiating the light guide plate with a laser generated by the laser generating unit; A rotating optical unit moving unit for moving the rotating optical unit at a predetermined speed for processing the optical pattern; And a control unit for controlling the laser generating unit, the rotating optical unit, and the rotating optical unit moving unit to process the optical pattern.
  • Figure 1 is a schematic block diagram of a first embodiment of a laser processing apparatus according to the present invention
  • Figure 3 is a front view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention
  • Figure 4 is a present invention 6 is a plan view showing the overall configuration of the laser processing apparatus according to the first embodiment of the present invention
  • Figure 6 is a block diagram showing a schematic configuration of a cooling unit according to an embodiment of the present invention.
  • the first embodiment of the light guide plate processing apparatus using a laser according to the present invention is a laser generating unit 100 for processing the optical pattern (A) and the transfer unit 300 and the laser generating unit 100 for transferring the light guide plate at a predetermined speed It includes a rotating optical unit 200 for irradiating the laser to process the optical pattern on the light guide plate for transferring the laser generated in the) and the control unit 400 for controlling each unit.
  • the laser generating unit 100 includes a laser light source 110 for generating a laser, a shutter device 120 for converting a laser generated from the laser light source 110 into a laser pulse, and a cooling device 130 for cooling the laser. Is done.
  • a beam equalizer 150 may be used at the rear end of the shutter device 120 to stabilize the power of the laser and to keep the output constant.
  • the laser light source 110 is a light source for generating a laser for processing the optical pattern A on the light guide plate 1, and the laser processing apparatus uses dots of the light corresponding to the optical pattern on the light guide plate 1 using the generated laser energy. (Including all shapes that form an optical pattern such as a circle and a rectangle) are formed.
  • FIG. 9 is a graph of reflectance versus wavelength of a laser of an acrylic resin used as the light guide plate 1, and it can be seen that only a specific wavelength laser has an excellent absorption rate for an acrylic resin. Therefore, in order to process the optical pattern on the light guide plate 1, since the laser must be absorbed in acryl, it is suitable to process the optical pattern uniformly and efficiently using light having a high absorption band.
  • CO2 laser is a gas laser using transition between vibration levels of carbon dioxide. It is suitable for light guide plate processing using laser because it has high absorption of acrylic resin used as material of light guide plate and can be easily oscillated using RF signal.
  • Laser light source In order to form an optical pattern, a laser having a pulse shape corresponding to the pattern needs to be irradiated to the light guide plate 1, so that an RF signal is applied to a carbon dioxide laser light source to generate a laser pulse corresponding to the optical pattern. The period of the RF signal is adjusted according to the optical pattern to be processed.
  • the dots forming the optical pattern have to be uniform in size in order to distribute the light evenly throughout the LCD, and the dot forming the optical pattern is not processed unless the energy of the laser becomes more than a predetermined size.
  • the dot size of the optical pattern formed on the light guide plate becomes smaller.
  • the width of the laser pulse must be small.
  • not only a laser pulse having a uniform size and sufficient energy for processing a light guide plate should be generated, but also a short cycle of each pulse.
  • the carbon dioxide laser shows a waveform in which the energy of the laser generated when the laser is generated or stopped by the RF signal increases exponentially and decreases exponentially. Therefore, when a laser pulse is generated by a certain period of RF signal, the energy waveform of the laser does not have the shape of a square wave but is exponentially increased and then exponentially decreased.
  • the RF signal period is shortened to process at speeds that are acceptable.
  • the laser oscillated by the carbon dioxide laser shows a waveform in which the energy decreases before reaching the processing energy level, so that the dot is not processed on the light guide plate or the laser below the processing level continues to be used. To cause thermal deformation of the light guide plate.
  • the size of the processed dot is not constant because the energy of the oscillated laser is not constant.
  • the present invention can control the laser light source 110 to generate the laser continuously and to provide a shutter device 120 to block or pass through the laser output continuously to generate a pulse of uniform size for each pulse, Not only does the laser pulse above the processing level energy be generated, but there is an effect that the waveform of the laser pulse can be a square wave. That is, instead of turning on / off the carbon dioxide laser to generate the laser pulse, the carbon dioxide laser is controlled to be blocked / passed by using the shutter device 120 while continuing to generate the laser pulse to make a laser pulse suitable for processing. This enables the generation of laser pulses with high quality and uniform energy even at high processing speeds to meet mass productivity.
  • the minimum on / off time is 150 ⁇ s, but if the processing speed is 4m / s, dots below 0.6mm cannot be processed.
  • the shutter device 120 can be turned on / off by about 1 ⁇ s, which is much shorter than the on / off time of the laser, so that the laser pulse can be generated even when processing at a processing speed suitable for mass production.
  • the optical pattern processed on the light guide plate 1 is uniformly formed and only the laser of the processing level or more is irradiated, the optical pattern can be processed while minimizing the thermal deformation of the light guide plate 1 and is also suitable for mass production. There is an effect that can supply a high quality laser suitable for processing even at the processing speed.
  • the shutter device 120 is a device for generating a laser pulse by blocking and passing the laser generated continuously.
  • the shutter device 120 may be used as long as the device can block or pass the laser for a very short time.
  • AOM Acoustic Optical Modulator
  • the internal refractive index is changed by the RF signal, and accordingly, the refractive angle of the laser is changed. Therefore, the laser beam is not irradiated to the light guide plate 1 by being off the path incident to the rotatable optical unit 200.
  • the changed path may be provided with a dummy member to absorb the energy of the laser.
  • the laser light source 110 oscillates the laser at a predetermined temperature or more, a lot of heat is generated.
  • the laser light source 110 is sensitive to temperature, so if the temperature is not constant, the output of the laser is not constant, and thus the size of the processed dot is not uniformly formed. Therefore, in order to maintain a constant output of energy, the cooling apparatus 130 of the present invention maintains a constant temperature of the laser light source 110.
  • the light guide plate becomes thinner and thinner in accordance with the recent slimming trend, and thus, the size of the dot forming the optical pattern must be formed very small.
  • the dot size must be uniform for uniform light distribution, it is very important to keep the uniformity of the laser output constant.
  • conventional cooling apparatus has a deviation of about several degrees Celsius, which is not enough to uniformly form small dots.
  • the output fluctuations of the laser light source are typically formed in the range of 3% of the output (100W ⁇ 3W for CO2 laser), but in order to form very small dots (approximately 40 ⁇ m to 300 ⁇ m),
  • the temperature is preferably maintained within the range of ⁇ 0.1 °C at a predetermined temperature.
  • the present invention controls the temperature through two or more steps. That is, in order to maintain the laser light source 110 at a predetermined temperature, the temperature is maintained in a range of ⁇ 0.2 ° C. in one step of temperature control and the temperature adjusted in the first step is detected and the difference is adjusted in two steps. If the temperature is adjusted through three or more steps, step 3 detects the temperature adjusted in step 2 and adjusts the difference in step 3.
  • the cooling device 130 maintains the temperature by using the cooling water, but the water is large and the temperature does not change easily. The reality is that it is difficult to control the temperature at once and it is more difficult to match the accuracy. Therefore, by providing a plurality of cooling unit and through this step by adjusting the temperature of the cooling water it is possible to adjust the temperature to the desired precision.
  • the cooling unit 130 in two stages, that is, the main cooling unit 132 and the auxiliary cooling unit 134 by using an example to maintain a constant temperature of the laser light source 110
  • the control temperature of the main cooling part 132 is 7.7. Set to ° C. In this case, even if the temperature deviation in the specification is taken into consideration, the maintenance temperature of the laser light source 110 does not exceed 8 ° C.
  • the temperature sensor 138 is provided at the outlet of the main cooling unit 132 and the main cooling unit 132 exits.
  • auxiliary cooling unit 134 Compared with the temperature of the cooling water and the target holding temperature of 8 °C and the difference is supplemented by the auxiliary cooling unit 134.
  • Auxiliary cooling unit is not a large temperature control capacity, but it is preferable to use a cooling device capable of temperature control more precisely, in the illustrative example, the auxiliary cooling unit 134 has only the function of heating, but to perform the function of cooling on the contrary. It may be possible to perform both heating and cooling.
  • the set temperature of the main cooling unit 132 is changed according to the function of the auxiliary cooling unit 134, the temperature of the laser light source 110 can be maintained at an accuracy of ⁇ 0.1 ° C. Cooling water having a precision of ⁇ 0.1 ° C.
  • Cooling of the light source in the cooling chamber 136 uses the principle of forming a flow path through which cooling water flows between the electrode plates of the laser light source 110, cooling the electrode or providing a heat sink, and allowing the cooling water to flow through the heat sink. It can be cooled while moving around the various devices provided in the laser light source 110.
  • the 45-rotating optical unit 200 irradiates the light guide plate 1 that is being transported according to the optical pattern with the laser generated by the laser generating unit 100.
  • the rotatable optical unit 200 receives the lasers incident from the mirrors 240 and 250 and the mirrors 240 and 250 for changing the advancing direction of the laser to irradiate the lasers to the light guide plate 1 being transferred. It comprises a laser header portion 220, 230 to irradiate and the wheel frame 260 is fixed to the laser header portion 220, 230 and the actuator 210 for rotating the wheel frame 260 at constant speed.
  • the mirrors 240 and 250 are installed on the upper part of the wheel frame 260 to reflect the laser generated by the laser generating unit 100 by 90 degrees and the laser reflected from the first mirror 240. It includes a second mirror 250 that reflects to each of the laser header portion (220, 230).
  • the first mirror 240 is fixedly installed in accordance with the direction of the laser output from the laser generating unit 100 irrespective of the rotation of the wheel frame 260.
  • the second mirror 250 is fixedly installed on the wheel frame 260, but is provided at a position opposite to the laser header parts 220 and 230, and rotates with the rotation of the wheel frame 260.
  • the laser reflected from the first mirror 240 is reflected to each of the laser header parts 220 and 230 for a predetermined period. That is, the second mirror 250 is installed in the same number as the laser header portion and is provided to be paired with each laser header portion so that the laser incident from the first mirror 240 is incident on each laser header portion. Therefore, as the wheel frame 260 rotates, only the second mirror 250 at the position opposite to the first mirror 240 injects the laser reflected from the first mirror 240 into the corresponding laser header part.
  • the first mirror or the second mirror may be omitted, but the laser uniformity and trade-off relationship.
  • the laser header unit 220 includes first and second reflecting mirrors 222 and 232 and first and second focusing lenses 224 and 234 to irradiate the laser reflected from the second mirror 250 to the light guide plate 1. )
  • the laser header unit 220 is preferably installed at least two or more depending on the configuration, it is shown in the figure that the four laser header unit is installed as an example.
  • the transfer unit 300 may be, for example, a constant speed conveyor system as a device for transferring the light guide plate at a predetermined speed.
  • the transfer unit 300 is coupled to the rotating optical unit 200 to form a curved optical pattern B on the light guide plate 1.
  • the optical pattern will be formed in a form in which the radius of curvature increases toward the rotation direction instead of a perfect circular pattern.
  • FIG. 2 is a schematic block diagram of a second embodiment of a laser processing apparatus according to the present invention
  • FIG. 5 is a front view showing the overall configuration of the laser processing apparatus according to the second embodiment of the present invention.
  • a second embodiment of the present invention will be described with reference to FIGS. 2 and 5, but a description overlapping with the first embodiment will be omitted.
  • the rotating optical unit 200 is transferred at a predetermined speed by the rotating optical unit moving unit 500 while the light guide plate is placed on the stage without movement.
  • the rotating optical unit 200 being transferred rotates at a constant speed for processing the optical pattern.
  • the optical pattern of the same shape as in the first embodiment can be processed even when the rotating optical unit 200 is processed while moving in the constant speed while the light guide plate 1 is fixed.
  • the light guide plate processing apparatus using the laser of the present invention can completely eliminate the time loss due to acceleration and deceleration and direction change at both ends as the optical apparatus of the conventional laser processing apparatus reciprocates vertically or horizontally and reciprocates. As a result, the processing time can be maintained almost similar to that of injection molding.
  • a first embodiment of a light guide plate processing method using the laser processing apparatus of the present invention will first convey the light guide plate provided on the transfer unit 300 at a constant speed for processing an optical pattern. While rotating the light guide plate at a constant speed, the rotating optical unit 200 processes the optical pattern on the light guide plate 1 while rotating at a constant speed. (S110) When the automated system is used, the optical guide plate is continuously transported continuously with high optical efficiency. The pattern can be processed.
  • a second embodiment of the light guiding plate processing method using the laser processing apparatus of the present invention is provided with a light guiding plate on which an optical pattern is to be processed (S200).
  • the rotating optical unit 200 is a rotating type. Constant speed linear motion across the light guide plate through the optical unit moving unit 500, and at the same time the optical unit 200 rotates at a constant speed to process the optical pattern.
  • S210, S220 Laser processing of the present invention through such processing The same optical pattern as in the first embodiment of the light guide plate processing method using the device can be processed.
  • the present invention has a feature capable of quickly and accurately processing the light guide plate, thereby minimizing defect rate and improving mass productivity.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to an apparatus and method for processing a light guide plate using a laser, and more particularly, to an apparatus and method for processing a light guide plate using a laser, which can significantly reduce processing time without acceleration/deceleration or changing of direction during processing of an optical pattern and can generate a laser optimized for processing the light guide plate using a cooling device and a shutter device which are adjusted by levels. The apparatus for processing a light guide plate using a laser according to the present invention relates to a laser processing apparatus for forming an optical pattern on a light guide plate using a laser, and comprises: a laser generating unit which generates the laser for forming the optical pattern; a transporting unit which transports the light guide plate on which the optical pattern is to be formed; a circulating optical unit which irradiates the laser generated from the laser generating unit onto the light guide plate being transported;and a control unit which controls the laser generating unit, the transporting unit, and the circulating optical unit for forming the optical pattern. The apparatus for processing a light guide plate using a laser according to the present invention can rapidly and accurately process a large-size light guide plate by forming an optical pattern using the circulating optical unit which does not require acceleration/deceleration or changing of direction, and can generate a uniform laser optimized for processing the light guide plate, thereby significantly improving the quality of processing and also significantly reducing a rate of defects.

Description

레이저를 이용한 도광판 가공장치 및 그 가공방법LGP processing machine using laser and its processing method
본 발명은 레이저를 이용한 도광판 가공장치에 대한 것으로 백라이트 유닛에 사용되는 도광판 상에 레이저를 이용하여 광학패턴을 가공하는 장치 및 도광판에 광학패턴을 가공하는 방법에 대한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light guide plate processing apparatus using a laser, and a device for processing an optical pattern using a laser on a light guide plate used in a backlight unit, and a method of processing an optical pattern on a light guide plate.
최근 디스플레이 장치로 각광 받고 있는 LCD(Liquid Crystal Display)는 각 화소를 제어하기 위한 전극이 형성된 기판 사이에 액정을 주입하고 화상정보를 표시하기 위해 기판 사이에 전계를 형성하여 형성된 전계에 의해 액정의 배열상태가 바뀌고 그에 따른 투과도 차를 이용하여 원하는 화상정보를 표시한다.BACKGROUND ART Liquid crystal displays (LCDs), which are recently attracting attention as display devices, inject liquid crystals between substrates on which electrodes for controlling each pixel are formed, and form an electric field between the substrates to display image information. The state is changed and the desired image information is displayed using the transmittance difference accordingly.
LCD와 같은 장치는 PDP(Plasma Display Pannel)과는 달리 액정 자체가 빛을 내는 것이 아니라 빛의 통과 여부만이 달라지기 때문에 화상정보를 표시하기 위해서는 광원장치가 별도로 마련되어야만 한다.Unlike a plasma display pannel (PDP), an LCD, such as a liquid crystal itself, does not emit light, but only light passes. Therefore, a light source device must be separately provided to display image information.
LCD 등에 마련되는 광원장치를 통상 백라이트 유닛이라고 부르며 이 백라이트 유닛에는 빛을 발생하는 음극선관, LED, 형광램프 등의 광원과 광원에서 발생된 빛을 고르게 분산시키는 도광판, 프리즘 시트 등이 포함된다.A light source device provided in an LCD or the like is commonly referred to as a backlight unit. The backlight unit includes a light source such as a cathode ray tube generating light, an LED, a fluorescent lamp, and a light guide plate and a prism sheet to evenly distribute the light generated from the light source.
LCD 등에 사용되는 백라이트 유닛에서 광원은 LCD의 끝단에 위치하는 것이 일반적이고 끝단에서 발생하는 빛을 고르게 분산시키기 위해 도광판을 포함하는 여러 개의 시트가 필요하게 된다.In a backlight unit used in an LCD or the like, the light source is generally located at the end of the LCD, and several sheets including the light guide plate are required to evenly distribute the light generated at the end.
이중 도광판은 통상 아크릴 수지로 이루어져 한 쪽면에 음각 또는 양각으로 일정한 광학패턴이 형성된다. 이러한 광학패턴은 광원에서 발생된 빛이 전반사에 의해 전파되는 중 도광판 밖으로 나오도록 하는 역할 즉, 특정위치에서 전파되는 빛의 입사각이 임계각 이하가 되도록 하여 한 쪽에 마련된 광원에서 발생된 빛을 LCD 전체로 고르게 전달하는 역할을 수행한다.The double light guide plate is usually made of an acrylic resin to form a constant optical pattern in an intaglio or embossed on one side. The optical pattern plays a role that the light generated from the light source comes out of the light guide plate during propagation by total reflection, that is, the incident angle of the light propagated at a specific position is less than the critical angle so that the light generated from the light source provided on one side is transferred to the whole LCD Serve evenly.
종래 광학패턴이 형성된 도광판은 광학패턴이 형성된 금형을 통한 사출성형을 이용하여 제조하였으나 10인치 이상의 대형 사이즈에 적용되는 도광판을 제조하기가 매우 어렵고, 최근 디스플레이장치가 슬림화되는 추세에 따라 도광판의 두께도 점점 얇아지게 되어 사출성형을 통해서는 일정 두께 이하의 도광판을 제조할 수 없는 문제점이 있다.Conventionally, the light guide plate formed with the optical pattern is manufactured by injection molding through a mold in which the optical pattern is formed, but it is very difficult to manufacture a light guide plate applied to a large size of 10 inches or more. There is a problem in that the light guide plate of a predetermined thickness or less through the injection molding is becoming thinner.
또한, 사출성형의 경우 도광판을 제조하기 위해서는 고가의 금형이 반드시 필요함에 따라 최근 소량 다품종화의 시장 상황에 대응하기가 곤란한 문제점이 있다.In addition, in the case of injection molding, an expensive mold is absolutely required to manufacture a light guide plate, and thus, it is difficult to cope with the market situation of a small quantity multi-variate.
또한, 종래의 레이저를 이용한 도광판 가공장치의 경우 레이저의 품질이 균일하지 않아 불량률이 높을 뿐만 아니라 레이저를 조사하는 광학장치의 비효율적으로 제어되어 도광판의 가공시간이 사출성형에 비해 매우 길기 때문에 제조원가가 높아지고 경제성이 떨어지는 문제점이 있다.In addition, the light guide plate processing apparatus using a conventional laser not only has a high quality of the laser because the quality of the laser is not uniform, but also inefficiently controlled by the optical device that irradiates the laser, so that the manufacturing time of the light guide plate is much longer than that of the injection molding. There is a problem of low economic efficiency.
본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 본 발명의 목적은 광학장치의 가감속, 방향전환 없이 광학패턴을 가공하여 가공속도를 높이고, 단계별 냉각장치를 이용하여 균일한 레이저를 발생시켜 도광판 가공 퀄러티를 향상시키고, 셔터장치를 통해 균일하면서도 도광판 가공에 최적화된 에너지를 가진 레이저 펄스를 발생시켜 도광판에 가공되는 광학패턴의 질을 향상시키고 빠른 가공이 가능한 레이저를 이용한 도광판 가공장치 및 그 가공방법을 제공함에 있다.The present invention is to solve the above problems, an object of the present invention is to increase the processing speed by processing the optical pattern without accelerating, decelerating, reorientation of the optical device, to generate a uniform laser using a step-by-step cooling device light guide plate Light guide plate processing device and processing method using laser which improves the quality of processing and generates laser pulse with energy optimized for light guide plate processing through the shutter device to improve the quality of optical pattern processed on the light guide plate and enables fast processing In providing.
상기와 같은 목적을 달성하기 위해 본 발명의 레이저를 이용한 도광판 가공장치의 제1실시예는 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서, 상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛; 상기 광학패턴이 가공될 도광판을 이송하는 이송유닛; 상기 레이저 발생유닛에서 발생된 레이저를 상기 이송 중인 도광판에 조사하는 회전형 광학유닛; 상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 이송유닛 및 회전형 광학유닛을 제어하는 제어유닛을 포함한다.In order to achieve the above object, a first embodiment of a light guide plate processing apparatus using a laser of the present invention is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, wherein a laser for processing the optical pattern is generated. A laser generating unit to make; A transfer unit for transferring the light guide plate on which the optical pattern is to be processed; A rotating optical unit for irradiating the laser generated by the laser generating unit to the light guide plate being transferred; It includes a control unit for controlling the laser generating unit, the transfer unit and the rotating optical unit for processing the optical pattern.
또한, 상기와 같은 목적을 달성하기 위해 본 발명의 레이저를 이용한 도광판 가공장치의 제2실시예는 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서, 상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛; 상기 광학패턴이 가공될 도광판이 위치하는 스테이지; 상기 레이저 발생유닛에서 발생된 레이저를 상기 도광판에 조사하는 회전형 광학유닛; 상기 회전형 광학유닛을 상기 광학패턴의 가공을 위해 소정속도로 이동시키는 회전형 광학유닛 이동부; 상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 회전형 광학유닛 및 회전형 광학유닛 이동부를 제어하는 제어유닛을 포함한다.In addition, a second embodiment of a light guide plate processing apparatus using a laser of the present invention to achieve the above object is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, the laser for processing the optical pattern Laser generating unit for generating a; A stage in which a light guide plate on which the optical pattern is to be processed is located; A rotating optical unit for irradiating the light guide plate with a laser generated by the laser generating unit; A rotating optical unit moving unit for moving the rotating optical unit at a predetermined speed for processing the optical pattern; And a control unit for controlling the laser generating unit, the rotating optical unit, and the rotating optical unit moving unit to process the optical pattern.
또한, 상기 레이저 발생유닛은 레이저 광원과, 상기 레이저 광원을 소정 온도로 유지하는 냉각장치를 포함하여 이루어지는 것을 특징으로 한다.In addition, the laser generation unit is characterized in that it comprises a laser light source, and a cooling device for maintaining the laser light source at a predetermined temperature.
또한, 상기 레이저 광원은 이산화탄소 레이저를 포함하여 이루어지는 것을 특징으로 한다.In addition, the laser light source is characterized in that it comprises a carbon dioxide laser.
또한, 상기 레이저 발생유닛은 셔터장치를 더 포함하고, 상기 제어유닛은 상기 이산화탄소 레이저에서 레이저가 연속적으로 발생되도록 제어하며, 상기 광학패턴에 대응하는 레이저 펄스가 발생하도록 상기 셔터장치의 작동을 제어하는 것을 특징으로 한다.The laser generating unit may further include a shutter device, wherein the control unit controls the laser to be continuously generated in the carbon dioxide laser, and controls the operation of the shutter device to generate a laser pulse corresponding to the optical pattern. It is characterized by.
또한, 상기 셔터장치는 어쿠스틱 광학 모듈레이터(AOM : Acoustic Optical Modulator)를 포함하여 이루어지는 것을 특징으로 한다.In addition, the shutter device is characterized in that it comprises an acoustic optical modulator (AOM).
또한, 상기 레이저 광원은 실질적으로 파장이 10㎛에서 20㎛(아크릴 흡수파장대) 사이인 레이저를 발생시키는 레이저 광원인 것을 특징으로 한다.The laser light source may be a laser light source for generating a laser having a wavelength substantially between 10 μm and 20 μm (acrylic absorption wavelength band).
또한, 상기 냉각장치는 상기 레이저 광원의 온도를 상기 소정온도의 ±0.1℃의 범위 내로 조절하는 것을 특징으로 한다.In addition, the cooling device is characterized in that for adjusting the temperature of the laser light source within the range of ± 0.1 ℃ of the predetermined temperature.
또한, 상기 냉각장치는 상기 소정온도의 ±0.1℃의 범위로 온도를 조절하기 위해 적어도 2 이상의 단계를 거쳐 온도를 조절하되, 각 단계를 거칠수록 온도 조절의 폭이 좁아지는 것을 특징으로 한다.In addition, the cooling device controls the temperature through at least two or more steps to adjust the temperature in the range of ± 0.1 ℃ of the predetermined temperature, characterized in that the width of the temperature control is narrowed as each step passes.
또한, 상기 냉각장치는 냉각수를 이용하는 냉각장치이고, 상기 냉각수의 온도를 일정하게 유지하기 위해 주냉각부와 보조냉각부와 주냉각부 내의 냉각수의 온도를 센싱하는 온도센서를 포함하여 이루어지며, 상기 보조냉각부는 상기 주냉각부의 입구 또는 출구에 마련되어 상기 온도센서에서 감지되는 냉각수의 온도에 기초하여 상기 주냉각부에 유입 또는 유출되는 냉각수를 가열 또는 냉각시키는 것을 특징으로 한다.In addition, the cooling device is a cooling device using a cooling water, and comprises a temperature sensor for sensing the temperature of the cooling water in the main cooling unit, the auxiliary cooling unit and the main cooling unit to maintain a constant temperature of the cooling water, The auxiliary cooling unit is provided at the inlet or the outlet of the main cooling unit, and heats or cools the cooling water flowing in or out of the main cooling unit based on the temperature of the cooling water detected by the temperature sensor.
또한, 상기 회전형 광학유닛은 상기 레이저 발생유닛에서 발생된 레이저의 진행방향을 바꾸기 위한 미러부와, 상기 미러부를 통해 입력되는 레이저를 도광판에 조사하는 레이저 헤더부와, 상기 레이저 헤더부가 고정 설치되는 휠프레임과, 상기 휠프레임을 정속회전시키는 엑츄에이터를 포함한다.The rotatable optical unit may include a mirror unit for changing a traveling direction of the laser generated by the laser generation unit, a laser header unit for irradiating a light guide plate to a laser input through the mirror unit, and the laser header unit may be fixedly installed. And a wheel frame and an actuator for rotating the wheel frame at a constant speed.
또한, 상기 미러부는 상기 휠프레임의 상부에 설치되어 상기 레이저 발생유닛에서 발생된 레이저의 진행방향을 바꾸는 제1미러와, 상기 휠프레임의 중앙부에 설치되어 상기 전반사 미러에서 반사된 레이저를 레이저 헤더부로 반사하는 제2미러를 포함하여 이루어지는 것을 특징으로 한다.The mirror unit may include a first mirror installed at an upper portion of the wheel frame to change a traveling direction of the laser generated by the laser generation unit, and a laser installed at a central portion of the wheel frame reflected from the total reflection mirror to a laser header unit. And a second mirror for reflecting.
또한, 상기 제1미러는 휠프레임의 상부에 고정설치되고, 상기 레이저 헤더부 및 제2미러는 적어도 2이상 짝을 이루어 상기 휠프레임에 설치되고, 각 제2미러는 상기 고정설치된 제1미러에서 반사된 레이저를 짝을 이루는 레이저 헤더부로 반사하는 것을 특징으로 한다.In addition, the first mirror is fixed to the upper portion of the wheel frame, the laser header portion and the second mirror is at least two pairs are installed in the wheel frame, each second mirror in the fixed first mirror And reflects the reflected laser back to the mating laser header portion.
또한, 상기와 같은 목적을 달성하기 위해 본 발명의 레이저 가공장치를 이용하는 도광판 가공방법의 제1실시예는 레이저 가공장치를 이용하여 도광판에 광학패턴을 가공하는 도광판 가공방법에 있어서, 상기 광학패턴의 가공을 위해 상기 도광판을 이송하는 상기 레이저 가공장치의 이송유닛 상에 마련된 도광판을 소정 속도로 이송하는 단계; 상기 이송단계에서 소정 속도로 이송되는 도광판에 상기 레이저 가공장치의 회전형 광학유닛을 정속 회전시켜 동심의 곡선 형태로 이송 중인 도광판에 광학패턴을 가공하는 단계를 포함한다.In addition, the first embodiment of the light guide plate processing method using the laser processing apparatus of the present invention in order to achieve the above object in the light guide plate processing method for processing an optical pattern on the light guide plate using a laser processing apparatus, Transferring the light guide plate provided on the transfer unit of the laser processing apparatus for transferring the light guide plate at a predetermined speed; And processing an optical pattern on the light guide plate being conveyed in a concentric curve form by rotating the rotating optical unit of the laser processing apparatus at a constant speed on the light guide plate being transferred at a predetermined speed in the transferring step.
또한, 상기와 같은 목적을 달성하기 위해 본 발명의 레이저 가공장치를 이용하는 도광판 가공방법의 제2실시예는 레이저 가공장치를 이용하여 도광판에 광학패턴을 가공하는 도광판 가공방법에 있어서, 상기 광학패턴의 가공을 위해 상기 도광판을 상기 레이저 가공장치의 스테이지에 설치하는 단계; 상기 스테이지에 설치된 도광판의 상부로 정속 회전하는 상기 레이저 가공장치의 회전형 광학유닛을 소정 속도로 이송하는 단계; 상기 소정 속도로 이송되는 상기 회전형 광학유닛을 정속 회전시켜 동심의 곡선 형태로 상기 스테이지에 마련된 도광판에 광학패턴을 가공하는 단계를 포함한다.In addition, the second embodiment of the light guide plate processing method using the laser processing apparatus of the present invention in order to achieve the above object in the light guide plate processing method for processing an optical pattern on the light guide plate using a laser processing apparatus, Installing the light guide plate on a stage of the laser processing apparatus for processing; Transferring a rotating optical unit of the laser processing apparatus, which rotates at a constant speed to an upper portion of the light guide plate installed at the stage, at a predetermined speed; Processing the optical pattern on the light guide plate provided on the stage by rotating the rotating optical unit at a predetermined speed at a constant speed in the form of concentric curves.
이상과 같은 구성의 본 발명은 광학유닛의 가감속, 방향전환없이 광학패턴의 가공이 이루어지므로 가공속도를 현저히 향상시킬 수 있는 효과가 있다.The present invention having the above configuration has the effect of significantly improving the processing speed since the processing of the optical pattern is made without changing the acceleration and deceleration of the optical unit.
또한, 셔터장치를 이용하여 레이저 펄스를 발생시킴에 따라 도광판 가공에 최적의 레이저를 균일하게 발생시킬 수 있는 효과가 있다.In addition, as the laser pulse is generated by using the shutter device, there is an effect of uniformly generating a laser optimal for light guide plate processing.
또한, 셔터장치를 이용함에 따라 빠른 가공에도 균일하고 가공에 최적화된 레이저를 공급할 수 있는 효과가 있다.In addition, the use of the shutter device has the effect of supplying a laser that is uniform and optimized for processing even in fast processing.
또한, 단계별 냉각장치를 이용하여 레이저 광원의 온도를 일정하게 유지함에 따라 균일하고도 고품질의 레이저를 발생시킬 수 있는 효과가 있다.In addition, by using the step-by-step cooling device to maintain a constant temperature of the laser light source has the effect of generating a uniform and high-quality laser.
도 1은 본 발명에 따른 레이저 가공장치의 제1실시에의 개략적인 블록도이고,1 is a schematic block diagram of a first embodiment of a laser processing apparatus according to the present invention;
도 2는 본 발명에 따른 레이저 가공장치의 제2실시에의 개략적인 블록도이고,2 is a schematic block diagram of a second embodiment of a laser processing apparatus according to the present invention;
도 3은 본 발명의 제1실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 정면도이고,3 is a front view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention,
도 4는 본 발명의 제1실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 평면도이고,4 is a plan view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention,
도 5는 본 발명의 제2실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 정면도이고,5 is a front view showing the overall configuration of a laser processing apparatus according to a second embodiment of the present invention,
도 6은 본 발명의 일 실시예에 따른 냉각유닛의 개략적인 구성을 나타내는 블록도이고,6 is a block diagram showing a schematic configuration of a cooling unit according to an embodiment of the present invention,
도 7은 본 발명에 따른 레이저 가공장치를 이용한 도광판 가공방법의 제1실시예를 나타내는 흐름도이고,7 is a flowchart illustrating a first embodiment of a light guide plate processing method using a laser processing apparatus according to the present invention;
도 8은 본 발명에 따른 레이저 가공장치를 이용한 도광판 가공방법의 제1실시예를 나타내는 흐름도이고,8 is a flowchart illustrating a first embodiment of a light guide plate processing method using a laser processing apparatus according to the present invention;
도 9는 아크릴 재질의 도광판에 대한 레이저의 파장 대비 흡수도를 나타내는 그래프이다.FIG. 9 is a graph showing absorption versus wavelength of a laser of an acrylic light guide plate. FIG.
본 발명의 레이저를 이용한 도광판 가공장치의 제1실시예는 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서, 상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛; 상기 광학패턴이 가공될 도광판을 이송하는 이송유닛; 상기 레이저 발생유닛에서 발생된 레이저를 상기 이송 중인 도광판에 조사하는 회전형 광학유닛; 상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 이송유닛 및 회전형 광학유닛을 제어하는 제어유닛을 포함한다.A first embodiment of a light guide plate processing apparatus using a laser of the present invention, the laser processing apparatus for processing an optical pattern on the light guide plate using a laser, comprising: a laser generating unit for generating a laser for processing the optical pattern; A transfer unit for transferring the light guide plate on which the optical pattern is to be processed; A rotating optical unit for irradiating the laser generated by the laser generating unit to the light guide plate being transferred; It includes a control unit for controlling the laser generating unit, the transfer unit and the rotating optical unit for processing the optical pattern.
또한, 본 발명의 레이저를 이용한 도광판 가공장치의 제2실시예는 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서, 상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛; 상기 광학패턴이 가공될 도광판이 위치하는 스테이지; 상기 레이저 발생유닛에서 발생된 레이저를 상기 도광판에 조사하는 회전형 광학유닛; 상기 회전형 광학유닛을 상기 광학패턴의 가공을 위해 소정속도로 이동시키는 회전형 광학유닛 이동부; 상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 회전형 광학유닛 및 회전형 광학유닛 이동부를 제어하는 제어유닛을 포함한다.In addition, a second embodiment of a light guide plate processing apparatus using a laser of the present invention is a laser processing apparatus for processing an optical pattern on a light guide plate using a laser, comprising: a laser generating unit for generating a laser for processing the optical pattern; A stage in which a light guide plate on which the optical pattern is to be processed is located; A rotating optical unit for irradiating the light guide plate with a laser generated by the laser generating unit; A rotating optical unit moving unit for moving the rotating optical unit at a predetermined speed for processing the optical pattern; And a control unit for controlling the laser generating unit, the rotating optical unit, and the rotating optical unit moving unit to process the optical pattern.
이하에서 도면을 참조하여 본 발명에 따른 레이저를 이용한 도광판 가공장치 및 가공방법에 대해 상세히 설명한다.Hereinafter, a light guide plate processing apparatus and a processing method using a laser according to the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명에 따른 레이저 가공장치의 제1실시에의 개략적인 블록도이고, 도 3은 본 발명의 제1실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 정면도이고, 도 4는 본 발명의 제1실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 평면도이고, 도 6은 본 발명의 일 실시예에 따른 냉각유닛의 개략적인 구성을 나타내는 블록도이다.Figure 1 is a schematic block diagram of a first embodiment of a laser processing apparatus according to the present invention, Figure 3 is a front view showing the overall configuration of a laser processing apparatus according to a first embodiment of the present invention, Figure 4 is a present invention 6 is a plan view showing the overall configuration of the laser processing apparatus according to the first embodiment of the present invention, Figure 6 is a block diagram showing a schematic configuration of a cooling unit according to an embodiment of the present invention.
본 발명에 따른 레이저를 이용한 도광판 가공장치의 제1실시예는 광학패턴(A)의 가공을 위한 레이저 발생유닛(100)과 도광판을 소정 속도로 이송하는 이송유닛(300)과 레이저 발생유닛(100)에서 발생된 레이저를 이송 중인 도광판에 광학패턴을 가공하기 위해 레이저를 조사하는 회전형 광학유닛(200) 및 각 유닛을 제어하는 제어유닛(400)을 포함한다.The first embodiment of the light guide plate processing apparatus using a laser according to the present invention is a laser generating unit 100 for processing the optical pattern (A) and the transfer unit 300 and the laser generating unit 100 for transferring the light guide plate at a predetermined speed It includes a rotating optical unit 200 for irradiating the laser to process the optical pattern on the light guide plate for transferring the laser generated in the) and the control unit 400 for controlling each unit.
레이저 발생유닛(100)은 레이저를 발생시키는 레이저 광원(110), 레이저 광원(110)에서 발생된 레이저를 레이저 펄스로 변환하는 셔터장치(120), 레이저를 냉각시키는 냉각장치(130)를 포함하여 이루어진다. 셔터장치(120)의 뒷단에 레이저의 파워를 안정화시키고 출력을 일정하게 유지하기 위한 빔 이퀄라이저(150)를 사용할 수도 있다.The laser generating unit 100 includes a laser light source 110 for generating a laser, a shutter device 120 for converting a laser generated from the laser light source 110 into a laser pulse, and a cooling device 130 for cooling the laser. Is done. A beam equalizer 150 may be used at the rear end of the shutter device 120 to stabilize the power of the laser and to keep the output constant.
레이저 광원(110)은 도광판(1)에 광학패턴(A)을 가공하기 위한 레이저를 발생시키는 광원으로서 레이저 가공장치는 발생된 레이저의 에너지를 이용하여 도광판(1)에 광학패턴에 대응하는 도트 등(원형, 직사각형 등 광학패턴을 형성하는 모든 형상을 포함함)을 형성한다.The laser light source 110 is a light source for generating a laser for processing the optical pattern A on the light guide plate 1, and the laser processing apparatus uses dots of the light corresponding to the optical pattern on the light guide plate 1 using the generated laser energy. (Including all shapes that form an optical pattern such as a circle and a rectangle) are formed.
레이저 광원(110)은 그 발생원리 또는 레이저의 증폭에 사용되는 물질에 따라 다양한 종류가 있으며 그에 따라 발생된 레이저의 특성 또한 다양하다. 도 9는 도광판(1)으로 사용되는 아크릴 수지의 레이저의 파장 대비 반사도에 대한 그래프로서 특정 파장대의 레이저만이 아크릴 수지에 대한 흡수율이 뛰어남을 알 수 있다. 따라서 도광판(1)에 광학패턴을 가공하기 위해서는 레이저가 아크릴에 흡수되어야 하므로 흡수율이 뛰어난 파장대의 빛을 이용하는 것이 균일하고 효율적인 광학패턴의 가공에 적합하다.There are various types of laser light source 110 according to the generation principle or the material used for amplifying the laser, and the characteristics of the laser generated according to the laser are also varied. FIG. 9 is a graph of reflectance versus wavelength of a laser of an acrylic resin used as the light guide plate 1, and it can be seen that only a specific wavelength laser has an excellent absorption rate for an acrylic resin. Therefore, in order to process the optical pattern on the light guide plate 1, since the laser must be absorbed in acryl, it is suitable to process the optical pattern uniformly and efficiently using light having a high absorption band.
특히 이산화탄소 레이저는 이산화탄소의 진동 준위간의 전이를 이용한 기체 레이저로서 도광판(1)의 재질로 사용되는 아크릴 수지에 대한 흡수도가 높고 RF 신호를 이용하여 손쉽게 발진시킬 수 있기 때문에 레이저를 이용한 도광판 가공에 적합한 레이저 광원이다. 다만, 광학패턴의 형성을 위해서는 패턴에 대응하는 펄스 형태의 레이저를 도광판(1)에 조사하여야 하므로 통상 광학패턴에 대응하는 레이저 펄스를 발생시키기 위해 이산화탄소 레이저 광원에 RF 신호를 인가시켜 레이저를 발진시키되 가공할 광학패턴에 따라 RF 신호의 주기를 조절한다. Especially, CO2 laser is a gas laser using transition between vibration levels of carbon dioxide. It is suitable for light guide plate processing using laser because it has high absorption of acrylic resin used as material of light guide plate and can be easily oscillated using RF signal. Laser light source. However, in order to form an optical pattern, a laser having a pulse shape corresponding to the pattern needs to be irradiated to the light guide plate 1, so that an RF signal is applied to a carbon dioxide laser light source to generate a laser pulse corresponding to the optical pattern. The period of the RF signal is adjusted according to the optical pattern to be processed.
광학패턴을 형성하는 도트 등은 LCD 전체에 고르게 빛을 분산시키기 위해서 그 크기가 균일해야할 뿐만 아니라 레이저의 에너지가 일정 크기 이상이 되지 않으면 광학패턴을 형성하는 도트의 가공이 이루어지지 않는 특성이 있다. 또한, 도광판의 두께가 얇아질수록 도광판에 형성되는 광학패턴의 도트 크기는 점점 작아지게 된다. 이러한 작은 크기의 도트를 형성하기 위해서는 레이저 펄스의 폭이 작아져야 한다. 또한, 대량 양산에 적합한 정도의 빠른 가공을 위해서는 크기가 균일하면서도 도광판 가공에 충분한 에너지를 가진 레이저 펄스를 발생시켜야 할뿐만 아니라 각 펄스의 주기 또한 짧아야 한다.The dots forming the optical pattern have to be uniform in size in order to distribute the light evenly throughout the LCD, and the dot forming the optical pattern is not processed unless the energy of the laser becomes more than a predetermined size. In addition, as the thickness of the light guide plate becomes thinner, the dot size of the optical pattern formed on the light guide plate becomes smaller. To form such a small dot, the width of the laser pulse must be small. In addition, in order to achieve a high-speed processing that is suitable for mass production, not only a laser pulse having a uniform size and sufficient energy for processing a light guide plate should be generated, but also a short cycle of each pulse.
하지만 이산화탄소 레이저는 RF 신호에 의해 레이저를 발생하거나 중단하는 경우 발생되는 레이저의 에너지가 지수적으로 증가하고 지수적으로 감소하는 파형을 나타낸다. 따라서 일정 주기의 RF 신호에 의해 레이저 펄스를 발생하는 경우 레이저의 에너지 파형이 구형파의 형태를 띠는 것이 아니라가 지수적 증가하였다가 지수적으로 감소하는 파형을 나타내고, 아주 작은 도트를 가공하거나 양산성을 충족할만한 속도로 가공하기 위해서는 RF 신호 주기가 짧아지게 된다. 이와 같이 RF 신호 주기가 짧아짐에 따라 이산화탄소 레이저에서 발진되는 레이저는 가공을 할 수 있는 에너지 레벨에 도달하기도 전에 에너지가 감소하는 파형을 나타내므로 도광판에 도트가 가공되지 않거나 가공 레벨 이하의 레이저가 계속 도광판에 전달되어 도광판의 열적 변형을 유발하게 된다. 또한, 짧은 주기로 레이저 발진과 중단이 반복됨에 따라 발진되는 레이저의 에너지가 일정치 않아 가공되는 도트의 크기가 일정하지 않은 문제점이 있다.However, the carbon dioxide laser shows a waveform in which the energy of the laser generated when the laser is generated or stopped by the RF signal increases exponentially and decreases exponentially. Therefore, when a laser pulse is generated by a certain period of RF signal, the energy waveform of the laser does not have the shape of a square wave but is exponentially increased and then exponentially decreased. The RF signal period is shortened to process at speeds that are acceptable. As the RF signal cycle becomes shorter, the laser oscillated by the carbon dioxide laser shows a waveform in which the energy decreases before reaching the processing energy level, so that the dot is not processed on the light guide plate or the laser below the processing level continues to be used. To cause thermal deformation of the light guide plate. In addition, as laser oscillation and interruption are repeated at short intervals, there is a problem that the size of the processed dot is not constant because the energy of the oscillated laser is not constant.
본 발명은 레이저 광원(110)이 레이저를 연속적으로 발생하도록 제어하고 셔터장치(120)를 마련하여 연속적으로 출력되는 레이저를 차단하거나 통과되도록 하여 각 펄스마다 크기가 균일한 펄스를 발생시킬 수 있고, 가공 레벨 에너지 이상의 레이저 펄스만이 발생되도록 할 뿐만 아니라, 레이저 펄스의 파형이 구형파가 되도록 할 수 있는 효과가 있다. 즉, 레이저 펄스를 발생시키기 위해 이산화탄소 레이저를 on/off 하는 것이 아니라 이산화탄소 레이저는 계속 발진하도록 하면서 셔터장치(120)를 이용하여 차단/통과하도록 제어하여 가공에 적합한 레이저 펄스를 만들도록 한다. 이를 통해 양산성을 충족할 수 있는 빠른 가공속도에서도 양질의 균일한 에너지를 갖는 레이저 펄스를 발생시킬 수 있다. 예를 들어 CO2 레이저의 경우 최소 on/off 타임이 150μs인데 가공속도를 4m/s라고 할 경우 0.6mm이하의 도트는 가공할 수 없다. 하지만 셔터장치(120)의 경우 레이저의 on/off 타임보다 훨씬 짧은 1μs 정도로 on/off 할 수 있어 양산에 적합한 가공속도로 가공을 하더라도 그에 적합한 레이저 펄스를 발생시킬 수 있게 된다.The present invention can control the laser light source 110 to generate the laser continuously and to provide a shutter device 120 to block or pass through the laser output continuously to generate a pulse of uniform size for each pulse, Not only does the laser pulse above the processing level energy be generated, but there is an effect that the waveform of the laser pulse can be a square wave. That is, instead of turning on / off the carbon dioxide laser to generate the laser pulse, the carbon dioxide laser is controlled to be blocked / passed by using the shutter device 120 while continuing to generate the laser pulse to make a laser pulse suitable for processing. This enables the generation of laser pulses with high quality and uniform energy even at high processing speeds to meet mass productivity. For example, with a CO2 laser, the minimum on / off time is 150μs, but if the processing speed is 4m / s, dots below 0.6mm cannot be processed. However, the shutter device 120 can be turned on / off by about 1 μs, which is much shorter than the on / off time of the laser, so that the laser pulse can be generated even when processing at a processing speed suitable for mass production.
이에 따라 도광판(1)에 가공되는 광학패턴의 도트가 균일하게 형성되고 가공 레벨 이상의 레이저만이 조사됨에 따라 도광판(1)의 열적 변형을 최소화하면서 광학패턴을 가공할 수 있을 뿐만 아니라 양산에 적합한 빠른 가공속도에서도 가공에 적합한 양질의 레이저를 공급할 수 있는 효과가 있다.Accordingly, as the dot of the optical pattern processed on the light guide plate 1 is uniformly formed and only the laser of the processing level or more is irradiated, the optical pattern can be processed while minimizing the thermal deformation of the light guide plate 1 and is also suitable for mass production. There is an effect that can supply a high quality laser suitable for processing even at the processing speed.
셔터장치(120)는 앞서 설명한 바와 같이 연속적으로 발생된 레이저를 차단, 통과하도록 하여 레이저 펄스를 만드는 장치이다. 이러한 셔터장치(120)는 레이저를 아주 짧은 시간동안 차단하거나 통과시킬 수 있는 장치이면 모두 사용될 수 있다. 다만, 셔터장치(120)의 제어 편이성을 위해 RF 신호에 의해 굴절율이 변하는 AOM(Acoustic Optical Modulator)를 이용하는 것이 바람직하다. AOM은 RF 신호에 의해 내부의 굴절율이 바뀌게 되고 그에 따라 레이저의 굴절각이 달라지게 되어 경로가 틀어지게 된다. 따라서 회전형 광학유닛(200)으로 입사되는 경로를 벗어나게 되어 레이저 펄스가 도광판(1)으로 조사되지 않는다. 물론 달라진 경로에는 더미부재를 마련하여 레이저의 에너지를 흡수하도록 할 수 있다.As described above, the shutter device 120 is a device for generating a laser pulse by blocking and passing the laser generated continuously. The shutter device 120 may be used as long as the device can block or pass the laser for a very short time. However, it is preferable to use an AOM (Acoustic Optical Modulator) in which the refractive index is changed by the RF signal for ease of control of the shutter device 120. In AOM, the internal refractive index is changed by the RF signal, and accordingly, the refractive angle of the laser is changed. Therefore, the laser beam is not irradiated to the light guide plate 1 by being off the path incident to the rotatable optical unit 200. Of course, the changed path may be provided with a dummy member to absorb the energy of the laser.
레이저 광원(110)은 일정 온도 이상에서 레이저를 발진하게 되므로 많은 열이 발생하게 된다. 또한, 레이저 광원(110)은 온도에 민감하게 반응하므로 온도가 일정치 않으면 레이저의 출력이 일정하지 않게 되고 그에 따라 가공되는 도트의 크기가 균일하게 형성되지 않는다. 따라서 에너지의 출력을 일정하게 유지하기 위해 본 발명의 냉각장치(130)는 레이저 광원(110)의 온도를 일정하게 유지한다. 앞서 설명한 바와 같이 최근 슬림화 경향에 따라 도광판의 두께가 점점 얇아지는 추세이고 그에 따라 광학패턴을 형성하는 도트의 크기 또한 매우 작게 형성되어야 한다. 또한 균일한 빛의 분산을 위해 도트의 크기도 균일해야 하므로 레이저의 출력의 균일도를 일정하게 유지하는 것은 매우 중요한 문제이다. 하지만 통상의 냉각장치는 수 ℃ 정도의 편차를 가지고 있는데 이는 앞서 작은 크기의 도트를 균일하게 형성하는데 충분하지 않은 편차이다. 대략 상온에서 레이저 광원의 출력변동은 통상 출력의 3%의 범위(CO2레이저의 경우 100W ± 3W) 내에서 형성되나 아주 작은 크기의 도트(대략 40μm에서 300μm)를 형성하기 위해서는 레이저 광원(110)의 온도는 소정 온도에서 ±0.1℃ 범위 내에서 유지되는 것이 바람직하다.Since the laser light source 110 oscillates the laser at a predetermined temperature or more, a lot of heat is generated. In addition, the laser light source 110 is sensitive to temperature, so if the temperature is not constant, the output of the laser is not constant, and thus the size of the processed dot is not uniformly formed. Therefore, in order to maintain a constant output of energy, the cooling apparatus 130 of the present invention maintains a constant temperature of the laser light source 110. As described above, the light guide plate becomes thinner and thinner in accordance with the recent slimming trend, and thus, the size of the dot forming the optical pattern must be formed very small. In addition, since the dot size must be uniform for uniform light distribution, it is very important to keep the uniformity of the laser output constant. However, conventional cooling apparatus has a deviation of about several degrees Celsius, which is not enough to uniformly form small dots. At approximately room temperature, the output fluctuations of the laser light source are typically formed in the range of 3% of the output (100W ± 3W for CO2 laser), but in order to form very small dots (approximately 40μm to 300μm), The temperature is preferably maintained within the range of ± 0.1 ℃ at a predetermined temperature.
위와 같은 온도를 한 번에 유지하는 것이 현실적으로 매우 어렵거나 위와 같은 온도를 유지하는 냉각장치는 매우 고가이므로 본 발명은 2 이상의 단계를 통해 온도를 조절한다. 즉, 레이저 광원(110)을 소정 온도로 유지하기 위해 1단계의 온도 조절에서 온도를 ±0.2℃ 범위로 유지하고 1단계에서 조절된 온도를 검출하여 그 차이만큼을 2단계에서 조절한다. 만약 3단계 이상을 통해 온도를 조절한다면 3단계에서는 2단계에서 조절된 온도를 검출하여 그 차이만큼을 3단계에서 조절한다. 냉각장치(130)은 통상 냉각수를 이용하여 온도를 유지하는데 물은 비열이 커 온도가 쉽게 변하지 않는다. 따라서 한 번에 온도를 조절하기도 어려울뿐더러 그 정확도를 맞추기는 더 어려운 것이 현실이다. 따라서 여러 개의 냉각부를 마련하고 이를 통해 단계별로 냉각수의 온도를 조절하게 되면 원하는 정밀도로 온도를 조절할 수 있게 된다. It is practically very difficult to maintain the above temperature at a time or the cooling device that maintains the above temperature is very expensive, so the present invention controls the temperature through two or more steps. That is, in order to maintain the laser light source 110 at a predetermined temperature, the temperature is maintained in a range of ± 0.2 ° C. in one step of temperature control and the temperature adjusted in the first step is detected and the difference is adjusted in two steps. If the temperature is adjusted through three or more steps, step 3 detects the temperature adjusted in step 2 and adjusts the difference in step 3. The cooling device 130 maintains the temperature by using the cooling water, but the water is large and the temperature does not change easily. The reality is that it is difficult to control the temperature at once and it is more difficult to match the accuracy. Therefore, by providing a plurality of cooling unit and through this step by adjusting the temperature of the cooling water it is possible to adjust the temperature to the desired precision.
본 발명의 일 실시예에서는 냉각장치(130)를 2단계의 냉각부 즉, 주냉각부(132)와 보조냉각부(134)를 이용하여 레이저 광원(110)의 온도를 일정하게 유지하는데 일예를 들어 설명하자면 레이저 광원(110)의 온도를 8 ±0.1℃의 정밀도로 온도를 유지하기 위해서는 주냉각부(132)의 스펙 상 온도 편차를 0.2℃라고 한다면 주냉각부(132)의 조절 온도를 7.7℃로 세팅한다. 이렇게 되면 스펙상의 온도편차를 감안하더라도 레이저 광원(110)의 유지온도인 8℃는 넘지 않게 되며 주냉각부(132)의 출구부분에 온도센서(138)를 마련하고 주냉각부(132)에서 나오는 냉각수의 온도와 목표유지온도인 8℃와 비교하고 그 차이만큼을 보조냉각부(134)에서 보충하게 된다. 보조냉각부는 온도조절 용량이 크진 않지만 보다 세밀하게 온도조절이 가능한 냉각장치를 사용하는 것이 바람직하며 설명을 위한 일예에서는 보조냉각부(134)가 가열하는 기능만을 가지고 있으나 반대로 냉각하는 기능을 수행하도록 할 수도 있고 가열과 냉각을 모두 수행하도록 할 수도 있다. 보조냉각부(134)의 기능에 따라 주냉각부(132)의 설정온도를 변경하게 되면 레이저 광원(110)의 온도를 바람직하게는 ±0.1℃의 정밀도로 유지할 수 있게 된다. 냉각장치(130)의 주냉각부(132)와 보조냉각부(134)를 통해 ±0.1℃의 정밀도를 갖는 냉각수는 레이저 광원(110)의 주위를 둘러싸고 있는 냉각챔버(136)로 입수되어 레이저 광원(110)의 온도를 일정하게 유지하고 주냉각부(132), 보조냉각부(134)를 거쳐 순환한다. 냉각챔버(136) 내에서 광원의 냉각은 레이저 광원(110)의 전극판 사이에 냉각수가 흐르는 유로를 형성하고 전극을 냉각시키거나 방열판을 마련하고 방열판에 냉각수가 흐르도록 하는 원리를 이용하며 냉각수가 레이저 광원(110)에 마련된 각종 디바이스 주위를 돌아다니면서 냉각시킬 수 있다.In one embodiment of the present invention by using the cooling unit 130 in two stages, that is, the main cooling unit 132 and the auxiliary cooling unit 134 by using an example to maintain a constant temperature of the laser light source 110 For example, in order to maintain the temperature of the laser light source 110 with an accuracy of 8 ± 0.1 ° C., if the temperature deviation of the specification of the main cooling part 132 is 0.2 ° C., the control temperature of the main cooling part 132 is 7.7. Set to ° C. In this case, even if the temperature deviation in the specification is taken into consideration, the maintenance temperature of the laser light source 110 does not exceed 8 ° C. The temperature sensor 138 is provided at the outlet of the main cooling unit 132 and the main cooling unit 132 exits. Compared with the temperature of the cooling water and the target holding temperature of 8 ℃ and the difference is supplemented by the auxiliary cooling unit 134. Auxiliary cooling unit is not a large temperature control capacity, but it is preferable to use a cooling device capable of temperature control more precisely, in the illustrative example, the auxiliary cooling unit 134 has only the function of heating, but to perform the function of cooling on the contrary. It may be possible to perform both heating and cooling. When the set temperature of the main cooling unit 132 is changed according to the function of the auxiliary cooling unit 134, the temperature of the laser light source 110 can be maintained at an accuracy of ± 0.1 ° C. Cooling water having a precision of ± 0.1 ° C. through the main cooling unit 132 and the sub cooling unit 134 of the cooling device 130 is obtained into the cooling chamber 136 surrounding the laser light source 110 to be laser light source. The temperature of the 110 is kept constant and circulated through the main cooling unit 132 and the auxiliary cooling unit 134. Cooling of the light source in the cooling chamber 136 uses the principle of forming a flow path through which cooling water flows between the electrode plates of the laser light source 110, cooling the electrode or providing a heat sink, and allowing the cooling water to flow through the heat sink. It can be cooled while moving around the various devices provided in the laser light source 110.

*45회전형 광학유닛(200)은 레이저 발생유닛(100)에서 발생한 레이저를 광학패턴에 따라 이송 중인 도광판(1)에 조사한다.The 45-rotating optical unit 200 irradiates the light guide plate 1 that is being transported according to the optical pattern with the laser generated by the laser generating unit 100.
회전형 광학유닛(200)은 이송 중인 도광판(1)에 레이저를 조사하기 위해 레이저의 진행방향을 바꾸는 미러부(240, 250)와 미러부(240, 250)로부터 입사되는 레이저를 도광판(1)에 조사하는 레이저 헤더부(220, 230)와 레이저 헤더부(220, 230)가 고정 설치되는 휠프레임(260)과 휠프레임(260)을 정속회전 시키는 엑츄에이터(210)을 포함하여 이루어진다.The rotatable optical unit 200 receives the lasers incident from the mirrors 240 and 250 and the mirrors 240 and 250 for changing the advancing direction of the laser to irradiate the lasers to the light guide plate 1 being transferred. It comprises a laser header portion 220, 230 to irradiate and the wheel frame 260 is fixed to the laser header portion 220, 230 and the actuator 210 for rotating the wheel frame 260 at constant speed.
미러부(240, 250)는 휠프레임(260)의 상부에 설치되어 레이저 발생유닛(100)에서 발생된 레이저를 90도 반사시키는 제1미러(240)과 제1미러(240)에서 반사된 레이저를 각각의 레이저 헤더부(220, 230)으로 반사하는 제2미러(250)을 포함하여 이루어진다. 제1미러(240)는 휠프레임(260)의 회전과 상관없이 레이저 발생유닛(100)에서 출력되는 레이저의 방향에 맞추어 고정설치된다. 제2미러(250)는 제1미러(240)와는 달리 휠프레임(260)에 고정설치되되 각 레이저 헤더부(220, 230)에 대향되는 위치에 마련되어 휠프레임(260)의 회전과 함께 회전하며 일정구간동안 제1미러(240)에서 반사된 레이저를 각 레이저 헤더부(220, 230)으로 반사시킨다. 즉, 제2미러(250)는 레이저 헤더부와 동일한 개수로 설치되며 각 레이저 헤더부와 짝을 이루어 제1미러(240)에서 입사되는 레이저를 각 레이저 헤더부에 입사되도록 마련된다. 따라서 휠프레임(260)의 회전에 따라 제1미러(240)와 대향되는 위치의 제2미러(250)만이 제1미러(240)에서 반사된 레이저를 해당 레이저 헤더부로 입사시킨다. 물론 광학적 구성을 달리한다면 제1미러 또는 제2미러를 생략할 수도 있으나 레이저의 균일성과 trade-off 관계에 있다.The mirrors 240 and 250 are installed on the upper part of the wheel frame 260 to reflect the laser generated by the laser generating unit 100 by 90 degrees and the laser reflected from the first mirror 240. It includes a second mirror 250 that reflects to each of the laser header portion (220, 230). The first mirror 240 is fixedly installed in accordance with the direction of the laser output from the laser generating unit 100 irrespective of the rotation of the wheel frame 260. Unlike the first mirror 240, the second mirror 250 is fixedly installed on the wheel frame 260, but is provided at a position opposite to the laser header parts 220 and 230, and rotates with the rotation of the wheel frame 260. The laser reflected from the first mirror 240 is reflected to each of the laser header parts 220 and 230 for a predetermined period. That is, the second mirror 250 is installed in the same number as the laser header portion and is provided to be paired with each laser header portion so that the laser incident from the first mirror 240 is incident on each laser header portion. Therefore, as the wheel frame 260 rotates, only the second mirror 250 at the position opposite to the first mirror 240 injects the laser reflected from the first mirror 240 into the corresponding laser header part. Of course, if the optical configuration is different, the first mirror or the second mirror may be omitted, but the laser uniformity and trade-off relationship.
레이저 헤더부(220)는 제2미러(250)에서 반사된 레이저를 도광판(1)로 조사하기 위해 제1, 제2반사미러(222, 232)와 제1, 제2집속렌즈(224, 234)를 포함하여 이루어진다. 레이저 헤더부(220)는 구성에 따라 적어도 2 이상 설치되는 것이 바람직하며 도면에는 4개의 레이저 헤더부가 설치된 것을 예시로 표시하였다.The laser header unit 220 includes first and second reflecting mirrors 222 and 232 and first and second focusing lenses 224 and 234 to irradiate the laser reflected from the second mirror 250 to the light guide plate 1. ) The laser header unit 220 is preferably installed at least two or more depending on the configuration, it is shown in the figure that the four laser header unit is installed as an example.
이송유닛(300)은 도광판을 소정 속도로 이송하는 장치로서 정속 컨베이어 시스템 등을 예로 들 수 있다. 이송유닛(300)은 회전형 광학유닛(200)과 결합하여 도광판(1)에 곡선형 광학패턴(B)를 형성한다. 이송 중인 도광판(1) 정속회전하는 회전형 광학유닛(200)을 통해 광학패턴을 가공함에 따라 완벽한 원형의 패턴이 아닌 회전방향 쪽으로 갈수록 곡률반경이 커지는 형태로 광학패턴이 형성될 것이다.The transfer unit 300 may be, for example, a constant speed conveyor system as a device for transferring the light guide plate at a predetermined speed. The transfer unit 300 is coupled to the rotating optical unit 200 to form a curved optical pattern B on the light guide plate 1. As the optical pattern is processed through the rotating optical unit 200 rotating at constant speed in the light guide plate 1 being transferred, the optical pattern will be formed in a form in which the radius of curvature increases toward the rotation direction instead of a perfect circular pattern.
도 2는 본 발명에 따른 레이저 가공장치의 제2실시에의 개략적인 블록도이고, 도 5는 본 발명의 제2실시예에 따른 레이저 가공장치의 전체 구성을 나타내는 정면도이다.FIG. 2 is a schematic block diagram of a second embodiment of a laser processing apparatus according to the present invention, and FIG. 5 is a front view showing the overall configuration of the laser processing apparatus according to the second embodiment of the present invention.
도 2 및 도 5를 참조하여 본 발명의 제2실시예를 설명하되 제1실시예와 중복되는 설명은 생략한다. 본 발명의 제2실시예는 제1실시예와는 달리 도광판은 스테이지 상에 이동 없이 놓여진 상태에서 회전형 광학유닛(200)이 회전형 광학유닛 이동부(500)에 의해 소정 속도로 이송된다. 물론 이송 중인 회전형 광학유닛(200)은 광학패턴의 가공을 위해 정속회전한다.A second embodiment of the present invention will be described with reference to FIGS. 2 and 5, but a description overlapping with the first embodiment will be omitted. Unlike the first embodiment, in the second embodiment of the present invention, the rotating optical unit 200 is transferred at a predetermined speed by the rotating optical unit moving unit 500 while the light guide plate is placed on the stage without movement. Of course, the rotating optical unit 200 being transferred rotates at a constant speed for processing the optical pattern.
회전형 광학유닛 이동부(500)는 회전형 광학유닛(200)이 이동하는 경로 상에 마련된 가이드 레일(510)과 회전형 광학유닛(200)과 결합되어 가이드 레일(510)을 따라 회전형 광학유닛(200)을 정속도로 이송시키는 회전형 광학유닛 이동 엑츄에이터(520)을 포함하여 이루어진다.The rotatable optical unit moving unit 500 is coupled to the guide rail 510 and the rotatable optical unit 200 provided on the path along which the rotatable optical unit 200 moves, and rotates along the guide rail 510. It comprises a rotary optical unit movement actuator 520 for transferring the unit 200 at a constant speed.
이렇게 도광판(1)이 고정된 상태에서 회전형 광학유닛(200)이 정속 이동하면서 가공을 하여도 제1실시예와 동일한 형태의 광학패턴을 가공할 수 있다.In this way, the optical pattern of the same shape as in the first embodiment can be processed even when the rotating optical unit 200 is processed while moving in the constant speed while the light guide plate 1 is fixed.
위와 같이 본 발명의 레이저를 이용한 도광판 가공장치는 종래 레이저 가공장치의 광학장치 등이 상하 또는 좌우로 왕복운동하며 광학패턴을 가공함에 따라 양 끝단에서 가감속 및 방향전환에 따른 시간적 손실을 완전히 없앨 수 있어 가공시간을 사출성형과 거의 비슷하게 유지할 수 있는 효과가 있다.As described above, the light guide plate processing apparatus using the laser of the present invention can completely eliminate the time loss due to acceleration and deceleration and direction change at both ends as the optical apparatus of the conventional laser processing apparatus reciprocates vertically or horizontally and reciprocates. As a result, the processing time can be maintained almost similar to that of injection molding.
도 7을 참조하여 본 발명의 레이저 가공장치를 이용한 도광판 가공방법의 제1실시예를 설명하면 우선 광학패턴의 가공을 위해 이송유닛(300) 상에 마련된 도광판을 소정 속도로 정속 이송시킨다.(S100) 도광판이 정속도로 이송되는 중 회전형 광학유닛(200)은 정속 회전하면서 도광판(1)에 광학패턴을 가공한다.(S110) 자동화된 시스템을 이용하게 되면 연속적으로 도광판을 이송시키면서 매우 효율적으로 광학패턴을 가공할 수 있게 된다. Referring to FIG. 7, a first embodiment of a light guide plate processing method using the laser processing apparatus of the present invention will first convey the light guide plate provided on the transfer unit 300 at a constant speed for processing an optical pattern. While rotating the light guide plate at a constant speed, the rotating optical unit 200 processes the optical pattern on the light guide plate 1 while rotating at a constant speed. (S110) When the automated system is used, the optical guide plate is continuously transported continuously with high optical efficiency. The pattern can be processed.
도 8을 참조하여 본 발명의 레이저 가공장치를 이용한 도광판 가공방법의 제2실시예를 설명하면 광학패턴이 가공될 도광판을 스테이지상에 설치한다.(S200) 회전형 광학유닛(200)이 회전형 광학유닛 이동부(500)를 통해 도광판을 가로질러 정속 직선운동하고, 동시에 회전형 광학유닛(200)이 정속 회전하면서 광학패턴을 가공한다.(S210, S220) 이러한 가공을 통해 본 발명의 레이저 가공장치를 이용한 도광판 가공방법의 제1실시예와 동일한 광학패턴을 가공할 수 있게 된다.Referring to FIG. 8, a second embodiment of the light guiding plate processing method using the laser processing apparatus of the present invention is provided with a light guiding plate on which an optical pattern is to be processed (S200). The rotating optical unit 200 is a rotating type. Constant speed linear motion across the light guide plate through the optical unit moving unit 500, and at the same time the optical unit 200 rotates at a constant speed to process the optical pattern. (S210, S220) Laser processing of the present invention through such processing The same optical pattern as in the first embodiment of the light guide plate processing method using the device can be processed.
위와 같이 본 발명은 도광판을 빠르고 정확하게 가공할 수 있는 특징이 있어 불량률을 최소화하고 양산성을 향상시킬 수 있다.As described above, the present invention has a feature capable of quickly and accurately processing the light guide plate, thereby minimizing defect rate and improving mass productivity.

Claims (15)

  1. 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서,
    상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛;
    상기 광학패턴이 가공될 도광판을 이송하는 이송유닛;
    상기 레이저 발생유닛에서 발생된 레이저를 상기 이송 중인 도광판에 조사하는 회전형 광학유닛;
    상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 이송유닛 및 회전형 광학유닛을 제어하는 제어유닛을 포함하는 레이저를 이용한 도광판 가공장치.    In the laser processing apparatus for processing an optical pattern on a light guide plate using a laser,
    A laser generating unit for generating a laser for processing the optical pattern;
    A transfer unit for transferring the light guide plate on which the optical pattern is to be processed;
    A rotating optical unit for irradiating the laser generated by the laser generating unit to the light guide plate being transferred;
    Light guide plate processing apparatus using a laser including a control unit for controlling the laser generating unit, the transfer unit and the rotating optical unit for processing the optical pattern.
  2. 레이저를 이용하여 도광판에 광학패턴을 가공하는 레이저 가공장치에 있어서,
    상기 광학패턴의 가공을 위한 레이저를 발생시키는 레이저 발생유닛;
    상기 광학패턴이 가공될 도광판이 위치하는 스테이지;
    상기 레이저 발생유닛에서 발생된 레이저를 상기 도광판에 조사하는 회전형 광학유닛;
    상기 회전형 광학유닛을 상기 광학패턴의 가공을 위해 소정속도로 이동시키는 회전형 광학유닛 이동부;
    상기 광학패턴의 가공을 위해 상기 레이저 발생유닛, 회전형 광학유닛 및 회전형 광학유닛 이동부를 제어하는 제어유닛을 포함하는 레이저를 이용한 도광판 가공장치.    In the laser processing apparatus for processing an optical pattern on a light guide plate using a laser,
    A laser generating unit for generating a laser for processing the optical pattern;
    A stage in which a light guide plate on which the optical pattern is to be processed is located;
    A rotating optical unit for irradiating the light guide plate with a laser generated by the laser generating unit;
    A rotating optical unit moving unit for moving the rotating optical unit at a predetermined speed for processing the optical pattern;
    A light guide plate processing apparatus using a laser including a control unit for controlling the laser generating unit, the rotating optical unit and the rotating optical unit moving unit for processing the optical pattern.
  3. 청구항 1 또는 2에서,
    상기 레이저 발생유닛은 레이저 광원과,
    상기 레이저 광원을 소정 온도로 유지하는 냉각장치를 포함하여 이루어지는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 1 or 2,
    The laser generating unit and the laser light source,
    A light guide plate processing apparatus using a laser, characterized by comprising a cooling device for maintaining the laser light source at a predetermined temperature.
  4. 청구항 3에서,
    상기 레이저 광원은 이산화탄소 레이저를 포함하여 이루어지는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 3,
    The laser light source is a light guide plate processing apparatus using a laser, characterized in that comprises a carbon dioxide laser.
  5. 청구항 4에서,
    상기 레이저 발생유닛은 셔터장치를 더 포함하고,
    상기 제어유닛은 상기 이산화탄소 레이저에서 레이저가 연속적으로 발생되도록 제어하며, 상기 광학패턴에 대응하는 레이저 펄스가 발생하도록 상기 셔터장치의 작동을 제어하는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 4,
    The laser generating unit further comprises a shutter device,
    And the control unit controls the laser to be continuously generated in the carbon dioxide laser, and controls the operation of the shutter device to generate a laser pulse corresponding to the optical pattern.
  6. 청구항 5에서,
    상기 셔터장치는 어쿠스틱 광학 모듈레이터(AOM : Acoustic Optical Modulator)를 포함하여 이루어지는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 5,
    The shutter device is a light guide plate processing apparatus using a laser, characterized in that comprises an acoustic optical modulator (AOM).
  7. 청구항 3에서,
    상기 레이저 광원은 실질적으로 파장이 10㎛에서 20㎛ 사이인 레이저를 발생시키는 레이저 광원인 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 3,
    And the laser light source is a laser light source for generating a laser having a wavelength substantially between 10 μm and 20 μm.
  8. 청구항 3에서,
    상기 냉각장치는 상기 레이저 광원의 온도를 상기 소정온도의 ±0.1℃의 범위 내로 조절하는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 3,
    The cooling device is a light guide plate processing apparatus using a laser, characterized in that for adjusting the temperature of the laser light source within the range of ± 0.1 ℃ of the predetermined temperature.
  9. 청구항 8에서,
    상기 냉각장치는 상기 소정온도의 ±0.1℃의 범위로 온도를 조절하기 위해 적어도 2 이상의 단계를 거쳐 온도를 조절하되, 각 단계를 거칠수록 온도 조절의 폭이 좁아지는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 8,
    The cooling apparatus adjusts the temperature through at least two or more steps to adjust the temperature in the range of ± 0.1 ℃ of the predetermined temperature, the light guide plate using a laser, characterized in that the width of the temperature control narrows as each step passes Processing equipment.
  10. 청구항 3에서,
    상기 냉각장치는 냉각수를 이용하는 냉각장치이고,
    상기 냉각수의 온도를 일정하게 유지하기 위해 주냉각부와 보조냉각부와 주냉각부 내의 냉각수의 온도를 센싱하는 온도센서를 포함하여 이루어지며,
    상기 보조냉각부는 상기 주냉각부의 입구 또는 출구에 마련되어 상기 온도센서에서 감지되는 냉각수의 온도에 기초하여 상기 주냉각부에 유입 또는 유출되는 냉각수를 가열 또는 냉각시키는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 3,
    The cooling device is a cooling device using a cooling water,
    It comprises a temperature sensor for sensing the temperature of the cooling water in the main cooling unit, the auxiliary cooling unit and the main cooling unit in order to maintain a constant temperature of the cooling water,
    The sub-cooling unit is provided at the inlet or the outlet of the main cooling unit, the light guide plate processing apparatus using a laser, characterized in that for heating or cooling the cooling water flowing in or out of the main cooling unit based on the temperature of the cooling water detected by the temperature sensor. .
  11. 청구항 1 또는 2에서,
    상기 회전형 광학유닛은 상기 레이저 발생유닛에서 발생된 레이저의 진행방향을 바꾸기 위한 미러부와,
    상기 미러부를 통해 입력되는 레이저를 도광판에 조사하는 레이저 헤더부와,
    상기 레이저 헤더부가 고정 설치되는 휠프레임과,
    상기 휠프레임을 정속회전시키는 엑츄에이터를 포함하는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 1 or 2,
    The rotating optical unit includes a mirror unit for changing the traveling direction of the laser generated by the laser generating unit;
    A laser header unit for irradiating a light guide plate with a laser input through the mirror unit;
    A wheel frame in which the laser header unit is fixed and installed;
    Light guide plate processing apparatus using a laser, characterized in that it comprises an actuator for rotating the wheel frame at constant speed.
  12. 청구항 11에서,
    상기 미러부는 상기 휠프레임의 상부에 설치되어 상기 레이저 발생유닛에서 발생된 레이저의 진행방향을 바꾸는 제1미러와,
    상기 휠프레임의 중앙부에 설치되어 상기 제1미러에서 반사된 레이저를 레이저 헤더부로 반사하는 제2미러를 포함하여 이루어지는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 11,
    A first mirror installed at an upper portion of the wheel frame to change a traveling direction of the laser generated by the laser generating unit;
    And a second mirror installed at the center of the wheel frame and reflecting the laser reflected from the first mirror to the laser header unit.
  13. 청구항 12에서,
    상기 제1미러는 휠프레임의 상부에 고정설치되고,
    상기 레이저 헤더부 및 제2미러는 적어도 2이상 짝을 이루어 상기 휠프레임에 설치되고, 각 제2미러는 상기 고정설치된 제1미러에서 반사된 레이저를 짝을 이루는 레이저 헤더부로 반사하는 것을 특징으로 하는 레이저를 이용한 도광판 가공장치.    In claim 12,
    The first mirror is fixedly installed on the top of the wheel frame,
    The laser header part and the second mirror are installed in the wheel frame in a pair of at least two, each second mirror is characterized in that for reflecting the laser beam reflected from the fixed first mirror to the paired laser header portion Light guide plate processing apparatus using a laser.
  14. 레이저 가공장치를 이용하여 도광판에 광학패턴을 가공하는 도광판 가공방법에 있어서,
    상기 광학패턴의 가공을 위해 상기 도광판을 이송하는 상기 레이저 가공장치의 이송유닛 상에 마련된 도광판을 소정 속도로 이송하는 단계;
    상기 이송단계에서 소정 속도로 이송되는 도광판에 상기 레이저 가공장치의 회전형 광학유닛을 정속 회전시켜 동심의 곡선 형태로 이송 중인 도광판에 광학패턴을 가공하는 단계를 포함하는 레이저 가공장치를 이용하는 도광판 가공방법.    In the light guide plate processing method of processing an optical pattern on the light guide plate using a laser processing device,
    Transferring the light guide plate provided on the transfer unit of the laser processing apparatus for transferring the light guide plate for processing the optical pattern at a predetermined speed;
    Light guide plate processing method using the laser processing device comprising the step of processing the optical pattern on the light guide plate being conveyed in a concentric curve form by rotating the rotary optical unit of the laser processing device at a constant speed on the light guide plate conveyed at a predetermined speed in the transfer step. .
  15. 레이저 가공장치를 이용하여 도광판에 광학패턴을 가공하는 도광판 가공방법에 있어서,
    상기 광학패턴의 가공을 위해 상기 도광판을 상기 레이저 가공장치의 스테이지에 설치하는 단계;
    상기 스테이지에 설치된 도광판의 상부로 정속 회전하는 상기 레이저 가공장치의 회전형 광학유닛을 소정 속도로 이송하는 단계;
    상기 소정 속도로 이송되는 상기 회전형 광학유닛을 정속 회전시켜 동심의 곡선 형태로 상기 스테이지에 마련된 도광판에 광학패턴을 가공하는 단계를 포함하는 레이저 가공장치를 이용하는 도광판 가공방법.    In the light guide plate processing method of processing an optical pattern on the light guide plate using a laser processing device,
    Installing the light guide plate on a stage of the laser processing apparatus for processing the optical pattern;
    Transferring a rotating optical unit of the laser processing apparatus, which rotates at a constant speed to an upper portion of the light guide plate installed at the stage, at a predetermined speed;
    And rotating an optical pattern on the light guide plate provided on the stage in a concentric curve by rotating the rotating optical unit at a predetermined speed.
PCT/KR2011/000425 2011-01-21 2011-01-21 Apparatus and method for processing light guide plate using laser WO2012099286A1 (en)

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