WO2012067126A1 - Sonde de contact et unité de sonde - Google Patents

Sonde de contact et unité de sonde Download PDF

Info

Publication number
WO2012067126A1
WO2012067126A1 PCT/JP2011/076335 JP2011076335W WO2012067126A1 WO 2012067126 A1 WO2012067126 A1 WO 2012067126A1 JP 2011076335 W JP2011076335 W JP 2011076335W WO 2012067126 A1 WO2012067126 A1 WO 2012067126A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
contact
longitudinal direction
probe
coil spring
Prior art date
Application number
PCT/JP2011/076335
Other languages
English (en)
Japanese (ja)
Inventor
風間　俊男
一也 相馬
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to JP2012544268A priority Critical patent/JPWO2012067126A1/ja
Publication of WO2012067126A1 publication Critical patent/WO2012067126A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Definitions

  • the present invention relates to a conductive contact probe used for a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor package or a liquid crystal panel, and a probe unit including the contact probe.
  • the electrode to be inspected may be spherical.
  • a contact probe suitable for contact with such a spherical electrode as disclosed in Patent Document 1, the same probe-like shape protrudes in the longitudinal direction and is rotationally symmetrical with respect to the central axis in the longitudinal direction.
  • a first plunger that contacts the spherical electrode, a second plunger that contacts the wiring board, and a coil spring that connects the two plungers. are used.
  • the wire is closely wound and the end is attached to the first plunger, and the wire extending from the close winding is wound at a predetermined pitch, and the end is the second plunger. And a rough winding portion attached to the head.
  • the plurality of protrusions can scrape off dirt and oxide film present on the surface of the spherical electrode, and a reliable electrical connection with the spherical electrode can be realized.
  • the first and second plungers are conducted through the tightly wound portion of the coil spring. Reduction and stabilization can be realized. Therefore, by using the probe unit including the contact probe described above, it is possible to ensure stable conduction when inspecting a semiconductor package or the like.
  • the plurality of protrusions are arranged rotationally symmetrically with respect to the central axis in the longitudinal direction, and the contact probe moves when contacting the spherical electrode.
  • the contact probe moves when contacting the spherical electrode.
  • the present invention has been made in view of the above, and it is possible to reliably scrape off an oxide film present on the surface of a spherical electrode to be contacted, and a contact probe capable of ensuring stable conduction and the contact probe.
  • An object is to provide a probe unit provided with a contact probe.
  • a contact probe according to the present invention is a conductive contact probe having a needle shape that can expand and contract along the longitudinal direction, and is at least one of the longitudinal directions. It is provided with a plurality of projecting portions provided at the end portions, each projecting in a weight shape or a mountain shape along the longitudinal direction, and including a tip having a different height from the others in the longitudinal direction. .
  • the contact probe according to the present invention is the above-described invention, wherein the first plunger having the plurality of protruding portions and the end portion in the longitudinal direction which is different from the end portion where the first plunger is located. And a coil spring that connects the first plunger and the second plunger and is extendable and contractible along the longitudinal direction.
  • the contact probe according to the present invention is the contact probe according to the above invention, wherein the coil spring is wound with a wire rod in close contact and one end portion is attached to one of the first and second plungers, and the close contact winding.
  • Coarse winding in which the wire continuously extending from the other end of the part is wound at a predetermined pitch and the end on the side not connected to the tightly wound part is attached to the other of the first and second plungers
  • the other of the first and second plungers to which the coarse winding portion is attached is at least the contact winding portion in a state in which the load at the time of inspection is applied to the contact probe and the coil spring is contracted. It is characterized in that it enters the inner circumference side.
  • the first plunger has a first base end portion through which the coil spring is inserted, and the second plunger is more than the first base end portion.
  • the length of the longitudinal direction is short, it has a 2nd base end part which penetrates the said coil spring,
  • adherence winding part is attached to the said 1st plunger, It is characterized by the above-mentioned.
  • the probe unit according to the present invention is formed with a plurality of contact probes according to the above invention and a plurality of holding holes for holding both ends of the contact probes in a state of being prevented from coming off while being exposed to the outside. And a probe holder having an insulating property.
  • the present invention it is provided at at least one end portion in the longitudinal direction, protrudes in a weight or mountain shape along the longitudinal direction, and includes a tip having a different height from the other along the longitudinal direction. Since the plurality of protrusions are provided, the timing at which the plurality of protrusions come into contact with the spherical electrode to be contacted is not uniform, and the protruding end that comes into contact first moves while scratching the spherical electrode. Therefore, it is possible to surely scrape off the oxide film present on the surface of the spherical electrode to be contacted and to ensure stable conduction.
  • FIG. 1 is a perspective view showing an overall configuration of a probe unit according to an embodiment of the present invention.
  • FIG. 2 is a diagram illustrating a configuration of a main part of the probe unit according to the embodiment of the present invention.
  • FIG. 3 is a top view showing the shape of the tip of the first plunger of the contact probe according to one embodiment of the present invention.
  • FIG. 1 is a perspective view showing a configuration of a probe unit according to an embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the present embodiment.
  • the probe unit 1 shown in these drawings electrically connects the semiconductor package 100 and the wiring substrate 200 that outputs a test signal to the semiconductor package 100. This is a device (test socket) used when performing characteristic inspection.
  • the probe unit 1 accommodates a plurality of contact probes 2 according to a predetermined pattern, and a conductive contact probe 2 that makes contact with the semiconductor package 100 and the wiring board 200, which are two different contacts at both ends in the longitudinal direction.
  • the probe holder 3 having at least an insulating surface and the outer periphery of the probe holder 3 are arranged so as to surround the probe holder 3, and the probe holder 3 is fixedly held, and the position of the semiconductor package 100 during the inspection is shifted. And an insulating base member 4 to be suppressed.
  • the contact probe 2 is located at a first plunger 21 that is in contact with the spherical electrode 101 of the semiconductor package 100, and an end in the longitudinal direction of the contact probe 2 that is different from the end where the first plunger 21 is located, A second plunger 22 that is in contact with the electrode 201 of the wiring board 200, the first plunger 21 and the second plunger 22 are connected, and a coil spring 23 that can expand and contract along the longitudinal direction of the contact probe 2 is provided.
  • the first plunger 21, the second plunger 22, and the coil spring 23 have the same axis.
  • the first plunger 21 is provided at a distal end portion 21a that contacts the spherical electrode 101 of the semiconductor package 100, a flange portion 21b that is provided on the proximal end side of the distal end portion 21a, and has a diameter larger than the diameter of the distal end portion 21a, and a flange portion
  • a cylindrical shape that is provided on the opposite side of the tip 21a with respect to 21b, has a diameter smaller than the diameter of the flange 21b and substantially equal to the inner diameter of the coil spring 23, and one end of the coil spring 23 is press-fitted into.
  • Boss portion 21c and a base end portion (first base end) that is provided on the opposite side of the boss portion 21c from the flange portion 21b and extends from the boss portion 21c in a cylindrical shape having a diameter smaller than the inner diameter of the coil spring 23. Part) 21d.
  • FIG. 3 is a top view when the tip 21a is viewed from the direction of arrow A in FIG.
  • tip part 21a shown in FIG. 2 represents the side surface when it sees from the arrow B direction of FIG.
  • the distal end portion 21 a has four projecting portions 211 a each projecting in a weight shape along the longitudinal direction of the contact probe 2.
  • the height (protrusion amount) in the longitudinal direction of the tips of the two protrusions 211a located on the left side of the central part in FIG. 3 is the two protrusions located on the right side of the central part in FIG. It is larger than the height in the longitudinal direction of the tip of the portion 211a.
  • This difference in height is preferably about 3 to 25% of the distance between the tips of the two protruding portions 211a having different heights.
  • the second plunger 22 has a substantially conical tip portion 22a, a flange portion 22b provided on the proximal end side of the tip portion 22a and having a diameter larger than the diameter of the tip portion 22a, and the flange portion 22b.
  • a cylindrical boss portion 22c provided on the opposite side of the tip portion 22a, having a diameter smaller than the diameter of the flange portion 22b and substantially equal to the inner diameter of the coil spring 23, and into which the other end of the coil spring 23 is press-fitted;
  • a base end portion that is provided on the opposite side of the boss portion 22c from the flange portion 22b and extends from the boss portion 22c in a columnar shape having a smaller diameter than the boss portion 22c and smaller than the inner diameter of the coil spring 23 ( 2nd base end part) 22d.
  • the length of the base end portion 22 d in the longitudinal direction of the contact probe 2 is longer than the length of the base end portion 21 d of the first plunger 21.
  • the coil spring 23 includes a tightly wound portion 23a around which a wire is wound in close contact, and a coarsely wound portion 23b around which a wire extending continuously from one end of the tightly wound portion 23a is wound at a predetermined pitch.
  • the end portion of the tightly wound portion 23 a is press-fitted into the boss portion 21 c of the first plunger 21, while the end portion of the coarsely wound portion 23 b is press-fitted into the boss portion 22 c of the second plunger 22.
  • the length of the proximal end portion 22d of the second plunger 22 and the length of the tightly wound portion 23a of the coil spring 23 are determined so that at least the load at the time of inspection is applied to the contact probe 2 and the coil spring 23 Is set so that a part of the base end portion 22d enters the inner peripheral side of the tightly wound portion 23a.
  • the contact probe 2 is formed using a noble metal or a noble metal alloy.
  • the noble metal include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), and rhodium (Rh).
  • the noble metal or noble metal alloy applied in the present embodiment preferably has a Vickers hardness (HV) of 400 or more and an electrical resistivity of 5.00 ⁇ 10 ⁇ 8 ⁇ ⁇ m or less.
  • HV Vickers hardness
  • the contact probe 2 it is also possible to use copper, copper alloy, iron, tungsten, beryllium alloy, or the like.
  • the diameter of the contact probe 2 is about several tens ⁇ m to several hundreds ⁇ m.
  • the length of the contact probe 2 in the longitudinal direction is about several mm to several tens of mm.
  • the probe holder 3 is formed by laminating a first substrate 31 and a second substrate 32 in the thickness direction (vertical direction in FIG. 2).
  • the first substrate 31 is provided with a plurality of holding holes 33 penetrating in the thickness direction.
  • the formation position of the holding hole 33 is determined according to the wiring pattern of the semiconductor package 100.
  • the holding hole 33 includes a cylindrical small-diameter portion 33a that can be inserted through the distal end portion 21a of the first plunger 21, and a cylindrical large-diameter portion 33b that is larger in diameter than the small-diameter portion 33a and coaxial with the small-diameter portion 33a. Is a stepped hole.
  • the diameter of the large-diameter portion 33b is larger than the outer diameter of the coil spring 23, and has a gap that can be bent when the coil spring 23 is contracted by applying a load.
  • the diameter of the small diameter portion 33 a is smaller than the diameter of the flange portion 21 b of the first plunger 21. For this reason, in the state shown in FIG. 2, the flange portion 21b is prevented from coming off from the probe holder 3 by coming into contact with the boundary wall surface between the small diameter portion 33a and the large diameter portion 33b.
  • the second substrate 32 is provided with a plurality of holding holes 34 corresponding to the plurality of holding holes 33 of the first substrate 31.
  • the holding hole 34 is coaxially connected to one of the plurality of holding holes 33 provided in the first substrate 31, and forms a holder hole together with the holding hole 33.
  • the holding hole 34 includes a cylindrical small-diameter portion 34a that can be inserted through the distal end portion 22a of the second plunger 22, and a cylindrical large-diameter portion 34b that has a larger diameter than the small-diameter portion 34a and is coaxial with the small-diameter portion 34a. Is a stepped hole.
  • the diameter of the small diameter portion 34 a is smaller than the diameter of the flange portion 22 b of the second plunger 22.
  • the flange portion 22 b is prevented from coming off from the probe holder 3 by contacting the boundary wall surface between the small diameter portion 34 a and the large diameter portion 34 b.
  • the diameter of the large diameter portion 34 b is equal to the diameter of the large diameter portion 33 b of the holding hole 33 and is larger than the outer diameter of the coil spring 23.
  • the holding holes 33 and 34 are formed by performing drilling, etching, punching, or processing using a laser, an electron beam, an ion beam, wire discharge, or the like.
  • the probe holder 3 having the above-described configuration may be formed using any insulating material such as resin, machinable ceramic, silicon, or the like, and a metal or alloy is used as a base material, and the surface of the base material is used. You may form by providing insulating coatings, such as resin.
  • the pitch of adjacent holder holes is about several tens to several hundreds of ⁇ m.
  • the contact probe 2 when inspecting the semiconductor package 100 will be described.
  • the contact probe 2 has a protruding portion having a tip with a large protruding amount along the longitudinal direction. Only 211a (the two protruding portions 211a on the left side of the central portion in FIG. 3) is in contact with the spherical electrode 101. Therefore, in this state, the contact between the tip 21a and the spherical electrode 101 is unstable.
  • the coil spring 23 starts to contract.
  • the protruding portion 211 a that is in contact with the spherical electrode 101 maintains contact with the spherical electrode 101, while the protruding portion 211 a that is not in contact with the spherical electrode 101 gradually approaches the spherical electrode 101.
  • the spherical electrode 101 is stably held by the four protruding portions 211a.
  • the longitudinal direction of the first plunger 21 is slightly inclined with respect to the longitudinal direction of the holding hole 33.
  • the protruding portion 211a that contacts the spherical electrode 101 first moves while scratching the surface of the spherical electrode 101 until the remaining protruding portion 211a contacts the spherical electrode 101. Can be removed.
  • the present invention it is provided at at least one end in the longitudinal direction, protrudes in a weight shape along the longitudinal direction, and the height of the tip along the longitudinal direction is the other. Since there are multiple protrusions including different ones, the timing at which the multiple protrusions come into contact with the spherical electrode to be contacted is not uniform, and the protruding end that comes in contact first moves while scratching the spherical electrode To do. Therefore, it is possible to surely scrape off the oxide film present on the surface of the spherical electrode to be contacted and to ensure stable conduction.
  • the bottoms of the two V-shaped grooves orthogonal to each other are circles on the end surface of the portion that becomes the tip portion after processing. You may make it pass the position shifted from the center of each. In this case, the height of the tip of the protruding portion in the longitudinal direction is three. Moreover, you may form so that two V-shaped groove
  • the tip of the first plunger may have three or more V-shaped grooves. Also in this case, the bottom of at least one groove passes through a position shifted from the longitudinal central axis of the tip.
  • the distal end portion of the first plunger may have two protrusions having mountain shapes with different heights in the longitudinal direction.
  • the length of the first base end portion in the longitudinal direction of the contact probe is made longer than the length of the second base end portion, and the end of the rough winding portion is press-fitted into the boss portion of the first plunger, It is good also as a structure which press-fit the edge part of the close_contact
  • at least the load at the time of inspection is applied to the contact probe and the coil spring is contracted so that the first base end portion enters the inner peripheral side of the tightly wound portion.
  • the first plunger rotates and inclines during inspection, and the proximal end portion of the first plunger enters the inner peripheral portion of the tightly wound portion of the coil spring. A part of the side surface of the base end portion of one plunger comes into contact with the inner surface of the tightly wound portion. Therefore, it is possible to ensure stable conduction as in the above embodiment.
  • a second plunger having a tip shape similar to that of the tip portion 21 a of the first plunger 21 it is desirable to determine the positional relationship between the distal end portion 21a of the first plunger 21 and the distal end portion of the second plunger in consideration of the curvature of the coil spring 23.
  • At least the surfaces of the first and second protrusions may be coated with a plating film such as electroplating or gold plating.
  • a plating film such as electroplating or gold plating.
  • the probe unit according to the present invention is not limited to application only to a test socket for semiconductor package inspection. That is, the probe unit according to the present invention can be applied for inspection of liquid crystal panels, wafers, and the like.
  • the contact probe according to the present invention can be applied as a connector for electrically connecting components of a hybrid vehicle, for example, in addition to the inspection of a semiconductor package or the like.
  • the diameter of the contact probe when applied as such a connector is larger than the diameter of the contact probe described in the above embodiment.
  • the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.
  • the probe unit according to the present invention can scrape off the oxide film present on the surface of the spherical electrode to be contacted, and is useful for ensuring stable conduction.
  • Probe unit 2 Contact probe 3
  • Probe holder 4 Base member 21 1st plunger 21a, 22a Tip part 21b, 22b Flange part 21c, 22c Boss part 21d, 22d Base end part 22 Second plunger 23 Coil spring 23a Contact

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente sonde de contact conductrice (2) qui présente la forme d'une aiguille qui peut s'étendre/se contracter dans la direction de la longueur comporte une pluralité de sections en saillie qui sont disposées à au moins une extrémité dans la direction de la longueur, chaque saillie ayant une forme de cône ou de montagne dans la direction de la longueur, y compris celles dont la hauteur de la pointe dans la direction de la longueur est différente de celles des autres. En conséquence, il est possible de gratter de manière fiable une pellicule d'oxyde présente sur la surface d'une électrode sphérique qui doit être mise en contact, et il est possible d'assurer une conduction plus stable.
PCT/JP2011/076335 2010-11-17 2011-11-15 Sonde de contact et unité de sonde WO2012067126A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012544268A JPWO2012067126A1 (ja) 2010-11-17 2011-11-15 コンタクトプローブおよびプローブユニット

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-257315 2010-11-17
JP2010257315 2010-11-17

Publications (1)

Publication Number Publication Date
WO2012067126A1 true WO2012067126A1 (fr) 2012-05-24

Family

ID=46084049

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/076335 WO2012067126A1 (fr) 2010-11-17 2011-11-15 Sonde de contact et unité de sonde

Country Status (3)

Country Link
JP (1) JPWO2012067126A1 (fr)
TW (1) TWI463141B (fr)
WO (1) WO2012067126A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103675395A (zh) * 2012-09-05 2014-03-26 英华达（上海）科技有限公司 测量稳压组件电流的检测***及检测方法
JPWO2014021465A1 (ja) * 2012-08-03 2016-07-21 山本貴金属地金株式会社 合金材料、コンタクトプローブおよび接続端子
US9622357B2 (en) 2014-05-06 2017-04-11 Apple Inc. Method for orienting discrete parts
US9689825B1 (en) 2013-09-09 2017-06-27 Apple Inc. Testing a layer positioned over a capacitive sensing device
US9739696B2 (en) 2015-08-31 2017-08-22 Apple Inc. Flexural testing apparatus for materials and method of testing materials
JP2018165670A (ja) * 2017-03-28 2018-10-25 日本発條株式会社 導電性接触子、導電性接触子ユニット、および導電性接触子ユニットを備える半導体検査装置
CN111856090A (zh) * 2019-04-25 2020-10-30 欧姆龙株式会社 探针、检查夹具及检查组件
CN113167817A (zh) * 2018-12-13 2021-07-23 株式会社村田制作所 探针

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6711469B2 (ja) * 2017-10-06 2020-06-17 株式会社村田製作所 プローブ
KR102321112B1 (ko) * 2020-05-22 2021-11-04 리노공업주식회사 검사소켓의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107377A (ja) * 2000-09-28 2002-04-10 Nhk Spring Co Ltd 可動ガイドプレート付き導電性接触子
JP2006343296A (ja) * 2005-06-10 2006-12-21 S Ii R:Kk 集積回路用ソケットのプローブ
JP2010038612A (ja) * 2008-08-01 2010-02-18 Hioki Ee Corp コンタクトプローブ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396293B1 (en) * 1999-02-18 2002-05-28 Delaware Capital Formation, Inc. Self-closing spring probe
US7545159B2 (en) * 2006-06-01 2009-06-09 Rika Denshi America, Inc. Electrical test probes with a contact element, methods of making and using the same
JP5008582B2 (ja) * 2008-02-04 2012-08-22 株式会社ヨコオ コンタクトプローブ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107377A (ja) * 2000-09-28 2002-04-10 Nhk Spring Co Ltd 可動ガイドプレート付き導電性接触子
JP2006343296A (ja) * 2005-06-10 2006-12-21 S Ii R:Kk 集積回路用ソケットのプローブ
JP2010038612A (ja) * 2008-08-01 2010-02-18 Hioki Ee Corp コンタクトプローブ

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014021465A1 (ja) * 2012-08-03 2016-07-21 山本貴金属地金株式会社 合金材料、コンタクトプローブおよび接続端子
US9804198B2 (en) 2012-08-03 2017-10-31 Yamamoto Precious Metal Co., Ltd. Alloy material, contact probe, and connection terminal
CN103675395A (zh) * 2012-09-05 2014-03-26 英华达（上海）科技有限公司 测量稳压组件电流的检测***及检测方法
TWI468699B (zh) * 2012-09-05 2015-01-11 Inventec Appliances Corp 測量穩壓元件電流之檢測系統及檢測方法
US9689825B1 (en) 2013-09-09 2017-06-27 Apple Inc. Testing a layer positioned over a capacitive sensing device
US9622357B2 (en) 2014-05-06 2017-04-11 Apple Inc. Method for orienting discrete parts
US9739696B2 (en) 2015-08-31 2017-08-22 Apple Inc. Flexural testing apparatus for materials and method of testing materials
JP2018165670A (ja) * 2017-03-28 2018-10-25 日本発條株式会社 導電性接触子、導電性接触子ユニット、および導電性接触子ユニットを備える半導体検査装置
CN113167817A (zh) * 2018-12-13 2021-07-23 株式会社村田制作所 探针
CN113167817B (zh) * 2018-12-13 2024-04-23 株式会社村田制作所 探针
CN111856090A (zh) * 2019-04-25 2020-10-30 欧姆龙株式会社 探针、检查夹具及检查组件
CN111856090B (zh) * 2019-04-25 2024-02-06 欧姆龙株式会社 探针、检查夹具及检查组件

Also Published As

Publication number Publication date
TWI463141B (zh) 2014-12-01
TW201229519A (en) 2012-07-16
JPWO2012067126A1 (ja) 2014-05-12

Similar Documents

Publication Publication Date Title
WO2012067126A1 (fr) Sonde de contact et unité de sonde
TWI422829B (zh) 檢查治具、電極構造及電極構造之製造方法
US10649004B2 (en) Contact terminal, inspection jig, and inspection apparatus
US10877085B2 (en) Inspection jig and inspection device
US10656179B2 (en) Contact terminal, inspection jig, and inspection device
WO2014017402A1 (fr) Gabarit de test et procédé de fabrication pour celui-ci
JP6762476B2 (ja) 筒状体、及びその製造方法
CN112600006B (zh) 电触头、电连接结构及电连接装置
KR102498454B1 (ko) 컨택트 프로브 및 검사 지그
JP6850583B2 (ja) ソケット
JP2007194187A (ja) コンタクトピン、及び電気部品用ソケット
WO2013018809A1 (fr) Unité de sondes
JPWO2018181776A1 (ja) コンタクトプローブおよびプローブユニット
JP6283929B2 (ja) 検査用治具及び検査用治具の製造方法
JP5406310B2 (ja) コンタクトプローブ
JP2021105547A (ja) コンタクトプローブ
JP2005061851A (ja) プローブカード用基板
WO2018181273A1 (fr) Sonde, unité de sonde et dispositif d'inspection à semi-conducteurs comportant une unité de sonde
JP5651333B2 (ja) プローブユニット
WO2012067125A1 (fr) Unité de sonde
US20220178968A1 (en) Contact terminal, inspection jig, and inspection device
JP2018165670A (ja) 導電性接触子、導電性接触子ユニット、および導電性接触子ユニットを備える半導体検査装置
TWI806083B (zh) 電性接觸子的電性接觸構造及電性連接裝置
US20220137094A1 (en) Inspection jig
US20230176089A1 (en) Contact terminal, inspection jig, and inspection apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11842265

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2012544268

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11842265

Country of ref document: EP

Kind code of ref document: A1