WO2012063666A1 - Liquid crystal display device - Google Patents

Liquid crystal display device Download PDF

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Publication number
WO2012063666A1
WO2012063666A1 PCT/JP2011/075030 JP2011075030W WO2012063666A1 WO 2012063666 A1 WO2012063666 A1 WO 2012063666A1 JP 2011075030 W JP2011075030 W JP 2011075030W WO 2012063666 A1 WO2012063666 A1 WO 2012063666A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
heat spreader
side wall
heat
led
Prior art date
Application number
PCT/JP2011/075030
Other languages
French (fr)
Japanese (ja)
Inventor
張　志芳
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012063666A1 publication Critical patent/WO2012063666A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/36—Airflow channels, e.g. constructional arrangements facilitating the flow of air

Definitions

  • the present invention relates to a liquid crystal display device.
  • the present invention relates to a backlight unit using a light emitting diode (LED) as a light source and a liquid crystal display device including the backlight unit.
  • LED light emitting diode
  • the liquid crystal display device includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight disposed on the back side of the liquid crystal panel.
  • a backlight disposed on the back side of the liquid crystal panel.
  • light emitted from the backlight is irradiated from the back side of the liquid crystal panel, so that an image displayed on the liquid crystal panel can be visually recognized.
  • An LED backlight includes a side edge method in which a light guide plate is disposed on the back side of a liquid crystal panel, an LED is disposed on a side surface of the light guide plate, and light is incident on the light guide plate.
  • LEDs are arranged in an array just below the back side of the liquid crystal panel.
  • the LED When an electric current is supplied to the LED that is the light source of the LED backlight to emit light, the LED generates heat and the internal temperature of the LED rises.
  • the heat radiation of the LED is insufficient, the temperature inside the LED excessively increases, which may cause a decrease in light emission efficiency or deterioration of the element itself.
  • the LED Since the LED is a light source smaller than the CCFL, even if the power consumption is the same, the heat is concentrated in a narrower region in the LED. That is, the LED tends to increase in temperature per unit area. For these reasons, when an LED is used as a light source, a technique for efficiently releasing heat from the LED to the outside is required.
  • Patent Document 1 includes a heat dissipation member that dissipates heat of an LED in a direct-type LED backlight. Further, Patent Document 2 is provided with a heat radiating plate on which LEDs are arranged in a direct type LED backlight, and the heat radiating plate is made of aluminum and has fins attached thereto. In these direct type backlights, it is easy to take a layout in which a large heat dissipation member or heat dissipation plate is arranged. In both cases, a heat dissipation plate with a relatively large area is connected to the LED to release heat from the LED to the outside. Like to do.
  • Patent Document 3 discloses a display device used in a personal computer.
  • the display device disclosed in Patent Document 3 is provided with a light source (LED) that emits light as a backlight, and a heat sink having a plurality of fins is attached to the LED.
  • LED light source
  • a heat sink having a plurality of fins is attached to the LED.
  • the light from the LED is reflected by the reflector without using the light guide plate, and the reflected light is irradiated to the liquid crystal panel.
  • a heat sink having a plurality of fins is attached in a pair of left and right, and the heat sink can be cooled by blowing air from a fan.
  • the heat countermeasure becomes good.
  • the LEDs may be arranged at the upper and lower end portions instead of the left and right end portions, but the display device disclosed in Patent Document 3 immediately takes such measures. I can't.
  • the present invention has been made in view of such a point, and a main object thereof is to provide a liquid crystal display device capable of improving the heat dissipation of an LED with a simple configuration.
  • the liquid crystal display device is a liquid crystal display device comprising a liquid crystal panel and a backlight unit for irradiating the liquid crystal panel with light
  • the backlight unit is an LED substrate on which a plurality of LED elements are arranged.
  • a heat spreader that contacts the LED substrate and dissipates heat of the LED substrate, a light guide plate into which light from the plurality of LED elements is introduced, and the LED substrate, the heat spreader, and the light guide plate are housed
  • the liquid crystal panel and the backlight chassis are housed in an exterior cabinet, and the heat spreader is formed with a recess having an air layer between the backlight chassis and the side wall of the backlight chassis.
  • a first through hole communicating with the air layer is formed on a side wall of the backlight chassis. It is, wherein the side wall of the outer cabinet, a second through-hole communicating with the space between the side wall of the backlight chassis is formed.
  • the liquid crystal panel and the light guide plate are arranged to extend in a vertical direction
  • the heat spreader includes an upper heat spreader provided on an upper side of the light guide plate and a lower side of the light guide plate.
  • the upper heat spreader and the lower heat spreader are each formed with a recess having the air layer, and the vertical direction is based on the region where the recess exists.
  • the first through hole and the second through hole are formed in a region along the line.
  • the heat spreader has a side wall portion that contacts a side wall of the backlight chassis, and a bottom surface portion that contacts a bottom surface of the backlight chassis, and in the side wall portion of the heat spreader.
  • the LED substrate is disposed on the light guide plate side.
  • the heat spreader includes a plurality of recesses having the air layer, and the first through-holes communicating with the air layers of the plurality of recesses include the backlight. Formed in the unit.
  • the second through hole is formed in a side wall of the exterior cabinet so as to extend obliquely with respect to the vertical direction.
  • a backlight unit is a backlight unit that irradiates light to a liquid crystal panel, and an LED substrate on which a plurality of LED elements are arranged, and a heat that contacts the LED substrate and dissipates heat of the LED substrate.
  • the heat spreader has a recess having an air layer between the side wall of the backlight chassis and the heat spreader, A first through hole communicating with the air layer is formed in a side wall of the backlight chassis, and a second hole communicating with a side wall of the backlight chassis is formed in the side wall of the exterior cabinet. Through-holes are formed.
  • the heat spreader is formed with the recess having the air layer between the side wall of the backlight chassis, and the first through hole communicating with the air layer is formed on the side wall of the backlight chassis.
  • a second through hole communicating with a space between the side wall of the backlight chassis is formed on the side wall of the exterior cabinet. Therefore, after the heat of the LED substrate is transmitted to the heat spreader, the air in the air layer in the recess of the heat spreader is heated, and the heated air moves to the outside through the first through hole and the second through hole. To do.
  • the heat of the heat spreader can be transmitted to the air layer, and the air in the air layer can be discharged to the outside. Therefore, the heat dissipation of the heat spreader can be improved, and as a result, the heat dissipation of the LED can be improved with a simple configuration.
  • FIG. 1 is a perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention.
  • 2 is an exploded perspective view schematically showing a configuration of a liquid crystal display device 100.
  • FIG. 2 is a cross-sectional view schematically showing the configuration of the upper part of the liquid crystal display device 100.
  • FIG. 2 is a cross-sectional view schematically showing a configuration of a lower part of the liquid crystal display device 100.
  • FIG. 4 is a cross-sectional view schematically showing a configuration of a modified example of the liquid crystal display device 100.
  • FIG. It is a perspective view which shows typically the structure of the exterior cabinet 70 in the modification of the liquid crystal display device 100.
  • FIG. 4 is a cross-sectional view schematically showing a configuration of an exterior cabinet 70 in a modified example of the liquid crystal display device 100.
  • FIG. 1 is a perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention.
  • the liquid crystal display device 100 of this embodiment includes a liquid crystal panel 10 that displays an image.
  • An exterior cabinet 70 is disposed in the outer frame area of the liquid crystal panel 10.
  • the liquid crystal panel 10 has a rectangular shape and is arranged along the vertical direction (gravity direction) 90.
  • FIG. 2 is an exploded perspective view schematically showing the configuration of the liquid crystal display device 100 of the present embodiment.
  • the liquid crystal display device 100 of this embodiment includes a liquid crystal panel 10 and a backlight unit 50 that irradiates the liquid crystal panel 10 with light.
  • the backlight unit 50 includes an LED substrate 32 on which a plurality of LED elements 31 are arranged, a heat spreader 34 that radiates heat from the LED substrate 32, a light guide plate 30, and a backlight chassis 40. ing.
  • the heat spreader 34 is in contact with the LED substrate 32 and serves as a heat dissipation member for the LED element 31.
  • Light from the LED element 31 is introduced into the light guide plate 30. Specifically, light emitted from the LED element 31 is incident on an end surface (a surface facing the LED substrate 32) 30 a of the light guide plate 30, then propagates through the light guide plate 30, and the main surface 30 m of the light guide plate 30. Then, the back side of the liquid crystal panel 10 is irradiated.
  • the backlight chassis 40 houses the LED substrate 32, the heat spreader 34, and the light guide plate 30.
  • the liquid crystal panel 10 and the backlight chassis 40 are accommodated in the exterior cabinet 70.
  • the exterior cabinet 70 in this example includes a front side cabinet (bezel) 71 that holds the outer frame region of the liquid crystal panel 10 and a back side cabinet 72 that can accommodate the backlight chassis 40.
  • an optical sheet 20 (20 a to 20 c) is provided between the liquid crystal panel 10 and the light guide plate 30.
  • the optical sheets 20a to 20c are, for example, a lens sheet, a prism sheet, and a diffusion plate, but other optical members can also be used.
  • a recess 36 having an air layer 35 is formed between the side walls 40 a of the backlight chassis 40.
  • a recess 36 made of a groove is provided on the back surface of the heat spreader 34 (the back surface with respect to the surface on which the LED elements 31 are mounted).
  • An air layer 35 exists in the recess 36.
  • a first through hole 45 communicating with the air layer 35 is formed in the side wall 40 a of the backlight chassis 40.
  • a second through hole 75 communicating with a space 73 between the side wall 40 a of the backlight chassis 40 is formed in the side wall 70 a of the exterior cabinet 70.
  • the liquid crystal panel 10 of the present embodiment generally has a rectangular shape as a whole, and is composed of a pair of translucent substrates (glass substrates) 11 and 12. Both the substrates 11 and 12 are arranged to face each other, and a liquid crystal layer (not shown) is provided between them.
  • the liquid crystal layer is made of a liquid crystal material whose optical characteristics change with application of an electric field between the substrates 11 and 12.
  • a sealing agent (not shown) is provided on the outer edge portions of the substrates 11 and 12 to seal the liquid crystal layer. Further, polarizing plates 13 and 13 are attached to the outer surfaces of both the substrates 11 and 12, respectively.
  • the back side of the substrates 11 and 12 is the array substrate (TFT substrate) 11, while the front side is the color filter substrate (CF substrate) 12.
  • the liquid crystal panel 10 of the present embodiment has a size of, for example, 20 inches to 110 inches (typically 32 inches to 60 inches).
  • the backlight unit 50 of the present embodiment is a side-edge type LED backlight including the light guide plate 30.
  • the light guide plate 30, the LED substrate 32, and the heat spreader 34 are housed in a region surrounded by the side wall 40 a of the backlight chassis 40 (region where the bottom surface 40 b is located).
  • the backlight chassis 40 is made of a metal material (for example, aluminum, iron, etc.), and is a sheet metal member that covers the entire back surface of the backlight unit 50 and the liquid crystal panel 10.
  • the heat spreader 34 of the present embodiment is made of a metal material (for example, aluminum) having good thermal conductivity.
  • the illustrated heat spreader 34 has an L-shape.
  • the LED substrate 32 is disposed on the side of the light guide plate 30 in the side wall portion 34 a of the heat spreader 34.
  • the LED elements 31 are arranged in a row on the LED substrate 32 so as to face the end face 30 a of the light guide plate 30.
  • Each LED element 31 consists of a white LED chip, for example.
  • the backlight chassis 40 in which the light guide plate 30 and the LED substrate 32 are accommodated is accommodated in an area surrounded by the side wall 70a of the exterior cabinet 70 (area where the bottom surface 72b is located).
  • the exterior cabinet 70 is made of, for example, a metal material (typically aluminum or iron) or a resin material.
  • the exterior cabinet 70 is composed of a front side cabinet (bezel) 71 and a back side cabinet 72, and a second penetrating both side walls 70 a in the front side cabinet 71 and the back side cabinet 72.
  • the through-hole 75 is formed.
  • the liquid crystal panel 10 and the light guide plate 30 are arranged to extend in the vertical direction (here, the Z direction).
  • the heat spreader 34 includes an upper heat spreader 34 ⁇ / b> A provided on the upper side of the light guide plate 30 and a lower heat spreader 34 ⁇ / b> B provided on the lower side of the light guide plate 30.
  • a recess 36 having an air layer 35 is formed in each of the upper heat spreader 34A and the lower heat spreader 34B.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of the upper part of the liquid crystal display device 100 of the present embodiment.
  • FIG. 4 is a cross-sectional view schematically showing the configuration of the lower part of the liquid crystal display device 100 of the present embodiment.
  • the heat spreader 34 (upper heat spreader 34 ⁇ / b> A) has a side wall portion 34 a that contacts the side wall 40 a of the backlight chassis 40 and a bottom surface portion 34 b that contacts the bottom surface 40 b of the backlight chassis 40. ing.
  • the heat spreader 34 only needs to be in contact with the backlight chassis 40 in a form in which heat is conducted. Therefore, the heat spreader 34 is in direct contact with the backlight chassis 40, and in addition to the backlight chassis 40 via other components (for example, an adhesive layer having excellent thermal conductivity, a thermal conductive sheet). It is also possible to make it contact.
  • the heat spreader 34 has a structure with an L-shaped cross section. However, the heat spreader 34 is not limited to that shape, and other structures can be used.
  • the LED substrate 32 is disposed on the side of the light guide plate 30 in the side wall portion 34a of the heat spreader 34.
  • the LED substrate 32 is in contact with the surface of the side wall portion 34 a of the heat spreader 34.
  • the LED board 32 should just be in contact with the heat spreader 34 in the form which heat conducts. Therefore, the LED substrate 32 is in direct contact with the heat spreader 34 in addition to the form in contact with the heat spreader 34, and is in contact with the heat spreader 34 via other components (for example, an adhesive layer having excellent thermal conductivity, a thermal conductive sheet). It is also possible to make it.
  • a recess 36 is formed in the heat spreader 34, and the air layer 35 existing in the recess 36 is heated by heat from the LED substrate 32.
  • the recess 36 of the heat spreader 34 is formed on the side of the side wall portion 34a opposite to the surface on which the LED substrate 32 is disposed.
  • the recess 36 of the heat spreader 34 is blocked by the side wall 40 a of the backlight chassis 40, thereby forming an air layer 35 in the recess 36.
  • a first through hole 45 is formed in a portion of the side wall 40a of the backlight chassis 40 where the air layer 35 is located.
  • a plurality of first through holes 45 are formed along the Y direction.
  • one first through hole 45 is formed along the Y direction. May be formed.
  • the side wall 70a of the exterior cabinet 70 is located above the region where the first through hole 45 is formed (above the vertical direction 90), and the second through hole 75 is formed on the side wall 70a. Is formed.
  • a plurality of second through holes 75 are formed along the Y direction.
  • one second through hole 75 is formed along the Y direction. May be formed.
  • the first through hole 45 and the second through hole 75 exist in a region along the vertical direction 90 with respect to the region where the recess 36 exists.
  • the first through hole 45 is formed in the backlight chassis 40 and the second through hole 75 is formed in the exterior cabinet 70 above the region where the recess 36 exists (above the vertical direction 90). Is formed.
  • the LED element 31 mounted on the LED substrate 32 emits light 39, and the light 39 is incident on the end surface 30 a of the light guide plate 30.
  • the light guided through the light guide plate 30 exits from the main surface 30 m of the light guide plate 30 and irradiates the liquid crystal panel 10 via the optical sheet 20. Then, an image is displayed by the light transmitted through the liquid crystal panel 10.
  • the LED element 31 When the LED element 31 operates, the LED element 31 generates heat, and the heat is transmitted to the LED substrate 32.
  • the heat of the LED board 32 is transmitted to the heat spreader 34 (34A), whereby the LED element 31 and the LED board 32 are dissipated.
  • the air layer 35 in the recess 36 is heated by the heat of the heat spreader 34.
  • the heated air in the air layer 35 passes through the first through hole 45 and moves to the space 73 located between the side wall 40 a of the backlight chassis 40 and the side wall 70 a of the exterior cabinet 70. Due to the movement of the heated air, a part of the heat of the heat spreader 34 transmitted from the LED substrate 32 is released to the outside of the backlight chassis 40 as indicated by an arrow 81.
  • the air (heated air) that has moved into the space 73 passes through the second through-hole 75 formed in the side wall 70a of the exterior cabinet 70 to the outside of the exterior cabinet 70 as indicated by an arrow 82. Moving.
  • the heated air moves to the outside of the exterior cabinet 70, the temperature in the exterior cabinet 70 is lowered, and the heat dissipation capability of the heat spreader 34 can be improved.
  • the heat of the heat spreader 34 is transmitted to the backlight chassis 40, and the heat of the backlight chassis 40 is transmitted to the space 73 between the exterior cabinet 70.
  • the heated air in the space 73 moves upward and moves from the second through-hole 75 to the outside (a periphery located outside the exterior cabinet 70).
  • This movement of air also has an effect of suppressing an increase in the temperature of the backlight chassis 40, and therefore, a decrease in the heat dissipation capability of the heat spreader 34 can be suppressed.
  • the concave portion 36 is not formed in the heat spreader 34 and the first through hole 45 and the second through hole 75 are not formed.
  • the heat of the LED substrate 32 on which the LED elements 31 are mounted is transmitted to the heat spreader 34, and the heat of the heat spreader 34 is transmitted to the backlight chassis 40 or only released to the surrounding air. That is, compared with the configuration of the present embodiment, the heat dissipation efficiency of the heat spreader 34 is reduced.
  • the cooling effect can be improved. That is, in the case of the configuration of the present embodiment, the air in the air layer 35 in the recess 36 is heated and lightened, rises, and naturally passes through the first through hole 45 and the second through hole 75. Move outside. The cooling effect due to the movement (discharge) of the heated air is greater than the cooling effect in which the heat of the heat spreader 34 and the backlight chassis 40 propagates to the surrounding air.
  • the heat of the heat spreader 34 and the backlight chassis 40 propagates to the surrounding air, so that a cooling effect can be obtained.
  • the heated air passes through the second through hole 75 and is released to the outside. Therefore, also in this respect, the cooling efficiency and the heat dissipation efficiency can be improved.
  • the recess 36 is formed in the heat spreader 34, the surface area of the portion of the heat spreader 34 located on the back side of the LED substrate 32 can be increased. By increasing the surface area, heat can be efficiently propagated from the heat spreader 34 to the air located in the air layer 35, and as a result, the heat dissipating ability of the heat spreader 34 can be improved.
  • the recess 36 is formed in the upper heat spreader 34A, but also the recess 36 is formed in the lower heat spreader 34B as shown in FIG. Is also possible.
  • the lower heat spreader 34B heats the air layer 35 in the recess 36.
  • the air in the heated air layer 35 is heated and lightened, and moves to the outside of the recess 36.
  • air air that has not yet been heated flows from the outside.
  • the air existing in the space 73 moves to the recess 36 through the first through hole 45 as indicated by an arrow 83. Further, with the movement, air flows from the second through hole 75 of the exterior cabinet 70 as indicated by an arrow 84. Thus, the air which has not yet been heated flows into the recess 36 of the lower heat spreader 34B (arrows 83 and 84), so that the heat dissipation effect of the lower heat spreader 34B can be improved.
  • the second through-hole 75 is formed in the lower part of the exterior cabinet 70 (below the vertical direction 90), so that the second through-hole 75 in the upper part (upper side of the vertical direction 90) of the exterior cabinet 70 is formed.
  • the air escape (arrow 82) can be improved. That is, since air is introduced into the lower part of the exterior cabinet 70 from the second through hole 75 as indicated by the arrow 84, the air can flow from the lower part to the upper part of the exterior cabinet 70. That is, a flow in which air is discharged from the second through-hole 75 in the upper portion of the exterior cabinet 70 (arrow 82) and a flow in which air is introduced into the second through-hole 75 in the lower portion of the exterior cabinet 70 (arrow 84). And work together. Therefore, air that has not yet been heated can be efficiently introduced into the space 73 of the exterior cabinet 70, and as a result, the heat dissipation efficiency of the liquid crystal display device 100 can be improved.
  • the recess 36 having the air layer 35 is formed in the heat spreader 34 that dissipates the heat of the LED substrate 32 on which the plurality of LED elements 31 are arranged, and the first communicates with the air layer 35.
  • the through hole 45 is formed in the side wall 40 a of the backlight chassis 40.
  • a second through hole 75 communicating with a space 73 between the side wall 40 a of the backlight chassis 40 is formed in the side wall 70 a of the exterior cabinet 70. Therefore, after the heat of the LED substrate 32 is transmitted to the heat spreader 34, the air in the air layer 35 in the recess 36 of the heat spreader 34 is heated, and the heated air passes through the first through hole 45 and the second through hole.
  • the heat of the heat spreader 34 can be transmitted to the air layer 35, and the air of the air layer 35 can be discharged to the outside. Therefore, the heat dissipation of the heat spreader 34 can be improved, and as a result, the heat dissipation of the LED element 31 can be improved with a simple configuration.
  • the liquid crystal panel 10 has been described as being arranged along the vertical direction 90.
  • the “vertical direction” (or gravity direction) here is relative to the horizontal plane. It does not mean strictly the direction of 90 °, but means the direction (substantially vertical direction) for defining the arrangement direction of the liquid crystal panel 10. That is, in the configuration of the present embodiment, the liquid crystal panel 10 only needs to be disposed substantially along the vertical direction. In one example, the liquid crystal panel 10 may be disposed in a range of 90 ° ⁇ 15 ° with respect to the horizontal plane. Good.
  • the liquid crystal display device 100 is arranged in the vertical direction (or substantially vertical direction) during operation, the liquid crystal display device 100 of the present embodiment may be arranged in the horizontal direction, for example, during the transfer movement. .
  • the liquid crystal display device 100 of the present embodiment can be modified as shown in FIG.
  • a plurality of recesses 36 are formed in the heat spreader 34.
  • the contact area between the heat spreader 34 and the air layer 35 can be increased, and thereby the heat dissipation of the heat spreader 34 can be improved.
  • a first through hole 45 communicating with each of the plurality of air layers 35 is formed.
  • the recess 36 has a groove shape (for example, a groove extending in the X direction)
  • the first through holes 45 may be arranged side by side along the Y direction or may be arranged at different locations.
  • FIG. 7 is a schematic cross-sectional view of the side wall 70a of the exterior cabinet 70 shown in FIG.
  • the second through hole 75 is formed to extend obliquely.
  • the second through hole 75 is formed in the side wall 70 a of the exterior cabinet 70 so as to extend obliquely with respect to the vertical direction 90.
  • a part of the side wall 70 a of the exterior cabinet 70 is inclined, and the inclined part 77 covers a part of the opening extending in the extending direction of the second through hole 75.
  • the second through-hole 75 obliquely, even if foreign matter such as dust or water drops falls from above the exterior cabinet 70, the foreign matter is removed from the exterior cabinet 70 by the inclined portion 77. It is possible to suppress or alleviate entering the inside.
  • the side wall 70a of the exterior cabinet 70 may be penetrated so that the second through hole 75 extends obliquely.
  • the inclined part (cover part) 77 can be provided by another member of the side wall 70a.
  • the image display unit is configured by using one liquid crystal panel 10, but one image display unit (multi-display) is formed by combining a plurality of liquid crystal panels 10. It is also possible to configure.
  • the liquid crystal display device 100 in which such a plurality of liquid crystal panels 10 are combined can be used for a large-screen digital signage (for example, a display device of 100 inches or more).
  • liquid crystal display device capable of improving the heat dissipation of an LED (light emitting diode) with a simple configuration.

Abstract

Provided is a liquid crystal display device that is capable of improving heat dissipation of an LED by a simple configuration. The liquid crystal display device (100) comprises a liquid crystal panel (10) and a backlight unit (50), wherein the backlight unit (50) comprises: an LED substrate (32) on which a plurality of LED elements (31) are arranged; a heat spreader (34) that disperses the heat of the LED substrate (32); a backlight (30); and a backlight chassis (40). A trench (36) having an air layer (35) is formed on the heat spreader (34), first through holes (45) in communication with the air layer (35) are formed on side walls (40a) of the backlight chassis (40), and second through holes (75) in communication with a space (73) between the side walls (40a) of the backlight chassis (40) are formed on a side wall (70a) of the exterior cabinet (70).

Description

液晶表示装置Liquid crystal display
　本発明は、液晶表示装置に関する。特に、発光ダイオード（ＬＥＤ）を光源として用いたバックライトユニットおよびそれを備えた液晶表示装置に関する。
　なお、本出願は２０１０年１１月８日に出願された日本国特許出願２０１０－２４９８６５号に基づく優先権を主張しており、その出願の全内容は本明細書中に参照として組み入れられている。 The present invention relates to a liquid crystal display device. In particular, the present invention relates to a backlight unit using a light emitting diode (LED) as a light source and a liquid crystal display device including the backlight unit.
Note that this application claims priority based on Japanese Patent Application No. 2010-249865 filed on November 8, 2010, the entire contents of which are incorporated herein by reference. .
　液晶表示装置は、一対の透光性基板の間に液晶が封止されてなる液晶パネルと、当該液晶パネルの背面側に配置されたバックライトとから構成されている。液晶表示装置では、バックライトから出射された光が液晶パネルの背面側から照射されることによって、液晶パネルに表示された画像が視認可能となる。 The liquid crystal display device includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight disposed on the back side of the liquid crystal panel. In the liquid crystal display device, light emitted from the backlight is irradiated from the back side of the liquid crystal panel, so that an image displayed on the liquid crystal panel can be visually recognized.
　従来のバックライトは、発光素子（光源と呼ぶこともある。）として冷陰極蛍光管（ＣＣＦＬ）を用いたものが多かった。しかし、近年は、発光素子として発光ダイオード（ＬＥＤ）を用いたバックライトも増えてきている（例えば、特許文献１、２、３など）。ＬＥＤバックライトは、広い再現の範囲、高い信頼性、および、水銀フリーなどという利点を有している。ＬＥＤバックライトには、液晶パネルの背面側に導光板を配置し、その導光板の側面にＬＥＤを配置して導光板に光を入射させるサイドエッジ方式がある。また、液晶パネルの背面側の直下にＬＥＤをアレイ状に配列した直下型のＬＥＤバックライトもある。 Conventional backlights often use cold cathode fluorescent tubes (CCFLs) as light emitting elements (sometimes referred to as light sources). However, in recent years, backlights using light emitting diodes (LEDs) as light emitting elements have also increased (for example, Patent Documents 1, 2, and 3). The LED backlight has advantages such as a wide reproduction range, high reliability, and mercury-free. An LED backlight includes a side edge method in which a light guide plate is disposed on the back side of a liquid crystal panel, an LED is disposed on a side surface of the light guide plate, and light is incident on the light guide plate. There is also a direct type LED backlight in which LEDs are arranged in an array just below the back side of the liquid crystal panel.
　ＬＥＤバックライトの光源であるＬＥＤに電流を供給して発光させると、ＬＥＤが発熱してＬＥＤの内部温度が上昇する。ここで、ＬＥＤの放熱が不十分である場合には、ＬＥＤ内部の温度が過度に上昇して、発光効率の低下または素子自体の劣化などを引き起こすおそれがある。ＬＥＤは、ＣＣＦＬよりも小さい光源であるため、消費電力が同じであっても、ＬＥＤにおいては熱がより狭い領域に集中する。つまり、ＬＥＤは、単位面積あたりにおける温度が上昇し易い。これらのことから、光源としてＬＥＤを用いる場合には、ＬＥＤからの熱を外部へ効率良く放出する技術が求められる。 When an electric current is supplied to the LED that is the light source of the LED backlight to emit light, the LED generates heat and the internal temperature of the LED rises. Here, when the heat radiation of the LED is insufficient, the temperature inside the LED excessively increases, which may cause a decrease in light emission efficiency or deterioration of the element itself. Since the LED is a light source smaller than the CCFL, even if the power consumption is the same, the heat is concentrated in a narrower region in the LED. That is, the LED tends to increase in temperature per unit area. For these reasons, when an LED is used as a light source, a technique for efficiently releasing heat from the LED to the outside is required.
　特許文献１には、直下型のＬＥＤバックライトにおいて、ＬＥＤの熱を放散する放熱部材が設けられている。また、特許文献２には、直下型のＬＥＤバックライトにおいて、ＬＥＤが配置された放熱板が設けられており、その放熱板は、アルミニウムからなり、フィンが取り付けられている。これらの直下型のバックライトにおいては、大型の放熱部材または放熱板を配置するレイアウトを取りやすく、いずれも、比較的面積の広い放熱板をＬＥＤに接続して、ＬＥＤからの熱を外部に放出するようにしている。 Patent Document 1 includes a heat dissipation member that dissipates heat of an LED in a direct-type LED backlight. Further, Patent Document 2 is provided with a heat radiating plate on which LEDs are arranged in a direct type LED backlight, and the heat radiating plate is made of aluminum and has fins attached thereto. In these direct type backlights, it is easy to take a layout in which a large heat dissipation member or heat dissipation plate is arranged. In both cases, a heat dissipation plate with a relatively large area is connected to the LED to release heat from the LED to the outside. Like to do.
　特許文献３には、パーソナルコンピュータにおいて用いられる表示装置が開示されている。特許文献３に開示された表示装置には、バックライトとして光を出射する光源（ＬＥＤ）が設けられており、ＬＥＤには、複数のフィンを有するヒートシンクが取り付けられている。このバックライトにおいては、導光板を用いずに、ＬＥＤからの光はリフレクターによって反射されて、その反射光は液晶パネルに照射される。複数のフィンを有するヒートシンクは、左右一対で取り付けられており、そのヒートシンクは、ファンからの送風によって冷却することができる。 Patent Document 3 discloses a display device used in a personal computer. The display device disclosed in Patent Document 3 is provided with a light source (LED) that emits light as a backlight, and a heat sink having a plurality of fins is attached to the LED. In this backlight, the light from the LED is reflected by the reflector without using the light guide plate, and the reflected light is irradiated to the liquid crystal panel. A heat sink having a plurality of fins is attached in a pair of left and right, and the heat sink can be cooled by blowing air from a fan.
特開２００９－１５２１４６号公報JP 2009-152146 A 特開２００６－１８１７５号公報JP 2006-18175 A 特開２００６－１０６２７２号公報JP 2006-106272 A
　特許文献１及び２に示した直下型のＬＥＤバックライトでは、ＬＥＤ基板を収納するバックライトシャーシの裏面側に、比較的大型の放熱部材（放熱板、ヒートシンクなど）を配置することが容易なことが多い。一方で、サイドエッジ方式のＬＥＤバックライトの場合、導光板の端面に複数のＬＥＤが配列されるために放熱部材を配置するスペースは、直下型のものと比較すると制約が厳しい。 In the direct type LED backlights shown in Patent Documents 1 and 2, it is easy to place a relatively large heat radiating member (heat radiating plate, heat sink, etc.) on the back side of the backlight chassis that houses the LED substrate. There are many. On the other hand, in the case of a side-edge type LED backlight, since a plurality of LEDs are arranged on the end face of the light guide plate, the space for disposing the heat radiating member is more restrictive than the direct type.
　また、特許文献３に開示された表示装置のように、左右一対に配置されたヒートシンクに、ファンからの風を当てることができる構成にすることができれば、熱対策は良好になる。しかしながら、サイドエッジ方式のＬＥＤバックライトにおけるコスト低減の要請、デザイン上の要請からそのようなことができないことがある。さらに、サイドエッジ方式のＬＥＤバックライトでは、ＬＥＤを左右端部でなく、上下端部に配置する場合もあるが、特許文献３に開示された表示装置ではそのような場合の対応を直ちに取ることはできない。 Further, as in the display device disclosed in Patent Document 3, if a configuration in which the wind from the fan can be applied to the heat sinks arranged in a pair on the left and right sides, the heat countermeasure becomes good. However, such a case may not be possible due to a request for cost reduction and a design requirement in a side-edge type LED backlight. Further, in the side-edge type LED backlight, the LEDs may be arranged at the upper and lower end portions instead of the left and right end portions, but the display device disclosed in Patent Document 3 immediately takes such measures. I can't.
　本発明はかかる点に鑑みてなされたものであり、その主な目的は、簡単な構成によってＬＥＤの放熱性を向上させることができる液晶表示装置を提供することにある。 The present invention has been made in view of such a point, and a main object thereof is to provide a liquid crystal display device capable of improving the heat dissipation of an LED with a simple configuration.
　本発明に係る液晶表示装置は、液晶パネルと、前記液晶パネルに光を照射するバックライトユニットとを備えた液晶表示装置であり、前記バックライトユニットは、複数のＬＥＤ素子が配列されたＬＥＤ基板と、前記ＬＥＤ基板に接触し、当該ＬＥＤ基板の熱を発散するヒートスプレッダーと、前記複数のＬＥＤ素子からの光が導入される導光板と、前記ＬＥＤ基板、前記ヒートスプレッダーおよび前記導光板が収納されるバックライトシャーシとを備え、前記液晶パネルおよび前記バックライトシャーシは、外装キャビネットに収納されており、前記ヒートスプレッダーには、前記バックライトシャーシの側壁との間に空気層を有する凹部が形成されており、前記バックライトシャーシの側壁には、前記空気層に連通する第１の貫通孔が形成されており、前記外装キャビネットの側壁には、前記バックライトシャーシの側壁との間の空間に連通する第２の貫通孔が形成されている。
　ある好適な実施形態において、前記液晶パネルおよび前記導光板は、鉛直方向に延びるように配置され、前記ヒートスプレッダーは、前記導光板の上部側に設けられた上部ヒートスプレッダーと前記導光板の下部側に設けられた下部ヒートスプレッダーとから構成され、前記上部ヒートスプレッダーおよび前記下部ヒートスプレッダーには、それぞれ、前記空気層を有する凹部が形成されており、前記凹部が存在する領域を基準にして鉛直方向に沿った領域において、前記第１の貫通孔および前記第２の貫通孔が形成されている。
　ある好適な実施形態において、前記ヒートスプレッダーは、前記バックライトシャーシの側壁に接触する側壁部位と、前記バックライトシャーシの底面に接触する底面部位とを有しており、前記ヒートスプレッダーの側壁部位における前記導光板の側に、前記ＬＥＤ基板が配置されている。
　ある好適な実施形態において、前記ヒートスプレッダーには、前記空気層を有する凹部が複数形成されており、前記複数の凹部のそれぞれの前記空気層に連通する前記第１の貫通孔が、前記バックライトユニットに形成されている。
　ある好適な実施形態において、前記第２の貫通孔は、前記鉛直方向に対して斜めに延びるように前記外装キャビネットの側壁に形成されている。
　本発明に係るバックライトユニットは、液晶パネルに光を照射するバックライトユニットであり、複数のＬＥＤ素子が配列されたＬＥＤ基板と、前記ＬＥＤ基板に接触し、当該ＬＥＤ基板の熱を発散するヒートスプレッダーと、前記複数のＬＥＤ素子からの光が導入される導光板と、前記ＬＥＤ基板、前記ヒートスプレッダーおよび前記導光板が収納されるバックライトシャーシとを備え、前記バックライトシャーシは、外装キャビネットに収納されており、前記ヒートスプレッダーには、前記バックライトシャーシの側壁との間に空気層を有する凹部が形成されており、
　前記バックライトシャーシの側壁には、前記空気層に連通する第１の貫通孔が形成されており、前記外装キャビネットの側壁には、前記バックライトシャーシの側壁との間の空間に連通する第２の貫通孔が形成されている。 The liquid crystal display device according to the present invention is a liquid crystal display device comprising a liquid crystal panel and a backlight unit for irradiating the liquid crystal panel with light, and the backlight unit is an LED substrate on which a plurality of LED elements are arranged. A heat spreader that contacts the LED substrate and dissipates heat of the LED substrate, a light guide plate into which light from the plurality of LED elements is introduced, and the LED substrate, the heat spreader, and the light guide plate are housed The liquid crystal panel and the backlight chassis are housed in an exterior cabinet, and the heat spreader is formed with a recess having an air layer between the backlight chassis and the side wall of the backlight chassis. And a first through hole communicating with the air layer is formed on a side wall of the backlight chassis. It is, wherein the side wall of the outer cabinet, a second through-hole communicating with the space between the side wall of the backlight chassis is formed.
In a preferred embodiment, the liquid crystal panel and the light guide plate are arranged to extend in a vertical direction, and the heat spreader includes an upper heat spreader provided on an upper side of the light guide plate and a lower side of the light guide plate. The upper heat spreader and the lower heat spreader are each formed with a recess having the air layer, and the vertical direction is based on the region where the recess exists. The first through hole and the second through hole are formed in a region along the line.
In a preferred embodiment, the heat spreader has a side wall portion that contacts a side wall of the backlight chassis, and a bottom surface portion that contacts a bottom surface of the backlight chassis, and in the side wall portion of the heat spreader. The LED substrate is disposed on the light guide plate side.
In a preferred embodiment, the heat spreader includes a plurality of recesses having the air layer, and the first through-holes communicating with the air layers of the plurality of recesses include the backlight. Formed in the unit.
In a preferred embodiment, the second through hole is formed in a side wall of the exterior cabinet so as to extend obliquely with respect to the vertical direction.
A backlight unit according to the present invention is a backlight unit that irradiates light to a liquid crystal panel, and an LED substrate on which a plurality of LED elements are arranged, and a heat that contacts the LED substrate and dissipates heat of the LED substrate. A spreader; a light guide plate into which light from the plurality of LED elements is introduced; and a backlight chassis in which the LED substrate, the heat spreader and the light guide plate are housed, and the backlight chassis is attached to an exterior cabinet. The heat spreader has a recess having an air layer between the side wall of the backlight chassis and the heat spreader,
A first through hole communicating with the air layer is formed in a side wall of the backlight chassis, and a second hole communicating with a side wall of the backlight chassis is formed in the side wall of the exterior cabinet. Through-holes are formed.
　本発明によれば、ヒートスプレッダーは、バックライトシャーシの側壁との間に空気層を有する凹部が形成されており、バックライトシャーシの側壁には、空気層に連通する第１の貫通孔が形成されており、外装キャビネットの側壁には、バックライトシャーシの側壁との間の空間に連通する第２の貫通孔が形成されている。したがって、ＬＥＤ基板の熱がヒートスプレッダーに伝わった後、ヒートスプレッダーの凹部における空気層の空気が加熱され、加熱された空気は、第１の貫通孔および第２の貫通孔を通って外部に移動する。したがって、ヒートスプレッダーの熱をバックライトシャーシに伝える放熱に加えて、ヒートスプレッダーの熱を空気層に伝えて、空気層の空気を外部に出すことができる。それゆえに、ヒートスプレッダーの放熱性を向上させることができ、その結果、簡単な構成によってＬＥＤの放熱性を向上させることができる。 According to the present invention, the heat spreader is formed with the recess having the air layer between the side wall of the backlight chassis, and the first through hole communicating with the air layer is formed on the side wall of the backlight chassis. In addition, a second through hole communicating with a space between the side wall of the backlight chassis is formed on the side wall of the exterior cabinet. Therefore, after the heat of the LED substrate is transmitted to the heat spreader, the air in the air layer in the recess of the heat spreader is heated, and the heated air moves to the outside through the first through hole and the second through hole. To do. Therefore, in addition to the heat radiation that transmits the heat of the heat spreader to the backlight chassis, the heat of the heat spreader can be transmitted to the air layer, and the air in the air layer can be discharged to the outside. Therefore, the heat dissipation of the heat spreader can be improved, and as a result, the heat dissipation of the LED can be improved with a simple configuration.
本発明の実施形態に係る液晶表示装置１００の構成を模式的に示す斜視図である。1 is a perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention. 液晶表示装置１００の構成を模式的に示す分解斜視図である。2 is an exploded perspective view schematically showing a configuration of a liquid crystal display device 100. FIG. 液晶表示装置１００の上部の構成を模式的に示す断面図である。2 is a cross-sectional view schematically showing the configuration of the upper part of the liquid crystal display device 100. FIG. 液晶表示装置１００の下部の構成を模式的に示す断面図である。2 is a cross-sectional view schematically showing a configuration of a lower part of the liquid crystal display device 100. FIG. 液晶表示装置１００の改変例の構成を模式的に示す断面図である。4 is a cross-sectional view schematically showing a configuration of a modified example of the liquid crystal display device 100. FIG. 液晶表示装置１００の改変例における外装キャビネット７０の構成を模式的に示す斜視図である。It is a perspective view which shows typically the structure of the exterior cabinet 70 in the modification of the liquid crystal display device 100. FIG. 液晶表示装置１００の改変例における外装キャビネット７０の構成を模式的に示す断面図である。4 is a cross-sectional view schematically showing a configuration of an exterior cabinet 70 in a modified example of the liquid crystal display device 100. FIG.
　以下、図面を参照しながら、本発明の実施形態を説明する。以下の図面においては、説明の簡潔化のために、実質的に同一の機能を有する構成要素を同一の参照符号で示す。なお、本発明は以下の実施形態に限定されない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.
　図１は、本発明の実施形態に係る液晶表示装置１００の構成を模式的に示す斜視図である。図１に示すように、本実施形態の液晶表示装置１００は、画像を表示する液晶パネル１０を備えている。液晶パネル１０の外枠領域には、外装キャビネット７０が配置されている。図示した例では、液晶パネル１０は、矩形の形状を有しており、鉛直方向（重力方向）９０に沿って配置されている。 FIG. 1 is a perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention. As shown in FIG. 1, the liquid crystal display device 100 of this embodiment includes a liquid crystal panel 10 that displays an image. An exterior cabinet 70 is disposed in the outer frame area of the liquid crystal panel 10. In the illustrated example, the liquid crystal panel 10 has a rectangular shape and is arranged along the vertical direction (gravity direction) 90.
　図２は、本実施形態の液晶表示装置１００の構成を模式的に示す分解斜視図である。図２に示すように、本実施形態の液晶表示装置１００は、液晶パネル１０と、液晶パネル１０に光を照射するバックライトユニット５０とから構成されている。 FIG. 2 is an exploded perspective view schematically showing the configuration of the liquid crystal display device 100 of the present embodiment. As shown in FIG. 2, the liquid crystal display device 100 of this embodiment includes a liquid crystal panel 10 and a backlight unit 50 that irradiates the liquid crystal panel 10 with light.
　本実施形態のバックライトユニット５０は、複数のＬＥＤ素子３１が配列されたＬＥＤ基板３２と、ＬＥＤ基板３２の熱を発散するヒートスプレッダー３４と、導光板３０と、バックライトシャーシ４０とから構成されている。ヒートスプレッダー３４は、ＬＥＤ基板３２に接触しており、ＬＥＤ素子３１の放熱部材となっている。ＬＥＤ素子３１からの光は、導光板３０に導入される。具体的には、ＬＥＤ素子３１から出射した光は、導光板３０のうちの端面（ＬＥＤ基板３２に対向する面）３０ａに入射した後、導光板３０を伝搬し、導光板３０の主面３０ｍから出て、液晶パネル１０の裏面側を照射する。バックライトシャーシ４０には、ＬＥＤ基板３２、ヒートスプレッダー３４および導光板３０が収納される。 The backlight unit 50 according to the present embodiment includes an LED substrate 32 on which a plurality of LED elements 31 are arranged, a heat spreader 34 that radiates heat from the LED substrate 32, a light guide plate 30, and a backlight chassis 40. ing. The heat spreader 34 is in contact with the LED substrate 32 and serves as a heat dissipation member for the LED element 31. Light from the LED element 31 is introduced into the light guide plate 30. Specifically, light emitted from the LED element 31 is incident on an end surface (a surface facing the LED substrate 32) 30 a of the light guide plate 30, then propagates through the light guide plate 30, and the main surface 30 m of the light guide plate 30. Then, the back side of the liquid crystal panel 10 is irradiated. The backlight chassis 40 houses the LED substrate 32, the heat spreader 34, and the light guide plate 30.
　本実施形態の構成では、液晶パネル１０およびバックライトシャーシ４０は、外装キャビネット７０に収納されている。この例における外装キャビネット７０は、液晶パネル１０の外枠領域を保持する表面側キャビネット（ベゼル）７１と、バックライトシャーシ４０を収納可能な裏面側キャビネット７２とから構成されている。また、図示した構成では、液晶パネル１０と導光板３０との間には、光学シート２０（２０ａ～２０ｃ）が設けられている。この例では、光学シート２０ａから２０ｃは、それぞれ、例えば、レンズシート、プリズムシート、拡散板であるが、他の光学部材を用いることも可能である。 In the configuration of the present embodiment, the liquid crystal panel 10 and the backlight chassis 40 are accommodated in the exterior cabinet 70. The exterior cabinet 70 in this example includes a front side cabinet (bezel) 71 that holds the outer frame region of the liquid crystal panel 10 and a back side cabinet 72 that can accommodate the backlight chassis 40. In the illustrated configuration, an optical sheet 20 (20 a to 20 c) is provided between the liquid crystal panel 10 and the light guide plate 30. In this example, the optical sheets 20a to 20c are, for example, a lens sheet, a prism sheet, and a diffusion plate, but other optical members can also be used.
　本実施形態のヒートスプレッダー３４には、バックライトシャーシ４０の側壁４０ａの間に空気層３５を有する凹部３６が形成されている。この例では、ヒートスプレッダー３４の背面（ＬＥＤ素子３１が実装された表面に対する背面）に、溝からなる凹部３６が設けられている。この凹部３６には、空気層３５が存在している。さらに、バックライトシャーシ４０の側壁４０ａには、空気層３５に連通する第１の貫通孔４５が形成されている。外装キャビネット７０の側壁７０ａには、バックライトシャーシ４０の側壁４０ａとの間の空間７３に連通する第２の貫通孔７５が形成されている。 In the heat spreader 34 of the present embodiment, a recess 36 having an air layer 35 is formed between the side walls 40 a of the backlight chassis 40. In this example, a recess 36 made of a groove is provided on the back surface of the heat spreader 34 (the back surface with respect to the surface on which the LED elements 31 are mounted). An air layer 35 exists in the recess 36. Further, a first through hole 45 communicating with the air layer 35 is formed in the side wall 40 a of the backlight chassis 40. A second through hole 75 communicating with a space 73 between the side wall 40 a of the backlight chassis 40 is formed in the side wall 70 a of the exterior cabinet 70.
　本実施形態の液晶パネル１０は、概して、全体として矩形の形状を有しており、一対の透光性基板（ガラス基板）１１および１２から構成されている。両基板１１および１２は、互いに対向して配置され、その間には液晶層（不図示）が設けられている。液晶層は、基板１１および１２の間の電界印加に伴って光学特定が変化する液晶材料からなる。 The liquid crystal panel 10 of the present embodiment generally has a rectangular shape as a whole, and is composed of a pair of translucent substrates (glass substrates) 11 and 12. Both the substrates 11 and 12 are arranged to face each other, and a liquid crystal layer (not shown) is provided between them. The liquid crystal layer is made of a liquid crystal material whose optical characteristics change with application of an electric field between the substrates 11 and 12.
　なお、基板１１および１２の外縁部には、シール剤（不図示）が設けられて、液晶層を封止している。また、両基板１１および１２の外面には、それぞれ、偏光板１３、１３が貼り付けられている。本実施形態では、基板１１および１２のうち、裏側がアレイ基板（ＴＦＴ基板）１１であり、一方、表側がカラーフィルタ基板（ＣＦ基板）１２である。なお、本実施形態の液晶パネル１０は、例えば、２０インチから１１０インチ（典型的には、３２インチから６０インチ）のサイズを有している。 A sealing agent (not shown) is provided on the outer edge portions of the substrates 11 and 12 to seal the liquid crystal layer. Further, polarizing plates 13 and 13 are attached to the outer surfaces of both the substrates 11 and 12, respectively. In this embodiment, the back side of the substrates 11 and 12 is the array substrate (TFT substrate) 11, while the front side is the color filter substrate (CF substrate) 12. Note that the liquid crystal panel 10 of the present embodiment has a size of, for example, 20 inches to 110 inches (typically 32 inches to 60 inches).
　本実施形態のバックライトユニット５０は、導光板３０を備えたサイドエッジ方式のＬＥＤバックライトである。図示した構成において、導光板３０、ＬＥＤ基板３２及びヒートスプレッダー３４は、バックライトシャーシ４０の側壁４０ａに囲まれた領域（底面４０ｂが位置する領域）内に収納される。バックライトシャーシ４０は、金属材料（例えば、アルミニウム、鉄など）から構成されており、バックライトユニット５０および液晶パネル１０の裏面全体を覆う板金部材である。 The backlight unit 50 of the present embodiment is a side-edge type LED backlight including the light guide plate 30. In the illustrated configuration, the light guide plate 30, the LED substrate 32, and the heat spreader 34 are housed in a region surrounded by the side wall 40 a of the backlight chassis 40 (region where the bottom surface 40 b is located). The backlight chassis 40 is made of a metal material (for example, aluminum, iron, etc.), and is a sheet metal member that covers the entire back surface of the backlight unit 50 and the liquid crystal panel 10.
　本実施形態のヒートスプレッダー３４は、熱伝導性の良好な金属材料（例えば、アルミニウム）から構成されている。図示したヒートスプレッダー３４は、Ｌ字型の形状を有している。そして、ヒートスプレッダー３４の側壁部位３４ａにおける導光板３０の側に、ＬＥＤ基板３２が配置されている。ＬＥＤ基板３２には、導光板３０の端面３０ａに対向するように、ＬＥＤ素子３１が一列に配列されている。各ＬＥＤ素子３１は、例えば白色ＬＥＤチップからなる。 The heat spreader 34 of the present embodiment is made of a metal material (for example, aluminum) having good thermal conductivity. The illustrated heat spreader 34 has an L-shape. The LED substrate 32 is disposed on the side of the light guide plate 30 in the side wall portion 34 a of the heat spreader 34. The LED elements 31 are arranged in a row on the LED substrate 32 so as to face the end face 30 a of the light guide plate 30. Each LED element 31 consists of a white LED chip, for example.
　また、導光板３０及びＬＥＤ基板３２が収納されたバックライトシャーシ４０は、外装キャビネット７０の側壁７０ａに囲まれた領域（底面７２ｂが位置する領域）内に収納される。外装キャビネット７０は、例えば、金属材料（典型的には、アルミニウム、鉄）、または、樹脂材料構成されている。この例では、外装キャビネット７０は、表面側キャビネット（ベゼル）７１と、裏面側キャビネット７２とから構成されており、そして、表面側キャビネット７１および裏面側キャビネット７２における両者の側壁７０ａを貫通する第２の貫通孔７５が形成されている。 In addition, the backlight chassis 40 in which the light guide plate 30 and the LED substrate 32 are accommodated is accommodated in an area surrounded by the side wall 70a of the exterior cabinet 70 (area where the bottom surface 72b is located). The exterior cabinet 70 is made of, for example, a metal material (typically aluminum or iron) or a resin material. In this example, the exterior cabinet 70 is composed of a front side cabinet (bezel) 71 and a back side cabinet 72, and a second penetrating both side walls 70 a in the front side cabinet 71 and the back side cabinet 72. The through-hole 75 is formed.
　本実施形態の構成においては、液晶パネル１０および導光板３０（すなわち、主面３０ｍ）は、鉛直方向（ここでは、Ｚ方向）に延びるように配置されている。また、ヒートスプレッダー３４は、導光板３０の上部側に設けられた上部ヒートスプレッダー３４Ａと、導光板３０の下部側に設けられた下部ヒートスプレッダー３４Ｂとから構成されている。本実施形態の構成では、上部ヒートスプレッダー３４Ａおよび下部ヒートスプレッダー３４Ｂのそれぞれに、空気層３５を有する凹部３６が形成されている。 In the configuration of the present embodiment, the liquid crystal panel 10 and the light guide plate 30 (that is, the main surface 30m) are arranged to extend in the vertical direction (here, the Z direction). The heat spreader 34 includes an upper heat spreader 34 </ b> A provided on the upper side of the light guide plate 30 and a lower heat spreader 34 </ b> B provided on the lower side of the light guide plate 30. In the configuration of the present embodiment, a recess 36 having an air layer 35 is formed in each of the upper heat spreader 34A and the lower heat spreader 34B.
　次に、図３および図４を参照しながら、本実施形態の液晶表示装置１００の構成について更に説明する。図３は、本実施形態の液晶表示装置１００の上部の構成を模式的に示す断面図である。そして、図４は、本実施形態の液晶表示装置１００の下部の構成を模式的に示す断面図である。 Next, the configuration of the liquid crystal display device 100 of the present embodiment will be further described with reference to FIGS. 3 and 4. FIG. 3 is a cross-sectional view schematically showing the configuration of the upper part of the liquid crystal display device 100 of the present embodiment. FIG. 4 is a cross-sectional view schematically showing the configuration of the lower part of the liquid crystal display device 100 of the present embodiment.
　図３に示すように、ヒートスプレッダー３４（上部ヒートスプレッダー３４Ａ）は、バックライトシャーシ４０の側壁４０ａに接触する側壁部位３４ａと、バックライトシャーシ４０の底面４０ｂに接触する底面部位３４ｂとを有している。ヒートスプレッダー３４は、熱が伝導する形でバックライトシャーシ４０に接触していればよい。したがって、ヒートスプレッダー３４は、直接、バックライトシャーシ４０に接触している形態の他、他の構成要素（例えば、熱伝導性に優れた接着剤層、熱伝導シート）を介してバックライトシャーシ４０に接触させることも可能である。なお、図示した例では、ヒートスプレッダー３４は、断面Ｌ字型の形状の構造を有しているが、その形状のものに限らず他の構造のものを使用することも可能である。 As shown in FIG. 3, the heat spreader 34 (upper heat spreader 34 </ b> A) has a side wall portion 34 a that contacts the side wall 40 a of the backlight chassis 40 and a bottom surface portion 34 b that contacts the bottom surface 40 b of the backlight chassis 40. ing. The heat spreader 34 only needs to be in contact with the backlight chassis 40 in a form in which heat is conducted. Therefore, the heat spreader 34 is in direct contact with the backlight chassis 40, and in addition to the backlight chassis 40 via other components (for example, an adhesive layer having excellent thermal conductivity, a thermal conductive sheet). It is also possible to make it contact. In the illustrated example, the heat spreader 34 has a structure with an L-shaped cross section. However, the heat spreader 34 is not limited to that shape, and other structures can be used.
　また、ヒートスプレッダー３４の側壁部位３４ａにおける導光板３０の側には、ＬＥＤ基板３２が配置されている。ＬＥＤ基板３２は、ヒートスプレッダー３４の側壁部位３４ａの表面に接触している。また、ＬＥＤ基板３２は、ヒートスプレッダー３４と熱が伝導する形で接触していればよい。したがって、ＬＥＤ基板３２は、直接、ヒートスプレッダー３４に接触している形態の他、他の構成要素（例えば、熱伝導性に優れた接着剤層、熱伝導シート）を介してヒートスプレッダー３４に接触させることも可能である。 Further, the LED substrate 32 is disposed on the side of the light guide plate 30 in the side wall portion 34a of the heat spreader 34. The LED substrate 32 is in contact with the surface of the side wall portion 34 a of the heat spreader 34. Moreover, the LED board 32 should just be in contact with the heat spreader 34 in the form which heat conducts. Therefore, the LED substrate 32 is in direct contact with the heat spreader 34 in addition to the form in contact with the heat spreader 34, and is in contact with the heat spreader 34 via other components (for example, an adhesive layer having excellent thermal conductivity, a thermal conductive sheet). It is also possible to make it.
　ヒートスプレッダー３４には、凹部３６が形成されており、凹部３６中に存在する空気層３５はＬＥＤ基板３２からの熱によって加熱されることになる。具体的には、ヒートスプレッダー３４の凹部３６は、側壁部位３４ａのうち、ＬＥＤ基板３２が配置される面と反対側に形成されている。ヒートスプレッダー３４の凹部３６は、バックライトシャーシ４０の側壁４０ａで塞がれ、それによって、凹部３６内に空気層３５が形成されている。 A recess 36 is formed in the heat spreader 34, and the air layer 35 existing in the recess 36 is heated by heat from the LED substrate 32. Specifically, the recess 36 of the heat spreader 34 is formed on the side of the side wall portion 34a opposite to the surface on which the LED substrate 32 is disposed. The recess 36 of the heat spreader 34 is blocked by the side wall 40 a of the backlight chassis 40, thereby forming an air layer 35 in the recess 36.
　バックライトシャーシ４０の側壁４０ａのうち、空気層３５が位置する部位には、第１の貫通孔４５が形成されている。図３に示した例では、Ｙ方向に沿って、複数の第１の貫通孔４５を形成しているが、図２に示すように、Ｙ方向に沿って、１つの第１の貫通孔４５を形成しても構わない。 A first through hole 45 is formed in a portion of the side wall 40a of the backlight chassis 40 where the air layer 35 is located. In the example shown in FIG. 3, a plurality of first through holes 45 are formed along the Y direction. However, as shown in FIG. 2, one first through hole 45 is formed along the Y direction. May be formed.
　また、第１の貫通孔４５が形成された領域の上方（鉛直方向９０の上方）には、外装キャビネット７０の側壁７０ａが位置しており、その側壁７０ａには、第２の貫通孔７５が形成されている。図３に示した例では、Ｙ方向に沿って、複数の第２の貫通孔７５を形成しているが、図２に示すように、Ｙ方向に沿って、１つの第２の貫通孔７５を形成しても構わない。 The side wall 70a of the exterior cabinet 70 is located above the region where the first through hole 45 is formed (above the vertical direction 90), and the second through hole 75 is formed on the side wall 70a. Is formed. In the example shown in FIG. 3, a plurality of second through holes 75 are formed along the Y direction. However, as shown in FIG. 2, one second through hole 75 is formed along the Y direction. May be formed.
　さらに、図３に示した構成では、凹部３６が存在する領域を基準にして鉛直方向９０に沿った領域において、第１の貫通孔４５および第２の貫通孔７５が存在している。具体的には、凹部３６が存在する領域の上方（鉛直方向９０の上方）において、バックライトシャーシ４０に第１の貫通孔４５が形成され、かつ、外装キャビネット７０に第２の貫通孔７５が形成されている。 Further, in the configuration shown in FIG. 3, the first through hole 45 and the second through hole 75 exist in a region along the vertical direction 90 with respect to the region where the recess 36 exists. Specifically, the first through hole 45 is formed in the backlight chassis 40 and the second through hole 75 is formed in the exterior cabinet 70 above the region where the recess 36 exists (above the vertical direction 90). Is formed.
　ＬＥＤ基板３２に実装されたＬＥＤ素子３１は光３９を出射し、その光３９は、導光板３０の端面３０ａに入射される。導光板３０を導波した光は、導光板３０の主面３０ｍから出て、光学シート２０を介して液晶パネル１０を照射する。そして、液晶パネル１０を透過した光によって、画像が表示されることになる。 The LED element 31 mounted on the LED substrate 32 emits light 39, and the light 39 is incident on the end surface 30 a of the light guide plate 30. The light guided through the light guide plate 30 exits from the main surface 30 m of the light guide plate 30 and irradiates the liquid crystal panel 10 via the optical sheet 20. Then, an image is displayed by the light transmitted through the liquid crystal panel 10.
　ＬＥＤ素子３１が動作すると、ＬＥＤ素子３１は発熱し、その熱はＬＥＤ基板３２に伝わる。ＬＥＤ基板３２の熱は、ヒートスプレッダー３４（３４Ａ）に伝わり、それによって、ＬＥＤ素子３１およびＬＥＤ基板３２の放熱が実行される。ヒートスプレッダー３４の熱によって、凹部３６中の空気層３５が加熱される。加熱された空気層３５の空気は、第１の貫通孔４５を通って、バックライトシャーシ４０の側壁４０ａと、外装キャビネット７０の側壁７０ａとの間に位置する空間７３に移動する。この加熱された空気の移動によって、ＬＥＤ基板３２から伝わったヒートスプレッダー３４の熱の一部は、矢印８１に示すようにバックライトシャーシ４０の外に放出される。 When the LED element 31 operates, the LED element 31 generates heat, and the heat is transmitted to the LED substrate 32. The heat of the LED board 32 is transmitted to the heat spreader 34 (34A), whereby the LED element 31 and the LED board 32 are dissipated. The air layer 35 in the recess 36 is heated by the heat of the heat spreader 34. The heated air in the air layer 35 passes through the first through hole 45 and moves to the space 73 located between the side wall 40 a of the backlight chassis 40 and the side wall 70 a of the exterior cabinet 70. Due to the movement of the heated air, a part of the heat of the heat spreader 34 transmitted from the LED substrate 32 is released to the outside of the backlight chassis 40 as indicated by an arrow 81.
　その後、空間７３に移動した空気（加熱された空気）は、矢印８２に示すように、外装キャビネット７０の側壁７０ａに形成された第２の貫通孔７５を通過して、外装キャビネット７０の外部に移動する。外装キャビネット７０の外部に、加熱された空気が移動することによって、外装キャビネット７０内の温度が下がり、ヒートスプレッダー３４の放熱能力を向上させることができる。 Thereafter, the air (heated air) that has moved into the space 73 passes through the second through-hole 75 formed in the side wall 70a of the exterior cabinet 70 to the outside of the exterior cabinet 70 as indicated by an arrow 82. Moving. When the heated air moves to the outside of the exterior cabinet 70, the temperature in the exterior cabinet 70 is lowered, and the heat dissipation capability of the heat spreader 34 can be improved.
　また、ヒートスプレッダー３４の熱はバックライトシャーシ４０に伝わり、そのバックライトシャーシ４０の熱は、外装キャビネット７０との間の空間７３に伝わる。空間７３における加熱された空気は、上方に移動して、第２の貫通孔７５から外部（外装キャビネット７０の外に位置する周囲）に移動する。この空気の移動によっても、バックライトシャーシ４０の温度の上昇を抑制する効果があり、それゆえに、ヒートスプレッダー３４の放熱能力の低下を抑制することができる。 Further, the heat of the heat spreader 34 is transmitted to the backlight chassis 40, and the heat of the backlight chassis 40 is transmitted to the space 73 between the exterior cabinet 70. The heated air in the space 73 moves upward and moves from the second through-hole 75 to the outside (a periphery located outside the exterior cabinet 70). This movement of air also has an effect of suppressing an increase in the temperature of the backlight chassis 40, and therefore, a decrease in the heat dissipation capability of the heat spreader 34 can be suppressed.
　ここで仮に、ヒートスプレッダー３４に凹部３６が形成されておらず、また、第１の貫通孔４５および第２の貫通孔７５も形成されていない場合を想定する。この場合、ＬＥＤ素子３１が実装されたＬＥＤ基板３２の熱は、ヒートスプレッダー３４に伝わり、ヒートスプレッダー３４の熱は、バックライトシャーシ４０に伝わるか、周囲の空気に放出されるにとどまる。すなわち、本実施形態の構成と比較すると、ヒートスプレッダー３４の放熱効率は低下してしまう。 Here, it is assumed that the concave portion 36 is not formed in the heat spreader 34 and the first through hole 45 and the second through hole 75 are not formed. In this case, the heat of the LED substrate 32 on which the LED elements 31 are mounted is transmitted to the heat spreader 34, and the heat of the heat spreader 34 is transmitted to the backlight chassis 40 or only released to the surrounding air. That is, compared with the configuration of the present embodiment, the heat dissipation efficiency of the heat spreader 34 is reduced.
　一方、本実施形態の構成では加熱された空気が外部に逃げる流れ（矢印８１および８２）があるので、ヒートスプレッダー３４およびバックライトシャーシ４０から周囲の空気に熱を放出させる場合と比較して、冷却効果を向上させることができる。すなわち、本実施形態の構成の場合、凹部３６内における空気層３５の空気は、加熱されて軽くなり、上昇して、自然と第１の貫通孔４５および第２の貫通孔７５を通過して外部に移動する。この加熱された空気の移動（排出）による冷却効果は、ヒートスプレッダー３４およびバックライトシャーシ４０の熱が周囲の空気に伝搬する冷却効果よりも大きい。 On the other hand, in the configuration of the present embodiment, since there is a flow (arrows 81 and 82) in which heated air escapes to the outside, compared to the case where heat is released from the heat spreader 34 and the backlight chassis 40 to the surrounding air, The cooling effect can be improved. That is, in the case of the configuration of the present embodiment, the air in the air layer 35 in the recess 36 is heated and lightened, rises, and naturally passes through the first through hole 45 and the second through hole 75. Move outside. The cooling effect due to the movement (discharge) of the heated air is greater than the cooling effect in which the heat of the heat spreader 34 and the backlight chassis 40 propagates to the surrounding air.
　また、本実施形態の構成でも、ヒートスプレッダー３４およびバックライトシャーシ４０の熱は周囲の空気に伝搬するので、それによる冷却効果も得ることができる。そして、本実施形態の構成においては、ヒートスプレッダー３４およびバックライトシャーシ４０の熱が周囲の空気に伝搬した後、その加熱された空気は、第２の貫通孔７５を通過して外部に放出されるので、その点でも、冷却効率・放熱効率を向上させることができる。 Also in the configuration of this embodiment, the heat of the heat spreader 34 and the backlight chassis 40 propagates to the surrounding air, so that a cooling effect can be obtained. In the configuration of the present embodiment, after the heat of the heat spreader 34 and the backlight chassis 40 propagates to the surrounding air, the heated air passes through the second through hole 75 and is released to the outside. Therefore, also in this respect, the cooling efficiency and the heat dissipation efficiency can be improved.
　加えて、ヒートスプレッダー３４に凹部３６を形成していることから、ヒートスプレッダー３４のうちのＬＥＤ基板３２の裏側に位置する部位の表面積を大きくすることができる。この表面積の増大によって、ヒートスプレッダー３４から、空気層３５に位置する空気へと効率良く熱を伝播することができ、その結果、ヒートスプレッダー３４の放熱能力を向上させることができる。 In addition, since the recess 36 is formed in the heat spreader 34, the surface area of the portion of the heat spreader 34 located on the back side of the LED substrate 32 can be increased. By increasing the surface area, heat can be efficiently propagated from the heat spreader 34 to the air located in the air layer 35, and as a result, the heat dissipating ability of the heat spreader 34 can be improved.
　本実施形態の液晶表示装置１００では、図３に示すように、上部ヒートスプレッダー３４Ａに凹部３６を形成する構成だけでなく、図４に示すように、下部ヒートスプレッダー３４Ｂに凹部３６を形成することも可能である。 In the liquid crystal display device 100 of this embodiment, as shown in FIG. 3, not only the recess 36 is formed in the upper heat spreader 34A, but also the recess 36 is formed in the lower heat spreader 34B as shown in FIG. Is also possible.
　下部ヒートスプレッダー３４Ｂに凹部３６を形成した場合、下部ヒートスプレッダー３４Ｂは、凹部３６内の空気層３５を加熱する。加熱された空気層３５の空気は、加熱されて軽くなり、凹部３６の外部へと移動する。その空気の移動を補うように、外部から空気（まだ加熱されていない空気）が流れ込む。 When the recess 36 is formed in the lower heat spreader 34B, the lower heat spreader 34B heats the air layer 35 in the recess 36. The air in the heated air layer 35 is heated and lightened, and moves to the outside of the recess 36. In order to compensate for the movement of the air, air (air that has not yet been heated) flows from the outside.
　具体的には、空間７３に存在する空気が、矢印８３に示すように第１の貫通孔４５を通って凹部３６に移動する。さらに、その移動に伴って、外装キャビネット７０の第２の貫通孔７５から矢印８４のように空気が流れ込む。このように、下部ヒートスプレッダー３４Ｂの凹部３６に、まだ加熱されていない空気が流れ込む（矢印８３、８４）ことによって、下部ヒートスプレッダー３４Ｂの放熱の効果を向上させることができる。 Specifically, the air existing in the space 73 moves to the recess 36 through the first through hole 45 as indicated by an arrow 83. Further, with the movement, air flows from the second through hole 75 of the exterior cabinet 70 as indicated by an arrow 84. Thus, the air which has not yet been heated flows into the recess 36 of the lower heat spreader 34B (arrows 83 and 84), so that the heat dissipation effect of the lower heat spreader 34B can be improved.
　さらに、外装キャビネット７０の下部（鉛直方向９０の下側）に第２の貫通孔７５が形成されていることによって、外装キャビネット７０の上部（鉛直方向９０の上側）の第２の貫通孔７５からの空気の抜け（矢印８２）を良くすることができる。すなわち、外装キャビネット７０の下部に第２の貫通孔７５から矢印８４に示すように空気が導入されるので、外装キャビネット７０の下部から上部への空気の流れができる。つまり、外装キャビネット７０の上部における第２の貫通孔７５から空気が排出される流れ（矢印８２）と、外装キャビネット７０の下部における第２の貫通孔７５に空気が導入される流れ（矢印８４）とが連係する。したがって、外装キャビネット７０の空間７３に、まだ加熱されていない空気を効率良く導入することができ、その結果、液晶表示装置１００の放熱効率を向上させることができる。 Further, the second through-hole 75 is formed in the lower part of the exterior cabinet 70 (below the vertical direction 90), so that the second through-hole 75 in the upper part (upper side of the vertical direction 90) of the exterior cabinet 70 is formed. The air escape (arrow 82) can be improved. That is, since air is introduced into the lower part of the exterior cabinet 70 from the second through hole 75 as indicated by the arrow 84, the air can flow from the lower part to the upper part of the exterior cabinet 70. That is, a flow in which air is discharged from the second through-hole 75 in the upper portion of the exterior cabinet 70 (arrow 82) and a flow in which air is introduced into the second through-hole 75 in the lower portion of the exterior cabinet 70 (arrow 84). And work together. Therefore, air that has not yet been heated can be efficiently introduced into the space 73 of the exterior cabinet 70, and as a result, the heat dissipation efficiency of the liquid crystal display device 100 can be improved.
　本実施形態の構成によれば、複数のＬＥＤ素子３１が配列されたＬＥＤ基板３２の熱を発散するヒートスプレッダー３４に、空気層３５を有する凹部３６が形成され、空気層３５に連通する第１の貫通孔４５がバックライトシャーシ４０の側壁４０ａに形成されている。また、外装キャビネット７０の側壁７０ａには、バックライトシャーシ４０の側壁４０ａとの間の空間７３に連通する第２の貫通孔７５が形成されている。したがって、ＬＥＤ基板３２の熱がヒートスプレッダー３４に伝わった後、ヒートスプレッダー３４の凹部３６における空気層３５の空気が加熱され、加熱された空気は、第１の貫通孔４５および第２の貫通孔７５を通って外部に移動する（矢印８１、８２）。したがって、ヒートスプレッダー３４の熱をバックライトシャーシ４０に伝える放熱に加えて、ヒートスプレッダー３４の熱を空気層３５に伝えて、空気層３５の空気を外部に出すことができる。それゆえに、ヒートスプレッダー３４の放熱性を向上させることができ、その結果、簡単な構成によってＬＥＤ素子３１の放熱性を向上させることができる。 According to the configuration of the present embodiment, the recess 36 having the air layer 35 is formed in the heat spreader 34 that dissipates the heat of the LED substrate 32 on which the plurality of LED elements 31 are arranged, and the first communicates with the air layer 35. The through hole 45 is formed in the side wall 40 a of the backlight chassis 40. Further, a second through hole 75 communicating with a space 73 between the side wall 40 a of the backlight chassis 40 is formed in the side wall 70 a of the exterior cabinet 70. Therefore, after the heat of the LED substrate 32 is transmitted to the heat spreader 34, the air in the air layer 35 in the recess 36 of the heat spreader 34 is heated, and the heated air passes through the first through hole 45 and the second through hole. It moves outside through 75 (arrows 81 and 82). Therefore, in addition to the heat radiation that transmits the heat of the heat spreader 34 to the backlight chassis 40, the heat of the heat spreader 34 can be transmitted to the air layer 35, and the air of the air layer 35 can be discharged to the outside. Therefore, the heat dissipation of the heat spreader 34 can be improved, and as a result, the heat dissipation of the LED element 31 can be improved with a simple configuration.
　なお、本実施形態の液晶表示装置１００において、例えば液晶パネル１０が鉛直方向９０に沿って配置されることを説明したが、ここでの「鉛直方向」（または、重力方向）は、水平面に対して９０°の方向のことをだけを厳密に意味しているのではなく、液晶パネル１０の配置方向を規定するためにおける方向（略鉛直方向）の意味である。すなわち、本実施形態の構成において、液晶パネル１０は、実質的に鉛直方向に沿って配置されていればよく、一例では、水平面を基準にして９０°±１５°の範囲で配置されていればよい。そのような範囲で配置されていても、空気層３５の空気が加熱されると、第１の貫通孔４５及び第２の貫通孔から移動するので、放熱性の向上の効果を得ることができる。また、動作時において液晶表示装置１００が鉛直方向（または略鉛直方向）に配置されるのであるから、例えば搬送移動中において、本実施形態の液晶表示装置１００を水平方向に配置しても構わない。 In the liquid crystal display device 100 of the present embodiment, for example, the liquid crystal panel 10 has been described as being arranged along the vertical direction 90. However, the “vertical direction” (or gravity direction) here is relative to the horizontal plane. It does not mean strictly the direction of 90 °, but means the direction (substantially vertical direction) for defining the arrangement direction of the liquid crystal panel 10. That is, in the configuration of the present embodiment, the liquid crystal panel 10 only needs to be disposed substantially along the vertical direction. In one example, the liquid crystal panel 10 may be disposed in a range of 90 ° ± 15 ° with respect to the horizontal plane. Good. Even if it is arranged in such a range, when the air in the air layer 35 is heated, it moves from the first through hole 45 and the second through hole, so that an effect of improving heat dissipation can be obtained. . Further, since the liquid crystal display device 100 is arranged in the vertical direction (or substantially vertical direction) during operation, the liquid crystal display device 100 of the present embodiment may be arranged in the horizontal direction, for example, during the transfer movement. .
　また、本実施形態の液晶表示装置１００は、図５に示すように改変することも可能である。図５に示した構成では、ヒートスプレッダー３４に凹部３６を複数形成している。複数の凹部３６（３６ａ、３６ｂ、３６ｃ）を形成することにより、ヒートスプレッダー３４と空気層３５との接触面積を増やすことができ、それによって、ヒートスプレッダー３４の放熱性を向上させることができる。 Further, the liquid crystal display device 100 of the present embodiment can be modified as shown in FIG. In the configuration shown in FIG. 5, a plurality of recesses 36 are formed in the heat spreader 34. By forming the plurality of recesses 36 (36a, 36b, 36c), the contact area between the heat spreader 34 and the air layer 35 can be increased, and thereby the heat dissipation of the heat spreader 34 can be improved.
　図５に示した例では、複数の空気層３５のそれぞれに連通する第１の貫通孔４５が形成されている。凹部３６が溝形状（例えば、Ｘ方向に延びる溝）の場合、第１の貫通孔４５は、Ｙ方向に沿って並べて配置してもよいし、異なる場所に配置しても構わない。 In the example shown in FIG. 5, a first through hole 45 communicating with each of the plurality of air layers 35 is formed. When the recess 36 has a groove shape (for example, a groove extending in the X direction), the first through holes 45 may be arranged side by side along the Y direction or may be arranged at different locations.
　また、本実施形態の液晶表示装置１００は、図６に示すように改変することも可能である。なお、図７は、図６に示した外装キャビネット７０の側壁７０ａの断面模式図である。図６及び図７に示した構成では、第２の貫通孔７５が斜めに延びるように形成されている。具体的には、第２の貫通孔７５は、鉛直方向９０に対して斜めに延びるように外装キャビネット７０の側壁７０ａに形成されている。図示した例では、外装キャビネット７０の側壁７０ａの一部を傾斜させて、その傾斜部７７によって、第２の貫通孔７５の延長方向に延びる開口部の一部を覆うようにしている。 Further, the liquid crystal display device 100 of the present embodiment can be modified as shown in FIG. 7 is a schematic cross-sectional view of the side wall 70a of the exterior cabinet 70 shown in FIG. In the configuration shown in FIGS. 6 and 7, the second through hole 75 is formed to extend obliquely. Specifically, the second through hole 75 is formed in the side wall 70 a of the exterior cabinet 70 so as to extend obliquely with respect to the vertical direction 90. In the illustrated example, a part of the side wall 70 a of the exterior cabinet 70 is inclined, and the inclined part 77 covers a part of the opening extending in the extending direction of the second through hole 75.
　このように、第２の貫通孔７５を斜めに延びるようにすることによって、外装キャビネット７０の上方から、ゴミ又は水滴などの異物が落ちてきても、傾斜部７７によってその異物が外装キャビネット７０の内部に進入することを抑制または緩和することができる。なお、第２の貫通孔７５を斜めに延びるようにした構成は、傾斜部７７を設けるものの他、他の手法によって実現してもよい。例えば、第２の貫通孔７５を斜めに延びるように、外装キャビネット７０の側壁７０ａを貫通させるようにしても構わない。あるいは、側壁７０ａの一部を傾斜部７７として設けるものの他、傾斜部（カバー部）７７を、側壁７０ａの別部材にて設けることも可能である。 As described above, by extending the second through-hole 75 obliquely, even if foreign matter such as dust or water drops falls from above the exterior cabinet 70, the foreign matter is removed from the exterior cabinet 70 by the inclined portion 77. It is possible to suppress or alleviate entering the inside. In addition, you may implement | achieve the structure which extended the 2nd through-hole 75 diagonally by other methods other than what provides the inclination part 77. FIG. For example, the side wall 70a of the exterior cabinet 70 may be penetrated so that the second through hole 75 extends obliquely. Alternatively, in addition to providing a part of the side wall 70a as the inclined part 77, the inclined part (cover part) 77 can be provided by another member of the side wall 70a.
　以上、本発明を好適な実施形態により説明してきたが、こうした記述は限定事項ではなく、勿論、種々の改変が可能である。例えば、上述した実施形態の液晶表示装置１００では、１枚の液晶パネル１０を用いて画像表示部を構成しているが、複数枚の液晶パネル１０を組み合わせて１つの画像表示部（マルチディスプレイ）を構成することも可能である。そのような複数枚の液晶パネル１０を組み合わせた液晶表示装置１００を、大画面のデジタルサイネージ（例えば、１００インチ以上の表示装置）の用途に使用することも可能である。 As mentioned above, although this invention has been demonstrated by suitable embodiment, such description is not a limitation matter and, of course, various modifications are possible. For example, in the liquid crystal display device 100 of the above-described embodiment, the image display unit is configured by using one liquid crystal panel 10, but one image display unit (multi-display) is formed by combining a plurality of liquid crystal panels 10. It is also possible to configure. The liquid crystal display device 100 in which such a plurality of liquid crystal panels 10 are combined can be used for a large-screen digital signage (for example, a display device of 100 inches or more).
　本発明によれば、簡単な構成によってＬＥＤ（発光ダイオード）の放熱性を向上させることができる液晶表示装置を提供することができる。 According to the present invention, it is possible to provide a liquid crystal display device capable of improving the heat dissipation of an LED (light emitting diode) with a simple configuration.
 １０ 液晶パネル
 １１ アレイ基板
 １２ ＣＦ基板
 １３ 偏光板
 ２０ 光学シート
 ３０ 導光板
 ３０ａ 導光板の端面
 ３０ｍ 導光板の主面
 ３１ ＬＥＤ素子
 ３２ ＬＥＤ基板
 ３４ ヒートスプレッダー
 ３４Ａ 上部ヒートスプレッダー
 ３４Ｂ 下部ヒートスプレッダー
 ３５ 空気層
 ３６ 凹部
 ４０ バックライトシャーシ
 ４０ａ バックライトシャーシの側壁
 ４５ 第１の貫通孔
 ５０ バックライトユニット
 ７０ 外装キャビネット
 ７０ａ 外装キャビネットの側壁
 ７１ 表面側キャビネット
 ７２ 裏面側キャビネット
 ７３ 空間
 ７５ 第２の貫通孔
 ７７ 傾斜部
 ９０ 鉛直方向
１００ 液晶表示装置 DESCRIPTION OF SYMBOLS 10 Liquid crystal panel 11 Array substrate 12 CF board 13 Polarizing plate 20 Optical sheet 30 Light guide plate 30a End surface of light guide plate 30m Main surface of light guide plate 31 LED element 32 LED substrate 34 Heat spreader 34A Upper heat spreader 34B Lower heat spreader 35 Air layer 36 Recess 40 Backlight chassis 40a Backlight chassis side wall 45 First through hole 50 Backlight unit 70 Exterior cabinet 70a Exterior cabinet side wall 71 Front side cabinet 72 Back side cabinet 73 Space 75 Second through hole 77 Inclined portion 90 Vertical Direction 100 liquid crystal display device

Claims (6)

  1. 　液晶パネルと、
    　前記液晶パネルに光を照射するバックライトユニットと
    を備えた液晶表示装置であって、
    　前記バックライトユニットは、
          複数のＬＥＤ素子が配列されたＬＥＤ基板と、
          前記ＬＥＤ基板に接触し、当該ＬＥＤ基板の熱を発散するヒートスプレッダーと、
          前記複数のＬＥＤ素子からの光が導入される導光板と、
          前記ＬＥＤ基板、前記ヒートスプレッダーおよび前記導光板が収納されるバックライトシャーシと
    　を備え、
    　前記液晶パネルおよび前記バックライトシャーシは、外装キャビネットに収納されており、
    　前記ヒートスプレッダーには、前記バックライトシャーシの側壁との間に空気層を有する凹部が形成されており、
    　前記バックライトシャーシの側壁には、前記空気層に連通する第１の貫通孔が形成されており、
    　前記外装キャビネットの側壁には、前記バックライトシャーシの側壁との間の空間に連通する第２の貫通孔が形成されている、液晶表示装置。     LCD panel,
    A liquid crystal display device comprising a backlight unit for irradiating the liquid crystal panel with light,
    The backlight unit is
    An LED substrate on which a plurality of LED elements are arranged;
    A heat spreader that contacts the LED substrate and dissipates heat of the LED substrate;
    A light guide plate into which light from the plurality of LED elements is introduced;
    A backlight chassis in which the LED substrate, the heat spreader, and the light guide plate are housed, and
    The liquid crystal panel and the backlight chassis are housed in an exterior cabinet,
    In the heat spreader, a recess having an air layer is formed between the side wall of the backlight chassis,
    The side wall of the backlight chassis is formed with a first through hole communicating with the air layer,
    A liquid crystal display device, wherein a second through hole communicating with a space between the side wall of the backlight chassis is formed in a side wall of the exterior cabinet.
  2. 　前記液晶パネルおよび前記導光板は、鉛直方向に延びるように配置され、
    　前記ヒートスプレッダーは、
          前記導光板の上部側に設けられた上部ヒートスプレッダーと、
          前記導光板の下部側に設けられた下部ヒートスプレッダーと
    　から構成され、
    　前記上部ヒートスプレッダーおよび前記下部ヒートスプレッダーには、それぞれ、前記空気層を有する凹部が形成されており、
    　前記凹部が存在する領域を基準にして鉛直方向に沿った領域において、前記第１の貫通孔および前記第２の貫通孔が形成されている、請求項１に記載の液晶表示装置。     The liquid crystal panel and the light guide plate are arranged to extend in a vertical direction,
    The heat spreader is
    An upper heat spreader provided on the upper side of the light guide plate;
    A lower heat spreader provided on the lower side of the light guide plate,
    The upper heat spreader and the lower heat spreader are each formed with a recess having the air layer,
    2. The liquid crystal display device according to claim 1, wherein the first through hole and the second through hole are formed in a region along a vertical direction with respect to a region where the concave portion exists.
  3. 　前記ヒートスプレッダーは、
          前記バックライトシャーシの側壁に接触する側壁部位と、
          前記バックライトシャーシの底面に接触する底面部位と
    　を有しており、
    　前記ヒートスプレッダーの側壁部位における前記導光板の側に、前記ＬＥＤ基板が配置されている、請求項１または２に記載の液晶表示装置。     The heat spreader is
    A sidewall portion that contacts the sidewall of the backlight chassis;
    A bottom surface portion that contacts the bottom surface of the backlight chassis,
    The liquid crystal display device according to claim 1, wherein the LED substrate is disposed on a side of the light guide plate in a side wall portion of the heat spreader.
  4. 　前記ヒートスプレッダーには、前記空気層を有する凹部が複数形成されており、
    　前記複数の凹部のそれぞれの前記空気層に連通する前記第１の貫通孔が、前記バックライトユニットに形成されている、請求項１から３の何れか一つに記載の液晶表示装置。     The heat spreader has a plurality of recesses having the air layer,
    4. The liquid crystal display device according to claim 1, wherein the first through hole communicating with the air layer of each of the plurality of recesses is formed in the backlight unit. 5.
  5. 　前記第２の貫通孔は、前記鉛直方向に対して斜めに延びるように前記外装キャビネットの側壁に形成されている、請求項１から４の何れか一つに記載の液晶表示装置。 The liquid crystal display device according to any one of claims 1 to 4, wherein the second through hole is formed on a side wall of the exterior cabinet so as to extend obliquely with respect to the vertical direction.
  6. 　液晶パネルに光を照射するバックライトユニットであって、
    　複数のＬＥＤ素子が配列されたＬＥＤ基板と、
    　前記ＬＥＤ基板に接触し、当該ＬＥＤ基板の熱を発散するヒートスプレッダーと、
    　前記複数のＬＥＤ素子からの光が導入される導光板と、
    　前記ＬＥＤ基板、前記ヒートスプレッダーおよび前記導光板が収納されるバックライトシャーシと
    　を備え、
    　前記バックライトシャーシは、外装キャビネットに収納されており、
    　前記ヒートスプレッダーには、前記バックライトシャーシの側壁との間に空気層を有する凹部が形成されており、
    　前記バックライトシャーシの側壁には、前記空気層に連通する第１の貫通孔が形成されており、
    　前記外装キャビネットの側壁には、前記バックライトシャーシの側壁との間の空間に連通する第２の貫通孔が形成されている、バックライトユニット。     A backlight unit for irradiating light to a liquid crystal panel,
    An LED substrate on which a plurality of LED elements are arranged;
    A heat spreader that contacts the LED substrate and dissipates heat of the LED substrate;
    A light guide plate into which light from the plurality of LED elements is introduced;
    A backlight chassis in which the LED substrate, the heat spreader, and the light guide plate are housed, and
    The backlight chassis is housed in an exterior cabinet,
    In the heat spreader, a recess having an air layer is formed between the side wall of the backlight chassis,
    The side wall of the backlight chassis is formed with a first through hole communicating with the air layer,
    A backlight unit in which a second through hole communicating with a space between the side wall of the backlight chassis is formed in a side wall of the exterior cabinet.
PCT/JP2011/075030 2010-11-08 2011-10-31 Liquid crystal display device WO2012063666A1 (en)

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