CN103104868B - A kind of LED-backlit module and electronic equipment - Google Patents
A kind of LED-backlit module and electronic equipment Download PDFInfo
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- CN103104868B CN103104868B CN201310002076.3A CN201310002076A CN103104868B CN 103104868 B CN103104868 B CN 103104868B CN 201310002076 A CN201310002076 A CN 201310002076A CN 103104868 B CN103104868 B CN 103104868B
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Abstract
The invention provides a kind of LED-backlit module and electronic equipment.This LED-backlit module is applied in a liquid crystal electron equipment, described LED-backlit module comprises a light guide plate and glue frame, described glue frame has the first side, described light guide plate has an incidence surface, described LED-backlit module also comprises: LED lamp bar, arrange near described first side, described LED lamp bar comprises circuit board and is arranged at least two LED of first surface of described circuit board, second of described circuit board is two faces that described circuit board is relative with described first surface, fits for described second with described first side; One fixture; Radiating piece, by described fixture, described radiating piece is fixed on described first surface, make described LED lamp bar between described radiating piece and described first side of described glue frame, described radiating piece is between described incidence surface and described first surface, and described radiating piece is used for dispelling the heat to described LED lamp bar.
Description
Technical field
The present invention relates to field of liquid crystal display, particularly relate to a kind of LED-backlit module and electronic equipment.
Background technology
Along with the development of lcd technology, the backlight of LCDs also instead of CCFL (cold-cathode tube) backlight by LED-backlit gradually, and LED-backlit refers to the backlight being used as LCDs with LED (light emitting diode).Compare with CCFL backlight, LED-backlit has low-power consumption, lower calorific value, brightness are high, the life-span is long advantage, further, in view of energy-conserving and environment-protective, the advantage such as ultra-thin, the LED-backlit structure that versatility is the widest in the industry is at present side-light type, simultaneously, in the industry in order to obtain larger viewing area under same volume, the face frame of liquid crystal display or LCD TV, what namely outer rim was done is more and more narrow, be referred to as in the industry extremely narrow frame, please refer to Figure 1A, the width w of face frame is smaller, usually be such as 6mm, 7.9mm, 9.9mm, 10.9mm, 15mm, and LED-backlit module is generally all arranged in the frame of face, the structure of LED-backlit module is described below for monolateral side light type LED back light module.
Please also refer to Figure 1A, Figure 1B and Fig. 2, this LED-backlit module comprises LED lamp bar, and LED lamp bar comprises circuit board and is positioned at the LED on circuit board; Radiating piece (heat-dissipation aluminum sectional material), the first side of next-door neighbour's glue frame, wherein, the outside (side relative with the first side) of glue frame is near face frame; LED lamp bar is fixed together by two-sided heat conduction subsides and heat-dissipation aluminum sectional material, as can be seen from Figure 1A and Figure 1B, heat-dissipation aluminum sectional material is between LED lamp component and the first side of glue frame, and namely heat-dissipation aluminum sectional material is near the first side of the glue frame of electronic equipment, and LED is near display panels.LGP (Light guide plate; Light guide plate) be positioned at the exiting surface side of LED, for the illumination of LED being mapped to the display panels be positioned on light guide plate.In addition, also there is reflector plate at the lower surface of light guide plate, for reflecting the light of LED, being also provided with diaphragm at light guide plate upper surface, diaphragm is provided with panel.
Another kind of mode uses screw to be fixed on heat-dissipation aluminum sectional material by LED lamp bar, but heat-dissipation aluminum sectional material is still between LED lamp bar and the first side, and thus, distance between two LED adjacent with screw will be far, so will cause optical density near screw hole can be much little compared with other positions, external manifestation is that near screw, comparatively other positions are dark, is formed " lamp shadow ".
Refer again to Fig. 2 and Fig. 3, A represents the distance of LED exiting surface to display screen active area (territory, effective display area), P represents the centre distance of two adjacent LEDs lamp, and the ratios affect lamp shadow problem of A/P, under the confined space restriction of extremely narrow frame, the position of heat-dissipation aluminum sectional material and thickness effect LED exiting surface are to the distance of the incidence surface of light guide plate, and then impact distance A, have increased the weight of lamp shadow problem further.
Summary of the invention
The invention provides a kind of LED-backlit module and electronic equipment, cause increasing the weight of the technical problem of lamp shadow in order to solve the position of the radiating piece existed in prior art and thickness effect LED exiting surface to the distance of the incidence surface of light guide plate.
One aspect of the present invention provides a kind of LED-backlit module, be applied in a liquid crystal electron equipment, described LED-backlit module comprises a light guide plate and glue frame, described glue frame has the first side, described light guide plate has an incidence surface, described LED-backlit module also comprises: LED lamp bar, arrange near described first side, described LED lamp bar comprises circuit board and is arranged at least two LED of first surface of described circuit board, second of described circuit board is two faces that described circuit board is relative with described first surface, fit with described first side for described second, one fixture, radiating piece, by described fixture, described radiating piece is fixed on described first surface, make described LED lamp bar between described radiating piece and described first side of described glue frame, described radiating piece is between described incidence surface and described first surface, and described radiating piece is used for dispelling the heat to described LED lamp bar, wherein, the width w of face frame is less than a predetermined value, and this predetermined value is 15mm, and meets A/P and be more than or equal to 0.8, A and represent the distance of LED exiting surface to territory, display screen effective display area, and P represents the centre distance of two adjacent LEDs lamp.
The present invention provides a kind of electronic equipment on the other hand, comprising: above-mentioned backlight module; Liquid crystal display module, is connected to described backlight module.
The one or more technical schemes provided in the embodiment of the present invention, at least have following technique effect or advantage:
One embodiment of the invention have employed in the limited space of glue frame, decrease the thickness effect of radiating piece, LED lamp bar is arranged between radiating piece and glue frame, move between LED lamp bar and light guide plate by radiating piece, move outside LED lamp bar, near the technical scheme of glue frame, the distance of LED exiting surface to active area is just added, namely A value increases, so compared with prior art, when P value is constant, by the increase of A, make the ratio of A/P become large, so lamp shadow problem can be alleviated, make display effect better.
Further, because lamp shadow problem can be overcome by increasing A value, so under the prerequisite keeping same display effect, P value can the scope of value wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED can become large, and need not be confined to small size; Further, when the size of LED becomes greatly, the quantity of LED will reduce, so production efficiency will improve, cost also can reduce.
Further, because move outside LED lamp bar, decrease the impact of radiating piece thickness, so keeping the situation that A and P is constant, when namely display effect is identical, it is narrower that face frame can do further, makes electronic equipment toward narrower narrow frame development.
Accompanying drawing explanation
Figure 1A-Figure 1B is the structure chart of LED-backlit module in prior art;
Fig. 2 is the schematic diagram of A, P value in prior art;
Fig. 3 is the side cutaway view of LED-backlit module in prior art;
Fig. 4 A is the structure chart of the LED-backlit module in one embodiment of the invention;
Fig. 4 B is the structure chart of the LED-backlit module in another embodiment of the present invention;
Fig. 4 C is the side view cutaway drawing of the LED-backlit module in one embodiment of the invention;
Fig. 5 is the A value schematic diagram in one embodiment of the invention;
Fig. 6 is the P value schematic diagram in one embodiment of the invention.
Detailed description of the invention
The invention provides a kind of LED-backlit module and electronic equipment, cause increasing the weight of the technical problem of lamp shadow in order to solve the position of the radiating piece existed in prior art and thickness effect LED exiting surface to the distance of the incidence surface of light guide plate.
Technical scheme in the embodiment of the present invention is solve above-mentioned technical problem, and general thought is as follows:
In the space that glue frame is limited, decrease the thickness effect of radiating piece, LED lamp bar is arranged between radiating piece and glue frame, move between LED lamp bar and light guide plate by radiating piece, move outside LED lamp bar, near the technical scheme of glue frame, the distance of LED exiting surface to active area is just added, namely A value increases, so compared with prior art, when P value is constant, by the increase of A, make the ratio of A/P become large, so lamp shadow problem can be alleviated, make display effect better.
Further, because lamp shadow problem can be overcome by increasing A value, thus P value can the scope of value wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED can become large, and need not be confined to small size; Further, when the size of LED becomes greatly, the quantity of LED will reduce, so production efficiency will improve, cost also can reduce.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete embodiment, technique scheme is described in detail.
In the present embodiment, LED-backlit module is applied in a liquid crystal electron equipment, and liquid crystal electron equipment has a frame, and the width w of face frame is less than a predetermined value, such as, be 6mm, 7.9mm, 9.9mm, 10.9mm, 15mm (please refer to shown in Figure 1A).LED-backlit module comprises a light guide plate and glue frame, and glue frame has the first side, and light guide plate has an incidence surface.
Next please refer to Fig. 4 A to Fig. 4 C, Fig. 4 A is the LED-backlit modular structure figure in one embodiment of the invention, and Fig. 4 C is the side sectional view of LED-backlit module.LED-backlit module also comprises LED lamp bar, and LED lamp bar comprises circuit board and be arranged at least two LED of first surface of circuit board, this LED lamp bar is arranged near the first side, second of circuit board near described first side, wherein, described second is two faces that described circuit board is relative with described first surface; One fixture (screw 10 as in Fig. 4 C), radiating piece (such as heat-dissipation aluminum sectional material), by this fixture, radiating piece is fixed on the first surface of circuit board, make LED lamp bar between radiating piece and the first side of glue frame, namely radiating piece is between LED lamp bar and the incidence surface of light guide plate.This radiating piece is used for dispelling the heat to LED lamp bar.Compared with prior art, under same face width of frame and space, the position of radiating piece and LED lamp bar is exchanged, and therefore need not will increase the width w of face frame.In the present embodiment, radiating piece is for heat-dissipation aluminum sectional material, but in other embodiments, radiating piece also can be the radiating piece of other materials.Wherein circuit board can be pcb board, in other embodiments, and also can the circuit board of other types.
By the technical scheme in the present embodiment, radiating piece is moved between LED lamp bar and light guide plate, namely move the first side near glue frame outside LED lamp bar, the distance of LED exiting surface to active area added, namely A value increases, so compared with prior art, when P value is constant, by the increase of A, the ratio of A/P is made to become large, so lamp shadow problem can be alleviated, make display effect better.
Further, because lamp shadow problem can be overcome by increasing A value, so under the prerequisite keeping same display effect, P value can the scope of value wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED can become large, and need not be confined to small size; Further, and when the size of LED become large after, the quantity of LED will reduce, so production efficiency will improve, cost also can reduce.
Next, for 46 cun of single minor face side light type LED back light modules, detailed numerical computations will be provided.
Please refer to Fig. 3 and Fig. 5, indicate in structure of the prior art in Fig. 3, LED exiting surface is such as 4.95mm to the distance A of display screen active area, and in Figure 5, in the structure that the present embodiment technical scheme provides, A is increased to 7.35mm, wherein, because heat-dissipation aluminum sectional material is fixed on LED side, so the distance increased comprises the thickness 0.4mm that two-sided heat conduction is pasted, and the thickness 2.0mm of heat-dissipation aluminum sectional material.
Structure conventionally, the experience in the industry cycle, usually will meet A/P and be more than or equal to 0.8, just can overcome lamp shadow problem, because A is 4.95mm, so P will be less than or equal to 6.1875mm; And according to the structure provided in the present embodiment, A is 7.35mm, A/P is met and be more than or equal to 0.8, as long as so P is just less than or equal to 9.1875mm.
Refer again to Fig. 6, P is the centre distance of two adjacent LEDs lamp, i.e. P=L
lED+ Δ S, wherein, Δ S must be more than or equal to 1mm, can calculate the size of the LED met design requirement so accordingly.
The structure of prior art: L
lED≤ P-Δ S, i.e. L
lED≤ 6.1875-1=5.1875mm, so LED must select 4014 model lamps could meet the requirement that A/P value is more than or equal to 0.8.
Structure in the present embodiment, L
lED≤ P-Δ S, i.e. L
lED≤ 9.1875-1=8.1875mm, so LED can select 5630 model lamps or 7020 model lamps, can meet the requirement that A/P value is more than or equal to 0.8, and decrease the quantity of required LED, can improve lamp bar assembly production efficiency, reduce costs.
Such as, and when P value remains unchanged, P value is 6.1875mm, A/P value 4.95mm/6.1875mm of the prior art is 0.8; And be increased to 7.35mm by the method A value in the present embodiment, so A/P value is 7.35/6.1875 is 1.1879, is far longer than 0.8, so better overcome lamp shadow problem, makes display effect better.
Further, because move outside LED lamp bar, decrease the impact of radiating piece thickness, so keeping the situation that A and P is constant, when namely display effect is identical, it is narrower that face frame can do further, makes electronic equipment toward narrower narrow frame development.
Please continue to refer to Fig. 4 A and Fig. 4 C, the below of at least two LED is formed with the first hole 101 on circuit boards, and radiating piece is provided with the through hole 201 consistent with the quantity in the first hole 101 with the first relevant position, hole 101.Further, merely illustrate first hole 101 and a through hole 201 in Figure 4 A, but when practical application, the quantity of the first hole 101 and through hole 201 actual conditions can be selected, as long as radiating piece and LED lamp bar can be fixed.
Further, fixture is specially the screw 10 consistent with the quantity of through hole 201, and radiating piece, successively through through hole 201, first hole 101, is fixed on the first face by screw 10.
Wherein, in one embodiment, the first hole 101 can be blind hole, also can be through hole, and be preferably through hole, because in actual production process, through hole better realizes, and better operates.
In a further embodiment, the length of screw 10 is greater than the length of through hole 201, and be less than or equal to the length of through hole 201 and the length sum in the first hole 101, so the tip of screw 10 can not be exposed to circuit board, both can fix radiating piece and circuit board, but not affect the laminating between circuit board and shell again.
Because the first hole is arranged at the below of LED, so the cabling in circuit board can not be affected, the distance between two adjacent LEDs lamp also can not be affected, so further overcome " lamp shadow " problem, and adopt screw to connect, and reliable, convenient, also reduce cost.
In a further embodiment, in the first hole 101, be provided with internal thread, make screw 10 can screw in the first hole 101 more easily, so easy assembly and disassembly.
In another embodiment, fixture is specially heat conduction and pastes (not shown), can double faced adhesive, together with namely being pasted to be pasted and fixed on radiating piece by circuit board by heat conduction.
Next, please continue to refer to Fig. 4 C, radiating piece comprises first end 20 and the second end 30, and first end 20 and the second end 30 link together at angle, and first end 20 is fixed on first surface.Preferably, radiating piece l-shaped, first end 20 and the second end 30 are respectively the two ends of L-type, and namely this angle is 90 degree, is convenient to the housing design of Subsequent electronic equipment.
Further, first end 20 and the second end 30 are formed in one structure, so easily manufacture, and can more firmly be fixed on shell by LED-backlit module, can also support LED-backlit module.
Refer again to Fig. 4 A, the second end 30 has a breach 301, and the position of breach 301 corresponds to the position of through hole 201, so can be mounted and dismounted screw 10 easily by breach 301.
Further, refer again to Fig. 4 B, the light guide plate of LED-backlit module is positioned at the inner side of the second end 30, makes light guide plate be positioned at the same side of the second end 30 with at least two LED.Display panels can be positioned on light guide plate, and by light guide plate, the light that LED can be sent is irradiated on display panels uniformly.
Further, the outside of the second end 30 is then fixedly connected with the backboard (shown in Figure 1A) of a shell.
Further, fit for second of circuit board with the first side of this glue frame, second is two faces that circuit board is relative with first surface.
Refer again to Fig. 4 A and Fig. 4 C, LED lamp bar being also provided with a terminal 40, for connecting a power supply, powering to circuit board.
Conveniently be connected to the power line cabling of terminal 40, radiating piece second end 30 is curved near the turning of terminal 40, thus, just can prevent square or other sharp-pointed dihedrals from being cut off by power line.
Each embodiment can be combined with each other use above, and those skilled in the art can select the combination between embodiment according to actual needs.
Another embodiment of the present invention additionally provides a kind of electronic equipment, this electronic equipment comprises LED-backlit module in the various embodiments described above, and liquid crystal display module, be connected to this LED-backlit module, this electronic equipment can be LCD TV, liquid crystal display, notebook computer, and other use the electronic equipment of liquid crystal display.
The one or more technical schemes provided in the embodiment of the present invention, at least have following technique effect or advantage:
One embodiment of the invention have employed in the limited space of glue frame, decrease the thickness effect of radiating piece, LED lamp bar is arranged between radiating piece and glue frame, move between LED lamp bar and light guide plate by radiating piece, move outside LED lamp bar, near the technical scheme of glue frame, the distance of LED exiting surface to active area is just added, namely A value increases, so compared with prior art, when P value is constant, by the increase of A, make the ratio of A/P become large, so lamp shadow problem can be alleviated, make display effect better.
Further, because lamp shadow problem can be overcome by increasing A value, so under the prerequisite keeping same display effect, P value can the scope of value wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED can become large, and need not be confined to small size; Further, when the size of LED becomes greatly, the quantity of LED will reduce, so production efficiency will improve, cost also can reduce.
Further, because move outside LED lamp bar, decrease the impact of radiating piece thickness, so keeping the situation that A and P is constant, when namely display effect is identical, it is narrower that face frame can do further, makes electronic equipment toward narrower narrow frame development.
Further, also below the upper LED of circuit board, the first hole is formed in one embodiment of the invention, radiating piece is provided with the through hole consistent with the quantity in the first hole with the first relevant position, hole, and fixture is specially screw, its quantity is consistent with through hole, then screw is through through hole, the first hole, is fixed on the first surface of circuit board by radiating piece.Because the first hole is arranged at the below of LED, so the cabling in circuit board can not be affected, the distance between two adjacent LEDs lamp also can not be affected, so further overcome " lamp shadow " problem, and adopt screw to connect, and reliable, convenient, also reduce cost.
Further again, the length of through hole described in the length that have also been devised screw in one embodiment of the invention, and be less than or equal to the length of described through hole and the length sum in described first hole, so the tip of screw can not be exposed to circuit board, both can fix radiating piece and circuit board, but not affect the laminating between circuit board and shell again.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. a LED-backlit module, be applied in a liquid crystal electron equipment, described LED-backlit module comprises a light guide plate and glue frame, and described glue frame has the first side, and described light guide plate has an incidence surface, it is characterized in that, described LED-backlit module also comprises:
LED lamp bar, arrange near described first side, described LED lamp bar comprises circuit board and is arranged at least two LED of first surface of described circuit board, second of described circuit board is two faces that described circuit board is relative with described first surface, fits for described second with described first side;
One fixture;
Radiating piece, by described fixture, described radiating piece is fixed on described first surface, make described LED lamp bar between described radiating piece and described first side of described glue frame, described radiating piece is between described incidence surface and described first surface, and described radiating piece is used for dispelling the heat to described LED lamp bar;
Wherein, the width w of face frame is less than a predetermined value, and this predetermined value is 15mm, and meets A/P and be more than or equal to 0.8, A and represent the distance of LED exiting surface to territory, display screen effective display area, and P represents the centre distance of two adjacent LEDs lamp.
2. backlight module as claimed in claim 1, it is characterized in that, described on described circuit board, the below of at least two LED is formed with the first hole; Described radiating piece is provided with the through hole consistent with the quantity in described first hole with described first relevant position, hole, described fixture is specially the screw consistent with the quantity of described through hole, described radiating piece through described through hole, described first hole, is fixed on described first surface by described screw successively.
3. backlight module as claimed in claim 2, is characterized in that, be provided with internal thread in described first hole.
4. backlight module as claimed in claim 2, it is characterized in that, the length of described screw is greater than the length of described through hole, and is less than or equal to the length of described through hole and the length sum in described first hole.
5. backlight module as claimed in claim 1, is characterized in that, described fixture is specially heat conduction and pastes.
6. backlight module as claimed in claim 1, it is characterized in that, described radiating piece comprises first end and the second end, and described first end and described second end link together at angle, and described first end is fixed on described first surface.
7. backlight module as claimed in claim 6, it is characterized in that, described light guide plate, be positioned at the inner side of described second end, wherein, described light guide plate and described at least two LED are positioned at the same side of described second end.
8. backlight module as claimed in claim 7, it is characterized in that, the outside of described second end is fixedly connected with the backboard of a shell.
9. an electronic equipment, is characterized in that, comprising:
Backlight module according to any one of right 1-8;
Liquid crystal display module, is positioned on described backlight module.
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| CN201310002076.3A CN103104868B (en) | 2012-08-15 | 2013-01-04 | A kind of LED-backlit module and electronic equipment |
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| CN201210290437 | 2012-08-15 | ||
| CN201210290437.4 | 2012-08-15 | ||
| CN201310002076.3A CN103104868B (en) | 2012-08-15 | 2013-01-04 | A kind of LED-backlit module and electronic equipment |
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| CN103104868B true CN103104868B (en) | 2015-09-09 |
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| EP3623692A1 (en) * | 2018-09-14 | 2020-03-18 | Xiamen Eco Lighting Co., Ltd. | Panel light device |
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| CN103557507A (en) * | 2013-10-31 | 2014-02-05 | 深圳市华星光电技术有限公司 | Heat conduction device, backlight module and liquid crystal display |
| CN103676317A (en) * | 2013-12-11 | 2014-03-26 | 合肥京东方光电科技有限公司 | Light guide plate, backlight source and LCD device |
| US9551826B2 (en) | 2014-01-27 | 2017-01-24 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LCD with backlight module having quantum dot unit and frame |
| CN103885243B (en) * | 2014-01-27 | 2017-04-19 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display comprising same |
| CN107037631A (en) * | 2016-12-02 | 2017-08-11 | 深圳市华星光电技术有限公司 | Liquid crystal display and its backlight module |
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