WO2012049716A1 - 有機発光パネルとその製造方法、および有機表示装置 - Google Patents
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- WO2012049716A1 WO2012049716A1 PCT/JP2010/006143 JP2010006143W WO2012049716A1 WO 2012049716 A1 WO2012049716 A1 WO 2012049716A1 JP 2010006143 W JP2010006143 W JP 2010006143W WO 2012049716 A1 WO2012049716 A1 WO 2012049716A1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
Definitions
- the present invention relates to an organic light emitting panel, a manufacturing method thereof, and an organic display device.
- each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween.
- driving the display device holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.
- the organic light emitting layers of adjacent pixel portions are partitioned by a partition (bank) made of an insulating material.
- the organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the partition walls and drying the ink.
- Patent Document 1 describes a technique in which a convex portion is provided on the surface portion of the partition wall, thereby controlling the pinning position of the ink with respect to the surface portion of the partition wall. ing. That is, by adopting the technique proposed in Patent Document 1, the pinning position when the ink in one pixel portion is dropped can be pinned to the convex portion formed on the surface portion, thereby The film thickness uniformity can be ensured.
- the technique proposed by the said patent document 1 is employ
- the present invention has been made to solve the above-described problems, and provides a display device with less inhomogeneous luminance in the surface and a method of manufacturing the same, by making the film thickness of the organic light emitting layer uniform over the entire surface of the panel. For the purpose.
- the organic light-emitting panel according to one embodiment of the present invention is characterized by adopting the following configuration.
- An organic light-emitting panel is a panel in which a plurality of pixel units are arranged, and each pixel unit of the plurality of pixel units has a different emission color and is arranged in order.
- Each light emitting unit includes a base layer including a first electrode, an organic light emitting layer provided opposite to the base layer, and formed by applying an ink containing an organic light emitting material corresponding to each emission color, and an organic light emitting layer And a second electrode formed on the side opposite to the base layer.
- adjacent light-emitting portions among the plurality of light-emitting portions are divided, and a plurality of partition walls defining each light-emitting portion are provided.
- regulate a predetermined light emission part may differ is characterized by the above-mentioned.
- the two adjacent partition walls defining the predetermined light emitting portion are configured to have different inclination angles of facing surface portions, and thus ink at the time of manufacturing is dropped.
- the pinning position at the time can be adjusted. Specifically, the pinning height increases when the inclination angle in the surface portion of the partition wall is increased, and the pinning height decreases when the inclination angle is decreased.
- the film thickness of the organic light emitting layer after drying the ink has an inverse relationship with the magnitude of the inclination angle of the surface portion of the partition wall. Specifically, the film thickness of the organic light-emitting layer corresponding to the relatively large tilt angle tends to be reduced, and the film thickness of the organic light-emitting layer corresponding to the smaller tilt angle is increased.
- the inclination angle of the opposing surface portions in the two adjacent partition walls defining the predetermined light emitting portion is made different to prevent the unevenness of the thickness of the organic light emitting layer. And good emission characteristics can be obtained.
- FIG. 1 is a block diagram showing a schematic configuration of an organic display device 1 according to Embodiment 1.
- FIG. 3 is a schematic cross-sectional view showing some subpixels 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing a configuration of subpixels 100a to 100c and banks 105a to 105d that partition the subpixels 100a to 100c in the display panel 10.
- (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small
- (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large
- (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small
- (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer.
- FIG. 6 is a diagram showing the film thickness distribution of organic light emitting layers in Samples 1 to 3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5.
- FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- FIG. (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A) is a schematic flow diagram showing a process order related to application and drying of inks 1060a to 1060c
- (b) is a schematic flow chart showing another process order related to application and drying of inks 1060a to 1060c. is there.
- 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1.
- FIG. (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- FIG. 6 is a schematic cross-sectional view showing a configuration of subpixels 300a to 300c and non-pixel portions 300d and 300e and banks 305a to 305e in a display panel included in the organic display device according to Embodiment 2.
- (A)-(c) is a schematic cross section which shows the process of apply
- FIG. 10 is a schematic cross-sectional view showing a configuration of subpixels 400a to 400c and non-pixel portions 400d and 400e and banks 405a to 405f in a display panel included in an organic display device according to Embodiment 3.
- FIG. 6 is a schematic cross-sectional view showing a state when inks 4060a to 4060c are collectively applied.
- (A) is a schematic cross section for demonstrating the definition of a taper angle.
- 4 is a schematic plan view for explaining regions 10a1, 10a2, and 10b in the display panel 10.
- FIG. 2 is an external perspective view showing an example of an external appearance of a set including the organic display device 1.
- FIG. 1 is an external perspective view showing an example of an external appearance of a set including the organic display device 1.
- FIG. 14 is a schematic plan view showing a configuration of a bank 805 included in a display panel 80 according to Modification 3.
- FIG. (A), (b) is a schematic cross section which shows the biased state of the film thickness distribution of the organic light emitting layer for every adjacent sub pixel in a display panel.
- (A) to (c) are schematic cross-sectional views showing the vapor concentration distribution during the formation of the organic light emitting layer and the state of uneven film shape in the ink drying process.
- An organic light-emitting panel is a panel in which a plurality of pixel units are arranged, and each pixel unit of the plurality of pixel units has a different emission color and is arranged in order.
- Each light emitting unit includes a base layer including a first electrode, an organic light emitting layer provided opposite to the base layer, and formed by applying an ink containing an organic light emitting material corresponding to each emission color, and an organic light emitting layer And a second electrode formed on the side opposite to the base layer.
- adjacent light-emitting portions among the plurality of light-emitting portions are divided, and a plurality of partition walls defining each light-emitting portion are provided.
- regulate a predetermined light emission part may differ is characterized by the above-mentioned.
- the two adjacent partition walls defining the predetermined light emitting portion are configured to have different inclination angles of facing surface portions, and thus ink at the time of manufacturing is dropped.
- the pinning position at the time can be adjusted. Specifically, the pinning height increases when the inclination angle in the surface portion of the partition wall is increased, and the pinning height decreases when the inclination angle is decreased.
- the film thickness of the organic light emitting layer after drying the ink has an inverse relationship with the magnitude of the inclination angle of the surface portion of the partition wall. Specifically, the film thickness of the organic light-emitting layer corresponding to the relatively large tilt angle tends to be reduced, and the film thickness of the organic light-emitting layer corresponding to the smaller tilt angle is increased.
- the inclination angle of the opposing surface portions in the two adjacent partition walls defining the predetermined light emitting portion is made different to prevent the unevenness of the thickness of the organic light emitting layer. And good emission characteristics can be obtained.
- the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of
- the pixel portion that is configured so that the inclination angles of the facing surface portions in two adjacent partition walls defining a predetermined light-emitting portion are different from each other is a plurality of light-emitting elements. It is possible to adopt a configuration in which the inclined angles of the facing surface portions in two adjacent partition walls defining another light emitting portion different from the predetermined light emitting portion of the portions are equal.
- the organic light emitting panel according to one aspect of the present invention by varying the inclination angle of the opposing surface portions in two adjacent partitions defining a predetermined light emitting portion, it is possible to prevent the unevenness of the film thickness of the organic light emitting layer, The point that good light emission characteristics can be obtained is as described above.
- the inclination angle of the facing surface portions in the two adjacent partition walls defining the other light-emitting portions is equalized, thereby causing a deviation in film thickness during manufacturing. With respect to the light emitting portion that does not, uneven thickness can be prevented, and good light emission characteristics can be obtained. Thus, good light emission characteristics can be obtained in the plurality of pixel portions.
- the plurality of light emitting units included in each pixel unit includes a first light emitting unit located on one side and a second light emitting located on the center side in the arrangement order. It is also possible to employ a configuration in which the plurality of pixel portions are formed so as to be adjacent to each other at least, including at least a third light emitting portion located on the other side. In this case, the plurality of pixel portions have the same inclination angle of the opposing surface portions in the two adjacent partitions defining the first light emitting portion, and the opposing surface portions in the adjacent two partitions defining the second light emitting portion. It is possible to adopt a configuration in which the pixel portions satisfy the relationship that the tilt angles of the two adjacent partition walls defining the third light emitting portion are equal and the tilt angles of the opposing surface portions are equal.
- a non-light emitting portion (for example, a portion where a bus bar is disposed) is not interposed between adjacent pixel portions, and ink application relating to the formation of the organic light emitting layer is performed in the arrangement order.
- ink application relating to the formation of the organic light emitting layer is performed in the arrangement order.
- the plurality of light-emitting units included in each pixel unit are arranged on the central side and the first light-emitting unit located on one side in the arrangement order. It is also possible to adopt a configuration in which at least a second light emitting unit and a third light emitting unit located on the other side are included, and a non-pixel unit is formed between adjacent pixel units of the plurality of pixel units. . In this case, a partition wall is formed between the pixel portion and the non-pixel portion, and the plurality of pixel portions are opposed to each other between two adjacent partition walls that define the first light emitting portion.
- the angle of inclination of the facing surface portions of the two adjacent partition walls defining the third light emitting portion is different, and the angle of inclination of the facing surface portions of the two adjacent partition walls defining the second light emitting portion is different.
- a configuration in which pixel portions satisfying the relationship of different can be employed can be employed.
- the ink application for forming the organic light emitting layer is performed in the arrangement order.
- the ink application for forming the organic light emitting layer is performed in the arrangement order.
- the plurality of light-emitting portions included in each pixel portion includes a first light-emitting portion located on one side and a first light-emitting portion located on the center side in the arrangement order. It is also possible to employ a configuration in which a non-pixel portion is formed between each of adjacent pixel portions of a plurality of pixel portions, including at least two light emitting portions and a third light emitting portion located on the other side. . In this case, a partition wall that partitions the pixel portion and the non-pixel portion is formed between the pixel portion and the non-pixel portion, and the plurality of pixel portions are adjacent to each other that defines the first light emitting portion.
- the angle of inclination of the opposing surface portions of the two partition walls is different, the angle of inclination of the opposing surface portions of the two adjacent partition walls defining the second light emitting portion is the same, and the opposing surface portions of the two adjacent partition walls defining the third light emitting portion It is possible to employ a configuration in which a pixel portion that satisfies the relationship that the inclination angles of the two are different is provided.
- the ink application for forming the organic light emitting layer is performed in the arrangement order.
- a non-light emitting portion for example, a portion where a bus bar is arranged
- the ink application for forming the organic light emitting layer is performed in the arrangement order.
- the non-pixel portion does not include the organic light emitting layer
- the third electrode is configured to have the same material as the second electrode and the first electrode in the pixel portion. It is also possible to adopt a configuration in which the second electrode and the third electrode are electrically connected.
- a light transmissive material for example, ITO, IZO, etc.
- This material has high electrical resistance.
- the third electrode is, for example, a bus bar.
- the organic light emitting panel in the above configuration, when the ink related to the formation of the organic light emitting layer is applied to the predetermined light emitting portion, the two regions adjacent to the predetermined light emitting portion.
- the inclination angle of the surface portion of the partition located on the side where the vapor concentration of the ink is low among the two partitions defining the predetermined light emitting portion is A configuration in which the inclination angle of the surface portion of the partition located on the higher vapor concentration side can be employed.
- the film thickness of the organic light emitting layer at one end portion on the side where the ink vapor concentration is low is equal to the vapor concentration of the ink. It tends to be thicker than the film thickness at the other end on the higher side. This tends to cause a bias in the film thickness distribution of the organic light emitting layer.
- the inclination angle of the surface portion of the partition located on the side where the ink vapor concentration is low is larger than the inclination angle of the surface portion of the partition located on the side where the ink vapor concentration is high.
- the ink pinning position in the partition located on the low side is relatively higher than the ink pinning position in the partition located on the high ink vapor concentration side, and as a result, the ink vapor concentration position is located on the low side.
- the film thickness of the organic light emitting layer on the partition wall side can be suppressed, and the deviation of the film thickness between the one end side and the other end side of the predetermined light emitting portion can be prevented.
- the thickness of the organic light-emitting layer can be prevented from being uneven with respect to the predetermined light-emitting portion, and the light emission characteristics in each pixel portion are good.
- the predetermined light-emitting portion corresponds to the light-emitting portion with respect to any one light-emitting portion in two adjacent light-emitting portions of the same pixel portion.
- the ink corresponding to the predetermined light emitting portion is applied.
- the ink corresponding to the light emitting part is applied to one light emitting part in two adjacent light emitting parts, and the light emitting part corresponds to the other light emitting part.
- the vapor concentration of the ink is higher on the one light emitting part side than on the other light emitting part side. .
- the film thickness of the organic light emitting layer at the end on the other light emitting part side is higher than the film thickness of the organic light emitting layer at the end on the one light emitting part side, and the film thickness tends to be biased. is there.
- the inclination angle of the surface portion of the partition wall located on the other light emitting portion side is larger than the inclination angle of the surface portion of the partition wall located on the one light emitting portion side
- the ink pinning position in the partition located is relatively higher than the ink pinning position in the partition located on the one light emitting part side, and as a result, the organic on the partition side located on the other light emitting part side.
- the film thickness of the light emitting layer can be suppressed, and deviation of the film thickness of the organic light emitting layer at one end and the other end of the predetermined light emitting portion can be prevented.
- the thickness of the organic light emitting layer can be prevented from being uneven with respect to the predetermined light emitting portion, and the light emission characteristics in each pixel portion are good.
- the organic light emitting panel in the above configuration, when the ink related to the formation of the organic light emitting layer is applied to the predetermined light emitting portion, the two regions adjacent to the predetermined light emitting portion.
- the ink when the ink is applied to another light emitting part different from the predetermined light emitting part, the vapor concentration of the ink is different and adjacent to the other light emitting part different from the predetermined light emitting part. It is also possible to adopt a configuration in which the vapor concentration of ink is equal in the two regions.
- each pixel portion of the plurality of pixel portions is applied in order from one side to the other side in the same pixel portion with the ink corresponding to each light emission color.
- a plurality of light emitting portions formed with an organic light emitting layer, which are located on one side and corresponding to the first light emitting portion on which the corresponding ink is applied in the first round and located on the center side.
- a plurality of light emitting units having at least a second light emitting unit to which ink is applied in the second round and a third light emitting unit located on the other side and corresponding ink is applied to the third round; When adopting the configuration, it has the following characteristics.
- a plurality of pixel portions are formed so as to be adjacent to each other, and in each pixel portion, facing surface portions in two adjacent partition walls that define the first light emitting portion.
- the inclination angles of the opposing surface portions of the two adjacent partition walls defining the second light emitting portion are different, and the inclination angles of the opposing surface portions of the two adjacent partition walls defining the third light emitting portion are equal. It can be said that it has the characteristic.
- a non-pixel portion is not provided between adjacent pixel portions, and ink application in each pixel portion is performed by the first light emitting portion, the second light emitting portion, and the third light emitting portion. It has an effect on the configuration performed in the order of the parts. That is, in the two adjacent partition walls that define the first light emitting portion where the ink application is performed in the first round, the inclined angles of the opposing surface portions are equal to each other, and the ink application is performed in the second round. Two adjacent partition walls defining the two light emitting portions have different inclination angles of the facing surface portions, and two adjacent partition walls defining the third light emitting portion where the ink application is performed in the third round are opposed to each other.
- the inclination angles of the surface portions to be performed are equal to each other. As a result, even when a difference occurs in the ink vapor concentration depending on the order of ink application, the first light emission is performed for the film thickness of the organic light emitting layer formed by relative adjustment of the pinning position of the ink with respect to the surface portion of each partition wall.
- the bias can be effectively prevented by the portion, the second light emitting portion, and the third light emitting portion.
- the inclination angle of the opposing surface portion of the partition located on the third light emitting unit side is the same as that of the partition located on the first light emitting unit side. It is possible to adopt a configuration that is larger than the inclination angle of the opposed surface portions. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- regulates a 2nd light emission part specifically faces the 1st light emission part is the adjacent which prescribes
- the inclination angle of the opposing surface portion of the partition located on the first light emitting unit side in two adjacent partitions defining the second light emitting unit is adjacent to the third light emitting unit. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in the two matching partition walls. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- each inclination angle can be specifically set within the following range.
- the inclination angle of the opposing surface of the partition located on the third light emitting unit side in the two adjacent partitions defining the second light emitting unit can be set to 35 [°] or more and 45 [°] or less.
- the inclination angle of the opposing surface portions of the partition located on the first light emitting unit side in the two adjacent partitions defining the second light emitting unit can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface portions in the two adjacent partition walls defining the first light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface portions in the two adjacent partitions defining the third light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- each pixel portion of the plurality of pixel portions is applied in order from one side to the other side in the same pixel portion with the ink corresponding to each light emission color.
- a plurality of light emitting portions formed with an organic light emitting layer, located on one side and corresponding to the first light emitting portion on which the corresponding ink is applied in the first round and located on the center side
- a plurality of light emitting units having at least a second light emitting unit applied with ink in the second round and a third light emitting unit located on the other side and applied with the corresponding ink in the third round;
- a non-pixel portion is formed between adjacent pixel portions in a plurality of pixel portions, and the pixel portion and the non-pixel portion are not between the pixel portion and the non-pixel portion.
- a partition wall that partitions the pixel portion is formed, and each pixel portion has two adjacent partition walls that define the second light-emitting portion, with the inclination angles of the opposing surface portions in the two adjacent partition walls that define the first light-emitting portion being equal.
- the inclination angle of the opposing surface portions in the partition walls is different, and the inclination angle of the opposing surface portions in the two adjacent partition walls defining the third light emitting portion is different.
- a non-pixel portion is provided between adjacent pixel portions, and the application of ink in each pixel portion is performed by the first light emitting portion, the second light emitting portion, and the third light emitting portion. It has an effect on the configuration performed in this order. That is, in the two adjacent partition walls that define the first light emitting portion where the ink application is performed in the first round, the inclined angles of the opposing surface portions are equal to each other, and the ink application is performed in the second round. Two adjacent partition walls defining two light emitting portions have different inclination angles of opposing surface portions, and two adjacent partition walls defining a third light emitting portion where ink application is performed in the third round. The inclination angles of the opposing surface portions are different from each other.
- the first light emission is performed for the film thickness of the organic light emitting layer formed by relative adjustment of the pinning position of the ink with respect to the surface portion of each partition wall.
- the bias can be effectively prevented by the portion, the second light emitting portion, and the third light emitting portion.
- the inclination angle of the opposing surface portion of the partition located on the third light emitting unit side in the two adjacent partitions defining the second light emitting unit is the same as that of the partition located on the first light emitting unit side.
- a partition wall having an inclination angle of an opposing surface portion of the partition wall located on the non-pixel portion side in two adjacent partition walls defining the third light emitting portion larger than an inclination angle of the facing surface portion positioned on the second light emitting portion side It is possible to adopt a configuration that is larger than the inclination angle of the opposing surface portions. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- regulates a 3rd light emission part It is possible to adopt a configuration in which the two inclined partition walls have the same inclination angle of the opposing surface portions of the partition wall located on the non-pixel portion side. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- regulates a 2nd light emission part specifically faces the 1st light emission part is the adjacent which prescribes
- the inclination angle of the opposing surface portion of the partition located on the second light emitting unit side in the two adjacent partitions defining the third light emitting unit is adjacent to the first light emitting unit. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in the two matching partition walls. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- each inclination angle can be specifically set within the following range.
- the inclination angle of the opposing surface part of the partition located on the third light emitting part side can be set to 35 [°] or more and 45 [°] or less. .
- the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side can be set to 35 [°] or more and 45 [°] or less.
- the inclination angle of the opposing surface portion of the partition located on the first light emitting unit side can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface of the partition located on the second light emitting unit side can be set to 25 [°] or more and 35 [°] or less. .
- the inclination angle of the opposing surface portions in the two adjacent partitions defining the first light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- each pixel portion of the plurality of pixel portions is simultaneously coated with ink corresponding to each light emission color from one side to the other side in the same pixel portion.
- a plurality of light-emitting portions that are located on the other side and have at least a third light-emitting portion to which the corresponding ink is applied have the following characteristics.
- a non-pixel portion is formed between adjacent pixel portions of a plurality of pixel portions, and the pixel portion and the non-pixel portion are provided between the pixel portion and the non-pixel portion.
- Partitioning partition walls are formed, and in each pixel portion, the inclination angles of the facing surface portions in the two adjacent partition walls defining the first light emitting portion are different, and the opposing two partition walls defining the second light emitting portion are opposed to each other.
- the inclined angle of the surface portions to be equal is the same, and the inclined angle of the facing surface portions in the two adjacent partition walls defining the third light emitting portion is different.
- a non-pixel portion is provided between adjacent pixel portions, and the application of ink in each pixel portion is performed by the first light emitting portion, the second light emitting portion, and the third light emitting portion.
- This has an effect on a configuration that is performed simultaneously at the same time. That is, since the ink application is performed at the same time and the non-pixel portion is provided between the adjacent pixel portions, when the ink is applied, the second light emitting portion located on the center side The vapor concentration of ink on both sides becomes equal, and the vapor concentration of ink on both sides of each light emitting unit differs between the first light emitting unit and the third light emitting unit.
- the inclination angles of the opposing surface portions in the two adjacent partition walls defining the first light emitting portion are different, and the two adjacent light emitting portions are defined.
- a configuration is adopted in which the inclined angles of the facing surface portions in the partition walls are equal, and the inclined angles of the facing surface portions in the two adjacent partition walls defining the third light emitting unit are different.
- the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side is opposite to the partition located on the second light emitting unit side.
- the inclination angle of the opposing surface part of the partition located on the non-pixel part side in two adjacent partitions defining the third light emitting part is larger than the inclination angle of the surface part to be It is possible to adopt a configuration that is larger than the inclination angle of the opposed surface portions. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- the inclination angle of the opposing surface part of the partition wall located on the non-pixel part side and the adjacent that defines the third light emitting part It is possible to adopt a configuration in which the inclination angles of the opposing surface portions of the partition located on the non-pixel portion side in the two partitions are equal. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- the inclination angle of the opposing surface portion of the partition wall located on the second light emitting unit side is adjacent to the second light emitting unit. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in the two matching partition walls. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- the inclination angle of the opposing surface portion of the partition wall located on the second light emitting unit side is adjacent to the second light emitting unit. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in the two matching partition walls. Thereby, it is possible to prevent unevenness in the film thicknesses of the respective organic light emitting layers of the first light emitting unit, the second light emitting unit, and the third light emitting unit.
- each inclination angle can be specifically set within the following range.
- the inclination angle of the opposing surface of the partition located on the non-pixel portion side can be set to 35 [°] or more and 45 [°] or less. .
- the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side can be set to 35 [°] or more and 45 [°] or less.
- the inclination angle of the opposing surface portion of the partition located on the second light emitting unit side can be set to 25 [°] or more and 35 [°] or less. .
- the inclination angle of the opposing surface of the partition located on the second light emitting unit side can be set to 25 [°] or more and 35 [°] or less. .
- the angle of inclination of the opposing surface parts in the two adjacent partitions defining the first light emitting part is 25 [°] or more and 35 [°] or less. can do.
- the organic light-emitting panel according to one embodiment of the present invention, a configuration in which the above-described inclination angle is an angle formed by each of the facing surface portions of the partition and the upper surface of the base layer on which the partition is formed is employed. Can do.
- the underlying layer includes a TFT (thin film transistor) layer formed below the first electrode, and two adjacent partitions defining the predetermined light-emitting portion.
- TFT thin film transistor
- an organic display device includes any one of the organic light emitting panels according to one embodiment of the present invention. Therefore, the organic display device according to one embodiment of the present invention can prevent unevenness in the thickness of the organic light-emitting layer in the organic light-emitting panel as described above, and favorable light-emitting characteristics can be obtained.
- the method for manufacturing an organic light emitting panel according to an aspect of the present invention is a method for manufacturing an organic light emitting panel in which a plurality of pixel portions are arranged, and includes the following steps.
- a photosensitive resist material is laminated on the underlayer.
- the laminated photosensitive resist material layer is subjected to mask exposure and patterned to form a plurality of openings corresponding to the plurality of light emitting portions in each pixel portion, and each adjacent light emitting portion is partitioned and separated. A plurality of partition walls defining the light emitting portion are formed.
- a 2nd electrode is formed above an organic light emitting layer.
- the third step at least a part of the plurality of pixel units is defined as a predetermined light-emitting unit among the plurality of light-emitting units to which the pixel unit belongs.
- the two adjacent partition walls are formed with different inclination angles of opposing surface portions.
- the pinning position when ink is dropped at the time of manufacturing is configured such that the inclined angles of the facing surface portions in two adjacent partition walls defining the predetermined light emitting portion are different. Can be adjusted. Specifically, the pinning height increases when the inclination angle in the surface portion of the partition wall is increased, and the pinning height decreases when the inclination angle is decreased.
- organic light emitting panel which concerns on 1 aspect of this invention, based on the relationship that the film thickness of the organic light emitting layer after ink drying has a reverse relationship with the magnitude
- the third step in the third step, at least a part of the pixel portions, other light emission different from the predetermined light-emitting portion among the plurality of light-emitting portions. It is possible to adopt a configuration in which the inclined angles of the facing surface portions in two adjacent partition walls defining the portion are formed to be equal.
- the organic light emitting layer is formed in a state in which the unevenness of the film thickness is prevented by making the inclination angles of the opposing surface portions in the two adjacent partitions defining the predetermined light emitting portion different from each other.
- an organic light-emitting panel having good light emission characteristics can be manufactured.
- the inclination angle of the facing surface portions in the two adjacent partition walls defining the other light emitting portions is made equal to each other at the time of manufacturing. With respect to the light emitting portion in which the uneven thickness does not occur, the uneven thickness can be prevented, and good light emission characteristics can be obtained. Accordingly, an organic light emitting panel having good light emission characteristics in all pixel portions can be manufactured.
- the opposing surface portions in the two adjacent partition walls that define the predetermined light-emitting portion are provided. It is possible to adopt a specific configuration in which the inclination angle in each surface portion of the target partition wall is made different by making the exposure amounts to the corresponding portions different from each other. Thereby, the inclination angle of the opposing surface portions in the two adjacent partition walls defining the predetermined light emitting portion can be configured to be different, and an organic light emitting layer having no thickness deviation is formed by adjusting the pinning position. can do. Therefore, an organic light emitting panel having good light emission characteristics can be manufactured.
- the photosensitive resist material is exposed in two adjacent partition walls that define the predetermined light-emitting portion in the third step. It is also possible to adopt a configuration in which the inclination angle of each surface portion of the target partition wall is made different by using masks having different light transmittances to the portion corresponding to the surface portion. Even when such a method is adopted, it can be configured such that the inclination angles of the opposing surface portions in two adjacent partition walls defining the predetermined light emitting portion are different, and the film thickness can be adjusted by adjusting the pinning position. An organic light emitting layer having no bias can be formed. Therefore, an organic light emitting panel having good light emission characteristics can be manufactured.
- the portion corresponding to the opposing surface portions in the two adjacent partitions defining the predetermined light-emitting portion is photosensitive. After exposing and developing the photosensitive resist material, by performing an additional exposure process on the portion corresponding to any one of the opposing surface portions, the inclination angle in each surface portion of the target partition wall is varied, It is also possible to adopt the configuration. Even when such a method is adopted, it can be configured such that the inclination angles of the opposing surface portions in two adjacent partition walls defining the predetermined light emitting portion are different, and the film thickness can be adjusted by adjusting the pinning position. An organic light emitting layer having no bias can be formed. Therefore, an organic light emitting panel having good light emission characteristics can be manufactured.
- an organic display device includes an organic light-emitting panel obtained by employing any one of the manufacturing methods according to the above aspect of the present invention.
- an organic display device including an organic light-emitting panel manufactured using such a manufacturing method, as described above it is possible to prevent unevenness of the film thickness of the organic light-emitting layer in the organic light-emitting panel, and good light-emitting characteristics can be obtained. .
- an anode electrode 902 and an electrode coating layer 903 covering the anode electrode 902 are provided on a substrate 901 for each of the subpixels 900a, 900b, and 900c. Then, a hole injection layer 904 is formed so as to cover the electrode coating layer 902 and the surface of the substrate 901.
- organic light emitting layers 906a, 906a, 906a, 906a, 906a, 906a, 906b and 906c are stacked.
- the organic light emitting layers 906a, 906b, and 906c are partitioned by banks 905a to 905d provided upright on the hole injection layer 904.
- the organic light emitting layer 906b of the subpixel 900b arranged in the center in the arrangement order may cause a deviation in film thickness.
- the height of the location C 3 in the bank 905 c of the organic light emitting layer 906 b is the height of the location C 2 in the bank 905 b and the location C on the bank 905 b side of the organic light emitting layer 906 a in the subpixel 900 a. The phenomenon that it becomes higher than the height of 1 occurs.
- the heights of the respective locations C 12 and C 14 on the banks 955c and 955d side of the organic light emitting layers 956b and 956c in the subpixels 950b and 950c are as follows.
- a phenomenon occurs in which the height of each of the organic light emitting layers 956b and 956c is higher than the heights of the respective locations C 11 and C 13 on the banks 955b and 955c side.
- the height of the portion on the bank 955a side and the height of the portion on the bank 955b side are substantially equal, resulting in a large deviation in film thickness. Absent.
- the present inventor presumed that the decrease in film thickness uniformity in the organic light-emitting layer was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 26A, it is assumed that ink 9060b for forming an organic light emitting layer is applied to a region defined between the banks 905b and 905c. As shown by the two-dot chain line, when the vapor concentration distribution is lower on the right side than on the left side in FIG. 26 (a), it is considered that the thickness of the organic light emitting layer is biased due to the following relationship. .
- surface profile L 90 of ink 9060B has a shape which raised the central portion of the sub-pixels.
- fast evaporation rate at low vapor concentrations side since slower at high vapor concentrations side, the changes to the surface profile L 91 It can be considered formally.
- the present inventor has obtained an inference regarding the organic light emitting panel that the uniformity of the thickness of the formed organic light emitting layer is reduced due to the nonuniformity of the vapor concentration distribution when the ink is dried. .
- the present inventor changes the pinning position of the bank side surface portion of the ink by changing the inclination angle of the surface portion of the bank in the panel surface. As a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.
- a display device (organic display device) 1 includes a display panel unit 10 and a drive control unit 20 connected thereto.
- the display panel unit 10 is an organic light emitting panel using an electroluminescence phenomenon of an organic material, and a plurality of pixel units are two-dimensionally arranged in the XY plane direction.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.
- the configuration of the display panel 10 will be described with reference to FIG. Note that the display panel 10 according to the present embodiment employs a top emission type organic light emitting panel as an example, and emits organic light having one of red (R), green (G), and blue (B). A plurality of pixel portions including layers are arranged and configured in a matrix. In FIG. 2, one subpixel 100 in one pixel portion is extracted and drawn.
- the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each subpixel 100.
- a bank (partition wall) 105 made of an insulating material and partitioning between the sub-pixels 100 is erected.
- An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each subpixel 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .
- the substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.
- the substrate 101 includes a TFT layer, a passivation film, an interlayer insulating film, and the like that are stacked.
- the anode electrode 102 is composed of a single layer made of a conductive material or a laminated body formed by laminating a plurality of layers.
- a conductive material for example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- Al aluminum
- an alloy containing the same For example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- MoCr molybdenum and chromium alloy
- NiCr nickel and
- Electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers at least a part of the surface of the anode electrode 102 at the upper part in the Z-axis direction.
- ITO indium tin oxide
- the hole injecting and transporting layer 104 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- PEDOT mixture of polythiophene and polystyrene sulfonic acid
- the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.
- the bank (partition wall) 105 is made of an organic material such as resin and has an insulating property.
- the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin.
- the bank 105 preferably has organic solvent resistance.
- the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the process.
- the side surface portion can be treated with fluorine.
- a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or more and having water repellency can be used as the insulating material used for forming the bank 105. This is because when a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent subpixels 100 is generated. This is because various problems such as an increase in power consumption are caused.
- the bank 105 when the bank 105 is formed using a hydrophilic material, the difference in lyophilicity / liquid repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. This is because it becomes difficult to selectively hold the ink containing an organic substance in the opening of the bank 105 in order to form the ink.
- the structure of the bank 105 not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted.
- the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.
- Organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108.
- As a material used for forming the organic light emitting layer 106 it is necessary to use a light emitting organic material that can be formed by a wet printing method.
- Electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
- the cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance
- the cathode electrode 108 As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also.
- the layer containing silver may be formed of silver alone, or may be formed of a silver alloy.
- a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.
- the sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.
- the display panel 10 employs a line bank 105 as an example. Specifically, each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction.
- the sub-pixel 100 is formed so that the emission color is different for each area partitioned by the bank 105.
- the sub-pixel 100 has 3 emission colors of red (R), green (G), and blue (B).
- R red
- G green
- B blue
- One pixel portion is configured by a combination of two subpixels.
- FIG. 4 is a cross-sectional end view in which the display panel 10 in FIG. 1 is cut along the AA ′ cross section and a part thereof is schematically shown.
- a subpixel 100a, a subpixel 100b, and a subpixel 100c are sequentially arranged in this order from the left side in the X-axis direction.
- the pixel portion and the pixel portion are arranged so as to be adjacent to each other.
- the subpixel 100a is defined by the bank 105a and the bank 105b
- the subpixel 100b is defined by the bank 105b and the bank 105c
- the subpixel 100c is defined by the bank 105b and the bank 105d.
- the surface portions 105aa, 105ba, 105bb, 105cb, 105cc, and 105dc and the surface of the hole injecting and transporting layer 104, which is the base layer have angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cb, ⁇ cc and ⁇ dc are formed.
- angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cb, ⁇ cc, and ⁇ dc satisfy the relationships shown by the following equations.
- FIG. 5 schematically illustrates the structure of one subpixel.
- the angle of inclination of the surface portion of the bank 105x (the angle formed by the surface portion of the bank 105x and the surface of the hole injecting and transporting layer 104) is the angle ⁇ x
- the inclination angle of the surface portion of the bank 105y (the angle formed by the surface portion of the bank 105y and the surface of the hole injection transport layer 104) is the angle ⁇ y.
- the angle ⁇ x and the angle ⁇ y satisfy the following relationship.
- Hy> Hx As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the sub-pixel is formed in the organic light emitting layer 106x to be formed due to the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.
- the thickness Tx and the thickness Ty satisfy the following relationship.
- the pinning position is higher in Sample 3 and Sample 4 where the taper angle is larger than the thickness distribution of Sample 2.
- the horizontal axis indicates the horizontal direction
- the vertical axis indicates the height direction.
- the anode electrode 102 and the electrode covering layer 103 are sequentially stacked on the upper surface in the Z-axis direction of the substrate 101 so as to correspond to the respective subpixel planned areas 1000a, 1000b, and 1000c. .
- a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface.
- the anode electrode 102 is formed by, for example, forming a thin film made of Al or an alloy thereof or an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the thin film using a photolithography method.
- the electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method and patterning the ITO thin film using a photolithography method or the like.
- a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injection / transport layer 104.
- a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coat method.
- a photosensitive resist material is used for the formation of the bank material layer 1050.
- an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.
- a mask 501 provided with openings 501a, 501b, 501c, and 501d is provided above the bank material layer 1050 at a location where a bank is to be formed. In this state, exposure is performed through the openings 501a, 501b, 501c, and 501d of the mask 501.
- the opening 501a of the mask 501 located on the left side of the planned subpixel area 1000a has a width Wa of the surface portion 105aa of the bank 105a to be formed. 4)) at the lower end points Pa1 and Pa2.
- the opening 501c of the mask 501 located between the sub-pixel 1000b and the sub-pixel 1000c has a width Wc1 of the point Pc1 at the upper end of the surface portion 105cb (see FIG. 4) of the bank 105c to be formed and the surface portion 105cc. (Refer to FIG. 4) and the point Pc2 of the skirt portion.
- a mask 502 having an opening 502c provided at a position corresponding to the surface portion 105cb (see FIG. 4) of the bank 105c is disposed above the bank material layer 1050.
- the second exposure is executed through the opening 502c of the mask 502.
- the width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the surface portion 105cb of the bank 105c to be formed.
- the surface portion 105cb of the bank 105c on the subpixel planned area 1000b side is more than the surface portion 105aa, 105ba, 105bb, 105dc of the banks 105a, 105b, and 105d and the surface portion 105cc of the bank 105c on the subpixel planned area 1000c side.
- the inclination angle increases.
- an ink 1060a containing an organic light emitting material is applied to the opening (subpixel planned area 1000a) partitioned by the bank 105a and the bank 105b using an ink jet method or the like.
- an ink 1060b containing an organic light emitting material is applied to the opening (sub-pixel planned region 1000b) partitioned by the bank 105b and the bank 105c, similarly using an inkjet method or the like.
- the pinning position Qcb of the ink 1060b with respect to the surface portion 105cb of the bank 105c is another pinning position. The position is higher than Qaa, Qba, and Qbb.
- ink 1060c containing an organic light emitting material is applied to the opening (subpixel planned region 1000c) partitioned by the bank 105c and the bank 105d using the same ink jet method or the like.
- the ink 1060c is applied to both sides in the X-axis direction. There is no difference in the vapor concentration, and the thickness of the organic light emitting layer is not biased even if the inclination angle of the bank surface is not adjusted. This is clear from the above.
- red ink (ink 1060a) is applied (step S1)
- green ink (ink 1060b) is applied (step S2)
- blue ink (ink) is applied.
- 1060c) was applied (step S3), and then the ink drying step (step S4) was collectively performed.
- step S11 application (step S11) of red ink (ink 1060a) and drying (step S12) are performed, and then application of green ink (ink 1060b) is performed.
- the execution of (Step S21) and its drying (Step S22) and the application of the blue ink (ink 1060c) (Step S31) and its drying (Step S32) may be performed sequentially.
- the relationship between the inclination angles of the surface portions 105aa, 105ba, 105bb, 105cb, 105cc, and 105dc of the banks 105a, 105b, 105c, and 105d can be the same as described above. Also in this case, the uneven thickness of the formed organic light emitting layer 106 can be suppressed.
- the inclination angle ⁇ cb of the surface portion 105cb on the subpixel 100c side in the bank 105c is set to the other surface portions 105aa, 105ba, 105bb, 105cc,
- the inclination angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cc, and ⁇ dc of 105 dc are set large. For this reason, as shown in FIG. 11A, when the ink 1060b is applied to the planned sub-pixel area 1000b, the pinning position Qcb becomes higher than the other pinning positions Qaa, Qba, Qbb.
- the inclination angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cc, ⁇ dc of the surface portions 105aa, 105ba, 105bb, 105cc, 105dc are equal to each other.
- the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in the subpixels 100a, 100b, and 100c, and luminance unevenness is small.
- the display apparatus 1 which has the said effect is manufactureable.
- “equal” does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device 1. Specifically, in the display panel 10, it means that the inclination angles are made equal within a practically allowable range of the difference in luminance efficiency (luminance unevenness) of the subpixels 100 a, 100 b, and 100 c belonging to the display panel 10.
- Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG.
- FIG. 13 shows a step corresponding to the step shown in FIG. 9C to FIG.
- a mask 503 is disposed thereon.
- the mask 503 is provided with light transmitting portions 503a, 503b, 503c1, 503c2, and 503d.
- Each of the light transmitting portions 503a, 503b, 503c1, 503c2, and 503d is provided corresponding to a location where the banks 105a, 105b, 105c, and 105d are to be formed.
- the width Wa of the light transmitting portion 503a in the region corresponding to the left side of the planned subpixel region 1000a is the surface portion 105aa of the bank 105a to be formed (FIG. 4). )) At the lower end points Pa1 and Pa2.
- the width Wc2 of the light transmitting portion 503c1 in the region corresponding to between the subpixel 1000b and the subpixel 1000c depends on the lower end point Pc2 and the upper end point Pc1 of the bank 105c (see FIG. 4) to be formed. It is prescribed.
- the light transmitting portion 503c2 is defined by the upper and lower end points Pc3 and Pc1 of the surface portion 105cb (see FIG. 4) of the bank 105c to be formed.
- the mask 503 is configured using a mask such as a halftone, and the light transmittances of the light transmitting portions 503a, 503b, 503c1, and 503d and the light transmitting portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a, 503b, 503c1, and 503d.
- Banks 105a, 105b, 105c, and 105d as shown in FIG. 10B are formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then baking. Can do. That is, the relationship expressed by the above [Equation 1] is higher in the portion exposed through the light transmitting portion 503c2 where the light transmittance is set higher than in the portion exposed through the other light transmitting portions 503a, 503b, 503c1, and 503d. As described above, the inclination angle of the side wall surface is increased.
- the display device 1 can also be manufactured by the manufacturing method as described above.
- a mask 504 is disposed thereon.
- the mask 504 is provided with openings 504a, 504c, and 504d corresponding to the respective locations where the bank 105 is to be formed.
- the openings 504a, 504b, and 504d are formed with the same width as the opening 501a of the mask 501 used in the manufacturing method of the above embodiment.
- the width Wc3 of the opening 504c provided at the location where the bank 105c (see FIG. 4) to be formed between the planned subpixel region 1000b and the planned subpixel region 1000c is to be formed is shown in FIG.
- the width is set to be larger than the width defined by the upper and lower points Pc2 and Pc3 of the surface portion 105cb (see FIG. 4) of the bank 105c. .
- the width is increased at a location where the inclination angle is to be increased.
- bank material layers 1051a, 1051b, 1051c, and 1051d remain at locations corresponding to the openings 504a, 504b, 504c, and 504d, respectively.
- the inclination angles of the respective surface portions of the bank material layers 1051a, 1051b, 1051c, and 1051d are uniform.
- baking is not performed at this time.
- a mask 505 is disposed thereabove.
- the mask 505 is provided with an opening 505c only in a portion (surface portion 105cb of the bank 105c) where the inclination angle is to be increased among portions corresponding to the surface portions of the banks 105a, 105b, 105c, and 105d to be formed. .
- Banks 105a, 105b, 105c, and 105d as shown in FIG. 15B can be formed by performing the second exposure / development with the mask 505 disposed and then baking.
- the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
- the inclination angle of the bank side surface formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.
- the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.
- a horizontal axis shows a horizontal direction and a vertical axis
- shaft shows a height direction.
- Embodiment 2 The configuration of the display device according to Embodiment 2 will be described with reference to FIGS.
- the display panel 30 is formed on a TFT substrate (hereinafter simply referred to as “substrate”) 101, similarly to the display panel 10 according to the first embodiment.
- An anode electrode 102 is formed corresponding to each of the subpixels 300 a, 300 b, and 300 c, and an electrode coating layer 103 and a hole injection / transport layer 104 are sequentially stacked on the anode electrode 102.
- each subpixel 300a, 300b, and 300c an organic light emitting layer, an electron injection layer, a cathode electrode, and a sealing layer are sequentially stacked in a region partitioned by the banks 305a, 305b, 305c, and 305d. (The illustration is omitted in FIG. 17).
- the display panel 30 according to the present embodiment is the same as the display panel 10 according to the first embodiment in that one pixel unit is configured by combining the sub-pixels 300a, 300b, and 300c. However, in the display panel 30 according to the present embodiment, the non-pixel portions 300d and 300e are provided between the adjacent pixel portions.
- an electrode (bus bar) 302 made of the same material as the anode electrode 102 and an electrode coating layer 303 covering the same are provided in the non-pixel portions 300d and 300e.
- a hole injecting and transporting layer 104 is extended on the electrode covering layer 303, and the cathode electrode 108 is formed on the hole injecting and transporting layer 104.
- the electrode 302 and the cathode electrode 108 are electrically connected. Connected.
- the organic light emitting layer 106 is not formed in the non-pixel portions 300d and 300e. By adopting such a configuration, it is possible to reduce the electrical resistance of the cathode electrode 108 made of ITO or the like, and to suppress a voltage drop.
- the surface 104 forms angles ⁇ 3aa, ⁇ 3ba, ⁇ 3bb, ⁇ 3cb, ⁇ 3cc, and ⁇ 3dc, respectively.
- angles ⁇ 3aa, ⁇ 3ba, ⁇ 3bb, ⁇ 3cb, ⁇ 3cc, and ⁇ 3dc satisfy the relationship represented by the following equations.
- an ink 3060a containing an organic light-emitting material is applied to the opening (sub-pixel planned region 3000a) partitioned by the bank 305a and the bank 305b using an inkjet method or the like.
- the ink concentration is not applied to the left side of the bank 305a and the right side of the bank 305b, so the vapor concentration distribution is substantially uniform.
- ink 3060b containing an organic light-emitting material is applied to the opening (sub-pixel planned region 3000b) partitioned by the bank 305b and the bank 305c, using the inkjet method or the like.
- the inclination angle ⁇ 3cb (see FIG. 17) of the surface portion 305cb in the bank 305c is set so as to satisfy the relationship of [Expression 7] (relatively large). Therefore, the pinning position Q3cb of the ink 3060b with respect to the surface portion 305cb of the bank 305c is higher than the other pinning positions Q3aa, Q3ba, Q3bb.
- the ink 3060c containing the organic light emitting material is applied to the opening (subpixel planned region 3000c) partitioned by the bank 305c and the bank 305d using the same ink jet method or the like.
- the non-pixel portion 3000d to which ink is not applied exists on the right side of the sub-pixel planned area 3000c, the vapor concentration on the right side of the sub-pixel 3000c is lower than that on the left side. Therefore, also for the bank 305d, the inclination angle ⁇ 3dc (see FIG. 17) of the surface portion 305dc on the side of the planned sub-pixel region 3000c (see FIG.
- the ink is dried, and then the display panel 30 is formed by sequentially stacking an electron injection layer, a cathode electrode, a sealing layer, and the like.
- the organic light-emitting layers in all the subpixels 300a, 300b, and 300c are provided.
- the uneven thickness can be suppressed, and the display panel 30 having high light emission characteristics can be obtained.
- the display panel 40 is formed on a TFT substrate (hereinafter simply referred to as “substrate”) 101, similarly to the display panel 10 according to the first embodiment.
- An anode electrode 102 is formed corresponding to each of the subpixels 400a, 400b, and 400c, and an electrode coating layer 103 and a hole injecting and transporting layer 104 are sequentially stacked on the anode electrode 102.
- each subpixel 400a, 400b, 400c an organic light emitting layer, an electron injection layer, a cathode electrode, and a sealing layer are sequentially stacked in a region partitioned by the banks 405a, 405b, 405c, 405d. (The illustration is omitted in FIG. 19).
- one pixel portion is configured by a combination of the subpixels 400a, 400b, and 400c, and the non-pixel portion 400d, 400e is provided. These points are the same as those of the display panel 30 according to the second embodiment.
- an electrode (bus bar) 402 made of the same material as the anode electrode 102 and an electrode covering layer 403 covering the electrode 402 are provided.
- a hole injecting and transporting layer 104 is provided on the electrode coating layer 403.
- a cathode electrode is formed thereon, and the electrode 402 and the cathode electrode are electrically connected.
- no organic light emitting layer is formed.
- the surface 104 forms angles ⁇ 4aa, ⁇ 4ba, ⁇ 4bb, ⁇ 4cb, ⁇ 4cc, and ⁇ 4dc, respectively.
- angles ⁇ 4aa, ⁇ 4ba, ⁇ 4bb, ⁇ 4cb, ⁇ 4cc, and ⁇ 4dc satisfy the relationship represented by the following equations.
- ink 4060a, 4060b, and 4060c are simultaneously applied to each of the sub-pixel planned areas 4000a, 4000b, and 4000c using an inkjet method or the like.
- the inks 4060a, 4060b, and 4060c only the planned sub-pixel region 4000b located at the center of the pixel portion has no difference in the vapor concentration distribution on the left and right in the X-axis direction.
- the non-pixel portion 4000d is present on the left side in the X-axis direction, so that the vapor concentration is lower on the left side than on the right side.
- the non-pixel portion 4000e exists on the right side in the X-axis direction, so that the vapor concentration is lower on the right side than on the left side.
- non-pixel portions 4000d and 4000e that are not coated with ink on the left side of the planned subpixel region 4000a and the right side of the planned subpixel region 4000c, respectively, but the surface portion 405aa of the bank 405a and the bank 405d
- the inclination angles ⁇ 4aa and ⁇ 4dc of the surface portion 405dc are larger than the other inclination angles ⁇ 4ba, ⁇ 4bb, ⁇ 4cb, and ⁇ 4cc.
- the pinning position Q4aa of the ink 4060a with respect to the surface portion 405aa of the bank 405a and the pinning position Q4dc of the ink 4060c with respect to the surface portion 405dc of the bank 405d are higher than the other pinning positions Q4ba, Q4bb, Q4cb, and Q4cc.
- the ink is dried, and then the electron injection layer, the cathode electrode, the sealing layer, and the like are sequentially laminated to form the display panel 40.
- the respective surfaces of the banks 105, 105a to 105d, 105x, 105y, 305a to 305e, and 405a to 405e are schematically shown as planes.
- the surface portion of the bank does not necessarily have to be a plane.
- FIG. 21 (a) when the bank 605, and the surface between the point P 61 to a point P 62, and the surface between the point P 62 to a point P 63, intersects It will be.
- pinning position Qy1 during inking resides on the surface between the point P 62 to a point P 63.
- the inclination angle ⁇ y2 face portion which is formed when subtracting the imaginary straight line L 1 which passes through the point P 62 is important in relation to the pinning position.
- the angle ⁇ y1 in the formation of the bank 605, by controlling the angle ⁇ y1 the surface and forms between the point P 61 of the hole injection transport layer 104 and the bank 605 is an underlying layer to the point P 62, the angle ⁇ y2 also controlled Therefore, it is possible to obtain the above effect by controlling the inclination angle ⁇ y1 substantially. That is, in the case of forming against the angle ⁇ y1 shown in FIG. 21 (a), the bank 705 angle ⁇ y11 large surface between the point P 71 to a point P 72 is (FIG. 21 (b)), FIG. 21 (b), the angle ⁇ y12 the surface between the point P 72 to a point P 73 with respect to the virtual straight line L 2 also increases with respect to the angle ⁇ y2 in FIG 21 (a).
- the application area of the above-described configuration in the display panels 10, 30, and 40 is not limited, but the above-described configuration is applied to all areas in the display panel.
- the above configuration can also be applied to a limited area.
- the display panel 10 in the direction along the surface, can be formally divided into a region 10a disposed in the center and a region 10b disposed in the vicinity thereof.
- the region 10a is connected to the source electrode or drain electrode of the TFT layer in which the anode electrode is formed, and contributes to light emission.
- the region 10b has the anode electrode below it.
- the region including the peripheral region 10a2 and the region 10b may be a pixel portion of about 0.5 [%] to several [%] (for example, 1 [%]) of the outer peripheral portion of the panel. This is because the film thickness variation of the organic light emitting layer in the case of not adjusting the tilt angle in the bank surface portion is taken into consideration.
- each configuration as an example is adopted to explain the configuration, operation, and effects of the present invention in an easy-to-understand manner.
- the present invention is not limited to the above embodiment.
- the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example.
- a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.
- the cathode electrode 108 When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.
- the specific external shape of the display device 1 is not shown.
- the organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.
- the forms of the banks 105, 105a to 105d, 105x, 105y, 305a to 305e, 405a to 405e, 605, and 705 are as shown in FIG.
- a so-called line bank structure is employed, a display panel employing a pixel bank 805 including a bank element 805a extending in the Y-axis direction and a bank element 805b extending in the X-axis direction as shown in FIG. 80 can be configured.
- the adjustment of the inclination angle of the bank surface portion employed in the first, second and third embodiments and the first and second modifications is performed by adjusting the vapor concentration in the ink application process and the drying process related to the formation of the organic light emitting layer at the time of manufacture.
- the distribution can be appropriately changed depending on the distribution. For example, due to the structure of the drying device, etc., when the flow of vapor during drying of the ink is in the direction from the outer periphery of the panel toward the center of the panel, it corresponds to the location where the film thickness of the organic light emitting layer increases. Then, the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.
- Embodiments 1, 2, and 3 and Modifications 1 and 2 there is no distinction in the setting of the inclination angle (taper angle) in the bank surface portion for each emission color (red, green, and blue). Since it is conceivable that the characteristics of the ink containing the organic light emitting material change according to the color, in this case, the inclination angle of the corresponding bank surface portion can be defined according to the ink characteristics of each emission color.
- the present invention is useful for realizing an organic light-emitting panel and an organic display device having little luminance unevenness and high image quality performance.
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Abstract
Description
本発明の一態様に係る有機発光パネルは、複数の画素部が配列されてなるパネルであって、複数の画素部の各画素部は、互いに発光色が異なり、順に配列された複数の発光部を有する。各発光部は、第1電極を含む下地層と、下地層に対向して設けられ、発光色ごとに対応した有機発光材料を含むインクが塗布されて形成された有機発光層と、有機発光層に対して下地層と反対側に形成された第2電極とを含む。そして、下地層の上方には、複数の発光部のうち隣り合う発光部を区画し、各発光部を規定する複数の隔壁が設けられ、複数の画素部は、属する複数の発光部のうちの所定の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なるように構成された画素部を含む、ことを特徴とする。
以下では、本発明を実施するための形態の一例について、図面を参酌しながら説明する。
本発明者は、[背景技術]において記載した有機発光パネルおよびこれを備える有機表示装置に関し、鋭意研究の結果、次のような知見を得た。
1.表示装置1の概略構成
本実施の形態に係る表示装置1の全体構成について、図1を用い説明する。
表示パネル10の構成について、図2を用い説明する。なお、本実施の形態に係る表示パネル10は、一例として、トップエミッション型の有機発光パネルを採用し、赤(R)、緑(G)、青(B)の何れか発光色を有する有機発光層を備える複数の画素部がマトリクス状に配置され構成されているが、図2では、一の画素部における一つのサブピクセル100を抜き出して描いている。
基板101は、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、又はアルミナ等の絶縁性材料をベースとして形成されている。そして、基板101には、図示を省略しているが、TFT層およびパッシベーション膜、さらには、層間絶縁膜などが積層形成されている。
アノード電極102は、導電性材料からなる単層、あるいは複数の層が積層されてなる積層体から構成されており、例えば、Al(アルミニウム)やこれを含む合金、Ag(銀)、APC(銀、パラジウム、銅の合金)、ARA(銀、ルビジウム、金の合金)、MoCr(モリブデンとクロムの合金)、NiCr(ニッケルとクロムの合金)などを用い形成されている。なお、本実施の形態のように、トップエミッション型の場合には、高反射性の材料で形成されていることが好ましい。
電極被覆層103は、例えば、ITO(酸化インジウムスズ)を用い形成されており、アノード電極102のZ軸方向上部の表面の少なくとも一部を被覆する。
ホール注入輸送層104は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)などの酸化物、あるいは、PEDOT(ポリチオフェンとポリスチレンスルホン酸との混合物)などの導電性ポリマー材料からなる層である。上記の内、酸化金属からなるホール注入輸送層104は、ホールを安定的に、またはホールの生成を補助して、有機発光層106に対しホールを注入および輸送する機能を有し、大きな仕事関数を有する。
バンク(隔壁)105は、樹脂等の有機材料で形成されており絶縁性を有する。バンク105の形成に用いる有機材料の例としては、アクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等があげられる。そして、バンク105は、有機溶剤耐性を有することが好ましい。
有機発光層106は、アノード電極102から注入されたホールと、カソード電極108から注入された電子とが再結合されることにより励起状態が生成され発光する機能を有する。有機発光層106の形成に用いる材料は、湿式印刷法を用い製膜できる発光性の有機材料を用いることが必要である。
電子注入層107は、カソード電極108から注入された電子を有機発光層106へ輸送する機能を有し、例えば、バリウム、フタロシアニン、フッ化リチウム、あるいはこれらの組み合わせで形成されることが好ましい。
カソード電極108は、例えば、ITO、IZO(酸化インジウム亜鉛)などで形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。光透過性については、透過率が80[%]以上とすることが好ましい。
封止層109は、有機発光層106などが水分に晒されたり、空気に晒されたりすることを抑制する機能を有し、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)などの材料を用い形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。
図3に示すように、本実施の形態に係る表示パネル10では、一例としてライン状のバンク105を採用している。具体的には、バンク105は、各々がY軸方向に延伸形成され、X軸方向において隣接する画素部100間を区画している。そして、サブピクセル100は、バンク105により区画された領域ごとに、発光色が異なるように形成されており、例えば、赤色(R)、緑色(G)、青色(B)の各発光色の3つのサブピクセルの組み合わせを以って、一つの画素部が構成されている。
領域ごとのバンク105の構成について、図4を用い説明する。なお、図4は、図1における表示パネル10をA-A'断面で切断し、その一部を模式化した断面端面図である。
なお、本実施の形態では、それぞれの角度θaa,θba,θbb,θcb,θcc,θdcを次のような範囲で設定することが望ましい。
[数3] 35[°]<θcb<45[°]
5.バンク105における側面部の傾斜角度θと有機発光層106の膜厚との関係
バンク105における面部の傾斜角度θと有機発光層106の膜厚との関係について、図5および図6を用い説明する。なお、図5では、一つのサブピクセルの構造を模式的に描いている。
各バンク105x,105yで区画された開口部に有機発光材料を含むインク1060x,1060yを滴下(塗布)すると、各ピンニング位置Px,Pyの高さHx,Hyが次のような関係となる。
図5(c)に示すように、インク1060xを乾燥させると、ピンニング位置Pxの高さHxが相対的に低いことに起因して、形成される有機発光層106xでは、サブピクセルの中央部分が盛り上がり、その膜厚が厚みTxとなる。
上記の関係を図6に纏めて示す。図6に示すように、バンク105の面部における傾斜角度(テーパ角)θを小さくすれば、ピンニング位置の高さHが低くなり、結果的に得られる有機発光層106の膜厚Tが厚くなる。逆に、バンク105の面部における傾斜角度(テーパ角)θを大きくすれば、ピンニング位置の高さHが高くなり、結果的に得られる有機発光層106の膜厚Tが薄くなる。
本実施の形態に係る表示パネル10の製造方法について、図9、図10および図11を用い、特徴となる部分を説明する。なお、以下で説明を省略する製造工程については、従来技術として提案されている種々の工程を採用することが可能である。
インクの塗布工程と乾燥工程との関係について、図12を用い説明する。
図4に示すように、本実施の形態に係る表示装置1の表示パネル10では、バンク105cにおけるサブピクセル100c側の面部105cbの傾斜角度θcbが、他の面部105aa,105ba,105bb,105cc,105dcの各傾斜角度θaa,θba,θbb,θcc,θdc大きく設定されている。このため、図11(a)に示すように、サブピクセル予定領域1000bにインク1060bを塗布した際に、そのピンニング位置Qcbが、他のピンニング位置Qaa,Qba,Qbbよりも高くなる。
次に、図13を用い、表示装置1の製造方法の変形例1について説明する。図13は、図9(c)から図10(a)に示す工程に対応する工程を示す。
次に、図14および図15を用い、表示装置1の製造方法の変形例2について説明する。図14および図15は、図9(c)から図10(b)に示す工程に対応する工程を示す。
上記実施の形態および変形例1,2に係る各製造方法について、具体例を以って形成後のバンク形状について検証を行った。その結果について、図16を用い説明する。
実施の形態2に係る表示装置の構成について、図17および図18を用い説明する。
図17に示すように、表示パネル30は、上記実施の形態1に係る表示パネル10と同様に、TFT基板(以下では、単に「基板」と記載する。)101上に、サブピクセル300a,300b,300cの各々に対応して、アノード電極102が形成されており、アノード電極102上に、電極被覆層103およびホール注入輸送層104が順に積層形成されている。
[数8] θ3dc>θ3aa=θ3ba=θ3bb=θ3cc
なお、本実施の形態では、それぞれの角度θ3aa,θ3ba,θ3bb,θ3cb,θ3cc,θ3dcを次のような範囲で設定することが望ましい。
[数10] 35[°]<θ3cb<45[°]
[数11] 35[°]<θ3dc<45[°]
上記[数7]、[数8]、[数9]、[数10]、[数11]の関係でバンク305a,305b,305c,305dの各々の面部305aa,305ba,305bb,305cb,305cc,305dcの傾斜角度θ3aa,θ3ba,θ3bb,θ3cb,θ3cc,θ3dcを規定するのは、隣り合う画素部と画素部との間に非画素部300d,300eを配することによるものである。これについて、インク3060a,3060b,3060cの塗布との関係を交えながら次に説明する。
表示パネル30の製造方法について、特徴となる工程を抜き出して、図18を用い説明する。なお、図18に示す工程以外の工程については、上記実施の形態1と同様である。
実施の形態3に係る表示装置の構成について、図19および図20を用い説明する。
図19に示すように、表示パネル40は、上記実施の形態1に係る表示パネル10と同様に、TFT基板(以下では、単に「基板」と記載する。)101上に、サブピクセル400a,400b,400cの各々に対応して、アノード電極102が形成されており、アノード電極102上に、電極被覆層103およびホール注入輸送層104が順に積層形成されている。
[数13] θ4dc>θ4ba=θ4bb=θ4cb=θ4cc
なお、本実施の形態では、それぞれの角度θ4aa,θ4ba,θ4bb,θ4cb,θ4cc,θ4dcを次のような範囲で設定することが望ましい。
[数15] 35[°]<θ4aa<45[°]
[数16] 35[°]<θ4dc<45[°]
上記[数12]、[数13]、[数14]、[数15]、[数16]の関係でバンク405a,405b,405c,405dの各々の面部405aa,405ba,405bb,405cb,405cc,405dcの傾斜角度θ4aa,θ4ba,θ4bb,θ4cb,θ4cc,θ4dcを規定するのは、隣り合う画素部と画素部との間に非画素部400d,400eを配することと、後述するインク4060a,4060b,4060cの塗布形態によるものである。
表示パネル40の製造方法について、特徴となる工程を抜き出して、図20を用い説明する。なお、図20に示す工程以外の工程については、上記実施の形態1と同様である。
先ず、上記実施の形態1,2,3および変形例1,2では、バンク105,105a~105d,105x,105y,305a~305e,405a~405eの各面部が平面であると模式的に示したが、バンクの面部については、必ずしも平面でなくてもよい。例えば、図21(a)に示すように、バンク605の場合には、ポイントP61からポイントP62までの間の面と、ポイントP62からポイントP63までの間の面とが、交差することになる。この場合、インク塗布時におけるピンニング位置Qy1は、ポイントP62からポイントP63までの間の面に存する。そして、ポイントP62を通る仮想直線L1を引いたときに形成される面部の傾斜角度θy2が、ピンニング位置との関係で重要となる。
10,30,40,80.表示パネル
10a1.発光中央領域
10a2.発光周辺領域
10b.ダミー領域
20.駆動制御部
21~24.駆動回路
25.制御回路
100,100a~100c,300a~300c,400a~400c.サブピクセル
101.基板
102.アノード電極
103.電極被覆層
104.ホール注入層
105,105a~105d,105x,105y,305a~305e,405a~405e,605,705,805.バンク
106,106a,106c,106x,106y.有機発光層
107.電子注入層
108.カソード電極
109.封止層
300d,300e,400d,400e.非画素部
501~505.マスク
1000a~1000c,3000a~3000c,4000a~4000c.サブピクセル予定領域
1050,1051a,1051b,1051e,1051f.バンク材料層
1060a~1060c,1060x,1060y,3060a~3060c,4060a~4060c.インク
3000d,3000e,4000d,4000e.非画素予定領域
Claims (35)
- 複数の画素部が配列されてなる有機発光パネルであって、
前記複数の画素部の各画素部は、互いに発光色が異なり、順に配列された複数の発光部を有し、
各発光部は、第1電極を含む下地層と、前記下地層に対向して設けられ、発光色ごとに対応した有機発光材料を含むインクが塗布されて形成された有機発光層と、前記有機発光層に対して前記下地層と反対側に形成された第2電極とを含み、
前記下地層の上方には、前記複数の発光部のうち隣り合う発光部を区画し、各発光部を規定する複数の隔壁が設けられ、
前記複数の画素部は、
各々に属する複数の発光部のうちの所定の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なるように構成された画素部を含む、
ことを特徴とする有機発光パネル。 - 前記所定の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なるように構成された前記画素部は、
前記複数の発光部のうちの前記所定の発光部とは異なる他の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しい、
請求項1記載の有機発光パネル。 - 前記複数の画素部の各画素部が備える前記複数の発光部には、前記配列の順において、一方側に位置する第1発光部と、中央側に位置する第2発光部と、他方側に位置する第3発光部とを少なくとも含み、
前記複数の画素部は、連続して隣り合うように形成されており、
前記複数の画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しい、
画素部を有する、
請求項1記載の有機発光パネル。 - 前記複数の画素部の各画素部が備える前記複数の発光部には、前記配列の順において、一方側に位置する第1発光部と、中央側に位置する第2発光部と、他方側に位置する第3発光部とを少なくとも含み、
前記複数の画素部の隣り合う画素部の各間には、非画素部が形成され、
前記画素部と前記非画素部との間には、画素部と非画素部を区画する隔壁が形成されており、
前記複数の画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なる、
画素部を有する、
請求項1記載の有機発光パネル。 - 前記複数の画素部の各画素部が備える前記複数の発光部には、前記配列の順において、一方側に位置する第1発光部と、中央側に位置する第2発光部と、他方側に位置する第3発光部とを少なくとも含み、
前記複数の画素部の隣り合う画素部の各間には、非画素部が形成され、
前記画素部と前記非画素部との間には、画素部と非画素部を区画する隔壁が形成されており、
前記複数の画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なる、
画素部を有する、
請求項1記載の有機発光パネル。 - 前記非画素部は、前記有機発光層を含むことなく、前記第2電極と前記第1電極と同じ材料を有し構成された第3電極とを含み、前記第2電極と前記第3電極とが電気的に接続される、
請求項4または請求項5記載の有機発光パネル。 - 前記所定の発光部に対して前記インクが塗布されるときに、前記所定の発光部に隣り合う2つの領域において、前記インクの蒸気濃度が異なっており、
前記所定の発光部を規定する2つの隔壁のうち、前記インクの蒸気濃度が低い側に位置する隔壁の前記面部の傾斜角度が、前記インクの蒸気濃度が高い側に位置する隔壁の前記面部の傾斜角度よりも大きい、
請求項1記載の有機発光パネル。 - 前記所定の発光部は、
同一画素部における隣り合う2つの発光部における、何れか一方の発光部に対して当該発光部に対応する前記インクが塗布された状態であって、且つ、前記他方の発光部に対して当該発光部に対応する前記インクが塗布される以前の状態において、当該所定の発光部に対応する前記インクが塗布されるものであり、
前記他方の発光部側に位置する隔壁の面部の傾斜角度が、前記一方の発光部側に位置する隔壁の面部の傾斜角度よりも大きい、
請求項1記載の有機発光パネル。 - 前記所定の発光部に対して前記インクが塗布されるときに、前記所定の発光部に隣り合う2つの領域において、前記インクの蒸気濃度が異なっており、
前記所定の発光部とは異なる他の発光部に対して前記インクが塗布されるときに、前記前記所定の発光部とは異なる他の発光部に隣り合う2つの領域において、前記インクの蒸気濃度が等しい、
請求項1記載の有機発光パネル。 - 前記複数の画素部の各画素部は、
同一画素部内における一方側から他方側に向け、各発光色に対応する前記インクが順番に塗布され、前記有機発光層が形成されてなる複数の発光部であって、一方側に位置し、対応するインクが第1巡目に塗布される第1発光部と、中央側に位置し,対応するインクが第2巡目に塗布される第2発光部と、他方側に位置し、対応するインクが第3巡目に塗布される第3発光部とを少なくとも有する複数の発光部を備え、
前記複数の画素部は、連続して隣り合うように形成されており、
各画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しい、
請求項1記載の有機発光パネル。 - 前記第2発光部における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度が、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きい、
請求項10記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項11記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第3発光部における、当該第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項12記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における前記第3発光部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第2発光部を規定する隣り合う2つの隔壁における前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
請求項13記載の有機発光パネル。 - 前記複数の画素部の各画素部は、
同一画素部内における一方側から他方側に向け、各発光色に対応する前記インクが順番に塗布され、前記有機発光層が形成されてなる複数の発光部であって、一方側に位置し,対応するインクが第1巡目に塗布される第1発光部と、中央側に位置し,対応するインクが第2巡目に塗布される第2発光部と、他方側に位置し,対応するインクが第3巡目に塗布される第3発光部とを少なくとも有する複数の発光部を備え、
前記複数の画素部の隣り合う画素部の各間には、非画素部が形成され、
前記画素部と前記非画素部との間には、画素部と非画素部を区画する隔壁が形成されており、
各画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なる、
請求項1記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度が、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きく、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度が、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きい、
請求項15記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度と、前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度とが等しい、
請求項16記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における、当該第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項15記載の有機発光パネル。 - 前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における、当該第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項18記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
請求項18記載の有機発光パネル。 - 前記複数の画素部の各画素部は、
同一画素部内における一方側から他方側にわたって、各発光色に対応する前記インクが同時に塗布され、前記有機発光層が形成されてなる複数の発光部であって、一方側に位置し,対応するインクが塗布される第1発光部と、中央側に位置し,対応するインクが塗布される第2発光部と、他方側に位置し,対応するインクが塗布される第3発光部とを少なくとも有する複数の発光部を備え、
前記複数の画素部の隣り合う画素部の各間には、非画素部が形成され、
前記画素部と前記非画素部との間には、画素部と非画素部を区画する隔壁が形成されており、
各画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なる、
請求項1記載の有機発光パネル。 - 前記第1発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度が、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きく、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度が、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きい、
請求項21記載の有機発光パネル。 - 前記第1発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度と、前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度とが等しい、
請求項22記載の有機発光パネル。 - 前記第1発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第2発光部を規定する隣り合う2つの隔壁における、当該第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項21記載の有機発光パネル。 - 前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第2発光部を規定する隣り合う2つの隔壁における、当該第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項24記載の有機発光パネル。 - 前記第1発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第1発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第2発光部を規定する隣り合う2つの隔壁における、当該第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
請求項25記載の有機発光パネル。 - 前記傾斜角度は、前記隔壁における前記対向する各面部と、前記隔壁が形成されている前記下地層の上面とがなす角度である、
請求項1記載の有機発光パネル。 - 前記下地層には、前記第1電極よりも下方に形成されたTFT層が含まれ、
所定の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なるように構成された前記画素部では、前記第1電極が前記TFT層に対して電気的に接続されている
請求項1記載の有機発光パネル。 - 請求項1から請求項28の何れかに記載の有機発光パネルを備えた有機表示装置。
- 複数の画素部が配列されてなる有機発光パネルの製造方法であって、
基板上に、第1電極を含む下地層を形成する第1工程と、
前記下地層の上に、感光性レジスト材料を積層する第2工程と、
前記積層した感光性レジスト材料層をマスク露光してパターニングすることにより、各画素部における複数の発光部に対応する複数の開口を形成するとともに、隣接する前記発光部を区画して各発光部を規定する複数の隔壁を形成する第3工程と、
前記複数の開口のそれぞれに対して、有機発光材料を含むインクを滴下して乾燥させ、有機発光層を形成する第4工程と、
前記有機発光層の上方に、第2電極を形成する第5工程と、
を有し、
前記第3工程では、
前記複数の画素部の少なくとも一部の画素部を、各々に属する複数の発光部のうちの所定の発光部を規定する隣り合う2つの前記隔壁における対向する面部の傾斜角度を異ならせて形成する
ことを特徴とする有機発光パネルの製造方法。 - 前記第3工程では、
前記少なくとも一部の画素部において、複数の発光部のうちの前記所定の発光部とは異なる他の発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度を等しくなるように形成する、
請求項30記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、前記所定の発光部を規定する隣り合う2つの前記隔壁における対向する面部に相当する部分への露光量を、互いに異ならせることにより、前記傾斜角度を異ならせる、
請求項30記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、前記所定の発光部を規定する隣り合う2つの前記隔壁における対向する面部に相当する部分への光の透過率が互いに異なるマスクを用いることにより、前記傾斜角度を異ならせる、
請求項30記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記所定の発光部を規定する隣り合う2つの前記隔壁における対向する面部に相当する部分に関し、前記感光性レジスト材料を露光して現像した後、前記対向する面部のいずれか一方に相当する部分に対し、露光処理を追加して行うことにより、前記傾斜角度を異ならせる、
請求項30記載の有機発光パネルの製造方法。 - 請求項30から請求項34の何れかに記載の製造方法により得られた有機発光パネルを備えた有機表示装置。
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KR102555828B1 (ko) | 2018-12-17 | 2023-07-13 | 엘지디스플레이 주식회사 | 고 해상도 마이크로 led 표시 장치 및 그 제조 방법 |
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US20130105782A1 (en) | 2013-05-02 |
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CN102960066A (zh) | 2013-03-06 |
US8907358B2 (en) | 2014-12-09 |
JP5735527B2 (ja) | 2015-06-17 |
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