WO2012039331A1 - Moule de formage de verre, dispositif de formage de verre, procédé de formage de verre, et procédé pour fabriquer un substrat de photomasque - Google Patents

Moule de formage de verre, dispositif de formage de verre, procédé de formage de verre, et procédé pour fabriquer un substrat de photomasque Download PDF

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Publication number
WO2012039331A1
WO2012039331A1 PCT/JP2011/070961 JP2011070961W WO2012039331A1 WO 2012039331 A1 WO2012039331 A1 WO 2012039331A1 JP 2011070961 W JP2011070961 W JP 2011070961W WO 2012039331 A1 WO2012039331 A1 WO 2012039331A1
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WO
WIPO (PCT)
Prior art keywords
glass
mold
side plate
ingot
base plate
Prior art date
Application number
PCT/JP2011/070961
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English (en)
Japanese (ja)
Inventor
史康 中野
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2012535009A priority Critical patent/JP5812005B2/ja
Priority to KR1020137002687A priority patent/KR101865977B1/ko
Priority to CN201180032870.1A priority patent/CN102958854B/zh
Publication of WO2012039331A1 publication Critical patent/WO2012039331A1/fr

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06Construction of plunger or mould
    • C03B11/08Construction of plunger or mould for making solid articles, e.g. lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B20/00Processes specially adapted for the production of quartz or fused silica articles, not otherwise provided for
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2201/00Type of glass produced
    • C03B2201/02Pure silica glass, e.g. pure fused quartz
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/02Press-mould materials
    • C03B2215/05Press-mould die materials
    • C03B2215/07Ceramic or cermets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/72Barrel presses or equivalent, e.g. of the ring mould type

Definitions

  • the present invention relates to a molding die for glass molding, a glass molding apparatus, a glass molding method, and a photomask substrate manufacturing method.
  • This application claims priority based on Japanese Patent Application No. 2010-210686 for which it applied on September 21, 2010, and uses the content here.
  • the glass lump is pressure-formed at a high temperature using a mold, and then the glass lump is cooled and then taken out of the furnace. It is. During this cooling, a difference in shrinkage due to a temperature drop occurs between the glass and the mold. That is, when a mold having a larger linear expansion coefficient than that of the glass to be molded is used, when the glass and the mold are shrunk during cooling, the outer mold is more than the inner glass due to the difference in linear expansion coefficient. The amount of shrinkage becomes larger. As a result, excessive stress is applied, causing a phenomenon that the mold is damaged or the glass is damaged.
  • aspects according to the present invention provide a mold, a glass molding apparatus, a glass molding method, and a method for manufacturing a photomask substrate that can avoid breakage of glass and a mold body and can mold glass into a desired shape. With the goal.
  • a first aspect of the present invention is a mold main body used for glass heating and pressing, A support member that is arranged so as to be able to contact a movable member in the mold body and is breakable to release stress based on a difference in linear expansion coefficient between the mold body and the glass. It is characterized by being a mold.
  • the second aspect of the present invention has a hollow portion that accommodates the glass ingot, and the hollow portion can be moved up and down inside the base plate, the side plate disposed thereon, and the side plates.
  • a glass molding die configured to be surrounded by a top plate, wherein the base plate is provided with a support member so as to come into contact with the outside of the side plate, The base plate is formed so as to be relatively movable in the outer direction, and is supported by the support member from the outside of the side plate. The support member heats the glass ingot accommodated in the hollow portion.
  • the glass ingot When the glass ingot is deformed by pressure, it has a strength that does not break with a shearing force generated by a load applied from the glass ingot via the side plate, and when the glass ingot deformed by heating and pressing is cooled, the molding is performed.
  • a third aspect of the present invention is characterized in that a glass forming apparatus having the above-described forming mold for glass forming, a heating means and a pressurizing means for the glass ingot is provided.
  • a glass forming method using the glass forming apparatus described above wherein a glass ingot is accommodated in a forming die, and the glass ingot is heated and pressurized by a heating means and a pressing means.
  • the side plate is moved outwardly with respect to the base plate due to a load applied due to a difference in linear expansion coefficient between the mold and the glass ingot.
  • the glass molding method is characterized in that the glass member is moved relative to each other so that a shearing force acts on the supporting member, and the supporting member is broken in accordance with the shearing force.
  • the fifth aspect of the present invention is characterized in that it is a method for producing a photomask substrate having a step of obtaining a glass molded body by using the glass molding method described above.
  • the mold of the aspect of the present invention it is possible to avoid breakage of the glass and the mold body, and to mold the glass into a desired shape.
  • FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is sectional drawing which shows the state which deform
  • FIG. 1 is a cross-sectional view showing a glass forming apparatus according to the present embodiment.
  • FIG. 2 is a plan view showing a glass forming mold in the glass forming apparatus of FIG. 3 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 4 is a cross-sectional view showing a state where the glass ingot is deformed in the glass forming mold of FIG.
  • FIG. 5 is a cross-sectional view showing a state in which a pin is broken in the glass forming mold of FIG. 6 to 9 are perspective views showing other examples of a molding die for glass molding.
  • the glass forming apparatus 1 of the present embodiment forms a photomask substrate such as a semiconductor mask, a liquid crystal mask, an optical large lens material, or the like into a desired shape from a synthetic quartz glass ingot manufactured using a silicon compound as a raw material. It is an apparatus for heat forming.
  • the glass forming apparatus 1 includes a heat insulating material 3 provided over the entire inner wall of a metal vacuum chamber 2, and a carbon heater (heating means) provided on the wall of the heat insulating material 3. ) 5.
  • a glass graphite mold 10 (hereinafter referred to as a mold 10) made of carbon graphite is installed in the center of the vacuum chamber 2, and a cylinder (pressurizing means) 4 is provided on the upper part thereof. ing.
  • the forming die 10 is disposed on the pedestal 6 inside the vacuum chamber 2 of the glass forming apparatus 1 and has a bottom portion including a base plate 14 and a bottom plate 17 as shown in FIGS.
  • the mold 10 (mold body) including the base plate 14 and the bottom plate 17 is made of carbon graphite as described above, and is made of a material having a larger linear expansion coefficient than the glass ingot 20A.
  • the linear expansion coefficient of synthetic quartz glass is about 5 ⁇ 10 ⁇ 7 / ° C.
  • the linear expansion coefficient of carbon graphite is about 2 to 5 ⁇ 10 ⁇ 6 / ° C.
  • molding die 10 (mold main body) has the hollow part 19 which accommodates glass ingot 20A,
  • the said hollow part 19 is the baseplate 14 and the baseplate 17, and the side plate 11 arrange
  • the inner sides of the side plates 11 are surrounded by a top plate 13 that can move up and down.
  • the mold 10 (mold body) is provided with a side plate 11 (movable member) formed to be movable relative to the base plate 14.
  • This side plate 11 and the side plate guide 12 fixed with bolts or the like limit the freedom (movement) of the top plate 13 that directly presses the glass ingot 20A to be formed in the vertical direction.
  • a rail 18 is provided on the base plate 14, and the side plate 11 is on the rail 18.
  • the side plate 11 is movable with respect to the base plate 14 in the direction of the rail 18 (that is, the outer direction of the side plate 11).
  • a pin (support member) 15 is disposed so as to contact the side plate 11.
  • the pin 15 supports and restrains the side plate 11 from the outside.
  • a plurality of insertion holes 16 are formed in the base plate 14 along positions that contact the outside of the side plate 11.
  • the pin 15 can be inserted into and removed from the plurality of insertion holes 16.
  • a plurality of pins 15 are arranged for each of the four side plates 11 in the mold 10 arranged in a substantially square shape in plan view.
  • two pins 15 are arranged on each side plate 11.
  • a plurality of pins 15 of the same type may be arranged.
  • the pins 15 may be arranged by combining different materials, shapes, and diameters according to the required strength and the like.
  • the plurality of insertion holes 16 are configured such that all of the insertion holes 16 can correspond to different shapes and diameters (for example, the diameter of the holes is gradually reduced from the surface side). Also good. Or the some insertion hole 16 may be comprised so that the shape and diameter which can be inserted mutually differ.
  • the number of pins 15 to be arranged may be changed for each side plate 11 (that is, the number of pins 15 may be different between one side plate 11 and another side plate 11). .
  • the pin 15 When the glass ingot 20A accommodated in the hollow portion 19 is deformed by heating and pressing, the pin 15 has a strength that does not break due to a shearing force generated by a load applied from the glass ingot 20A through the side plate 11, and is heated.
  • the glass ingot 20B deformed by pressing is cooled, the glass ingot 20B has a strength to break due to a shearing force generated by a load applied due to the difference between the linear expansion coefficient of the mold 10 and the linear expansion coefficient of the glass ingot 20A. is doing.
  • the linear expansion coefficients of the members constituting the mold 10 are all equal. In this case, since the lateral width of the base plate 14 is the largest, the magnitude of the shear force generated during cooling is substantially determined by the difference in the linear expansion coefficient between the base plate 14 and the glass ingot 20A.
  • the pin 15 has a strength that can withstand the pressure acting on the side plate 11 from the deformed glass ingot 20A when the glass ingot 20A accommodated in the hollow portion 19 is deformed by heating and pressing. is doing.
  • the base plate 14 of the mold 10 made of carbon graphite has a larger linear expansion coefficient than the glass ingot 20B. 14 is larger.
  • a load is generated in which the glass ingot 20B having a small shrinkage amount pushes the side plate 11 disposed on the base plate 14 having a large shrinkage amount toward the outside.
  • the pin 15 has such strength that it can be broken by a shearing force generated by the load applied at this time.
  • a load is applied due to the difference in linear expansion coefficient between the glass ingot 20B and the base plate 14 of the mold 10 when the glass ingot 20B is cooled, and the pin 15 is bent by a shearing force generated by the load. As a result, the glass and the mold 10 can be prevented from being damaged.
  • the cylinder (pressurizing means) 4 for directly pressing the top plate 13 is installed on the upper portion of the glass forming apparatus 1.
  • the glass ingot 20 ⁇ / b> A is pressed and molded to an arbitrary thickness.
  • a base plate 14, a bottom plate 17, a side plate 11, and a side plate guide 12 are arranged in combination on the base 6 inside the vacuum chamber 2 in the glass forming apparatus 1. Further, predetermined pins 15 (here, two pins 15 are arranged for each side plate 11) are inserted into insertion holes 16 formed in the base plate 14. Thereby, the shaping
  • the inside of the vacuum chamber 2 is filled with an inert gas. Further, the glass ingot 20 ⁇ / b> A in the hollow portion 19 of the mold 10 is heated by the carbon heater 5, and the temperature is raised to the softening point or higher from the crystallization temperature. At this time, the inside of the glass ingot 20A may be held at a constant temperature until the temperature reaches a uniform temperature.
  • the cylinder 4 When the predetermined temperature is reached, the cylinder 4 is operated to move the top plate 13 downward, and the glass ingot 20A is pressure-molded. In addition, at the time of starting the pressure molding, the mold 10 exhibits expansion according to the environmental temperature. Further, as the pressurization process of the glass ingot 20A progresses, the glass ingot 20A gradually becomes a flat shape and is in close contact with the side plate 11 without any gap.
  • the pressing force of the top plate 13 acts on the side plate 11 as a stress in the outer peripheral direction (outward direction) via the glass ingot 20A.
  • the side plate 11 is difficult to move because the freedom to move outward is restricted by the pins 15.
  • the stress generated by the glass molding is transmitted to the pin 15 through the glass ingot 20 ⁇ / b> A and the side plate 11.
  • the side plate 11 is moved in the outer circumferential direction in which the glass ingot 20A flows due to the force received from the glass ingot 20A at the same time as the restraint is released.
  • the glass ingot 20 ⁇ / b> A flows out of the area surrounded by the side plate 11, and a shape following the inner side surface of the side plate 11 cannot be obtained.
  • the pin 15 needs to be strong enough to withstand the stress generated by the molding of the glass, and is configured to have this.
  • the glass ingot 20 ⁇ / b> A is pressed to the state in close contact with the bottom plate 17, the top plate 13, and the side plate 11 of the mold 10 by the above-described heat and pressure molding, Then, a cooling process is performed. With this cooling, the mold 10 and the glass ingot 20B show shrinkage according to the ambient temperature.
  • the mold 10 has a larger linear expansion coefficient than the glass ingot 20B.
  • the base plate 14 of the mold 10 is larger in the lateral direction than the side plate 11. Therefore, the contraction amount of the base plate 14 becomes relatively large with respect to the side plate 11, and the contraction accompanying cooling becomes remarkable. Accordingly, when viewed relatively, a load is generated in the direction in which the glass ingot 20B expands as it cools, that is, in the direction in which the side plate 11 is pushed outward (outward).
  • the load received by the side plate 11 is transmitted to the pins 15 installed outside the side plate 11.
  • the pin 15 is broken toward the outside as shown in FIG.
  • the side plate 11 is released from the restraint, and at the same time, the side plate 11 moves in the outer circumferential direction (outward direction) in which the glass ingot 20B flows to release the stress.
  • the glass ingot 20B since the glass ingot 20B has already been solidified by cooling, it does not flow out of the area surrounded by the side plates 11. Then, it cools to about room temperature and takes out the shaping
  • the pin (support) that is broken by the stress generated by cooling after molding.
  • a pin 15 (pin-like member, rod-like member) is used as a support member, and the pin 15 can be inserted into and removed from a plurality of insertion holes 16 formed in the base plate 14. Therefore, the strength can be easily changed by changing the number and types of pins 15 to be arranged. For example, in the present embodiment, two pins 15 of the same type are arranged on each side plate. If the number of pins to be arranged is increased, the strength as a whole pin can be increased (in contrast, if the number of pins to be arranged is reduced, the strength as a whole pin can be lowered).
  • the pins when placing multiple pins, use only one with a large diameter, use only a plurality with a small diameter, or use a mixture of one with a large diameter and one with a small diameter.
  • the strength can be changed by mixing a plurality of types with different shapes.
  • positioning a some pin you may arrange
  • the pin 15 that can be inserted into and removed from the insertion hole 16 formed in the base plate 14 is used as the support member. Therefore, the processing after the pin 15 is broken can be simplified. For example, it is only necessary to remove the broken pin 15 from the insertion hole 16 and reinsert the new pin 15 into the insertion hole 16 after the glass is formed. Therefore, the manufacturing efficiency of glass and a photomask substrate can be improved.
  • the load applied to the side plate and the shear force generated on the pin are obtained in advance by dynamic simulation, and the shear force generated by the load during cooling does not break with the shear force generated by the load during molding.
  • the strength of the pin can be determined so as to break with force. If the strength required for the pin is determined in this way, a pin having the required strength can be selected from various pins whose strength has been measured in advance.
  • quartz glass is taken as an example of the glass to be molded and carbon (carbon graphite) is taken as an example of the material of the mold, but the present invention is not limited to this.
  • carbon carbon graphite
  • the material of the mold may be another material that can be used at a high temperature such as alumina (aluminum oxide).
  • the material of the glass and the mold it may be determined in consideration of the glass composition and molding conditions.
  • the linear expansion coefficient of the glass is relatively smaller than the linear expansion coefficient of the material of the mold (particularly the base plate) (conditions in which the support member breaks and the function of the mold of the present invention is exhibited). If it is a combination, the effect of the present embodiment can be obtained.
  • carbon is often preferable because carbon is superior in strength and thermal shock resistance to alumina.
  • carbon graphite is used as the material of the pin 15.
  • a material other than carbon graphite may be used.
  • a material that can be used at a high temperature such as alumina (aluminum oxide) may be used.
  • the pin 15 pin-like member, rod-like member
  • a member other than the pin 15 may be used as long as the member has a necessary strength and can be broken by a predetermined load.
  • the support member other than the pin 15 for example, a plurality of insertion members 115b that can be inserted into and removed from the insertion holes 116 formed in the base plate 114 are formed below the long plate member 115a as shown in FIG. The long plate-like member 115 with an insertion member is mentioned.
  • the long plate-like member 115a contacting the side plate 111 is pressed in the outer peripheral direction (outward) during cooling, so that the long plate-like member 115a is inserted.
  • the portion between the members 115b can be broken.
  • a groove 216 is formed at a position along the side plate 211 in the base plate 214 instead of the insertion hole 16, and a thin plate member 215 that can be inserted into and removed from the groove 216 is used as a support member.
  • a part (contact portion) of the thin plate member 215 is in contact with the side plate 211, and this is pressed in the outer peripheral direction (outward direction) during cooling.
  • another part (insertion portion) of the thin plate member 215 is inserted into the groove 216 and substantially fixed. As a result, the portion between the contact portion and the insertion portion of the thin plate member 215 can be broken.
  • a substantially L-shaped member 315 is a support member.
  • the L-shaped bottom portion 315b of the substantially L-shaped member 315 is fixed to the base plate 314 with its longitudinal direction as the outer peripheral direction (outward direction).
  • a recess 316 for fixing the bottom portion 315b is formed in the base plate 314.
  • the side plate 311 is in contact with the L-shaped upper portion 315a.
  • the substantially L-shaped member 315 is inserted into a recess 316 provided in the base plate 314 and substantially fixed to the base plate 314, and one end of the base portion 315b is used as a base.
  • An upper portion 315a extending in a direction orthogonal to the extending direction of the bottom portion 315b, and one surface of the upper portion 315a is in contact with the side plate 311.
  • the side plate 311 presses the upper portion 315a of the substantially L-shaped member 315 during cooling, so that the space between the L-shaped upper portion 315a and the bottom portion 315b is reduced. The part can be broken.
  • a substantially L-shaped long plate-like member 415 is used as a support member, and an L-shaped bottom portion 415 b of the substantially L-shaped rod-like member 415 is fixed to the base plate 414.
  • a recess 416 for fixing the bottom portion 415b is formed in the base plate 414.
  • the side plate 411 is in contact with the upper portion 415a of the L shape.
  • the substantially L-shaped long plate-like member 415 has a bottom portion 415 b that is inserted into a recess 416 provided in the base plate 414 and substantially fixed to the base plate 414.
  • the bottom side portion 415 b has a long side extending along the side plate 411.
  • the substantially L-shaped long plate-like member 415 has an upper portion 415 a extending with one long side of the bottom portion 415 b as a base, and one surface of the upper portion 415 a is in contact with the side plate 411.
  • the angle between the bottom portion 415b and the upper portion 415a is, for example, 90 °.
  • the present invention is not limited to this.
  • the molding temperature may be equal to or higher than the crystallization temperature of the glass ingot 20A.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Glass Melting And Manufacturing (AREA)

Abstract

La présente invention concerne un moule de formage de verre qui comprend : un corps de moule (10) utilisé pour former du verre par chauffage et pressurisation du verre ; et un élément de support (15) disposé de sorte que l'élément de support (15) puisse entrer en contact avec le composant mobile (11) du corps de moule et pouvant être rompu afin de libérer la contrainte causée par la différence de coefficient de dilatation linéaire entre le corps de moule et le verre.
PCT/JP2011/070961 2010-09-21 2011-09-14 Moule de formage de verre, dispositif de formage de verre, procédé de formage de verre, et procédé pour fabriquer un substrat de photomasque WO2012039331A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012535009A JP5812005B2 (ja) 2010-09-21 2011-09-14 ガラス成形用の成形型、ガラス成形装置、ガラス成形方法及びフォトマスク基板の製造方法
KR1020137002687A KR101865977B1 (ko) 2010-09-21 2011-09-14 유리 성형용 성형형, 유리 성형 장치, 유리 성형 방법 및 포토마스크 기판의 제조 방법
CN201180032870.1A CN102958854B (zh) 2010-09-21 2011-09-14 玻璃成形用的成形模具、玻璃成形装置、玻璃成形方法及光罩基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010210686 2010-09-21
JP2010-210686 2010-09-21

Publications (1)

Publication Number Publication Date
WO2012039331A1 true WO2012039331A1 (fr) 2012-03-29

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PCT/JP2011/070961 WO2012039331A1 (fr) 2010-09-21 2011-09-14 Moule de formage de verre, dispositif de formage de verre, procédé de formage de verre, et procédé pour fabriquer un substrat de photomasque

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JP (1) JP5812005B2 (fr)
KR (1) KR101865977B1 (fr)
CN (1) CN102958854B (fr)
TW (1) TWI498289B (fr)
WO (1) WO2012039331A1 (fr)

Cited By (3)

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JP2012250867A (ja) * 2011-06-01 2012-12-20 Asahi Glass Co Ltd 石英ガラスの成形方法
US9027365B2 (en) 2013-01-08 2015-05-12 Heraeus Quartz America Llc System and method for forming fused quartz glass
JP2016153878A (ja) * 2015-02-12 2016-08-25 パナソニックIpマネジメント株式会社 光源装置および投写型表示装置

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KR101804394B1 (ko) * 2017-01-09 2017-12-04 한동희 유리 성형 장치
CN109020165B (zh) * 2018-08-01 2021-09-10 浙江千玉装饰科技股份有限公司 一种琉璃的生产工艺
JP7294887B2 (ja) * 2019-05-30 2023-06-20 矢崎エナジーシステム株式会社 板ガラスの製造方法
CN112208119A (zh) * 2020-08-14 2021-01-12 中国人民解放军总参谋部第六十研究所 一种直升机桨叶热变形自适应成型模具及使用方法

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KR101146551B1 (ko) * 2004-07-02 2012-05-25 가부시키가이샤 니콘 석영 유리의 성형 방법
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JPH08208250A (ja) * 1994-10-27 1996-08-13 Shinetsu Quartz Prod Co Ltd 石英ガラス成形品を製造するためのモールド
JP2002053332A (ja) * 2000-08-10 2002-02-19 Nikon Corp 合成石英ガラスの成形方法及び合成石英ガラス成形装置
JP2006001821A (ja) * 2004-06-21 2006-01-05 Nikon Corp 石英ガラスの成形装置および成形方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012250867A (ja) * 2011-06-01 2012-12-20 Asahi Glass Co Ltd 石英ガラスの成形方法
US9027365B2 (en) 2013-01-08 2015-05-12 Heraeus Quartz America Llc System and method for forming fused quartz glass
JP2016153878A (ja) * 2015-02-12 2016-08-25 パナソニックIpマネジメント株式会社 光源装置および投写型表示装置

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KR20130112029A (ko) 2013-10-11
KR101865977B1 (ko) 2018-06-08
TW201217279A (en) 2012-05-01
JP5812005B2 (ja) 2015-11-11
JPWO2012039331A1 (ja) 2014-02-03
TWI498289B (zh) 2015-09-01
CN102958854A (zh) 2013-03-06
CN102958854B (zh) 2015-03-25

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