WO2012019530A1 - Touch panel with intermediate conductive layer and method for manufacturing same - Google Patents

Touch panel with intermediate conductive layer and method for manufacturing same Download PDF

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Publication number
WO2012019530A1
WO2012019530A1 PCT/CN2011/078112 CN2011078112W WO2012019530A1 WO 2012019530 A1 WO2012019530 A1 WO 2012019530A1 CN 2011078112 W CN2011078112 W CN 2011078112W WO 2012019530 A1 WO2012019530 A1 WO 2012019530A1
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layer
conductive layer
intermediate conductive
touch panel
micrometers
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PCT/CN2011/078112
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French (fr)
Chinese (zh)
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陈栋南
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牧东光电（苏州）有限公司
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Publication of WO2012019530A1 publication Critical patent/WO2012019530A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the invention relates to a touch panel with an intermediate conductive layer and a manufacturing method thereof, belonging to a touch panel composite layer Structure and process technology field.
  • the processing method of the touch panel is to adopt a layer-by-layer bonding process, which is easy to cause inaccurate alignment, and increases the thickness and weight of the touch panel, and reduces the transmittance and touch sensitivity of the touch product. Degree, product quality is difficult to get much improved.
  • a large amount of etching waste liquid is required to be etched away due to the formation of a corresponding sensing line pattern, which causes serious environmental pollution; and the color difference of the touch panel is large, and the etching trace is obvious.
  • the photoresist process has also been applied in the precision process of touch panels.
  • a photoresist process By using a photoresist process, different depth layers of the touch panel can be photoresist etched to obtain a corresponding pattern. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity.
  • the invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
  • the invention fully utilizes the photoresist etching technology to realize precision processing on different depth layers of the touch panel, and adding an intermediate conductive layer on the transparent conductive layer serves to protect the conductive material and also improves the adhesion of the conductive material.
  • a grid pattern non-conductive region is introduced to eliminate the etching trace, and the etching waste liquid is reduced to be environmentally friendly.
  • the present invention discloses a touch panel having an intermediate conductive layer, wherein the first layer is a nameplate layer, the second layer is a metal circuit layer, the third layer is an intermediate conductive layer, and the fourth layer is a transparent conductive layer.
  • the fifth layer is a substrate layer which is sequentially stacked.
  • the thickness of the nameplate layer ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer or the transparent conductive layer ranges from 0.04 micrometers to 0.1 millimeters. Between microns; the thickness of the substrate layer ranges from 50 microns to 180 microns.
  • the intermediate conductive layer is indium oxide; the metal wiring layer is copper wire; the transparent conductive layer is indium tin oxide; and the substrate layer is hardened glass or polycarbonate resin.
  • the method for fabricating a touch panel having an intermediate conductive layer of the present invention comprises the following steps: performing under dust-free drying conditions;
  • Step 1 one side of the substrate layer covers the transparent conductive layer, and the intermediate conductive layer is covered on the transparent conductive layer;
  • Step 2 plating a metal circuit layer on the intermediate conductive layer, and sticking a photoresist film on the metal circuit layer; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal trace, the sensing line and the grid-shaped etching line;
  • Step 3 first exposing and developing the operating area of the surface of the metal circuit layer, and etching the intermediate conductive layer and the transparent conductive layer with a mixed line of sulfuric acid hydrogen peroxide at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 forming a metal trace on the periphery of the metal circuit layer in the third step
  • Step 5 Lay the nameplate layer on the metal trace and the transparent conductive layer in step three with a transparent optical adhesive.
  • the molar concentration range of the sulfuric acid hydrogen peroxide mixture is between 4.0 MOL/L and 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 2, the thickness of the photoresist film ranges from 15 ⁇ m to 20 ⁇ m; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns.
  • the etching reaction time is from 30 seconds to 60 seconds.
  • the photoresist is used to remove the residual photoresist film to improve the appearance quality of the product.
  • the invention discloses a touch panel with an intermediate conductive layer and a manufacturing method thereof.
  • photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and an intermediate conductive layer is added to protect the conductive material.
  • the role also increases the adhesion of the conductive material. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch product, and improving the transmittance and the touch sensitivity.
  • the invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
  • FIG. 1 is a schematic view showing the structure of a cross-sectional structure of a touch panel having an intermediate conductive layer of the present invention. Among them are: nameplate layer 1, metal circuit layer 2, intermediate conductive layer 3, transparent conductive layer 4, and substrate layer 5.
  • Figure 2 is a schematic block diagram of a partial structure pattern of the present invention.
  • Figure 3 is a schematic block diagram of the production flow of the present invention.
  • FIG. 4 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.
  • the touch panel with an intermediate conductive layer of the present invention comprises a first layer which is a nameplate layer 1, a second layer which is a metal wiring layer 2, a third layer which is an intermediate conductive layer 3, and a fourth layer which is transparent.
  • the conductive layer 4 and the fifth layer are the substrate layers 5, which are sequentially stacked.
  • the thickness of the nameplate layer 1 ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer 2 ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer 3 or the transparent conductive layer 4 ranges from 0.04 micrometers. Between 0.1 microns; the thickness of the substrate layer 5 ranges from 50 microns to 180 microns.
  • the intermediate conductive layer 3 is indium oxide; the metal wiring layer 2 is copper wire; the transparent conductive layer 4 is indium tin oxide; and the substrate layer 5 is hardened glass or polycarbonate resin.
  • FIG. 3 shows a method of fabricating a touch panel having an intermediate conductive layer, and each step is performed under dust-free drying conditions
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces, the sensing lines and the grid-shaped etch lines ;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration range of the mixture of sulfuric acid and hydrogen peroxide in the above step 3 is between 4.0 MOL/L and 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 2, the thickness of the photoresist film ranges from 15 ⁇ m to 20 ⁇ m; in step 5, transparent optics
  • the thickness of the glue ranges from 50 microns to 100 microns.
  • the etching reaction time is 30 seconds to 60 seconds.
  • the thickness of the nameplate layer 1 is 0.7 mm; the thickness of the metal wiring layer 2 is 0.04 ⁇ m; the thickness of the intermediate conductive layer 3 is 0.04 ⁇ m, the thickness of the transparent conductive layer 4 is 0.04 ⁇ m; the thickness of the substrate layer 5 is 50 ⁇ m, the substrate Layer 5 is a polycarbonate resin.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.0 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; and in step two, the thickness of the photoresist film is 15 ⁇ m. Among them, the etching reaction time was 30 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 50 microns.
  • the thickness of the nameplate layer 1 is 1.8 mm; the thickness of the metal wiring layer 2 is 0.07 ⁇ m; the thickness of the intermediate conductive layer 3 is 0.08 ⁇ m, the thickness of the transparent conductive layer 4 is 0.08 ⁇ m; the thickness of the substrate layer 5 is 180 ⁇ m, the substrate Layer 5 is a hardened glass.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; and in step 2, the thickness of the photoresist film is 20 ⁇ m. Among them, the etching reaction time was 60 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 100 micrometers.
  • the thickness of the nameplate layer 1 is 1.1 mm; the thickness of the metal wiring layer 2 is 0.1 micrometer; the thickness of the intermediate conductive layer 3 is 0.1 micrometer, the thickness of the transparent conductive layer 4 is 0.1 micrometer; the thickness of the substrate layer 5 is 125 micrometers, the substrate Layer 5 is a polycarbonate resin.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.2 MOL/L.
  • the grid pattern is a square matrix; wherein, the single square etching side length is 0.35 mm, and the etching line width is 60 micrometers; in the second step, the thickness of the photoresist film is 18 micrometers. Among them, the etching reaction time was 45 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 75 microns.

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Abstract

Disclosed in the present invention are a touch panel with an intermediate conductive layer and a method for manufacturing the same, which belong to the technical field of touch panel composite layer structure and the manufacturing processes therefor. In the present invention, nonconductive regions in a grid pattern are introduced while etching an induction layer, so as to reduce etching traces and decrease etching waste liquid, which is beneficial for environmental protection. During the processing of the touch panel, full use is made of photoresist etching technology to achieve precise processing of the touch panel at different depth levels, and an intermediate conductive layer is added therein which serves to protect conductive materials, and also to enhance the adhesion of the conductive materials.

Description

具有中间导电层的触控面板 及其 制作 方法 Touch panel with intermediate conductive layer and manufacturing method thereof 技术领域Technical field
本发明 涉及一种具有中间导电层的触控面板 及其 制作 方法 ，属于触控面板 复合层 结构及其制程技术领域。  The invention relates to a touch panel with an intermediate conductive layer and a manufacturing method thereof, belonging to a touch panel composite layer Structure and process technology field.
背景技术Background technique
一般来说，触控面板的加工方式是采取逐层贴合的工序，容易造成贴合对位不精确，而且增加触控面板的厚度和重量，降低触控产品的透光度及触控敏感度，产品品质很难得到很大提升。加工感应层时，因为成形相应的感应线图案需要蚀刻掉大量透明导电材料，造成大量的蚀刻废液，环境污染严重；而且触控面板的色差大，蚀刻痕迹明显。In general, the processing method of the touch panel is to adopt a layer-by-layer bonding process, which is easy to cause inaccurate alignment, and increases the thickness and weight of the touch panel, and reduces the transmittance and touch sensitivity of the touch product. Degree, product quality is difficult to get much improved. When processing the sensing layer, a large amount of etching waste liquid is required to be etched away due to the formation of a corresponding sensing line pattern, which causes serious environmental pollution; and the color difference of the touch panel is large, and the etching trace is obvious.
随着光阻工艺技术的不断发展，使得光阻工艺在触控面板精密制程中也得到了应用。通过采用光阻工艺可以对触控面板的不同深度层面进行光阻蚀刻得到相应的图案。因此，电镀工艺与光阻工艺的有机结合可以省去复杂的贴合工序来加工触控面板，从而有效降低触控面板的厚度重量，提高透光度和触控敏感度。本发明在对感应层蚀刻中引入网格图案非导电区域来降低蚀刻痕迹，减少蚀刻废液利于环保。With the continuous development of photoresist technology, the photoresist process has also been applied in the precision process of touch panels. By using a photoresist process, different depth layers of the touch panel can be photoresist etched to obtain a corresponding pattern. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity. The invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
技术问题technical problem
本发明充分利用光阻蚀刻技术对触控面板实现不同深度层面精密加工，并且在透明导电层上加入中介导电层起到保护导电材料的作用，也提高导电材料的附着力。在对感应层蚀刻中引入网格图案非导电区域来消除蚀刻痕迹，减少蚀刻废液利于环保。The invention fully utilizes the photoresist etching technology to realize precision processing on different depth layers of the touch panel, and adding an intermediate conductive layer on the transparent conductive layer serves to protect the conductive material and also improves the adhesion of the conductive material. In the etching of the sensing layer, a grid pattern non-conductive region is introduced to eliminate the etching trace, and the etching waste liquid is reduced to be environmentally friendly.
技术解决方案Technical solution
技术方案：本发明公开一种具有中间导电层的触控面板，包含第一层是铭板层，第二层是金属线路层，第三层是中间导电层，第四层是透明导电层，第五层是基板层，依次叠加。所述铭板层的厚度范围值在0.7毫米到1.8毫米之间；金属线路层的厚度范围值在0.04微米到0.1微米之间；中间导电层或者透明导电层的厚度范围值在0.04微米到0.1微米之间；基板层的厚度范围值在50微米到180微米之间。中间导电层是氧化铟；金属线路层是铜线；透明导电层是氧化铟锡；基板层是硬化玻璃或者聚碳酸树脂。Technical Solution: The present invention discloses a touch panel having an intermediate conductive layer, wherein the first layer is a nameplate layer, the second layer is a metal circuit layer, the third layer is an intermediate conductive layer, and the fourth layer is a transparent conductive layer. The fifth layer is a substrate layer which is sequentially stacked. The thickness of the nameplate layer ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer or the transparent conductive layer ranges from 0.04 micrometers to 0.1 millimeters. Between microns; the thickness of the substrate layer ranges from 50 microns to 180 microns. The intermediate conductive layer is indium oxide; the metal wiring layer is copper wire; the transparent conductive layer is indium tin oxide; and the substrate layer is hardened glass or polycarbonate resin.
本发明的制作具有中间导电层的触控面板的方法，包括如下步骤在无尘干燥条件下进行；The method for fabricating a touch panel having an intermediate conductive layer of the present invention comprises the following steps: performing under dust-free drying conditions;
步骤一：基板层的一面覆盖透明导电层，在透明导电层上覆盖中间导电层；Step 1: one side of the substrate layer covers the transparent conductive layer, and the intermediate conductive layer is covered on the transparent conductive layer;
步骤二：中间导电层上电镀金属线路层，在金属线路层上贴光阻膜；其中，光阻膜上的镂空图案分别与金属走线痕迹、感应线和网格状蚀刻线痕迹吻合；Step 2: plating a metal circuit layer on the intermediate conductive layer, and sticking a photoresist film on the metal circuit layer; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal trace, the sensing line and the grid-shaped etching line;
步骤三：先对金属线路层表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液线路蚀刻中间导电层和透明导电层，形成感应线和网格图案非导电区域；Step 3: first exposing and developing the operating area of the surface of the metal circuit layer, and etching the intermediate conductive layer and the transparent conductive layer with a mixed line of sulfuric acid hydrogen peroxide at room temperature to form a non-conductive region of the sensing line and the grid pattern;
步骤四：对步骤三中金属线路层周边曝光显影蚀刻形成金属走线；Step 4: forming a metal trace on the periphery of the metal circuit layer in the third step;
步骤五：用透明光学胶将铭板层贴合在金属走线和步骤三中透明导电层上。Step 5: Lay the nameplate layer on the metal trace and the transparent conductive layer in step three with a transparent optical adhesive.
在步骤三中硫酸双氧水混合液的摩尔浓度范围值在4.0MOL/L到4.5MOL/L之间。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度范围值在15微米到20微米之间；步骤五中透明光学胶的厚度范围值在50微米到100微米之间。蚀刻反应时间为30秒钟到60秒钟。最后各线路图案成形后用光阻剂清除残余光阻膜，提高产品外观品质。In the third step, the molar concentration range of the sulfuric acid hydrogen peroxide mixture is between 4.0 MOL/L and 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 2, the thickness of the photoresist film ranges from 15 μm to 20 μm; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns. The etching reaction time is from 30 seconds to 60 seconds. Finally, after the pattern of each line is formed, the photoresist is used to remove the residual photoresist film to improve the appearance quality of the product.
有益效果Beneficial effect
本发明公开了具有中间导电层的触控面板及其制作方法，通过采用光阻工艺可以对触控面板的不同深度层面进行光阻蚀刻得到相应的图案，并且加入中介导电层起到保护导电材料作用，也提高导电材料的附着力。因此，电镀工艺与光阻工艺的有机结合可以省去复杂的贴合工序来加工触控面板，从而有效降低触控产品的厚度重量，提高透光度和触控敏感度。本发明在对感应层蚀刻中引入网格图案非导电区域来降低蚀刻痕迹，减少蚀刻废液利于环保。 The invention discloses a touch panel with an intermediate conductive layer and a manufacturing method thereof. By using a photoresist process, photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and an intermediate conductive layer is added to protect the conductive material. The role also increases the adhesion of the conductive material. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch product, and improving the transmittance and the touch sensitivity. The invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
附图说明DRAWINGS
图1是本发明的具有中间导电层的触控面板剖面结构组成示意图。其中有：铭板层1，金属线路层2，中间导电层3，透明导电层4，基板层5。1 is a schematic view showing the structure of a cross-sectional structure of a touch panel having an intermediate conductive layer of the present invention. Among them are: nameplate layer 1, metal circuit layer 2, intermediate conductive layer 3, transparent conductive layer 4, and substrate layer 5.
图2是本发明的局部结构图案示意框图。Figure 2 is a schematic block diagram of a partial structure pattern of the present invention.
图3是本发明的制作流程示意框图。Figure 3 is a schematic block diagram of the production flow of the present invention.
图4是本发明的局部网格图案非导电区域示意框图。4 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.
本发明的实施方式Embodiments of the invention
下面是本发明的具体实施例来进一步描述：The following is a specific embodiment of the invention to further describe:
图1所示，本发明的具有中间导电层的触控面板，包含第一层是铭板层1，第二层是金属线路层2，第三层是中间导电层3，第四层是透明导电层4，第五层是基板层5，依次叠加。铭板层1的厚度范围值在0.7毫米到1.8毫米之间；金属线路层2的厚度范围值在0.04微米到0.1微米之间；中间导电层3或者透明导电层4的厚度范围值在0.04微米到0.1微米之间；基板层5的厚度范围值在50微米到180微米之间。中间导电层3是氧化铟；金属线路层2是铜线；透明导电层4是氧化铟锡；基板层5是硬化玻璃或者聚碳酸树脂。As shown in FIG. 1, the touch panel with an intermediate conductive layer of the present invention comprises a first layer which is a nameplate layer 1, a second layer which is a metal wiring layer 2, a third layer which is an intermediate conductive layer 3, and a fourth layer which is transparent. The conductive layer 4 and the fifth layer are the substrate layers 5, which are sequentially stacked. The thickness of the nameplate layer 1 ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer 2 ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer 3 or the transparent conductive layer 4 ranges from 0.04 micrometers. Between 0.1 microns; the thickness of the substrate layer 5 ranges from 50 microns to 180 microns. The intermediate conductive layer 3 is indium oxide; the metal wiring layer 2 is copper wire; the transparent conductive layer 4 is indium tin oxide; and the substrate layer 5 is hardened glass or polycarbonate resin.
通过图3可知，制作具有中间导电层的触控面板的方法，各步骤在无尘干燥条件下进行；FIG. 3 shows a method of fabricating a touch panel having an intermediate conductive layer, and each step is performed under dust-free drying conditions;
步骤一：基板层5的一面覆盖透明导电层4，在透明导电层4上覆盖中间导电层3；Step 1: one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
步骤二：中间导电层3上电镀金属线路层2，在金属线路层2上贴光阻膜；其中，光阻膜上镂空图案分别与金属走线痕迹、感应线和网格状蚀刻线痕迹吻合；Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces, the sensing lines and the grid-shaped etch lines ;
步骤三：先对金属线路层2表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液线路蚀刻中间导电层3和透明导电层4，形成感应线和网格图案非导电区域；Step 3: After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
步骤四：对步骤三中金属线路层2周边曝光显影蚀刻形成金属走线；Step 4: in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace;
步骤五：用透明光学胶将铭板层1贴合在金属走线和步骤三中透明导电层4上。Step 5: The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
上述步骤三中硫酸和双氧水混合液的摩尔浓度范围值在4.0MOL/L到4.5MOL/L之间。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度范围值在15微米到20微米之间；步骤五中透明光学胶的厚度范围值在50微米到100微米之间。其中，蚀刻反应时间为30秒钟到60秒钟。The molar concentration range of the mixture of sulfuric acid and hydrogen peroxide in the above step 3 is between 4.0 MOL/L and 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; in step 2, the thickness of the photoresist film ranges from 15 μm to 20 μm; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns. Among them, the etching reaction time is 30 seconds to 60 seconds.
实施例1：Example 1:
铭板层1的厚度是0.7毫米；金属线路层2的厚度是0.04微米；中间导电层3的厚度是0.04微米，透明导电层4的厚度是0.04微米；基板层5的厚度是50微米，基板层5是聚碳酸树脂。The thickness of the nameplate layer 1 is 0.7 mm; the thickness of the metal wiring layer 2 is 0.04 μm; the thickness of the intermediate conductive layer 3 is 0.04 μm, the thickness of the transparent conductive layer 4 is 0.04 μm; the thickness of the substrate layer 5 is 50 μm, the substrate Layer 5 is a polycarbonate resin.
制作具有中间导电层的触控面板的方法，各步骤在无尘干燥条件下进行；a method of fabricating a touch panel having an intermediate conductive layer, each step being performed under dust-free drying conditions;
步骤一：基板层5的一面覆盖透明导电层4，在透明导电层4上覆盖中间导电层3；Step 1: one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
步骤二：中间导电层3上电镀金属线路层2，在金属线路层2上贴光阻膜；其中，光阻膜上镂空图案与金属走线痕迹和网格状蚀刻线痕迹吻合；Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
步骤三：先对金属线路层2表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液线路蚀刻中间导电层3和透明导电层4，形成感应线和网格图案非导电区域；Step 3: After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
步骤四：对步骤三中金属线路层2周边曝光显影蚀刻形成金属走线；Step 4: in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace;
步骤五：用透明光学胶将铭板层1贴合在金属走线和步骤三中透明导电层4上。Step 5: The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
上述步骤三中硫酸双氧水混合液的摩尔浓度是4.0MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度是15微米。其中，蚀刻反应时间为30秒钟。步骤五中透明光学胶的厚度是50微米。The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.0 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step two, the thickness of the photoresist film is 15 μm. Among them, the etching reaction time was 30 seconds. The thickness of the transparent optical adhesive in step 5 is 50 microns.
实施例2：Example 2:
铭板层1的厚度是1.8毫米；金属线路层2的厚度是0.07微米；中间导电层3的厚度是0.08微米，透明导电层4的厚度是0.08微米；基板层5的厚度是180微米，基板层5是硬化玻璃。The thickness of the nameplate layer 1 is 1.8 mm; the thickness of the metal wiring layer 2 is 0.07 μm; the thickness of the intermediate conductive layer 3 is 0.08 μm, the thickness of the transparent conductive layer 4 is 0.08 μm; the thickness of the substrate layer 5 is 180 μm, the substrate Layer 5 is a hardened glass.
制作具有中间导电层的触控面板的方法，各步骤在无尘干燥条件下进行；a method of fabricating a touch panel having an intermediate conductive layer, each step being performed under dust-free drying conditions;
步骤一：基板层5的一面覆盖透明导电层4，在透明导电层4上覆盖中间导电层3；Step 1: one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
步骤二：中间导电层3上电镀金属线路层2，在金属线路层2上贴光阻膜；其中，光阻膜上镂空图案与金属走线痕迹和网格状蚀刻线痕迹吻合；Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
步骤三：先对金属线路层2表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液线路蚀刻中间导电层3和透明导电层4，形成感应线和网格图案非导电区域；Step 3: After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
步骤四：对步骤三中金属线路层2周边曝光显影蚀刻形成金属走线；Step 4: in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace;
步骤五：用透明光学胶将铭板层1贴合在金属走线和步骤三中透明导电层4上。Step 5: The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
上述步骤三中硫酸双氧水混合液的摩尔浓度是4.5MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度是20微米。其中，蚀刻反应时间为60秒钟。步骤五中透明光学胶的厚度是100微米。The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.5 MOL/L. In the third step, the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 μm; and in step 2, the thickness of the photoresist film is 20 μm. Among them, the etching reaction time was 60 seconds. The thickness of the transparent optical adhesive in step 5 is 100 micrometers.
实施例3：Example 3:
铭板层1的厚度是1.1毫米；金属线路层2的厚度是0.1微米；中间导电层3的厚度是0.1微米，透明导电层4的厚度是0.1微米；基板层5的厚度是125微米，基板层5是聚碳酸树脂。The thickness of the nameplate layer 1 is 1.1 mm; the thickness of the metal wiring layer 2 is 0.1 micrometer; the thickness of the intermediate conductive layer 3 is 0.1 micrometer, the thickness of the transparent conductive layer 4 is 0.1 micrometer; the thickness of the substrate layer 5 is 125 micrometers, the substrate Layer 5 is a polycarbonate resin.
制作具有中间导电层的触控面板的方法，各步骤在无尘干燥条件下进行；a method of fabricating a touch panel having an intermediate conductive layer, each step being performed under dust-free drying conditions;
步骤一：基板层5的一面覆盖透明导电层4，在透明导电层4上覆盖中间导电层3；Step 1: one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
步骤二：中间导电层3上电镀金属线路层2，在金属线路层2上贴光阻膜；其中，光阻膜上镂空图案与金属走线痕迹和网格状蚀刻线痕迹吻合；Step 2: plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
步骤三：先对金属线路层2表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液线路蚀刻中间导电层3和透明导电层4，形成感应线和网格图案非导电区域；Step 3: After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
步骤四：对步骤三中金属线路层2周边曝光显影蚀刻形成金属走线；Step 4: in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace;
步骤五：用透明光学胶将铭板层1贴合在金属走线和步骤三中透明导电层4上。Step 5: The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
上述步骤三中硫酸双氧水混合液的摩尔浓度是4.2MOL/L。步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度是18微米。其中，蚀刻反应时间为45秒钟。步骤五中透明光学胶的厚度是75微米。The molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.2 MOL/L. In the third step, the grid pattern is a square matrix; wherein, the single square etching side length is 0.35 mm, and the etching line width is 60 micrometers; in the second step, the thickness of the photoresist film is 18 micrometers. Among them, the etching reaction time was 45 seconds. The thickness of the transparent optical adhesive in step 5 is 75 microns.

Claims (7)

  1. 一种具有中间导电层的触控面板，包含第一层是铭板层（1），其特征在于：第二层是金属线路层（2），第三层是中间导电层（3），第四层是透明导电层（4），第五层是基板层（5），依次叠加。 A touch panel having an intermediate conductive layer, comprising a first layer is a nameplate layer (1), characterized in that: the second layer is a metal circuit layer (2), and the third layer is an intermediate conductive layer (3), The fourth layer is a transparent conductive layer (4), and the fifth layer is a substrate layer (5), which are sequentially stacked.
  2. 如权利要求1所述具有中间导电层的触控面板，其特征在于：所述铭板层（1）的厚度范围值在0.7毫米到1.8毫米之间；金属线路层（2）的厚度范围值在0.04微米到0.1微米之间；中间导电层（3）或者透明导电层（4）的厚度范围值在0.04微米到0.1微米之间；基板层（5）的厚度范围值在50微米到180微米之间。The touch panel with an intermediate conductive layer according to claim 1, wherein the thickness of the nameplate layer (1) ranges from 0.7 mm to 1.8 mm; and the thickness range of the metal wiring layer (2) Between 0.04 micrometers and 0.1 micrometers; the thickness of the intermediate conductive layer (3) or the transparent conductive layer (4) ranges from 0.04 micrometers to 0.1 micrometers; the thickness of the substrate layer (5) ranges from 50 micrometers to 180 micrometers. between.
  3. 如权利要求1所述具有中间导电层的触控面板，其特征在于：所述中间导电层（3）是氧化铟；金属线路层（2）是铜线；透明导电层（4）是氧化铟锡；基板层（5）是硬化玻璃或者聚碳酸树脂。The touch panel with an intermediate conductive layer according to claim 1, wherein the intermediate conductive layer (3) is indium oxide; the metal wiring layer (2) is copper wire; and the transparent conductive layer (4) is indium oxide. Tin; the substrate layer (5) is a hardened glass or a polycarbonate resin.
  4. 一种如权利要求1所述的制作具有中间导电层的触控面板的方法，包括如下步骤，其特征在于：所述步骤在无尘干燥条件下进行；A method of fabricating a touch panel having an intermediate conductive layer according to claim 1, comprising the steps of: said step being performed under dust-free drying conditions;
    步骤一：基板层（5）的一面覆盖透明导电层（4），在透明导电层（4）上覆盖中间导电层（3）；Step 1: one side of the substrate layer (5) covers the transparent conductive layer (4), and covers the intermediate conductive layer (3) on the transparent conductive layer (4);
    步骤二：中间导电层（3）上电镀金属线路层（2），在金属线路层（2）上贴光阻膜；其中，光阻膜上镂空图案分别与金属走线痕迹、感应线和网格状蚀刻线痕迹吻合；Step 2: plating the metal circuit layer (2) on the intermediate conductive layer (3), and sticking the photoresist film on the metal circuit layer (2); wherein the hollow pattern on the photoresist film is respectively related to the metal trace, the sensing line and the net The lattice etching line traces are consistent;
    步骤三：先对金属线路层（2）表面视窗操作区域曝光显影后，室温状态下，用硫酸双氧水混合液蚀刻中间导电层（3）和透明导电层（4），形成感应线和网格图案非导电区域；Step 3: After exposing and developing the surface operation area of the metal circuit layer (2), the intermediate conductive layer (3) and the transparent conductive layer (4) are etched with a mixture of sulfuric acid hydrogen peroxide at room temperature to form a sensing line and a grid pattern. Non-conductive area;
    步骤四：对步骤三中金属线路层（2）周边曝光显影蚀刻形成金属走线；Step 4: forming a metal trace on the periphery of the metal circuit layer (2) in the third step;
    步骤五：用透明光学胶将铭板层（1）贴合在金属走线和步骤三中透明导电层（4）上。Step 5: Lay the nameplate layer (1) on the metal trace and the transparent conductive layer (4) in step three with a transparent optical adhesive.
  5. 如权利要求4所述制作具有中间导电层的触控面板的方法，其特征在于：所述步骤三中硫酸双氧水混合液的摩尔浓度范围值在4.0MOL/L到4.5MOL/L之间。The method of claim 4, wherein the molar concentration range of the sulfuric acid hydrogen peroxide mixture in the third step is between 4.0 MOL/L and 4.5 MOL/L.
  6. 如权利要求4所述制作具有中间导电层的触控面板的方法，其特征在于：所述步骤三中网格图案为方块矩阵；其中，单个方块蚀刻边长0.35毫米，蚀刻线宽60微米；步骤二中光阻膜的厚度范围值在15微米到20微米之间。The method of fabricating a touch panel having an intermediate conductive layer according to claim 4, wherein the grid pattern in the third step is a matrix of squares; wherein a single square has a side length of 0.35 mm and an etch line width of 60 μm; The thickness of the photoresist film in the second step ranges from 15 micrometers to 20 micrometers.
  7. 如权利要求4所述制作具有中间导电层的触控面板的方法，其特征在于：所述蚀刻反应时间为30秒钟到60秒钟。 A method of fabricating a touch panel having an intermediate conductive layer according to claim 4, wherein the etching reaction time is from 30 seconds to 60 seconds.
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