WO2012019530A1 - Écran tactile avec couche conductrice intermédiaire et procédé pour sa fabrication - Google Patents

Écran tactile avec couche conductrice intermédiaire et procédé pour sa fabrication Download PDF

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Publication number
WO2012019530A1
WO2012019530A1 PCT/CN2011/078112 CN2011078112W WO2012019530A1 WO 2012019530 A1 WO2012019530 A1 WO 2012019530A1 CN 2011078112 W CN2011078112 W CN 2011078112W WO 2012019530 A1 WO2012019530 A1 WO 2012019530A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive layer
intermediate conductive
touch panel
micrometers
Prior art date
Application number
PCT/CN2011/078112
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English (en)
Chinese (zh)
Inventor
陈栋南
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牧东光电（苏州）有限公司
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Publication date
Application filed by 牧东光电（苏州）有限公司 filed Critical 牧东光电（苏州）有限公司
Publication of WO2012019530A1 publication Critical patent/WO2012019530A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the invention relates to a touch panel with an intermediate conductive layer and a manufacturing method thereof, belonging to a touch panel composite layer Structure and process technology field.
  • the processing method of the touch panel is to adopt a layer-by-layer bonding process, which is easy to cause inaccurate alignment, and increases the thickness and weight of the touch panel, and reduces the transmittance and touch sensitivity of the touch product. Degree, product quality is difficult to get much improved.
  • a large amount of etching waste liquid is required to be etched away due to the formation of a corresponding sensing line pattern, which causes serious environmental pollution; and the color difference of the touch panel is large, and the etching trace is obvious.
  • the photoresist process has also been applied in the precision process of touch panels.
  • a photoresist process By using a photoresist process, different depth layers of the touch panel can be photoresist etched to obtain a corresponding pattern. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch panel, and improving the transmittance and touch sensitivity.
  • the invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
  • the invention fully utilizes the photoresist etching technology to realize precision processing on different depth layers of the touch panel, and adding an intermediate conductive layer on the transparent conductive layer serves to protect the conductive material and also improves the adhesion of the conductive material.
  • a grid pattern non-conductive region is introduced to eliminate the etching trace, and the etching waste liquid is reduced to be environmentally friendly.
  • the present invention discloses a touch panel having an intermediate conductive layer, wherein the first layer is a nameplate layer, the second layer is a metal circuit layer, the third layer is an intermediate conductive layer, and the fourth layer is a transparent conductive layer.
  • the fifth layer is a substrate layer which is sequentially stacked.
  • the thickness of the nameplate layer ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer or the transparent conductive layer ranges from 0.04 micrometers to 0.1 millimeters. Between microns; the thickness of the substrate layer ranges from 50 microns to 180 microns.
  • the intermediate conductive layer is indium oxide; the metal wiring layer is copper wire; the transparent conductive layer is indium tin oxide; and the substrate layer is hardened glass or polycarbonate resin.
  • the method for fabricating a touch panel having an intermediate conductive layer of the present invention comprises the following steps: performing under dust-free drying conditions;
  • Step 1 one side of the substrate layer covers the transparent conductive layer, and the intermediate conductive layer is covered on the transparent conductive layer;
  • Step 2 plating a metal circuit layer on the intermediate conductive layer, and sticking a photoresist film on the metal circuit layer; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal trace, the sensing line and the grid-shaped etching line;
  • Step 3 first exposing and developing the operating area of the surface of the metal circuit layer, and etching the intermediate conductive layer and the transparent conductive layer with a mixed line of sulfuric acid hydrogen peroxide at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 forming a metal trace on the periphery of the metal circuit layer in the third step
  • Step 5 Lay the nameplate layer on the metal trace and the transparent conductive layer in step three with a transparent optical adhesive.
  • the molar concentration range of the sulfuric acid hydrogen peroxide mixture is between 4.0 MOL/L and 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 2, the thickness of the photoresist film ranges from 15 ⁇ m to 20 ⁇ m; in step 5, transparent optics The thickness of the glue ranges from 50 microns to 100 microns.
  • the etching reaction time is from 30 seconds to 60 seconds.
  • the photoresist is used to remove the residual photoresist film to improve the appearance quality of the product.
  • the invention discloses a touch panel with an intermediate conductive layer and a manufacturing method thereof.
  • photoresist etching can be performed on different depth layers of the touch panel to obtain a corresponding pattern, and an intermediate conductive layer is added to protect the conductive material.
  • the role also increases the adhesion of the conductive material. Therefore, the organic combination of the electroplating process and the photoresist process can eliminate the complicated bonding process to process the touch panel, thereby effectively reducing the thickness and weight of the touch product, and improving the transmittance and the touch sensitivity.
  • the invention introduces a grid pattern non-conductive region in the etching of the sensing layer to reduce the etching trace, and reduces the etching waste liquid to be environmentally friendly.
  • FIG. 1 is a schematic view showing the structure of a cross-sectional structure of a touch panel having an intermediate conductive layer of the present invention. Among them are: nameplate layer 1, metal circuit layer 2, intermediate conductive layer 3, transparent conductive layer 4, and substrate layer 5.
  • Figure 2 is a schematic block diagram of a partial structure pattern of the present invention.
  • Figure 3 is a schematic block diagram of the production flow of the present invention.
  • FIG. 4 is a schematic block diagram of a non-conductive region of a partial grid pattern of the present invention.
  • the touch panel with an intermediate conductive layer of the present invention comprises a first layer which is a nameplate layer 1, a second layer which is a metal wiring layer 2, a third layer which is an intermediate conductive layer 3, and a fourth layer which is transparent.
  • the conductive layer 4 and the fifth layer are the substrate layers 5, which are sequentially stacked.
  • the thickness of the nameplate layer 1 ranges from 0.7 mm to 1.8 mm; the thickness of the metal wiring layer 2 ranges from 0.04 micrometers to 0.1 micrometers; and the thickness of the intermediate conductive layer 3 or the transparent conductive layer 4 ranges from 0.04 micrometers. Between 0.1 microns; the thickness of the substrate layer 5 ranges from 50 microns to 180 microns.
  • the intermediate conductive layer 3 is indium oxide; the metal wiring layer 2 is copper wire; the transparent conductive layer 4 is indium tin oxide; and the substrate layer 5 is hardened glass or polycarbonate resin.
  • FIG. 3 shows a method of fabricating a touch panel having an intermediate conductive layer, and each step is performed under dust-free drying conditions
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces, the sensing lines and the grid-shaped etch lines ;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration range of the mixture of sulfuric acid and hydrogen peroxide in the above step 3 is between 4.0 MOL/L and 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; in step 2, the thickness of the photoresist film ranges from 15 ⁇ m to 20 ⁇ m; in step 5, transparent optics
  • the thickness of the glue ranges from 50 microns to 100 microns.
  • the etching reaction time is 30 seconds to 60 seconds.
  • the thickness of the nameplate layer 1 is 0.7 mm; the thickness of the metal wiring layer 2 is 0.04 ⁇ m; the thickness of the intermediate conductive layer 3 is 0.04 ⁇ m, the thickness of the transparent conductive layer 4 is 0.04 ⁇ m; the thickness of the substrate layer 5 is 50 ⁇ m, the substrate Layer 5 is a polycarbonate resin.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.0 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; and in step two, the thickness of the photoresist film is 15 ⁇ m. Among them, the etching reaction time was 30 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 50 microns.
  • the thickness of the nameplate layer 1 is 1.8 mm; the thickness of the metal wiring layer 2 is 0.07 ⁇ m; the thickness of the intermediate conductive layer 3 is 0.08 ⁇ m, the thickness of the transparent conductive layer 4 is 0.08 ⁇ m; the thickness of the substrate layer 5 is 180 ⁇ m, the substrate Layer 5 is a hardened glass.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.5 MOL/L.
  • the grid pattern is a matrix of squares; wherein the single square has a side length of 0.35 mm and an etch line width of 60 ⁇ m; and in step 2, the thickness of the photoresist film is 20 ⁇ m. Among them, the etching reaction time was 60 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 100 micrometers.
  • the thickness of the nameplate layer 1 is 1.1 mm; the thickness of the metal wiring layer 2 is 0.1 micrometer; the thickness of the intermediate conductive layer 3 is 0.1 micrometer, the thickness of the transparent conductive layer 4 is 0.1 micrometer; the thickness of the substrate layer 5 is 125 micrometers, the substrate Layer 5 is a polycarbonate resin.
  • Step 1 one side of the substrate layer 5 covers the transparent conductive layer 4, and covers the intermediate conductive layer 3 on the transparent conductive layer 4;
  • Step 2 plating the metal circuit layer 2 on the intermediate conductive layer 3, and sticking the photoresist film on the metal circuit layer 2; wherein the hollow pattern on the photoresist film is consistent with the traces of the metal traces and the traces of the grid-shaped etch lines;
  • Step 3 After exposing and developing the surface operation area of the metal circuit layer 2, the intermediate conductive layer 3 and the transparent conductive layer 4 are etched with a sulfuric acid hydrogen peroxide mixture line at room temperature to form a non-conductive region of the sensing line and the grid pattern;
  • Step 4 in the third step, the metal circuit layer 2 is exposed and developed to form a metal trace
  • Step 5 The nameplate layer 1 is adhered to the metal trace and the transparent conductive layer 4 in the third step with a transparent optical adhesive.
  • the molar concentration of the sulfuric acid hydrogen peroxide mixture in the above step 3 is 4.2 MOL/L.
  • the grid pattern is a square matrix; wherein, the single square etching side length is 0.35 mm, and the etching line width is 60 micrometers; in the second step, the thickness of the photoresist film is 18 micrometers. Among them, the etching reaction time was 45 seconds.
  • the thickness of the transparent optical adhesive in step 5 is 75 microns.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention concerne un écran tactile doté d'une couche conductrice intermédiaire et un procédé pour sa fabrication, qui appartiennent au domaine technique des structures d'écrans tactiles en couches composites et de leurs processus de fabrication. Selon la présente invention, des régions non conductrices formant un motif quadrillé sont introduites pendant la gravure chimique d'une couche d'induction, de façon à réduire les traces de gravure chimique et à diminuer la quantité de déchets liquides de gravure chimique, ce qui est bénéfique pour la protection de l'environnement. Pendant le traitement de l'écran tactile, il est fait pleinement usage de la technologie de gravure chimique avec résine photosensible pour réaliser un traitement précis de l'écran tactile à différents niveaux de profondeur, et une couche conductrice intermédiaire ajoutée dans celui-ci sert à protéger des matériaux conducteurs, et également à renforcer l'adhérence des matériaux conducteurs.
PCT/CN2011/078112 2010-08-13 2011-08-08 Écran tactile avec couche conductrice intermédiaire et procédé pour sa fabrication WO2012019530A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010252115.1 2010-08-13
CN2010102521151A CN101893966A (zh) 2010-08-13 2010-08-13 具有中间导电层的触控面板及其制作方法

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WO2012019530A1 true WO2012019530A1 (fr) 2012-02-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110727359A (zh) * 2019-08-29 2020-01-24 晟光科技股份有限公司 一种用于笔记本的触控面板制造方法

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CN101893966A (zh) * 2010-08-13 2010-11-24 牧东光电（苏州）有限公司 具有中间导电层的触控面板及其制作方法
CN103440063A (zh) * 2013-06-28 2013-12-11 厦门高卓立科技有限公司 触摸屏显示器及其制作方法
CN103365467A (zh) * 2013-06-28 2013-10-23 厦门高卓立科技有限公司 触摸屏图形结构及触摸屏显示器
CN109427435B (zh) * 2017-10-20 2020-07-03 佳陞科技有限公司 导电网线图案结构及其制造方法
CN107861656A (zh) * 2017-11-08 2018-03-30 合肥鑫晟光电科技有限公司 触摸屏的制造方法、显示装置
CN108446048B (zh) * 2018-03-07 2022-01-18 业成科技（成都）有限公司 透明导电层的图案结构

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CN101441545A (zh) * 2008-12-08 2009-05-27 中国南玻集团股份有限公司 电容式触控屏及其制造方法
WO2010080988A2 (fr) * 2009-01-09 2010-07-15 Apple Inc. Procédé de fabrication de panneaux tactiles minces
CN101571778A (zh) * 2009-06-15 2009-11-04 南京华睿川电子科技有限公司 投射电容式触摸屏
CN101893966A (zh) * 2010-08-13 2010-11-24 牧东光电（苏州）有限公司 具有中间导电层的触控面板及其制作方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110727359A (zh) * 2019-08-29 2020-01-24 晟光科技股份有限公司 一种用于笔记本的触控面板制造方法

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