WO2011137845A1 - 一种电源模块电路板的制作方法、电源模块及其磁芯 - Google Patents

一种电源模块电路板的制作方法、电源模块及其磁芯 Download PDF

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Publication number
WO2011137845A1
WO2011137845A1 PCT/CN2011/074905 CN2011074905W WO2011137845A1 WO 2011137845 A1 WO2011137845 A1 WO 2011137845A1 CN 2011074905 W CN2011074905 W CN 2011074905W WO 2011137845 A1 WO2011137845 A1 WO 2011137845A1
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Prior art keywords
circuit board
magnetic core
power module
core
board
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PCT/CN2011/074905
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English (en)
French (fr)
Inventor
黄良荣
陈海亮
陈健
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to BRPI1106079A priority Critical patent/BRPI1106079B8/pt
Priority to HU1200280A priority patent/HU230993B1/hu
Priority to MX2011013414A priority patent/MX2011013414A/es
Publication of WO2011137845A1 publication Critical patent/WO2011137845A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Definitions

  • the invention relates to a method for manufacturing a power module circuit board, a power module and a magnetic core thereof.
  • the application body is required to be submitted on October 27, 2010, and the application number is 201010521469.1.
  • the present invention relates to the field of power supply technologies, and in particular, to a method for manufacturing a power module circuit board, a power module, and a magnetic core thereof. Background technique
  • the core is an indispensable material for the power module. It is mainly used in the transformer and inductor of the power module. The layout of the core used in the transformer and inductor accounts for about 30% of the area of the power module. In the connection between the core and the power module, there are currently two types of technologies:
  • the first type is the conventional magnetic core bonding technology.
  • the technology includes two types: one is the common magnetic core bonding, and the winding of the power module is made inside the circuit board. In the area where the magnetic core is laid, the circuit board is slotted.
  • the magnetic core is divided into an upper core and a lower core, and both parts are exposed on the outside of the circuit board, and are connected to the power module by bonding; the other is a separate device with a magnetic core, and the core is used as a core A part of a separate device is connected to the power module by soldering.
  • the second type is the planar magnetic core integrated embedding technology, which embeds the entire planar magnetic core into the inside of the circuit board.
  • the windings of the power module are composed of circuit boards, and the other layers on the circuit board where the magnetic core is located can be laid out with other components, such as resistors. , capacitors, etc.
  • This technology can be divided into horizontal buried magnetic and vertical buried magnetic according to different ways of placing the magnetic core embedded in the circuit board.
  • the inventors have found that the conventional magnetic core bonding technology occupies the layout space of the circuit board, which is disadvantageous to the high-density and miniaturized design of the power module; and the planar magnetic core is embedded in the whole technology, because the entire magnetic core is buried in the circuit board. Internally, it cannot be directly radiated by the heat sink, which is not conducive to heat dissipation of the core. Summary of the invention
  • the embodiment of the invention provides a method for manufacturing a circuit board, a power module and a magnetic core thereof, which can save the layout space of the printed circuit board, and is advantageous for the high-density and miniaturization design of the power module, and is beneficial to heat dissipation of the magnetic core.
  • a method for manufacturing a power module circuit board comprising:
  • the two parts of the power module core are electrically connected by glue bonding.
  • a power module includes a magnetic core, a part of the magnetic core is buried inside the circuit board, formed integrally with the circuit board, and forms an adhesive surface on a surface of the circuit board; A part of the magnetic body is exposed outside the circuit board; the two parts of the magnetic core are electrically connected by glue bonding.
  • a magnetic core of a power module comprising: a lower core and an upper core; the lower core is embedded in the circuit board, formed integrally with the circuit board, and forms a bond on the surface of the circuit board
  • the upper magnetic core is exposed outside the circuit board; the lower magnetic core and the upper magnetic core are electrically connected by glue bonding.
  • the heat sink can solve the problem of heat dissipation of the core through the heat sink. Conducive to the core heat dissipation.
  • FIG. 1 is a cross-sectional view of a magnetic core of a power module according to an embodiment of the present invention
  • FIG. 2 is a top view of a magnetic core of a power module according to an embodiment of the present invention.
  • FIG. 3 is a flow chart of processing a first circuit board sub-board with windings according to an embodiment of the present invention
  • FIG. 4 is a flow chart of processing a second circuit board sub-board with windings according to an embodiment of the present invention
  • the processing flow chart of the circuit board motherboard provided by the example
  • FIG. 6 is a flowchart of assembling a circuit board according to an embodiment of the present invention.
  • FIG. 7 is a schematic flowchart diagram of a method for manufacturing a power module circuit board according to an embodiment of the present invention. detailed description
  • FIG. 1 is a cross-sectional view of a magnetic core of a power module according to an embodiment of the present invention
  • FIG. 2 is a top view of a magnetic core of a power module according to an embodiment of the present invention.
  • the magnetic core of the power module provided by the embodiment of the invention includes: a lower core and an upper core; the lower core is embedded in the circuit board during production of a power module circuit board (eg, PCB, Printed Circuit Board) Internally formed integrally with the circuit board, and after the circuit board is processed, forming an adhesive surface on the surface of the circuit board; the upper magnetic core is exposed outside the circuit board; The core and the upper core are electrically connected by glue bonding during assembly of the circuit board.
  • a power module circuit board eg, PCB, Printed Circuit Board
  • the magnetic core of the power module provided by the embodiment of the present invention is embedded in the circuit board by the lower core, and the upper core is exposed outside the circuit board, and the upper and lower parts of the magnetic core are electrically connected by glue bonding. Therefore, on the one hand, the surface of the circuit board where the core region is located does not affect the layout of other components. As shown in FIG. 1, the device 1 and the device 2 are mounted on the lower surface of the circuit board where the core region is located, thereby saving the circuit board.
  • the layout space provides a good solution for the high-density and miniaturization of the power module, which is beneficial to the high-density and miniaturization design of the power module, and on the other hand, the core can be solved by the heat sink. The problem of heat is difficult to heat the core.
  • the lower magnetic core embedded in the inner surface of the circuit board has a bonding surface formed on the surface of the circuit board lower than the surface layer of the circuit board or flush with the surface layer of the circuit board, thereby avoiding the process of manufacturing the circuit board. Or damage the core during board assembly.
  • the bonding surface of the lower core is similar to the pad of the circuit board
  • the upper core is similar to the surface mount device of the circuit board, so that the glue or dot is printed on the pad.
  • Glue, or a layer of glue on the pad can electrically connect the upper and lower parts of the core, so that the core can be automatically surface-mounted, and the current core installation requires manual bonding. Compared, it can reduce assembly costs.
  • FIG. 3 is a processing flow chart of the first circuit board sub-board with winding
  • FIG. 4 is a processing flow chart of the second circuit board sub-board with winding
  • Figure 5 is a flow chart of the processing of the motherboard of the circuit board
  • Figure 6 is a flow chart of the assembly of the circuit board.
  • the processing flow of the first circuit board daughter board with windings includes:
  • unloading (the first sub-board includes the TOP surface, windings, etc.) ⁇ the first sub-board inner layer production ⁇ browning ⁇ pressing ⁇ drilling blind holes ⁇ blind hole metallization.
  • the outer circuit of the first sub-board is made: only the line on one side of the sub-board.
  • Resin plug hole Fill the blind hole 1 with a resin material and ensure that the resin surface and the copper surface are kept flat.
  • the processing flow of the second circuit board daughter board with windings includes:
  • the second sub-board includes PP sheet, inner core board and BOTTOM (bottom) core board.
  • slotting 2 The inner core board, the BOTTOM surface core board, and the PP piece corresponding to the lower core area need to be buried, and the slot size is such that the lower core can smoothly place the slotted area.
  • the second sub-board inner layer is fabricated: the inner layer pattern of the circuit board except the first sub-board is fabricated.
  • the processing process of the board mother board includes:
  • stacking board stacking the processed first and second sub-boards in order, and The lower core is placed in the corresponding slotted area.
  • Pressing Pressing the lower core, the first sub-board and the second sub-board into one unit.
  • drill through hole ⁇ through hole metallization ⁇ make the outer layer pattern.
  • the board assembly process includes:
  • Tin, Dispensing Print solder paste on the board pad and apply a layer of glue on the bonding surface of the lower core.
  • Post, Reflow Place the upper core and other components on the board and reflow to complete the assembly.
  • a method for manufacturing a power module circuit board according to an embodiment of the present invention includes:
  • a part of the power module magnetic core is buried inside the circuit board, forming a whole with the circuit board, and forming an adhesive surface on the surface of the circuit board;
  • a portion of the core of the power module buried inside the board must have a bonding surface on the surface of the board that is lower than the surface of the board or at least flush with the surface of the board.
  • a part of the core of the power module buried inside the circuit board forms a bonding surface on the surface of the circuit board similar to the pad of the circuit board, and is exposed on the outside of the circuit board.
  • the other part of the power module core is similar to the surface mount device of the circuit board, and the two parts of the power module core are electrically connected by glue bonding.
  • the circuit board winding of the power module is located in the area of the core of the power module embedded in the circuit board, which is realized by the circuit board coil, and the windings are connected by blind holes or through holes.
  • the surface of the circuit board where the core area of the power module is located does not affect the layout of other components, so that the layout space of the circuit board can be effectively utilized.
  • the method for manufacturing the power module circuit board provided by the embodiment of the present invention is that a part of the magnetic core is buried inside the circuit board, and another part is exposed outside the circuit board, and the two parts of the magnetic core are glued.
  • the electrical connection is realized; on the one hand, the surface layer of the circuit board where the core region is located does not affect the layout of other components, which can save the layout space of the circuit board, and is advantageous for the high-density and miniaturized design of the power module, and on the other hand, can be solved by the heat sink.
  • the problem of difficult heat dissipation of the core is conducive to heat dissipation of the core.
  • the surface mount device can realize automatic surface mount, which can reduce the assembly cost compared with the current manual installation of the magnetic core.
  • a power module provided by an embodiment of the present invention includes a magnetic core, and a part of the magnetic core is buried in the circuit board during processing of the power module circuit board, and forms a circuit with the circuit board. Integrally, and after the processing of the circuit board is completed, forming an adhesive surface on the surface of the circuit board; another part of the magnetic core is exposed outside the circuit board; two parts of the magnetic core are in the During the assembly process of the board, the electrical connection is achieved by glue bonding.
  • the power module provided by the embodiment of the present invention has a part of the magnetic core buried in the circuit board, and another part is exposed outside the circuit board, and the two parts of the magnetic core are electrically connected by glue bonding;
  • the surface layer of the circuit board where the core region is located does not affect the layout of other components, which can save the layout space of the circuit board, provide a good solution for the high-density and miniaturization of the power module, and on the other hand, can solve the magnetic core through the heat sink. The problem of heat dissipation is difficult.
  • a part of the magnetic core buried inside the circuit board forms a bonding surface on the surface of the circuit board lower than or is flush with the surface layer of the circuit board, thereby avoiding the circuit board manufacturing process or Damage to the core during board assembly.
  • the core embedded in the circuit board is assembled when the power module circuit board is assembled.
  • a part of the bonding surface formed on the surface of the circuit board is similar to the pad of the circuit board, and another part of the magnetic core exposed outside the circuit board is similar to the surface-mounting device of the circuit board, by using on the pad.
  • the upper and lower parts of the magnetic core can be electrically connected by printing or dispensing, or by applying a layer of glue on the pad. Therefore, the magnetic core automatic surface mount can be realized, and the assembly cost can be reduced as compared with the current manual installation of the magnetic core.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Dc-Dc Converters (AREA)

Description

一种电源模块电路板的制作方法、 电源模块及其磁芯 本申请要求了 2010年 10月 27日提交的、 申请号为 201010521469.1、 发 明名称为"一种电源模块电路板的制作方法、电源模块及其磁芯"的中国申请的 优先权， 其全部内容通过引用结合在本申请中。 技术领域
本发明涉及电源技术领域， 特别涉及一种电源模块电路板的制作方法、 电源模块及其磁芯。 背景技术
磁芯是电源模块必不可少的材料， 主要用于电源模块的变压器和电感中， 而变压器和电感所用磁芯的布局面积约占电源模块面积的 30%。 在实现磁芯 与电源模块的连接上， 当前存在以下两类技术：
第一类是常规磁芯粘接技术， 该技术包括两种： 一种是普通磁芯粘接， 将电源模块的绕组做在电路板内部， 在布局磁芯的区域， 电路板做开槽设计， 磁芯分为上磁芯和下磁芯两部分， 且两部分都是表露在电路板外部， 通过粘 接实现与电源模块连接； 另一种是带磁芯的独立器件焊接， 磁芯作为独立器 件的一部分， 通过焊接的方式与电源模块连接。
第二类是平面磁芯整体埋入技术， 将整个平面磁芯全部埋入电路板内部， 电源模块的绕组由电路板构成， 磁芯所在的电路板上下表层都可布局其它元 器件， 如电阻、 电容等。 该技术根据埋入电路板内部磁芯的摆放方式不同， 又可以分为卧式埋磁和立式埋磁。
在实现本发明的过程中发明人发现， 常规磁芯粘接技术占用电路板的布 局空间， 不利于电源模块高密小型化设计； 而平面磁芯整体埋入技术， 由于 整个磁芯埋入电路板内部， 不能通过散热器直接散热， 不利于磁芯散热。 发明内容
本发明实施例提供一种电路板的制作方法、 电源模块及其磁芯， 能够节 省印制电路板的布局空间， 有利于电源模块的高密小型化设计， 同时有利于 磁芯散热。
本发明实施例采用如下技术方案：
一种电源模块电路板的制作方法， 包括：
将电源模块磁芯的一部分埋入所述电路板内部， 与所述电路板形成一个 整体， 并在所述电路板表面形成粘接面；
将电源模块磁芯的另一部分棵露在所述电路板外部；
将所述电源模块磁芯的两个部分通过胶水粘接方式实现电气连接。
一种电源模块， 包括磁芯， 所述磁芯的一部分埋入所述电路板内部， 与 所述电路板形成一个整体， 并在所述电路板表面形成粘接面； 所述磁芯的另 一部分棵露在所述电路板外部； 所述磁芯的两个部分通过胶水粘接方式实现 电气连接。
一种电源模块的磁芯， 包括： 下磁芯和上磁芯； 所述下磁芯埋入所述电 路板内部， 与所述电路板形成一个整体， 并在所述电路板表面形成粘接面； 所述上磁芯棵露在所述电路板外部； 所述下磁芯和所述上磁芯通过胶水粘接 方式实现电气连接。
由本发明实施例的上述技术方案可知， 通过将磁芯的一部分埋入电路板 内部， 另一部分棵露在电路板外部， 磁芯的两个部分通过胶水粘接方式实现 电气连接； 从而一方面在磁芯区域所在的电路板表层不影响布局其他元器件， 能够节省电路板的布局空间， 有利于电源模块的高密小型化设计， 另一方面 又可以通过散热器解决磁芯散热困难的问题， 有利于磁芯散热。
附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例描述中所 需要使用的附图作一筒单地介绍。
图 1为本发明实施例提供的电源模块的磁芯的截面图；
图 2为本发明实施例提供的电源模块的磁芯的俯视图；
图 3为本发明实施例提供的带绕组的第一电路板子板的加工流程图； 图 4为本发明实施例提供的带绕组的第二电路板子板的加工流程图； 图 5为本发明实施例提供的电路板母板的加工流程图；
图 6为本发明实施例提供的电路板组装的流程图；
图 7为本发明实施例提供的电源模块电路板的制作方法的流程示意图。 具体实施方式
下面结合本发明实施例中的附图， 对本发明实施例中的技术方案进行清 楚、 完整地描述。
参见图 1和图 2, 图 1为本发明实施例提供的电源模块的磁芯的截面图， 图 2为本发明实施例提供的电源模块的磁芯的俯视图。
本发明实施例提供的电源模块的磁芯， 包括： 下磁芯和上磁芯； 所述下 磁芯在电源模块电路板 (例如： PCB , Printed Circuit Board )制作过程中埋入 所述电路板内部， 与所述电路板形成一个整体， 并在所述电路板加工完成后， 在所述电路板表面形成粘接面； 所述上磁芯棵露在所述电路板外部； 所述下 磁芯和所述上磁芯在所述电路板组装过程中， 通过胶水粘接方式实现电气连 接。
由此可知， 本发明实施例提供的电源模块的磁芯， 通过将下磁芯埋入电 路板内部， 上磁芯棵露在电路板外部， 通过胶水粘接方式实现磁芯上下两部 分的电气连接； 从而一方面在磁芯区域所在的电路板表层不影响布局其他元 器件， 如图 1所示， 器件 1和器件 2就贴装在磁芯区域所在的电路板下表层， 能够节省电路板的布局空间， 为电源模块的高密小型化提供良好的解决方案， 有利于电源模块的高密小型化设计， 另一方面又可以通过散热器解决磁芯散 热困难的问题， 有利于磁芯散热。
优选地， 所述埋入电路板内部的下磁芯在所述电路板表面形成的粘接面 低于所述电路板表层或者与所述电路板表层齐平， 这样可以避免在电路板制 作过程或电路板组装过程中损坏磁芯。
另外， 在电源模块电路板组装时， 下磁芯的粘接面类似于电路板的焊盘， 上磁芯类似于电路板的表贴器件， 这样通过采用在所述焊盘上印胶或点胶， 或者在所述焊盘上涂覆一层胶的方式， 可以将磁芯的上下两个部分实现电气 连接， 从而可实现磁芯自动表贴， 与目前磁芯的安装需要手工粘接相比， 能 够降低组装成本。
参见图 3至图 6的电源模块电路板的制作流程图， 其中， 图 3为带绕组 的第一电路板子板的加工流程图； 图 4 为带绕组的第二电路板子板的加工流 程图； 图 5为电路板母板的加工流程图； 图 6为电路板组装的流程图。
如图 3所示， 带绕组的第一电路板子板的加工流程包括：
511 , 开料（第一子板包括 TOP面、 绕组等）→第一子板内层线路制作→ 棕化→压合→钻盲孔→盲孔金属化。
512, 开槽 1 : 将需要埋入下磁芯区域对应的子板开槽， 便于下磁芯放入 开槽区域中。
513 , 第一子板外层线路制作： 仅做子板一面的线路。
514, 树脂塞孔： 用树脂材料填充盲孔 1 , 并保证树脂面和铜面保持平整。 如图 4所示， 带绕组的第二电路板子板的加工流程包括：
521 , 开料： 第二子板包括 PP片， 内层芯板和 BOTTOM (底)面芯板等。
522,开槽 2:将需要埋入下磁芯区域对应的内层芯板、 BOTTOM面芯板、 PP片开槽， 开槽大小使得下磁芯能够顺利放置开槽区域。
523 , 第二子板内层线路制作： 制作除第一子板外的电路板内层图形。 如图 5所示， 电路板母板的加工流程包括：
S31 , 叠板： 将上述加工后的第一子板和第二子板按顺序叠在一起， 并将 下磁芯放入对应开槽区域。
532, 压合： 将下磁芯、 第一子板和第二子板压合成一个整体。
533 , 钻通孔→通孔金属化→制作外层图形。
534, 阻焊塞通孔→控深钻盲孔 2→电路板表层处理→电路板母板加工完 成。
如图 6所示， 电路板组装流程包括：
541 , 印锡、 点胶： 在电路板焊盘上印刷锡膏， 在下磁芯的粘接面涂覆一 层胶。
542, 贴件、 回流： 将上磁芯及其它器件贴装在电路板上， 经过回流， 完 成组装。
综上所述， 参见图 7, 本发明实施例提供的电源模块电路板的制作方法， 包括：
51 , 将电源模块磁芯的一部分埋入电路板内部， 与所述电路板形成一个 整体， 并在所述电路板表面形成粘接面；
52, 将电源模块磁芯的另一部分棵露在所述电路板外部；
53 , 将所述电源模块磁芯的两个部分通过胶水粘接方式实现电气连接。 需要说明的是：
a、 由于磁芯易破碎， 因此埋入电路板内部的电源模块磁芯的一部分在所 述电路板表面形成的粘接面必须低于电路板表层或者至少与电路板表层齐 平。
b、 在电源模块电路板组装时， 埋入电路板内部的电源模块磁芯的一部分 在所述电路板表面形成的粘接面类似于电路板的焊盘， 棵露在所述电路板外 部的电源模块磁芯的另一部分类似于电路板的表贴器件， 电源模块磁芯的两 个部分之间通过胶水粘接的方式实现电气连接。
c、 电源模块的电路板绕组位于埋入电路板内部的电源模块磁芯的区域， 由电路板线圏实现， 绕组之间通过盲孔或通孔连接。 d、 在电源模块磁芯区域所在的电路板表层不影响布局其他元器件， 从而 可以有效地利用电路板的布局空间。
由此可知， 本发明实施例提供的电源模块电路板的制作方法， 通过将磁 芯的一部分埋入电路板内部， 另一部分棵露在电路板外部， 磁芯的两个部分 通过胶水粘接方式实现电气连接； 从而一方面在磁芯区域所在的电路板表层 不影响布局其他元器件， 能够节省电路板的布局空间， 有利于电源模块的高 密小型化设计， 另一方面又可以通过散热器解决磁芯散热困难的问题， 有利 于磁芯散热。
另外， 由于埋入电路板内部的电源模块磁芯的一部分在电路板表面形成 的粘接面类似于电路板的焊盘， 棵露在电路板外部的电源模块磁芯的另一部 分类似于电路板的表贴器件， 因此可实现自动表贴， 与目前磁芯的安装需要 手工粘接相比， 能够降低组装成本。
仍参见图 1和图 2, 本发明实施例提供的电源模块， 包括磁芯， 所述磁芯 的一部分在电源模块电路板加工过程中埋入所述电路板内部， 与所述电路板 形成一个整体， 并在所述电路板加工完成后， 在所述电路板表面形成粘接面； 所述磁芯的另一部分棵露在所述电路板外部； 所述磁芯的两个部分在所述电 路板组装过程中， 通过胶水粘接方式实现电气连接。
由此可知， 本发明实施例提供的电源模块， 通过将磁芯的一部分埋入电 路板内部， 另一部分棵露在电路板外部， 磁芯的两个部分通过胶水粘接方式 实现电气连接； 从而一方面在磁芯区域所在的电路板表层不影响布局其他元 器件， 能够节省电路板的布局空间， 为电源模块的高密小型化提供良好的解 决方案， 另一方面又可以通过散热器解决磁芯散热困难的问题。
优选地， 所述埋入电路板内部的磁芯的一部分在电路板表面形成的粘接 面低于所述电路板表层或者与所述电路板表层齐平， 这样可以避免在电路板 制作过程或电路板组装过程中损坏磁芯。
另外可以理解的是， 在电源模块电路板组装时， 埋入电路板内部的磁芯 的一部分在电路板表面形成的粘接面类似于电路板的焊盘， 棵露在电路板外 部的磁芯的另一部分则类似于电路板的表贴器件， 这样通过采用在所述焊盘 上印胶或点胶， 或者在所述焊盘上涂覆一层胶的方式， 可以将磁芯的上下两 个部分实现电气连接。 因此可实现磁芯自动表贴， 与目前磁芯的安装需要手 工粘接相比， 能够降低组装成本。
上述具体实施例并不用以限制本发明， 对于本技术领域的普通技术人员 来说， 凡在不脱离本发明原理的前提下， 所作的任何修改、 等同替换、 改进 等， 均应包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1、 一种电源模块电路板的制作方法， 其特征在于， 包括：
将电源模块磁芯的一部分埋入电路板内部， 与所述电路板形成一个整体， 并在所述电路板表面形成粘接面；
将电源模块磁芯的另一部分棵露在所述电路板外部；
将所述电源模块磁芯的两个部分通过胶水粘接方式实现电气连接。
2、 根据权利要求 1所述的方法， 其特征在于， 将电源模块磁芯的一部分埋 入所述电路板内部， 与所述电路板形成一个整体包括：
分别加工带绕组的第一电路板子板和带绕组的第二电路板子板；
根据预埋入的所述电源模块磁芯的一部分的形状， 在所述第一电路板子板 和所述第二电路板子板对应的位置分别开槽；
将开槽后的所述第一电路板子板和所述第二电路板子板按顺序叠放， 并将 所述电源模块磁芯的一部分放入对应开槽区域；
将所述电源模块磁芯的一部分与所述叠放在一起的两个电路板子板压合成 一个整体。
3、 根据权利要求 1所述的方法， 其特征在于， 所述埋入电路板内部的电源 模块磁芯的一部分在所述电路板表面形成的粘接面低于所述电路板表层或者与 所述电路板表层齐平。
4、 根据权利要求 1-3任一所述的方法， 其特征在于， 所述方法还包括： 在电源模块磁芯所在区域的电路板表层布局元器件。
5、 一种电源模块， 其特征在于， 包括磁芯， 所述磁芯的一部分埋入所述电 源模块电路板内部， 与所述电路板形成一个整体， 并在所述电路板表面形成粘 接面； 所述磁芯的另一部分棵露在所述电路板外部； 所述磁芯的两个部分通过 胶水粘接方式实现电气连接。
6、 根据权利要求 5所述的电源模块， 其特征在于， 所述埋入电路板内部的 磁芯的一部分在所述电路板表面形成的粘接面低于所述电路板表层或者与所述 电路板表层齐平。
7、 根据权利要求 5或 6所述的电源模块， 其特征在于， 所述电源模块的绕 组位于所述埋入电路板内部的磁芯的一部分的区域。
8、 根据权利要求 7所述的电源模块， 其特征在于， 在所述磁芯所在区域的 电路板表层布局有元器件。
9、 一种电源模块的磁芯， 其特征在于， 包括： 下磁芯和上磁芯； 所述下磁 芯埋入所述电路板内部， 与所述电路板形成一个整体， 并在所述电路板表面形 成粘接面； 所述上磁芯棵露在所述电路板外部； 所述下磁芯和所述上磁芯通过 胶水粘接方式实现电气连接。
10、 根据权利要求 9所述的电源模块的磁芯， 其特征在于， 所述下磁芯在 所述电路板表面形成的粘接面低于所述电路板表层或者与所述电路板表层齐 平。
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