WO2011137845A1 - 一种电源模块电路板的制作方法、电源模块及其磁芯 - Google Patents
一种电源模块电路板的制作方法、电源模块及其磁芯 Download PDFInfo
- Publication number
- WO2011137845A1 WO2011137845A1 PCT/CN2011/074905 CN2011074905W WO2011137845A1 WO 2011137845 A1 WO2011137845 A1 WO 2011137845A1 CN 2011074905 W CN2011074905 W CN 2011074905W WO 2011137845 A1 WO2011137845 A1 WO 2011137845A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- magnetic core
- power module
- core
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Definitions
- the invention relates to a method for manufacturing a power module circuit board, a power module and a magnetic core thereof.
- the application body is required to be submitted on October 27, 2010, and the application number is 201010521469.1.
- the present invention relates to the field of power supply technologies, and in particular, to a method for manufacturing a power module circuit board, a power module, and a magnetic core thereof. Background technique
- the core is an indispensable material for the power module. It is mainly used in the transformer and inductor of the power module. The layout of the core used in the transformer and inductor accounts for about 30% of the area of the power module. In the connection between the core and the power module, there are currently two types of technologies:
- the first type is the conventional magnetic core bonding technology.
- the technology includes two types: one is the common magnetic core bonding, and the winding of the power module is made inside the circuit board. In the area where the magnetic core is laid, the circuit board is slotted.
- the magnetic core is divided into an upper core and a lower core, and both parts are exposed on the outside of the circuit board, and are connected to the power module by bonding; the other is a separate device with a magnetic core, and the core is used as a core A part of a separate device is connected to the power module by soldering.
- the second type is the planar magnetic core integrated embedding technology, which embeds the entire planar magnetic core into the inside of the circuit board.
- the windings of the power module are composed of circuit boards, and the other layers on the circuit board where the magnetic core is located can be laid out with other components, such as resistors. , capacitors, etc.
- This technology can be divided into horizontal buried magnetic and vertical buried magnetic according to different ways of placing the magnetic core embedded in the circuit board.
- the inventors have found that the conventional magnetic core bonding technology occupies the layout space of the circuit board, which is disadvantageous to the high-density and miniaturized design of the power module; and the planar magnetic core is embedded in the whole technology, because the entire magnetic core is buried in the circuit board. Internally, it cannot be directly radiated by the heat sink, which is not conducive to heat dissipation of the core. Summary of the invention
- the embodiment of the invention provides a method for manufacturing a circuit board, a power module and a magnetic core thereof, which can save the layout space of the printed circuit board, and is advantageous for the high-density and miniaturization design of the power module, and is beneficial to heat dissipation of the magnetic core.
- a method for manufacturing a power module circuit board comprising:
- the two parts of the power module core are electrically connected by glue bonding.
- a power module includes a magnetic core, a part of the magnetic core is buried inside the circuit board, formed integrally with the circuit board, and forms an adhesive surface on a surface of the circuit board; A part of the magnetic body is exposed outside the circuit board; the two parts of the magnetic core are electrically connected by glue bonding.
- a magnetic core of a power module comprising: a lower core and an upper core; the lower core is embedded in the circuit board, formed integrally with the circuit board, and forms a bond on the surface of the circuit board
- the upper magnetic core is exposed outside the circuit board; the lower magnetic core and the upper magnetic core are electrically connected by glue bonding.
- the heat sink can solve the problem of heat dissipation of the core through the heat sink. Conducive to the core heat dissipation.
- FIG. 1 is a cross-sectional view of a magnetic core of a power module according to an embodiment of the present invention
- FIG. 2 is a top view of a magnetic core of a power module according to an embodiment of the present invention.
- FIG. 3 is a flow chart of processing a first circuit board sub-board with windings according to an embodiment of the present invention
- FIG. 4 is a flow chart of processing a second circuit board sub-board with windings according to an embodiment of the present invention
- the processing flow chart of the circuit board motherboard provided by the example
- FIG. 6 is a flowchart of assembling a circuit board according to an embodiment of the present invention.
- FIG. 7 is a schematic flowchart diagram of a method for manufacturing a power module circuit board according to an embodiment of the present invention. detailed description
- FIG. 1 is a cross-sectional view of a magnetic core of a power module according to an embodiment of the present invention
- FIG. 2 is a top view of a magnetic core of a power module according to an embodiment of the present invention.
- the magnetic core of the power module provided by the embodiment of the invention includes: a lower core and an upper core; the lower core is embedded in the circuit board during production of a power module circuit board (eg, PCB, Printed Circuit Board) Internally formed integrally with the circuit board, and after the circuit board is processed, forming an adhesive surface on the surface of the circuit board; the upper magnetic core is exposed outside the circuit board; The core and the upper core are electrically connected by glue bonding during assembly of the circuit board.
- a power module circuit board eg, PCB, Printed Circuit Board
- the magnetic core of the power module provided by the embodiment of the present invention is embedded in the circuit board by the lower core, and the upper core is exposed outside the circuit board, and the upper and lower parts of the magnetic core are electrically connected by glue bonding. Therefore, on the one hand, the surface of the circuit board where the core region is located does not affect the layout of other components. As shown in FIG. 1, the device 1 and the device 2 are mounted on the lower surface of the circuit board where the core region is located, thereby saving the circuit board.
- the layout space provides a good solution for the high-density and miniaturization of the power module, which is beneficial to the high-density and miniaturization design of the power module, and on the other hand, the core can be solved by the heat sink. The problem of heat is difficult to heat the core.
- the lower magnetic core embedded in the inner surface of the circuit board has a bonding surface formed on the surface of the circuit board lower than the surface layer of the circuit board or flush with the surface layer of the circuit board, thereby avoiding the process of manufacturing the circuit board. Or damage the core during board assembly.
- the bonding surface of the lower core is similar to the pad of the circuit board
- the upper core is similar to the surface mount device of the circuit board, so that the glue or dot is printed on the pad.
- Glue, or a layer of glue on the pad can electrically connect the upper and lower parts of the core, so that the core can be automatically surface-mounted, and the current core installation requires manual bonding. Compared, it can reduce assembly costs.
- FIG. 3 is a processing flow chart of the first circuit board sub-board with winding
- FIG. 4 is a processing flow chart of the second circuit board sub-board with winding
- Figure 5 is a flow chart of the processing of the motherboard of the circuit board
- Figure 6 is a flow chart of the assembly of the circuit board.
- the processing flow of the first circuit board daughter board with windings includes:
- unloading (the first sub-board includes the TOP surface, windings, etc.) ⁇ the first sub-board inner layer production ⁇ browning ⁇ pressing ⁇ drilling blind holes ⁇ blind hole metallization.
- the outer circuit of the first sub-board is made: only the line on one side of the sub-board.
- Resin plug hole Fill the blind hole 1 with a resin material and ensure that the resin surface and the copper surface are kept flat.
- the processing flow of the second circuit board daughter board with windings includes:
- the second sub-board includes PP sheet, inner core board and BOTTOM (bottom) core board.
- slotting 2 The inner core board, the BOTTOM surface core board, and the PP piece corresponding to the lower core area need to be buried, and the slot size is such that the lower core can smoothly place the slotted area.
- the second sub-board inner layer is fabricated: the inner layer pattern of the circuit board except the first sub-board is fabricated.
- the processing process of the board mother board includes:
- stacking board stacking the processed first and second sub-boards in order, and The lower core is placed in the corresponding slotted area.
- Pressing Pressing the lower core, the first sub-board and the second sub-board into one unit.
- drill through hole ⁇ through hole metallization ⁇ make the outer layer pattern.
- the board assembly process includes:
- Tin, Dispensing Print solder paste on the board pad and apply a layer of glue on the bonding surface of the lower core.
- Post, Reflow Place the upper core and other components on the board and reflow to complete the assembly.
- a method for manufacturing a power module circuit board according to an embodiment of the present invention includes:
- a part of the power module magnetic core is buried inside the circuit board, forming a whole with the circuit board, and forming an adhesive surface on the surface of the circuit board;
- a portion of the core of the power module buried inside the board must have a bonding surface on the surface of the board that is lower than the surface of the board or at least flush with the surface of the board.
- a part of the core of the power module buried inside the circuit board forms a bonding surface on the surface of the circuit board similar to the pad of the circuit board, and is exposed on the outside of the circuit board.
- the other part of the power module core is similar to the surface mount device of the circuit board, and the two parts of the power module core are electrically connected by glue bonding.
- the circuit board winding of the power module is located in the area of the core of the power module embedded in the circuit board, which is realized by the circuit board coil, and the windings are connected by blind holes or through holes.
- the surface of the circuit board where the core area of the power module is located does not affect the layout of other components, so that the layout space of the circuit board can be effectively utilized.
- the method for manufacturing the power module circuit board provided by the embodiment of the present invention is that a part of the magnetic core is buried inside the circuit board, and another part is exposed outside the circuit board, and the two parts of the magnetic core are glued.
- the electrical connection is realized; on the one hand, the surface layer of the circuit board where the core region is located does not affect the layout of other components, which can save the layout space of the circuit board, and is advantageous for the high-density and miniaturized design of the power module, and on the other hand, can be solved by the heat sink.
- the problem of difficult heat dissipation of the core is conducive to heat dissipation of the core.
- the surface mount device can realize automatic surface mount, which can reduce the assembly cost compared with the current manual installation of the magnetic core.
- a power module provided by an embodiment of the present invention includes a magnetic core, and a part of the magnetic core is buried in the circuit board during processing of the power module circuit board, and forms a circuit with the circuit board. Integrally, and after the processing of the circuit board is completed, forming an adhesive surface on the surface of the circuit board; another part of the magnetic core is exposed outside the circuit board; two parts of the magnetic core are in the During the assembly process of the board, the electrical connection is achieved by glue bonding.
- the power module provided by the embodiment of the present invention has a part of the magnetic core buried in the circuit board, and another part is exposed outside the circuit board, and the two parts of the magnetic core are electrically connected by glue bonding;
- the surface layer of the circuit board where the core region is located does not affect the layout of other components, which can save the layout space of the circuit board, provide a good solution for the high-density and miniaturization of the power module, and on the other hand, can solve the magnetic core through the heat sink. The problem of heat dissipation is difficult.
- a part of the magnetic core buried inside the circuit board forms a bonding surface on the surface of the circuit board lower than or is flush with the surface layer of the circuit board, thereby avoiding the circuit board manufacturing process or Damage to the core during board assembly.
- the core embedded in the circuit board is assembled when the power module circuit board is assembled.
- a part of the bonding surface formed on the surface of the circuit board is similar to the pad of the circuit board, and another part of the magnetic core exposed outside the circuit board is similar to the surface-mounting device of the circuit board, by using on the pad.
- the upper and lower parts of the magnetic core can be electrically connected by printing or dispensing, or by applying a layer of glue on the pad. Therefore, the magnetic core automatic surface mount can be realized, and the assembly cost can be reduced as compared with the current manual installation of the magnetic core.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI1106079A BRPI1106079B8 (pt) | 2010-10-27 | 2011-05-30 | método de fabricação de uma placa de circuito de módulo de energia, módulo de energia, e cerne magnético da mesma |
HU1200280A HU230993B1 (hu) | 2010-10-27 | 2011-05-30 | Eljárás tápegység modul áramköri lap előállítására, tápegység modul, valamint mágnesmag a tápegység modulhoz |
MX2011013414A MX2011013414A (es) | 2010-10-27 | 2011-05-30 | Metodo de fabricacion de una tarjeta de circuito de modulo de potencia, modulo de potencia y nucleo magnetico del mismo. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010521469A CN101980589B (zh) | 2010-10-27 | 2010-10-27 | 一种电源模块电路板的制作方法、电源模块及其磁芯 |
CN201010521469.1 | 2010-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011137845A1 true WO2011137845A1 (zh) | 2011-11-10 |
Family
ID=43601065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2011/074905 WO2011137845A1 (zh) | 2010-10-27 | 2011-05-30 | 一种电源模块电路板的制作方法、电源模块及其磁芯 |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN101980589B (zh) |
BR (1) | BRPI1106079B8 (zh) |
HU (1) | HU230993B1 (zh) |
MX (1) | MX2011013414A (zh) |
WO (1) | WO2011137845A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10308480B2 (en) | 2016-07-08 | 2019-06-04 | Otis Elevator Company | Embedded power module |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101980589B (zh) * | 2010-10-27 | 2012-10-17 | 华为技术有限公司 | 一种电源模块电路板的制作方法、电源模块及其磁芯 |
CN102325429B (zh) * | 2011-08-15 | 2016-09-14 | 深圳市核达中远通电源技术有限公司 | 一种粘结模块电源的上、下磁芯方法 |
CN102686025B (zh) * | 2012-05-07 | 2016-03-30 | 华为技术有限公司 | 电源模块的印刷电路板、电源模块及其制造方法 |
CN104183358B (zh) * | 2014-08-09 | 2017-12-12 | 乐清市华信电子有限公司 | 滤波模组 |
CN108471670B (zh) * | 2018-05-09 | 2024-07-12 | 天芯互联科技有限公司 | 一种埋入式电源模块结构及其制作方法 |
CN113194630B (zh) * | 2021-04-21 | 2023-10-27 | 深圳市汇川技术股份有限公司 | 平面磁件及其制作方法 |
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US6148500A (en) * | 1995-07-24 | 2000-11-21 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
US20090237899A1 (en) * | 2008-03-24 | 2009-09-24 | Asic Advantage Inc. | Semiconductor package with embedded magnetic component and method of manufacture |
CN100584144C (zh) * | 2007-02-09 | 2010-01-20 | 西安交通大学 | 一种用于开关电源模块的无源基板及其制备方法 |
CN101980589A (zh) * | 2010-10-27 | 2011-02-23 | 华为技术有限公司 | 一种电源模块电路板的制作方法、电源模块及其磁芯 |
Family Cites Families (5)
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US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
US6189203B1 (en) * | 1999-04-08 | 2001-02-20 | Lucent Technologies Inc. | Method of manufacturing a surface mountable power supply module |
US7468648B2 (en) * | 2004-03-10 | 2008-12-23 | Det International Holding Limited | Magnetic device |
JP5005427B2 (ja) * | 2007-05-25 | 2012-08-22 | 日本メクトロン株式会社 | 多層プリント配線板の製造方法 |
CN101778539B (zh) * | 2009-12-23 | 2011-11-09 | 深南电路有限公司 | 一种pcb加工工艺方法 |
-
2010
- 2010-10-27 CN CN201010521469A patent/CN101980589B/zh active Active
-
2011
- 2011-05-30 WO PCT/CN2011/074905 patent/WO2011137845A1/zh active Application Filing
- 2011-05-30 BR BRPI1106079A patent/BRPI1106079B8/pt active IP Right Grant
- 2011-05-30 MX MX2011013414A patent/MX2011013414A/es active IP Right Grant
- 2011-05-30 HU HU1200280A patent/HU230993B1/hu unknown
Patent Citations (4)
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US6148500A (en) * | 1995-07-24 | 2000-11-21 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
CN100584144C (zh) * | 2007-02-09 | 2010-01-20 | 西安交通大学 | 一种用于开关电源模块的无源基板及其制备方法 |
US20090237899A1 (en) * | 2008-03-24 | 2009-09-24 | Asic Advantage Inc. | Semiconductor package with embedded magnetic component and method of manufacture |
CN101980589A (zh) * | 2010-10-27 | 2011-02-23 | 华为技术有限公司 | 一种电源模块电路板的制作方法、电源模块及其磁芯 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10308480B2 (en) | 2016-07-08 | 2019-06-04 | Otis Elevator Company | Embedded power module |
US10919732B2 (en) | 2016-07-08 | 2021-02-16 | Otis Elevator Company | Embedded power module |
Also Published As
Publication number | Publication date |
---|---|
BRPI1106079B1 (pt) | 2020-10-20 |
BRPI1106079B8 (pt) | 2021-02-02 |
MX2011013414A (es) | 2012-02-21 |
CN101980589B (zh) | 2012-10-17 |
CN101980589A (zh) | 2011-02-23 |
HUP1200280A2 (en) | 2013-01-28 |
BRPI1106079A2 (pt) | 2016-05-10 |
HU230993B1 (hu) | 2019-08-28 |
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