WO2011081071A1 - 被洗浄物の洗浄方法、および該洗浄方法に用いる洗浄装置 - Google Patents
被洗浄物の洗浄方法、および該洗浄方法に用いる洗浄装置 Download PDFInfo
- Publication number
- WO2011081071A1 WO2011081071A1 PCT/JP2010/073177 JP2010073177W WO2011081071A1 WO 2011081071 A1 WO2011081071 A1 WO 2011081071A1 JP 2010073177 W JP2010073177 W JP 2010073177W WO 2011081071 A1 WO2011081071 A1 WO 2011081071A1
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- WIPO (PCT)
- Prior art keywords
- cleaning
- pressure
- kpa
- composition
- tank
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 503
- 238000000034 method Methods 0.000 title claims abstract description 194
- 239000000203 mixture Substances 0.000 claims abstract description 246
- 230000004907 flux Effects 0.000 claims abstract description 119
- 230000001965 increasing effect Effects 0.000 claims abstract description 24
- 238000007654 immersion Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 69
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 31
- 238000005406 washing Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 16
- -1 amine compound Chemical class 0.000 claims description 15
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 239000012459 cleaning agent Substances 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000006353 oxyethylene group Chemical group 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 3
- 230000009467 reduction Effects 0.000 abstract description 28
- 239000003599 detergent Substances 0.000 abstract description 10
- 230000008569 process Effects 0.000 description 118
- 238000012360 testing method Methods 0.000 description 65
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- 238000009835 boiling Methods 0.000 description 15
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- 239000004065 semiconductor Substances 0.000 description 9
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- 238000005187 foaming Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
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- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
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- 239000004094 surface-active agent Substances 0.000 description 6
- BVKSYBQAXBWINI-LQDRYOBXSA-N (2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-6-amino-2-[[(2s)-2-amino-5-(diaminomethylideneamino)pentanoyl]amino]hexanoyl]amino]-5-(diaminomethylideneamino)pentanoyl]amino]-3-hydroxypropanoyl]amino]-5-(diaminomethylideneamino)pentanoyl]amino]propanoy Chemical compound OC(=O)CC[C@@H](C(O)=O)NC(=O)[C@H](C)NC(=O)[C@H](CCCN=C(N)N)NC(=O)[C@H](CO)NC(=O)[C@H](CCCN=C(N)N)NC(=O)[C@H](CCCCN)NC(=O)[C@@H](N)CCCN=C(N)N BVKSYBQAXBWINI-LQDRYOBXSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000011086 high cleaning Methods 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000000543 intermediate Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 3
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229910052751 metal Chemical class 0.000 description 3
- 239000002184 metal Chemical class 0.000 description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 3
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 3
- DJQULQXOZQDEBV-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]-2-methylpropane Chemical compound COCCOCCOCC(C)C DJQULQXOZQDEBV-UHFFFAOYSA-N 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 2
- YJTIFIMHZHDNQZ-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]ethanol Chemical compound CC(C)COCCOCCO YJTIFIMHZHDNQZ-UHFFFAOYSA-N 0.000 description 2
- FETMDPWILVCFLL-UHFFFAOYSA-N 2-[2-(2-propan-2-yloxyethoxy)ethoxy]ethanol Chemical compound CC(C)OCCOCCOCCO FETMDPWILVCFLL-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
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- 235000011187 glycerol Nutrition 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 2
- MBRRDORCFVPYMA-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOC MBRRDORCFVPYMA-UHFFFAOYSA-N 0.000 description 1
- KODLUXHSIZOKTG-UHFFFAOYSA-N 1-aminobutan-2-ol Chemical compound CCC(O)CN KODLUXHSIZOKTG-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- JUXXCHAGQCBNTI-UHFFFAOYSA-N 1-n,1-n,2-n,2-n-tetramethylpropane-1,2-diamine Chemical compound CN(C)C(C)CN(C)C JUXXCHAGQCBNTI-UHFFFAOYSA-N 0.000 description 1
- HRWADRITRNUCIY-UHFFFAOYSA-N 2-(2-propan-2-yloxyethoxy)ethanol Chemical compound CC(C)OCCOCCO HRWADRITRNUCIY-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
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- 229940064004 antiseptic throat preparations Drugs 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
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- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
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- 239000003112 inhibitor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- CXKWCBBOMKCUKX-UHFFFAOYSA-M methylene blue Chemical compound [Cl-].C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 CXKWCBBOMKCUKX-UHFFFAOYSA-M 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 150000002780 morpholines Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/46—Specific cleaning or washing processes applying energy, e.g. irradiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Definitions
- the present invention relates to a method for cleaning an object to be cleaned to which a flux residue adheres, a method for manufacturing an electronic component using the cleaning method, and a cleaning apparatus used in the cleaning method.
- a cleaning composition for an object to be cleaned to which a flux residue is adhered a composition containing a glycol ether compound and an amine compound (see Patent Documents 1 and 2, etc.) and a composition further containing a surfactant A thing (refer patent documents 3 and 4 etc.) etc. are known.
- a cleaning method that alternately performs a plurality of times is a method of cleaning parts having gaps such as fine bag holes, and a pressure swing cleaning method that repeatedly performs decompression and normal pressure in the liquid tank (Patent Document) 6 etc.).
- a solvent naphtha-based cleaning liquid is used as the cleaning composition.
- a surfactant diluted solution is used as a cleaning composition, and after the pressure in the liquid tank is reduced to a desired pressure, the control valve is immediately switched to maintain the pressure in the liquid tank at normal pressure. Returned.
- JP-A-9-87668 JP 2009-41094 A JP-A-4-57897 JP-A-3-227400 Japanese Patent Laid-Open No. 2001-170577 JP-A-6-296940
- a space Gap
- solder used for mounting the component contains flux, but after soldering, if the flux remains as a residue in the gap for a long time, migration or the like occurs, causing a short circuit between the electrodes. Become.
- the present invention is not only high in cleaning properties for flux residues present in narrow gaps, but also has good rinsing properties with water, foaming is suppressed, and a cleaning method for an object to be cleaned to which flux residues are attached, and the cleaning An electronic component manufacturing method using the method is provided.
- the method for cleaning an object to be cleaned to which a flux residue is attached includes a cleaning step of cleaning the object to be cleaned to which a flux residue is attached using a cleaning composition.
- the cleaning process includes an immersion process (first process) in which an object to be cleaned with a flux residue attached is immersed in the cleaning composition contained in a cleaning tank capable of adjusting pressure, and a pressure in the cleaning tank.
- the pressure reducing step (second step) for reducing the pressure to a pressure P 1 (kPa) satisfying the following formula (1), and the pressure in the cleaning tank reduced in the pressure reducing step to P 1 ⁇ 0.4 (kPa)
- the reduced pressure holding step third step for continuously holding the temperature of the cleaning composition in the cleaning tank at 50 to 70 ° C.
- a pressure increasing step for setting the pressure in the cleaning tank to a pressure P 2 (kPa) that satisfies the following formula (2).
- the second to fourth steps are performed for 10 to 220 seconds.
- water (component A) is 2 wt% or more and 10 wt% or less
- glycol ether component B
- the amine compound is 0.8 wt%.
- the component B is represented by the following general formula (1).
- R 1 is an alkyl group having 1 to 6 carbon atoms
- R 2 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- EO is an oxyethylene group
- m is an average addition mole of EO. Number and satisfy 2 ⁇ m ⁇ 3.
- the component C is represented by the following general formula (2).
- R 3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- EO represents an oxyethylene group
- p and q each represents an average added mole number of EO, and 1 ⁇ p + q ⁇ 4 is satisfied.
- the method for producing an electronic component including a solder bump according to the present invention is derived from the flux by a step of forming a solder bump using a solder flux including a flux on a substrate of the electronic component, and the method for cleaning an object to be cleaned according to the present invention. Cleaning the flux residue.
- the cleaning apparatus of the present invention is a cleaning apparatus used in the method for cleaning an object to be cleaned of the present invention
- a water control mechanism is provided for adjusting the content of the water (component A) in the cleaning composition in the cleaning tank to 2 wt% or more and 10 wt% or less.
- a specific detergent composition is used.
- a series of steps including the pressure reduction step, the pressure reduction holding step, and the pressure increase step in this order is defined as one cycle, and this one cycle is performed within a specific time, the physical force generated due to the pressure change and the pressure reduction
- the physical force generated due to the boiling of the cleaning composition during the holding step acts on the flux residue existing in the narrow gap of the object to be cleaned. Therefore, not only the cleaning performance for the flux residue present in the narrow gap is high, but also the rinsing performance with water is good and the foaming is suppressed, and the cleaning method for the object to be cleaned to which the flux residue is adhered, and A method for manufacturing an electronic component including solder bumps using a cleaning method can be provided.
- FIG. 1A is a conceptual plan view of a test piece used for evaluating the cleaning property of a cleaning composition against a flux residue.
- FIG. 1B is a conceptual side view of the test piece shown in FIG. 1A.
- FIG. 2 is a schematic view of a pressure-adjustable cleaning tank used for the foamability test of the cleaning composition.
- FIG. 3 is a conceptual diagram of the cleaning apparatus used in the examples.
- flux refers to a rosin flux mainly containing rosin or a rosin derivative used for soldering.
- soldering includes reflow and flow soldering.
- solder flux refers to a mixture of solder and flux
- flux residue refers to a flux-derived residue remaining on a substrate or the like after soldering using flux or solder flux.
- soldder includes lead (Pb) -containing solder and Pb-free solder.
- “physical force generated due to boiling of the cleaning composition” refers to physical force due to convection caused by boiling of water contained in the cleaning composition
- “Boiling” means the boiling of water contained in the cleaning composition. Therefore, the larger the content of water in the cleaning composition, the larger the physical force, and the smaller the content of water in the cleaning composition, the smaller the physical force.
- cleaning method In the method for cleaning an object to which the flux residue adheres according to the present invention (hereinafter sometimes simply referred to as “cleaning method”), a specific glycol ether and a specific amine compound are contained in specific amounts, respectively, and water A series of steps including a decompression step, a decompression holding step, and a pressurization step in this order are performed within a predetermined time using a cleaning composition having a content of 2% by weight or more and 10% by weight or less.
- the cleaning performance with respect to the flux residue existing in the narrow gap becomes higher. Therefore, if the cleaning method of the present invention is used in the manufacturing process of electronic parts including solder bumps, it can be expected that the productivity and reliability of the electronic parts are improved.
- a cleaning process for example, a cleaning process, a rinsing process for rinsing an object to be cleaned using a rinse agent composition, and a drying process are performed in this order.
- An object to be cleaned to which the cleaning method of the present invention is preferably used is a manufacturing intermediate including a circuit board or the like and a component soldered to the circuit board or the like, and a flux is provided in a gap between the circuit board and the component.
- the thing containing a residue is mentioned.
- Manufacturing intermediates are intermediates in the manufacturing process of electronic components such as semiconductor packages and semiconductor devices. For example, semiconductor chips, chip-type capacitors, and other circuit boards by soldering using flux on a circuit board. Including those equipped with.
- the gap in the object to be cleaned is, for example, a space formed between the circuit board and the component mounted on the circuit board by soldering, and its height (the shortest distance between the circuit board and the component) For example, a space of 5 to 500 ⁇ m, 10 to 250 ⁇ m, or 20 to 100 ⁇ m.
- the width and depth of the gap depend on the size and interval of the components to be mounted and the electrodes (lands) on the circuit board, but the width is, for example, 130 to 20000 ⁇ m or 130 to 10,000 ⁇ m, and the depth is 130 to 25000 ⁇ m. Or 130 to 10000 ⁇ m.
- the cleaning step is an immersion step (the immersion step is also referred to as a “first step”) in which an object to be cleaned, to which the flux residue is attached, is immersed in a cleaning agent composition described later housed in a pressure-adjustable cleaning tank.
- a depressurization step (the depressurization step is also referred to as a “second step”) until the pressure in the cleaning tank reaches a predetermined value, and the pressure in the cleaning tank depressurized in the depressurization step within a predetermined pressure range.
- the pressure reduction holding process (a pressure reduction holding process is also called “the 3rd process”) which hold
- the process includes a pressure increasing process (this process is also referred to as “fourth process”) in which the pressure in the cleaning tank is increased to a predetermined value.
- the cleaning step may further include a post-pressurization pressure holding step (step 4a) and / or a fifth step.
- the 4a process is performed after the 4th process, and when the cleaning process includes the 5th process, it is performed before the 5th process.
- the pressure in the cleaning tank is continuously maintained within a predetermined pressure range for a predetermined time.
- the fifth process is performed after the fourth process, and when the cleaning process includes the fourth process, the fifth process is performed after the fourth process.
- a series of steps including at least the second step to the fourth step in this order is further repeated 1 to 50 times.
- the cleaning step may be performed using one cleaning tank, or may be performed using two or more cleaning tanks.
- the first step is not performed in the fifth step, and the second to fourth steps may be repeated 1 to 50 times.
- the first to fourth steps may be repeated 1 to 50 times in the fifth step, or the fifth step.
- the number of repetitions is X
- the first to fourth steps are repeated Y (where Y ⁇ X) times
- the second to fourth steps are repeated (XY) times. Also good.
- a series of steps from the second step to the fourth step that is, the second step to the fourth step is performed in 10 to 220 seconds, but the flux present in a narrow gap From the viewpoint of improving the cleaning performance for residues and shortening the cleaning time, it is preferably 15 to 100 seconds, more preferably 15 to 50 seconds, and even more preferably 15 to 40 seconds.
- the filling amount of the cleaning composition in the washing tank is not particularly limited as long as the washing object can be immersed therein.
- the washing tank for example, a pressure vessel provided with a heating means, an ultrasonic vibrator, or the like can be used.
- the inside of the cleaning tank communicates with an air pipe connected to a suction device such as a vacuum pump, and the air pipe includes a branch pipe that is not connected to the suction device.
- a suction device such as a vacuum pump
- the air pipe includes a branch pipe that is not connected to the suction device.
- opening / closing the switching control valve provided in the branch pipe By opening / closing the switching control valve provided in the branch pipe, the inside of the cleaning tank can be reduced to a desired pressure or increased to a desired pressure.
- An example of such a cleaning tank is disclosed in, for example, JP-A-6-296940.
- the temperature of the cleaning composition filled in the cleaning tank is preferably 50 to 70 ° C., more preferably 55 to 70 ° C. immediately before the start of pressure reduction, from the viewpoint of improving the cleaning property. More preferably, it is 60 to 70 ° C.
- the cleaning composition adjusted to 10 to 40 ° C. is filled in the cleaning tank and then heated to a temperature within the above preferred range.
- the cleaning composition may be heated using a heating means provided in the cleaning tank as necessary.
- the temperature of the cleaning composition is measured by a thermometer installed in the cleaning tank.
- the inside of the cleaning tank is preferably 0.1 to 6 (kPa), more preferably from the viewpoint of improving the cleaning performance against the flux residue existing in the narrow gap of the object to be cleaned and shortening the cleaning time. More preferably, the pressure is reduced until a pressure in the range of 0.1 to 5 (kPa), more preferably 0.1 to 4 (kPa) is reached.
- the cleaning composition can be forcibly put into the narrow gap by reducing the pressure, so that air that hinders contact between the flux residue existing in the narrow gap and the cleaning composition can be expelled from the gap. And the dissolved gas contained in a cleaning composition can also be deaerated. Therefore, the cleaning method of the present invention is suitable as a cleaning method for flux residue that has entered a narrow gap.
- the depressurization time required for setting the pressure in the cleaning tank to P 1 (kPa) is a cleaning from the viewpoint of both improving the cleaning performance for the flux residue existing in the narrow gap and shortening the cleaning time. It is more preferably 1 second or more and 120 seconds or less from the start of pressure reduction in the tank, more preferably 1 second or more and 60 seconds or less, further preferably 1 second or more and 30 seconds or less, and more preferably 1 second or more and 15 seconds or less. Is more preferable.
- the pressure reduction rate at which the pressure in the cleaning tank is set to P 1 is 15 to 30 (from the viewpoint of improving the cleaning performance against the flux residue existing in the narrow gap and shortening the cleaning time.
- kPa / s preferably 17 to 30 (kPa / s), and more preferably 18 to 30 (kPa / s).
- the temperature of the cleaning composition in the second step is a viewpoint of improving the cleaning performance for the flux residue existing in the narrow gap, more specifically, obtaining a high physical force by boiling the cleaning composition and the cleaning composition.
- the evaporation of water in the product is suppressed, that is, from the viewpoint of suppressing the decrease in the cleaning property due to the change in the composition of the cleaning composition by suppressing the decrease in the water in the cleaning tank. It is preferably ⁇ 70 ° C., more preferably 55 to 70 ° C., and further preferably 60 to 70 ° C.
- the cleaning composition may be heated using a heating means provided in the cleaning tank as necessary.
- the said temperature of the cleaning composition in a 2nd process is an average value of the temperature measured, for example for every second with the thermometer installed in the washing tank. This average value can be determined by a formula for calculating the average temperature of the cleaning composition in the third step described later.
- the pressure in the cleaning tank reduced in the pressure reducing process is set to P 1 ⁇ 0.4 kPa
- the temperature of the cleaning composition in the cleaning tank is set to 50 to 70 ° C., 8 Hold continuously for ⁇ 16 seconds.
- the pressure in the cleaning tank needs to be 0.1 to 7 (kPa) from the viewpoint of maintaining a stable boiling state of the cleaning composition, but from the same point of view, the third step
- the fluctuation range of the pressure in the washing tank is preferably P 1 ⁇ 0.3 (kPa), more preferably P 1 ⁇ 0.2 (kPa), and P 1 ⁇ 0.1 (kPa). More preferably. That is, the pressure in the cleaning tank during the reduced pressure holding step is preferably substantially constant, and more preferably constant.
- the pressure in the washing tank is measured with a manometer.
- the temperature of the cleaning composition in the third step is 50 to 70 ° C. when the pressure in the cleaning tank is P 1 ⁇ 0.4 (kPa) from the viewpoint of maintaining a stable boiling state of the cleaning composition.
- the pressure P 1 in the cleaning tank is 50 to 70 ° C. when the pressure P 1 is 0.1 to 5 (kPa).
- the pressure P 1 in the washing tank is more than 5 kPa and 7 kPa or less, it is preferably 60 to 70 ° C.
- the temperature of the cleaning composition in the third step can be varied within a temperature range of 50 to 70 ° C., but the fluctuation range is the third from the viewpoint of maintaining a stable boiling state of the cleaning composition.
- the average value of the temperature of the cleaning composition in the process is preferably within ⁇ 1.0 ° C., more preferably within ⁇ 0.5 ° C., and further preferably within ⁇ 0.2 ° C. That is, in the cleaning method of the present invention, the temperature of the cleaning composition during the third step is preferably substantially constant, and more preferably constant.
- the temperature Ti of the cleaning composition during the third step is measured, for example, every second by a thermometer installed in the cleaning tank.
- the boiling state of the cleaning composition is 8 seconds or more from the viewpoint of improving the cleaning property for the flux residue existing in the narrow gap.
- the time for maintaining the reduced pressure (the time of the third step) needs to be 16 seconds or less. Therefore, the holding time of the reduced pressure is 8 to 16 seconds from the viewpoint of achieving both improvement of the cleaning property for the flux residue existing in the gap and shortening of the cleaning time, and for the same reason, the holding time is 8 to 15 seconds.
- 9 to 13 seconds are more preferable.
- Time decompression of holding, in the second step the pressure in the cleaning tank is calculated from the time it reaches the P 1.
- P 1 is 5 (kPa)
- P 1 is 5 (kPa)
- the time for holding the reduced pressure is measured.
- the third step even if the pressure in the cleaning tank rises or falls, if the pressure is in the range of P 1 ⁇ 0.4 (kPa), the pressure in the cleaning tank is maintained in a reduced pressure state. Calculate the retention time of the vacuum.
- the third step while applying ultrasonic vibration to the cleaning composition.
- the flux residue and the cleaning composition are brought into good contact with each other, and the dissolved gas in the cleaning composition is degassed.
- it is preferable to apply ultrasonic vibration to the cleaning composition since the cleaning performance with respect to the flux residue existing in the gap is improved, and therefore the cleaning time can be expected to be shortened.
- the frequency of ultrasonic waves and the energy density of ultrasonic waves applied to the cleaning composition in the third step are 20 to 400 kHz from the viewpoint of improving the cleaning performance against the flux residue existing in the gap and suppressing damage to the object to be cleaned.
- 0.1 to 4.0 W / cm 2 is preferable, and 35 to 200 kHz and 0.2 to 2.0 W / cm 2 are more preferable.
- the application of the ultrasonic vibration can be performed by, for example, an ultrasonic vibrator arranged in the cleaning tank.
- application of ultrasonic vibration to the cleaning composition is not limited to only during the third step.
- the application of ultrasonic vibration to the cleaning composition may be performed during at least one of the first to fifth steps.
- the application of ultrasonic vibration to the cleaning composition is preferably carried out in all steps from the first step to the fifth step from the viewpoint of improving the detergency of the flux residue present in the gap.
- the pressure in the cleaning tank is preferably a pressure in the range of 50 to 102 kPa, and a pressure in the range of 80 to 102 kPa, from the viewpoint of improving the cleaning performance for the flux residue present in the gap. It is more preferable that the pressure is normal pressure. Note that the normal pressure is a pressure when neither depressurizing nor pressurizing, and is usually equal to the atmospheric pressure and is approximately 1 atm (101.3 (kPa)).
- the pressurization time required for setting the pressure in the cleaning tank to P 2 (kPa) is the cleaning from the viewpoint of both improvement of the cleaning performance for the flux residue existing in the narrow gap and reduction of the cleaning time. It is preferably 1 second or more and 60 seconds or less from the start of pressure increase in the tank, more preferably 1 second or more and 30 seconds or less, and further preferably 1 second or more and 10 seconds or less.
- the temperature of the cleaning composition in the fourth step is preferably equal to the temperature of the cleaning composition in the third step described above from the viewpoint of enhancing the cleaning performance for the flux residue present in the narrow gap, specifically, Is preferably 50 to 70 ° C., more specifically, more preferably the same temperature as the holding temperature in the third step.
- the cleaning composition may be heated using a heating means provided in the cleaning tank as necessary.
- the said temperature of the cleaning composition in a 4th process is an average value of the temperature measured every second, for example with the thermometer installed in the washing tank. This average value can be calculated
- Step 4a The cleaning method of the present invention is performed after the fourth step and before the fifth step, which will be described later, from the viewpoint of improving the cleaning performance with respect to the flux residue existing in the narrow gap, and the pressure P 3 in the cleaning tank is set to 50 to 120.
- a pressure in the range of (kPa), P 2 ⁇ 0.4 (kPa) is equal to or P 2 ⁇ 0.4 (kPa) boosted pressure holding step of holding 8-16 seconds at a higher pressure than the (This step is also referred to as “step 4a”).
- the cleaning method of the present invention preferably includes the fourth step a from the viewpoint of improving the cleaning performance.
- the cleaning tank in the fourth step is opened to balance the pressure in the cleaning tank with the pressure outside the cleaning tank, and the inside of the cleaning tank What is necessary is just to maintain the equilibrium state of the pressure of this and the pressure outside a washing tank for a predetermined time.
- the temperature of the cleaning composition in the cleaning tank is particularly efficient when repeated cleaning is performed when the pressure in the cleaning tank in the third step is P 1 ⁇ 0.4 (kPa). In view of the above, it is preferably 50 to 70 ° C.
- the temperature of the cleaning composition in the cleaning tank in step 4a may vary within the range of 50 to 70 ° C., but is more preferably the same temperature as the cleaning composition in step 4a. .
- the said temperature of the cleaning composition in a 4th process is an average value of the temperature measured, for example every second with the thermometer installed in the washing tank. This average value can be calculated
- the time for maintaining the pressure P 3 in the cleaning tank at P 2 ⁇ 0.4 (kPa) or higher than P 2 ⁇ 0.4 (kPa) in the range of 50 to 120 kPa is as follows: From the viewpoint of achieving both improvement in cleaning performance for flux residue present in the gap and shortening of the cleaning time, it is preferably 8 to 18 seconds, more preferably 8 to 16 seconds, and 9 to 16 seconds. Further preferred.
- the cleaning method of the present invention includes the step 4a, if the series of steps consisting of the second step to the step 4a is set as one cycle, the cleaning performance for the flux residue existing in the narrow gap is improved and the cleaning time is shortened.
- the one cycle is preferably performed for 20 to 230 seconds, more preferably 25 to 110 seconds, more preferably 25 to 60 seconds, and further preferably 25 to 50 seconds.
- the cleaning method of the present invention preferably includes a step (fifth step) in which the second to fourth steps are further repeated 1 to 50 times from the viewpoint of improving the cleaning performance for the flux residue existing in the narrow gap.
- the second to fourth steps that are repeatedly performed in the fifth step may be performed under the same conditions as the second to fourth steps that are performed before the fifth step.
- the pressure in the cleaning tank is set to 0.1 to 6 (kPa) in the repeated second step.
- the pressure is preferably reduced until reaching a pressure within the range of 1), the pressure reduction time is preferably from 1 second to 120 seconds from the start of pressure reduction, and the temperature of the cleaning composition is preferably from 50 to 70 ° C.
- the pressure in the cleaning tank it is preferable to maintain the pressure in the cleaning tank at a pressure of P 1 ⁇ 0.4 (kPa), and the pressure in the cleaning tank is set to P 1 ⁇ 0.
- the temperature of the cleaning composition is preferably 50 to 70 ° C. when the pressure in the cleaning tank is P 1 ⁇ 0.4 (kPa).
- the temperature of the agent composition is more preferably constant, and the holding time of reduced pressure is preferably 8 to 16 seconds.
- the pressure reached by the pressure increase is preferably normal pressure, and the temperature of the cleaning composition is preferably 50 to 70 ° C.
- a step (first step) of immersing the object to be cleaned in the cleaning composition is further required.
- “Step of repeating steps 2 to 4 1 to 50 times” is read as “step of repeating steps 1 to 4 1 to 50 times”.
- the washing method of this invention includes the said 4a process, it is preferable to perform the 4a process also after each 4th process performed in a 5th process.
- the fifth step includes the step 4a, it is preferable that the step 4a is performed after at least one repeated cycle when the second to fourth steps to be repeated are one cycle, and there is a narrow gap.
- step 4a it is more preferable to perform the step 4a after all the cycles in the fifth step, from the viewpoint of both improvement of the washing performance for the flux residue and shortening of the cleaning time. That is, in the fifth step, it is preferable to repeat at least one cycle consisting of the second step to the fourth step 1 to 50 times, and preferably repeating one cycle consisting of the first step to the fourth step 1 to 50 times. Alternatively, it is preferable that one cycle including the second step to the fourth step a is repeated 1 to 50 times.
- the number of repetitions (the above-mentioned number of cycles in the fifth step) varies depending on the gap shape of the article to be cleaned and the state of the flux residue, but 1 to 40 times from the viewpoint of improving the washability and productivity for the flux residue present in the gap. Is preferably 2 to 35 times, more preferably 3 to 30 times.
- water may be added to the cleaning composition in the cleaning tank during the cleaning process for cleaning one object to be cleaned.
- water is added to the cleaning composition in the cleaning tank during and / or before the cleaning process for cleaning each object to be cleaned. May be added.
- the cleaning composition is boiled, particularly in the fifth step, the water content in the cleaning composition is reduced while the second to fourth steps are repeated. There is.
- the concentration of water in the cleaning composition is measured, for example, with a moisture meter such as a moisture sensor, and cleaning is performed based on the measured value. What is necessary is just to replenish water to the cleaning composition in a tank. In order to accurately measure the concentration of water in the cleaning composition, it is preferable that the concentration of water is measured while the cleaning composition is stirred by a stirrer, a circulation pump, an ultrasonic vibrator, or the like.
- any of a near-infrared spectroscopic type, a capacitance conductivity type, and a conductivity type may be used, for example.
- the replenishment of water to the cleaning composition in the cleaning tank is, for example, a cleaning composition in a sub tank equipped with an electromagnetic valve that is connected to the cleaning tank and opens and closes according to a measured value by a moisture sensor provided in the cleaning tank. This can be done by circulating the product and the cleaning composition in the cleaning tank.
- water supply is performed, for example, while the objects to be cleaned are pulled up from the cleaning tank and drained in order to move the objects to be rinsed.
- the moisture sensor is preferably provided not only in the cleaning tank but also in the sub tank.
- Such adjustment of the water content in the cleaning composition can be performed using a cleaning apparatus as shown in FIG. 3, for example.
- the cleaning device is stored in the cleaning tank 11 and a pressure adjusting unit (not shown) that can store the cleaning composition inside and can adjust the internal pressure.
- a cleaning tank 11 including a moisture meter 15 that can measure the concentration of water in the cleaning composition, a sub tank 14 that can store the cleaning composition, and the cleaning tank 11 and the sub tank 14 can communicate with each other.
- a circulation pipe 18 provided with a valve 17 (for example, an electromagnetic valve) that can open and close the flow path according to the measured value by the meter 15, and the cleaning composition in the cleaning tank 11 according to the measured value by the moisture meter 15.
- a liquid feeding section (a pump or the like, not shown) for circulating the cleaning composition in the sub tank 14 through the circulation pipe 18.
- the valve 17 is opened and the liquid feeding unit is operated, so that the concentration of water in the cleaning composition in the cleaning tank 11 is predetermined.
- the cleaning agent composition in the sub tank 14 and the cleaning composition in the cleaning tank 11 can be circulated through the circulation line 18 until the value is within the range.
- the predetermined range needs to be 2% by weight or more and 10% by weight or less from the viewpoint of ensuring high detergency against the flux residue, but is preferably 3 to 8% by weight from the same viewpoint. More preferred is 7% by weight.
- the value within the predetermined range is preferably the initial value of the concentration of water in the cleaning composition in the cleaning tank 11.
- the moisture control mechanism is composed of a sub-tank 14, a moisture meter 15, and a circulation line 18 provided with a valve 17. It is preferable that not only the cleaning tank 11 but also the sub tank 14 includes a moisture meter 16.
- cleaning apparatus may further contain the 1st rinse tank 12 which pre-rinses with respect to the to-be-washed
- the cleaning composition can be used for cleaning other objects to be cleaned, which is economical.
- the cleaning step is performed before the first step, for example, in a cleaning composition contained in a cleaning tank separate from the cleaning tank in which the first to fifth steps are performed. You may further include the process of immersing a thing for a fixed period.
- the cleaning composition may be the same as the cleaning composition described later used in the first to fourth steps, or a conventionally known flux residue other than the cleaning composition described later is attached.
- a cleaning composition for cleaning an object to be cleaned may be used.
- the immersion time in the cleaning composition is preferably 1 to 10 minutes, for example.
- the rinsing step is a step of rinsing dirt such as a cleaning agent composition adhering to the object to be cleaned, a residual flux residue, or a redeposited flux residue, and the cleaning method of the present invention includes steps 4a and 5
- the cleaning method of the present invention includes the fourth step, but when the fifth method is not included, the cleaning method of the present invention includes the fifth step after the fourth step. In the case, it is performed after the fifth step.
- the rinsing step may be performed using one rinsing tank, or may be performed using two or more rinsing tanks.
- the rinsing process can be performed by performing the same process as the first to fourth processes in the cleaning process, except that the cleaning composition is replaced with a rinsing composition. That is, in an example of the rinsing process, after the object to be cleaned that has undergone the cleaning process is immersed in the rinse agent composition accommodated in the rinsing tank, a series of processes including a decompression process, a decompression holding process, and a pressurization process in this order are performed. Do.
- the series of steps may include a step corresponding to the step 4a (post-pressurization pressure holding step) in the cleaning step.
- the cleaning composition used in the fifth step in the cleaning step is replaced with the rinsing agent composition, and a series of steps including a pressure reduction step, a pressure reduction holding step, and a pressure increase step are repeated. More preferably, a series of steps including a reduced pressure holding step, a pressure increasing step, and a post pressure rising pressure holding step are repeated. Conditions such as temperature, pressure, time, number of cycles, time taken for one cycle, application of ultrasonic vibration, and the like in each step may be the same as those in the cleaning step.
- the number of repetitions of the second to fourth steps or the number of repetitions of the second to fourth steps in the rinsing step may be determined as appropriate according to the degree of the stain, but both good rinsing properties and improvement in productivity are compatible. In view of the above, it is preferably 1 to 50 times, more preferably 1 to 40 times, still more preferably 2 to 35 times, and even more preferably 3 to 30 times.
- the total number of rinses performed in each rinse tank may be the above number.
- the rinse agent composition usually, water, preferably ion-exchanged water or the like is used for the rinse agent composition.
- the rinse agent composition can be obtained by mixing a detergent composition described later and water, preferably ion-exchanged water. It is preferable to use a diluted solution of the cleaning composition.
- the rinse step includes a rinse step using the diluted solution and a final rinse step using water, preferably ion exchange water, as the rinse agent composition.
- the rinsing process using the diluent is referred to as a pre-rinsing process.
- Each of the pre-rinsing process and the finishing rinsing process can be performed using, for example, a cleaning tank similar to the cleaning tank used in the cleaning process as the rinse tank.
- the content of effective components other than water of the cleaning composition in the rinsing composition used in the pre-rinsing process is not particularly limited unless dirt and / or the cleaning composition remains on the object to be cleaned after the finishing rinsing process. Although there is no limitation, it is preferably 0.0001 to 10% by weight, more preferably 0.0001 to 8% by weight, and further preferably 0.0001 to 5% by weight.
- a cleaning agent composition for cleaning an object to be cleaned to which a conventionally known flux residue is attached other than the cleaning agent composition described later may be included.
- the water content in the rinsing agent composition is the residual flux residue or redeposition. 90 to 99.9999% by weight, more preferably 92 to 99.9999% by weight, and 95 to 99.9999% by weight from the viewpoint of improving the rinsing performance of dirt such as flux residue. And more preferred.
- the temperature of the rinse agent composition is preferably 50 to 70 ° C. from the viewpoint of improving rinsing properties.
- ultrasonic vibration it is preferable to apply ultrasonic vibration to the rinse agent composition from the viewpoint of improving rinsing properties.
- ultrasonic vibration is applied to the rinse agent composition in the third step of the rinse step, air existing in the gap is expelled from the gap through the second step, so that the dirt and the rinse agent composition are in good contact with each other.
- ultrasonic vibration is applied to the rinse agent composition from which the dissolved gas has been degassed, the removal of dirt existing in the gaps is improved. Therefore, it is preferable to apply ultrasonic vibration to the rinsing agent composition in the third step of the rinsing step because the rinsing time can be shortened.
- the frequency of ultrasonic waves and the energy density of ultrasonic waves may be the same as those applied to the cleaning composition in the third step.
- the rinse agent composition adhering to the surface is removed and then transported into a vacuum drying container. Is done.
- the temperature in the vacuum drying container is set to 50 to 100 ° C., for example, and the pressure in the vacuum drying container is reduced to 0.1 to 5 (kPa). Drying with a vacuum drying container may be performed, for example, for 1 to 30 minutes.
- the cleaning method of the present invention includes one or more cleaning steps, for example, a rinsing step including a pre-rinsing step and a finishing rinsing step, and a drying step that are continuously performed in this order.
- a rinsing step including a pre-rinsing step and a finishing rinsing step
- a drying step that are continuously performed in this order.
- An example of such equipment is disclosed in, for example, JP-A-6-296940.
- the cleaning composition in the present invention contains water (component A), a specific glycol ether (component B), and a specific amine compound (component C).
- Ingredient A consists of water, such as distilled water, ion-exchange water, or ultrapure water.
- the content of water in the cleaning composition is required to be 2% by weight or more and 10% by weight or less from the viewpoint of ensuring a high cleaning performance against the flux residue, but from the same viewpoint, it is 3 to 8% by weight. It is preferably 4 to 7% by weight.
- the present invention provides a cleaning method for reducing pressure, maintaining a reduced pressure state, and increasing pressure, and preferably having a water content in a cleaning composition used in a cleaning method for repeatedly decreasing pressure, maintaining a reduced pressure state, and increasing pressure.
- One of the characteristics is that it is in a specific range of 2 wt% to 10 wt%.
- a narrow gap that has conventionally been difficult to remove due to a physical force generated due to pressure change due to reduced pressure and increased pressure and a physical force generated due to boiling of the cleaning composition during the reduced pressure holding process.
- the flux residue can be dramatically removed.
- the content of water in the cleaning composition is determined by paying attention to the physical force generated due to the boiling of the cleaning composition. If the water content is less than 2% by weight, the physical force due to boiling is insufficient, and if it exceeds 10% by weight, the solubility of the flux residue is inferior, so that sufficient detergency cannot be obtained anyway.
- Component B consists of glycol ether represented by the following general formula (1).
- R 1 is an alkyl group having 1 to 6 carbon atoms
- R 2 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- EO is an oxyethylene group
- m is an average of EO Indicates the number of added moles and satisfies 2 ⁇ m ⁇ 3.
- the number of carbon atoms of R 1 is preferably 2 to 4, and more preferably 3 to 4, from the viewpoint of ensuring high detergency against the flux residue and high safety.
- a monoalkyl type glycol having an average addition mole number m of EO of 2 from the viewpoint of improving the solubility of the flux residue in the cleaning composition.
- Ether monoalkyl type glycol ether with an average addition mole number m of EO of 3
- These glycol ethers may be used alone or in combination of two or more.
- Examples of the monoalkyl type glycol ether having an average addition mole number m of EO of 2 include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monohexyl ether and the like. .
- Examples of the monoalkyl type glycol ether having an average added mole number m of EO of 3 include triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether and the like.
- dialkyl type glycol ethers having an average addition mole number m of EO of 2 include diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl propyl ether, diethylene glycol diethyl ether, diethylene glycol methyl butyl ether, diethylene glycol butyl methyl ether, and diethylene glycol methyl isobutyl ether. Can be mentioned.
- dialkyl type glycol ether having an average added mole number m of EO of 3 examples include triethylene glycol dimethyl ether.
- glycol ethers diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monomono ether from the viewpoints of improving safety, exhibiting high water solubility, and enhancing the solubility of flux residues.
- the content of component B in the cleaning composition is required to be 50% by weight or more and less than 97.75% by weight from the viewpoint of improving the cleaning performance with respect to the flux residue remaining in the narrow gap, but from the same viewpoint 60 to less than 97.75% by weight, more preferably 80 to 97.25% by weight.
- Component C consists of an amine compound represented by the following general formula (2).
- R 3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- EO represents an oxyethylene group
- p and q each represents an average added mole number of EO, and 1 ⁇ p + q ⁇ 4 is satisfied.
- the number of carbon atoms in R 3 is preferably 1 to 3 from the viewpoint of improving the washing performance and rinsing performance for the flux residue remaining in the gap.
- p + q satisfies 1 ⁇ p + q ⁇ 4, and more preferably satisfies 1 ⁇ p + q ⁇ 3 from the viewpoint of improving detergency against the flux residue remaining in the gap.
- component C represented by the general formula (2) examples include monoethanolamine, diethanolamine, methyldiethanolamine, and methylmonoethanol from the viewpoints of improvement of rinsing properties and improvement of detergency against the flux residue remaining in the gap.
- alkylolamines such as amines and ethyl monoethanolamine.
- the content of the component C in the cleaning composition is required to be 0.05% by weight or more and 5% by weight or less from the viewpoint of improving the rinsing property and improving the cleaning property with respect to the flux residue remaining in the gap. 0.5 to 1.5% by weight is preferable.
- the weight ratio of component B to component C is preferably 20 to 99 from the viewpoint of improving detergency against the flux residue remaining in the gap, more preferably 94 to 98, 95 -97 are more preferred.
- the weight ratio of component B to component A is preferably 20 to 99 from the viewpoint of improving detergency against the flux residue remaining in the gap, more preferably 20 to 50, and more preferably 30 to 50 Is more preferable.
- the weight ratio of the weight of component B to the total weight of component A and component C ⁇ component B / [component A + component C] ⁇ is 10 to 50 from the viewpoint of improving detergency against the flux residue remaining in the gap. Some are preferred, but 15 to 35 are more preferred, and 23 to 33 are even more preferred.
- the cleaning composition may contain the following surfactant (component D).
- the content of component D in the cleaning composition is preferably less than 0.01% by weight from the viewpoint of suppression of foaming properties, and from the same viewpoint, 0.005% by weight or less is preferable, and substantially It is more preferable not to include it, and it is even more preferable not to include it.
- component D include non-oxygenated polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene carboxylic acid ester, polyoxyethylene polyoxypropylene carboxylic acid ester, polyoxyethylene polyoxypropylene copolymer and the like.
- examples thereof include ionic surfactants.
- the cleaning composition has high cleaning performance against flux residue present in a narrow gap, good rinsing with water, and low foaming properties, which are exhibited when an object to be cleaned is cleaned with the cleaning composition.
- the amine compound other than Component C may contain morpholines such as morpholine and ethylmorpholine; piperazine, triethyldiamine, pentamethyldiethylenetriamine, tetramethylpropylenediamine and the like.
- the cleaning composition is usually used in the cleaning composition as necessary, chelating agents, antiseptics, rust inhibitors, bactericides, antibacterial agents, antioxidants, esters, and glycerin. Or at least one selected from the group consisting of alcohols such as polyethylene glycol.
- the total content of the other optional components in the cleaning composition is preferably 45% by weight or less, and preferably 20% by weight or less, from the viewpoint of improving the cleaning property with respect to the flux residue remaining in the gap. More preferably, 0.1% by weight or less is further preferable, and 0.05% by weight or less is even more preferable.
- the preparation method of a cleaning composition is not restrict
- a container for mixing each component a container made of SUS, a container made of GS (glass lining), or the like can be used.
- a stirring blade such as a propeller blade, a pitched paddle, or a max blend, or magnetic A stirrer or the like can be used.
- the temperature of the mixed liquid during stirring is preferably 10 to 40 ° C, more preferably 20 to 30 ° C.
- the peripheral speed of the stirring blade is usually preferably 1 to 3 m / sec.
- the mixed solution is preferably mixed for 15 minutes or more, and more preferably mixed for 20 minutes or more.
- the pH of the cleaning composition may be appropriately determined according to the type of the object to be cleaned, the required quality of the object to be cleaned, etc., but is preferably 8 to 11 from the viewpoint of suppressing the corrosion of the object to be cleaned. 9 to 11 are more preferable.
- the pH of the cleaning composition may be selected from inorganic acids such as nitric acid and sulfuric acid, oxycarboxylic acids, polyvalent carboxylic acids, aminopolycarboxylic acids, organic acids such as amino acids, and metal salts and ammonium salts thereof, ammonia, It can be adjusted by mixing a desired amount of a basic substance such as sodium hydroxide, potassium hydroxide or amine.
- the method of manufacturing an electronic component of the present invention is a method of manufacturing an electronic component including a solder bump, and is derived from the solder flux by the step of forming the solder bump on the substrate of the electronic component using the solder flux and the cleaning method of the present invention. Cleaning the flux residue. That is, the method for manufacturing an electronic component of the present invention is a manufacturing intermediate in which a component is soldered on a substrate using a solder flux, then reflowed, and the component is mounted on the substrate via a solder bump ( And a step of cleaning a solder flux-derived flux residue present in the gap between the substrate and the component by the cleaning method of the present invention.
- Solder bumps are, for example, a printing method in which paste solder flux is printed on a substrate and then heated (reflowed) to form solder bumps, or electro solder plating is performed on openings in a resist layer formed on the substrate.
- a plating method for forming solder bumps by heating (reflow) a method for forming solder bumps by filling paste openings in a resist layer formed on a substrate and then heating (reflowing) to form solder bumps, etc. It can be formed by a solder bump forming method using a flux.
- the “substrate” of the electronic component includes not only a circuit substrate, a package substrate (interposer), and the like, but also a semiconductor chip on which solder bumps can be formed.
- the electronic component include a semiconductor device including the substrate. It is done.
- the “component” include a semiconductor chip, a chip capacitor, a circuit board different from the circuit board used as the “substrate”, and the like.
- the cleaning compositions of Examples 1 to 17 and Comparative Examples 1 to 23 were obtained by blending and mixing the components so that the compositions shown in Table 1, Table 3, Table 5, and Table 6 were obtained.
- the temperature of the mixed liquid during stirring was 25 ° C., and a magnetic stirrer (80 mm rotator) was used for stirring the mixed liquid.
- the rotational speed of the magnetic stirrer was 200 rpm, and the stirring time after all components were charged into the container was 30 minutes.
- the pH of these cleaning compositions was 10-11.
- the pH of each cleaning composition is a value at 25 ° C. measured using a pH meter (HM-30G, manufactured by Toa Denpa Kogyo Co., Ltd.).
- the following tests (1) to (6) were performed using the obtained detergent composition.
- the obtained cleaning composition was filled in a cleaning tank (volume: 25 L) and heated to 60 ° C.
- a pair of aluminum plates 2 are arranged in parallel to each other on one main surface of a commercially available MPU (micro processing unit) PKG substrate 1 so that the interval W4 is 3 mm.
- a cover glass 5 was placed on a pair of aluminum plates 2.
- the height W3 of the space between the cover glass 5 and the PKG substrate 1 is 50 ⁇ m.
- the fixing of the pair of aluminum plates 2 to the PKG substrate 1 and the fixing of the cover glass 5 to the pair of aluminum plates 2 are performed using an epoxy resin 3a, and the PKG substrate 1, the pair of aluminum plates 2, A gap 17 surrounded by the cover glass 5 was formed.
- the flux residue prepared in ⁇ Preparation of Flux Residue> was taken from a copper plate, put 0.05 g near one end of the gap 17, and then placed in a high-temperature bath at 150 ° C. Then, the flux residue entered into the gap 17 by capillary action. Next, one end of the gap 17 was sealed with an epoxy resin 3b to obtain a test piece.
- the length in the longitudinal direction of the flux residue filled in the region 4 by capillary action was 5 mm, and the entire surface surrounding the region 4 was covered with the flux residue.
- the lengths of W1 and W2 are both 5 mm, and member number 6 indicates an air reservoir in which air has accumulated.
- the space (gap 17) surrounded by the PKG substrate 1, the pair of aluminum plates 2, the cover glass 5, and the epoxy resin 3b has a height of 50 ⁇ m, a width of 3 mm, and a depth of 10 mm.
- the pressure was increased at a speed of (in the case of Example 1) until the pressure P 2 shown in Table 1, Table 3, Table 5, and Table 6 was reached. If the pressure P 2 is equal to atmospheric pressure (101.3 (kPa)) is then Table 1 the pressure in the cleaning tank, Table 3, Table 5, and Table 6 time described in ( "boosted pressure holding The time was maintained). If the pressure P 2 is lower than atmospheric pressure, the pressure of the cleaning tank, Table 1, Table 3, Table 5, and time ( "boosted pressure holding time” reference) described in Table 6 was maintained. A series of steps including a pressure reduction step, a pressure reduction holding step, a pressure increasing step, and a post-pressure increasing pressure holding step were performed as shown in Table 1, Table 3, Table 5, and Table 6 (see “Number of Cycles”).
- Comparative Example 1 neither pressure reduction nor pressure increase was performed. In Examples 16 to 17 and Comparative Examples 2 and 20 to 23, the post-pressurization pressure holding step was not performed. For Comparative Example 13, the reduced pressure holding step and the post pressure rising pressure holding step were not performed.
- the pressure in the washing tank during the decompression process, the decompression holding process, the pressurization process, and the post-pressurization pressure holding process was measured with a manometer (DM-10S manufactured by Shibata Kagaku Co., Ltd.). The pressure in the washing tank was continuously monitored during each step. Further, in any of the examples and comparative examples in which the reduced pressure holding step and the pressure holding step after pressure increase were performed, the pressure in the cleaning tank during the reduced pressure holding step was kept within the range of P 1 ⁇ 0.4 (kPa). The pressure in the cleaning tank during the pressure holding step after pressure increase was within the range of P 2 ⁇ 0.4 (kPa).
- the temperature of the cleaning agent composition in the cleaning tank and the temperature of the rinsing agent composition described below during the decompression process, the decompression holding process, the pressurization process, and the post-pressurization pressure holding process are thermometers attached to the cleaning tank. Measured with The temperature of the cleaning composition in the decompression step, the decompression holding step, the pressurization step, and the post-pressurization pressure holding step was measured and monitored every second during each step, but in any of the examples and comparative examples, The average temperature of the cleaning composition was within ⁇ 0.1 ° C.
- the temperature “60 ° C.” of the cleaning composition of Example 1 in Table 1 is the pressure reduction step (second step), the pressure reduction holding step (third step), the pressure increasing step (fourth step), and after pressure increasing In the pressure holding step (step 4a), it means that the average temperature of the cleaning composition is 60 ° C. in any step.
- the temperature of the cleaning composition during the decompression process, the decompression holding process, the pressurization process, and the post-pressurization pressure holding process is monitored by a temperature control device installed in the washing tank every second. To the specified temperature.
- the pre-rinsing process and the finishing rinsing process were performed once in this order, and the objects to be cleaned that were washed after the finishing rinsing process were dried.
- the washing process, the pre-rinsing process, and the finishing rinsing process were each performed in separate tanks.
- each of the examples and the comparative examples was used as a rinse agent composition under the same conditions as the cleaning process except that a 5% diluted solution of the used cleaning composition was used.
- the process and the pressure holding process after pressure increase were performed in this order. The number of cycles is the same as that of the corresponding cleaning process.
- the depressurization step, the depressurization holding step, the pressurization step, and the post-pressurization pressure holding step were performed in this order under the same conditions as the corresponding cleaning step except that water was used as the rinse agent composition.
- the number of cycles is the same as that of the corresponding cleaning process.
- Comparative Example 1 neither pressure reduction nor pressure increase was performed in the pre-rinse process and the finish rinse process. In Examples 16 to 17 and Comparative Examples 2 and 20 to 23, the post-pressurization pressure holding step was not performed. For Comparative Example 13, the reduced pressure holding step and the post pressure rising pressure holding step were not performed.
- Drying of the test piece that has undergone the cleaning process and the rinsing process is performed by blowing hot air (25 ° C.) on the test piece to remove the rinse agent composition adhering to the surface, and then in a vacuum drying container set at 80 ° C. The test piece was allowed to stand for 5 minutes. The pressure in the vacuum drying container was 1.0 (kPa).
- the cleaning composition was used while the test pieces were immersed in the cleaning compositions of Examples 1 to 13, 16, and 17 and the cleaning compositions of Comparative Examples 1 to 13, and 20 to 23.
- Ultrasonic vibration 40 kHz, 1.0 W / cm 2 ) was continuously applied to the object.
- Gap cleanability test 2 (a) A test similar to the gap cleaning property test 1 was conducted except that the energy density of ultrasonic vibration applied to the cleaning composition was 0.5 W / cm 2 . The gap cleanability test 2 (a) was performed on the cleaning compositions of Examples 1 to 13 and the cleaning compositions of Comparative Examples 1 to 13.
- Gap cleanability test 2 (b) A test similar to the gap cleanability test 2 (a) was performed except that the number of cycles in the cleaning step was twice that in the gap cleanability test 2 (a). The gap cleaning property test 2 (b) was performed on the cleaning compositions of Examples 1 to 13 and the cleaning compositions of Comparative Examples 1 to 13.
- the area of the region where the flux residue remains in the region 4 that can be seen when the test pieces before and after each gap cleaning test are viewed in plan was observed using an optical microscope (50 times magnification).
- the ratio of the area of the area 4 where the flux residue is removed to the area of the area 4 that can be seen when each test piece is viewed in plan is calculated as a cleaning rate (percentage).
- the cleaning property of the cleaning composition was evaluated.
- the test piece After setting one of the 20 test pieces on the jig, the test piece is cleaned with the cleaning composition in the cleaning tank 11 so that the air pocket 6 (see FIG. 1A) is below the region 4. It was immersed in (60 degreeC).
- the cleaning composition of Example 1 was used as the cleaning composition.
- the pressure reduction process, the pressure reduction holding process, the pressure increasing process, and the pressure maintaining process after pressure increasing were performed in this order under the same conditions as in (1) Gap cleaning performance test 1. That is, the pressure in the cleaning tank is reduced to 4 kPa, the reduced pressure state is maintained for 10 seconds, and then the pressure in the cleaning tank is increased to normal pressure (101.3 kPa), and then the normal pressure state is maintained for 10 seconds. .
- a series of steps consisting of the pressure reduction step, the pressure reduction holding step, the pressure increasing step, and the pressure maintaining step after pressure increase was repeated 10 times.
- the amount of the cleaning composition in the cleaning tank before the start of the cleaning process was 20 L.
- One cycle consisting of the decompression step, the decompression holding step, the pressurization step and the post-pressurization pressure holding step was performed in 30 seconds.
- the cleaning time is 300 seconds.
- test piece was immersed in the cleaning composition, ultrasonic vibration (40 kHz, 1.0 W / cm 2 ) was continuously applied to the cleaning composition.
- a series of steps consisting of a decompression step, a decompression holding step, a pressurization step, and a post-pressurization pressure holding step were repeated 10 times, and then the test piece was taken out from the cleaning tank.
- the test piece was pre-rinsed and finished rinsed once in this order under the same conditions as in (1) Gap cleaning property test 1 and after the final rinse step, the washed test piece was dried. .
- the pre-rinsing process and the finishing rinsing process were each performed for 300 seconds.
- a 5% diluted solution of the cleaning composition of Example 1 was used as the rinse agent composition
- water was used as the rinse agent composition.
- the cleaning composition in the cleaning tank 11 and the cleaning composition in the sub tank 14 are circulated.
- the content of water in the cleaning composition in the cleaning tank 11 was adjusted to a concentration (5.0% by weight) equal to the initial value.
- the content of water in the cleaning composition in the cleaning tank 11 and the content of water in the cleaning composition in the sub tank 14 were determined according to the capacitance type moisture meter (EMC manufactured by Yamamoto Electric Instruments Co., Ltd., EMC). -113N) 15,16.
- EMC capacitance type moisture meter
- the pre-rinsing process and the finishing rinsing process were each performed by replacing each unused rinse agent composition at the end of rinsing of one test piece. This detergency test was conducted in the same manner up to the 20th test piece.
- the number of cleaning cycles for each test piece is 10 times, and the total number of cycles for a total of 20 test pieces is 200 times.
- Rinseability test In the rinseability test, it was tested to what extent the cleaning composition in the gap 17 between the pair of glass plates in the test piece could be rinsed with water. However, with respect to the test piece used in this test, the gap 17 is not filled with a flux residue.
- a test piece was prepared in which the gap 17 was filled with a detergent composition colored with methylene blue (reagent; manufactured by Sigma-Aldrich), which is a water-soluble dye.
- a detergent composition colored with methylene blue (reagent; manufactured by Sigma-Aldrich), which is a water-soluble dye.
- the test piece is rinsed with the rinse agent composition ( It was immersed in water (60 ° C.).
- rinsing was performed under the same conditions as the cleaning step (first to fifth steps) in the gap cleaning test 1 or 3 by replacing the cleaning composition with water.
- the area of the area where the dye remained when the gaps 17 of the test pieces after the rinsing test were viewed in plan was observed using an optical microscope (magnification 50 times).
- the ratio (percentage) of the area of the area from which the dye is removed out of the plane that can be seen when the test piece gap 17 is viewed in plan to the area of the plane that can be seen when the test piece gap 17 is viewed in plan is calculated as the rinsing property.
- the rinsing properties of the cleaning composition were evaluated according to the following criteria.
- Rinse property is 90% or more
- B: Rinse property is 70% or more and less than 90%
- C: Rinse property is 50% or more and less than 70%
- member number 8 indicates a decompression release valve
- member number 10 indicates a valve for controlling opening and closing of a pipe connected to the vacuum pump
- member number 9 indicates a liquid drain valve.
- Bubble height is less than 10 cm
- Bubble height is 10 cm or more and less than 20 cm
- Bubble height is 20 cm or more
- a cleaning composition having a specific composition with a low water content of 2 to 10% by weight is used, and the pressure in the cleaning tank reached in the decompression step is 0.
- the pressure in the cleaning tank is P 1 ⁇ 0.4 (kPa) in the reduced pressure holding step
- the temperature of the cleaning composition is 50 to 70 ° C.
- the pressure in the cleaning tank which is continuously held for 8 to 16 seconds and reached in the pressure increasing process, is P 2 (kPa) in the range of 50 to 120 kPa, and the process from the pressure reducing process to the pressure increasing process is performed in 10 to 220 seconds.
- Examples 1 to 17 have higher cleaning properties for the cleaning agent composition with respect to the flux residue remaining in the narrow gap 17 and better rinsing properties with water than Comparative Examples 1 to 23.
- the detergent compositions of Examples 1 to 17 had a surfactant content other than Component B and Component C of 0.008% by weight or less, and substantially contained surfactants other than Component B and Component C. Therefore, foaming is suppressed.
- Glycerin manufactured by Kao
- Solvent naphtha manufactured by Wako Pure Chemical Industries
- the cleaning composition of the present invention can be suitably used for cleaning a flux residue remaining in a narrow gap.
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Abstract
Description
0.1(kPa)≦P1≦7(kPa) (1)
50(kPa)≦P2≦120(kPa) (2)
前記洗浄剤組成物は、水(成分A)を2重量%以上10重量%以下、グリコールエーテル(成分B)を50重量%以上97.75重量%未満、及びアミン化合物(成分C)を0.05重量%以上5重量%以下含む。
前記成分Bは、下記一般式(1)で表される。
R1-O-(EO)m-R2 (1)
前記一般式(1)において、R1は炭素数1~6のアルキル基、R2は水素原子又は炭素数1~3のアルキル基、EOはオキシエチレン基であり、mはEOの平均付加モル数を示し、2≦m≦3を満たす。
前記成分Cは、下記一般式(2)で表される。
前記一般式(2)において、R3は水素原子又は炭素数1~4のアルキル基を示し、EOはオキシエチレン基であり、p、qは各々EOの平均付加モル数を示し、1≦p+q≦4を満たす。
前記洗浄槽内の前記洗浄剤組成物の前記水(成分A)の含有量を2重量%以上10重量%以下にするための水分制御機構を備える。
本発明の洗浄方法では、例えば、洗浄工程と、リンス剤組成物を用いて被洗浄物をすすぐリンス工程と、乾燥工程とをこの順で行う。
本発明の洗浄方法が好適に使用される被洗浄物としては、回路基板等と回路基板等にハンダ付けされた部品とを含む製造中間物であって、当該回路基板と部品との隙間にフラックス残渣を含むものが挙げられる。製造中間物は、半導体パッケージや半導体装置等の電子部品の製造工程における製造物中間であって、例えば、回路基板上にフラックスを使用したハンダ付けにより半導体チップ、チップ型コンデンサ、及び他の回路基板などが搭載された物を含む。
洗浄工程は、フラックス残渣が付着した被洗浄物を、圧力調整可能な洗浄槽内に収容された後述する洗浄剤組成物に浸漬する浸漬工程(浸漬工程は「第1工程」ともいう。)と、洗浄槽内の圧力が所定の値になるまで減圧する減圧工程(減圧工程は「第2工程」ともいう。)と、減圧工程で減圧された洗浄槽内の圧力を所定の圧力範囲内に、且つ、洗浄槽内の洗浄剤組成物の温度を所定の温度範囲内に、所定時間連続して保持する減圧保持工程(減圧保持工程は「第3工程」ともいう。)と、前記減圧保持工程を経た後、洗浄槽内の圧力を所定の値になるまで昇圧する昇圧工程(この工程は「第4工程」ともいう。)とを含む。
洗浄工程では、まず、洗浄剤組成物が収容された洗浄槽内にフラックス残渣が付着した被洗浄物を投入して、洗浄剤組成物に被洗浄物を浸漬する。
次に、洗浄槽内の圧力がP1(kPa)になるまで減圧する。P1は、関係式0.1(kPa)≦P1≦7(kPa)を満たす。
次に、減圧保持工程において、前記減圧工程で減圧された洗浄槽内の圧力を、P1±0.4kPaに、且つ、洗浄槽内の洗浄剤組成物の温度を50~70℃に、8~16秒間連続保持する。
時間平均保持温度Tx=Σ(Ti*ti)/Σti
[平均化する前の保持温度をTi、該温度で保持された時間をtiとする。]
次に、洗浄槽内の圧力がP2(kPa)になるまで昇圧する。P2は、関係式50≦P2≦120(kPa)を満たす。
本発明の洗浄方法は、狭い隙間に存在するフラックス残渣に対する洗浄性を高める観点から、第4工程後、後述する第5工程の前に行われ、洗浄槽内の圧力P3を、50~120(kPa)の範囲内の圧力であって、P2±0.4(kPa)と等しいか又はP2±0.4(kPa)よりも高い圧力に8~16秒間保持する昇圧後圧力保持工程(この工程は「第4a工程」ともいう。)をさらに含んでいると好ましい。特に、第4工程で洗浄剤組成物に超音波振動が印加される場合、本発明の洗浄方法は、洗浄性を向上させる観点から、前記第4a工程を含んでいると好ましい。
本発明の洗浄方法は、狭い隙間に存在するフラックス残渣に対する洗浄性の向上の観点から、前記第2工程~第4工程をさらに1~50回繰り返す工程(第5工程)を含むと好ましい。第5工程で繰り返し行われる第2~第4工程は、第5工程の前に行われる前記第2~第4工程と同じ条件で行えばよい。具体的には、狭い隙間に存在するフラックス残渣に対する洗浄性の向上と洗浄時間の短縮化の両立の観点から、繰り返し行われる第2工程では、洗浄槽内の圧力を0.1~6(kPa)の範囲内の圧力に達するまで減圧することが好ましく、その減圧時間は減圧開始から1秒以上120秒以内であると好ましく、洗浄剤組成物の温度は50~70℃であると好ましい。また、同様の観点から、繰り返し行われる第3工程では、洗浄槽内の圧力をP1±0.4(kPa)の圧力に保持することが好ましく、洗浄槽内の圧力をP1±0.1(kPa)の圧力に保持することがより好ましく、洗浄剤組成物の温度は、洗浄槽内の圧力がP1±0.4(kPa)である場合50~70℃であると好ましく、洗浄剤組成物の温度は一定であるとより好ましく、減圧の保持時間は8~16秒であると好ましい。同様の観点から、繰り返し行われる第4工程では、昇圧により達する圧力は常圧であることが好ましく、洗浄剤組成物の温度は50~70℃であると好ましい。
本発明の洗浄方法では、1つの被洗浄物の洗浄のための洗浄工程の途中で、洗浄槽内の洗浄剤組成物に水を添加してもよい。また、複数の被洗浄物の洗浄のために洗浄槽が連続使用される場合、各被洗浄物の洗浄のための洗浄工程の途中及び/又は前に、洗浄槽内の洗浄剤組成物に水を添加してもよい。本発明の洗浄方法では、洗浄剤組成物を沸騰させるので、特に、第5工程において、第2工程~第4工程を繰り返し行ううちに、洗浄剤組成物中の水の含有量が低減する場合がある。よって、本発明で使用する洗浄剤組成物中の各成分の配合割合の変動を抑制して高い洗浄性を維持するために、第1工程~第5工程のうちの何れかの工程の前及び/又は途中で、洗浄槽内の洗浄剤組成物に水を添加して、洗浄剤組成物の組成の変動を抑制すると好ましい。
本発明の洗浄方法では、洗浄工程が、第1工程の前に、例えば、第1工程~第5工程が行われる洗浄槽とは別の洗浄槽に収容された洗浄剤組成物中に被洗浄物を一定期間浸漬する工程をさらに含んでいてもよい。前記洗浄剤組成物は、第1工程~第4工程で使用される後述する洗浄剤組成物と同じであってもよいし、後述する洗浄剤組成物以外の従来公知の、フラックス残渣が付着した被洗浄物を洗浄するための洗浄剤組成物であってもよい。洗浄剤組成物への浸漬時間は、例えば、1~10分であると好ましい。
リンス工程は、被洗浄物に付着した洗浄剤組成物、残留したフラックス残渣、又は再付着したフラックス残渣等の汚れをすすぎ洗いする工程であり、本発明の洗浄方法が第4a工程および第5工程ともに含まない場合は、第4工程の後に、本発明の洗浄方法が第4a工程は含むが第5工程を含まない場合は、第4a工程の後に、本発明の洗浄方法が第5工程を含む場合は、第5工程の後に行われる。リンス工程は、1つのリンス槽を用いて行ってもよいし、2つ以上のリンス槽を用いて行ってもよい。
リンス工程の後に行われる乾燥工程では、例えば、リンス剤組成物から取り出された被洗浄物に温風を吹き付けることにより、表面に付着したリンス剤組成物を取り除いた後、真空乾燥容器内に搬送される。真空乾燥容器内の温度は、例えば、50~100℃に設定され、真空乾燥容器内は、0.1~5(kPa)に減圧される。真空乾燥容器による乾燥は、例えば、1~30分間行えばよい。
次に、本発明の洗浄方法に使用される洗浄剤組成物について説明する。
成分Aは、蒸留水、イオン交換水、又は超純水等の水からなる。
成分Bは、下記一般式(1)で表されるグリコールエーテルからなる。
成分Cは、下記一般式(2)で表されるアミン化合物からなる。
洗浄剤組成物は、洗浄剤組成物を用いて被洗浄物を洗浄した場合に奏される、狭い隙間に存在するフラックス残渣に対する高い洗浄性、良好な水によるすすぎ性、および、低泡立ち性が損なわれない範囲で、成分C以外のアミン化合物として、モルホリン、エチルモルホリン等のモルホリン類;ピペラジン、トリエチルジアミン、ペンタメチルジエチレントリアミン、テトラメチルプロピレンジアミン等を含んでいてもよい。
洗浄剤組成物の調製方法は、何ら制限されず、成分A、成分B、及び成分Cを混合し、必要に応じて、成分Dおよび/又はその他の任意成分をさらに混合することによって調製できる。
洗浄剤組成物のpHは、被洗浄物の種類や洗浄後の被洗浄物の要求品質等に応じて適宜決定すればよいが、被洗浄物の腐食を抑制する観点から、8~11が好ましく、9~11がより好ましい。
本発明の電子部品の製造方法は、ハンダバンプを含む電子部品の製造方法であって、電子部品の基板上にハンダフラックスを使用してハンダバンプを形成する工程と、本発明の洗浄方法によりハンダフラックス由来のフラックス残渣を洗浄する工程とを含む。すなわち、本発明の電子部品の製造方法は、ハンダフラックスを用いて基板上に部品をハンダ付けし、次いで、リフローして、前記基板上にハンダバンプを介して前記部品が搭載された製造中間物(被洗浄物)を得る工程と、前記基板と前記部品との隙間に存在するハンダフラックス由来のフラックス残渣を、本発明の洗浄方法により洗浄する工程とを含む。ハンダバンプは、例えば、ペースト状のハンダフラックスを基板上に印刷塗布してその後加熱(リフロー)してハンダバンプを形成する印刷法や、基板上に形成したレジスト層の開口部に電気ハンダメッキを行いその後加熱(リフロー)してハンダバンプを形成するメッキ法、基板上に形成したレジスト層の開口部にペースト状のハンダフラックスを充填してその後加熱(リフロー)してハンダバンプを形成する方法など、従来公知のフラックスを用いるハンダバンプの形成方法により形成できる。
クリームハンダ(タムラ化研製LIFSOLDER LF-204-11)を銅板に塗布した後、これらを窒素雰囲気下で熱処理(250℃)して、フラックス残渣を調製した。即ち、前記熱処理によりクリームハンダ中のフラックスを融かしてハンダ金属から浮かせ、ハンダ金属とフラックス残渣とを分けた。フラックス残渣は銅板上において茶褐色のまくのような汚れとして観察できる。
図1Aおよび図1Bに示されるように、市販のMPU(micro processing unit)のPKG基板1の一方の主面に1対のアルミ板2をその間隔W4が3mmとなるよう相互に平行に配置し、1対のアルミ板2上にカバーガラス5を配置した。カバーガラス5とPKG基板1との間の空間の高さW3は50μmである。1対のアルミ板2のPKG基板1への固定、および、カバーガラス5の1対のアルミ板2への固定は、エポキシ樹脂3aを用いて行い、PKG基板1、1対のアルミ板2、カバーガラス5で囲まれた隙間17を形成した。
次に、テストピースを治具にセットした後、空気溜まり6が領域4よりも下になるように洗浄槽(容積:25L)内の洗浄剤組成物(60℃、5L)に浸漬した。次いで、洗浄槽内の圧力を、例えば19kPa/s(実施例1の場合)の速度で表1、表3、表5、および表6に示された圧力P1に達するまで減圧する減圧工程を経た後、その減圧された圧力を表1、表3、表5、および表6に示された時間保持し(「減圧保持時間」参照)、次いで、洗浄槽内の圧力を、例えば19kPa/s(実施例1の場合)の速度で表1、表3、表5、および表6に示された圧力P2に達するまで昇圧した。圧力P2が常圧(101.3(kPa))に等しい場合は、その後、洗浄槽内の圧力を表1、表3、表5、および表6に記載された時間(「昇圧後圧力保持時間」参照)常圧に保持した。圧力P2が常圧より低い場合は、その洗浄槽内の圧力を、表1、表3、表5、および表6に記載された時間(「昇圧後圧力保持時間」参照)保持した。減圧工程、減圧保持工程、昇圧工程、および昇圧後圧力保持工程からなる一連の工程は、表1、表3、表5、および表6に記載の回数行った(「サイクル数」参照)。ただし、比較例1では、減圧も昇圧も行わなかった。また、実施例16~17、比較例2、20~23については、昇圧後圧力保持工程は行わなかった。比較例13については、減圧保持工程および昇圧後圧力保持工程は行わなかった。
洗浄剤組成物に印加される超音波振動のエネルギー密度が0.5W/cm2であること以外は、隙間洗浄性試験1と同様の試験をした。尚、隙間洗浄性試験2(a)は、実施例1~13の洗浄剤組成物および比較例1~13の洗浄剤組成物について行った。
洗浄工程におけるサイクル数が、隙間洗浄性試験2(a)におけるそれの2倍であること以外は、隙間洗浄性試験2(a)と同様の試験をした。尚、隙間洗浄性試験2(b)は、実施例1~13の洗浄剤組成物および比較例1~13の洗浄剤組成物について行った。
実施例14~15の洗浄剤組成物および比較例14~19の洗浄剤組成物について、超音波振動は付与しなかったこと以外は隙間洗浄性試験1と同様にして試験を行った。ただし、比較例14では、減圧も昇圧も行わなかった。また、実施例14,15、比較例15~19については、昇圧後圧力保持工程は行わなかった。
この試験には、図3に示されるように、洗浄工程が行われる洗浄槽11、プレリンスが行われる第1すすぎ槽12、仕上げリンス工程が行われる第2すすぎ槽13を含む洗浄装置を用いた。また、前記<テストピースの作成>と同じ方法で作成したテストピースを20個用意した。
<フラックス残渣の洗浄性の判定基準>
A:洗浄率が90%以上
B: 洗浄率が80%以上90%未満
C:洗浄率が70%以上80%未満
D:洗浄率が60%以上70%未満
E:洗浄率が50%以上60%未満
F:洗浄率が50%未満
すすぎ性試験では、前記テストピースにおける1対のガラス板間の隙間17に入った洗浄剤組成物を水でどの程度濯げるか、テストした。ただし、この試験に用いるテストピースについては、前記隙間17にフラックス残渣は充填していない。
A:すすぎ性が90%以上
B:すすぎ性が70%以上90%未満
C:すすぎ性が50%以上70%未満
D:すすぎ性が50%未満
(a)図2に示された容器7内に、洗浄剤組成物を2リットル入れ、容器7内を減圧(5kPa)した時の泡の高さ、(b)図2に示された容器7内に、洗浄剤組成物の濃度が10重量%となるように洗浄剤組成物を水で希釈して得た希釈液(プレリンス工程用のリンス剤組成物に相当)を2リットル入れ、容器7内を減圧(5kPa)した時の泡の高さを目視にて観察した。
A:泡高さが10cm未満
B:泡高さが10cm以上20cm未満
C:泡高さが20cm以上
[成分B]
シ゛エチレンク゛リコールモノフ゛チルエーテル(日本乳化剤社製)
トリエチレンク゛リコールモノフ゛チルエーテル(日本乳化剤社製)
シ゛エチレンク゛リコールモノヘキシルエーテル(日本乳化剤社製)
トリエチレンク゛リコールシ゛メチルエーテル(日本乳化剤社製)
[成分C]
シ゛エタノールアミン(和光純薬工業社製)
メチルシ゛エタノールアミン(和光純薬工業社製)
[成分D]
SecC12-14-O-(EO)7H(非イオン性界面活性剤、日本触媒社製)
SecC12-14-O-(EO)7Hは、SecC12-O-(EO)7HとSecC14-O-(EO)7Hとの混合物である。
[任意成分]
グリセリン(花王社製)
[その他]
ソルベントナフサ(和光純薬工業社製)
界面活性剤10%水溶液:BASF社 Lutensol XL-70(非イオン界面活性剤の10重量%水溶液)
Claims (9)
- 洗浄剤組成物を用いてフラックス残渣が付着した被洗浄物を洗浄する洗浄工程を含み、
前記洗浄工程は、
フラックス残渣が付着した被洗浄物を、圧力調整可能な洗浄槽内に収容された前記洗浄剤組成物に浸漬する浸漬工程(第1工程)と、
前記洗浄槽内の圧力を、下記式(1)を満たす圧力P1(kPa)に減圧する減圧工程(第2工程)と、
0.1(kPa)≦P1≦7(kPa) (1)
前記減圧工程で減圧された前記洗浄槽内の圧力をP1±0.4(kPa)に、且つ、前記洗浄槽内の前記洗浄剤組成物の温度を50~70℃に、8~16秒間連続して保持する減圧保持工程(第3工程)と、
前記減圧保持工程を経た後、前記洗浄槽内の圧力を下記式(2)を満たす圧力P2(kPa)にする昇圧工程(第4工程)とを含み、
50(kPa)≦P2≦120(kPa) (2)
前記第2工程~第4工程までを、10~220秒間で行い、
前記洗浄剤組成物は、
水(成分A)を2重量%以上10重量%以下、
グリコールエーテル(成分B)を50重量%以上97.75重量%未満及び、
アミン化合物(成分C)を0.05重量%以上5重量%以下含み、
前記成分Bは、下記一般式(1)で表され、
R1-O-(EO)m-R2 (1)
〔前記一般式(1)において、R1は炭素数1~6のアルキル基、R2は水素原子又は炭素数1~3のアルキル基、EOはオキシエチレン基であり、mはEOの平均付加モル数を示し、2≦m≦3を満たす。〕
前記成分Cは、下記一般式(2)で表される、
〔前記一般式(2)において、R3は水素原子又は炭素数1~4のアルキル基を示し、EOはオキシエチレン基であり、p、qは各々EOの平均付加モル数を示し、1≦p+q≦4を満たす。〕
被洗浄物の洗浄方法。 - 少なくとも前記第2工程~前記第4工程をさらに1~50回繰り返す工程(第5工程)をさらに含み、
前記第5工程で繰り返えされる前記第2工程~前記第4工程までを各々10~220秒間で行う、請求項1に記載の被洗浄物の洗浄方法。 - 前記第4工程の後に、前記洗浄槽内の圧力を、50~120kPaの範囲内の圧力であって、P2±0.4(kPa)と等しいか又はP2±0.4(kPa)よりも高い圧力に8~16秒間保持する昇圧後圧力保持工程(第4a工程)をさらに含む、請求項1または2に記載の、被洗浄物の洗浄方法。
- さらに、水を90~99.9999重量%含むリンス剤組成物で前記被洗浄物をリンスするリンス工程を含む、請求項1~3のいずれかの項に記載の、被洗浄物の洗浄方法。
- 前記リンス工程が、第5工程における、第2工程~4工程で用いる前記洗浄剤組成物を前記リンス剤組成物に代えて行われる、請求項4に記載の被洗浄物の洗浄方法。
- 前記洗浄工程の前記第3工程を、前記洗浄剤組成物へ超音波振動を印加しながら行う、請求項1~5のいずれかの項に記載の被洗浄物の洗浄方法。
- 前記リンス工程の第3工程を、前記リンス剤組成物へ超音波振動を印加しながら行う、請求項5に記載の被洗浄物の洗浄方法。
- 電子部品の基板上に、フラックスを含むハンダフラックスを使用してハンダバンプを形成する工程と、
請求項1~7のいずれかの項に記載の前記被洗浄物の洗浄方法により前記フラックス由来の前記フラックス残渣を洗浄する工程とを含む、ハンダバンプを含む電子部品の製造方法。 - 請求項1~7のいずれかの項に記載の被洗浄物の洗浄方法に使用される洗浄装置であって、
前記洗浄槽内の前記洗浄剤組成物の前記水(成分A)の含有量を2重量%以上10重量%以下にするための水分制御機構を備えた洗浄装置。
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KR20150067737A (ko) | 2013-12-10 | 2015-06-18 | 카오카부시키가이샤 | 땜납 플럭스 잔사 제거용 세정제 조성물 |
JP2015145476A (ja) * | 2014-02-03 | 2015-08-13 | 花王株式会社 | 半田フラックス残渣除去用洗浄剤組成物 |
CN105127535A (zh) * | 2015-09-25 | 2015-12-09 | 广东小天才科技有限公司 | 一种潮敏器件的取焊和焊接方法 |
JP2016014081A (ja) * | 2014-06-30 | 2016-01-28 | 花王株式会社 | 半田フラックス残渣除去用洗浄剤組成物 |
CN111180312A (zh) * | 2019-12-31 | 2020-05-19 | 贵州振华风光半导体有限公司 | 一种适用于集成电路的回流焊清洗方法 |
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JP2013244447A (ja) * | 2012-05-25 | 2013-12-09 | Rix Corp | フラックス洗浄装置 |
KR102384908B1 (ko) | 2015-11-25 | 2022-04-08 | 삼성전자주식회사 | 자성 패턴 세정 조성물, 자성 패턴 형성 방법 및 자기 메모리 장치의 제조 방법 |
KR101996370B1 (ko) * | 2018-10-17 | 2019-07-05 | 서영파일테크 주식회사 | 탄성부재의 플로킹공정 |
KR102266933B1 (ko) * | 2019-12-30 | 2021-06-21 | 주식회사 금호 | 도금액 제거용 초음파 세척장치 |
CN114101191A (zh) * | 2021-11-19 | 2022-03-01 | 横店集团东磁股份有限公司 | 一种太阳能单晶电池刻蚀工序所用行走滚轮的清洗方法 |
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KR20150067737A (ko) | 2013-12-10 | 2015-06-18 | 카오카부시키가이샤 | 땜납 플럭스 잔사 제거용 세정제 조성물 |
JP2015113379A (ja) * | 2013-12-10 | 2015-06-22 | 花王株式会社 | 半田フラックス残渣除去用洗浄剤組成物 |
JP2015145476A (ja) * | 2014-02-03 | 2015-08-13 | 花王株式会社 | 半田フラックス残渣除去用洗浄剤組成物 |
JP2016014081A (ja) * | 2014-06-30 | 2016-01-28 | 花王株式会社 | 半田フラックス残渣除去用洗浄剤組成物 |
CN105127535A (zh) * | 2015-09-25 | 2015-12-09 | 广东小天才科技有限公司 | 一种潮敏器件的取焊和焊接方法 |
CN111180312A (zh) * | 2019-12-31 | 2020-05-19 | 贵州振华风光半导体有限公司 | 一种适用于集成电路的回流焊清洗方法 |
CN111180312B (zh) * | 2019-12-31 | 2023-08-11 | 贵州振华风光半导体股份有限公司 | 一种适用于集成电路的回流焊清洗方法 |
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JPWO2011081071A1 (ja) | 2013-05-09 |
KR20120108034A (ko) | 2012-10-04 |
TW201134562A (en) | 2011-10-16 |
JP5711150B2 (ja) | 2015-04-30 |
TWI504450B (zh) | 2015-10-21 |
KR101824445B1 (ko) | 2018-02-01 |
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