WO2011048873A1 - Inductance à couches multiples - Google Patents

Inductance à couches multiples Download PDF

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Publication number
WO2011048873A1
WO2011048873A1 PCT/JP2010/064771 JP2010064771W WO2011048873A1 WO 2011048873 A1 WO2011048873 A1 WO 2011048873A1 JP 2010064771 W JP2010064771 W JP 2010064771W WO 2011048873 A1 WO2011048873 A1 WO 2011048873A1
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Prior art keywords
coil
magnetic
layer
multilayer
multilayer inductor
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PCT/JP2010/064771
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English (en)
Japanese (ja)
Inventor
謙一郎 野木
義明 上山
健次 岡部
将孝 小原
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太陽誘電株式会社
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Priority to CN2010800357678A priority Critical patent/CN102473504A/zh
Publication of WO2011048873A1 publication Critical patent/WO2011048873A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates to a multilayer inductor used as a choke coil for a power circuit or the like, for example.
  • the multilayer inductor 29 includes the multilayer chip 22 and the multilayer chip 22.
  • the multilayer chip 22 is arranged between a plurality of magnetic layers 23 having a square planar shape and stacked in the thickness direction, and adjacent magnetic layers 23 and 23.
  • a plurality of coil patterns 213 are provided. The coil patterns 213 are connected to each other to form a spiral coil 218. Further, a lead portion reaching the edge of the magnetic layer 23 is connected to the start end and the end of the coil 218 to form a coil conductor.
  • the pair of external electrodes 27 is formed on the end faces of the multilayer chip 22 facing each other, and is connected to the starting end drawing portion 28 and the terminal drawing portion 210 of the coil 218, respectively.
  • the conventional multilayer inductor has a problem that the direct current superposition characteristic is worse than that of the winding inductor.
  • the deterioration of the DC superimposition characteristics of the multilayer inductor is a phenomenon in which the inductance value is significantly reduced due to saturation of magnetic flux density in the magnetic body constituting the choke coil as the value of the DC current to be supplied increases. .
  • Patent Document 1 describes that in a multilayer inductor, all or part of an outer region surrounding a coil pattern is made of a nonmagnetic material.
  • Patent Document 2 in a multilayer inductor, at least a part of a magnetic path portion surrounded by a coil is made of a non-magnetic material, thereby reducing magnetic flux, improving inductance superposition characteristics, and having a high inductance value at high current. Those with are listed.
  • Patent Document 1 when the entire outer periphery of the coil pattern is made of a non-magnetic material, or as described in Patent Document 2, the magnetic path portion surrounded by the coil is made of non-magnetic ceramics. In some cases, it has been found that there is a problem that the initial inductance value is significantly reduced. In addition, as described in Patent Document 1 in order to increase the inductance value, if a part of the non-magnetic material is removed, the magnetic flux is concentrated in the removal region and the magnetic saturation is likely to occur, and the direct current superimposition characteristic is deteriorated. There is.
  • an object of the present invention is to provide a multilayer inductor capable of increasing the inductance value and preventing the Q value from being lowered without impairing the direct current superimposition characteristics.
  • Patent Document 1 As a result of intensive research to achieve the above object, the present inventors, as described in Patent Document 1, in a state in which a non-magnetic material is put in the entire region of the outer periphery of the coil that circulates in the multilayer inductor, In the body chip, it has been found that there are high and low magnetic flux density regions. In order to increase the inductance value L of Patent Document 1, it is considered to remove a part of a non-magnetic material having a constant area. If the non-magnetic material in the region where the magnetic flux density is high is removed, the magnetic flux density is more concentrated in the region and the magnetic saturation state is likely to occur, and the direct current superimposition characteristic is greatly deteriorated.
  • the Q value can be improved by forming the notched region where the nonmagnetic material is removed so as to be in contact with the external electrode.
  • a multilayer inductor used as a choke coil for a power circuit, etc. A plurality of magnetic layers laminated in the thickness direction in a rectangular plane shape; A plurality of coil patterns arranged between adjacent magnetic layers are connected to each other to form a spiral coil and have leading portions reaching the edge of the magnetic layer at the start and end of the coil.
  • a laminate chip having A pair of external electrodes formed on the end face of the multilayer chip and connected to the start and end of the coil conductor; Columnar regions each including a side portion parallel to the lamination direction of the magnetic material and configured only by the magnetic material layer are disposed in the notch portion so as not to contact the coil conductor.
  • Characteristic multilayer inductor [2] The multilayer inductor according to [1], wherein the columnar region is in contact with an external electrode.
  • the structure of the present invention makes it easy for magnetic flux to be generated in a columnar region formed by only the magnetic layers at the four corners of the multilayer chip. That is, the magnetic material characteristics of the columnar region where magnetic flux is hardly generated in the multilayer chip can be utilized. As a result, the inductance value is improved as compared with the conventional multilayer inductor in which the nonmagnetic material layer is arranged on the entire outer periphery of the coil, the direct current superposition characteristic is hardly deteriorated, and the Q value can be further improved.
  • FIG. 1 is a perspective view of a multilayer inductor having a nonmagnetic layer having square cutouts formed at four corners on the outermost periphery according to the first embodiment of the present invention.
  • 2A is a cross-sectional view of the multilayer inductor shown in FIG. 1
  • FIG. 1A is a cross-sectional view of L1-L1 ′ in FIG. 1
  • FIG. 2B is a cross-sectional view of L2-L2 ′ in FIG.
  • FIG. 2 is an element configuration diagram of a multilayer inductor having a nonmagnetic layer in which square notches are formed at four corners on the outermost periphery of the nonmagnetic layer shown in FIG. 1.
  • FIG. 5A is a cross-sectional view of the multilayer inductor shown in FIG. 5, wherein FIG. 5A is a cross-sectional view of L3-L3 ′ in FIG. 5, and FIG. 5B is a cross-sectional view of L4-L4 ′ in FIG. FIG.
  • FIG. 6 is an element configuration diagram of the multilayer inductor shown in FIG. 5 in which a nonmagnetic layer is disposed on the entire outer periphery of the coil. It is a figure which shows the result of having simulated the magnetic flux density distribution in the multilayer surface 216 of the multilayer inductor shown in FIG. Examples, comparative examples, and conventional examples of the present invention are represented by laminated surfaces representing respective forms.
  • (A) shows Example 1 (laminated surface 116 in FIG. 3), (b) Example 2 (lamination surface 117 in FIG. 4), (c) is Comparative Example 1, and (d) is Conventional Example 1. It is a figure showing the inductance change rate when an electric current is added to the laminated inductor of each form example.
  • FIG. 7 is a diagram showing a multilayer inductor without a nonmagnetic layer, which is one of the conventional examples for the present invention, where (a) is a perspective view and (b) is a view of L5-L5 ′ of (a). It is sectional drawing. It is an element block diagram of the laminated body chip
  • FIGS. 1 A first embodiment of the present invention is shown in FIGS. 1 is a perspective view
  • FIG. 2 is a cross-sectional view
  • (a) is a cross-sectional view of L1-L1 ′ of FIG. 1
  • (b) is a cross-sectional view of L2-L2 ′ of FIG. is there.
  • FIG. 3 is an element configuration diagram of the multilayer chip shown in FIG.
  • the first embodiment of the multilayer inductor of the present invention has a rectangular parallelepiped multilayer chip 12 and a pair of external electrodes 17 formed on the end face of the multilayer chip. .
  • the multilayer chip 12 includes a plurality of magnetic layers 13 having a square planar shape and stacked in the thickness direction, and a plurality of coil patterns 113 respectively disposed between adjacent magnetic layers.
  • the coil patterns 113 are connected to each other to form a spiral coil 118.
  • lead portions 18 and 110 reaching the edge of the magnetic layer are connected to the start and end of the coil 118 to form the coil conductor 15.
  • a nonmagnetic layer 14 is disposed in an area outside the spiral coil 118 between the adjacent magnetic layers 13 in the multilayer chip 12 where the coil pattern 113 is disposed. Yes.
  • the nonmagnetic layer 14 has substantially the same outer dimensions as the magnetic layer, and has an annular shape in which square cutout portions 115 are formed at four corners on the outer periphery. At this time, as shown in FIG. 2b, a columnar region 112 made of only a magnetic layer is formed in the notch 115.
  • External electrodes 17 are provided on two opposite side surfaces of the laminated chip 12 so as to be electrically connected to the start and end of the coil by applying silver paste.
  • the surface of the external electrode is subjected to two-layer plating.
  • the main part of the multilayer chip is a magnetic layer made of Ni—Zn—Cu ferrite or the like, and the magnetic layer is formed by stacking a plurality of sheets of a rectangular magnetic layer.
  • a spiral coil is formed inside the multilayer chip, and a non-magnetic layer made of a material such as Zn—Cu-based ferrite is disposed on the outer periphery of the coil.
  • a coil pattern conductor having a shape obtained by dividing a coil turn is screen-printed on a sheet of a magnetic layer as shown in FIG.
  • a coil is formed by conducting and laminating the coil pattern on the magnetic sheet in the thickness direction via the through hole.
  • the coil circulates in a substantially rectangular shape.
  • the non-magnetic layer is formed by screen printing on the outer region of the coil pattern on the magnetic layer sheet. A nonmagnetic layer is in contact with the outer periphery of the coil pattern, and the outer dimension of the nonmagnetic layer is substantially the same as that of the magnetic layer.
  • the nonmagnetic layer is formed with square notches 115 at four corners on the outer periphery, and these notches 115 do not contact the coil pattern.
  • the notch 115 formed in the non-magnetic material 14 has a cross section formed only of the magnetic material layer so as to include a side portion parallel to the lamination direction of the magnetic material layer in the multilayer chip.
  • a square columnar region 112 is formed.
  • it is an effective means to reduce the magnetic flux passing through the external electrode, so that the columnar region 112 is at least so that the magnetic flux passing through the external electrode can be guided to the columnar region. It is formed so as to be in contact with the external electrode on one surface.
  • the columnar region 112 and the external electrode are preferably formed in contact with each other over a wider area in order to improve the Q value.
  • FIG. 4 A second embodiment of the present invention is shown in FIG.
  • the second embodiment of the multilayer inductor of the present invention has a rectangular parallelepiped multilayer chip 12 and a pair of external electrodes 17 formed on the end face of the multilayer chip.
  • the multilayer chip 12 includes a plurality of magnetic layers 13 having a square planar shape and stacked in the thickness direction, and a plurality of coil patterns 113 respectively disposed between adjacent magnetic layers.
  • the coil patterns 113 are connected to each other to form a helical coil.
  • lead portions 18 and 110 reaching the edge of the magnetic layer are connected to the start and end of the coil to form a coil conductor.
  • a non-magnetic layer 14 is disposed between the adjacent magnetic layers 13 in the multilayer chip 12 where the coil pattern 113 is disposed and outside the spiral coil.
  • the nonmagnetic layer 14 has substantially the same outer dimensions as the magnetic layer, and has a ring shape in which triangular notches 115 are formed at four corners on the outer periphery. At this time, the notched portion 115 is formed with a columnar region 16 having a triangular cross-section composed only of a magnetic layer.
  • External electrodes 17 are provided on the two opposing side surfaces of the laminated chip so as to be electrically connected to the start and end of the coil by applying silver paste.
  • the external electrode 17 is subjected to two-layer plating.
  • the main part of the multilayer chip 12 is a magnetic layer made of Ni—Zn—Cu based ferrite or the like, and the magnetic layer is formed by stacking a plurality of sheets of rectangular magnetic layers.
  • a spiral coil is formed inside the multilayer chip, and a nonmagnetic layer 14 made of Zn—Cu ferrite or the like is disposed on the outer periphery of the coil.
  • a coil pattern conductor having a shape obtained by dividing the coil turns is screen-printed on a magnetic sheet.
  • the coil is formed by conducting and laminating the coil pattern on the magnetic sheet in the thickness direction via the through hole.
  • the coil circulates in a substantially rectangular shape.
  • the nonmagnetic layer 14 is formed by screen printing on the outer region of the coil pattern on the magnetic sheet.
  • a nonmagnetic layer is in contact with the outer periphery of the coil pattern, and the outer dimension of the nonmagnetic layer is substantially the same as that of the magnetic layer.
  • the nonmagnetic layer 14 is formed with isosceles triangular notches 115 at four corners on the outer periphery, and the area thereof is the same as the square notch 115 of the first embodiment. This notch 115 does not contact the coil pattern.
  • the notch 115 formed in the nonmagnetic layer 14 has a columnar region having a triangular cross-section configured only by the magnetic layer so as to include a side parallel to the stacking direction of the magnetic layer in the multilayer chip. 16 is formed.
  • the columnar region 16 is formed so as to guide more magnetic flux passing through the external electrode to the columnar region 16. It is formed so as to be in contact with the external electrode 17 on at least one surface. In order to improve the Q value, it can be said that the columnar region 16 and the external electrode 17 are preferably formed in contact with each other over a wider area.
  • FIGS. 5 is a perspective view of the multilayer inductor 20
  • FIG. 6 is a cross-sectional view of the multilayer inductor 20
  • FIG. 7 is an element configuration diagram of the multilayer inductor 20. As shown in FIGS.
  • the multilayer inductor 20 includes a rectangular parallelepiped multilayer chip 22 and a pair of external electrodes 27 formed on the end face of the multilayer chip.
  • the multilayer chip 22 includes a plurality of magnetic layers 23 having a square planar shape and stacked in the thickness direction, A plurality of coil patterns 213 are provided between adjacent magnetic layers. The coil patterns 213 are connected to each other to form a spiral coil 218. Furthermore, lead portions 28 and 210 reaching the edge of the magnetic layer are connected to the start and end of the coil 218 to form a coil conductor 25.
  • a non-magnetic layer 24 is disposed in an area outside the spiral coil 218 between the adjacent magnetic layers 23 in the multilayer chip 22 where the coil pattern 213 is disposed. Yes.
  • the nonmagnetic layer 24 has an outer shape substantially the same as that of the magnetic layer and has an annular shape.
  • the difference from the present invention is that the annular non-magnetic layer 24 is formed with notches 115 at the four corners of the outer periphery of the first and second embodiments of the present invention described above. In other words, the columnar region 112 or 16 consisting only of the magnetic layer is not formed.
  • FIG. 8 is a cross-sectional view of the laminated surface having the single coil pattern 213 (the laminated surface 216 in FIG. 7) in the multilayer chip in which the entire outer region of the substantially C-shaped coil pattern 213 in FIG.
  • the magnetic flux density is indicated by brightness. The lower the magnetic flux density, the higher the brightness is displayed.
  • the simulation was performed assuming that the outer dimension of the magnetic layer was 2.4 ⁇ 2.4 mm.
  • the numerical value of the scale indicates the magnetic flux density, and the unit is T.
  • the magnetic flux density in the four corner regions (in the portion A in FIG. 8) of the multilayer chip is lower than the magnetic flux density in other regions in the multilayer chip.
  • the magnetic flux density in the region in contact with the coil conductor B is high.
  • the magnetic flux density at the four corners of the multilayer chip in FIG. 8 is lower than the magnetic flux density at other regions in the multilayer chip. It can be seen that the region is hard to be magnetically saturated.
  • notches 115 are formed at four corners on the outermost periphery of the nonmagnetic layer disposed in the region outside the coil of the multilayer chip, and only the magnetic layer is formed here.
  • the configured columnar region 112 or 16 is arranged so as not to contact the coil conductor. This structure makes it easy for magnetic flux to be generated in the four corner areas of the multilayer chip, and it is possible to utilize the magnetic properties of the areas where magnetic flux has hardly been generated in the multilayer chip until now. .
  • the inductance value is improved as compared with the conventional multilayer inductor in which the nonmagnetic material layer is inserted on the entire outer periphery of the coil, and the direct current superposition characteristic is hardly deteriorated. You can enjoy the benefits.
  • the notched portion of the non-magnetic layer is formed in a region having a high magnetic flux density, for example, a region in contact with the coil conductor in the simulation results of FIG.
  • a region having a high magnetic flux density for example, a region in contact with the coil conductor in the simulation results of FIG.
  • a notch portion of the nonmagnetic material layer is formed in a region in contact with the external electrode, and a columnar region composed of only the magnetic material layer is disposed in the notch portion.
  • the magnetic flux leaks to the outside of the multilayer chip and easily passes through the external electrode because of the nonmagnetic layer around the entire circumference of the coil.
  • the magnetic flux is more likely to pass through the columnar region than the external electrode.
  • the Q value is improved.
  • Example 1 First, ethyl cellulose and tepineol were added to and kneaded with Ni-Zn-Cu ferrite fine powder after calcining and pulverizing mainly containing FeO 2 , CuO, ZnO, and NiO to prepare a slurry.
  • the slurry was drawn with a doctor blade so as to have a constant thickness, and the dried one was cut into a predetermined printing size to produce a magnetic sheet.
  • through holes were formed at predetermined positions by a method such as punching with a mold or drilling by laser processing.
  • a silver paste was printed on a magnetic sheet using a screen plate having a partial shape of a coil pattern and dried.
  • the non-magnetic paste was prepared by adding ethyl cellulose and tepineol to a calcined and pulverized Zn—Cu ferrite fine powder mainly containing FeO 2 , CuO, and ZnO.
  • the non-magnetic paste was positioned so as to be printed at a predetermined position outside the coil pattern, and screen printing was performed. At this time, the printed pattern shape of the non-magnetic material occupies the outer region of the coil pattern, but square notches are formed at the four corners on the outermost periphery. Due to this notch, a columnar region in which only the magnetic layer is continuous during lamination is formed.
  • tin electrolytic barrel plating is performed to form an external electrode 17 in which a silver electrode layer, a nickel plating layer, and a tin plating layer are laminated in this order, as shown in FIG. A multilayer inductor 10 was obtained.
  • each main part of the multilayer inductor sample of Example 1 obtained above is as follows.
  • Multi-layer inductor dimensions length 3.2mm x width 1.6mm x height 1.6mm
  • Magnetic layer Ni—Zn—Cu-based ferrite
  • Non-magnetic layer disposed on the outer periphery of the coil pattern, and square corners with sides of 0.2 mm are formed at the four corners.
  • Coil 1 turn dimension Long side 2.0mm x Short side 1.0mm Conductor width 0.3mm
  • the laminated surface 116 shown in FIG. 3 is shown in FIG.
  • Example 2 First, ethyl cellulose and tepineol were added to and kneaded with Ni-Zn-Cu ferrite fine powder after calcining and pulverizing mainly containing FeO 2 , CuO, ZnO, and NiO to prepare a slurry.
  • the slurry was drawn with a doctor blade so as to have a constant thickness, and the dried one was cut into a predetermined printing size to produce a magnetic sheet.
  • a through hole is formed in a predetermined position in the magnetic sheet by a technique such as punching with a mold or drilling by laser processing.
  • a silver paste was printed on a magnetic sheet using a screen plate having a partial shape of a coil pattern and dried.
  • the non-magnetic paste was prepared by adding ethyl cellulose and tepineol to a Zn-Cu ferrite fine powder after calcining and pulverizing mainly containing FeO2, CuO and ZnO.
  • the non-magnetic paste was positioned so as to be printed at a predetermined position outside the coil pattern, and screen printing was performed. At this time, the printed pattern shape of the non-magnetic material occupies the outer area of the coil pattern, but isosceles triangular notches are formed at the four corners on the outermost periphery.
  • the area of the notch is the same as the area of the first embodiment, and the notch forms a columnar region in which only the magnetic layer is continuous during lamination.
  • tin electrolytic barrel plating is performed to form an external electrode in which a silver electrode layer, a nickel plating layer, and a tin plating layer are stacked in this order. An inductor 11 was obtained.
  • Multi-layer inductor dimensions length 3.2mm x width 1.6mm x height 1.6mm
  • Magnetic material layer Ni-Zn-Cu ferrite
  • Nonmagnetic material layer An outer periphery of the coil pattern, cut off by a right angled isosceles triangle with two sides sandwiching a right angle between the four corners. Each notch is formed. The area of the notch is the same as that of the first embodiment.
  • Coil 1 turn dimension Long side 2.0mm x Short side 1.0mm Conductor width 0.3mm
  • the laminated surface 117 shown in FIG. 4 is shown in FIG.
  • the non-magnetic paste was prepared by adding ethyl cellulose and tepineol to a Zn-Cu ferrite fine powder after calcining and pulverizing mainly containing FeO2, CuO and ZnO.
  • the non-magnetic paste was positioned so as to be printed at a predetermined position outside the coil pattern, and screen printing was performed. At this time, the printed pattern shape of the non-magnetic material layer occupies the outer area of the coil pattern, but at the substantially central portion of the four straight portions of the coil, 0 is obtained after firing, as in the first and second embodiments. There is a square notch with an area of .04 mm 2 .
  • the notch is disposed in contact with the coil pattern on the inner side and in contact with the outer periphery of the magnetic layer so as to divide the outer region of the coil pattern.
  • a columnar region in which only the magnetic layer is continuous at the time of lamination is formed in the notch.
  • a silver paste is applied to the two opposite side surfaces of the obtained laminate chip by a dip method so as to be connected to the coil lead portion, and heated for 1 hour at about 600 ° C. in the atmosphere and baked to form a pair of silver electrode layers. did. After nickel electrolytic barrel plating was performed on the silver electrode layer, tin electrolytic barrel plating was performed to form an external electrode, whereby the multilayer inductor 21 of Comparative Example 1 was obtained.
  • each main part of the multilayer inductor sample of Comparative Example 1 obtained above is as follows.
  • Multi-layer inductor dimensions length 3.2mm x width 1.6mm x height 1.6mm
  • Magnetic material Ni—Zn—Cu-based ferrite
  • Non-magnetic material layer disposed on the outer periphery of the coil pattern
  • a notch of 0.04 mm 2 is formed at the approximate center of the four sides of the coil. Note that the area of the notch is the same as that in the first and second embodiments.
  • Coil 1 turn dimension Long side 2.0mm x Short side 1.0mm Conductor width 0.3mm
  • a representative surface of Comparative Example 1 is shown in FIG. 9c.
  • the non-magnetic paste was prepared by adding ethyl cellulose and tepineol to a calcined and pulverized Zn—Cu ferrite fine powder mainly containing FeO 2 , CuO, and ZnO.
  • the non-magnetic paste was positioned so as to be printed at a predetermined position outside the coil pattern, and screen printing was performed. At this time, the printed pattern shape of the non-magnetic material has no notch as shown in FIG. 7, and occupies the entire outer area of the coil pattern.
  • magnetic sheets were laminated, the positions were determined so that the coil patterns of adjacent magnetic sheets were connected and connected through through-holes, and press-bonded. This was cut into a predetermined size, heated at 500 ° C.
  • a silver paste is applied to the opposing two side surfaces of the obtained laminated chip by a dip method or the like so as to be connected to the coil lead-out portion, and heated for 1 hour at about 600 ° C. in the atmosphere and baked to form a pair of silver electrode layers. Formed. After nickel electrolytic barrel plating is performed on the silver electrode layer, tin electrolytic barrel plating is performed to form an external electrode in which a silver electrode layer, a nickel plating layer, and a tin plating layer are laminated in this order.
  • the multilayer inductor 20 of the conventional example 1 shown was obtained.
  • each main part of the multilayer inductor sample of Conventional Example 1 obtained above is as follows.
  • Multi-layer inductor dimensions length 3.2mm x width 1.6mm x height 1.6mm
  • Magnetic material layer Ni-Zn-Cu ferrite
  • Nonmagnetic material layer Arranged in the entire outer periphery of the coil pattern
  • Coil 1 turn size Long side 2.0 mm x Short side 1.0 mm Conductor width 0.3 mm
  • the laminated surface 217 shown in FIG. 7 is shown in FIG.
  • FIG. 10 shows the result obtained by measuring the inductance value at that time and calculating the rate of change of the inductance with respect to the initial inductance value.
  • the horizontal axis represents the current value flowing through the multilayer inductor sample
  • the vertical axis represents the rate of change in inductance with respect to the initial inductance value.
  • the alternate long and short dash line indicates Example 1
  • the solid line indicates Example 2
  • the two-dot chain line indicates Comparative Example 1
  • the broken line indicates Conventional Example 1.
  • the inductance change rate is the smallest because the non-magnetic layer is in the entire outer periphery of the coil.
  • the inductance change rate decreased substantially uniformly with respect to the current value, and showed an inductance change rate of about -16% at 1200 mA.
  • the inductance change rate is increased in the multilayer inductor samples of Example 1 and Example 2 having the nonmagnetic material layer in which the notches are formed at the four corners on the outermost periphery.
  • the rate of change in inductance with respect to the current value is slightly large up to about 200 mA, the rate of change in inductance with respect to the current value is almost uniformly reduced thereafter.
  • Example 1 In the case of Example 1, an inductance change rate of about ⁇ 27% at 1200 mA was shown, and in the case of Example 2, an inductance change rate of about ⁇ 22% at 1200 mA was shown.
  • the inductance change rate is further increased in the multilayer inductor sample of Comparative Example 1 having a nonmagnetic layer in which a rectangular notch is formed at substantially the central part of the outer peripheral four sides of the coil.
  • the multilayer inductor sample of Comparative Example 1 shows an inductance change rate of about ⁇ 55% when the current value is between 0 and 400 mA, and then decreases substantially uniformly with respect to the current value, and the inductance change is about ⁇ 60% at 1200 mA. Showed the rate.
  • the notch portion of the nonmagnetic material layer is formed in a region having a high magnetic flux density, so that the magnetic flux in the region is saturated to a current value of 400 mA and the direct current superimposition characteristics are deteriorated. It is.
  • the notched portion of the nonmagnetic material layer is formed in the region having the lowest magnetic flux density, so that the magnetic flux does not saturate with respect to the current value, that is, the DC superimposition characteristics. Does not drop significantly, and is at a level that can be used sufficiently.
  • FIG. 11 shows the multilayer inductor samples obtained in Examples 1 and 2 of the present invention and the multilayer inductor sample of Conventional Example 1 obtained as described above and the current value flowing through the sample on the horizontal axis. Is shown on the vertical axis.
  • the alternate long and short dash line indicates Example 1
  • the solid line indicates Example 2
  • the broken line indicates Conventional Example 1.
  • the current value flowing through the sample is in the range up to 300 mA
  • the inductor sample of Example 2 of the present invention the current value flowing through the sample is up to 150 mA. It can be seen that the inductance values are higher than those of Conventional Example 1 in the range.
  • Example 1 and Example 2 the notch portion of the nonmagnetic material layer is formed at the four corners, so that the magnetic flux is guided to the four corner regions, that is, the region where the magnetic flux density of the multilayer chip is low. Is. This is because the non-magnetic material has been arranged uniformly or at a position that is not considered so far, so that the magnetic property of the part is effectively used by guiding the magnetic flux to the region where the magnetic flux density is low. It is a thing.
  • the results of the Q value for each test condition are shown in Table 1.
  • the Q value was measured at a frequency of 1 MHz using 4285A manufactured by Agilent.
  • the Q values of Comparative Example 1, Example 1, and Example 2 are higher than those of Conventional Example 1.
  • the difference in these Q values is presumed to be due to the amount of magnetic flux passing through the external electrode. That is, when the amount of magnetic flux passing through the external electrode is large, the eddy current generated in the external electrode becomes a loss factor along with the magnetic flux, so that the Q value decreases, and conversely, when the amount of magnetic flux passing through the external electrode is small
  • the Q value is increased, and a more preferable characteristic value is obtained.
  • Example 1 and Example 2 there are four regions in the multilayer chip where no non-magnetic material is provided, and all of the regions are provided in contact with the external electrodes, so that they passed through the external electrodes in Conventional Example 1. A part of the magnetic flux passes through a region where no nonmagnetic material is provided in the first and second embodiments.
  • the magnetic flux passing through the external electrode is less than that in Conventional Example 1, so that the Q value in Example 1 and Example 2 is higher than that in Conventional Example 1.
  • the Q value of Comparative Example 1 in which two regions where no nonmagnetic material is provided is in contact with the external electrode is a value between Conventional Example 1, Example 1, and Example 2.
  • Example 1 and Example 2 of the present invention are compared with Conventional Example 1 and Comparative Example 1, the present invention increases the inductance value L and further improves the Q value without impairing the DC superimposition characteristics. It can be said that it was possible.

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Abstract

L'invention concerne une inductance à couches multiples pouvant augmenter la valeur d'inductance (L) et empêcher que la valeur Q ne diminue, sans perdre les caractéristiques de superposition de courant continu. L'inductance à couches multiples (10) possède une puce à couches multiples (12), prenant la forme d'un parallélépipède rectangulaire, et une paire d'électrodes extérieures (17) formées sur les surfaces d'extrémité de la puce à couches multiples. La puce à couches multiples est dotée d'une pluralité de couches magnétiques (13), de conducteurs bobinés (15) et de couches non magnétiques (14). Chacune des couches non magnétiques est implantée entre des couches magnétiques adjacentes, des parties encochées de forme rectangulaires (115) sont formées dans les quatre coins de la périphérie extérieure de chaque couche non magnétique, dans une zone extérieure à une bobine en spirale (118), et des zones en forme de colonne (112), constituées de couches magnétiques, sont formées dans les parties encochées. Cette structure introduit le flux magnétique dans les zones en forme de colonne, de sorte que la saturation magnétique tend à ne pas se produire et que les caractéristiques de superposition de courant continu sont préservées. De plus, les parties encochées formées dans le matériau non magnétique sont disposées de manière à être mises en contact avec les électrodes extérieures, si bien que le coefficient Q est amélioré.
PCT/JP2010/064771 2009-10-23 2010-08-31 Inductance à couches multiples WO2011048873A1 (fr)

Priority Applications (1)

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CN2010800357678A CN102473504A (zh) 2009-10-23 2010-08-31 积层电感器

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JP2009244738A JP2011091269A (ja) 2009-10-23 2009-10-23 積層インダクタ
JP2009-244738 2009-10-23

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JP (1) JP2011091269A (fr)
KR (1) KR20120023689A (fr)
CN (1) CN102473504A (fr)
TW (1) TW201135761A (fr)
WO (1) WO2011048873A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5464306B2 (ja) * 2012-01-10 2014-04-09 株式会社村田製作所 アンテナ素子およびアンテナモジュール
WO2014069050A1 (fr) * 2012-11-01 2014-05-08 株式会社村田製作所 Bobine d'induction stratifiée
KR102460765B1 (ko) * 2016-06-22 2022-10-28 파나소닉 아이피 매니지먼트 가부시키가이샤 커먼 모드 노이즈 필터
CN107146680A (zh) * 2017-03-15 2017-09-08 广东风华高新科技股份有限公司 积层电感器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130109A (ja) * 1994-11-02 1996-05-21 Matsushita Electric Ind Co Ltd 積層部品用非磁性絶縁材料、積層部品およびその製造法
JP2006318946A (ja) * 2005-05-10 2006-11-24 Fdk Corp 積層インダクタ
JP2007281379A (ja) * 2006-04-11 2007-10-25 Fdk Corp 積層インダクタ

Family Cites Families (1)

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Publication number Priority date Publication date Assignee Title
CN1220994C (zh) * 1998-10-22 2005-09-28 太阳诱电株式会社 积层电子元件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130109A (ja) * 1994-11-02 1996-05-21 Matsushita Electric Ind Co Ltd 積層部品用非磁性絶縁材料、積層部品およびその製造法
JP2006318946A (ja) * 2005-05-10 2006-11-24 Fdk Corp 積層インダクタ
JP2007281379A (ja) * 2006-04-11 2007-10-25 Fdk Corp 積層インダクタ

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KR20120023689A (ko) 2012-03-13
CN102473504A (zh) 2012-05-23
TW201135761A (en) 2011-10-16

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