WO2011043464A1 - 型および型の製造方法ならびに反射防止膜 - Google Patents
型および型の製造方法ならびに反射防止膜 Download PDFInfo
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- WO2011043464A1 WO2011043464A1 PCT/JP2010/067753 JP2010067753W WO2011043464A1 WO 2011043464 A1 WO2011043464 A1 WO 2011043464A1 JP 2010067753 W JP2010067753 W JP 2010067753W WO 2011043464 A1 WO2011043464 A1 WO 2011043464A1
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- alumina layer
- porous alumina
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/12—Anodising more than once, e.g. in different baths
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Definitions
- An optical element such as a display device or a camera lens used for a television or a mobile phone is usually provided with an antireflection technique in order to reduce surface reflection and increase light transmission.
- an antireflection technique in order to reduce surface reflection and increase light transmission. For example, when light passes through the interface of a medium with a different refractive index, such as when light enters the interface between air and glass, the amount of transmitted light is reduced due to Fresnel reflection, etc., and visibility is reduced. is there.
- anodized porous alumina layer obtained by anodizing aluminum will be briefly described.
- a method for producing a porous structure using anodization has attracted attention as a simple method capable of forming regularly ordered nano-sized cylindrical pores (fine concave portions).
- an acidic or alkaline electrolyte such as sulfuric acid, oxalic acid, or phosphoric acid
- a voltage is applied using the aluminum substrate as an anode
- oxidation and dissolution proceed simultaneously on the surface of the aluminum substrate.
- An oxide film having pores can be formed. These cylindrical pores are oriented perpendicular to the oxide film and exhibit self-organized regularity under certain conditions (voltage, type of electrolyte, temperature, etc.). Is expected.
- Patent Document 3 discloses a technique for forming a tapered concave portion in which the pore diameter continuously changes by repeating aluminum anodization and pore diameter enlargement processing.
- Non-Patent Document 1 an aqueous solution of oxalic acid is used as an electrolytic solution, and a mirror surface of an aluminum substrate is subjected to anodization (MA: mild anodization) at a relatively low voltage (40 V), and then a relatively high voltage ( An anodizing method in which anodization (HA) is performed at 100 to 160 V) is disclosed.
- MA mild anodization
- HA anodizing method in which anodization (HA) is performed at 100 to 160 V
- Non-Patent Document 1 has the subject of forming a porous alumina layer having a pore arrangement with extremely high regularity by utilizing self-organization, and cannot be obtained by conventional MA. It is said that a highly ordered self-organized porous alumina layer having a pore interval of 300 nm can be formed by the above method.
- the MA process in order to prevent breakdown in the HA process, it is necessary to form a porous alumina layer having a thickness of 400
- the present invention has been made to solve the above-mentioned problems, and its main object is to provide a mold manufacturing method capable of suppressing the formation of a plurality of micropores in one pore. .
- the mold manufacturing method according to the present invention is a mold manufacturing method having an inverted moth-eye structure on the surface, which has a plurality of recesses having a two-dimensional size of 50 nm or more and less than 500 nm when viewed from the normal direction of the surface.
- A a step of forming a porous alumina layer having a plurality of fine recesses by anodizing the surface of an aluminum substrate; and (b) after the step (a), the porous alumina layer.
- the number density of the fine recesses after the step (c) is less than 1.26 times the number density of the fine recesses after the step (a).
- the step (a) and the step (c) are performed in the same electrolytic solution, and the growth rate in the thickness direction of the porous alumina layer in the step (a) is determined by the step (c). Is smaller than the growth rate in the thickness direction of the porous alumina layer.
- Another mold of the present invention is a mold produced by any one of the above manufacturing methods, and has a plurality of recesses having a two-dimensional size of 50 nm or more and less than 500 nm when viewed from the normal direction of the surface.
- the aspect ratio is 0.5 or more and 6.0 or less.
- the aspect ratio of the plurality of recesses refers to the ratio of the depth to the two-dimensional size (diameter) of the recesses.
- the antireflection film of the present invention is an antireflection material produced using the above mold, and has a plurality of convex portions having a bottom surface having a diameter of 50 nm or more and 500 nm or less on the surface.
- the portions are arranged so as not to have periodicity, and the surface has a plurality of locations where two or more of the plurality of projections are in contact with each other, and the two or more projections
- the number density of the places in contact with each other is 1.3 pieces / ⁇ m 2 or less.
- (A)-(e) is typical sectional drawing for demonstrating the manufacturing method of the moth-eye type
- (A)-(e) is typical sectional drawing for demonstrating the manufacturing method of the mold 200A for moth eyes of a comparative example.
- (A), (b), (c) is a figure which shows the SEM image of the surface of the type
- an aluminum base material 10 having a glass substrate 16 and an aluminum film 18 deposited on the glass substrate 16 is prepared.
- the aluminum base material 10 in which the aluminum film 18 having a thickness of 1 ⁇ m is formed on the glass substrate 16 by using a vacuum deposition method or a sputtering method is prepared.
- etching solution for example, an aqueous solution of 10% by mass of phosphoric acid, an organic acid such as formic acid, acetic acid or citric acid, or a mixed solution of chromium phosphoric acid can be used.
- etching is performed using phosphoric acid (1 mol / L (liter), 30 ° C.) for 25 minutes.
- the pores formed in the first anodic oxidation step in the second anodic oxidation step will be described in detail later. It is possible to make it difficult to generate a structure in which a plurality of micropores are formed on the inner surface (hereinafter also referred to as “a micropore having a plurality of micropores”).
- the second anodic oxidation step may be performed in the same electrolytic solution as the first anodic oxidation step.
- FIG. 2 a conventional moth-eye mold manufacturing method in which the applied voltage in the first anodic oxidation step and the applied voltage in the second anodic oxidation step are the same, and the first and second anodes It will be described that a large number of pores having a plurality of micropores formed when the applied voltage in the oxidation step is the same.
- an aluminum substrate 50 having a glass substrate 56 and an aluminum film 58 deposited on the glass substrate 56 is prepared.
- Mode I In the initial stage of anodization, a thin barrier layer is formed on the aluminum surface. When the surface of aluminum is flat, a flat thin barrier layer is uniformly formed. The overall current density decreases monotonically.
- a plurality of micropores are easily formed in the pores formed by the first anodic oxidation as follows. Conceivable. In order to form a plurality of micropores in the pores formed by the first anodic oxidation, the pores are formed at intervals smaller than the pore interval of the porous alumina layer formed by the first anodic oxidation. Need to be done. Here, it is considered that there is a distribution in the voltage (effective voltage) that is actually applied to the surface of the aluminum substrate during anodization. This distribution of effective voltage is considered to be caused by, for example, a local concentration distribution of the electrolytic solution.
- the effective voltage of the portion where the above-described voltage is relatively low and micropores are likely to be newly formed becomes high. It is considered that a plurality of micropores are hardly formed by oxidation.
- the number density of fine recesses in the porous alumina layer after the second anodic oxidation step is set by making the applied voltage of the second anodic oxidation larger than the applied voltage of the first anodic oxidation.
- the number density of all the fine recesses including the pores and the micropores formed in the pores can be less than 1.26 times the number density of the fine recesses after the first anodic oxidation. It was.
- the growth rate in the thickness direction of the porous alumina layer in the second anodic oxidation step is preferably 0.5 nm / sec or more and 35 nm / sec or less.
- the growth rate of the porous alumina layer in the thickness direction can vary depending on, for example, the type of the electrolytic solution, the concentration of the electrolytic solution, and the applied voltage. If the type and concentration of the electrolytic solution are the same, the higher the applied voltage, the higher the growth rate of the porous alumina layer. Further, if the applied voltage is the same, the growth rate increases as the concentration of the electrolytic solution increases.
- both Examples 1 and 2 were able to reduce the number density of pores in which a plurality of micropores were formed as compared with the moth-eye mold of Comparative Example 1.
- Example 2 has a smaller number density of pores in which a plurality of micropores are formed than Example 1.
- an antireflection film in which a cured product layer of an ultraviolet curable resin to which the concavo-convex structure of the moth-eye mold was transferred was formed on the TAC film was obtained.
- FIG. 7 is a diagram schematically showing a measurement system of the scattered light intensity of the antireflection film 110A.
- the antireflection film 110A is fixed to the transparent acrylic plate 46, and light is irradiated from a light source 54 installed at an angle of ⁇ 1 (here, 30 °) with respect to the back surface of the transparent acrylic plate 46.
- the intensity of the scattered light was measured using a luminance meter 52 (super low luminance spectral radiometer (SR-UL1, manufactured by TOPCON)) installed at an angle of ⁇ 2 (here, 30 °) with respect to the surface of the acrylic plate 46 (
- scattered light is schematically shown by arrows.
- As the light source 54 standard light D65 was used.
- the antireflection film preferably has a small color difference from an achromatic color, and particularly preferably 3.0 or less. This is because when the color difference from the achromatic color is large, the color reproducibility of the display panel is deteriorated when used as an antireflection film of a display device. In general, when the color difference between two objects to be compared is more than 3.0, it is recognized that they have different colors. Therefore, the antireflection film has a color difference from an achromatic color of more than 3.0. If so, the color difference is so large that the color difference is recognized when compared with the achromatic color, which is not preferable. All of the antireflection films 110A, 110B, and 210A were able to reduce the color difference ⁇ E from the achromatic color to 3.0 or less.
- the method for manufacturing a moth-eye mold according to an embodiment of the present invention can be used for manufacturing a moth-eye mold having a desired aspect ratio.
- the aspect ratio the ratio of the height to the two-dimensional size (diameter) of the bottom surface of the protrusion
- the aspect ratio of the convex portion can be lowered by decreasing the aspect ratio of the pores of the porous alumina layer of the mold (ratio of the depth to the two-dimensional size (diameter) of the pores).
- five types of antireflection films 300A to 300E were produced by the method described with reference to FIG.
- a TAC film was used as a workpiece.
- the ultraviolet curable resin was cured by irradiating the ultraviolet curable resin with ultraviolet rays ( 2 J / cm 2 ) in a state where the ultraviolet curable resin was applied between the surface of the TAC film and the mold. Note that the TAC film was bonded with a roller so that air bubbles would not enter.
- an antireflection film in which a cured product layer of an ultraviolet curable resin to which the concavo-convex structure of the moth-eye mold was transferred was formed on the TAC film was obtained.
- the obtained antireflection film was attached to a transparent acrylic plate. As described above, since the two-dimensional sizes of the mold pores were all about 180 nm, the two-dimensional sizes of the projections on the surface of the five types of antireflection films obtained were Was about 180 nm. Therefore, the aspect ratio of the protrusions on the surfaces of the five types of antireflection films was larger as the protrusions were higher.
- the scattered light intensity of the antireflection films 300A, 300B, 300C, 300D, and 300E was examined using a luminance meter by the same method as described with reference to FIG.
- FIG. 10 shows the wavelength dependence of the scattered light intensity of the antireflection films 300A, 300B, 300C, 300D, and 300E as a thick solid line, a thin solid line, a dotted line, a one-dot chain line, and a thick dotted line, respectively.
- the scattered light intensity increased in the order of the antireflection films 300A, 300B, 300C, 300D, and 300E in the entire wavelength region.
- the color difference from the achromatic color is 3.0 or less because a decrease in color reproducibility when used as an antireflection film of a display device is suppressed.
- Table 3 only the antireflection film 300E had a color difference from an achromatic color larger than 3.0. From Table 3, the antireflection film 300D had a sticking density of 1.3 and a color difference from an achromatic color of 2.3. Therefore, if the sticking density is 1.3 or less, the color difference from the achromatic color can be 3.0 or less, which is preferable from the viewpoint of color reproducibility.
- the aspect ratio of the protrusion is 1.42 (antireflection film 300D) or less
- the sticking density can be 1.3 or less
- the color difference from the achromatic color can be 3.0 or less. preferable.
- a moth-eye mold in which pores having a desired aspect ratio are formed can be manufactured.
- the shape of the moth-eye mold is preferably conical, from the normal direction of the surface of the pore.
- the two-dimensional size and pore spacing when viewed are preferably 50 nm or more and less than 500 nm.
- the barrier-type alumina layer is used before the first anodic oxidation process. Is preferably formed. In particular, when anodizing using a deposited aluminum film, it is preferable to form a barrier type alumina layer in order to increase the pore spacing. By forming a barrier type alumina layer in advance, a porous alumina layer having a desired pore interval can be formed.
- the size of the pore interval in the porous alumina layer obtained through the stable growth process of the pores depends on the magnitude of the applied voltage.
- the pore spacing D int is represented by the sum of the pore wall total thickness 2a and the pore diameter D p (see FIG. 11C).
- the pore wall thickness is the thickness of the barrier layer.
- the pore interval D int and the applied voltage sometimes do not satisfy the above relationship. That is, the thickness of the barrier layer is proportional to the applied voltage, but the pore interval Dint is not proportional to the applied voltage and does not exceed a certain value.
- the surface of the aluminum film is anodized under the condition that a porous alumina layer having a pore interval of 200 nm or more is expected to be formed from the above-described relationship. Even so, the pore spacing did not exceed about 180-190 nm.
- the aluminum film deposited on the substrate was an aggregate of crystal grains, and the average grain size of the crystal grains was approximately 180 to 190 nm.
- the pore spacing of the porous alumina layer obtained by anodizing the surface of the aluminum film is limited by the crystal grain size constituting the aluminum film. The reason is considered as follows.
- the grain boundary in the aluminum film becomes a recess on the film surface. Accordingly, the surface of the barrier layer formed in the above modes I and II also becomes a recess at a position corresponding to the grain boundary, and as a result of the concentration of the electric field, pores grow preferentially at the position corresponding to the grain boundary. Thereafter, even when anodic oxidation proceeds, preferential dissolution in pores formed at positions corresponding to the grain boundaries continues.
- the barrier layer grows until it has a recess where electric field concentration is large enough to cause local dissolution, and then transitions to mode III, whereas aluminum having a grain boundary
- electric field concentration occurs in the recess due to the grain boundary, and the mode III is shifted. Therefore, the thickness of the barrier layer when shifting to mode III is thinner in an aluminum film having a grain boundary than in aluminum having a flat surface.
- the present inventor forms the barrier type alumina layer 12 before the anodic oxidation for forming the porous alumina layer on the surface of the aluminum film, so that the pore interval is limited by the crystal grain size constituting the aluminum film.
- the inventors have come up with the following method for forming an anodized layer.
- a method for forming an anodized layer according to an embodiment of the present invention will be described with reference to FIGS.
- an aluminum base material 10 having an aluminum film 18 deposited on a glass substrate 16 is prepared.
- the aluminum film 18 is formed using, for example, a vacuum deposition method or a sputtering method.
- the thickness of the aluminum film 18 is, for example, 1 ⁇ m.
- the average grain size of the crystal grains constituting the aluminum film 18 is approximately 180 to 190 nm.
- the thickness of the barrier-type alumina layer 12 is appropriately set according to the target pore interval, as will be described later with reference to experimental examples.
- the barrier type alumina layer By forming the barrier type alumina layer, it is possible to suppress the pore interval of the porous alumina layer formed thereafter from being limited by the crystal grain size, and to adjust the thickness of the barrier type alumina layer 12. By doing so, the pore interval of the porous alumina layer can be adjusted.
- anodic oxidation is performed under conditions for forming a porous alumina layer.
- the condition at this time is a condition in which the thickness a of the barrier layer 14b in the porous alumina layer 14 to be formed is larger than the thickness of the already formed barrier type alumina layer. If the condition at this time is such that the thickness a of the barrier layer 14b in the porous alumina layer 14 to be formed is smaller than the thickness of the barrier-type alumina layer already formed, the anodic oxidation does not proceed. This is because sufficient current is not supplied to the aluminum film.
- the surface 18s of the base material 10 is anodized for 2 minutes using ammonium tartrate (concentration 0.1 mol / L, pH 6.5, liquid temperature 23.0 ° C.).
- ammonium tartrate concentration 0.1 mol / L, pH 6.5, liquid temperature 23.0 ° C.
- the barrier type alumina layer 12 was formed.
- any one of 80, 100, 120, 150, and 180 V shown in Table 4 was applied by a direct current method.
- the porous alumina layer 14 was formed by anodic oxidation using oxalic acid (pH 6.5, concentration 0.6 wt%, liquid temperature 5 ° C.).
- the applied voltage was a pulse voltage having an amplitude of 150, 200, or 300 V shown in Table 4, a pulse width t of 10 msec, and a pulse interval T of 1 sec. Note that the pulse voltage was applied in order to suppress the disconnection of the aluminum film. Anodized until the aluminum was completely alumina.
- the anodic oxidation time for forming the porous alumina layer was in the range of 1 to 30 min.
- the porous alumina layers 90A-90B and the porous alumina layers 90F-90I As the porous alumina layer 90C-90E is applied, the higher the applied voltage of anodic oxidation for forming the barrier type alumina layer, that is, the thicker the barrier type alumina layer is. As shown, the pore spacing was large (Table 4).
- the substrate was the same substrate as that used in the porous alumina layer 90A-90I.
- porous alumina layer 92I-92L In the formation process of the porous alumina layer 92I-92L, first, anodization was effectively performed for 2 minutes using an ammonium tartrate aqueous solution having a concentration of 0.001 mol / L, pH 6.5, and liquid temperature of 23.0 ° C. A barrier type alumina layer 12 was formed.
- the applied voltage was a pulse voltage having an amplitude of one of 280, 300, 330, and 350 V shown in Table 7, a pulse width of 100 msec, and a pulse interval of 900 msec. By applying such a pulse voltage for 20 minutes, anodization was effectively performed for 2 minutes.
- the pore interval of the porous alumina layer produced without forming the barrier type alumina layer was also examined.
- a voltage of 200 V, 250 V, and 380 V is applied, and the surface of the same aluminum substrate is anodized using a tartaric acid aqueous solution (concentration: 2 wt%, liquid temperature: 23 ° C.) until the aluminum becomes completely alumina.
- porous alumina layers 292A, 292B, and 292C shows the average value of the pore spacing.
- the standard deviation of the pore spacing was obtained and the pore spacing distribution was examined, but there was no great difference in any porous alumina layer.
- the pore intervals (about 300 nm to about 720 nm) of the porous alumina layers 92A to 92D, 92E to 92H, and 92I to 92L are respectively the same as the applied alumina layers 292A and 292B in the anodic oxidation using the tartaric acid aqueous solution. , 292C pore spacing (about 300 nm to 380 nm).
- the porous alumina layer 92L Comparing the porous alumina layer 92L and the porous alumina layer 292C having the highest applied voltage (380V) for forming the porous alumina layer, the porous alumina layer 92L has a pore interval of about 720 nm, whereas the porous alumina layer The pore spacing of 292C is about 380 nm and is very small. This is presumably because, in the porous alumina layer 292C, as described in the example using oxalic acid, the pore spacing was limited by the particle size of the crystal particles constituting the aluminum film. When tartaric acid was used, the pore spacing was limited to about twice the average particle size, and a larger pore spacing was obtained than when oxalic acid was used. This is probably because the density of pores (number of pores per unit area) is small because the ability to dissolve alumina is low.
- the thickness of the barrier type alumina layer was proportional to the applied voltage. That is, the larger the applied voltage of the first anodic oxidation, the thicker the barrier type alumina layer.
- the pore spacing of the porous alumina layers 92A-92L prepared using the tartaric acid aqueous solution showed the same tendency as the porous alumina layers 9A-90I prepared using the oxalic acid aqueous solution.
- the porous alumina layer 92A-92L was able to have a larger pore interval than the porous alumina layer 90A-90I.
- the porous alumina layer 92G-92L had a pore interval of 400 nm or more.
- the porous alumina layer having a pore interval of 400 nm or more can be used, for example, as a moth eye mold for producing an antireflection film having a projection interval forming a moth eye structure of 400 nm or more.
- a mold having a porous alumina layer with a pore spacing of 400 nm or more for example, a concavo-convex structure can be formed on the surface of a solar cell for the purpose of improving the light collection efficiency.
- interval is 400 nm or more can be used for the type
- the case where the deposited aluminum film is used has been described as an example.
- pores are not limited to the surface shape. Can be formed. Therefore, a porous alumina layer having a large pore interval can be formed. Even when an aluminum substrate having a relatively flat surface is used, a porous alumina layer having a desired pore spacing can be formed by forming a barrier-type alumina layer.
- a step of forming a barrier-type alumina layer in advance before the step of forming a porous alumina layer is performed.
- the present invention can be used for a mold for forming an antireflection film.
- the antireflection film can be used for any application where antireflection is desired, including optical elements such as display devices.
Abstract
Description
実施例1および2のモスアイ用型は、図1(e)に示したモスアイ用型100Aの構成を有する。図1(a)~(e)を参照して説明した製造工程を、以下のように行った。なお、実施例1および2は、2回目以降の陽極酸化で印加する電圧および処理時間が互いに異なる。
14 ポーラスアルミナ層
14p 細孔(反転されたモスアイ構造)
16 基板
18 アルミニウム膜
100A モスアイ用型
Claims (11)
- 表面の法線方向から見たときの2次元的な大きさが50nm以上500nm未満の複数の凹部を有する、反転されたモスアイ構造を表面に有する型の製造方法であって、
(a)アルミニウム基材の表面を陽極酸化することによって、複数の微細な凹部を有するポーラスアルミナ層を形成する工程と、
(b)前記工程(a)の後に、前記ポーラスアルミナ層をエッチング液に接触させることによって、前記ポーラスアルミナ層の前記複数の微細な凹部を拡大させる工程と、
(c)前記工程(b)の後に、前記表面をさらに陽極酸化することによって、前記複数の微細な凹部を成長させる工程とを包含し、
前記工程(c)で印加する電圧は、前記工程(a)で印加する電圧より高い、
製造方法。 - 前記工程(c)の後の前記微細な凹部の数密度は、前記工程(a)の後の前記微細な凹部の数密度の1.26倍未満である、請求項1に記載の型の製造方法。
- 前記工程(a)および前記工程(c)は、同じ電解液中で行われる、請求項1または2に記載の型の製造方法。
- 前記工程(a)における前記ポーラスアルミナ層の厚さ方向の成長速度は、前記工程(c)における前記ポーラスアルミナ層の厚さ方向の成長速度よりも小さい、請求項3に記載の型の製造方法。
- (d)前記工程(a)の前に、前記アルミニウム基材の表面を陽極酸化することによってバリア型アルミナ層を形成する工程を包含する、請求項1から4のいずれかに記載の型の製造方法。
- 前記複数の微細な凹部の中心間隔の平均値は180nm以上である、請求項1から5のいずれかに記載の型の製造方法。
- 前記工程(c)の後に、前記工程(b)および(c)をさらに行う、請求項1から6のいずれかに記載の型の製造方法。
- 前記アルミニウム基材は、基板と、前記基板上に堆積されたアルミニウム膜とを有する、請求項1から7のいずれかに記載の型の製造方法。
- 請求項1から8のいずれかに記載の製造方法により作製された型であって、
表面の法線方向から見たときの2次元的な大きさが50nm以上500nm未満である複数の凹部を有する、反転されたモスアイ構造を表面に有するポーラスアルミナ層を有する、型。 - 請求項1から8のいずれかに記載の製造方法により作製された型であって、
表面の法線方向から見たときの2次元的な大きさが50nm以上500nm未満である複数の凹部を有する、反転されたモスアイ構造を表面に有するポーラスアルミナ層を有し、
前記複数の凹部の中心間隔は50nm以上500nm未満であり、
前記複数の凹部の形状は円錐状であり、
前記複数の凹部のアスペクト比は、0.5以上6.0以下である、型。 - 請求項9または10に記載の型を用いて作製された反射防止膜であって、
表面に直径が50nm以上500nm未満である底面を有する複数の凸部が設けられており、
前記複数の凸部は周期性を有しないように配置されており、
前記表面には、前記複数の凸部のうちの2つ以上の凸部同士が接触した箇所が複数存在し、
前記2つ以上の凸部同士が接触した箇所の数密度は1.3個/μm2以下である、反射防止膜。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10822134.2A EP2487279B1 (en) | 2009-10-09 | 2010-10-08 | Mold and production method for same, and anti-reflection film |
JP2011518629A JP4796217B2 (ja) | 2009-10-09 | 2010-10-08 | 型および型の製造方法ならびに反射防止膜 |
US13/499,736 US9127371B2 (en) | 2009-10-09 | 2010-10-08 | Mold and production method for same, and anti-reflection film |
BR112012007963A BR112012007963A2 (pt) | 2009-10-09 | 2010-10-08 | molde e método de produção para o mesmo, e filme anti-reflexão |
CN201080045124.1A CN102575372B (zh) | 2009-10-09 | 2010-10-08 | 模具和模具的制造方法以及防反射膜 |
RU2012118394/02A RU2012118394A (ru) | 2009-10-09 | 2010-10-08 | Форма и способ ее изготовления, и просветляющая пленка |
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JP2013032569A (ja) * | 2011-08-02 | 2013-02-14 | Mitsubishi Rayon Co Ltd | モールドの製造方法、および微細凹凸構造を表面に有する成形体 |
JP2013112892A (ja) * | 2011-12-01 | 2013-06-10 | Dnp Fine Chemicals Co Ltd | ナノ構造体作製用型体の製造方法、製造装置、ナノ構造体作製用型体及びナノ構造体 |
JP2013119636A (ja) * | 2011-12-06 | 2013-06-17 | Dainippon Printing Co Ltd | 型の製造方法および型 |
JP2013137446A (ja) * | 2011-12-28 | 2013-07-11 | Asahi Kasei E-Materials Corp | 反射防止膜製造用モールド及びその製造方法 |
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JP2013142802A (ja) * | 2012-01-11 | 2013-07-22 | Dainippon Printing Co Ltd | 反射防止フィルム、反射防止フィルムの作製に用いられる型、および、型の製造方法 |
US20150299888A1 (en) * | 2012-12-10 | 2015-10-22 | Mitsubishi Rayon Co., Ltd. | Method for producing anodic porous alumina, method for producing molded article having microscopic pattern on surface, and molded article having microscopic pattern on surface |
WO2014092048A1 (ja) * | 2012-12-10 | 2014-06-19 | 三菱レイヨン株式会社 | 陽極酸化ポーラスアルミナの製造方法、および微細凹凸構造を表面に有する成形体の製造方法、並びに微細凹凸構造を表面に有する成形体 |
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JP2014164102A (ja) * | 2013-02-25 | 2014-09-08 | Dainippon Printing Co Ltd | 反射防止物品及び画像表示装置 |
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JP2014209230A (ja) * | 2013-03-29 | 2014-11-06 | 大日本印刷株式会社 | 反射防止物品、画像表示装置及び反射防止物品の製造用金型 |
JP2014209231A (ja) * | 2013-03-29 | 2014-11-06 | 大日本印刷株式会社 | 反射防止物品、画像表示装置、反射防止物品の製造用金型 |
JP2015132689A (ja) * | 2014-01-10 | 2015-07-23 | デクセリアルズ株式会社 | 反射防止構造体及びその設計方法 |
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KR101700240B1 (ko) | 2015-05-14 | 2017-02-13 | 한국과학기술원 | 양극 산화 공정을 이용한 광 포획 구조체의 제조방법과 광 포획 구조체 |
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EP2487279A4 (en) | 2015-08-05 |
EP2487279A1 (en) | 2012-08-15 |
EP2487279B1 (en) | 2017-09-20 |
JP4796217B2 (ja) | 2011-10-19 |
US9127371B2 (en) | 2015-09-08 |
US20120196090A1 (en) | 2012-08-02 |
BR112012007963A2 (pt) | 2016-03-29 |
RU2012118394A (ru) | 2013-11-20 |
CN102575372A (zh) | 2012-07-11 |
CN102575372B (zh) | 2014-05-28 |
JPWO2011043464A1 (ja) | 2013-03-04 |
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