WO2011031089A3 - 세정액 조성물 - Google Patents
세정액 조성물 Download PDFInfo
- Publication number
- WO2011031089A3 WO2011031089A3 PCT/KR2010/006174 KR2010006174W WO2011031089A3 WO 2011031089 A3 WO2011031089 A3 WO 2011031089A3 KR 2010006174 W KR2010006174 W KR 2010006174W WO 2011031089 A3 WO2011031089 A3 WO 2011031089A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solution composition
- cleaning solution
- present
- metal
- aqueous cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000000356 contaminant Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 230000007704 transition Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 150000004696 coordination complex Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005536 corrosion prevention Methods 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은 평판표시장치(FPD)를 제조하는 공정에 있어서, 박막트랜지스터의 채널부에 형성되는 오염물을 제거하기 위한 수계 세정액 조성물 및 이를 이용한 세정방법에 관한 것이다. 본 발명의 수계 세정액 조성물은 박막트랜지스터의 채널부에 형성되는 유기오염물 및 금속-레지스트 침착물, 금속산화물, 금속 착화물에 대한 세정력이 우수할 뿐만 아니라, 기판상에 형성되어 있는 금속배선 특히, 구리 및 구리합금 배선, 및 절연막의 부식방지 효과도 우수하다. 또한, 다량의 탈이온수를 포함하고 있어 취급이 용이하며 환경적으로 유리하다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010800381376A CN102498197A (zh) | 2009-09-11 | 2010-09-10 | 清洗组成物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0086046 | 2009-09-11 | ||
KR1020090086046A KR20110028109A (ko) | 2009-09-11 | 2009-09-11 | 세정액 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011031089A2 WO2011031089A2 (ko) | 2011-03-17 |
WO2011031089A3 true WO2011031089A3 (ko) | 2011-08-04 |
Family
ID=43732966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/006174 WO2011031089A2 (ko) | 2009-09-11 | 2010-09-10 | 세정액 조성물 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20110028109A (ko) |
CN (1) | CN102498197A (ko) |
TW (1) | TW201127952A (ko) |
WO (1) | WO2011031089A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101101378B1 (ko) * | 2009-12-31 | 2012-01-02 | 주식회사 엘지화학 | Tft-lcd용 세정액 조성물 |
KR101275659B1 (ko) * | 2011-12-26 | 2013-06-17 | 원광대학교산학협력단 | 편물기를 이용한 3차원 세포지지체 제조 방법 및 그 세포지지체 |
KR101895621B1 (ko) * | 2012-07-19 | 2018-09-05 | 동우 화인켐 주식회사 | 유-무기 하이브리드형 배향막 제거 조성물 |
TWI561615B (en) | 2012-07-24 | 2016-12-11 | Ltc Co Ltd | Composition for removal and prevention of formation of oxide on surface of metal wiring |
KR101932774B1 (ko) * | 2013-03-15 | 2018-12-26 | 동우 화인켐 주식회사 | 평판표시장치용 세정제 조성물 및 이를 이용한 세정방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030323A (ko) * | 1999-09-10 | 2001-04-16 | 나까네 히사시 | 포토레지스트용 박리액 및 이것을 사용한 포토레지스트박리방법 |
KR20050006191A (ko) * | 2002-04-26 | 2005-01-15 | 도오꾜오까고오교 가부시끼가이샤 | 포토레지스트 박리 방법 |
KR20050076756A (ko) * | 2004-01-23 | 2005-07-27 | 도오꾜오까고오교 가부시끼가이샤 | 박리 세정액, 그 박리 세정액을 사용한 반도체기판세정방법 및 금속배선 형성방법 |
KR20060049205A (ko) * | 2004-06-15 | 2006-05-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 기판으로부터 잔사를 제거하기 위한 조성물 및 그의 사용방법 |
KR20060048757A (ko) * | 2004-07-01 | 2006-05-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 탈거 및 세정용 조성물 및 이의 용도 |
-
2009
- 2009-09-11 KR KR1020090086046A patent/KR20110028109A/ko not_active Application Discontinuation
-
2010
- 2010-09-10 CN CN2010800381376A patent/CN102498197A/zh active Pending
- 2010-09-10 WO PCT/KR2010/006174 patent/WO2011031089A2/ko active Application Filing
- 2010-09-13 TW TW099130898A patent/TW201127952A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030323A (ko) * | 1999-09-10 | 2001-04-16 | 나까네 히사시 | 포토레지스트용 박리액 및 이것을 사용한 포토레지스트박리방법 |
KR20050006191A (ko) * | 2002-04-26 | 2005-01-15 | 도오꾜오까고오교 가부시끼가이샤 | 포토레지스트 박리 방법 |
KR20050076756A (ko) * | 2004-01-23 | 2005-07-27 | 도오꾜오까고오교 가부시끼가이샤 | 박리 세정액, 그 박리 세정액을 사용한 반도체기판세정방법 및 금속배선 형성방법 |
KR20060049205A (ko) * | 2004-06-15 | 2006-05-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 기판으로부터 잔사를 제거하기 위한 조성물 및 그의 사용방법 |
KR20060048757A (ko) * | 2004-07-01 | 2006-05-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 탈거 및 세정용 조성물 및 이의 용도 |
Also Published As
Publication number | Publication date |
---|---|
TW201127952A (en) | 2011-08-16 |
KR20110028109A (ko) | 2011-03-17 |
WO2011031089A2 (ko) | 2011-03-17 |
CN102498197A (zh) | 2012-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101709459B (zh) | 铝合金的表面处理方法与处理液 | |
TWI532881B (zh) | 用於導電多層膜之蝕刻液組成物及其蝕刻方法 | |
WO2011031089A3 (ko) | 세정액 조성물 | |
WO2015053800A3 (en) | Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper | |
WO2011094568A3 (en) | Cleaning agent for semiconductor provided with metal wiring | |
WO2007011568A3 (en) | Contact clean by remote plasma and repair of silicide surface | |
TW200708597A (en) | Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition | |
CN103898509A (zh) | 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 | |
WO2011019222A3 (ko) | 구리 배선의 형성을 위한 식각액 조성물 | |
MY165726A (en) | Cleaning liquid composition for electronic device | |
WO2011025180A3 (en) | A photoresist stripping composition for manufacturing lcd | |
WO2010125189A3 (fr) | Procédé de préparation d'un substrat métallisé, ledit substrat et ses utilisations | |
TW200702498A (en) | Method for electrodeposition of bronzes | |
WO2010022849A8 (de) | Randentschichtung von dünnschicht-solar-modulen mittels ätzen | |
WO2010127764A3 (de) | Verfahren zum kontaktieren eines halbleitersubstrates | |
TW200603269A (en) | Method of barrier layer surface treatment to enable direct copper plating on barrier metal | |
SG151262A1 (en) | Formation of metal silicide layer over copper interconnect for reliability enhancement | |
WO2010036114A3 (en) | Method and kit for manufacturing metal nanoparticles and metal-containing nanostructured composite materials | |
CN103890234A (zh) | 钼合金膜及铟氧化膜的蚀刻液组合物 | |
WO2010052541A3 (en) | Oxidation and cleaning process for silicon wafers | |
WO2008036823A3 (en) | Uric acid additive for cleaning formulations | |
EP2626891A3 (en) | Activation process to improve metal adhesion | |
WO2012177017A3 (ko) | 금속 배선 식각액 및 이를 이용한 액정 표시 장치의 제조 방법 | |
KR20180066764A (ko) | 다중막 식각액 조성물 및 이를 이용한 식각방법 및 이를 이용한 표시 장치용 어레이 기판의 제조방법 | |
WO2011084127A3 (en) | Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080038137.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10815634 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10815634 Country of ref document: EP Kind code of ref document: A2 |