WO2011021780A3 - Composition for anisotropic conductive film - Google Patents

Composition for anisotropic conductive film Download PDF

Info

Publication number
WO2011021780A3
WO2011021780A3 PCT/KR2010/004720 KR2010004720W WO2011021780A3 WO 2011021780 A3 WO2011021780 A3 WO 2011021780A3 KR 2010004720 W KR2010004720 W KR 2010004720W WO 2011021780 A3 WO2011021780 A3 WO 2011021780A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
conductive film
anisotropic conductive
epoxy resin
aromatic rings
Prior art date
Application number
PCT/KR2010/004720
Other languages
French (fr)
Korean (ko)
Other versions
WO2011021780A2 (en
Inventor
박영우
Original Assignee
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Publication of WO2011021780A2 publication Critical patent/WO2011021780A2/en
Publication of WO2011021780A3 publication Critical patent/WO2011021780A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons

Abstract

The present invention relates to a composition for an anisotropic conductive film, comprising: an epoxy resin containing polycyclic aromatic rings; an acrylic rubber-based resin; conductive particles; and a hardener. After hardening, the epoxy resin containing polycyclic aromatic rings has a glass transition temperature (Tg) of 165°C to 220°C, the acrylic rubber-based resin has a Tg of 0°C to 20°C, and the combined content of the epoxy resin containing polycyclic aromatic rings and the acrylic rubber-based resin is 45 to 65 wt % of the overall weight percentage of the composition (solid portion). The composition for an anisotropic conductive film not only has both flexibility and impact resistance to compensate for the brittle property of epoxy resin under high temperature and high moisture conditions to prevent a hardened anisotropic conductive film from cracking, but can also lower connection resistance and can supplement thermal stability so as to exhibit high reliability and high adhesiveness.
PCT/KR2010/004720 2009-08-20 2010-07-20 Composition for anisotropic conductive film WO2011021780A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0077079 2009-08-20
KR1020090077079A KR101138799B1 (en) 2009-08-20 2009-08-20 Composition For Anisotropic Conductive Film

Publications (2)

Publication Number Publication Date
WO2011021780A2 WO2011021780A2 (en) 2011-02-24
WO2011021780A3 true WO2011021780A3 (en) 2011-05-19

Family

ID=43607426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/004720 WO2011021780A2 (en) 2009-08-20 2010-07-20 Composition for anisotropic conductive film

Country Status (4)

Country Link
KR (1) KR101138799B1 (en)
CN (1) CN101993575B (en)
TW (1) TWI423267B (en)
WO (1) WO2011021780A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464353B1 (en) 2011-12-28 2014-11-25 제일모직 주식회사 Composition for use of an anisotropic conductive film, an anisotropic conductive film thereof and a semiconductor device using the same
KR101365107B1 (en) * 2012-09-21 2014-02-20 제일모직주식회사 Anisotropic conductive film and semiconductor device comprising the same
JP6180159B2 (en) * 2013-04-04 2017-08-16 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
CN104250525B (en) * 2013-06-25 2016-04-20 第一毛织株式会社 Anisotropic conductive film, picture display and semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (en) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Anisotropic conductive adhesive film
JP2006008978A (en) * 2004-06-23 2006-01-12 Lg Cable Ltd Anisotropic electroconductive adhesive and adhesive film using the same
KR100673773B1 (en) * 2005-10-18 2007-01-24 제일모직주식회사 Anisotropic conductive film composition using fluoren-based (meth)acrylate
KR100722121B1 (en) * 2006-07-21 2007-05-25 제일모직주식회사 Anisotropic conductive film composition for high reliability
KR100787728B1 (en) * 2006-12-20 2007-12-24 제일모직주식회사 Anisotropic conductive film composition using acryl copolymer for high reliability and anisotropic conductive film using thereof
KR100891414B1 (en) * 2007-11-20 2009-04-02 제일모직주식회사 Anisotropic conductive film composition for high storage stability

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000798B1 (en) * 2003-07-04 2010-12-13 회명산업 주식회사 Anisotropic conductive film adhesive and flat panel display device produced with the same
US7279268B2 (en) * 2004-09-09 2007-10-09 Intel Corporation Conductive lithographic polymer and method of making devices using same
US7326369B2 (en) * 2005-03-07 2008-02-05 National Starch And Chemical Investment Holding Corporation Low stress conductive adhesive
JP2007091959A (en) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd Anisotropically conductive adhesive
JP2007112949A (en) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd Anisotropic conductive adhesive
CN1883938A (en) * 2006-05-25 2006-12-27 刘萍 Multilayer anisotropic conductive film and process for preparing same
TW200815560A (en) * 2006-06-16 2008-04-01 Hitachi Chemical Co Ltd Film-shaped adhesive for circuit connection
CN101308711B (en) * 2008-04-29 2010-11-10 深圳典邦科技有限公司 Multilayer anisotropic conductive film and process for preparing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (en) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Anisotropic conductive adhesive film
JP2006008978A (en) * 2004-06-23 2006-01-12 Lg Cable Ltd Anisotropic electroconductive adhesive and adhesive film using the same
KR100673773B1 (en) * 2005-10-18 2007-01-24 제일모직주식회사 Anisotropic conductive film composition using fluoren-based (meth)acrylate
KR100722121B1 (en) * 2006-07-21 2007-05-25 제일모직주식회사 Anisotropic conductive film composition for high reliability
KR100787728B1 (en) * 2006-12-20 2007-12-24 제일모직주식회사 Anisotropic conductive film composition using acryl copolymer for high reliability and anisotropic conductive film using thereof
KR100891414B1 (en) * 2007-11-20 2009-04-02 제일모직주식회사 Anisotropic conductive film composition for high storage stability

Also Published As

Publication number Publication date
CN101993575B (en) 2013-03-27
TWI423267B (en) 2014-01-11
TW201108253A (en) 2011-03-01
KR101138799B1 (en) 2012-04-24
WO2011021780A2 (en) 2011-02-24
KR20110019519A (en) 2011-02-28
CN101993575A (en) 2011-03-30

Similar Documents

Publication Publication Date Title
MY153907A (en) Fusion bonded epoxy coating compositions that include magnesium oxide
WO2010123314A2 (en) Novel epoxy resin and epoxy resin composition comprising the same
TW200745260A (en) Thermosetting resin composition and uses thereof
MY150038A (en) Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
WO2011021780A3 (en) Composition for anisotropic conductive film
MY156448A (en) Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating material
TW200738815A (en) Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
WO2011116050A3 (en) Curing agents for epoxy resins
MY156527A (en) Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
TW200734377A (en) Phenol resin and resin composition
MY161359A (en) Epoxy resin composition and semiconductor sealing material using same
ZA200803382B (en) Weather-resistant epoxy resin system
TW200801081A (en) Novel phenolic resin, its preparation and its use
EP2163579A3 (en) Epoxy resin composition
MY156450A (en) Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
CN103709976A (en) Hot-melt glue and preparation method thereof
WO2011054945A3 (en) Use of guanidine derivatives as curing accelerators for epoxy resins
EP2557099A4 (en) Novel phenol resin, curable resin composition, cured article thereof, and printed wiring board
BR112012014525A2 (en) method for stabilizing pressure sensitive polyacrylate adhesives in admixture with adhesive resins
CN102127388B (en) Acid-resistant high-temperature-resistant elastic adhesive
WO2010076990A3 (en) Compositions for an anisotropic conductive film, and anisotropic conductive film using same
CN101457132A (en) High toughness epoxy adhesive
CN104388036A (en) Silicone rubber adhesive
CN102695768A (en) Anisotropic electrically-conductive adhesive agent

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10810088

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10810088

Country of ref document: EP

Kind code of ref document: A2