WO2010125784A1 - 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置 - Google Patents
構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置 Download PDFInfo
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- WO2010125784A1 WO2010125784A1 PCT/JP2010/002953 JP2010002953W WO2010125784A1 WO 2010125784 A1 WO2010125784 A1 WO 2010125784A1 JP 2010002953 W JP2010002953 W JP 2010002953W WO 2010125784 A1 WO2010125784 A1 WO 2010125784A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2005—Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
- H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/14—Reflecting surfaces; Equivalent structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0236—Electromagnetic band-gap structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
Definitions
- the present invention relates to a structure, a printed board, an antenna, a transmission line waveguide converter, an array antenna, and an electronic device.
- a structure including a right-handed and left-handed composite medium and having a controlled dispersion relationship with respect to electromagnetic waves, and a printed circuit board, antenna, transmission line waveguide converter, array antenna, and electronic device including the structure About.
- the dispersion relationship is the relationship between the wave number (or wavelength) of a propagating electromagnetic wave and the frequency.
- the dispersion relation can be controlled by appropriately setting the dimensions, arrangement, physical properties, and the like of various elements.
- a CRLH transmission line that is a medium of a right-handed left-handed composite (Composite Right and Left Handed; CRLH) is known.
- the CRLH transmission line is known to exhibit properties as a right-handed medium, a left-handed medium, and an electromagnetic bandgap structure (hereinafter abbreviated as an EBG structure) depending on the frequency of incident electromagnetic waves.
- EBG structure electromagnetic bandgap structure
- a general CRLH transmission line has a structure in which unit structures are periodically arranged in one dimension or two dimensions.
- a mushroom type structure which is one type of unit structure, has a structure in which a conductor patch on the surface of a dielectric layer and a conductor plane on the back surface of the dielectric layer are electrically connected by a conductor via or the like penetrating the dielectric layer. Yes.
- an EBG structure a structure having a dispersion relationship in which propagation of electromagnetic waves in a specific frequency band is suppressed.
- a substrate such as a printed circuit board or a device package substrate
- propagation of electromagnetic waves generated on the surface of the substrate can be suppressed.
- electromagnetic interference between antennas mounted on the substrate or between devices can be reduced.
- the EBG structure functions as a magnetic wall that reflects incident electromagnetic waves in the same phase in the vicinity of the band gap. If the EBG structure is installed on the back surface of the antenna using this characteristic, the antenna can be reduced in height without decreasing the radiation efficiency.
- a capacitance component formed between adjacent conductor patches constitutes an LC parallel resonance circuit with an inductance component formed from a conductor via. Since the CRLH transmission line has a band gap in the vicinity of the resonance frequency, it can be used as an EBG structure. In order to lower the frequency of this band gap, the inductance component is preferably increased. However, if the conductor via is lengthened to increase the inductance component, the structure becomes thicker.
- Patent Document 1 an intermediate layer in which a planar inductance element such as a spiral inductor is disposed is provided between a conductor patch layer and a conductor plane layer.
- the inductance element is connected to the patch layer or conductor plane by a conductor via.
- the antenna of Patent Document 2 uses line length resonance in a frequency band in which a CRLH transmission line operates as a left-handed medium.
- a normal medium right-handed medium
- the wavelength of the electromagnetic wave becomes longer as the frequency becomes lower, so that the structure of the antenna becomes larger.
- the wavelength of the electromagnetic wave becomes shorter as the frequency becomes lower. Therefore, the antenna can be downsized by using the CRLH transmission line as the left-handed medium.
- a slit is provided in the vicinity of a connection portion between a conductor plane and a conductor via to form a coplanar line. By providing the coplanar line, the inductance component can be increased without increasing the thickness of the antenna.
- Patent Document 1 Although the inductance component can be increased without causing thickening, there are the following problems.
- the structure of Patent Document 1 it is necessary to provide, for each unit structure, two conductor vias, a first conductor via that connects the inductance element to the conductor patch layer and a second conductor via that connects the inductance element to the conductor plane layer. Therefore, the structure becomes complicated and the number of man-hours required for manufacturing increases, leading to a decrease in manufacturing efficiency and an increase in manufacturing cost.
- unnecessary electromagnetic waves leak from the slits of the conductor plane provided to form the coplanar line and are radiated to the outside of the conductor plane.
- the present invention has been made in view of the above circumstances, and can achieve a reduction in thickness and frequency at a low cost, and can reduce unnecessary radiation to the back of the structure. Is one of the purposes. Another object is to provide a printed circuit board, an antenna, a transmission line waveguide converter, an array antenna, and an electronic device including the structure.
- the structure of the present invention is arranged between the first conductor, the second conductor provided at least partially opposite to the first conductor, the first conductor and the second conductor, and A transmission line that is electrically connected to one conductor plane of the first conductor or the second conductor via a conductor connecting portion and is opposed to the other conductor, and has an open end, It includes at least one unit structure including at least the second conductor, the transmission line, and the conductor connection portion.
- the printed circuit board according to the present invention includes the structure according to the present invention.
- the antenna of the present invention includes the structure according to the present invention.
- the transmission line waveguide converter of the present invention is characterized by including the structure according to the present invention as a reflector.
- the array antenna of the present invention is characterized in that the antenna according to the present invention is used as an array element and a plurality of array elements are arranged on the same plane.
- the electronic device of the present invention includes a structure according to the present invention, a printed circuit board according to the present invention, an antenna according to the present invention, a transmission line waveguide converter according to the present invention, and the book. It comprises at least one of the array antennas according to the invention.
- the operating band of the structure can be easily controlled without causing an increase in the size of the conductor connection portion, and thus the structure can be thinned. Since it is less necessary to provide a Copt Renner line from the viewpoint of controlling the operating band, it is possible to reduce leakage of electromagnetic waves caused by the Copt Renner line. Since the number of conductor connection portions per unit structure can be reduced, a low-cost structure can be obtained. As described above, the structure of the present invention can realize thinning and low frequency at low cost, and can reduce unnecessary radiation to the back surface of the structure. The structure of the present invention contributes to suppression of equipment noise and is useful for reducing malfunctions of electronic devices.
- the antenna of the present invention is useful for downsizing a wireless communication device that transmits and receives electromagnetic waves in the microwave and millimeter wave bands.
- the dimensions and scale may be different from the actual structure in order to show the characteristic parts in an easy-to-understand manner.
- the positional relationship between the constituent elements may be described based on the xyz coordinate system.
- this xyz coordinate system two directions orthogonal to each other in the plane direction of the first conductor plane are defined as the x-axis direction and the y-axis direction, and the normal direction of the first conductor plane is defined as the z-axis direction.
- the same components are shown with the same reference numerals, and detailed description thereof may be omitted.
- the structure shown below includes a left-handed right-handed composite medium (CRLH transmission line) which is one of metamaterials.
- CRLH transmission line which is one of metamaterials.
- the dispersion relationship of the CRLH transmission line is controlled with high accuracy, and the structure of the present invention can be operated as a right-handed medium, an EBG structure, or a left-handed medium.
- the structure shown below is disposed between the first conductor, the second conductor provided at least partially facing the first conductor, and the first conductor and the second conductor, A transmission line that is electrically connected to either one of the first conductor or the second conductor via a conductor connecting portion and is opposed to the other conductor, and has an open end, At least one unit structure including at least the second conductor, the transmission line, and the conductor connection portion is included.
- an open stub is configured including the second conductor, the transmission line, and the conductor connection portion, and a CRLH transmission line including the open stub is configured.
- the necessity for providing a coplanar line is reduced, and the necessity for forming a slit for forming the coplanar line in one conductor is reduced. Therefore, the number of slits can be reduced and the slits can be eliminated, and unnecessary electromagnetic waves can be significantly reduced from being emitted to the outside of one conductor through the slits.
- the CRLH transmission line is configured by the open stub, the number of conductor connection portions per unit structure can be reduced as compared with the CRLH transmission line configured by the short stub. Therefore, it is possible to obtain a low-cost structure that can reduce the man-hours and costs required for forming the conductor connection portion.
- FIG. 1 is a plan view of the structure according to the first embodiment viewed from the positive z-axis direction.
- FIG. 2 is a plan view of the structure viewed from the positive z-axis direction through the conductor patch 4 of FIG. 1 (indicated by a two-dot chain line in FIG. 2).
- FIG. 3 is a cross-sectional view taken along the line AA ′ in FIGS.
- the CRLH transmission line that is the structure of the first embodiment includes a conductor plane 1 that is a first conductor, a lower dielectric 2 that is a dielectric layer, and an upper dielectric that is a second dielectric layer. It includes a body 3, a conductor patch 4 that is a second conductivity, a conductor via 5 that is a conductor connection portion, and a transmission line 6.
- the conductor plane 1 and the conductor patch 4 are both plate-shaped.
- the structure according to the first embodiment has a structure in which the lower dielectric 2, the transmission line 6, the upper dielectric 3, and the conductor patch 4 are laminated in this order from the conductor plane 1 to the upper layer with the conductor plane 1 as the lowermost layer. It has become.
- the conductor via 5 penetrates the lower dielectric 2.
- the transmission line 6 is electrically connected to the conductor plane 1 through the conductor via 5.
- the structure according to the first embodiment has a structure in which unit structures are two-dimensionally repeated on the conductor plane 1, for example, periodically arranged.
- the unit structure may be a structure in which the unit structure is repeatedly arranged one-dimensionally.
- the unit structure is a part including the conductor patch 4.
- the unit structure includes a conductor via 5 and a transmission line 6 arranged in a portion sandwiched between one conductor patch 4 and the conductor plane 1.
- the conductor plane 1 is shared by a plurality of unit structures.
- the conductor plane 1 may be provided for each column or row of the conductor patch 4. Two or more of the plurality of conductor patches 4 may be provided integrally.
- 3 indicates the width of the region including one of the unit structures
- the symbol b indicates the diameter of the conductor via 5
- the symbol g indicates the interval between the conductor patches 4
- the symbol h indicates the thickness of the upper dielectric 3
- Reference symbol w indicates the line width of the transmission line 6
- reference symbol t indicates the thickness of the lower dielectric 2.
- the conductor patch 4 of the present embodiment has a substantially square planar shape.
- the conductor patch 4 has a smaller dimension in the x-axis direction and a dimension in the y-axis direction than the conductor plane 1.
- the surface direction of the conductor patch 4 is substantially parallel to the surface direction of the conductor plane 1.
- the plurality of conductor patches 4 are repeatedly arranged on the plane facing the conductor plane 1, for example, periodically.
- the plurality of conductor patches 4 are periodically arranged at equal intervals in the x-axis direction and the y-axis direction, and are two-dimensionally arranged. Between the two conductor patches 4 adjacent to each other in the plurality of conductor patches 4, an electric capacity corresponding to the interval g is formed.
- a transmission line 6 is disposed between each of the plurality of conductor patches 4 and the conductor plane 1.
- the upper dielectric 3 is disposed between the transmission line 6 and the conductor patch 4.
- the transmission line 6 of the present embodiment is provided in a plane in a plane facing the conductor patch 4, and the planar shape is a spiral shape (spiral shape).
- One end of the transmission line 6 is disposed at the center of the spiral shape, and is in contact with the conductor via 5 to be conducted.
- the other end of the transmission line 6 is disposed on the spiral outer periphery and is an open end (open end).
- the first conductor plane (conductor plane 1) is used as one of the first conductor plane (conductor plane 1) and the second conductor plane (conductor patch 2). ) Is selected.
- the transmission line 6 is configured to function as an open stub having the conductor patch 4 which is the other conductor plane as a return path.
- the unit structure is repeated, for example, periodically arranged.
- the unit structure includes a conductor plane 1, a conductor patch 4, a conductor via 5, and a transmission line 6. By repeating the unit structure, the structure functions as a metamaterial.
- the interval between the same vias should be within 1 ⁇ 2 of the assumed wavelength ⁇ of the electromagnetic wave. Is preferred.
- “Repetition” includes a case where a part of the structure is missing in any unit structure. Further, when the unit structure has a two-dimensional array, “repetition” includes a case where the unit structure is partially missing.
- “periodic” includes a case where some of the constituent elements are deviated in some unit structures and a case where the arrangement of some unit structures themselves is deviated.
- a plurality of unit structures arranged periodically, for example, are periodically coupled to each other, and operate as a two-dimensional CRLH transmission line.
- an electromagnetic wave corresponding to the band gap does not propagate through the CRLH transmission line.
- Such a CRLH transmission line functions as an EBG structure.
- EBG structure when an EBG structure is provided on the substrate surface, electromagnetic waves in a predetermined frequency band do not propagate on the substrate surface, and interference of electromagnetic waves can be suppressed in a device including the substrate.
- FIG. 4 is a diagram expressing the unit structure of the CRLH transmission line according to the structure of the first embodiment as an equivalent circuit diagram corresponding to an operation with respect to an electromagnetic wave propagating in the x-axis direction or the y-axis direction.
- C R in FIG. 4 is the capacitance of a parallel plate made of conductive plane 1 and the conductor patches 4
- L R is the inductance of the conductor patches 4.
- C L is the capacitance between two adjacent conductor patches 4
- L L L represents the inductance of the conductor via 5.
- the open stub is constituted by a transmission line 6.
- the admittance Y of the CRLH transmission line is composed of C R , L L , and an open stub, and is represented by the following formula (2).
- ZStub in the equation (2) is an input impedance of the open stub and is represented by the following equation (3).
- c 0 is the speed of light in vacuum
- Z 0 is the characteristic impedance of the transmission line 6 (open stub in FIG. 4)
- d is the line length of the transmission line 6
- ⁇ eff is the effective relative dielectric of the transmission line 6. Rate.
- the CRLH transmission line has a band gap in a frequency band in which the imaginary part of the series impedance Z represented by the expression (1) is different from the imaginary part of the admittance Y represented by the expressions (2) and (3). Produce. Therefore, the band gap can be set to a desired frequency band by appropriately designing the parameters in the equations (1) to (3).
- the dispersion relation is a relation of frequency with respect to the wave number (or wavelength) of the electromagnetic wave propagating through the CRLH transmission line.
- FIG. 5 is a graph showing an example of the dispersion relation of the CRLH transmission line according to the present invention.
- the horizontal axis represents the wave number and the vertical axis represents the frequency.
- the dispersion relationship of the CRLH transmission line in the first embodiment is a downward-sloping curve in the frequency band from 4.6 GHz to 6.0 GHz. Therefore, the CRLH transmission line operates as a left-handed medium in this frequency band.
- the dispersion relationship is a curve that rises to the right in the frequency band from 9.2 GHz to 10.7 GHz. Therefore, the CRLH transmission line operates as a right-handed medium in this frequency band.
- the line length d of the open stub is determined by the shape and dimensions of the transmission line 6, when the transmission line 6 is provided in a plane as in the first embodiment, the numerical range that can be selected as the line length d of the open stub is markedly large. Become wider. Since the design freedom of the line length d of the open stub is high, the dispersion relation of the structures can be easily controlled, and for example, the band gap can be easily set to a desired frequency band.
- the band gap is lowered as the line length d is increased. Since it is easy to increase the line length d, the band gap can be easily lowered in frequency. Therefore, it is less necessary to increase the inductance of the conductor via 5 from the viewpoint of lowering the band gap, and the need to increase the length of the conductor via 5 (the thickness t of the lower dielectric 2) is reduced. Therefore, the thickness t of the lower dielectric 2 can be reduced, and the structure can be thinned.
- the number of conductive vias per unit structure can be reduced as compared with the configuration in which both the conductive plate 1 and the conductive patch 4 are connected to the transmission line 6, and in short, the number of conductive vias per unit structure. Can be made one. Thereby, the formation process of a conductor via can be simplified and it can be set as a low-cost structure.
- the admittance Y can be controlled by an open stub, and the admittance Y can be easily controlled by adjusting the line length d. Accordingly, the need for controlling the admittance Y is reduced by providing the coplanar line, and the necessity for providing a slit for forming the coplanar line is reduced. Therefore, the number of slits can be reduced and the slits can be eliminated, and unnecessary electromagnetic waves are radiated to the outside of the conductor plane 1 through the slits.
- the configuration in which the conductor via 5 does not penetrate the upper dielectric 3 is illustrated, but the conductor via 5 is provided so that the transmission line 6 and the conductor plane 1 are electrically connected. What is necessary is just to change suitably about the aspect of the conductor via 5.
- FIG. 6 a configuration in which the conductor via 5 penetrates the upper dielectric 3 may be adopted, and the effect of the present invention can also be obtained by this configuration.
- the conductor via 5 is a through via penetrating the upper dielectric 3
- the conductor via 5 is formed around the conductor via 5 in the conductor patch 4.
- An opening having a larger diameter than the diameter may be formed to provide the clearance 8.
- the structure may be manufactured as follows. First, after forming a laminated body other than the conductor via 5, an opening is formed in the conductor patch 4 by a known processing method such as etching. Next, a through-hole that penetrates the upper dielectric 3, the transmission line 6, and the lower dielectric 2 and communicates with the conductor plane 1 is formed by a known processing method such as drilling. The diameter of the through hole is made smaller than the opening of the conductor patch 4. Then, a conductor via 5 made of a conductor is formed by embedding a conductor in the through hole. In this way, since the conductor via 5 is formed after the process of laminating the components is completed, the structure can be made more efficient at a lower cost than the technique of interrupting the process of laminating and forming the conductor via 5. Can be manufactured well.
- the configuration in which the transmission line 6 is connected to the conductor plane 1 via the conductor via 5 is illustrated, but the transmission line 6 is connected to the conductor patch 4 via the conductor via 5 as shown in FIG. It may be a configuration.
- the conductor patch 4 is selected as one of the first conductor plane (conductor plane 1) and the second conductor plane (conductor patch 4).
- the transmission line 6 functions as an open stub using the conductor plane 1 as the other conductor plane as a return path, and this structure also operates in the same manner as in the first embodiment.
- the transmission line 6 may be electrically connected to one of the first conductor plane and the second conductor plane and face the other conductor plane. Can be appropriately modified. Hereinafter, modifications regarding the shape and the like of the transmission line 6 will be described.
- the configuration in which the shape of the transmission line 6 is a spiral shape is illustrated, but for example, a configuration in which the shape of the transmission line 6 is a substantially linear shape as shown in FIG.
- the shape of the transmission line 6 shown in FIG. 8 one end portion overlaps with the substantially central portion of the conductor patch 4 in plan view, and the other end portion overlaps with one of the corner portions of the conductor patch 4 in plan view.
- the transmission line 6 is electrically connected to the conductor via 5 at one end.
- the shape of the transmission line 6 may be a meander shape in addition to a spiral shape or a linear shape.
- the arrangement and shape of the transmission line 6 may be different in the plurality of unit structures. For example, the unit structure in which the spiral transmission line 6 is arranged and the unit structure in which the linear transmission line 6 is arranged may be mixed.
- the transmission line 6 may include branch lines 6 a and 6 b that are branched from the branch portion with the connection portion with the conductor via 5 as a branch portion.
- the branch lines 6a and 6b are both continuous with the branch portion and have different lengths.
- the transmission path having such a configuration can be regarded as a branch line in which the branch lines 6a and 6b branch from the connection portion.
- electrical connection is achieved at the connection portion between the starting point and the ending point in the transmission line including the branch lines 6a and 6b.
- the impedance conversion periods of the branch lines 6a and 6b are different, so that the degree of freedom in design of the dispersion relationship is remarkably increased.
- a branch line with a part of the branch lines 6a and 6b as a base point may be provided, or the branch lines 6a and 6b may extend in different directions.
- the planar shape of the branch line can be appropriately selected from a straight line shape, a broken line shape, a curved line shape, a combination of these, and the like.
- the configuration in which the conductor patch 4 is square is illustrated, but the conductor patch 4 may have a shape other than the square.
- the configuration in which the unit structures are periodically arranged in a square lattice shape is illustrated, but the adjacent conductor patches 4 may be capacitively coupled, and the unit structure may be arranged in a triangular lattice shape or 1 It may be a dimensional periodic array. Even when the shape and arrangement of the conductor patch 4 are different from those of the first embodiment, the effect of the present invention can be obtained as long as the adjacent conductor patches 4 are capacitively coupled.
- the structure operates as an EBG structure, but it is also possible to operate the structure as a left-handed medium.
- the structure operates mainly as an EBG structure.
- antennas including a structure will be described.
- the structure operates mainly as a left-handed medium.
- FIG. 10 is a plan view showing a schematic configuration of the printed circuit board 20 of the second embodiment.
- 11 is a cross-sectional view taken along line A2-A2 ′ of FIG.
- the printed circuit board 20 includes a ground plane 21, devices 22 and 23, and an EBG structure 24 disposed between the devices 22 and 23.
- the thickness portion from the surface layer on which the devices 22 and 23 are provided to the ground plane 21 is made of a dielectric.
- the device 22 is a device that becomes a noise source
- the device 23 is a device that is susceptible to noise.
- the devices 22 and 23 are both connected to the ground plane 21.
- the dielectric portion of the printed circuit board 20 and the ground plane 21 form a kind of surface wave line. Noise generated in the device 22 propagates through the surface wave line and enters the device 23, which may cause a malfunction or the like in the device 23.
- the EBG structure 24 is disposed so as to block a surface wave line that can be a noise propagation path between the devices 22 and 23.
- the strip-shaped EBG structure 24 is continuously arranged from one end of the printed circuit board 20 to the other end.
- the EBG structure 24 is constituted by the structure of the present invention, and includes a band gap in the dispersion relation as described in the first embodiment.
- the band gap is set to a frequency band including a frequency band of noise generated in the device 22.
- the printed circuit board 20 having such a configuration, noise generated in the device 22 is blocked by the EBG structure 24. Therefore, noise reaching the device 23 is remarkably reduced, and malfunction of the device 23 can be suppressed. Since the EBG structure 24 applies the present invention, the printed circuit board 20 can be made thin. In addition, since the band gap of the EBG structure 24 can be lowered at low cost, it is possible to deal with noise in a wide frequency band, and the printed circuit board 20 can be made at low cost.
- an EBG structure 24 may be provided so as to surround a device 23 that is susceptible to noise.
- the configuration in which the EBG structure is mounted on the printed board is illustrated, but the effect of the present invention can also be obtained when the EBG structure is mounted on an electronic component other than the printed board.
- an EBG structure according to the present invention on a device package substrate or the like, or to provide an EBG structure on a semiconductor device such as silicon using a fine wiring process.
- the description has been given here of the suppression of noise propagation between devices for example, in the case of suppressing unnecessary coupling between adjacent antennas
- the EBG according to the present invention is exactly the same as in the case of devices.
- a structure can be used.
- FIG. 13A is a cross-sectional view showing an example of a patch antenna using the EBG structure according to the present invention as a reflector
- FIG. 13B is a plan view of the patch antenna.
- the patch antenna 30 includes an EBG structure 31, an antenna element 32, and a coaxial feed line 33.
- the patch antenna 30 is mainly composed of a substantially plate-shaped substrate.
- the antenna element 32 has a substantially plate shape and is provided in contact with one surface of the substrate.
- the coaxial feed line 33 is provided on the other surface of the substrate and is electrically connected to the antenna element 32 through the substrate.
- the EBG structure 31 is arranged around the antenna element 32 in a ring shape or a part of the circumference.
- the band gap of the EBG structure 31 is designed to correspond to the use frequency band of the patch antenna 30.
- the surface wave generated in the antenna element 32 propagates on one surface of the substrate and is blocked by the EBG structure 31. Therefore, the surface wave is prevented from propagating to the other surface of the substrate, and the surface wave is not radiated from the other surface, so that deterioration of the antenna characteristics can be avoided.
- FIG. 14A is a cross-sectional view showing an example of an inverted L antenna 35 using the EBG structure according to the present invention as a reflector
- FIG. 14B is a plan view of a patch antenna.
- the inverted L-shaped antenna 35 includes an EBG structure 36, an antenna element 37, and a coaxial feed line 38.
- the inverted L-shaped antenna 35 is mainly composed of a substantially plate-shaped substrate.
- the antenna element 37 protrudes from the one surface of the substrate in the normal direction of this surface, bends at a position away from the substrate, and extends in the surface direction of the substrate.
- the coaxial feeder line 38 is provided on the other surface of the substrate and is electrically connected to the antenna element 37 through the substrate.
- the EBG structure 36 is arranged around the portion of the antenna element 37 that protrudes in the normal direction from one surface in a ring shape or a part of the periphery.
- the EBG structure 36 is disposed so as to protrude from a region overlapping with a portion of the antenna element 37 extending in the surface direction of the substrate in the normal direction of the other surface to the outside of this region.
- the EBG structure 36 functions as a reflector for the antenna element 37.
- the inverted L-shaped antenna 35 having such a configuration, radiation from the other surface is suppressed in the same manner as the patch antenna 30.
- the EBG structure 36 functions as a reflector and the electromagnetic waves are reflected in the same phase by the EBG structure 36, the antenna element 37 can be disposed close to the surface of the EBG structure 36.
- the patch antenna 30 and the inverted L-shaped antenna 35 are described as examples of the antenna.
- the structure of the present invention can be applied to other types of antennas, thereby obtaining the effects of the present invention. Can do.
- FIG. 15 is a cross-sectional view showing an example of a transmission line waveguide converter using the EBG structure according to the present invention as a reflector.
- the transmission line waveguide converter 40 includes an EBG structure 41 as a reflector, a transmission line 42, and a waveguide 43.
- the band gap of the EBG structure 41 is designed to correspond to the frequency band of the electromagnetic wave to be transmitted.
- the transmission line 42 can be disposed close to the surface of the EBG structure 41. Thereby, a thin transmission line waveguide converter 40 can be realized.
- the antenna of the present embodiment includes a structure according to the present invention, and the structure operates as a left-handed medium.
- FIG. 16 is a perspective view showing a schematic configuration of an antenna according to the fifth embodiment of the present invention.
- FIG. 16 shows the internal structure through a part of the antenna for convenience of explanation.
- FIG. 17 is a plan view of the antenna according to the fifth embodiment viewed from the positive z-axis direction.
- FIG. 18 is a plan view of the antenna according to the fifth embodiment seen through the conductor patch 4 from the positive z-axis direction.
- 19 is a cross-sectional view taken along line A3-A3 ′ of FIGS.
- the antenna of the fifth embodiment includes a conductor plane 1, which is a first conductor plane, a lower dielectric 2, an upper dielectric 3, a conductor patch 4, which is a second conductive plane, a conductor via 5, and a transmission line.
- 6 includes a microstrip line 7 serving as a power feeding unit.
- the conductor plane 1 and the conductor patch 4 are both plate-shaped.
- the structure according to the fifth embodiment has a structure in which the conductor plane 1 is the lowermost layer, and the lower dielectric 2, the transmission line 6, the upper dielectric 3, and the conductor patch 4 are laminated in this order from the conductor plane 1 to the upper layer. It has become.
- the microstrip line 7 is provided on the same plane as the conductor patch 4, that is, on the upper dielectric 3, and is electrically connected to one of the conductor patches 4.
- the conductor via 5 penetrates the lower dielectric 2.
- the transmission line 6 is electrically connected to the conductor plane 1 through the conductor via 5.
- the antenna of the fifth embodiment has a structure in which unit structures are periodically arranged on the conductor plane 1 one-dimensionally.
- the unit structure is a part including the conductor patch 4.
- the unit structure includes a conductor via 5 and a transmission line 6 arranged in a portion sandwiched between one conductor patch 4 and the conductor plane 1.
- the symbol s shown in FIG. 17 indicates the dimension of the side (here, the long side) facing the adjacent conductor patch 4 in the conductor patch 4.
- 19 indicates the width of the region including one of the unit structures
- the symbol b is the diameter of the conductor via 5
- the symbol g is the interval between the conductor patches 4
- the symbol h is the thickness of the upper dielectric 3
- Reference symbol w indicates the width of the transmission line 6
- reference symbol t indicates the thickness of the lower dielectric 2.
- the conductor patch 4 of the present embodiment has a substantially rectangular planar shape.
- the conductor patch 4 has a smaller dimension in the x-axis direction and a dimension in the y-axis direction than the conductor plane 1.
- the surface direction of the conductor patch 4 is substantially parallel to the surface direction of the conductor plane 1.
- the plurality of conductor patches 4 are periodically arranged on a plane facing the conductor plane 1.
- the plurality of conductor patches 4 are periodically arranged at equal intervals in the x-axis direction, which is the short side direction of the conductor patch 4, and are arranged one-dimensionally. Between the two conductor patches 4 adjacent to each other in the plurality of conductor patches 4, an electric capacity corresponding to the interval g is formed.
- the microstrip line 7 is electrically connected to the conductor patch 4 located at the end of the plurality of conductor patches 4.
- the microstrip line 7 extends from the conductor patch 4 in the negative x-axis direction and is electrically connected to a radio circuit (not shown). An electrical signal supplied from the wireless circuit is input to the conductor patch 4 via the microstrip line 7.
- a transmission line 6 having the conductor patch 4 as a return path is disposed between each of the plurality of conductor patches 4 and the conductor plane 1.
- the upper dielectric 3 is disposed between the transmission line 6 and the conductor patch 4.
- the transmission line 6 of the present embodiment has a spiral shape in plan view. One end of the transmission line 6 is disposed at the center of the spiral shape, and is in contact with the conductor via 5 to be conducted. The other end of the transmission line 6 is disposed on the spiral outer periphery and is an open end. That is, in the structure in the fifth embodiment, the first conductor plane (conductor plane 1) is used as one of the first conductor plane (conductor plane 1) and the second conductor plane (conductor patch 2). ) Is selected. As described above, the transmission line 6 is configured to function as an open stub having the conductor patch 4 which is the other conductor plane as a return path.
- the plurality of unit structures arranged periodically are capacitively coupled to each other and operate as a one-dimensional CRLH transmission line.
- the unit structure connected to the microstrip line 7 is electrically excited by an electrical signal transmitted through the microstrip line 7.
- the structure which supplies electric power to the edge part of a CRLH transmission line is illustrated here, it is set as the structure which supplies electric power to conductor patches other than the edge part of a CRLH transmission line, in order to take the impedance matching of an antenna and electric power feeding part. Also good.
- the antenna of the fifth embodiment utilizes the fact that half-wave resonance occurs in the x-axis direction of the CRLH transmission line, and can be considered as one type of resonator.
- the relationship between wavelength and frequency in the resonator is determined by the dispersion relationship of the medium inside the resonator. In a normal dielectric, the dispersion relationship between the relative permittivity ⁇ and the relative permeability ⁇ is given by the following formula (4).
- c 0 represents the speed of light in vacuum
- the admittance Y in FIG. 4 needs to be inductive (the imaginary part of the admittance Y is negative) in a desired frequency band. Therefore, in order to lower the operating band of the antenna, the frequency band where the admittance Y becomes inductive may be lowered. From equations (2) and (3), the admittance Y is a function of the line length d of the open stub, and by increasing the line length d, the frequency band in which the admittance Y becomes inductive can be lowered. By applying the periodic boundary condition to the equivalent circuit of the unit structure shown in FIG. 4, the dispersion relationship of the CRLH transmission line in the antenna can be obtained.
- FIG. 20 is a graph showing an example of the dispersion relationship.
- the horizontal axis represents the wave number, and the vertical axis represents the frequency.
- the dispersion relationship of the CRLH transmission line in the fifth embodiment is a downward-sloping curve in the frequency band from 4.2 to 4.9 GHz. Therefore, the CRLH transmission line operates as a left-handed medium in this frequency band.
- the dispersion relationship is a curve that rises to the right in the frequency band from 9.3 GHz to 11.7 GHz. Therefore, the CRLH transmission line operates as a right-handed medium in this frequency band.
- a condition for causing a half-wave resonance in a resonator having a line length L is given by the following equation (5), where n is an integer.
- the straight line passing through the origin is the dispersion relation of the dielectric substrate composed of the lower dielectric 2 and the upper dielectric 3.
- the wavelength of the electromagnetic wave propagating through the CRLH transmission line is extended more than in the dielectric substrate at the resonance point included in the high frequency band than the dispersion relationship of the dielectric substrate. Therefore, for example, the radiation efficiency can be increased by increasing the size of the antenna.
- the admittance Y of the CRLH transmission line in the antenna according to the present embodiment is obtained by Expression (2) and Expression (3). Therefore, the left-handed system band can be designed to a desired frequency band by appropriately designing the parameters included in the expressions (2) and (3).
- the structure according to the present invention has a high degree of freedom in designing the line length d of the open stub, the operating band of the antenna of this embodiment can be easily controlled, and the antenna can be thinned. ing.
- the number of conductor vias per unit structure can be reduced, and a low-cost antenna can be obtained.
- the admittance Y can be controlled by an open stub, and the necessity of controlling the admittance Y is reduced by providing a coplanar line. Therefore, the necessity of providing a slit for forming a coplanar line is reduced, and unnecessary electromagnetic waves are radiated to the outside of the conductor plane 1 through the slit.
- the configuration in which the conductor via 5 does not penetrate the upper dielectric 3 is illustrated, but the conductor via 5 is provided so that the transmission line 6 and the conductor plane 1 are electrically connected. What is necessary is just to change suitably about the aspect of the conductor via 5.
- FIG. 21 a configuration in which the conductor via 5 penetrates the upper dielectric 3 may be adopted. Even in such a configuration, the effect of the present invention can be obtained.
- the conductor via 5 is a through via penetrating the upper dielectric 3, an opening is formed around the conductor via 5 in the conductor patch 4 in order to electrically insulate the conductor via 5 and the conductor patch 4.
- a clearance 8 may be provided.
- the transmission line 6 is connected to the conductor plane 1 via the conductor via 5
- the transmission line 6 is connected to the conductor patch 4 via the conductor via 5. It may be configured.
- the conductor patch 4 is selected as one of the first conductor plane (conductor plane 1) and the second conductor plane (conductor patch 4).
- the transmission line 6 functions as an open stub having the conductor plane 1 which is the other conductor plane as a return path, and the antenna having this configuration operates in the same manner as in the fifth embodiment.
- the shape of the transmission line 6 is a spiral shape
- the shape of the transmission line may be a substantially linear shape as shown in FIG. 23, for example.
- one end portion overlaps with the substantially central portion of the conductor patch 4 in plan view
- the other end portion overlaps with one of the end portions in the long side direction of the conductor patch 4 in plan view.
- the transmission line 6 is electrically connected to the conductor via 5 at one end.
- the shape of the transmission line 6 may be a meander shape in addition to a spiral shape or a linear shape.
- the arrangement and shape of the transmission line 6 may be different in the plurality of unit structures. For example, a unit structure in which a spiral transmission line is arranged and a unit structure in which a linear transmission line is arranged may be mixed.
- the transmission line 6 may include branch lines 6a and 6b branched from the branch part with the connection part with the conductor via 5 as a branch part.
- the branch lines 6a and 6b are both continuous with the branch portion and have different lengths.
- the transmission path having such a configuration can be regarded as a branch line in which the branch lines 6a and 6b branch from the connection portion.
- electrical connection is achieved at the connection portion between the starting point and the ending point in the transmission line including the branch lines 6a and 6b.
- a branch line with a part of the branch lines 6a and 6b as a base point may be provided, or the branch lines 6a and 6b may extend in different directions.
- the planar shape of the branch line can be appropriately selected from a straight line shape, a broken line shape, a curved line shape, a combination of these, and the like.
- the configuration in which the conductor patch 4 is rectangular has been exemplified.
- the adjacent conductor patch 4 only needs to be capacitively coupled, and the effect of the present invention can be achieved even if the conductor patch 4 has a square shape or the like. Can be obtained.
- the microstrip line is used as the power supply unit
- a power supply unit other than the microstrip line can also be used.
- a configuration may be adopted in which a slit is provided in the conductor plane 1 to form the coplanar line 11 and the CRLH transmission line is fed using the coplanar line 11 as a feeding portion.
- the coplanar line 11 is connected to a conductor via 5 having a unit structure located at the end of the CRLH transmission line.
- An electrical signal from a radio circuit (not shown) is supplied to the CRLH transmission line via the coplanar line 11.
- the coplanar lines 11 may be provided for at least one of the unit structures, and the number of coplanar lines 11 can be reduced, so that the emission of electromagnetic waves to the back side can be minimized.
- a coplanar line can be provided on the conductor patch 4.
- a coplanar line extending in the long side direction of the conductor patch 4 is provided, it is easy to increase the inductance included in the admittance Y.
- the microstrip line 7 as a power feeding unit may feed power to the antenna by being capacitively coupled to the conductor patch 4 having a unit structure located outside.
- the auxiliary conductor patch 10 may be provided at a position overlapping both the conductor patch 4 capacitively coupled to the microstrip line 7 and the microstrip line 7.
- the auxiliary conductor patch 10 is also received as a box with the microstrip line 7 and the conductor patch 4.
- a first capacitor is formed between the auxiliary conductor patch 10 and the microstrip line 7, and a second capacitor is formed between the auxiliary patch 10 and the conductor patch 4. That is, by providing the auxiliary conductor patch 10, a capacity in which the first capacity and the second capacity are connected in series is provided in parallel to the capacity formed between the microstrip line 7 and the conductor patch 4. become. For this reason, the impedance of the microstrip line 7 can be easily matched to the antenna by changing the size and layout of the auxiliary conductor patch 10.
- coplanar line 11 shown in FIG. 25 may also be fed to the antenna by capacitively coupling to the unit structure located outside.
- the antenna of the present invention can be easily manufactured by a general process used for manufacturing printed circuit boards and device package substrates.
- the antenna of the present invention can be provided in a semiconductor device such as silicon by using a fine wiring process or the like used in semiconductor technology.
- the dispersion relationship of the CRLH transmission line in the fifth embodiment has a band gap between the right-handed band and the left-handed band, that is, in the frequency band from 4.9 GHz to 9.3 GHz. ing. This is because, in the equivalent circuit diagram shown in FIG. 4, there is a gap between the resonance frequency of the series impedance Z that defines the lower limit frequency of the right-handed band and the resonance frequency of admittance Y that defines the upper limit frequency of the left-handed band. is there.
- the Bloch impedance of a CRLH transmission line has a steep frequency dependence when a band gap exists in the dispersion relationship of the CRLH transmission line. Therefore, when having a band gap, it is difficult to achieve wide-band impedance matching with the feed line. For this reason, the CRLH transmission line operated as a part of the antenna is designed so as to satisfy a condition (referred to as a balance condition) for eliminating the band gap by matching the admittance Y and the resonance frequency of the series impedance Z. It is preferable.
- FIG. 26 is a graph showing an example of a dispersion relationship of CRLH transmission lines designed to satisfy the balance condition. As shown in FIG. 26, when the balance is designed so as to satisfy the balance condition, the band gap disappears and the right-handed band and the left-handed band are connected. In order to satisfy the balance condition, CL, which is a capacitance between two adjacent conductor patches 4, may be increased to lower the resonance frequency of the series impedance Z.
- FIG. 27 is a perspective view showing an antenna according to a sixth embodiment of the present invention.
- 28 is a cross-sectional view taken along line A4-A4 ′ of FIG.
- the antenna of the sixth embodiment is obtained by adding an auxiliary conductor patch 9 to the antenna of the fifth embodiment.
- the auxiliary conductor patch 9 is provided in a layer sandwiched between the lower dielectric 2 and the upper dielectric 3, that is, in the same layer as the transmission line 6.
- the auxiliary conductor patch 9 is disposed so as to overlap both of the two adjacent conductor patches 4 in the Z-axis direction.
- the auxiliary conductor patch 9 has a rectangular planar shape, and the long side direction thereof coincides with the long side direction of the conductor patch 4.
- the capacitive coupling via the auxiliary conductor patch 9 is connected in parallel to the direct capacitive coupling between the two adjacent conductor patches 4. Therefore, CL that is the capacity between the two conductor patches 4 can be easily increased, and a CRLH transmission line that satisfies the balance condition can be easily designed.
- the auxiliary conductor patch 9 has a rectangular shape. However, any auxiliary conductor patch 9 may be used as long as it forms an electric capacity by overlapping both of the two adjacent conductor patches 4. The shape of the conductor patch 9 can be appropriately modified.
- the auxiliary conductive patch 9 is provided in the same layer as the transmission line 6. However, an electric capacity is formed by overlapping with two adjacent conductor patches 4.
- the auxiliary conductive patch 9 may be provided in a different layer from the transmission line 6.
- the structure according to the first to fourth embodiments may be provided with the auxiliary conductive patch 9.
- FIG. 29 is a plan view of the antenna according to the seventh embodiment viewed from the positive z-axis direction.
- 30 and 31 are plan views of an antenna according to a modification of the seventh embodiment of the present invention as seen from the positive z-axis direction.
- the antenna of the seventh embodiment differs from the antennas of the fifth and sixth embodiments in that the unit structures are two-dimensionally periodically arranged.
- the conductor patch 4 has a square shape, and three unit structures are arranged in the x-axis direction and four in the y-axis direction.
- the antenna of the seventh embodiment Since the CRLH transmission line having different line lengths L is formed in the x-axis direction and the y-axis direction, the antenna of the seventh embodiment has different frequencies at which half-wave resonance occurs in the x-axis direction and the y-axis direction. . Thereby, the antenna of 7th Embodiment functions as a dual band antenna or a multiband antenna.
- auxiliary conductor patch 9 demonstrated in 6th Embodiment in the antenna of 7th Embodiment.
- the antenna shown in FIG. 30 is provided with auxiliary conductor patches 9 between two conductor patches 4 adjacent in the x-axis direction and between two conductor patches 4 adjacent in the y-axis direction.
- the capacity between the adjacent conductor patches 4 can be easily increased, and a dual-band antenna or a multi-band antenna that satisfies the balance condition of the CRLH line can be easily realized. Is possible.
- the auxiliary conductor patch 9 may be provided only on one of the conductor patches 4 adjacent in the x-axis direction and between the conductor patches 4 adjacent in the y-axis direction.
- the antenna shown in FIG. 31 three unit structures are arranged in the x-axis direction and three in the y-axis direction.
- An auxiliary conductor patch 9 is provided between two conductor patches 4 adjacent in the y-axis direction.
- the auxiliary conductor patch 9 since the auxiliary conductor patch 9 is provided only in the y-axis direction, the dispersion relationship of the CRLH transmission line exhibits anisotropy in the x-axis direction and the y-axis direction.
- the unit structures are arranged symmetrically in the x-axis direction and the y-axis direction, but the frequencies at which half-wave resonance occurs in the x-axis direction and the y-axis direction are different. Accordingly, the antenna shown in FIG. 31 can be used as a dual band antenna or a multiband antenna.
- auxiliary conductor patch 9 illustrates the configuration in which the auxiliary conductor patch 9 is provided only in the y-axis direction, but the auxiliary conductor patch 9 may be provided only in the x-axis direction. Further, for example, the auxiliary conductor patch 9 may have a different size in the x-axis direction and the y-axis direction so that the dispersion relationship has anisotropy in the x-axis direction and the y-axis direction.
- 29 and 30 show the case where the microstrip line 7 is used as a power feeding unit, the coplanar line 11 shown in FIG. 25 and other power feeding units can also be used.
- FIG. 32 is a plan view schematically showing the configuration of the array antenna of the eighth embodiment.
- the array antenna according to the eighth embodiment has a configuration in which a plurality of array elements 50 are arranged on a printed circuit board 51 using the antenna according to the present invention as an array element 50.
- the antenna described in the fifth embodiment is adopted as the array element 50, and the four array elements 50 are arranged one-dimensionally.
- the array elements 50 are connected in parallel by the microstrip line 7.
- the directivity becomes a beam shape, and the antenna gain in the beam direction can be increased.
- the antenna of another embodiment of the present invention can be used as the array element 50. Further, by increasing the number of array elements 50, the beam can be made sharper and the gain in the beam direction can be increased.
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Abstract
Description
特許文献1の構造では、インダクタンス要素を導体パッチ層に接続する第1導体ビアと、インダクタンス要素を導体プレーン層に接続する第2導体ビアの2つの導体ビアを単位構造ごとに設ける必要がある。したがって、構造が複雑になり、製造に要する工数が増えること等により製造効率の低下や製造コストの増大を招いてしまう。
特許文献2の構造では、不要な電磁波が、コプレナー線路を形成するために設けた導体プレーンのスリットから漏れて、導体プレーンの外側に放射されてしまう。
本発明の構造体は、第1導体と、前記第1導体に少なくとも一部が対向して設けられた第2導体と、前記第1導体と前記第2導体との間に配置され、前記第1導体又は前記第2導体のいずれか一方の導体プレーンと導体接続部を介して電気的に接続されているとともに他方の導体に対向して設けられ、開放端を有する伝送線路と、を含み、前記第2導体と前記伝送線路と前記導体接続部とを少なくとも含んで構成される単位構造を少なくとも一つ含むこと特徴とする。
以上のように、本発明の構造体は、薄型化及び低周波化を低コストで実現することが可能であり、しかも構造裏面への不要放射を低減することが可能なものになっている。本発明の構造体は、機器雑音抑制に寄与し、電子装置の誤動作低減等に有益である。本発明のアンテナは、マイクロ波・ミリ波帯域の電磁波を送受信する無線通信機器等の小型化に有益である。
また、CRLH伝送線路のアドミタンスを増加させる観点で、コプレナー線路を設ける必要性が低くなり、コプレナー線路を形成するためのスリットを一方の導体に形成する必要性が低くなる。したがって、スリットの数を減らすことやスリットをなくすことができ、不要な電磁波がスリットを通って一方の導体の外側に放射されることを格段に低減することができる。
また、オープンスタブによりCRLH伝送線路が構成されているので、ショートスタブにより構成されるCRLH伝送線路と比較して、単位構造あたりの導体接続部の数を減らすことができる。したがって、導体接続部の形成に要する工数やコストを低減することができる、低コストの構造体にすることができる。
図1は、第1実施形態に係る構造体をz軸正方向から見た平面図である。図2は、図1の導体パッチ4(図2で2点鎖線で示す)を透視して、構造体をz軸正方向から見た平面図である。図3は、図1及び図2のA-A'線断面図である。
また、後に説明する第5~第8実施形態では、構造体を含んだアンテナについて説明する。第5~第8実施形態では、構造体が主として左手系媒質として動作するようになっている。
次に本発明の第2実施形態に係るプリント基板について説明する。図10は、第2実施形態のプリント基板20の概略構成を示す平面である。図11は、図10のA2-A2'線断面図である。図10、図11に示すようにプリント基板20は、グランドプレーン21と、デバイス22、23と、デバイス22、23の間に配置されたEBG構造24とを備える。プリント基板20は、デバイス22、23が設けられた表層からグランドプレーン21に至る厚み部分が誘電体により構成されている。デバイス22はノイズ源となるデバイスであり、デバイス23はノイズの影響を受けやすいデバイスである。
また、ここではデバイス間のノイズ伝播抑制を例に説明したが、例えば近接して設置されたアンテナ間の不要な結合を抑制する場合にも、デバイスの場合と全く同様に、本発明に係るEBG構造を用いることができる。
次に、本発明の第3実施形態に係るアンテナについて説明する。図13(a)は、本発明に係るEBG構造を反射板として用いたパッチアンテナの一例を示す断面図であり、(b)はパッチアンテナの平面図である。図13に示すようにパッチアンテナ30は、EBG構造31、アンテナエレメント32、及び同軸給電線路33より構成されている。
次に、本発明の第4実施形態に係る伝送線路導波管変換器について説明する。図15は、本発明に係るEBG構造を反射板として用いた伝送線路導波管変換器の一例を示す断面図である。図14に示すように伝送線路導波管変換器40は、反射板としてのEBG構造41、伝送線路42、及び導波管43を備えている。EBG構造41のバンドギャップは、伝送する電磁波の周波数帯に対応させて設計されている。
次に、本発明に係る第5実施形態のアンテナについて説明する。本実施形態のアンテナは、本発明に係る構造体を含んでおり、構造体が左手系媒質として動作するようになっている。
次に、本発明の第6実施形態に係るアンテナについて説明する。図20に示したように、第5実施形態におけるCRLH伝送線路の分散関係は、右手系バンドと左手系バンドの間、すなわち4.9GHzから9.3GHzまでの周波数帯に、バンドギャップを有している。これは、図4に示した等価回路図において、右手系バンドの下限周波数を規定する直列インピーダンスZの共振周波数と、左手系バンドの上限周波数を規定するアドミタンスYの共振周波数にギャップがあるためである。
また、第6実施形態では補助導電パッチ9を伝送線路6と同一層に設けられた構成を例示したが、隣接する2つの導体パッチ4の双方と重なることにより電気的な容量を構成するものであればよく、補助導電パッチ9が伝送線路6と異なる層に設けられた構成であってもよい。また、第1~第4実施形態に係る構造体において、補助導電パッチ9が設けられた構成にすることも可能である。
次に、本発明の第7実施形態に係るアンテナについて説明する。図29は、第7実施形態のアンテナをz軸正方向から見た平面図である。図30、図31は、それぞれ、本発明の第7実施形態の変形例のアンテナをz軸正方向から見た平面図である。
第7実施形態のアンテナは、単位構造が2次元的に周期配列されている点で、第5、第6実施形態のアンテナと異なる。ここでは、導体パッチ4の形状が正方形であり、単位構造がx軸方向に3つ、y軸方向に4つ配列されている。第7実施形態のアンテナは、x軸方向とy軸方向に線路長Lの異なるCRLH伝送線路が形成されているため、x軸方向とy軸方向とで1/2波長共振が生じる周波数が異なる。これにより、第7実施形態のアンテナは、デュアルバンドアンテナまたはマルチバンドアンテナとして機能するようになっている。
次に、本発明の第8実施形態に係るアレイアンテナについて説明する。図32は、第8実施形態のアレイアンテナの構成を模式的に示す平面図である。図32に示すように、第8実施形態のアレイアンテナは、本発明に係るアンテナをアレイ要素50として、プリント基板51に複数のアレイ要素50が配列された構成になっている。ここでは、アレイ要素50として第5実施形態で説明したアンテナを採用しており、4つのアレイ要素50が1次元的に配列されている。アレイ要素50は、マイクロストリップライン7により並列に接続されている。
Claims (28)
- 第1導体と、
前記第1導体に少なくとも一部が対向して設けられた第2導体と、
前記第1導体と前記第2導体との間に配置され、前記第1導体又は前記第2導体のいずれか一方と導体接続部を介して電気的に接続されているとともに他方の導体に対向して設けられ、開放端を有する伝送線路と、を含み、
前記第2導体と前記伝送線路と前記導体接続部とを少なくとも含んで構成される単位構造を少なくとも一つ含むことを特徴とする構造体。 - 前記単位構造が繰り返し配置されていること特徴とする請求項1に記載の構造体。
- 前記第1導体は、繰り返し配置されている複数の前記単位構造で共通になっていることを特徴とする請求項1又は2に記載の構造体。
- 前記第1導体において前記第2導体に対向する面の面方向の寸法が、前記第2導体において前記第1導体に対向する面の面方向の寸法と異なることを特徴とする請求項1~3のいずれか一項に記載の構造体。
- 前記他方の導体が前記伝送線路のリターンパスであることを特徴とする請求項1~4のいずれか一項に記載の構造体。
- 前記第2導体において前記第1導体と対向する面が、前記第1導体において前記第2導体と対向する面と平行になっていることを特徴とする請求項1~5のいずれか一項に記載の構造体。
- 前記第1導体又は前記第2導体の前記一方の導体と前記伝送線路との間に配置された誘電体層を含み、
前記導体接続部が前記誘電体層を貫通して設けられた導体ビアであることを特徴とする請求項1~6のいずれか一項に記載の構造体。 - 前記一方の導体と前記伝送線路との間に配置された誘電体層と、前記他方の導体と前記伝送線路との間に配置された第2の誘電体層を含み、
前記他方の導体に開口が設けられており、
前記導体接続部が、前記誘電体層と前記第2の誘電体層とを貫通して設けられた導体ビアであるとともに、一部が前記開口内に配置されており前記他方の導体と非接触になっていることを特徴とする請求項1~6のいずれか一項に記載の構造体。 - 前記単位構造が、前記第1導体と平行な平面上に1次元的に又は2次元的に周期的に配置されていることを特徴とする請求項1~8のいずれか一項に記載の構造体。
- 前記伝送線路は、前記他方の導体と対向する面に平面的に設けられており、該伝送線路の平面形状がスパイラル形状になっていることを特徴とする請求項1~9のいずれか一項に記載の構造体。
- 前記伝送線路は、前記他方の導体プレーンと対向する面に平面的に設けられており、該伝送線路の平面形状がミアンダ形状になっていることを特徴とする請求項1~9のいずれか一項に記載の構造体。
- 前記伝送線路が複数の端部を含んでおり、前記複数の端部の少なくとも1つが前記導体接続部と電気的に接続されていることを特徴とする請求項1~11のいずれか一項に記載の構造体。
- 前記伝送線路が、分岐部と該分岐部から互いに分岐した枝線路とを含んでおり、前記枝線路の線路長が互いに異なっていることを特徴とする請求項1~12のいずれか一項に記載の構造体。
- 前記単位構造は、該単位構造に入射する電磁波の波数又は波長に対する周波数の分散関係にバンドギャップを有しており、該単位構造により電磁バンドギャップ構造の一部が構成されることを特徴とする請求項1~13のいずれか一項に記載の構造体。
- 請求項1~14のいずれか一項に記載の構造体を備えることを特徴とするプリント基板。
- 前記構造体により反射板が構成されることを特徴とする請求項15に記載のプリント基板。
- 前記プリント基板に複数のデバイスが設けられており、前記デバイスの間における電磁波の伝播経路の少なくとも1つを遮って、前記構造体が設けられていることを特徴とする請求項16に記載のプリント基板。
- 前記構造体を構成する前記単位構造の少なくとも1つに電気信号を供給する給電部が設けられていることを特徴とする請求項15に記載のプリント基板。
- 請求項1~14のいずれか一項に記載の構造体を備えることを特徴とするアンテナ。
- 前記構造体により反射板が構成されることを特徴とする請求項19に記載のアンテナ。
- 前記単位構造の少なくとも1つに電気信号を供給する給電部が設けられていることを特徴とする請求項19に記載のアンテナ。
- 前記単位構造は複数繰り返し配置されており、
前記第2導体と異なる平面に設けられ、互いに隣接する2つの前記第2導体の双方と重なるように配置された補助導体を少なくとも1つ備えることを特徴とする請求項20に記載のアンテナ。 - 前記補助導体が、前記伝送線路と同一平面に配置されていることを特徴とする請求項22に記載のアンテナ。
- 前記給電部が、前記他方の導体と同一平面に設けられているとともに、前記他方の導体の少なくとも1つと電気的に接続されていることを特徴とする請求項21~23のいずれか一項に記載のアンテナ。
- 前記給電部が、前記一方の導体と同一平面に設けられ前記導体接続部のいずれか1つに接続するコプレナー線路を含んでいることを特徴とする請求項21~23のいずれか一項に記載のアンテナ。
- 請求項1~14のいずれか一項に記載の構造体を反射板として備えることを特徴とする伝送線路導波管変換器。
- 請求項20~25のいずれか一項に記載のアンテナをアレイ要素として、複数のアレイ要素を同一平面に配置して構成されることを特徴とするアレイアンテナ。
- 請求項1~14のいずれか一項に記載の構造体、請求項15~18のいずれか一項に記載のプリント基板、請求項19~25のいずれか一項に記載のアンテナ、請求項26に記載の伝送線路導波管変換器、及び請求項27に記載のアレイアンテナの少なくとも1つを備えることを特徴とする電子装置。
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CN102414920B (zh) | 2016-06-08 |
CN102414920A (zh) | 2012-04-11 |
JPWO2010125784A1 (ja) | 2012-10-25 |
JP5533860B2 (ja) | 2014-06-25 |
US9269999B2 (en) | 2016-02-23 |
US20120032865A1 (en) | 2012-02-09 |
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