WO2010114260A3 - 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 - Google Patents

발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 Download PDF

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Publication number
WO2010114260A3
WO2010114260A3 PCT/KR2010/001893 KR2010001893W WO2010114260A3 WO 2010114260 A3 WO2010114260 A3 WO 2010114260A3 KR 2010001893 W KR2010001893 W KR 2010001893W WO 2010114260 A3 WO2010114260 A3 WO 2010114260A3
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WO
WIPO (PCT)
Prior art keywords
light
emitting devices
photo
coating layer
coating
Prior art date
Application number
PCT/KR2010/001893
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English (en)
French (fr)
Other versions
WO2010114260A2 (ko
Inventor
권성훈
정수은
Original Assignee
서울대학교산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울대학교산학협력단 filed Critical 서울대학교산학협력단
Priority to US13/262,342 priority Critical patent/US8455890B2/en
Publication of WO2010114260A2 publication Critical patent/WO2010114260A2/ko
Publication of WO2010114260A3 publication Critical patent/WO2010114260A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

발광소자를 코팅하는 방법으로, 먼저 복수의 발광소자들을 준비한다. 상기 복수의 발광소자들을 제1 광경화성 액체로 도포한다. 상기 제1 광경화성 액체에 제1 광을 선택적으로 노출함으로써, 상기 복수의 발광소자들 표면의 적어도 일부 영역에 제1 코팅층을 형성한다. 상기 제1 코팅층이 형성된 상기 복수의 발광소자들을 제2 광경화성 액체로 도포한다. 상기 제2 광경화성 액체에 제2 광을 선택적으로 노출함으로써, 상기 복수의 발광소자들 또는 상기 제1 코팅층 표면의 적어도 일부 영역에 제2 코팅층을 형성한다. 상기 제1 코팅층은 경화된 상기 제1 광경화성 액체에 해당하며, 상기 제2 코팅층은 경화된 상기 제2 광경화성 액체에 해당한다.
PCT/KR2010/001893 2009-03-30 2010-03-29 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 WO2010114260A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/262,342 US8455890B2 (en) 2009-03-30 2010-03-29 Method for coating light-emitting devices, light coupler, and method for manufacturing the light coupler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0026991 2009-03-30
KR1020090026991A KR100984126B1 (ko) 2009-03-30 2009-03-30 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법

Publications (2)

Publication Number Publication Date
WO2010114260A2 WO2010114260A2 (ko) 2010-10-07
WO2010114260A3 true WO2010114260A3 (ko) 2010-12-09

Family

ID=42828820

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PCT/KR2010/001893 WO2010114260A2 (ko) 2009-03-30 2010-03-29 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법

Country Status (3)

Country Link
US (1) US8455890B2 (ko)
KR (1) KR100984126B1 (ko)
WO (1) WO2010114260A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
KR101167184B1 (ko) 2011-05-25 2012-07-24 한국광기술원 Ｌｅｄ 패키지 봉지재의 경화 장치
JP6655004B2 (ja) 2013-03-14 2020-02-26 マイクロン デバイシーズ， エルエルシー 無線植込み型電力受信機システム及び方法
US9341941B2 (en) 2013-08-01 2016-05-17 Samsung Electronics Co., Ltd. Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask
DE102015103835A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
KR102335106B1 (ko) * 2015-06-19 2021-12-03 삼성전자 주식회사 발광 소자 패키지 및 그 제조 방법
US10094530B2 (en) * 2015-06-25 2018-10-09 Texas Instruments Incorporated Apparatus for spatially and spectrally adaptable dichromatic white light source using spatial light modulator
KR20180090002A (ko) * 2017-02-02 2018-08-10 서울반도체 주식회사 발광 다이오드 패키지
US10527854B1 (en) * 2018-06-18 2020-01-07 Facebook Technologies, Llc Illumination source for a waveguide display

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05341155A (ja) * 1992-04-07 1993-12-24 Ricoh Co Ltd 光カプラー及びその製造方法
US6069440A (en) * 1996-07-29 2000-05-30 Nichia Kagaku Kogyo Kabushiki Kaisha Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material
JP2001250255A (ja) * 2000-03-02 2001-09-14 Sony Corp 光学装置及び光ディスク装置
KR20050071780A (ko) * 2004-01-02 2005-07-08 주식회사 메디아나전자 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736450B2 (ja) 1985-09-05 1995-04-19 株式会社コパル Ｌｅｄ光源
JP2000269523A (ja) 1999-03-16 2000-09-29 Fuji Xerox Co Ltd 光電変換装置
JP3725413B2 (ja) 2000-10-06 2005-12-14 松下電器産業株式会社 半導体発光装置
JP4122737B2 (ja) 2001-07-26 2008-07-23 松下電工株式会社 発光装置の製造方法
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7494246B2 (en) * 2007-06-06 2009-02-24 Philips Lumileds Lighting Company, Llc Thin luminaire for general lighting applications

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05341155A (ja) * 1992-04-07 1993-12-24 Ricoh Co Ltd 光カプラー及びその製造方法
US6069440A (en) * 1996-07-29 2000-05-30 Nichia Kagaku Kogyo Kabushiki Kaisha Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material
JP2001250255A (ja) * 2000-03-02 2001-09-14 Sony Corp 光学装置及び光ディスク装置
KR20050071780A (ko) * 2004-01-02 2005-07-08 주식회사 메디아나전자 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법

Also Published As

Publication number Publication date
US8455890B2 (en) 2013-06-04
KR100984126B1 (ko) 2010-09-28
WO2010114260A2 (ko) 2010-10-07
US20120032200A1 (en) 2012-02-09

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