WO2010097855A1 - Procédé de fabrication d'un panneau d'affichage - Google Patents

Procédé de fabrication d'un panneau d'affichage Download PDF

Info

Publication number
WO2010097855A1
WO2010097855A1 PCT/JP2009/005257 JP2009005257W WO2010097855A1 WO 2010097855 A1 WO2010097855 A1 WO 2010097855A1 JP 2009005257 W JP2009005257 W JP 2009005257W WO 2010097855 A1 WO2010097855 A1 WO 2010097855A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
sealing material
display panel
liquid crystal
reflecting member
Prior art date
Application number
PCT/JP2009/005257
Other languages
English (en)
Japanese (ja)
Inventor
江口誠
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2010097855A1 publication Critical patent/WO2010097855A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • the present invention relates to a method for manufacturing a display panel in which a pair of substrates are overlapped at a predetermined interval and a display medium layer is sealed in a gap between the pair of substrates.
  • a liquid crystal display panel includes a pair of substrates disposed opposite to each other (that is, a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate), a liquid crystal layer provided between the pair of substrates, A pair of substrates are bonded to each other, and a sealing material provided in a frame shape is provided between the substrates to enclose liquid crystal.
  • a TFT Thin Film Transistor
  • CF Color Filter
  • a method for reducing the external size of the liquid crystal panel has been proposed. More specifically, in a liquid crystal display panel including the above-described TFT substrate, CF substrate, liquid crystal layer, and sealing material, the TFT substrate, the CF substrate, and the sealing material are divided in a region where the sealing material is disposed. Discloses a method of forming an end face of a liquid crystal display panel. And it is described by such a method that the frame part of a liquid crystal display panel can be made small and the external size of a liquid crystal display panel can be made small (for example, refer patent document 1).
  • a terminal for connecting the liquid crystal display panel to an integrated circuit chip (or IC chip) which is an electronic component is provided, and a frame region ( That is, it is necessary to expose the terminal area.
  • a frame region That is, it is necessary to expose the terminal area.
  • Patent Document 1 since the method described in Patent Document 1 is applicable only when the TFT substrate and the CF substrate are divided together, there is a problem that it cannot be applied to the terminal region. Further, when the CF substrate corresponding to the terminal region is divided, if the CF substrate is divided together with the sealing material in the terminal region, the wiring on the TFT substrate is peeled off together with the sealing material when the CF substrate is removed. Therefore, in order to avoid the inconvenience, it is necessary to form the end surface of the CF substrate so that the end surface of the CF substrate is outside the outer surface of the sealing material, and it is difficult to narrow the terminal region. There was a problem that there was.
  • an object of the present invention is to provide a method for manufacturing a display panel that can cope with the narrowing of the frame area of the terminal area of the display panel.
  • a method for manufacturing a display panel according to the present invention includes a first substrate having a terminal region in which terminals and wirings are formed, a first substrate facing the first substrate, and a first material via a sealing material.
  • a display panel manufacturing method comprising: a second substrate bonded to a substrate; and a display medium layer sealed with a sealant between the first substrate and the second substrate.
  • the step of forming a reflective member that reflects laser light on the wiring, and the sealing material is arranged so that the sealing material covers a part of the reflective member.
  • the method includes at least a step of separating and removing the second substrate corresponding to the terminal region and the sealing material by reflecting the laser beam with the reflecting member.
  • the reflecting member is formed on the wiring, damage to the wiring can be prevented even when the laser beam is irradiated.
  • the sealing material is divided and removed together with the second substrate corresponding to the terminal region after the laser beam is irradiated, the reflection member is formed on the wiring. It is possible to divide and remove the second substrate and the sealing material without peeling the wiring on the one substrate. Accordingly, the end surface of the second substrate and the outer surface of the sealing material can be made flush with each other at the end surface of the terminal region. As a result, the terminal area can be narrowed.
  • the surface on the sealing material side of the reflective member is more than the intermediate position of the sealing material in the width direction of the sealing material. You may arrange
  • the display panel manufacturing method of the present invention includes a first substrate having a terminal region in which terminals and wirings are formed, a first substrate facing the first substrate, and bonded to the first substrate through a sealing material. It is a manufacturing method of a display panel comprising two substrates and a display medium layer sealed with a sealing material between a first substrate and a second substrate. Moreover, the manufacturing method of the display panel of this invention forms the resin member which can peel with respect to a reflection member on the reflection member, the process of forming the reflection member which reflects a laser beam on wiring in a terminal area
  • the second substrate, the sealing material, and the resin corresponding to the terminal region are irradiated with laser light from the second substrate side toward the first substrate side and reflected by the reflecting member in the region where the second substrate side is provided.
  • a step of separating and removing the member is
  • the second substrate corresponding to the terminal region is divided and removed after irradiating the laser beam, even if the sealing material is divided and removed together with the second substrate, Since the reflecting member is formed on the first substrate, the second substrate and the sealing material can be separated and removed without removing the sealing material and the wiring on the first substrate being peeled off. Accordingly, the end surface of the second substrate and the outer surface of the sealing material can be made flush with each other at the end surface of the terminal region. As a result, the terminal area can be narrowed.
  • the resin member which can be peeled with respect to the reflecting member is formed on the reflecting member, when the unnecessary portion of the resin member is divided and removed, the unnecessary portion of the resin member is easily peeled off from the reflecting member. It becomes possible. Therefore, the second substrate, the sealing material, and the resin member corresponding to the terminal region can be easily divided and removed.
  • the sealing material side surface of the reflecting member and the sealing material side surface of the resin member in the width direction of the sealing material may be disposed so as to be located outside the intermediate position of the sealing material.
  • the reflecting member may be formed of a metal material.
  • the display panel manufacturing method of the present invention has an excellent characteristic that it can cope with the narrowing of the frame area of the terminal area of the display panel. Therefore, the method for manufacturing a display panel of the present invention is suitably used for a display panel using a liquid crystal layer as a display medium layer.
  • FIG. 1 is a plan view of a liquid crystal display panel according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB in FIG.
  • It is a top view which shows the TFT mother substrate for manufacturing the liquid crystal display panel which concerns on the 1st Embodiment of this invention.
  • It is sectional drawing for demonstrating the reflection member in the TFT substrate of the liquid crystal display panel which concerns on the 1st Embodiment of this invention.
  • It is a top view which shows CF mother board for manufacturing the liquid crystal display panel which concerns on the 1st Embodiment of this invention.
  • FIG. 1 is a plan view of a liquid crystal display panel according to the first embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along the line AA of FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB of FIG.
  • the liquid crystal display panel 1 includes a TFT substrate 10 that is a first substrate, a CF substrate 20 that is a second substrate facing the TFT substrate 10, and the TFT substrate 10 and the CF substrate 20.
  • a liquid crystal layer 25 which is a display medium layer provided therebetween, and a sealing material 26 provided in a frame shape for adhering the TFT substrate 10 and the CF substrate 20 to each other and enclosing the liquid crystal layer 25 are provided.
  • the sealing material 26 is formed so as to go around the liquid crystal layer 25, and the TFT substrate 10 and the CF substrate 20 are bonded to each other via the sealing material 26.
  • the TFT substrate 10 protrudes from the CF substrate 20 on the upper side, and a plurality of terminals for driving the liquid crystal display panel 1 are in the protruding region.
  • a terminal region T provided with 27 is formed.
  • a plurality of connection wires 28 connected to the plurality of terminals 29 are provided.
  • a display area (or central area) D for displaying an image is defined in an area where the TFT substrate 10 and the CF substrate 20 overlap.
  • the display area D is configured by arranging a plurality of pixels, which are the minimum unit of an image, in a matrix.
  • the TFT substrate 10 has a frame region F that is formed around the display region D and does not contribute to display. As shown in FIG. 1, the frame region F is formed around the display region D.
  • the CF substrate is formed on the end surface of the terminal region T as shown in FIGS.
  • the end surface 20a of 20 and the outer surface 26a of the sealing material 26 are configured to be on the same plane, and the terminal region T is narrowed.
  • the TFT substrate 10 includes, for example, a plurality of gate lines (not shown) provided so as to extend in parallel with each other on a substrate body such as a glass substrate or a plastic substrate, and a gate insulating film provided so as to cover each gate line (Not shown) and a plurality of source lines (not shown) extending in parallel to each other in a direction orthogonal to the gate lines on the gate insulating film.
  • the TFT substrate 10 includes a plurality of TFTs (not shown) provided at each intersection of the gate lines and the source lines, and an interlayer insulating film (not shown) provided so as to cover the source lines and the TFTs.
  • the TFT 5 includes a gate electrode (not shown) in which each gate line protrudes to the side, a semiconductor layer (not shown) provided in an island shape at a position overlapping the gate electrode on the gate insulating film, And a source electrode (not shown) and a drain electrode (not shown) provided to face each other.
  • the drain electrode is connected to the pixel electrode via a contact hole (not shown) formed in the interlayer insulating film.
  • the pixel electrode includes a transparent electrode (not shown) provided on the interlayer insulating film, and a reflective electrode (not shown) stacked on the transparent electrode and provided on the surface of the transparent electrode. . Further, in the TFT substrate 10 and the display area D of the liquid crystal display panel 1 including the TFT substrate 10, the reflective area is defined by the reflective electrode, and the transmissive area is defined by the transparent electrode exposed from the reflective electrode.
  • the CF substrate 20 includes, for example, a black matrix (not shown) provided in a lattice shape and a frame shape as a light-shielding portion on a substrate body such as a glass substrate or a plastic substrate, and a red color provided between each lattice of the black matrix. And a color filter (not shown) including a green layer, a green layer, and the like.
  • the CF substrate 20 covers a common electrode (not shown) provided so as to cover the black matrix and the color filter, a photo spacer (not shown) provided in a column shape on the common electrode, and the common electrode. And an alignment film (not shown) provided.
  • the liquid crystal layer 25 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.
  • the sealing material 26 is provided in a rectangular frame shape surrounding the entire periphery of the display area D.
  • the frame width of the sealing material 26 is not particularly limited, but can be set to 0.5 mm or more and 2.0 mm or less, for example.
  • the liquid crystal display panel 1 includes one pixel for each pixel electrode. By applying a predetermined voltage to the liquid crystal layer 25 in each pixel, the alignment state of the liquid crystal layer 25 is changed. An image is displayed by adjusting the transmittance of light incident from the backlight.
  • FIG. 4 is a plan view showing a TFT mother substrate for manufacturing the liquid crystal display panel according to the first embodiment of the present invention
  • FIG. 5 is a plan view of the liquid crystal display panel according to the first embodiment of the present invention. It is sectional drawing for demonstrating the reflection member in a TFT substrate.
  • FIG. 6 is a plan view showing a CF mother substrate for manufacturing the liquid crystal display panel according to the first embodiment of the present invention
  • FIGS. 7 to 11 show the first embodiment of the present invention. It is sectional drawing for demonstrating the manufacturing method of the liquid crystal display panel which concerns.
  • the manufacturing method in this embodiment is provided with a mother board
  • a TFT, a pixel electrode, and the like are patterned to form a plurality of active element layers each constituting the display region D.
  • an alignment film is formed on the surface, and a TFT mother substrate 70 in which a plurality of display regions D and terminal regions T are defined in a matrix form as shown in FIG. 4 is manufactured.
  • the terminal 27 and the wiring 28 are formed monolithically by a known method.
  • twelve TFT substrates 10 are produced from one TFT mother substrate 70.
  • the reflection member 2 that reflects the laser light is formed on the wiring 28 in the terminal region T of the TFT substrate 10 on which the terminal 27 and the wiring 28 are formed. There is a feature in the point to do.
  • the reflecting member 2 is for preventing the laser light from entering the TFT substrate 10 and the wiring 28 when the CF substrate 10 corresponding to the terminal region T is divided by the laser light.
  • the material for forming the reflecting member 2 is not particularly limited as long as it reflects laser light.
  • aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), molybdenum (Mo) A metal material that reflects laser light such as) can be used.
  • the reflecting member 2 is formed on the wiring 28 in the terminal region T by a method such as photolithography, for example.
  • a black matrix, a color filter, a common electrode, and the like are patterned on the substrate body 17 made of alkali-free glass to form a plurality of CF element layers each constituting the display region D.
  • an alignment film is formed on the surface, and a CF mother substrate 80 in which a plurality of display regions D are defined in a matrix shape as shown in FIG. 6 is manufactured.
  • the black matrix is made of metal materials such as Ta (tantalum), Cr (chromium), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), and Al (aluminum), and black pigments such as carbon.
  • metal materials such as Ta (tantalum), Cr (chromium), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), and Al (aluminum), and black pigments such as carbon.
  • the sealing material 26 is drawn in a frame shape on the frame region F on the four sides of the CF substrate 20 on the CF substrate 20 using, for example, a dispenser.
  • the sealing material 26 is formed in a frame shape along the four sides of the CF substrate 20 as shown in FIG.
  • the sealing material 26 is an ultraviolet curable resin or an ultraviolet curable and thermosetting resin.
  • the sealing material 26 is formed so as not to contact the end portion of the substrate and the display region D.
  • Another method for forming the sealing material 26 includes screen printing, but there are disadvantages such as distortion or breakage of the screen plate or contamination of the substrate due to contact with the substrate. Therefore, in an active matrix type liquid crystal display panel in which the frame region F is narrow and the impurity management of the liquid crystal material is required, a drawing method using a dispenser that is non-contact with the substrate and has high drawing position accuracy is suitable. .
  • a liquid crystal material is dropped and injected inside the display area D of each of the CF substrates 20 formed on the CF mother substrate 80 (that is, inside the sealing material 26).
  • the dropping of the liquid crystal material is performed, for example, by dropping a liquid crystal material while a dropping device having a function of dropping the liquid crystal material moves over the entire substrate surface. If the liquid crystal material is dropped on the inside of the sealing material 26 after the sealing material 26 is drawn on the TFT substrate 10, a dropping mark is likely to occur, and a circuit on the TFT substrate 10 is damaged due to static electricity. There is also a problem. Therefore, it is preferable to drop the liquid crystal material after drawing the sealing material 26 on the CF substrate 20 as in the present embodiment.
  • CF substrate 20 onto which the liquid crystal material is dropped in the liquid crystal material injecting step and the TFT substrate 10 manufactured in the TFT substrate manufacturing step are bonded together so that the display areas D overlap each other under reduced pressure.
  • the sealing material 26 covers a part of the reflecting member 2 (that is, a part of the inner surface 2a and the upper surface 2b of the reflecting member 2) (that is, a part of the reflecting member 2).
  • the TFT substrate 10 and the CF substrate 20 are bonded to each other with the sealing material 26 disposed so that the reflecting member 2 and the sealing material 26 overlap each other.
  • the inner surface of the reflecting member 2 that is, the surface of the reflecting member 2 on the sealing material 26 side
  • the sealing material 26 is arranged so as to be located outside (that is, in the width direction X of the sealing material 26 and in the direction of the arrow Y in the drawing).
  • the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the TFT substrate 10 are bonded together by performing heat and pressure treatment.
  • the liquid crystal display panel 5 before dividing the CF substrate 20 shown in FIG. 8 is obtained by bringing the cutting edge of the super steel wheel into contact with the front and back surfaces of the bonded body and dividing the bonded body into each display region D.
  • the super steel wheel is, for example, a disc-shaped cutting blade made of a cemented carbide such as tungsten carbide, and is configured such that the side surface of the disc protrudes in a tapered shape toward the center in the thickness direction. Yes. Further, the super steel wheel may have a protrusion formed on its tapered blade edge.
  • ⁇ CF substrate cutting process> First, as shown in FIG. 9, in a region where the sealing material 26 of the liquid crystal display panel 5 is disposed before the CF substrate 20 is divided, a planned splitting surface 29 from the CF substrate 20 side toward the TFT substrate 10 side. A laser beam L is irradiated along the line. At this time, in the present embodiment, as described above, since the reflection member 2 that reflects the laser light L is provided in the terminal region T of the TFT substrate 10, the laser light in the terminal region T of the TFT substrate 10 is provided. In the region where L is incident, the laser light L incident on the CF substrate 20 and the sealing material 26 is reflected by the reflecting member 2.
  • the TFT substrate 10 and the wiring 28 provided below the reflecting member 2 are not irradiated with the laser light L, and the TFT substrate 10 and the wiring 28 are not damaged by the laser light L. Therefore, as shown in FIG. 10, only the CF substrate 20 and the sealing material 26 are divided by the irradiation of the laser light L.
  • the reflecting member 2 remaining on the TFT substrate 10 is removed by etching from the state shown in FIG.
  • the unnecessary portion 20b of the divided CF substrate 20 and the unnecessary portion 26b of the sealing material 26 are required. 11
  • the unnecessary portion 20b of the divided CF substrate 20 and the unnecessary portion 26b of the sealing material 26 can be removed simultaneously with the removal of the reflecting member 2, as shown in FIG. .
  • an external component that is, an electronic component such as an integrated circuit chip
  • liquid crystal display panel 1 shown in FIGS. 1 to 3 is manufactured.
  • the sealing material 26 is arranged so that the inner surface 2 a of the reflecting member 2 is positioned outside the intermediate position C of the sealing material 26 in the width direction X of the sealing material 26. Even when the reflecting member 2 is removed, a sufficient contact area between the sealing material 26 and the wiring 28 formed on the TFT substrate 10 can be secured, thereby preventing a decrease in sealing strength due to the sealing material. It becomes possible.
  • etching for example, a method of removing the reflecting member 2 by using the corrosive action of chemicals, corroding the reflecting member 2 with a corrosive agent, and the like can be adopted.
  • the reflection member 2 that reflects the laser light L is formed on the wiring 28 in the terminal region T of the TFT substrate 10.
  • the sealing material 26 is disposed so that the sealing material 26 covers a part of the reflecting member 2, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26.
  • the laser beam L is irradiated from the CF substrate 20 side to the TFT substrate 10 side, and the laser beam L is reflected by the reflecting member 2, whereby the terminal region T
  • the CF substrate 20 and the sealing material 26 corresponding to are separated and removed. Accordingly, since the reflecting member 2 is formed on the wiring 28, damage to the wiring 28 can be prevented even when the laser light L is irradiated.
  • the sealing material 26 is divided and removed together with the CF substrate 20. Even in the case where the reflective member 2 is formed on the wiring 28, the CF substrate 20 and the sealing material 26 are separated and removed without removing the sealing material 26 and the wiring 28 being peeled off. Is possible. Therefore, unlike the prior art, it is not necessary to form the end surface 20a of the CF substrate 20 outside the outer surface 26a of the sealing material 26 at the end surface of the terminal region T. The end surface 20a of the CF substrate 20 and the outer surface 26a of the sealing material 26 can be made flush. As a result, the terminal region T can be narrowed.
  • the surface 2 a on the sealing material 26 side of the reflecting member 2 is positioned in the middle of the sealing material 26 in the width direction X of the sealing material 26.
  • the sealing material 26 is arranged so as to be positioned outside C. Therefore, even when the reflecting member 2 is removed, a sufficient contact area between the sealing material 26 and the wiring 28 formed on the TFT substrate 10 can be ensured. It becomes possible to prevent. As a result, it is possible to narrow the frame of the terminal region T without reducing the sealing strength of the sealing material 26.
  • the reflecting member 2 is formed of a metal material. Therefore, it is possible to form the reflecting member 2 with an inexpensive and versatile metal material.
  • FIG. 12 is a cross-sectional view for explaining the reflecting member and the resin member in the TFT substrate of the liquid crystal display panel according to the second embodiment of the present invention.
  • 13 to 17 are cross-sectional views for explaining a method of manufacturing a liquid crystal display panel according to the second embodiment of the present invention.
  • FIG. 18 is a cross-sectional view of a liquid crystal display panel according to the second embodiment of the present invention. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Further, the overall structure of the liquid crystal display panel is the same as that described in the first embodiment, and a detailed description thereof is omitted here.
  • the manufacturing method in the present embodiment includes a mother substrate manufacturing process, a sealing material forming process, a liquid crystal material injection process, a bonded body forming process, a mother substrate cutting process, and a CF substrate cutting process.
  • ⁇ Mother substrate manufacturing process> As in the case of the first embodiment described above, first, for example, a TFT, pixel electrodes, and the like are patterned on the substrate body 6 made of non-alkali glass, and a plurality of active elements each constituting the display region D are formed. Form a layer. Thereafter, an alignment film is formed on the surface, and a TFT mother substrate 70 in which a plurality of display regions D and terminal regions T are defined in a matrix is manufactured.
  • the reflecting member 2 that reflects the laser light is formed and the reflection is performed.
  • the resin member 3 that can be peeled from the reflecting member 2 is formed on the surface of the member 2.
  • This resin member 3 has a weak adhesive force with the reflecting member 2 and can be peeled from the reflecting member 2.
  • the resin member 3 is formed of a resin material that has a weak adhesive force with the metal, such as vinyl acetate, and can be peeled off from the metal. can do.
  • the resin member 3 is formed on the reflecting member 2 in the terminal region T by, for example, coating directly on the reflecting member 2 or by a method such as photolithography.
  • a black matrix, a color filter, a common electrode, etc. are patterned on the substrate body 17 made of non-alkali glass, and the display area D is formed in each.
  • a plurality of constituent CF element layers are formed.
  • an alignment film is formed on the surface, and a CF mother substrate 80 in which a plurality of display regions D are defined in a matrix is manufactured.
  • the seal material 26 is drawn in a frame shape on the frame region F on the four sides of the CF substrate 20 on the CF substrate 20 using, for example, a dispenser.
  • a liquid crystal material is dropped and injected inside the display area D of each of the CF substrates 20 formed on the CF mother substrate 80 (that is, inside the sealing material 26).
  • CF substrate 20 onto which the liquid crystal material is dropped in the liquid crystal material injecting step and the TFT substrate 10 manufactured in the TFT substrate manufacturing step are bonded together so that the display areas D overlap each other under reduced pressure.
  • the sealing material 26 includes a part of the reflecting member 2 (that is, a part of the inner surface 2 a and the upper surface 2 b of the reflecting member 2) and a part of the resin member 3.
  • the sealing material 26 is disposed so as to cover the inner surface 3a and a part of the upper surface 3b of the resin member 3 (that is, the reflective member 2 and the resin member 3 and the sealing material 26 overlap with each other).
  • the TFT substrate 10 and the CF substrate 20 are bonded together via the material 26.
  • the sealing material 26 is positioned so that the surface 3a on the material 26 side is located outside the intermediate position C of the sealing material 26 (that is, in the width direction X of the sealing material 26 and in the direction of arrow Y in the figure). Arrange.
  • the liquid crystal material is diffused to form the liquid crystal layer 25, and under predetermined conditions,
  • the sealing material 26 and the TFT substrate 10 are bonded by performing a heat and pressure treatment.
  • ⁇ CF substrate cutting process> First, as shown in FIG. 15, in a region where the sealing material 26 of the liquid crystal display panel 7 before the CF substrate 20 is divided is arranged, a planned division surface 31 from the CF substrate 20 side to the TFT substrate 10 side. A laser beam L is irradiated along the line. At this time, in the present embodiment, as described above, since the reflection member 2 that reflects the laser light L is provided in the terminal region T of the TFT substrate 10, the laser light in the terminal region T of the TFT substrate 10 is provided. In the region where L is incident, the laser light L incident on the CF substrate 20, the sealing material 26 and the resin member 3 is reflected by the reflecting member 2.
  • the TFT substrate 10 and the wiring 28 provided below the reflecting member 2 are not irradiated with the laser light L, and the TFT substrate 10 and the wiring 28 are not damaged by the laser light L. Accordingly, as shown in FIG. 16, only the CF substrate 20, the sealing material 26, and the resin member 3 are divided by the irradiation with the laser light L.
  • the unnecessary portion 20b of the divided CF substrate 20, the unnecessary portion 26b of the sealing material 26, and the unnecessary portion 3c of the resin member 3 are removed. As a result, since the terminal 27 provided in the terminal region T is exposed, the terminal 27 and the external component can be connected.
  • the resin member 3 can be peeled from the reflecting member 2, when removing the unnecessary portion 3c of the resin member 3, the unnecessary portion 3c of the resin member 3 can be easily peeled off. it can.
  • the liquid crystal display panel 15 shown in FIG. 18 is manufactured by removing the reflective member 2 remaining on the TFT substrate 10 by etching.
  • the resin member 3 remaining on the reflection member 2 can be removed at the same time.
  • the inner side surface 2 a of the reflecting member 2 and the inner side surface 3 a of the resin member 3 are positioned outside the intermediate position C of the sealing material 26 in the width direction X of the sealing material 26.
  • the sealing material 26 is arranged. Therefore, even when the reflecting member 2 and the resin member 3 are removed, a sufficient contact area between the sealing material 26 and the wiring 28 formed on the TFT substrate 10 can be secured. It becomes possible to prevent a decrease in strength.
  • the reflection member 2 that reflects the laser light L is formed on the wiring 28.
  • the resin member 3 that can be peeled from the reflecting member 2 is formed on the reflecting member 2.
  • the sealing material 26 is arranged so that the sealing material 26 covers a part of the reflecting member 2 and the resin member 3, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26. .
  • the laser beam L is irradiated from the CF substrate 20 side to the TFT substrate 10 side, and the laser beam L is reflected by the reflecting member 2, whereby the terminal region T
  • the CF substrate 20, the sealing material 26, and the resin member 3 corresponding to the above are separated and removed.
  • the reflecting member 2 since the reflecting member 2 is formed on the wiring 28, damage to the wiring 28 can be prevented even when the laser light L is irradiated. Further, after irradiating the laser beam L, when the CF substrate 20 corresponding to the terminal region T is separated and removed (ie, the unnecessary portion 20b of the CF substrate 20), the sealing material 26 is divided together with the CF substrate 20. Even in the case of removal, since the reflecting member 2 is formed on the wiring 28, the CF substrate 20 and the sealing material 26 are connected to each other without removing the wiring 28 on the TFT substrate 10 together with the removal of the sealing material 26. It becomes possible to divide and remove. Therefore, the end surface 20a of the CF substrate 20 and the outer surface 26a of the sealing material 26 can be made flush with each other at the end surface of the terminal region T. As a result, the terminal region T can be narrowed.
  • the resin member 3 that can be peeled from the reflection member 2 is formed on the reflection member 2, when the unnecessary portion 3c of the resin member 3 is divided and removed, the resin member 3 The unnecessary portion 3c can be easily peeled off from the reflecting member 2. Therefore, the CF substrate 20, the sealing material 26, and the resin member 3 corresponding to the terminal region T can be easily divided and removed.
  • the inner side surface 2 a of the reflecting member 2 and the inner side surface 3 a of the resin member 3 are positioned outside the intermediate position C of the sealing material 26.
  • the sealing material 26 is arranged. Therefore, even when the reflecting member 2 and the resin member 3 are removed, a sufficient contact area between the sealing material 26 and the wiring 28 formed on the TFT substrate 10 can be secured. It is possible to prevent a decrease in the seal strength. As a result, the terminal region T can be narrowed without reducing the sealing strength of the sealing material 26.
  • the sealing material 26 is formed on the CF substrate 20.
  • the sealing material 26 may be formed on the TFT substrate 10, and both the TFT substrate 10 and the CF substrate 20 are used.
  • the sealing material 26 may be formed. That is, in the present invention, the sealing material 26 is arranged so that the sealing material 26 covers a part of the reflecting member 2 (or a part of the reflecting member 2 and a part of the resin member 3), and the sealing material 26 is As long as the TFT substrate 10 and the CF substrate 20 can be bonded together, the sealing material 26 may be formed in any manner.
  • the reflecting member 2 is formed on the wiring 28.
  • an insulating member non-conductive member
  • the reflection member 2 may be formed on the wiring 28 through the insulating member.
  • the reflective member 2 (or the reflective member 2 and the resin member 3) remaining on the TFT substrate 10 is removed.
  • the reflective member 2 (or the reflective member 2 and the resin member 3) is used. ) May be left without being removed.
  • a configuration may be adopted in which a resin cover member is provided on the surface of the reflecting member 2.
  • liquid crystal display panel has been described as an example of the display panel, but the present invention can be applied to other display panels such as an organic EL display panel.
  • a manufacturing method of a display panel in which a pair of substrates are overlapped with a predetermined interval and a display medium layer is sealed in a gap between the pair of substrates.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)

Abstract

Dans une région de borne (T) d'un substrat TFT (10), un élément réfléchissant (2) qui réfléchit un faisceau laser (L) est formé sur un câblage (28). Un matériau de scellement (26) est disposé de façon que l'élément réfléchissant (2) soit partiellement couvert par le matériau de scellement (26), et le substrat TFT (10) et un substrat CF (20) sont liés par le matériau de scellement (26) entre ceux-ci. Le substrat CF (20) et le matériau de scellement (26), qui correspondent à la région de borne (T), sont coupés et enlevés par le rayonnement du faisceau laser (L) depuis le côté du substrat CF (20) vers le côté du substrat TFT (10) et par la réflexion du faisceau laser (L) par l'élément réfléchissant (2), dans une région où le matériau de scellement (26) est disposé.
PCT/JP2009/005257 2009-02-26 2009-10-08 Procédé de fabrication d'un panneau d'affichage WO2010097855A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009044390 2009-02-26
JP2009-044390 2009-02-26

Publications (1)

Publication Number Publication Date
WO2010097855A1 true WO2010097855A1 (fr) 2010-09-02

Family

ID=42665082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/005257 WO2010097855A1 (fr) 2009-02-26 2009-10-08 Procédé de fabrication d'un panneau d'affichage

Country Status (1)

Country Link
WO (1) WO2010097855A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012073456A1 (fr) * 2010-11-30 2012-06-07 シャープ株式会社 Panneau d'affichage et son procédé de fabrication
CN102736296A (zh) * 2011-04-13 2012-10-17 乐金显示有限公司 液晶显示装置的制造方法
CN104393022A (zh) * 2014-09-30 2015-03-04 友达光电股份有限公司 显示装置及其制造方法
CN105892135A (zh) * 2016-06-27 2016-08-24 京东方科技集团股份有限公司 母板面板、显示面板、显示装置及显示面板的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004094173A (ja) * 2002-09-04 2004-03-25 Sony Corp 表示装置の製造方法、表示装置、およびレーザー加工方法
JP2008096836A (ja) * 2006-10-13 2008-04-24 Sharp Corp 液晶表示パネルの製造方法、および液晶表示パネル

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004094173A (ja) * 2002-09-04 2004-03-25 Sony Corp 表示装置の製造方法、表示装置、およびレーザー加工方法
JP2008096836A (ja) * 2006-10-13 2008-04-24 Sharp Corp 液晶表示パネルの製造方法、および液晶表示パネル

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012073456A1 (fr) * 2010-11-30 2012-06-07 シャープ株式会社 Panneau d'affichage et son procédé de fabrication
US9001303B2 (en) 2010-11-30 2015-04-07 Sharp Kabushiki Kaisha Display panel and method for fabricating same
CN102736296A (zh) * 2011-04-13 2012-10-17 乐金显示有限公司 液晶显示装置的制造方法
CN104393022A (zh) * 2014-09-30 2015-03-04 友达光电股份有限公司 显示装置及其制造方法
CN105892135A (zh) * 2016-06-27 2016-08-24 京东方科技集团股份有限公司 母板面板、显示面板、显示装置及显示面板的制作方法

Similar Documents

Publication Publication Date Title
JP5934797B2 (ja) 表示パネル
JP4925030B2 (ja) 液晶表示装置及びその製造方法
JP4961271B2 (ja) 液晶表示パネルの製造方法及び液晶表示パネル
US9239495B2 (en) Display device, electronic device including display device, and method for manufacturing display device
JP4731631B2 (ja) 表示パネル
WO2012073456A1 (fr) Panneau d'affichage et son procédé de fabrication
WO2012029281A1 (fr) Substrat de matrice active, procédé de fabrication de ce substrat et dispositif d'affichage
KR20120049708A (ko) 액정패널의 제조방법
JP2004252047A (ja) 半透過型表示装置
WO2013183216A1 (fr) Panneau d'affichage et son procédé de fabrication
WO2010097855A1 (fr) Procédé de fabrication d'un panneau d'affichage
JP4648422B2 (ja) 表示素子の製造方法
JPH11264970A (ja) 液晶表示装置
JP3987522B2 (ja) 液晶表示装置の製造方法
JP2005084228A (ja) 液晶表示装置
JP2010164653A (ja) 表示パネル
US8330929B2 (en) Display panel
KR101641356B1 (ko) 액정 표시 패널의 제조 방법
JP2012108310A (ja) 非平面形状ディスプレイ及びその製造方法
CN110045535B (zh) 液晶显示装置及其制造方法
JP2009294601A (ja) 表示装置
JP2009047758A (ja) 液晶表示パネル及び液晶表示パネルの製造方法
WO2011125268A1 (fr) Panneau d'affichage à cristaux liquides
KR100928481B1 (ko) 액정표시장치의 제조방법
JP2018169458A (ja) 液晶表示装置の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09840709

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 09840709

Country of ref document: EP

Kind code of ref document: A1