WO2010067518A1 - 静電誘導型のエネルギー変換素子 - Google Patents
静電誘導型のエネルギー変換素子 Download PDFInfo
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- WO2010067518A1 WO2010067518A1 PCT/JP2009/006047 JP2009006047W WO2010067518A1 WO 2010067518 A1 WO2010067518 A1 WO 2010067518A1 JP 2009006047 W JP2009006047 W JP 2009006047W WO 2010067518 A1 WO2010067518 A1 WO 2010067518A1
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- substrate
- electret
- electrode
- conversion element
- energy conversion
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Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/02—Electrets, i.e. having a permanently-polarised dielectric
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/06—Influence generators
- H02N1/08—Influence generators with conductive charge carrier, i.e. capacitor machines
Definitions
- the present invention relates to an electrostatic induction type energy conversion element, and more specifically to an electrostatic induction type energy conversion element for generating electric power using environmental vibration or the like.
- TPMS tire pressure monitoring system
- TPMS tire pressure monitoring system
- health monitoring of airplanes, buildings, bridges, etc. and large-scale distribution management
- battery replacement is difficult, it takes time to replace the battery, a lot
- applications such as cardiac pacemakers and capsule endoscopes it is not preferable to install a battery because the patient's surgery is required to replace the battery, increasing the physical burden. Even in the case of a rechargeable battery, there are the same inconveniences as battery replacement regarding the charging operation.
- vibration severe Hz to several tens of Hz
- moving objects cars, airplanes, etc.
- structures buildingss, bridges, etc.
- environmental vibration Such a vibration is referred to as environmental vibration.
- electromagnetic induction type There are three main types of energy conversion elements that generate electricity by environmental vibration: electromagnetic induction type, piezoelectric type, and electrostatic induction type.
- the electromagnetic induction type element has problems that it is difficult to lower the frequency because the power generation amount is proportional to the square of the frequency, and the size and weight are increased.
- Piezoelectric elements have problems of mass production and cost, such as reliability and handling during assembly. Therefore, an electrostatic induction type element is expected.
- the electrostatic induction type energy conversion element is suitable for obtaining electric power using environmental vibration because the amount of power generation is proportional to the frequency, but in order to obtain a large amount of power generation, there are many electret electrodes. Need to be injected. Further, when the electret electrode has a large amount of charge, degradation of power generation efficiency due to discharge becomes a problem.
- these problems have not been solved in the conventional electrostatic induction type energy conversion element, sufficient electric charge cannot be injected into the electret, and deterioration of power generation efficiency due to discharge has not been sufficiently prevented. It was. In the following, these problems will be specifically described by taking the energy conversion element disclosed in Patent Document 1 as an example.
- FIG. 1 The structure of the energy conversion element 11 (electrostatic induction type conversion element) disclosed in Patent Document 1 is shown in FIG.
- the energy conversion element 11 electrostatic induction type conversion element
- a plurality of strip-shaped base electrodes 13 are provided on the upper surface of the fixed substrate 12, and electrets 14 are provided on the base electrodes 13.
- the counter electrodes 16 are provided on the lower surface of the counter substrate 15 facing the fixed substrate 12 at the same pitch as the base electrodes 13.
- the electret 14 is formed by injecting charges near the surface of the insulating material.
- the electret 14 is made of a polymer having a fluorinated aliphatic ring structure in the main chain, thereby increasing the surface charge density.
- a moisture-proof film composed of polyparaxylylene or a derivative thereof is formed on the upper surface of the electret 14 to prevent deterioration due to humidity.
- the energy conversion element 11 having such a structure, when the load 17 is connected between the two electrodes 13 and 16 and the counter substrate 15 is moved in the direction indicated by the arrow in FIG. A charge of the opposite polarity is electrostatically induced in the electrode 16 and a current flows through the load 17 and can be used for power generation.
- the electret 14 is formed on the upper surface of the base electrode 13, the side wall of the base electrode 13 is exposed from the electret 14. Therefore, most of the electric charges (electrons) emitted from the needle 18 like the left electret 14 in FIG. 2 are guided to the base electrode 13 and returned to the high-voltage power source 19 (the arrow line in FIG. This represents the flow of charge during discharge.) Accordingly, the amount of charge injected into the electret 14 is reduced accordingly.
- the electret 14 and the base electrode 13 are formed by a semiconductor process (photolithography process). Even if the electret 14 and the base electrode 13 are designed to be formed in the same area, misalignment in the manufacturing process can be reduced. The width tends to vary due to process errors such as overetching of the electret 14. Therefore, the edge of the base electrode 13 tends to protrude from the electret 14 and be exposed like the right electret 14 in FIG. In such a case, the amount of charge induced to the base electrode 13 is further increased, and the amount of charge injected into the electret 14 is further decreased.
- the gap between the upper and lower electrodes 16 and 13 needs to be about 50 ⁇ m (see Non-Patent Document 1).
- Non-Patent Document 1 it is necessary to seal the energy conversion element with SF6. Therefore, conventionally, it is necessary to hermetically seal the energy conversion element with a ceramic package or the like, and the package of the energy conversion element has been expensive.
- the withstand voltage is determined by the distance between the upper and lower electrodes, it is required to produce an element that does not exceed the withstand voltage regardless of the distance between the electrodes as a countermeasure against discharge. In particular, it is desired to prevent discharge from an electret having a surface potential of 1000 V regardless of the distance between the upper and lower electrodes.
- the present invention has been made in view of such technical problems, and an object of the present invention is to provide an electrostatic induction type energy conversion element capable of charging an electret with a lot of electric charges. Another object of the present invention is to provide a highly reliable electrostatic induction type energy conversion element that is less deteriorated by discharge.
- the energy conversion element of the present invention includes a first substrate and a second substrate that face each other at a predetermined interval and are movable relative to each other.
- the first substrate and the second substrate At least one conductive member is formed on each of the surfaces facing each other, and each of the conductive members has a plurality of electrodes and an electrode pad, and at least one of the conductive members includes a conductive member.
- An electret is formed corresponding to each electrode, and the electret covers the surface opposite to the surface fixed to any one of the surfaces of each electrode, and the outer peripheral surface of each electrode is 5 ⁇ m or more. It is characterized by covering with a coating thickness.
- each electret covers the surface opposite to the surface fixed to any one of the surfaces of each electrode, and each Since the outer peripheral surface of the electrode is covered with a coating thickness of 5 ⁇ m or more, when the charge is injected into the electret and charged, it is difficult for the charge to be guided to the electrode, and the reduction in the amount of charge injected into the electret is prevented. it can. Therefore, more charges can be held in the electret, the surface potential of the electret can be increased, and the amount of power generation can be increased.
- the outer peripheral surface of the electrode on which the electret is formed is covered with the electret with a coating thickness of 10 ⁇ m or more. According to this embodiment, the surface potential of the electret can be made higher, and the variation in the surface potential can be reduced.
- At least one of the first substrate and the second substrate has a plurality of grooves recessed in parallel to each other,
- the electrode is disposed in the groove, the electret is embedded in the groove, and the electrode in the groove is covered with the electret.
- the electrode since the electrode disposed in the groove is covered with the electret embedded in the groove, the electrode can be reliably covered with the electret, and the reliability of the element is improved. Also, by filling the electrode in the groove, it is possible to more reliably prevent the charge from flowing to the electrode during charge injection, and the surface potential of the electret can be further increased to increase the amount of power generation.
- the cross section perpendicular to the longitudinal direction thereof may be a rectangular shape with a curved inner corner, or a trapezoidal shape in which the width of the opening is wider than the width of the bottom surface. It may be a triangular shape widened. According to the grooves of these shapes, it is difficult for air bubbles to bite into the electrets embedded in the grooves. Moreover, it becomes easy to inject the electret into the groove.
- the groove can be formed by performing dry etching on the substrate. Further, in the case where a substrate having a groove or a part of the substrate is formed of a resin material, the groove can be formed using a transfer technique when the resin material is formed. Further, when the substrate having a groove is a Si substrate, the groove is formed in the substrate by using anisotropic etching, and an insulating film made of SiO 2 , SiN, or SiON is formed on the surface of the groove. Good. According to these methods, a fine groove can be accurately produced.
- the electrode pad of the conductive member is formed on an opposing surface of at least one of the first substrate and the second substrate. The entire region except for the region is covered with an insulating film.
- the withstand voltage between the electrodes can be improved, the decrease in the surface charge of the electret can be suppressed, and the energy can be reduced.
- the reliability of the conversion element can be improved.
- a guard electrode is provided between adjacent electrets, and in at least one of the first substrate and the second substrate, only the electrode that is not covered with the electret and the guard electrode are covered with an insulating film. Also good.
- an insulating polymer material such as BCB (benzocyclobutene) resin or SiLK resin (manufactured by Dow Chemical Company) may be used, and insulation such as SiO 2 , SiN, SrTiO 3 , SiON, and TiO 2 may be used.
- An inorganic material may be used. If an insulating coating made of these materials is used, the withstand voltage between the conductive members can be further increased.
- the means for solving the above-described problems in the present invention has a feature in which the above-described constituent elements are appropriately combined, and the present invention enables many variations by combining such constituent elements. .
- FIG. 1 is a perspective view showing the structure of the energy conversion element disclosed in Patent Document 1.
- FIG. FIG. 2 is a schematic view showing a state in which charges are injected into the electret in the energy conversion element same as above.
- FIG. 3 is a schematic front view showing the structure of the energy conversion element according to Embodiment 1 of the present invention.
- FIG. 4 is a perspective view illustrating a main part of the energy conversion element according to the first embodiment.
- FIG. 5 is a plan view showing the conductive member for the base electrode and the conductive member for the guard electrode formed on the fixed substrate.
- FIG. 6 is a schematic diagram illustrating a state in which charges are injected into the electret in the energy conversion element of the first embodiment.
- FIG. 7 is a diagram showing results obtained by experimentally determining the relationship between the surface potential of the electret and the electrode coating width of the electret in the conventional example and the first embodiment.
- FIG. 8 is a diagram showing a Paschen curve showing the withstand voltage between the upper and lower electrodes.
- FIG. 9 is an enlarged view of a part of FIG.
- FIG. 10 is a diagram showing the result of measuring the surface potential of the sample substrate as shown in FIG.
- FIG. 11 is a schematic view showing a sample substrate for obtaining the data of FIG.
- FIG. 12 is an exploded perspective view showing the structure of the casing of the energy conversion element.
- FIG. 13 is a schematic front view showing a movable substrate in a modification of the first embodiment.
- FIG. 14 is a schematic front view showing a fixed substrate in another modification of the first embodiment.
- FIG. 15 is a schematic front view showing the structure of the energy conversion device according to the second embodiment of the present invention.
- FIG. 16 is a schematic front view of a fixed substrate in a modification of the second embodiment.
- FIG. 17 is a schematic front view of a fixed substrate in another modification of the second embodiment.
- FIG. 18 is a schematic front view of a fixed substrate in still another modified example of the second embodiment.
- FIG. 19 is a schematic front view of a fixed substrate in still another modification of the second embodiment.
- 20A and 20B are schematic views showing an example of a method for forming a groove in a substrate.
- FIGS. 21A to 21C are schematic views showing another method for forming a groove in a substrate.
- 22A and 22B are schematic views showing still another method for forming a groove in a substrate.
- FIG. 3 is a schematic front view showing the structure of the energy conversion element according to Embodiment 1 of the present invention
- FIG. 4 is a perspective view showing the main part thereof.
- the structure of the energy conversion element 21 (power generation element) according to the first embodiment will be described with reference to FIGS.
- the energy conversion element 21 includes a fixed substrate 22 and a movable substrate 23, and both the substrates 22 and 23 face each other in parallel with a predetermined interval.
- the fixed substrate 22 and the movable substrate 23 are insulating substrates such as a glass substrate and a resin substrate.
- the fixed substrate 22 and the movable substrate 23 are housed in a casing 24.
- the fixed substrate 22 is fixed in the casing 24 so that the movable substrate 23 can be translated in one direction while maintaining a state parallel to the fixed substrate 22. And held in the casing 24.
- a spring fixing portion 25 is projected on the upper surface of the movable substrate 23, and a plurality of springs 26 (tensile springs) are stretched between the spring fixing portion 25 and the casing 24.
- One or a plurality of springs 26 are arranged on both sides of the spring fixing portion 25 and extend in parallel with the moving direction of the movable substrate 23.
- the movable substrate 23 is forcibly translated (vibrated) by external vibration, for example, environmental vibration, but when no force is applied from the outside, the movable substrate 23 is predetermined by the balance of the elastic force of the left and right springs 26. Rest or return to the initial position of.
- the spring 26 has a function of protecting the movable substrate 23 by absorbing the impact applied to the movable substrate 23 when an impact or large vibration is applied to the movable substrate 23. Further, when a large vibration is applied, the spring 26 absorbs vibration energy from the outside and temporarily holds it as elastic energy, and the movable substrate 23 can be vibrated by releasing this elastic energy. Power can be generated using energy efficiently.
- a base electrode 27 (electrode) having a long strip shape in one direction is provided on the inner surface (upper surface) of the fixed substrate 22 at a constant pitch and in parallel with each other.
- the longitudinal direction of the base electrode 27 is orthogonal to the moving direction of the movable substrate 23, and the arrangement direction of the base electrodes 27 is parallel to the moving direction of the movable substrate 23.
- the fixed substrate 22 includes a signal extraction pad 30 (electrode pad), and all of the base electrodes 27 are electrically connected to the signal extraction pad 30 by a wiring pattern.
- a strip-shaped guard electrode 29 is provided between the base electrodes 27 so as to be parallel to the base electrode 27. The guard electrode 29 may be connected to the ground or may be in an electrically floating state from the ground.
- An electret 28 is formed of Teflon (registered trademark) or fluororesin on the upper surface of each base electrode 27.
- the width W of the electret 28 is wider than the width w of the base electrode 27 (that is, W> w), and the entire upper surface and outer peripheral surface of the base electrode 27 are covered with the electret 28.
- the end surface in the longitudinal direction of the base electrode 27 appears to be exposed from the electret 28, but both side surfaces in the width direction and both end surfaces in the longitudinal direction of the base electrode 27 are also covered with the electret 28.
- the base electrode 27 and the guard electrode 29 actually have a pattern shape as shown in FIG.
- the fixed substrate 22 is provided with a comb-like conductive member 100 for a base electrode and a comb-like conductive member 101 for a guard electrode.
- the conductive member 100 includes base electrodes 27 arranged at a constant pitch, a conductive path 102 connecting the base electrodes 27, and a signal extraction pad 30.
- the conductive member 101 includes a guard electrode 29 arranged at a constant pitch, a conduction path 103 that connects each guard electrode 29, and an electrode pad 104.
- the conductive members 100 and 101 are arranged so as to mesh with each other, and the base electrodes 27 and the guard electrodes 29 are alternately arranged.
- the entire area excluding the signal extraction pad 30 on the exposed surface from the fixed substrate 22 is covered with the electret 28.
- both side surfaces 27 a and longitudinal end surfaces 27 b in the width direction of the base electrode 27 and both side surfaces of the conduction path 102 are covered with the electret 28.
- the exposed portions of the electret 28, the guard electrode 29, and the fixed substrate 22 are covered with the insulating coating 31.
- strip-like counter electrodes 32 (electrodes) that are long in one direction are provided in parallel to each other.
- the longitudinal direction of the counter electrode 32 is orthogonal to the moving direction of the movable substrate 23, and the arrangement direction of the counter electrodes 32 is parallel to the moving direction of the movable substrate 23.
- the counter electrode 32 has a width equal to the width w of the base electrode 27 or the width W of the electret 28, or an intermediate width between both widths w and W, and is arranged at a pitch equal to that of the base electrode 27.
- the movable substrate 23 is provided with a signal extraction pad 34, and all the counter electrodes 32 are electrically connected to the signal extraction pad 34 (electrode pad) by a wiring pattern. Further, exposed portions of the counter electrode 32 and the movable substrate 23 (that is, regions other than the region where the signal extraction pad 34 is provided) are covered with an insulating film 33.
- the counter electrode 32 and the signal extraction pad 34 are also part of a comb-like conductive member, like the base electrode 27 and the signal extraction pad 30. Are connected by a conduction path.
- the insulating coatings 31 and 33 are formed by depositing an insulating inorganic material such as SiO 2 , SiN, SiON, SrTiO 3 , or TiO 2 , which is a material having a high withstand voltage, on the entire surface other than the pad region by a sputtering method or a CVD method. It may be a material having a low dielectric constant, such as polyimide, BCB resin, SiLK resin or the like coated on the entire surface other than the pad region. These insulating coatings 31 and 33 also have a hygroscopic effect. In order to increase the withstand voltage, it is desirable to provide the insulating coatings 31 and 33 on both the fixed substrate 22 and the movable substrate 23. However, the insulating coating 31 or 33 is provided only on one of the fixed substrate 22 and the movable substrate 23. 33 may be provided.
- an insulating inorganic material such as SiO 2 , SiN, SiON, SrTiO 3 , or TiO 2
- the signal extraction pad 30 is connected to the ground, and a load 35 is connected between the signal extraction pad 34 and the signal extraction pad 30.
- an insulating film made of SiO 2 , SiN, SiON, SrTiO 3 , TiO 2 or the like is formed on the upper surface of the fixed substrate 22.
- the base electrode 27, electret 28, guard electrode 29, and signal extraction pad 30 may be formed on the surface of the insulating film.
- an insulating film made of SiO 2 , SiN, SiON, SrTiO 3 , TiO 2 or the like is formed on the lower surface of the movable substrate 23.
- the counter electrode 32 and the signal extraction pad 34 may be formed on the surface of the insulating film.
- the counter electrode 32 of the movable substrate 23 and the base electrode 27 of the fixed substrate 22 face each other at the initial position of the movable substrate 23 described above.
- FIG. 6 shows the configuration of an apparatus for charge injection, in which a needle 36, a grid 38 disposed below the needle 36, a heater 40 disposed below the needle 36, a high-voltage power source 37 for applying a negative voltage to the needle 36 (for example, a ⁇ 8 kV DC power supply) and a grid voltage power supply 39 (for example, ⁇ 600 V DC power supply) for applying a negative voltage to the grid 38 are included.
- the fixed substrate 22 on which the base electrode 27 and the electret 28 are formed is placed between the heater 40 and the grid 38 and preheated to about 120 ° C. by the heater 40.
- a DC high voltage power supply 37 is connected so that the needle 36 has a negative voltage, a high voltage is applied between the needle 36 and the base electrode 27, and an air discharge is generated around the tip of the needle 36, thereby causing the electret 28 to Inject charge.
- the energy conversion element 21 of the present embodiment since the entire upper surface and both side surfaces in the width direction of the base electrode 27 are covered with the electrets 28, the light is emitted from the needle 36 as shown by the arrowed line in FIG.
- the charged charges (electrons) do not enter the both side surfaces of the base electrode 27 and become lost, the amount of charges injected into the electret 28 can be increased, and the surface potential of the electret 28 can be increased. Power generation efficiency can be increased.
- a negative voltage that is weaker than that of the high-voltage power supply 37 is applied to the grid 38 by the grid voltage power supply 39, and the electric field applied to the electret 28 by spreading the charge discharged from the needle 36 to the whole and adjusting the grid voltage. Can be controlled.
- FIG. 7 shows the result of experimentally determining the relationship between the surface potential of the electret and the electrode coating width of the electret when the same voltage is applied to inject charges in the conventional example and this embodiment.
- the horizontal axis in FIG. 7 indicates the electrode coating width [ ⁇ m], and the vertical axis indicates the surface potential [V] of the electret 14 or 28.
- the electrode covering width represents a value obtained by subtracting the width w of the base electrode 27 from the width W of the electret 28.
- the widths of the electrets 14 and 28 were fixed (300 ⁇ m), and the width of the base electrode 13 or the base electrode 27 was changed.
- the surface potential of the electret 28 can be increased by covering both side surfaces of the base electrode 27 with the electret 28. Moreover, the surface potential of the electret 28 increases as the electrode coating width increases. On the other hand, when the electrode coating width is increased to some extent, the rate of increase in the surface potential of the electret 28 is slowed down, and the advantage of increasing the electrode coating width can no longer be expected. On the other hand, there is a demerit that the substrate area is increased by increasing the electrode covering width or the number of base electrodes 27 that can be formed on the same substrate area is reduced.
- the electrode coating width in the present embodiment is preferably 10 ⁇ m or more and 30 ⁇ m or less, and particularly preferably 20 ⁇ m or more and 30 ⁇ m or less (region C).
- the coating thickness of the electret 28 on one side in the width direction or the end surface in the longitudinal direction of the base electrode 27 is preferably 5 ⁇ m or more and 15 ⁇ m or less, and more preferably 10 ⁇ m or more and 15 ⁇ m or less. It will be.
- FIG. 7 shows that when the electrode coating width is 20 ⁇ m or more (coating thickness is 10 ⁇ m), the effect of further reducing the variation in the surface potential of the electret 28 can be obtained. That is, FIG. 7 shows the standard deviation St Dev (Standard Deviation) of each surface potential when the electrode coating width is 4 ⁇ m, 10 ⁇ m, and 20 ⁇ m. In FIG. 7, these electrode coating widths show only three representative measured values, but the standard deviation is calculated by adding other measured values.
- St Dev Standard Deviation
- the base electrode 27 by covering the base electrode 27 with the electret 28, the variation in the surface potential of the electret 28 due to the variation in the width of the base electrode 27 can be reduced, so that the manufacturing process of the energy conversion element 21 is facilitated. Furthermore, since the base electrode 27 is covered with the electret 28, discharge between the base electrode 27 and the counter electrode 32 during use can be prevented, and the reliability of the energy conversion element 21 is improved.
- This energy conversion element 21 is installed in a place where vibration occurs or an object.
- the vibration environment vibration
- the movable substrate 23 reciprocates in parallel with the fixed substrate 22 due to the vibration.
- the amount of charge induced in the counter electrode 32 of the movable substrate 23 is maximized when facing the electret 28 and the overlapping area with the electret 28 is maximum, and the movable substrate 23 is displaced and the counter electrode 32 and the electret 28 are displaced.
- the amount of charge induced in the counter electrode 32 decreases.
- the amount of charge induced in the counter electrode 32 increases as the movable substrate 23 returns to the original direction and the overlapping area of the counter electrode 32 and the electret 28 increases.
- an alternating current flows through the load 35 connected between the base electrode 27 and the counter electrode 32. That is, an alternating electromotive force e is generated between the base electrode 27 and the counter electrode 32 due to vibration applied to the energy conversion element 21.
- the amount of charge (surface charge density ⁇ ) injected into the electret 28 at the time of charge injection can be increased.
- the output of the element 21 can be increased, and the power generation efficiency can be increased.
- the electret 28 can be increased in charge as described above. However, when the electret 28 is increased in charge, a discharge occurs between the counter electrode 32 and the base electrode 27 accordingly. It becomes easy. When discharge occurs, the electret 28 loses its charge and the amount of charge decreases. In order to prevent discharge, the interelectrode gap g may be increased. However, as the interelectrode gap g increases, the power generation efficiency decreases. For this reason, in the conventional example, a moisture-proof film made of a parylene film is used to prevent discharge.
- an insulating coating 31 made of an insulating inorganic material such as SiO 2 or an insulating polymer material such as polyimide, BCB resin, or SiLK resin is formed on at least one of the fixed substrate 22 and the movable substrate 23. Since 33 is formed, the withstand voltage can be improved as compared with the parylene film, and the reliability of the energy conversion element 21 can be improved.
- Table 1 below shows the withstand voltage per unit thickness of SiO 2 , BCB resin, SiLK resin, polyimide, C type parylene, N type parylene, air, and SF6.
- SiO 2 , BCB resin, and SiLK resin have a higher dielectric breakdown voltage per unit thickness than C-type and N-type parylene, by using a SiO 2 film as the insulating coating 31 or 33, The withstand voltage of the energy conversion element 21 can be improved as compared with the conventional example using a parylene film as the moisture-proof film.
- the dielectric withstand voltage per unit thickness is smaller than that of parylene, polyimide is inexpensive and can easily form a thick insulating film, so a thick insulating film can be formed than a parylene film, As a result, the withstand voltage of the energy conversion element 21 can be improved as compared with the conventional example using a parylene film.
- FIG. 8 is a diagram showing a Paschen curve, the horizontal axis of which is a logarithmic scale indicating the gap g between the upper and lower electrodes (the distance between the electret 14 and the counter electrode 16 in the conventional example, the distance between the electret 28 and the electrode 32 in the present embodiment).
- the vertical axis indicates the withstand voltage on a logarithmic scale.
- the Paschen curve indicates the withstand voltage between the upper and lower electrodes.
- the region above the Paschen curve represents a discharge generation region where discharge occurs, and the region below the Paschen curve represents a stable region where no discharge occurs.
- FIG. 8 is a diagram showing a Paschen curve, the horizontal axis of which is a logarithmic scale indicating the gap g between the upper and lower electrodes (the distance between the electret 14 and the counter electrode 16 in the conventional example, the distance between the electret 28 and the electrode 32 in the present embodiment).
- the vertical axis indicates the withstand voltage on a logarithmic
- FIG. 9 is an enlarged view of a part of the Paschen curve of FIG. 8, and shows a case where the film thickness is 2 ⁇ m of sputtered SiO 2 , the film thickness of 2 ⁇ m is C-type parylene, and there is no insulating film. .
- the dielectric breakdown voltage is improved as compared with the case where any of the 2 ⁇ m thick sputtered SiO 2 , the 2 ⁇ m thick C type parylene, and the 0.3 ⁇ m thick C type parylene has no insulating film. Yes.
- the insulation breakdown voltage is less than 1000 V when the distance between the upper and lower electrodes is shorter than about 100 ⁇ m without the insulating coating, and the distance between the upper and lower electrodes is less than about 50 ⁇ m in the case of parylene.
- the withstand voltage When it becomes shorter, the withstand voltage is less than 1000V. On the other hand, when SiO 2 is used as the insulating film, the withstand voltage can be maintained at 1000 V or higher until the distance between the upper and lower electrodes is about 10 ⁇ m, and high withstand voltage performance can be obtained. Therefore, according to the present embodiment, the energy conversion element 21 having high withstand voltage and high reliability can be manufactured.
- FIG. 10 is a diagram showing the result of measuring the surface potential of the sample substrate as shown in FIG.
- FIG. 11 is a schematic view showing a sample substrate used in this experiment.
- a base electrode 42 is formed on the surface of a square glass substrate 41 having a side of 30 mm, an electret 43 is formed thereon, and the electret 43 is removed with a width of 5 mm at one end of the substrate 41. Thus, the base electrode 42 is exposed.
- the result of the measurement is shown in FIG.
- the vertical axis represents the surface potential
- the horizontal axis represents the position of the measurement probe 44 (measurement position X) measured from the origin.
- the origin X 0.0 mm is a position slightly away from the end of the electret 43 (for example, about 0.4 mm) and is a place where the base electrode 42 is exposed.
- the center portion of the electret 43 shows a high surface potential, but the surface potential decreases as it approaches the exposed region of the base electrode 42.
- the base electrode 42 Since the base electrode 42 is exposed at the left end of the sample substrate in FIG. 11, a phenomenon similar to the structure in which the base electrode is exposed from the electret (see the conventional example in FIG. 1) is observed in this region. It is thought that it is awake. Therefore, when the surface potential in the case of the conventional example is plotted on FIG. 10 (triangle mark), it almost coincides with the measured value of the sample substrate. Similarly, the surface potential of the structure in which the base electrode is covered with the electret (this embodiment) is plotted on FIG. 10 (circle mark). According to FIG. 10, in the sample substrate, the measurement width of the electret corresponding to the same surface potential as that of the structure in which the base electrode is covered with the electret is 1.8 mm.
- the structure of the present embodiment corresponds to a sample substrate having an electret width of 3.6 mm. Therefore, if the width of the electret 28 is 3.6 mm or less, it is considered that the effect of improving the surface potential according to the present embodiment can be exhibited.
- FIG. 12 is an exploded perspective view showing a specific structure of the casing 24.
- the casing 24 includes a base block 45 and a case cover 47.
- the base block 45 has a space for accommodating the fixed substrate 22 and the movable substrate 23, and a plurality of leads 46 protrude from the lower surface.
- the fixed substrate 22 is installed on the bottom surface in the base block 45 and is electrically connected to the leads 46.
- the movable substrate 23 is slidably accommodated in the base block 45 with a certain distance from the fixed substrate 22 and is electrically connected to the lead 46.
- the upper surface of the base block 45 is closed by the case cover 47.
- the energy conversion element 21 having such a structure is assembled as follows. First, the fixed substrate 22 having the base electrode 27 and the electret 28 formed on the upper surface is charged by corona discharge to inject charges into the electret 28. Then, an insulating film 31 is formed on the electret 28 and the like.
- the frame 49 is attached to the movable substrate 23 having the counter electrode 32 and the insulating coating 33 formed on the lower surface, and the spring 26 is attached to the spring fixing portion 25 provided on the frame 49.
- the fixed substrate 22 is placed in the base block 45 in which the leads 46 are integrally formed, and the fixed substrate 22 is bonded to the bottom surface thereof. Then, the signal extraction pad of the fixed substrate 22 and the lead 46 are wire-bonded with Au wire. After fixing the fixed substrate 22 to the base block 45, a gap holding component (not shown) is attached on the fixed substrate 22, and the gap is adjusted by the gap holding component.
- the movable substrate 23 is slidably held with a predetermined gap with the fixed substrate 22, and the end of the spring 26 is fixed to the inner surface of the base block 45. Further, the signal extraction pad of the movable substrate 23 is connected to the lead 46.
- case cover 47 is stacked on the upper surface of the base block 45 and bonded.
- FIG. 13 is a schematic front view showing the movable substrate 23 in a modification of the first embodiment.
- the insulating film 33 is formed only in the region where the counter electrode 32 is formed.
- the insulating coating 33 is formed by forming an insulating inorganic material by sputtering or CVD, or coating or electrodepositing an insulating organic material.
- FIG. 14 is a schematic front view showing a fixed substrate 22 in another modification of the first embodiment.
- the insulating film 33 is formed only in the region where the guard electrode 29 is formed.
- the fixed substrate 22 having the structure as shown in FIG. 14 can obtain a good withstand voltage when combined with the movable substrate 23 as shown in FIG.
- the fixed substrate 22 having the structure as shown in FIG. 14 has a good withstand voltage even when combined with the movable substrate 23 in which an insulating film is formed on the entire region other than the pad region like the movable substrate 23 of the first embodiment. Obtainable.
- FIG. 15 is a schematic front view showing the structure of the energy conversion element 51 according to Embodiment 2 of the present invention.
- This embodiment is characterized in that the base electrode 27 and the electret 28 are embedded in the groove 52 of the fixed substrate 22, and has the same configuration as that of the first embodiment in other respects.
- a plurality of parallel grooves 52 are provided on the upper surface of the fixed substrate 22.
- the cross section perpendicular to the longitudinal direction of the groove 52 has a substantially flat bottom surface, is curved from both side surfaces to the inner corner, and has a substantially bowl shape.
- a strip-shaped base electrode 27 is provided on the bottom surface of each groove 52 along the longitudinal direction of the groove 52, and the base electrode 27 is covered with the electret 28 by filling the electret 28 in the groove 52.
- the base electrode 27 after providing the base electrode 27 on the bottom surface of the groove 52 formed in the fixed substrate 22, the base electrode 27 is reliably covered with the electret 28 by filling the electret 28 in the groove 52. Therefore, it is less likely that the edge of the base electrode 27 is exposed from the electret 28 due to the displacement of the electret 28.
- the cross-sectional shape of the groove 52 is formed in a bowl shape so that the inner corner portion is not easily generated, and bubbles are hardly generated in the electret 28.
- Modification of the second embodiment 16 to 19 each show a modification of the second embodiment.
- the cross section perpendicular to the longitudinal direction of the groove 52 has a substantially rectangular shape, and the inner corner portion (a portion in FIG. 16) of the groove 52 and the edge of the opening portion (b portion in FIG. 16). It is curved.
- the cross section perpendicular to the longitudinal direction of the groove 52 is substantially rectangular, and only the inner corner portion (a portion in FIG. 17) located at the lower end portion of both vertical side surfaces is curved to form the inner corner portion. It has a curved rectangular shape.
- the cross section of the groove 52 is formed in an inverted trapezoidal shape with an opening wider than the bottom.
- the inner corner of the groove 52 and the edge of the opening may be curved.
- the groove 52 is formed in a V-groove shape (triangular shape), and the base electrode 27 is also formed in a V-shaped cross section accordingly.
- FIGS. 20A and 20B show the case where a glass substrate is used as the fixed substrate 22.
- the surface of the fixed substrate 22 other than the groove forming region is covered with the mask 53, and the fixed substrate 22 is dry-etched or wet-etched through the opening of the mask 53.
- a groove 52 is formed in the fixed substrate 22 as shown in FIG.
- FIG. 21A to 21C show the case where the fixed substrate 22 is constituted by the glass substrate 54 and the resin 55.
- FIG. 21A after a molten ultraviolet curable resin 55 is dropped on a flat glass substrate 54, a protrusion is formed on the lower surface as shown in FIG.
- the resin 55 is pressed by a stamper 56 (mold) formed with 57, and the resin 55 is spread between the stamper 56 and the glass substrate 54.
- the resin 55 is photocured by irradiating the resin 55 with ultraviolet light through the glass substrate 54.
- the stamper 56 is peeled from the cured resin 55, the fixed substrate 22 is formed by the glass substrate 54 and the cured resin 55, and the groove 52 is formed on the upper surface of the fixed substrate 22.
- FIGS. 22A and 22B show the case where a Si substrate is used as the fixed substrate 22.
- the surface of the fixed substrate 22 other than the groove forming region is covered with a mask 53, and the fixed substrate 22 is anisotropically etched or isotropically etched through the opening of the mask 53.
- the groove 52 is formed on the upper surface of the fixed substrate 22.
- an insulating film 58 such as a SiO 2 film, a SiN film, or a SiON film is formed on the upper surface of the fixed substrate 22 to perform an insulating process.
- the substrate having no electret is moved by vibration, but the substrate having an electret may be moved by vibration.
- electrets are provided on electrodes only in a partial region (for example, a half region), and in the other substrate, a region other than the region facing the region (for example, the remaining half region). ) May be provided with an electret only.
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Abstract
Description
特許文献1に開示されたエネルギー変換素子11(静電誘導型変換素子)の構造を図1に示す。このエネルギー変換素子11では、固定基板12の上面に短冊状をしたベース電極13を複数設け、各ベース電極13の上にエレクトレット14を設けている。また、固定基板12と対向する対向基板15の下面には、ベース電極13と同じピッチで対向電極16を設けている。
エレクトレット14に電荷を注入する方法としては、コロナ放電による方法が一般的である。特許文献1では、図2に示すように、コロナ放電用のニードル18を用い、直流高圧電源19を使ってニードル18とベース電極13との間に高電圧を印加し、所定時間、所定電圧で放電させてエレクトレット14に電荷を注入して荷電させている。
環境振動(10Hz程度)を利用して0.1mW以上の発電量を得るためには、上下の電極16、13間のギャップを50μm程度にする必要がある(非特許文献1参照)。しかし、上下の電極16、13間のギャップを50μm程度にすると、エレクトレット14の表面を0.3μm厚のパリレン膜からなる防湿膜で覆っていたとしても、空気および0.3μm厚の防湿膜では、荷電圧が基板間の絶縁耐圧を超えるために上下の電極間で放電が発生し、エレクトレット14に保持されていた電荷が抜ける問題があった(非特許文献2参照)。
以下、図3~図12を参照して本発明の第1の実施形態を説明する。
前記エレクトレット28の表面には、電荷を注入して電荷を固定化している。エレクトレット28に電荷を注入する方法としては、コロナ放電による方法などを用いる。図6は、電荷注入のための装置の構成を示し、ニードル36、その下方に配置されたグリッド38、その下方に配置されたヒーター40、ニードル36に負電圧を印加するための高圧電源37(例えば、-8kVの直流電源)、グリッド38に負電圧を印加するためのグリッド電圧電源39(例えば、-600Vの直流電源)とからなる。ベース電極27やエレクトレット28を形成された固定基板22は、ヒーター40とグリッド38との間に置かれ、ヒーター40で120℃程度に予熱される。ついで、ニードル36側が負電圧となるように直流高圧電源37をつないで、ニードル36とベース電極27との間に高圧を印加し、ニードル36の先端周辺に空中放電を生じさせることでエレクトレット28に電荷を注入する。
図7は、従来例及び本実施形態において、同じ電圧を印加して電荷を注入したときのエレクトレットの表面電位とエレクトレットの電極被覆幅の関係を実験的に求めた結果を表している。図7の横軸は電極被覆幅[μm]を示し、縦軸はエレクトレット14又は28の表面電位[V]を示す。電極被覆幅とは、本実施形態では、エレクトレット28の幅Wからベース電極27の幅wを引いた値を表しており、従来例では、エレクトレット14の幅からベース電極13の幅を引いた値を表している。なお、図7のデータを得る際には、エレクトレット14、28の幅を一定(300μm)とし、ベース電極13又はベース電極27の幅を変化させた。
電極被覆幅=4μm のとき、標準偏差St Dev=99[V]
電極被覆幅=10μm のとき、標準偏差St Dev=93[V]
電極被覆幅=20μm のとき、標準偏差St Dev=65[V]
という結果が得られた。この実験に基づけば、電極被覆幅を20μm以上(あるいは、エレクトレットの被覆厚を10μm以上)とすることにより、エレクトレット28の表面電位のばらつきを小さくできることが分かる。
このエネルギー変換素子21は、振動の発生する場所や対象物に設置される。例えばエネルギー変換素子21が車両などに取り付けられると、その振動(環境振動)を感知する。エネルギー変換素子21が、外部からの振動を感知すると、その振動によって可動基板23が固定基板22と平行に往復運動する。可動基板23の対向電極32に誘起される電荷量は、エレクトレット28に正対していてエレクトレット28との重なり面積が最大のときに最大となり、可動基板23がずれて対向電極32とエレクトレット28との重なり面積が小さくなるにつれて対向電極32に誘起される電荷量が減少する。逆に、可動基板23が元の方向に戻って対向電極32とエレクトレット28との重なり面積が大きくなるにつれて対向電極32に誘起される電荷量が増加する。この結果、ベース電極27と対向電極32の間に接続された負荷35には交流電流が流れる。つまり、エネルギー変換素子21に加わる振動によって、ベース電極27と対向電極32との間には交流の起電力eが発生することになる。
Pmax: 最大出力(powerの最大値)
σ: エレクトレットの表面電荷密度
n: 対向電極32の本数
d: エレクトレットの厚み
S: ベース電極27と対向電極32の重なり合う最大面積
f: 振動の周波数
g: 対向電極32とエレクトレット28のギャップ(電極間ギャップ)
ε: エレクトレット28の比誘電率
ε0: 空気の誘電率
本実施形態のエネルギー変換素子21では、上記のようにエレクトレット28の荷電量を大きくすることができるが、エレクトレット28の荷電量が増加すると、それだけ対向電極32とベース電極27の間で放電が起きやすくなる。放電が起きると、エレクトレット28の荷電が抜け出て荷電量が減少する。放電を防止するためには電極間ギャップgを大きくすればよいが、電極間ギャップgが大きくなると発電効率が低下する。そのため、従来例ではパリレン膜からなる防湿膜を用いて放電を防止していた。
図13は実施形態1の一変形例における可動基板23を示す概略正面図である。この変形例では、対向電極32の形成された領域にのみ絶縁被膜33を形成している。この場合も、絶縁性無機材料をスパッタ法やCVD法で成膜したり、絶縁性有機材料をコーティング又は電着させたりして、絶縁被膜33を形成する。
図15は本発明の実施形態2によるエネルギー変換素子51の構造を示す概略正面図である。この実施形態は、ベース電極27及びエレクトレット28を、固定基板22の溝52内に埋め込んだ点を特徴としており、その他の点については実施形態1と同様な構成を有している。
図16~図19は、それぞれ実施形態2の変形例を表す。図16に示す変形例では、溝52の長手方向に垂直な断面をほぼ矩形形状とし、溝52の内隅部(図16のa部)とその開口部の縁(図16のb部)を湾曲させている。図17の変形例では、溝52の長手方向に垂直な断面をほぼ矩形状とし、垂直な両側面の下端部に位置する内隅部(図17のa部)のみを湾曲させて内隅部の湾曲した矩形形状としている。図18の変形例では、溝52の断面を底面よりも開口部が広くなった逆台形状に形成している。なお、図18の変形例においても、溝52の内隅部やその開口部の縁を湾曲させてもよい。図19の変形例では、溝52をV溝状(三角形状)に形成しており、それに応じてベース電極27も断面V字状に形成している。これら図16~図19の変形例も、それぞれエレクトレット28内に気泡が混入しにくくするための工夫である。
次に、実施形態2又はその変形例において、固定基板22に溝52を形成する方法を図20~図22により説明する。図20(a)(b)は固定基板22としてガラス基板を用いた場合である。この場合には、図20(a)のようにマスク53によって固定基板22の溝形成領域以外の面を覆っておき、マスク53の開口を通して固定基板22をドライエッチング又はウェットエッチングすることで、図20(b)のように固定基板22に溝52を形成する。なお、溝形成領域に沿ってレーザー光を走査することで溝52を形成するレーザー加工方法を用いてもよい。
22 固定基板
23 可動基板
27 ベース電極
28 エレクトレット
29 ガード電極
30 信号取出用パッド
31 絶縁被膜
32 対向電極
33 絶縁被膜
34 信号取出用パッド
52 溝
w ベース電極の幅
W エレクトレットの幅
Claims (14)
- 所定の間隔を隔てて対向し、かつ互いに相対的に移動可能となった第1の基板と第2の基板を備え、
前記第1の基板と前記第2の基板の互いに対向する面に、それぞれ少なくとも1つの導電性部材が形成され、
前記導電性部材はいずれも複数本の電極と電極パッドを有し、
前記導電性部材のうち少なくとも一つの導電性部材には、各電極に対応してエレクトレットが形成されており、
前記エレクトレットは、各電極の表面のうちいずれかの基板に固定されている面と反対面を覆うとともに、各電極の外周面を5μm以上の被覆厚で覆っていることを特徴とするエネルギー変換素子。 - 前記エレクトレットが形成された電極の外周面が、10μm以上の被覆厚でエレクトレットにより覆われていることを特徴とする、請求項1に記載のエネルギー変換素子。
- 前記第1の基板と前記第2の基板のうち少なくとも一方の基板は、互いに平行に凹設された複数本の溝を有し、当該溝内に前記電極が配設され、当該溝内に前記エレクトレットを埋設すると共にエレクトレットにより前記溝内の電極を覆ったことを特徴とする、請求項1に記載のエネルギー変換素子。
- 前記溝は、その長手方向に垂直な断面が、内隅部の湾曲した矩形形状であることを特徴とする、請求項3に記載のエネルギー変換素子。
- 前記溝は、その長手方向に垂直な断面が、底面の幅よりも開口部の幅が広くなった台形形状であることを特徴とする、請求項3に記載のエネルギー変換素子。
- 前記溝は、その長手方向に垂直な断面が、開口側で広くなった三角形状であることを特徴とする、請求項3に記載のエネルギー変換素子。
- 前記溝を有する基板は、ガラス基板、半導体基板又は樹脂基板からなり、
前記溝は、当該基板にドライエッチングを用いて凹設されていることを特徴とする、請求項3に記載のエネルギー変換素子。 - 前記溝を有する基板または当該基板の一部が樹脂材料によって形成されており、
前記溝は、前記樹脂材料を成形する際に転写技術を用いて凹設されていることを特徴とする、請求項3に記載のエネルギー変換素子。 - 前記溝を有する基板は、Si基板からなり、
前記溝は、当該基板に異方性エッチングを用いて凹設されており、
前記溝の表面には、SiO2、SiN、またはSiONよりなる絶縁膜が形成されていることを特徴とする、請求項3に記載のエネルギー変換素子。 - 前記第1の基板と前記第2の基板のうち少なくとも一方の基板の対向面では、前記導電性部材の、前記電極パッドが形成された領域を除く領域全体が絶縁被膜で覆われていることを特徴とする、請求項1に記載のエネルギー変換素子。
- 前記エレクトレットで覆われていない電極のみを絶縁被膜で覆ったことを特徴とする、請求項1に記載のエネルギー変換素子。
- 隣接する前記エレクトレット間にガード電極を設け、
前記第1の基板と前記第2の基板のうち少なくとも一方の基板においては、前記エレクトレットで覆われていない電極と前記ガード電極のみを絶縁被膜で覆ったことを特徴とする、請求項1に記載のエネルギー変換素子。 - 前記絶縁被膜は、絶縁性高分子材料からなることを特徴とする、請求項10から12のうちいずれか1項に記載のエネルギー変換素子。
- 前記絶縁被膜は、SiO2、SiN、SrTiO3、SiON、TiO2などの絶縁性無機材料よりなることを特徴とする、請求項10から12のうちいずれか1項に記載のエネルギー変換素子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/133,496 US8841816B2 (en) | 2008-12-08 | 2009-11-12 | Energy conversion device of electrostatic induction type |
KR1020117012304A KR101236045B1 (ko) | 2008-12-08 | 2009-11-12 | 정전유도형의 에너지 변환 소자 |
CA2746033A CA2746033C (en) | 2008-12-08 | 2009-11-12 | Energy conversion device of electrostatic induction type |
EP09831626.8A EP2375557B1 (en) | 2008-12-08 | 2009-11-12 | Energy conversion device of electrostatic induction type |
CN200980149184.5A CN102246407B (zh) | 2008-12-08 | 2009-11-12 | 静电感应型的能量变换元件 |
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JP2008312742A JP5126038B2 (ja) | 2008-12-08 | 2008-12-08 | 静電誘導型のエネルギー変換素子 |
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PCT/JP2009/006047 WO2010067518A1 (ja) | 2008-12-08 | 2009-11-12 | 静電誘導型のエネルギー変換素子 |
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US (1) | US8841816B2 (ja) |
EP (1) | EP2375557B1 (ja) |
JP (1) | JP5126038B2 (ja) |
KR (1) | KR101236045B1 (ja) |
CN (1) | CN102246407B (ja) |
CA (1) | CA2746033C (ja) |
WO (1) | WO2010067518A1 (ja) |
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Also Published As
Publication number | Publication date |
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EP2375557A1 (en) | 2011-10-12 |
JP5126038B2 (ja) | 2013-01-23 |
CA2746033C (en) | 2014-08-05 |
US20120169179A1 (en) | 2012-07-05 |
CN102246407B (zh) | 2015-01-14 |
CA2746033A1 (en) | 2010-06-17 |
KR20110089322A (ko) | 2011-08-05 |
CN102246407A (zh) | 2011-11-16 |
EP2375557A4 (en) | 2014-04-23 |
EP2375557B1 (en) | 2020-01-22 |
US8841816B2 (en) | 2014-09-23 |
KR101236045B1 (ko) | 2013-02-21 |
JP2010136598A (ja) | 2010-06-17 |
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