WO2010041317A1 - インターフェイス部材、テスト部ユニットおよび電子部品試験装置 - Google Patents
インターフェイス部材、テスト部ユニットおよび電子部品試験装置 Download PDFInfo
- Publication number
- WO2010041317A1 WO2010041317A1 PCT/JP2008/068344 JP2008068344W WO2010041317A1 WO 2010041317 A1 WO2010041317 A1 WO 2010041317A1 JP 2008068344 W JP2008068344 W JP 2008068344W WO 2010041317 A1 WO2010041317 A1 WO 2010041317A1
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- WO
- WIPO (PCT)
- Prior art keywords
- socket
- interface member
- test
- electronic component
- test head
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Definitions
- the present invention includes an interface member for electrically connecting a test head main body and a socket board in an electronic component testing apparatus, the interface member and the socket board, and is detachably attached to the main body of the test head.
- the present invention relates to a test unit, a test head, and an electronic component testing apparatus.
- test apparatus for testing the finally manufactured electronic parts.
- an apparatus for performing a test by applying high or low temperature stress to an IC device is known.
- a test chamber is formed on the upper part of the test head, and a test tray for holding a plurality of IC devices that are similarly set to a predetermined set temperature while controlling the inside of the test chamber to a predetermined set temperature by air.
- the IC device is transported to a socket on the test head, where the IC device is pressed against the socket by a pusher, and the test is performed. Under such heat stress, the IC device is tested and divided into at least a good product and a defective product.
- the test head is generally referred to as a test head main body in which a signal module for processing a signal is accommodated, and a test unit unit (Hi-Fix or motherboard) that is detachably attached to the test head main body. .).
- the test unit is provided between the socket board having the socket and the socket board and the test head main body, and an interface member for electrically connecting the two (sometimes referred to as a performance board or a motherboard). And.
- FIG. 9 is a cross-sectional view showing the internal structure of a conventional test unit 50. As shown in FIG. 9, the upper part of the test unit 50 is located in the test chamber 102.
- the socket board 51 included in the test unit 50 is provided with a socket 512 to which the IC device 2 is mounted and a plurality of socket-side connectors 514 that are electrically connected to the socket 512.
- the interface member 52 includes an upper frame 521 having a hollow inside, a frame-like lower frame 522, and a plurality of interface member side connectors (hereinafter referred to as “IF”) provided in the holes 52h in the board portion of the upper frame 521.
- Side connector ") 524 The interface member 52 includes an upper frame 521 having a hollow inside, a frame-like lower frame 522, and a plurality of interface member side connectors (hereinafter referred to as “IF”) provided in the holes 52h in the board portion of the upper frame 521.
- Side connector ") 524 A cable 524c that is electrically connected to the test head main body extends from the IF-side connector 524.
- the IF connector 524 and the socket connector 514 are respectively fitted.
- the holes 52h of the upper frame 521 are opened between the plurality of IF-side connectors 524, the internal space 510 of the socket board 51, the internal space 520a of the upper frame 521, and The lower frame 522 communicates with the internal space 520b. Further, the internal space 520a of the upper frame 521 and the internal space 520b of the lower frame 522 are open to the outside of the apparatus and the internal space of the test head body without being particularly sealed.
- the internal spaces 510, 520a, and 520b of the test unit unit 50 are low in the degree of sealing and the heat insulation is insufficient, so that the heat of the test chamber 102 easily escapes from the test unit unit 50. Even if the temperature-adjusted air is introduced into the internal spaces 510, 520a, 520b of the test unit 50, the volumes of the internal spaces 510, 520a, 520b are relatively large, and therefore the internal spaces 510, 520a, 520b Convection occurs and heat is released outside. Furthermore, even if dry air is introduced into the internal spaces 510, 520a, and 520b of the test unit 50 in order to prevent condensation during the low temperature test, the dry air escapes to the outside, and condensation cannot be effectively prevented.
- the present invention has been made in view of such a situation, and an object thereof is to provide an interface member, a test unit, a test head, and an electronic component testing apparatus having a structure with a high degree of sealing and excellent heat insulation. To do.
- the present invention is electrically connected to a main body of a test head used in an electronic component testing apparatus, a socket in which an electronic component to be tested is mounted, and the socket.
- An interface member provided between a socket board having a plurality of connectors and electrically connecting the main body of the test head and the socket board, the connector being fitted to a socket side connector of the socket board
- a frame for supporting the connector wherein the frame is formed with holes through which the plurality of connectors pass, and between the plurality of connectors passing through the same hole.
- an interface member provided with a heat insulating material (Invention 1).
- the present invention relates to a main body of a test head used in an electronic component testing apparatus, a socket in which an electronic component to be tested is mounted, and a socket board having a plurality of connectors electrically connected to the socket.
- An interface member for electrically connecting the main body of the test head and the socket board, a connector that fits into a socket side connector of the socket board, and a frame that supports the connector The interface member is characterized in that a heat insulating material is provided between a cable extending from one of the connectors and a cable extending from the other connector ( Invention 2).
- the heat insulating material is spread in the plane direction of the frame (Invention 4).
- the said heat insulating material becomes a block shape, and the said heat insulating material is spread in the planar direction of the said frame by providing so that the said block-shaped heat insulating material may adjoin two or more. Is preferred (Invention 5).
- the heat insulating material is preferably made of an elastic material (Invention 6).
- the elastic material is preferably a porous elastic material having many closed cells (Invention 7).
- frame is formed with the hole through which the said several connector penetrates, Between the said several connector which has penetrated the said hole, it is 2nd heat insulating material ( It is preferable that a heat insulating material in the above invention 1 is provided (invention 8).
- the inside of the frame is preferably a substantially sealed space (Invention 9).
- the heat insulating material may be provided with an air passage for introducing the dry air (Invention 11).
- the present invention relates to a main body of a test head used in an electronic component testing apparatus, a socket in which an electronic component to be tested is mounted, and a socket board having a plurality of connectors electrically connected to the socket.
- An interface member for electrically connecting the main body of the test head and the socket board, a connector that fits into a socket side connector of the socket board, and a frame that supports the connector An interface member is provided, wherein a heat insulating sheet extending in the plane direction of the frame is provided between the plurality of connectors (Invention 12).
- the connector has a flange formed below the fitting portion, and the heat insulating sheet has a size that the fitting portion of the connector penetrates but the flange does not penetrate. It is preferable that the heat insulation sheet is provided so that the fitting portion of the connector passes through the hole and is in close contact with the flange (Invention 13).
- the present invention provides a test unit unit mounted on a main body of a test head, and includes a socket in which an electronic component to be tested is mounted and a plurality of connectors electrically connected to the socket. And the interface member (invention 1), and a space surrounded by the socket board and the interface member is substantially sealed (invention 14).
- the present invention provides a test unit unit mounted on a main body of a test head, and includes a socket in which an electronic device to be tested is mounted and a plurality of connectors electrically connected to the socket. And a test unit unit comprising the interface member (invention 2) (invention 15).
- the present invention is a test unit unit mounted on a main body of a test head, and includes a socket in which an electronic component to be tested is mounted and a plurality of connectors electrically connected to the socket. And the interface member (invention 8), and a space surrounded by the socket board and the interface member is substantially sealed (invention 16).
- the present invention is a test unit unit mounted on a main body of a test head, and includes a socket in which an electronic component to be tested is mounted and a plurality of connectors electrically connected to the socket. And the interface member (invention 12), and a space surrounded by the socket board and the interface member is substantially sealed (invention 17).
- an air passage for introducing the dry air may be formed in the interface member (Invention 19).
- the present invention provides a test head comprising the test head main body and the test unit (invention 14 to 17) attached to the test head main body (invention 20).
- the present invention supplies dry air to the test head main body, the test unit (invention 14, 16, 17) attached to the test head main unit, and the substantially sealed space in the test unit. And a test head comprising the apparatus (Invention 21).
- Tenth aspect of the present invention relates to a test head main body, a test unit unit including the interface member (invention 10) attached to the test head main body, and an apparatus for supplying dry air into the frame of the interface member.
- a test head is provided (Invention 22).
- the present invention includes the test head (invention 20) and an electronic component handling apparatus that surrounds the electronic device under test and mounts the electronic device under test in a socket on the test head.
- a characteristic electronic device testing apparatus is provided (Invention 23).
- the present invention includes the test head (Invention 21) and an electronic component handling apparatus that surrounds the electronic device under test and mounts the electronic device under test in a socket on the test head.
- a characteristic electronic device testing apparatus is provided (Invention 24).
- this invention was equipped with the said test head (invention 22) and the electronic component handling apparatus which manages the electronic device under test and mounts the said electronic device under test to the socket on the said test head.
- a characteristic electronic device testing apparatus is provided (Invention 25).
- the electronic component handling apparatus includes a chamber for heating and / or cooling the electronic device under test to a predetermined temperature (Invention 26).
- the interface member or test unit according to the present invention has a high degree of sealing of the internal space and has excellent heat insulation. Therefore, it is possible to more accurately control the temperature of the electronic component, and it is possible to effectively prevent condensation in the interface member or the test unit by introducing dry air.
- FIG. 1 is an overall side view of an IC device test apparatus according to an embodiment of the present invention.
- FIG. 2 is a perspective view of the handler in the same embodiment.
- FIG. 3 is a cross-sectional view of the main part in the test chamber of the handler in the same embodiment.
- FIG. 4 is a cross-sectional view of the test unit in the same embodiment.
- FIG. 5 is a perspective view of the upper frame of the interface member in the same embodiment.
- FIG. 6 is a perspective view of a lower frame of the interface member in the same embodiment.
- FIG. 7 is a cross-sectional view of a test unit in another embodiment.
- FIG. 8 is a perspective view of the interface member side connector in the same embodiment.
- FIG. 9 is a cross-sectional view of a conventional test unit.
- the IC device test apparatus 10 includes a handler 1, a test head 5, and a test main apparatus 6.
- the handler 1 sequentially carries IC devices (an example of electronic components) to be tested to a socket provided in the test head 5, classifies the IC devices that have been tested according to the test results, and stores them in a predetermined tray. To do.
- the socket provided in the test head 5 is electrically connected to the test main device 6 through the cable 7, and the IC device detachably attached to the socket is connected to the test main device 6 through the cable 7, The IC device is tested by a test electrical signal from the test main apparatus 6.
- a control device for mainly controlling the handler 1 is built in the lower part of the handler 1, but a space portion 8 is provided in part.
- the test head 5 is replaceably disposed in the space portion 8, and an IC device can be attached to a socket on the test head 5 through a through hole formed in the handler 1.
- the handler 1 is an apparatus for testing an IC device as an electronic component to be tested in a temperature state (high temperature) higher than normal temperature or a low temperature state (low temperature).
- the handler 1 is as shown in FIG.
- the chamber 100 includes a constant temperature bath 101, a test chamber 102, and a heat removal bath 103.
- the upper portion of the test head 5 is inserted into the test chamber 102 as shown in FIG. 3, where the IC device 2 is tested.
- the handler 1 of this embodiment stores an IC device to be tested from now on, an IC storage unit 200 that classifies and stores tested IC devices, and is sent from the IC storage unit 200.
- a number of IC devices before being set in the handler 1 are stored in the customer tray, and are supplied to the IC storage section 200 of the handler 1 shown in FIG.
- the IC device 2 is transferred from the customer tray to the test tray TST conveyed in the handler 1.
- the IC device moves while being placed on the test tray TST, is subjected to high-temperature or low-temperature stress in the chamber 100, is tested for proper operation, and is unloaded at the unloader unit 400. Classified according to the test results.
- the chamber 100 is provided with a thermostatic chamber 101 that applies a desired high or low temperature thermal stress to the IC device under test loaded on the test tray TST, and the thermostatic chamber 101 is subjected to the thermal stress.
- the IC device In the heat removal tank 103, when a high temperature is applied in the constant temperature tank 101, the IC device is cooled by blowing air to return to room temperature, and when a low temperature is applied in the constant temperature tank 101, the IC device is heated with warm air or a heater or the like. Heat to a temperature that does not cause condensation. The heat-removed IC device is carried out to the unloader unit 400.
- the constant temperature bath 101 is provided with a vertical transfer device, and a plurality of test trays are on standby while being supported by the vertical transfer device until the test chamber 102 is empty. Mainly, during this standby, high or low temperature thermal stress is applied to the IC device under test.
- the test head 5 is disposed below the test chamber 102, and the upper portion of the test unit 50 provided on the test head 5 is located in the test chamber 102 as shown in FIGS.
- the test tray TST is sequentially carried onto the test unit 50. There, the IC devices 2 mounted on the test tray TST are brought into electrical contact with the sockets of the test unit 50, and all the IC devices 2 in the test tray TST are tested. On the other hand, the test tray TST for which the test has been completed is removed by the heat removal tank 103, and after the temperature of the IC device 2 is returned to room temperature, it is discharged to the unloader unit 400 shown in FIG.
- the test chamber 102 includes a casing 80 that forms a substantially sealed space on the upper side of the test unit 50. Inside the casing 80, a temperature adjusting blower 90 and a temperature sensor 82 are provided.
- the temperature adjusting blower 90 includes a fan 92 and a heat exchanging portion 94, sucks air inside the casing by the fan 92, discharges it into the casing 80 through the heat exchanging portion 94, and circulates the casing 80.
- the inside of is set to a predetermined temperature condition (high temperature or low temperature).
- the heat exchanging portion 94 of the temperature adjusting blower 90 is constituted by a heat dissipating heat exchanger or an electric heater through which a heating medium flows when the inside of the casing is heated to a high temperature. It is possible to provide a sufficient amount of heat to maintain a high temperature. Further, when the inside of the casing is cooled, the heat exchanging portion 94 is composed of an endothermic heat exchanger or the like in which a refrigerant such as liquid nitrogen circulates. It is possible to absorb a sufficient amount of heat to maintain.
- the internal temperature of the casing 80 is detected by the temperature sensor 82, and the air volume of the fan 92 and the heat volume of the heat exchanging section 94 are controlled so that the inside of the casing 80 is maintained at a predetermined temperature.
- a pusher 30 that presses the IC device 2 against the socket 512 is provided above the test unit unit 50 including the socket 512.
- the pusher 30 is an adapter. 62.
- Each adapter 62 is elastically held by the match plate 60.
- the match plate 60 is positioned above the test unit 50, and the test tray TST can be inserted between the pusher 30 and the socket 512. Is provided.
- the pusher 30 held by the match plate 60 is movable in the Z-axis direction with respect to the test head 5 or the drive plate 72 of the Z-axis drive device 70.
- test tray TST is conveyed between the pusher 30 and the socket 512 from the direction perpendicular to the paper surface (X axis) in FIG.
- a transport roller or the like is used as a means for transporting the test tray TST inside the chamber 100.
- the drive plate 72 of the Z-axis drive device 70 is raised along the Z-axis direction, and the test tray TST is sufficiently inserted between the pusher 30 and the socket 512. Gaps are formed.
- a pressing portion 74 is fixed to the lower surface of the drive plate 72, and this pressing portion 74 presses the upper surface of the adapter 62 held by the match plate 60.
- a drive shaft 78 is fixed to the drive plate 72, and a drive source (not shown) such as a motor is connected to the drive shaft 78. This drive source can move the drive shaft 78 up and down along the Z-axis direction and press the adapter 62 by the pressing portion 74.
- the test head 5 includes a test head main body in which a signal module for processing a signal is accommodated, and a test unit 50 that is detachably attached to the test head main body.
- the test unit 50 includes a socket board 51 and an interface member 52 that is provided between the socket board 51 and the test head main body and electrically connects both.
- the socket board 51 includes a plate-like board body 511, a socket 512 provided on the upper side of the board body 511, a socket guide 513 provided so as to surround the socket 512, and a lower side of the board body 511.
- a frame-shaped frame 515 and a plurality of socket-side connectors 514 provided inside the frame 515 (inner space 510) and electrically connected to the socket 512 are provided.
- the socket 512 is provided with a probe pin 512a connected to an external terminal of the IC device 2.
- the socket guide 513 is provided with a guide bush 513a into which a guide pin formed on the pusher 30 is inserted. The pusher 30 and the socket guide 513 are positioned by inserting the guide pin of the pusher 30 into the guide bush 513a.
- the interface member 52 includes an upper frame 521 having a hollow inside and a frame-like lower frame 522.
- the space inside the upper frame 521 is referred to as an internal space 520 (of the interface member 52).
- the upper portion of the upper frame 521 is a substrate portion, and a hole 52h is formed in the substrate portion.
- a plurality of IF-side connectors 524 are provided through the hole 52h.
- a plate-like heat insulating material 525 is provided between the plurality of IF-side connectors 524 penetrating through the same hole 52h (see FIGS. 4 and 5). By providing the heat insulating material 525, the hole 52h is substantially sealed.
- the IF-side connector 524 and the socket-side connector 514 are fitted with each other.
- the heat insulating material 525 for example, a plastic resin having excellent heat insulating properties is used.
- a heat insulating material used here as shown in FIG. 5, there are a plate-shaped heat insulating material 525 a and a heat insulating material 525 b in which a hole is formed in the center, in addition to the plate-shaped heat insulating material 525.
- the heat insulating material 525a is provided between the plurality of IF-side connectors 524, and another IF-side connector 524 passes through the hole of the heat insulating material 525a.
- the heat insulating material 525b is provided in the hole 52h of the upper frame 521, and the IF connector 524 penetrates the hole of the heat insulating material 525b.
- a connector cover 523 is attached on the substrate portion of the upper frame 521 so as to fix the IF-side connector 524.
- a cable 524 c that is electrically connected to the test head main body extends from the IF side connector 524.
- a plurality of block-like heat insulating materials 526 are laid in the planar direction on the inner side (opening) of the frame-like lower frame 522.
- a hole 526h is formed in the heat insulating material 526, and the cable 524c passes through the hole 526h.
- the hole 526h of the heat insulating material 526 has a size that allows a plurality of cables 524c extending from one IF side connector 524 to pass therethrough, but is not limited thereto, and the cable 524c is not limited to this. It may be the size which penetrates one by one.
- the heat insulating material 526 is preferably made of an elastic material. As a result, the heat insulating material 526 can be placed exactly inside the lower frame 522, and the degree of sealing can be increased to improve the heat insulating property.
- the elastic material is preferably a porous elastic material having many closed cells. Such an elastic material is particularly excellent in heat insulation.
- a porous silicone sponge having many closed cells is preferably used as a material for such a heat insulating material 526.
- the heat insulating material 526 in the present embodiment has a plurality of blocks, this facilitates the manufacturing process of passing the cable 524c through the hole 526h of the heat insulating material 526 and fitting the heat insulating material 526 into the lower frame 522. It will be something.
- the heat insulating material 526 is formed with a ventilation path 528 for introducing dry air into the internal space 520 of the interface member 52 (upper frame 521), and a pipe 527 is connected to the ventilation path 528.
- the heat insulating material 526, the upper frame 521, and the connector cover 523 are formed with a ventilation path 529 for introducing dry air into the internal space 510 of the socket board 51, and a pipe 527 is also connected to the ventilation path 529.
- the pipe 527 is connected to a dry air supply device (not shown).
- the dry air supply device has a dry air temperature adjustment function.
- the internal space 510 of the socket board 51 surrounded by the board body 511 of the socket board 51, the frame 515, and the connector cover 523 of the interface member 52 is insulated between the IF side connectors 524.
- the sealing degree is high and the heat insulating property is excellent. Therefore, the heat of the test chamber 102 can be prevented from escaping from the socket board 51 to the interface member 52 side.
- the internal space 520 of the interface member 52 is provided with a heat insulating material 526 inside the lower frame 522, so that the degree of sealing is high and the heat insulating property is excellent. Therefore, it is possible to suppress the heat of the test chamber 102 from escaping from the interface member 52 to the outside of the apparatus or the test head main body.
- the dry air whose temperature is adjusted is supplied from the dry air supply device to the internal space 510 of the socket board 51 through the pipe 527 and the air passage 529, and the temperature is supplied to the internal space 520 of the interface member 52 through the pipe 527 and the air passage 528.
- the adjusted dry air it is possible to effectively prevent condensation during the low temperature test.
- the internal space 510 of the socket board 51 and the internal space 520 of the interface member 52 have a high degree of sealing, dry air does not easily escape to the outside of the apparatus or the test head main body, and condensation can be more effectively prevented. .
- the IC device 2 can be controlled to a predetermined set temperature, and a test at an accurate temperature can be performed. In addition, it is possible to prevent occurrence of a short circuit due to condensation inside the test unit 50.
- a heat insulating sheet 53 that extends in the plane direction of the substrate portion of the upper frame 521 may be provided between the plurality of IF-side connectors 524.
- the IF-side connector 524 includes a fitting portion 524 a that fits with the socket-side connector 514 and a flange 524 b that is formed below the fitting portion 524 a.
- the heat insulating sheet 53 is formed with a hole having a size through which the fitting portion 524a of the IF-side connector 524 penetrates but the flange 524b does not penetrate.
- the heat insulating sheet 53 is provided so that the fitting portion 524a of the IF-side connector 524 passes through the hole of the heat insulating sheet 53 and is in close contact with the flange 524b.
- the heat insulating sheet 53 is pressed against the board portion of the upper frame 521 by the connector cover 523, thereby closely contacting the flange 524 b of the IF side connector 524 and the board portion of the upper frame 521.
- heat insulating sheet 53 for example, a sheet formed by laminating a metal layer made of aluminum or the like on a porous sheet can be used.
- the heat insulating sheet 53 As described above, the heat insulating properties of the internal space 510 of the socket board 51 and the internal space 520 of the interface member 52 can be further improved.
- the present invention is useful for an electronic component test apparatus that performs a test by controlling the electronic component at a predetermined temperature.
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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Abstract
Description
2…ICデバイス(電子部品)
10…ICデバイス(電子部品)試験装置
5…テストヘッド
50…テスト部ユニット
51…ソケットボード
510…内部空間
512…ソケット
514…ソケット側コネクタ
52…インターフェイス部材
520…内部空間
521…アッパーフレーム
521h…穴
522…ロアフレーム
524…インターフェイス部材側コネクタ
524a…嵌合部
524b…フランジ
524c…ケーブル
525,525a,525b,526…断熱材
526h…穴
528,529…ドライエア通気路
53…断熱シート
Claims (26)
- 電子部品試験装置において使用されるテストヘッドの本体部と、被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードとの間に設けられ、前記テストヘッドの本体部と前記ソケットボードとを電気的に接続するインターフェイス部材であって、
前記ソケットボードが有するソケット側コネクタと嵌合するコネクタと、
前記コネクタを支持するフレームと
を備えており、
前記フレームには、複数の前記コネクタが貫通する穴が形成されており、
同一の前記穴を貫通している前記複数のコネクタの相互間には、断熱材が設けられている
ことを特徴とするインターフェイス部材。 - 電子部品試験装置において使用されるテストヘッドの本体部と、被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードとの間に設けられ、前記テストヘッドの本体部と前記ソケットボードとを電気的に接続するインターフェイス部材であって、
前記ソケットボードが有するソケット側コネクタと嵌合するコネクタと、
前記コネクタを支持するフレームと
を備えており、
一の前記コネクタから延びているケーブルと、他の前記コネクタから延びているケーブルとの間には、断熱材が設けられている
ことを特徴とするインターフェイス部材。 - 前記断熱材には穴が形成されており、前記ケーブルは、前記断熱材の穴を貫通していることを特徴とする請求項2に記載のインターフェイス部材。
- 前記断熱材は、前記フレームの平面方向に敷き詰められていることを特徴とする請求項2に記載のインターフェイス部材。
- 前記断熱材はブロック状になっており、前記ブロック状の断熱材が複数隣接するように設けられることにより、前記断熱材は、前記フレームの平面方向に敷き詰められることを特徴とする請求項4に記載のインターフェイス部材。
- 前記断熱材は、弾性材料からなることを特徴とする請求項2に記載のインターフェイス部材。
- 前記弾性材料は、独立気泡を多数有する多孔性の弾性材料であることを特徴とする請求項6に記載のインターフェイス部材。
- 前記フレームには、複数の前記コネクタが貫通する穴が形成されており、
前記穴を貫通している前記複数のコネクタの相互間には、第2の断熱材が設けられている
ことを特徴とする請求項2に記載のインターフェイス部材。 - 前記フレームの内部は、略密閉された空間になっていることを特徴とする請求項2に記載のインターフェイス部材。
- 前記フレームの内部空間に、ドライエアが導入されることを特徴とする請求項9に記載のインターフェイス部材。
- 前記断熱材には、前記ドライエアを導入するための通気路が形成されていることを特徴とする請求項10に記載のインターフェイス部材。
- 電子部品試験装置において使用されるテストヘッドの本体部と、被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードとの間に設けられ、前記テストヘッドの本体部と前記ソケットボードとを電気的に接続するインターフェイス部材であって、
前記ソケットボードが有するソケット側コネクタと嵌合するコネクタと、
前記コネクタを支持するフレームと
を備えており、
複数の前記コネクタの相互間には、前記フレームの平面方向に広がる断熱シートが設けられている
ことを特徴とするインターフェイス部材。 - 前記コネクタには、嵌合部の下側にフランジが形成されており、
前記断熱シートには、前記コネクタの嵌合部は貫通するが前記フランジは貫通しない大きさの穴が形成されており、
前記断熱シートは、前記穴に前記コネクタの嵌合部が貫通し、前記フランジと密着するように設けられている
ことを特徴とする請求項12に記載のインターフェイス部材。 - テストヘッドの本体部に装着されるテスト部ユニットであって、
被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードと、
請求項1に記載のインターフェイス部材と
を備えており、
前記ソケットボードおよび前記インターフェイス部材によって囲まれる空間は、略密閉されている
ことを特徴とするテスト部ユニット。 - テストヘッドの本体部に装着されるテスト部ユニットであって、
被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードと、
請求項2に記載のインターフェイス部材と
を備えたことを特徴とするテスト部ユニット。 - テストヘッドの本体部に装着されるテスト部ユニットであって、
被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードと、
請求項8に記載のインターフェイス部材と
を備えており、
前記ソケットボードおよび前記インターフェイス部材によって囲まれる空間は、略密閉されている
ことを特徴とするテスト部ユニット。 - テストヘッドの本体部に装着されるテスト部ユニットであって、
被試験電子部品が装着されるソケットおよび前記ソケットに電気的に接続されている複数のコネクタを有するソケットボードと、
請求項12に記載のインターフェイス部材と
を備えており、
前記ソケットボードおよび前記インターフェイス部材によって囲まれる空間は、略密閉されている
ことを特徴とするテスト部ユニット。 - 前記略密閉された空間に、ドライエアが導入されることを特徴とする請求項14、16および17のいずれかに記載のテスト部ユニット。
- 前記インターフェイス部材には、前記ドライエアを導入するための通気路が形成されていることを特徴とする請求項18に記載のテスト部ユニット。
- テストヘッド本体と、
前記テストヘッド本体に装着される、請求項14~17のいずれかに記載のテスト部ユニットと
を備えたことを特徴とするテストヘッド。 - テストヘッド本体と、
前記テストヘッド本体に装着される、請求項14、16および17のいずれかに記載のテスト部ユニットと、
前記テスト部ユニットにおける前記略密閉された空間に、ドライエアを供給する装置と
を備えたことを特徴とするテストヘッド。 - テストヘッド本体と、
前記テストヘッド本体に装着される、請求項10に記載のインターフェイス部材を備えたテスト部ユニットと、
前記インターフェイス部材における前記フレームの内部に、ドライエアを供給する装置と
を備えたことを特徴とするテストヘッド。 - 請求項20に記載のテストヘッドと、
被試験電子部品を取り廻して、前記テストヘッド上のソケットに前記被試験電子部品を装着する電子部品ハンドリング装置と
を備えたことを特徴とする電子部品試験装置。 - 請求項21に記載のテストヘッドと、
被試験電子部品を取り廻して、前記テストヘッド上のソケットに前記被試験電子部品を装着する電子部品ハンドリング装置と
を備えたことを特徴とする電子部品試験装置。 - 請求項22に記載のテストヘッドと、
被試験電子部品を取り廻して、前記テストヘッド上のソケットに前記被試験電子部品を装着する電子部品ハンドリング装置と
を備えたことを特徴とする電子部品試験装置。 - 前記電子部品ハンドリング装置は、被試験電子部品を所定温度に加熱及び/又は冷却するチャンバを備えていることを特徴とする請求項23~25のいずれかに記載の電子部品試験装置。
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KR1020097020188A KR101104288B1 (ko) | 2008-10-09 | 2008-10-09 | 인터페이스 부재, 테스트부 유닛 및 전자 부품 시험 장치 |
US13/122,112 US20110227595A1 (en) | 2008-10-09 | 2008-10-09 | Interface member, test section unit and electronic device handling apparatus |
PCT/JP2008/068344 WO2010041317A1 (ja) | 2008-10-09 | 2008-10-09 | インターフェイス部材、テスト部ユニットおよび電子部品試験装置 |
CN2008801314329A CN102171581B (zh) | 2008-10-09 | 2008-10-09 | 接口构件、测试部单元以及电子元件测试装置 |
JP2010532734A JPWO2010041317A1 (ja) | 2008-10-09 | 2008-10-09 | インターフェイス部材、テスト部ユニットおよび電子部品試験装置 |
TW098130686A TWI405970B (zh) | 2008-10-09 | 2009-09-11 | Interface elements, test unit and electronic components test device |
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PCT/JP2008/068344 WO2010041317A1 (ja) | 2008-10-09 | 2008-10-09 | インターフェイス部材、テスト部ユニットおよび電子部品試験装置 |
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JP (1) | JPWO2010041317A1 (ja) |
KR (1) | KR101104288B1 (ja) |
CN (1) | CN102171581B (ja) |
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Cited By (2)
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KR101567364B1 (ko) * | 2015-01-26 | 2015-11-20 | (주)정우이엔지 | 다층의 어댑터 트레이와 무전기 시험환경을 제공하는 이동형 정비 장치 |
CN108445378A (zh) * | 2018-06-06 | 2018-08-24 | 广州市雅江光电设备有限公司 | 一种led驱动板测试装置 |
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KR101951206B1 (ko) * | 2012-10-05 | 2019-02-25 | (주)테크윙 | 테스트핸들러 |
JP2016023961A (ja) * | 2014-07-16 | 2016-02-08 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
US9921244B1 (en) | 2017-01-24 | 2018-03-20 | Advantest Corporation | Production-level modularized load board produced using a general universal device interface for automatic test equipment for semiconductor testing |
US9921266B1 (en) * | 2017-01-24 | 2018-03-20 | Advantest Corporation | General universal device interface for automatic test equipment for semiconductor testing |
CN109425812B (zh) * | 2017-08-28 | 2021-03-12 | 创意电子股份有限公司 | 半导体封装元件的检测***及其热阻障层元件 |
TWI659216B (zh) * | 2017-10-20 | 2019-05-11 | 鴻勁精密股份有限公司 | 具防結露單元之測試裝置及其應用之測試分類設備 |
KR102007823B1 (ko) * | 2018-01-30 | 2019-10-21 | 주식회사 대성엔지니어링 | 테스트소켓가열모듈 및 이를 포함하는 소자테스트장치 |
KR102015395B1 (ko) * | 2018-05-15 | 2019-08-28 | (주)티에스이 | 반도체소자 테스트용 인터페이스 보드 |
KR102363018B1 (ko) * | 2020-07-14 | 2022-02-15 | 주식회사 엑시콘 | 냉각 성능이 우수한 반도체 디바이스 테스트 시스템 |
KR20220080393A (ko) | 2020-12-07 | 2022-06-14 | 삼성전자주식회사 | 테스트 장치 및 방법 |
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- 2008-10-09 CN CN2008801314329A patent/CN102171581B/zh active Active
- 2008-10-09 KR KR1020097020188A patent/KR101104288B1/ko active IP Right Grant
- 2008-10-09 JP JP2010532734A patent/JPWO2010041317A1/ja active Pending
- 2008-10-09 US US13/122,112 patent/US20110227595A1/en not_active Abandoned
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US20110227595A1 (en) | 2011-09-22 |
KR20100076917A (ko) | 2010-07-06 |
TWI405970B (zh) | 2013-08-21 |
KR101104288B1 (ko) | 2012-01-11 |
JPWO2010041317A1 (ja) | 2012-03-01 |
TW201018916A (en) | 2010-05-16 |
CN102171581A (zh) | 2011-08-31 |
CN102171581B (zh) | 2013-09-18 |
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