WO2009136716A3 - 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지 - Google Patents

프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지 Download PDF

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Publication number
WO2009136716A3
WO2009136716A3 PCT/KR2009/002347 KR2009002347W WO2009136716A3 WO 2009136716 A3 WO2009136716 A3 WO 2009136716A3 KR 2009002347 W KR2009002347 W KR 2009002347W WO 2009136716 A3 WO2009136716 A3 WO 2009136716A3
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WO
WIPO (PCT)
Prior art keywords
led
housing
metal
housing body
reflective protrusion
Prior art date
Application number
PCT/KR2009/002347
Other languages
English (en)
French (fr)
Other versions
WO2009136716A2 (ko
Inventor
윤성노
김민공
Original Assignee
Yun Sung No
Kim Min Kong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yun Sung No, Kim Min Kong filed Critical Yun Sung No
Priority to CN2009801071478A priority Critical patent/CN101971366A/zh
Priority to JP2010548628A priority patent/JP2011513966A/ja
Priority to US12/919,250 priority patent/US20110044052A1/en
Priority to EP09742822A priority patent/EP2276077A2/en
Publication of WO2009136716A2 publication Critical patent/WO2009136716A2/ko
Publication of WO2009136716A3 publication Critical patent/WO2009136716A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명에 다른 프레스 단조방식으로 제조된 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지는, 하나 이상의 발광다이오드 (LED:LIGHT EMITTING DIODE)칩이 상면 중앙부에 형성된 칩장착부에 장착되는 하우징바디와 상기 하우징바디의 상면에서 칩장착부의 외측에 형성되는 반사돌부를 일체로 형성하되, 상기일체로 형성되는 하우징바디를 반사돌부를 금속재질로 형성하여서 된 것이다. 본 발명은, 하나 이상의 발광다이오드 (LED:LIGHT EMITTING DIODE)칩이 장착되는 하우징바디와 반사돌부를 금속제로 형성함으로써 발광다이오드 하우징은 체적 (크기)을 균일하게 하여 규격화할 수 있고, 발광다이오드 하우징을 규격화함으로써 발광다이오드 칩을 자삽 (자동 장착)하고 발광다이오드 칩과 단자간에 전극선을 자동으로 연결할 수가 있으며 외부단자를 자동으로 장착할 수 있으며 수지 (캐스팅 수지 혹은 실리콘)를 도포하는 일련의 공정 자동화 가동률을 높일 수 있으며, 따라서 생산성을 높일 수 있어서 원가를 절감할 수 있고 하우징과 반사돌부를 금속제로 형성함으로써 반사면의 조도를 높여 광소자패키지의 휘도를 향상시킬 수 있을 뿐만 아니라 금속재료로 되어 있어서 휘도저하가 발생하지 않으며 발광다이오드에서 발생하는 빛을 효율적으로 활용할 수 있다.
PCT/KR2009/002347 2008-05-06 2009-05-04 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지 WO2009136716A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2009801071478A CN101971366A (zh) 2008-05-06 2009-05-04 压锻式led用金属壳体和使用该金属壳体的led金属封装
JP2010548628A JP2011513966A (ja) 2008-05-06 2009-05-04 プレス鍛造方式の発光ダイオード金属製ハウジング及び金属製ハウジングを用いた発光ダイオード金属製パッケージ
US12/919,250 US20110044052A1 (en) 2008-05-06 2009-05-04 Press-forged led metal housing and led metal package using the same
EP09742822A EP2276077A2 (en) 2008-05-06 2009-05-04 Press forged metal housing for leds and an led metal package using the metal housing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0041641 2008-05-06
KR1020080041641A KR100997198B1 (ko) 2008-05-06 2008-05-06 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제하우징을 이용한 발광다이오드 금속제 패키지

Publications (2)

Publication Number Publication Date
WO2009136716A2 WO2009136716A2 (ko) 2009-11-12
WO2009136716A3 true WO2009136716A3 (ko) 2010-02-18

Family

ID=41265143

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002347 WO2009136716A2 (ko) 2008-05-06 2009-05-04 프레스 단조 방식의 발광다이오드 금속제 하우징 및 금속제 하우징을 이용한 발광다이오드 금속제 패키지

Country Status (6)

Country Link
US (1) US20110044052A1 (ko)
EP (1) EP2276077A2 (ko)
JP (1) JP2011513966A (ko)
KR (1) KR100997198B1 (ko)
CN (1) CN101971366A (ko)
WO (1) WO2009136716A2 (ko)

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KR101157530B1 (ko) * 2009-12-16 2012-06-22 인탑스엘이디 주식회사 발광다이오드 패키지 및 그 제조방법
DE102011003608A1 (de) * 2010-08-20 2012-02-23 Tridonic Gmbh & Co. Kg Gehäustes LED-Modul
KR200454785Y1 (ko) * 2010-12-29 2011-07-28 (주)유영지앤아이 Ｌｅｄ 어레이 패키지
US8563337B2 (en) 2011-10-24 2013-10-22 Avago Technologies General Ip (Singapore) Pte. Ltd. Simultaneous silicone dispension on coupler
US9494302B2 (en) * 2013-03-11 2016-11-15 Shenzhen Aoto Electronics Co., Ltd High-definition LED display screen and surface-mounted LED composite lamp with ultra-small point distance thereof
KR20200017047A (ko) 2018-08-08 2020-02-18 (주)메탈라이프 프레스 가공 및 초음파 용접을 이용하여 정밀한 치수 제어 및 방열 특성이 우수한 고출력 반도체 소자용 금속패키지의 월을 제조하는 방법

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KR100613067B1 (ko) * 2004-07-22 2006-08-16 서울반도체 주식회사 금속본체를 채택하는 발광 다이오드 패키지
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Also Published As

Publication number Publication date
JP2011513966A (ja) 2011-04-28
KR100997198B1 (ko) 2010-11-29
WO2009136716A2 (ko) 2009-11-12
US20110044052A1 (en) 2011-02-24
EP2276077A2 (en) 2011-01-19
CN101971366A (zh) 2011-02-09
KR20090115992A (ko) 2009-11-11

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