WO2009101774A1 - Dispositif d'imagerie et son procédé de fabrication - Google Patents

Dispositif d'imagerie et son procédé de fabrication Download PDF

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Publication number
WO2009101774A1
WO2009101774A1 PCT/JP2009/000440 JP2009000440W WO2009101774A1 WO 2009101774 A1 WO2009101774 A1 WO 2009101774A1 JP 2009000440 W JP2009000440 W JP 2009000440W WO 2009101774 A1 WO2009101774 A1 WO 2009101774A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
imaging device
lens
mid
substrate
Prior art date
Application number
PCT/JP2009/000440
Other languages
English (en)
Japanese (ja)
Inventor
Tatsuhiko Inagaki
Makoto Imai
Hidetoshi Mimura
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/681,825 priority Critical patent/US7979982B2/en
Priority to CN200980100943A priority patent/CN101855898A/zh
Priority to EP09711230.4A priority patent/EP2244460B1/fr
Publication of WO2009101774A1 publication Critical patent/WO2009101774A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to an imaging device and a method of manufacturing the same.
  • imaging devices have come to be mounted, for example, on vehicles and mobile phones, and downsizing has been required with the spread of imaging devices. Then, in order to miniaturize the imaging device, there is known an imaging device in which an imaging element is mounted on a circuit board with space saving by the MID method.
  • the conventional imaging device 10 described in Patent Document 1 converts the light passing through the lens 11, the lens bracket 12 on which the lens 11 is mounted, the lens fixing nut 13, and the lens 11 into an electrical signal.
  • the upper case 23 is engaged with the flat spring 21 to fix the lens bracket 12 to the lower case 22 side when fixed to the lower case 22.
  • the lens bracket 12 is formed with a guide groove 12b for positioning the MID 15 with respect to the lens bracket 12 in a direction orthogonal to the optical axis direction (indicated by the arrow 11A) by engaging with the MID 15.
  • the lens bracket 12 is formed with a claw 12 d for fixing the plate spring 21, and the upper case 23 engages with the plate spring 21 when fixed to the lower case 22.
  • An engaging portion 23a is formed. Therefore, when the upper case 23 is fixed to the lower case 22, the engagement portion 23 a of the upper case 23 engages with the plate spring 21, whereby the MID mounting substrate 16 is pressed by the lens bracket 12 and the lower case It is supposed to be fixed at 22.
  • the lens 11 to which the fixing nut 13 is attached is inserted into the lens bracket 12.
  • the male screw 11a of the lens 11 engages with the female screw 12a of the lens bracket 12, whereby the lens 11 to which the fixing nut 13 is attached and the lens bracket 12 are integrated.
  • the imaging element 14, the MID 15, and the MID mounting substrate 16 are integrated by being fixed to one another.
  • the leaf spring 21 is fixed to the lens bracket 12 by the leaf spring 21 being engaged with the claws 12 d of the lens bracket 12.
  • the lens bracket 12 is fitted to the MID 15 in the guide groove portion 12b and engaged with the MID mounting substrate 16 at the engaging portion 12c, whereby the positioning of the MID 15 with respect to the lens bracket 12 in the direction orthogonal to the optical axis direction is performed. Be done.
  • the position (focus position) in the optical axis direction with respect to the imaging device 14 is adjusted by adjusting the engagement position of the lens 11 with respect to the lens bracket 12, and after the focus adjustment with the imaging device 14 is completed, the lens The lens 11 is fixed to the lens bracket 12 by the fixing nut 13.
  • the lens bracket 12 to which the lens 11 is fixed, the imaging device 14 fixed to the lens bracket 12, the MID 15, the MID mounting substrate 16 and the like are inserted into the lower case 22 as the built-in object 20.
  • the engaging portion 21 a of the plate spring 21 fixed to the lens bracket 12 that constitutes a part of the built-in item is the upper case 23
  • the internal component 20 is fixed to the upper case 23 and the lower case 22 by being pressed by the engaging portion 23 a.
  • the lower case 22 and the upper side in the manufacturing process of the imaging device 10 are applied to, for example, an on-vehicle camera device whose attachment position is predetermined for the vehicle. It is necessary to adjust the position of the internals 20 with respect to the case 23 to an optimal position.
  • JP, 2007-102017, A JP, 2007-102017, A
  • the position of the included item 20 with respect to the lower case 22 and the upper case 23 is Not only is the adjustment difficult, but after completion, there is a possibility that the position of the built-in 20 with respect to the lower case 22 and the upper case 23 may shift due to vibration, so the optical axis of the lens 11 is shifted from the imaging target There was a problem.
  • the present invention has been made to solve such conventional problems, and since the manufacturing process can be simplified, it can be easily manufactured, and the shift of the optical axis of the lens due to vibration or the like It is an object of the present invention to provide an imaging device capable of preventing
  • the imaging device of the present invention is provided with a first case forming a part of a case, a lens, a second case forming a case integral with the first case, and light passing through the lens as an electric signal.
  • An imaging element to be converted, a circuit board on which the imaging element is mounted, an attachment portion for attaching the circuit board to the second case, a light receiving surface of the lens and the imaging element between the circuit board and the attachment portion The first case is fixed to the second case while the circuit board on which the image pickup device is mounted is fixed to the second case by the mounting portion. It has a configuration that
  • the imaging device fixes the first case to the second case in a state where the circuit board on which the imaging device is mounted is fixed to the second case by the attachment portion. Deviation of the optical axis can be prevented.
  • the circuit board mounting the imaging device is attached to the second case provided with the lens through the attaching portion, and the first case is fixed to the second case in this state.
  • the manufacturing process becomes simple, but also the distance between the lens and the light receiving surface of the imaging device can be adjusted by the adjusting member, so that the focus adjustment of the imaging device can be simplified, and as a result, it is easy. Can be manufactured.
  • the imaging device of the present invention has a configuration in which the attachment portion is integrally formed with the second case.
  • the attachment portion is integrally formed on the second case, the circuit board on which the imaging device is mounted can be directly fixed to the second case. Deviation of the optical axis can be prevented.
  • the mounting portion of the imaging device of the present invention is integrally formed on the second case, the manufacturing process becomes simple and can be easily manufactured.
  • a first case constituting a part of a case, a lens provided with a second case constituting an integral case with the first case, and light passing through the lens
  • An imaging element for converting into an electrical signal, a circuit board on which the imaging element is mounted, an attaching portion for attaching the circuit board to the second case, the lens and the imaging element between the circuit board and the attaching portion
  • a fixing step wherein, in the attaching step, the circuit board is attached to the second case by the attaching portion by the adjusting member. It has a configuration which is adapted to adjust the distance between the light receiving surface of serial lens and the imaging element.
  • the first case is fixed to the second case in a state in which the circuit board on which the image pickup device is mounted is fixed to the second case by the mounting portion. It is possible to manufacture an imaging device capable of preventing the shift of the optical axis of the lens due to the above.
  • the method of manufacturing the imaging device of the present invention adjusts the focus position by the adjustment member when the circuit board is attached to the second case by the attachment portion, so that the adjustment member is simply provided.
  • the focus position adjustment can be performed in the following steps, and the imaging device can be easily manufactured.
  • the present invention can provide an imaging device that can be easily manufactured because the manufacturing process can be simplified, and can prevent deviation of the optical axis of the lens due to vibration and the like, and a manufacturing method thereof. It is possible.
  • Sectional view of an on-vehicle camera in an embodiment of an imaging device according to the present invention Sectional drawing of vehicle-mounted camera which shows a part of assembly process of vehicle-mounted camera in one embodiment of imaging device which concerns on this invention
  • the imaging device according to the present invention Sectional drawing which shows a mode that the MID mounting substrate of the vehicle-mounted camera in one Embodiment is moved to the direction of arrow B.
  • Sectional drawing after spacer insertion of the vehicle-mounted camera in one Embodiment of the imaging device which concerns on this invention The figure which shows the resolution characteristic at the time of focus position detection of the vehicle-mounted camera in one embodiment of the imaging device concerning the present invention
  • Imaging device 2 Lower case (first case) 3 Upper case (second case) 3a, 3b lens 3c, 3d substrate mounting boss (mounting part) 4 Image sensor 5 MID 6 MID mounting board (circuit board) 7a, 7b Spacer (adjusting member) 8a, 8b Fixing screw (attachment part)
  • FIG. 1 is a cross-sectional view of an on-vehicle camera 1 according to an embodiment of the present invention.
  • the on-vehicle camera 1 of the present embodiment is provided with a lower case 2 constituting a part of a main body case, lenses 3 a and 3 b, and constitutes a main body case integral with the lower case 2.
  • Upper case 3 imaging device 4, MID 5 on which imaging device 4 is mounted, MID mounting substrate 6 on which MID 5 is mounted, and mounting of two substrates projecting toward the MID mounting substrate 6 from the inside of the upper case 3
  • Spacers 7a and 7b provided between bosses 3c and 3d, substrate mounting bosses 3c and 3d and MID mounting substrate 6, and fixing screws 8a and 8b for fixing MID mounting substrate 6 to substrate mounting bosses 3c and 3d Is equipped.
  • the lower case 2 and the upper case 3 are made of resin or the like, and are fixed to each other to form a main case of the on-vehicle camera 1.
  • the lower case 2 and the upper case 3 respectively constitute a first case and a second case of the present invention.
  • the resin and the like of the joint surface of the lower case 2 and the upper case 3 are completely melted, so that high airtightness of the main body case of the on-vehicle camera 1 is obtained, and the dripproof effect of the on-vehicle camera 1 is also enhanced.
  • the upper case 3 is integrally formed with two substrate mounting bosses 3c, 3d projecting from a desired position on the inner side.
  • the substrate mounting bosses 3c and 3d are not limited to two, and may be three or four or more. Further, the board attachment bosses 3c, 3d may be separate parts which are not integrally formed with the upper case 3.
  • the substrate mounting bosses 3c, 3d are adapted to fix the MID mounting substrate 6. The details of the substrate mounting bosses 3c and 3d will be described later.
  • the lenses 3a and 3b are fixed so as to be embedded in the upper case 3 and are made of glass or a resin such as plastic, and the like to focus light from an object on the imaging device 4 There is.
  • the lenses 3a and 3b are integrated with the upper case 3, it is necessary to provide packing or the like at the joint portion between the lens and the case as in a conventional on-vehicle camera in which the lens and the case are separate.
  • the configuration of the upper case 3 can be simplified.
  • the imaging device 4 is mounted on the MID 5 and is configured to convert the light passing through the lenses 3a and 3b into an electrical signal.
  • the MID 5 mounts the imaging device 4 as a three-dimensional circuit molding member and is fixed to the MID mounting substrate 6, and is interposed between the substrate mounting bosses 3c and 3d with a predetermined distance. . That is, the MID 5 is fixed on the MID mounting substrate 6 so that the position of the light receiving surface of the imaging device 4 with respect to the optical axis of the lenses 3 a and 3 b is a desired position.
  • the MID mounting substrate 6 is formed with holes through which the fixing screws 8a and 8b pass, and the MID mounting substrate 6 is fixed to the substrate mounting bosses 3c and 3d via the holes and the fixing screws 8a and 8b. It has become.
  • the MID mounting board 6 constitutes the circuit board of the present invention.
  • the spacers 7a and 7b are provided between the substrate mounting bosses 3c and 3d and the MID mounting substrate 6 and have a predetermined thickness, and the end surface portions 3e and 3f of the substrate mounting bosses 3c and 3d and the MID mounting substrate 6 Functions as an adjusting member for adjusting the distance between the mounting surfaces 6a and 6b of the lens.
  • the substrate mounting bosses 3c, 3d described above have end face portions 3e, 3f parallel to the direction orthogonal to the optical axis direction. Screw holes are formed in the end face portions 3e and 3f, respectively, and the MID mounting substrate 6 is fixed at a position parallel to the imaging device 4 by fixing the fixing screws 8a and 8b to the screw holes. As described above, the MID mounting substrate 6 is positioned in the direction orthogonal to the optical axis direction. As a result, the position of the light receiving surface of the imaging device 4 with respect to the optical axis of the lenses 3a and 3b is fixed.
  • the substrate mounting bosses 3c, 3d and the fixing screws 8a, 8b constitute a mounting portion of the present invention. Further, the surfaces of the end face portions 3e and 3f which the substrate mounting bosses 3c and 3d respectively have are not limited to being parallel to the direction orthogonal to the optical axis direction.
  • a focus adjustment chart is imaged as an imaging target by the imaging element 4 via the lenses 3a and 3b, and the process is performed based on the resolution of the image of the imaged focus adjustment chart.
  • the imaging device 4 captures a focus adjustment chart. Then, with the end faces 3e and 3f of the substrate mounting bosses 3c and 3d in contact with the mounting surfaces 6a and 6b of the MID mounting substrate 6 in a state in which the focus adjustment chart is imaged by the imaging device 4, FIG. As shown in c), between the end face portions 3e and 3f of the substrate mounting bosses 3c and 3d and the mounting surface on the substrate mounting boss side of the MID mounting substrate 6 (hereinafter referred to as "upper surface of the MID mounting substrate 6").
  • the MID mounting substrate 6 While changing the distance Z, the MID mounting substrate 6 is moved in the direction of the arrow B, that is, in the optical axis direction of the lenses 3a and 3b, and the resolution is measured. At this time, the relationship between the resolution of the focus adjustment chart image captured by the imaging device 4 and the distance Z is as shown in FIG. Here, if the distance Z is not appropriate, the resolution of the focus adjustment chart image captured by the imaging device 4 also decreases.
  • FIG. 2 (a) to 2 (c) are cross-sectional views of the on-vehicle camera 1 showing a part of the assembling process of the on-vehicle camera 1. As shown in FIG.
  • the upper case 3 provided with the lenses 3a and 3b in advance is prepared.
  • the MID mounting substrate 6 on which the MID 5 on which the imaging element 4 is mounted is mounted in advance is applied to the end face portions 3e and 3f of the substrate mounting bosses 3c and 3d formed on the upper case 3. Get in touch.
  • the MID 5 mounted on the MID mounting substrate 6 is interposed between the two substrate mounting bosses 3c and 3d formed in the upper case 3 as described above.
  • the above-described focus position is detected to obtain the distance Z0.
  • the spacers 7a and 7b as adjusting members set to a thickness corresponding to the distance Z0, the end surface portions 3e and 3f of the substrate mounting bosses 3c and 3d, and the upper surface of the MID mounting substrate 6 In between.
  • the fixing screw 8a as a fixing means is used.
  • 8b secure to the substrate mounting bosses 3c, 3d.
  • the MID mounting substrate 6 is fixed to the substrate mounting bosses 3c, 3d by the fixing screws 8a, 8b, whereby positioning of the lenses 3a, 3b in the direction orthogonal to the optical axis direction is also performed.
  • the above-described distance Z0 which is the optimum focus position differs depending on the on-vehicle camera due to the variation of the lens fixed position, the variation of the MID height, and the like. Therefore, in the focus adjustment, a plurality of types of spacers having different thicknesses are prepared in advance, and a thickness corresponding to the above-mentioned distance Z0 of the plurality of types of spacers is provided for each on-vehicle camera. It is preferable to select and use a spacer.
  • the spacer used for the focus adjustment does not necessarily have to be a spacer having a thickness corresponding to the above-described distance Z0, and for example, corresponds to a range in which a focus shift to such an extent as absorbed in the depth of focus is allowed.
  • One of the spacers may be selected for use.
  • the lower case 2 is integrated as a body case of the on-vehicle camera 1.
  • the substrate attachment bosses 3c and 3d are integrally formed on the upper case 3 provided integrally with the lenses 3a and 3b, and the substrate attachment Since the MID mounting substrate 6 is fixed to the bosses 3c and 3d, not only the positional deviation of the imaging device 4 with respect to the lenses 3a and 3b can be prevented, but also the position of the imaging device 4 relative to the body case of the on-vehicle camera 1 Misalignment can also be prevented.
  • the initially set imaging region can be maintained even if the vibration or the like is applied.
  • the on-vehicle camera 1 fixes the MID mounting substrate 6 to the substrate attachment bosses 3c and 3d integrally formed in the upper case 3 provided with the lenses 3a and 3b via the spacers 7a and 7b. Since this makes it possible to simplify the manufacturing process of the in-vehicle camera 1, the in-vehicle camera 1 can be easily manufactured.
  • the spacers 7a and 7b having a thickness corresponding to the distance Z0 at which the optimum focus position can be obtained, the end surface portions 3e and 3f of the substrate mounting bosses 3c and 3d, and the MID mounting substrate Since the MID mounting substrate 6 is fixed to the substrate mounting bosses 3c, 3d by being interposed between the upper surface of the substrate 6 and the upper surface 6, the focus adjustment process can be simplified.
  • the present invention is not limited to this, and for example, a separate lens mirror provided with a lens group
  • the cylinder may be integrally fixed to the upper case 3.
  • the circuit board on which the imaging device formed by the MID method is mounted is described as an example, but the present invention is not limited to this, and for example, a packaged imaging device It can apply also to the circuit board which mounted.
  • the imaging device and the method of manufacturing the same according to the present invention can simplify the manufacturing process, and hence can be easily manufactured, and also prevent deviation of the optical axis of the lens due to vibration or the like.
  • it is useful as an imaging device mounted in a vehicle and imaging an object, and a method of manufacturing the same.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

L'invention porte sur un dispositif d'imagerie dont le procédé de fabrication peut être plus simple que le dispositif d'imagerie de l'état de la technique. Le dispositif peut être facilement fabriqué et prévenir le désalignement de l'axe optique d'une lentille par suite de vibrations, entre autre. Une caméra montée sur véhicule (1) comprend un boîtier inférieur (2) formant une partie du boîtier ; un boîtier supérieur (3) muni de lentilles (3a et 3b) et formant le boîtier intégré au boîtier inférieur (2) ; un élément d'imagerie (4) pour convertir la lumière traversant les lentilles (3a et 3b) en signaux électriques ; un substrat de montage MID (6) sur lequel est monté l'élément d'imagerie (4) ; des bossages du substrat de montage (3c et 3d) pour monter le substrat de montage MID (6) sur le boîtier supérieur (3) ; et des espaceurs (7a et 7b) intercalés entre le substrat de montage MID (6) et les bossages du substrat de montage (3c et 3d) pour ajuster l'espacement entre les lentilles (3a et 3b) et la face de réception de l'élément d'imagerie (4). Le substrat de montage MID (6) sur lequel est monté l'élément d'imagerie (4) est conçu pour fixer le boîtier inférieur (2) au boîtier supérieur (3) au moyen des bossages du substrat de montage (3c et 3d).
PCT/JP2009/000440 2008-02-13 2009-02-05 Dispositif d'imagerie et son procédé de fabrication WO2009101774A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/681,825 US7979982B2 (en) 2008-02-13 2009-02-05 Imaging device, and method for manufacturing the same
CN200980100943A CN101855898A (zh) 2008-02-13 2009-02-05 摄像装置及其制造方法
EP09711230.4A EP2244460B1 (fr) 2008-02-13 2009-02-05 Dispositif d'imagerie et son procédé de fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-032033 2008-02-13
JP2008032033A JP2009194543A (ja) 2008-02-13 2008-02-13 撮像装置およびその製造方法

Publications (1)

Publication Number Publication Date
WO2009101774A1 true WO2009101774A1 (fr) 2009-08-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/000440 WO2009101774A1 (fr) 2008-02-13 2009-02-05 Dispositif d'imagerie et son procédé de fabrication

Country Status (5)

Country Link
US (1) US7979982B2 (fr)
EP (1) EP2244460B1 (fr)
JP (1) JP2009194543A (fr)
CN (1) CN101855898A (fr)
WO (1) WO2009101774A1 (fr)

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JP6827177B2 (ja) * 2017-05-24 2021-02-10 パナソニックＩｐマネジメント株式会社 車載カメラおよびその組立方法
DE102017124550A1 (de) * 2017-10-20 2019-04-25 Connaught Electronics Ltd. Kamera für ein Kraftfahrzeug mit zumindest zwei Leiterplatten und verbesserter elektromagnetischer Abschirmung, Kamerasystem, Kraftfahrzeug sowie Herstellungsverfahren
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US7979982B2 (en) 2011-07-19
CN101855898A (zh) 2010-10-06
EP2244460A1 (fr) 2010-10-27
EP2244460A4 (fr) 2011-11-02
JP2009194543A (ja) 2009-08-27
EP2244460B1 (fr) 2015-04-01

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