WO2009096460A1 - Dispositif d'imagerie, terminal portable, procédé de fabrication de dispositif d'imagerie et procédé de fabrication de terminal portable - Google Patents

Dispositif d'imagerie, terminal portable, procédé de fabrication de dispositif d'imagerie et procédé de fabrication de terminal portable Download PDF

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Publication number
WO2009096460A1
WO2009096460A1 PCT/JP2009/051443 JP2009051443W WO2009096460A1 WO 2009096460 A1 WO2009096460 A1 WO 2009096460A1 JP 2009051443 W JP2009051443 W JP 2009051443W WO 2009096460 A1 WO2009096460 A1 WO 2009096460A1
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WO
WIPO (PCT)
Prior art keywords
lens
spacer
imaging device
imaging
space
Prior art date
Application number
PCT/JP2009/051443
Other languages
English (en)
Japanese (ja)
Inventor
Yusuke Hirao
Yasunari Fukuta
Keiji Matsusaka
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Publication of WO2009096460A1 publication Critical patent/WO2009096460A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is an imaging device, a portable terminal, a manufacturing method of the imaging device, and a manufacturing method of the portable terminal.
  • a compact and thin imaging device is mounted on a portable terminal (for example, a mobile phone or a PDA (Personal Digital Assistant)) which is a compact and thin electronic device.
  • Information such as audio information and image information is transmitted bidirectionally between such a portable terminal and, for example, a remote electronic device.
  • Examples of the imaging device used in an imaging device such as a portable terminal include solid-state imaging devices such as a CCD (Charge Coupled Device) type image sensor and a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor.
  • solid-state imaging devices such as a CCD (Charge Coupled Device) type image sensor and a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor.
  • resin lenses that can be mass-produced inexpensively are used as imaging lenses that form subject images on these imaging elements in order to reduce costs.
  • the lens when the lens is formed of resin, it can be processed easily and with high accuracy.
  • a lens having a desired aspheric surface is easily manufactured. Therefore, in the case of a high-performance imaging lens, such a resin lens has been particularly used.
  • an imaging lens employing an optical system including only a resin lens and an imaging lens employing an optical system including a resin lens and a glass lens are known.
  • an imaging lens employing an optical system including a resin lens and a glass lens are known.
  • it is difficult to achieve both ultra-compact and high productivity for these imaging lenses due to technical limitations.
  • the replica method is a method in which a large number of lenses (lens elements) are simultaneously formed on one lens substrate (wafer). Further, a lens substrate (lens block unit) including a plurality of lenses formed by this method is divided after being connected to a wafer-like imaging device (sensor wafer) via a spacer (a space in which the spacer is interposed). Has a very high degree of sealing).
  • the lens block in a state where the lens block unit is divided, and the imaging lens including one or a plurality of lens blocks connected to the imaging device is referred to as a wafer scale lens.
  • the module including the image pickup device is called a wafer scale camera module (also referred to as a camera module for short).
  • Patent Document 1 discloses an imaging lens including a wafer scale lens (an optical element having a lens connected to at least one substrate surface of a lens substrate) formed by a replica method.
  • Patent Document 2 discloses an imaging lens including a wafer scale lens. JP 2006-323365 A Japanese Patent No. 3929479
  • an image pickup apparatus including such an image pickup lens and an image pickup device is attached to a printed circuit board on which paste-like solder is printed, and then subjected to a heat treatment (reflow treatment), thereby printing the print device.
  • a heat treatment reflow treatment
  • the imaging lens is placed in an environment near 300 ° C. (about 250 to 280 ° C.). Then, the air between the lens blocks sealed via the spacer and the air between the lens block and the image sensor expand. If such air expansion occurs excessively, for example, the lens blocks may be separated from each other, and the imaging lens may be damaged.
  • the present invention has been made in view of the above situation. And the objective of this invention is providing the imaging device etc. which can endure the heating in a reflow process.
  • a lens block a lens block having a lens connected to at least one of the object-side substrate surface and the image-side substrate surface of the lens substrate, an imaging element, and a first spacer interposed between the lens block and the imaging element;
  • An image pickup apparatus comprising: the lens block sandwiching the first spacer; the image pickup device; and a first pressure reduction mechanism for allowing air to pass between a space formed by the first spacer and the outside.
  • the imaging device A plurality of the lens blocks; A second spacer interposed between the lens blocks, 2.
  • the first pressure reduction mechanism includes: At least one of the adhesive between the first spacer and the lens substrate and between the first spacer and the imaging element is formed discontinuously so that the space communicates with the outside. 3.
  • the second pressure reduction mechanism includes: 3. The adhesive according to claim 2, wherein the adhesive between the second spacer and the lens substrate is an opening formed by a gap formed discontinuously so that the space communicates with the outside. Imaging device.
  • the second pressure reduction mechanism is a hollow cylinder that communicates a space formed by the lens block sandwiching the second spacer and the second spacer and the outside.
  • the imaging apparatus according to any one of 1 to 12, further comprising an adjustment member that adjusts a degree of communication between the space and the outside.
  • the adjustment member is a piston that is movable by a pressure difference between the outside and the space.
  • valve also serves as an isolation member that separates the space from the outside.
  • a portable terminal comprising the imaging device according to any one of 1 to 20.
  • the first pressure reduction mechanism allows air to pass between the lens block and the imaging device sandwiching the first spacer and the space formed by the first spacer and the outside, so that the space and the outside The pressure difference is eliminated. Therefore, a situation in which the pressure in the space becomes higher than the outside due to heating and the imaging apparatus is damaged does not occur.
  • FIG. 2 is a longitudinal sectional view at the position A-A ′ in FIG. 1. It is a perspective view of an example of an imaging device couple
  • FIG. 4 is a perspective view in which a first lens block and the like of the imaging device in FIG. 3 are omitted. It is a perspective view of a hollow cylinder. It is a perspective view of an example of an imaging device couple
  • FIG. 10B is a cross-sectional view taken along the line D-D ′ in FIG. (A) It is sectional drawing which shows the state in which the piston has block
  • (B) It is sectional drawing which shows the state which the piston has connected the exterior and space.
  • (C) It is sectional drawing which shows the state which the piston has block
  • (A) It is sectional drawing of a lens block unit.
  • (B) It is sectional drawing which shows the state in the middle of manufacture of an imaging lens.
  • (C) It is sectional drawing of an imaging lens.
  • BK Lens block UT Lens block unit PRB Printed board L, L1 to L4 Lens LS, LS1, LS2 Lens board PT Parallel flat plate (cover member) B1 Spacer B2 Substrate (cover member) BD1 to BD4 Adhesive GP1 to GP4 Gap HL1 to HL4 Opening (pressure reduction mechanism) 15 Passage port on the outside 16 Passage port on the space side MC, MC1, MC2 Hollow cylinder (pressure reduction mechanism) 11, 13 opening 12 intermediate port SP1, SP2 space VE valve (adjusting member, isolation member) PN piston (adjustment member, isolation member) 23 Main body 24N, 24T Specimen LN Imaging lens SR Imaging element IM Optical image (image plane) SS light receiving surface AX optical axis LU imaging device CU portable terminal 1 signal processing unit 2 control unit 3 memory 4 operation unit 5 display unit
  • the imaging lens is suitable for use in a digital device with an image input function (for example, a portable terminal).
  • a digital device including a combination of an imaging lens and an imaging element is an imaging device that optically captures an image of a subject and outputs it as an electrical signal.
  • the imaging device is a main component (optical device) of a camera that captures still images and moving images of a subject.
  • a main component optical device of a camera that captures still images and moving images of a subject.
  • an imaging lens that forms an optical image of an object in order from the object (that is, subject) side, and the imaging lens
  • an image sensor that converts the optical image formed by the method into an electrical signal.
  • cameras examples include digital cameras, video cameras, surveillance cameras, in-vehicle cameras, and videophone cameras.
  • Cameras are built into personal computers, mobile terminals (for example, compact and portable information device terminals such as mobile phones and mobile computers), peripheral devices (scanners, printers, etc.), and other digital devices. Or it may be externally attached.
  • a camera is configured by mounting an imaging apparatus, but also various devices having a camera function are configured by mounting the imaging apparatus.
  • a digital device with an image input function such as a mobile phone with a camera is configured.
  • FIG. 12 is a block diagram of a mobile terminal CU that is an example of a digital device with an image input function.
  • the imaging device LU mounted on the portable terminal CU in this figure includes an imaging lens LN, a plane parallel plate PT, and an imaging element SR.
  • the imaging lens LN forms an optical image IM of the object.
  • the imaging lens LN includes, for example, a lens block BK (details will be described later), and forms an optical image IM on the light receiving surface SS of the imaging element SR.
  • the symbol IM may indicate an image plane on which an optical image is formed.
  • the optical image IM to be formed by the imaging lens LN corresponds to, for example, an optical low-pass filter (a parallel flat plate PT shown in FIG. 12) having a predetermined cutoff frequency characteristic determined by the pixel pitch of the imaging element SR. .)
  • an optical low-pass filter a parallel flat plate PT shown in FIG. 12
  • the spatial frequency characteristics are adjusted so that so-called aliasing noise that occurs when converted into an electrical signal is minimized.
  • the plane parallel plate PT is, for example, an optical filter such as an optical low-pass filter or an infrared cut filter disposed as necessary (the plane parallel plate PT corresponds to a cover glass or the like of the image sensor SR). There is also.)
  • the imaging element SR converts the optical image IM formed on the light receiving surface SS by the imaging lens LN into an electrical signal.
  • a CCD (Charge Coupled Device) type image sensor having a plurality of pixels and a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor can be cited as the imaging element (solid imaging element) SR.
  • the imaging lens LN is positioned so as to form an optical image IM of the subject on the light receiving surface SS of the imaging element SR. Therefore, the optical image IM formed by the imaging lens LN is efficiently converted into an electrical signal by the imaging element SR.
  • the imaging device LU when such an imaging device LU is mounted on a portable terminal CU with an image input function, the imaging device LU is usually arranged inside the body of the portable terminal CU.
  • the imaging device LU takes a form as necessary.
  • the unitized imaging device LU may be detachable or rotatable with respect to the main body of the mobile terminal CU.
  • the mobile terminal CU includes a signal processing unit 1, a control unit 2, a memory 3, an operation unit 4, and a display unit 5 in addition to the imaging device LU.
  • the signal processing unit 1 performs predetermined digital image processing, image compression processing, and the like on the signal generated by the image sensor SR as necessary.
  • the processed signal is recorded as a digital video signal in the memory 3 (semiconductor memory, optical disc, etc.), or converted into an infrared signal via a cable and transmitted to another device.
  • the control unit 2 is a microcomputer and performs function control such as a photographing function and an image reproduction function, that is, control of a lens moving mechanism for focusing.
  • the control unit 2 controls the imaging device LU so as to perform at least one of still image shooting and moving image shooting of a subject.
  • the memory 3 stores, for example, a signal generated by the image sensor SR and processed by the signal processing unit 1.
  • the operation unit 4 is a part including operation members such as an operation button (for example, a release button) and an operation dial (for example, a shooting mode dial), and transmits information input by the operator to the control unit 2.
  • operation members such as an operation button (for example, a release button) and an operation dial (for example, a shooting mode dial), and transmits information input by the operator to the control unit 2.
  • the display unit 5 includes a display such as a liquid crystal monitor, and displays an image using an image signal converted by the image sensor SR or image information recorded in the memory 3.
  • the imaging lens LN includes a lens block BK in which a plurality of optical elements are connected (see FIG. 13C and the like described later).
  • the lens block BK connects the lens L to at least one of the two surfaces (object-side substrate surface and image-side substrate surface) facing each other on the lens substrate LS (note that the lens L is Show positive or negative power).
  • continuous means that the substrate surface of the lens substrate LS and the lens L are in a directly adhered state, or that the substrate surface of the lens substrate LS and the lens L are in an indirectly bonded state through another member. Means.
  • the lens block unit UT in which a plurality of lens blocks BK are arranged on a plane as shown in the cross-sectional view of FIG. (The number of lens blocks BK included in the lens block unit UT may be singular or plural).
  • a curable resin is transferred onto a lens wafer in a lens shape using a mold.
  • a large number of lenses are simultaneously produced on the lens wafer.
  • a low softening point glass is formed on a glass substrate by a CVD (Chemical Vapor Deposition) method.
  • the low softening point glass film is finely processed by lithography and dry etching. Further, by heating, the low softening point glass film is melted into a lens shape. That is, in this reflow method, a large number of lenses are simultaneously produced on a glass substrate.
  • the reflow method processing for simultaneously producing a large number of lenses described here is different from the heat processing (reflow processing) described in [Problems to be Solved by the Invention].
  • the former is a process for softening the glass to produce the lens L
  • the latter is a process for softening the solder to mount an electronic component (such as the imaging device LU).
  • imaging device LU when manufacturing electronic products, such as portable terminal CU, ensuring relatively high productivity, mounting of imaging device LU to the printed circuit board contained in portable terminal CU is performed by the latter processing (reflow processing). Good. However, in this process, the imaging device LU must withstand high temperatures. The imaging device LU described below satisfies the requirement to withstand high temperatures.
  • the first lens block unit UT1 includes a first lens substrate LS1 that is a parallel flat plate whose opposing planes are parallel, a plurality of first lenses L1 that are bonded to one plane, and a plurality that are bonded to the other plane. And a second lens L2.
  • the second lens block unit UT2 includes a second lens substrate LS2 that is a parallel plate, a plurality of third lenses L3 bonded to one plane, a plurality of fourth lenses L4 bonded to the other plane, Consists of.
  • the lattice-like spacer B1 is interposed between the first lens block unit UT1 and the second lens block unit UT2 (specifically, between the first lens substrate LS1 and the second lens substrate LS2), and The distance between the lens block unit UT1 and the second lens block unit UT2 is kept constant. Further, the spacer B1 is interposed between the substrate B2 and the second lens block unit UT2, and keeps the distance between the substrate B2 and the lens block unit UT2 constant. And each lens L is located in the part of the hole of the grating
  • the substrate B2 is a plane parallel plate (corresponding to the plane parallel plate PT in FIG. 12) such as a sensor cover glass or an IR cut filter included in the image sensor SR.
  • the spacers B1 are interposed between the first lens block unit UT1 and the second lens block unit UT2 and between the second lens block unit UT2 and the substrate B2, so that the lens substrates LS (first The lens substrate LS1 and the second lens substrate LS2) are combined and integrated.
  • the imaging lens LN has been described as a two-lens configuration, but may be a single-lens configuration.
  • the first lens block unit UT1 is unnecessary, and after the second lens block unit UT2, the spacer B1, and the substrate B2 are integrated, the first lens block unit UT1 is cut along the lattice frame of the spacer B1. Imaging lens LN obtained in this way.
  • the imaging lens LN has a two-lens configuration, but it is needless to say that a single-lens configuration may be used.
  • the imaging lens LN is manufactured by separating the members in which the plurality of lens blocks BK (the first lens block BK1 and the second lens block BK2) are incorporated, the lens interval of each imaging lens LN is increased. Adjustment and assembly are not required. Therefore, more efficient mass production of the imaging lens LN is possible.
  • the spacer B1 has a lattice shape. Therefore, the spacer B1 also serves as a mark when the imaging lens LN is separated from a member in which the plurality of lens blocks BK are incorporated. Therefore, the imaging lens LN is easily separated from the member in which the plurality of lens blocks BK are incorporated, and it does not take time and effort. As a result, the imaging lens LN can be mass-produced at low cost.
  • FIG. 1 shows an imaging device (camera module) LU that covers the light receiving surface of the imaging element SR with the plane parallel plate PT (the substrate B2 in FIGS. 13B and 13C) of the imaging lens LN. . Further, as shown in FIG. 1, the imaging device LU is attached to a printed circuit board (circuit board) PRB on which paste solder is printed. Then, with the imaging device LU attached on the printed circuit board PRB, heat treatment (reflow processing) is performed, and the imaging device LU is mounted on the printed circuit board.
  • a printed circuit board circuit board
  • the first lens substrate LS1 and the second lens substrate LS2 of the imaging device LU. are formed with openings HL (HL1, HL2).
  • the opening HL1 allows the space SP1 formed by the first lens substrate LS1 and the second lens substrate LS2 to face each other to communicate with the outside without being closed. Therefore, the air in the space SP1 flows to the outside.
  • the opening HL2 allows the space SP2 formed by the second lens substrate LS2 and the plane parallel plate PT (and thus the image pickup element SR) to face each other without being closed, and communicates with the space SP1. Therefore, the air in the space SP2 flows into the space SP1, and further flows to the outside through the opening HL1.
  • the opening HL makes the pressure in the space SP (the space formed by the gap between the holding members holding the spacer B1) included in the imaging device LU the same as the external pressure.
  • the opening HL is formed easily, damage to the imaging device LU is easily prevented.
  • the opening (pressure reduction mechanism) HL is not necessarily formed in the lens substrate LS.
  • the opening HL (HL3, HL4) may be formed in a state in which a part of the spacer B1 is missing.
  • the opening HL3 allows the space SP1 to communicate with the outside. Therefore, the air in the space SP1 flows to the outside.
  • the opening HL4 allows the space SP2 to communicate with the outside. Therefore, the air in the space SP2 flows to the outside. Therefore, even if the air in the spaces SP1 and SP2 is thermally expanded by the reflow processing for the imaging device LU, the air flows to the outside. Therefore, a situation in which the lens block BK1, the lens block BK2, and the parallel flat plate PT are separated from each other by the pressure of the thermally expanded air does not occur.
  • the spacer B1 includes the opening HL, the amount of the material forming the spacer B1 is reduced, so that the imaging device LU becomes light and inexpensive.
  • a hollow cylinder (pressure reduction mechanism) MC as shown in FIG. 5 may be incorporated in the spacer B1.
  • This hollow cylinder MC not only allows the openings 11 and 13 at both ends of the cylinder to pass through, but also allows the intermediate port 12 located in the middle of the cylinder to communicate with the inside of the cylinder.
  • the hollow cylinder MC (MC1, MC2) is a perspective view of FIG. 6, FIG. 7 (A) (a cross-sectional view taken along the line BB ′ in FIG. 6 and viewed from the direction of the arrow), and FIG. As shown in FIG. 7 (B) (a cross-sectional view cut in the longitudinal direction at the CC ′ position in FIG. 6 and viewed from the direction of the arrow), it is incorporated in the spacer B1. Furthermore, the openings 11 and 13 at both ends of the hollow cylinder MC communicate with the outside, and the intermediate port 12 communicates with the space SP (SP1 and SP2).
  • the hollow cylinder MC1 causes the air in the space SP1 flowing through the intermediate port 12 to flow outside through the openings 11 and 13 at both ends.
  • the hollow cylinder MC2 allows the air in the space SP2 flowing through the intermediate port 12 to flow to the outside from the openings 11 and 13 at both ends. Therefore, in the imaging device LU incorporating such a hollow cylinder MC, the situation in which the lens block BK1, the lens block BK2, and the plane parallel plate PT are separated from each other by the pressure of air thermally expanded by the reflow process does not occur.
  • the integrated first lens block unit UT1, second lens block unit UT2, spacer B1, and substrate B2 are along the lattice frame (position of the broken line Q) of the spacer B1. If the hollow cylinder MC is included in each imaging lens LN when being cut and cut as shown in FIG. 13C, the imaging device LU including the imaging lens LN simply prevents damage due to the reflow process. .
  • the lens substrate LS1 and the spacer B1 are bonded with an adhesive or the like, the lens substrate LS1 and the spacer B1 are bonded to each other.
  • a place where the agent is not interposed can be provided, and the place where the adhesive is not interposed can be replaced with the openings HL3 and HL4 shown in FIG.
  • the imaging device LU has a lens substrate LS1, a spacer B1, a lens substrate LS2, a spacer B1, and a plane parallel plate PT coupled with an adhesive or the like.
  • the space SP1 is formed by overlapping the lens substrate LS1, the spacer B1, and the lens substrate LS2, and similarly, the space SP2 is formed by overlapping the lens substrate LS2, the spacer B1, and the plane parallel plate PT. Is done.
  • the lens substrate LS1, the spacer B1, and the lens substrate LS2 are overlapped and bonded to each other with an adhesive interposed therebetween.
  • the adhesive BD1 for bonding the spacer B1 and the lens substrate LS2 is not provided around the entire frame surface where the spacer B1 faces the lens substrate LS2.
  • the adhesive BD1 is provided on the side portion except for the corner portion of the spacer B1.
  • FIG. 8B shows a state where the state of the adhesive BD1 provided on the spacer B1 is seen through from the lower side (image sensor SR side) of FIG. 8A.
  • the adhesive BD3 is provided at the corners except for the side of the spacer B1.
  • FIG. 9B shows a state where the state of the adhesive BD3 provided on the spacer B1 is seen through from the lower side (image sensor SR side) of FIG. 9A.
  • gaps GP1 and GP3 are formed depending on the thickness of the adhesive, and air can flow between the outside and the space SP1.
  • the gaps GP2 and GP4 are formed in the portions where the adhesives BD2 and BD4 are not provided, depending on the thickness of the adhesive. Can flow.
  • the position where the gap is provided is not limited to the above position. It may be between the lens substrate LS1 and the spacer B1, or between the lens substrate LS2 and the spacer B1. Further, it is preferable that the adhesive contacting the frame surface of the spacer B1 is arranged with symmetry with respect to the optical axis of the imaging device LU. By providing symmetry, it is possible to prevent the optical axis from being inclined.
  • the adhesive that bonds the substrate LS1 and the spacer B1 is provided all around the frame surface of the spacer B1, but is omitted.
  • the gaps GP1 to GP4 in the imaging device LU for example, there is a method of applying an adhesive to the frame surface of the spacer B1 by screen printing.
  • the application area of the adhesive can be freely set within the grid-like frame surface of the spacer B1 by the mask pattern used for screen printing.
  • the adhesive to be applied is a mixture of resin and metal microspheres of the diameter specified in the adhesive material and dispersed.
  • the thickness of the adhesive can be defined by the microspheres having a defined diameter, and the gaps GP1 to GP4 can be set to desired widths.
  • the intervals between the lens substrate LS1, the lens substrate LS2, and the imaging element SR can be set. It can be set with high accuracy together with the thickness of the spacer B1.
  • the size of the microspheres to be mixed and dispersed in the adhesive material is preferably 5 ⁇ m to 50 ⁇ m, and more preferably 10 ⁇ m to 30 ⁇ m in consideration of the ease of adhesive application, air flow, and dust and the like.
  • the means for adjusting the thickness of the adhesive is not limited to the above-described mixing / dispersing of microspheres, and a clearance jig may be used.
  • the area of the opening surface in the opening HL, the area of the radial cross section in the hollow cylinder MC, and the opening area of the gap GP are desirably 2500 ⁇ m 2 or less. This is because dust cannot easily enter the inside of the imaging device LU.
  • the opening HL formed in the lens substrate LS, the opening HL formed in the spacer B1, the hollow cylinder MC incorporated in the spacer B1, and the gap GP by the adhesive is included in the imaging device LU. If so, the internal pressure will not increase to such an extent that the imaging device LU is damaged.
  • the imaging device LU may include an opening HL formed in the lens substrate LS and an opening HL formed in the spacer B1, or built in the opening HL and spacer B1 formed in the lens substrate LS.
  • the hollow cylinder MC may be included.
  • the imaging device LU may include an opening HL formed in the spacer B1 and a hollow cylinder MC built in the spacer B1, or may have a gap GP by an adhesive.
  • the number of the opening HL, the hollow cylinder MC, and the gap GP for one space may be singular or plural.
  • the number and combination of the opening HL, the hollow cylinder MC and the gap GP (combination of the same kind of opening HL, combination of different kinds of opening HL, The combination of the opening HL, the hollow cylinder MC, and the gap GP is not particularly limited.
  • Embodiment 2 A second embodiment will be described.
  • symbol is attached and the description is abbreviate
  • a member (adjustment member) that is a more preferable embodiment and prevents dust from entering the imaging device LU will be described.
  • a valve (adjustment member, isolation member) VE that separates the space SP1 may be included in the imaging device LU.
  • a thin-film valve VE may be formed so as to close the passage port 15 on the outside of the opening HL3.
  • Such a valve VE closes the passage opening 15 on the outside of the opening HL3 and separates the space SP from the outside when the pressure of the space SP1 at room temperature or the like is not too high than the external pressure. Therefore, it is difficult for dust to enter the space SP1 (as a result, inside the imaging device LU).
  • the valve VE is placed on the outside of the opening HL as shown in FIG. 10B (see the valve VE indicated by a dotted line). Open the passage opening 15 without blocking it. Then, the thermally expanded air in the space SP1 flows to the outside.
  • valve VE moves (opens and closes) in accordance with the pressure difference between the space SP and the outside that is generated by the thermal expansion of air, and adjusts the degree of communication between the space SP and the outside. Therefore, the valve VE does not prevent the damage of the imaging device LU when the imaging device LU is subjected to reflow processing.
  • the valve VE prevents dust from entering the imaging device LU when the imaging device LU is at room temperature or the like. The valve VE closes the opening HL again after the reflow process. Therefore, dust does not enter the imaging device LU after the reflow process.
  • valve VE there is a member that moves (opens and closes) according to the pressure difference between the space SP and the outside, and adjusts the degree of communication between the space SP and the outside.
  • piston PN adjustment member, isolation member shown in the cross-sectional views of FIGS. 11 (A) to 11 (C).
  • the piston PN includes a rod-shaped main body 23 that fits in the opening HL3 in the spacer B1, and flanges 24N and 24T formed at both ends of the body 23 (note that the flanges 24N and 24T are formed in the opening HL3).
  • the outer side passage port 15 and the space side passage port 16 are closed).
  • the piston PN is directed outward along the longitudinal direction of the main body 23 (along the longitudinal direction of the opening HL3) or toward the space SP1.
  • the outer flange (isolation member) 24T in the piston PN blocks the passage opening 15 on the outer side of the opening HL3.
  • the imaging device LU is reflowed in a state where the flange 24T closes the opening HL3 as described above and the air in the space SP1 is thermally expanded, the air pushes the flange 24N on the space SP1 side in the piston PN.
  • such a piston PN does not impair prevention of damage to the imaging device LU when the imaging device LU is subjected to reflow processing, while the imaging device LU is at room temperature or the like. Intrusion of dust into the imaging device LU is prevented.
  • valve VE and the piston PN can be said to be members that separate the space SP from the outside by sealing the opening HL after reducing the pressure increase in the space SP.
  • the opening HL may be sealed with a separate member instead of the valve VE and the piston PN.
  • the piston PN can be moved to the outside and the space SP side, the user may appropriately move the piston PN to seal the opening HL.
  • valve VE and the piston PN correspond to the opening HL, but may correspond to the hollow cylinder MC.
  • the valve VE may open and close the openings 11 and 13 at both ends of the hollow cylinder MC.
  • the piston PN may pass through the main body 23 through the hollow portion of the hollow cylinder MC, be provided in the openings 11 and 13 at both ends, and open and close the openings 11 and 13 at both ends of the hollow cylinder MC with the flange pieces 24N and 24T. .
  • the opening HL formed in the lens substrate LS may be positioned outside the effective diameter of the lens substrate LS (and thus the lens block BK).
  • the optical performance of the imaging lens LN is unlikely to deteriorate due to the opening HL. Therefore, the opening HL is easily formed.
  • the manufacturing burden of the imaging device LU is reduced, and as a result, the cost of the imaging device LU is reduced.
  • the spacer B1 is basically located outside the effective diameter of the lens substrate LS. Therefore, the imaging device LU including the opening HL formed in the spacer B1 and the hollow cylinder MC included in the spacer B1 is easily manufactured and the cost is reduced.
  • the opening HL formed in the lens substrate LS is positioned on the lens substrate LS closest to the object side.
  • adhesion of dust to the image sensor SR is further reduced.
  • the dust is relatively far from the image plane (the light receiving surface of the imaging element SR) and adheres to a location where the luminous flux spreads. . Therefore, the influence of dust on the imaging performance of the imaging device LU is small.
  • the effective diameter of the optical element for example, the first lens block BK1 located closest to the object side is relatively small. Therefore, a sufficient space for forming the opening HL is secured (the opening HL is easily formed).
  • the space SP is formed by the space SP1 formed by the lens substrates (LS1, LS2), the parallel flat plate PT which is the cover member of the image sensor SR, and the second lens substrate LS2.
  • the space SP2 was mentioned. However, it is not limited to this. For example, if the plane parallel plate PT does not exist, the space SP formed by the second lens substrate LS2 and the imaging element SR may be used.
  • a spacer B1 is arranged on the periphery of the lens block BK, and a plurality of lens block units UT are connected via the spacer B1, and a connected lens block unit UT is connected along the spacer B1.
  • a cutting process for cutting see FIGS. 13A to 13C).
  • the imaging device LU was completed by attaching the imaging lens LN manufactured with this manufacturing method so that the light-receiving surface of the image pick-up element SR may be covered.
  • the manufacturing method of the imaging device LU is not limited to this.
  • the imaging device LU may be manufactured by a manufacturing method including the following first connection step, second connection step, and cutting step.
  • the spacer B1 is arranged on the periphery of the lens block BK, and the plurality of lens block units UT are connected with the spacer B1 interposed.
  • the lens block unit UT in which spacers are arranged on the periphery of the lens block BK and the image sensor SR (however, when the parallel plane plate PT is attached to the light receiving surface of the image sensor SR, the parallel plane plate PT and the image sensor SR). ) With a spacer B1 interposed.
  • the lens block unit UT and the image sensor SR that are connected to each other are cut along the spacer B1.
  • the manufacturing method of the imaging device LU as described above the labor for attaching the imaging lens LN and the imaging element SR is reduced, and the imaging device LU is manufactured in large quantities at a lower cost.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

La présente invention concerne un dispositif d'imagerie résistant au procédé de refusion. Le dispositif d'imagerie est pourvu de : un bloc lentille comportant une lentille continue à un substrat de lentille et à au moins une surface de substrat de lentille sur le côté d'un objet ou à la surface du substrat de lentille sur le côté d'une image ; un élément d'imagerie ; et un premier espacement entre le bloc lentille et l'élément d'imagerie. Le dispositif d'imagerie est également pourvu d'un premier mécanisme de réduction de pression pour faire passer l'air entre le bloc lentille, qui est intercalé entre le premier espacement, et l'élément d'imagerie et entre un espace formé par le premier espacement et l'extérieur.
PCT/JP2009/051443 2008-01-31 2009-01-29 Dispositif d'imagerie, terminal portable, procédé de fabrication de dispositif d'imagerie et procédé de fabrication de terminal portable WO2009096460A1 (fr)

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JP2008-021091 2008-01-31

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JP2011130315A (ja) * 2009-12-21 2011-06-30 Ricoh Co Ltd 撮像装置、車載撮像装置および撮像装置の製造方法
EP2477052A1 (fr) * 2011-01-18 2012-07-18 Samsung Electro-Mechanics Co., Ltd. Module de lentille et procédé de fabrication associé
JP2013007969A (ja) * 2011-06-27 2013-01-10 Sharp Corp 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール
WO2020180428A1 (fr) * 2019-03-05 2020-09-10 Microsoft Technology Licensing, Llc Système de lentille et appareil d'imagerie
WO2020208750A1 (fr) * 2019-04-10 2020-10-15 オリンパス株式会社 Procédé de fabrication de dispositif d'imagerie, dispositif d'imagerie et endoscope
WO2023021669A1 (fr) * 2021-08-19 2023-02-23 オリンパス株式会社 Module d'imagerie, endoscope et procédé de fabrication de module d'imagerie

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JP2005020229A (ja) * 2003-06-25 2005-01-20 Konica Minolta Opto Inc 撮像ユニット
JP2005039152A (ja) * 2003-07-18 2005-02-10 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
JP2005352314A (ja) * 2004-06-11 2005-12-22 Canon Inc 撮像装置および電子機器

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JP2005020229A (ja) * 2003-06-25 2005-01-20 Konica Minolta Opto Inc 撮像ユニット
JP2005039152A (ja) * 2003-07-18 2005-02-10 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
JP2005352314A (ja) * 2004-06-11 2005-12-22 Canon Inc 撮像装置および電子機器

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011130315A (ja) * 2009-12-21 2011-06-30 Ricoh Co Ltd 撮像装置、車載撮像装置および撮像装置の製造方法
EP2477052A1 (fr) * 2011-01-18 2012-07-18 Samsung Electro-Mechanics Co., Ltd. Module de lentille et procédé de fabrication associé
CN102608725A (zh) * 2011-01-18 2012-07-25 三星电机株式会社 镜头模块及其制造方法
JP2013007969A (ja) * 2011-06-27 2013-01-10 Sharp Corp 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール
WO2020180428A1 (fr) * 2019-03-05 2020-09-10 Microsoft Technology Licensing, Llc Système de lentille et appareil d'imagerie
CN111665604A (zh) * 2019-03-05 2020-09-15 微软技术许可有限责任公司 透镜***及成像装置
CN111665604B (zh) * 2019-03-05 2022-09-06 微软技术许可有限责任公司 透镜***及成像装置
WO2020208750A1 (fr) * 2019-04-10 2020-10-15 オリンパス株式会社 Procédé de fabrication de dispositif d'imagerie, dispositif d'imagerie et endoscope
US20210382294A1 (en) * 2019-04-10 2021-12-09 Olympus Corporation Image pickup apparatus manufacturing method, image pickup apparatus, and endoscope
WO2023021669A1 (fr) * 2021-08-19 2023-02-23 オリンパス株式会社 Module d'imagerie, endoscope et procédé de fabrication de module d'imagerie

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