WO2009060541A1 - インライン型ウェハ搬送装置 - Google Patents

インライン型ウェハ搬送装置 Download PDF

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Publication number
WO2009060541A1
WO2009060541A1 PCT/JP2007/071817 JP2007071817W WO2009060541A1 WO 2009060541 A1 WO2009060541 A1 WO 2009060541A1 JP 2007071817 W JP2007071817 W JP 2007071817W WO 2009060541 A1 WO2009060541 A1 WO 2009060541A1
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
inline
conveyance
conveyance chamber
type wafer
Prior art date
Application number
PCT/JP2007/071817
Other languages
English (en)
French (fr)
Inventor
Naoki Watanabe
Einstein Noel Abarra
David Djulianto DJAYAPRAWIRA
Yasumi Kurematsu
Original Assignee
Canon Anelva Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corporation filed Critical Canon Anelva Corporation
Priority to JP2009539925A priority Critical patent/JP4473343B2/ja
Priority to CN2007801014565A priority patent/CN101855717B/zh
Priority to PCT/JP2007/071817 priority patent/WO2009060541A1/ja
Publication of WO2009060541A1 publication Critical patent/WO2009060541A1/ja
Priority to US12/750,955 priority patent/US8016537B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　未処理ウェハを外部から搬入し、処理済みウェハを外部へ搬出するためのロードロックチャンバ（５１）と、ロードロックチャンバに接続される第１の末端搬送チャンバ（５４ａ）と、少なくとも１つの中間搬送チャンバ（５４ｂ）と、隣接して設けられ独立に処理可能な一対のプロセスモジュール（５２ａ、５２ｂ）の複数の組と、ロードロックチャンバと反対側の端部に配置された第２の末端搬送チャンバ（５４ｃ）とが直列に接続された構造を有する。プロセスモジュール（５２ａ、５２ｂ、５２ｃ、５２ｄ）の各組は、第１の末端搬送チャンバと中間搬送チャンバとの間、中間搬送チャンバ間、及び中間搬送チャンバと第２の末端搬送チャンバとの間にそれぞれ１組ずつ配置される。
PCT/JP2007/071817 2007-11-09 2007-11-09 インライン型ウェハ搬送装置 WO2009060541A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009539925A JP4473343B2 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置
CN2007801014565A CN101855717B (zh) 2007-11-09 2007-11-09 在线型晶圆输送装置
PCT/JP2007/071817 WO2009060541A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置
US12/750,955 US8016537B2 (en) 2007-11-09 2010-03-31 Inline-type wafer conveyance device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/071817 WO2009060541A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/750,955 Continuation US8016537B2 (en) 2007-11-09 2010-03-31 Inline-type wafer conveyance device

Publications (1)

Publication Number Publication Date
WO2009060541A1 true WO2009060541A1 (ja) 2009-05-14

Family

ID=40625456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/071817 WO2009060541A1 (ja) 2007-11-09 2007-11-09 インライン型ウェハ搬送装置

Country Status (4)

Country Link
US (1) US8016537B2 (ja)
JP (1) JP4473343B2 (ja)
CN (1) CN101855717B (ja)
WO (1) WO2009060541A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024358A1 (ja) * 2012-08-10 2014-02-13 キヤノンアネルバ株式会社 トンネル磁気抵抗素子の製造装置
US9617024B2 (en) 2006-12-20 2017-04-11 Momentive Performance Materials Inc. Method for forming a pouch
JP2017168866A (ja) * 2012-07-04 2017-09-21 東京エレクトロン株式会社 基板処理装置
JP2019071480A (ja) * 2012-07-20 2019-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 磁気メモリを製造するための装置及び磁気接合を提供するための方法
KR20200083233A (ko) * 2018-12-28 2020-07-08 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법
KR20200083285A (ko) * 2018-12-28 2020-07-08 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법

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US8834969B2 (en) * 2007-10-24 2014-09-16 Oerlikon Advanced Technologies Ag Method for manufacturing workpieces and apparatus
JP4494524B2 (ja) * 2007-11-09 2010-06-30 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
JP5209717B2 (ja) 2008-06-25 2013-06-12 キヤノンアネルバ株式会社 スパッタリング装置及びその制御用プログラムを記録した記録媒体
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
JP2011009362A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
US8677929B2 (en) * 2010-12-29 2014-03-25 Intevac, Inc. Method and apparatus for masking solar cell substrates for deposition
JP2013143513A (ja) * 2012-01-12 2013-07-22 Hitachi High-Technologies Corp 真空処理装置
KR102064391B1 (ko) * 2012-08-31 2020-01-10 삼성디스플레이 주식회사 기판 처리 장치
JP6076884B2 (ja) * 2013-11-19 2017-02-08 東京エレクトロン株式会社 剥離システム
US9299598B2 (en) * 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
US10504741B2 (en) * 2017-02-28 2019-12-10 Tokyo Electron Limited Semiconductor manufacturing method and plasma processing apparatus
JP6807775B2 (ja) 2017-02-28 2021-01-06 東京エレクトロン株式会社 成膜方法及びプラズマ処理装置
JP6742287B2 (ja) * 2017-02-28 2020-08-19 東京エレクトロン株式会社 半導体製造方法及びプラズマ処理装置
KR20230131969A (ko) 2017-03-15 2023-09-14 램 리써치 코포레이션 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
US10378279B2 (en) * 2017-07-12 2019-08-13 Lam Research Corporation Step ladder with component rack system for fabrication facility
JP7097777B2 (ja) 2018-08-10 2022-07-08 東京エレクトロン株式会社 成膜装置および成膜方法
US11664207B2 (en) 2018-08-10 2023-05-30 Tokyo Electron Limited Film-forming apparatus, film-forming system, and film-forming method
JP2020026575A (ja) * 2018-08-10 2020-02-20 東京エレクトロン株式会社 成膜装置、成膜システム、および成膜方法
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
KR20210103407A (ko) * 2020-02-12 2021-08-23 에이에스엠 아이피 홀딩 비.브이. 다중 방향 반응 챔버를 갖는 반응기 시스템

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JPH098094A (ja) * 1995-06-21 1997-01-10 Shibaura Eng Works Co Ltd 真空処理装置
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JP2007005435A (ja) * 2005-06-22 2007-01-11 Rorze Corp 処理装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9617024B2 (en) 2006-12-20 2017-04-11 Momentive Performance Materials Inc. Method for forming a pouch
JP2017168866A (ja) * 2012-07-04 2017-09-21 東京エレクトロン株式会社 基板処理装置
JP2019071480A (ja) * 2012-07-20 2019-05-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 磁気メモリを製造するための装置及び磁気接合を提供するための方法
WO2014024358A1 (ja) * 2012-08-10 2014-02-13 キヤノンアネルバ株式会社 トンネル磁気抵抗素子の製造装置
JPWO2014024358A1 (ja) * 2012-08-10 2016-07-25 キヤノンアネルバ株式会社 トンネル磁気抵抗素子の製造装置
KR20200083233A (ko) * 2018-12-28 2020-07-08 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법
KR20200083285A (ko) * 2018-12-28 2020-07-08 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법
KR102238879B1 (ko) 2018-12-28 2021-04-09 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법
KR102279006B1 (ko) 2018-12-28 2021-07-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 반송 방법
US11127613B2 (en) 2018-12-28 2021-09-21 SCREEN Holdings Co., Ltd. Substrate treating apparatus and substrate transporting method
US11260429B2 (en) 2018-12-28 2022-03-01 SCREEN Holdings Co., Ltd. Substrate treating apparatus and substrate transporting method
US11590540B2 (en) 2018-12-28 2023-02-28 SCREEN Holdings Co., Ltd. Substrate treating apparatus and substrate transporting method

Also Published As

Publication number Publication date
CN101855717B (zh) 2011-10-19
JP4473343B2 (ja) 2010-06-02
JPWO2009060541A1 (ja) 2011-03-17
US8016537B2 (en) 2011-09-13
US20100215460A1 (en) 2010-08-26
CN101855717A (zh) 2010-10-06

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