WO2009051079A1 - 静電型補強装置 - Google Patents

静電型補強装置 Download PDF

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Publication number
WO2009051079A1
WO2009051079A1 PCT/JP2008/068477 JP2008068477W WO2009051079A1 WO 2009051079 A1 WO2009051079 A1 WO 2009051079A1 JP 2008068477 W JP2008068477 W JP 2008068477W WO 2009051079 A1 WO2009051079 A1 WO 2009051079A1
Authority
WO
WIPO (PCT)
Prior art keywords
reinforcing
reinforcing material
suction
electrode part
material body
Prior art date
Application number
PCT/JP2008/068477
Other languages
English (en)
French (fr)
Inventor
Fow-Lai Poh
Original Assignee
Tsukuba Seiko Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsukuba Seiko Ltd. filed Critical Tsukuba Seiko Ltd.
Priority to CN2008801176545A priority Critical patent/CN101874298B/zh
Priority to US12/734,145 priority patent/US8335070B2/en
Priority to KR1020107010679A priority patent/KR101511814B1/ko
Publication of WO2009051079A1 publication Critical patent/WO2009051079A1/ja

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Working Measures On Existing Buildindgs (AREA)

Abstract

処理工程において一時的に補強が必要な薄状の補強対象物（１０１）を補強するための補強装置である。この補強装置は、電気絶縁層（１１３）の内部に電極部（１１２）を埋設させた薄板状の静電保持部を備える補強材本体（１１０）と、補強対象物（１０１）をアースに導通可能とする第１の接続端子（１２１）と、電極部（１１２）をアース又は高電圧に導通可能とする第２の接続端子（１２２）とを備えることにより補強材本体（１１０）と分離可能に構成される電圧制御部（１２０）を備えている。電圧制御部（１２０）は、補強対象物（１０１）に対してアースから電極部（１１２）に供給された電荷と逆極性の電荷を供給させることにより静電保持部に吸着力を発揮させて補強対象物（１０１）を吸着して補強材本体（１１０）を補強材として機能させる吸着工程部と、補強対象物（１０１）及び電極部（１１２）に蓄積された電荷を放出させて静電吸着能力を消滅させる吸着開放工程部とを備えている。
PCT/JP2008/068477 2007-10-15 2008-10-10 静電型補強装置 WO2009051079A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801176545A CN101874298B (zh) 2007-10-15 2008-10-10 静电型加固装置
US12/734,145 US8335070B2 (en) 2007-10-15 2008-10-10 Electrostatic-type reinforcement apparatus
KR1020107010679A KR101511814B1 (ko) 2007-10-15 2008-10-10 정전형 보강 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007268047A JP5112808B2 (ja) 2007-10-15 2007-10-15 静電型補強装置
JP2007-268047 2007-10-15

Publications (1)

Publication Number Publication Date
WO2009051079A1 true WO2009051079A1 (ja) 2009-04-23

Family

ID=40567346

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068477 WO2009051079A1 (ja) 2007-10-15 2008-10-10 静電型補強装置

Country Status (6)

Country Link
US (1) US8335070B2 (ja)
JP (1) JP5112808B2 (ja)
KR (1) KR101511814B1 (ja)
CN (1) CN101874298B (ja)
TW (1) TWI458041B (ja)
WO (1) WO2009051079A1 (ja)

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CN102044466B (zh) * 2009-10-12 2013-03-27 北京北方微电子基地设备工艺研究中心有限责任公司 一种静电卡盘及其残余电荷的消除方法
US8486726B2 (en) 2009-12-02 2013-07-16 Veeco Instruments Inc. Method for improving performance of a substrate carrier
CN103066000B (zh) * 2011-10-19 2015-11-25 中芯国际集成电路制造(上海)有限公司 晶圆承载设备及晶圆承载的方法
CN103065997B (zh) * 2011-10-19 2015-08-05 中芯国际集成电路制造(上海)有限公司 晶圆承载设备及晶圆承载的方法
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
KR20170124620A (ko) 2013-08-05 2017-11-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
KR101812666B1 (ko) 2013-08-05 2017-12-27 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
JP6441927B2 (ja) 2013-08-06 2018-12-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 局部的に加熱されるマルチゾーン式の基板支持体
WO2015042309A1 (en) 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
US9460950B2 (en) 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
JP2017515301A (ja) 2014-05-09 2017-06-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保護カバーを有する基板キャリアシステム
JP2017516294A (ja) * 2014-05-09 2017-06-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリアシステム及びそれを使用するための方法
CN104051495B (zh) * 2014-05-28 2017-02-15 京东方科技集团股份有限公司 封装装置和封装设备
US9959961B2 (en) 2014-06-02 2018-05-01 Applied Materials, Inc. Permanent magnetic chuck for OLED mask chucking
CN104049392B (zh) * 2014-06-10 2017-01-18 京东方科技集团股份有限公司 防止显示面板异常放电的装置和显示面板制备***
JP6433204B2 (ja) * 2014-09-01 2018-12-05 株式会社ディスコ 静電支持プレート及び静電支持プレートの製造方法
JP2016111121A (ja) * 2014-12-04 2016-06-20 株式会社ディスコ ウェーハの加工方法
CN107431040B (zh) 2015-04-15 2020-10-16 株式会社爱发科 吸附装置、真空处理装置
WO2016195945A1 (en) 2015-06-04 2016-12-08 Applied Materials, Inc. Transparent electrostatic carrier
DE102015210736B3 (de) 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP6742214B2 (ja) * 2016-10-04 2020-08-19 株式会社ディスコ 静電チャックプレートの給電装置
JP7190802B2 (ja) * 2017-02-16 2022-12-16 日本特殊陶業株式会社 静電チャックおよび基板保持方法
JP6965776B2 (ja) * 2018-02-08 2021-11-10 トヨタ自動車株式会社 静電吸着搬送装置およびその方法
JP7015707B2 (ja) * 2018-02-15 2022-02-03 株式会社ディスコ 被加工物の加工方法
TWI675202B (zh) * 2018-11-30 2019-10-21 財團法人工業技術研究院 流體管路內部靜電量測系統及其方法
KR102236374B1 (ko) * 2019-04-19 2021-04-05 주식회사 이에스티 정전척, 기판 이송장치 및 이송방법
CN114175491A (zh) 2019-07-22 2022-03-11 丰田自动车株式会社 致动器
JP7287374B2 (ja) * 2020-10-12 2023-06-06 トヨタ自動車株式会社 アクチュエータ
US20240047258A1 (en) * 2021-02-25 2024-02-08 Hitachi High-Tech Corporation Plasma processing apparatus
TW202326879A (zh) 2021-11-16 2023-07-01 日商東京威力科創股份有限公司 處理系統、靜電載具及處理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206545A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 保持装置およびそれを用いた半導体製造装置
JPH05315429A (ja) * 1992-05-07 1993-11-26 Hitachi Ltd 半導体製造装置の搬送装置
JPH08274153A (ja) * 1996-03-18 1996-10-18 Hitachi Ltd 試料処理方法
JPH0964160A (ja) * 1995-08-29 1997-03-07 Hitachi Ltd 半導体製造方法および装置
JP2004047511A (ja) * 2002-07-08 2004-02-12 Tokyo Electron Ltd 離脱方法、処理方法、静電吸着装置および処理装置
JP2006040993A (ja) * 2004-07-23 2006-02-09 Nikon Corp 静電チャック

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319906A (ja) 2000-05-11 2001-11-16 Takatori Corp ウエハ表面保護テープの剥離装置
JP2003282671A (ja) 2002-03-27 2003-10-03 Tsukuba Seiko Co Ltd 静電保持装置及びそれを用いた搬送装置
JP4188144B2 (ja) 2003-06-02 2008-11-26 筑波精工株式会社 静電保持装置及びそれを用いた静電ピンセット、搬送装置
JP4498852B2 (ja) 2004-08-13 2010-07-07 筑波精工株式会社 ハンドリング装置及びそれを用いたハンドリング方法
KR20080107473A (ko) * 2004-11-04 2008-12-10 가부시키가이샤 알박 정전 척 장치
US7446284B2 (en) * 2005-12-21 2008-11-04 Momentive Performance Materials Inc. Etch resistant wafer processing apparatus and method for producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206545A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 保持装置およびそれを用いた半導体製造装置
JPH05315429A (ja) * 1992-05-07 1993-11-26 Hitachi Ltd 半導体製造装置の搬送装置
JPH0964160A (ja) * 1995-08-29 1997-03-07 Hitachi Ltd 半導体製造方法および装置
JPH08274153A (ja) * 1996-03-18 1996-10-18 Hitachi Ltd 試料処理方法
JP2004047511A (ja) * 2002-07-08 2004-02-12 Tokyo Electron Ltd 離脱方法、処理方法、静電吸着装置および処理装置
JP2006040993A (ja) * 2004-07-23 2006-02-09 Nikon Corp 静電チャック

Also Published As

Publication number Publication date
US20100309603A1 (en) 2010-12-09
TW200935553A (en) 2009-08-16
CN101874298A (zh) 2010-10-27
KR20100076028A (ko) 2010-07-05
US8335070B2 (en) 2012-12-18
KR101511814B1 (ko) 2015-04-13
JP5112808B2 (ja) 2013-01-09
JP2009099674A (ja) 2009-05-07
TWI458041B (zh) 2014-10-21
CN101874298B (zh) 2012-02-08

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